TW201921162A - Substrate Processing Device, Device Manufacturing System And Device Manufacturing Method - Google Patents

Abstract

A substrate processing device (1011) is provided with: a first support component (1021) that supports one member object of a set consisting of a first object (M) and a second object (P), said member object being supported such that, in one member area of a set consisting of an illumination area (IR) and a projection area (PA), said member object aligns with a first surface (p1001) that curves with a specified curvature and in the form of a cylindrical surface; and a second support component (1022) that supports the other member object of the set consisting of the first object and the second object, said member object being supported such that, in the other member area of the set consisting of the illumination area and the projection area, said member object aligns with a specified second surface (p1002). A projection optical system (PL) is provided with a deflecting component for propagating an image-forming light beam such that within a principal ray of the image-forming light beam, which extends from the illumination area to the projection area, the principal ray between the first surface and the projection optical system is oriented in a radial direction not perpendicular to the second surface, said direction being a first-surface radial direction.

Description

   Element manufacturing method   

The present invention relates to a substrate processing apparatus, a component manufacturing system, and a component manufacturing method.

This application claims priority based on Japanese Patent Application No. 2011-278290 filed on December 20, 2011 and Japanese Patent Application No. 2012-024058 filed on February 7, 2012, the contents of which are incorporated herein by reference.

A substrate processing apparatus such as an exposure apparatus is described in Patent Document 1 described below, and is used for manufacturing various elements. The substrate processing apparatus can project an image of a pattern formed on the mask M disposed in the illumination area onto a substrate disposed in the projection area or the like. The mask M used for the substrate processing apparatus includes a planar shape and a cylindrical shape.

In addition, as one of the methods of manufacturing an element, for example, a roll-to-roll method described in Patent Document 2 described below is known. The roll-to-roll method is a method in which various substrates are processed on a transport path while a substrate such as a film is transported from a roll for delivery to a roll for recycling. The substrate may be processed in a substantially flat state, for example, between transfer rollers. In addition, the substrate may be processed in a curved state, for example, on a roller surface.

Advance technical literature

[Patent Document 1] Japanese Patent Laid-Open No. 2007-299918

[Patent Document 2] International Publication No. 2008/129819

As in the above substrate processing apparatus (exposure device), for example, in the case where one or both of the illumination area on the reticle and the projection area on the substrate are bent with a predetermined curvature, if the imaging performance of the projection optical system used for exposure is considered, In particular, there are restrictions on the setting of the main ray of the imaging beam. For example, it is assumed that a mask pattern formed on the outer cylindrical surface of a cylindrical rotating mask with a radius R is projected by a projection optical system onto a substrate ( Film, sheet, net, etc.). In this case, in general, as long as the main rays of the imaging beam from the mask pattern (cylindrical surface) to the substrate surface (cylindrical surface) are set, the rotation center axis and the circle of the cylindrical rotating mask are formed. The projection optical system of the optical path in which the rotation center axis of the drum rotation reel is linearly connected may be sufficient.

However, when the size of the mask pattern is large in the direction of the rotation axis of the cylindrical rotating mask, it is sometimes necessary to provide a plurality of such projection optical systems in the direction of the rotation axis. In such a multitude, even if a plurality of projection optics are closely aligned in the direction of the rotation axis, the projection fields of view (projection areas) of each projection optics will necessarily separate the thickness of metal objects such as the lens barrel, The large mask pattern cannot be faithfully exposed.

When the substrate processing apparatus described above is complicated, for example, the device cost may increase and the device size may increase. As a result, it is possible to increase the manufacturing cost of the device.

For example, when precise patterning must be applied, as a substrate processing device, a photomask that is illuminated with a pattern of an electronic element or a display element is used, and the light from the pattern of the photomask is projected and exposed on a photosensitive layer (light Resistance, etc.) on the substrate. In the case where the pattern of the photomask is repeatedly exposed to a flexible long substrate (film, sheet, net, etc.) that is continuously conveyed by a roll-to-roll method, if the transport direction of the long substrate is also used as the scanning direction, A scanning exposure device in which a cylindrical rotating photomask is used as a photomask can expect a dramatic improvement in productivity.

This rotating photomask has a transmission method in which a pattern is formed on the outer peripheral surface of a transparent cylinder such as glass by a light-shielding layer, and a reflective portion and an absorbing portion are formed on the outer peripheral surface of a metallic cylindrical body (also a cylinder). Pattern of reflection. A transmissive cylindrical reticle must be equipped with an illumination optical system (optical members such as mirrors and lenses) for illuminating the illuminating light with a pattern facing the outer peripheral surface inside the cylindrical reticle. It is difficult to pass the rotation axis through the cylindrical light. The inner center of the mask may be complicated by the holding structure of the cylindrical mask or the structure of the rotary drive system.

On the other hand, in the case of a reflective cylindrical photomask, a metal cylindrical body (or cylinder) can be used. Therefore, although a photomask can be inexpensively manufactured, it is necessary to provide irradiation in the outer space of the cylindrical photomask. The illuminating optical system of the illuminating light for exposure and the projection optical system for projecting the reflected light from the pattern formed on the outer surface onto the substrate are subject to change in the configuration of the exposure device side in order to satisfy the required resolution, transfer fidelity, etc. Get complicated situations.

An aspect of the present invention is to provide a substrate processing apparatus equipped with a large light even if one or both of a photomask or a substrate (a flexible substrate such as a film, a sheet, or a net) are arranged in a cylindrical shape. The mask pattern faithfully exposes the projection optical system used. Another object is to provide a device manufacturing system and a device manufacturing method capable of faithfully exposing a large mask pattern.

Another object is to provide a substrate processing apparatus capable of simplifying the configuration of the apparatus. Another object is to provide a component manufacturing system and a component manufacturing method capable of reducing manufacturing costs.

According to one aspect of the present invention, there is provided a substrate processing apparatus including: a projection optical system for projecting a light beam from an illumination area on a first object (photomask) onto a projection area on a second object (substrate); (1) a supporting member for supporting one of the first object and the second object along one of the first and second surfaces curved in a cylindrical shape with a predetermined curvature in one of the illumination area and the projection area; and the second supporting member, The other of the first object and the second object is supported along the predetermined second surface in the other one of the illumination area and the projection area; the projection optical system includes a deflection member that extends from the illumination area to The imaging beam is propagated in such a way that the principal rays between the first surface of the imaging beam of the projection area and the principal ray between the projection optical system are directed in a direction that is not perpendicular to the second surface in the radial direction of the first surface.

According to another aspect of the present invention, a component manufacturing system is provided, including the substrate processing apparatus of the above aspect.

According to another aspect of the present invention, a component manufacturing method is provided, including: exposing a second object by the substrate processing apparatus of the above aspect; and forming a pattern of the first object by processing the second object after exposure.

According to another aspect of the present invention, a substrate processing apparatus is provided, which projects and exposes an image of a reflective mask pattern onto a sensing substrate, and includes: a mask holding member to hold the mask pattern; and a projection optical system, which will be set from A reflected light beam generated in a part of the illumination region on the mask pattern is projected onto the sensing substrate, thereby imaging an image of a part of the mask pattern on the sensing substrate; an optical member includes: disposed on the projection optics for oblique illumination of the illumination region In the optical path of the system, the part that passes one of the illumination light to the illumination area and the reflected light beam generated from the illumination area and the part that reflects the other; and the illumination optical system, which generates a light source image that is the source of the illumination light. A part of the light path and the optical member of the projection optical system makes the illumination light from the light source image go to the illumination area, and a conjugate surface optically conjugated with the light source image is formed at or near the reflective portion or the passing portion of the optical member.

According to another aspect of the present invention, a substrate processing apparatus is provided, which projects and exposes an image of a reflective mask pattern onto a sensing substrate, and includes: a mask holding member to hold the mask pattern; and a projection optical system, which will be set from A reflected light beam generated in a part of the illumination region on the mask pattern is projected onto the sensing substrate, thereby imaging an image of a part of the mask pattern on the sensing substrate; an optical member includes: disposed on the projection optics for oblique illumination of the illumination region In the optical path of the system, the part that passes one of the illumination light to the illumination area and the reflected beam generated from the illumination area and the part that reflects the other; and the illumination optical system, which is a plurality of light source images that will be the source of the illumination light It is formed regularly or randomly at the position of or near the reflective portion or the passing portion of the optical member.

According to another aspect of the present invention, a component manufacturing system is provided, including the substrate processing apparatus of the above aspect.

According to another aspect of the present invention, a component manufacturing method is provided, including: exposing an object by the substrate processing apparatus of the above aspect; and developing the exposed object.

According to another aspect of the present invention, a component manufacturing method is provided, which continuously transfers a flexible sheet substrate in a long side direction and simultaneously forms a pattern for the component on the sheet substrate, which includes: The cylindrical mask with a certain radius from the center line is formed with a cylindrical mask with a transmissive or reflective mask pattern corresponding to the pattern of the element to rotate around the first center line; The second center line is a cylindrical body with a cylindrical outer peripheral surface of a certain radius, which bends and supports a part of the sheet substrate, and at the same time moves the sheet substrate in a long direction; a mask pattern is formed by a set of projection optical systems The projection image is exposed on a sheet substrate. The set of projection optical systems is configured to be approximately symmetrical with respect to the center plane including the first center line and the second center line, and a mask pattern with a cylindrical mask is used as the object surface. When the surface of the sheet-shaped substrate supported by the cylindrical body is used as the image plane, the extension line of the main ray of the imaging beam from the object plane to the image plane passes through the object plane toward the first center line, and the main plane passing through the image plane The extension of the light is directed to the second Center line.

According to the aspect of the present invention, even if one or both of the mask and the substrate are cylindrical surfaces, a large mask pattern can be faithfully exposed by a substrate processing device (exposure device) having a small projection optical system. . Furthermore, according to aspects of the present invention, a device manufacturing system and a device manufacturing method capable of faithfully exposing a large mask pattern can be provided.

Also, according to the aspect of the present invention, a substrate processing apparatus capable of simplifying the configuration of the apparatus can be provided. In addition, according to aspects of the present invention, a component manufacturing system and a component manufacturing method capable of reducing manufacturing costs can be provided.

1001‧‧‧component manufacturing system

1009‧‧‧Transportation device

1011‧‧‧Substrate processing device

1021‧‧‧The first reel member

1022‧‧‧Second reel member

1050‧‧‧The first deflection member

1057‧‧‧The second deflection member

1078‧‧‧Mask stage

1120‧‧‧3rd deflection member

1121‧‧‧4th deflection member

1132‧‧‧7th deflection member

1133‧‧‧8th deflection member

1136‧‧‧9th deflection member

1137‧‧‧10th deflection member

1140‧‧‧11th biasing member

1143‧‧‧12th deflection member

1151‧‧‧13th deflection member

1152‧‧‧14th deflection member

AX1001‧‧‧1st central axis

AX1002‧‧‧ 2nd central axis

D1001‧‧‧First diameter direction

D1002‧‧‧The second diameter direction

D1003‧‧‧1st normal direction

D1004‧‧‧ 2nd normal direction

DFx‧‧‧Distance

DMx‧‧‧ circumference

IR‧‧‧ Illumination area

M‧‧‧Photomask

P‧‧‧ substrate

PA‧‧‧ Projection area

PL‧‧‧ Projection Optics

PL1001 ~ PL1006‧‧‧‧Projection Module

p1001‧‧‧side 1

p1002‧‧‧side 2

p1003‧‧‧center plane

p1007‧‧‧ middle image plane

2001‧‧‧component manufacturing system

2005‧‧‧ Higher-level control device

2013‧‧‧Control device

2014‧‧‧The first optical department

2015‧‧‧The Second Department of Optics

2020‧‧‧Rotating reel

2030‧‧‧Rotating reel

2040‧‧‧Concave mirror

2094‧‧‧ rod lens

U3‧‧‧Processing device (substrate processing device, exposure device)

FIG. 1 is a diagram showing the structure of a component manufacturing system according to the first embodiment.

FIG. 2 is a diagram showing the overall configuration of a substrate processing apparatus (exposure apparatus) according to the first embodiment.

FIG. 3 is a view showing a configuration of a mask holding device of the exposure device shown in FIG. 2. FIG.

FIG. 4 is a diagram showing the configuration of a first reel member and an illumination optical system of the exposure apparatus shown in FIG. 2.

FIG. 5 is a diagram showing the arrangement of the illumination area and the projection area of the exposure apparatus shown in FIG. 2.

FIG. 6 is a diagram showing a configuration of a projection optical system applied to the exposure apparatus shown in FIG. 2.

Fig. 7 is a diagram showing the overall configuration of an exposure apparatus according to a second embodiment.

Fig. 8 is a diagram showing the overall configuration of an exposure apparatus according to a third embodiment.

FIG. 9 is a diagram illustrating a positional relationship condition of a projection area of an illumination area of the exposure apparatus shown in FIG. 8.

FIG. 10 is a graph showing changes in the conditions explained with FIG. 9 as a function of the radius of the cylindrical mask.

Fig. 11 is a diagram showing the overall configuration of an exposure apparatus according to a fourth embodiment.

FIG. 12 is a diagram showing the configuration of the oblique illumination method of the exposure apparatus according to the fifth embodiment.

FIG. 13 is a diagram showing a configuration of a projection optical system according to a sixth embodiment.

FIG. 14 is a diagram showing the structure of a case where the projection optical system shown in FIG. 13 is pluralized.

FIG. 15 is a diagram showing the pluralized projection optical system shown in FIG. 14 viewed from another direction.

Fig. 16 is a diagram showing a configuration of a projection optical system according to a seventh embodiment.

Fig. 17 is a diagram showing a configuration of a projection optical system according to an eighth embodiment.

FIG. 18 is a diagram showing a configuration of a projection optical system according to a ninth embodiment.

FIG. 19 is a diagram showing a configuration of a projection optical system according to a tenth embodiment.

Fig. 20 is a diagram showing the structure of a component manufacturing system according to the eleventh embodiment.

Fig. 21 is a diagram showing a configuration of a substrate processing apparatus (exposure apparatus) according to an eleventh embodiment.

Fig. 22 is a diagram showing the structure of an optical member according to the eleventh embodiment.

FIG. 23 is a schematic diagram showing a light path from an illumination area to a projection area.

Fig. 24 is a diagram showing a configuration example of a light source device according to the eleventh embodiment.

Fig. 25 is a diagram showing a configuration example of a fly-eye lens array according to the eleventh embodiment.

Fig. 26 is a diagram showing a configuration example of a diaphragm in the illumination optical system of the eleventh embodiment.

Fig. 27 is a diagram showing a configuration example of an optical member according to the eleventh embodiment.

Fig. 28 is a diagram showing a configuration example of a fly-eye lens array according to a twelfth embodiment.

Fig. 29 is a diagram showing a configuration example of a fly-eye lens array according to a thirteenth embodiment.

Fig. 30 is a diagram showing a configuration example of a fly-eye lens array according to a fourteenth embodiment.

FIG. 31 is a diagram showing a configuration example of a light source image forming section of the fifteenth embodiment.

Fig. 32A is a diagram showing a configuration example of an illumination optical system according to a sixteenth embodiment.

32B is a diagram showing a configuration example of an illumination optical system according to a sixteenth embodiment.

Fig. 33A is a diagram showing each part of the illumination optical system of the sixteenth embodiment.

Fig. 33B is a diagram showing each part of the illumination optical system of the sixteenth embodiment.

Fig. 33C is a diagram showing each part of the illumination optical system of the sixteenth embodiment.

Fig. 34 is a diagram showing a configuration of a substrate processing apparatus (exposure apparatus) according to a seventeenth embodiment.

Fig. 35 is a diagram showing the arrangement of an illumination area and a projection area in the seventeenth embodiment.

Fig. 36 is a diagram showing a configuration example of an exposure apparatus according to a seventeenth embodiment.

Fig. 37 is a diagram showing a configuration example of a projection optical system according to an eighteenth embodiment.

Fig. 38 is a diagram showing a configuration example of a projection optical system according to a nineteenth embodiment.

Fig. 39 is a flowchart showing a method for manufacturing a device according to this embodiment.

    [First Embodiment]    

FIG. 1 is a diagram showing the configuration of a component manufacturing system 1001 according to this embodiment. The component manufacturing system 1001 shown in FIG. 1 includes a substrate supply device 1002 for supplying a substrate P, a processing device 1003 that performs a predetermined process on the substrate P supplied by the substrate supply device 1002, and the recycling has been performed by the processing device 1003 The substrate recovery device 1004 of the substrate P and the upper control device 1005 of each part of the control element manufacturing system 1001.

In this embodiment, the substrate P is a (piece) substrate having flexibility, such as a so-called flexible substrate. The component manufacturing system 1001 of this embodiment can manufacture a flexible component from a flexible substrate P. The substrate P is selected, for example, to have a degree of flexibility that does not break when the element manufacturing system 1001 is bent.

In addition, the flexibility of the substrate P at the time of element manufacturing can be adjusted, for example, according to the material, size, and thickness of the substrate P, and can be adjusted according to environmental conditions such as humidity and temperature at the time of element manufacturing. The substrate P may be a substrate having no flexibility such as a so-called rigid substrate. The substrate P may be a composite substrate in which a flexible substrate and a rigid substrate are combined.

As the flexible substrate P, a foil made of a metal or an alloy such as a resin film and stainless steel can be used. The material of the resin film includes, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, and polycarbonate resin. One or more of polystyrene resin and polyvinyl alcohol resin.

The characteristics of the substrate P, such as the coefficient of thermal expansion, are set so that the amount of deformation caused by the heat applied to the various processing steps applied to the substrate P can be substantially ignored. For the substrate P, for example, a non-significantly large thermal expansion coefficient can be selected. The thermal expansion coefficient can be set to be smaller than a threshold value corresponding to a process temperature and the like by mixing an inorganic filler with a resin film, for example. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide. In addition, the substrate P may be an ultra-thin glass monomer having a thickness of about 100 μm produced by a float method or the like, or a laminated body in which the above-mentioned resin film and aluminum foil are bonded to the ultra-thin glass.

In the present embodiment, the substrate P is a substrate for so-called multi-face pickup. The component manufacturing system 1001 of this embodiment executes various processes for manufacturing one component repeatedly on the substrate P. The substrate P subjected to various processes is diced into individual elements, and becomes a plurality of elements. The size of the substrate P is, for example, about 1 m to 2 m in the width direction (short-side direction), and the length in the longitudinal direction (long-side direction) is, for example, 10 m or more.

In addition, the size of the substrate P can be appropriately set depending on the size of the manufactured element and the like. For example, the size of the substrate P may be 1 m or less or 2 m or more in the width direction, and 10 m or less in the length direction. In addition, when the substrate P is a substrate for so-called multi-face pickup, it may be a strip-shaped substrate or a substrate formed by connecting a plurality of substrates. In addition, the component manufacturing system 1001 can also manufacture components by using a separate substrate for each component. In this case, the substrate P may be a substrate corresponding to the size of one element.

The substrate supply device 1002 of this embodiment supplies the substrate P to the processing device 1003 by sending out the substrate P wound on the supply reel 1006. The substrate supply device 1002 includes, for example, a shaft portion around which the substrate P is wound, a rotation driving portion that rotates the shaft portion, and the like. In this embodiment, the substrate P is transported in the longitudinal direction, and is sent to the processing device 1003. That is, in this embodiment, the conveyance direction of the substrate P is substantially the same as the longitudinal direction of the substrate P.

In addition, the substrate supply device 1002 may include a cover portion or the like that covers the substrate P wound on the supply reel 1006. In addition, the substrate supply device 1002 may include, for example, a mechanism such as a clamp-type driving roller that sequentially sends out the substrate P in the longitudinal direction.

The substrate recovery device 1004 of the present embodiment recovers the substrate P by winding the substrate P passing through the processing device 1003 on a recovery roll 1007. The substrate recovery device 1004 includes, for example, the same as the substrate supply device 1002, and includes a shaft portion for winding the substrate P, a rotation driving portion that rotates the shaft portion, and a cover portion that covers the substrate P wound on the recovery roll 1007.

In addition, the processed substrate P is cut by a cutting device, and the substrate recovery device 1004 may recover the cut substrate. In this case, the substrate recovery device 1004 may also be a device that recovers by stacking and cutting substrates. The cutting device described above may be a part of the processing device 1003, or may be a different device from the processing device 1003, for example, it may be a part of the substrate recovery device 1004.

The processing device 1003 transfers the substrate P supplied from the substrate supply device 1002 to the substrate recovery device 1004, and processes the processed surface of the substrate P during the transfer. The processing device 1003 includes a processing device 1010 for processing a processed surface of the substrate P, and a transfer device 1009 including a transfer roller 1008 that transfers the substrate P under conditions corresponding to the processing.

The processing apparatus 1010 includes one or two or more apparatuses for performing various processes on the processed surface of the substrate P to form the constituent elements. In the component manufacturing system 1001 of this embodiment, a device that executes various processes is appropriately provided along the conveyance path of the substrate P, and components such as flexible displays can be produced in a so-called roll-to-roll method. With the roll-to-roll method, components can be produced with good efficiency.

In this embodiment, various devices of the processing device 1010 include a film forming device, an exposure device, a coating and developing device, and an etching device. The film forming apparatus is, for example, a gold plating apparatus, a vapor deposition apparatus, or a sputtering apparatus. The film forming device is formed on the substrate P by a functional film such as a conductive film, a semiconductor film, and an insulating film. The coating and developing device is a photosensitive material such as a photoresist film formed on a substrate P on which a functional film is formed by a film forming device. The exposure device applies an exposure process to the substrate P by projecting an image of a pattern corresponding to the film pattern of the constituent element on the substrate P on which the photosensitive material is formed. The coating and developing device develops the exposed substrate P. The etching device uses the photosensitive material of the developed substrate P as a photomask M to etch a functional film. In this way, the processing device 1010 forms a functional film of a desired pattern on the substrate P.

In addition, the processing device 1010 may be provided with a device that directly forms a film pattern without etching, such as a film-forming device such as an imprint method and a droplet discharge device. At least one of various devices of the processing device 1010 may be omitted.

In this embodiment, the higher-level control device 1005 controls the substrate supply device 1002 and causes the substrate supply device 1002 to execute a process of supplying the substrate P to the processing device 1010. The higher-level control device 1005 controls the processing device 1010 so that the processing device 1010 executes various processes on the substrate P. The higher-level control device 1005 controls the substrate recovery device 1004 and causes the substrate recovery device 1004 to perform a process of recovering the substrate P to which the processing device 1010 has applied various processes.

Next, the configuration of the substrate processing apparatus according to this embodiment will be described with reference to FIGS. 2, 3, and 4. FIG. 2 is a diagram showing the overall configuration of the substrate processing apparatus 1011 according to this embodiment. The substrate processing apparatus 1011 shown in FIG. 2 is at least a part of the processing apparatus 1010 described above. In this embodiment, the substrate processing apparatus 1011 includes at least a part of an exposure apparatus EX and a transport apparatus 1009 that perform exposure processing.

The exposure device EX of this embodiment is a so-called scanning exposure device, which simultaneously drives the rotation of the cylindrical mask (cylindrical mask) M and the transfer of the flexible substrate P, and simultaneously forms the image of the pattern formed on the mask M A projection optical system PL (PL1001 to PL1006) having a transmission magnification of equal magnification (× 1) is projected onto the substrate P. In addition, in FIGS. 2 to 4, the Y axis of the orthogonal coordinate system XYZ is set to be parallel to the rotation center line (first center line) AX1001 of the cylindrical mask M, and the X axis is set to the direction of scanning exposure. And the transport direction of the substrate P at the exposure position.

As shown in FIG. 2, the exposure device EX includes a mask holding device 1012, an illumination device 1013, a projection optical system PL, and a control device 1014. The substrate processing apparatus 1011 rotates the mask M held by the mask holding apparatus 1012 and transfers the substrate P by the transfer apparatus 1009. The illuminating device 1013 illuminates a part of the reticle M held by the reticle holding device 1012 (illumination area IR) with a uniform brightness by the illuminating light beam EL1. The projection optical system PL projects an image of the pattern of the illumination area IR on the mask M onto a part of the substrate P (projection area PA) that is transported by the transport device 1009. As the mask M moves, the position on the mask M arranged in the illumination area IR also changes, and as the substrate P moves, the position arranged on the substrate P in the projection area PA also changes, thereby placing the mask M on An image of a predetermined pattern (mask pattern) is projected on the substrate P. The control device 1014 controls each section of the exposure device EX so that each section executes processing. In the present embodiment, the control device 1014 controls at least a part of the transport device 1009.

In addition, the control device 1014 may be a part or all of the upper control device 1005 of the component manufacturing system 1001. The control device 1014 may be controlled by a higher-level control device 1005, and may be a different device from the higher-level control device 1005. The control device 1014 includes, for example, a computer system. The computer system includes hardware such as a CPU, various memories, an OS, and peripheral devices. The operation process of each part of the substrate processing apparatus 1011 is performed by storing the program in a computer-readable recording medium in a program form, and reading and executing the program by a computer system, thereby performing various processes. When the computer system can be connected to the Internet or an Internet system, it also includes a web page providing environment (or display environment). The computer-readable recording medium includes portable media such as a floppy disk, an optical magnetic disk, a ROM, and a CD-ROM, and a memory device such as a hard disk built into the computer system. The computer can read the recording medium, including those who keep the program in a short period of time when the program is sent through a communication line such as the Internet or a telephone line, or the server client in this case. The volatile memory in the computer system keeps the program for a certain time. In addition, the program can also be used to realize a part of the function of the substrate processing apparatus 1011, or can be combined with a program recorded in a computer system to realize the function of the substrate processing apparatus 1011. The higher-level control device 1005 can be implemented by a computer system in the same manner as the control device 1014.

