JP6927348B2 - Pattern formation method - Google Patents

Description

The present invention relates to a pattern forming method.
The present application claims priority based on Japanese Patent Application No. 2011-278290 filed on December 20, 2011, and Japanese Patent Application No. 2012-024058 filed on February 7, 2012, the contents of which are hereby set forth. Invite.

Substrate processing devices such as exposure devices are used in the manufacture of various devices, for example, as described in Patent Document 1 below. The substrate processing apparatus can project an image of a pattern formed on the mask M arranged in the illumination region onto a substrate or the like arranged in the projection region. The mask M used in the substrate processing apparatus includes a flat one, a cylindrical one, and the like.

Further, as one of the methods for manufacturing a device, for example, a roll-to-roll method as described in Patent Document 2 below is known. The roll-to-roll method is a method in which a substrate such as a film is conveyed from a roll for delivery to a roll for collection, and various processes are performed on the substrate along a transfer path. The substrate may be treated in a substantially flat state, for example, between transport rollers. Further, the substrate may be treated in a curved state, for example, on the surface of a roller.

JP-A-2007-299918 International Publication 2008/129819

In the substrate processing apparatus (exposure apparatus) as described above, for example, when one or both of the illumination region on the mask and the projection region on the substrate are curved with a predetermined curvature, the imaging of the projection optical system used for exposure is formed. Considering the performance, there are restrictions on the setting of the main ray of the imaging light beam. For example, the surface of a substrate (film, sheet, web, etc.) in which a mask pattern formed on the outer peripheral cylindrical surface of a cylindrical rotating mask having a radius R is wound around a cylindrical rotating drum (roller) having a radius R by a projection optical system. Let's assume the case of forming an image and projecting on. In this case, in general, the main rays of the imaging light beam from the mask pattern (cylindrical surface shape) to the surface of the substrate (cylindrical surface shape) are the rotation center axis of the cylindrical rotation mask and the rotation center axis of the cylindrical rotation drum. A projection optical system that forms an optical path that linearly connects the two may be provided.

However, when the size of the mask pattern is large with respect to the direction of the rotation axis of the cylindrical rotation mask, it may be necessary to provide a plurality of such projection optical systems in the direction of the rotation axis. In the case of such multi-layering, even if a plurality of projection optical systems are densely arranged in a row in the direction of the rotation axis, the projection fields (projection areas) of each projection optical system are equal to the thickness of a metal object such as a lens barrel. However, it is always separated, and it is no longer possible to faithfully expose a large mask pattern.

Further, in the substrate processing apparatus as described above, for example, if the configuration of the apparatus is complicated, the cost of the apparatus may be high, the size of the apparatus may be large, and the like. As a result, the manufacturing cost of the device can be high.

For example, when precise patterning is required, a mask on which a pattern of an electronic device or a display device is drawn is illuminated as a substrate processing device, and a photosensitive layer (photoresist or the like) forms light from the mask pattern. An exposure apparatus is used that projects and exposes on the substrate. Even when the mask pattern is repeatedly exposed on a flexible long substrate (film, sheet, web, etc.) that is continuously transported by the roll-to-roll method, the transport direction of the long substrate is scanned in the scanning direction. Therefore, it is expected that productivity can be dramatically improved by using a scanning exposure apparatus in which the mask is a cylindrical rotating mask.

Such a rotating mask includes a transmission method in which a pattern is formed on the outer peripheral surface of a transparent cylindrical body such as glass with a light-shielding layer, and a reflecting portion and an absorbing portion on the outer peripheral surface of a metallic cylindrical body (which may be a cylindrical body). There is a reflection method in which a pattern is formed by. In the transmission type cylindrical mask, it is necessary to incorporate an illumination optical system (optical members such as a mirror and a lens) for irradiating the illumination light directed to the pattern on the outer peripheral surface inside the cylindrical mask, and the inside of the cylindrical mask. It is difficult to pass the rotation axis through the center, and the holding structure of the cylindrical mask and the configuration of the rotation drive system may become complicated.

On the other hand, in the case of a reflective cylindrical mask, since a metal cylinder (or cylinder) can be used, the mask can be produced at low cost, but the outer space of the cylindrical mask is illuminated with illumination light for exposure. It is necessary to provide an optical system and a projection optical system that projects the reflected light from the pattern formed on the outer peripheral surface toward the substrate, and the configuration on the exposure device side to satisfy the required resolution, transfer fidelity, etc. Can be complicated.

An aspect of the present invention is to allow a large mask pattern to be faithfully exposed even if one or both of the mask or the substrate (flexible substrate such as a film, sheet, web, etc.) is arranged in a cylindrical surface shape. It is an object of the present invention to provide a cylindrical mask exposure apparatus equipped with a projection optical system. Another object is to provide a pattern forming method that allows a large mask pattern to be faithfully exposed.

Another object is to provide a pattern forming method that can simplify the configuration of the device. Another object is to provide a pattern forming method capable of reducing the manufacturing cost.

According to one aspect of the present invention, it is a pattern forming method for forming a pattern for a device on the sheet substrate while continuously feeding a flexible sheet substrate in a long direction, wherein the pattern of the device is formed. The transmissive or reflective mask pattern corresponding to the above rotates a cylindrical mask formed along a cylindrical surface having a constant radius from the first center line around the first center line, and at the same time, the first center line. The cylindrical drum is supported by bending a part of the sheet substrate into a cylindrical surface shape by a cylindrical drum having a cylindrical outer peripheral surface having a constant radius from the second center line set substantially parallel to the above. Rotating around the second centerline to synchronize the velocity of the mask pattern along the cylindrical surface with the velocity along the outer peripheral surface of the sheet substrate and the first centerline or the second. When viewed from the direction in which the center line extends, the mask pattern is arranged symmetrically with respect to the center surface including the first center line and the second center line, and the mask pattern is an image of the object surface and the surface of the sheet substrate. When it is a surface, among the main rays of the imaging light beam directed from the object surface to the image plane, the extension line of the main ray passing through the object surface is directed to the first center line, and the main ray passing through the image plane. A pattern forming method is provided including scanning and exposing a projected image of the mask pattern onto the sheet substrate by a set of projection optical systems arranged so that the extension line faces the second center line.

According to the aspect of the present invention, even when one or both of the mask and the substrate have a cylindrical surface shape, a large mask pattern can be faithfully exposed by a cylindrical mask exposure apparatus provided with a compact projection optical system. Further, according to the aspect of the present invention, it is possible to provide a pattern forming method capable of faithfully exposing a large mask pattern.

Further, according to the aspect of the present invention, it is possible to provide a pattern forming method that can simplify the configuration of the device. Further, according to the aspect of the present invention, it is possible to provide a pattern forming method capable of reducing the manufacturing cost.

It is a figure which shows the structure of the device manufacturing system by 1st Embodiment. It is a figure which shows the whole structure of the substrate processing apparatus (exposure apparatus) by 1st Embodiment. It is a figure which shows the structure of the mask holding apparatus of the exposure apparatus shown in FIG. It is a figure which shows the structure of the 1st drum member and the illumination optical system of the exposure apparatus shown in FIG. It is a figure which shows the arrangement of the illumination area and the projection area in the exposure apparatus shown in FIG. It is a figure which shows the structure of the projection optical system applied to the exposure apparatus shown in FIG. It is a figure which shows the whole structure of the exposure apparatus by 2nd Embodiment. It is a figure which shows the whole structure of the exposure apparatus by 3rd Embodiment. It is a figure explaining the condition of the positional relationship of the projection area of the illumination area in the exposure apparatus shown in FIG. It is a graph which shows that the condition described in FIG. 9 changes according to the radius of a cylindrical mask. It is a figure which shows the whole structure of the exposure apparatus by 4th Embodiment. It is a figure which shows the structure of the epi-illumination system of the exposure apparatus according to 5th Embodiment. It is a figure which shows the structure of the projection optical system by 6th Embodiment. It is a figure which shows the structure in the case of mulching the projection optical system shown in FIG. It is a figure which looked at the mulched projection optical system shown in FIG. 14 from another direction. It is a figure which shows the structure of the projection optical system by 7th Embodiment. It is a figure which shows the structure of the projection optical system by 8th Embodiment. It is a figure which shows the structure of the projection optical system by 9th Embodiment. It is a figure which shows the structure of the projection optical system by 10th Embodiment. It is a figure which shows the structure of the device manufacturing system of 11th Embodiment. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) of 11th Embodiment. It is a figure which shows the structure of the optical member of 11th Embodiment. It is a schematic diagram which shows the optical path from an illumination area to a projection area. It is a figure which shows the structural example of the light source apparatus of 11th Embodiment. It is a figure which shows the structural example of the fly eye lens array of 11th Embodiment. It is a figure which shows the structural example of the diaphragm in the illumination optical system of 11th Embodiment. It is a figure which shows the structural example of the optical member of 11th Embodiment. It is a figure which shows the structural example of the fly eye lens array of the twelfth embodiment. It is a figure which shows the structural example of the fly eye lens array of 13th Embodiment. It is a figure which shows the structural example of the fly eye lens array of 14th Embodiment. It is a figure which shows the structural example of the light source image forming part of 15th Embodiment. It is a figure which shows the structural example of the illumination optical system of 16th Embodiment. It is a figure which shows the structural example of the illumination optical system of 16th Embodiment. It is a figure which shows each part of the illumination optical system of 16th Embodiment. It is a figure which shows each part of the illumination optical system of 16th Embodiment. It is a figure which shows each part of the illumination optical system of 16th Embodiment. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) of 17th Embodiment. It is a figure which shows the arrangement of the illumination area and the projection area of 17th Embodiment. It is a figure which shows the structural example of the exposure apparatus of 17th Embodiment. It is a figure which shows the structural example of the projection optical system of 18th Embodiment. It is a figure which shows the structural example of the projection optical system of 19th Embodiment. It is a flowchart which shows the device manufacturing method of this embodiment.

[First Embodiment]
FIG. 1 is a diagram showing a configuration of the device manufacturing system 1001 of the present embodiment. The device manufacturing system 1001 shown in FIG. 1 is processed by a substrate supply device 1002 that supplies a substrate P, a processing device 1003 that executes a predetermined process on the substrate P supplied by the substrate supply device 2, and a processing device 1003. It is provided with a substrate recovery device 1004 for recovering the substrate P to which the above-mentioned is applied, and a higher-level control device 1005 for controlling each part of the device manufacturing system 1001.

In the present embodiment, the substrate P is a (sheet) substrate having flexibility (flexibility) such as a so-called flexible substrate. In the device manufacturing system 1001 of the present embodiment, the flexible device can be manufactured by the flexible substrate P. The substrate P is selected to be flexible enough not to break when bent, for example, in the device manufacturing system 1001.

The flexibility of the substrate P at the time of device manufacturing can be adjusted by, for example, the material, size, thickness, etc. of the substrate P, and also by the environmental conditions such as humidity and temperature at the time of device manufacturing. You can also do it. Further, the substrate P may be a substrate having no flexibility such as a so-called rigid substrate or the like. Further, the substrate P may be a composite substrate in which a flexible substrate and a rigid substrate are combined.

The flexible substrate P is, for example, a resin film, a foil made of a metal such as stainless steel, or an alloy. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or includes 2 or more.

For the substrate P, for example, characteristics such as a coefficient of thermal expansion are set so that the amount of deformation due to heat received in various processing steps applied to the substrate P can be substantially ignored. As an example, the substrate P can be selected so that the coefficient of thermal expansion is not remarkably large. The coefficient of thermal expansion may be set smaller than the threshold value according to the process temperature or the like by, for example, mixing an inorganic filler with the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. Further, the substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminate obtained by laminating the above resin film, foil or the like on the ultrathin glass. It may be.

In the present embodiment, the substrate P is a so-called multi-chamfering substrate. The device manufacturing system 1001 of the present embodiment repeatedly executes various processes for manufacturing one device on the substrate P. The substrate P subjected to various treatments is divided (diced) for each device into a plurality of devices. The dimensions of the substrate P are, for example, about 1 m to 2 m in the width direction (short direction) and 10 m or more in the length direction (long direction).

The dimensions of the substrate P are appropriately set according to the dimensions of the device to be manufactured and the like. For example, the dimension of the substrate P may be 1 m or less or 2 m or more in the width direction, or 10 m or less in the long direction. Further, when the substrate P is a substrate for multi-chamfering, it may be a single strip-shaped substrate or a substrate in which a plurality of substrates are connected. Further, the device manufacturing system 1001 may manufacture a device by using an independent substrate for each device. In this case, the substrate P may be a substrate having dimensions corresponding to one device.

The substrate supply device 1002 of the present embodiment supplies the substrate P to the processing apparatus 1003 by feeding out the substrate P wound around the supply roll 1006. The substrate supply device 1002 includes, for example, a shaft portion around which the substrate P is wound, a rotation drive portion for rotating the shaft portion, and the like. In the present embodiment, the substrate P is conveyed in the elongated direction thereof and sent to the processing apparatus 1003. That is, in the present embodiment, the transport direction of the substrate P is substantially the same as the elongated direction of the substrate P.

The substrate supply device 1002 may include a cover portion or the like that covers the substrate P wound around the supply roll 1006. Further, the substrate supply device 1002 may include a mechanism for sequentially feeding the substrate P in the elongated direction thereof, such as a nip-type drive roller or the like.

The substrate recovery device 1004 of the present embodiment recovers the substrate P by winding the substrate P that has passed through the processing device 1003 on the recovery roll 1007. The substrate recovery device 1004 includes, for example, a shaft portion around which the substrate P is wound, a rotation drive unit for rotating the shaft portion, a cover portion for covering the substrate P wound around the recovery roll 1007, and the like, similarly to the substrate supply device 1002. including.

The processed substrate P may be cut by a cutting device, and the substrate recovery device 1004 may recover the cut substrate. In this case, the substrate recovery device 1004 may be a device for stacking and collecting the cut substrates. The cutting device may be a part of the processing device 1003, may be a device different from the processing device 1003, or may be a part of the substrate recovery device 1004, for example.

The processing device 1003 transports the substrate P supplied from the substrate supply device 1002 to the substrate recovery device 1004, and processes the surface to be processed of the substrate P in the process of transporting the substrate P. The processing device 1003 includes a processing device 1010 that performs processing on the surface to be processed of the substrate P, and a transfer device 1009 including a transfer roller 1008 that feeds the substrate P under conditions corresponding to the processing.

The processing apparatus 1010 includes one or more apparatus that executes various processes for forming elements constituting the device with respect to the surface to be processed of the substrate P. In the device manufacturing system 1001 of the present embodiment, devices for executing various processes are appropriately provided along the transport path of the substrate P, and devices such as flexible displays can be produced by a so-called roll-to-roll method. According to the roll-to-roll method, devices can be produced efficiently.

In the present embodiment, various devices of the processing device 1010 include a film forming device, an exposure device, a coater developer device, and an etching device. The film forming apparatus is, for example, a plating apparatus, a vapor deposition apparatus, a sputtering apparatus, or the like. The film forming apparatus forms a functional film such as a conductive film, a semiconductor film, and an insulating film on the substrate P. The coater developer apparatus forms a photosensitive material such as a photoresist film on the substrate P on which the functional film is formed by the film forming apparatus. The exposure apparatus exposes the substrate P by projecting an image of a pattern corresponding to the film pattern constituting the device onto the substrate P on which the photosensitive material is formed. The coater developer device develops the exposed substrate P. The etching apparatus etches the functional film using the photosensitive material of the developed substrate P as a mask M. In this way, the processing apparatus 1010 forms a functional film having a desired pattern on the substrate P.

The processing apparatus 1010 may include an apparatus for directly forming a film pattern without etching, such as an imprint type film forming apparatus and a droplet ejection apparatus. At least one of the various devices of the processing device 1010 may be omitted.

In the present embodiment, the host control device 1005 controls the substrate supply device 1002 to cause the substrate supply device 1002 to perform a process of supplying the substrate P to the processing processing device 1010. The host control device 1005 controls the processing device 1010 to cause the processing device 1010 to perform various processes on the substrate P. The host control device 1005 controls the substrate recovery device 1004 to cause the substrate recovery device 1004 to perform a process of recovering the substrate P to which the processing processing device 1010 has been subjected to various treatments.

Next, the configuration of the substrate processing apparatus of this embodiment will be described with reference to FIGS. 2, 3, and 4. FIG. 2 is a diagram showing an overall configuration of the substrate processing apparatus 1011 of the present embodiment. The substrate processing apparatus 1011 shown in FIG. 2 is at least a part of the processing apparatus 1010 as described above. The substrate processing device 1011 of the present embodiment includes an exposure device EX that executes an exposure process and at least a part of a transfer device 1009.

The exposure apparatus EX of the present embodiment is a so-called scanning exposure apparatus, and is formed on the mask M while synchronously driving the rotation of the cylindrical mask (cylindrical mask) M and the feeding of the flexible substrate P. The image of the pattern is projected onto the substrate P via the projection optical system PL (PL1001 to PL1006) having a projection magnification of 1 (× 1). In FIGS. 2 to 4, the Y axis of the Cartesian coordinate system XYZ is set parallel to the rotation center line (first center line) AX1001 of the cylindrical mask M, and the X axis is set in the direction of scanning exposure, that is, It is set in the transport direction of the substrate P at the exposure position.

As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 1012, an illumination device 1013, a projection optical system PL, and a control device 1014. The substrate processing device 1011 rotates and moves the mask M held by the mask holding device 1012, and transports the substrate P by the transport device 1009. The illumination device 1013 illuminates a part of the mask M (illumination region IR) held by the mask holding device 1012 with an illumination luminous flux EL1 with uniform brightness. The projection optical system PL projects an image of the pattern in the illumination region IR on the mask M onto a part of the substrate P (projection region PA) transported by the transport device 1009. As the mask M moves, the portion on the mask M arranged in the illumination area IR changes, and as the substrate P moves, the portion on the substrate P arranged in the projection area PA changes. , An image of a predetermined pattern (mask pattern) on the mask M is projected on the substrate P. The control device 1014 controls each part of the exposure apparatus EX, and causes each part to execute the process. Further, in the present embodiment, the control device 1014 controls at least a part of the transfer device 1009.

The control device 1014 may be a part or all of the higher-level control device 1005 of the device manufacturing system 1001. Further, the control device 1014 is controlled by the upper control device 1005 and may be a device different from the upper control device 1005. The control device 1014 includes, for example, a computer system. A computer system includes, for example, a CPU and hardware such as various memories, an OS, and peripheral devices. The operation process of each part of the board processing apparatus 1011 is stored in a computer-readable recording medium in the form of a program, and various processes are performed by reading and executing this program by the computer system. The computer system also includes a homepage providing environment (or display environment) when it can be connected to the Internet or an intranet system. The computer-readable recording medium includes a flexible disk, a magneto-optical disk, a portable medium such as a ROM or a CD-ROM, and a storage device such as a hard disk built in a computer system. A computer-readable recording medium is one that dynamically holds a program for a short period of time, such as a communication line when a program is transmitted via a network such as the Internet or a communication line such as a telephone line. It also includes programs that hold programs for a certain period of time, such as volatile memory inside a computer system that serves as a server or client. Further, the program may be for realizing a part of the functions of the board processing device 1011 or may be realized by combining the functions of the board processing device 1011 with a program already recorded in the computer system. The host control device 1005 can be realized by using a computer system in the same manner as the control device 1014.

Next, each part of the exposure apparatus EX of FIG. 2 will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a diagram showing the configuration of the mask holding device 1012, and FIG. 4 is a diagram showing the configuration of the first drum member 1021 and the illumination optical system IL.

As shown in FIG. 3 (FIG. 2), the mask holding device 1012 has a first member (hereinafter referred to as a first drum member 1021) for holding the mask M, a guide roller 1023 for supporting the first drum member 1021, and a first member. It includes a drive roller 1024 that drives the drum member 1021, a first detector 1025 that detects the position of the first drum member 1021, and a first drive unit 1026.

As shown in FIG. 4 (FIG. 2 or 3), the first drum member 1021 forms the first surface p1001 on which the illumination region IR on the mask M is arranged. In the present embodiment, the first surface p1001 includes a surface (hereinafter referred to as a cylindrical surface) in which a line segment (generatrix) is rotated around an axis parallel to the line segment (first central axis AX1001). The cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a cylinder, or the like. The first drum member 1021 is made of, for example, glass or quartz, and has a cylindrical shape having a certain wall thickness, and its outer peripheral surface (cylindrical surface) forms the first surface p1001. That is, in the present embodiment, the illumination region IR on the mask M is curved in a cylindrical surface shape having a constant radius r1001 (see FIG. 1) from the rotation center line AX1001. Of the first drum member 1021, the portion of the first drum member 1021 that overlaps the pattern of the mask M when viewed from the radial direction, for example, the central portion of the first drum member 1021 other than both ends in the Y-axis direction as shown in FIG. , It has translucency with respect to the illumination luminous flux EL1001.

The mask M is created as a transmissive flat sheet mask in which a pattern is formed on one surface of, for example, a strip-shaped ultrathin glass plate (for example, a thickness of 100 to 500 μm) having good flatness with a light-shielding layer such as chromium. It is used in a state of being curved along the outer peripheral surface of the first drum member 21 and wound (pasted) around the outer peripheral surface. The mask M has a pattern non-forming region in which a pattern is not formed, and is attached to the first drum member 1021 in the pattern non-forming region. The mask M can be removed (released) from the first drum member 1021.

The mask M is made of an ultrathin glass plate, and instead of winding the mask M around the first drum member 1021 made of a transparent cylindrical base material, chrome or the like is directly applied to the outer peripheral surface of the first drum member 1021 made of a transparent cylindrical base material. A mask pattern formed by a light-shielding layer may be drawn and formed and integrated. Also in this case, the first drum member 1021 functions as a support member for the mask (first object).

The first drum member 1021 may have a structure in which a thin plate-shaped mask M is curved and attached to the inner peripheral surface thereof. Further, the mask M may be formed with all or a part of the panel pattern corresponding to one display device, or the panel pattern corresponding to a plurality of display devices may be formed. Further, a plurality of panel patterns may be repeatedly arranged on the mask M in the circumferential direction around the first central axis AX1001, or a small panel pattern may be repeatedly arranged in a direction parallel to the first central axis AX1001. Multiple may be arranged. Further, the mask M may include a panel pattern of the first display device and a panel pattern of the second display device having a size or the like different from that of the first display device. Further, on the outer peripheral surface (or inner peripheral surface) of the first drum member 1021, a plurality of separated thin plate-shaped masks M can be individually attached in a direction parallel to the first central axis AX1001 or in a circumferential direction. It may be provided.

The guide roller 1023 and the drive roller 1024 shown in FIG. 3 extend in the Y-axis direction parallel to the first central axis AX1001 of the first drum member 1021. The guide roller 1023 and the drive roller 1024 are rotatably provided around an axis parallel to the first central axis AX1001. Each of the guide roller 1023 and the drive roller 1024 has an outer diameter at an end portion in the axial direction larger than the outer diameter of the other portion, and this end portion is circumscribed with the first drum member 1021. As described above, the guide roller 1023 and the drive roller 1024 are provided so as not to come into contact with the mask M held by the first drum member 1021. The drive roller 1024 is connected to the first drive unit 1026. The drive roller 1024 rotates the first drum member 1021 around the first central axis AX1001 by transmitting the torque supplied from the first drive unit 1026 to the first drum member 1021.

The mask holding device 1012 includes one guide roller 1023 and one drive roller 1024, but the number of guide rollers 1023 may be two or more, and the number of drive rollers 1024 may be two or more. At least one of the guide roller 1023 and the drive roller 1024 is arranged inside the first drum member 1021 and may be inscribed in the first drum member 1021. Further, of the first drum member 1021, the portions (both ends in the Y-axis direction) that do not overlap with the pattern of the mask M when viewed from the radial direction of the first drum member 1021 have translucency with respect to the illumination luminous flux EL1. It may or may not have translucency. Further, one or both of the guide roller 1023 and the drive roller 1024 may be, for example, a truncated cone shape, and the central axis (rotational axis) thereof may be non-parallel to the first central axis AX1001.

The first detector 1025 optically detects the rotational position of the first drum member 1021. The first detector 1025 includes, for example, a rotary encoder and the like. The first detector 1025 supplies information indicating the detected rotation position of the first drum member 1021 to the control device 1014. The first drive unit 1026 including an actuator such as an electric motor adjusts the torque for rotating the drive roller 1024 according to the control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the first drum member 1021 by controlling the first drive unit 1026 based on the detection result of the first detector 1025. In other words, the control device 1014 controls one or both of the rotation position and the rotation speed of the mask M held by the first drum member 1021.

