TWI585541B - A substrate processing apparatus, an element manufacturing system, and an element manufacturing method - Google Patents

Description

Substrate processing apparatus, component manufacturing system, and component manufacturing method

The present invention relates to a substrate processing apparatus, a component manufacturing system, and a component manufacturing method.

The present application claims priority based on Japanese Patent Application No. 2011-278290, filed on Dec. 20, 2011, and Japanese Patent Application No. 2012-024058, filed on Feb. 7, 2012.

A substrate processing apparatus such as an exposure apparatus, for example, described in Patent Document 1 below, is used for the manufacture of various elements. The substrate processing apparatus can project an image of a pattern formed on the mask M disposed in the illumination area onto a substrate or the like disposed in the projection area. The mask M used for the substrate processing apparatus has a flat shape or a cylindrical shape.

Further, as one of the methods for manufacturing an element, for example, a roll to roll method described in Patent Document 2 below is known. In the roll-to-roll method, the substrate is subjected to various treatments on the transport path while the substrate is transported from the take-up reel to the take-up reel. The substrate is sometimes subjected to a treatment in a substantially planar state, for example, between the transfer rollers. Further, the substrate is also subjected to treatment in a state of being bent, for example, on the surface of the drum.

Advanced technical literature

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-299918

[Patent Document 2] International Publication No. 2008/129819

In the above-described substrate processing apparatus (exposure apparatus), for example, when one or both of the illumination areas on the reticle and the projection area on the substrate are bent at a predetermined curvature, if the imaging performance of the projection optical system for exposure is considered, In particular, a limitation is imposed on the setting of the chief ray of the imaging beam. For example, it is assumed that a reticle pattern of a cylindrical surface of a cylindrical rotating reticle formed at a radius R is projected by a projection optical system onto a substrate of a cylindrical rotating reel (roller) wound at a radius R ( The surface of the film, sheet, mesh, etc.). In this case, generally, the chief ray of the imaging beam from the reticle pattern (cylindrical shape) to the surface of the substrate (cylindrical surface) is formed to form a central axis of rotation of the cylindrical rotating reticle with a circle The projection optical system of the optical path in which the central axis of the rotation of the cylinder rotating drum is linearly connected may be used.

However, in the case where the size of the reticle pattern is large in the direction of the rotation axis of the cylindrical rotating reticle, it is sometimes necessary to provide a plurality of such projection optical systems in the direction of the rotating shaft. In the case of such a multiplication, even if a plurality of projection optics are closely arranged in a row in the direction of the rotation axis, the projection fields (projection areas) of the projection optical systems must separate the thickness of the metal such as the lens barrel. The large mask pattern cannot be faithfully exposed.

Further, when the substrate processing apparatus described above is complicated, for example, when the configuration of the apparatus is complicated, there is a possibility that the apparatus cost is increased and the apparatus size is increased. As a result, it is possible to increase the manufacturing cost of the component.

For example, when precision patterning must be applied, as a substrate processing apparatus, An exposure device that illuminates a mask that has a pattern of electronic components or display elements and that projects light from a pattern of the reticle onto a substrate on which a photosensitive layer (photoresist or the like) is formed is used. In the case where the pattern of the photomask is repeatedly exposed to the continuously conveyed flexible long substrate (film, sheet, net, etc.) by the roll-to-roll method, if the transport direction of the long substrate is also used as the scanning direction, In the case of a scanning type exposure apparatus in which a cylindrical rotating reticle is used as a reticle, productivity jumpability can be expected.

Such a rotating reticle is formed by a transmissive portion in which a light-shielding layer is formed on a peripheral surface of a transparent cylinder such as glass, and a reflective portion and an absorbing portion are formed on the outer peripheral surface of the metallic cylindrical body (or a cylindrical body). The way the pattern is reflected. In a transmissive cylindrical reticle, an illumination optical system (an optical member such as a mirror or a lens) for illuminating illumination light having a pattern toward the outer peripheral surface must be incorporated in the cylindrical reticle, and it is difficult to pass the rotating shaft through the cylindrical light. The inner center of the cover has a complicated structure in which the cylindrical reticle holding structure or the rotary drive system is complicated.

On the other hand, in the case of a reflective cylindrical mask, since a metal cylindrical body (or a cylindrical body) can be used, it is possible to inexpensively form a photomask, but it is necessary to provide illumination in a peripheral space outside the cylindrical mask. The illumination optical system for illuminating light for exposure and the projection optical system for projecting the reflected light from the pattern formed on the outer peripheral surface onto the substrate, and the composition of the exposure device side to satisfy the required resolution, transfer faith, and the like A complicated situation.

An aspect of the present invention is to provide a substrate processing apparatus that can mount a large light even if one or both of a mask or a substrate (a flexible substrate such as a film, a sheet, or a mesh) are arranged in a cylindrical shape. The mask pattern faithfully exposes the projection optics used. Other purposes, to provide a larger mask pattern A component manufacturing system and a component manufacturing method for field exposure.

Further, another object is to provide a substrate processing apparatus capable of simplifying the configuration of the apparatus. Further, another object is to provide a component manufacturing system and a component manufacturing method capable of reducing manufacturing costs.

According to an aspect of the present invention, a substrate processing apparatus including: a projection optical system that projects a light beam from an illumination region on a first object (photomask) onto a second object (substrate); The support member supports one of the first object and the second object so as to be along the first surface curved in a cylindrical shape with a predetermined curvature in one of the illumination region and the projection region; and the second support member; The other of the first object and the second object is supported along the predetermined second surface in the other of the illumination region and the projection region; the projection optical system includes a deflecting member that is from the illumination region to The imaging light beam propagates so that the chief ray between the first surface of the imaging beam and the projection optical system in the projection region is directed in the radial direction of the first surface and the second surface is non-perpendicular.

According to another aspect of the present invention, a component manufacturing system including the substrate processing apparatus of the above aspect is provided.

According to another aspect of the present invention, a method of manufacturing a device includes: exposing a second object by the substrate processing apparatus of the above aspect; and forming a pattern of the first object by processing the exposed second object.

According to another aspect of the present invention, a substrate processing apparatus is provided for projecting and exposing an image of a reflective mask pattern onto a sensing substrate, comprising: a mask holding member for holding a mask pattern; and a projection optical system for setting to A reflected beam generated by a portion of the illumination region of the mask pattern is projected onto the sensing substrate, thereby imaging an image of a portion of the mask pattern onto the sensing substrate; and the optical member includes: disposed in the projection optical system for obliquely illuminating the illumination region a portion of the light path that passes between one of the illumination light from the illumination region and the reflected light beam that is generated from the illumination region, and a portion that reflects the other; and the illumination optical system generates a light source image that is a source of the illumination light, and is projected through the projection A portion of the optical path and the optical member direct the illumination light from the source image to the illumination region, and a conjugate surface that is optically conjugate with the source image is formed at or near the reflective portion or the passage portion of the optical member.

According to another aspect of the present invention, a substrate processing apparatus is provided for projecting and exposing an image of a reflective mask pattern onto a sensing substrate, comprising: a mask holding member for holding a mask pattern; and a projection optical system for setting The reflected light beam generated by the illumination region of a portion of the mask pattern is projected onto the sensing substrate, thereby imaging an image of a portion of the mask pattern onto the sensing substrate; and the optical member includes: disposed in the projection optics for obliquely illuminating the illumination region a portion of the light path that passes between the illumination light from the illumination region and the reflected light beam from the illumination region and the portion that reflects the other; and the illumination optical system that serves as a source of illumination light It is formed regularly or in a random number at or near the position of the reflecting portion or the passing portion of the optical member.

According to another aspect of the present invention, a component manufacturing system including the substrate processing apparatus of the above aspect is provided.

According to another aspect of the present invention, a method of manufacturing a device comprising: exposing an object by the substrate processing apparatus of the above aspect; and making the exposure The object is developed.

According to another aspect of the present invention, a method for manufacturing a device is disclosed in which a flexible sheet substrate is continuously transferred in a longitudinal direction and a pattern for a component is formed on the sheet substrate, which comprises: a cylindrical mask having a transmissive or reflective reticle pattern corresponding to the pattern of the element is rotated around the first center line; the center line is parallel to the first center line The second center line is a cylindrical body having a cylindrical outer peripheral surface having a certain radius, and a part of the sheet substrate is bent and supported, and the sheet substrate is transferred to the longitudinal direction; the reticle pattern is patterned by a set of projection optical systems The projected image is exposed on the sheet substrate, and the set of projection optical systems is configured to be substantially symmetrical with respect to a center plane including the first center line and the second center line, and the reticle pattern of the cylindrical mask is used as a object surface When the surface of the sheet-shaped substrate supported by the cylindrical body is used as the image plane, the chief ray of the imaging light beam from the object surface to the image plane passes through the extension line of the chief ray of the object surface toward the first center line, and passes through the image plane. The extension of the light is toward the second Center line.

According to the aspect of the present invention, even if one or both of the photomask and the substrate are cylindrical, it is possible to faithfully expose a large mask pattern by a substrate processing apparatus (exposure apparatus) having a small projection optical system. . Further, according to the aspect of the invention, it is possible to provide a component manufacturing system and a device manufacturing method capable of faithfully exposing a large mask pattern.

Further, according to the aspect of the invention, it is possible to provide a substrate processing apparatus capable of simplifying the configuration of the apparatus. Moreover, according to the aspect of the invention, it is possible to provide a component manufacturing system and a component manufacturing method capable of reducing the manufacturing cost.

[First Embodiment]

Fig. 1 is a view showing the configuration of a component manufacturing system 1001 of the present embodiment. The component manufacturing system 1001 shown in FIG. 1 includes a substrate supply device 1002 that supplies a substrate P, a processing device 1003 that performs a predetermined process on a substrate P supplied from the substrate supply device 1002, and a recovery process that has been processed by the processing device 1003. The substrate recovery device 1004 of the substrate P and the upper control device 1005 of each unit of the control element manufacturing system 1001.

In the present embodiment, the substrate P is a flexible (sheet) substrate such as a flexible substrate. In the component manufacturing system 1001 of the present embodiment, a flexible component can be manufactured by the flexible substrate P. The substrate P is selected, for example, to have a degree of flexibility that does not break when the component manufacturing system 1001 is bent.

Further, the flexibility of the substrate P at the time of component manufacture can be adjusted, for example, depending on the material, size, thickness, and the like of the substrate P, and can be adjusted depending on environmental conditions such as humidity and temperature at the time of component manufacture. Further, the substrate P may be a substrate that does not have flexibility such as a so-called rigid substrate. Further, the substrate P may be a composite substrate in which a flexible substrate and a rigid substrate are combined.

As the flexible substrate P, a foil made of a metal or an alloy such as a resin film or stainless steel can be used. The material of the resin film includes, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate resin. , polystyrene resin, polyvinyl alcohol resin One or two or more.

The characteristics of the substrate P such as the coefficient of thermal expansion and the like are set to substantially neglect the amount of deformation caused by heat applied to various processing steps of the substrate P. For the substrate P, for example, it is possible to select a coefficient of thermal expansion that is not significantly large. The thermal expansion coefficient can be set to be smaller than the threshold value corresponding to the process temperature or the like by, for example, mixing the inorganic filler with the resin film. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like. Further, the substrate P may be an extremely thin glass monomer having a thickness of about 100 μm manufactured by a floating method or the like, or a laminate of the above-mentioned resin film and aluminum foil bonded to the ultra-thin glass.

In the present embodiment, the substrate P is a so-called multi-faceted substrate. In the component manufacturing system 1001 of the present embodiment, various processes for manufacturing one component are repeatedly performed on the substrate P. The substrate P subjected to various treatments is divided into various elements to form a plurality of elements. The size of the substrate P is, for example, about 1 m to 2 m in the width direction (short side direction) and 10 m or more in the longitudinal direction (longitudinal direction).

Further, the size of the substrate P can be appropriately set depending on the size of the element to be manufactured and the like. For example, the size of the substrate P may be 1 m or less or 2 m or more in the width direction, and may be 10 m or less in the longitudinal direction. Further, when the substrate P is a so-called multi-faceted substrate, it may be a strip-shaped substrate or a substrate in which a plurality of substrates are connected. Further, the component manufacturing system 1001 can also manufacture an element by a substrate independent of each component. In this case, the substrate P may be a substrate equivalent to the size of one element.

The substrate supply device 1002 of the present embodiment supplies the substrate P to the processing device 1003 by feeding the substrate P wound on the supply reel 1006. base The board supply device 1002 includes, for example, a shaft portion on which the substrate P is wound, a rotation driving portion that rotates the shaft portion, and the like. In the present embodiment, the substrate P is transported in the longitudinal direction and sent to the processing device 1003. That is, in the present embodiment, the transport direction of the substrate P is substantially the same as the longitudinal direction of the substrate P.

Further, the substrate supply device 1002 may include a cover portion or the like that covers the substrate P wound on the supply reel 1006. Further, the substrate supply device 1002 may include a mechanism for sequentially feeding the substrate P toward the longitudinal direction thereof, for example, a clamp type driving roller.

In the substrate recovery apparatus 1004 of the present embodiment, the substrate P is recovered by winding the substrate P passing through the processing apparatus 1003 on the collection reel 1007. The substrate collection device 1004 includes, for example, a shaft portion around which the substrate P is wound, a rotation driving portion that rotates the shaft portion, and a cover portion that covers the substrate P that is wound around the collection reel 1007, in the same manner as the substrate supply device 1002.

Further, the substrate P after the processing is cut by the cutting device, and the substrate collecting device 1004 can also collect the cut substrate. In this case, the substrate recovery device 1004 may be a device that overlaps the cut substrate to recover the device. The above-described cutting device may be part of the processing device 1003 or may be different from the processing device 1003, for example, may be part of the substrate recovery device 1004.

The processing device 1003 transfers the substrate P supplied from the substrate supply device 1002 to the substrate collection device 1004, and processes the processed surface of the substrate P during the transfer. The processing apparatus 1003 includes a processing apparatus 1010 that processes a surface to be processed of the substrate P, and a transport apparatus 1009 that includes a transport drum 1008 that transfers the substrate P under conditions corresponding to the processing.

The processing device 1010 includes one or more devices for performing various processes for forming the constituent elements of the substrate P on the processed surface of the substrate P. In the component manufacturing system 1001 of the present embodiment, the apparatus for performing various processes is appropriately disposed along the transport path of the substrate P, and an element such as a flexible display can be produced by a so-called roll-to-roll method. With the roll-to-roll method, components can be produced with good efficiency.

In the present embodiment, various devices of the processing device 1010 include a film forming device, an exposure device, a coating and developing device, and an etching device. The film forming apparatus is, for example, a gold plating apparatus, a vapor deposition apparatus, a sputtering apparatus, or the like. In the film forming apparatus, a functional film such as a conductive film, a semiconductor film, or an insulating film is formed on the substrate P. In the coating and developing apparatus, a photosensitive material such as a resist film is formed on the substrate P on which the functional film is formed by the film forming apparatus. The exposure apparatus applies an exposure process to the substrate P by projecting an image of a pattern corresponding to the film pattern constituting the element onto the substrate P on which the photosensitive material is formed. The developing device is applied to develop the exposed substrate P. In the etching apparatus, the photosensitive material of the substrate P after development is used as a mask M to etch the functional film. In this manner, the processing device 1010 forms a functional film of a desired pattern on the substrate P.

Further, the processing apparatus 1010 may include a film forming apparatus such as an imprint method or a droplet discharge apparatus that directly forms a film pattern without etching. At least one of the various devices of the processing device 1010 may also be omitted.

In the present embodiment, the upper control device 1005 controls the substrate supply device 1002 to cause the substrate supply device 1002 to perform the process of supplying the substrate P to the processing device 1010. The upper control device 1005 controls the processing device 1010 to cause the processing device 1010 to execute various types of the substrate P. deal with. The upper control device 1005 controls the substrate recovery device 1004 to cause the substrate recovery device 1004 to execute a process of recovering the substrate P to which various processes have been applied by the processing device 1010.

Next, the configuration of the substrate processing apparatus of the present embodiment will be described with reference to Figs. 2, 3 and 4. Fig. 2 is a view showing the overall configuration of a substrate processing apparatus 1011 of the present embodiment. The substrate processing apparatus 1011 shown in FIG. 2 is at least a part of the processing apparatus 1010 described above. In the present embodiment, the substrate processing apparatus 1011 includes at least a part of the exposure apparatus EX and the transport apparatus 1009 that perform exposure processing.

In the exposure apparatus EX of the present embodiment, the image of the pattern formed on the mask M is simultaneously driven by synchronously driving the rotation of the cylindrical mask (cylindrical mask) M and the transfer of the flexible substrate P. The projection optical system PL (PL1001 to PL1006) whose projection magnification is equal to (×1) is projected onto the substrate P. In addition, in FIGS. 2 to 4, the Y-axis of the orthogonal coordinate system XYZ is set to be parallel to the rotation center line (first center line) AX1001 of the cylindrical mask M, and the X-axis is set to the direction of scanning exposure. And the transport direction of the substrate P at the exposure position.

As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 1012, an illumination device 1013, a projection optical system PL, and a control device 1014. In the substrate processing apparatus 1011, the mask M held by the mask holding device 1012 is rotationally moved, and the substrate P is transported by the transport apparatus 1009. The illuminating device 1013 illuminates a portion (illumination region IR) of the reticle M held by the reticle holding device 1012 with a uniform brightness by the illumination light beam EL1. The projection optical system PL projects an image of the pattern of the illumination region IR on the mask M by the transport device 1009. A portion of the substrate P (projection area PA) is sent. With the movement of the mask M, the portion disposed on the mask M of the illumination region IR also changes, and the portion disposed on the substrate P of the projection region PA also changes in accordance with the movement of the substrate P, whereby the mask M is placed thereon. The image of the predetermined pattern (mask pattern) is projected on the substrate P. The control device 1014 controls each unit of the exposure device EX so that each unit performs processing. Further, in the present embodiment, the control device 1014 controls at least a part of the transport device 1009.

Further, the control device 1014 may be part or all of the upper control device 1005 of the component manufacturing system 1001. Further, the control device 1014 may be controlled by the higher-level control device 1005 and different from the higher-level control device 1005. Control device 1014 includes, for example, a computer system. The computer system includes hardware such as a CPU and various memories or OSs, peripheral devices, and the like. The operation of each unit of the substrate processing apparatus 1011 is performed by being stored in a computer-readable recording medium in the form of a program and being read by a computer system to execute the processing. The computer system can also be connected to the Internet or the Internet system, and also includes the webpage providing environment (or display environment). Moreover, the computer readable recording medium includes a floppy disk, a magnetic disk, a ROM, a CD-ROM and the like, and a memory device such as a hard disk embedded in a computer system. The computer can read the recording medium, and also includes the communication line when the program is sent through a communication line such as the Internet or a telephone line such as the Internet, and the program is dynamically maintained in a short time, and also includes the server client as in this case. The volatile memory inside the computer system keeps the programmer for a certain period of time. Further, the program may be used to implement a part of the function of the substrate processing apparatus 1011, or may be combined with a program already recorded in a computer system to realize the function of the substrate processing apparatus 1011. Upper control The setting 1005 can be realized by using a computer system in the same manner as the control device 1014.