Next, each part of the exposure apparatus EX of FIG. 2 will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a diagram showing the configuration of the mask holding device 1012, and FIG. 4 is a diagram showing the configuration of the first reel member 1021 and the illumination optical system IL.

As shown in FIG. 3 (FIG. 2), the mask holding device 1012 includes a first member (hereinafter, referred to as a first roll member 1021) that holds the mask M, a guide roller 1023 that supports the first roll member 1021, and a drive. The driving roller 1024 of the first reel member 1021, the first detector 1025 that detects the position of the first reel member 1021, and the first driving unit 1026.

As shown in FIG. 4 (FIG. 2 or FIG. 3), the first reel member 1021 forms a first surface p1001 of the illumination area IR arrangement on the light distribution cover M. In the present embodiment, the first surface p1001 includes a surface (hereinafter referred to as a cylindrical surface) that rotates a line segment (general line) about an axis (first central axis AX1001) parallel to the line segment. The cylindrical surface is, for example, a cylindrical outer peripheral surface or a cylindrical outer peripheral surface. The first roll member 1021 is made of, for example, glass, quartz, or the like, and has a cylindrical shape with a certain thickness, and the outer peripheral surface (cylindrical surface) forms a first surface p1001. That is, in this embodiment, the illumination area IR on the mask M is bent from the rotation center line AX1001 into a cylindrical surface shape having a certain radius r1001 (see FIG. 1). The portion of the first reel member 1021 that overlaps the pattern of the reticle M as viewed from the radial direction of the first reel member 1021, for example, the center of the first reel member 1021 other than both ends in the Y-axis direction of the first reel member 1021 shown in FIG. Part of it is transparent to the illumination beam EL1001.

The photomask M is made, for example, as a transmissive planar sheet mask in which a light-shielding layer such as chromium is formed on one side of a short strip-shaped ultra-thin glass plate (for example, a thickness of 100 to 500 μm) with good flatness. The outer peripheral surface of the cylindrical member 1021 is curved, and is used while being wound (attached) to the outer peripheral surface. The photomask M has a patterned non-formed area where no pattern is formed, and is mounted on the first roll member 1021 in the patterned non-formed area. The photomask M can be detached (released) from the first reel member 1021.

In addition, instead of forming the mask M with an extremely thin glass plate and winding the mask M around the first roll member 1021 of the transparent cylindrical base material, the first roll of the transparent cylindrical base material may be replaced. The outer peripheral surface of the member 1021 is directly drawn to form a mask pattern formed by a light-shielding layer such as chromium, and is integrated. In this case, the first reel member 1021 also functions as a support member of the photomask (first object).

In addition, the first roll member 1021 may have a structure in which a thin plate-shaped mask M is bent and attached to the inner peripheral surface thereof. In addition, the mask M may be formed with a whole or a part of a panel pattern corresponding to one display element, or may be formed with a panel pattern corresponding to a plurality of display elements. Furthermore, in the photomask M, a plurality of panel patterns may be repeatedly arranged in a circumferential direction around the first center axis AX1001, or a plurality of small panel patterns may be repeatedly arranged in a direction parallel to the first center axis AX1001. The photomask M may include a panel pattern and a size of the second display element, which are different from the first display element, such as the pattern and size of the panel for the first display element. Furthermore, a plurality of separate thin-plate-shaped masks M may be provided on the outer peripheral surface (or inner peripheral surface) of the first roll member 1021 in a direction parallel to the first central axis AX1001 or in a peripheral direction.

The guide roller 1023 and the drive roller 1024 shown in FIG. 3 extend in the Y-axis direction parallel to the first central axis AX1001 of the first roll member 1021. The guide roller 1023 and the drive roller 1024 are provided so as to be rotatable about an axis parallel to the first central axis AX1001. The outer diameter of the guide roller 1023 and the drive roller 1024 is larger than that of the other end portions, and this end portion is externally connected to the first roll member 1021. As described above, the guide roller 1023 and the drive roller 1024 are provided so as not to contact the photomask M held by the first roll member 1021. The driving roller 1024 transmits the torque supplied from the first driving unit 1026 to the first reel member 1021, so that the first reel member 1021 rotates about the first central axis AX1001.

In addition, although the mask holding device 1012 includes a guide roller 1023 and a drive roller 1024, the number of the guide rollers 1023 may be two or more, and the number of the drive rollers 1024 may also be two or more. At least one of the guide roller 1023 and the drive roller 1024 may be disposed inside the first reel member 1021 and inwardly connected to the first reel member 1021. In addition, the portion of the first reel member 1021 viewed from the radial direction of the first reel member 1021 so as not to overlap the pattern of the mask M (both ends in the Y-axis direction) can transmit light to the illumination beam EL1001. It may not have translucency. One or both of the guide roller 1023 and the drive roller 1024 may be, for example, a truncated cone shape, and the central axis (rotation axis) thereof is non-parallel with respect to the first central axis AX1001.

The first detector 1025 optically detects the rotation position of the first reel member 1021. The first detector 1025 includes, for example, a rotary encoder. The first detector 1025 supplies information indicating the detected rotational position of the first reel member 1021 to the control device 1014. The first driving unit 1026 including an actuator such as an electric motor adjusts a torque for rotating the driving roller 1024 according to a control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the first reel member 1021 by controlling the first driving unit 1026 based on a detection result of the first detector 1025. In other words, the control device 1014 controls one or both of the rotation position and the rotation speed of the mask M held by the mask holding device 1012.

In addition, a sensor (hereinafter referred to as a Y-direction position measurement sensor) that optically measures the position of the first reel member 1021 in the Y-axis direction in FIG. 3 can also be added to the first detector 1025. Although the Y-direction position of the first reel member 1021 shown in FIG. 2 and FIG. 3 is basically limited to remain unchanged, in order to perform the relative positions of the exposed area or alignment mark on the substrate P and the pattern of the mask M For alignment, it is also conceivable to assemble a mechanism (actuator) that slightly moves the first reel member 1021 (mask M) in the Y direction. In this case, it is also possible to use the measurement information from the Y-direction position measurement sensor to control the Y-direction micro-movement mechanism of the first reel member 1021.

As shown in FIG. 2, the transfer device 1009 includes a first transfer roller 1030, a first guide member 1031, and a second support member (hereinafter referred to as a second roll) forming a second surface p1002 of the projection area PA on the arrangement substrate P. Member 1022), a second guide member 1033, a second conveyance roller 1034, a second detector 1035, and a second driving portion 1036. The transfer drum 1008 shown in FIG. 1 includes a first transfer drum 1030 and a second transfer drum 1034.

In this embodiment, the substrate P transferred from the upstream of the transfer path to the first transfer roller 1030 is transferred to the first guide member 1031 via the first transfer roller 1030. The substrate P passing through the first guide member 1031 is surface-supported by a cylindrical or cylindrical second roll member (cylindrical body) 1022 with a radius r1002, and is conveyed to the second guide member 1033. The substrate P that has passed through the second guide member 1033 is conveyed downstream of the conveyance path through the second conveyance roller 1034. In addition, each of the rotation centerlines (second centerline) AX1002 of the second reel member 1022 and the rotation centerlines of the first transfer drum 1030 and the second transfer drum 1034 is set to be parallel to the Y axis.

The first guide member 1031 and the second guide member 1033 are moved in a direction that intersects the width direction of the substrate P (moved in the XZ plane in FIG. 2), and the transfer path is adjusted to act on the substrate P. Tension etc. The first guide member 1031 (and the first conveyance roller 1030) and the second guide member 1033 (and the second conveyance roller 1034) can be configured to be movable in the width direction (Y direction) of the substrate P, for example. The Y-direction position of the substrate P wound around the outer periphery of the second reel member 1022 is adjusted. In addition, the transfer device 1009 only needs to be able to transfer the substrate P along the projection area PA of the projection optical system PL, and its configuration can be appropriately changed.

The second reel member 1022 forms a second surface p1002 that supports a part of the projection area PA on the substrate P including the projection light beam from the projection optical system PL in a circular arc shape. In the present embodiment, the second reel member 1022 is a part of the conveying device 1009, and also serves as a support member (substrate stage) that supports the substrate P to be exposed. That is, the second reel member 1022 may be a part of the exposure device EX.

The second reel member 1022 can rotate around its central axis (hereinafter referred to as the second central axis AX1002), and the substrate P is bent into a cylindrical surface along the outer peripheral surface (cylindrical surface) of the second transporting roller 1034, and is bent at One part configures the projection area PA.

In this embodiment, the radius r1001 of the portion where the mask M is wound on the outer peripheral surface of the first roll member 1021 and the radius r1002 of the portion where the substrate P is wound on the outer peripheral surface of the second roll member 1022 are set to be substantially the same. . This is because it is assumed that the thickness of the thin-plate-shaped mask M and the thickness of the substrate P are substantially equal.

On the other hand, for example, when a pattern is directly formed on the outer peripheral surface of the first roll member 1021 (transparent cylindrical base material) by a chromium layer, the thickness of the chromium layer can be ignored, so it is compared with the pattern surface of the photomask. The radius remains r1001. If the thickness of the substrate P is about 200 μm, the radius of the surface of the substrate P in the projection area PA is r1002 + 200 μm. In this case, the radius r1002 of the portion where the substrate P is wound on the outer peripheral surface of the second roll member 1022 can be reduced by the thickness of the substrate P.

From the above, in order to strictly set the conditions, each radius of the first roll member 1021 and the second roll member 1022 may be determined as the pattern surface of the photomask supported by the outer peripheral surface of the first roll member 1021. The cylindrical surface has a radius equal to the radius of the surface of the substrate P supported by the outer peripheral surface of the second roll member 1022.

In this embodiment, the second reel member 1022 is rotated by a torque supplied from a second drive unit 1036 including an actuator such as an electric motor. The second detector 1035 includes, for example, a rotary encoder. The second detector 1035 optically detects a rotation position of the second reel member 1022. The second detector 1035 supplies information indicating the detected rotational position of the second reel member 1022 to the control device 1014. The second driving unit 1026 adjusts a torque for rotating the second reel member 1022 based on a control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the second reel member 1022 by controlling the second driving unit 1036 based on the detection result of the second detector 1035, so that the first reel member 1021 and the second reel member 1022 move synchronously ( Synchronous rotation).

In addition, when the substrate P is a thin flexible film, wrinkles or distortion may occur when the substrate P is rolled around the second roll member 1022. Therefore, it is important to bring the substrate P into the contact position with the outer peripheral surface of the second roll member 1022 as straight as possible, and to make the tension in the conveying direction (X direction) of the substrate P as constant as possible. From this viewpoint, the control device 1014 controls the second driving unit 1036 so that the rotation speed unevenness of the second reel member 1022 is extremely small.

In addition, in this embodiment, if a plane including the first central axis AX1001 of the first reel member 1021 and the second central axis AX1002 of the second reel member 1022 is set as the center plane p1003 (parallel to the YZ plane), Then, near the position where the central plane p1003 intersects with the cylindrical first plane p1001, the central plane p1003 and the first plane p1001 will have an approximately orthogonal relationship. Similarly, the central plane p1003 and the cylindrical second plane p1001 will have an approximately orthogonal relationship. Near the position where the plane p1002 intersects, the center plane p1003 and the second plane p1002 have an approximately orthogonal relationship.

The exposure apparatus EX of this embodiment is assumed to be an exposure apparatus equipped with a so-called multi-lens projection optical system. The projection optical system PL includes a plurality of projection modules for projecting an image of a part of the pattern of the mask M. For example, in FIG. 2, there are three projection modules (projection optics) PL1001, PL1003, and PL1005 on the left side of the center plane p1003, and they are arranged at a certain interval in the Y direction. PL1002, PL1004, and PL1006 are arranged at regular intervals in the Y direction.

In this multi-lens-type exposure device EX, the Y-direction ends of the areas (projection areas PA1001 to PA1006) exposed by the plurality of projection modules PL1001 to PL1006 are superposed by scanning to project a desired pattern. The overall image. When such an exposure device EX needs to process a substrate P having a larger Y-direction width and a larger Y-direction width of the pattern on the reticle M, it is necessary to add a projection module and correspond to the Y-direction. Since the module on the side of the lighting device 1013 is sufficient, there is an advantage that it can be easily applied to the increase in the size of the panel (the width of the substrate P).

The exposure device EX may not be a multi-lens system. For example, when the dimension in the width direction of the substrate P is small to a certain extent, the exposure device EX may also project an image of the full width of the pattern on the substrate P through a projection module. In addition, a plurality of projection modules PL1001 ~ PL1006 can also project the patterns corresponding to one element respectively. That is, the exposure device EX can also project patterns for a plurality of elements in parallel by a plurality of projection modules.

The lighting device 1013 of this embodiment includes a light source device (not shown) and an illumination optical system IL. As shown in FIG. 4, the illumination optical system IL includes a plurality of (for example, six) illumination modules IL1001 to IL1006 corresponding to each of the plurality of projection modules PL1001 to PL1006 and arranged in the Y-axis direction. The light source device includes a lamp light source such as a mercury lamp, or a solid-state light source such as a laser diode or a light emitting diode (LED). The illumination light emitted by the light source device is, for example, far-ultraviolet light (DUV light) such as glow lines (g-line, h-line, i-line), KrF excimer laser light (wavelength 248 nm), and ArF excimer laser light (wavelength) 193nm) and so on. The illumination light emitted from the light source device has a uniform illumination distribution, and is distributed to a plurality of illumination modules IL1001 to IL1006 through a light guide member such as an optical fiber.

In addition, the light source device may be disposed inside the first reel member 1021 or may be disposed outside the first reel member 1021. The light source device may be a device (external device) different from the exposure device EX.

The plurality of illumination modules IL1001 to IL1006 each include a plurality of optical components such as a lens. In this embodiment, the light emitted from the light source device and passing through any one of the plurality of lighting modules IL1001 to IL1006 is referred to as an illumination light beam EL1. Each of the plurality of illumination modules IL1001 to IL1006 includes, for example, an integrator optical system, a rod lens, a fly-eye lens, etc., and illuminates the illumination region IR with an illumination light beam EL1 having a uniform illumination distribution. In this embodiment, a plurality of lighting modules IL1001 to IL1006 are arranged inside the first reel member 1021. Each of the plurality of illumination modules IL1001 to IL1006 passes through the first reel member 1021 from the inside of the first reel member 1021 and illuminates each illumination region IR (IR1001 ~) on the mask M held on the outer peripheral surface of the first reel member 1021. IR1006).

In this embodiment, each lighting module is referred to as a first lighting module IL1001 and a second lighting module IL1002 in the order of −Y side (front side of the paper surface in FIG. 2) to + Y side (deep side of the paper surface in FIG. 2). , The third lighting module IL1003, the fourth lighting module IL1004, the fifth lighting module IL1005, and the sixth lighting module IL1006. That is, among the plurality of lighting modules IL1001 to IL1006, the first lighting module IL1001 is arranged on the most -Y side, and the sixth lighting module IL1006 is arranged on the most + Y side. In addition, the number of projection modules included in the projection optical system PL may be one or more, five or less, or seven or more.

The plurality of lighting modules IL1001 to IL1006 are separated from each other in a direction (for example, the X-axis direction) crossing the first central axis AX1001 so as not to interfere with each other. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are arranged at positions overlapping each other when viewed from the Y-axis direction. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are arranged separately from each other in the Y-axis direction.

In this embodiment, the second lighting module IL1002 is disposed symmetrically with respect to the center plane p1003 and the first lighting module IL1001 when viewed from the Y-axis direction. The fourth lighting module IL1004 and the sixth lighting module IL1006 are arranged at positions overlapping the second lighting module IL1002 when viewed from the Y-axis direction. The second lighting module IL1002, the fourth lighting module IL1004, and the sixth lighting module IL1006 are arranged separately from each other in the Y-axis direction.

The plurality of lighting modules IL1001 to IL1006 are all directed to the first radial direction D1001 or the second radial direction D1002 that intersects the central plane p1003 in the radiation direction (radial direction) of the first central axis AX1001 of the first reel member 1021. The illumination light beam EL1 is irradiated. The illumination direction of the illumination beam EL1 of each lighting module is changed in accordance with the order of the light modules arranged in the Y-axis direction. For example, the irradiation direction of the illumination beam from the first lighting module IL1001 (first radial direction D1001) is inclined to the -X side from the Z axis direction, and the irradiation direction of the illumination beam from the second lighting module IL1002 (second radial direction D1002) ) Is inclined to the + X side from the -Z axis direction. Similarly, the irradiation direction of the illumination light beam from each of the third lighting module IL1003 and the fifth lighting module IL1005 is substantially parallel to the irradiation direction of the first lighting module IL1001, and from the fourth lighting module IL1004 and the first The irradiation direction of each of the lighting beams of the 6 lighting module IL1006 is substantially parallel to the irradiation direction of the second lighting module IL1002.

FIG. 5 is a diagram showing the arrangement of the illumination area IR and the projection area PA in this embodiment. In addition, FIG. 5 is a plan view illustrating the illumination area IR disposed on the mask M of the first reel member 1021 (the left image in FIG. 5) as viewed from the -Z side and disposed on the second volume as viewed from the + Z side. A plan view of the projection area PA on the substrate P of the cylindrical member 1022 (right view in FIG. 5). The symbol Xs in FIG. 5 indicates the moving direction (rotation direction) of the first reel member 1021 or the second reel member 1022.

The first to sixth lighting modules IL1001 to IL1006 respectively illuminate the first to sixth lighting areas IR1001 to IR1006 on the photomask M. For example, the first illumination module IL1001 illuminates the first illumination area IR1001, and the second illumination module IL1002 illuminates the second illumination area IR1002.

Although the first illumination area IR1001 of this embodiment is described as being a slender trapezoidal area in the Y direction, it may be a rectangular area including this trapezoidal area according to the structure of the projection optical system (projection module) PL described later. . The third illumination region IR1003 and the fifth illumination region IR1005 are both regions having the same shape as the first illumination region IR1001, and are arranged at regular intervals in the Y-axis direction. The second illumination area IR1002 is a trapezoidal (or rectangular) area symmetrical to the first illumination area IR1001 with respect to the center plane p1003. The fourth illumination region IR1004 and the sixth illumination region IR1006 are both regions having the same shape as the second illumination region IR1002, and are arranged at regular intervals in the Y-axis direction.

As shown in FIG. 5, each of the first to sixth lighting areas IR1001 to IR1006 is arranged so that the triangular portions of the hypotenuse of the adjacent trapezoidal lighting area overlap when viewed in the circumferential direction of the first surface p1001. Therefore, for example, the rotation of the first reel member 1021 passes through the first area A1001 on the mask M of the first illumination area IR1001, and the rotation of the first reel member 1021 passes through the second illumination area IR1002. The second area A1002 on the photomask M is partially repeated.

In this embodiment, the mask M has a patterned area A1003 in which a pattern is formed, and a patterned non-formation area A1004 in which a pattern is not formed. This pattern non-formation area A1004 is arranged to surround the pattern formation area A1003 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern forming area A1003 of the photomask M moves in the direction Xs with the rotation of the first reel member 1021, and each of the partial areas in the Y-axis direction in the pattern forming area A1003 passes any of the first to sixth illumination areas IR1001 to IR1006. . In other words, the first to sixth illumination areas IR1001 to IR1006 are arranged so as to cover the full width in the Y-axis direction of the pattern formation area A1003.

As shown in FIG. 2, the projection optical system PL includes a plurality of projection modules PL1001 to PL1006 arranged in the Y-axis direction. Each of the plurality of projection modules PL1001 to PL1006 corresponds to each of the first to sixth lighting areas IR1001 to IR1006 in a one-to-one correspondence with the mask M appearing in the lighting area IR illuminated by the corresponding lighting module. An image of a partial pattern is projected on each projection area PA on the substrate P.

For example, the first projection module PL1001 corresponds to the first lighting module IL1001, and projects the pattern image of the mask M in the first lighting area IR1001 (see FIG. 5) illuminated by the first lighting module IL1001 on the substrate P. The first projection area PA1001. The third projection module PL1003 and the fifth projection module PL1005 correspond to the third lighting module IL1003 and the fifth lighting module IL1005, respectively. The third projection module PL1003 and the fifth projection module PL1005 are arranged at positions that do not overlap the first projection module PL1001 when viewed from the Y-axis direction.

The second projection module PL1002 corresponds to the second lighting module IL1002, and projects the pattern image of the mask M in the second lighting area IR1002 (see FIG. 5) illuminated by the second lighting module IL1002 on the substrate P. The second projection area PA1002. The second projection module PL1002 is disposed at a position symmetrical to the first projection module PL1001 with respect to the center plane p1003 when viewed from the Y-axis direction.

The fourth projection module PL1004 and the sixth projection module PL1006 are respectively arranged corresponding to the fourth lighting module IL1004 and the sixth lighting module IL1006. The fourth projection module PL1004 and the sixth projection module PL1006 are arranged from the Y-axis direction. A position that does not overlap the second projection module PL1002 when viewed.

In addition, in this embodiment, the light that reaches each of the illumination areas IR1001 to IR1006 from the illumination module 1013 to each illumination area IR1001 to IR1006 on the mask M is referred to as an illumination beam EL1, and is received by each illumination area IR1001 to IR1006. The intensity distribution corresponding to the local pattern of the appearing mask M is adjusted, and the light that enters each projection module PL1001 ~ PL1006 and reaches each projection area PA1001 ~ PA1006 is called imaging beam EL2.

As shown in the right figure in FIG. 5, the pattern image in the first illumination area IR1001 is projected on the first projection area PA1001, and the pattern image in the third illumination area IR1003 is projected on the third projection area PA1003 and the fifth illumination area. The pattern image in IR1005 is projected on the fifth projection area PA1005. In this embodiment, the first projection area PA1001, the third projection area PA1003, and the fifth projection area PA1005 are arranged in a line in the Y-axis direction.

The pattern image in the second illumination area IR1002 is projected onto the second projection area PA1002. In this embodiment, the second projection area PA1002 is arranged symmetrically with respect to the center plane p1003 and the first projection area PA1001 when viewed from the Y-axis direction. The pattern image in the fourth illumination area IR1004 is projected on the fourth projection area PA1004, and the pattern image in the sixth illumination area IR1006 is projected on the sixth projection area PA1006. In this embodiment, the second projection area PA1002, the fourth projection area PA1004, and the sixth projection area PA1006 are arranged in a line in the Y-axis direction.

Each of the first to sixth projection areas PA1001 to PA1006 is arranged so that when viewed in the circumferential direction of the second surface p1002, the projection area adjacent to the direction parallel to the second central axis AX1002 overlaps the end portion (the triangular portion of the trapezoid). . Therefore, for example, the third area A1005 on the substrate P of the first projection area PA1001 is passed by the rotation of the second reel member 1022, and the substrate is passed through the second projection area PA1002 by the rotation of the second reel member 1022. The fourth area A1006 on P is partially repeated.

The shapes of the first projection area PA1001 and the second projection area PA1002, and the like, are set so that the exposure amounts of the areas where the third area A1005 and the fourth area A1006 overlap are substantially the same as those of the areas that do not overlap.

In this embodiment, as shown in the right diagram in FIG. 5, the area to be exposed by the substrate P (hereinafter referred to as the exposure area A1007) is moved in the direction Xs with the rotation of the second reel member 1022, and Y in the exposure area A1007 Each partial area in the axial direction passes through any of the first to sixth projection areas PA1001 to PA1006. In other words, the first to sixth projection areas PA1001 to PA1006 are arranged to cover the full width in the Y-axis direction of the exposure area A1007.

In addition, the irradiation direction of the illumination beam EL1 with respect to the first projection module PL1001 may be, for example, the traveling direction of the main light passing through any position in the first illumination area IR1001, or the direction of the main light passing through the center of the first illumination area IR1001. The direction of travel of the main ray. The irradiation directions of the illumination light beam EL1 with respect to the second to sixth projection modules PL1002 to PL1006 are also the same.

In addition, the first to sixth projection areas PA1001 to PA1006 may be arranged so that the areas on the substrate P passing through any of them do not overlap each other at the ends. For example, the third area A1005 passing through the first projection area PA1001 may not overlap with a part of the fourth area A1006 passing through the second projection area PA1002. That is, even if it is a multi-lens method, continuous exposure of each projection module can not be performed. In this case, the third area A1005 may also be an area where the pattern corresponding to the first element is projected, and the fourth area A1006 may also be an area where the pattern corresponding to the second element is projected. The second element described above may be an element of the same kind as the first element, and the same pattern as the third region A1005 is projected on the fourth region A1006. The second element described above may be a different type of element from the first element, and a pattern different from the third region A1005 is projected on the fourth region A1006.

Next, a detailed configuration of the projection optical system PL of this embodiment will be described with reference to FIG. 6. In this embodiment, each of the second to sixth projection modules PL1002 to PL1006 has the same configuration as the first projection module PL1001. Therefore, the configuration of the first projection module PL1001 will be described to represent the projection optical system PL.