A sensor (hereinafter referred to as a Y-direction position measurement sensor) that optically measures the position of the first drum member 1021 in the Y-axis direction in FIG. 3 can be added to the first detector 1025. The Y-direction position of the first drum member 1021 shown in FIGS. 2 and 3 is basically constrained so as not to fluctuate, but the exposed region or alignment mark on the substrate P is relative to the pattern of the mask M. It is conceivable to incorporate a mechanism (actuator) for finely moving the first drum member 1021 (mask M) in the Y direction for proper alignment. In such a case, the measurement information from the Y-direction position measurement sensor can also be used to control the Y-direction fine movement mechanism of the first drum member 1021.

As shown in FIG. 2, the transport device 1009 is a second support member (hereinafter, first) that forms a second surface p1002 on which the first transport roller 1030, the first guide member 1031, and the projection region PA on the substrate P are arranged. It includes a second drum member 1022), a second guide member 1033, a second transport roller 1034, a second detector 1035, and a second drive unit 1036. The transport roller 1008 shown in FIG. 1 includes a first transport roller 1030 and a second transport roller 1034.

In the present embodiment, the substrate P transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030. The substrate P that has passed through the first guide member 1031 is supported by the surface of the cylindrical or cylindrical second drum member (cylindrical body) 1022 having a radius r1002 and is conveyed to the second guide member 1033. The substrate P that has passed through the second guide member 1033 is conveyed downstream of the transfer path via the second transfer roller 1034. The rotation center line (second center line) AX1002 of the second drum member 1022 and the rotation center lines of the first transfer roller 1030 and the second transfer roller 1034 are both parallel to the Y axis. Set.

The first guide member 1031 and the second guide member 1033 move, for example, in a direction intersecting the width direction of the substrate P (moving in the XZ plane in FIG. 2), thereby acting on the substrate P in the transport path, or the like. To adjust. Further, the first guide member 1031 (and the first transport roller 1030) and the second guide member 1033 (and the second transport roller 1034) are configured to be movable in the width direction (Y direction) of the substrate P, for example. Therefore, the position of the substrate P wound around the outer circumference of the second drum member 1022 in the Y direction can be adjusted. The transport device 1009 may be capable of transporting the substrate P along the projection region PA of the projection optical system PL, and its configuration can be changed as appropriate.

The second drum member 1022 forms a second surface p1002 that supports a part including the projection region PA on the substrate P on which the imaging light flux from the projection optical system PL is projected in an arc shape. In the present embodiment, the second drum member 1022 is a part of the transport device 1009 and also serves as a support member (board stage) for supporting the substrate P to be exposed. That is, the second drum member 1022 may be a part of the exposure apparatus EX.

The second drum member 1022 is rotatable around its central axis (hereinafter referred to as the second central axis AX1002), and the substrate P is a cylindrical surface along the outer peripheral surface (cylindrical surface) on the second drum member 1022. It is curved in a shape, and the projection area PA is arranged in a part of the curved portion.

In the present embodiment, the radius r1001 of the portion of the outer peripheral surface of the first drum member 1021 around which the mask M is wound and the radius r1002 of the portion of the outer peripheral surface of the second drum member 1022 around which the substrate P is wound are defined as the radius r1001. It is set to be substantially the same. This is because it is assumed that the thickness of the thin plate-shaped mask M and the thickness of the substrate P are substantially equal.
On the other hand, for example, when a pattern is directly formed on the outer peripheral surface of the first drum member 1021 (transmissive cylindrical base material) with a chromium layer or the like, the thickness of the chromium layer can be ignored, so that the radius of the pattern surface of the mask is r1001. On the other hand, if the thickness of the substrate P is about 200 μm, the radius of the surface of the substrate P in the projection region PA is r1002 + 200 μm. In such a case, the radius r1002 of the portion of the outer peripheral surface of the second drum member 1022 around which the substrate P is wound may be reduced by the thickness of the substrate P.
Therefore, in order to set the conditions strictly, the radius of the pattern surface (cylindrical surface) of the mask supported by the outer peripheral surface of the first drum member 1021 is the substrate supported by the outer peripheral surface of the second drum member 1022. The radii of the first drum member 1021 and the second drum member 1022 may be determined so as to be equal to the radius of the surface of P.

In the present embodiment, the second drum member 1022 is rotated by the torque supplied from the second drive unit 1036 including the actuator such as an electric motor. The second detector 1035 includes, for example, a rotary encoder and the like, and optically detects the rotational position of the second drum member 1022. The second detector 1035 supplies the information indicating the detected rotation position of the second drum member 1022 to the control device 1014. The second drive unit 1036 adjusts the torque for rotating the second drum member 1022 according to the control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the second drum member 1022 by controlling the second drive unit 1036 based on the detection result of the second detector 1035, and controls the rotation position of the second drum member 1022, and the first drum member 1021 and the second drum member 1022. And are moved synchronously (synchronized rotation).

By the way, when the substrate P is a thin flexible film, wrinkles and twists may occur when the substrate P is wound around the second drum member 1022. Therefore, it is important that the substrate P enters the substrate P as straight as possible to the contact position with the outer peripheral surface of the second drum member 1022, and that the tension applied to the substrate P in the transport direction (X direction) is as constant as possible. From this point of view, the control device 1014 controls the second drive unit 1036 so that the rotational speed unevenness of the second drum member 1022 becomes extremely small.

In the present embodiment, assuming that the plane including the first central axis AX1001 of the first drum member 1021 and the second central axis AX1002 of the second drum member 1022 is the central surface p1003 (parallel to the YZ surface), the central surface p1003 In the vicinity of the position where and the cylindrical first surface p1001 intersect, the central surface p1003 and the first surface p1001 are approximately orthogonal to each other. Similarly, the central surface p1003 and the cylindrical second surface p1002 Near the intersection of, the central plane p1003 and the second plane p1002 are approximately orthogonal to each other.

The exposure apparatus EX of the present embodiment is an exposure apparatus that assumes that a so-called multi-lens type projection optical system is mounted. The projection optical system PL includes a plurality of projection modules that project a part of the image in the pattern of the mask M. For example, in FIG. 2, three projection modules (projection optical system) PL1001, PL1003, PL1005 are arranged on the left side of the central surface p1003 at regular intervals in the Y direction, and three projection modules (projection optical system) are also arranged on the right side of the central surface p1003. System) PL1002, PL1004, PL1006 are arranged at regular intervals in the Y direction.

In such a multi-lens type exposure apparatus EX, the Y-direction ends of the regions exposed by the plurality of projection modules PL1001 to PL1006 (projection regions PA1001 to PA1006) are superimposed on each other by scanning to obtain a desired pattern. Project the whole picture. Such an exposure apparatus EX has a projection module and corresponding illumination even when the size of the pattern on the mask M in the Y direction becomes large and it is inevitably necessary to handle the substrate P having a large width in the Y direction. Since it is only necessary to add the module on the device 1013 side in the Y direction, there is an advantage that it can be easily applied to increase the panel size (width of the substrate P).

The exposure apparatus EX does not have to be a multi-lens system. For example, when the dimension in the width direction of the substrate P is small to some extent, the exposure apparatus EX may project an image of the entire width of the pattern onto the substrate P by one projection module. Further, each of the plurality of projection modules PL1001 to PL1006 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project patterns for a plurality of devices in parallel by a plurality of projection modules.

The lighting device 1013 of the present embodiment includes a light source device (not shown) and an illumination optical system IL. As shown in FIG. 4, the illumination optical system IL includes a plurality of (for example, six) illumination modules IL1001 to IL1006 arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1001 to PL1006. The light source device includes, for example, a lamp light source such as a mercury lamp, or a solid-state light source such as a laser diode or a light emitting diode (LED). The illumination light emitted by the light source device is, for example, far ultraviolet light (DUV light) such as emission line (g line, h line, i line), KrF excimer laser light (wavelength 248 nm), and ArF excimer laser light emitted from a lamp light source. (Wavelength 193 nm) and the like. The illumination light emitted from the light source device has a uniform illuminance distribution and is distributed to a plurality of illumination modules IL1001 to IL1006 via a light guide member such as an optical fiber.

The light source device may be arranged inside the first drum member 1021 or may be arranged outside the first drum member 1021. Further, the light source device may be a device (external device) different from the exposure device EX.

Each of the plurality of illumination modules IL1001 to IL1006 includes a plurality of optical members such as a lens. In the present embodiment, the light emitted from the light source device and passing through any of the plurality of lighting modules IL1001 to IL1006 is referred to as an illumination luminous flux EL1. Each of the plurality of illumination modules IL1001 to IL1006 includes, for example, an integrator optical system, a rod lens, a fly-eye lens, and the like, and illuminates the illumination region IR with an illumination luminous flux EL1 having a uniform illuminance distribution. In this embodiment, the plurality of lighting modules IL1001 to IL1006 are arranged inside the first drum member 1021. Each of the plurality of lighting modules IL1001 to IL1006 passes through the first drum member 1021 from the inside of the first drum member 1021 and is held on the outer peripheral surface of the first drum member 1021. Illuminate IR1006).

In the present embodiment, the first lighting module IL1001, the second lighting module IL1002, and the third lighting module are arranged in the order from the −Y side (front side of the paper surface in FIG. 2) to the + Y side (back side of the paper surface in FIG. 2). It is called a lighting module IL1003, a fourth lighting module IL1004, a fifth lighting module IL1005, and a sixth lighting module IL1006. That is, among the plurality of lighting modules IL1001 to IL1006, the first lighting module IL1001 is arranged on the most −Y side, and the sixth lighting module IL1006 is arranged on the most + Y side. The number of projection modules included in the projection optical system PL may be 1 or more and 5 or less, or 7 or more.

The plurality of lighting modules IL1001 to IL1006 are arranged apart from each other in a direction intersecting the first central axis AX1001 (for example, the X-axis direction) so as not to interfere with each other. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are arranged at positions where they overlap each other when viewed from the Y-axis direction. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are arranged apart from each other in the Y-axis direction.

In the present embodiment, the second illumination module IL1002 is arranged symmetrically with respect to the first illumination module IL1001 with respect to the central surface p1003 when viewed from the Y-axis direction. The fourth lighting module IL1004 and the sixth lighting module IL1006 are arranged at positions overlapping with the second lighting module IL1002 when viewed from the Y-axis direction. The second lighting module IL1002, the fourth lighting module IL1004, and the sixth lighting module IL1006 are arranged apart from each other in the Y-axis direction.

Each of the plurality of lighting modules IL1001 to IL1006 is located in the first radial direction D1001 or the second radial direction D1002 intersecting the central surface p1003 in the radial direction (diameter direction) with respect to the first central axis AX1001 of the first drum member 1021. The illumination luminous flux EL1 is irradiated toward. The irradiation direction of the illumination luminous flux EL1 of each illumination module changes alternately in the order in which the illumination modules are arranged in the Y-axis direction. For example, the irradiation direction of the illumination flux from the first illumination module IL1 (first radial direction D1001) is inclined to the −X side with respect to the Z-axis direction, and the irradiation direction of the illumination flux from the second illumination module IL1002 (first). The biaxial direction D1002) is inclined to the + X side with respect to the −Z axis direction. Similarly, the irradiation direction of the illumination luminous flux from each of the third illumination module IL1003 and the fifth illumination module IL1005 is substantially parallel to the irradiation direction of the first illumination module IL1001, and the fourth illumination module IL1004 and the sixth illumination module IL1004. The irradiation direction of the illumination luminous flux from each of the illumination modules IL1006 is substantially parallel to the irradiation direction of the second illumination module IL1002.

FIG. 5 is a diagram showing the arrangement of the illumination region IR and the projection region PA in the present embodiment. Note that FIG. 5 shows a plan view (left view in FIG. 5) of the illumination region IR on the mask M arranged on the first drum member 1021 as viewed from the −Z side, and the illumination region IR arranged on the second drum member 1022. A plan view (right view in FIG. 5) of the projection region PA on the substrate P as viewed from the + Z side is shown. Reference numeral Xs in FIG. 5 indicates a moving direction (rotational direction) of the first drum member 1021 or the second drum member 1022.

The first to sixth illumination modules IL1001 to IL1006 illuminate the first to sixth illumination regions IR1001 to IR1006 on the mask M, respectively. For example, the first illumination module IL1001 illuminates the first illumination region IR1001, and the second illumination module IL1002 illuminates the second illumination region IR1002.

The first illumination region IR1001 in the present embodiment will be described as a trapezoidal region elongated in the Y direction, but depending on the configuration of the projection optical system (projection module) PL described later, a rectangular region including this trapezoidal region. May be. The third illumination region IR1003 and the fifth illumination region IR1005 are regions having the same shape as the first illumination region IR1001, respectively, and are arranged at regular intervals in the Y-axis direction. The second illumination region IR1002 is a trapezoidal (or rectangular) region symmetrical with the first illumination region IR1001 with respect to the central surface p1003. The fourth illumination region IR1004 and the sixth illumination region IR1006 are regions having the same shape as the second illumination region IR1002, respectively, and are arranged at regular intervals in the Y-axis direction.

As shown in FIG. 5, each of the first to sixth illumination regions IR1001 to IR1006 has triangular portions on the hypotenuses of adjacent trapezoidal illumination regions when viewed along the circumferential direction of the first surface p1001. They are arranged so that they overlap (overlap). Therefore, for example, the first region A1001 on the mask M passing through the first illumination region IR1001 by the rotation of the first drum member 1021 is on the mask M passing through the second illumination region IR1002 by the rotation of the first drum member 1021. It partially overlaps with the second region A1002.

In the present embodiment, the mask M has a pattern forming region A1003 in which a pattern is formed and a pattern non-forming region A1004 in which a pattern is not formed. The pattern-non-forming region A1004 is arranged so as to surround the pattern-forming region A1003 in a frame shape, and has a characteristic of blocking the illumination luminous flux EL1. The pattern forming region A1003 of the mask M moves in the direction Xs with the rotation of the first drum member 1021, and each partial region of the pattern forming region A1003 in the Y-axis direction is the first to sixth illumination regions IR1001 to Pass through any of IR1006. In other words, the first to sixth illumination regions IR1001 to IR1006 are arranged so as to cover the entire width of the pattern forming region A1003 in the Y-axis direction.

As shown in FIG. 2, the projection optical system PL includes a plurality of projection modules PL1001 to PL1006 arranged in the Y-axis direction. Each of the plurality of projection modules PL1001 to PL1006 has a one-to-one correspondence with each of the first to sixth illumination modules IL1006, and is a partial mask M appearing in the illumination region IR illuminated by the corresponding illumination module. An image of a pattern is projected onto each projection area PA on the substrate P.

For example, the first projection module PL1001 corresponds to the first illumination module IL1001 and displays an image of the mask M pattern in the first illumination region IR1001 (see FIG. 5) illuminated by the first illumination module IL1001 on the substrate P. It is projected onto the first projection area PA1001. The third projection module PL1003 and the fifth projection module PL1005 correspond to the third illumination module IL1003 and the fifth illumination module IL1005, respectively. The third projection module PL1003 and the fifth projection module PL1005 are arranged at positions overlapping with the first projection module PL1001 when viewed from the Y-axis direction.

Further, the second projection module PL1002 corresponds to the second illumination module IL1002, and the image of the mask M pattern in the second illumination region IR1002 (see FIG. 5) illuminated by the second illumination module IL1002 is displayed on the substrate P. It is projected onto the second projection area PA1002. The second projection module PL1002 is arranged symmetrically with respect to the first projection module PL1001 with the central surface p1003 in between when viewed from the Y-axis direction.

The fourth projection module PL1004 and the sixth projection module PL1006 are arranged corresponding to the fourth illumination module IL1004 and the sixth illumination module IL1006, respectively, and the fourth projection module PL1004 and the sixth projection module PL1006 are arranged from the Y-axis direction. As you can see, it is arranged at a position where it overlaps with the second projection module PL1002.

In the present embodiment, the light reaching the respective illumination regions IR1001 to IR1006 on the mask M from the respective illumination modules IL1001 to IL1006 of the illumination device 1013 is defined as the illumination luminous flux EL1, and the portion of the mask M appearing in each of the illumination regions IR1001 to IR1006. The light that is incident on the projection modules PL1001 to PL1006 and reaches the projection regions PA1001 to PA1006 after receiving the intensity distribution modulation according to the pattern is referred to as the imaging luminous flux EL2.

As shown in the right figure in FIG. 5, the image of the pattern in the first illumination area IR1001 is projected on the first projection area PA1001, and the image of the pattern in the third illumination area IR1003 is projected on the third projection area PA1003. The image of the pattern in the fifth illumination region IR1005 is projected onto the fifth projection region PA1005. In the present embodiment, the first projection region PA1001, the third projection region PA1003, and the fifth projection region PA1005 are arranged so as to line up in the Y-axis direction.

Further, the image of the pattern in the second illumination region IR1002 is projected on the second projection region PA1002. In the present embodiment, the second projection region PA1002 is arranged symmetrically with respect to the first projection region PA1001 with respect to the central plane p1003 when viewed from the Y-axis direction. Further, the image of the pattern in the fourth illumination area IR1004 is projected on the fourth projection area PA1004, and the image of the pattern in the sixth illumination area IR1006 is projected on the sixth projection area PA1006. In the present embodiment, the second projection region PA1002, the fourth projection region PA1004, and the sixth projection region PA1006 are arranged so as to line up in the Y-axis direction.

Each of the first to sixth projection regions PA1001 to PA1006 has a projection region adjacent to each other in a direction parallel to the second central axis AX1002 and an end portion (trapezoidal) when viewed along the circumferential direction of the second surface p1002. The triangular parts) are arranged so as to overlap. Therefore, for example, the third region A1005 on the substrate P passing through the first projection region PA1001 by the rotation of the second drum member 1022 is on the substrate P passing through the second projection region PA1002 by the rotation of the second drum member 1022. It partially overlaps with the fourth region A1006.
The first projection area PA1001 and the second projection area PA1002 are each so that the exposure amount in the area where the third area A1005 and the fourth area A1006 overlap is substantially the same as the exposure amount in the non-overlapping area. The shape etc. are set.

In the present embodiment, the region to be exposed on the substrate P (hereinafter referred to as the exposure region A1007) moves in the direction Xs with the rotation of the second drum member 1022 and is exposed as shown in the right figure in FIG. Each partial region in the Y-axis direction of the region A1007 passes through any of the first to sixth projection regions PA1001 to PA1006. In other words, the first to sixth projection regions PA1001 to PA1006 are arranged so as to cover the entire width of the exposure region A1007 in the Y-axis direction.

The irradiation direction of the illumination luminous flux EL1 with respect to the first projection module PL1001 may be, for example, the traveling direction of the main ray passing through any position in the first illumination region IR1001, or the main light beam passing through the center of the first illumination region IR1001. It may be the traveling direction of the light beam. The same applies to the irradiation direction of the illumination luminous flux EL1 with respect to the second to sixth projection modules PL1002 to PL1006.

By the way, the first to sixth projection regions PA1001 to PA1006 may be arranged so that the regions on the substrate P passing through any of them do not overlap each other at the ends. For example, the third region A1005 passing through the first projection region PA1001 may not partially overlap with the fourth region A1006 passing through the second projection region PA1002. That is, even in the multi-lens system, it is possible not to perform joint exposure by each projection module. In this case, the third region A1005 is a region on which the pattern corresponding to the first device is projected, and the fourth region A1006 is a region on which the pattern corresponding to the second device is projected. good. The second device may be the same type of device as the first device, and the same pattern as that of the third region A1005 may be projected on the fourth region A1006. The second device is a device of a different type from the first device, and a pattern different from that of the third region A1005 may be projected on the fourth region A1006.

Next, the detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. In the present embodiment, each of the second to sixth projection modules PL1001 to PL1006 has the same configuration as the first projection module PL1001. Therefore, the configuration of the first projection module PL1001 will be described on behalf of the projection optical system PL.

The first projection module PL1001 shown in FIG. 6 is formed by the first optical system 1041 and the first optical system 1041 that form an image of the pattern of the mask M arranged in the first illumination region IR1001 on the intermediate image plane p1007. It includes a second optical system 1042 that reimages at least a part of the intermediate image in the first projection region PA1001 of the substrate P, and a first field diaphragm 1043 arranged on the intermediate image plane p1007 on which the intermediate image is formed.

Further, the first projection module PL1001 includes a focus correction optical member 1044 for finely adjusting the focus state of a mask pattern image (hereinafter referred to as a projected image) formed on the substrate P, and the projected image is minute in the image plane. It is provided with an image shift correction optical member 1045 for laterally shifting the image, a magnification correction optical member 1047 for finely correcting the magnification of the projected image, and a rotation correction mechanism 1046 for slightly rotating the projected image in the image plane.

The focus correction optical member 1044 is arranged at a position where the imaging light flux EL2 emitted from the first illumination region IR1001 is incident, and the image shift correction optical member 1045 is incident with the imaging light flux EL2 emitted from the focus correction optical member 1044. It is placed in position. The magnification correction optical member 1047 is arranged at a position where the imaging light flux EL2 emitted from the second optical system 1042 is incident.

The imaged luminous flux EL2 from the pattern of the mask M is emitted from the first illumination region IR1001 in the normal direction, passes through the focus correction optical member 1044, and is incident on the image shift correction optical member 1045. The imaging light beam EL2 transmitted through the image shift correction optical member 1045 is reflected by the first reflecting surface (curved mirror) p1004 of the first deflection member 1050, which is an element of the first optical system 1041, and passes through the first lens group 1051. It is reflected by the first concave mirror 1052, is reflected again by the second reflecting surface (plane mirror) p1005 of the first deflection member 1050 through the first lens group 1051, and is incident on the first field aperture 1043.

The imaging light beam EL2 that has passed through the first field aperture 1043 is reflected by the third reflecting surface (curved mirror) p1008 of the second deflection member 1057, which is an element of the second optical system 1042, and passes through the second lens group 1058 to the second. It is reflected by the two concave mirrors 1059, is reflected again by the fourth reflecting surface (plane mirror) p1009 of the second deflection member 1057 through the second lens group 1058, and is incident on the magnification correction optical member 1047.
The image luminous flux EL2 emitted from the magnification correction optical member 1047 is incident on the first projection region PA1001 on the substrate P, and the image of the pattern appearing in the first illumination region IR1001 is the same magnification as the first projection region PA1001 (×). It is projected in 1).

The first optical system 1041 and the second optical system 1042 are, for example, telecentric catadioptric systems obtained by modifying the Dyson system. In the present embodiment, the optical axis of the first optical system 1041 (hereinafter referred to as the first optical axis AX1003) is substantially orthogonal to the central plane p1003. The first optical system 1041 includes a first deflection member 1050, a first lens group 1051, and a first concave mirror 1052. The imaging light beam EL2 emitted from the image shift correction optical member 1045 is reflected by the first reflecting surface p1004 of the first deflection member 1050 and travels toward one side (−X side) of the first optical axis AX1003. It is incident on the first concave mirror 1052 arranged on the pupil surface through one lens group 1051. The imaging light beam EL2 reflected by the first concave mirror 1052 travels to the other side (+ X side) of the first optical axis AX1003, passes through the first lens group 1051, and is reflected by the second reflecting surface p1005 of the first deflection member 1050. Then, it is incident on the first visual field aperture 1043.

The first deflection member 1050 is a triangular prism extending in the Y-axis direction. In the present embodiment, each of the first reflecting surface p1004 and the second reflecting surface p1005 includes a mirror surface (surface of the reflecting film) formed on the surface of the triangular prism. The main ray EL3 of the imaging light beam EL2 passing through the center of the first illumination region IR1001 travels along the first radial direction D1001 inclined in the XZ plane with respect to the central plane p1003 and is incident on the first projection module PL1001. do.

In the first deflection member 1050, the main ray EL3 reaching the first reflecting surface p1004 from the first illumination region IR1001 and the main ray EL3 (parallel to the central surface p1003) reaching the intermediate image plane p1007 from the second reflecting surface p1005 are formed. The image light beam EL2 is deflected so as to be non-parallel (intersect) in the XZ plane.

In order to form the optical path as described above, in the present embodiment, the ridge line at which the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 intersect and the first optical axis AX1003 are included, and the XY surface is included. When the parallel surface is p1006, the first reflecting surface p1004 and the second reflecting surface p1005 are arranged at an asymmetric angle with respect to this surface p1006.

Assuming that the angle of the first reflecting surface p1004 with respect to the surface p1006 is θ1001 and the angle of the second reflecting surface p1005 with respect to the surface p1006 is θ1002, the angle (θ1001 + θ1002) is set to less than 90 ° in the present embodiment, and the angle θ1001 is 45. Less than °, the angle θ1002 is set to substantially 45 °.