Next, each part of the exposure apparatus EX of Fig. 2 will be described in detail with reference to Figs. 3 and 4 . 3 is a view showing the configuration of the mask holding device 1012, and FIG. 4 is a view showing the configuration of the first reel member 1021 and the illumination optical system IL.

As shown in FIG. 3 (FIG. 2), the mask holding device 1012 includes a first member (hereinafter referred to as a first reel member 1021) that holds the mask M, a guide roller 1023 that supports the first reel member 1021, and a drive. The drive roller 1024 of the first reel member 1021, the first detector 1025 that detects the position of the first reel member 1021, and the first drive unit 1026.

As shown in FIG. 4 (FIG. 2 or FIG. 3), the first reel member 1021 forms a first surface p1001 in which the illumination region IR on the photomask M is disposed. In the present embodiment, the first surface p1001 includes a surface (hereinafter referred to as a cylindrical surface) on which a line segment (bus bar) is rotated about an axis parallel to the line segment (the first central axis AX1001). The cylindrical surface is, for example, a peripheral surface other than the cylinder, a cylindrical outer peripheral surface, or the like. The first reel member 1021 is made of, for example, glass or quartz, has a cylindrical shape with a constant thickness, and its outer peripheral surface (cylindrical surface) forms a first surface p1001. That is, in the present embodiment, the illumination region IR on the mask M is bent from the rotation center line AX1001 into a cylindrical surface shape having a constant radius r1001 (see Fig. 1). The portion of the first reel member 1021 that overlaps the pattern of the mask M as viewed from the radial direction of the first reel member 1021, for example, the center of the first reel member 1021 shown in FIG. Part of the illumination beam EL1001 is translucent.

The mask M is formed, for example, on a surface of a short strip-shaped ultra-thin glass plate (for example, a thickness of 100 to 500 μm) having a flatness, and a transmissive planar sheet mask formed with a light-shielding layer such as chrome, so as to be along the first roll. Outer peripheral surface of the cylindrical member 1021 It is bent and used in a state of being wound (attached) to the other peripheral surface. The mask M has a pattern non-formation region in which no pattern is formed, and is attached to the first reel member 1021 in the pattern non-formation region. The photomask M can be attached (detached) to the first reel member 1021.

Further, instead of forming the mask M as an extremely thin glass plate and winding the mask M around the first reel member 1021 of the transparent cylindrical base material, the first reel of the transparent cylindrical base material may be used. The outer peripheral surface of the member 1021 is directly formed by forming a mask pattern formed of a light shielding layer such as chrome. In this case, the first reel member 1021 also functions as a support member of the photomask (first object).

In addition, the first reel member 1021 may be configured such that the thin mask-shaped mask M is bent and attached to the inner peripheral surface thereof. Further, the mask M may be formed with a whole or a part of a pattern for a panel corresponding to one display element, or a pattern for a panel corresponding to a plurality of display elements may be formed. Further, in the mask M, a plurality of panel patterns may be repeatedly arranged around the circumferential direction of the first central axis AX1001, or a plurality of patterns for the small panel may be arranged in a plurality of directions parallel to the first central axis AX1001. Further, the mask M may include a panel pattern of a second display element different from the first display element such as a pattern and a panel of the first display element. Further, the outer circumferential surface (or inner circumferential surface) of the first reel member 1021 may be provided with a structure in which a plurality of separate thin plate-shaped photomasks M are individually mounted in a direction parallel to the first central axis AX1001 or in the circumferential direction.

The guide roller 1023 and the drive roller 1024 shown in FIG. 3 extend in the Y-axis direction which is parallel to the first central axis AX1001 of the first reel member 1021. The guiding roller 1023 and the driving roller 1024 are arranged to be able to be wound around the first The central axis AX1001 rotates in parallel with the axis. The guide roller 1023 and the drive roller 1024 have an outer diameter larger than that of the other portions in the axial direction, and the end portion is externally connected to the first reel member 1021. As described above, the guide roller 1023 and the drive roller 1024 are disposed so as not to be in contact with the mask M held by the first reel member 1021. The driving roller 1024 transmits the torque supplied from the first driving unit 1026 to the first reel member 1021, and rotates the first reel member 1021 around the first central axis AX1001.

In addition, although the mask holding device 1012 includes one guiding roller 1023 and one driving roller 1024, the number of the guiding rollers 1023 may be two or more, and the number of the driving rollers 1024 may be two or more. At least one of the guide roller 1023 and the drive roller 1024 may be disposed inside the first reel member 1021 and inscribed with the first reel member 1021. In the first reel member 1021, the portion of the first reel member 1021 that does not overlap the pattern of the mask M (the both end sides in the Y-axis direction) is visible from the radial direction of the first reel member 1021, and is transparent to the illumination light beam EL1001. It may not have light transmission. Further, one or both of the guide roller 1023 and the drive roller 1024 may be, for example, a truncated cone shape, and the central axis (rotation axis) thereof may be non-parallel with respect to the first central axis AX1001.

The first detector 1025 optically detects the rotational position of the first reel member 1021. The first detector 1025 includes, for example, a rotary encoder. The first detector 1025 supplies information indicating the detected rotational position of the first reel member 1021 to the control device 1014. The first driving unit 1026 including an actuator such as an electric motor adjusts a torque for rotating the driving roller 1024 in accordance with a control signal supplied from the control device 1014. The control device 1014 controls the first driving unit 1026 based on the detection result of the first detector 1025. The rotational position of the first reel member 1021 is controlled. In other words, the control device 1014 controls one or both of the rotational position and the rotational speed of the mask M held by the mask holding device 1012.

Further, a sensor (hereinafter referred to as a Y-direction position measuring sensor) that optically measures the position of the first reel member 1021 in the Y-axis direction in FIG. 3 can be added to the first detector 1025. Although the position of the first reel member 1021 shown in FIG. 2 and FIG. 3 in the Y direction is substantially not changed, the relative position of the exposed area or the alignment mark on the substrate P and the pattern of the mask M is performed. For the alignment, it is also conceivable to assemble a mechanism (actuator) that causes the first reel member 1021 (mask M) to be slightly moved in the Y direction. In this case, the Y-direction micro-motion mechanism of the first reel member 1021 can also be controlled by the measurement information from the Y-direction position measuring sensor.

As shown in FIG. 2, the transport apparatus 1009 includes a first transport roller 1030, a first guide member 1031, and a second support member that forms a second surface p1002 of the projection area PA on the placement substrate P (hereinafter referred to as a second reel). Member 1022), second guide member 1033, second transfer cylinder 1034, second detector 1035, and second drive unit 1036. Moreover, the conveyance drum 1008 shown in FIG. 1 includes the 1st conveyance roller 1030 and the 2nd conveyance roller 1034.

In the present embodiment, the substrate P transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030. The substrate P of the first guide member 1031 is supported by the surface of the second or second tubular member (cylindrical body) 1022 supported by the cylindrical shape or the cylindrical shape by the radius r1002, and is transported to the second guiding member 1033. The substrate P that has passed through the second guiding member 1033 is transported to the downstream of the transport path via the second transport roller 1034. In addition, the second The rotation center line (second center line) AX1002 of the reel member 1022 and the respective rotation center lines of the first conveyance roller 1030 and the second conveyance roller 1034 are set to be parallel to the Y-axis.

The first guiding member 1031 and the second guiding member 1033 move, for example, by moving in a direction intersecting the width direction of the substrate P (moving in the XZ plane in FIG. 2), and the transfer path is adjusted to act on the substrate P. Tension and so on. In addition, the first guiding member 1031 (and the first conveying roller 1030) and the second guiding member 1033 (and the second conveying roller 1034) can be configured to be movable in the width direction (Y direction) of the substrate P, for example. The position of the substrate P wound around the outer circumference of the second reel member 1022 in the Y direction is adjusted. Further, the transport device 1009 is only required to be able to transport the substrate P along the projection area PA of the projection optical system PL, and the configuration can be appropriately changed.

The second reel member 1022 forms a second surface p1002 that supports a portion of the projection area PA on the substrate P projected from the imaging light beam from the projection optical system PL in an arc shape. In the present embodiment, the second reel member 1022 is a part of the conveying device 1009 and serves as a supporting member (substrate stage) for supporting the substrate P to be exposed. That is, the second reel member 1022 may be a part of the exposure device EX.

The second reel member 1022 is rotatable about its central axis (hereinafter referred to as a second central axis AX1002), and the substrate P is bent into a cylindrical shape along the outer peripheral surface (cylindrical surface) of the second transfer drum 1034 to be bent. A part of the projection area PA is configured.

Further, in the present embodiment, the radius r1001 of the portion around the mask M in the outer circumferential surface of the first reel member 1021 and the radius r1002 of the portion of the outer circumferential surface of the second reel member 1022 in which the substrate P is wound are set to be substantially the same. . This factor It is assumed that the thickness of the thin plate-shaped mask M is substantially equal to the thickness of the substrate P.

On the other hand, for example, when the peripheral surface of the first reel member 1021 (transmissive cylinder base material) is directly patterned by the chrome layer, since the thickness of the chrome layer can be ignored, the pattern surface of the reticle is compared The radius remains at r1001, and if the thickness of the substrate P is about 200 μm, the radius of the surface of the substrate P in the projection area PA is r1002+200 μm. In this case, the radius r1002 of the portion of the outer circumferential surface of the second reel member 1022 in which the substrate P is wound may be reduced by the thickness of the substrate P.

As described above, in order to strictly set the conditions, the respective radii of the first reel member 1021 and the second reel member 1022 may be determined as the pattern surface of the reticle supported by the outer circumferential surface of the first reel member 1021. The radius of the cylindrical surface is equal to the radius of the surface of the substrate P supported by the outer circumferential surface of the second reel member 1022.

In the present embodiment, the second reel member 1022 is rotated by a torque supplied from a second driving unit 1036 including an actuator such as an electric motor. The second detector 1035 includes, for example, a rotary encoder, and the second detector 1035 optically detects the rotational position of the second reel member 1022. The second detector 1035 supplies information indicating the detected rotational position of the second reel member 1022 to the control device 1014. The second drive unit 1026 adjusts the moment for rotating the second reel member 1022 in accordance with the control signal supplied from the control device 1014. The control device 1014 controls the second drive unit 1036 based on the detection result of the second detector 1035 to control the rotational position of the second reel member 1022, and simultaneously moves the first reel member 1021 and the second reel member 1022 ( Synchronize Rotate).

Further, when the substrate P is a thin flexible film, wrinkles or distortion may occur when the second roll member 1022 is wound. Therefore, it is important that the substrate P enters the contact position with the outer circumferential surface of the second reel member 1022 as much as possible, and the tension in the conveyance direction (X direction) of the application substrate P is made as constant as possible. In this view, the control device 1014 controls the second drive unit 1036 so that the rotation speed unevenness of the second reel member 1022 is extremely small.

In the present embodiment, the plane including the first central axis AX1001 of the first reel member 1021 and the second central axis AX1002 of the second reel member 1022 is the center plane p1003 (parallel to the YZ plane). Then, in the vicinity of the position where the center plane p1003 intersects the cylindrical first surface p1001, the center plane p1003 and the first surface p1001 are approximately orthogonal to each other, and similarly, the center plane p1003 and the second cylinder shape. Near the position where the surface p1002 intersects, the center plane p1003 and the second surface p1002 have an approximately orthogonal relationship.

The exposure apparatus EX of the present embodiment is assumed to be an exposure apparatus in which a projection optical system of a multi-lens type is mounted. The projection optical system PL includes a plurality of projection modules that project a part of the image of the mask M. For example, in FIG. 2, three projection modules (projection optical systems) PL1001, PL1003, and PL1005 are arranged at a predetermined interval in the Y direction on the left side of the center plane p1003, and three projection modules (projection optical systems) are also provided on the right side of the center plane p1003. PL1002, PL1004, and PL1006 are arranged at regular intervals in the Y direction.

In the multi-lens type exposure apparatus EX, an area exposed by a plurality of projection modules PL1001 to PL1006 is scanned by scanning (projection area) The Y-direction ends of PA1001~PA1006) are superposed on each other, thereby projecting the overall image of the desired pattern. In such an exposure apparatus EX, even when the necessity of the substrate P having a large Y-direction width in the Y-direction of the pattern on the reticle M is generated, it is only necessary to add a projection module and a corresponding direction in the Y direction. Since the module on the side of the illuminating device 1013 is sufficient, there is an advantage that it can be easily applied to the size of the panel (the width of the substrate P).

Further, the exposure device EX may not be a multi-lens method. For example, when the dimension of the substrate P in the width direction is small to some extent, the exposure apparatus EX can also project an image of the full width of the pattern onto the substrate P by one projection module. Further, a plurality of projection modules PL1001 to PL1006 may respectively project a pattern corresponding to one element. That is, the exposure device EX can also project a pattern of a plurality of components in parallel by a plurality of projection modules.

The illumination device 1013 of the present embodiment includes a light source device (not shown) and an illumination optical system IL. As shown in FIG. 4, the illumination optical system IL includes a plurality of (for example, six) illumination modules IL1001 to IL1006 arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1001 to PL1006. The light source device includes a light source such as a mercury lamp, or a solid state light source such as a laser diode or a light emitting diode (LED). The illumination light emitted from the light source device is, for example, a bright line (g line, h line, i line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), and ArF excimer laser light (wavelength). 193nm) and so on. The illuminance distribution emitted from the light source device is uniformized, and is distributed to a plurality of illumination modules IL1001 to IL1006 through a light guide member such as an optical fiber.

Further, the light source device may be disposed inside the first reel member 1021 or may be disposed outside the first reel member 1021. Moreover, the light source device can also be A device (external device) different from the exposure device EX.

The plurality of illumination modules IL1001 to IL1006 each include a plurality of optical members such as lenses. In the present embodiment, the light that is emitted from the light source device and passes through any of the plurality of illumination modules IL1001 to IL1006 is referred to as an illumination light beam EL1. Each of the plurality of illumination modules IL1001 to IL1006 includes, for example, an integrator optical system, a rod lens, a fly-eye lens, etc., and the illumination region IR is illuminated by the illumination beam EL1 having a uniform illumination distribution. In the present embodiment, a plurality of illumination modules IL1001 to IL1006 are disposed inside the first reel member 1021. Each of the plurality of illumination modules IL1001 to IL1006 passes through the first reel member 1021 from the inside of the first reel member 1021 and illuminates the illumination area IR (IR1001~) held by the photomask M on the outer circumferential surface of the first reel member 1021. IR1006).

In the present embodiment, each of the illumination modules is referred to as a first illumination module IL1001 and a second illumination module IL1002 in the order of the Y side (the front side of the paper surface of FIG. 2) on the +Y side (the deep side of the paper surface of FIG. 2). The third lighting module IL1003, the fourth lighting module IL1004, the fifth lighting module IL1005, and the sixth lighting module IL1006. That is, among the plurality of illumination modules IL1001 to IL1006, the first illumination module IL1001 is disposed on the most-Y side, and the sixth illumination module IL1006 is disposed on the most +Y side. Further, the number of projection modules provided in the projection optical system PL may be one or more, five or less, or seven or more.

The plurality of illumination modules IL1001 to IL1006 are disposed apart from each other in a direction intersecting the first central axis AX1001 (for example, in the X-axis direction) so as not to interfere with each other. The first illumination module IL1001, the third illumination module IL1003, and the fifth illumination module IL1005 are disposed at positions overlapping each other when viewed in the Y-axis direction. a first lighting module IL1001, a third lighting module IL1003, and The fifth illumination module IL1005 is disposed apart from each other in the Y-axis direction.

In the present embodiment, the second illumination module IL1002 is disposed symmetrically with respect to the first illumination module IL1001 with respect to the center plane p1003 when viewed in the Y-axis direction. The fourth illumination module IL1004 and the sixth illumination module IL1006 are disposed at positions overlapping the second illumination module IL1002 when viewed from the Y-axis direction. The second illumination module IL1002, the fourth illumination module IL1004, and the sixth illumination module IL1006 are disposed apart from each other in the Y-axis direction.

Each of the plurality of illumination modules IL1001 to IL1006 is in the first radial direction D1001 or the second radial direction D1002 that intersects the central plane p1003 in the radial direction (diameter direction) of the first central axis AX1001 of the first reel member 1021. The illumination beam EL1 is illuminated. The illumination direction of the illumination beam EL1 of each illumination module is alternately changed in the order in which the bright modules are arranged in the Y-axis direction. For example, the illumination direction of the illumination beam from the first illumination module IL1001 (the first radial direction D1001) is inclined toward the -X side from the Z-axis direction, and the illumination direction of the illumination beam from the second illumination module IL1002 (the second radial direction D1002) ) It is inclined to the +X side from the -Z axis direction. Similarly, the illumination directions of the illumination beams from the third illumination module IL1003 and the fifth illumination module IL1005 are substantially parallel to the illumination direction of the first illumination module IL1001, and are derived from the fourth illumination module IL1004 and the The illumination direction of each of the illumination modules IL1006 is substantially parallel to the illumination direction of the second illumination module IL1002.

Fig. 5 is a view showing the arrangement of the illumination area IR and the projection area PA of the embodiment. In addition, FIG. 5 is a plan view (left diagram in FIG. 5) of the illumination region IR disposed on the mask M of the first reel member 1021 as viewed from the -Z side, and is disposed on the second volume as viewed from the +Z side. On the substrate P of the tubular member 1022 A top view of the projection area PA (the right image in Fig. 5). The symbol Xs in Fig. 5 indicates the moving direction (rotation direction) of the first reel member 1021 or the second reel member 1022.

The first to sixth illumination modules IL1001 to IL1006 illuminate the first to sixth illumination regions IR1001 to IR1006 on the mask M, respectively. For example, the first illumination module IL1001 illuminates the first illumination region IR1001, and the second illumination module IL1002 illuminates the second illumination region IR1002.

The first illumination region IR1001 of the present embodiment is described as being a trapezoidal region elongated in the Y direction. However, depending on the configuration of the projection optical system (projection module) PL described later, it may be a rectangular region including the trapezoidal region. . Each of the third illumination region IR1003 and the fifth illumination region IR1005 has the same shape as the first illumination region IR1001, and is arranged at a constant interval in the Y-axis direction. Further, the second illumination region IR1002 is a trapezoidal (or rectangular) region that is symmetrical with respect to the first illumination region IR1001 with respect to the center plane p1003. Each of the fourth illumination region IR1004 and the sixth illumination region IR1006 has the same shape as the second illumination region IR1002, and is arranged at a constant interval in the Y-axis direction.

As shown in FIG. 5, each of the first to sixth illumination regions IR1001 to IR1006 is arranged such that the triangular portions of the oblique side portions of the adjacent trapezoidal illumination regions are overlapped when viewed in the circumferential direction of the first surface p1001. Therefore, for example, the first region A1001 on the mask M passing through the first illumination region IR1001 by the rotation of the first reel member 1021 and the second illumination region IR1002 passing through the rotation of the first reel member 1021 A part of the second area A1002 on the mask M is repeated.

