WO2014024594A1 - Processing apparatus and device manufacturing method - Google Patents

Abstract

A processing apparatus (EX) projects and exposes a pattern formed in a mask pattern (M) to a substrate (P). The processing apparatus is provided with: a mask holding member (DM) that holds the mask pattern in a bent state; a substrate supporting member (DP) that supports the substrate; a lighting system (IU) that lights a part of the mask pattern; an intermediate image forming optical system (PL1), which forms an intermediate image (IM) corresponding to a lighting region (IR) formed on the mask pattern by means of the lighting system, and which brings the tangential plane (IMa) of the intermediate image and the tangential plane (IRa) of the lighting region on the mask pattern into a conjugate relationship by satisfying shine-proof conditions; and a projection optical system (PL2), which projects the intermediate image to a projection region (PR) on the substrate supported by means of the substrate supporting member.

Description

Processing apparatus and device manufacturing method

The present invention relates to a processing apparatus and a device manufacturing method.
This application claims priority based on Japanese Patent Application No. 2012-173982 for which it applied on August 6, 2012, and uses the content here.

In recent years, flat panel displays such as liquid crystal display panels have been widely used as display devices such as televisions. Various devices such as a flat panel display are manufactured by forming various film patterns such as a transparent thin film electrode on a substrate such as a glass plate using, for example, an exposure process and an etching technique.

The exposure process is performed by, for example, transferring an image corresponding to an illumination area set on the mask pattern on which the exposure pattern is formed, onto a projection area set on the substrate. As an exposure apparatus that performs such exposure processing, for example, an exposure apparatus that performs exposure while rotating a cylindrical mask pattern has been proposed (see Patent Document 1 below).
In addition, as a device manufacturing method, a roll-to-roll manufacturing method in which various processing such as exposure processing is performed on the substrate on the transport path while transporting the substrate such as a film from the roll for delivery to the roll for collection. Has been proposed (see Patent Document 2 below).

International Publication No. 2008/029917 International Publication No. 2008/1229819

By the way, the exposure process may be performed in a state where the projection area is not parallel to the illumination area. For example, in an exposure apparatus that uses a mask pattern that is curved in a cylindrical surface, the projection area is not parallel to the illumination area depending on the position of the illumination area on the mask pattern.
Further, in the roll-to-roll method, for example, when exposing a substrate that is curved on a roll, the projection region is not parallel to the illumination region depending on the position of the projection region on the substrate. Thus, when the projection area and the illumination area are in a non-parallel relationship, the exposure accuracy may be reduced.

An object of an aspect of the present invention is to provide a processing apparatus and a device manufacturing method capable of performing exposure with high precision even when a projection area and an illumination area are in a non-parallel relationship.

According to the first aspect of the present invention, there is provided a processing apparatus for projecting and exposing a pattern formed on a mask pattern onto a substrate, the mask holding member holding the mask pattern in a curved state, and supporting the substrate. A substrate support member; an illumination system for illuminating a part of the mask pattern; and an intermediate image corresponding to an illumination area formed on the mask pattern by the illumination system; and a tangential plane of the intermediate image and the An intermediate image forming optical system in which a tangent plane of an illumination area on the mask pattern satisfies a Scheimpflug condition and is conjugated, and the intermediate image is projected onto a projection area on a substrate supported by the substrate support member A projection optical system is provided.

According to the second aspect of the present invention, there is provided a processing apparatus for projecting and exposing a pattern formed on a mask pattern onto a substrate, the mask holding member holding the mask pattern, and supporting the substrate in a curved state. A substrate support member for illuminating, an illumination system for illuminating a part of the mask pattern, an intermediate image forming optical system for forming an intermediate image corresponding to an illumination area formed on the mask pattern by the illumination system, and the intermediate Projection optics for projecting an image onto a projection area on a substrate supported by the substrate support member, and bringing the tangent plane of the intermediate image and the tangential plane of the projection area into a conjugate relationship by satisfying the Scheinproof condition And a processing apparatus comprising the system.

According to the third aspect of the present invention, the pattern formed on the mask pattern is moved by the processing apparatus of the first aspect or the second aspect while moving the substrate having the sensitive layer and the mask pattern. There is provided a device manufacturing method including projecting exposure to a substrate, and performing subsequent processing using a change in the sensitive layer of the projection-exposed substrate.

According to the aspect of the present invention, it is possible to provide a processing apparatus and a device manufacturing method that can accurately expose even if the projection area and the illumination area have a non-parallel relationship.

It is a figure which shows an example of a device manufacturing system. It is a figure which shows the exposure apparatus by 1st Embodiment. It is a figure which shows the conditions of Scheinproof in a both-side telecentric optical system. It is a figure which shows an example of a structure of an intermediate image formation optical system. 3 is a table 1 showing an example of specifications of the intermediate image forming optical system. It is a perspective view which shows the processing apparatus (exposure apparatus) by 2nd Embodiment. It is a perspective view which shows the exposure apparatus seen from the direction different from FIG. It is a disassembled perspective view which shows an example of a field lens. It is a top view which shows an example of an aperture part. It is a figure which shows schematically the exposure apparatus by 3rd Embodiment. It is a figure which shows an example of a structure of an illumination system. It is a figure which shows an example of a structure of an illumination system. It is Table 2 which shows an example of the item of an illumination system. It is a figure which shows schematically the exposure apparatus by 4th Embodiment. It is a top view which shows the example of arrangement | positioning of a projection area | region. It is a figure which shows schematically the exposure apparatus by 5th Embodiment. It is a figure which shows schematically the exposure apparatus by 6th Embodiment. It is a figure which shows schematically the exposure apparatus by 7th Embodiment. It is a flowchart which shows an example of a device manufacturing method.

[First Embodiment]
FIG. 1 is a diagram illustrating a configuration example of a device manufacturing system SYS (flexible display manufacturing line). Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 is sequentially passed through n processing devices U1, U2, U3, U4, U5,. The example until it winds up to FR2 is shown.

In FIG. 1, the XYZ orthogonal coordinate system is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the direction (width direction) orthogonal to the transport direction (long direction) of the substrate P is Y. Set in the axial direction. For example, the Z-axis direction is set to the vertical direction, and the X-axis direction and the Y-axis direction are set to the horizontal direction.

The substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and conveyed to the processing apparatus U1. The center of the substrate P in the Y-axis direction (width direction) is servo-controlled by the edge position controller EPC1 so as to be within a range of about ± 10 μm to several tens μm with respect to the target position.

The processing device U1 is, for example, a coating device, and applies a photosensitive functional liquid (a photoresist, a photosensitive coupling material, a UV curable resin liquid, etc.) to the surface of the substrate P by a printing method. In the processing apparatus U1, for example, the coating mechanism Gp1 uniformly applies the photosensitive functional liquid to the surface of the substrate P on the impression cylinder roller DR2 around which the substrate P is wound. The drying mechanism Gp2 rapidly removes the solvent or moisture contained in the photosensitive functional liquid applied to the substrate P.

The processing apparatus U2 is, for example, a heating apparatus, and heats the substrate P transported from the processing apparatus U1 to a predetermined temperature (for example, about several tens of degrees Celsius to about 120 degrees Celsius), and the photosensitive functional layer applied to the surface. To settle stably. In the processing apparatus U2, for example, a plurality of rollers and an air turn bar convey the substrate P in a folded manner. The heating chamber HA1 heats the substrate P that has been carried in. The cooling chamber part HA2 cools the substrate P so as to be in line with the environmental temperature of the subsequent process. The nipped drive roller DR3 carries the substrate P out.

The processing apparatus U3 includes an exposure apparatus, and for example, irradiates the photosensitive functional layer of the substrate P conveyed from the processing apparatus U2 with ultraviolet patterning light corresponding to the circuit pattern and wiring pattern for display. In the processing apparatus U3, the edge position controller EPC2 controls the center of the substrate P in the Y direction (width direction) to a fixed position. The nipped driving roller DR4 carries the substrate P into the exposure apparatus. The two sets of drive rollers DR6 and DR7 carry out the substrate P while giving a predetermined slack (play) DL to the substrate P.

In the processing apparatus U3, the rotating drum DM (mask holding member) holds a sheet-like mask pattern M (mask substrate) on the outer peripheral surface. The illumination system IU illuminates a part of the mask pattern M held on the rotary drum DM. In the processing device U3, the projection system PL projects an image of the illuminated part of the mask pattern M onto the projection area. The rotating drum DP (substrate support member) supports the substrate P transported in the X-axis direction with a predetermined tension in the projection region.
The alignment microscope AM detects an alignment mark or the like formed in advance on the substrate P in order to relatively align (align) the pattern to be exposed (transferred) with the substrate P.