By setting the main ray EL3 reflected by the first reflecting surface p1004 and incident on the first lens group 1051 parallel to the optical axis AX1003, the main ray EL3 is set to the center of the first concave mirror 1052, that is, the optical axis of the pupil surface. It can be passed through the intersection with the AX1003, and a telecentric imaging state can be secured. For this purpose, in FIG. 6, when the inclination angle of the main ray EL3 (first radial direction D1001) reaching the first reflection surface p1004 from the first illumination region IR1001 with respect to the central surface p1003 is θd, the first reflection surface p1004 The angle θ1001 of may be set so as to satisfy the following equation (1).
θ1001 = 45 ° − (θd / 2) ・ ・ ・ (1)

In the present embodiment, each of the plurality of lenses belonging to the first lens group 1051 has an axisymmetric shape around the first optical axis AX1003. The imaged luminous flux EL2 reflected by the first reflecting surface p1004 is incident on the first lens group 1051 from one side (+ Z side) with respect to the surface p1006. The first concave mirror 1052 is arranged at or near the position of the pupil surface of the first optical system 1041.

The main ray EL3 of the imaging light beam EL2 that has passed through the first lens group 1051 is incident on the intersection of the first optical axis AX1003 and the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 travels in the first lens group 1051 along an optical path symmetrical with respect to the surface p1006 as compared with before being incident on the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 is emitted from the other side (−Z side) of the first lens group 1051 and reflected by the second reflecting surface p1005 of the first deflection member 1050 to be the central surface p1003. It travels along the parallel main ray EL3.

The first field diaphragm 1043 has an opening that defines the shape of the first projection region PA1001. That is, the shape of the opening of the first visual field diaphragm 1043 defines the shape of the first projection region PA1001. Therefore, as shown in FIG. 6, when the field diaphragm 1043 can be arranged on the intermediate image plane p1007, the opening shape of the field diaphragm 1043 can be made into a trapezoidal shape as shown in the right figure of FIG. In that case, the shapes of the first to sixth illumination regions IR1001 to IR1006 do not have to be similar to the respective shapes (trapezoids) of the first to sixth projection regions PA1001 to PA1006, and each projection region ( It can be made into a rectangle that includes the trapezoidal shape of the field diaphragm (opening of 1043).

The second optical system 1042 has the same configuration as the first optical system 1041, and is provided symmetrically with respect to the first optical system 1041 with respect to the intermediate image plane p1007 including the first field diaphragm 1043. The optical axis of the second optical system 1042 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the central plane p1003. The second optical system 1042 includes a second deflection member 1057, a second lens group 1058, and a second concave mirror 1059. The imaging light beam EL2 emitted from the first optical system 1041 and passed through the first field diaphragm 1043 is reflected by the third reflecting surface p1008 of the second deflection member 1057, passes through the second lens group 1058, and passes through the second concave mirror 1059. Incident in. The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the second lens group 1058 again, is reflected by the fourth reflecting surface p1009 of the second deflection member 1057, and is incident on the magnification correction optical member 1047.

The second deflection member 1057, the second lens group 1058, and the second concave mirror 1059 of the second optical system 1042 are the same as the first deflection member 1050, the first lens group 1051, and the first concave mirror 1052 of the first optical system 1041, respectively. Is. The angle θ1003 formed by the third reflecting surface p1008 of the second deflection member 1057 with the second optical axis AX1004 is substantially the same as the angle θ1002 formed by the second reflecting surface p1005 of the first deflection member 1050 with the first optical axis AX1003. be. Further, the angle θ1004 formed by the fourth reflecting surface p1009 of the second deflection member 1057 with the second optical axis AX1004 is substantially the angle θ1001 formed by the first reflecting surface p1004 of the first deflection member 1050 with the first optical axis AX1003. It is the same. Each of the plurality of lenses belonging to the second lens group 1058 has an axisymmetric shape around the second optical axis AX1004.
The second concave mirror 1059 is arranged at or near the position of the pupil surface of the second optical system 1042.

The imaged luminous flux EL2 that has passed through the first visual field diaphragm 1043 travels in the direction along the main ray parallel to the central surface p1003 and is incident on the third reflecting surface (plane) p1008. The tilt angle θ1003 of the third reflecting surface p1008 with respect to the second optical axis AX1004 (or the surface p1006 or the intermediate image plane p1007) of the second optical system 1042 is 45 ° in the XZ plane, and the imaged light beam EL2 reflected here is , The second lens group 1058 is incident on the upper half of the visual field region. The main ray EL3 of the imaging light beam EL2 incident on the second lens group 1058 is parallel to the second optical axis AX1004 and is incident on the intersection of the second optical axis AX1004 and the second concave mirror 1059.

The imaged luminous flux EL2 reflected by the second concave mirror 1059 travels symmetrically with respect to the second optical axis AX1004 as compared with before the incident on the second concave mirror 1059. The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the visual field region of the lower half of the second lens group 1058 again, is reflected by the fourth reflecting surface p1009 of the second deflection member 1057, and intersects the central surface p1003. Proceed in the direction of

The traveling direction of the main ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 and directed toward the first projection region PA1001 is from the first illumination region IR1001 to the first with respect to the intermediate image plane p1007 including the first field diaphragm 1043. It is set symmetrically with the traveling direction of the main ray EL3 of the imaging light beam EL2 incident on the optical system 1041. That is, when viewed in the XZ plane, the angle θ1004 of the fourth reflecting surface p1009 of the second deflection member 1057 with respect to the second optical axis AX1004 satisfies the following formula (2) as in the previous formula (1). Is set.
θ1004 = 45 ° − (θd / 2) ・ ・ ・ (2)
As a result, the main ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 is directed to the normal direction of the first projection region PA1001 (cylindrical plane) on the substrate P (toward the rotation center line AX1002 in FIG. 2). Direction).

In the present embodiment, the focus correction optical member 1044, the image shift correction optical member 1045, the rotation correction mechanism 1046, and the magnification correction optical member 1047 constitute an imaging characteristic adjusting mechanism for adjusting the imaging characteristics of the first projection module PL1001. do. By controlling the imaging characteristic adjustment mechanism, the projection conditions of the projected image on the substrate P can be adjusted for each projection module. The projection condition referred to here includes one or more items of the translational position, the rotation position, the magnification, and the focus of the projection area on the substrate P. The projection conditions can be determined for each position of the projection region with respect to the substrate P during synchronous scanning. By adjusting the projection conditions of the projected image, it is possible to correct the distortion of the projected image when compared with the pattern of the mask M. The configuration of the imaging characteristic adjustment mechanism can be changed as appropriate, and at least a part thereof can be omitted.

The focus correction optical member 1044 is, for example, formed by superimposing two wedge-shaped prisms in opposite directions (opposite directions in the X direction in FIG. 6) so as to form a transparent parallel flat plate as a whole. By sliding the pair of prisms in the slope direction without changing the distance between the surfaces facing each other, the thickness of the parallel flat plate is made variable. As a result, the effective optical path length of the first optical system 1041 is finely adjusted, and the focus state of the pattern image formed on the intermediate image plane p1007 and the projection region PA1001 is finely adjusted.

The image shift correction optical member 1045 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 6 and a transparent parallel flat glass that can be tilted in a direction orthogonal to the transparent parallel flat glass. By adjusting the amount of inclination of each of the two parallel flat glass sheets, the pattern image formed on the intermediate image plane p1007 and the projection region PA1001 can be slightly shifted in the X direction and the Y direction.

In the magnification correction optical member 1047, for example, a concave lens, a convex lens, and a concave lens are coaxially arranged at predetermined intervals, the front and rear concave lenses are fixed, and the convex lens between them is moved in the optical axis (main ray) direction. It is configured in. As a result, the pattern image formed in the projection region PA1001 is isotropically enlarged or reduced by a small amount while maintaining the telecentric imaging state. The optical axes of the three lens groups constituting the magnification correction optical member 1047 are tilted in the XZ plane so as to be parallel to the tilted main ray EL3 passing therethrough.

The rotation correction mechanism 1046 uses, for example, an actuator (not shown) to slightly rotate the first deflection member 1050 around an axis parallel to the first optical axis AX1003. By this rotation correction mechanism 1046, the pattern image formed on the intermediate image plane p1007 can be slightly rotated in the intermediate image plane p1007.

In this way, the imaged luminous flux EL2 emitted from the first projection module PL1001 has a pattern that appears in the first illumination region IR1001 in the first projection region PA1001 of the substrate P arranged on the outer peripheral surface of the second drum member 1022. Form an image. In the present embodiment, the main ray EL3 of the imaging light beam EL2 passing through the center of the first illumination region IR1001 is emitted from the first illumination region IR1001 in the normal direction and is emitted from the normal direction with respect to the first projection region PA1001. Incident. In this way, the image of the mask M pattern appearing in the cylindrical first illumination region IR1001 is projected onto the first projection region PA1001 on the cylindrical substrate P. Further, the image of the mask M pattern appearing in each of the second to sixth illumination regions IR1002 to IR1006 is similarly projected on each of the second to sixth projection regions PA1002 to PA1006 on the cylindrical surface substrate P. Will be done.

In the present embodiment, as shown in FIGS. 2 and 5, the odd-numbered illumination regions IR1001, IR1003, IR1005 and the even-numbered illumination regions IR1002, IR1004, and IR1006 are arranged at symmetrical distances with respect to the central plane p1003. At the same time, the odd-numbered projection regions PA1001, PA1003, PA1005 and the even-numbered projection regions PA1002, PA1004, PA1006 are also arranged at symmetrical distances with respect to the central plane p1003. Therefore, each of the six projection modules can have the same configuration, the parts of the projection optical system can be standardized, the assembly process and the inspection process can be simplified, and the imaging characteristics (aberration) of each projection module can be simplified. Etc.) can be uniformly aligned. This means that the quality (transfer fidelity) of the panel pattern formed on the substrate P can be adjusted to the position and region in the panel, especially when the joint exposure is performed between the projection regions of the individual projection modules by the multi-lens method. It is advantageous to keep it constant regardless of.

Further, in a general exposure apparatus, when the projection region is curved in a cylindrical surface shape, defocus may occur depending on the position of the projection region, for example, when the imaged luminous flux is incident from a direction non-vertical to the projection region. It can grow. As a result, poor exposure may occur and defective devices may occur.

In the present embodiment, the first deflection member 1050 (first reflection surface p1004) and the second deflection member 1057 (fourth reflection surface p1009) of the projection optical system PL (for example, the first projection module PL1001) are the first illumination. The main ray EL3 is deflected so that the main ray EL3 emitted from the region IR1001 in the normal direction is projected onto the first projection region PA1001 from the normal direction. Therefore, in the substrate processing apparatus 1011, the focus error of the projected image in the projection region PA1001, in particular, the entire best focus surface of the projected image in each of the projection regions PA1001 to PA1006 shown in FIG. 5 is the entire projection module PL1001. It is possible to reduce the deviation from the depth of focus of PL1006, and the occurrence of poor exposure and the like is suppressed. As a result, the generation of defective devices by the device manufacturing system 1001 is suppressed.

In the present embodiment, since the projection optical system PL includes the first visual field diaphragm 1043 arranged at the position where the intermediate image is formed, the shape of the projected image and the like can be managed with high accuracy. Therefore, the substrate processing apparatus 1011 can reduce, for example, the overlapping error of the first to sixth projection regions PA1001 to PA1006, and suppresses the occurrence of exposure defects and the like. Further, the second reflecting surface p1005 of the first deflection member 1050 deflects the main ray EL3 from the first illumination region IR1001 so as to be orthogonal to the field diaphragm 1043. Therefore, the substrate processing apparatus 1011 can manage the shape of the projected image and the like with higher accuracy.

Further, in the present embodiment, each of the first to sixth projection modules PL1001 to PL1006 projects an image of the pattern of the mask M as an upright image. Therefore, when the substrate processing apparatus 1011 projects the mask M pattern by dividing it into the first to sixth projection modules PL1001 to PL1006, for example, the region on which the projected image is projected (for example, the third region A1005 and the fourth region) Since the joint exposure in which A1006) is partially overlapped is possible, it becomes easy to design the mask M.

In the present embodiment, in the substrate processing apparatus 1011, the exposure apparatus EX exposes the substrate P while the conveying device 1009 continuously conveys the substrate P along the second surface p1002 at a constant speed, thus increasing the productivity of the exposure processing. be able to. As a result, the device manufacturing system 1001 can efficiently manufacture the device.

In the present embodiment, the first reflecting surface p1004 and the second reflecting surface p1005 are arranged on the surface of the same deflection member (first deflection member 1050), but even if they are arranged on the surfaces of different members. good. Further, one or both of the first reflection surface p1004 and the second reflection surface p1005 may be arranged on the inner surface of the first deflection member 1050, and may have a property of reflecting light under all reflection conditions, for example.

Further, the above-described modifications relating to the first reflecting surface p1004 and the second reflecting surface p1005 can be applied to one or both of the third reflecting surface p1008 and the fourth reflecting surface p1009. For example, when the radius r1002 of the second surface p1002 is changed, the fourth reflecting surface p1009 of the second deflection member 1057 is such that the imaging light beam EL2 is incident on the first projection region PA1001 from the normal direction. , The angle θ1004 is set, and the arcuate circumference between the center point of the first projection region PA1001 and the center point of the second projection region PA1002 is the corresponding illumination region IR1001 on the mask M (radius r1001). The arrangement is set so as to match the arcuate circumference between the center point and the center point of the illumination area IR1002.

[Second Embodiment]
Next, the second embodiment will be described. In the present embodiment, the same components as those in the above embodiment may be designated by the same reference numerals as those in the above embodiment to simplify or omit the description thereof.

FIG. 7 is a diagram showing a configuration of the substrate processing device 1011 of the present embodiment. The transfer device 1009 of the present embodiment includes a first transfer roller 1030, a first guide member (air turn bar, etc.) 1031, a fourth transfer roller 1071, a fifth transfer roller 1072, a sixth transfer roller 1073, and a second guide. A member (air turn bar, etc.) 1033 and a second transfer roller 1034 are provided.

The substrate P transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030. The substrate P that has passed through the first guide member 1031 is conveyed to the fifth transfer roller 1072 via the fourth transfer roller 1071. The central axis of the fifth transport roller 1072 is arranged on the central surface p1003. The substrate P that has passed through the fifth transfer roller 1072 is conveyed to the second guide member 1033 via the sixth transfer roller 1073.
The sixth transport roller 1073 is arranged symmetrically with respect to the central surface p1003 with respect to the fourth transport roller 1071. The substrate P that has passed through the second guide member 1033 is conveyed downstream of the transfer path via the second transfer roller 1034. The first guide member 1031 and the second guide member 1033 adjust the tension acting on the substrate P in the transport path in the same manner as the first guide member 1031 and the second guide member 1033 shown in FIG.

The first projection region PA1001 in FIG. 7 is set on the substrate P which is linearly conveyed between the fourth transfer roller 1071 and the fifth transfer roller 1072. The substrate P is supported between the fourth transport roller 1071 and the fifth transport roller 1072 so that a predetermined tension is applied in the transport direction, and the substrate P is fed along the planar second surface p1002.

The first projection region PA1001 (second plane p1002) is inclined so as to be non-perpendicular to the central plane p1003. The normal direction of the first projection region PA1001 (hereinafter referred to as the first normal direction D1003) is the first radial direction D1001 with respect to the plane orthogonal to the central plane p1003, for example, the intermediate image plane p1007 also shown in FIG. Arranged symmetrically. The main ray EL3 of the imaging light beam EL2 emitted from the first projection module PL1001 is incident on the first projection region PA1001 from the first normal direction D1003. In other words, the first normal direction D1003 of the substrate P spanned by the fourth transport roller 1071 and the fifth transport roller 1072 is symmetrical with respect to the first radial direction D1001 with respect to the intermediate image plane p1007 orthogonal to the central plane p1003. The fourth transport roller 1071 and the fifth transport roller 1072 are arranged so as to be.

The second projection region PA1002 is set on the substrate P which is conveyed between the fifth transfer roller 1072 and the sixth transfer roller 1073. The substrate P is supported between the fifth transfer roller 1072 and the sixth transfer roller 1073 so as to apply a constant tension, and is fed along the flat second surface p1002.

The second projection region PA1002 is inclined so as to be non-perpendicular to the central plane p1003. The normal direction of the second projection region PA1002 (second normal direction D1004) is symmetrical with respect to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the central plane p1003. The main ray EL3 of the imaging light beam EL2 emitted from the second projection module PL1002 is incident on the second projection region PA1002 from the second normal direction D1004. In other words, the second normal direction D1004 of the substrate P spanned by the fifth transport roller 1072 and the sixth transport roller 1073 is symmetrical with respect to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the central plane p1003. The fifth transfer roller 1072 and the sixth transfer roller 1073 are arranged so as to be.

In the substrate processing apparatus 1011 of the present embodiment, the fourth transfer roller 1071, the fifth transfer roller 1072, and the sixth transfer roller 1073 are used to substantially flatten the cylindrical second surface p1002 shown in FIG. The transfer fidelity of the pattern image projected on the substrate P in each of the projection regions PA1001 to PA1006 is further improved from the viewpoint of the depth of focus (DOF). Further, as shown in FIG. 2, the height of the entire transport device 1009 in the Z direction can be kept low as compared with the case where the second drum member 1022 having a radius r1002 is used for supporting and transporting the substrate P. , The entire device can be made smaller.

Further, in the apparatus configuration of FIG. 7, the fourth transport roller 1071, the fifth transport roller 1072, and the sixth transport roller 1073 are a part of the transport device 1009 and are support members (supporting the substrate P to be exposed). It also serves as a substrate stage on the EX side of the exposure apparatus). Bell Nui supports the back surface side of the substrate P between the 4th transport roller 1071 and the 5th transport roller 1072 and between the 5th transport roller 1072 and the 6th transport roller 1073 in a non-contact manner by a fluid bearing. A pad plate of the type may be provided to further enhance the flatness of a partial region of the substrate P on which the projection regions PA1001 to PA1006 are located.

Further, at least one of the transfer rollers of the transfer device 1009 shown in FIG. 7 may be fixed to the projection optical system PL or may be movable. For example, the fifth transport roller 1072 has three translational directions parallel to the X-axis direction, a translational direction parallel to the Y-axis direction, and a translational direction parallel to the Z-axis direction, and around an axis parallel to the X-axis direction. Of 6 directions (6 degrees of freedom) including the direction of rotation of, the direction of rotation around the axis parallel to the Y-axis direction, and 3 directions of rotation around the axis parallel to the Z-axis direction, at least one direction (1 degree of freedom). ), It may be slightly movable. Alternatively, by finely adjusting the relative positions of one or both of the fourth transport roller 1071 and the sixth transport roller 1073 in the Z-axis direction with respect to the fifth transport roller 1072, the first normal line of the first projection region PA1001 The angle formed by the second normal direction D1004 of the direction D1003 or the second projection region PA1002 and the surface of the flattened and supported substrate P can be finely adjusted. By slightly moving the selected roller in this way, it is possible to adjust the posture of the surface of the substrate P with respect to the pattern projection image plane in each projection region PA1001 to PA1006 with high accuracy.

[Third Embodiment]
Next, the third embodiment will be described with reference to FIG. In the present embodiment, the same components as those of the above-described embodiments may be designated by the same reference numerals as those of the above-described embodiments to simplify or omit the description thereof.

FIG. 8 shows the configuration of the exposure apparatus EX as the substrate processing apparatus 1011 of the present embodiment, and the basic configuration is the same as that of FIG. 7 above. However, as compared with the configuration of FIG. 7, the angle θ1004 of the fourth reflecting surface p1009 of the second deflection member 1057 provided in each projection module PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1004 is set to 45 °. A large point is that the substrate P transported by the transport device 1009 is supported at the positions of the projection regions PA1001 to PA1006 so as to be in a plane orthogonal to the central plane p1003 (parallel to the XY plane in FIG. 8). different.

In the configuration of FIG. 8, the substrate P is transferred from the upstream of the transfer path to the eighth transfer roller 1076 via the first transfer roller 1030, the first guide member 1031 (air turn bar, etc.), and the fourth transfer roller 1071. Be transported. The substrate P that has passed through the eighth transfer roller 1076 is conveyed downstream of the transfer path via the second guide member 1033 (air turn bar, etc.) and the second transfer roller 1034.
As shown in FIG. 8, the substrate P is supported and conveyed between the fourth transfer roller 1071 and the eighth transfer roller 1076 with a predetermined tension so as to be parallel to the XY plane. In this case, the second surface p1002 on which the substrate P is supported becomes a flat surface, and the projection regions PA1001 to PA1006 are arranged in the second surface p1002.

Further, in the second optical system 1042 constituting each projection module PL1001 to PL1006, the third reflection surface p1008 and the fourth reflection surface p1009 of the second deflection member 1057 are imaged to be emitted from the second optical system 1042 to the substrate P. The main ray EL3 of the luminous flux EL2 is arranged so as to be substantially parallel to the central surface p1003. That is, in the first deflection member 1050 and the second deflection member 1057 of the projection optical system PL (projection modules PL1001 to PL1006), each of the main rays EL3 emitted in the normal direction from each of the cylindrical illumination regions IR1001 to IR1006 The imaging optical path is deflected so as to enter the projection regions PA1001 to PA1006 set on a common plane from the normal direction.

In the present embodiment, from the center point of the projection region PA1001 (and PA1003, PA1005) to the center point of the projection region PA1002 (and PA1004, PA1006) in the XZ plane viewed from the direction parallel to the first central axis AX1001 of the mask M. The distance DFx along the second surface p1002 (the surface of the substrate P) up to is the first surface p1001 from the center point of the illumination region IR1001 (and IR1003, IR1005) to the center point of the illumination region IR1002 (and IR1004, IR1006). The distance (string length or circumference) along (cylindrical surface with radius r) is set to be substantially equal to DMx.

Here, the mutual positional relationship of the illumination area IR and the mutual positional relationship of the projection area PA will be described with reference to FIG. 9, which schematically shows the mutual positional relationship. In FIG. 9, reference numeral α indicates an angle (opening angle) [°] formed by the first radial direction D1001 and the second radial direction D1002, and reference numeral r indicates a radius [mm] of the first surface p1001. ..

In FIG. 9, the circumference DMx [mm] from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 in the XZ plane is expressed by the following equation (3) using the angle α and the radius r. ..
DMx = π ・ α ・ r / 180 ・ ・ ・ (3)
Further, the linear distance Ds from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 is expressed by the following equation (4).
Ds = 2 ・ r ・ sin (π ・ α / 360) ・ ・ ・ (4)

For example, when the angle α is 30 ° and the radius r is 180 mm, the circumference DMx is about 94.248 mm and the distance Ds is about 93.175 mm. That is, if the X coordinate of the center point of the illumination area IR1001 and the X coordinate of the center point of the projection area PA1001 match, and the X coordinate of the center point of the illumination area IR1002 and the X coordinate of the center point of the projection area PA1002 match. Assuming that, when two points separated by the circumferential length DMx in the circumferential direction in the pattern of the mask M are projected onto the substrate P via the projection regions PA1001 and PA1002, respectively, the two points are the distance Ds in the X direction on the substrate P. It will be exposed at (Ds <DMx). That is, according to the above numerical example, the pattern exposed on the substrate P via the odd-numbered projection regions PA1001, PA1003, and PA1005 and the exposure on the substrate P via the even-numbered projection regions PA1002, PA1004, and PA1006. It means that the pattern to be formed is deviated by a maximum of about 1.073 mm in the X direction.

Therefore, in the present embodiment, the projection optics so that the linear distance DFx between the center point of the projection region PA1001 and the center point of the projection region PA1002 is substantially equal to the peripheral length DMx on the flattened substrate P. The arrangement condition of the specific optical member in the system PL is changed from the condition shown in FIG. 6 above.

Specifically, the fourth reflecting surface p1009 of the second deflection member 1057 is slightly displaced from the position as shown in FIG. 6 in a direction parallel to the optical axis AX1004 (X axis), and as a result, the linear distance DFx Is installed so that it matches the circumference DMx. According to the numerical example given above, the difference between the circumference DMx and the distance Ds is 1.073 mm. For example, the second deflection member 1057 included in each of the odd-numbered projection modules PL1001, PL1003, and PL1005. It is easy to move the position of the 4 reflecting surface p1009 in parallel with the second concave mirror 1059 side along the optical axis AX1004 by about 1 mm.

However, in that case, parts different from the even-numbered projection modules PL1002, PL1004, and PL1006 may be required for the configuration of the second deflection member 1057 (arrangement of the fourth reflecting surface p1009).
Therefore, the position of the fourth reflection surface p1009 of the second deflection member 1057 mounted on all the projection modules PL1001 to PL1006 is parallel to the second concave mirror 1059 side along the optical axis AX1004 by about 0.5 mm, which is half of the above 1 mm. If it is moved, parts can be standardized.

FIG. 10 shows the difference between the circumference DMx along the pattern surface (first surface p1001) of the mask M described with reference to FIG. 9 and the linear distance Ds between the centers of the odd-numbered and even-numbered illumination regions. It is a graph showing the correlation with the angle α, the vertical axis represents the difference, and the horizontal axis represents the opening angle α. Further, the plurality of curves in the graph of FIG. 10 represent a case where the radius r of the pattern surface (cylindrical first surface p1001) of the mask M is changed to 180 mm, 210 mm, 240 mm, and 300 mm. As explained above with a numerical example, when the angle α is 30 ° and the radius r is 180 mm, the circumference DMx is about 94.248 mm and the distance Ds is about 93.175 mm. The difference shown on the vertical axis of the graph of 10 is about 1.073 mm.