The first projection module PL1001 shown in FIG. 6 includes a first optical system 1041 that forms a pattern image of the mask M arranged in the first illumination area IR1001 on an intermediate image plane p1007, and an intermediate image formed by the first optical system 1041. At least a part of it is re-imaged on the second optical system 1042 in the first projection area PA1001 of the substrate P, and the first field diaphragm 1043 disposed on the intermediate image plane p1007 forming the intermediate image.

In addition, the first projection module PL1001 includes a focus correction optical member 1044 for finely adjusting the focus state of a pattern image (hereinafter referred to as a projection image) of a mask formed on the substrate P, and for finely adjusting the projection image on the image plane. The image movement correction optical member 1045 for horizontal movement, the magnification correction optical member 1047 for slightly correcting the magnification of the projection image, and the rotation correction mechanism 1046 for slightly rotating the projection image within the image plane.

The focus correction optical member 1044 is disposed at a position where the imaging beam EL2 emitted from the first illumination area IR1001 is incident, and the image shift correction optical member 1045 is disposed at a position where the imaging beam EL2 emitted from the focus correction optical member 1044 is incident. The magnification correction optical member 1047 is arranged at a position where the imaging beam EL2 emitted from the second optical system 1042 enters.

The imaging beam EL2 of the pattern from the mask M is emitted from the first illumination area IR1001 in the normal direction, and is incident on the image shift correction optical member 1045 through the focus correction optical member 1044. The imaging light beam EL2 transmitted through the image shift correction optical member 1045 is reflected by the first reflecting surface (planar mirror) p1004 of the first deflection member 1050, which is the first optical system 1041, and is reflected by the first lens group 1051 and the first concave mirror 1052. Then, it passes through the first lens group 1051 and reflects on the second reflecting surface (planar mirror) p1005 of the first deflection member 1050 again, and enters the first field diaphragm 1043.

The imaging light beam EL2 passing through the first field diaphragm 1043 is reflected by the third reflecting surface (planar mirror) p1008 of the second deflection member 1057, which is an element of the second optical system 1042, and is reflected by the second lens group 1058 and the second concave mirror 1059. The light is reflected by the second lens group 1058 on the fourth reflecting surface (planar mirror) p1009 of the second deflection member 1057 again, and enters the optical member 1047 for magnification correction.

The imaging beam EL2 emitted from the magnification correction optical member 1047 is incident on the first projection area PA1001 on the substrate P, and the pattern image appearing in the first illumination area IR1001 is projected on the first projection area PA1001 at equal magnification (× 1). .

The first optical system 1041 and the second optical system 1042 are, for example, a telecentric refracting optical system in which a Dyson system is deformed. In this embodiment, the optical axis of the first optical system 1041 (hereinafter referred to as the first optical axis AX1003) is substantially orthogonal to the center plane p1003. The first optical system 1041 includes a first deflection member 1050, a first lens group 1051, and a first concave mirror 1052. The imaging light beam EL2 emitted from the image shift correction optical member 1045 is reflected by the first reflection surface p1004 of the first deflection member 1050 and travels toward one side (-X side) of the first optical axis AX1003, and enters through the first lens group 1051. A first concave mirror 1052 disposed on the pupil surface. The imaging beam EL2 reflected by the first concave mirror 1052 travels to the other side (+ X side) of the first optical axis AX1003, passes through the first lens group 1051, and is reflected by the second reflecting surface p1005 of the first deflection member 1050. Enter the first field diaphragm 1043.

The first deflection member 1050 is a triangular ridge extending in the Y-axis direction. In this embodiment, each of the first reflection surface p1004 and the second reflection surface p1005 includes a mirror surface (the surface of the reflection film) formed on the surface of the triangular ridge. The main ray EL3 passing through the imaging beam EL2 in the center of the first illumination area IR1001 is incident on the first projection direction PL1001 along the first radial direction D1001 inclined in the XZ plane with respect to the central plane p1003.

The first deflecting member 1050 deflects the imaging beam EL2 into a main ray EL3 reaching the first reflection surface p1004 from the first illumination area IR1001 and a main ray EL3 reaching the intermediate image plane p1007 from the second reflection surface p1005 (and the central plane p1003 (Parallel) becomes non-parallel in the XY plane.

In order to form the optical path as described above, in this embodiment, a ridge line intersecting the first reflection surface p1004 and the second reflection surface p1005 of the first deflecting member 1050 and the first optical axis AX1003 are included, and a plane parallel to the XY plane is set as p1006, with respect to this surface p1006, the first reflection surface p1004 and the second reflection surface p1005 are arranged at an asymmetrical angle.

When the angle of the first reflection surface p1004 with respect to the surface p1006 is set to θ 1001, and the angle of the second reflection surface p1005 with respect to the surface p1006 is set to θ 1002, in this embodiment, the angle (θ 1001 + θ 1002) is set It is under 90 °, the angle θ 1001 is set to 45 °, and the angle θ 1002 is set to substantially 45 °.

By setting the principal ray EL3 reflected on the first reflection surface p1004 and incident on the first lens group 1051 to be parallel to the optical axis AX1003, the principal ray EL3 can pass through the center of the first concave mirror 1052, that is, the pupil light The intersection of the axis AX1003 can ensure the telecentric imaging state. Therefore, in FIG. 6, when the inclination angle of the main ray EL3 (first radial direction D1001) from the first illumination area IR1001 to the first reflection surface p1004 with respect to the center plane p1003 is set to θd, the angle of the first reflection surface p1004 θ 1001 may be set so as to satisfy the following formula (1).

θ 1001 = 45 °-(θd / 2) ... (1)

In this embodiment, each of the plurality of lenses belonging to the first lens group 1051 is axisymmetrically shaped around the first optical axis AX1003. The imaging light beam EL2 reflected on the first reflection surface p1004 enters the first lens group 1051 from one side (+ Z side) of the opposite surface p1006. The first concave mirror 1052 is arranged at or near the pupil surface of the first optical system 1041.

The main ray EL3 of the imaging beam EL2 passing through the first lens group 1051 enters the intersection of the first optical axis AX1003 and the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 travels in the first lens group 1051 along a light path that is symmetrical to the opposite surface p1006, as compared with the state before the incident on the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 is emitted from the other side (-Z side) of the first lens group 1051, and is reflected by the second reflecting surface p1005 of the first deflection member 1050, along the main line parallel to the central plane p1003. Light EL3 travels.

The first field diaphragm 1043 has an opening that defines the shape of the first projection area PA1001. That is, the shape of the opening of the first field diaphragm 1043 defines the shape of the first projection area PA1001. Therefore, as shown in FIG. 6, when the first field diaphragm 1043 can be arranged on the intermediate image plane p1007, the opening shape of the first field diaphragm 1043 can be made trapezoidal as shown in the right diagram of FIG. 5 above. In each case, the shapes of the first to sixth illumination areas IR1006 may not be similar to the shapes (trapezoidal) of the first to sixth projection areas PA1001 to PA1006, and may include the openings of the projection areas (the first field diaphragm 1043). ) In a trapezoidal shape.

The second optical system 1042 has the same configuration as the first optical system 1041, and is arranged symmetrically to the first optical system 1041 with respect to the intermediate image plane p1007 including the first field diaphragm 1043. The optical axis of the second optical system 1042 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the center plane p1003. The second optical system 1042 includes a second deflection member 1057, a second lens group 1058, and a second concave mirror 1059. The imaging beam EL2 emitted from the first optical system 1041 and passed through the first field stop 1043 is reflected by the third reflecting surface p1008 of the second deflection member 1057, and enters the second concave mirror 1059 through the second lens group 1058. The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the second lens group 1058 again, is reflected by the fourth reflecting surface p1009 of the second deflection member 1057, and is incident on the magnification correction optical member 1047.

The second deflection member 1057, the second lens group 1058, and the second concave mirror 1059 of the second optical system 1042 are the same as the first deflection member 1050, the first lens group 1051, and the first concave mirror 1052 of the first optical system 1041, respectively. The angle θ 1003 formed by the third reflection surface p1008 of the second deflection member 1057 and the second optical axis AX1004, and the angle θ 1002 formed by the second reflection surface p1005 of the first deflection member 1050 and the first optical axis AX1003 the same. An angle θ 1004 between the fourth reflecting surface p1009 of the second deflecting member 1057 and the second optical axis AX1004, and an angle θ 1001 between the first reflecting surface p1004 of the second deflecting member 1050 and the first optical axis AX1003. Substantially the same. Each of the plurality of lenses belonging to the second lens group 1058 has an axisymmetric shape around the second optical axis AX1004.

The second concave mirror 1059 is arranged at or near the pupil surface of the second optical system 1042.

The imaging light beam EL2 passing through the first field diaphragm 1043 travels in the direction of the principal ray parallel to the central plane p1003 and enters the third reflecting surface (plane) p1008. The inclination angle θ 1003 of the third reflecting surface p1008 with respect to the second optical axis AX1004 (or the plane p1006 or the intermediate image plane p1007) of the second optical system 1042 is 45 ° in the XZ plane, and the imaging beam EL2 reflected here is emitted. Enter the field of view of the upper half of the second lens group 1058. The main ray EL3 of the imaging beam EL2 that has entered the second lens group 1058 becomes parallel to the second optical axis AX1004, and enters the intersection of the second optical axis AX1004 and the second concave mirror 1059.

The imaging light beam EL2 reflected by the second concave mirror 1059 travels symmetrically with respect to the second optical axis AX1004 as compared with the state before the incident on the second concave mirror 1059. The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the field of view of the lower half of the second lens group 1058 again, is reflected by the fourth reflecting surface p1009 of the second deflection member 1057, and travels in a direction crossing the center plane p1003.

The direction of travel of the main ray EL3 of the imaging beam EL2 emitted from the second optical system 1042 toward the first projection area PA1001 is set relative to the middle image plane p1007 including the first field diaphragm 1043 and incident from the first illumination area IR1001. The traveling direction of the main ray EL3 of the imaging beam EL2 of the first optical system 1041 is symmetrical. That is, when viewed in the XZ plane, the angle θ 1004 of the fourth reflecting surface p1009 of the second deflection member 1057 with respect to the second optical axis AX1004 is set to satisfy the following formula (2) in the same manner as the previous formula (1). .

θ 1004 = 45 °-(θd / 2) ... (2)

Thereby, the main ray EL3 of the imaging beam EL2 emitted from the second optical system 1042 is directed to the normal direction of the first projection area PA1001 (cylindrical surface) on the substrate P (to the center of rotation AX1002 in FIG. 2). Direction).

In this embodiment, the focus correction optical member 1044, the image shift correction optical member 1045, the rotation correction mechanism 1046, and the magnification correction optical member 1047 constitute an imaging characteristic adjustment mechanism that adjusts the imaging characteristics of the first projection module PL1001. By controlling the imaging characteristic adjustment mechanism, the projection conditions of the projection image on the substrate P can be adjusted for each projection module. The projection conditions referred to here include one or more of the projected area's parallel position or rotation position, magnification, and focus on the substrate P. The projection conditions can be determined for each position relative to the projection area of the substrate P during the synchronous scanning. By adjusting the projection conditions of the projection image, the distortion of the projection image when compared with the pattern of the mask M can be corrected. In addition, the configuration of the imaging characteristic adjustment mechanism can be appropriately changed, and at least a part thereof can be omitted.

The focus-correcting optical member 1044 is, for example, a pair of wedge-shaped ridges (reverse direction in the X direction in FIG. 6) laminated into a transparent parallel plate as a whole. By making the pair of slugs slide in the direction of the oblique plane without changing the interval between the surfaces facing each other, the thickness as a parallel flat plate can be changed. Thereby, the effective optical path length of the first optical system 1041 is fine-tuned, and the focus state of the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 is fine-tuned.

The image shift correction optical member 1045 is composed of a transparent parallel plate glass that can be inclined in the XZ plane in FIG. 6 and a transparent parallel plate glass that can be inclined in a direction orthogonal thereto. By adjusting the respective inclination amounts of the two parallel plate glasses, the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 can be slightly shifted in the X direction or the Y direction.

The magnification correction optical member 1047 is configured by, for example, arranging three lenses of a concave lens, a convex lens, and a concave lens coaxially at a predetermined interval, and fixing the front and rear concave lenses so that the convex lenses therebetween move in the direction of the optical axis (principal light). Thereby, the pattern image formed in the projection area PA1001 can be enlarged or reduced by a small amount while maintaining a telecentric imaging state. In addition, the optical axes of the three lens groups constituting the optical element 1047 for magnification correction are inclined in the XZ plane so as to be parallel to the main light beam EL3 passing therethrough.

The rotation correction mechanism 1046 is, for example, a person who slightly rotates the first deflection member 1050 about an axis parallel to the first optical axis AX1003 by an actuator (not shown). By this rotation correction mechanism 1046, the image formed on the intermediate image plane p1007 can be rotated slightly within the intermediate image plane p1007.

As described above, the imaging beam EL2 emitted from the first projection module PL1001 is an image of a pattern appearing in the first illumination region IR1001 on the first projection area PA1001 of the substrate P disposed on the outer peripheral surface of the second reel member 1022. In this embodiment, the main ray EL3 of the imaging beam EL2 passing through the center of the first illumination area IR1001 is emitted from the first illumination area IR1001 in the normal direction, and is incident on the first projection area PA1001 from the normal direction. In this way, the image of the pattern of the mask M appearing in the first illuminated area IR1001 of the cylindrical surface is projected onto the first projection area PA1001 of the substrate P of the cylindrical surface. In addition, the images of the patterns appearing in the second to sixth illumination areas IR1002 to IR1006 are similarly projected on each of the second to sixth projection areas PA1002 to PA1006 on the cylindrical substrate P.

In this embodiment, as shown in FIGS. 2 and 5, the odd-numbered lighting areas IR1001, IR1003, and IR1005 and the even-numbered lighting areas IR1002, IR1004, and IR1006 are arranged at a symmetrical distance from the center plane p1003, and the odd-numbered projection areas PA1001, PA1003, PA1005 and even projection areas PA1002, PA1004, PA1006 are also arranged at symmetrical distances from the center plane p1003. Therefore, each of the six projection modules can be made into the same structure, the components of the projection optical system can be shared, the assembly steps and inspection steps can be simplified, and the imaging characteristics (aberrations, etc.) of each projection module can be integrated into the same . In this regard, particularly in the case of successive exposures between the projection areas of each projection module by the multi-lens method, the quality (transfer fidelity) of the panel pattern formed on the substrate P may not depend on the position within the panel. It is advantageous to keep the area constant.

In addition, in a general exposure device, if the projection area is curved into a cylindrical shape, for example, when an imaging beam enters the projection area from a non-vertical direction, the defocus may be increased depending on the position of the projection area. As a result, there is a case where a poor exposure occurs and a defective element is generated.

In this embodiment, the first deflecting member 1050 (the first reflecting surface p1004) and the second deflecting member 1057 (the fourth reflecting surface p1009) of the projection optical system PL (for example, the first projection module PL1001) use the main light EL3 The main ray EL3 deflected so as to be emitted from the first illumination area IR1001 toward the normal direction is projected from the normal direction onto the first projection area PA1001. Therefore, the substrate processing apparatus 1011 can reduce the focus error of the projected image in the projection area PA1001, especially the optimal focus plane of the projected image in each of the projection areas PA1001 to PA1006 shown in FIG. 5 from the entire projection module as a whole. The width of the Depth of Focus of PL1001 ~ PL1006 is greatly shifted to prevent the occurrence of poor exposure. As a result, the occurrence of defective components in the component manufacturing system 1001 can be suppressed.

In this embodiment, since the projection optical system PL includes the first field diaphragm 1043 arranged at the position where the intermediate image is formed, it is possible to accurately manage the shape and the like of the projected image. Therefore, the substrate processing apparatus 1011 can reduce, for example, overlapping errors of the first to sixth projection areas PA1001 to PA1006, and suppress the occurrence of poor exposure and the like. The second reflecting surface p1005 of the first deflecting member 1050 deflects the main ray EL3 from the first illumination area IR1001 so as to be orthogonal to the field diaphragm 1043. Therefore, the substrate processing apparatus 1011 can more accurately manage the shape and the like of the projected image.

In this embodiment, each of the first to sixth projection modules PL1001 to PL1006 projects an image of the pattern of the mask M into an upright image. Therefore, when the substrate processing device 1011 divides the pattern of the photomask M into first to sixth projection modules PL1001 to PL1006 for projection, it is possible to perform projection of the projected area (for example, the third area A1005 and the fourth area A1006). ) Partially overlapped successive exposures make the design of the photomask M easy.

In this embodiment, since the substrate processing apparatus 1011 is configured to continuously convey the substrate P at a constant speed along the second surface p1002 by the transfer apparatus 1009 and expose the substrate P by the exposure apparatus EX, the productivity of the exposure process can be improved. As a result, the component manufacturing system 1001 can manufacture components with good efficiency.

In addition, in the present embodiment, although the first reflection surface p1004 and the second reflection surface p1005 are arranged on the surface of the same deflection member (the first deflection member 1050), they may be arranged on the surfaces of different members. One or both of the first reflection surface p1004 and the second reflection surface p1005 may be disposed on the inner surface of the first deflection member 1050, and have a characteristic of reflecting light under the condition of total reflection, for example.

Furthermore, the above-mentioned deformations related to the first reflection surface p1004 and the second reflection surface p1005 can also be applied to one or both of the third reflection surface p1008 and the fourth reflection surface p1009. For example, when the radius r1002 of the second surface p1002 is changed, the fourth reflecting surface p1009 of the second deflection member 1057 is set to an angle θ 1004 such that the imaging beam EL2 enters the first projection area PA1001 from the normal direction. The arrangement is set such that the arc-shaped perimeter between the center points of the first projection area PA1001 and the second projection area PA1002, and the center point and lighting area of the lighting area IR1001 corresponding to the mask M (radius r1001). The arc-shaped perimeters between the center points of IR1002 are the same.

    [Second Embodiment]    

Next, a second embodiment will be described. In this embodiment, the same constituent elements as those in the above-mentioned embodiment may be given the same reference numerals as those in the above-mentioned embodiment, and the description thereof will be simplified or omitted.

FIG. 7 is a diagram showing the configuration of a substrate processing apparatus 1011 according to this embodiment. The transfer device 1009 of this embodiment includes a first transfer roller 1030, a first guide member (such as an air rotating lever) 1031, a fourth transfer roller 1071, a fifth transfer roller 1072, a sixth transfer roller 1073, and a second guide. A member (such as an air rotating lever) 1033 and a second transfer drum 1034.

The substrate P transferred from the upstream of the transfer path to the first transfer roller 1030 is transferred to the first guide member 1031 via the first transfer roller 1030. The substrate P that has passed through the first guide member 1031 is transferred to the fifth transfer roller 1072 through the fourth transfer roller 1071. The fifth conveyance roller 1072 has its central axis disposed on a central plane p1003. The substrate P passing through the fifth transporting roller 1072 is transported to the second guide member 1033 via the sixth transporting roller 1073.

The sixth conveyance roller 1073 is arranged symmetrically to the fourth conveyance roller 1071 with respect to the center plane p1003. The substrate P that has passed through the second guide member 1033 is conveyed downstream of the conveyance path through the second conveyance roller 1034. The first guide member 1033 and the second guide member 1033 adjust the tension acting on the substrate P in the transport path in the same manner as the first guide member 1031 and the second guide member 1033 shown in FIG. 2.

The first projection area PA1001 in FIG. 7 is set on the substrate P that is linearly transferred between the fourth transfer roller 1071 and the fifth transfer roller 1072. Between the fourth transfer roller 1071 and the fifth transfer roller 1072, the substrate P is supported so as to be given a predetermined tension in the transfer direction, and the substrate P is transferred along the planar second surface p1002.

The first projection area PA1001 (the second surface p1002) is inclined so as to be non-vertical with respect to the center surface p1003. The normal direction of the first projection area PA1001 (hereinafter referred to as the first normal direction D1003) is arranged opposite to the plane orthogonal to the central plane p1003, for example, the intermediate image plane p1007 also shown in FIG. 6 and the first radial direction. D1001 is symmetrical. The main ray EL3 of the imaging beam EL2 emitted from the first projection module PL1001 enters the first projection area PA1001 from the first normal direction D1003. In other words, the fourth transport roller 1071 and the fifth transport roller 1072 are arranged so as to be mounted on the first normal direction D1003 of the substrate P on the fourth transport roller 1071 and the fifth transport roller 1072, with respect to the middle orthogonal to the center plane p1003. The image plane p1007 is symmetrical to the first radial direction D1001.

The second projection area PA1002 is set on the substrate P that is linearly transported between the fifth transporting roller 1072 and the sixth transporting roller 1073. The substrate P is supported between the fifth transfer roller 1072 and the sixth transfer roller 1073 so as to be given a certain tension, and the substrate P is transferred along the planar second surface p1002.

The second projection area PA1002 is inclined so as to be non-vertical with respect to the center plane p1003. The normal direction of the second projection area PA1002 (hereinafter referred to as the second normal direction D1004) is arranged symmetrically to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. The main ray EL3 of the imaging beam EL2 emitted from the second projection module PL1002 enters the second projection area PA1002 from the second normal direction D1004. In other words, the fifth transporting roller 1072 and the sixth transporting roller 1073 are arranged so as to be mounted on the second normal direction D1004 of the substrate P between the fifth transporting roller 1072 and the sixth transporting roller 1073, relatively to the middle orthogonal to the center plane p1003. The image plane p1007 is symmetrical to the second radial direction D1002.

In the substrate processing apparatus 1011 of this embodiment, the second conveying roller 1071, the fifth conveying roller 1072, and the sixth conveying roller 1073 bring the second surface p1002 of the cylindrical surface shape shown in FIG. 2 closer to an approximate plane, The fidelity of the transfer of the pattern image projected on the substrate P in each of the projection areas PA1001 to PA1006 is further improved from the viewpoint of depth of focus (DOF). In addition, as shown in FIG. 2, compared with the case where the second reel member 1022 having a radius r1002 is used to support and transfer the substrate P, the height of the Z direction of the entire transfer device 1009 can be suppressed to be lower, and the device can be made smaller. Overall small.

In the device configuration of FIG. 7, the fourth conveying roller 1071, the fifth conveying roller 1072, and the sixth conveying roller 1073 are part of the conveying device 1009, and also serve as a supporting member for supporting the substrate P to be exposed (exposure device EX). Side of the substrate stage). In addition, between the fourth transfer roller 1071 and the fifth transfer roller 1072, and between the fifth transfer roller 1072 and the sixth transfer roller 1073, a back surface side of the substrate P may be supported in a non-contact plane by a fluid bearing. The padding method of the Benui method makes the flatness of a partial area of the substrate P where each projection area PA1001 ~ PA1006 is located more improved.

In addition, at least one of the conveyance rollers of the conveyance device 1009 shown in FIG. 7 may be fixed to the projection optical system PL or movable. For example, the fifth conveying roller 1072 may include three parallel directions including a parallel direction parallel to the X-axis direction, a parallel direction parallel to the Y-axis direction, and a parallel direction parallel to the Z-axis direction and a direction parallel to the X-axis direction. At least one of the six directions (six degrees of freedom) (six degrees of freedom) of the three directions of rotation (six degrees of freedom) about the rotation direction of the axis parallel to the Y-axis direction, and the three rotation directions of the rotation direction about the axis parallel to the Z-axis direction. Degrees of freedom) move slightly. Alternatively, the first normal direction D1003 of the first projection area PA1001 can be fine-tuned by adjusting the relative position of the Z-axis direction of one or both of the fourth conveying roller 1071 and the sixth conveying roller 1073 relative to the fifth conveying roller 1072. Or the angle formed by the second normal direction D1004 of the second projection area PA1002 and the surface of the substrate P supported by the planarization. In this way, by slightly moving the selected roller, the posture of the surface of the substrate P with respect to the pattern projection image surface in each of the projection areas PA1001 to PA1006 can be made uniform.

    [Third Embodiment]    

Next, a third embodiment will be described. In this embodiment, the same constituent elements as those in the above-mentioned embodiments may be given the same reference numerals as those in the above-mentioned embodiments, and descriptions thereof will be simplified or omitted.

FIG. 8 shows the configuration of the exposure apparatus EX as the substrate processing apparatus 1011 in this embodiment, and the basic configuration is the same as that of the previous FIG. 7. However, the difference from the configuration of FIG. 7 lies in that the angle θ 1004 of the fourth reflection surface p1009 of the second deflection member 1057 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1004 is set to The substrate P conveyed by the conveying device 1009 at 45 ° is supported on a plane orthogonal to the center plane p1003 (parallel to the XY plane in FIG. 8) at the position of each of the projection areas PA1001 to PA1006.

In the configuration of FIG. 8, the substrate P is transferred from the upstream of the transfer path to the eighth transfer roller 1076 via the first transfer roller 1030, the first guide member 1031 (such as an air rotating lever), and the fourth transfer roller 1071. The substrate P that has passed through the eighth conveyance roller 1076 is conveyed downstream of the conveyance path through the second guide member 1033 (air rotating rod or the like) and the second conveyance roller 1034.