In the present embodiment, the mask M has a pattern forming region A1003 in which a pattern is formed and a pattern non-forming region A1004 in which a pattern is not formed. The pattern non-formation region A1004 is disposed in a frame-like surrounding pattern formation region A1003 and has a characteristic of shielding the illumination light beam EL1. The pattern forming region A1003 of the mask M moves in the direction Xs with the rotation of the first reel member 1021, and each of the partial regions in the Y-axis direction in the pattern forming region A1003 passes through any of the first to sixth illumination regions IR1001 to IR1006. . In other words, the first to sixth illumination regions IR1001 to IR1006 are arranged to cover the full width in the Y-axis direction of the pattern formation region A1003.

As shown in FIG. 2, the projection optical system PL includes a plurality of projection modules PL1001 to PL1006 arranged in the Y-axis direction. Each of the plurality of projection modules PL1001 to PL1006 is in a one-to-one correspondence with each of the first to sixth illumination regions IR1001 to IR1006, and the reticle M appearing in the illumination region IR illuminated by the corresponding illumination module The image of the partial pattern is projected on each of the projection areas PA on the substrate P.

For example, the first projection module PL1001 corresponds to the first illumination module IL1001, and the pattern image of the mask M in the first illumination region IR1001 (see FIG. 5) illuminated by the first illumination module IL1001 is projected onto the substrate P. The first projection area PA1001. The third projection module PL1003 and the fifth projection module PL1005 correspond to the third illumination module IL1003 and the fifth illumination module IL1005, respectively. The third projection module PL1003 and the fifth projection module PL1005 are disposed at positions that do not overlap with the first projection module PL1001 when viewed from the Y-axis direction.

Further, the second projection module PL1002 corresponds to the second illumination module IL1002, The pattern image of the mask M in the second illumination region IR1002 (see FIG. 5) illuminated by the second illumination module IL1002 is projected onto the second projection area PA1002 on the substrate P. The second projection module PL1002 is disposed at a position symmetrical with respect to the center plane p1003 with respect to the first projection module PL1001 when viewed in the Y-axis direction.

The fourth projection module PL1004 and the sixth projection module PL1006 are disposed corresponding to the fourth illumination module IL1004 and the sixth illumination module IL1006, respectively, and the fourth projection module PL1004 and the sixth projection module PL1006 are disposed from the Y-axis direction. The position that does not overlap with the second projection module PL1002 when viewed.

Further, in the present embodiment, the light that reaches each of the illumination regions IR1001 to IR1006 on the mask M from the illumination modules IL1001 to IL1006 of the illumination device 1013 is referred to as an illumination light beam EL1, and is received in each of the illumination regions IR1001 to IR1006. The light having the intensity distribution corresponding to the partial pattern of the mask M appearing and incident on each of the projection modules PL1001 to PL1006 and reaching the respective projection areas PA1001 to PA1006 is referred to as an imaging beam EL2.

As shown in the right diagram of FIG. 5, the pattern image in the first illumination area IR1001 is projected on the first projection area PA1001, and the pattern image in the third illumination area IR1003 is projected on the third projection area PA1003, and the fifth illumination area. The pattern image in IR1005 is projected on the fifth projection area PA1005. In the present embodiment, the first projection area PA1001, the third projection area PA1003, and the fifth projection area PA1005 are arranged in a line in the Y-axis direction.

Further, the pattern image in the second illumination region IR1002 is projected on the second projection area PA1002. In the present embodiment, the second projection area PA1002 is disposed so as to be opposite to the center plane p1003 and the first projection area when viewed in the Y-axis direction. PA1001 is symmetrical. Further, the pattern image in the fourth illumination region IR1004 is projected on the fourth projection region PA1004, and the pattern image in the sixth illumination region IR1006 is projected on the sixth projection region PA1006. In the present embodiment, the second projection area PA1002, the fourth projection area PA1004, and the sixth projection area PA1006 are arranged in a line in the Y-axis direction.

Each of the first to sixth projection areas PA1001 to PA1006 is arranged such that the projection area adjacent to the direction parallel to the second central axis AX1002 is overlapped with the end portion (the triangular portion of the trapezoid) when viewed in the circumferential direction of the second surface p1002. . Therefore, for example, the third region A1005 on the substrate P of the first projection region PA1001 and the substrate passing through the second projection region PA1002 by the rotation of the second reel member 1022 by the rotation of the second reel member 1022 Part 4 of the fourth area A1006 on P is repeated.

The shape of each of the first projection area PA1001 and the second projection area PA1002 is set such that the exposure amount in the region overlapping the third region A1005 and the fourth region A1006 is substantially the same as the exposure amount in the non-overlapping region.

In the present embodiment, the region to be exposed of the substrate P (hereinafter referred to as the exposure region A1007) is moved in the direction Xs with the rotation of the second reel member 1022 as shown in the right diagram of FIG. 5, and the exposure region A1007 is Y. Each of the partial regions in the axial direction passes through any of the first to sixth projection regions PA1001 to PA1006. In other words, the first to sixth projection areas PA1001 to PA1006 are arranged to cover the full width of the exposure area A1007 in the Y-axis direction.

Further, the irradiation direction of the illumination light beam EL1 with respect to the first projection module PL1001 may be, for example, the traveling direction of the chief ray passing through any position in the first illumination region IR1001, or may be the first illumination region IR1001. The direction of travel of the main light of the center. The illumination directions of the illumination light beams EL1 of the second to sixth projection modules PL1002 to PL1006 are also the same.

Further, the first to sixth projection areas PA1001 to PA1006 may be arranged such that the regions on the substrate P by either of them do not overlap each other at the ends. For example, the third area A 1005 passing through the first projection area PA 1001 may not overlap with the fourth area A 1006 passing through the second projection area PA 1002. That is, even if the multi-lens method is used, the continuous exposure of each projection module can be eliminated. In this case, the third area A 1005 may be a region in which the pattern corresponding to the first element is projected, and the fourth area A 1006 may be projected on the area corresponding to the pattern of the second element. The second element described above may be the same type of element as the first element, and the same pattern as the third area A1005 is projected in the fourth area A1006. The second element described above may be a different type of element from the first element, and a pattern different from the third area A1005 may be projected in the fourth area A1006.

Next, a detailed configuration of the projection optical system PL of the present embodiment will be described with reference to Fig. 6 . Further, in the present embodiment, each of the second to sixth projection modules PL1002 to PL1006 has the same configuration as the first projection module PL1001. Therefore, the configuration of the first projection module PL1001 will be described to represent the projection optical system PL.

The first projection module PL1001 shown in FIG. 6 includes a first optical system 1041 that images a pattern image of the mask M disposed in the first illumination region IR1001 on the intermediate image plane p1007, and an intermediate image formed by the first optical system 1041. At least a part of the image is re-imaged on the second optical system 1042 of the first projection area PA1001 of the substrate P and the first field stop 1043 disposed on the intermediate image surface p1007 of the intermediate image.

Moreover, the first projection module PL1001 is provided to be finely adjusted to be formed on the substrate P The focus correcting optical member 1044 in the in-focus state of the pattern image of the upper mask (hereinafter referred to as the projected image), the image shift correcting optical member 1045 for slightly shifting the projected image in the image plane, and the magnification of the micro-corrected projection image The magnification correction optical member 1047 and the rotation correcting mechanism 1046 for slightly rotating the projection image in the image plane.

The focus correction optical member 1044 is disposed at a position where the imaging light beam EL2 emitted from the first illumination region IR1001 is incident, and the image correcting optical member 1045 is disposed at a position where the imaging light beam EL2 emitted from the focus correction optical member 1044 is incident. The magnification correction optical member 1047 is disposed at a position where the imaging light beam EL2 emitted from the second optical system 1042 is incident.

The imaging light beam EL2 from the pattern of the mask M is emitted from the first illumination region IR1001 in the normal direction, and is incident on the image-shift correction optical member 1045 by the focus correction optical member 1044. The imaging beam EL2 transmitted through the image-shifting correction optical member 1045 is reflected by the first reflecting surface (planar mirror) p1004 of the first deflecting member 1050 which is a requirement of the first optical system 1041, and is reflected by the first concave mirror 1052 by the first lens group 1051. The second lens group 1051 is again reflected by the second reflecting surface (planar mirror) p1005 of the first deflecting member 1050, and is incident on the first field stop 1043.

The imaging beam EL2 of the first field stop 1043 is reflected by the third reflecting surface (plane mirror) p1008 of the second deflecting member 1057, which is a requirement of the second optical system 1042, and is reflected by the second concave mirror 1059 by the second lens group 1058. The second lens group 1058 is again reflected by the fourth reflecting surface (planar mirror) p1009 of the second deflecting member 1057, and is incident on the magnification correcting optical member 1047.

The imaging light beam EL2 emitted from the magnification correction optical member 1047 is incident on the first projection area PA1001 on the substrate P, and the pattern image appearing in the first illumination region IR1001 is projected on the first projection area PA1001 at a magnification (×1). .

The first optical system 1041 and the second optical system 1042 are, for example, telecentric refraction optical systems in which a Dyson system is deformed. In the present embodiment, the optical axis of the first optical system 1041 (hereinafter referred to as the first optical axis AX1003) is substantially perpendicular to the center plane p1003. The first optical system 1041 includes a first deflecting member 1050, a first lens group 1051, and a first concave mirror 1052. The imaging beam EL2 emitted from the image-correcting optical member 1045 is reflected by the first reflecting surface p1004 of the first deflecting member 1050 and travels to one side (-X side) of the first optical axis AX1003, and is incident by the first lens group 1051. The first concave mirror 1052 is disposed on the kneading surface. The imaging beam EL2 reflected by the first concave mirror 1052 travels to the other side (+X side) of the first optical axis AX1003, passes through the first lens group 1051, and is reflected by the second reflecting surface p1005 of the first deflecting member 1050. The first field of view pupil 1043 is entered.

The first deflecting member 1050 is a triangular ridge extending in the Y-axis direction. In the present embodiment, each of the first reflecting surface p1004 and the second reflecting surface p1005 includes a mirror surface (surface of the reflecting film) formed on the surface of the triangular ridge. The chief ray EL3 of the imaging light beam EL2 at the center of the first illumination region IR1001 travels along the first radial direction D1001 inclined in the XZ plane with respect to the center plane p1003, and enters the first projection module PL1001.

The first deflecting member 1050 deflects the imaging light beam EL2 from the first illumination region IR1001 to the chief ray EL3 of the first reflection surface p1004 and the principal ray EL3 from the second reflection surface p1005 to the intermediate image plane p1007 (with the center plane p1003) Parallel) becomes non-parallel in the XY plane.

In the present embodiment, the ridge line intersecting the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 and the first optical axis AX1003 are formed, and the surface parallel to the XY plane is set as the optical path. In the case of p1006, the first reflecting surface p1004 and the second reflecting surface p1005 are arranged at an asymmetrical angle with respect to the surface p1006.

When the angle of the first reflecting surface p1004 with respect to the surface p1006 is θ 1001 and the angle of the second reflecting surface p1005 with respect to the surface p1006 is θ 1002, the angle (θ 1001 + θ 1002) is set in the present embodiment. When 90° is not full, the angle θ 1001 is set to 45° not full, and the angle θ 1002 is set to be substantially 45°.

By setting the chief ray EL3 that is reflected by the first reflecting surface p1004 and incident on the first lens group 1051 to be parallel to the optical axis AX1003, the chief ray EL3 can pass through the center of the first concave mirror 1052, that is, the surface of the first concave mirror 1052. The intersection of the axis AX1003 ensures the imaging state of the telecentric. Therefore, in FIG. 6, when the inclination angle of the chief ray EL3 (first radial direction D1001) from the first illumination region IR1001 to the first reflection surface p1004 with respect to the center plane p1003 is θd, the first reflection surface p1004 The angle θ 1001 may be set to satisfy the following formula (1).

θ 1001=45°-(θ d/2)...(1)

In the present embodiment, each of the plurality of lenses belonging to the first lens group 1051 has an axisymmetric shape around the first optical axis AX1003. The imaging light beam EL2 reflected by the first reflecting surface p1004 is incident on the first lens group 1051 from one side (+Z side) of the opposing surface p1006. The first concave mirror 1052 is disposed at or near the top surface of the first optical system 1041.

The chief ray EL3 of the imaging light beam EL2 passing through the first lens group 1051 enters the intersection of the first optical axis AX1003 and the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 travels along the optical path that is symmetric with respect to the opposite surface p1006 in the first lens group 1051 as compared with before the first concave mirror 1052 is incident. The image forming beam EL2 reflected by the first concave mirror 1052 is emitted from the other side (-Z side) of the first lens group 1051, and is reflected by the second reflecting surface p1005 of the first deflecting member 1050, and is parallel to the center plane p1003. Light EL3 travels.

The first field stop 1043 has an opening that defines the shape of the first projection area PA1001. In other words, the shape of the opening of the first field stop 1043 defines the shape of the first projection area PA1001. Therefore, as shown in FIG. 6, when the first field stop 1043 can be placed on the intermediate image plane p1007, the opening shape of the first field stop 1043 can be made trapezoidal as shown in the right figure of FIG. In this case, the shapes of the first to sixth illumination regions IR1006 may not be similar to the shapes of the first to sixth projection regions PA1001 to PA1006 (trapezoidal), and may include openings of the respective projection regions (the first field of view pupil 1043). ) The trapezoidal shape of the rectangle.

The second optical system 1042 has the same configuration as the first optical system 1041, and is provided symmetrically with respect to the first optical system 1041 with respect to the intermediate image plane p1007 including the first field of view pupil 1043. The optical axis of the second optical system 1042 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the center plane p1003. The second optical system 1042 includes a second deflecting member 1057, a second lens group 1058, and a second concave mirror 1059. The imaging light beam EL2 that has been emitted from the first optical system 1041 and passed through the first field stop 1043 is reflected by the third reflecting surface p1008 of the second deflecting member 1057. The second lens group 1058 is incident on the second concave mirror 1059. The imaging beam EL2 reflected by the second concave mirror 1059 is again reflected by the second lens group 1058 on the fourth reflecting surface p1009 of the second deflecting member 1057, and is incident on the magnification correcting optical member 1047.

The second deflecting member 1057, the second lens group 1058, and the second concave mirror 1059 of the second optical system 1042 are the same as the first deflecting member 1050, the first lens group 1051, and the first concave mirror 1052 of the first optical system 1041, respectively. The angle θ 1003 formed by the third reflecting surface p1008 of the second deflecting member 1057 and the second optical axis AX1004 and the angle θ 1002 formed by the second reflecting surface p1005 of the first deflecting member 1050 and the first optical axis AX1003 are substantially the same. The angle θ 1004 between the fourth reflecting surface p1009 of the second deflecting member 1057 and the second optical axis AX1004 and the angle θ 1001 between the first reflecting surface p1004 of the first deflecting member 1050 and the first optical axis AX1003 Essentially the same. Each of the plurality of lenses belonging to the second lens group 1058 has an axisymmetric shape around the second optical axis AX1004.

The second concave mirror 1059 is disposed at or near the top surface of the second optical system 1042.

The imaging beam EL2 of the first field stop 1043 travels in the direction of the chief ray parallel to the center plane p1003 and enters the third reflecting surface (plane) p1008. The inclination angle θ 1003 of the third reflection surface p1008 with respect to the second optical axis AX1004 (or the surface p1006 or the intermediate image surface p1007) of the second optical system 1042 is 45° in the XZ plane, and the imaging light beam EL2 reflected there is emitted. The field of view of the upper half of the second lens group 1058 is entered. The chief ray EL3 of the imaging beam EL2 incident on the second lens group 1058 is flattened to the second optical axis AX1004. The line enters the intersection of the second optical axis AX1004 and the second concave mirror 1059.

The imaging light beam EL2 reflected by the second concave mirror 1059 travels symmetrically with respect to the second optical axis AX1004 as compared with before the second concave mirror 1059 is incident. The imaging beam EL2 reflected by the second concave mirror 1059 passes through the field of view of the lower half of the second lens group 1058, and is reflected by the fourth reflecting surface p1009 of the second deflecting member 1057, and travels in a direction intersecting the center plane p1003.

The traveling direction of the chief ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 to the first projection area PA1001 is set to be incident on the intermediate image plane p1007 including the first field of view pupil 1043 and from the first illumination region IR1001. The traveling direction of the chief ray EL3 of the imaging light beam EL2 of the first optical system 1041 is symmetrical. In other words, when viewed in the XZ plane, the angle θ 1004 of the fourth reflecting surface p1009 of the second deflecting member 1057 with respect to the second optical axis AX1004 is set to satisfy the following formula (2) as in the previous formula (1). .

θ 1004=45°-(θ d/2)...(2)

Thereby, the principal ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 is directed to the normal direction of the first projection area PA1001 (cylindrical surface) on the substrate P (to the rotation center line AX1002 in FIG. 2) Direction) travel.

In the present embodiment, the focus correction optical member 1044, the image-shift correction optical member 1045, the rotation correction mechanism 1046, and the magnification correction optical member 1047 constitute an imaging characteristic adjustment mechanism that adjusts the imaging characteristics of the first projection module PL1001. By controlling the imaging characteristic adjustment mechanism, the projection conditions of the projected image on the substrate P can be adjusted for each projection module. The projection conditions referred to herein include items of one or more of the parallel position, the rotational position, the magnification, and the focus of the projection area on the substrate P. Projection conditions, can be relative to the base when scanning synchronously Each position of the projection area of the board P is determined. By adjusting the projection conditions of the projection image, it is possible to correct the skew of the projection image when compared with the pattern of the mask M. Further, the configuration of the imaging characteristic adjustment mechanism can be appropriately changed, and at least a part thereof can be omitted.

The focus correcting optical member 1044, for example, is formed by laminating two wedge-shaped turns (reverse in the X direction in FIG. 6) into a transparent parallel plate as a whole. The thickness of the parallel flat plate can be changed by causing the pair of turns to slide in the direction of the slope without changing the interval between the opposing faces. Thereby, the effective optical path length of the first optical system 1041 is finely adjusted, and the focus state of the pattern image formed on the intermediate image surface p1007 and the projection area PA1001 is finely adjusted.

The image-correcting optical member 1045 is formed of a transparent parallel plate glass which can be inclined in the XZ plane in Fig. 6 and a transparent parallel plate glass which can be inclined in a direction orthogonal thereto. By adjusting the amount of tilt of the two parallel flat glass sheets, the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 can be slightly displaced in the X direction or the Y direction.

The magnification correction optical member 1047 is configured such that three pieces of a concave lens, a convex lens, and a concave lens are coaxially arranged at a predetermined interval, and the front and rear concave lenses are fixed, and the convex lens is moved in the optical axis (main ray) direction. Thereby, the pattern image formed in the projection area PA1001 can be expanded or reduced by a small amount while maintaining the imaging state of the telecentric. Further, the optical axes of the three lens groups constituting the magnification correcting optical member 1047 are inclined in the XZ plane so as to be parallel to the principal ray EL3 passing therethrough.