As shown in FIG. 10, the difference between the peripheral length DMx on the pattern surface (first surface p1001) of the mask M and the linear distance Ds from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 is Since it changes according to the radius r and the angle α of the first surface p1001, the position of the fourth reflecting surface p1009 of the second deflection member 1057 may be set based on the relationship of the graph of FIG.

In order to make the linear distance DFx on the substrate P and the peripheral length DMx on the mask M substantially equal, even if the position of the fourth reflecting surface p1009 of the second deflection member 1057 in the X direction is optimally arranged. Finally, it may be difficult to adjust in the submicron order, so the residual difference of several μm to several tens of μm or less is projected using the image shift correction optical member 1045 shown in FIG. By slightly shifting in the X direction, the linear distance DFx and the circumference DMx can be matched with sufficient accuracy.

In this way, the projected image is slightly shifted in the X direction by using the image shift correction optical member 1045, and the distance (perimeter) between the two points with respect to the scanning exposure direction in the mask pattern plane and the two points. The method of adjusting each projection module PL1001 to PL1006 so that the interval distance (perimeter) with respect to the scanning exposure direction of each image point when is projected onto the substrate P is equal in the submicron order is shown in the above figure. The same applies to the device configuration of FIGS. 2 to 6 and the device configuration of FIG. 7.

[Fourth Embodiment]
Next, the fourth embodiment will be described with reference to FIG. In FIG. 11, components similar to those of the above-described embodiments may be designated by the same reference numerals as those of the above-described embodiments to simplify or omit the description thereof.

FIG. 11 is a diagram showing a configuration of an exposure apparatus EX as a substrate processing apparatus 1011. In the present embodiment, the configuration of the transport device 1009 on the substrate P is the same as the configuration of the transport device 1009 shown in FIG. The configuration of the substrate processing apparatus 1011 shown in FIG. 11 is different from the configurations of the apparatus of FIGS. 2, 7, and 8 above in that the mask M is not a rotating cylindrical mask but a normal transmissive flat mask. The angle θ1001 with respect to the optical axis AX1003 (plane p1006) of the first reflection surface p1004 of the first deflection member 1050 provided in each projection module PL1001 to PL1006 of the projection optical system PL is set to 45 ° or the like.

In FIG. 11, the mask holding device 1012 includes a mask stage 1078 that holds a flat mask M and a moving device that scans and moves the mask stage 1078 along the X direction in a plane orthogonal to the central plane p1003 (not shown). And.

Since the pattern plane of the mask M in FIG. 11 is a plane substantially parallel to the XY plane, each main ray EL3 on the mask M side of the projection modules PL1001 to PL1006 becomes perpendicular to the XY plane, and each illumination on the mask M. The optical axes (main rays) of the illumination modules IL1001 to IL1006 that illuminate the regions IR1001 to IR1006 are also arranged so as to be perpendicular to the XY plane.

In the present embodiment, the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflection member 1050 included in the first optical system 1041 of the projection modules PL1001 to PL1006 are formed by the imaging light beam EL2 emitted from the first optical system 1041. The main ray EL3 of the above is arranged so as to be substantially parallel to the central surface p1003. That is, in the first deflection member 1050 and the second deflection member 1057 included in each of the projection modules PL1001 to PL1006, the main ray EL3 traveling in the normal direction from each illumination region IR1001 to IR1006 on the mask M is along the cylindrical surface. The imaging light beam EL2 is deflected so as to be incident on the projection regions PA1001 to PA1006 formed on the substrate P from the normal direction.

Therefore, the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 are arranged so as to be orthogonal to each other, and the first reflection surface p1004 and the second reflection surface p1005 are both the first optical axis AX1003 (XY). It is set to substantially 45 ° with respect to the surface).

Further, the third reflecting surface p1008 of the second deflection member 1057 is non-plane symmetric with respect to the fourth reflecting surface p1009 with respect to a plane (parallel to the XY plane) including the second optical axis AX1004 and orthogonal to the central plane p1003. Have been placed. The angle θ1003 formed by the third reflecting surface p1008 with the second optical axis AX1004 is substantially 45 °, and the angle θ1004 formed by the fourth reflecting surface p1009 with the second optical axis AX1004 is substantially less than 45 °. The setting of the angle θ1004 is as described with reference to FIG.

Further, also in the present embodiment, as in FIG. 9, when viewed in the XZ plane, the illumination region IR1002 is located from the center point of the illumination region IR1001 (and IR1003, IR1005) on the mask M (first surface p1001). The distance to the center point of (and IR1004, IR1006) is from the center point of the projection region PA1001 (and PA1003, PA1005) on the cylindrical substrate P to the center point of the second projection region PA1002 (and PA1004, PA1006). It is set to be substantially equal to the length (perimeter) along the cylindrical second surface p1002.

Also in the substrate processing device 1011 shown in FIG. 11, the control device 1014 shown in FIG. 2 controls the moving device (linear motor for scanning exposure, actuator for fine movement, etc.) of the mask holding device 1012, and the second The mask stage 1078 is driven in synchronization with the rotation of the drum member 1022. In the substrate processing apparatus 1011 shown in FIG. 11, it is necessary to perform an operation (rewinding) of returning the mask M to the initial position in the −X direction after performing scanning exposure by synchronously moving the mask M in the + X direction. Therefore, when the second drum member 1022 is continuously rotated at a constant speed and the substrate P is continuously fed at a constant speed, pattern exposure is not performed on the substrate P during the rewinding operation of the mask M, and the transfer direction of the substrate P is not performed. The panel patterns are formed in a discrete manner (separated from each other). However, since it is practically assumed that the speed of the substrate P (here, the peripheral speed) and the speed of the mask M at the time of scanning exposure are 50 to 100 mm / s, the mask stage 1078 is used when rewinding the mask M. For example, if it is driven at a maximum speed of 500 mm / s, the margin regarding the substrate transport direction between the panel patterns formed on the substrate P can be narrowed.

[Fifth Embodiment]
Next, the fifth embodiment will be described with reference to FIG. In FIG. 12, the same components as those of the above-described embodiments may be designated by the same reference numerals as those of the above-described embodiments to simplify or omit the description thereof.

The mask M in FIG. 12 uses the same cylindrical mask M as in FIGS. 2, 7, and 8, but creates a pattern with a high reflection portion and a low reflection (light absorption) portion with respect to the illumination light. It is configured as a reflective mask. Therefore, the transmissive illumination device 1013 (illumination optical system IL) as in each of the above embodiments cannot be used, and epi-illumination that projects illumination light from each projection module PL1001 to PL1006 toward the reflective mask M. A configuration like a lighting system is required.

In FIG. 12, a polarizing beam splitter PBS and a 1/4 wave plate PK are provided between the first reflecting surface p1004 of the first deflecting member 1050 constituting the first optical system 1041 and the reflective mask M. In the configuration of each projection module shown in FIG. 6 above, the focus correction optical member 1044 and the image shift correction optical member 1045 are provided at the positions, but in the present embodiment, the focus correction optical member 1044 and the image shift correction are provided. The optical member 1045 is moved to a space in front of or behind the intermediate image plane p1007 (field diaphragm 1043).

The wave plane splitting surface of the polarizing beam splitter PBS is angled α / 2 (θd) with respect to the central surface p1003 by the angle θ1001 (<45 °) with respect to the optical axis AX1003 (plane p6) of the first reflecting surface p1004 of the first deflecting member 1050. ) Is tilted and is arranged at about 45 ° with respect to the main ray EL3 traveling in the radial direction (normal direction) from the illumination region IR1001 on the reflection type mask M.

The illumination light beam EL1 is, for example, emitted from a laser light source having good polarization characteristics, and becomes linearly polarized light (S-polarized light) through a beam shaping optical system, an illuminance uniforming optical system (fly-eye lens, rod element, etc.) and the like. It is incident on the beam splitter PBS. Most of the illumination light flux EL1 is reflected on the wave plane dividing surface of the polarizing beam splitter PBS, and the illumination light flux EL1 is converted into circularly polarized light through the 1/4 wave plate PK to set the illumination region IR1001 on the reflection type mask M. Illuminate the shape or rectangle.

The light (imaging light beam) reflected by the pattern plane (first plane p1001) of the mask M is again converted into linearly polarized light (P-polarized light) through the 1/4 wave plate PK, and the wave plane splitting of the polarizing beam splitter PBS. It almost penetrates the surface and faces the first reflecting surface p1004 of the first deflecting member 1050. The configuration after the first reflecting surface p1004 and the optical path of the imaging light beam (main ray EL3) are the same as those described in FIG. 6, and the reflecting portion appearing in the illumination region IR1001 on the reflective mask M. The image of the pattern according to is projected in the projection area PA1001.

As described above, in the present embodiment, a reflection type cylindrical mask is simply added to the first optical system 1041 of the projection module PL1001 (and PL1002 to PL1006) by adding the polarizing beam splitter PBS and the 1/4 wave plate PK. Even so, the epi-illumination system can be easily realized. Further, the illumination luminous flux EL1 is configured to be incident on the polarizing beam splitter PBS from a direction intersecting the direction of the main ray EL3 of the imaging light beam reflected by the reflection type mask M and directed toward the reflection type mask M. ing. Therefore, even if the extinction ratio (separation characteristic) of the P-polarized light and the S-polarized light of the polarizing beam splitter PBS is slightly small, a part of the illumination luminous flux EL1 as stray light is directly from the wave plane dividing surface of the polarizing beam splitter PBS. The first reflecting surface p1004 of the 1050 does not go toward the projection region PA1001 of the substrate P, the quality (contrast, etc.) of the image projected and exposed on the substrate P is kept good, and the mask pattern can be faithfully transferred. ..

[Sixth Embodiment]
FIG. 13 is a diagram showing a configuration of a projection optical system PL (first projection module PL1001) according to the sixth embodiment. The first projection module PL1001 includes a third deflection member (plane mirror) 1120, a first lens group (equal magnification projection) 1051, a first concave mirror 1052 arranged on the pupil surface, a fourth deflection member (plane mirror) 1121, and A fifth optical system (magnifying projection system) 1122 is provided. The first surface p1001 on which the illumination region IR (first illumination region IR1001) is arranged is a pattern surface of the mask M (transmissive type or reflective type) held by the cylindrical first drum member 1021 and is a cylindrical surface. It has become. Further, the second surface p1002 on the substrate P on which the projection region PA (first projection region PA1001) is arranged is a flat surface here.
When the mask M held by the first drum member 1021 (mask support member) is a reflection type as shown in FIG. 12, a polarizing beam splitter and 1 are inserted between the mask M and the third deflection member 1120. A / 4 wave plate is provided.

In FIG. 13, the imaged luminous flux EL2 emitted from the first illumination region IR1001 is reflected by the fifth reflecting surface p1017 of the third deflection member 1120 and is incident on the first lens group 1051. The imaged luminous flux EL2 incident on the first lens group 1051 is reflected by the first concave mirror 1052, folded back, emitted from the first lens group 1051, and incident on the sixth reflecting surface p1018 of the fourth deflection member 1121. The first lens group 1051 and the first concave mirror 1052 form an intermediate image of the mask M pattern appearing in the first illumination region IR1001 at the same magnification in the same manner as in the above embodiment.

The imaged luminous flux EL2 reflected by the sixth reflecting surface p1018 enters the fifth optical system 1122 through the formation position of the intermediate image, and reaches the first projection region PA1001 through the fifth optical system 1122. The fifth optical system 1122 reimages the intermediate image formed by the first lens group 1051 and the first concave mirror 1052 in the first projection region PA1001 at a predetermined magnification (for example, 2 times or more).

In FIG. 13, the fifth reflection surface p1017 of the third deflection member 1120 corresponds to the first reflection surface p1004 of the first deflection member 1050 described with reference to FIG. 6, and the sixth reflection surface p1018 of the fourth deflection member 1121 is It corresponds to the second reflecting surface p5 of the first deflection member 50 described with reference to FIG.

In the projection optical system shown in FIG. 13, the extension line of the main ray EL3 between the third deflection member 1120 and the mask M (cylindrical first surface p1001) is set to pass through the rotation center line AX1001 of the mask M. The main ray EL3 of the imaging light beam EL2 between the second optical system 1122 having the optical axis AX1008 perpendicular to the surface of the substrate P supported in a plane (second surface p1002) and the projection region PA1001 on the substrate P is the first. It is set so as to be perpendicular to the two planes p1002, that is, to satisfy the telecentric imaging condition. In order to maintain such a condition, the projection optical system of FIG. 13 includes an adjusting mechanism that slightly rotates the third deflection member 1120 or the fourth deflection member 1121 in the XZ plane in FIG.

The third deflection member 1120 and the fourth deflection member 1121 have a minute rotation in the YZ plane in FIG. 13, a minute movement in the X-axis direction and the Z-axis direction, and an axial rotation parallel to the Z-axis. It may be configured to enable minute rotation. In that case, the image projected in the projection area PA1001 can be finely shifted in the X direction or slightly rotated in the XY plane.

Although the projection module PL1001 is an enlarged projection optical system as a whole, it may be an equal-magnification projection optical system or a reduced projection optical system as a whole. In that case, since the first optical system including the first lens group 1051 and the first concave mirror 1052 is the same magnification system, the projection magnification of the fifth optical system 1122 in the subsequent stage may be changed to the same magnification or reduction.

[Modified example of the sixth embodiment]
FIG. 14 is a view of the configuration of a modified example using the projection optical system according to the sixth embodiment as viewed from the Y-axis direction, and FIG. 15 is a view of the configuration of FIG. 14 as viewed from the X-axis direction. In the projection optical system shown in FIGS. 14 and 15, a plurality of magnified projection optical systems of FIG. 13 are arranged in the Y-axis direction, that is, in the axial direction of the rotation center axis AX1001 of the cylindrical mask M to be multi-layered. A modified example is shown.

As shown in FIG. 15, the projection optical system PL of this modification includes a first projection module PL1001 and a second projection module PL1002. The second projection module PL1002 has the same configuration as the first projection module PL1001 and is arranged in contrast to the first projection module PL1001 with respect to the central plane p1003 as shown in FIG. 14, but the Y axis in FIG. As for the directions, as shown in FIG. 15, they are separated from each other.

As shown in FIG. 14, the first projection module PL1001 has a third deflection member 1120A, a first lens group 1051A, a first concave mirror 1052A, and a fourth deflection member 1121A that receive an imaging light flux from the illumination region IR1001 on the mask M. , And a fifth optical system (magnifying imaging system) 1122A.

The projection module PL1001 shown in FIGS. 14 and 15 has a different inclination direction of the main light beam between the mask M and the third deflection member 1120A as compared with the above-mentioned projection optical systems (FIGS. 6 and 13). .. That is, the reflection surface p1004 of the first deflection member 1050 of FIG. 6 and the reflection surface of the third deflection member 1120 of FIG. 13 refer to the main ray EL3 from the illumination region IR1001 of the mask M with the first lens group 1051 (1051A). While it is deflected at an blunt angle (90 ° or more) so as to be parallel to the optical axis AX1003 of the first optical system composed of the first concave mirror 1052 (1052A), in the configuration of FIG. 14, the illumination region IR1001 The main ray EL3 from is deflected at a sharp angle (less than 90 °) so as to be parallel to the optical axis of the first optical system.

Similarly, as shown in FIG. 14, the second projection module PL1002 also receives the imaged luminous flux from the illumination region IR1002 on the mask M, the third deflection member 1120B, the first lens group 1051B, the first concave mirror 1052B, and the first The four deflection members 1121B and the fifth optical system (magnifying imaging system) 1122B are provided.

The projection optical systems PL1001 and PL1002 shown in FIGS. 14 and 15 are magnified projection optical systems as a whole, and as shown in FIG. 15, the mask M (first drum member 1021) in which the first illumination region IR1001 is arranged is arranged. The first region A1001 above and the second region A1002 on the mask M (first drum member 1021) on which the second illumination region IR1002 is arranged are separated from each other in the Y direction. However, by appropriately determining the magnification of the projection optical systems PL1001 and PL1002, the third region A1005 (image region) of the first region A1001 projected onto the projection region PA1001 on the substrate P and the projection region on the substrate P The fourth region A1006 (image region) of the second region A1002 projected on the PA1002 is set so as to partially overlap in the Y direction when viewed in the YZ plane. As a result, the first region A1001 and the second region A1002 on the mask M (first drum member 1021) are formed by being connected in the Y direction on the substrate P, and a large panel pattern can be projected and exposed. ..

As described above, in the substrate processing apparatus including the projection optical system PL shown in FIGS. 14 and 15, the projection optical system shown in FIG. 13 is arranged symmetrically with respect to the central plane p1003 and the Y axis. Compared with the case where a plurality of projection optical systems are arranged in the direction, the width dimension of the entire projection optical system in the X direction can be made compact, and the size of the processing device in the X direction can be reduced.

As described in FIG. 9 above, in FIG. 14 seen in the XZ plane, the peripheral length between the center points of the illumination region IR1001 and the illumination region IR1002 defined on the mask M (first drum member 1021). The distance DFx between the DMx and the respective center points of the corresponding projection regions PA1001 and PA1002 on the substrate P is set in the relationship of DFx = Mp · DMx when the magnification of the projection optical system is Mp.

[7th Embodiment]
FIG. 16 is a diagram showing a configuration of a projection optical system according to the seventh embodiment. The imaged luminous flux EL2 from the first illumination region IR1001 formed on the cylindrical first surface p1001 (mask pattern surface) enters the sixth optical system 1131 and passes through the sixth optical system 1131 to the seventh deflection member. The imagerized luminous flux EL2 reflected by the ninth reflecting surface p1022 of the (plane mirror) 1132 reaches the intermediate image plane p1007 on which the first field diaphragm 1043 is arranged, and an image of the mask M pattern is formed on the intermediate image plane p1007. NS.

The imaged luminous flux EL2 that has passed through the intermediate image plane p1007 is reflected by the tenth reflecting surface p1023 of the eighth deflecting member (plane mirror) 1133, and is supported along the cylindrical second plane p1002 through the seventh optical system 1134. It reaches the first projection region PA1001 on the substrate P. The first projection module PL1001 of FIG. 16 projects an image of the mask M pattern in the first illumination region IR1001 onto the first projection region PA1001 as an upright image.

In FIG. 16, the sixth optical system 1131 is an imaging optical system having the same magnification, and its optical axis AX1010 is substantially coaxial with the main ray of the imaging luminous flux EL2 passing through the center of the first illumination region IR1001. .. In other words, the optical axis AX1010 is substantially parallel to the first radial direction D1001 shown in FIGS. 4 or 7-9.

The seventh optical system 1134 is an image-forming optical system having the same magnification, and the intermediate image formed by the sixth optical system 1131 is re-imaged in the first projection region PA1001. The optical axis AX1011 of the seventh optical system 1134 is substantially parallel to the first normal direction (diameter direction) D1003 of the cylindrical second surface p1002 passing through the center of the first projection region PA1001.

In the present embodiment, the two deflection members 1132 and 1133 are symmetrically arranged on the XZ plane in FIG. 16 with the intermediate image plane p1007 in between. For convenience, an intermediate image plane is formed at a position where the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 intersect, and a reflection surface parallel to the YZ plane is formed at the position of the intermediate image plane. It is also conceivable to arrange one plane mirror with an optical path to bend the optical path. However, in the case where one plane mirror is sufficient, if the angle formed by the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 is larger than 90 ° in the XZ plane in FIG. The angle formed by the reflecting surface of one plane mirror and each of the optical axes AX1010 and AX1011 is a sharp angle of less than 45 °, and the imaging characteristics may not be very preferable. For example, if the angle formed by the optical axes AX1010 and AX1011 is about 140 °, the angle formed by the reflecting surface of one plane mirror and the optical axes AX1010 and AX1011 is 20 °. Therefore, as shown in FIG. 16, if the optical path is bent by using the two deflection members (plane mirrors) 1132 and 1133, such a problem is alleviated.

In the configuration of FIG. 16, the sixth optical system 1131 may be an imaging lens having a magnification of Mf, the seventh optical system 1134 may be an imaging lens having a reduction magnification of 1 / Mf, and the projection system may be the same magnification as a whole. .. On the contrary, the sixth optical system 1131 may be used as an imaging lens having a reduction magnification of 1 / Mf, the seventh optical system 1134 may be used as an imaging lens having a magnification magnification of Mf, and a projection system having the same magnification as a whole may be used.

[8th Embodiment]
FIG. 17 is a diagram showing a configuration of a projection optical system PL (first projection module PL1001) according to the eighth embodiment. The basic configuration of the optical system is the same as that of FIG. 16 above, except that two deflection members (plane mirrors) 1140 and 1143 are added.

In FIG. 17, the eighth optical system 1135 corresponding to the imaging optical system 1131 in FIG. 16 is composed of a third lens 1139 and a fourth lens 1141, and its optical axis is along the cylindrical first surface p1001. It is set substantially parallel to the main ray of the imaging light beam EL2 emitted in the normal direction from the center of the first illumination region IR1001 on the mask M supported by the lens. A pupil surface of the eighth optical system 1135 is formed between the third lens 1139 and the fourth lens 1141, and an eleventh deflection member (plane mirror) 1140 is provided at that position.

The imaged light beam EL2 emitted from the first illumination region IR1001 and passed through the third lens 1139 is bent at the thirteenth reflecting surface p1026 of the eleventh deflecting member 1140 at an angle of 90 ° or close to it, and becomes the fourth lens 1141. It is incident and is reflected by the 11th reflection surface p1024 of the 9th deflection member (plane mirror) 1136 corresponding to the deflection member 1132 in FIG. 16 to reach the field diaphragm 1043 arranged on the intermediate image plane p1007. As a result, the eighth optical system 1135 forms an image of the mask M pattern appearing in the first illumination region IR1001 at the position of the intermediate image plane p1007.

The eighth optical system 1135 is an imaging optical system having the same magnification, and the intermediate image plane p1007 is configured to be orthogonal to the central plane p1003. Further, the optical axis of the third lens 1139 is substantially parallel to or substantially coaxial with the main ray of the imaging light beam EL2 emitted in the normal direction (radial direction of the cylindrical first surface p1001) from the center of the first illumination region IR1001. It is parallel.

The ninth optical system 1138 in FIG. 17 has the same configuration as the eighth optical system 1135, and has the same configuration as the eighth optical system 1135 with respect to the intermediate image plane p1007 including the first field diaphragm 1043 and substantially orthogonal to the central plane p1003. They are arranged symmetrically. The imaging light beam EL2 that has passed through the field diaphragm 1043 through the eighth optical system 1135 and the ninth deflection member 1136 is reflected by the twelfth reflection surface p1025 of the tenth deflection member (plane mirror) 1137 to cause the ninth optical system 1138. The first projection region PA1001 on the substrate P supported along the cylindrical second surface p1002 through the fifth lens 1142, the twelfth deflection member 1143 arranged at the pupil position, and the sixth lens 1144. To reach. In the configuration of FIG. 17, the optical axis of the sixth lens 1144 is substantially the main ray of the imaging light beam EL2 traveling in the normal direction (radial direction of the cylindrical second surface p1002) with respect to the first projection region PA1001. Is set coaxially or parallel to.

[9th Embodiment]
FIG. 18 is a diagram showing a configuration of a projection optical system PL (first projection module PL1001) according to the ninth embodiment. The first projection module PL1001 of FIG. 18 is a so-called in-line type reflection / refraction type projection optical system. The first projection module PL1001 is described in FIGS. 13 and 14 the tenth optical system 1145 having the same magnification, the first field diaphragm 1043 (intermediate image plane p1007), and FIGS. A second optical system 1122 as shown is provided.

The tenth optical system 1145 forms an intermediate image of a pattern appearing in the first illumination region IR1001 on the mask M supported along the cylindrical first surface p1001 at the position of the field diaphragm 1043. In this embodiment, the tenth optical system 1145 is an optical system of the same magnification system. Each of the fourth concave mirror 1146 and the fifth concave mirror 1147 is configured, for example, as part of a rotating ellipsoid. This rotating ellipsoidal surface is a surface formed by rotating an ellipse around a major axis (X-axis direction) or a minor axis (Z-axis direction) of the ellipse.

In the configuration of FIG. 18, the main ray of the imaging luminous flux EL2 emitted from the center of the first illumination region IR1001 in the normal direction (diameter direction) of the cylindrical first surface p1001 is the first surface when viewed in the XZ plane. It is set so as to face the rotation center axis AX1001 of p1001 (first drum member 1021). That is, the main light beam of the imaging luminous flux EL2 directed from the mask M (first surface p1001) toward the fourth concave mirror 1146 of the projection module PL1001 is inclined in the XZ plane with respect to the central surface p1003.