As shown in FIG. 8, between the 4th conveyance roller 1071 and the 8th conveyance roller 1076, the board | substrate P is supported with predetermined tension, and conveyed in parallel with an XY plane. In this case, the second surface p1002 of the support substrate P is a flat surface, and the projection areas PA1001 to PA1006 are arranged in the second surface p1002.

Further, in the second optical system 1042 constituting each of the projection modules PL1001 to PL1006, the third reflective surface p1008 and the fourth reflective surface p1009 of the second deflection member 1057 are arranged so as to be imaged from the second optical system 1042 to the substrate P. The main ray EL3 of the light beam EL2 is substantially parallel to the center plane p1003. That is, the first deflecting member 1050 and the second deflecting member 1057 of the projection optical system PL (projection modules PL1001 to PL1006) deflect the imaging optical path so as to project from the cylindrical illumination areas IR1001 to IR1006 in a normal direction. Each of the principal rays EL3 enters the projection areas PA1001 to PA1006 set on the common plane from the normal direction.

In this embodiment, the center point of the projection area PA1001 (and PA1003, PA1005) to the center of the projection area PA1002 (and PA1004, PA1006) in the XZ plane viewed from a direction parallel to the first central axis AX1001 of the mask M The distance DFx along the second surface p1002 (the surface of the substrate P) is set from the center point of the lighting area IR1001 (and IR1003, IR1005) to the center point of the lighting area IR1002 (and IR1004, IR1006) on the first surface. The distance (chord length or perimeter) DMx of p1001 (the cylindrical surface of radius r1001) is substantially equal.

Here, the positional relationship between the illumination areas IR and the projection area PA will be described with reference to FIG. 9 schematically shown. In FIG. 9, the symbol α indicates the angle (aperture angle) [°] formed by the first radial direction D1001 and the second radial direction D1002, and the symbol r indicates the radius [mm] of the first surface p1001.

In FIG. 9, the circumference DMx [mm] from the center point of the illumination area IR1001 to the center point of the illumination area IR1002 in the XZ plane is expressed by the following formula (3) using the angle α and the radius r.

DMx = π‧α‧r / 180 ... (3)

The straight line distance Ds from the center point of the illumination area IR1001 to the center point of the illumination area IR1002 is expressed by the following formula (4).

Ds = 2‧r‧sin (π‧α / 360) ... (4)

For example, when the angle α is 30 ° and the radius r is 180 mm, the perimeter DMx is about 94.248 mm and the distance Ds is about 93.175 mm. That is, if it is assumed that the X coordinate of the center point of the illumination area IR1001 is consistent with the X coordinate of the center point of the projection area PA1001, and the X coordinate of the center point of the illumination area IR1002 is consistent with the X coordinate of the center point of the projection area PA1002, In the pattern of the mask M, two points separated by the perimeter DMx in the circumferential direction are respectively projected on the substrate P through the projection areas PA1001 and PA1002, and the two points are separated by a distance Ds (Ds <DMx) on the substrate P in the X direction. exposure. That is, if according to the previous numerical example, it means that the pattern exposed on the substrate P through the odd projection areas PA1001, PA1003, PA1005 and the pattern exposed on the substrate P through the even projection areas PA1002, PA1004, PA1006, in The X direction will be offset by a maximum of 1.073mm.

Therefore, in this embodiment, the arrangement conditions of specific optical components in the projection optical system PL are changed from the conditions shown in FIG. 6 previously, so that the center point of the projection area PA1001 and the projection area PA1002 are projected on the planarized substrate P. The straight line distance DFx between the center points and the perimeter DMx is substantially equal.

Specifically, the fourth reflecting surface p1009 of the second deflection member 1057 is slightly shifted from the position shown in FIG. 6 to a direction parallel to the optical axis AX1004 (X axis), and as a result, the straight line distance DFx and the perimeter are set. DMx is consistent. According to the numerical example given earlier, the difference between the perimeter DMx and the distance Ds is 1.073mm, and the fourth reflecting surface p1009 of the second deflection member 1057 included in each of the odd-numbered projection modules PL1001, PL1003, and PL1005 can be easily replaced. The positions are shifted along the optical axis AX1004 toward the second concave mirror 1059 side by about 1 mm in parallel.

However, in such a configuration, the configuration of the second deflecting member 1057 (the configuration of the fourth reflecting surface p1009) may have parts different from the even-numbered projection modules PL1002, PL1004, and PL1006.

Therefore, as long as the position of the fourth reflecting surface p1009 of the second deflection member 1057 mounted on all the projection modules PL1001 to PL1006 is moved parallel to the second concave mirror 1059 side along the optical axis AX1004 by about 0.5 mm, which is half of the above 1 mm, Seek commonality of parts.

FIG. 10 is a graph showing the correlation between the difference between the perimeter DMx of the pattern surface of the mask M (the first surface p1001) and the linear distance Ds between the centers of the odd and even lighting areas illustrated in FIG. 9 and the angle α. Indicates the difference, and the horizontal axis indicates the aperture angle α. The plural curve in the graph of FIG. 10 shows a case where the radius r of the pattern surface (the first surface p1001 of a cylindrical shape) of the mask M is changed to 180 mm, 210 mm, 240 mm, and 300 mm. As explained in the numerical example, when the angle α is 30 ° and the radius r is 180mm, the perimeter DMx is about 94.248mm and the distance Ds is about 93.175mm. Therefore, the difference shown on the vertical axis of the graph in FIG. 10 It is about 1.073mm.

As shown in FIG. 10, the difference between the perimeter DMx on the pattern surface (the first surface p1001) of the reticle M and the straight line distance Ds from the center point of the illumination area IR1001 to the center point of the illumination area IR1002 depends on the first The radius r and the angle α of the surface p1001 change. Therefore, the position of the fourth reflecting surface p1009 of the second deflection member 1057 may be set according to the relationship of the graph in FIG. 10.

In addition, in order to make the linear distance DMx on the substrate P substantially equal to the perimeter DMx on the mask M, it is still difficult to arrange the X-direction position of the fourth reflecting surface p1009 of the second deflection member 1057 optimally. It is consistent at the ultra-micron level, so the residual difference of several μm to tens of μm or less can be used to slightly shift the projected image in the X direction by using the image shift correction optical member 1045 shown in FIG. 6 previously. Sufficient accuracy makes the straight line distance DMx coincide with the perimeter DMx.

As described above, the image shift correction optical member 1045 is used to slightly shift the projected image in the X direction, and each projection area PA1001 to PA1006 is adjusted to the distance (perimeter) between the two object points in the scanning exposure direction within the mask pattern surface. The method of equalizing the separation distance (perimeter) of the scanning exposure direction of each image point when the two object points are projected on the substrate P is at the ultra-micron level, and it can also be used in the previous device of FIGS. 2 to 6 This configuration is applicable to the device configuration of FIG. 7.

    [Fourth Embodiment]    

Next, a fourth embodiment will be described. In FIG. 11, the same constituent elements as those in the above-mentioned embodiments may be assigned the same reference numerals as those in the above-mentioned embodiments, and the descriptions thereof may be simplified or omitted.

FIG. 11 is a diagram showing the configuration of an exposure apparatus EX as a substrate processing apparatus 1011 in this embodiment. In this embodiment, the configuration of the transfer device 1009 for the substrate P is the same as the configuration of the transfer device 1009 previously shown in FIG. 2. The difference between the structure of the substrate processing device 1011 shown in FIG. 11 and the structures of the previous devices of FIG. 2, FIG. 7, and FIG. 8 is that the photomask M is not a rotating cylindrical photomask but a normal transmission type flat photomask, The angle θ 1001 of the first reflecting surface p1004 of the first deflecting member 1050 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1003 (plane p1006) is set to 45 ° or the like.

In FIG. 11, the mask holding device 1012 includes a mask stage 1078 that holds a planar mask M, and a moving device that scans and moves the mask stage 1078 in the X direction in a plane orthogonal to the center plane p1003. (Illustration omitted).

Since the pattern surface of the mask M in FIG. 11 is a plane substantially parallel to the XY plane, the main light rays EL3 on the mask M side of the projection modules PL1001 to PL1006 are perpendicular to the XY plane, and each of the illumination mask M The light axes (principal rays) of the illumination modules IL1001 to IL1006 in the illumination area IR1001 to IR1006 are also perpendicular to the XY plane.

In this embodiment, the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 included in the first optical system 1041 of the projection modules PL1001 to PL1006 are arranged so as to form the imaging beam EL2 emitted from the first optical system 1041. The principal ray EL3 is substantially parallel to the central plane p1003. That is, the first deflecting member 1050 and the second deflecting member 1057 included in each of the projection modules PL1001 to PL1006 deflect the imaging beam EL2 so as to travel from the illumination areas IR1001 to IR1006 on the mask M in a normal direction. The main light rays EL3 enter the projection areas PA1001 to PA1006 formed on the substrate P along the cylindrical surface from the normal direction.

Therefore, the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 are arranged orthogonally, and the first reflection surface p1004 and the second reflection surface p1005 are both set substantially relative to the first optical axis AX1003 (XY plane) Up to 45 °.

The third reflecting surface p1008 of the second deflecting member 1057 is arranged to be asymmetric to the fourth reflecting surface p1009 with respect to a plane (parallel to the XY plane) including the second optical axis AX1004 and orthogonal to the center plane p1003. The angle θ 1003 formed by the third reflection surface p1008 and the second optical axis AX1004 is substantially 45 °, and the angle θ 1004 formed by the fourth reflection surface p1009 and the second optical axis AX1004 is substantially 45 ° or less, The setting of the angle θ 1004 is as described in FIG. 6.

Moreover, this embodiment is also the same as the previous FIG. 9. When viewed in the XZ plane, the center point of the illumination area IR1001 (and IR1003, IR1005) on the mask M (first surface p1001) to the illumination area IR1002 (and The distance from the center point of IR1004, IR1006) is set to the center point of the projection area PA1001 (and PA1003, PA1005) on the cylindrical substrate P to the center point of the second projection area PA1002 (and PA1004, PA1006). The length (perimeter) of the second surface p1002 along the cylindrical surface along the second surface p1002 is substantially the same.

Similarly, the substrate processing apparatus 1011 shown in FIG. 11 controls the moving device (such as a linear motor for scanning exposure or an actuator for micro-movement) of the mask holding device 1012 by the control device 1014 shown in FIG. 2, and The rotation of the second reel member 1022 drives the photomask stage 1078 in synchronization with the rotation. After the substrate processing apparatus 1011 shown in FIG. 11 performs scanning exposure by synchronous movement of the reticle M in the + X direction, it is necessary to return (rewind) the reticle M to its initial position in the -X direction. Therefore, when the second reel member 1022 is continuously rotated at a constant speed and the substrate P is continuously transferred at a constant speed, during the rewinding operation of the photomask M, the pattern exposure is not performed on the substrate P, but the substrate P will be exposed on the substrate P. The pattern for the panel is dispersed (separated) in the conveying direction. However, in practice, since the speed of the substrate P (here, the peripheral speed) and the speed of the photomask M during scanning exposure are assumed to be 50 to 100 mm / s, it is only necessary to roll the photomask back when the photomask M is rolled back. When the stage 1078 is driven at a maximum speed of, for example, 500 mm / s, it is possible to reduce the gap between the patterns for the panel formed on the substrate P in the substrate conveyance direction.

    [Fifth Embodiment]    

Next, a fifth embodiment will be described. In FIG. 12, the same constituent elements as those in the above-mentioned embodiments may be assigned the same reference numerals as those in the above-mentioned embodiments, and descriptions thereof may be simplified or omitted.

The mask M in FIG. 12 uses the same cylindrical mask M as in the previous FIG. 2, FIG. 7, and FIG. 8, but has a structure in which the illumination light has a high reflection portion and a low reflection (light absorption) portion. Patterned reflective mask. Therefore, it is not possible to use the transmissive lighting device 1013 (illumination optical system IL) as in the previous embodiments, and it is necessary to have the oblique lighting system that projects the illumination light from the projection modules PL1001 to PL1006 to the reflective mask M. Make up.

In FIG. 12, a polarizing beam splitter PBS and a quarter-wavelength plate PK are provided between the first reflecting surface p1004 of the first deflecting member 1050 constituting the first optical system 1041 and the reflective mask M. In the structure of each projection module shown in FIG. 6 previously, although a focus correction optical member 1044 and an image shift correction optical member 1045 are provided at this position, in this embodiment, the focus correction optical member 1044 and the image shift correction The optical member 1045 is moved to a space in front of or behind the intermediate image plane p1007 (field diaphragm 1043).

The wavefront splitting surface of the polarizing beam splitter PBS is arranged at an angle θ 1001 (<45 °) of the first reflecting surface p1004 of the first deflection member 1050 with respect to the optical axis AX1003 (plane p6), and is inclined at an angle α / to the central plane p1003. 2 (θd), and the main ray EL3 which travels in the radial direction (normal direction) from the illumination area IR1001 on the reflective mask M is about 45 °.

The illumination beam EL1 is, for example, emitted from a laser light source having a good polarization characteristic, and passes through a beam-shaping optical system or an illumination uniformity optical system (such as a fly-eye lens or a rod-shaped element) to be linearly polarized (S-polarized) and enters the polarizing beam splitter PBS. Most of the illumination beam EL1 is reflected on the wavefront division surface of the polarizing beam splitter PBS. The illumination beam EL1 is converted into circularly polarized light by the 1/4 wavelength plate PK, and the illumination area IR1001 on the reflective mask M is irradiated into a trapezoid or a rectangle. .

The light (imaging beam) reflected on the pattern surface (the first surface p1001) of the reticle M is converted into linear polarized light (P polarized light) again by the 1/4 wavelength plate PK, and most of it passes through the wavefront of the polarizing beam splitter PBS. The split surface is directed toward the first reflecting surface p1004 of the first deflecting member 1050. The structure of the first reflecting surface p1004 or later, or the optical path of the imaging beam (main light EL3) is the same as that described in FIG. 6 above, and the pattern formed by the reflecting portion appearing in the illumination area IR1001 on the reflective mask M The image is projected in the projection area PA1001.

As described above, in this embodiment, a polarizing beam splitter PBS and a quarter-wave plate PK are added to the first optical system 1041 of the projection module PL1001 (and PL1002 to PL1006), even if it is a reflective cylinder. It can also realize the oblique lighting system simply. In addition, the illumination light beam EL1 is configured to enter the polarizing beam splitter PBS from a direction in which the main light beam EL3 of the imaging light beam reflected on the reflection type mask M crosses, and is directed toward the reflection type mask M. Therefore, even in the case where the extinction ratio (separation characteristic) of the P polarized light and the S polarized light of the small polarizing beam splitter PBS is somewhat, it can be avoided that stray light causes a part of the illumination beam EL1 from the wavefront of the polarizing beam splitter PBS. The split surface directly strikes the first reflecting surface p1004 of the first deflection member 1050 and the projection area PA1001 of the substrate P, which can well maintain the quality (contrast, etc.) of the image projected on the substrate P, and faithfully turn the mask pattern. Seal.

    [Sixth Embodiment]    

FIG. 13 is a diagram showing a configuration of a projection optical system PL (a first projection module PL1001) according to a sixth embodiment. The first projection module PL1001 includes a third deflection member (planar mirror) 1120, a first lens group (equal magnification projection) 1051, a first concave mirror 1052 arranged on a pupil surface, a fourth deflection member (planar mirror) 1121, and fifth optics. System (magnification projection system) 1122. The first surface p1001 in which the illumination area IR (the first illumination area IR1001) is arranged is a pattern surface of the mask M (transmission type or reflection type) held on the first roll member 1021 in a cylindrical shape, and is a cylindrical surface. . The second surface p1002 on the substrate P on which the projection area PA (the first projection area PA1001) is arranged is a plane here.

In addition, when the mask M held by the first reel member 1021 (mask support member) is a reflective type as shown in FIG. 12 previously, a polarizing beam is provided between the mask M and the third deflection member 1120. Beam filter and 1/4 wavelength plate.

In FIG. 13, the imaging beam EL2 emitted from the first illumination area IR1001 is reflected by the fifth reflection surface p1017 of the third deflection member 1120 and enters the first lens group 1051. The imaging light beam EL2 that has entered the first lens group 1051 is reflected by the first concave mirror 1052 and is returned to be emitted from the first lens group 1051 and enters the sixth reflection surface p1018 of the fourth deflection member 1121. The first lens group 1051 and the first concave mirror 1052 form the intermediate image of the pattern of the mask M appearing in the first illumination area IR1001 at the same magnification as in the above embodiment.

The imaging light beam EL2 reflected on the sixth reflection surface p1018 enters the fifth optical system 1122 through the formation position of the intermediate image, and reaches the first projection area PA1001 through the fifth optical system 1122. The fifth optical system 1122 is an image of the intermediate image formed by the first lens group 1051 and the first concave mirror 1052 on the first projection area PA1001 at a predetermined magnification (for example, 2 times or more).

In FIG. 13, the fifth reflecting surface p1017 of the third deflecting member 1120 corresponds to the first reflecting surface p1004 of the first deflecting member 1050 described in FIG. 6, and the sixth reflecting surface p1018 of the fourth deflecting member 1121 corresponds to FIG. 6 illustrates the second reflecting surface p1005 of the first deflecting member 1050.

In the projection optical system shown in FIG. 13, the extension line of the main ray EL3 between the third deflection member 1120 and the mask M (the first surface p1001 in a cylindrical shape) is set to pass through the rotation center line AX1001 of the mask M The principal ray EL3 of the imaging beam EL2 between the fifth optical system 1122 having an optical axis AX1008 perpendicular to the surface (second surface p1002) of the substrate P supported by the plane and the projection area PA1001 on the substrate P is set to be equal to the first The two-sided p1002 is vertical, that is, it satisfies the telecentric imaging conditions. In order to maintain such conditions, the projection optical system of FIG. 13 is provided with an adjustment mechanism that rotates the third deflection member 1120 or the fourth deflection member 1121 slightly in the XZ plane in FIG. 13.

In addition, the third deflecting member 1120 or the fourth deflecting member 1121 can be slightly rotated in the YZ plane in FIG. 13, and can also be configured to move slightly in the X-axis direction or the Z-axis direction and be parallel to the Z-axis. The axis rotates slightly. In this case, the image projected into the projection area PA1001 can be slightly shifted in the X direction or rotated in the XY plane.

In addition, although the entire projection module PL1001 is an enlarged projection optical system, the entire projection module PL1001 may be an equal magnification projection optical system or a reduced projection optical system. In this case, since the first optical system composed of the first lens group 1051 and the first concave mirror 1052 is an equal magnification system, the projection magnification of the fifth optical system 1122 in the subsequent stage may be changed to equal magnification or reduction.

    [Modification of the sixth embodiment]    

FIG. 14 is a view showing the configuration of a modification of the projection optical system using the sixth embodiment when viewed from the Y-axis direction, and FIG. 15 is a view showing the configuration of FIG. 14 when viewed from the X-axis direction. The projection optical system shown in FIG. 14 and FIG. 15 shows that the magnified projection optical system of FIG. 13 is arranged in the Y-axis direction, that is, in the axial direction of the rotation center line AX1001 of the cylindrical surface mask M, and becomes plural. Variations of the situation.

As shown in FIG. 15, the projection optical system PL of this modification includes a first projection module PL1001 and a second projection module PL1002. The second projection module PL1002 has the same structure as the first projection module PL1001. As shown in FIG. 14, although it is arranged symmetrically to the first projection module PL1001 with respect to the center plane p1003, it is in the Y-axis direction in FIG. 14. They are separated from each other as shown in FIG. 15.

As shown in FIG. 14, the first projection module PL1001 includes a third deflection member 1120A, a first lens group 1051A, a first concave mirror 1052A, and a fourth deflection member 1121A that receive an imaging beam from an illumination area IR1001 on the mask M. And a fifth optical system (magnification imaging system) 1122A.

The projection module PL1001 shown in FIG. 14 and FIG. 15 changes the inclination direction of the main ray between the mask M and the third deflection member 1120A compared with the previous projection optical systems (FIG. 6 or FIG. 13). That is, the reflection surface p1004 of the first deflection member 1050 in FIG. 6 or the reflection surface p1004 of the third deflection member 1120 in FIG. 13 causes the main light EL3 from the illumination area IR1001 of the mask M to be deflected at an obtuse angle (90 ° or more). It is parallel to the optical axis AX1003 of the first optical system composed of the first lens group 1051 (1051A) and the first concave mirror 1052 (1052A). In contrast, in the configuration of FIG. Full) The main ray EL3 from the illumination area IR1001 is parallel to the optical axis of the first optical system.

As shown in FIG. 14, the second projection module PL1002 includes a third deflection member 1120B, a first lens group 1051B, a first concave mirror 1052B, and a fourth deflection, which receive the imaging beam from the illumination area IR1002 on the mask M. The member 1121B and the fifth optical system (magnification imaging system) 1122B.

The projection modules PL1001 and PL1002 shown in FIG. 14 and FIG. 15 are magnified projection optical systems as a whole. As shown in FIG. 15, the first mask on the first illumination area IR1001 (the first reel member 1021) is arranged. The area A1001 and the second area A1002 on the mask M (the first reel member 1021) in which the second illumination area IR1002 is arranged are separated from each other in the Y direction. However, by appropriately determining the magnifications of the projection modules PL1001 and PL1002, the first area A1001 and the third area A1005 (image area) of the projection area PA1001 projected on the substrate P and the projection area PA1001 and the projected area on the substrate P are projected. The second area A1002 and the fourth area A1006 (image area) of the projection area PA1002 are set in a relationship in which they partially overlap in the Y direction when viewed in the YZ plane. Thereby, the first area A1001 and the second area A1002 on the photomask M (the first reel member 1021) are formed by being connected to the Y direction on the substrate P, and a pattern for exposing a large panel can be projected.

As described above, the substrate processing apparatus provided with the projection optical system PL shown in FIG. 14 and FIG. 15 is arranged symmetrically with respect to the center plane p1003 of the projection optical system shown in FIG. 13 previously, and is arranged in a plural number with respect to the Y-axis direction. Compared with each case, the width dimension in the X direction of the entire projection optical system can be made smaller, and the size in the X direction can also be made smaller as a processing device.

In addition, as described in FIG. 9 previously, in FIG. 14 viewed in the XZ plane, the circumference between the center points of the illumination area IR1001 and the illumination area IR1002 on the reticle M (the first reel member 1021) is specified. The distance DFx between the long DMx and each center point of the corresponding projection areas PA1001 and PA1002 on the substrate P is set to the relationship of DFx = Mp‧DMx when the magnification of the projection optical system is set to Mp.

    [Seventh embodiment]    

FIG. 16 is a diagram showing a configuration of a projection optical system according to a seventh embodiment. The imaging beam EL2 from the first illumination area IR1001 formed on the cylindrical first surface p1001 (mask pattern surface) enters the sixth optical system 1131, and passes through the sixth optical system 1131 to the seventh deflection member (planar mirror). The imaging beam EL2 reflected by the ninth reflecting surface p1022 of 1132 reaches the middle image plane p1007 where the first field diaphragm 1043 is arranged, and the middle image plane p1007 forms an image of the pattern of the mask M.

The imaging beam EL2 passing through the intermediate image plane p1007 is reflected by the tenth reflecting surface p1023 of the eighth deflection member (planar mirror) 1133, and reaches the first through the seventh optical system 1134 on the substrate P supported along the cylindrical second surface p1002 1 Projection area PA1001. The first projection module PL1001 in FIG. 16 is an image of the pattern of the mask M in the first illumination area IR1001 as an erect image and is projected on the first projection area PA1001.

In FIG. 16, the sixth optical system 1131 is an imaging optical system of equal magnification, and its optical axis AX1010 is substantially coaxial with the main ray of the imaging beam EL2 passing through the center of the first illumination area IR1001. In other words, the optical axis AX1010 is substantially parallel to the first radial direction D1001 shown in FIG. 4 or FIGS. 7 to 9.

The seventh optical system 1134 is an imaging optical system of the same magnification, and the intermediate image formed by the sixth optical system 1131 is imaged on the first projection area PA1001. The optical axis AX1011 of the seventh optical system 1134 is substantially parallel to the first normal direction (radial direction) D1003 of the cylindrical second surface p1002 passing through the center of the first projection area PA1001.

In this embodiment, the two deflection members 1132 and 1133 are arranged symmetrically on the XZ plane in FIG. 16 with the intermediate image plane p1007 interposed therebetween. For the sake of simplicity, it is also considered that an intermediate image plane is formed at a position where the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 intersect, and a reflective surface parallel to the YZ plane is arranged at the position of the intermediate image plane. A plane mirror, and the light path is bent. However, when it can be processed by a flat mirror, in the XZ plane of FIG. 16, the angle formed by the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 is larger than 90 °. The angle formed by a piece of flat mirror and each optical axis AX1010, AX1011 becomes an acute angle of less than 45 °, and the imaging characteristics are not very good. For example, if the angle formed by the optical axes AX1010 and AX1011 becomes about 140 °, the angle formed by the reflection surface of a flat mirror and each optical axis AX1010 and AX1011 becomes 20 °. Therefore, if two light deflecting members (planar mirrors) 1132, 1133 are used to bend the optical path as shown in FIG. 16, such a problem can be alleviated.