The rotation correcting mechanism 1046 rotates the first deflecting member 1050 slightly around the axis parallel to the first optical axis AX1003 by, for example, an actuator (not shown). The image formed on the intermediate image plane p1007 can be slightly rotated in the intermediate image plane p1007 by the rotation correcting mechanism 1046.

As described above, the imaging light beam EL2 emitted from the first projection module PL1001 forms an image of the pattern appearing in the first illumination region IR1001 in the first projection region PA1001 of the substrate P disposed on the outer circumferential surface of the second reel member 1022. In the present embodiment, the chief ray EL3 of the imaging light beam EL2 passing through the center of the first illumination region IR1001 is emitted from the first illumination region IR1001 in the normal direction, and is incident on the first projection region PA1001 from the normal direction. In this manner, the image of the pattern of the mask M appearing in the cylindrical first illumination region IR1001 is projected onto the first projection area PA1001 on the cylindrical substrate P. Further, images of the patterns appearing in the second to sixth illumination regions IR1002 to IR1006 are similarly projected onto the second to sixth projection regions PA1002 to PA1006 on the cylindrical substrate P.

In the present embodiment, as shown in FIGS. 2 and 5, the odd-numbered illumination regions IR1001, IR1003, and IR1005 and the even-numbered illumination regions IR1002, IR1004, and IR1006 are disposed at a distance symmetric with respect to the center plane p1003, and an odd projection area. The PA1001, PA1003, and PA1005 and the even projection areas PA1002, PA1004, and PA1006 are also disposed at a distance symmetric with respect to the center plane p1003. Therefore, all of the six projection modules can be made into the same configuration, the components of the projection optical system can be common, the assembly steps and the inspection steps can be simplified, and the imaging characteristics (aberrations, etc.) of the projection modules can be aggregated into the same. . In this case, in particular, in the case of continuous exposure between the projection areas of the respective projection modules by the multi-lens method, the quality of the pattern for the panel formed on the substrate P (transfer faithfulness) may not depend on the position in the panel. Or the area is kept constant, advantageous.

Further, in a general exposure apparatus, when the projection area is curved into a cylindrical shape, for example, when the imaging beam enters the projection area from a non-perpendicular direction, the defocus may become large depending on the position of the projection area. As a result, exposure failure may occur and defective components may occur.

In the present embodiment, the first deflecting member 1050 (first reflecting surface p1004) and the second deflecting member 1057 (fourth reflecting surface p1009) of the projection optical system PL (for example, the first projection module PL1001) are the chief ray EL3. The chief ray EL3 that is deflected toward the normal direction from the first illumination region IR1001 is projected from the normal direction to the first projection region PA1001. Therefore, the substrate processing apparatus 1011 can reduce the focus error of the projected image in the projection area PA1001, in particular, the best focus surface of the projected image in each of the projection areas PA1001 to PA1006 shown in FIG. 5 from each projection module. The depth of the depth of the Depth of Focus of PL1001 to PL1006 is greatly shifted, and the occurrence of poor exposure or the like is suppressed. As a result, generation of defective components of the component manufacturing system 1001 can be suppressed.

In the present embodiment, since the projection optical system PL includes the first visual field pupil 1043 disposed at a position where the intermediate image is formed, the shape of the projection image and the like can be managed with high precision. Therefore, the substrate processing apparatus 1011 can reduce the overlap error of the first to sixth projection areas PA1001 to PA1006, for example, and suppress the occurrence of exposure failure or the like. Further, the second reflecting surface p1005 of the first deflecting member 1050 deflects the chief ray EL3 from the first illumination region IR1001 so as to be orthogonal to the field stop 1043. Therefore, the substrate processing apparatus 1011 can manage the shape and the like of the projection image with higher precision.

Further, in the present embodiment, the first to sixth projection modules PL1001~ Each of the PL1006 projects an image of the pattern of the mask M into an erect image. Therefore, when the substrate processing apparatus 1011 divides the pattern of the mask M into the first to sixth projection modules PL1001 to PL1006, it is possible to perform an area in which the projection image is to be projected (for example, the third area A1005 and the fourth area A1006). A part of the overlap is successively exposed, so that the design of the mask M becomes easy.

In the present embodiment, the substrate processing apparatus 1011 exposes the substrate P by the exposure apparatus EX while continuously transporting the substrate P at a constant speed along the second surface p1002. Therefore, the productivity of the exposure processing can be improved. As a result, the component manufacturing system 1001 can manufacture components with good efficiency.

In the present embodiment, the first reflecting surface p1004 and the second reflecting surface p1005 are disposed on the same surface of the deflecting member (the first deflecting member 1050), but may be disposed on the surface of the different members. Further, one or both of the first reflecting surface p1004 and the second reflecting surface p1005 may be disposed on the inner surface of the first deflecting member 1050, and have characteristics of reflecting light by, for example, total reflection.

Further, the above-described deformation relating to the first reflecting surface p1004 and the second reflecting surface p1005 can be applied to one or both of the third reflecting surface p1008 and the fourth reflecting surface p1009. For example, when the radius r1002 of the second surface p1002 is changed, the fourth reflecting surface p1009 of the second deflecting member 1057 sets the angle θ 1004 so that the imaging light beam EL2 enters the first projection area PA1001 from the normal direction. The arrangement is set to an arc-shaped perimeter between the first projection area PA1001 and the center point of the second projection area PA1002, and a center point and an illumination area of the illumination area IR1001 corresponding to the mask M (radius r1001). The arc-shaped perimeter between the center points of IR1002 is the same.

[Second Embodiment]

Next, a second embodiment will be described. In the embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 7 is a view showing the configuration of a substrate processing apparatus 1011 of the present embodiment. The transport device 1009 of the present embodiment includes a first transport roller 1030, a first guide member (air rotating lever or the like) 1031, a fourth transport roller 1071, a fifth transport roller 1072, a sixth transport roller 1073, and a second guide. A member (air rotating lever or the like) 1033 and a second conveying roller 1034.

The substrate P transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030. The substrate P that has passed through the first guiding member 1031 is transported to the fifth transport roller 1072 via the fourth transport roller 1071. The fifth transport roller 1072 has its central axis disposed on the center plane p1003. The substrate P that has passed through the fifth transport roller 1072 is transported to the second guiding member 1033 via the sixth transport roller 1073.

The sixth transport roller 1073 is disposed symmetrically with respect to the fourth transport roller 1071 with respect to the center plane p1003. The substrate P that has passed through the second guiding member 1033 is transported to the downstream of the transport path via the second transport roller 1034. Similarly to the first guiding member 1031 and the second guiding member 1033 shown in FIG. 2, the first guiding member 1033 and the second guiding member 1033 adjust the tension acting on the substrate P in the transport path.

The first projection area PA1001 in FIG. 7 is set on the substrate P that is linearly transported between the fourth transport roller 1071 and the fifth transport roller 1072. Between the fourth transport roller 1071 and the fifth transport roller 1072, the substrate P is supported so as to be given a predetermined tension in the transport direction, and the substrate P is along the planar second surface p1002. Was transferred.

The first projection area PA1001 (the second surface p1002) is inclined so as not to be perpendicular to the center plane p1003. The normal direction of the first projection area PA1001 (hereinafter referred to as the first normal direction D1003) is disposed on a plane orthogonal to the center plane p1003, for example, the intermediate image plane p1007 shown in FIG. 6 and the first radial direction. D1001 is symmetrical. The chief ray EL3 of the imaging light beam EL2 emitted from the first projection module PL1001 is incident on the first projection area PA1001 from the first normal direction D1003. In other words, the fourth transport roller 1071 and the fifth transport roller 1072 are disposed so as to be disposed in the first normal direction D1003 of the substrate P of the fourth transport roller 1071 and the fifth transport roller 1072, and are orthogonal to the center plane p1003. The image plane p1007 is symmetrical with the first radial direction D1001.

The second projection area PA1002 is set on the substrate P that is linearly transported between the fifth transport roller 1072 and the sixth transport roller 1073. The substrate P is supported between the fifth transport roller 1072 and the sixth transport roller 1073 so as to be biased, and the substrate P is transferred along the planar second surface p1002.

The second projection area PA1002 is inclined so as not to be perpendicular to the center plane p1003. The normal direction of the second projection area PA1002 (hereinafter referred to as the second normal direction D1004) is arranged symmetrically with respect to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. The chief ray EL3 of the imaging light beam EL2 emitted from the second projection module PL1002 is incident on the second projection area PA1002 from the second normal direction D1004. In other words, the fifth transport roller 1072 and the sixth transport roller 1073 are disposed so as to be disposed in the second normal direction D1004 of the substrate P of the fifth transport roller 1072 and the sixth transport roller 1073, and are orthogonal to the center plane p1003. Image plane p1007 and second radial direction D1002 Into symmetry.

In the substrate processing apparatus 1011 of the present embodiment, the second surface p1002 of the cylindrical surface shown in FIG. 2 is brought close to an approximate plane by the fourth transport roller 1071, the fifth transport roller 1072, and the sixth transport roller 1073. The transfer faith level of the pattern image projected on the substrate P in each of the projection areas PA1001 to PA1006 is further improved from the viewpoint of depth of focus (DOF). Further, as shown in FIG. 2, in comparison with the case where the second reel member 1022 having the radius r1002 is used for supporting and transporting the substrate P, the height of the entire transport apparatus 1009 can be suppressed to be lower, and the apparatus can be made smaller. The overall size is small.

In the apparatus configuration of Fig. 7, the fourth transport roller 1071, the fifth transport roller 1072, and the sixth transport roller 1073 are one part of the transport device 1009, and also serve as a supporting member for supporting the substrate P to be exposed (exposure device EX Side substrate carrier). Further, between the fourth transport roller 1071 and the fifth transport roller 1072, and between the fifth transport roller 1072 and the sixth transport roller 1073, a back surface side of the substrate P may be planarly supported by a fluid bearing in a non-contact manner. The Benui-type pad further improves the flatness of the partial region of the substrate P in which the projection areas PA1001 to PA1006 are located.

Further, at least one of the transport rollers of the transport device 1009 shown in FIG. 7 may be fixed to the projection optical system PL or may be movable. For example, the fifth transport roller 1072 may also have a parallel direction parallel to the X-axis direction, a parallel direction parallel to the Y-axis direction, and a parallel direction parallel to the Z-axis direction, and a parallel direction parallel to the X-axis direction. At least one of six directions of rotation (six degrees of freedom) of the three directions of rotation of the axis, the direction of rotation about the axis parallel to the Y-axis direction, and the direction of rotation about the axis parallel to the Z-axis direction The direction (one degree of freedom) moves slightly. Alternatively, the first normal direction D1003 of the first projection area PA1001 may be finely adjusted by adjusting the relative position of one or both of the fourth transport roller 1071 and the sixth transport roller 1073 in the Z-axis direction with respect to the fifth transport roller 1072. Or an angle formed by the second normal direction D1004 of the second projection area PA1002 and the surface of the substrate P supported by the planarization. In this manner, by moving the selected roller slightly, it is possible to accurately match the surface posture of the substrate P with respect to the pattern projection surface in each of the projection regions PA1001 to PA1006.

[Third embodiment]

Next, a third embodiment will be described. In the present embodiment, the same components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 8 is a view showing the configuration of an exposure apparatus EX as the substrate processing apparatus 1011 of the present embodiment, and the basic configuration is the same as that of Fig. 7 previously. However, the difference from the configuration of FIG. 7 is that the angle θ 1004 of the fourth reflecting surface p1009 of the second deflecting member 1057 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1004 is set to The substrate P conveyed by the transport device 1009 at 45° is supported by a plane orthogonal to the center plane p1003 (parallel to the XY plane in FIG. 8) at the positions of the projection areas PA1001 to PA1006.

In the configuration of FIG. 8 , the substrate P is transported from the upstream of the transport path to the eighth transport roller 1076 via the first transport roller 1030 , the first guide member 1031 (air rotating lever, etc.), and the fourth transport roller 1071 . The substrate P that has passed through the eighth transport roller 1076 passes through the second guiding member 1033 (air rotating lever or the like) and the second transport The drum 1034 is conveyed downstream of the conveyance path.

As shown in FIG. 8, between the fourth transport roller 1071 and the eighth transport roller 1076, the substrate P is supported and transported in parallel with the XY plane with a predetermined tension. In this case, the second surface p1002 of the support substrate P is a flat surface, and each of the projection areas PA1001 to PA1006 is disposed in the second surface p1002.

Further, in the second optical system 1042 constituting each of the projection modules PL1001 to PL1006, the third reflecting surface p1008 and the fourth reflecting surface p1009 of the second deflecting member 1057 are arranged to be emitted from the second optical system 1042 to the substrate P. The chief ray EL3 of the light beam EL2 is substantially parallel to the center plane p1003. In other words, the first deflecting member 1050 and the second deflecting member 1057 of the projection optical system PL (projection modules PL1001 to PL1006) deflect the imaging optical path from the cylindrically-shaped illumination regions IR1001 to IR1006 in the normal direction. Each of the chief ray EL3 is incident on each of the projection areas PA1001 to PA1006 set on the common plane from the normal direction.

In the present embodiment, the center of the projection area PA1001 (and PA1003, PA1005) is projected to the center of the projection area PA1002 (and PA1004, PA1006) in the XZ plane viewed from the direction parallel to the first central axis AX1001 of the mask M. The distance DFx along the second surface p1002 (the surface of the substrate P) is set to be along the first side of the center point of the illumination area IR1001 (and IR1003, IR1005) to the center point of the illumination area IR1002 (and IR1004, IR1006). The distance (chord length or circumference) DMx of p1001 (cylindrical surface of radius r1001) is substantially equal.

Here, the positional relationship between the illumination regions IR and the projection region PA will be described with reference to FIG. 9 which is schematically shown. In addition, in FIG. 9, the symbol α shows the first radial direction D1001 and the second radial direction D1002. Angle (aperture angle) [°], symbol r shows the radius [mm] of the first face p1001.

In Fig. 9, the circumference DMx [mm] of the center point of the illumination region IR1001 in the XZ plane to the center point of the illumination region IR1002 is expressed by the following equation (3) using the angle α and the radius r.

DMx=π‧α‧r/180...(3)

Further, the linear distance Ds from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 is expressed by the following formula (4).

Ds=2‧r‧sin(π‧α/360)...(4)

For example, when the angle α is 30° and the radius r is 180 mm, the circumference DMx is about 94.248 mm and the distance Ds is about 93.175 mm. That is, if it is assumed that the X coordinate of the center point of the illumination area IR1001 coincides with the X coordinate of the center point of the projection area PA1001, and the X coordinate of the center point of the illumination area IR1002 coincides with the X coordinate of the center point of the projection area PA1002, then When two points of the circumferential separation DMx in the pattern of the mask M are projected onto the substrate P through the projection areas PA1001 and PA1002, respectively, the two points are on the substrate P by the distance Ds (Ds < DMx) in the X direction. exposure. That is, according to the previous numerical example, it means that the pattern exposed on the substrate P through the odd projection areas PA1001, PA1003, PA1005 and the pattern exposed on the substrate P through the even-numbered projection areas PA1002, PA1004, PA1006 are The X direction will be offset by a maximum of 1.073 mm.

Therefore, in the present embodiment, the configuration conditions of the specific optical member in the projection optical system PL are changed from the conditions shown in FIG. 6 previously to project the center point of the region PA1001 and the projection region PA1002 on the planarized substrate P. The linear distance DFx between the center points is substantially equal to the circumference DMx.

Specifically, the fourth reflecting surface p1009 of the second deflecting member 1057 is slightly shifted from the position shown in FIG. 6 to the direction parallel to the optical axis AX1004 (X-axis), and the result is set to a straight line distance DFx and circumference. DMx is consistent. According to the numerical example exemplified above, the difference between the circumference DMx and the distance Ds is 1.073 mm, and the fourth reflecting surface p1009 of the second deflecting member 1057 included in each of the odd projection modules PL1001, PL1003, and PL1005 can be easily easily formed. The position is arranged to move parallel to the second concave mirror 1059 side by about 1 mm along the optical axis AX1004.

However, in this configuration, the configuration of the second deflecting member 1057 (arrangement of the fourth reflecting surface p1009) may be different from the even number of projection modules PL1002, PL1004, and PL1006.

Therefore, the position of the fourth reflecting surface p1009 of the second deflecting member 1057 of all the projection modules PL1001 to PL1006 can be moved parallel to the second concave mirror 1059 side by the optical axis AX1004 by 0.5 mm. Seek commonality of parts.

Figure 10 is a graph showing the correlation between the difference DMx between the circumference DMx of the pattern surface (the first surface p1001) of the mask M and the center of the odd-numbered and even-numbered illumination regions, and the angle α, as shown in Fig. 9, the multi-axis The difference is represented, and the horizontal axis represents the aperture angle α. Further, the complex curve in the graph of Fig. 10 indicates a case where the radius r of the pattern surface (the first surface p1001 of the cylindrical surface) of the mask M is changed to 180 mm, 210 mm, 240 mm, or 300 mm. As described in the numerical examples, the angle α is 30° and the radius r is 180 mm. The circumference DMx is about 94.248 mm and the distance Ds is about 93.175 mm. Therefore, the difference shown by the vertical axis of the graph of FIG. It is about 1.073mm.

As shown in FIG. 10, the difference between the circumferential length DMx on the pattern surface (first surface p1001) of the mask M and the linear distance Ds from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 is due to the first Since the radius r of the surface p1001 changes with the angle α, the position of the fourth reflecting surface p1009 of the second deflecting member 1057 may be set in accordance with the relationship of the graph of FIG.

Further, in order to make the linear distance DMx on the substrate P substantially equal to the circumferential length DMx on the mask M, even if the position of the fourth reflecting surface p1009 of the second deflecting member 1057 in the X direction is optimally arranged, it is still difficult. In the super-micron level, the remaining difference of several μm to several tens of μm or less can be slightly shifted by the image-shifting optical member 1045 shown in FIG. Full precision makes the linear distance DMx consistent with the perimeter DMx.

As described above, the image-shift correction optical member 1045 is used to slightly shift the projection image in the X direction, and the projection areas PA1001 to PA1006 are adjusted to be spaced apart by the distance between the two object points in the scanning exposure direction in the mask pattern plane (perimeter) The method of separating the distance (circumference) of the scanning exposure directions of the respective image points when the two object points are projected onto the substrate P is equal to the ultra-micron level, and similarly, the apparatus of the previous FIGS. 2 to 6 can be used. The configuration and the device configuration of Fig. 7 are applied.

[Fourth embodiment]

Next, a fourth embodiment will be described. In the drawings, the same components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 11 is a view showing the configuration of an exposure apparatus EX as the substrate processing apparatus 1011 of the present embodiment. In the present embodiment, the substrate P transport device 1009 The configuration is the same as that of the conveying device 1009 shown in Fig. 2 previously. The configuration of the substrate processing apparatus 1011 shown in FIG. 11 is different from the configuration of each of the previous FIGS. 2, 7, and 8 in that the mask M is not a rotating cylindrical mask and is a normal transmissive planar mask. The angle θ 1001 of the first reflecting surface p1004 of the first deflecting member 1050 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1003 (surface p1006) is set to 45° or the like.