The fifth optical system 1122 is, for example, a refraction-type magnifying projection optical system as described in FIG. 13, and an intermediate image formed at the position of the field diaphragm 1043 by the tenth optical system 1145 is formed on a planar second surface. It projects onto the first projection region PA1001 on the substrate P supported along p1002.

In the fourth concave mirror 1146 and the fifth concave mirror 1147 of the tenth optical system, the imaging light beam EL2 emitted in the normal direction from the first illumination region IR1001 passes through the fifth optical system 1122 with respect to the first projection region PA1001. The imaging light beam EL2 is deflected so that it is incident from the linear direction. A substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of exposure defects and enables faithful projection exposure, similarly to the substrate processing apparatus 1011 described in the above embodiment. The fifth optical system 1122 may be a projection optical system having the same magnification or a reduction optical system.

[10th Embodiment]
FIG. 19 is a diagram showing a configuration of a projection optical system PL (first projection module PL1001) of the tenth embodiment. The first projection module PL1001 in FIG. 19 is an optical system of a refraction system that does not include a reflecting member having power. The first projection module PL1001 includes an eleventh optical system 1150, a thirteenth deflection member 1151, a first field diaphragm 1043, a fourteenth deflection member 1152, and a twelfth optical system 1153.

In the present embodiment, the imaged luminous flux EL2 emitted from the first illumination region IR1001 on the mask M held along the cylindrical first surface p1001 is composed of a wedge-shaped prism through the eleventh optical system 1150. It is deflected in the XZ plane by the thirteenth deflection member 1151 to reach the first field diaphragm 1043 arranged on the intermediate image plane p1007, and an intermediate image of the mask pattern is formed here. Further, the imaged luminous flux EL2 that has passed through the first field diaphragm 1043 is deflected in the XZ plane by the 14th deflecting member 1152 formed of a wedge-shaped prism and is incident on the 12th optical system 1153 to cause the 12th optical system 1153. Through it, it reaches the first projection region PA1001 on the substrate P supported along the cylindrical second surface p1002.

The optical axis of the eleventh optical system 1150 is substantially parallel to, for example, the main ray of the imaging light beam EL2 emitted in the normal direction (radial direction of the cylindrical first surface p1001) from the center of the first illumination region IR1001. It is parallel. Further, the twelfth optical system 1153 has the same configuration as the eleventh optical system 1150, and is symmetrical with the eleventh optical system 1150 with respect to the intermediate image plane p1007 (perpendicular to the central plane p1003) in which the first field diaphragm 1043 is arranged. Is arranged. The optical axis of the twelfth optical system 1153 is set substantially parallel to the main ray of the imaging luminous flux EL2 incident on the first projection region PA1001 along the normal line of the planar second surface p1002.

The thirteenth deflection member 1151 has a ninth surface p1028 in which the image-forming luminous flux EL2 passing through the eleventh optical system 1150 is incident, and a tenth surface p1029 in which the image-forming luminous flux incident from the ninth surface p1028 is emitted. It is arranged in front of or immediately before the first field diaphragm 1043 (intermediate image plane p1007). In the present embodiment, each of the ninth plane p1028 and the tenth plane p1029 forming a predetermined apex angle is a plane that is inclined with respect to a plane (XY plane) orthogonal to the central plane p1003 and extends in the Y-axis direction. It is composed.

The 14th deflection member 1152 is a prism member similar to the 13th deflection member 1151, and is arranged symmetrically with respect to the 13th deflection member 1151 with respect to the intermediate image plane p1007 in which the first field diaphragm 1043 is located. The 14th deflection member 1152 has an eleventh surface p1030 on which the image light flux EL2 incident through the first visual field diaphragm 1043 is incident, and a twelfth surface p1031 on which the imaging light flux EL2 incident from the eleventh surface p1030 is emitted. , Is arranged behind or immediately after the first field diaphragm 1043 (intermediate image plane p1007).

In the present embodiment, the thirteenth deflection member 1151 and the fourteenth deflection member 1152 incident the imaged luminous flux EL2 emitted in the normal direction from the first illumination region IR1001 on the first projection region PA1001 from the normal direction. Bias like. A substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of exposure defects and enables faithful projection exposure, similarly to the substrate processing apparatus 1011 described in the above embodiment.

The eleventh optical system 1150 or the twelfth optical system 1153 may be a magnifying projection system or a reduced projection system, but either the mask M or the substrate P may be a cylindrical surface (or a cylindrical surface). When projection exposure is performed while supporting along the arc plane), the distance between the visual fields on the object surface side (perimeter distance) and the final image plane between the two projection modules separated in the circumferential length direction of the cylindrical plane. The ratio to the distance (perimeter distance) of the projection visual field on the side may be set to match the projection magnification.

[11th Embodiment]
FIG. 20 is a diagram showing a partial configuration of the device manufacturing system (flexible display manufacturing line) of the eleventh embodiment. Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 sequentially passes through n processing devices U1, U2, U3, U4, U5, ... Un, and is a recovery roll. An example of winding up to FR2 is shown. The upper control device 2005 comprehensively controls each of the processing devices U1 to Un constituting the production line.

In FIG. 20, the Cartesian coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is set to the Y direction. It shall be done. The substrate P may be one whose surface is modified and activated by a predetermined pretreatment in advance, or one in which a fine partition wall structure (concavo-convex structure) for precision patterning is formed on the surface.

The substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and conveyed to the processing device U1, but the center of the substrate P in the Y direction (width direction) is targeted by the edge position controller EPC1. Servo control is performed so that the position falls within the range of ± tens of μm to several tens of μm.

The processing apparatus U1 continuously or continuously applies a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curable resin liquid, etc.) to the surface of the substrate P in the transport direction (long direction) of the substrate P by a printing method. It is a coating device that selectively coats. A coating mechanism including an impression roller DR2 around which the substrate P is wound, a coating roller for uniformly applying the photosensitive functional liquid on the surface of the substrate P on the impression roller DR2, and the like in the processing device U1. Gp1, a drying mechanism Gp2 for rapidly removing the solvent or water contained in the photosensitive functional liquid applied to the substrate P, and the like are provided.

The processing device U2 is a heating device for heating the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several 10 to 120 ° C.) to stabilize the photosensitive functional layer coated on the surface. Is. In the processing device U2, a plurality of rollers and an air turn bar for folding back and transporting the substrate P, a heating chamber portion HA1 for heating the carried-in substrate P, and the temperature of the heated substrate P are set. A cooling chamber portion HA2, a nipped drive roller DR3, and the like are provided to lower the temperature so as to be uniform with the environmental temperature of the post-process (processing apparatus U3).

The processing device U3 as a substrate processing device is an exposure device that irradiates the photosensitive functional layer of the substrate P conveyed from the processing device U2 with ultraviolet patterning light corresponding to a circuit pattern for display and a wiring pattern. be. The edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) to a fixed position, the nipped drive roller DR4, and the substrate P are partially wound in the processing device U3 with a predetermined tension, and the substrate P is partially wound. A rotating drum DR5 that supports the portion exposed to the pattern on the P in a uniform cylindrical surface, and two sets of drive rollers DR6, DR7, etc. for giving a predetermined slack (play) DL to the substrate P are provided. ing.

Further, in the processing device U3, a projection optical system that projects an image of a part of the mask pattern of the cylindrical mask M onto a part of the cylindrical mask M and the substrate P supported by the rotating drum DR5 in a cylindrical surface shape. Alignment microscopes AM1 and AM2 for detecting an alignment mark or the like formed in advance on the substrate P are provided in order to relatively align the PL with the image of a part of the projected mask pattern and the substrate P. Has been done.

In the present embodiment, since the cylindrical mask M is of the reflective type (the pattern of the outer peripheral surface is formed by the highly reflective portion and the non-reflective portion), the pattern is formed through a part of the optical elements of the projection optical system PL. An epi-illumination optical system that irradiates the cylindrical mask M with the illumination light for exposure is also provided. The configuration of the epi-illumination optical system will be described in detail later.

The processing device U4 is a wet processing device that performs wet development processing, electroless plating treatment, and the like on the photosensitive functional layer of the substrate P conveyed from the processing device U3. In the processing apparatus U4, three processing tanks BT1, BT2, and BT3 layered in the Z direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like are provided.

The processing device U5 is a heating / drying device that warms the substrate P conveyed from the processing device U4 and adjusts the water content of the substrate P moistened by the wet process to a predetermined value, but the details will be omitted. After that, the substrate P that has passed through the final processing apparatus Un of the series of processes through several processing apparatus is wound up on the recovery roll FR2 via the nipped drive roller DR1. Even during the winding, the edge position controller EPC2 is used by the edge position controller EPC2 so that the center of the substrate P in the Y direction (width direction) or the edge of the substrate in the Y direction does not fluctuate in the Y direction. The relative position of the direction is sequentially corrected and controlled.

As the substrate P used in the present embodiment, the same substrate P as that illustrated in the first embodiment can be used, and the description thereof will be omitted here.

The device manufacturing system 2001 of the present embodiment repeatedly executes various processes for manufacturing one device on the substrate P. The substrate P subjected to various treatments is divided (diced) for each device into a plurality of devices. The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (the short Y direction) and 10 m or more in the length direction (the long X direction).

Next, the configuration of the processing apparatus U3 (exposure apparatus) of the present embodiment will be described, but before that, the basic configuration of the exposure apparatus of the present embodiment will be described with reference to FIGS. 21 to 23.

The exposure device U3 shown in FIG. 21 is a so-called scanning exposure device, which is a reflective cylindrical mask M having a circumferential surface having a radius r2001 from the rotation center axis AX2001 and a circumferential surface having a radius r2002 from the rotation center axis AX2002. It is provided with a rotating drum 2030 (DR5 in FIG. 1) having the above. Then, by synchronously rotating the cylindrical mask M and the rotating drum 2030 at a predetermined rotation speed ratio, an image of the pattern formed on the outer circumference of the cylindrical mask M becomes a part of the outer peripheral surface of the rotating drum 2030. The surface of the substrate P wound around the surface (the surface curved along the cylindrical surface) is continuously and repeatedly projected and exposed.

The exposure device U3 is provided with a transport mechanism 2009, a mask holding mechanism 2012, an illumination optical system IL, a projection optical system PL, and a control device 2013, and is held by the control device 2013 in the mask holding mechanism 2012 in a cylindrical shape. The rotation drive of the mask M and the fine movement in the rotation center axis AX2001 direction, or the rotation drive of the rotation drum 2030 and the fine movement in the rotation center axis AX2002 direction, which form a part of the transfer mechanism 2009 that conveys the substrate P in the long direction, are controlled. Will be done.

The mask holding mechanism 2012 applies a rotational driving force around the rotation center axis AX2001 to the rotation drum 2020 formed on the outer peripheral surface of the reflection type mask M (mask pattern), or the direction of the rotation center axis AX2001 parallel to the Y axis. Drive transmission mechanisms 2021 and 2022 such as rollers, gears, and belts for finely moving the rotary drum 2020, a rotary motor for giving the necessary driving force to these drive transmission mechanisms 2021 and 2022, and a linear for fine movement. It includes a first drive unit 2024 including a motor, a piezo element, and the like. Further, the rotation angle position of the rotation drum 2020 (mask M) and the position in the rotation center axis AX2001 direction are measured by the first detector 2023 including the rotary encoder, the laser interferometer, the gap sensor, etc., and the measurement information is measured in real time. It is sent to the control device 2013 and used to control the first drive unit 2024.

Similarly, in the rotary drum 2030, a rotary motor, a linear motor for fine movement, a second drive unit 2032 including a piezo element, etc. A small amount of power is given in the direction of. The rotation angle position of the rotation drum 2030 and the position in the rotation center axis AX2002 direction are measured by a second detector 2031 including a rotary encoder, a laser interferometer, a gap sensor, etc., and the measurement information is sent to the control device 2013 in real time. It is used to control the second drive unit 2032.

Here, in the present embodiment, it is assumed that the rotation center axis AX2001 of the cylindrical mask M and the rotation center axis AX2002 of the rotation drum 2030 are located in the center plane pc parallel to the YZ plane and parallel to each other.
Then, the illumination region IR of the exposure illumination light is set at the portion intersecting the central surface pc on the cylindrical pattern surface p2001 on which the cylindrical mask M is formed, and the cylinder is formed along the outer peripheral surface p2002 of the rotating drum 2030. It is assumed that a projection region PA for projecting an image of a part of the mask pattern appearing in the illumination region IR is set at a portion intersecting the central surface pc on the substrate P wound in a shape.

In the present embodiment, the projection optical system PL emits the illumination light beam EL1 toward the illumination region IR on the cylindrical mask M, and the light beam (imaging light beam) EL2 reflected and diffracted by the mask pattern in the illumination region IR. The illumination optical system IL is configured by an epi-illumination method that shares a part of the optical path of the projection optical system PL so as to form an image of a pattern on the projection region PA on the substrate P.

As shown in FIG. 21, the projection optical system PL is tilted 45 ° in the XZ plane with respect to the central plane pc, and has a prism mirror 2041 provided with reflection planes 2041a and 2041b orthogonal to each other, and light orthogonal to the central plane pc. It includes a second optical system 2015 having a shaft 2015a and composed of a concave mirror 2040 arranged on the pupil surface pd and a plurality of lenses.

Here, assuming that the plane including the optical axis 2015a and parallel to the XY plane is p2005, the angle θ2001 of the reflection plane 2041a with respect to the plane p2005 is + 45 °, and the angle of the reflection plane 2041b with respect to the plane p2005. θ2002 is −45 °.

The projection optical system PL is telecentric as, for example, a half image field type reflective bending type projection optical system (a modified type of the Dyson optical system) in which a circular image field is divided by the upper and lower reflection planes 2041a and 2041b of the prism mirror 2041. It is composed. Therefore, the imaging light beam EL2 reflected / diffracted by the pattern in the illumination region IR is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041 and is a concave mirror arranged on the pupil surface pd through a plurality of lenses. Reach 2040 (may be a plane mirror). Then, the imaging light beam EL2 reflected by the concave mirror 2040 passes through an optical path symmetrical with respect to the plane p2005, reaches the reflection plane 2041b of the prism mirror 2041, is reflected there, reaches the projection region PA on the substrate P, and masks. An image of the pattern is formed on the substrate P at the same magnification (x1).

In order to apply the epi-illumination method to such a projection optical system PL, in the present embodiment, a passing portion (window) is formed in a part of the reflection surface p2004 of the concave mirror 2040 arranged on the pupil surface pd. , The illumination light flux EL1 is configured to be incident from the surface p2003 (glass surface) side through the passing portion.
FIG. 21 shows only a part of the first optical system 2014 arranged behind the concave mirror 2040 in the illumination optical system IL of the present embodiment, and is illuminated by a light source, a fly-eye lens, an illumination field aperture, or the like, which will be described later. Of the light, only the illumination light beam EL1 related to one point light source image Sf of a large number of point light source images generated on the pupil surface pd is shown.

Since the point light source image Sf is set to have an optically conjugate relationship with, for example, a point light source image (light emitting point of the light source) formed on each emission side of a plurality of lens elements constituting the fly-eye lens, it has a cylindrical shape. The illumination region IR on the mask M is illuminated by the Koehler illumination method with a uniform illumination distribution by the illumination light beam EL1 via the second optical system 2015 of the projection optical system PL and the reflection plane 2041a on the upper side of the prism mirror 2041. ..

In FIG. 21, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL, and the illumination region IR on the cylindrical mask M is cylindrical. The width of the pattern surface p2001 in the circumferential direction is narrow, and is set in a long slit shape in the direction of the rotation center axis AX2001.

As an example, assuming that the radius r2001 of the pattern surface p2001 of the cylindrical mask M is 200 mm and the thickness tf of the substrate P is 0.2 mm, the conditions for projection exposure are that the radius r2002 of the outer peripheral surface of the rotating drum 30 is r2002. = R2001-tf (199.8 mm) can be set.

Further, the narrower the circumferential width (width in the scanning exposure direction) of the illumination region IR (or projection region PA), the more faithfully the fine pattern can be projected and exposed, but in inverse proportion to that, the inside of the illumination region IR. It is necessary to increase the illuminance per unit area of. The width of the illumination area IR (or projection area PA) is determined by the cylindrical mask M, the radii r2001 and r2002 of the rotating drum 2030, the fineness of the pattern to be transferred (line width, etc.), and the projection optics. It is determined by considering the depth of focus of the system PL, etc.

By the way, in FIG. 21, assuming that the position on the reflection surface p2004 of the concave mirror 2040 through which the optical axis 2015a passes is the center point 2044, the point light source image Sf is a position deviated from the center point 2044 in the paper surface (XZ surface) in the −Z direction. The normal reflected light (0th-order diffracted light) of the imaging light beam EL2 (including diffracted light) reflected by the illumination region IR on the cylindrical mask M is the center point on the reflecting surface p2004. It converges so as to form a point light source image Sf'at a position symmetrical with respect to 2044. Therefore, if the region including the portion where the point light source image Sf'is located on the reflection surface p2004 and the portion around which the ± 1st-order diffracted light is distributed is set as the reflection portion, the imaged light beam EL2 from the illumination region IR can be obtained. The projection region PA is reached through the plurality of lenses of the second optical system 2015 and the reflection plane 2041b of the prism mirror 2041 with almost no loss.

The concave mirror 2040 is formed by depositing a metallic reflective film such as aluminum on the concave surface of a concave lens made of a transparent optical glass material (quartz or the like) to form a reflective surface p2004, and usually, the light of the reflective film is obtained. The transmittance is extremely low. Therefore, in the present embodiment, in order to make the illumination light flux EL1 incident from the surface p2003 on the back side of the reflection surface p2004, a part of the reflective film constituting the reflection surface p2004 is removed by etching or the like, and the converged illumination light flux EL1 passes through ( Form a transparent window.

FIG. 22 is a view of the reflection surface p2004 of such a concave mirror 2040 as viewed from the X direction. In FIG. 22, for the sake of simplicity, the three window portions 2042a and 2042b are positioned on the reflection surface p2004 at positions deviated by a certain amount in the −Z direction from the plane p2005 (parallel to the XY surface) including the optical axis 2015a. , 2042c are provided so as to be separated from each other in the Y direction. The windows 2042a, 2042b, and 2042c are formed by removing the reflective film constituting the reflective surface p2004 by selective etching, and here, the light source images Sfa, Sfb, and Sfc (illumination luminous flux EL1a) are used. , EL1b, EL1c) is made into a small rectangular shape that does not block it, but other shapes (circle, ellipse, polygon, etc.) may be used. The three point light source images Sfa, Sfb, and Sfc are, for example, formed by three lens elements arranged in the Y direction among a plurality of lens elements of the fly-eye lens provided in the illumination optical system IL.

When viewed in the reflective surface p2004, the mutual positional relationship of each window portion 2042a, 2042b, 2042c is defined as a non-point symmetric relationship with respect to the center point 2044 (optical axis 2015a), that is, a non-point symmetric relationship. .. Although only three windows are shown here, even when more windows are created, the windows are set in a non-point symmetric positional relationship with respect to the center point 2044.

Then, when the illumination luminous flux EL1a from the point light source image Sfa generated in the window portion 2042a becomes a substantially parallel luminous flux and is irradiated to the illumination region IR of the cylindrical mask M, the imaged luminous flux which is the reflected diffracted light thereof. The EL2a is converged as a point light source image Sfa'at a position point-symmetrical to the window portion 2042a with respect to the center point 2044 on the reflecting surface p2004 of the concave mirror 2040.

Similarly, the illumination luminous fluxes EL1b and EL1c from the point light source images Sfb and Sfc generated in the window portions 2042b and 2042c also become substantially parallel luminous fluxes and irradiate the illumination region IR of the cylindrical mask M. The reflected light fluxes EL2b and EL2c are converged as point light source images Sfb'and Sfc' on the reflecting surface p2004 of the concave mirror 2040 at positions point-symmetrical to each of the windows 2042b and 2042c with respect to the center point 2044. ..

Further, as shown in FIG. 22, the imaging luminous fluxes EL2a, EL2b, and EL2c that form the point light source images Sfa', Sfb', and Sfc' include 0th-order diffracted light (specularly reflected light) and ± 1st-order diffracted light. However, each of the ± 1st-order diffracted lights DLa, DLb, and DLc spreads and is distributed in the Z-axis direction and the Y-axis direction with the 0th-order diffracted light in between.

Further, in the point light source images Sfa', Sfb', and Sfc' (especially the 0th-order diffracted light) formed on the reflecting surface p2004, since the illumination region IR of the cylindrical mask M is a cylindrical surface, FIG. 22 The shapes of the point light source images Sfa, Sfb, and Sfc that serve as the illumination luminous flux EL1 are distributed in the paper surface (YZ surface) as if they were stretched in the Z direction (circumferential direction of the cylindrical mask).

As shown in FIG. 22, when each point light source image Sfa, Sfb, Sfc is located below the plane p2005 including the center point 2044 (optical axis 2015a) (−Z direction), it is within the paper surface shown in FIG. (In the XZ plane), the illumination light beam EL1 (EL1a, EL1b, EL1c) reaches the cylindrical mask M via the second optical system 2015 and the reflection plane 2041a on the upper side of the prism mirror 2041. The illumination light fluxes EL1 (EL1a, EL1b, EL1c) are parallel light fluxes immediately before the cylindrical mask M, but are slightly inclined with respect to the central surface pc. The amount of inclination corresponds to the amount of displacement in the Z direction from the center point 2044 (optical axis 2015a) of the point light source image Sf (Sfa, Sfb, Sfc) in the reflection surface p2004 (inside the pupil surface pd).

The imaging light beam EL2 (EL2a, EL2b, EL2c) reflected and diffracted in the illumination region IR has a gradient symmetrical to the illumination light beam EL1 (EL1a, EL1b, EL1c) with respect to the central plane pc in the XZ plane, and is a prism. It reaches the reflection plane 2041a on the upper side of the mirror 2041, reflects here and enters the second optical system 2015, and reaches the portion of the reflection plane p2004 of the concave mirror 2040 above the plane p2005 (center point 2044).

In the example shown in FIGS. 21 and 22 above, in the reflecting surface p2004 of the concave mirror 2040, below the plane p2005 parallel to the XY plane including the optical axis 2015a of the projection optical system PL (-Z direction). The point light source image (condensing point) Sf of the illumination light beam EL1 is distributed, but the condition described above, that is, the mutual positional relationship of the window portion 2042 in the reflection surface p2004 through which the point light source image of the illumination light beam is passed is determined. The position of the point light source image Sf (window portion 2042) on the reflecting surface p2004 can be freely set as long as the relationship is not point-symmetrical (non-point-symmetrical relationship) with respect to the center point 2044.

When a window portion 2042 through which a large number of point light source images Sf, which is a source of the illumination luminous flux EL1, passes is formed on the reflection surface p2004 of the concave mirror 2040 under at least such a condition, the illumination luminous flux is formed on the reflection surface p2004 (pupil surface pd). And the imaged luminous flux can be efficiently spatially separated.

While a large number of window portions 2042 (point light source images Sfa, Sfb, Sfc ...) of the illumination luminous flux are uniformly distributed in the reflection surface p2004, the spatial separation between the illumination luminous flux and the imaged luminous flux is kept good. For this purpose, the magnitudes (including ± primary diffracted light DLa, DLb, DLc) of each point light source image Sfa', Sfb', Sfc' ... formed by the convergence of the imaged luminous flux EL2 on the reflecting surface p2004. The size) may be set to be smaller than the distance between the adjacent window portions 2042 in the Y direction and the Z direction. In other words, the pupil surface pd (reflection surface p2004) of each point light source image Sfa, Sfb, Sfc ... Of the illumination luminous flux EL1 so that the individual dimensions of the window portions 2042a, 2042b, 2042c ... It is effective to narrow down the dimensions in) as small as possible.

In this embodiment, a mercury discharge lamp, a metal halide lamp, an ultraviolet LED, or the like can be used as the light source, but in order to reduce the point light source images Sfa, Sfb, Sfc ... Of the illumination luminous flux EL1, the brightness is high. A laser light source that emits light having a narrow oscillation wavelength band can be used.

Here, an example of the configuration of the illumination optical system IL (first optical system 2014) shown in FIGS. 21 and 22 will be described with reference to FIG. 23. In FIG. 23, the same members as those described in FIGS. 21 and 22 are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 23, the prism mirror 2041 in FIG. 21 is omitted, and the optical path between the illumination region IR on the cylindrical pattern surface p2001 of the cylindrical mask M and the second optical system 2015 and the rotating drum 2030. The optical path between the projection region PA on the outer peripheral surface (or the surface of the substrate P) p2002 and the second optical system 2015 is shown in an expanded manner.