In addition, in the configuration of FIG. 16, the sixth optical system 1131 may be used as the imaging lens with magnification Mf, the seventh optical system 1134 may be used as the imaging lens with reduced magnification 1 / Mf, and the entire projection system may be equal. Conversely, the sixth optical system 1131 may be used as an imaging lens with a reduction ratio of 1 / Mf, and the seventh optical system 1134 may be used as an imaging lens with a magnification of Mf.

    [Eighth Embodiment]    

FIG. 17 is a diagram showing a configuration of a projection optical system PL (first projection module PL1001) according to an eighth embodiment. Although the basic optical system has the same structure as that shown in FIG. 16 above, the difference is that two deflection members (planar mirrors) 1140 and 1143 are further added.

In FIG. 17, the eighth optical system 1135 corresponding to the imaging optical system 1131 in FIG. 16 is composed of a third lens 1139 and a fourth lens 1141, and the optical axis is set to be the same as the first surface along the cylindrical surface. The main rays of the imaging beam EL2 emitted from the center of the first illumination area IR1001 on the supported mask M of p1001 toward the normal direction are substantially parallel. A pupil surface of the eighth optical system 1135 is formed between the third lens 1139 and the fourth lens 1141, and an eleventh deflection member (planar mirror) 1140 is provided at this position.

The imaging beam EL2 emitted from the first illumination area IR1001 and passed through the third lens 1139 is bent at a angle of 90 ° or close to the thirteenth reflection surface p1026 of the eleventh deflection member 1140, and enters the fourth lens 1141. Corresponding to the ninth deflecting member (planar mirror) 1136 of the ninth deflecting member 1132 in FIG. 16, the eleventh reflecting surface p1024 reflects and reaches the field diaphragm 1043 disposed on the middle image plane p1007. Thereby, the eighth optical system 1135 forms the image of the pattern of the mask M appearing in the first illumination area IR1001 at the position of the intermediate image plane p1007.

In addition, the eighth optical system 1135 is an imaging optical system of equal magnification, and the intermediate image plane p1007 is configured to be orthogonal to the central plane p1003. The optical axis of the third lens 1139 is substantially coaxial or parallel to the main light beam of the imaging beam EL2 emitted from the center of the first illumination area IR1001 toward the normal direction (radial direction of the cylindrical first surface p1001).

The ninth optical system 1138 of FIG. 17 has the same configuration as the eighth optical system 1135, and is arranged so as to be symmetrical to the eighth optical system 1135 with respect to the intermediate image plane p1007 including the first field diaphragm 1043 and substantially orthogonal to the center plane p1003. . The optical axis of the eighth optical system 1135 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the center plane p1003. The imaging light beam EL2 passing through the field diaphragm 1043 through the eighth optical system 1135 and the ninth deflection member 1136 is reflected on the twelfth reflection surface p1025 of the tenth deflection member (planar mirror) 1137, and passes through the first nineth optical system 1138. The five lenses 1142, the twelfth deflecting member 1143 and the sixth lens 1144 arranged at the pupil position reach the first projection area PA1001 on the substrate P supported along the cylindrical second surface p1002. In the configuration of FIG. 17, the optical axis of the sixth lens 1144 is set to be substantially coaxial with the main ray of the imaging beam EL2 that travels in a normal direction (a cylindrical second surface p1002 radius direction) with respect to the first projection area PA1001. Or parallel.

    [Ninth Embodiment]    

FIG. 18 is a diagram showing a configuration of a projection optical system PL (first projection module PL1001) according to a ninth embodiment. The first projection module PL1001 of FIG. 18 is a so-called linear-type retroreflective projection optical system. The first projection module PL1001 includes a tenth optical system 1145 composed of two pieces of a fourth concave mirror 1146 and a fifth concave mirror 1147, a first field diaphragm 1043 (middle image plane p1007), and as shown in Figs. 13 and 14 The fifth optical system 1122 is shown.

The tenth optical system 1145 forms an intermediate image of a pattern appearing in the first illumination area IR1001 on the mask M supported along the cylindrical first surface p1001 at the position of the field diaphragm 1043. In this embodiment, the tenth optical system 1145 is an equal magnification optical system. Each of the fourth concave mirror 1146 and the fifth concave mirror 1147 is configured as a part of a rotating ellipse, for example. This rotating elliptical surface is a surface formed by rotating an ellipse about the long axis (X-axis direction) or the short axis (Z-axis direction) of the ellipse.

In the structure of FIG. 18, the main light ray of the imaging beam EL2 emitted from the center of the first illumination area IR1001 toward the normal direction (radial direction) of the cylindrical first surface p1001 is set to be directed toward the XZ plane when viewed. The rotation center axis AX1001 of the first surface p1001 (the first reel member 1021). That is, the principal rays of the imaging beam EL2 from the mask M (the first surface p1001) to the fourth concave mirror 1146 of the projection module PL1001 are inclined in the XZ plane with respect to the center plane p1003.

The fifth optical system 1122 is, for example, the refracting magnifying projection optical system described in FIG. 13, and the intermediate image formed at the position of the field stop 1043 by the tenth optical system 1145 is projected on the second plane along the plane. The first projection area PA1001 on the substrate P supported by p1002.

The fourth concave mirror 1146 and the fifth concave mirror 1147 of the tenth optical system 1145 deviate the imaging beam EL2 so that the imaging beam EL2 emitted from the first illumination area IR1001 in the normal direction enters the normal direction through the fifth optical system 1122. The first projection area PA1001. The substrate processing apparatus provided with such a projection optical system PL can perform the faithful projection exposure similarly to the substrate processing apparatus 1011 described in the above embodiment, while suppressing the occurrence of poor exposure. In addition, the fifth optical system 1122 may be an equal magnification projection optical system, or may be a reduced optical system.

    [Tenth embodiment]    

FIG. 19 is a diagram showing a configuration of a projection optical system PL (first projection module PL1001) according to a tenth embodiment. The first projection module PL1001 in FIG. 19 is a refractive optical system that does not include a reflective member having power. The first projection module PL1001 includes an eleventh optical system 1150, a thirteenth deflection member 1151, a first field diaphragm 1043, a fourteenth deflection member 1152, and a twelfth optical system 1153.

In this embodiment, the imaging beam EL2 emitted from the first illumination area IR1001 on the mask M held along the cylindrical first surface p1001 passes through the eleventh optical system 1150 and is formed by the thirteenth wedge-shaped frame. The deflection member 1151 is deflected in the XZ plane to reach the first field diaphragm 1043 arranged on the intermediate image plane p1007, and an intermediate image of a mask pattern is formed here. Further, the imaging beam EL2 passing through the first field diaphragm 1043 is deflected by a 14th deflection member 1152 formed by a wedge-shaped ridge in the XZ plane, and enters the 12th optical system 1153. The 12th optical system 1153 reaches the circle. The first projection area PA1001 on the substrate P on which the second surface p1002 of the cylindrical shape is supported.

The optical axis of the eleventh optical system 1150 is, for example, substantially coaxial or parallel to the main ray of the imaging beam EL2 emitted from the center of the first illumination area IR1001 in a normal direction (radial direction of the cylindrical surface of the first surface p1001). The twelfth optical system 1153 has the same configuration as the eleventh optical system 1150, and is arranged symmetrically to the eleventh optical system 1150 with respect to the intermediate image plane p1007 (orthogonal to the center plane p1003) of the first field diaphragm 1043. The optical axis of the twelfth optical system 1153 is set to be substantially parallel to the main ray of the imaging beam EL2 that enters the first projection area PA1001 along the normal of the planar second surface p1002.

The 13th deflection member 1151 has a ninth surface p1028 that is incident through the imaging beam EL2 of the eleventh optical system 1150 and a tenth surface p1029 that emits the imaging beam that is incident from the ninth surface p1028, and is disposed on the first field diaphragm 1043. (Middle image plane p1007) immediately before or immediately before. In this embodiment, each of the ninth surface p1028 and the tenth surface p1029 constituting a predetermined apex angle is formed by a plane inclined to a plane (XY plane) orthogonal to the central plane p1003 and extending in the Y-axis direction.

The 14th deflection member 1152 is the same member as the 13th deflection member 1151, and is arranged symmetrically to the 13th deflection member 1151 with respect to the middle image plane p1007 where the first field diaphragm 1043 is located. The 14th deflection member 1152 has an 11th surface p1030 to which the imaging beam EL2 passing through the first field diaphragm 1043 and a 12th surface p1031 to emit the imaging beam EL2 which enters from the 11th surface p1030 are arranged in the first field Diaphragm 1043 (middle image plane p1007) is immediately behind or immediately behind.

In this embodiment, the 13th deflection member 1151 and the 14th deflection member 1152 are deflected so that the imaging beam EL2 emitted from the first illumination area IR1001 in the normal direction enters the first projection area PA1001 from the normal direction. The substrate processing apparatus provided with such a projection optical system PL can perform the faithful projection exposure similarly to the substrate processing apparatus 1011 described in the above embodiment, while suppressing the occurrence of poor exposure.

In addition, although the eleventh optical system 1150 or the twelfth optical system 1153 may be an equal-numbered projection optical system or a reduced optical system, either one of the mask M or the substrate P is along a cylindrical surface ( (Or arc surface) in the state of projection exposure under the state of support, between the two projection modules separated in the circumferential direction of the cylindrical surface, the visual field interval (perimeter distance) on the object plane side and the final image plane side The ratio of the interval (perimeter distance) of the projection field of view can also be set to match the projection magnification.

    [Eleventh Embodiment]    

FIG. 20 is a diagram showing a part of a component manufacturing system (flexible display manufacturing line) according to the eleventh embodiment. Here, it is shown that the flexible substrate P (sheet, film, etc.) pulled out from the supply roller FR1 passes through n processing devices U1, U2, U3, U4, U5, ... Un in order and is rolled up for recycling. Example of roller FR2. The higher-level control device 2005 controls the processing devices U1 to Un constituting the manufacturing line as a whole.

In FIG. 20, the orthogonal coordinate system XYZ is set such that the surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (length direction) of the substrate P is set to the Y direction. In addition, the substrate P may be one in which the surface is modified and activated by a predetermined pretreatment in advance, or a fine partition wall structure (concavo-convex structure) for precise patterning is formed on the surface.

The substrate P wound on the supply roller FR1 is conveyed to the processing device U1 by being pulled out by the driven driving roller DR1. The center of the substrate P in the Y direction (width direction) is servo-controlled by the edge position controller EPC1. The relative target position is in the range of ± tens of μm to tens of μm.

The processing device U1 is a method in which a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curing resin liquid, etc.) is continuously or selectively applied to the surface of the substrate P in a printing manner on the conveying direction (lengthwise direction) of the substrate P. Of coating device. In the processing device U1, a coating mechanism Gp1 including a coating roller DR2 on which the substrate P is wound is provided, and a coating roller such as a coating roller for uniformly coating a photosensitive functional liquid on the surface of the substrate P is provided on the pressing roller DR2. A drying mechanism Gp2 for quickly removing the solvent or water contained in the photosensitive functional liquid applied to the substrate P.

The processing device U2 is a heating device for heating the substrate P transferred from the processing device U1 to a predetermined temperature (for example, about 10 to 120 ° C.) and stabilizing the photosensitive functional layer applied on the surface. In the processing device U2, a plurality of rollers and air rotating rods for folding and transferring the substrate P, a heating chamber section HA1 for heating the loaded substrate P, and a temperature for lowering the temperature of the heated substrate P to and after are provided. In the step (processing device U3), the cooling chamber portion HA2 with the same ambient temperature is held, and the driven roller DR3 is held.

The processing device U3 as the substrate processing device is an exposure device that irradiates the photosensitive functional layer of the substrate P transferred from the processing device U2 with patterned light corresponding to ultraviolet rays corresponding to a circuit pattern or a wiring pattern for a display. In the processing device U3, an edge position controller EPC that controls the center of the Y direction (width direction) of the substrate P at a certain position, a driven roller DR4 being held, the substrate P is wound locally with a predetermined tension, and the substrate is provided. The pattern exposure part on P supports a rotating roll DR5 having a uniform cylindrical surface shape, and two sets of driving rollers DR6, DR7, etc. for giving a predetermined slack (gap) DL to the substrate P.

Further, in the processing device U3, a cylindrical mask M is provided, and a part of the mask pattern of the cylindrical mask M is projected on a part of the substrate P supported in a cylindrical surface by the rotating drum DR5. The image projection optical system PL is an alignment microscope AM1 or AM2 that detects an alignment mark or the like formed in advance on the substrate P in order to relatively align (align) the image of a part of the projected mask pattern with the substrate P.

In this embodiment, since the cylindrical mask M is of a reflective type (the pattern on the outer peripheral surface is composed of a highly reflective portion and a non-reflective portion), a part of the optical element of the transmission optical system PL is also provided. The oblique illumination optical system of the cylindrical mask M is irradiated with the exposure illumination light. The configuration of the oblique illumination optical system will be described in detail later.

The processing device U4 is a dry processing device that performs wet development processing and electroless plating processing on the photosensitive functional layer of the substrate P transferred from the processing device U3. The processing device U4 is provided with three processing tanks BT1, BT2, and BT3 that are layered in the Z direction, a plurality of rollers that bend and transport the substrate P, and a driving roller DR8 that is clamped.

Although the processing device U5 is a heating and drying device that warms the substrate P transferred from the processing device U3 and adjusts the moisture content of the substrate P wetted in the wet process to a predetermined value, the detailed structure is omitted. After that, the substrate P after passing through the final processing apparatus Un of the series of processes through several processing apparatuses is wound to the recovery roller FR2 through the clamped driving roller DR1. During this winding, the edge position controller EPC2 is also used to successively correct and control the relative position of the driving roller DR1 and the recovery roller FR2 in the Y direction so that the center of the Y direction (width direction) of the substrate P or the substrate end in the Y direction is in the Y direction. Not uneven.

The substrate P used in this embodiment can be the same as that exemplified in the first embodiment, and the description is omitted here.

The component manufacturing system 2001 of this embodiment repeatedly executes various processes for manufacturing one component on the substrate P. The substrate P to which various processes are applied is divided (cut) according to each element, and becomes a plurality of elements. The size of the substrate P, for example, is about 10 cm to 2 m in the width direction (the Y direction as the short side), and 10 m or more in the length direction (the X direction as the long side).

Next, although the configuration of the processing device U3 (exposure device) of this embodiment will be described, before this, the basic configuration of the exposure device of this embodiment will be described with reference to FIGS. 21 to 23.

The exposure apparatus U3 shown in FIG. 21 is a so-called scanning exposure apparatus, which includes a reflective cylindrical mask M having a circumferential surface having a radius r2001 from the rotation center axis AX2001 and a circumferential surface having a radius r2002 from the rotation center axis AX2002. The reel 2030 (DR5 in Figure 1). Next, by rotating the cylindrical mask M and the rotating reel 2030 at a predetermined rotation speed ratio, the image of the pattern formed on the outer periphery of the cylindrical mask M is continuously projected and exposed to the roll. A surface (a surface curved along a cylindrical surface) of the substrate P around a part of the outer peripheral surface of the rotary reel 2030.

The exposure device U3 is provided with a conveying mechanism 2009, a mask holding device 2012, an illumination optical system IL, a projection optical system PL, and a control device 2013. The control device 2013 controls and holds the cylindrical shape of the mask holding device 2012. Rotary drive of the photomask M or micro-movement in the direction of the rotation central axis AX2001, or rotary drive 2030 or a micro-movement in the rotation of the central axis AX2002 constituting part of the transport mechanism 2009 that transports the substrate P in the longitudinal direction.

The mask holding device 2012 includes drive transmission mechanisms 2021 and 2022 such as rollers, gears, and belts. The rotation reel 2020, which is provided with a reflective mask M (mask pattern) on the outer peripheral surface, imparts rotation around a rotation center axis AX2001. The driving force may cause the rotary reel 2020 to move slightly in the direction of the rotation center axis AX2001 parallel to the Y axis; and the first driving unit 2024 includes a rotating motor and a micro-movement to provide the necessary driving force to these drive transmission mechanisms 2021 and 2022. Used for linear motors or piezoelectric elements. The rotation angle position of the rotating reel 2020 (mask M) or the position in the direction of the rotation center axis AX2001 is measured by a first detector 2023 including a rotary encoder, a laser interferometer, and a gap sensor. The measurement information is sent to the control device 2013 in real time and used for the control of the first driving unit 2024.

Similarly, the rotary reel 2030 is provided with a rotational driving force or a rotation around a rotation center axis AX2002 parallel to the Y axis by a second driving unit 2032 including a rotary motor, a linear motor for micro-motion, or a piezoelectric element. Micro-power in the direction of the central axis AX2002. The rotational angle position of the rotary reel 2030 or the position in the direction of the rotation center axis AX2002 is measured by a second detector 2031 including a rotary encoder, a laser interferometer, a gap sensor, and the like. The measurement information is sent in real time. The control device 2013 is used for control of the second driving unit 2032.

Here, in this embodiment, the rotation center axis AX2001 of the cylindrical mask M and the rotation center axis AX2002 of the rotation reel 2030 are parallel to each other and are located in a center plane pc parallel to the YZ plane.

Next, an illumination area IR for exposure illumination light is set on a portion of the cylindrical pattern surface p2001 on which the cylindrical mask M is formed and intersects the central surface pc. A portion on the cylindrical substrate P intersecting the center plane pc is set to a projection area PA for projecting an image of a part of the mask pattern appearing in the illumination area IR.

In this embodiment, the projection optical system PL emits an illumination beam EL1 toward the illumination region IR on the cylindrical mask M, and reflects the diffracted beam (imaging beam) with a mask pattern incident on the illumination region IR. EL2, a mode in which a pattern image is formed on the projection area PA on the substrate P, and the illumination optical system IL is constituted by a tilting method of a part of the optical path of the common projection optical system PL.

As shown in FIG. 21, the projection optical system PL includes a chirped mirror 2041 that is inclined at 45 ° with respect to the center plane pc in the XZ plane and has reflection planes 2041a and 2041b that are orthogonal to each other, and a mirror that is orthogonal to the center plane pc. The optical axis 2015a is a second optical system 2015 that is configured by a concave mirror 2040 and a plurality of lenses arranged on the pupil plane pd.

Here, if a plane including the optical axis 2015a and parallel to the XY plane is set to p2005, the angle θ 2001 of the reflection plane 2041a based on the plane p2005 is + 45 °, and the reflection plane 2041b based on the plane p2005 The angle θ 2002 is -45 °.

The projection optical system PL is configured, for example, as a refracting projection optical system (a deformation type of the Dyson optical system) of a half-image field type that divides a circular image field of view by reflection planes 2041a and 2041b above and below the chirped mirror 2041. Telecentric. Therefore, the imaging beam EL2 reflected and refracted by the pattern in the illumination area IR is reflected by the reflection plane 2041a on the upper side of the chirped mirror 2041, and reaches a concave mirror 2040 (also a plane mirror) arranged on the pupil plane pd through a plurality of lenses. . Next, the imaging beam EL2 reflected by the concave mirror 2040 reaches the reflection plane 2041b of the chirped mirror 2041 through the optical path symmetrical to the plane p2005, and is reflected there to reach the projection area PA on the substrate P, and the image of the mask pattern It is imaged on the substrate P at equal magnification (× 1).

In order to apply the oblique illumination method to this projection optical system PL, in this embodiment, a passing portion (window) is formed on a part of the reflecting surface p2004 of the concave mirror 2040 arranged on the pupil surface pd, and the passing portion passes from the surface p2003. (Glass surface) The illumination beam EL1 is made incident.

In FIG. 21, only the part of the first optical system 2014 disposed behind the concave mirror 2040 in the illumination optical system IL of this embodiment is shown, and only the illumination light from a light source, a fly-eye lens, an illumination field stop, etc., which will be described later, is generated in The illumination beam EL1 of a plurality of point light source images of the pupil plane pd and one point light source image Sf.

The point light source image Sf is set to be optically conjugated to, for example, a point light source image (light emitting point of a light source) formed by each of the plurality of lens elements constituting the fly-eye lens. The illumination region IR is illuminated by the illumination optical beam EL1 passing through the second optical system 2015 of the projection optical system PL and the reflection plane 2041a on the upper side of the chirped mirror 2041 by a uniform illumination distribution using the Keira illumination method.

In addition, in FIG. 21, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL, and the illumination area IR on the cylindrical mask M is set in a circle. The cylindrical pattern surface p2001 has a narrow width in the circumferential direction and a long slit shape in the direction of the rotation center axis AX2001.

For example, when the radius r2001 of the pattern surface p2001 of the cylindrical mask M is set to 200 mm, and the thickness tf of the substrate P is set to 0.2 mm, the conditions for projection exposure can be set to the outer peripheral surface of the rotating reel 2030. The radius r2002 is r2002 = r2001-tf (199.8mm).

Also, the narrower the circumferential width (the width of the scanning exposure direction) of the illumination area IR (or the projection area PA), the more faithfully the exposure can be projected to a fine pattern, but it is necessary to increase the Illuminance per unit area. To set the width of the illumination area IR (or projection area PA), you can consider the radius r2001, r2002 of the cylindrical mask M or the rotating reel 2030, the fineness of the pattern to be transferred (line width Etc.) and the depth of focus of the projection optics PL and so on.

Next, in FIG. 21, when the position on the reflecting surface p2004 of the concave mirror 2040 through which the optical axis 2015a passes is taken as the center point 2044, the point light source image Sf is formed from the center point 2044 on the paper surface (XZ plane) to- The position shifted in the Z direction. Therefore, the normal reflected light (zero-order diffraction light) in the imaging beam EL2 (including the diffracted light) reflected by the illumination area IR on the cylindrical mask M is converged to the opposite reflective surface. The center point 2044 on p2004 is a point-symmetrical position to form a point light source image Sf ′. Therefore, as long as the area including the portion where the point light source image Sf ′ on the reflecting surface p2004 is located and the portion around which the 1st-order diffraction light is distributed is set as the reflection portion, the imaging beam EL2 from the illumination area IR is roughly The projection plane PA is transmitted through the plurality of lenses of the second optical system 2015 and the reflection plane 2041b of the chirped mirror 2041 without loss.

The concave mirror 2040 is a reflective surface p2004 formed by vapor-depositing a metallic reflective film such as aluminum on the concave surface of a concave lens made of a transmissive optical glass material (quartz or the like). Generally, the light transmittance of the reflective film is extremely small. Therefore, in this embodiment, in order to make the illumination light beam EL1 enter from the surface p2003 on the back side of the reflection surface p2004, a part of the reflection film constituting the reflection surface p2004 is removed by etching or the like, so that the converged illumination light beam EL1 can pass through (transmittance) Through) window.

FIG. 22 is a view of the reflecting surface p2004 of such a concave mirror 2040 as viewed from the X direction. In FIG. 22, for the sake of simplicity, the reflection surface p2004 is shifted by a certain amount from the plane p2005 (parallel to the XY plane) including the optical axis 2015a to the -Z direction, and three windows 2042a are provided separately in the Y direction. , 2042b, 2042c. The window portions 2042a, 2042b, and 2042c are made by selectively removing the reflection film constituting the reflection surface p2004 by selective etching. Although the point light sources Sfa, Sfb, and Sfc (illumination beams EL1a, EL1b are not shielded) EL1c) small rectangular shape, but can also be other shapes (round, oval, polygon, etc.). The three point light sources like Sfa, Sfb, and Sfc are created by, for example, three lens elements arranged in the Y direction among a plurality of lens elements of a fly-eye lens provided in the illumination optical system IL.

When viewed in the reflecting surface p2004, the positional relationship between the windows 2042a, 2042b, and 2042c is set to be non-point-symmetric, that is, non-point-symmetric, relative to the center point 2044 (optical axis 2015a). Although only three window portions are shown here, in the case of making more window portions, the window portions are also set to have a non-point symmetrical positional relationship with respect to the center point 2044.

In addition, the illumination beam EL1a from the point light source image Sfa generated in the window portion 2042a becomes a substantially parallel beam and irradiates the illumination region IR of the cylindrical mask M, and the imaging beam EL2a reflecting the diffracted light is in the concave mirror 2040. The reflection surface p2004 converges into a point light source image Sfa ′ at a position where the relative center point 2044 and the window portion 2042a are point symmetrical.

Similarly, although the illumination light beams EL1b and EL1c from the point light sources Sfb and Sfc generated in the window portions 2042b and 2042c also become substantially parallel beams and illuminate the illumination area IR of the cylindrical mask M, the reflection The imaging light beams EL2b and EL2c of the light converge on the reflecting surface p2004 of the concave mirror 2040 at point-symmetrical positions of each of the relative center point 2044 and the windows 2042b and 2042c into point light sources like Sfb ', Sfc'.

As shown in FIG. 22, the imaging light beams EL2a, EL2b, and EL2c, which are point light sources like Sfa ', Sfb', and Sfc ', include zero-order diffracted light (specular reflection light) and ± 1-order diffracted light. The ± 1st-order diffracted light DLa, DLb, and DLc are spread and distributed in the Z-axis direction and the X-axis direction through 0-order diffracted light.

Furthermore, the point light source images Sfa ', Sfb', and Sfc '(especially zero-order diffracted light) formed on the reflective surface p2004 are cylindrical surfaces of the illumination area IR of the cylindrical mask M. Therefore, FIG. 22 The paper surface (YZ surface) is distributed so that the shape of the point light source images Sfa, Sfb, and Sfc is stretched in the Z direction (the circumferential direction of the cylindrical mask).