In FIG. 11, the mask holding device 1012 includes a mask holder 1078 that holds the planar mask M, and a moving device that scans the mask stage 1078 in the X direction in a plane orthogonal to the center plane p1003 ( The illustration is omitted).

Since the pattern surface of the mask M of FIG. 11 is substantially parallel to the XY plane, the main rays EL3 of the mask M side of the projection modules PL1001 to PL1006 are perpendicular to the XY plane, and each of the illumination masks M is illuminated. The optical axes (principal rays) of the illumination modules IL1001 to IL1006 of the illumination areas IR1001 to IR1006 are also perpendicular to the XY plane.

In the present embodiment, the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 included in the first optical system 1041 of the projection modules PL1001 to PL1006 are disposed as the imaging light beam EL2 emitted from the first optical system 1041. The chief ray EL3 is substantially parallel to the center plane p1003. That is, the first deflecting member 1050 and the second deflecting member 1057 included in each of the projection modules PL1001 to PL1006 deflect the imaging light beam EL2 from the respective illumination regions IR1001 to IR1006 on the mask M toward the normal direction. The chief ray EL3 is incident from the normal direction into each of the projection areas PA1001 to PA1006 formed on the substrate P along the cylindrical surface.

Therefore, the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 are arranged to be orthogonal to each other, and the first reflecting surface p1004 and the second reflecting surface p1005 are both set to be substantially opposite to the first optical axis AX1003 (XY plane). It is 45°.

Further, the third reflecting surface p1008 of the second deflecting member 1057 is disposed so as to be non-surface symmetrical with respect to the surface (parallel to the XY plane) orthogonal to the center plane p1003 with respect to the second optical axis AX1004. Further, the angle θ 1003 formed by the third reflecting surface p1008 and the second optical axis AX1004 is substantially 45°, and the angle θ 1004 formed by the fourth reflecting surface p1009 and the second optical axis AX1004 is substantially 45° or less. Regarding the setting of the angle θ 1004, as explained in the previous FIG.

Further, in the present embodiment, similarly to the previous FIG. 9, when viewed in the XZ plane, the center point of the illumination area IR1001 (and IR1003, IR1005) on the mask M (first surface p1001) is to the illumination area IR1002 (and The distance from the center point of IR1004, IR1006) is set to the center point of the projection area PA1001 (and PA1003, PA1005) on the cylindrical substrate P to the center point of the second projection area PA1002 (and PA1004, PA1006). The length (circumference) of the second surface p1002 along the cylindrical surface along the second surface p1002 is substantially equal.

Similarly, in the substrate processing apparatus 1011 shown in FIG. 11, the moving device (the linear motor for scanning exposure or the actuator for fine movement, etc.) of the mask holding device 1012 is controlled by the control device 1014 shown in FIG. The rotation of the second reel member 1022 synchronously drives the mask stage 1078. In the substrate processing apparatus 1011 shown in FIG. 11, after the scanning exposure is performed by the synchronous movement of the mask M in the +X direction, it is necessary to return the mask M to the initial position in the -X direction (winding back). Therefore, the second reel member 1022 is continuously rotated at a constant speed and will When the substrate P is continuously transferred at a constant speed, the substrate P is not exposed to the pattern P during the winding operation of the mask M, and the pattern for the panel is dispersed (separated) in the transport direction of the substrate P. However, in practice, since the speed of the substrate P (here, the peripheral speed) and the speed of the mask M during the scanning exposure are assumed to be 50 to 100 mm/s, it is only necessary to cover the mask M during the rewinding of the mask M. When the stage 1078 is driven at the highest speed of, for example, 500 mm/s, the blank of the pattern for the panel formed on the substrate P in the substrate transfer direction can be reduced.

[Fifth Embodiment]

Next, a fifth embodiment will be described. In the same manner as in the above-described embodiments, the same components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

The mask M of Fig. 12 uses a cylindrical mask M similar to that of Figs. 2, 7, and 8, but is constructed to have a high reflection portion and a low reflection (light absorption) portion for illumination light. A patterned reflective mask. Therefore, it is not possible to use the transmissive illumination device 1013 (illumination optical system IL) as in the previous embodiments, and it is necessary to project the illumination illumination from the side of each of the projection modules PL1001 to PL1006 to the reflective mask M. Composition.

In FIG. 12, a polarization beam splitter PBS and a quarter-wavelength plate PK are provided between the first reflection surface p1004 of the first deflection member 1050 constituting the first optical system 1041 and the reflection type mask M. In the configuration of each of the projection modules shown in Fig. 6, the focus correcting optical member 1044 and the image shift correcting optical member 1045 are provided at this position. However, in the present embodiment, the focus correcting optical member 1044 and the image shift correction are provided. The optical member 1045 moves to a space in front of or behind the intermediate image plane p1007 (viewing pupil 1043).

The wavefront division surface of the polarization beam splitter PBS is disposed at an inclination angle α/ with respect to the center plane p1003 according to the angle θ 1001 (<45°) of the first reflection surface p1004 of the first deflecting member 1050 with respect to the optical axis AX1003 (surface p6). 2 (θ d ) is a principal ray EL3 that travels in the radial direction (normal direction) from the illumination region IR1001 on the reflective reticle M by about 45°.

The illumination light beam EL1 is emitted from a laser light source having excellent polarization characteristics, for example, and is incident on the polarization beam splitter PBS by a beam-shaping optical system or an illuminance-normalized optical system (a fly-eye lens or a rod-shaped element). The majority of the illumination beam EL1 is reflected on the wavefront dividing surface of the polarization beam splitter PBS, and the illumination beam EL1 is converted into circularly polarized light by the 1⁄4 wavelength plate PK, and the illumination region IR1001 on the reflective mask M is irradiated into a trapezoid or rectangle. .

The light (imaging beam) reflected by the pattern surface (the first surface p1001) of the mask M is again converted into linearly polarized light (P-polarized light) by the 1⁄4 wavelength plate PK, and most of the transmitted wavefront of the PBS of the polarization beam splitter is transmitted. The split surface is incident on the first reflection surface p1004 of the first deflecting member 1050. The optical path of the first reflecting surface p1004 or the imaging beam (main ray EL3) is the same as that described above with reference to FIG. 6, and the pattern formed by the reflecting portion appearing in the illumination region IR1001 on the reflective mask M The image is projected in the projection area PA1001.

As described above, in the present embodiment, only the polarization beam splitter PBS and the quarter-wavelength plate PK are added to the first optical system 1041 of the projection module PL1001 (and PL1002 to PL1006), even if it is a reflection type cylinder. The reticle can also easily realize the oblique illumination system. Further, the illumination light beam EL1 is configured to enter the polarization beam splitter PBS from the direction in which the direction of the chief ray EL3 of the imaging light beam reflected by the reflective reticle M intersects, and is incident on the reflective reticle M. So even how much In the case of a small polarization beam splitter PBS P-polarization and S-polarization extinction ratio (separation characteristics), it is also possible to avoid stray light so that a part of the illumination beam EL1 is directly directed from the wavefront splitting surface of the polarization beam splitter PBS. The first reflecting surface p1004 of the first deflecting member 1050 and the projection area PA1001 of the substrate P can satisfactorily maintain the quality of the image projected onto the substrate P (contrast, etc.), and faithfully transfer the mask pattern.

[Sixth embodiment]

Fig. 13 is a view showing the configuration of a projection optical system PL (first projection module PL1001) according to the sixth embodiment. The first projection module PL1001 includes a third deflecting member (planar mirror) 1120, a first lens group (equal projection) 1051, a first concave mirror 1052 disposed on the pupil surface, a fourth deflecting member (planar mirror) 1121, and a fifth optical System (enlarged projection system) 1122. The first surface p1001 of the illumination area IR (the first illumination area IR1001) is placed on the pattern surface of the mask M (transmissive or reflective type) of the first reel member 1021 having a cylindrical surface, and is a cylindrical surface. . Further, the second surface p1002 on the substrate P on which the projection area PA (first projection area PA1001) is placed is a plane.

Further, the mask M held by the first reel member 1021 (the reticle supporting member) is provided with a polarizing light between the reticle M and the third deflecting member 1120 in the case of the reflection type as in the previous FIG. Beamer and quarter wave plate.

In FIG. 13, the imaging light beam EL2 emitted from the first illumination region IR1001 is reflected by the fifth reflecting surface p1017 of the third deflecting member 1120, and is incident on the first lens group 1051. The imaging light beam EL2 that has entered the first lens group 1051 is reflected by the first concave mirror 1052 and is folded back and emitted from the first lens group 1051, and is incident on the sixth reflection surface p1018 of the fourth deflecting member 1121. By the first lens group 1051 The first concave mirror 1052 forms an intermediate image of the pattern of the mask M appearing in the first illumination region IR1001 in the same manner as in the above embodiment.

The imaging beam EL2 reflected by the sixth reflecting surface p1018 enters the fifth optical system 1122 through the position at which the intermediate image is formed, and reaches the first projection region PA1001 through the fifth optical system 1122. The fifth optical system 1122 re-images the intermediate image formed by the first lens group 1051 and the first concave mirror 1052 at a predetermined magnification (for example, twice or more) in the first projection area PA1001.

In FIG. 13, the fifth reflecting surface p1017 of the third deflecting member 1120 corresponds to the first reflecting surface p1004 of the first deflecting member 1050 described with reference to FIG. 6, and the sixth reflecting surface p1018 of the fourth deflecting member 1121 corresponds to FIG. 6 illustrates the second reflecting surface p1005 of the first deflecting member 1050.

In the projection optical system shown in FIG. 13, the extension line of the chief ray EL3 between the third deflecting member 1120 and the mask M (the first surface p1001 of the cylindrical surface) is set to pass through the rotation center line AX1001 of the mask M. The chief ray EL3 of the imaging light beam EL2 between the fifth optical system 1122 having the optical axis AX1008 perpendicular to the surface (the second surface p1002) of the plane-supported substrate P (the second surface p1002) and the projection area PA1001 on the substrate P is set to The two sides of p1002 are vertical, that is, the imaging conditions for telecentricity are satisfied. In order to maintain such a condition, the projection optical system of FIG. 13 includes an adjustment mechanism that slightly rotates the third deflecting member 1120 or the fourth deflecting member 1121 in the XZ plane in FIG.

Further, the third deflecting member 1120 or the fourth deflecting member 1121 may be configured to be slightly rotatable in the X-axis direction or the Z-axis direction, and may be parallel to the Z-axis, in addition to being slightly rotatable in the YZ plane in FIG. The axis rotates slightly. In this case, the image projected into the projection area PA1001 can be slightly displaced by X. Direction or slightly rotate in the XY plane.

Further, although the entire projection module PL1001 is an enlarged projection optical system, it may be an equal magnification projection optical system as a whole, or may be a reduced projection optical system. In this case, since the first optical system including the first lens group 1051 and the first concave mirror 1052 is a doubling system, the projection magnification of the fifth optical system 1122 in the subsequent stage may be changed to be equal or smaller.

[Modification of the sixth embodiment]

Fig. 14 is a view showing a configuration of a modification of the projection optical system according to the sixth embodiment as seen from the Y-axis direction, and Fig. 15 is a view showing a configuration of Fig. 14 as seen from the X-axis direction. In the projection optical system shown in FIG. 14 and FIG. 15, a plurality of projection optical systems shown in FIG. 13 are arranged in the axial direction of the rotation center line AX1001 of the reticle M which is a cylindrical surface in the Y-axis direction, and are plural. A modified example of the situation.

As shown in FIG. 15, the projection optical system PL of the present modification includes a first projection module PL1001 and a second projection module PL1002. The second projection module PL1002 has the same configuration as the first projection module PL1001. As shown in FIG. 14, the second projection module PL1002 is disposed symmetrically with respect to the first projection module PL1001 with respect to the center plane p1003, but in the Y-axis direction of FIG. They are separated from each other as shown in FIG.

As shown in FIG. 14, the first projection module PL1001 includes a third deflecting member 1120A, a first lens group 1051A, a first concave mirror 1052A, and a fourth deflecting member 1121A that receive an imaging beam from the illumination region IR1001 on the mask M. And the fifth optical system (magnification imaging system) 1122A.

The projection module PL1001 shown in FIG. 14 and FIG. 15 changes the mask M and the third deflecting member compared with the previous projection optical systems (FIG. 6 or FIG. 13). The direction of the main light between 1120A. That is, the reflecting surface p1004 of the first deflecting member 1050 of FIG. 6 or the reflecting surface of the third deflecting member 1120 of FIG. 13 deflects the chief ray EL3 from the illumination region IR1001 of the mask M at an obtuse angle (90° or more). The optical axis AX1003 of the first optical system constituted by the first lens group 1051 (1051A) and the first concave mirror 1052 (1052A) is parallel to each other, and the configuration of FIG. 14 is an obtuse angle (90° not). The main light EL3 from the illumination region IR1001 is parallel to the optical axis of the first optical system.

Similarly, as shown in FIG. 14, the second projection module PL1002 includes a third deflecting member 1120B that receives an imaging beam from the illumination region IR1002 on the mask M, a first lens group 1051B, a first concave mirror 1052B, and a fourth bias. Member 1121B and fifth optical system (magnified imaging system) 1122B.

The projection modules PL1001 and PL1002 shown in FIG. 14 and FIG. 15 are enlarged projection optical systems as a whole, and as shown in FIG. 15, the first mask 1 (first reel member 1021) of the first illumination region IR1001 is placed. The area A1001 and the second area A1002 on the mask M (the first reel member 1021) on which the second illumination area IR1002 is placed are separated from each other in the Y direction. However, the magnification of the projection modules PL1001 and PL1002 is appropriately determined, and the third region A1005 (image region) of the first region A1001 of the projection region PA1001 projected on the substrate P is projected onto the substrate P. The fourth area A1006 (image area) of the second area A1002 of the projection area PA1002 is set to have a relationship partially overlapping in the Y direction when viewed in the YZ plane. Thereby, the first region A1001 and the second region A1002 on the mask M (the first reel member 1021) are formed to be connected to the Y direction on the substrate P, and the large panel pattern can be projected and exposed.

As described above, the projection optical system PL shown in FIGS. 14 and 15 is provided. In the substrate processing apparatus, the projection optical system shown in FIG. 13 is arranged symmetrically with respect to the center plane p1003, and the width of the projection optical system in the X direction is smaller than that of the case where a plurality of the Y-axis directions are arranged. As a processing device, the size in the X direction can also be made small.

In addition, as previously described in FIG. 9, in FIG. 14 viewed in the XZ plane, the circumference between the center points of the illumination area IR1001 and the illumination area IR1002 on the mask M (the first reel member 1021) is defined. The distance DFx between the long DMx and the respective center points of the projection areas PA1001 and PA1002 on the substrate P is set to a relationship of DFx=Mp‧DMx when the magnification of the projection optical system is Mp.

[Seventh embodiment]

Fig. 16 is a view showing the configuration of a projection optical system according to a seventh embodiment. The imaging beam EL2 from the first illumination region IR1001 formed on the first surface p1001 (mask pattern surface) of the cylindrical shape enters the sixth optical system 1131, and the seventh optical member 1131 passes through the sixth optical system 1131. The imaging beam EL2 reflected by the ninth reflecting surface p1022 of 1132 reaches the intermediate image plane p1007 in which the first field of view pupil 1043 is placed, and the intermediate image plane p1007 forms an image of the pattern of the mask M.

The imaging beam EL2 passing through the intermediate image plane p1007 is reflected by the 10th reflecting surface p1023 of the eighth deflecting member (planar mirror) 1133, and reaches the first substrate 1 supported by the cylindrical second surface p1002 through the seventh optical system 1134. 1 Projection area PA1001. In the first projection module PL1001 of FIG. 16, the image of the pattern of the mask M in the first illumination region IR1001 is projected as an erect image on the first projection area PA1001.

In Fig. 16, the sixth optical system 1131 is an imaging optical system of equal magnification, and its optical axis AX1010 is substantially coaxial with the chief ray of the imaging light beam EL2 passing through the center of the first illumination region IR1001. In other words, the optical axis AX1010 is substantially parallel to the first radial direction D1001 shown in FIG. 4 or FIGS. 7 to 9.

The seventh optical system 1134 is an imaging optical system of the same magnification, and the intermediate image formed by the sixth optical system 1131 is re-imaged in the first projection area PA1001. The optical axis AX1011 of the seventh optical system 1134 is substantially parallel to the first normal direction (diameter direction) D1003 of the cylindrical second surface p1002 passing through the center of the first projection region PA1001.

In the present embodiment, the two deflecting members 1132 and 1133 are arranged symmetrically with respect to the XZ plane in Fig. 16 via the intermediate image plane p1007. For the sake of convenience of explanation, an intermediate image plane is formed at a position where the optical axis AX1010 of the sixth optical system 1131 intersects with the optical axis AX1011 of the seventh optical system 1134, and a reflecting surface parallel to the YZ plane is disposed at the position of the intermediate image surface. A flat mirror that bends the light path. However, when it can be processed by a single plane mirror, in the XZ plane of FIG. 16, the angle formed by the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 is larger than 90°, The angle formed by a plane mirror and each optical axis AX1010, AX1011 becomes an acute angle of 45°, and the imaging characteristics are not excellent. For example, when the angle formed by the optical axes AX1010 and AX1011 is about 140°, the angle formed by the reflection surface of one plane mirror and each of the optical axes AX1010 and AX1011 becomes 20°. Therefore, if the optical path is bent using two pieces of deflecting members (planar mirrors) 1132 and 1133 as shown in Fig. 16, such a problem can be alleviated.

In addition, in the configuration of FIG. 16, the sixth optical system 1131 can also be used as a In the imaging lens of the large magnification Mf, the seventh optical system 1134 is used as an imaging lens of a reduction magnification of 1/Mf, and the whole is an equal magnification projection system. Conversely, the sixth optical system 1131 can be used as an imaging lens with a magnification ratio of 1/Mf, and the seventh optical system 1134 can be used as an imaging lens of magnification Mf as a whole.

[Eighth Embodiment]

Fig. 17 is a view showing the configuration of a projection optical system PL (first projection module PL1001) according to the eighth embodiment. The configuration of the basic optical system is the same as that shown in Fig. 16 above, but differs in that two deflecting members (planar mirrors) 1140 and 1143 are further added.

In Fig. 17, the eighth optical system 1135 corresponding to the imaging optical system 1131 in Fig. 16 is composed of a third lens 1139 and a fourth lens 1141, and its optical axis is set to be the first surface along the cylindrical surface. The chief ray of the imaging beam EL2 emitted from the center of the first illumination region IR1001 on the photomask M supported by p1001 in the normal direction is substantially parallel. A pupil plane of the eighth optical system 1135 is formed between the third lens 1139 and the fourth lens 1141, and an eleventh deflecting member (planar mirror) 1140 is provided at this position.