The processing apparatus U4 is, for example, a wet processing apparatus, and performs various types of wet processing such as wet development processing and electroless plating processing on the photosensitive functional layer of the substrate P conveyed from the processing device U3. Do at least one. In the processing apparatus U4, for example, the plurality of rollers bend and transport the substrate P. The substrate P being transported is immersed in three treatment tanks BT1, BT2, and BT3 that are hierarchized in the Z direction. The nipped drive roller DR8 carries the substrate P out.

The processing device U5 is, for example, a heating and drying device, and warms the substrate P transported from the processing device U4, and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value.
After passing through several processing apparatuses as described above, the substrate P that has passed through the final processing apparatus Un of the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR9. Also during the winding, the drive roller DR9 and the recovery roll are driven by the edge position controller EPC3 so that the center of the substrate P in the Y-axis direction (width direction) or the substrate end in the Y-axis direction does not vary in the Y-axis direction. The relative position of the FR2 in the Y-axis direction is successively corrected and controlled.

The host control device CONT controls the operation of each processing device U1 to Un constituting the production line. The host control device CONT monitors the processing status and processing status of each processing device U1 to Un, monitors the transport status of the substrate P between the processing devices, and performs feedback correction and feedforward based on the results of prior and subsequent inspections and measurements. Make corrections.

The substrate P used in the present embodiment is, for example, a foil (foil) made of a metal or an alloy such as a resin film or stainless steel. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.

The substrate P can be selected so that its thermal expansion coefficient is not significantly large so that the amount of deformation caused by heat in various processing steps can be substantially ignored. The thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like.
The substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like. The board | substrate P may be the laminated body which bonded together said resin film, foil, etc. to this ultra-thin glass. The substrate P may be a substrate whose surface has been modified and activated in advance by a predetermined pre-treatment, or a substrate having a fine partition structure (uneven structure) for precise patterning formed on the surface. The above thickness is an example, and the present invention is not limited to this.

The device manufacturing system SYS of the present embodiment repeatedly or continuously executes various processes for manufacturing a device (such as a display panel) on the substrate P. The substrate P that has been subjected to various types of processing is divided (diced) for each device to form a plurality of devices.
As for the dimension of the substrate P, for example, the dimension in the width direction (short Y-axis direction) is about 10 cm to 2 m, and the dimension in the length direction (long X-axis direction) is 10 m or more. The above dimensions are examples, and the present invention is not limited thereto. The dimension in the width direction of the substrate P may be 10 cm or less, or 2 m or more. The dimension in the length direction of the substrate P may be less than 10 m.

Next, the configuration of the processing apparatus U3 (exposure apparatus) of this embodiment will be described. FIG. 2 is a view showing the exposure apparatus EX according to the present embodiment. The exposure apparatus EX shown in FIG. 2 is a so-called scanning exposure apparatus, and moves the substrate P (photosensitive sheet) and the mask pattern M, and scans the substrate P with the exposure light L2 from the mask pattern M, whereby the mask pattern M The exposure pattern formed on the substrate P is transferred to the substrate P (projection exposure).

The exposure apparatus EX includes a rotary drum DM (mask holding member) that holds the mask pattern M in a curved state, a rotary drum DP (substrate support member) that supports the substrate P, and illumination that illuminates a part of the mask pattern M. A system IU, a first projection optical system PL1 (intermediate image forming optical system) that forms an intermediate image IM corresponding to the illumination region IR formed on the mask pattern M, and a substrate P supported by the rotary drum DP Is provided with a second projection optical system PL2 (projection optical system) that projects the intermediate image IM onto the projection region PR, and a control device 10 that controls each part of the exposure apparatus EX.

The rotary drum DM is a mask holding member that holds the mask pattern M. The rotating drum DM has a cylindrical outer peripheral surface (hereinafter also referred to as a cylindrical surface DMa), and holds the mask pattern M curved in a cylindrical surface along the cylindrical surface DMa. The cylindrical surface is a surface curved with a predetermined radius around a predetermined center line, and is, for example, at least a part of an outer peripheral surface of a column or a cylinder.

The mask pattern M is, for example, a transmissive mask pattern, and includes a pattern formed on the rotating drum DM with a light shielding member such as chrome. The mask pattern M is, for example, a planar sheet-like mask substrate, and has flexibility that can be curved into a cylindrical surface. The mask pattern M is formed on the cylindrical surface DMa of the rotating drum DM. It may be held on the rotating drum DM by being wound. Thus, the rotary drum DM may hold the mask pattern M so that it can be released (replaceable).

The rotary drum DM is provided so as to be rotatable around the rotation center axis AX1, and is rotated by torque supplied from the drive unit 11. The rotational position of the rotary drum DM is detected by the detection unit 12 and controlled based on the detection result by the detection unit 12. The control device 10 controls the rotational position of the rotary drum DM by controlling the drive unit 11 based on the detection result acquired from the detection unit 12. That is, the control device 10 can control the rotational position of the mask pattern M held on the rotary drum DM.

The rotary drum DP is a substrate holding member (substrate support member) that holds the substrate P. The rotary drum DP has a cylindrical outer peripheral surface DPa (support surface), and is provided so as to be rotatable around a rotation center axis AX2. The rotation center axis AX2 of the rotation drum DP is set substantially parallel to the rotation center axis AX1 of the rotation drum DM, for example. In the following description, a surface including the rotation center axis AX1 of the rotary drum DM and the rotation center axis AX2 of the rotation drum DP is appropriately referred to as a center plane 13.

The outer peripheral surface DPa of the rotary drum DP is a support surface that supports the substrate P. The substrate P is transported so as to be wound around the rotating drum DP as the rotating drum DP rotates. Therefore, the projection region PR is curved along the outer peripheral surface DPa of the rotating drum DP on the substrate P being conveyed on the outer peripheral surface DPa of the rotating drum DP.
A guide roller 14a and a guide roller 14b are provided before and after the rotary drum DP in the transport path of the substrate P. The guide roller 14a and the guide roller 14b adjust the tension of the substrate P so that the substrate P adheres to the rotary drum DP without sagging.

The control device 10 controls the drive unit 15 based on the rotational position of the rotary drum DP detected by the detection unit 16, and rotates the rotary drum DP by the drive unit 15. That is, the control device 10 can control the position of the substrate P supported by the rotary drum DP. The control device 10 controls the relative position between the mask pattern M and the substrate P by controlling the drive unit 11 and the drive unit 15.

In the exposure apparatus EX, when the rotary drum DM is rotated by the drive unit 11, the mask pattern M is moved (rotated) relative to the illumination area IR. When the rotary drum DP is rotated by the driving unit 15, the substrate P moves (rotates) relative to the projection region PR. In other words, the rotary drum DM, the drive unit 11, the rotary drum DP, and the drive unit 15 function as a moving device that moves the mask pattern M and the substrate P.

The rotating speed of the rotating drum DM (the peripheral speed of the mask pattern M) and the rotating speed of the rotating drum DP (the conveying speed of the substrate P) are the ratio of the outer diameter of the rotating drum DM to the outer diameter of the rotating drum DP, and the projection system PL. It is set according to the magnification of. For example, when the outer diameter of the rotating drum DM is substantially the same as the outer diameter of the rotating drum DP and the projection system PL is the same size, the control device 10 sets the exposure pattern at a predetermined position on the substrate P. , The rotating drum DM and the rotating drum DP are rotated at substantially the same speed.

The scanning direction in which the substrate P is scanned by the exposure light L2 in the exposure apparatus EX is a direction substantially perpendicular to the rotation center axis AX1. In the following description, a direction (X axis direction) perpendicular to the rotation center axis AX1 (Y axis direction) may be referred to as a scanning direction, and a Y axis direction may be referred to as a non-scanning direction.

The driving unit 11 may be capable of moving the rotating drum DM in at least one direction of the X-axis direction, the Y-axis direction, and the Z-axis direction. In this case, the detection unit 12 may detect the position of the rotary drum DM in the direction in which the drive unit 11 moves the rotary drum DM. The control device 10 may control the position of the rotating drum DM in an arbitrary direction by controlling the drive unit 11 based on the detection result of the detection unit 12.

Such position adjustment of the rotating drum DM may be applied to the rotating drum DP. The exposure apparatus EX can control the relative position between the rotating drum DM and the rotating drum DP by controlling the position of one or both of the rotating drum DM and the rotating drum DP. Thereby, the exposure apparatus EX can adjust the relative position of the illumination area IR and the projection area PR, for example.

The illumination system IU generates the exposure light L2 corresponding to the pattern formed on the mask pattern M by illuminating the mask pattern M held on the rotating drum DM with the illumination light L1. The illumination system IU illuminates the illumination area IR with uniform brightness by Koehler illumination or the like. The illumination system IU includes, for example, a light source 20 and an illumination optical system 21.
The light source 20 includes at least one of a lamp light source that emits bright line light such as g-line, h-line, and i-line, and a solid-state light source such as a laser diode (LD) or a light-emitting diode (LED). The illumination optical system 21 includes, for example, an illuminance uniforming optical system such as an integrator optical system for uniformizing the illuminance in the illumination region IR.