As shown in FIG. 22, when each point light source image Sfa, Sfb, Sfc is located on the lower side (-Z direction) than the plane p2005 including the center point 2044 (optical axis 2015a), the paper surface (XZ In-plane), the illumination beam EL1 (EL1a, EL1b, EL1c) passes through the second optical system 2015 and the reflection plane 2041a on the upper side of the chirped mirror 2041 to reach the cylindrical mask M. Although these illumination light beams EL1 (EL1a, EL1b, EL1c) are parallel light beams in front of and near the cylindrical mask M, they are slightly inclined with respect to the center plane pc. The amount of tilt corresponds to the amount of displacement in the Z direction of the point light source image Sf (Sfa, Sfb, Sfc) from the center point 2044 (optical axis 2015a) in the reflective surface p2004 (pupil plane pd).

The imaging beam EL2 (EL2a, EL2b, EL2c) that is reflected and refracted by IR in the illumination area reaches the upper side of the chirped mirror 2041 with an inclination symmetrical to the illumination beam EL1 (EL1a, EL1b, EL1c) relative to the center plane pc in the XZ plane. The reflection plane 2041a reflects here and enters the second optical system 2015, and reaches a portion above the plane p2005 (center point 2044) of the reflection surface p2004 of the concave mirror 2040.

In the example shown in FIG. 21 and FIG. 22 above, the point light source image (concentration point) Sf of the illumination beam EL1 is distributed on the optical axis 2015a including the projection optical system PL although it is within the reflective surface p2004 of the concave mirror 2040. The XY plane is parallel to the lower side of the plane p2005 (-Z direction), but as long as it is set to the conditions described previously, that is, the position relationship between the windows 2042 in the reflective surface p2004 of the point light source image of the illumination beam is relative to the center point 2044 is not a point-symmetric relationship (non-point-symmetric relationship), and the position of the point light source image Sf (window portion 2042) on the reflecting surface p2004 can be freely set.

If at least under such conditions, the window portion 2042 through which the plurality of point light sources Sf as the source of the illumination light beam EL1 pass is formed on the reflective surface p2004 of the concave mirror 2040, the reflective surface p2004 (pupil surface pd) can be used, The illumination beam is effectively spatially separated from the imaging beam.

In order to uniformly distribute the plurality of window portions 2042 (point light source images Sfa, Sfb, Sfc, etc.) of the illumination beam on the reflecting surface p2004, and to maintain a good separation between the illumination beam and the imaging beam, The size of each point light source image Sfa ', Sfb', Sfc '... formed by the convergence of the imaging beam EL2 on the reflective surface p2004 (including the size of the 1st-order diffracted light DLa, DLb, DLc) is set to The distance between the Y direction and the Z direction of the adjacent window portion 2042 may be smaller. In other words, the point light source images Sfa, Sfb, Sfc ... of the illumination beam EL1 are reduced as much as possible within the pupil plane pd (reflection plane p2004), so as to reduce the window portions 2042a, 2042b, 2042c ... as much as possible. This method is effective for each size.

In this embodiment, although a mercury discharge lamp, a halogen lamp, an ultraviolet LED, or the like can be used as a light source, in order to reduce the point light sources of the illumination beam EL1 such as Sfa, Sfb, Sfc, etc., high luminance and radiation vibration can be used. Laser light source with narrow wavelength band.

Here, an example of the configuration of the illumination optical system IL (first optical system 2014) shown in FIGS. 21 and 22 will be described with reference to FIG. 23. In addition, in FIG. 23, the same reference numerals are assigned to the same members as those described in FIGS. 21 and 22, and the description is omitted. In FIG. 23, the cymbal mirror 2041 in FIG. 21 is omitted, and the optical path and rotation between the illumination region IR on the cylindrical pattern M and the cylindrical pattern surface p2001 and the second optical system 2015 are rotated. The light path between the projection area PA on the outer peripheral surface of the roll 2030 (or the surface of the substrate P) p2002 and the second optical system 2015 is displayed.

As described above, the illumination optical system IL is provided with a fly-eye lens 2062 from which a light beam EL0 (illumination light beam EL0) from a light source is incident to generate a plurality of point light source images, so that each light beam from the plurality of point light source images is in the illumination field of view. A condenser lens 2065 superimposed on the blind 2064 and a lens system 2066 that guides the illumination light passing through the opening of the illumination field diaphragm 2064 to the concave mirror 2040 of the projection optical system PL (second optical system 2015). Since the Keira illumination method is applied, the surface Ep that generates a point light source image on the exit side of the fly-eye lens 2062 is set by the glass material (concave lens shape) constituting the condenser lens 2065, the lens system 2066, and the concave mirror 2040 to form the concave mirror 2040. The pupil plane on which the reflection plane is located is conjugated.

In the YZ plane, the center of the exit end of the fly-eye lens 2062 is arranged on the optical axis 2065a of the condenser lens 2065, and the center of the illumination field diaphragm 2064 (opening) is arranged on the optical axis 2065a. Furthermore, the illumination field diaphragm 2064 is arranged in the illumination area IR on the cylindrical mask M by a glass material (concave lens shape) constituting the lens system 2066, a concave mirror 2040, and a plurality of lenses of the second optical system 2015. (Pattern plane p2001) An optically conjugate plane 2014b.

The optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL (second optical system 2015), but the optical axis 2065a of the condenser lens 2065 is disposed so as to be opposite to The optical axis 2014a of the first optical system 2014 is decentered in the -Z direction within the paper surface (XZ surface) of Fig. 23.

Here, two point light source images SPa and SPd, which are generated at a plurality of point light source images of the surface Ep on the exit side of the fly-eye lens 2062, which are asymmetrical in the Z direction across the optical axis 2065a, are used as an example to describe the illumination beam. Phenomenon.

The light beam from the point light source image SPa is irradiated with the illumination field diaphragm 2064 by the condenser lens 2065 into a substantially parallel light beam. The illumination beam EL1a of the opening (transparent slit shape in the Y direction) of the transmission illumination field diaphragm 2064 converges into a point light source through a lens system 2066 in a window formed on the reflecting surface of the concave mirror 2040 of the projection optical system PL. Like Sfa.

The illumination light beam EL1a from the point light source image Sfa passes through the second optical system 2015 of the projection optical system PL to illuminate the illuminated area IR on the cylindrical pattern surface p2001 of the cylindrical mask M as described in Fig. 21. The imaging light beam EL2a generated on the pattern surface p2001 by irradiation of the illumination light beam EL1a from the point light source image Sfa is retrograde in the second optical system 2015 and further forms a point light source image Sfa 'on the concave mirror 2040. The point light source image Sfa created by the light beam from the illumination optical system IL and the point light source image Sfa 'created by the imaging beam EL2a are in a point-symmetrical relationship in the pupil plane pd.

Similarly, the light beam from the point light source image SPd is irradiated with the illumination field diaphragm 2064 by the condenser lens 2065 into a substantially parallel light beam. The illumination light beam EL1d at the opening of the transmission illumination field diaphragm 2064 converges into a point light source image Sfd in the window formed on the reflecting surface of the concave mirror 2040 through the lens system 2066. The illumination beam EL1d from the point light source image Sfd passes through the second optical system 2015 to illuminate the illumination region IR on the cylindrical pattern surface p2001. The imaging light beam EL2a generated on the pattern surface p2001 by irradiation with the illumination light beam from the point light source image Sfd is retrograde in the second optical system 2015 and further forms a point light source image Sfd 'on the concave mirror 2040. The point light source image Sfd created by the light beam from the illumination optical system IL and the point light source image Sfd 'created by the imaging beam EL2d are in a point-symmetrical relationship in the pupil plane pd.

On the reflecting surface of the concave mirror 2040, imaging light beams EL2a and EL2d with light sources like Sfa 'and Sfd' are formed, projected into a cylindrical projection area PA on the substrate P, and an image of a mask pattern in the illumination area IR is projected on Within the projection area PA of the substrate P.

FIG. 24 shows the structure of a light source device 2055 that emits an illumination light beam EL0 into the fly-eye lens 2062 of the illumination optical system IL shown in FIG. 23. The light source device 2055 includes a solid-state light source 2057, an expansion lens (concave lens) 2058, a condenser lens 2059, and a light guide member 2060. The solid-state light source 2057 includes, for example, a laser diode (LD), a light emitting diode (LED), and the like. The illumination light beam LB emitted from the solid-state light source 2057 is converted into a divergent light beam by the expansion lens 2058, and is condensed by the condensing lens 2059 at a predetermined convergence ratio (NA) on the incident end surface 2060a of the light guide member 2060.

The light guide member 2060 is, for example, an optical fiber, and the illumination beam LB that is incident on the end face 2060a is saved from the NA (numerical aperture) and emitted from the exit end face 2060b. The lens system 2061 (collimator) is converted into a substantially parallel Illumination beam EL0. The lens system 2061 adjusts the beam diameter of the illumination light beam EL0 to irradiate the entire surface of the entrance side of the fly-eye lens 2062. In addition, although the diameter of a single optical fiber is, for example, 300 μm, when the light intensity of the illumination light beam LB from the solid-state light source 2057 is large, a plurality of optical fibers can be tightly bundled.

FIG. 25 shows an array state of a plurality of point light source images SP formed by viewing the surface Ep (parallel to the YZ plane) of the fly-eye lens 2062 in FIG. 23 from the condenser lens 2065 side. When the center point of the surface Ep on the exit side of the fly-eye lens 2062 is set to 2062a in the YZ plane, the center point 2062a is located on the optical axis 2065a of the condenser lens 2065.

As shown in FIG. 25, the fly-eye lens 2062 of this embodiment includes a plurality of lens elements 2062E arranged on a surface orthogonal to the optical axis 2065a of the condenser lens 2065. Each of the plurality of lens elements 2062E has a rectangular cross section elongated in the Y direction, and is tightly bundled in the Y direction and the Z direction. Although a point light source image (point) SP is formed at the center of the exit end of each lens element 2062E, this is a conjugate image of the exit end face 2060b of the light guide member 2060 (optical fiber) in FIG. 24. In addition, when viewed in the YZ plane, a plurality of lens elements 2062E are bundled so that each point light source image SP is asymmetric to each other with respect to the center point 2062a (optical axis 2065a).

In the example shown in FIG. 25, when the surface including the optical axis 2065a of the condenser lens 2065 and the plane parallel to the XY plane is set to p2006, a group of lens elements 2062E located on the + Z side than this plane p2006 is the upper lens. The element group 2062U, and the lens element 2062E located on the -Z side more than this surface p2006 is the lower lens element group 2062D. Between the upper lens element group 2062U and the lower lens element group 2062D, the position is shifted from the lens element 2062E. 1/2 the size in the Y direction. As a result, the plurality of point light source images SP dispersed in the upper lens element group 2062U and the plurality of point light source images SP dispersed in the lower lens element group 2062D are also opposite to a line parallel to the Y axis passing through the center point 2062a. Asymmetric configuration.

The reason why the cross-sectional shape of each lens element 2062E of the fly-eye lens 2062 in the YZ plane is a rectangle extending in the Y direction is to match the slit-like opening shape of the illumination field diaphragm 2064 in FIG. 23. The appearance will also be described with reference to FIG. 26.

FIG. 26 is a view of the illumination field diaphragm 2064 in FIG. 23 viewed in the YZ plane. An opening 2064A having an elongated rectangular (or trapezoidal) shape in the Y direction is formed in the illumination field diaphragm 2064, and the light beams of each point light source image SP from the fly-eye lens 2062 pass through the condenser lens 2065 in the illumination field diaphragm. A rectangular illumination light beam EL1 including an opening 2064A on 2064 is superimposed. When the opening center of the opening 2064A has been arranged on the optical axis 2065a of the condenser lens 2065, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is decentered from the opening center of the opening 2064A to the + Z direction. Its location.

Fig. 27 is a view from the second optical system 2015 side of the projection optical system PL, which can be used for the reflecting surface p2004 (arranged on the pupil plane pd) of the concave mirror 2040 of the point light source image SP generated by the fly-eye lens 2062 of Fig. 25 . Since the reflective surface p2004 of the concave mirror 2040 is conjugated to the surface Ep on the exit side of the fly-eye lens 2062, the distribution of the plurality of point light source images SP (lens element 2062E) shown in FIG. 25 is as shown in FIG. 27 on the reflective surface p2004 ( The distribution of the point light source image Sf (black circle) in the pupil plane pd).

As described previously with reference to FIG. 22, on the reflective surface p2004 of the concave mirror 2040, the window portion 2042 for transmitting a plurality of point light source images Sf is arranged in a non-point symmetry with respect to the center point 2044 (optical axis 2015 a). In the example of FIG. 27, the window portion 2042 is formed in a slit shape elongated in the Z direction so that the illumination light beams from the plurality of point light source images Sf arranged in a line in the Z direction are collectively transmitted. In addition, the slit-shaped window portion 2042 in the reflecting surface p2004 is a highly reflecting portion that efficiently reflects the imaging beam from the pattern in the illumination region IR of the cylindrical mask M.

The plurality of point light source images Sf are arranged in a non-plane symmetry with respect to a plane p2005 that includes the optical axis 2015a of the second optical system 2015 and is orthogonal to the center plane pc (FIG. 21), and each of the slit-shaped window portions 2042 has a Y-direction dimension. It is set to a narrow degree so as not to block the point light source image Sf. As described with reference to FIG. 23, the light beam (illumination light beam EL1) from each of the plurality of point light source images Sf passing through each of the window portions 2042 passes through the second optical system 2015 to illuminate the pattern surface p2001 of the cylindrical mask M in an overlapping manner. Illumination area IR. Thereby, the illumination area IR is illuminated with a uniform illuminance distribution.

Although the reflected light (imaging beam EL2) from the mask pattern appearing in the illumination area IR of the pattern surface p2001 will return to the reflective surface p2004 of the concave mirror 2040, the imaging beam EL2 becomes a point light source image again on the reflective surface p2004. Sf 'becomes a separate distribution. As illustrated in FIG. 22, the distribution of the plurality of point light sources Sf '(especially 0-order diffraction light) generated on the reflecting surface p2004 by the imaging beam EL2 is relative to the center point 2044 and is the same as the illumination beam EL1. The distribution of the plurality of point light sources like Sf is point-symmetric.

As shown in FIG. 27, the areas on the reflective surface p2004 that are point-symmetrically related to the plurality of window portions 2042 distributed as the point light source image Sf as the source of the illumination light beam EL1 are all highly reflective portions, so imaging is performed again. The point light source image Sf ′ (including the primary diffraction light) on the reflecting surface p2004 is reflected with almost no loss and reaches the substrate P.

    [Modification 1 of Eleventh Embodiment]    

In addition, in FIG. 27, even on the reflection surface p2004 of the concave mirror 2040, a portion on a line p2005 (parallel to the XY plane) including the optical axis 2015a of the projection optical system PL (second optical system 2015) is used as the illumination beam In the case of the point light source image Sf of the source, as long as the previous configuration conditions, the portion where the point light source image Sf is located is set to the window portion 2042, and the area where the relative center point 2044 and the window portion 2042 are point symmetrical is set to reflect Part (light-shielding part).

However, when the point light source image Sf (window portion 2042) is located at the center point 2044, if the illumination light beam with the point light source image Sf as the source illuminates the illumination area IR on the cylindrical mask M, then The reflected imaging light beam converges to form a point light source image Sf ′ at the center point 2044 (window portion 2042) of the reflecting surface p2004, and thus may not become an imaging light beam directed to the substrate P. Therefore, the arrangement of a plurality of lens elements 2062E constituting the fly-eye lens 2062 can be changed in a manner that the pointless light source image Sf is near the center point 2044 of the reflective surface p2004, or a light shielding film is applied to the lens element 2062E corresponding to the center point 2044 position ( Smear).

In this embodiment, as shown in FIGS. 25 and 27, the point light source image SP (the arrangement of lens elements 2062E) formed on the surface Ep formed on the exit side of the fly-eye lens 2062 and the concave mirror are formed. The configuration of the window portion 2042 of the reflection surface p2004 of 2040 matches one-to-one, but it is not necessarily necessary. That is, for a plurality of point light source images SP formed on the surface Ep on the exit side of the fly-eye lens 2062, a part of the point light source images Sf that are incident from the surface p2003 on the back side of the concave mirror 2040 and reach the reflective surface p2004 (pupil surface pd) are incident on the point Ep. It is also possible to block light without maintaining the state of the reflecting surface without providing the window portion 2042. This shading can also be achieved by forming a shading film or a light absorbing layer in the area where the point light source image Sf to be shielded is located in the surface p2003 on the back side of the concave mirror 2040.

    [Modification 2 of the eleventh embodiment]    

The imaging beam EL2 (many point light sources like Sf ') incident on the concave mirror 2040 from the second optical system 2015 constituting the projection optical system PL may not necessarily be completely reflected by the concave mirror 2040. For example, in the reflective surface p2004 of the concave mirror 2040, in addition to the transmissive window portion 2042 and the reflective portion, a plurality of point light source images Sf that shield the source of the illumination beam EL1 and a complex number formed by the convergence of the imaging beam EL2 may be provided. One or both of the point light source images Sf ′ are light-shielding portions of part of the point light source images.

The eleventh embodiment has been described above. In this embodiment, as shown in FIG. 21 or FIG. 22, the illumination light from the illumination optical system IL is incident from the back side of the concave mirror 2040 disposed on the pupil plane pd of the projection optical system PL. Through the second optical system 2015 constituting the projection optical system PL and the reflection plane 2041a on the upper side of the chirped mirror 2041, it reaches the illumination region IR on the cylindrical mask M as the illumination beam EL1.

If the imaging optical path test of the projection optical system PL in this embodiment is divided into the first optical path from the illumination area IR (object surface) to the concave mirror 2040 (pupil plane pd) and the concave mirror 2040 (pupil plane pd) to the projection region PA ( Image plane), the first optical path also serves as the optical path for the oblique illumination for guiding the illumination beam from the illumination optical system IL to the illumination area IR.

As described above, the processing device U3 (exposure device) of this embodiment is a diagonally illuminating illumination method that efficiently separates the illumination beam and the imaging beam spatially with a reflector disposed on the pupil surface of the projection optical system PL or its vicinity. Therefore, the device configuration can be simplified. In addition, compared with the method of separating the illumination light beam and the imaging light beam by the difference in the polarization state, it is not necessary to use a large polarizing beam splitter or a wavelength plate, and the device configuration can be simplified.

In addition, in the method of separating the polarization of the illumination beam and the imaging beam, it is necessary to cope with the wavefront disturbance caused by the wavelength plate or the problem of the projection image characteristics (contrast, aberration) caused by the problem of the extinction ratio of the polarizing beam splitter Etc.), but in this embodiment, there is almost no deterioration in the characteristics of the projected image due to these reasons, and the occurrence of poor exposure can be suppressed. In addition, the processing device U3 of this embodiment is equipped with a down-tilt illumination method that irradiates the illumination light to the reflective mask M through a part of the projection optical system, so it is compared with the case where the illumination optical system is assembled inside the transmissive mask. In particular, the degree of freedom in designing the illumination optics is improved.

In this embodiment, the light source device 2055 shown in FIG. 24 can reduce the size of the point light source image, so it is assumed that a laser light source with strong directivity of radiation (for example, excimer laser light such as KrF, ArF, XeF) is used. , But not limited to this. For example, a light source that emits bright rays such as g-rays, h-rays, and i-rays, or a laser diode or a light-emitting diode (LED) with weak directivity of the emitted light may be used.

Since the component manufacturing system 2001 (FIG. 20) of this embodiment can simplify the configuration of the processing device U3 (exposure device), the manufacturing cost of the component can be reduced. Moreover, since the processing apparatus U3 is a method of scanning and exposing while carrying the substrate P along the outer peripheral surface p2002 of the rotary reel 2030, the exposure process can be performed efficiently. As a result, the component manufacturing system 2001 can manufacture components with good efficiency.

    [Twelfth Embodiment]    

Next, a twelfth embodiment will be described with reference to FIG. 28. In this embodiment, the configuration of the fly-eye lens 2062 described in FIG. 25 and FIG. 27 and the configuration of the point light source image Sf formed in the reflective surface p2004 of the concave mirror 2040 is changed. The same symbols as those in the above-mentioned embodiment will simplify or omit the description.

FIG. 28 is a diagram showing how a plurality of lens elements 2062E of the fly-eye lens 2062 are equivalently arranged in the YZ plane orthogonal to the optical axis 2015a of the projection optical system PL. In a manner that a plurality of lens elements 2062E (point light source image Sf) are arranged in an asymmetrical manner with respect to the center point 2044 (optical axis 2015a) of the reflective surface p2004 of the concave mirror 2040, the center of the lens element 2062E closest to the center point 2044 is The center point 2044 is displaced in the Y direction and the Z direction.

In this embodiment, the cross-sectional shape (shape in the YZ plane) of each lens element 2062E of the fly-eye lens 2062 is set to be equal to that of the rectangular opening 2064A including the illumination field diaphragm 2064 as described in FIG. 26. The rectangular shape is similar, but here, the ratio Py / Pz of the Y-direction cross-sectional dimension Py and the Z-direction cross-sectional dimension Pz is set to approximately 4. Therefore, the plurality of point light source images Sf distributed in the reflecting surface p2004 (pupil plane pd) are also arranged in the Y direction with a pitch of the cross-sectional size Py and in the Z direction with a pitch of the cross-sectional size Pz.

As long as it is a normal fly-eye lens, although the center of each lens element 2062E will be arranged straight in both the Y direction and the Z direction, in this embodiment, the lens elements 2062E adjacent to the Z direction are in the Y direction. Each displacement ΔY is arranged. If this displacement amount ΔY is set to about 1/4 of the Y-direction cross-sectional dimension (arrangement pitch) Py of lens element 2062E, the point light source images Sf will be located within 45 degrees, ± 135 toward each other in the YZ plane. A position separated by either direction.

In FIG. 28, when the four point light source images Sf located near the center point 2044 of the reflecting surface p2004 and surrounding the center point 2044 are specified, the area surrounded by the four point light source images Sf (here, the tilted The position of the center of gravity of the rectangle) is displaced from the center point 2044. In other words, the position of the center of gravity of the area surrounded by the four point light source images Sf is located at a position different from the center point 2044. By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane so that such a displacement occurs, each of the point light source images Sf can be arranged with a non-symmetrical relationship with respect to the center point 2044. This means that the area on the reflecting surface p2004 in which the relative center point 2044 and each point light source image Sf are point-symmetric can be made a reflecting portion at any time.

Although a window portion 2042 for transmitting each point light source image Sf is formed in the reflecting surface p2004 of the concave mirror 2040 corresponding to the distribution of the point light source image Sf configured as described above, the shape, size, and configuration of the window portion can be considered in several ways. form. To put it simply, as shown in FIG. 28, a circular window portion 2042H that transmits only one point light source image Sf is distributed in a comprehensive manner on the reflecting surface p2004 in accordance with the arrangement of the point light source images Sf.

As another form, the slot-shaped window portions 2042K in which all the point light source images Sf arranged in a row on the reflecting surface p2004 are inclined in a direction of 45 degrees with respect to the Y direction may be integrated. When a series of point light source image Sf located in this window portion 2042K is used as the source illumination beam to illuminate the illumination region IR of the cylindrical mask M, the reflected beam (imaging beam) becomes the reflection surface p2004 of the concave mirror 2040. The point light source image Sf '(including the primary diffraction image) converges on a reflection region 2042K' displaced from a window portion through which the point light source image Sf is transmitted. In addition, the two point light source images Sf arranged in a direction inclined at 45 degrees with respect to the Y direction may also be a set of oval-shaped (or gourd-shaped) window portions 2042L integrated and transmitted. Regardless of the type of window portion 2042H, 2042K, 2042L, they are formed as small as possible within a range where the illumination light from each point light source image Sf is not blocked locally.

In the above twelfth embodiment, the Y-direction displacement amount ΔY of the lens element 2062E of the fly-eye lens 2062 can be arbitrarily set, and the ratio of the cross-sectional size Py / Pz of the lens element 2062E is not necessarily set to an integer multiple.

    [Thirteenth Embodiment]    

Next, a thirteenth embodiment will be described with reference to FIG. 29. This embodiment is also a modification of the configuration of the fly-eye lens 2062 and the arrangement of the point light source image Sf formed in the reflective surface p2004 of the concave mirror 2040, as in FIG. 28. In the configuration of FIG. 29, the centers of the plurality of lens elements 2062E of the fly-eye lens 2062 are linearly arranged in the Y direction and the Z direction in the YZ plane.

In the case of such a fly-eye lens 2062, the point light source images Sf formed on the exit side of each lens element 2062E are arranged at a pitch of the sectional size Py in the Y direction and at a pitch of the sectional size Pz in the Z direction. This situation is also as explained in the twelfth embodiment of FIG. 28, focusing on the four points that are located very close to the center point 2044 (optical axis 2015a) of the reflective surface p2004 of the concave mirror 2040 and surround the center point 2044. When the light source images Sfv1, Sfv2, Sfv3, Sfv4, the center of gravity position Gc of the area (rectangle) surrounded by the four point light source images Sfv1 ~ Sfv4 is shifted from the center point 2044. In other words, the center of gravity position Gc is located at a position different from the center point 2044.