The imaging beam EL2 that has been emitted from the first illumination region IR1001 and passed through the third lens 1139 is bent at an angle of 90° or closer to the thirteenth reflecting surface p1026 of the eleventh deflecting member 1140, and is incident on the fourth lens 1141. The eleventh reflecting surface p1024 corresponding to the ninth deflecting member (planar mirror) 1136 of the deflecting member 1132 in Fig. 16 is reflected, and reaches the field stop 1043 disposed on the intermediate image plane p1007. Thereby, the eighth optical system 1135 forms an image of the pattern of the mask M appearing in the first illumination region IR1001 at the position of the intermediate image plane p1007.

In addition, the 8th optical system 1135 is an equivalent imaging optical system, and the intermediate image plane P1007 is configured to be orthogonal to the center plane p1003. Further, the optical axis of the third lens 1139 is substantially coaxial or parallel with the chief ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (the radial direction of the cylindrical first surface p1001).

The ninth optical system 1138 of FIG. 17 has the same configuration as the eighth optical system 1135, and is disposed symmetrically with respect to the eighth optical system 1135 with respect to the intermediate image plane p1007 including the first field stop 1043 and substantially perpendicular to the center plane p1003. . The optical axis of the eighth optical system 1135 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the center plane p1003. The imaging light beam EL2 that has passed through the field stop 1043 via the eighth optical system 1135 and the ninth deflecting member 1136 is reflected by the twelfth reflecting surface p1025 of the tenth deflecting member (planar mirror) 1137, and constitutes the ninth optical system 1138. The fifth lens 1142, the twelfth deflecting member 1143 disposed at the 瞳 position, and the sixth lens 1144 reach the first projection area PA1001 on the substrate P supported by the cylindrical second surface p1002. In the configuration of Fig. 17, the optical axis of the sixth lens 1144 is set to be substantially coaxial with the chief ray of the imaging light beam EL2 that travels in the normal direction (the radial direction of the cylindrical second surface p1002) with respect to the first projection area PA1001. Or parallel.

[Ninth Embodiment]

Fig. 18 is a view showing the configuration of a projection optical system PL (first projection module PL1001) according to a ninth embodiment. The first projection module PL1001 of Fig. 18 is a so-called in-line type of anti-refracting projection optical system. The first projection module PL1001 includes a tenth optical system 1145, a first field stop 1043 (intermediate image surface p1007), which are formed by two of the fourth concave mirror 1146 and the fifth concave mirror 1147, and FIGS. 13 and 14 The fifth optical system 1122 is shown.

In the tenth optical system 1145, an intermediate image of a pattern appearing in the first illumination region IR1001 on the mask M supported along the cylindrical first surface p1001 is formed at the position of the field stop 1043. In the present embodiment, the tenth optical system 1145 is an optical system of an octave system. Each of the fourth concave mirror 1146 and the fifth concave mirror 1147 is configured, for example, as a part of a rotating elliptical surface. The ellipsoid is formed by rotating the ellipse around the major axis (X-axis direction) or the minor axis (Z-axis direction) of the ellipse.

In the configuration of Fig. 18, the chief ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 toward the normal direction (diameter direction) of the cylindrical first surface p1001 is set to be viewed when viewed in the XZ plane. The rotation center axis AX1001 of the first surface p1001 (the first reel member 1021). That is, the chief ray of the imaging light beam EL2 that is incident from the mask M (the first surface p1001) to the fourth concave mirror 1146 of the projection module PL1001 is inclined in the XZ plane with respect to the center plane p1003.

The fifth optical system 1122 is, for example, a refractive index enlarged projection optical system described in FIG. 13, and the intermediate image formed at the position of the visual field pupil 1043 by the tenth optical system 1145 is projected on the second surface along the plane. The first projection area PA1001 on the substrate P supported by p1002.

The fourth concave mirror 1146 and the fifth concave mirror 1147 of the tenth optical system 1145 deflect the imaging light beam EL2 so that the imaging light beam EL2 emitted from the first illumination region IR1001 in the normal direction passes through the fifth optical system 1122 from the normal direction. The first projection area PA1001. In the substrate processing apparatus including the projection optical system PL, similarly to the substrate processing apparatus 1011 described in the above embodiment, it is possible to suppress the occurrence of exposure failure and perform faithful projection exposure. In addition, the fifth optical system 1122 can also be an equal magnification projection optical system, or can be reduced. Department of optics.

[Tenth embodiment]

Fig. 19 is a view showing the configuration of a projection optical system PL (first projection module PL1001) according to the tenth embodiment. The first projection module PL1001 of Fig. 19 is a refractive system optical system that does not include a reflective member having power. The first projection module PL1001 includes an eleventh optical system 1150, a thirteenth deflecting member 1151, a first field stop 1043, a fourth deflecting member 1152, and a twelfth optical system 1153.

In the present embodiment, the imaging light beam EL2 emitted from the first illumination region IR1001 on the mask M held along the cylindrical first surface p1001 is formed by the elliptical shape of the eleventh optical system 1150. The deflecting member 1151 is deflected in the XZ plane and reaches the first field stop 1043 disposed on the intermediate image plane p1007, where an intermediate image of the mask pattern is formed. Further, the 14th deflecting member 1152 which is formed by the wedge shape of the imaging beam EL2 of the first field stop 1043 is deflected in the XZ plane and enters the twelfth optical system 1153, and passes through the twelfth optical system 1153 to reach the circle. The first projection area PA1001 on the substrate P supported by the cylindrical second surface p1002.

The optical axis of the eleventh optical system 1150 is substantially coaxial or parallel to the chief ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (the radial direction of the first surface p1001 of the cylindrical surface). Further, the twelfth optical system 1153 and the eleventh optical system 1150 have the same configuration, and are disposed so as to be symmetric with the eleventh optical system 1150 with respect to the intermediate image plane p1007 (which is orthogonal to the center plane p1003) of the first field of view pupil 1043. The optical axis of the twelfth optical system 1153 is set to be substantially parallel to the chief ray of the imaging light beam EL2 incident on the first projection area PA1001 along the normal line of the planar second surface p1002.

The thirteenth deflecting member 1151 has a ninth surface p1028 that is incident on the imaging light beam EL2 of the eleventh optical system 1150, and a tenth surface p1029 that emits an imaging light beam that is incident from the ninth surface p1028, and is disposed on the first field of view pupil 1043. (middle image plane p1007) before or immediately before. In the present embodiment, each of the ninth surface p1028 and the tenth surface p1029 constituting the predetermined apex angle is configured to be inclined with respect to a plane (XY plane) orthogonal to the center plane p1003 and extending in a plane extending in the Y-axis direction.

The fourth deflecting member 1152 is a member similar to the thirteenth deflecting member 1151, and is disposed symmetrically with respect to the intermediate image plane p1007 and the thirteenth deflecting member 1151 in which the first field stop 1043 is located. The 14th deflecting member 1152 has the 11th surface p1030 that is incident on the imaging light beam EL2 of the first field stop 1043 and the 12th surface p1031 that emits the imaging light beam EL2 incident from the 11th surface p1030, and is disposed in the first field light.阑1043 (middle image plane p1007) is behind or immediately after.

In the present embodiment, the thirteenth deflecting member 1151 and the fourteenth deflecting member 1152 deflect the imaging light beam EL2 emitted from the first illumination region IR1001 in the normal direction into the first projection region PA1001 from the normal direction. In the substrate processing apparatus including the projection optical system PL, similarly to the substrate processing apparatus 1011 described in the above embodiment, it is possible to suppress the occurrence of exposure failure and perform faithful projection exposure.

Further, the eleventh optical system 1150 or the twelfth optical system 1153 may be an optical system that is twice as large as the projection optical system, but may be one of the mask M or the substrate P along the cylindrical surface ( When projecting or exposing in a state of being supported by a circular arc surface, between two projection modules separated in the circumferential direction of the cylindrical surface, The ratio of the field of view interval (circumference distance) on the front side to the interval (circumference distance) of the projected field of view on the final image side may be set to match the projection magnification.

[Eleventh Embodiment]

Fig. 20 is a view showing a partial configuration of a component manufacturing system (flexible display manufacturing line) according to the eleventh embodiment. Here, it is shown that the flexible substrate P (sheet, film, etc.) pulled out from the supply roller FR1 is sequentially wound up to be recovered by n processing apparatuses U1, U2, U3, U4, U5, ... Un. An example of the roller FR2. The higher-level control device 2005 collectively controls the respective processing devices U1 to Un constituting the manufacturing line.

In FIG. 20, the orthogonal coordinate system XYZ is set such that the surface (or the back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (longitudinal direction) of the substrate P is set to the Y direction. In addition, the substrate P may be modified or activated by a predetermined pre-treatment, or may have a fine partition wall structure (concave-convex structure) formed on the surface for precise patterning.

The substrate P wound on the supply roller FR1 is pulled out by the clamped drive roller DR1 and transported to the processing device U1, and the center of the substrate P in the Y direction (width direction) is servo-controlled by the edge position controller EPC1. The relative target position is in the range of ± ten μm to several tens of μm.

The processing apparatus U1 applies a photosensitive functional liquid (photoresist, photosensitive decane coupling material, UV curing resin liquid, etc.) continuously or selectively on the surface of the substrate P in the transport direction (longitudinal direction) of the substrate P by printing. Coating device. In the processing apparatus U1, a pressure roller DR2 on which a substrate P is wound, and a coating mechanism Gp1 including a coating roller for uniformly applying a photosensitive functional liquid on the surface of the substrate P on the pressure roller DR2 are provided. Used to remove quickly The drying mechanism Gp2 or the like which is applied to the solvent or moisture contained in the photosensitive functional liquid of the substrate P.

The processing apparatus U2 is a heating apparatus for heating the substrate P conveyed from the processing apparatus U1 to a predetermined temperature (for example, about 10 to 120 ° C) to stabilize the photosensitive functional layer applied to the surface. In the processing device U2, a plurality of rollers for rotating the substrate P and an air rotating rod, and a heating chamber portion HA1 for heating the loaded substrate P are provided to lower the temperature of the heated substrate P to In the step (processing device U3), the cooling chamber portion HA2 having the same ambient temperature, the driven roller DR3 being held, and the like.

The processing device U3 as the substrate processing apparatus is an exposure device that irradiates the photosensitive functional layer of the substrate P transferred from the processing device U2 with the patterned light of ultraviolet rays corresponding to the circuit pattern or the wiring pattern for the display. In the processing device U3, an edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) at a certain position, a driven roller DR4 that is held, and a substrate P are partially wound at a predetermined tension and the substrate is placed. The pattern exposure portion on P is supported by a uniform cylindrical rotating drum DR5, and two sets of driving rollers DR6, DR7 and the like for imparting a predetermined slack (void) DL to the substrate P.

Further, in the processing apparatus U3, a cylindrical mask M is provided, and a part of the mask pattern in which the cylindrical mask M is projected on a portion of the substrate P supported by the rotating reel DR5 is projected. The projection optical system PL detects the alignment microscopes AM1 and AM2 formed in advance on the alignment marks of the substrate P in order to align (align) the image of one portion of the projected mask pattern with the substrate P.

In the present embodiment, since the cylindrical mask M is made of a reflective type (the pattern of the outer peripheral surface is composed of a highly reflective portion and a non-reflecting portion), a part of the optical element that transmits the projection optical system PL is also provided. The exposure illumination light is applied to the oblique illumination optical system of the cylindrical mask M. The configuration of the falling oblique illumination optical system will be described in detail later.

The processing apparatus U4 performs a wet processing process such as a wet development process and an electroless plating process on the photosensitive functional layer of the substrate P transferred from the processing apparatus U3. The processing unit U4 is provided with three processing tanks BT1, BT2, and BT3 which are layered in the Z direction, a plurality of rollers for bending and transporting the substrate P, and a driving roller DR8 which is sandwiched.

The processing apparatus U5 is a heating and drying apparatus that warms the substrate P conveyed from the processing apparatus U3 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the detailed structure is omitted. Thereafter, the substrate P after passing through the final processing unit Un of the series of processes is wound up to the recovery roller FR2 through the clamped driving roller DR1 through several processing means. At the time of winding, the edge position controller EPC2 is also successively corrected to control the relative position of the drive roller DR1 and the recovery roller FR2 in the Y direction so that the center of the substrate P (width direction) or the substrate end of the Y direction is in the Y direction. Not uneven.

The substrate P used in the present embodiment can be used in the same manner as those exemplified in the first embodiment, and the description thereof is omitted here.

In the component manufacturing system 2001 of the present embodiment, various processes for manufacturing one component are repeatedly performed on the substrate P. The substrate P to which various treatments are applied is divided (cut) depending on each element, and becomes a plurality of elements. The size of the substrate P, for example, the width direction (as the Y direction of the short side) is 10 cm to 2 m. The dimension of the length direction (as the X direction of the long side) is 10 m or more.

Next, the configuration of the processing apparatus U3 (exposure apparatus) of the present embodiment will be described. However, the basic configuration of the exposure apparatus of the present embodiment will be described with reference to Figs. 21 to 23 .

The exposure apparatus U3 shown in FIG. 21 is a scanning exposure apparatus having a reflective cylindrical mask M having a circumferential surface having a radius r2001 from a central axis of rotation AX2001 and a circumferential surface having a radius r2002 from a central axis of rotation AX2002. Rotating reel 2030 (DR5 in Figure 1). Then, by rotating the cylindrical mask M and the rotating reel 2030 at a predetermined rotational speed ratio, the image of the pattern formed on the outer circumference of the cylindrical mask M is continuously projected and exposed to the roll. The surface of the substrate P (the surface curved along the cylindrical surface) around a portion of the outer peripheral surface of the rotating reel 2030.

The exposure device U3 is provided with a transport mechanism 2009, a mask holding device 2012, an illumination optical system IL, a projection optical system PL, and a control device 2013, and is controlled by the control device 2013 to be held in a cylindrical shape of the mask holding device 2012. The rotation of the shutter M or the rotation of the central axis AX2001 in the direction of rotation or the rotation of the rotating reel 2030 which is a part of the transport mechanism 2009 for transporting the substrate P in the longitudinal direction or the rotation of the central axis AX2002.

The mask holding device 2012 includes drive transmission mechanisms 2021 and 2022 such as a drum, a gear, and a belt. The rotation reel 2020 in which the reflection type mask M (mask pattern) is formed on the outer peripheral surface is rotated around the rotation center axis AX2001. Driving force or causing the rotating reel 2020 to be slightly moved in the direction of the central axis of rotation AX2001 parallel to the Y-axis; and the first driving portion 2024, including for driving The motion transmitting mechanisms 2021 and 2022 provide a rotating motor that requires a driving force, a linear motor for micromotion, a piezoelectric element, and the like. Further, the position of the rotation angle of the rotating reel 2020 (mask M) or the direction of the rotation center axis AX2001 is measured by the first detector 2023 including a rotary encoder, a laser interferometer, a gap sensor, or the like. The measurement information is immediately sent to the control device 2013 for use in the control of the first drive unit 2024.

Similarly, the rotating reel 2030 is provided with a rotational driving force or a rotation about a central axis of rotation AX2002 parallel to the Y-axis by a second driving portion 2032 including a rotary motor, a linear motor for fine movement, or a piezoelectric element. Micro-power in the direction of the central axis AX2002. The position of the rotational angle of the rotating reel 2030 or the position of the central axis of rotation AX2002 is measured by the second detector 2031 including a rotary encoder, a laser interferometer, a gap sensor, etc., and the measurement information is sent immediately. The control device 2013 is used for the control of the second drive unit 2032.

Here, in the present embodiment, the central axis of rotation AX2001 of the cylindrical mask M and the central axis of rotation AX2002 of the rotating reel 2030 are parallel to each other and are located in the center plane pc parallel to the YZ plane.

Next, an illumination region IR for exposure illumination light is set in a portion intersecting the center plane pc on the cylindrical pattern surface p2001 in which the cylindrical mask M is formed, and is wound on the outer peripheral surface p2002 along the rotating reel 2030. A portion of the substrate P that is wound around the cylindrical surface that intersects the center plane pc is provided with a projection area PA for projecting an image of a portion of the mask pattern appearing in the illumination region IR.

In this embodiment, the projection optical system PL emits the illumination light beam EL1 into the illumination region IR on the cylindrical mask M, and is incident on the illumination region IR. The reticle pattern reflects the diffracted light beam (imaging beam) EL2, and the projection area PA on the substrate P forms an image of the pattern. The illumination optical system IL is configured to have a portion of the optical path of the shared projection optical system PL.

As shown in FIG. 21, the projection optical system PL includes a pupil mirror 2041 which is inclined at 45 degrees in the XZ plane with respect to the center plane pc and has reflection planes 2041a and 2041b which are orthogonal to each other, and has a plane orthogonal to the center plane pc. The optical axis 2015a is a second optical system 2015 composed of a concave mirror 2040 disposed on the pupil surface pd and a plurality of lenses.

Here, if the plane including the optical axis 2015a and parallel to the XY plane is p2005, the angle θ 2001 of the reflection plane 2041a based on the plane p2005 is +45°, and the reflection plane 2041b based on the plane p2005 The angle θ 2002 is -45°.

The projection optical system PL is configured, for example, as a transflective projection optical system (deformation type of the Dyson optical system) of a half-image field type in which the circular image field of view is divided by the reflection planes 2041a and 2041b of the pupil mirror 2041. Far hearted. Therefore, the image beam EL2 reflected and refracted by the pattern in the illumination region IR is reflected by the reflection plane 2041a on the upper side of the pupil mirror 2041, and reaches the concave mirror 2040 disposed on the pupil plane pd through a plurality of lenses (may also be a plane mirror). . Next, the imaging beam EL2 reflected by the concave mirror 2040 reaches the reflection plane 2041b of the pupil mirror 2041 through a symmetrical optical path with respect to the plane p2005, where it is reflected to reach the projection area PA on the substrate P, and the image of the mask pattern It is imaged on the substrate P in equal magnification (x1).

In order to apply the oblique illumination method to the projection optical system PL, in the present embodiment, the reflection surface of the concave mirror 2040 disposed on the pupil surface pd is configured. One part of p2004 forms a passing portion (window) through which the illumination light beam EL1 is incident from the surface p2003 (glass surface).

In Fig. 21, only one portion of the first optical system 2014 disposed behind the concave mirror 2040 in the illumination optical system IL of the present embodiment is shown, and only illumination light from a light source, a fly-eye lens, an illumination field stop, or the like, which will be described later, is generated. A plurality of point sources of the facet pd are like a point source such as the illumination beam EL1 of Sf.

The point light source image Sf is, for example, set to be optically conjugate with the point light source image (light emitting point of the light source) formed on each of the emission sides of the plurality of lens elements constituting the fly-eye lens, so that the cylindrical mask M is attached. The illumination region IR is illuminated by a uniform illumination distribution by the Keira illumination method by the illumination beam EL1 transmitted through the second optical system 2015 of the projection optical system PL and the reflection plane 2041a on the upper side of the pupil mirror 2041.