The illumination area IR is formed at a position shifted in the circumferential direction of the cylindrical surface DMa from a position (proximity position CP) closest to the substrate P (rotating drum DP) in the mask pattern M (rotating drum DM). The illumination region IR is curved in a cylindrical shape corresponding to the shape of the mask pattern M. In the following description, a plane in contact with the illumination area IR at an arbitrary point in the illumination area IR (for example, the center of the illumination area IR) is referred to as a tangent plane IRa of the illumination area IR.

Note that the illumination area IR has a dimension (arc length) in the circumferential direction of the rotating drum DM that is set to be sufficiently smaller than the circumferential length of the rotating drum DM, and can be handled as a substantially flat surface. Therefore, in each drawing referred to in the following description, the illumination region IR may be approximately shown as a part of the tangent plane IRa. The same applies to the other curved surfaces of the illumination region IR.

The mask pattern M in FIG. 2 is a transmissive type, and the illumination system IU irradiates the mask pattern M with illumination light L1 from the inside of the rotary drum DM. The rotating drum DM is formed in a cylindrical shape so that the illumination system IU can be accommodated therein. The illumination system IU is supported from the outside of the rotating drum DM so as not to rotate with respect to the outside of the rotating drum DM while the rotating drum DM is rotating.
Each part of the mask pattern M in the circumferential direction passes through the illumination region IR in turn as the rotary drum DM rotates relative to the illumination region IR. The illumination light L1 that has passed (transmitted) through the mask pattern M becomes exposure light L2. The exposure light L2 emitted from the mask pattern M is incident on the projection system PL.

Next, the projection system PL will be described in detail. The projection system PL in FIG. 2 projects (transfers) the image of the mask pattern M in the illumination region IR onto the substrate P as an equal-size erect image. Both the first projection optical system PL1 and the second projection optical system PL2 of the projection system PL have the same configuration, and the surface 22 that passes through the center between the rotary drum DM and the rotary drum DP and is perpendicular to the center plane 13 They are arranged symmetrically.

The field of view (object plane) of the projection system PL is set to at least a part of the illumination area IR. A projection region PR (image plane) conjugate with the field of the projection system PL is arranged symmetrically with respect to the illumination region IR with respect to the surface 22. As described above, the illumination region IR is set at a position shifted from the center surface 13 in the circumferential direction of the rotary drum DM. The tangent plane IRa of the illumination area IR is not parallel to the surface 22.
Therefore, the projection region PR of the projection system PL is arranged at a position shifted from the central plane 13 in the circumferential direction of the rotary drum DP. The tangent plane PRa of the projection region PR has a non-parallel relationship with the surface 22. The tangent plane PRa of the projection region PR is a plane that is in contact with the projection region PR at an arbitrary point in the projection region PR (for example, the center of the projection region PR).

The first projection optical system PL1 of the projection system PL forms an intermediate image IM corresponding to the mask pattern M in the illumination region IR so that a part of the intermediate image IM is arranged on the surface 22. The intermediate image formation surface 23 on which the intermediate image IM is formed is curved into a cylindrical surface corresponding to the shape of the illumination region IR. A part of the intermediate imaging plane 23 is disposed so as to pass through the plane 22. A tangent plane 23 a of the intermediate image plane 23 is substantially parallel to the plane 22. The tangent plane 23a of the intermediate imaging plane 23 is in a non-parallel relationship with the tangent plane IRa of the illumination region IR.

In order to focus on the tangent plane 23a of the intermediate image plane 23, the first projection optical system PL1 (intermediate image forming optical system) of the projection system PL is in contact with the tangent plane IRa of the illumination region IR and the intermediate image plane 23. The flat surface 23a is configured so as to satisfy the Shineproof condition. The tangent plane 23a of the intermediate image plane 23 is a plane that contacts the intermediate image plane 23 at an arbitrary point on the intermediate image plane 23 (for example, the center of the intermediate image plane 23).

The second projection optical system PL2 (projection optical system) of the projection system PL projects the intermediate image IM formed by the first projection optical system PL1 onto the projection region PR. The tangent plane 23a of the intermediate imaging plane 23 is in a non-parallel relationship with the tangent plane PRa of the projection region PR. In order to focus on the tangent plane PRa of the projection region PR, the second projection system optical system PL2 of the projection system PL has a condition that the tangent plane 23a of the intermediate image plane 23 and the tangent plane PRa of the projection region PR are shine-proof. It is comprised so that it may satisfy.

In the projection system PL, the optical path of the exposure light L2 in the second projection optical system PL2 is bent with respect to the optical path of the exposure light L2 in the first projection optical system PL1. For example, the first projection optical system PL1 and the second projection optical system PL2 are each configured as an axially symmetric optical system, and the optical axis 40 of the first projection optical system PL1 and the optical axis 45 of the second projection optical system PL2 Are arranged so as to intersect at the plane 22.
A field lens 24 is interposed between the first projection optical system PL1 and the second projection optical system PL2 so that the illumination light L1 from the first projection optical system PL1 is deflected and directed toward the second projection optical system PL2. Has been placed. The field lens 24 is disposed in the vicinity of the intermediate image plane 23 so that a part of the field lens 24 is disposed on the intermediate image plane 23.

Next, the conditions for Shine Proof will be described. FIG. 3 is a diagram showing conditions for Scheimpflug in the bilateral telecentric optical system 30.

3, reference numeral 31 denotes an object plane, reference numeral 32 denotes an image plane, and reference numeral θ denotes an angle formed by the object plane 31 and the image plane 32. When the optical system 30 is the first projection optical system PL1, the object plane 31 corresponds to the field of view (illumination region IR) of the projection system PL, and the image plane 32 corresponds to the intermediate imaging plane 23. When the optical system 30 is the second projection optical system PL2, the object plane 31 corresponds to the intermediate image plane 23, and the image plane 32 corresponds to the projection region PR.

Here, for convenience of explanation, it is assumed that the optical system 30 includes a lens group 33 and a lens group 34, and the lens group 33 and the lens group 34 are axially symmetric (rotationally symmetric) with respect to a predetermined axis (optical axis 30a). . In FIG. 3, reference numeral f1 indicates the focal length of the lens group 33 (first lens group), and reference numeral f2 indicates the focal length of the lens group 34 (second lens group). When the image magnification (imaging magnification, projection magnification) of the optical system 30 is k, the image magnification k is the ratio of the focal length f2 of the second lens group to the focal length f1 of the first lens group (k = f2 / f1). become.

The optical system 30 is configured such that the rear focal position of the lens group 33 and the front focal position of the lens group 34 substantially coincide. In the optical system 30, with respect to the object plane 31 passing through the front focal position of the lens group 33, a plane passing through the rear focal position of the lens group 33 and perpendicular to the optical axis 30 a becomes a so-called pupil plane 35. An image plane 32 conjugate with the object plane 31 is disposed at the rear focal position.

Here, an angle formed by the object plane 31 and the pupil plane 35 is α, and sin α is appropriately approximated by α. If the off-axis object point 36 is separated from the on-axis object point 37 by an object height h in a direction perpendicular to the optical axis 30a, the off-axis object point 36 is h × sinα ( The approximate deviation amount is separated by αh).

An off-axis image point 38 on which the off-axis object point 36 forms an image is formed in the direction perpendicular to the optical axis 30a by an amount (kh) obtained by multiplying the object height h by the magnification (lateral magnification) of the optical system 30 in this direction. It will be away from the upper image point 39. Further, the off-axis image point 38 is separated from the on-axis image point 39 in a direction parallel to the optical axis 30a by a deviation amount obtained by multiplying the magnification (vertical magnification) of the optical system 30 in this direction by the deviation amount αh. Become.
If the horizontal magnification of the optical system 30 is k, the vertical magnification is equal to the square of the horizontal magnification (k ² ). Therefore, off-axis object point 36 is a position away from the on-axis image point 39 by kh in a direction perpendicular to the optical axis 30a, k ² .alpha.h from on-axis image point 39 in a direction parallel to the optical axis 30a The image is formed at a position (off-axis image point 38) that is far away. This indicates that the angle β formed by the image plane 32 and the pupil plane 35 is kα.
Here, assuming a single lens optically equivalent to the optical system 30, the distance from the lens to the image plane 32 is a value obtained by multiplying the distance from the object plane 31 to the lens by the image magnification k. Therefore, the line of intersection between the plane extending the principal surface (pupil surface 35) of the lens and the object plane 31 coincides with the line of intersection between the plane extending the principal plane (pupil surface 35) of the lens and the image plane 32. become.