By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane so that such a displacement occurs, each of the point light source images Sf can be arranged with a non-symmetrical relationship with respect to the center point 2044. Therefore, the region on the reflecting surface p2004 in which the relative center point 2044 and each point light source image Sf are point-symmetric can be made a reflecting portion at any time.

In addition, the reflecting surface p2004 of the concave mirror 2040 of this embodiment is formed in accordance with the arrangement pitch of the lens elements 2062E (point light source image Sf) to form a circular window portion 2042H which is useful for transmitting the point light source image Sf individually.

    [14th Embodiment]    

Next, a fourteenth embodiment will be described with reference to FIG. 30. This embodiment is similar to FIG. 28 and FIG. 29, and relates to the configuration of the fly-eye lens 2062 and the deformed arrangement of the point light source image Sf formed in the reflective surface p2004 of the concave mirror 2040. In the structure of FIG. 30, although the multiple lens elements 2062E (the shape of the cross section is a slender rectangle in the Y direction) of the fly-eye lens 2062 are arranged in the Y direction at a pitch of the cross-sectional size Py, and are close in the Z direction at the pitch of the cross-sectional size Pz. The lens elements 2062E group arranged in one row in the Y direction are arranged in the Y direction, and each row in the Z direction is alternately arranged in the Y direction to change (shift) the position.

In the case of the fly-eye lens 2062, the point light source image Sf is generated on the exit end side of all the lens elements 2062E that receive illumination light from the light source (for example, EL0 in FIG. 24), but in order to cover the point light source image Sf, The center point 2044 of the reflective surface p2004 of the concave mirror 2040 is one of two point light source images Sf in a point-symmetrical arrangement relationship with each other, and a light-shielding body 2062s is formed with the corresponding lens element 2062E.

In the configuration of FIG. 30, a light-shielding body 2062s (metal thin film, etc.) is formed in correspondence with the corresponding lens element 2062E so that the selected point light source images Sf in the reflective surface p2004 of the concave mirror 2040 are randomly and uniformly distributed. When such a fly-eye lens 2062 is used, a circular window portion 2042H for transmitting the point light source image Sf is formed on the reflective surface p2004 of the concave mirror 2040 as shown in FIG. 30.

    [Fifteenth embodiment]    

Next, a fifteenth embodiment will be described with reference to FIG. 31. In this embodiment, instead of the fly-eye lens 2062 described so far, a plurality of point light source images Sf are formed in the reflection surface p2004 of the concave mirror 2040 by the light source image forming portion. FIG. 31 shows a cross section of a surface including a concave mirror 2040 parallel to the XZ plane and including the optical axis 2015a (center point 2044). Each window portion 2042H is formed on a reflection surface p2004 where a point light source image Sf (Sfa) is located.

The concave mirror 2040 is, for example, a reflective film formed on the concave side of a base material made of a precision ceramic or glass ceramic with a low thermal expansion coefficient. A plurality of window portions 2042H are formed on the reflective film under the same conditions as in the previous embodiments. In this embodiment, a base material behind the window portion 2042H is formed to pass through a part of the illumination optical system IL, that is, the optical fiber Fbs. Hole (1mm diameter).

The emitting end of each optical fiber Fbs functions as a point light source image, and is provided on a surface substantially the same as the reflection surface p2004. The illumination light irradiated on the entrance end of each optical fiber Fbs is set such that the illumination beam (for example, EL1a) projected from the exit end of the optical fiber Fbs has a predetermined numerical aperture (divergence angle characteristic). In addition, the direction of the illuminating light beam from the emitting end of each optical fiber Fbs is set to coincide with the direction of the main ray passing through the emitting end (point light source image).

In the structure shown in FIG. 31, since a plurality of point light sources like Sf are generated at the emitting end of the optical fiber Fbs without using the fly-eye lens 2062, although the number of optical fibers corresponding to the number of window sections 2042H is required, the light source can reach the concave mirror 2040. System, that is, the overall size of the illumination optical system IL.

In addition, although a small hole penetrating through the exit end of the optical fiber Fbs is provided in the concave mirror 2040, a thin light tube (cylindrical rod) made of quartz and the like can be embedded in each of the small holes, and each light end of the light tube can be inserted. An ultraviolet light emitting diode (LED) with a condenser lens is arranged on the side, so that the exit end side of each light pipe is consistent with the reflective surface p2004 of the concave mirror 2040.

    [16th embodiment]    

Next, a sixteenth embodiment will be described with reference to Figs. 32A, 32B, 33A, 33B, and 33C. In this embodiment, instead of the fly-eye lens 2062 in the illumination optical system IL, a rod lens (corner-shaped glass or quartz) is used to uniformly illuminate the illumination region IR on the cylindrical mask M.

FIG. 32A is a plan view of the optical path from the light guide member 2060 (optical fiber) that guides the light from the light source to the projection optical system PL (second optical system 2015) as viewed from the Y-axis direction, and FIG. 32B is the optical path of FIG. 32A as viewed from the Z-axis direction Top view. In FIGS. 32A and 32B, the configuration of the optical path from the illumination field diaphragm 2064 to the projection optical system PL is the same as the previous configuration of FIG. 23, so the description of this portion is omitted.

The illumination optical system IL shown in FIGS. 32A and 32B includes a light guide member 2060, a condenser lens 2093, a rod lens 2094, an illumination field diaphragm 2064, a lens system 2066, and the like described with reference to FIG. 24. The configuration of the projection optical system PL (second optical system 2015) after the concave mirror 2040 is the same as that of FIGS. 21 and 23.

The illumination light beam EL0 emitted from the light guide member (optical fiber) 2060 converges to the entrance end face 2094a of the rod lens 2094 or its vicinity by the condenser lens 2093. The cross-sectional shape of the rod lens 2094 along the YZ plane (the entrance end surface 2094a and the exit end surface 2094b) is formed into a rectangular shape including a trapezoidal or rectangular opening 2064A (FIG. 26) of the illumination field diaphragm 2064. The cross-sectional shape is substantially similar to the cross-sectional shape of the lens element 2062E of the fly-eye lens 2062 shown in FIG. 25 and FIGS. 28 to 30.

When a rod lens 2094 is used, the illumination beam EL0 that converges at the incident end surface 2094a is inside the rod lens 2094, and moves between the side 2094c parallel to the XZ plane and the side 2094d parallel to the XY plane to repeat the interior. After reflection, it enters the exit end face 2094b. In the case of a rod lens, although the most uniform distribution of the illuminance of the illumination light is the exit end face 2094b, its uniformity will be better as the number of internal reflections increases. Therefore, the emission end surface 2094b and the surface 2014b conjugated to the illumination region IR on the cylindrical mask M are arranged in line.

Since the cross section of the rod lens 2094 in this embodiment is rectangular, the number of reflections of the illumination light between the opposite side surfaces 2094c is smaller than the number of reflections of the illumination light between the opposite side surfaces 2094d. The number of times the illumination beam EL0 is reflected on the inner surface of the rod lens 2094 is to set the length of the rod lens 2094 twice or more from the viewpoint of improving the uniformity of illuminance. In addition, since the shape of the exit end face 2094b of the rod lens 2094 defines the outer edge of the illumination area IR, the illumination field diaphragm 2064 may be omitted.

Next, if the line connecting the central point of the incident end face 2094a of the rod lens 2094 in the YZ plane and the central point of the incident end face 2094b in the YZ plane is set as the central axis AX2003, this central axis AX2003 is related to the projection optical system. The optical axis 2015a of the PL (the optical axis 2014a of the lens system 2066) is parallel, but decentered in the Z direction. Further, although the emission end of the light guide member 2060 is disposed on the optical axis 2093a of the condenser lens 2093, the optical axis 2093a is disposed displaced in the -Y direction with respect to the center axis AX2003 of the rod lens 2094.

By this displacement in the -Y direction, a plurality of point light source images Sf generated in the reflecting surface p2004 of the concave mirror 2040 can be arranged to be non-point symmetrical with respect to the center point 2044 (optical axis 2015a) of the reflecting surface p2004. This is described in detail with reference to FIGS. 33A to 33C. FIG. 33A is a view looking at the condenser lens 2093 from the exit end 2094b side of the rod lens 2094 toward the X-axis direction, FIG. 33B is a view looking at the rod lens 2094 from the lens system 2066 side toward the X-axis direction, and FIG. 33C is a view from the X-axis direction View the reflective surface p2004 of the concave mirror 2040.

As shown in FIG. 33A, the cross section of the rod lens 2094 is a rectangle defined by a side surface 2094d parallel to the XY plane and a side surface 2094c parallel to the XZ plane. The central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 are opposite to each other. The ground is eccentric. Further, as shown in FIG. 33B, with respect to the optical axis 2014a (2015a) of the lens system 2066, the center axis AX2003 of the rod lens 2094 is decentered in the Z direction.

In this configuration, the concave lens and lens system 2066, which is the base material of the concave mirror 2040, is formed on the reflecting surface p2004 of the concave lens 2040 on the reflection surface p2004 of the surface 2014b where the exit end face 2094b of the rod lens 2094 is located. on. Therefore, as shown in FIG. 33C, a plurality of point light source images Sf on the reflective surface p2004 of the concave mirror 2040 are formed with a pitch DSy in the Y direction and a pitch DSz in the Z direction. The point light source image Sf appears as a virtual image of a point image of the illumination light beam EL0 that converges on the entrance end face 2094a of the rod lens 2094.

The point light source image Sf of the plurality of point light sources is rectangular, so the arrangement pitch of the point light source image Sf in the direction parallel to the long side of the cross section (Y direction) is DSy, which is parallel to the direction parallel to the short side (Z direction). The point light source image Sf has a long arrangement pitch DSz. As shown in FIGS. 32A and 32B, since the number of internal reflections of the illumination light in the rod lens 2094 is greater in the Z direction than in the Y direction, the number of point light source images Sf generated on the reflecting surface p2004 of the concave mirror 2040 is also The Z direction is more than the Y direction. In the example of FIG. 33C, five point light source images Sf are arranged in the Z direction, and three point light source images Sf are arranged in the Y direction.

Furthermore, by decentering the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 with respect to the Y direction, a point light source image Sf generated on the reflecting surface p2004 of the concave mirror 2040 is distributed relative to the center point. 2044 (optical axis 2015a) as a whole is eccentric to the Y direction, and each of the point light source images Sf can be arranged in a non-point symmetrical relationship with respect to the center point 2044.

Similar to the previous embodiment shown in FIG. 27, on the reflective surface p2004 of the concave mirror 2040, a plurality of point light source images Sf arranged in a row in the Z direction are collectively transmitted through the slot-shaped window portions 2042 in the Y direction at a pitch. DSy is formed with three columns. The width in the Y direction of each window portion 2042 is set to be as small as possible so as not to block the illumination light beam with the point light source image Sf as the source. These slot-shaped window portions 2042 are also formed to be non-point symmetrical to each other with respect to the center point 2044.

In the structure of FIG. 33C, the y-direction eccentricity of the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 is set to be closest to the center point 2044 on the reflection surface p2004 (pupil plane pd) of the concave mirror 2040. The distance from the point light source image Sf of (optical axis 2015a) to the center point 2044 in the Y direction (set to Yk) is set so that one half of the interval (set to Yw) of the window portion 2042 arranged in the Y direction is not full, that is, Yk <( Yw / 2).

As described above, if the point light source image Sf, which is the source of the illumination beam EL1 that illuminates the illumination region IR of the cylindrical mask M, is arranged on the reflective surface p2004 (pupil plane pd) of the concave mirror 2040, The imaging beam EL2 generated by the illumination area IR on the mask M is a diffraction image Sf '(including 0th order light and ± 1st order light) of the point light source image Sf on the reflection surface p2004 as shown in FIG. 33C. And distribution. On the reflecting surface p2004, the diffraction image Sf 'and the point light source image Sf, which is the source of the illumination beam EL1, are located at a point symmetrical position with respect to the center point 2044.

In this embodiment, since the relationship between the distance Yk and the interval Yw is set to Yk <(Yw / 2), the plurality of diffraction images Sf ′ generated on the concave mirror 2040 (pupil plane pd) by the imaging beam EL2. , Are all formed on the reflecting portion offset from the window portion 2042. In this way, the imaging light beam EL2 is reflected by the reflection portion of the concave mirror 2040 with little loss, and is projected on the projection area PA on the substrate P held along the outer peripheral surface p2002 as shown in FIG. 21 previously.

As described above, even in the case of using the rod lens 2094, it is possible to displace the convergence position of the illumination light beam EL0 on the incident end face 2094a of the rod lens 2094 from the central axis AX2003, so that many point light sources like Sf The center points 2044 of the reflective surfaces p2004 of the concave mirror 2040 are set to be non-point symmetrical with each other.

    [Seventeenth embodiment]    

Next, the configuration of the processing device (exposure device) U3 of the seventeenth embodiment will be described with reference to Figs. 34 and 35. The exposure device of this embodiment corresponds to the Y-direction size of the pattern exposure area on the substrate P which is larger than the Y-direction size of the illumination area IR or projection area PA of the projection optical system PL shown in FIG. The projection optics are arranged in the Y direction to expand the possible exposure range in the Y direction.

Therefore, the pattern of the cylindrical mask M must be projected on the substrate P as an erect image. In the projection optical system PL shown in FIG. 21 previously, although the X direction of the mask pattern image projected on the substrate P is upright, it is reversed in the Y direction. Therefore, by arranging the projection optical systems of the same configuration one after the other (in series), the projected image inverting the Y direction can be inverted again in the Y direction, and the result is in the projection area PA on the substrate P. , Make it an erect image in both the X direction and the Z direction.

FIG. 34 shows the overall configuration of the exposure apparatus of this embodiment, and FIG. 35 shows the arrangement relationship between the illumination area IR and the projection area PA formed by each of a plurality of projection optical systems. The orthogonal coordinate system of each figure is XYZ. The coordinate system set in the embodiment of FIG. 21 is the same. In addition, the same reference numerals are given to the components and requirements equivalent to those of the exposure apparatus shown in FIG. 21 and FIG. 23.

The substrate p transferred from the upstream of the transfer path is wound around a part of the outer peripheral surface of the rotary reel 2030 through a transfer roller or a guide member (not shown), and is then transferred downstream through a guide member or a transfer roller (not shown). The second driving unit 2032 drives the rotation reel 2030 clockwise around the rotation center axis AX2002, and the substrate P is transferred at a constant speed. Each of the projection areas PA2001 to PA2006 of the six projection optical systems PL2001 to PL2006 is located at a portion where the substrate P is wound on the cylindrical outer peripheral surface of the rotary reel 2030. Corresponding to each of the six projection areas PA2001 to PA2006, six illumination areas IR 2001 to PA2006 are set on the outer peripheral surface of the cylindrical mask M (the cylindrical mask pattern surface).

The six projection optical systems PL2001 to PL2006 are all of the same optical configuration, and are divided into a center plane pc (and a YZ plane) which includes a rotation center axis AX2001 including a cylindrical mask M and a rotation center axis AX2002 of a rotating reel 2030. Parallel) The projection optical systems PL2001, PL2003, and PL2005 (also collectively referred to as odd-numbered projection optical systems PLo) set on the left (-X direction), and the projection optical systems PL2002, PL2004, and PL2006 (set on the right (+ X direction)) Also known as even-numbered projection optics PLe).

The projection optical systems PL2001 to PL2006 of this embodiment include the projection optical system PL shown in FIG. 21 and the illumination optical systems IL2001 to IL2006 for oblique illumination. Since the configuration is the same as that of FIG. 21, the projection optical system PL2001 and the illumination optical system IL2001 will be representatively and briefly described. Illumination optics IL2001 is the illumination beam EL0 from the light source device 2055. The concave mirror 2040 disposed on the pupil of the upper unit of the projection optics PL2001 (the same as the projection optics PL of FIG. 21) is arranged on the back side of the reflective surface p2004 Generate multiple point light sources like Sf. The illumination light beam EL1 using this point light source image Sf as a source is reflected on a reflection plane 2041a on the upper side of the chirped mirror 2041, and illuminates the illumination region IR2001 on the outer peripheral surface of the cylindrical mask M.

The imaging beam EL2 reflected from the mask pattern in the illumination area IR2001 is reflected on the reflection plane 2041a, and then reflected on the concave mirror 2040, and reflected on the reflection surface (2041b) below the chirped mirror 2041, and is reflected on the surface p2007 (intermediate image) Face p2007) forms a spatial image (intermediate image) of the mask pattern.

The projection unit of the projection optics PL2001 is also a half-field equal-refraction projection system equipped with a chirping mirror, a plurality of lens elements, and a concave mirror 2078 arranged on the pupil surface, forming an intermediate image on the intermediate image plane p2007. After the light beam EL2 is reflected by the concave mirror 2078, it is reflected by the reflection plane 2076b on the lower side of the chirped mirror (2076), reaches the projection area PA2001 on the substrate P, and generates an orthographic image of the mask pattern in the projection area PA2001. In addition, the projection unit of the projection optical system PL2001 (the intermediate image plane to the projection area) needs to re-image the intermediate image formed on the intermediate image plane p2007 on the projection region PA2001 on the substrate P, so it reflects on the concave mirror 2078. The surface is not provided with a window portion 2042 formed on the reflective surface p2004 of the concave mirror 2040.

The projection optical system PL2001 constructed as above (the same applies to other projection optical systems PL2002 to PL2006), because it is a projection system of the so-called multi-lens method, there may be cases where the projection optical system PL cannot pass through the illumination area like the projection optical system PL of FIG. 21 The case where the main ray of the central point in the IR and the main ray passing through the central point in the projection area PA2001 are arranged in the central plane pc.

Therefore, as shown in FIG. 34, the angle θ 2001 (see FIG. 21) of the reflection plane 2041a of the chirped mirror 2041 of the projection unit on the projection optical system PL2001 (also the same for PL2003 and PL2005) is set to a value other than 45 °. The extension line D2001 of the main ray passing through the center point in the illumination area IR2001 is directed to the rotation center axis AX2001 of the cylindrical mask M. Similarly, the angle of the reflection plane 2076b of the 稜鏡 mirror 2076 of the projection unit on the lower side of the projection optical system PL2001 is set to a value other than 45 ° with respect to the XY plane, so that the principal rays passing through the center point in the projection area PA2001 The extension line D2001 is directed to the rotation center axis AX2002 of the cylindrical mask M.

The projection optical system PL2002 (also the same for PL2004 and PL2006) symmetrically disposed with respect to the center plane pc and the projection optical system PL2001 is the same. The angle θ 2001 of the reflection plane 2041a of the chirped mirror 2041 of the upper projection unit is set to 45 °. Other values so that the extension line D2002 of the main ray passing through the center point in the illumination area IR2002 to the rotation center axis AX2001 of the cylindrical mask M, and the reflection plane 2076b of the 稜鏡 mirror 2076 of the projection unit in the rear stage The angle is set to a value other than 45 ° with respect to the XY plane, so that the extension line D2002 of the main ray passing through the center point in the projection area PA2002 goes to the rotation center axis AX2002 of the cylindrical mask M.

As mentioned above, the odd-numbered projection optical system PLo and even-numbered projection optical system PLe that the extension lines D2001 and D2002 of the main ray are symmetrically inclined with respect to the center plane pc are symmetrically arranged with respect to the center plane pc when viewed in the XZ plane. However, when viewed on the XY plane, it is arranged offset from the Y direction. Specifically, each of the projection optical systems PL2001 to PL2006 is provided such that the illumination areas IR2001 to IR2006 formed on the pattern surface of the cylindrical mask M and the projection areas PA2001 to PA2006 formed on the substrate P become as shown in FIG. 35. Configuration relationship.

Fig. 35 is a view of the arrangement of the illumination area IR2001 ~ IR2006 and the projection area PA2001 ~ PA2006 in the XY plane. The picture on the left is the illumination on the cylindrical mask M viewed from the side of the middle image plane p2007 where the middle image is formed. For the areas IR2001 ~ IR2006, the picture on the right is viewed from the middle image plane p2007 side when the projection areas PA2001 ~ PA2006 supported on the substrate P of the rotating reel 2030 are viewed. The symbol Xs in FIG. 35 indicates the movement direction (rotation direction) of the cylindrical mask M (rotating reel 2020) and the rotating reel 2030.

In FIG. 35, each of the illumination areas IR2001 to IR2006 has an elongated ladder shape with an upper bottom edge and a lower bottom edge parallel to the center plane pc (parallel to the Y axis). This means that each of the illumination optical systems IL2001 to IL2006 shown in FIG. 34 is provided with the illumination field diaphragm 2064 shown in FIG. 26 previously. In addition, each of the projection optical systems PL2001 to PL2006 in FIG. 34 forms an intermediate image on the intermediate image plane p2007. Therefore, when a field diaphragm having a trapezoidal opening is arranged there, the shape of each of the illumination areas IR2001 to IR2006 can be configured. It is simple rectangular shape (including the size of trapezoidal opening).

On the outer peripheral surface of the cylindrical mask M, the center points of the illumination areas IR2001, IR2003, and IR2005 formed by the odd-numbered projection optical system Plo are located on the surface Lo (vertical to the XY plane) parallel to the center plane pc. The center points of the illumination regions IR2002, IR2004, and IR2006 formed by the even-numbered projection optical system PLe are located on a plane Le (vertical to the XY plane) parallel to the central plane pc.

If the lighting areas IR2001 to IR2006 are trapezoidal, the Y-direction dimension of the lower bottom edge is A2002a, and the Y-direction dimension of the upper bottom edge is A2002b, then the center points of the odd-numbered illumination areas IR2001, IR2003, and IR2005 are at The Y direction is arranged at intervals (A2002a + A2002b), and the center points of the even-numbered illumination areas IR2002, IR2004, and IR2006 are also arranged at intervals (A2002a + A2002b) in the Y direction. However, relative to the odd-numbered illuminated areas IR2001, IR2003, and IR2005, the even-numbered illuminated areas IR2002, IR2004, and IR2006 are relatively offset in the Y direction by (A2002a + A2002b) / 2. In addition, the X-direction distances of the faces Lo and Le from the center plane pc are set to be equal to each other.

In this embodiment, each of the illumination areas IR2001 to IR2006 is configured such that the ends of the illumination area adjacent to the Y direction when viewed along the circumferential direction (Xs direction) of the outer peripheral surface of the cylindrical mask M (hedges of trapezoidal shape)部) overlap each other. Thereby, even when the Y-direction size of the pattern area A2003 of the cylindrical mask M is large, the effective exposure area thereof can be ensured. In addition, although the pattern region A2003 is surrounded by a frame-shaped pattern non-formation region A2004, the pattern non-formation region A2004 is made of a material having extremely low reflectance (or high light absorption) to the illumination light.

On the other hand, as shown on the right side of FIG. 35, when the projection areas PA2001 to PA2006 on the substrate P are provided in each of the illumination optical systems IL2001 to IL2006 as shown in FIG. 26, the illumination field diaphragm 2064 is reflected in the cylinder. The arrangement and shape of the illumination areas IR2001 to IR2006 on the outer peripheral surface of the photomask M (similar relationship). Therefore, the center points of the odd-numbered projection areas PA2001, PA2003, and PA2005 are located on the surface Lo, and the center points of the even-numbered projection areas PA2002, PA2004, and PA2006 are located on the surface Le.

In addition, in the figure on the right side of FIG. 35, although the substrate P is moved at a constant speed in the circumferential direction (Xs direction) along the outer peripheral surface of the rotating reel 2030, the area A2007 shown by the oblique line in the figure is obtained through six projections. The area PA2001 ~ PA2006 is exposed to 100% of the target exposure amount (dose).

In addition, for example, the partial area A2005a exposed at the end (triangular portion) in the + Y direction of the area A2005 exposed by the projection area PA2001 corresponding to the illumination area IR2001 does not reach the target exposure amount. However, when the substrate P is moved in the Xs direction (peripheral direction), and the area A006 is exposed by the projection area PA2002 corresponding to the illumination area IR2002, the underexposure is added. As a result, the partial area A2005a is also relative to the target exposure amount. (Dose) was exposed at 100%.

In this way, the entire projected image of the pattern area A2003 formed on the outer peripheral surface of the cylindrical mask M is transferred to the long side of the substrate P at equal times every time the cylindrical mask M rotates. direction.

In addition, although the main rays of light from the illumination areas IR2001 to IR2006 on the cylindrical mask M to the imaging beams EL2 of the projection optical systems PL2001 to PL2006 pass through the center points of the illumination areas IR2001 to IR2006 The extension lines D2001 and D2002 of the light are set to intersect with the rotation center axis AX2001 of the cylindrical mask M, but it is not necessarily necessary, as long as the main rays and the rotation center axis pass through any point in each of the lighting areas IR2001 ~ IR2006 AX2001 can be crossed. Similarly, the imaging light beams EL2 from the projection optical systems PL2001 to PL2006 to the projection areas PA2001 to PA2006 on the substrate P are the same, as long as any of the principal rays is consistent with that of the rotating reel 2030. Rotate the extension lines D2001, D2002 of the central axis AX2002.

Next, specific configurations of the projection optical systems PL2001 to PL2006 and the illumination optical systems IL2001 to IL2006 shown in FIG. 34 will be described using FIG. 36. Although FIG. 36 typically shows detailed structures of the projection optical system PL2001 and the illumination optical system IL2001, the structures of the other projection optical systems PL2002 to PL2006 and the illumination optical systems IL2002 to IL2006 are the same.