In addition, in FIG. 21, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is disposed coaxially with the optical axis 2015a of the projection optical system PL, and the illumination region IR on the cylindrical mask M is set to a circle. The cylindrical pattern surface p2001 has a narrow width in the circumferential direction and a slit shape that is long in the direction of the rotation center axis AX2001.

For example, when the radius r2001 of the pattern surface p2001 of the cylindrical mask M is set to 200 mm and the thickness tf of the substrate P is set to 0.2 mm, the conditions for projection exposure can be set as the outer circumference of the rotating reel 2030. The radius r2002 is r2002=r2001-tf (199.8 mm).

Further, the narrower the width of the illumination region IR (or the projection area PA) in the circumferential direction (the width of the scanning exposure direction), the more faithfully projection exposure can be performed to the fine image. However, in contrast to this, it is necessary to increase the illuminance per unit area in the illumination area IR. To what extent the width of the illumination area IR (or the projection area PA) is to be determined, the radius of the cylindrical reticle M or the rotating reel 2030, r2002, the fineness of the pattern to be transferred (line width) can be considered. Etc.), the depth of focus of the projection optical system PL, etc., and then determined.

Next, in Fig. 21, when the position on the reflecting surface p2004 of the concave mirror 2040 through which the optical axis 2015a passes is taken as the center point 2044, the point light source image Sf is formed in the paper surface (XZ plane) from the center point 2044. The position in which the Z direction is shifted, so that the normal reflected light (0th-order diffracted light) in the imaging light beam EL2 (including the diffracted light) reflected by the illumination region IR on the cylindrical mask M converges to the opposite reflecting surface. The center point 2044 on p2004 is a point symmetrical position to form a point source image Sf'. Therefore, as long as the region including the portion where the point source image Sf' on the reflection surface p2004 is located and the portion where the ±1st-order diffracted light is distributed is the reflection portion, the imaging beam EL2 from the illumination region IR is substantially The plurality of lenses passing through the second optical system 2015 and the reflection plane 2041b of the pupil mirror 2041 arrive at the projection area PA without loss.

The concave mirror 2040 is formed by depositing a metallic reflective film such as aluminum on a concave surface of a concave lens made of a transmissive optical glass material (quartz or the like) to form a reflecting surface p2004. Generally, the light transmittance of the reflecting film is extremely small. Therefore, in the present embodiment, in order to inject the illumination light beam EL1 from the surface p2003 on the back side of the reflection surface p2004, a part of the reflection film constituting the reflection surface p2004 is removed by etching or the like, and the condensed illumination light beam EL1 can pass (transmission). Over the window.

Fig. 22 is a view showing a state of the reflecting surface p2004 of the concave mirror 2040 viewed from the X direction. In Fig. 22, in order to make the explanation simple, it is on the reflecting surface p2004 The upper surface p2005 (parallel to the XY plane) including the optical axis 2015a is shifted by a certain amount in the -Z direction, and three window portions 2042a, 2042b, and 2042c are separated in the Y direction. The window portions 2042a, 2042b, and 2042c are formed by selectively removing the reflective film constituting the reflecting surface p2004. Here, the dot light source images Sfa, Sfb, and Sfc are not shielded (illumination light beams EL1a, EL1b). , EL1c) is a small rectangular shape, but can also be other shapes (circles, ellipses, polygons, etc.). The three point light sources such as Sfa, Sfb, and Sfc are formed, for example, by three lens elements arranged in the Y direction among a plurality of lens elements of a fly-eye lens provided in the illumination optical system IL.

When viewed in the reflecting surface p2004, the positional relationship between the respective window portions 2042a, 2042b, and 2042c is set to be non-point symmetrical, that is, non-point symmetrical with respect to the center point 2044 (optical axis 2015a). Although only three window portions are shown here, in the case where more window portions are formed, the window portions are also set to have a positional relationship that is not point-symmetric with respect to the center point 2044.

Further, after the illumination light beam EL1a of the point light source image Sfa generated in the window portion 2042a is substantially parallel to the illumination region IR of the cylindrical mask M, the imaging beam EL2a for reflecting the diffracted light is at the concave mirror 2040. The reflecting surface p2004 converges to a point source image Sfa' at a position that is point-symmetric with respect to the window portion 2042a at a relative center point 2044.

Similarly, the illumination light beams EL1b and EL1c from the respective point light source images Sfb and Sfc generated in the window portions 2042b and 2042c are also substantially parallel beams and are incident on the illumination region IR of the cylindrical mask M, but the reflection thereof is reflected. The optical imaging beams EL2b, EL2c converge to a point on the reflecting surface p2004 of the concave mirror 2040 at a point symmetry between the opposite center point 2044 and the windows 2042b, 2042c. The light source is like Sfb', Sfc'.

Further, as shown in FIG. 22, the imaging light beams EL2a, EL2b, and EL2c which are the point light source images Sfa', Sfb', and Sfc' include 0 times of diffracted light (positive reflected light) and ±1 times of diffracted light, but each The ±1st-order diffracted light DLa, DLb, and DLc are spread and distributed in the Z-axis direction and the X-axis direction with 0 times of diffracted light.

Further, the point light source image formed on the reflection surface p2004 is Sfa', Sfb', Sfc' (especially 0-time diffracted light), and since the illumination region IR of the cylindrical mask M is a cylindrical surface, FIG. 22 In the paper surface (YZ plane), the shape of the point light source images Sfa, Sfb, and Sfc is distributed in the shape of the Z direction (the circumferential direction of the cylindrical mask).

As shown in Fig. 22, when the respective point light source images Sfa, Sfb, and Sfc are located on the lower side (-Z direction) of the plane p2005 including the center point 2044 (optical axis 2015a), the paper surface shown in Fig. 21 (XZ) In the plane, the illumination light beam EL1 (EL1a, EL1b, EL1c) passes through the second optical system 2015 and the reflection plane 2041a on the upper side of the 稜鏡 mirror 2041 to reach the cylindrical mask M. These illumination light beams EL1 (EL1a, EL1b, EL1c) are parallel beams in the front of the cylindrical mask M, but are slightly inclined with respect to the center plane pc. The amount of tilt corresponds to the amount of displacement in the Z direction from the center point 2044 (optical axis 2015a) of the point source image Sf (Sfa, Sfb, Sfc) in the reflecting surface p2004 (the pupil plane pd).

The imaging light beam EL2 (EL2a, EL2b, EL2c) reflected and refracted in the illumination region IR reaches the upper side of the 稜鏡 mirror 2041 with respect to the center plane pc in the XZ plane symmetrically with the illumination light beam EL1 (EL1a, EL1b, EL1c). The reflection plane 2041a is reflected here and enters the second optical system 2015, and reaches the upper portion of the plane p2005 (center point 2044) of the reflection surface p2004 of the concave mirror 2040. Minute.

In an example shown in FIGS. 21 and 22, the point light source image (light collecting point) Sf of the illumination light beam EL1 is distributed over the optical axis 2015a including the projection optical system PL in the reflection surface p2004 of the concave mirror 2040. The XY plane is parallel to the lower side of the plane p2005 (-Z direction), but as long as the condition is set as previously described, that is, the position of the window portion 2042 in the reflecting surface p2004 of the point source image of the illumination beam is relative to the center point. If 2044 is not a point symmetry relationship (non-point symmetry relationship), the position of the point light source image Sf (window portion 2042) on the reflection surface p2004 can be freely set.

At least under such conditions, the window portion 2042 through which a plurality of point light source images Sf passing through the source of the illumination light beam EL1 is formed on the reflection surface p2004 of the concave mirror 2040 can be made on the reflection surface p2004 (the surface pd). The illumination beam is spatially separated from the imaging beam efficiently.

In order to uniformly distribute the plurality of window portions 2042 (the point light source images of the illumination beam, Sfa, Sfb, Sfc, ...) in the reflection surface p2004, while maintaining the spatial separation of the illumination beam from the imaging beam, the The size of each point source image S40', Sfb', Sfc'... formed on the reflecting surface p2004 by the convergence of the imaging beam EL2 (including the size of the ±1 order diffracted light DLa, DLb, DLc) is set to The spacing between the Y direction and the Z direction of the adjacent window portion 2042 may be small. In other words, the size of each point source image Sfa, Sfb, Sfc... of the illumination beam EL1 within the pupil plane pd (reflection surface p2004) is reduced as much as possible to minimize the window portions 2042a, 2042b, 2042c... This method is effective for each size.

In this embodiment, as a light source, a mercury discharge lamp or a halogen can be used. A lamp, an ultraviolet LED, or the like, but in order to reduce the point light sources such as Sfa, Sfb, Sfc, ... of the illumination beam EL1, it is possible to use a laser light source having a high luminance and radiating a narrow band of light.

Here, an example of the configuration of the illumination optical system IL (first optical system 2014) shown in Figs. 21 and 22 will be described with reference to Fig. 23 . In FIG. 23, the same members as those described in FIGS. 21 and 22 are denoted by the same reference numerals, and description thereof will be omitted. In addition, in FIG. 23, the meandering mirror 2041 in FIG. 21 is omitted, and the optical path between the illumination region IR on the cylindrical mask M and the cylindrical pattern surface p2001 and the second optical system 2015, and the rotation are omitted. The optical path between the projection area PA on the outer circumferential surface of the reel 2030 (or the surface of the substrate P) p2002 and the second optical system 2015 is displayed.

As described above, the illumination optical system IL is provided with a light beam EL0 (illumination light beam EL0) from a light source to generate a plurality of point light source images, and a plurality of light source images from a plurality of point light source images are illuminated in the field of illumination. A condensing lens 2065 that overlaps on the aperture 2064 and a lens system 2066 that guides the illumination light passing through the opening of the illumination field stop 2064 to the concave mirror 2040 of the projection optical system PL (second optical system 2015). Since the Keira illumination method is applied, the surface Ep of the point light source image is generated on the emission side of the fly-eye lens 2062, and is set to the concave mirror 2040 by the glass material (concave lens shape) constituting the collecting lens 2065, the lens system 2066, and the concave mirror 2040. The reflecting surface on which the reflecting surface is located is conjugated.

In the YZ plane, the center of the exit end of the fly-eye lens 2062 is disposed on the optical axis 2065a of the collecting lens 2065, and the center of the illumination field stop 2064 (opening) is disposed on the optical axis 2065a. Further, the illumination field stop 2064 is composed of a glass material (concave lens shape) constituting the lens system 2066 and the concave mirror 2040, and a second optical The plurality of lenses of 2015 are disposed on a surface 2014b that is optically conjugate with the illumination region IR (pattern surface p2001) on the cylindrical mask M.

Further, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is disposed coaxially with the optical axis 2015a of the projection optical system PL (second optical system 2015), but the optical axis 2065a of the collecting lens 2065 is disposed to be opposed to each other. The optical axis 2014a of the first optical system 2014 is eccentric in the -Z direction in the paper surface (XZ plane) of FIG.

Here, the illumination light beam will be described by taking two point light source images SPa and SPd which are located at positions asymmetric with respect to the Z direction via the optical axis 2065a among a plurality of point light source images generated on the emission surface Ep of the fly-eye lens 2062 as an example. The phenomenon.

The light beam from the point source image SPa is illuminated by the condensing lens 2065 into a substantially parallel beam to illuminate the illumination field stop 2064. The illumination light beam EL1a of the opening of the transmission illumination field stop 2064 (slit in the Y direction) is converged into a point light source in the window formed by the reflection surface of the concave mirror 2040 of the projection optical system PL by the lens system 2066. Like Sfa.

As shown in FIG. 21, the illumination light beam EL1a from the point light source image Sfa illuminates the illumination region IR on the cylindrical pattern surface p2001 of the cylindrical mask M through the second optical system 2015 of the projection optical system PL. The imaging light beam EL2a generated on the pattern surface p2001 by the illumination from the illumination light beam EL1a of the point light source image Sfa is reversely traveled by the second optical system 2015, and the point light source image Sfa' is again imaged on the concave mirror 2040. The point light source image Sfa created by the light beam from the illumination optical system IL and the point light source image Sfa' formed by the imaging light beam EL2a are located in a point symmetry relationship in the pupil plane pd.

Similarly, the light beam from the point source such as SPd is illuminated by the collecting lens 2065 into a substantially parallel beam to illuminate the illumination field stop 2064. Transmission illumination field of view The illumination light beam EL1d of the opening of the aperture 2064 is converged into the point light source image Sfd in the window formed in the reflection surface of the concave mirror 2040 by the lens system 2066. The illumination light beam EL1d from the point light source image Sfd is transmitted through the second optical system 2015 to illuminate the illumination area IR on the cylindrical pattern surface p2001. The imaging light beam EL2a generated on the pattern surface p2001 by the illumination of the illumination light beam from the point light source image Sfd is reversed by the second optical system 2015, and the point light source image Sfd' is again imaged on the concave mirror 2040. The point source image Sfd formed by the light beam from the illumination optical system IL and the point source image Sfd' formed by the imaging beam EL2d are located in point symmetry relationship in the pupil plane pd.

An imaging beam EL2a, EL2d having a somewhat light source image Sfa', Sfd' is formed on the reflecting surface of the concave mirror 2040, projected in a cylindrical projection area PA on the substrate P, and an image of the reticle pattern in the illumination region IR is imaged and projected. In the projection area PA of the substrate P.

Fig. 24 is a view showing the configuration of a light source device 2055 which is incident on the illumination beam EL0 of the fly-eye lens 2062 which generates the illumination optical system IL shown in Fig. 23. The light source device 2055 includes a solid-state light source 2057, an extended lens (concave lens) 2058, a collecting lens 2059, and a light guiding member 2060. The solid state light source 2057 includes, for example, a laser diode (LD), a light emitting diode (LED), and the like. The illumination beam LB emitted from the solid-state light source 2057 is converted into a divergent beam by the expansion lens 2058, and is condensed by the condensing lens 2059 at a predetermined convergence ratio (NA) to the incident end face 2060a of the light guiding member 2060.

The light guiding member 2060 is, for example, an optical fiber, and emits an illumination light beam LB incident on the end surface 2060a, and stores NA (numerical aperture) from the emission end surface 2060b, and is converted into substantially parallel by the lens system 2061 (collimator). Illumination beam EL0. The lens system 2061 adjusts the beam diameter of the illumination light beam EL0 to illuminate the entire surface on the incident side of the fly-eye lens 2062. Further, although the diameter of the single optical fiber is, for example, 300 μm, when the light intensity of the illumination light beam LB from the solid-state light source 2057 is large, a plurality of optical fibers can be closely bundled.

Fig. 25 is a view showing an arrangement state of a plurality of point light source images SP formed by the surface Ep (parallel to the YZ plane) on the emission side of the fly-eye lens 2062 in Fig. 23 as viewed from the side of the collecting lens 2065. When the center point of the exit surface Ep of the fly-eye lens 2062 is set to 2062a in the YZ plane, the center point 2062a is located on the optical axis 2065a of the collecting lens 2065.

As shown in FIG. 25, the fly-eye lens 2062 of the present embodiment includes a plurality of lens elements 2062E arranged on a plane orthogonal to the optical axis 2065a of the collecting lens 2065. Each of the plurality of lens elements 2062E has a rectangular cross section elongated in the Y direction and is tightly bundled in the Y direction and the Z direction. Although a point light source image (dot) SP is formed at the center of the emission end of each lens element 2062E, this is a conjugate image of the emission end surface 2060b of the light guiding member 2060 (optical fiber) in Fig. 24 . Further, when viewed in the YZ plane, the plurality of lens elements 2062E are bundled so that the point source images SP are not point-symmetric with respect to each other with respect to the center point 2062a (the optical axis 2065a).

In the example shown in FIG. 25, when the optical axis 2065a including the collecting lens 2065 and the surface parallel to the XY plane are p2006, the group of lens elements 2062E located on the +Z side of the surface p2006 is the upper lens. The group of elements 2062U, the group of lens elements 2062E located on the -Z side of the surface p2006 is the lower lens element group 2062D, and between the upper lens element group 2062U and the lower lens element group 2062D, the position is shifted by the lens element 2062E. 1/2 of the size in the Y direction. As a result, a plurality of pieces dispersed in the upper lens element group 2062U The point source image SP and the plurality of point source images SP dispersed in the lower lens element group 2062D are also arranged asymmetrically with respect to a line parallel to the Y axis passing through the center point 2062a.

The cross-sectional shape of each of the lens elements 2062E of the fly-eye lens 2062 in the YZ plane is formed as a rectangle extending in the Y direction in order to match the slit-like opening shape of the illumination field stop 2064 in FIG. The appearance will also be described with reference to FIG.

Figure 26 is a view of the illumination field stop 2064 of Figure 23 viewed in the YZ plane. In the illumination field stop 2064, an opening portion 2064A having a rectangular shape (or a trapezoidal shape) elongated in the Y direction is formed, and a light beam from the point light source image SP of the fly eye lens 2062 is illuminated by the condensing lens 2065. The rectangular illumination light beam EL1 including the opening portion 2064A is overlapped on 2064. When the center of the opening of the opening 2064A is placed on the optical axis 2065a of the collecting lens 2065, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is eccentrically moved from the center of the opening of the opening 2064A to the +Z direction. The location.

FIG. 27 is a view showing a reflection surface p2004 (arranged to the pupil plane pd) of the concave mirror 2040 which can be used for the distribution of the point light source image SP generated by the fly-eye lens 2062 of FIG. 25 as viewed from the second optical system 2015 side of the projection optical system PL. . Since the reflecting surface p2004 of the concave mirror 2040 is conjugate with the emitting surface Ep of the fly-eye lens 2062, the distribution of the plurality of point light source images SP (lens elements 2062E) shown in Fig. 25 is as shown in Fig. 27 on the reflecting surface p2004 ( The point source of the left and right sides of the facet pd) is like Sf (black circle).

As previously illustrated in FIG. 22, the reflective surface p2004 of the concave mirror 2040 is used to make the plurality of point light sources like Sf transmit the window portion 2042 relative to the center point. 2044 (optical axis 2015a) is configured to be non-point symmetrical. In the example of Fig. 27, the window portion 2042 is formed in a slit shape elongated in the Z direction so that the illumination beams from the plurality of point light source images Sf arranged in a line in the Z direction are collected and transmitted. Further, a portion other than the slit-like window portion 2042 in the reflecting surface p2004 is a high-reflecting portion for efficiently reflecting the image forming beam from the pattern in the illumination region IR of the cylindrical mask M.

A plurality of point light sources such as Sf are arranged in a non-plane symmetry with respect to a plane p2005 including the optical axis 2015a of the second optical system 2015 and orthogonal to the center plane pc (FIG. 21), and the Y-direction dimension of each of the slit-shaped window portions 2042 It is set to a narrower extent so as not to obscure the point source like Sf. As described with reference to Fig. 23, the light beams (illumination light beams EL1) from the plurality of point light source images Sf passing through the respective window portions 2042 are superimposed on the pattern surface p2001 of the cylindrical mask M by the second optical system 2015. Illumination area IR. Thereby, the illumination area IR is illuminated with a uniform illumination distribution.