Here, it is assumed that the center of the visual field of the projection system PL shown in FIG. 2 is arranged at a position rotated from the center plane 13 by an angle θ. In this case, the angle (α + β) between the image plane 32 and the object plane 31 shown in FIG. From the three formulas θ = α + β, β = kα, k = f2 / f1, the angle α formed by the pupil plane 35 and the object plane 31 is the angle θ, the focal length f1 of the lens group 33, and the focal length of the lens group 34. The angle internally divided by f2, that is, α = θ × f1 / (f1 + f2).
In order to configure the first projection optical system PL1 with such an optical system 30, the angle (θ−α) of the optical axis 40 of the first projection optical system PL1 with respect to the center plane 13, that is, θ × f2 / (f1 + f2). ) Just tilt. For example, when the lens group 33 and the lens group 34 have the same focal length, the angle formed by the optical axis 40 of the first projection optical system PL1 with respect to the center plane 13 is θ / 2.

Next, a configuration example of the first projection optical system PL1 will be described. FIG. 4 is a diagram showing an example of the configuration of the first projection optical system PL1. FIG. 5 is a table 1 showing an example of specifications of the first projection optical system PL1. The first projection optical system PL1 in FIG. 4 is an optical system that is axially symmetric (rotationally symmetric) around the optical axis 40. In FIG. 4, the object plane 41 and the image plane 42 are set perpendicular to the optical axis 40 in order to make it easy to understand the light beam passing through the first projection optical system PL1.

4 includes a lens group 33, a lens group 34, and an aperture stop 43. The first projection optical system PL1 shown in FIG. The aperture stop 43 is disposed at or near the position of the pupil plane 35 of the first projection optical system PL1, for example. The lens group 33 and the lens group 34 have the same configuration, and are arranged symmetrically (plane-symmetric) with respect to the aperture stop 43. Therefore, Table 1 in FIG. 5 describes the specifications for the lens group 33 and omits the specifications for the lens group 34.

The surface numbers in Table 1 of FIG. 5 are numbers that increase from the aperture stop 43 (pupil surface 35) to the starting point (surface number 0) and approach the object plane 41 from the aperture stop 43. For example, the first optical surface corresponding to the surface number 1 is an optical surface arranged on the object plane 41 side after the pupil plane 35. The first optical surface is denoted by reference symbol A1, the second optical surface is denoted by reference symbol A2, and the nth optical surface is denoted by reference symbol An for an integer n of 0 or more.

The “curvature radius” of the nth optical surface An is positive when it is convex toward the pupil surface 35 and negative when it is convex toward the object surface 41. The “center distance” of the nth optical surface An indicates the distance from the nth optical surface An to the (n + 1) th optical surface A (n + 1). For example, the “center distance” with respect to the 0th optical surface A0 indicates the distance from the 0th optical surface A0 (pupil surface 35) to the first optical surface A1.
Each of the first optical surface A1 to the tenth optical surface A10 is a lens surface. The center-to-center distance from the first optical surface A1 to the second optical surface A2 indicates the thickness of the center of this lens. The “center distance” with respect to the tenth optical surface A10 indicates the distance from the tenth optical surface A10 to the object surface 41.

The lens group 33 has a configuration in which lenses 44 a to 44 e are arranged along the optical axis 40 in order from the aperture stop 43 toward the object plane 41.

The lens 44a has a first optical surface A1 facing the pupil surface 35 side and a second optical surface A2 facing the object surface 41 side. The lens 44a has a shape like a so-called plano-convex lens. In the lens 44a, the first optical surface A1 is convex toward the pupil surface 35 (the radius of curvature is positive), and the second optical surface A2 is substantially planar (slightly convex toward the object surface 41). is there.

The lens 44b has a third optical surface A3 facing the pupil surface 35 side and a fourth optical surface A4 facing the object surface 41 side. The lens 44b has a shape like a so-called meniscus lens. In the lens 44b, the third optical surface A3 is convex toward the pupil surface 35, and the fourth optical surface A4 is concave toward the object surface 41.

The lens 44c has a fifth optical surface A5 facing the pupil surface 35 side and a sixth optical surface A6 facing the object surface 41 side. The lens 44c has a shape like a so-called biconcave lens. In the lens 44c, the fifth optical surface A5 is concave toward the pupil surface 35, and the sixth optical surface A6 is concave toward the object surface 41.

The lens 44d has a seventh optical surface A7 facing the pupil surface 35 side and an eighth optical surface A8 facing the object surface 41 side. The lens 44d has a shape like a so-called plano-convex lens. In the lens 44d, the seventh optical surface A7 is substantially planar (slightly concave toward the pupil surface 35), and the eighth optical surface A8 is convex toward the object surface 41.

The lens 44e has a ninth optical surface A9 facing the pupil surface 35 side and a tenth optical surface A10 facing the object surface 41 side. The lens 44e has a shape like a so-called biconvex lens. In the lens 44e, the ninth optical surface A9 is convex toward the pupil surface 35, and the tenth optical surface A10 is convex toward the object surface 41.

The lens group 33 described above is an example, and one or both of the number of lenses and the lens shape constituting the lens group 33 can be changed as appropriate. The lens group 33 may include an optical member having no refractive power such as a glass flat plate.
4 is a refractive optical system that does not include a reflective member, but may be a catadioptric optical system that includes a reflective member and a lens, or a reflective system that includes a reflective member and does not include a lens. An optical system may be used. The lens group 34 may have a different configuration from the lens group 33. For example, the focal length f2 of the lens group 34 may be different from the focal length f1 of the lens group 33 (see FIG. 3).

Incidentally, the illumination system IU shown in FIG. 2 is arranged so that the direction in which the illumination light L1 is emitted (exit axis IUa) is substantially coaxial with the optical axis 40 of the first projection optical system PL1. The illumination system IU illuminates the illumination area IR from a direction that is not perpendicular to the tangent plane IRa of the illumination area IR.
In other words, the direction perpendicular to the tangential plane IRa of the illumination area IR is a direction (radial direction of the rotating drum DM) passing through the rotation center axis AX1 in a plane (XZ plane) perpendicular to the rotation center axis AX1 of the rotation drum DM. . The illumination system IU irradiates the illumination region IR with the illumination light L1 from a position shifted from the rotation center axis AX1.

In FIG. 2, the intersection 46 between the radial direction (center plane 13) of the cylindrical surface DMa passing through the proximity position CP and the exit axis of the illumination system IU is arranged at a position away from the rotation center axis AX1 with the proximity position CP as a starting point. Is done. For example, when the lens group 33 and the lens group 34 of the first projection optical system PL1 are both equal magnification optical systems, the distance from the proximity position CP to the intersection 46 is from the proximity position CP to the rotation center axis AX1. Is set to about twice the distance.

In the exposure apparatus EX configured as described above, the first projection optical system PL1 has a conjugate relationship between the tangent plane IMa of the intermediate image IM and the tangent plane IRa of the illumination area IR on the mask pattern M satisfying the Scheimpflug condition. To. Therefore, the exposure apparatus EX can accurately project and expose the image of the mask pattern M in the illumination area IR onto the substrate P even when the illumination area IR is set at a position shifted from the center plane 13. .
In addition, the second projection optical system PL2 has a conjugate relationship between the tangent plane IMa of the intermediate image IM and the tangent plane PRa of the projection region PR on the substrate P by satisfying the Scheinproof condition. Therefore, the exposure apparatus EX can project and expose the image of the mask pattern M in the illumination area IR onto the substrate P with high accuracy.
As described above, since the exposure apparatus EX can be arranged at a position shifted from the center plane 13 in the illumination area IR, the degree of freedom in arrangement of the illumination system IU and the projection system PL is increased. Exposure accuracy can be ensured while applying.

Further, in the exposure apparatus EX, the field lens 24 deflects the illumination light L1 from the first projection optical system PL1 and directs it toward the second projection optical system PL2, so that the periphery of the projection region PR becomes darker than the center. Etc. are suppressed.

Further, since the first projection optical system PL1 has the same configuration of the lens group 33 and the lens group 34, for example, the design cost and the manufacturing cost of the apparatus can be reduced. Further, since the second projection optical system PL2 has the same configuration as the first projection optical system PL1, the design cost and the manufacturing cost of the exposure apparatus EX can be reduced.

Note that at least a part of the illumination system IU may be arranged outside the rotating drum DM. For example, the illumination system IU may have a configuration in which the light source 20 is disposed outside the rotating drum DM and the light from the light source 20 is guided (transmitted) to the illumination optical system 21 by an optical fiber or the like.

In the present embodiment, the shine proof condition has been described using a tangent plane as a plane corresponding to a curved surface such as the illumination region IR (hereinafter referred to as an approximate plane). Can be appropriately selected so that the defocus due to the error when approximated by is less than the depth of focus.
For example, the projection system PL uses the plane parallel to the tangent plane IRa at the center of the illumination area IR and passing through any point on the illumination area IR as the above approximate plane so as to satisfy the Scheinproof condition. It may be configured. In addition, for example, the projection system PL is a plane that passes through an arbitrary point on the illumination area IR, and a plane whose inclination falls within the inclination of the tangential plane at each end in the circumferential direction of the illumination area IR. It may be configured to use the approximate plane and satisfy the Scheimpflug condition.
Such definition of the approximate plane can be applied to curved surfaces such as the intermediate image plane 23 and the projection region IR, and can also be applied to the following embodiments.