As described above, the illumination optical system IL is subjected to the fly-eye lens 2062 in which the light beam EL0 (illumination light beam EL0) from the light source is incident to generate a large number of point light source images, and from each of the large number of point light source images. 2065, which is a condenser lens that superimposes the light beam of the above on the illumination field aperture (blind) 2064, and 2066, which is a lens system that guides the illumination light that has passed through the opening of the illumination field aperture 2064 to the concave mirror 2040 of the projection optical system PL (second optical system 2015). And are provided. In order to apply the Koehler illumination method, the surface Ep on which the point light source image is generated on the emission side of the fly-eye lens 2062 is the concave mirror 2040 depending on the glass material (concave lens shape) constituting the condenser lens 2065, the lens system 2066, and the concave mirror 2040. It is set to be conjugate with the pupil surface pd in which the reflecting surface is located.

In the YZ plane, the center of the ejection end of the fly-eye lens 2062 is arranged on the optical axis 2065a of the condenser lens 2065, and the center of the illumination field diaphragm 2064 (opening) is arranged on the optical axis 2065a. Further, the illumination field diaphragm 2064 is composed of a lens system 2066, a glass material (concave lens shape) constituting the concave mirror 2040, and a plurality of lenses of the second optical system 2015, and the illumination region IR (pattern surface p2001) on the cylindrical mask M. It is arranged on a surface 2014b that is optically conjugate with the lens.

Further, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL (second optical system 2015), but the optical axis 2065a of the condenser lens 2065 is the first. It is arranged eccentrically in the −Z direction on the paper surface (XZ surface) of FIG. 23 with respect to the optical axis 2014a of the optical system 2014.

Here, among the plurality of point light source images generated on the plane Ep on the emission side of the fly-eye lens 2062, two point light source images SPa and SPd located asymmetrically in the Z direction with the optical axis 2065a in between are taken as an example. , The behavior of the illumination light source will be explained.

The luminous flux from the point light source image SPA becomes a substantially parallel luminous flux by the condenser lens 2065 and irradiates the illumination field diaphragm 2064. The illumination luminous flux EL1a transmitted through the opening (slit-shaped elongated in the Y direction) of the illumination field aperture 2064 converges as a point light source image Sfa in the window formed on the reflection surface of the concave mirror 2040 of the projection optical system PL by the lens system 2066. Will be done.

As described with reference to FIG. 21, the illumination light flux EL1a from the point light source image Sfa is the illumination region IR on the cylindrical pattern surface p2001 of the cylindrical mask M via the second optical system 2015 of the projection optical system PL. Illuminate. The imaging light flux EL2a generated on the pattern surface p2001 by the irradiation of the illumination light source EL1a from the point light source image Sfa reverses the second optical system 2015 and reimages the point light source image Sfa'on the concave mirror 2040. In the pupil surface pd, the point light source image Sfa created by the luminous flux from the illumination optical system IL and the point light source image Sfa'created by the imaging light flux EL2a are located in the pupil surface pd in a point-symmetrical relationship.

Similarly, the luminous flux from the point light source image SPd becomes a substantially parallel luminous flux by the condenser lens 2065 and illuminates the illumination field diaphragm 2064. The illumination luminous flux EL1d transmitted through the opening of the illumination field diaphragm 2064 is converged as a point light source image Sfd in the window formed on the reflection surface of the concave mirror 2040 by the lens system 2066. The illumination light flux EL1d from the point light source image Sfd illuminates the illumination region IR on the cylindrical pattern surface p2001 via the second optical system 2015. The imaged luminous flux EL2d generated on the pattern surface p2001 by the irradiation of the illumination luminous flux from the point light source image Sfd reverses the second optical system 2015 and reimages the point light source image Sfd'on the concave mirror 2040. In the pupil surface pd, the point light source image Sfd created by the luminous flux from the illumination optical system IL and the point light source image Sfd'created by the imaging light flux EL2d are located in the pupil surface pd in a point-symmetrical relationship.

The imaged luminous fluxes EL2a and EL2d forming the point light source images Sfa'and Sfd' on the reflecting surface of the concave mirror 2040 are projected into the cylindrical projection area PA on the substrate P, and the image of the mask pattern in the illumination area IR. Is imaged and projected in the projection area PA of the substrate P.

FIG. 24 shows the configuration of the light source device 2055 that generates the illumination luminous flux EL0 incident on the fly-eye lens 2062 of the illumination optical system IL shown in FIG. The light source device 2055 includes a solid light source 2057, an expander lens (concave lens) 2058, a condenser lens 2059, and a light guide member 2060. The solid-state light source 2057 includes, for example, a laser diode (LD), a light emitting diode (LED), and the like. The illumination light beam LB emitted from the solid-state light source 2057 is converted into a divergent light beam by the expander lens 2058, and is focused by the condenser lens 2059 on the incident end surface 2060a of the light guide member 2060 with a predetermined degree of convergence (NA).

The light guide member 2060 is, for example, an optical fiber, and the illumination luminous flux LB incident on the incident end surface 2060a is emitted from the emission end surface 2060b while preserving the NA (numerical aperture), and is illuminated substantially in parallel by the lens system 2061 (colimeter). It is converted to the luminous flux EL0. The lens system 2061 adjusts the luminous flux diameter of the illumination flux EL0 so as to irradiate the entire surface of the fly-eye lens 2062 on the incident side. The diameter of a single optical fiber is, for example, about 300 μm, but when the light intensity of the illumination luminous flux LB from the solid-state light source 2057 is high, a plurality of optical fibers may be tightly bundled.

FIG. 25 is a view of the arrangement state of a large number of point light source images SP formed on the emission-side surface Ep (parallel to the YZ surface) of the fly-eye lens 2062 in FIG. 23 from the condenser lens 2065 side. Assuming that the center point of the plane Ep on the injection side of the fly-eye lens 2062 is 2062a in the YZ plane, this center point 2062a is located on the optical axis 2065a of the condenser lens 2065.

As shown in FIG. 25, the fly-eye lens 2062 of the present embodiment includes a plurality of lens elements 2062E arranged on a plane orthogonal to the optical axis 2065a of the condenser lens 2065. Each of the plurality of lens elements 2062E has a rectangular cross section elongated in the Y direction, and is tightly bundled in the Y direction and the Z direction. A point light source image (spot) SP is formed at the center of the emission end of each lens element 2062E, which is a conjugate image of the emission end surface 2060b of the light guide member 2060 (optical fiber) in FIG. 24. A plurality of lens elements 2062E are bundled so that each point light source image SP is astigmatic with respect to the center point 2062a (optical axis 2065a) when viewed in the YZ plane.

In the example shown in FIG. 25, when the optical axis 2065a of the condenser lens 2065 is included and the surface parallel to the XY surface is p2006, the set of lens elements 2062E located on the + Z side of this surface p2006 is the upper lens element group. Assuming that the set of the lens elements 2062E located on the −Z side of the surface p2006 of 2062U is the lower lens element group 2062D, the dimension of the lens element 2062E in the Y direction is between the upper lens element group 2062U and the lower lens element group 2062D. The position is shifted by 1/2. As a result, the plurality of point light source images SP scattered in the upper lens element group 2062U and the plurality of point light source image SPs scattered in the lower lens element group 2062D are parallel to the Y axis passing through the center point 2062a. The arrangement is also asymmetric with respect to the lines.

The cross-sectional shape of each lens element 2062E of the fly-eye lens 2062 in the YZ plane is formed as a rectangle extending in the Y direction in order to match the slit-shaped aperture shape of the illumination field diaphragm 2064 in FIG. 23. .. The situation will be described with reference to FIG. 26.

FIG. 26 is a view of the illumination field diaphragm 2064 in FIG. 23 viewed in the YZ plane. An elongated rectangular (or trapezoidal) opening 2064A is formed in the illumination field diaphragm 2064 in the Y direction, and the luminous flux from each point light source image SP of the fly-eye lens 2062 is collected by the illumination field diaphragm 2064 by the condenser lens 2065. Above, it is superimposed as a rectangular illumination flux EL1 including the opening 2064A. When the opening center of the opening 2064A is arranged on the optical axis 2065a of the condenser lens 2065, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is positioned eccentrically in the + Z direction from the opening center of the opening 2064A. Pass.

FIG. 27 shows the state of the reflection surface p2004 (arranged on the pupil surface pd) of the concave mirror 2040 that can be used for the distribution of the point light source image SP generated by the fly-eye lens 2062 of FIG. It is seen from the optical system 2015 side. Since the reflective surface p2004 of the concave mirror 2040 is conjugate with the surface Ep on the emission side of the fly-eye lens 2062, the distribution of the plurality of point light source images SP (lens element 2062E) shown in FIG. 25 is as shown in FIG. 27. In the pupil surface pd), the distribution of the point light source image Sf (black circle) is inverted left and right and up and down.

As described with reference to FIG. 22, window portions 2042 for transmitting a plurality of point light source images Sf are arranged astigmatically symmetrically with respect to the center point 2044 (optical axis 2015a) on the reflection surface p2004 of the concave mirror 2040. Will be done. In the example of FIG. 27, the window portion 2042 is formed in a slit shape elongated in the Z direction so as to collectively transmit the illumination light fluxes from the plurality of point light source images Sf arranged in a row in the Z direction. Except for the slit-shaped window portion 2042 in the reflecting surface p2004, it is a highly reflecting portion that efficiently reflects the imaged luminous flux from the pattern in the illumination region IR of the cylindrical mask M.

The plurality of point light source images Sf are arranged non-plane symmetrically with respect to the plane p2005 including the optical axis 2015a of the second optical system 2015 and orthogonal to the central surface pc (FIG. 21), and the Y of each slit-shaped window portion 2042. The dimension in the direction is set so narrow that the point light source image Sf is not shielded from light. As described with reference to FIG. 23, the luminous flux (illumination luminous flux EL1) from each of the plurality of point light source images Sf passing through each window portion 2042 passes through the second optical system 2015 and the pattern surface p2001 of the cylindrical mask M. The upper illumination area IR is superimposed and irradiated. As a result, the illumination region IR is illuminated with a uniform illuminance distribution.

The reflected light (imaging light flux EL2) from the mask pattern appearing in the illumination region IR of the pattern surface p2001 returns to the reflecting surface p2004 of the concave mirror 2040, but the imaging light beam EL2 is again pointed on the reflecting surface p2004. It becomes a light source image Sf'and has a separated distribution. As described with reference to FIG. 22, the distribution of a large number of point light source images Sf'(especially 0th-order diffracted light) generated on the reflection surface p2004 by the imaging light flux EL2 becomes a large number of illumination light flux EL1 with respect to the center point 2044. It has a point-symmetrical relationship with the distribution of the point light source image Sf.

As shown in FIG. 27, all the regions on the reflection surface p2004 having a point-symmetrical relationship with the plurality of window portions 2042 in which a large number of point light source images Sf, which are the sources of the illumination luminous flux EL1, are distributed, are high reflection portions. Therefore, the point light source image Sf'(including the primary diffracted light) reimaged on the reflecting surface p2004 is reflected with almost no loss and reaches the substrate P.

[Modification 1 of the eleventh embodiment]
In FIG. 27, the illumination light beam is formed on a line of the reflection surface p2004 of the concave mirror 2040 that intersects the plane p2005 (parallel to the XY plane) including the optical axis 2015a of the projection optical system PL (second optical system 2015). Even when the point light source image Sf that is the source of the point light source image Sf is located, the portion where the point light source image Sf is located is set as the window portion 2042 as in the above arrangement condition, and the region symmetrical to the window portion 2042 with respect to the center point 2044. Should be set as a reflecting part (light-shielding part).

However, when the point light source image Sf (window portion 2042) is located at the center point 2044, when the illumination luminous flux originating from the point light source image Sf irradiates the illumination region IR on the cylindrical mask M, it is reflected there. Since the formed image-forming light flux converges so as to form a point light source image Sf'at the center point 2044 (window portion 2042) of the reflecting surface p2004, the image-forming light flux may not be the image-forming light flux toward the substrate P. From this, the arrangement of a large number of lens elements 2062E constituting the fly-eye lens 2062 is changed so that the point light source image Sf is not located near the center point 2044 of the reflection surface p2004, or the position of the center point 2044 is changed. A light-shielding film (black coating) may be applied to the corresponding lens element 2062E.

Further, in the present embodiment, as shown in FIGS. 25 and 27, the arrangement of the point light source image SP (arrangement of the lens elements 2062E) formed on the surface Ep on the emission side of the fly-eye lens 2062 and the reflection of the concave mirror 2040. The arrangement of the window portion 2042 formed on the surface p2004 is matched on a one-to-one basis, but this is not always necessary. That is, among a large number of point light source image SPs formed on the emission side surface Ep of the fly-eye lens 2062, a part of the point light source image SP that can enter from the back surface p2003 of the concave mirror 2040 and reach the reflection surface p2004 (pupil surface pd). The point light source image Sf may be shielded from light by leaving the reflecting surface as it is without providing the window portion 2042. The light shielding can be similarly realized by forming a light shielding film or a light absorbing layer in the region where the point light source image Sf to be shielded is located in the surface p2003 on the back side of the concave mirror 2040.

[Modification 2 of the 11th embodiment]
The image luminous flux EL2 (a large number of point light source images Sf') incident on the concave mirror 2040 from the second optical system 2015 constituting the projection optical system PL does not necessarily have to be completely reflected by the concave mirror 2040. For example, on the reflecting surface p2004 of the concave mirror 2040, in addition to the transmissive window portion 2042 and the reflecting portion, a plurality of point light source images Sf that are sources of the illumination luminous flux EL1 and a plurality of points formed by the convergence of the imaging luminous flux EL2. A light-shielding portion may be provided to shield the point light source image of one or a part of the point light source image Sf'.

Although the eleventh embodiment has been described above, in the present embodiment, as shown in FIG. 21 or 22, the illumination light from the illumination optical system IL is arranged on the pupil surface pd of the projection optical system PL. It is incident from the back side of the concave mirror 2040, and enters the illumination region IR on the cylindrical mask M as the illumination light beam EL1 via the second optical system 2015 constituting the projection optical system PL and the reflection plane 2041a on the upper side of the prism mirror 2041. Reach.

The imaging optical path of the projection optical system PL in this embodiment is the first optical path from the illumination region IR (object surface) to the concave mirror 2040 (pupil surface pd) and the projection region PA (image plane) from the concave mirror 2040 (pupil surface pd). ), The first optical path also serves as an optical path for epi-illumination for guiding the illumination light beam from the illumination optical system IL to the illumination region IR.

As described above, in the processing apparatus U3 (exposure apparatus) of the present embodiment, the illumination light flux and the imaging light flux are efficiently spatially separated by the reflecting mirror arranged at or near the pupil surface of the projection optical system PL. Since the epi-illumination method is used, the configuration of the device can be simplified. Further, as compared with the method of separating the illumination luminous flux and the imaging luminous flux according to the difference in the polarization state, it is not necessary to use a large polarization beam splitter, a wave plate, or the like, and the device configuration can be simplified.

Furthermore, in the method of separating the illumination luminous flux and the imaging luminous flux by polarization, it is necessary to deal with the deterioration of the characteristics (contrast, aberration, etc.) of the projected image due to the disturbance of the wave surface due to the wave plate and the problem of the extinction ratio in the polarization beam splitter. However, in the present embodiment, there is almost no deterioration in the characteristics of the projected image due to such a cause, and the occurrence of exposure defects can be suppressed. Further, since the exposure apparatus U3 of the present embodiment incorporates an epi-illumination method of irradiating the reflection type mask M with illumination light through a part of the optical path of the projection optical system, the inside of the transmission type mask is illuminated. Compared with the case of incorporating an optical system, the degree of freedom in designing the illumination optical system is particularly high.

In the present embodiment, the light source device 2055 shown in FIG. 24 uses a laser light source having strong synchrotron radiation directivity (for example, excimer laser light such as KrF, ArF, XeF) because the size of the point light source image can be reduced. I assumed that, but it is not limited to that. For example, a lamp light source that emits emission line light such as g-line, h-line, or i-line, or a laser diode or light-emitting diode (LED) having a weak directivity of the radiated light may be used.

In the device manufacturing system 2001 (FIG. 20) of the present embodiment, the configuration of the processing device U3 (exposure device) can be simplified, so that the manufacturing cost of the device can be reduced. Further, since the processing device U3 is a system in which the substrate P is scanned and exposed while being conveyed along the outer peripheral surface p2002 of the rotary drum 2030, the exposure processing can be efficiently executed. As a result, the device manufacturing system 2001 can efficiently manufacture the device.

[12th Embodiment]
Next, the twelfth embodiment will be described with reference to FIG. 28. This embodiment is a modification of the configuration of the fly-eye lens 2062 described with reference to FIGS. 25 and 27 and the arrangement of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040. Similar components are designated by the same reference numerals as those in the above embodiment to simplify or omit the description thereof.

FIG. 28 shows how the plurality of lens elements 2062E of the fly-eye lens 2062 are equivalently arranged in the reflection surface p2004 of the concave mirror 2040 in the YZ plane orthogonal to the optical axis 2015a of the projection optical system PL. It is a view. The lens element closest to the center point 2044 so that the plurality of lens elements 2062E (point light source image Sf) are arranged in a non-point symmetric arrangement with respect to the center point 2044 (optical axis 2015a) of the reflection surface p2004 of the concave mirror 2040. The center of 2062E is displaced from the center point 2044 in the Y direction and the Z direction.

Also in this embodiment, the cross-sectional shape (shape in the YZ plane) of each lens element 2062E of the fly-eye lens 2062 includes the rectangular opening 2064A of the illumination field aperture 2064 as described with reference to FIG. 26 above. Although the shape is set to be similar to the rectangle to be used, here, it is assumed that the ratio Py / Pz of the cross-sectional dimension Py in the Y direction and the cross-sectional dimension Pz in the Z direction is set to approximately 4. Therefore, a large number of point light source images Sf distributed in the reflection surface p2004 (pupil surface pd) are also arranged at a pitch of cross-sectional dimension Py in the Y direction and at a pitch of cross-sectional dimension Pz in the Z direction.

In a normal fly-eye lens, the centers of the lens elements 2062E are arranged in a straight line in both the Y direction and the Z direction, but in the present embodiment, the lens elements 2062E adjacent to the Z direction are arranged in the Y direction ΔY. Displace and place them one by one. When this displacement amount ΔY is set to about 1/4 of the cross-sectional dimension (array pitch) Py of the lens element 2062E in the Y direction, the light source images Sf at each point are either ± 45 degrees or ± 135 degrees in the YZ plane. It will be located apart in that direction.

In FIG. 28, when four point light source images Sf located in the immediate vicinity of the center point 2044 of the reflection surface p2004 and surrounding the center point 2044 are specified, a region surrounded by the four point light source images Sf (here, an inclined rectangle). The position of the center of gravity of) is displaced from the center point 2044. In other words, the position of the center of gravity of the region surrounded by the four point light source images Sf is different from the center point 2044. By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane so that such a displacement occurs, each of all the point light source images Sf is in a non-point symmetric relationship with respect to the center point 2044. Can be placed. This means that a region on the reflecting surface p2004 that has a point-symmetrical relationship with each point light source image Sf with respect to the center point 2044 can always be formed as a reflecting portion.

Corresponding to the distribution of the point light source image Sf arranged as described above, a window portion 2042 for transmitting each point light source image Sf is formed in the reflection surface p2004 of the concave mirror 2040. There are several possible forms of dimensions and arrangement. Simply, as shown in FIG. 28, a circular window portion 2042H that allows only one point light source image Sf to pass through is distributed over the entire surface of the reflection surface p2004 according to the arrangement of the point light source image Sf. ..

As another form, a slot-shaped window portion 2042K may be used so as to collectively transmit all the point light source images Sf arranged in a line at an angle of 45 degrees with respect to the Y direction on the reflecting surface p2004. When an illumination luminous flux originating from a series of point light source images Sf located in the window portion 2042K irradiates the illumination region IR of the cylindrical mask M, the reflected luminous flux (imaging luminous flux) is the reflecting surface of the concave mirror 2040. On p2004, the point light source image Sf'(including the primary diffraction image) converges in the reflection region 2042K'displaced from the window portion through which the point light source image Sf is transmitted. In addition, an oval-shaped (or gourd-shaped) window portion 2042L may be used in which two point light source images Sf arranged at an angle of 45 degrees with respect to the Y direction are paired and transmitted together. Whichever window portion 2042H, 2042K, 2042L is formed, it is formed as small as possible within a range that does not partially block the illumination light from each point light source image Sf.

In the above twelfth embodiment, the displacement amount ΔY of the lens element 2062E of the fly-eye lens 2062 in the Y direction can be arbitrarily set, and the ratio Py / Pz of the cross-sectional dimensions of the lens element 2062E does not necessarily have to be an integral multiple. ..

[13th Embodiment]
Next, the thirteenth embodiment will be described with reference to FIG. 29. Similar to FIG. 28, this embodiment also relates to the configuration of the fly-eye lens 2062 and the modification of the arrangement of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040. In the configuration of FIG. 29, the centers of the plurality of lens elements 2062E of the fly-eye lens 2062 are linearly arranged in the Y direction and the Z direction in the YZ plane.

In the case of such a fly-eye lens 2062, the point light source images Sf formed on the emission side of each lens element 2062E are arranged at a pitch of cross-sectional dimension Py in the Y direction and at a pitch of cross-sectional dimension Pz in the Z direction. NS. Even in such a case, as described in the twelfth embodiment of FIG. 28, four point light source images located in the immediate vicinity of the center point 2044 (optical axis 2015a) of the reflection surface p2004 of the concave mirror 2040 and surrounding the center point 2044. When focusing on Sfv1, Sfv2, Sfv3, and Sfv4, the center of gravity position Gc of the region (rectangular) surrounded by the four point light source images Sfv1 to Sfv4 is displaced from the center point 2044. In other words, the center of gravity position Gc is at a position different from the center point 2044.

By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane so that such a displacement occurs, each of all the point light source images Sf is in a non-point symmetric relationship with respect to the center point 2044. Can be placed. Therefore, the region on the reflecting surface p2004 that has a point-symmetrical relationship with each point light source image Sf with respect to the center point 2044 can always be a reflecting portion.

On the reflecting surface p2004 of the concave mirror 2040 of the present embodiment, circular window portions 2042H for individually transmitting the point light source image Sf are formed in accordance with the pitch of the arrangement of the lens elements 2062E (point light source image Sf). Has been done.

[14th Embodiment]
Next, the 14th embodiment will be described with reference to FIG. Similar to FIGS. 28 and 29, this embodiment also relates to the configuration of the fly-eye lens 2062 and the modification of the arrangement of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040. In the configuration of FIG. 30, a plurality of lens elements 2062E (cross-sectional shape is an elongated rectangle in the Y direction) of the fly-eye lens 2062 are arranged in the Y direction at a pitch of the cross-sectional dimension Py, and are densely arranged in the Z direction at a pitch of the cross-sectional dimension Pz. Although they are arranged, the lens elements 2062E group for one row arranged in the Y direction are arranged by alternately changing (shifting) the position in the Y direction by Py / 2 for each row in the Z direction.

In the case of the fly-eye lens 2062, the point light source image Sf is generated on the emission end side of all the lens elements 2062E that receive the illumination light from the light source (for example, EL0 in FIG. 24). The light-shielding body 2062s is formed on the corresponding lens element 2062E so as to shield one of the two point light source images Sf having a point-symmetrical arrangement relationship with respect to the center point 2044 of the reflection surface p2004 of the concave mirror 2040.

In the configuration of FIG. 30, a light-shielding body 2062s (metal thin film or the like) is provided on the corresponding lens element 2062E so that the selected point light source image Sf is randomly and uniformly distributed in the reflection surface p2004 of the concave mirror 2040. Is formed. Even when such a fly-eye lens 2062 is used, as shown in FIG. 30, a circular window portion 2042H for transmitting the point light source image Sf is formed on the reflecting surface p2004 of the concave mirror 2040.

[15th Embodiment]
Next, the fifteenth embodiment will be described with reference to FIG. 31. In the present embodiment, a large number of point light source images Sf are formed in the reflection surface p2004 of the concave mirror 2040 by the light source image forming unit without using the fly-eye lens 2062 described so far. FIG. 31 shows a cross section of the concave mirror 2040 on a surface parallel to the XZ surface and including the optical axis 2015a (center point 2044), and the window portion 2042H is shown on the reflection surface p2004 on which the point light source image Sf (Sfa) is located. Is formed.

In the concave mirror 2040, for example, a reflective film is formed on the concave side of a base material made of fine ceramics or glass ceramics having a low coefficient of thermal expansion. A plurality of window portions 2042H are formed on the reflective film according to the same conditions as in each of the above embodiments, and in the present embodiment, the base material behind the window portion 2042H is a part of the illumination optical system IL. A through hole (diameter of about 1 mm) through which the optical fiber Fbs is passed is formed.