As shown in FIG. 36, the illumination light beam EL0 from the light source device 2055 (see FIG. 24) including the light guide member 2060 and the lens system 2061 is incident on the fly-eye lens 2062 of the illumination optical system IL2001 (see FIGS. 25 and 28 to 30). . A plurality of point light source images generated on the surface Ep of the fly-eye lens 2062 as the source of the illumination beam are uniformly illuminated on the surface 2014b conjugated to the mask provided with the illumination field diaphragm 2064 by the condenser lens 2065. distributed. The illumination beam passing through the opening of the illumination field diaphragm 2064, the base material (quartz, etc.) of the concave lens 2040 of the second optical system 2015 of the transmission lens system 2066, the projection optical system PL2001 (first stage), and the concave lens 2040 The window portion (2042) of the reflecting surface p2004, the second optical system 2015, and the reflection plane 2041a on the upper side of the chirping mirror 2041 are reflected in the direction along the extension line ID2001 and reach the illumination area on the cylindrical mask M IR.

As in the previous configuration of FIG. 23, since the reflective surface p2004 of the concave mirror 2040 is disposed on the pupil surface pd in the imaging beam of the projection optical system PL2001, its reflective surface p2004 is disposed substantially in common with the surface Ep on the exit side of the fly-eye lens 2062. The yoke thus generates a plurality of point light source image relays generated on the surface Ep on the exit side of the fly-eye lens 2062 in the window portion 2042 formed on the reflection surface p2004.

In the specific configuration of FIG. 36, a focusing correction optical member 2080 and an image are provided along the inclined extension line D2001 between the reflection plane 2041a on the upper side of the chirped mirror 2041 and the pattern surface p2001 of the cylindrical mask M.移 optic member 2081. The focus-correcting optical member 2080 is, for example, a pair of wedge-shaped ridges (reverse direction in the X direction in FIG. 36) laminated into a transparent parallel plate as a whole. By sliding the pair of cymbals, the thickness of the parallel flat plate can be changed, the effective optical path length of the imaging beam can be changed, and the focus state of the pattern image formed on the middle image plane p2007 and the projection area PA2001 can be fine-tuned.

The image shift correction optical member 2081 is composed of a transparent parallel plate glass that can be tilted in the XZ plane in FIG. 36 and a transparent parallel plate glass that can be tilted in a direction orthogonal thereto. By adjusting the inclination amounts of the two parallel flat glass plates, the pattern image formed on the intermediate image plane p2007 and the projection area PA2001 can be slightly shifted in the X direction or the Y direction.

Next, the image of the mask pattern appearing in the illumination area IR2001 passes through the focus correction optical member 2080, the image shift correction optical member 2081, the reflection plane 2041a of the chirped mirror 2041, and the upper side (first stage) of the projection optics PL2001. The second optical system 2015 and the reflection plane 2041b of the chirped mirror 2041 are imaged on the intermediate image plane p2007, where the intermediate image plane p2007 can be arranged so that the shape of the projection area PA201 becomes a trapezoidal field diaphragm 2075 as shown in FIG. 35. In this case, the opening portion of the illumination field diaphragm 2064 provided in the illumination optical system IL2001 may be a rectangle (rectangle) including a trapezoidal opening portion of the field diaphragm 2075.

The imaging beam that becomes an intermediate image at the opening of the field diaphragm 2075 passes through the reflection plane 2076a, the second optical system 2077, and the chirped mirror 2076 that constitute the lower side (second stage) of the projection optical system PL2001. The reflection plane 2076b is projected on a projection area PA2001 on the substrate P wound around the outer peripheral surface p2002 of the rotating reel 2030. The reflecting surface of the concave mirror 2078 included in the second optical system 2077 is arranged on the pupil plane pd, and the reflecting plane 2076b on the lower side of the chirping mirror 2076 is set to an angle of 45 ° or less with respect to the XY plane, so that the main ray of the imaging beam Travel along an extension line D2001 inclined to the center plane pc.

Next, in the specific configuration of FIG. 36, a magnification correcting optical member 2083 is provided between the reflection plane 2076b below the chirping mirror 2076 and the projection area PA2001 wound on the substrate P of the rotary reel 2030, which is a concave lens The three lenses, the convex lens, and the concave lens are coaxially arranged at a predetermined interval, and the front and rear concave lenses are fixed, so that the convex lens therebetween moves in the direction of the optical axis (principal light). Thereby, the pattern image formed in the projection area PA2001 can be enlarged or reduced by a small amount while maintaining a telecentric imaging state.

In addition, although not shown in FIG. 36, a rotation correction mechanism capable of rotating either one of the holmium mirror 2041 or the holmium mirror 2076 slightly around an axis parallel to the Z axis is also provided. This rotation correction mechanism rotates each of the plurality of projection areas PA2001 to PA2006 (and the projected mask pattern image) shown in FIG. 35 slightly within the XY plane, for example.

As described above, in the seventeenth embodiment, as shown in FIGS. 34 and 36, each of the six sets of projection optical systems PL2001 to PL2006 can have a main ray that intersects with the central axis of rotation AX2001 of the cylindrical mask M The illumination light illuminates each of the illumination areas IR2001 to IR2006 on the outer peripheral surface (pattern surface) of the cylindrical mask M.

Further, the imaging beam is deflected such that the main light rays traveling from the respective illumination areas IR2001 to IR2006 toward the normal direction of the pattern surface p2001 of the cylindrical mask M are also incident from the normal direction to the substrate P along the outer peripheral surface p2002. The projection area above is PA2001 ~ PA2006. Therefore, it is possible to reduce the defocus of the projected image, suppress the occurrence of processing defects such as poor exposure, and as a result, the occurrence of defective elements can be suppressed.

In addition, each of the projection optical systems PL2001 to PL2006 is formed between the outer peripheral surface of the cylindrical mask M and the chirped mirror 2041 (reflection plane 2041a) so that the main ray of the imaging beam is inclined with respect to the center plane pc. Therefore, the conditions for the spatial arrangement of each of the projection optical systems PL2001 to PL2006, and the conditions of interference (collision) with each other, are alleviated.

In addition, the reflection plane 2076b on the lower side of the chirping mirror 2041 and the reflection plane 2076a on the upper side of the chirping mirror 2076 are set at an angle of 45 ° with respect to the XY plane to image through each of the intermediate image planes p2007 of the projection optical systems PL2001 to PL2006. The main ray of the light beam is parallel to the central plane pc.

    [Modification of the 17th embodiment]    

In the exposure apparatus provided with the projection optical system of the multi-lens method shown in Figs. 34 to 36, although the image of the mask pattern in a cylindrical shape is projected and exposed on the surface of the substrate P supported in a cylindrical shape, However, the photomask M or the substrate P may be configured to support either one of the planes, or may support both planes. For example, as shown in FIG. 34, the substrate P can be wound around a rotating reel 2030 to be supported in a cylindrical shape, and the mask M can be formed by scanning in a parallel plane glass (quartz) and moving linearly in the X direction. Exposure method, or conversely, the photomask M may be supported by the rotating reel 2020 as shown in FIG. 34, and the substrate P may be supported by a flat surface stage or an air cushion-type holder and linearly moved in the X direction. Either way.

Moreover, the projection optical system and the illumination optical system of the previous embodiments can be applied regardless of whether the supporting form of the mask M or the substrate P is a cylindrical surface or a planar shape, but as long as it is supported on a plane parallel to the XY plane The angle of inclination of the reflecting plane 2041a on the upper side of the chirping mirror 2041 or the reflecting plane 2076b on the lower side of the chirping mirror 2076 can be set to 45 °. In other words, as long as the normal line passing through the center of the illumination area IR (object surface) on the reticle M or the center of the projection area PA (image surface) on the substrate P is matched, the principal ray on the object surface side of the optical system will be projected Or the main ray on the image plane side can be tilted in the XZ plane.

    [18th embodiment]    

FIG. 37 is a diagram showing a configuration of a projection optical system PL (PL2001 in the case of a multi-lens method) of the eighteenth embodiment. The projection optical system PL (PL2001) of this embodiment reflects the imaging light beam EL2 (the main light is EL6) from the mask pattern in the illumination region IR (IR2001) on the outer peripheral surface of the cylindrical mask M on a plane. The reflecting surface 2100a of the mirror 2100 reflects through the second optical system 2015 (half-field type of refracting imaging system) having a concave mirror 2040 having a reflecting surface p2004 disposed on the pupil surface, and reflects it on the reflecting surface 2101a of the flat mirror 2101. On the intermediate image plane Im, an equal multiple intermediate image of the mask pattern appearing in the illumination area IR (IR2001) is formed.

Further, the intermediate image formed on the intermediate image plane Im is supported by a magnified imaging system 2102 (having an optical axis 2102a parallel to the Z axis) projected on a peripheral surface p2002 parallel to the XY plane by a magnification of, for example, two times or more. Projection area PA (PA2001) on the substrate P. The substrate P is supported on a plane holder HH having a pad for a fluid bearing having a flat surface through the fluid bearing layer. In this embodiment, similarly, a plurality of point light source images are generated on the reflecting surface p2004 of the concave mirror 2040 constituting the projection optical system PL (PL2001) by the illumination light from the illumination optical system IL (IL2001) at the back. Sf transmitted window portion 2042.

The magnifying projection optical system as shown in FIG. 37 is multi-lensed. When exposing a mask pattern having a large size in the Y direction, the projection optical system PL (PL1) including the illumination optical system IL (IL2001) and the flat mirrors 2100 and 2101 is exposed. The groups are arranged in the XZ plane so as to be symmetrical with respect to the center plane pc as shown in the previous Figs. 34 and 35, and are separated and arranged in the Y direction to project on the Y-direction end (triangular part) of the projection area PA (PA2001). Like parts overlap.

In this embodiment, when the central plane pc is a plane including the rotation central axis AX2001 of the cylindrical mask M and perpendicular to the XY plane (outer peripheral surface p2002), the projection optical system PL2001, PL2003, etc. with an odd number The central points of the areas IR2001, IR2003 ... (for example, the point where the main ray EL6 passes), because the main ray EL6 on the photomask side is inclined with respect to the central plane pc, so from the outer peripheral surface and the central plane of the cylindrical photomask M The intersection of pc starts at the perimeter separation distance DMx. Therefore, the center points of the illumination areas IR2002, IR2004 ... of even-numbered projection optical systems PL2002, PL2004 ... are also separated on the perimeter from the intersection of the outer surface of the cylindrical mask M and the center plane pc. Distance DMx. Therefore, the odd-numbered illumination regions IR2001 ... and the even-numbered illumination regions IR2002 ... are separated from each other in the circumferential direction on the cylindrical mask M (2DMx).

On the other hand, the center points of the projection areas PA2001, PA2003 ... of the odd-numbered projection optical systems PL2001, PL2003 ... (for example, the point where the main ray EL6 passes) are separated from the center plane pc in the X direction on the substrate P The distance DFx, therefore, the projection area PA2001 of the odd number and the projection area PA2002 of the even number are separated by a distance (2DFx) in the X direction on the substrate P. Therefore, when the respective illumination areas IR2001, IR2002 ... formed on the cylindrical mask M are uniformly formed in the circumferential direction, if the projection optical systems PL2001, PL2002 ... are enlarged, If the magnification is set to Mp, it needs to be set to satisfy the relationship of MP‧ (2DMx) = 2DFx. If it is impossible to construct the above conditions due to structural problems, as long as the odd-numbered illumination areas IR2001, IR2003 ... formed on the cylindrical mask M and the even-numbered illumination areas IR2002, The mask pattern used for IR2004 ... can be relatively staggered in the circumferential direction.

    [19th Embodiment]    

Fig. 38 is a diagram showing a configuration of a projection optical system PL in a nineteenth embodiment. The projection optical system PL of this embodiment is composed of a lens system 2103, a lens system 2104, a concave mirror (reflection optical member) 2040 disposed on a pupil surface, deflection mirrors 2106, 2107, and a lens system 2108.

In this embodiment, the imaging beam EL2 from the illumination area IR on the outer peripheral surface of the cylindrical mask M is on the optical axis 2103a of the lens system 2103, and enters the lens system 2103 through a half field of view on the -X side, and The incident lens system 2104 (its optical axis 2104a is coaxial with the optical axis 2103a). The imaging beam EL2 passing through the lens system 2103 is reflected on the reflective surface p2004 of the concave mirror 2040 (its optical axis is 2104a), and is reflected on the reflective surface p2106a of the deflection mirror 2106 toward the -X direction, and is guided to the lens systems 2103, 2104, and the concave mirror 2040. After the formed light path is out, it is reflected toward the -Z direction on the reflecting surface 2107a of the deflection mirror 2107.

The imaging beam EL2 reflected by the deflector 2107 is irradiated onto the projection area PA through the lens system 2108. With the above optical path, the projection optical system PL images the image of the mask pattern appearing in the illumination region IR on the mask M on the projection region on the substrate P which is planarly supported by the same structure as in FIG. 37. Within PA. The projection optical system of this embodiment is designed not to form an intermediate image plane, in particular, to achieve a magnified projection with a small system. In addition, the extension line D2001 of the main ray EL6 of the cylindrical mask M side of the projection optical system PL is set to cross the central axis AX2001 of rotation of the cylindrical mask M, and the main ray EL6 of the substrate P side is set. It is perpendicular to the surface of the substrate P supported by the plane.

In FIG. 38, the imaging beam EL2 from the illumination area IR can be designed to be the -X side of the optical axis 2108a (parallel to the Z axis and perpendicular to the substrate P) of the lens system 2108 that gives the main magnification. Therefore, the part from the + X side from the optical axis 2108a of the lens system 2108 is cut away, and the part is not helpful for the projection of the mask pattern. Thereby, the size of the X direction (scanning direction of the substrate P) of the projection optical system PL can be reduced.

In this embodiment, as in the previous FIG. 21, FIG. 23, FIG. 31, FIG. 32A, 32B, and FIG. 37, the illumination optical system IL and the light source device 2055 are arranged on the back side of the concave mirror 2040, and a plurality of point light source images Sf are generated in It is formed in the window portion (2042) of the reflective surface p2004 (arranged on the pupil surface) of the concave mirror 2040. The distribution on the reflection surface p2004 of the point light source image and the shape or arrangement of the window portion in the reflection surface p2004 are set as shown in Figs. 27 to 30 or Figs. 33A to 33C according to the conditions described previously in Fig. 22.

As in each of the above-mentioned embodiments or modifications (FIGS. 12, 21, and 34 to 38), the cylindrical mask M is assumed to have a pattern formed by a reflective portion and a non-reflective portion formed directly on a metal, ceramic, The surface of a cylindrical base material such as glass, but it can also be made into a sheet-shaped reflective photomask with a pattern of reflective film formed on one side of a short strip-shaped ultra-thin glass plate (for example, thickness of 100 to 500 μm) with good flatness. It is curved and wound along the outer peripheral surface of the metallic rotating reel 2020.

The above-mentioned sheet-shaped reflective mask can also be permanently attached to the outer peripheral surface of the rotating reel 2020, and can also be fixed to be releasable (replaceable). Such a sheet-shaped reflective mask includes, for example, a film having a material having a high reflectance to the illumination light beam EL1 such as aluminum or a dielectric multilayer film. In this case, the rotating reel 2020 may be provided with a light-shielding layer (film) that absorbs the illumination light beam EL1 passing through the transparent portion of the sheet-shaped reflective mask, and the light-shielding layer also suppresses the generation of stray light.

In addition, the cylindrical mask M may include a pattern in which only one element (a display element) is formed on the entire circumference, or a pattern in which a plurality of patterns corresponding to one element (a display element) are formed. Furthermore, the element pattern on the cylindrical mask M may be arranged repeatedly in the circumferential direction of the outer peripheral surface, or a plurality of patterns may be arranged in a direction parallel to the rotation center axis AX2001. In addition, a pattern for manufacturing a first element and a pattern for manufacturing a second element different from the first element may be provided on the cylindrical mask M.

    [Element manufacturing method]    

Next, a device manufacturing method will be described. Fig. 39 is a flowchart showing a method for manufacturing a device according to this embodiment.

In the device manufacturing method shown in FIG. 39, first, for example, the function and performance design of a display panel of a self-luminous device such as an organic EL is designed, and a necessary circuit pattern or wiring pattern is designed by CAD or the like (step 201). Next, a mask M (cylindrical or planar) of each necessary layer portion is produced based on the design of each pattern and other elements of various layers designed by CAD or the like (step 202). In addition, first, a transparent substrate or a substrate with a rolled element substrate, such as a transparent film or sheet, or an extremely thin metal foil, or a flexible substrate (resin film, metal foil film, plastic, etc.) as a display element substrate is prepared by purchasing or manufacturing. Etc.) (step 203).

In addition, the roll-shaped substrate prepared in step 203 can also be a person who has modified its surface if necessary, has a base layer formed in advance (for example, small unevenness formed by embossing), and has a pre-stacked function of light sensitivity. Film or transparent film (insulating material).

Next, the prepared substrate is put into a reel-type or batch-type manufacturing line, and electrodes or wirings constituting elements such as display panel elements, insulating films, and semiconductor films (thin-film semiconductors) such as TFTs are formed on the substrate. The bottom layer is a light-emitting layer of a self-light-emitting element such as an organic EL as a display pixel portion, which is formed by being laminated on the bottom layer (step 204). The step 204 typically includes a step of forming a resist pattern on a film on the substrate, and a step of etching the film using the resist pattern as a photomask. The formation of the resist pattern is a step of uniformly forming a resist film on the surface of the substrate, and exposing the resist film of the substrate with the exposure light patterned through the photomask M according to the above-mentioned embodiments. A step of forming a latent image with a mask pattern by the exposure.

In the case of manufacturing a flexible element using a printing technique or the like, it is a step of forming a functional sexy light layer (photosensitive silane coupling material) on a substrate surface by a coating method. The patterned exposure light irradiates the functional sexy light layer and forms a pattern on the functional sexy light layer to form a hydrophilic part and a water-repellent part according to the pattern shape. The functional hydrophilic light layer has a high hydrophilicity. A step of partially coating a plating base liquid or the like and depositing a metallic pattern by electroless plating, etc.

In addition, in this step 204, although the conventional lithographic step of exposing the photoresist layer using the exposure device described in the previous embodiments is also included, it also includes pattern exposure to the photo-sensitive catalyst layer by The electrolytic plating method is a wet step of forming a pattern (wiring, electrode, etc.) of a metal film, or a printing step of drawing a pattern using a conductive ink containing silver nano particles, or the like.

Secondly, according to the manufactured element, each of the display elements continuously manufactured on a long substrate, such as a reel, is cut or cut, or other substrates, such as a protective film (for a protective film, to be manufactured in other steps), are implemented. Environmental shielding layer), a sheet-like color filter with a sealing function, or a thin glass substrate, etc., which are attached to the surface of each display panel element to assemble the element (step 205). Next, post-processing (step) is performed to check whether the display panel element functions normally or whether it meets the desired performance or characteristics (step 206) (step 206). In the above manner, elements such as a display panel (flexible display) can be manufactured.

In addition, the technical scope of the present invention is not limited to those described in the above embodiments or modifications. For example, one or more of the constituent elements described in the above embodiments or modifications may be omitted. In addition, the constituent elements described in the above embodiments or modifications may be appropriately combined.

Claims (10)

    A method for manufacturing an element is to form a pattern for the element on the sheet substrate while continuously transferring the flexible sheet substrate in one direction. The method includes: making a circle with a certain radius from the first center line; The cylindrical mask formed with a transmissive or reflective mask pattern corresponding to the pattern of the aforementioned element rotates around the first centerline; by having a second center parallel to the first centerline The line is a cylindrical body with a cylindrical outer peripheral surface of a certain radius, and while the sheet substrate is bent and supported, the sheet substrate is moved in a circumferential direction along the outer peripheral surface; by a set of projections The operation of exposing the projection image of the mask pattern on the sheet substrate by the optical system, the set of projection optical systems is configured to be symmetrical with respect to a center plane including the first center line and the second center line, and When the mask pattern of the cylindrical mask is used as the object surface and the surface of the sheet substrate supported by the cylindrical body is used as the image surface, the main ray of the imaging beam from the object surface to the image surface passes through the object. The principal ray toward the extension line of the first center line, toward the center line through the extended line of the second main surface of the light rays of the image.         For example, in the method for manufacturing a component according to item 1 of the patent application, wherein when the aforementioned mask pattern of the aforementioned cylindrical mask is set to a reflective type, polarized light arranged between each of the aforementioned set of projection optical systems and the aforementioned mask pattern is used. The beam splitter irradiates illumination light toward each of a group of illumination areas set on the mask pattern corresponding to each of the aforementioned set of projection optical systems, and causes each of the reflections in the aforementioned group of illumination areas to come from the mask pattern The aforementioned imaging beam is incident on each of the aforementioned set of projection optical systems via the aforementioned polarizing beam splitter.         For example, the method for manufacturing a component according to item 2 of the patent application, wherein a wavelength plate is provided between the aforementioned mask pattern and the aforementioned polarizing beam splitter, and the aforementioned polarizing beam splitter is configured to allow the aforementioned illumination light set to be linearly polarized to enter and cause The illumination light is reflected to the illumination area through the wavelength plate, and the imaging light beam reflected in the illumination area is transmitted to the projection optical system via the wavelength plate and the polarized beam splitting.         For example, the method of manufacturing a component according to item 3 of the patent application, wherein the main light passing through the object plane is a main light passing through the center of the illumination area set on the mask pattern, and the main light passing through the image plane is passed through The main ray at the center of the projection area on the sheet-like substrate projected by the imaging beam from the aforementioned projection optics.         For example, the method for manufacturing a component according to item 4 of the patent application, wherein each of the aforementioned set of projection optical systems includes: a first optical system having a first optical axis perpendicular to the central plane, and incident from the aforementioned set of illumination areas One of the imaging beams generated by one party and traveling through the wavelength plate and the polarizing beam splitter forms an intermediate image of the mask pattern; and a second optical system having a second optical axis perpendicular to the central plane and incident thereon The imaging beam, which becomes the intermediate image, re-images the intermediate image on the projection area; the main ray of the imaging beam generated from the illumination area is set as the first main ray, and the imaging is directed toward the projection area. When the main ray of the light beam is set as the second main ray, the first optical axis and the first main ray are set at an obtuse angle of 90 ° or more in a plane perpendicular to the first center line and the second center line. The second optical axis and the second main ray are set at an obtuse angle of 90 ° or more.         For example, the method for manufacturing a component according to item 5 of the patent application, wherein each of the aforementioned set of projection optical systems is set to the aforementioned light that will appear in the aforementioned illumination area by the aforementioned first optical system and the aforementioned second optical system. The image of the mask pattern is projected into the projection area at equal magnification, and an obtuse angle of 90 ° or more of the first optical axis and the first main ray, and 90 ° or more of the second optical axis and the second main ray The obtuse angles are set equal.         For example, the method for manufacturing a component according to item 1 of the patent application range, wherein the aforementioned projection optical system is arranged on one of the aforementioned central planes when viewed in a plane perpendicular to the aforementioned first central line and the aforementioned second central line. The first projection module on the side and the second projection module arranged on the other side of the center plane to be symmetrical to the first projection module; the first projection module and the second projection module are in The directions of the first center line or the second center line are arranged separately, and the mask patterns formed in different areas of the cylindrical surface of the cylindrical mask in which the mask pattern is formed are formed in different directions of the first center line. Each of them is simultaneously projected onto the aforementioned sheet substrate.         For example, in the method for manufacturing a component according to item 7 of the patent application, wherein when the aforementioned mask pattern of the aforementioned cylindrical mask is set as a reflection type, the imaging light path is arranged between the aforementioned first projection module and the aforementioned mask pattern. The first polarizing beam splitter irradiates illumination light toward a first illumination area corresponding to the first projection module set on the mask pattern, and is disposed between the second projection module and the mask pattern. The second polarizing beam splitter in the imaging light path irradiates the illumination light toward a second illumination area corresponding to the second projection module set on the mask pattern.         The element manufacturing method according to any one of claims 1 to 8 in the patent application scope, wherein the first state is set so that the radius of the outer peripheral surface of the cylindrical body is the same as the radius of the cylindrical surface of the cylindrical mask, and Any of the second states in which the surface radius of the sheet-shaped substrate supported in a cylindrical shape by the outer peripheral surface of the cylindrical body and the cylindrical surface radius of the cylindrical mask are made the same.         A device manufacturing method comprising bending a portion of a strip direction of a flexible strip-shaped substrate having a flexible functional layer formed on a surface in a strip direction and supporting the strip-shaped substrate in any one of claims 1 to 8 In the state of the outer peripheral surface of the cylindrical body of one item, the operation of rotating the cylindrical body at a predetermined rotation speed around the second center line and moving the sheet substrate at a predetermined speed in a long direction; The aforementioned cylindrical mask according to any one of the first to eighth patent scopes, which rotates around the first center line at a rotational speed synchronized with the rotational speed of the cylindrical body; and between the aforementioned cylindrical mask and the aforementioned During the synchronous rotation of the cylindrical body, the projection image of the mask pattern of the cylindrical mask is scanned and exposed to the sheet substrate by the aforementioned set of projection optical systems according to any one of the claims 1 to 8. The operation of the photosensitive functional layer.