[Second Embodiment]
Next, a second embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof may be simplified or omitted.

6 and 7 are perspective views showing the exposure apparatus EX according to the present embodiment. FIG. 7 is a view from a different viewpoint from FIG. The exposure apparatus EX is a so-called multi-lens type exposure apparatus, and includes a plurality of projection modules PM arranged in a non-scanning direction (Y-axis direction) perpendicular to the scanning direction (X-axis direction). The exposure apparatus EX joins areas (exposure areas) on the substrate P exposed by each of the plurality of projection modules PM in the Y-axis direction, so that the exposure is wider than when the number of projection modules PM is one. The area can be exposed.

The plurality of projection modules PM shown in FIG. 6 are arranged so that the positions of the projection modules PM viewed from the Y-axis direction are alternately shifted in the order in which they are arranged in the Y-axis direction. For example, among the plurality of projection modules PM, the first projection module PMa in which the arrangement order from one to the other in the Y-axis direction is an odd number is arranged on the −X side with respect to the center plane 13. Among the plurality of projection modules PM, the second projection module PMb in which the order of arrangement from one to the other in the Y-axis direction is an even number is arranged on the + X side with respect to the center plane 13.

The plurality of projection modules PM shown in FIG. 7 scan the projection region PR2 of the second projection module PMb by scanning and the end portion in the Y-axis direction of the region on the substrate P passing through the projection region PR1 of the first projection module PMa by scanning. The position in the Y-axis direction is arranged so as to be shifted so that the end in the Y-axis direction of the region on the substrate P that passes therethrough overlaps. In the present embodiment, the plurality of projection modules PM are arranged so as to be arranged at a predetermined pitch in the non-scanning direction (Y-axis direction) when viewed from the scanning direction (X-axis direction). Note that the illumination system IU illustrated in FIG. 2 is provided for each projection module PM, for example.

The field lens 24 in FIG. 6 is integrally provided across the intermediate image plane 23c of the first projection module PMa and the intermediate image plane 23d of the second projection module PMb. In the present embodiment, a plurality of first projection modules PMa are arranged in the scanning direction (Y-axis direction), and the field lens 24 is provided integrally over the intermediate image planes 23c of the plurality of first projection modules PMa. It has been. The field lens 24 is also provided integrally over the intermediate image plane 23d for the plurality of second projection modules PMb.

2 and 3, the angle at which the optical axis 40 of the first projection optical system PL1 is inclined with respect to the center plane 13 is θ × f2 / (f1 + f2), and the rotating drum DM Is proportional to the angle θ at which the visual field center of the first projection optical system PL1 is viewed from the rotation center axis AX1.
Here, if the radius of the rotating drum DM is R, the focal length of the field lens 24 is R × (f1 + f2) / (2 × f1), which is at the position of the field of view (illumination region IR) of the first projection optical system PL1. It does n’t matter. Therefore, the field lens 24 can be configured by a cylindrical lens having a uniform focal length distribution in the Y-axis direction, for example.

FIG. 8 is an exploded perspective view showing an example of the field lens 24. 8 includes an optical member 47 (first optical member) disposed on the same side as the illumination region IR with respect to the tangent plane IMa of the intermediate image IM (see FIG. 2), and the tangent plane IMa of the intermediate image IM. The optical member 48 (2nd optical member) arrange | positioned on the opposite side to the illumination area | region IR, and the aperture part 49 pinched | interposed into the optical member 47 and the optical member 48 are provided.

The optical member 47 is a plano-convex cylindrical lens, and has a surface 47a facing the first projection optical system PL1 and a surface 47b facing the surface 47a. The surface 47a is curved so that the focal length of the field lens 24 is R × (f1 + f2) / (2 × f1). The surface 47b is substantially planar.
The focal length of the field lens 24 is substantially the same as the radius (R) of the rotating drum DM when the focal length f1 of the lens group 33 and the focal length f2 of the lens group 34 are the same. Therefore, for example, if the radius (R) of the rotating drum DM is about 250 mm, the radius of curvature of the field lens 24 is about 339 mm, for example.

In the present embodiment, the optical member 48 has substantially the same shape as the optical member 47 in accordance with the same configuration of the first projection optical system PL1 and the second projection optical system PL2. The optical member 48 has a surface 48a that faces the second projection optical system PL2, and a surface 48b that faces the opposite side of the surface 48a. The optical member 47 and the optical member 48 are integrated by joining the planar surface 47b and the surface 48b.

The diaphragm unit 49 is a so-called field diaphragm and defines the shape of the projection region PR. For example, the diaphragm 49 is disposed substantially at the center in the thickness direction (Z-axis direction) of the field lens 24. The diaphragm portion 49 is constituted by, for example, a light shielding film (light shielding member) formed of chromium or the like on one or both of the surface 47b of the optical member 47 and the surface 48b of the optical member 48.

The diaphragm 49 has an opening 50 through which at least part of the exposure light L2 from the first projection optical system PL1 passes. The opening 50 is provided for each projection module PM, and is disposed at or near the position where the intermediate image IM is formed in each projection module PM.
The opening 50 is arranged such that the position in the X-axis direction is shifted between the opening 50a corresponding to the first projection module PMa and the opening 50b corresponding to the second projection module PMb. In the present embodiment, corresponding to the projection modules PM being arranged at a constant pitch in the Y-axis direction, the openings 50 are arranged at a constant pitch dy in the Y-axis direction.

The opening 50a corresponding to the first projection module PMa (see FIGS. 6 and 7) and the opening 50b corresponding to the second projection module PMb are non-scanning directions (Y-axis direction) when viewed from the scanning direction (X-axis direction). Are arranged so that their end portions overlap each other. Each of the openings 50a and 50b in FIG. 8 has a trapezoidal shape, and a pair of opposite sides (upper and lower bases) parallel to each other are substantially perpendicular to the scanning direction.
When viewed from the scanning direction, the openings 50a and 50b are arranged such that the shorter side of the upper base and the lower base does not overlap the openings 50a and 50b, and the trapezoidal hypotenuse (leg) has the openings 50a. And the opening 50b.

FIG. 9 is a plan view showing an example of the diaphragm 49. Here, for convenience of explanation, it is assumed that the resolution of the exposure apparatus EX is about 4 μm to 5 μm. When, for example, i-line (wavelength is about 365 nm) light is used as the illumination light L1 from the illumination system IU, the numerical aperture of the projection system PL is set to about 0.06, for example, and the depth of focus at this numerical aperture Becomes about 100 μm. Assuming that half of the depth of focus (about 50 μm) is the tolerance of the object plane position and the radius (R) of the rotating drum is about 250 mm, the size of the field of view of the projection system PL is about 10 mm in the scanning direction. become.
Under such conditions, each projection module PM has, for example, a maximum lens diameter of about 22 mm, a total length of about 180 mm, and a field diameter νφ of about 14.2 mm.

In the example of FIG. 9, the aperture 50 of the diaphragm 49 has substantially the same shape as the field of view of each projection module PM, and is set to a hexagon having a vertex in the non-scanning direction (Y-axis direction). The opening 50 includes a rectangular portion 50c having a pair of sides parallel to the non-scanning direction, and a triangular portion 50d adjacent to both ends of the rectangular portion 50c in the Y-axis direction. In the rectangular portion 50c, for example, the dimension u1 in the scanning direction (X-axis direction) is set to about 10 mm, and the dimension u2 in the non-scanning direction is set to about 10 mm. For example, the dimension u3 in the non-scanning direction of the triangular part 50d is set to about 2 mm.

In the diaphragm 49, the triangular part 50d of the opening 50 (for example, the opening 50b) functions as a part (screen joint part) for joining the area passing through the projection area PR of the projection module in the Y-axis direction. For example, when the substrate P is moved in the scanning direction (X-axis direction), the region on the substrate P that passes through the projection region PR corresponding to the triangular portion 50d of the opening 50b is arranged next to the opening 50b when viewed from the scanning direction. It passes through the region on the substrate P corresponding to the triangular portion 50d of the opening 50a.

In this way, the amount of the exposure light L2 can be made uniform between the region passing through the projection region PR corresponding to the triangular portion 50d and the region passing through the projection region PR corresponding to the rectangular portion 50c in the substrate P. In other words, the opening 50 is arranged so that the amount of the exposure light L2 incident on the substrate P can be aligned in the Y-axis direction. Needless to say, the shape and dimensions of the opening 50 as described above are merely examples, and can be changed as appropriate.