The emission end of each optical fiber Fbs functions as a point light source image and is installed on substantially the same surface as the reflection surface p2004. The illumination light emitted to the incident end of each optical fiber Fbs is set so that the illumination luminous flux (for example, EL1a) projected from the emission end of the optical fiber Fbs has a predetermined numerical aperture (divergence angle characteristic). Further, the direction of the illumination light beam from the emission end of each optical fiber Fbs is set so as to match the direction of the main light beam passing through the emission end (point light source image).

In the configuration shown in FIG. 31, since each of a large number of point light source images Sf is generated at the injection end of the optical fiber Fbs without using the fly-eye lens 2062, optical fibers corresponding to the number of window portions 2042H are required. The system from the light source to the concave mirror 2040, that is, the entire illumination optical system IL can be made compact.

Further, the concave mirror 2040 is provided with small holes through which the emission end of the optical fiber Fbs penetrates, and a thin optical pipe (cylindrical rod) made of quartz or the like is embedded in each of the small holes, and each of the optical pipes is embedded. An ultraviolet light emitting diode (LED) with a condensing lens may be installed on the incident end side of the light pipe, and the emission end side of each optical pipe may be aligned with the reflecting surface p2004 of the concave mirror 2040.

[16th Embodiment]
Next, the 16th embodiment will be described with reference to FIGS. 32A and 32B and 33A, 33B and 33C. In the present embodiment, instead of the fly-eye lens 2062 in the illumination optical system IL, a rod lens (square columnar glass or quartz) is used to uniformly illuminate the illumination region IR on the cylindrical mask M.

FIG. 32A is a plan view of the optical path from the light guide member 2060 (optical fiber) that guides the light of the light source to the projection optical system PL (second optical system 2015) from the Y-axis direction, and FIG. 32B is a plan view of the optical path of FIG. 32A. Is a plan view seen from the Z-axis direction. In FIGS. 32A and 32B, the optical path configuration from the illumination field diaphragm 2064 to the projection optical system PL is the same as the configuration of FIG. 23 above, and thus the description of that portion will be omitted.

The illumination optical system IL shown in FIGS. 32A and 32B includes a light guide member 2060, a condenser lens 2093, a rod lens 2094, an illumination field aperture 2064, a lens system 2066, and the like described with reference to FIG. 24. The configuration of the projection optical system PL (second optical system 2015) after the concave mirror 2040 is the same as that in FIGS. 21 and 23 above.

The illumination luminous flux EL0 emitted from the light guide member (optical fiber) 2060 is converged by the condenser lens 2093 at or near the incident end surface 2094a of the rod lens 2094. The cross-sectional shape of the rod lens 2094 along the YZ plane (incident end face 2094a, ejection end face 2094b) is formed into a rectangle including the trapezoidal shape of the illumination field diaphragm 2064 and the rectangular opening 2064A (FIG. 26). Its cross-sectional shape is substantially similar to the cross-sectional shape of the lens element 2062E of the fly-eye lens 2062 shown in FIGS. 25 and 28 to 30 above.

When the rod lens 2094 is used, the illumination luminous flux EL0 converged on the incident end surface 2094a is inside the rod lens 2094 many times between the side surface 2094c parallel to the XZ surface and the side surface 2094d parallel to the XY surface. The reflection is repeated and the process proceeds to the injection end face 2094b. In the case of a rod lens, the illuminance distribution of the illumination light is most uniform at the emission end face 2094b, but the uniformity becomes better as the number of repetitions of internal reflection increases. Therefore, the ejection end surface 2094b is arranged so as to coincide with the surface 2014b conjugate with the illumination region IR on the cylindrical mask M.

Since the rod lens 2094 of the present embodiment has a rectangular cross section, the number of times the illumination light is reflected between the opposing side surfaces 2094c is less than the number of times the illumination light is reflected between the opposite side surfaces 2094d. The length of the rod lens 2094 and the like are set so that the number of times the illumination luminous flux EL0 is reflected on the inner surface of the rod lens 2094 is two or more times from the viewpoint of improving the illuminance uniformity. Since the shape of the ejection end face 2094b of the rod lens 2094 defines the outer edge of the illumination region IR, the illumination field diaphragm 2064 may be omitted.

Assuming that the line connecting the center point of the incident end surface 2094a of the rod lens 2094 in the YZ plane and the center point of the ejection end surface 2094b in the YZ plane is the central axis AX2003, this central axis AX2003 is the projection optical system PL. Is parallel to the optical axis 2015a (optical axis 2014a of the lens system 2066), but is eccentric in the Z direction. Further, the ejection end of the light guide member 2060 is arranged on the optical axis 2093a of the condenser lens 2093, and the optical axis 2093a is arranged so as to be displaced in the −Y direction with respect to the central axis AX2003 of the rod lens 2094. Will be done.

Due to the displacement in the −Y direction, a large number of point light source images Sf generated in the reflecting surface p2004 of the concave mirror 2040 can be arranged non-point symmetric with respect to the center point 2044 (optical axis 2015a) of the reflecting surface p2004. .. This will be described in detail with reference to FIGS. 33A to 33C. 33A is a view of the condenser lens 2093 in the X-axis direction from the ejection end surface 2094b side of the rod lens 2094, FIG. 33B is a view of the rod lens 2094 in the X-axis direction from the lens system 2066 side, and FIG. 33C is a concave mirror 2040. It is a figure which looked at the reflection surface p2004 of the above from the X-axis direction.

As shown in FIG. 33A, the cross section of the rod lens 2094 is a rectangle defined by a side surface 2094d parallel to the XY plane and a side surface 2094c parallel to the XZ plane, and the central axis AX2003 of the rod lens 2094 and the condenser lens 2093. The optical axis 2093a is relatively eccentric in the Y direction. Further, as shown in FIG. 33B, the central axis AX2003 of the rod lens 2094 is eccentric in the Z direction with respect to the optical axis 2014a (2015a) of the lens system 2066.

In such a configuration, the concave lens and the lens system 2066, which are the base materials of the concave mirror 2040, set the Fourier transform surface (pupil surface pd) of the surface 2014b on which the ejection end surface 2094b of the rod lens 2094 is located on the reflection surface p2004 of the concave mirror 2040. To form. Therefore, as shown in FIG. 33C, a large number of point light source images Sf are formed on the reflecting surface p2004 of the concave mirror 2040 with a pitch DSy in the Y direction and a pitch DSz in the Z direction. These point light source images Sf appear as virtual images of spot images of the illumination luminous flux EL0 converged on the incident end surface 2094a of the rod lens 2094.

Since the cross section of the rod lens 2094 is rectangular in the plurality of point light source images Sf, the pitch DSy of the arrangement of the point light source images Sf in the direction parallel to the long side of the cross section (Y direction) is parallel to the short side. It is longer than the pitch DSz of the arrangement of the point light source image Sf in the direction (Z direction). Further, as shown in FIGS. 32A and 32B, the number of internal reflections of the illumination light in the rod lens 2094 is larger in the Z direction than in the Y direction, so that it is generated on the reflection surface p2004 of the concave mirror 2040. The number of point light source images Sf is also larger in the Z direction than in the Y direction. In the example of FIG. 33C, five point light source images Sf are arranged in the Z direction, and three point light source images Sf are arranged in the Y direction.

Further, by eccentricizing the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 in the Y direction relatively, the distribution of the point light source image Sf generated on the reflecting surface p2004 of the concave mirror 2040 is determined. The center point 2044 (optical axis 2015a) is eccentric as a whole in the Y direction, and each of the point light source images Sf can be arranged in a non-point symmetric relationship with respect to the center point 2044.

Similar to the embodiment shown in FIG. 27 above, on the reflecting surface p2004 of the concave mirror 2040, a slot-shaped window portion 2042 that collectively transmits a plurality of point light source images Sf arranged in a row in the Z direction is transmitted in the Y direction. Three rows are formed with a pitch DSy. The width of each window portion 2042 in the Y direction is set as small as possible within a range that does not block the illumination light flux originating from the point light source image Sf. These slot-shaped window portions 2042 are also formed so as to be arranged in a non-point symmetric manner with respect to the center point 2044.

In the configuration of FIG. 33C, the distance in the Y direction (Yk) from the point light source image Sf closest to the center point 2044 (optical axis 2015a) on the reflection surface p2004 (pupil surface pd) of the concave mirror 2040 to the center point 2044. Is set to less than half of the distance (referred to as Yw) of the window portions 2042 arranged in the Y direction, that is, the light of the central axis AX2003 of the rod lens 2094 and the light of the condenser lens 2093 so as to be set to Yk <(Yw / 2). The amount of eccentricity of the axis 2093a in the Y direction is set.

In this way, when the point light source image Sf, which is the source of the illumination luminous flux EL1 that irradiates the illumination region IR of the cylindrical mask M, is arranged on the reflection surface p2004 (pupil surface pd) of the concave mirror 2040, it is placed on the cylindrical mask M. As shown in FIG. 33C, the imaged luminous flux EL2 generated from the illumination region IR of the above is the diffraction image Sf'of the point light source image Sf (including the 0th-order light and the ± 1st-order diffracted light) on the reflecting surface p2004. Is distributed. On the reflecting surface p2004, the diffraction image Sf'and the point light source image Sf which is the source of the illumination luminous flux EL1 are located point-symmetrically with respect to the center point 2044.

In the present embodiment, since the relationship between the distance Yk and the interval Yw is set to Yk <(Yw / 2), a plurality of plurality of images generated on the concave mirror 2040 (pupil surface pd) by the imaging luminous flux EL2. The diffraction image Sf'is formed on the reflection portion deviated from the window portion 2042. In this way, the imaged luminous flux EL2 is reflected by the reflecting portion of the concave mirror 2040 with almost no loss, and as shown in FIG. 21 above, the projected region on the substrate P held along the outer peripheral surface p2002. It is projected on the PA.

As described above, even when the rod lens 2094 is used, by displacing the convergence position of the illumination luminous flux EL0 on the incident end surface 2094a of the rod lens 2094 from the central axis AX2003, each of a large number of point light source images Sf can be obtained. The center point 2044 of the reflecting surface p2004 of the concave mirror 2040 can be set to have an astigmatic relationship with each other.

[17th Embodiment]
Next, the configuration of the processing apparatus (exposure apparatus) U3 according to the 17th embodiment will be described with reference to FIGS. 34 and 35. In the exposure apparatus of the present embodiment, the Y-direction dimension of the pattern region of the cylindrical mask M and the Y-direction dimension of the pattern exposure region on the substrate P are illuminated by the projection optical system PL shown in FIG. In order to correspond to the size of the region IR and the projection region PA larger than the dimensions in the Y direction, a plurality of projection optical systems are arranged in the Y direction to widen the effective exposure range in the Y direction.
For that purpose, it is necessary to project the pattern of the cylindrical mask M as an upright image on the substrate P. In the projection optical system PL shown in FIG. 21 above, the X direction of the mask pattern image projected on the substrate P is upright, but the Y direction is inverted. Therefore, by providing a projection optical system having the same configuration in tandem (serial), the projection image whose Y direction is inverted is inverted again in the Y direction, and as a result, X is formed in the projection region PA on the substrate P. Make an upright image in both the direction and the Y direction.

FIG. 34 shows the overall schematic configuration of the exposure apparatus according to the present embodiment, FIG. 35 shows the arrangement relationship between the illumination region IR and the projection region PA by each of the plurality of projection optical systems, and the orthogonal coordinate system XYZ of each figure is , It is matched with the coordinate system set in the embodiment of FIG. 21 above. Further, the same reference numerals are given to those equivalent to the members and elements of the exposure apparatus shown in FIGS. 21 and 23 above.

The substrate P transported from the upstream of the transport path is wound around a part of the outer peripheral surface of the rotary drum 2030 via a transport roller or a guide member (not shown), and then the guide member or the transport roller (not shown) is moved. It is transported downstream via. The second drive unit 2032 drives the rotary drum 2030 to rotate clockwise around the rotation center axis AX2002, and the substrate P is fed at a constant speed. The projection regions PA2001 to PA2006 of the six projection optical systems PL2001 to PL2006 are located on the portion of the cylindrical outer peripheral surface of the rotating drum 2030 around which the substrate P is wound. Six illumination regions IR2001 to IR2006 are set on the outer peripheral surface (cylindrical mask pattern surface) of the cylindrical mask M corresponding to each of the six projection regions PA2001 to PA2006.

The six projection optical systems PL2001 to PL2006 all have the same optical configuration, and the central plane pc (parallel to the YZ plane) including the rotation central axis AX2001 of the cylindrical mask M and the rotation drum 2030 and the rotation central axis AX2002. ), The projection optical systems PL2001, PL2003, and PL2005 (collectively referred to as odd-numbered projection optical systems PLo) installed on the left side (-X direction) and the projection optical systems installed on the right side (+ X direction). It is divided into PL2002, PL2004, and PL2006 (collectively referred to as an even-numbered projection optical system PLe).

The projection optical systems PL2001 to PL2006 of the present embodiment include the projection optical system PL shown in FIG. 21 and the illumination optical systems IL2001 to IL2006 for epi-illumination. Since the configuration is the same as that of FIG. 21, the projection optical system PL2001 and the illumination optical system IL2001 will be briefly described as representatives. The illumination optical system IL2001 receives the illumination light beam EL0 from the light source device 2055 and is arranged from the back side of the concave mirror 2040 arranged on the pupil surface of the upper unit of the projection optical system PL2001 (the projection optical system PL similar to FIG. 21). , A large number of point light source images Sf are generated on the reflecting surface p2004. The illumination luminous flux EL1 originating from the point light source image Sf is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041 and illuminates the illumination region IR2001 on the outer peripheral surface of the cylindrical mask M.

The imaging light beam EL2 reflected from the mask pattern in the illumination region IR2001 is reflected by the reflection plane 2041a, then by the concave mirror 2040, and is reflected by the lower reflection surface (2041b) of the prism mirror 2041. A spatial image (intermediate image) of the mask pattern is formed on the surface p2007 (intermediate image surface p2007).
The projection unit in the subsequent stage of the projection optical system PL2001 is also a half-field 1x reflection refraction projection system equipped with a prism mirror, a plurality of lens elements, a concave mirror 2078 arranged on the pupil surface, etc. The imaging light beam EL2 forming the intermediate image is reflected by the concave mirror 2078, then reflected by the reflection plane 2076b below the prism mirror (2076), reaches the projection region PA2001 on the substrate P, and enters the projection region PA2001. Generates an erect image of the mask pattern. The projection unit in the subsequent stage (from the intermediate image plane to the projection region) of the projection optical system PL2001 only needs to reimage the intermediate image formed on the intermediate image plane p2007 in the projection region PA2001 on the substrate P. The reflective surface of the concave mirror 2078 is not provided with a window portion 2042 as formed on the reflective surface p2004 of the concave mirror 2040.

Since the projection optical system PL2001 having the above configuration (the same applies to the other projection optical systems PL2002 to PL2006) is one projection system of the so-called multi-lens system, it is illuminated like the projection optical system PL of FIG. It may not be possible to arrange the main ray passing through the center point in the region IR and the main ray passing through the center point in the projection region PA2001 in the center plane pc.

Therefore, as shown in FIG. 34, the projection optical system PL2001 (PL2003, PL2005 is also the same) so that the extension line D2001 of the main ray passing through the center point in the illumination region IR2001 faces the rotation center axis AX2001 of the cylindrical mask M. The angle θ2001 (see FIG. 21) of the reflection plane 2041a of the prism mirror 2041 of the projection unit on the upper side of) is set to a value other than 45 °. Similarly, the reflection plane 2076b of the prism mirror 2076 of the projection unit below the projection optical system PL2001 so that the extension line D2001 of the main ray passing through the center point in the projection region PA2001 faces the rotation center axis AX2002 of the rotation drum 2030. The angle of is set to a value other than 45 ° with respect to the XY plane.

The same applies to the projection optical system PL2002 (same for PL2004 and PL2006) arranged symmetrically with respect to the central plane pc, and the extension line D2002 of the main ray passing through the central point in the illumination region IR2002 is a cylinder. The angle θ2001 of the reflection plane 2041a of the prism mirror 2041 of the upper projection unit is set to a value other than 45 ° so as to be directed toward the rotation center axis AX2001 of the mask M, and the main ray passing through the center point in the projection region PA2002. The angle of the reflection plane 2076b of the prism mirror 2076 in the subsequent projection unit is set to a value other than 45 ° with respect to the XY plane so that the extension line D2002 of the above is directed toward the rotation center axis AX2002 of the rotation drum 2030.

As described above, the odd-numbered projection optical system PLo and the even-numbered projection optical system PLe in which the extension lines D2001 and D2002 of the main rays are inclined in contrast with respect to the central plane pc are the central plane pc when viewed in the XZ plane. Although they are arranged symmetrically with respect to each other, they are arranged so as to be offset in the Y direction when viewed in the XY plane. Specifically, each projection is such that the illumination regions IR2001 to IR2006 formed on the pattern surface of the cylindrical mask M and the projection regions PA2001 to PA2006 formed on the substrate P have the arrangement relationship shown in FIG. 35. The optical systems PL2001 to PL2006 are installed.

FIG. 35 is a view of the arrangement of the illumination areas IR2001 to IR2006 and the projection areas PA2001 to PA2006 in the XY plane, and the figure on the left shows the illumination areas IR2001 to IR2006 on the cylindrical mask M with an intermediate image. It is viewed from the intermediate image plane p2007 side to be formed, and the figure on the right side is a view of the projection regions PA2001 to PA2006 on the substrate P supported by the rotating drum 2030 from the intermediate image plane p2007 side. Further, reference numeral Xs in FIG. 35 indicates a moving direction (rotating direction) of the cylindrical mask M (rotating drum 2020) and the rotating drum 2030.

In FIG. 35, each of the illumination regions IR2001 to IR2006 has an upper base and a lower base parallel to the central surface pc (parallel to the Y axis) and has an elongated trapezoidal shape in the Y direction. This means that each of the illumination optical systems IL2001 to IL2006 shown in FIG. 34 includes an illumination field diaphragm 2064 as shown in FIG. 26 above. Since each projection optical system PL2001 to PL2006 in FIG. 34 forms an intermediate image on the intermediate image plane p2007, when a field diaphragm having a trapezoidal aperture is arranged there, the shape of each illumination region IR2001 to IR2006. May be a simple rectangular shape (a size that includes a trapezoidal opening).

On the outer peripheral surface of the cylindrical mask M, the center points of the illumination regions IR2001, IR2003, and IR2005 formed by the even-numbered projection optical system PLo are planes Lo parallel to the center plane pc (perpendicular to the XY plane). The center points of the illumination regions IR2002, IR2004, and IR2006, which are located above and are formed by the even-numbered projection optical system PLe, are located on the plane Le (perpendicular to the XY plane) parallel to the center plane pc.

Assuming that each illumination region IR2001 to IR2006 has a trapezoidal shape, the dimension of the lower base in the Y direction is A2002a, and the dimension of the upper base in the Y direction is A2002b, the center points of the odd-numbered illumination regions IR2001, IR2003, and IR2005 are They are arranged at intervals (A2002a + A2002b) in the Y direction, and the center points of the even-numbered illumination regions IR2002, IR2004, and IR2006 are also arranged at intervals (A2002a + A2002b) in the Y direction. However, the even-numbered illumination regions IR2002, IR2004, and IR2006 are relatively displaced in the Y direction by the dimension (A2002a + A2002b) / 2 with respect to the odd-numbered illumination regions IR2001, IR2003, and IR2005. The distances in the X direction from the central surface pc of the surface Lo and the surface Le are set to be equal to each other.

In the present embodiment, each of the illumination regions IR2001 to IR2006 has end portions (trapezoidal) of the illumination regions adjacent to each other in the Y direction when viewed along the circumferential direction (Xs direction) of the outer peripheral surface of the cylindrical mask M. The hypotenuses) are configured to overlap (overlap) each other. As a result, even when the size of the pattern region A2003 of the cylindrical mask M in the Y direction is large, an effective exposure region that covers it can be secured. The pattern region A2003 is surrounded by a frame-shaped pattern non-forming region A2004, but the pattern non-forming region A2004 is made of a material having an extremely low reflectance (or high light absorption) with respect to illumination light. ing.

On the other hand, as shown on the right side of FIG. 35, the projection regions PA2001 to PA2006 on the substrate P are cylindrical when the illumination field diaphragm 2064 as shown in FIG. 26 is provided in each illumination optical system IL2001 to IL2006. It reflects the arrangement and shape of the illumination regions IR2001 to IR2006 formed on the outer peripheral surface of the shaped mask M (similar relationship). Therefore, the center points of the odd-numbered projection areas PA2001, PA2003, and PA2005 are located on the surface Lo, and the center points of the even-numbered projection areas PA2002, PA2004, and PA2006 are located on the surface Le.

In the figure on the right side of FIG. 35, the substrate P is fed at a constant speed in the circumferential direction (Xs direction) along the outer peripheral surface of the rotating drum 2030, but the area A2007 shown by the diagonal line in the figure is 6 It is a portion exposed at 100% with respect to a target exposure amount (tooth amount) by one projection area PA2001 to PA2006.

Further, for example, of the region A2005 exposed by the projection region PA2001 corresponding to the illumination region IR2001, the partial region A2005a exposed at the end (triangular portion) in the + Y direction has not reached the target exposure amount. However, when the substrate P is sent in the Xs direction (circumferential direction) and the exposure area A2006 is exposed by the projection area PA2002 corresponding to the illumination area IR2002, the insufficient exposure amount is integrated, and as a result, the partial area is accumulated. A2005a is also exposed at 100% of the target exposure amount.

In this way, the entire projected image of the pattern region A2003 formed on the outer peripheral surface of the cylindrical mask M is repeated at the same magnification in the long direction on the substrate P for each rotation of the cylindrical mask M. It will be transferred.

Of the main rays of each imaging light beam EL2 directed from the respective illumination regions IR2001 to IR2006 on the cylindrical mask M toward the projection optical system PL2001 to PL2006, the main rays passing through the center point in each illumination region IR2001 to IR2006. The extension lines D2001 and D2002 are made to intersect the rotation center axis AX2001 of the cylindrical mask M, but it is not always necessary, and the main ray passing through any point in each illumination region IR2001 to IR2006 is the rotation center. It may intersect the axis AX2001. Similarly, with respect to the imaging luminous flux EL2 directed from each projection optical system PL2001 to PL2006 toward each projection region PA2001 to PA2006 on the substrate P, one of the main rays is directed to the rotation center axis of the rotating drum 2030. It may be aligned with the extension lines D2001 and D2002 that intersect with AX2002.

Next, the specific configurations of the projection optical systems PL2001 to PL2006 and the illumination optical systems IL2001 to IL2006 shown in FIG. 34 will be described with reference to FIG. 36. FIG. 36 typically shows the detailed configurations of the projection optical system PL2001 and the illumination optical system IL2001, but the configurations of the other projection optical systems PL2002 to PL2006 and the illumination optical systems IL2002 to IL2006 are also the same.

As shown in FIG. 36, the illumination luminous flux EL0 from the light source device 2055 (see FIG. 24) including the light guide member 2060 and the lens system 2061 is the fly-eye lens 2062 (see FIGS. 25 and 28 to 30) of the illumination optical system IL2001. ). The illumination luminous flux originating from a large number of point light source images generated on the emission side surface Ep of the fly-eye lens 2062 has a uniform illuminance on the surface 2014b conjugate with the mask on which the illumination field aperture 2064 is arranged by the condenser lens 2065. Be distributed. The illumination light beam passing through the opening of the illumination field aperture 2064 is reflected by the lens system 2066, the base material (quartz, etc.) of the concave mirror 2040 of the second optical system 2015 on the upper side (first stage) of the projection optical system PL2001, and the concave mirror 2040. The window portion (2042) formed on the surface p2004, the second optical system 2015 is transmitted, and the reflection plane 2041a on the upper side of the prism mirror 2041 is reflected in the direction along the extension line D2001, and is reflected on the cylindrical mask M. The illuminated area IR is reached.

Similar to the configuration of FIG. 23 above, the reflection surface p2004 of the concave mirror 2040 is arranged on the pupil surface pd in the imaging optical path of the projection optical system PL2001, and the reflection surface p2004 is the surface Ep on the emission side of the fly-eye lens 2062. Since they are arranged substantially in conjugation, a relay of a large number of point light source images generated on the surface Ep on the emission end side of the fly-eye lens 2062 is generated in the window portion 2042 formed on the reflection surface p2004. NS.

Further, in the specific configuration of FIG. 36, the focus correction optical member 2080 and the image shift optical member 2081 are inclined between the reflection plane 2041a on the upper side of the prism mirror 2041 and the pattern surface p2001 of the cylindrical mask M. It is provided along the extension line D2001. The focus correction optical member 2080 is, for example, formed by superimposing two wedge-shaped prisms in opposite directions (opposite directions in the X direction in FIG. 36) so as to form a transparent parallel flat plate as a whole. By sliding this pair of prisms to change the thickness of the parallel flat plate, the effective optical path length of the imaging optical path is finely adjusted, and the pattern formed on the intermediate image plane p2007 and the projection region PA2001. The focus state of the image is fine-tuned.