In the exposure apparatus EX configured as described above, since the plurality of projection modules PM are arranged in the non-scanning direction, the processing range in the non-scanning direction can be expanded. For example, a large-sized substrate for a large device, It can be exposed to a large substrate for chamfering. Further, since the exposure apparatus EX has the same configuration in the first projection module PM and the second projection module PM, for example, the design cost and the manufacturing cost of the apparatus can be reduced.
The number of projection modules PM can be selected as appropriate, and may be one as in the first embodiment, or may be two or more as in the second embodiment.

In the exposure apparatus EX, since the field lens 24 is shared by the first projection module PMa and the second projection module PMb, the number of parts can be reduced, for example, the cost of alignment can be reduced. it can.
Further, since the field lens 24 is shared by the plurality of first projection modules PMa and shared by the plurality of second projection modules PMb, the number of parts can be reduced, for example, the cost of alignment is reduced. You can do that.

In the above-described embodiment, the first projection optical system PL1 is an equal magnification optical system, but may be either an enlargement optical system or a reduction optical system.
The second projection optical system PL2 may be either an enlargement optical system or a reduction optical system, and may have a magnification different from that of the first projection optical system PL1. For example, the first projection optical system PL1 may be an enlargement optical system and the second projection optical system PL2 may be a reduction optical system. In this case, the field of view is at the position of the enlarged intermediate image IM. By providing the stop, the range of the projection region PR can be accurately defined.
Further, the projection system PL may be any of an equal magnification optical system, an enlargement optical system, and a reduction optical system.

[Third Embodiment]
Next, a third embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof may be simplified or omitted. FIG. 10 is a view schematically showing the exposure apparatus EX according to the present embodiment, and illustration of the second projection optical system PL2 and the like is omitted. The exposure apparatus EX of FIG. 10 differs from the above-described embodiment in the configuration of the illumination system IU.

The illumination system IU includes a light guide rod 51 for guiding (transmitting) illumination light from the light source to the illumination optical system 21. The light guide rod 51 in FIG. 10 is a cylindrical member that is substantially parallel (here, substantially coaxial) with the rotation center axis AX1 of the rotary drum DM. The light guide rod 51 is formed so that light is reflected on the inner surface thereof. The light guide rod 51 guides light in a direction substantially parallel to the rotation center axis AX1 by internal reflection.

The light guide rod 51 includes an incident portion (not shown) where light enters from a light source, and an emission portion 52 for taking out light propagated through the light guide rod 51 in a direction intersecting (orthogonal) with the rotation center axis AX1. And have. In the present embodiment, a plurality of projection modules PM are provided as in the exposure apparatus EX of FIG. 6, and the emission unit 52 is provided for each projection module PM. The emission part 52 can be realized by, for example, providing a notch part 52a to partially break the conditions for internal reflection of the light guide rod 51.

The notch 52 a is locally provided in the circumferential direction around the center line of the light guide rod 51. The light reflected from the inner surface of the notch 52a is broken in reflection conditions on the inner surface on the side opposite to the notch 52a with respect to the center line of the light guide rod 51, so that the light guide rod 51 passes through the inner surface on the opposite side to the notch 52a. It is taken out outside. The notch 52a is locally provided in the direction parallel to the center line of the light guide rod 51 according to the position of each projection module PM.

10 is arranged substantially coaxially with the rotation center axis AX1 of the rotary drum DM. The illumination light L1 is emitted from the light guide rod 51 in the radial direction of the rotary drum DM. The illumination optical system 21 deflects the illumination light L1 emitted from the light guide rod 51 and makes it telecentric on the incident side with respect to the illumination region IR.

11A and 11B are diagrams illustrating an example of the configuration of the illumination system IU. FIG. 11A is a front view seen from the scanning direction (X-axis direction). FIG. 11B is a side view seen from the non-scanning direction (Y-axis direction). FIG. 12 is a table 2 showing an example of specifications of the illumination system IU.

The illumination optical system 21 in FIGS. 11A and 11B telecentrically illuminates the cylindrical lens 143 (deflection member) that deflects the illumination light L1 from the light guide rod 51 and the illumination light L1 from the cylindrical lens 143 on the incident side of the illumination region IR. A condenser lens 144 is provided.

The cylindrical lens 143 is configured so that the direction of the principal ray of the illumination light L1 when entering the illumination area IR is substantially parallel to the optical axis 40 of the projection system PL (first projection optical system PL1). Is deflected in a plane substantially perpendicular to the rotation center axis AX1. The cylindrical lens 143, for example, does not substantially collect light propagating along a plane perpendicular to the scanning direction (YZ plane in FIG. 11A), and is on a plane perpendicular to the non-scanning direction (XZ plane in FIG. 11B). It is configured to collect light propagating along.
The focal length fi of the cylindrical lens 143 is expressed by the following formula (1), where b (see FIG. 10) is the distance from the center line of the light guide rod 51 to the cylindrical lens 143.
fi = b (f2 × R + f1 × b) / (f2 × R) (1)

In the present embodiment, the exposure apparatus EX is provided with a plurality of projection modules PM, and the cylindrical lens 143 covers the dimension (width) of the substrate P in the non-scanning direction so that it can be shared by the plurality of projection modules PM. It has enough length to do. In other words, the cylindrical lens 143 is provided over the entire range where a plurality of fields of view by the plurality of projection modules PM are distributed in the non-scanning direction so as to collectively deflect the illumination light L1 from the plurality of projection modules PM. ing.

11A and 11B includes a condenser lens 144 including a lens 53a, a lens 53b, and a lens 53c. Examples of each lens of the condenser lens 144 are shown in Table 2 of FIG.

Hereinafter, an optical surface whose surface number is n in Table 2 is represented by an nth optical surface An. The eleventh optical surface A11 and the twelfth optical surface A12 are surfaces of the lens 53a. The thirteenth optical surface A13 and the fourteenth optical surface A14 are surfaces of the lens 53b. The fifteenth optical surface A15 and the sixteenth optical surface A16 are surfaces of the lens 53c.
Table 2 shows the radius of curvature and dimensions of each optical surface in each of the scanning direction and the non-scanning direction. “Distance between centers” in Table 2 indicates the distance from the center of the optical surface to the center of the next optical surface. For example, the “center distance” corresponding to the surface number 11 indicates the distance from the center of the eleventh optical surface A11 to the center of the twelfth optical surface A12, and corresponds to the thickness of the center of the lens 53a.
The “center distance” corresponding to the surface number 16 indicates the distance from the center of the sixteenth optical surface A16 to the center of the illumination region IR (mask pattern M).

The condenser lens 144 is configured such that the illumination light L1 illuminates the illumination region IR (mask pattern M) telecentrically. Here, an equivalent lens that is optically equivalent to the condenser lens 144 and the cylindrical lens 143 is assumed. The front focal position of the equivalent lens is set at substantially the same position as the light source image 54 (see FIG. 10) formed inside the light guide rod 51. The rear focal position of the equivalent lens is set at substantially the same position as the illumination area IR.
The light source image 54 is formed on or near the center line of the light guide rod 51, for example.

Since the cylindrical lens 143 has substantially no refractive power in the non-scanning direction (Y-axis direction), the condenser lens 144 is, for example, the optical axis 40 of the first projection system optical system PL1 and the non-scanning direction (Y The focal length in the plane including (axial direction) is set to about half (R / 2) of the radius R of the rotating drum DM. The condenser lens 144 takes into consideration the refractive power of the cylindrical lens 143 in the scanning direction, and the focal length in the plane perpendicular to the non-scanning direction is set to a value different from R × (1 + f2 / f1) / 4.

In the condenser lens 144 of FIGS. 11A and 11B, the lenses 53a to 53c have curvatures in the scanning direction and the non-scanning direction as shown in Table 2 of FIG. 12 so that the number of condenser lenses 144 can be reduced. Are composed of different toric surfaces. In the condenser lens 144, the lens group including the lens 53a and the lens 53b has a positive refractive power, and the lens group including the lens 53c has a negative refractive power.

In the illumination system IU, for example, the cylindrical lens 143 is disposed at a position where the radius R of the rotating drum DM is 250 mm and the distance b (see FIG. 10) from the light source image 54 to the cylindrical lens 143 is about 80 mm. If so, the focal length of the cylindrical lens 143 is about 105.6 mm from the above equation (1). With such a cylindrical lens 143, the illumination light L1 (beam) from the light guide rod 51 is expanded about 4.125 times in the scanning direction.
Under such conditions, the condenser lens 144 corresponding to the example of Table 2 is disposed at a position of about 9 mm from the cylindrical lens 143, for example. The lens group including the lens 53a and the lens 53b is composed of a plurality of lenses for aberration correction, and the combined focal length thereof is, for example, about 197.41 mm in the scanning direction and about 130.77 mm in the non-scanning direction. The focal length in the scanning direction (XZ plane) when the condenser lens 144 and the cylindrical lens 143 are combined is, for example, 47.86 mm.
Needless to say, the shape and dimensions of the condenser lens 144 described above are merely examples, and can be changed as appropriate.

By the way, the magnification with which the cylindrical lens 143 spreads the illumination light L1 is different between the scanning direction and the non-scanning direction. When the spread of the illumination light L1 when entering the cylindrical lens 143 is isotropic, the illumination region IR In some cases, the spread of the illumination light L1 when incident on the light has anisotropy.
In the present embodiment, the cutout portion 52a (FIG. 10) of the light guide rod 51 is formed in, for example, an ellipse so that the illumination light L1 spreads isotropically when entering the illumination region IR, and the scanning direction And a dimension in the direction corresponding to the non-scanning direction (width in the Y-axis direction) are different from each other.

Since the exposure apparatus EX configured as described above guides the illumination light L1 from the light source to the illumination optical system 21 by the light guide rod 51, for example, the arrangement of the light source or the arrangement of the power line for supplying power to the light source is free. The degree becomes higher. Therefore, the exposure apparatus EX easily accommodates the illumination system IU inside the rotary drum DM when, for example, a plurality of projection modules PM are provided.

The exposure apparatus EX shown in FIG. 6 and the like has a configuration in which the exposure light L2 from the first projection optical system PL1 is deflected by the field lens 24 and directed to the second projection optical system PL2. Instead, the exposure light L2 may be deflected by a prism or the like.

In addition, the incident part of the light guide rod 51 is provided at a position selected as appropriate, and may be disposed either inside or outside the rotary drum DM. For example, the light source is disposed outside the rotating drum DM, and the light guide rod 51 is provided across the outside and inside of the rotating drum DM, and light from the light source enters the incident portion of the light guiding rod 51. Thus, it may be provided outside the rotating drum DM.
Further, the light source may be disposed inside the rotating drum DM, and the incident portion of the light guide rod 51 may be provided inside the rotating drum DM.

Further, the number of incident portions of the light guide rod 51 may be one, or may be two or more. For example, the light source may be provided only at one end in the Y-axis direction, and the incident portion of the light guide rod 51 may be provided at this one end.
Moreover, the light source may be provided at both ends in the Y-axis direction, and the incident portion of the light guide rod 51 may be provided at each of the both ends.

[Fourth Embodiment]
Next, a fourth embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof may be simplified or omitted. FIG. 13 schematically shows the exposure apparatus EX according to the present embodiment. FIG. 14 is a plan view showing an arrangement example of the projection regions PR.

In the exposure apparatus EX of FIG. 7, the plurality of projection modules PM are arranged in two rows, but the number of rows of the projection modules PM may be more than two. In the exposure apparatus EX of FIG. 13, the projection modules PM are arranged at four locations in the scanning direction as viewed from the non-scanning direction (Y-axis direction). In these projection modules PM, the optical axes 40 of the first projection optical system PL1 are set in different directions, and the optical axes 45 of the second projection optical system PL2 are set in different directions.

13 is provided so that each of the plurality of projection modules PM extends over a position where an intermediate image is formed. The field lens 24 deflects the exposure light L2 from each first projection optical system PL1 so as to be directed toward the second projection optical system PL2.

Corresponding to the position of the plurality of projection modules PM being shifted in the scanning direction (X-axis direction), the position of the projection region PR (see FIG. 14) by each projection module PM is the plurality of projection modules PM in the scanning direction. It is shifted by. The projection modules PM whose positions in the scanning direction are different from each other are arranged so that the positions in the non-scanning direction are also shifted, and the position of the projection region PR is also shifted in the non-scanning direction.

[Fifth Embodiment]
Next, a fifth embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof may be simplified or omitted. FIG. 15 is a view schematically showing the exposure apparatus EX according to the present embodiment.

In the exposure apparatus EX of FIG. 15, a plurality of projection modules PM are arranged in the scanning direction (X-axis direction) when viewed from the non-scanning direction (Y-axis direction), and the lens array extends across the optical path of the plurality of projection modules PM. Has been placed. For example, the lens array 55 is disposed across the optical path of the first projection module PMa and the optical path of the second projection module PMb. In the lens array 55, lens elements 56a of the first projection module PMa and lens elements 56b of the second projection module PMb are arranged.
In the present embodiment, the projection modules PM are arranged at four locations when viewed from the non-scanning direction, and the field lens 24 is provided over the four projection modules PM.

The lens array 55 can be realized, for example, by forming a plurality of lens elements using etching or the like on a plate such as quartz. The lens elements of the lens array 55 differ in curvature (focal length) and optical axis inclination according to the position of the projection module PM. The inclination of the optical axis can be realized by shifting the position of the center of curvature between the upper side and the lower side of each lens element. The curvature (focal length) can be realized by controlling the etching depth.

In the present embodiment, the lens array 55 in which the lens elements of the projection modules PM arranged in the scanning direction (X-axis direction) as viewed from the non-scanning direction (Y-axis direction) has been described. It is also possible to use a lens array 55 in which the lens elements of the projection modules PM arranged in the direction are arranged.
For example, a plurality of first projection modules PMa in FIG. 15 are arranged in the Y-axis direction, and the lens array 55 is provided across the optical paths of the plurality of first projection modules PM. PM lens elements may be arranged.

FIG. 15 shows an example in which the lens elements of the projection module PM are respectively provided in the lens array 55. Of the lens elements of the projection module PM, the number of lens elements provided in the lens array 55 is as follows. One may be sufficient. That is, the projection module PM may include lens elements provided in the lens array 55 and lens elements not provided in the lens array 55.
Further, when an optical member such as an aperture stop other than the lens is provided in the projection module PM, the optical member may be shared by the plurality of projection modules PM by arranging the optical member over the optical path of the plurality of projection modules PM.

[Sixth Embodiment]
Next, a sixth embodiment will be described. In the present embodiment, the same components as those in the above embodiment may be denoted by the same reference numerals, and the description thereof may be simplified or omitted. FIG. 16 is a view schematically showing the exposure apparatus EX according to the present embodiment.

The exposure apparatus EX described with reference to FIG. 2 and the like performs exposure using the transmission type mask pattern M. The exposure apparatus EX of FIG. 16 uses the illumination system IU arranged outside the rotary drum DM to reflect the mask pattern. M is illuminated and exposed with a light beam (exposure light L2) reflected and diffracted by the mask pattern M.

The illumination system IU in FIG. 16 includes a light source device 57 and a light separation unit 58. The light source device 57 includes, for example, the light source 20 and the illumination optical system 21 illustrated in FIG. 2 and emits illumination light L1. The light separation unit 58 includes a polarizing beam splitter prism (hereinafter referred to as a PBS prism 59), and a quarter wavelength plate 60 disposed in an optical path between the PBS prism 59 and the rotating drum DM (illumination region IR).

The light source device 57 emits S-polarized light with respect to the polarization separation film (PBS film 59a) of the PBS prism 59 as illumination light L1. Illumination light L1 emitted from the light source device 57 is reflected by the polarization separation film of the PBS prism 59, the traveling direction is bent, and the light passes through the quarter-wave plate 60 to be substantially circularly polarized and enter the illumination region IR. .
The reflected light beam (exposure light L2) generated by the mask pattern M illuminated by the illumination light L1 passes through the quarter-wave plate 60 to be P-polarized with respect to the PBS film 59a, and passes through the PBS film 59a to be a projection system. Incident on PL. In the projection system PL, the first projection optical system PL1 forms an intermediate image IM, and the second projection optical system PL2 projects the intermediate image IM onto the substrate P, as in the above-described embodiment.
For example, the PBS prism 59 and the light source device 57 are arranged so that the traveling direction of the exposure light L2 reflected and diffracted by the mask pattern M is substantially parallel (coaxial) to the optical axis 40 of the first projection optical system PL1. ing.

[Seventh Embodiment]
Next, a seventh embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof may be simplified or omitted. FIG. 17 is a view schematically showing the exposure apparatus EX according to the present embodiment.

The exposure apparatus EX described in FIG. 2 and the like performs projection exposure on the curved projection area PR, but the exposure apparatus EX in FIG. 17 performs projection exposure on the planar projection area PR. In FIG. 17, the substrate P is stretched over and supported by a transport roller 61a and a transport roller 61b. The projection region PR is set on the substrate P that is transported in a plane between the transport roller 61a and the transport roller 61b.
In the present embodiment, a support member 62 that supports a portion of the substrate P passing through the projection region PR is provided. The support member 62 has an air pad surface 62a in which, for example, a blow-out port that blows out gas and a suction port that sucks gas from the blow-out port are arranged. The support member 62 supports the substrate P in a non-contact manner on the air pad surface 62a so as to keep the substrate P flat in the projection region PR.