The image shift optical member 2081 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 36 and a transparent parallel flat glass that can be tilted in a direction orthogonal to the transparent parallel flat glass. By adjusting the amount of inclination of each of the two parallel flat glass sheets, the pattern image formed on the intermediate image plane p2007 and the projection region PA2001 can be slightly shifted in the X direction and the Y direction.

The image of the mask pattern appearing in the illumination region IR2001 is the focus correction optical member 2080, the image shift optical member 2081, the reflection plane 2041a of the prism mirror 2041, and the second optical system on the upper side (first stage) of the projection optical system PL2001. In 2015, an image is formed on the intermediate image plane p2007 via the reflection plane 2041b of the prism mirror 2041. On the intermediate image plane p2007, a field diaphragm 2075 that makes the shape of the projection region PA2001 trapezoidal as shown in FIG. 35 can be arranged. In that case, the opening of the illumination field diaphragm 2064 provided in the illumination optical system IL2001 may be a rectangle (rectangle) including the trapezoidal opening of the field diaphragm 2075.

The imaging light beam formed as an intermediate image at the opening of the field aperture 2075 is the reflection plane 2076a of the lower (second stage) prism mirror 2076 constituting the projection optical system PL2001, the second optical system 2077, and the prism mirror 2076. It is projected onto the projection region PA2001 on the substrate P wound around the outer peripheral surface p2002 of the rotating drum 2030 via the reflection plane 2076b. The reflection surface of the concave mirror 2078 included in the second optical system 2077 is arranged on the pupil surface pd, and the reflection plane 2076b below the prism mirror 2076 is an extension line in which the main ray of the imaging light beam is inclined with respect to the central surface pc. The angle with respect to the XY plane is set to be less than 45 ° so as to proceed along D2001.

Then, in the specific configuration of FIG. 36, a concave lens, a convex lens, and a concave lens are formed between the reflection plane 2076b on the lower side of the prism mirror 2076 and the projection region PA2001 on the substrate P wound around the rotating drum 2030. Are coaxially arranged at predetermined intervals, the front and rear concave lenses are fixed, and a magnification correction optical member 2083 is provided to move the convex lens between them in the direction of the optical axis (main ray). As a result, the pattern image formed in the projection region PA2001 is isotropically enlarged or reduced by a small amount while maintaining the telecentric imaging state.

Although not shown in FIG. 36, a rotation correction mechanism is also provided that allows either one of the prism mirrors 2041 and 2076 to be slightly rotated around an axis parallel to the Z axis. In this rotation correction mechanism, for example, each of the plurality of projection regions PA2001 to PA2006 (and the projected mask pattern image) shown in FIG. 35 is minutely rotated in the XY plane.

As described above, in the seventeenth embodiment, as shown in FIGS. 34 and 36, each of the six sets of projection optical systems PL2001 to PL2006 is illuminated on the outer peripheral surface (pattern surface) of the cylindrical mask M. The regions IR2001 to IR2006 can be epi-illuminated with illumination light having a main ray that intersects the rotation center axis AX2001 of the cylindrical mask M.

Further, the main light beam traveling from each of the illumination regions IR2001 to IR2006 in the normal direction of the pattern surface p2001 of the cylindrical mask M is also in the normal direction of each of the projection regions PA2001 to PA2006 on the substrate P along the outer peripheral surface p2002. The imaged light beam is deflected so that it is incident from. Therefore, the defocus of the projected image can be reduced, the occurrence of processing defects such as exposure defects is suppressed, and as a result, the occurrence of defective devices is suppressed.

Further, in each of the projection optical systems PL2001 to PL2006, the main ray of the imaging light beam is inclined with respect to the central surface pc between the outer peripheral surface of the cylindrical mask M and the prism mirror 2041 (reflection plane 2041a). Since it is configured, the conditions of interference (collision) with each other are alleviated in the spatial arrangement of the projection optical systems PL2001 to PL2006.

The reflection plane 2041b on the lower side of the prism mirror 2041 and the prism mirror 2076 so that the main ray of the imaging light beam passing through the intermediate image planes p2007 of the projection optical systems PL2001 to PL2006 is parallel to the central plane pc. The upper reflection plane 2076a is set at an angle of 45 ° with respect to the XY plane.

[Modified example of the 17th embodiment]
In the exposure apparatus provided with the multi-lens type projection optical system shown in FIGS. 34 to 36, an image of a cylindrical mask pattern was projected and exposed on the surface of the substrate P supported by the cylindrical surface. Either one of the M and the substrate P may be supported in a plane, or both may be supported in a plane. For example, as shown in FIG. 34, the substrate P is wound around a rotating drum 2030 and supported in a cylindrical surface shape, and the mask M is formed on a conventional parallel flat glass (quartz) and linearly moved in the X direction. An exposure method, conversely, a scanning exposure method in which the mask M is supported by a rotating drum 2020 as shown in FIG. 34, and the substrate P is supported by a flat flat stage or an air pad type holder and sent linearly in the X direction. It may be any of.

Further, regardless of whether the support form of the mask M or the substrate P is a cylindrical surface shape or a flat surface shape, the projection optical system and the illumination optical system according to each of the above embodiments can be applied, but they are parallel to the XY plane. On the side supported in a plane, the inclination angle of the reflection plane 2041a on the upper side of the prism mirror 2041 and the reflection plane 2076b on the lower side of the prism mirror 2076 with respect to the XY plane may be set to 45 °. In other words, the object surface of the projection optical system is aligned with the normal line passing through the center of the illumination region IR (object surface) on the mask M and the normal line passing through the center of the projection area PA (image plane) on the substrate P. The main ray on the side and the main ray on the image plane side may be tilted in the XZ plane.

[18th Embodiment]
FIG. 37 is a diagram showing a configuration of a projection optical system PL (PL2001 in the case of a multi-lens system) according to the eighteenth embodiment. In the projection optical system PL (PL2001) of the present embodiment, the imaging light beam EL2 (main ray is EL6) from the mask pattern in the illumination region IR (IR2001) on the outer peripheral surface of the cylindrical mask M is a plane mirror. The reflection surface of the plane mirror 2101 is reflected by the reflection surface 2100a of the 2100, and is transmitted through a second optical system 2015 (half-field type reflection / refraction imaging system) having a concave mirror 2040 in which the reflection surface p2004 is arranged on the pupil surface. It is reflected by 2101a to form an intermediate image of the same size as the mask pattern appearing in the illumination region IR (IR2001) on the intermediate image plane Im.

Further, the intermediate image formed on the intermediate image plane Im is formed on the outer peripheral surface p2002 parallel to the XY plane by, for example, the magnifying imaging system 2102 (having an optical axis 2102a parallel to the Z axis) having a magnification of 2 times or more. It is projected onto the projection area PA (PA2001) on the substrate P supported along the line. The substrate P is supported via a fluid bearing layer on a flat holder HH provided with a pad for a fluid bearing having a flat surface. Also in the case of the present embodiment, a large number of point light source images Sf generated by the illumination light from the illumination optical system IL (IL2001) behind are formed on the reflection surface p2004 of the concave mirror 2040 constituting the projection optical system PL (PL2001). A window portion 2042 for transmission is formed.

When the magnifying projection optical system as shown in FIG. 37 is multilensed to expose a mask pattern having a large dimension in the Y direction, the projection optical system PL (PL1) including the illumination optical system IL (IL2001) and the plane mirrors 2100 and 2101 As shown in FIGS. 34 and 35 above, the pair of lenses is arranged symmetrically with respect to the central plane pc in the XZ plane, and the end portion (triangular portion) of the projection region PA (PA2001) in the Y direction with respect to the Y direction. ), The projected images are arranged so as to be partially overlapped with each other.

In the present embodiment, assuming that the central surface pc includes the rotation central axis AX2001 of the cylindrical mask M and is a surface perpendicular to the XY surface (outer peripheral surface p2002), the odd-numbered projection optical systems PL2001, PL2003 ... At each center point of the illumination regions IR2001, IR2003 ... (For example, the point through which the main ray EL6 passes), the main ray EL6 on the mask side is tilted with respect to the center surface pc, so that the outer peripheral surface and the center surface of the cylindrical mask M The circumference is separated by the distance DMx from the intersection with pc. Therefore, the center points of the illumination regions IR2002, IR2004 ... Of the even-numbered projection optical systems PL2002, PL2004 ... Are also distances in circumference from the line of intersection between the outer peripheral surface and the central surface pc of the cylindrical mask M. Only DMx will be separated. Therefore, the odd-numbered illumination region IR2001 ... and the even-numbered illumination region IR2002 ... are separated by a distance (2DMx) in the circumferential length direction on the cylindrical mask M.

On the other hand, the center points (points through which the main ray EL6 passes) of the projection regions PA2001, PA2003 ... Of the odd-numbered projection optical systems PL2001, PL2003 ... Are distanced DFx in the X direction from the center plane pc on the substrate P. The odd-numbered projection area PA2001 ... and the even-numbered projection area PA2002 ... Are separated by a distance (2DFx) in the X direction on the substrate P. Therefore, when the mask patterns for each of the illumination regions IR2001, IR2002 ... Formed on the cylindrical mask M are aligned in the circumferential direction, the magnification of the projection optical systems PL2001, PL2002 ... Is increased. It is necessary to set Mp so as to satisfy the relationship of Mp · (2DMx) = 2DFx. If it cannot be configured under such conditions due to mechanical reasons, the mask patterns for the odd-numbered illumination areas IR2001, IR2003 ... Formed on the cylindrical mask M and the even-numbered illumination areas IR2002 ... The mask pattern for IR2004 ... may be formed so as to be relatively shifted in the circumferential direction.

[19th Embodiment]
FIG. 38 is a diagram showing the configuration of the projection optical system PL of the 19th embodiment. The projection optical system PL of the present embodiment is composed of a lens system 2103, a lens system 2104, a concave mirror (reflection optical member) 2040 arranged on the pupil surface, a deflection mirror 2106, 2107, and a lens system 2108.

In the present embodiment, the imaging light beam EL2 from the illumination region IR on the outer peripheral surface of the cylindrical mask M is incident on the lens system 2103 via the half field on the −X side with respect to the optical axis 2103a of the lens system 2103. Then, it is incident on the lens system 2104 (its optical axis 2104a is coaxial with the optical axis 2103a). The imaging light beam EL2 that has passed through the lens system 2104 is reflected by the reflecting surface p2004 of the concave mirror 2040 (its optical axis is 2104a) and is reflected in the −X direction by the reflecting surface 2106a of the deflection mirror 2106. After being guided out of the optical path formed by the concave mirror 2040, it is reflected in the −Z direction by the reflecting surface 2107a of the deflection mirror 2107.

The imaged luminous flux EL2 reflected by the deflection mirror 2107 is irradiated to the projection region PA through the lens system 2108. Due to the above optical path, the projection optical system PL causes the image of the mask pattern appearing in the illumination region IR on the cylindrical mask M into the projection region PA on the substrate P which is plane-supported by the same configuration as in FIG. 37. Image image. The projection optical system of the present embodiment is designed so as not to form an intermediate image plane, particularly in order to realize magnified projection in a compact system. Further, the extension line D2001 of the main ray EL6 on the cylindrical mask M side of the projection optical system PL is set so as to intersect the rotation center axis AX2001 of the cylindrical mask M, and the main ray EL6 on the substrate P side is set. It is set perpendicular to the surface of the substrate P supported in a plane.

In FIG. 38, the imaged luminous flux EL2 from within the illumination region IR is designed to pass on the −X side of the optical axis 2108a (parallel to the Z axis and perpendicular to the substrate P) of the lens system 2108 that gives the main magnification. can do. Therefore, the portion of the lens system 2108 on the + X side of the optical axis 2108a that does not contribute to the projection of the mask pattern is cut off. As a result, the size of the projection optical system PL in the X direction (scanning direction of the substrate P) can be reduced.

In this modified example as well, the illumination optical system IL and the light source device 2055 are arranged on the back side of the concave mirror 2040, and the reflecting surface of the concave mirror 2040 is the same as in FIGS. 21, 23, 31, 32A, 32B, and 37. A large number of point light source images Sf are generated in the window portion (2042) formed on p2004 (arranged on the pupil surface). The distribution of the point light source image on the reflection surface p2004 and the shape and arrangement of the window portion in the reflection surface p2004 are as shown in FIGS. 27 to 30 or 33A to 33C according to the conditions described in FIG. 22 above. Is set to.

In each of the above-described embodiments and modifications (FIGS. 12, 21, 34 to 38), the cylindrical mask M has a reflective portion and a non-reflective portion on the surface of a cylindrical base material such as metal, ceramics, and glass. It is assumed that the pattern by the reflective part is directly formed, but a sheet-like reflective type in which a pattern is formed by a reflective film on one surface of a strip-shaped ultrathin glass plate (for example, 100 to 500 μm in thickness) having good flatness. A mask may be used, and the mask may be curved and wound along the outer peripheral surface of the metallic rotating drum 2020.

Such a sheet-like reflective mask may be permanently attached to the outer peripheral surface of the rotating drum 2020, or may be releasably (replaceable) fixed. The reflective film of the sheet-shaped reflective mask includes a film made of a material having a high reflectance with respect to the illumination luminous flux EL1 such as aluminum, a dielectric multilayer film, and the like. In that case, the rotating drum 2020 may be provided with a light-shielding layer (film) that absorbs the illumination luminous flux EL1 that has passed through the transparent portion of the sheet-shaped reflective mask, and the light-shielding layer also suppresses the generation of stray light.

Further, the cylindrical mask M may have only a pattern corresponding to one device (one display panel) formed over the entire circumference, or may correspond to one device (one display panel). A plurality of patterns to be formed may be formed. Further, the device patterns on the cylindrical mask M may be repeatedly arranged in the circumferential direction of the outer peripheral surface, or may be arranged in a plurality of directions parallel to the rotation center axis AX2001. Further, the cylindrical mask M may be provided with a pattern for manufacturing the first device and a pattern for manufacturing a second device different from the first device.

[Device manufacturing method]
Next, a device manufacturing method will be described. FIG. 39 is a flowchart showing the device manufacturing method of the present embodiment.

In the device manufacturing method shown in FIG. 39, first, the function and performance of a device such as a display panel using a self-luminous element such as an organic EL are designed, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step 201). .. Next, a mask M (cylindrical or planar) for the required layers is manufactured based on the device design such as a pattern for each layer designed by CAD or the like (step 202). In addition, a transparent film or sheet that is the base material of the device, a substrate such as an ultra-thin metal foil, or a flexible substrate (resin film, metal foil film, plastic, etc.) that is the base material of the display panel is wound. The roll is prepared by purchase, manufacturing, or the like (step 203).

The roll-shaped substrate prepared in step 203 includes a surface modified as necessary, a base layer (for example, microconcavities and convexities formed by an imprint method) preformed, and a light-sensitive substrate. A functional film or a transparent film (insulating material) may be laminated in advance.

Next, the prepared substrate is put into a roll-type or patch-type production line, and the substrate is composed of electrodes, wirings, insulating films, TFTs such as semiconductor films (thin film semiconductors), etc. that constitute devices such as display panel devices. In addition to forming the backplane layer to be formed, a light emitting layer made of a self-luminous element such as an organic EL serving as a display pixel portion is formed so as to be laminated on the backplane layer (step 204). Step 204 typically includes a step of forming a resist pattern on the film on the substrate and a step of etching the film with the resist pattern as a mask. The resist pattern is formed by a step of uniformly forming a resist film on the surface of the substrate, a step of exposing the resist film of the substrate with a patterned exposure light via a mask M according to each of the above embodiments. A step of developing a resist film on which a latent image of a mask pattern is formed by exposure is carried out.

In the case of manufacturing a flexible device using printing technology or the like, a step of forming a functional photosensitive layer (photosensitive silane coupling material, etc.) on the surface of a substrate by a coating method, via a mask M according to each of the above embodiments. An exposure process in which the functional photosensitive layer is irradiated with the patterned exposure light to form a pattern by forming a hydrophilic portion and a water-repellent portion on the functional photosensitive layer according to the pattern shape. A step of applying a plating base solution or the like to a highly hydrophilic portion of the layer and precipitating and forming a metallic pattern by electroless plating is carried out.

Further, this step 204 also includes a conventional photolithography step of exposing the photoresist layer using the exposure apparatus described in each of the above embodiments, but the photosensitive catalyst layer is pattern-exposed and electroless. It also includes a wet step of forming a metal film pattern (wiring, electrodes, etc.) by a plating method, a printing step of drawing a pattern with a conductive ink containing silver nanoparticles, and the like.

Then, depending on the device to be manufactured, for example, for each display panel device continuously manufactured on a long substrate by a roll method, the substrate is diced or cut, or another substrate manufactured in a separate process is used. For example, a step of attaching a protective film (environmental barrier layer), a sheet-shaped color filter having a sealing function, a thin glass substrate, or the like to the surface of each display panel device is carried out, and the device is assembled (step 205). ). Next, post-processing (step) such as inspection is performed on the device, such as whether the display panel device functions normally or satisfies the desired performance and characteristics (step 206). As described above, a device such as a display panel (flexible display) can be manufactured.

The technical scope of the present invention is not limited to the above-described embodiment or modification. For example, one or more of the components described in the above embodiments or modifications may be omitted. In addition, the components described in the above-described embodiment or modification can be combined as appropriate.

1001 ... Device manufacturing system, 1009 ... Conveyor device, 1011 ... Substrate processing device, 1021 ... First drum member, 1022 ... Second drum member, 1050 ... First deflection member, 1057 ... 2nd deflection member, 1078 ... Stage, 1120 ... 3rd deflection member, 1121 ... 4th deflection member, 1132 ... 7th deflection member, 1133 ... 8th deflection member , 1136 ... 9th deflection member, 1137 ... 10th deflection member, 1140 ... 11th deflection member, 1143 ... 12th deflection member, 1151 ... 13th deflection member, 1152 ... 14th deflection member, AX1001 ... 1st central axis, AX1002 ... 2nd central axis, D1001 ... 1st radial direction, D1002 ... 2nd radial direction, D1003 ... 1st normal direction , D1004 ... 2nd normal direction, DFx ... distance, DMx ... circumference length, IR ... illumination area, M ... mask, P ... substrate, PA ... projection area, PL ... Projection optical system, PL1001 to PL1006 ... Projection module, p1001 ... First plane, p1002 ... Second plane, p1003 ... Central plane, p1007 ... Intermediate image plane, 2001 ...・ ・ Device manufacturing system, 2005 ・ ・ ・ Upper control device, 2013 ・ ・ ・ Control device, 2014 ・ ・ ・ 1st optical system, 2015 ・ ・ ・ 2nd optical system, 2020 ・ ・ ・ Rotating drum, 2030 ・ ・ ・Rotating drum, 2040 ... concave mirror, 2094 ... rod lens, U3 ... processing device (board processing device, exposure device).

Claims (12)

A pattern forming method in which a flexible sheet substrate is continuously fed in a long direction and a pattern for a device is formed on the sheet substrate.
A transmissive or reflective mask pattern corresponding to the pattern of the device rotates a cylindrical mask formed along a cylindrical surface having a certain radius from the first center line around the first center line, and the above-mentioned While supporting a part of the sheet substrate by bending it into a cylindrical surface shape by a cylindrical drum having a cylindrical outer peripheral surface having a constant radius from the second center line set substantially parallel to the first center line, the said Rotating the cylindrical drum around the second centerline to synchronize the velocity of the mask pattern along the cylindrical surface with the velocity of the sheet substrate along the outer peripheral surface.
When viewed from the direction in which the first center line or the second center line extends, the mask pattern is arranged symmetrically with respect to the center surface including the first center line and the second center line, and the mask pattern is used as an object. When the surface of the sheet substrate is used as the image plane, the extension line of the main ray passing through the object surface among the main rays of the imaging light beam directed from the object surface to the image plane is directed toward the first center line. The extension line of the main ray passing through the image plane is obtained by scanning and exposing the projected image of the mask pattern to the sheet substrate by a set of projection optical systems arranged so as to face the second center line.
Pattern forming method including. The pattern forming method according to claim 1.
The illumination light applied to the cylindrical mask for exposure of the mask pattern to the sheet substrate is the same with respect to the circumferential direction of the cylindrical mask on the cylindrical surface when viewed from the direction in which the first center line extends. A set of illumination areas set at each of the symmetrical positions across the central plane is illuminated.
When viewed from the direction in which the second center line extends, the set of projection optical systems supports the imaging light flux generated from each of the set of illumination regions in a cylindrical surface shape by the cylindrical drum. Projects onto a set of projection regions set at each of the symmetrical positions on the sheet substrate across the central plane.
Pattern formation method. The pattern forming method according to claim 2.
In each of the set of projection optical systems, among the main rays of the imaged luminous flux, the first main ray that passes through the center of the illumination region and travels in the normal direction of the illumination region is directed from the central surface to the cylinder. A first deflection member that incidents and deflects the imaged light beam from the illumination region so as to have a predetermined tilt angle of less than 90 ° in the circumferential direction of the mask.
Of the main rays of the imaged luminous flux, a second main ray that passes through the center of the projected region and travels in the normal direction of the projected region has a predetermined inclination of less than 90 ° from the central surface in the circumferential direction of the cylindrical drum. A second deflection member that deflects the imaging light beam toward the projection region so as to form an angle is provided.
Pattern formation method. The pattern forming method according to claim 3.
Each of the set of projection optical systems
A first optical system having a first optical axis perpendicular to the central surface and incident with the imaged luminous flux deflected by the first deflection member to form an intermediate image of the pattern.
By having a second optical axis perpendicular to the central surface, incident the imaging light flux that has become the intermediate image, and projecting the image beam toward the second deflection member, the intermediate image is projected into the projection region. With a second optical system that reimages
When viewed from the direction in which the first center line or the second center line extends, the first optical axis and the first main ray are set at an obtuse angle of 90 ° or more, and the second optical axis and the second optical axis are set. The second main ray is set at an obtuse angle of 90 ° or more.
Pattern formation method. The pattern forming method according to claim 4.
Each of the set of projection optical systems forms a part of the mask pattern appearing in the illumination region in the projection region at the same magnification.
The obtuse angle of 90 ° or more between the first optical axis and the first main ray and the obtuse angle of 90 ° or more between the second optical axis and the second main ray were set equally.
Pattern formation method. The pattern forming method according to any one of claims 3 to 5.
The cylindrical mask is a reflective mask.
Linearly polarized illumination is provided by a polarized beam splitter and a 1/4 wavelength plate arranged between the first deflecting member of each of the set of projection optical systems and the illumination region on the cylindrical surface of the cylindrical mask. The projected optical system converts the light into circularly polarized illumination light and irradiates it toward the illumination region, and converts the circularly polarized imaging light beam reflected in the illumination region into linearly polarized imaging light beam. To be incident on
Pattern formation method. The pattern forming method according to any one of claims 1 to 6.
The radius of the outer peripheral surface of the cylindrical drum and the radius of the pattern surface of the cylindrical mask were set to be the same.
Pattern formation method. The pattern forming method according to any one of claims 1 to 6.
The radius of the surface of the sheet substrate supported in a cylindrical shape on the outer peripheral surface of the cylindrical drum and the radius of the pattern surface of the cylindrical mask were set to be the same.
Pattern formation method. The pattern forming method according to any one of claims 3 to 5.
The cylindrical mask is a reflective mask.
Each of the set of illumination systems provided corresponding to each of the set of projection optical systems illuminates each of the set of illumination regions with illumination light, and in each optical path of the projection optical system. The light separation member arranged separates the illumination light applied to each of the illumination regions and the imaging light beam from each of the illumination regions.
Pattern formation method. The pattern forming method according to claim 9.
The light separation member is arranged at the position of each pupil of the set of projection optical systems, and has a reflection portion and a transmission portion in different regions in the plane of the pupil, and the illumination light is the illumination light. The illumination region is irradiated through the transmission portion of the light separation member, and the imaging light beam from the illumination region is reflected by the reflection portion toward the projection region.
Pattern formation method. The pattern forming method according to any one of claims 3 to 5.
Each of the set of projection optical systems
A first optical system having a first optical axis perpendicular to the central surface and incident with the imaged luminous flux deflected by the first deflection member to form an intermediate image of the pattern.
By having a second optical axis perpendicular to the central surface, incident the imaging light flux that has become the intermediate image, and projecting the image beam toward the second deflection member, the intermediate image is projected into the projection region. With a second optical system that reimages
When viewed from the direction in which the first center line or the second center line extends, the first optical axis and the first main ray are set at an obtuse angle of 90 ° or more, and the second optical axis and the second optical axis are set. The second main ray is set at an obtuse angle of 90 ° or more.
Pattern formation method. The pattern forming method according to claim 11.
The obtuse angle of 90 ° or more between the first optical axis and the first main ray and the obtuse angle of 90 ° or more between the second optical axis and the second main ray were set equally.
Pattern formation method.

Images