In FIG. 17, the substrate P is stretched between the transport roller 61 b and the transport roller 61 c, and the substrate P is transported symmetrically with respect to the center plane 13. The exposure apparatus EX can be a multi-lens type exposure apparatus by adding a projection system PL (projection module PM) to the transport path between the transport roller 61b and the transport roller 61c.
Further, the conveyance path between the conveyance roller 61b and the conveyance roller 61c may be asymmetric with respect to the conveyance path between the conveyance roller 61a and the conveyance roller 61b with respect to the center plane 13. In this case, the inclination of the optical axis of the projection module PM to be added, the position in the X-axis direction, and the like can be appropriately set according to the inclination of the projection region PR.

As described above, the exposure apparatus EX may be configured to expose the substrate P supported in a planar shape.
Further, in the above-described embodiment, the configuration in which the mask pattern M is held in a state of being curved into a cylindrical surface and the exposure process is performed has been described. However, the mask pattern M is held in a planar shape, and the substrate P is cylindrical. A configuration in which exposure processing is performed while being supported in a curved state in a planar shape may be used. In this configuration, the second projection optical system PL2 satisfies the Shine proof condition between the tangent plane IMa of the intermediate image IM and the tangent plane PRa of the projection region PR so that the first projection optical system PL1 has a conjugate relationship. The formed intermediate image can be projected with high accuracy.

[Device manufacturing method]
Next, a device manufacturing method will be described. FIG. 18 is a flowchart showing the device manufacturing method of the present embodiment.

In the device manufacturing method shown in FIG. 18, first, function / performance design of a device such as a liquid crystal display panel or an organic EL display panel is performed (step 201). Next, a mask pattern M is manufactured based on the device design (step 202). In addition, a substrate such as a transparent film or sheet, which is a base material of the device, or an ultrathin metal foil is prepared by purchasing or manufacturing (step 203).

Next, the prepared substrate is put into a roll-type or patch-type production line, and the TFT backplane layers such as electrodes, wiring, insulating film, and semiconductor film constituting the device on the substrate, and organic EL light emission that becomes the pixel portion A layer is formed (step 204). Step 204 typically includes a step of forming a resist pattern on a film on the substrate and a step of etching the film using the resist pattern as a mask.
For forming the resist pattern, a step of uniformly forming a resist film on the substrate surface, and a step of exposing the resist film on the substrate with the exposure light L2 patterned via the mask pattern M according to each of the above embodiments. Then, a step of developing the resist film on which the latent image of the mask pattern is formed by the exposure is performed.

In the case of flexible device manufacturing using printing technology together, a process of forming a functional photosensitive layer (photosensitive silane coupling material, etc.) on the substrate surface by a coating method, via the mask pattern M according to each of the above embodiments The step of irradiating the functional photosensitive layer with the patterned exposure light L2 to form a hydrophilic portion and a water repellent portion according to the pattern shape on the functional photosensitive layer, the hydrophilicity of the functional photosensitive layer A step of applying a plating base solution or the like to a high portion and depositing a metallic pattern by electroless plating is performed.

Then, depending on the device to be manufactured, for example, the substrate is diced or cut, or another substrate manufactured in a separate process, for example, a sheet-like color filter having a sealing function or a thin glass substrate is attached. The combining process is performed to assemble the device (step 205). Next, post-processing such as inspection is performed on the device (step 206). A device can be manufactured as described above.

Note that the technical scope of the present invention is not limited to the above embodiment. For example, one or more of the elements described in the above embodiments may be omitted. The elements described in the above embodiments can be combined as appropriate.

M ... Mask pattern, P ... Substrate, 23 ... Intermediate imaging plane, 23a ... Tangent plane, 24 ... Field lens, 47, 48 ... Optical member, 49 ... Aperture 55, lens array, 56a, 56b, lens element, DM, rotating drum (mask holding member), DP, rotating drum (substrate support member), DPa, outer peripheral surface (supporting) Surface), EX ... exposure apparatus, IM ... intermediate image, IMa ... tangent plane, IR ... illumination area, IRa ... tangent plane, IU ... illumination system, L1 ... illumination Light, L2 ... exposure light, PL1 ... first projection optical system (intermediate image forming optical system), PL2 ... second projection optical system (projection optical system), PM ... projection module, PR. ..Projection area, PRa ... tangent plane, U3 ... processing device.

Claims (16)

1. A processing apparatus for projecting and exposing a pattern formed on a mask pattern onto a substrate,
   A mask holding member for holding the mask pattern in a curved state;
   A substrate support member for supporting the substrate;
   An illumination system for illuminating a part of the mask pattern;
   An intermediate image corresponding to an illumination area formed on the mask pattern is formed by the illumination system, and a tangential plane of the intermediate image and a tangential plane of the illumination area on the mask pattern satisfy a Scheinproof condition. An intermediate image forming optical system in a conjugate relationship;
   And a projection optical system that projects the intermediate image onto a projection area on the substrate supported by the substrate support member.
2. The processing apparatus according to claim 1, wherein the projection optical system has a conjugate relationship between the tangent plane of the intermediate image and the tangent plane of the projection region by satisfying a Scheinproof condition.
3. The substrate support member includes a support surface that supports the substrate in a state of being curved into a cylindrical surface,
   The processing apparatus according to claim 2, wherein the projection region is curved along a support surface of the substrate support member.
4. The processing apparatus according to any one of claims 1 to 3, wherein the illumination system illuminates the illumination area from a direction non-perpendicular to the tangential plane of the illumination area.
5. The mask pattern is a transmissive mask pattern,
   The processing apparatus according to claim 4, wherein the illumination system is disposed inside the mask holding member.
6. The mask holding member holds the mask pattern in a state of being curved into a cylindrical surface that is rotationally symmetric around a center line,
   In a plane perpendicular to the center line of the cylindrical surface, the radial direction of the cylindrical surface passing through a proximity point closest to the substrate in the mask pattern is opposite to the proximity point with respect to the center line, and from the illumination system. The processing apparatus according to claim 5, wherein the processing apparatus intersects with the light emission direction.
7. A processing apparatus for projecting and exposing a pattern formed on a mask pattern onto a substrate,
   A mask holding member for holding the mask pattern;
   A substrate support member for supporting the substrate in a curved state;
   An illumination system for illuminating a part of the mask pattern;
   An intermediate image forming optical system for forming an intermediate image corresponding to an illumination area formed on the mask pattern by the illumination system;
   The intermediate image is projected onto a projection area on the substrate supported by the substrate support member, and the tangent plane of the intermediate image and the tangent plane of the projection area satisfy a Scheinproof condition and have a conjugate relationship. A projection optical system.
8. The processing apparatus according to claim 1, further comprising a field lens disposed at or near a position where the intermediate image is formed.
9. The processing device according to claim 8, wherein the field lens deflects light from the intermediate image forming optical system and directs the light to the projection optical system.
10. The field lens is
    A first optical member disposed on the same side as the illumination area with respect to the tangential plane of the intermediate image;
    A second optical member disposed on the opposite side of the illumination area with respect to the tangent plane of the intermediate image;
    The processing apparatus according to claim 8, further comprising: a diaphragm portion sandwiched between the first optical member and the second optical member.
11. The processing apparatus according to any one of claims 1 to 10, comprising a plurality of the intermediate image forming optical systems and a plurality of the projection optical systems,
    A moving device for moving the substrate and the mask pattern;
    A first projection module including a first intermediate image forming optical system and a first projection optical system;
    A second projection module that is disposed at a position different from the first projection module with respect to the moving direction of the moving device and includes a second intermediate image forming optical system and a second projection optical system;
    A part of the area on the substrate that passes through the projection area of the first projection module according to the movement by the moving device, and a part on the substrate that passes through the projection area of the second projection module according to the movement by the moving apparatus. The first projection module and the second projection module are arranged at different positions in a direction perpendicular to the moving direction by the moving device so that a part of the region overlaps.
12. The processing apparatus according to claim 11, further comprising a field lens provided across the imaging plane of the first projection module and the imaging plane of the second projection module.
13. A plurality of the first projection modules are arranged in the direction perpendicular to the moving direction by the moving device,
    The processing apparatus of Claim 11 or 12 provided with the field lens provided over the imaging surface of these 1st projection modules.
14. Arranged across the optical path of the first projection module and the optical path of the second projection module;
    The processing apparatus according to any one of claims 11 to 13, further comprising a lens array in which lens elements of the first projection module and lens elements of the second projection module are arranged.
15. A plurality of the first projection modules are arranged in the direction perpendicular to the moving direction by the moving device,
    The processing apparatus according to any one of claims 11 to 14, further comprising a lens array that is disposed over an optical path of the plurality of first projection modules and in which lens elements of the plurality of first projection modules are disposed.
16. Projecting and exposing the pattern formed on the mask pattern onto the substrate by the processing apparatus according to any one of claims 1 to 15, while moving the substrate having the sensitive layer and the mask pattern;
    Performing a subsequent process using a change in the sensitive layer of the projection-exposed substrate.

Images