The reflected light (imaging light beam EL2) of the reticle pattern appearing in the illumination area IR from the pattern surface p2001 returns to the reflecting surface p2004 of the concave mirror 2040, but the imaging light beam EL2 becomes the point light source image again on the reflecting surface p2004. Sf' becomes a separate distribution. As illustrated in FIG. 22, the distribution of a plurality of point light source images Sf' (especially 0-order diffracted light) generated on the reflecting surface p2004 by the imaging light beam EL2 is opposite to the center point 2044 and as the illumination light beam EL1. Most point sources have a point-symmetric relationship like the distribution of Sf.

As shown in FIG. 27, the area on the reflecting surface p2004 in which the plurality of window portions 2042 distributed as the plurality of point light source images Sf as the source of the illumination light beam EL1 are in point symmetry is re-imaged because they are both highly reflective portions. In reflection The point light source on the surface p2004, like Sf' (which also includes the primary diffracted light), is reflected almost without loss and reaches the substrate P.

[Modification 1 of the eleventh embodiment]

Further, in Fig. 27, even a portion of the reflecting surface p2004 of the concave mirror 2040 intersecting the plane p2005 (parallel to the XY plane) including the optical axis 2015a of the projection optical system PL (second optical system 2015) serves as an illumination beam. In the case where the point source of the source is like Sf, the portion where the point source image Sf is located is set as the window portion 2042 as in the previous arrangement condition, and the region which is point symmetrical with respect to the window portion 2042 is set as a reflection. The part (shading part) can be used.

However, when the point light source image Sf (window portion 2042) is located at the center point 2044, if the illumination light beam on the cylindrical mask M is irradiated with the illumination light source having the point light source image Sf as the source, it is there. The reflected imaging beam converges to form a point source image Sf' at the center point 2044 (window portion 2042) of the reflecting surface p2004, and thus there is a case where the imaging beam is not incident on the substrate P. Therefore, the arrangement of the plurality of lens elements 2062E constituting the fly-eye lens 2062 can be changed in the vicinity of the center point 2044 of the reflection surface p2004 without the point source image Sf, or the light shielding film can be applied to the lens element 2062E corresponding to the position of the center point 2044 ( Painted).

Further, in the present embodiment, as shown in FIG. 25 and FIG. 27, the arrangement of the point light source image SP (the arrangement of the lens elements 2062E) formed on the surface Ep on the emission side of the fly-eye lens 2062 and the concave mirror are formed. The arrangement of the window portion 2042 of the reflecting surface p2004 of 2040 is matched one-to-one, but it is not necessarily necessary. In other words, a plurality of point light source images SP formed on the emission surface Ep of the fly-eye lens 2062 are incident from the surface p2003 on the back side of the concave mirror 2040. The point light source image Sf which is one of the reflection surface p2004 (the pupil surface pd) is reached, and the window portion 2042 is not provided and the reflection surface is maintained to be shielded from light. This light shielding can be similarly realized by forming a light shielding film or a light absorbing layer in a region where the light source image Sf to be shielded is located in the surface p2003 on the back side of the concave mirror 2040.

[Modification 2 of the eleventh embodiment]

The imaging light beam EL2 (a plurality of point light source images Sf') incident on the concave mirror 2040 from the second optical system 2015 constituting the projection optical system PL may not necessarily be completely reflected by the concave mirror 2040. For example, in the reflective surface p2004 of the concave mirror 2040, in addition to the transmissive window portion 2042 and the reflecting portion, a plurality of point source images Sf that are shielded as the source of the illumination beam EL1 and a plurality of points formed by the convergence of the imaging beam EL2 may be provided. The point light source is like one side of Sf' or a part of the light source part of the light source.

As described above, the eleventh embodiment has been described. In the present embodiment, as shown in Fig. 21 or Fig. 22, the illumination light from the illumination optical system IL is incident from the back side of the concave mirror 2040 disposed on the pupil surface pd of the projection optical system PL. The second optical system 2015 constituting the projection optical system PL and the reflection plane 2041a on the upper side of the 稜鏡 mirror 2041 reach the illumination region IR on the cylindrical mask M as the illumination light beam EL1.

When the imaging optical path test of the projection optical system PL in the present embodiment is divided into the illumination region IR (object surface) to the first optical path of the concave mirror 2040 (the pupil plane pd) and the concave mirror 2040 (the pupil surface pd) to the projection area PA ( In the second optical path of the image plane, the first optical path serves as an optical path for oblique illumination for guiding the illumination light from the illumination optical system IL to the illumination region IR.

As described above, the processing apparatus U3 (exposure apparatus) of the present embodiment is The mirror disposed in or near the plane of the projection optical system PL efficiently spatially separates the oblique illumination mode of the illumination beam and the imaging beam, thereby making the device simple. Further, compared with the manner in which the illumination beam is separated from the imaging beam by the difference in the polarization state, it is not necessary to use a large polarization beam splitter or a wavelength plate, etc., and the device configuration can be simplified.

Furthermore, in the manner of separating the illumination beam from the imaging beam, there is a need to correspond to the wavefront turbulence caused by the wavelength plate or the projection image characteristics (contrast, aberration) due to the problem of the extinction ratio of the polarization beam splitter. In the case of the deterioration, in the present embodiment, there is almost no deterioration in the characteristics of the projected image due to such reasons, and occurrence of exposure failure can be suppressed. Further, since the processing apparatus U3 of the present embodiment incorporates a tilt illumination method in which the illumination light is irradiated to the reflective mask M by a part of the transmission projection optical system, the illumination optical system is assembled in the transmissive type photomask. In particular, the degree of freedom in the design of the illumination optics is increased.

In the present embodiment, the light source device 2055 shown in FIG. 24 is capable of reducing the size of the point source image, and thus it is assumed that a laser light source having high directivity of radiation (for example, excimer laser light such as KrF, ArF, or XeF) is used. However, it is not limited to this. For example, a fluorescent light source such as a g-line, an h-line, or an i-line, or a laser diode or a light-emitting diode (LED) having a weak radiation directivity can be used.

In the component manufacturing system 2001 (FIG. 20) of the present embodiment, since the configuration of the processing device U3 (exposure device) can be simplified, the manufacturing cost of the device can be reduced. Further, since the processing apparatus U3 scans and exposes the substrate P while transporting the substrate P along the outer peripheral surface p2002 of the rotating reel 2030, the exposure processing can be performed efficiently. As a result, the component manufacturing system 2001 can achieve good efficiency. Manufacturing components.

[12th embodiment]

Next, a twelfth embodiment will be described with reference to Fig. 28 . In the present embodiment, the configuration of the point light source image Sf formed in the reflecting surface p2004 of the concave mirror 2040 is changed by the configuration of the fly-eye lens 2062 described in the previous FIGS. 25 and 27, and the same constituent elements as those of the above-described embodiment are given. The same reference numerals as in the above embodiment are simplified or omitted.

28 is a view showing how the plurality of lens elements 2062E of the fly-eye lens 2062 in the reflecting surface p2004 of the concave mirror 2040 are arranged in an equivalent manner in the YZ plane orthogonal to the optical axis 2015a of the projection optical system PL. The center point 2044 (optical axis 2015a) of the reflecting surface p2004 of the concave mirror 2040 is arranged in a non-point symmetrical manner with respect to a plurality of lens elements 2062E (point source image Sf), and the center of the lens element 2062E closest to the center point 2044 is The center point 2044 is displaced in the Y direction and the Z direction.

In this embodiment, the cross-sectional shape (the shape in the YZ plane) of each lens element 2062E of the fly-eye lens 2062 is set to be the rectangular opening portion 2064A including the illumination field stop 2064 as described above with reference to FIG. The shape of the rectangle is similar, but here, the ratio Py/Pz of the cross-sectional dimension Py in the Y direction to the cross-sectional dimension Pz in the Z direction is set to be substantially four. Therefore, a plurality of point light source images Sf distributed in the reflecting surface p2004 (the pupil surface pd) are also arranged at a pitch of the cross-sectional dimension Py in the Y direction, and are arranged at a pitch of the cross-sectional dimension Pz in the Z direction.

As long as the normal fly-eye lens is used, the center of each lens element 2062E is arranged straight in the Y direction and the Z direction. However, in this embodiment, the lens elements 2062E adjacent to each other in the Z direction are in the Y direction. Each displacement △ Y to configure. If the displacement amount ΔY is set to about 1/4 of the cross-sectional dimension (arrangement pitch) Py of the lens element 2062E in the Y direction, the point light source images Sf will be located at ±45 degrees and ±135 in the YZ plane. The position where the direction is separated in either direction.

In Fig. 28, when four point light source images Sf surrounding the center point 2044 near the center point 2044 of the reflecting surface p2004 are specified, the area surrounded by the four point light sources Sf (here, the tilting) The center of gravity of the rectangle is displaced from the center point 2044. In other words, the position of the center of gravity of the area surrounded by the four point light sources Sf is located at a position different from the center point 2044. By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane such that such displacement occurs, it is possible to arrange each of the point light source images Sf in a non-point symmetrical relationship with respect to each other with respect to the center point 2044. This means that the area on the reflecting surface p2004 at which the relative center point 2044 is point-symmetric with respect to each point light source image Sf can be used as a reflecting portion.

Although the window portion 2042 for transmitting the point light source image Sf is formed in the reflecting surface p2004 of the concave mirror 2040 corresponding to the distribution of the point light source image Sf as configured above, the shape, size, and arrangement of the window portion can be considered. form. In a simple manner, as shown in FIG. 28, a circular window portion 2042H in which only one point light source is transmitted by Sf is arranged in an array in which the point source image Sf is arranged in the entire surface of the reflecting surface p2004.

Alternatively, the groove-like window portion 2042K in which all of the point light source images Sf are arranged in a line in a direction inclined by 45 degrees with respect to the Y direction on the reflection surface p2004 may be formed. When the illumination region IR of the cylindrical mask M is irradiated with an illumination beam of a series of point source such as Sf as the source located in the window portion 2042K, the reflected beam (imaging beam) is the reflection surface p2004 of the concave mirror 2040. The upper point light source image Sf' (which also includes the primary diffraction image) converges on the reflection region 2042K' which is displaced from the window portion through which the point light source image Sf is transmitted. Further, the two point light source images Sf arranged in a direction inclined by 45 degrees with respect to the Y direction may be a group of window portions 2042L which are arranged to be transmitted in an elliptical shape (or gourd shape). Regardless of which of the window portions 2042H, 2042K, and 2042L, the illumination light from each of the point light source images Sf is partially reduced in size.

In the above-described twelfth embodiment, the Y-direction displacement amount ΔY of the lens element 2062E of the fly-eye lens 2062 can be arbitrarily set, and the ratio Py/Pz of the cross-sectional dimension of the lens element 2062E is not necessarily set to an integral multiple.

[Thirteenth embodiment]

Next, a thirteenth embodiment will be described with reference to Fig. 29 . Similarly to FIG. 28, this embodiment is also a deformer in which the configuration of the fly-eye lens 2062 and the point light source image Sf formed in the reflecting surface p2004 of the concave mirror 2040 are disposed. In the configuration of Fig. 29, the centers of the plurality of lens elements 2062E of the fly-eye lens 2062 are linearly arranged in the Y direction and the Z direction in the YZ plane.

In the case of such a fly-eye lens 2062, the point light source image Sf formed on the emission side of each lens element 2062E is arranged at a pitch of the cross-sectional dimension Py in the Y direction and at a pitch of the cross-sectional dimension Pz in the Z direction. In this case as well as the description of the twelfth embodiment of Fig. 28, attention is paid to the four points surrounding the center point 2044 at the center point 2044 (optical axis 2015a) of the reflecting surface p2004 of the concave mirror 2040. When the light source is like Sfv1, Sfv2, Sfv3, or Sfv4, the center of gravity Gc of the region (rectangular) surrounded by the four point light sources Sfv1 to Sfv4 is displaced from the center point 2044. In other words, the center of gravity position Gc is located at a different position from the center point 2044.

By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane such that such displacement occurs, it is possible to arrange each of the point light source images Sf in a non-point symmetrical relationship with respect to each other with respect to the center point 2044. Therefore, the region on the reflecting surface p2004 in which the relative center point 2044 is point-symmetric with respect to each point light source image Sf can be made into a reflecting portion at any time.

Further, in the reflection surface p2004 of the concave mirror 2040 of the present embodiment, the arrangement pitch of the lens element 2062E (point source image Sf) is matched to form a circular window portion 2042H for individually transmitting the point light source image Sf.

[Fourteenth embodiment]

Next, a fourteenth embodiment will be described with reference to Fig. 30. Similarly to FIGS. 28 and 29, the present embodiment is also a deformer in which the configuration of the fly-eye lens 2062 and the point light source image Sf formed in the reflecting surface p2004 of the concave mirror 2040 are disposed. In the configuration of Fig. 30, the plurality of lens elements 2062E of the fly-eye lens 2062 (the cross-sectional shape is a rectangle elongated in the Y direction) are arranged at a pitch of the cross-sectional dimension Py in the Y direction, and the pitch of the cross-sectional dimension Pz is tight in the Z direction. The group of lens elements 2062E arranged in a row in the Y direction is arranged in a position in which each column of the Z direction is changed (staggered) in the Y direction.

In the case of the fly-eye lens 2062, the point source image Sf is generated on the emission end side of all the lens elements 2062E receiving the illumination light from the light source (for example, EL0 in Fig. 24), but is shielded from the point source image Sf. The center point 2044 of the reflecting surface p2004 of the concave mirror 2040 is one of the two point light source images Sf in a point-symmetric arrangement relationship with each other, and the light blocking body 2062s is formed in the corresponding lens element 2062E.

In the configuration of Fig. 30, the corresponding lens element 2062E is formed into a mask. The light source 2062s (metal thin film or the like) is uniformly distributed in a random number of point light source images Sf selected in the reflecting surface p2004 of the concave mirror 2040. When such a fly-eye lens 2062 is used, as shown in Fig. 30, a circular window portion 2042H for transmitting the point light source image Sf is formed on the reflecting surface p2004 of the concave mirror 2040.

[Fifteenth embodiment]

Next, a fifteenth embodiment will be described with reference to Fig. 31. In the present embodiment, the plurality of point light source images Sf are formed in the reflection surface p2004 of the concave mirror 2040 by the light source image forming portion without using the fly-eye lens 2062 described so far. Fig. 31 shows a cross section including a surface of the concave mirror 2040 which is parallel to the XZ plane and includes the optical axis 2015a (center point 2044), and each of the window portions 2042H is formed on the reflecting surface p2004 where the point light source image Sf (Sfa) is located.

The concave mirror 2040 is formed, for example, by a reflective film formed on the concave side of a base material made of a fine ceramic or a glass ceramic having a low thermal expansion coefficient. In the reflective film, a plurality of window portions 2042H are formed under the same conditions as in the previous embodiments. In the present embodiment, the base material behind the window portion 2042H is formed so that the optical fiber Fbs, which is a part of the illumination optical system IL, passes through. Hole (diameter of 1 mm).

The emission end of each of the optical fibers Fbs functions as a point light source image, and is provided on substantially the same surface as the reflection surface p2004. The illumination light that is incident on the incident end of each of the optical fibers Fbs is set such that the illumination light beam (for example, EL1a) projected from the emission end of the optical fiber Fbs has a predetermined numerical aperture (divergence angle characteristic). Further, the direction of the illumination beam from the emission end of each of the optical fibers Fbs is set to coincide with the direction of the chief ray passing through the emission end (point source image).

In the configuration shown in FIG. 31, since a plurality of point light source images Sf are generated at the emission end of the optical fiber Fbs without using the fly-eye lens 2062, it is necessary The number of optical fibers corresponding to the number of the window portions 2042H is reduced, but the entire light source to the concave mirror 2040, that is, the illumination optical system IL can be miniaturized.

Further, although the concave mirror 2040 is provided with a small hole through which the output end of the optical fiber Fbs passes, a quartz thin tube (cylindrical rod) or the like may be embedded in each of the small holes, and the respective injection ends of the optical tube may be embedded in the small end. An ultraviolet light emitting diode (LED) having a collecting lens is disposed on the side, and the emitting end side of each light pipe is aligned with the reflecting surface p2004 of the concave mirror 2040.

[Sixth embodiment]

Next, a sixteenth embodiment will be described with reference to Figs. 32A and 32B, Figs. 33A, 33B and 33C. In the present embodiment, instead of the fly-eye lens 2062 in the illumination optical system IL, a rod lens (corner-shaped glass or quartz) is used to uniformly illuminate the illumination region IR on the cylindrical mask M.

32A is a plan view of the optical path of the light guiding member 2060 (optical fiber) guiding the light of the light source to the projection optical system PL (second optical system 2015) from the Y-axis direction, and FIG. 32B is the optical path of FIG. 32A viewed from the Z-axis direction. Top view. In Figs. 32A and 32B, the optical path from the illumination field stop 2064 to the projection optical system PL is the same as that of the previous Fig. 23, and therefore the description thereof will be omitted.

The illumination optical system IL shown in FIGS. 32A and 32B includes the light guiding member 2060, the collecting lens 2093, the rod lens 2094, the illumination field stop 2064, the lens system 2066, and the like described with reference to FIG. The configuration of the projection optical system PL (second optical system 2015) after the concave mirror 2040 is the same as that of the previous FIGS. 21 and 23.

The illumination light beam EL0 emitted from the light guiding member (optical fiber) 2060 converges on the incident end face 2094a of the rod lens 2094 or the vicinity thereof by the collecting lens 2093. Next. The cross-sectional shape of the rod lens 2094 along the YZ plane (injection end surface 2094a and emission end surface 2094b) is formed into a rectangular shape including a trapezoidal or rectangular opening portion 2064A (FIG. 26) of the illumination field stop 2064. The cross-sectional shape is substantially similar to the cross-sectional shape of the lens element 2062E of the fly-eye lens 2062 shown in the previous FIGS. 25 and 28 to 30.

In the case where the rod lens 2094 is used, the illumination light beam EL0 that converges on the incident end surface 2094a is inside the rod lens 2094, and moves mostly between the side surface 2094c parallel to the XZ plane and the side surface 2094d parallel to the XY plane to overlap the inside. The reflection is advanced to the exit end face 2094b. In the case of a rod lens, although the illuminance distribution of the illumination light is most uniform, the emission end surface 2094b, the uniformity of the illumination is better with the number of internal reflections. Therefore, the emission end surface 2094b is arranged in line with the surface 2014b conjugated to the illumination region IR on the cylindrical mask M.

Since the cross section of the rod lens 2094 of the present embodiment has a rectangular shape, the number of times of reflection of the illumination light between the opposite side faces 2094c is smaller than the number of reflections of the illumination light between the opposite side faces 2094d. The number of times the illumination light beam EL0 is reflected on the inner surface of the rod lens 2094 is set such that the length of the rod lens 2094 is two or more from the viewpoint of improving illuminance uniformity. Further, since the shape of the exit end face 2094b of the lever lens 2094 defines the outer edge of the illumination region IR, the illumination field stop 2064 can also be omitted.

Next, when the line connecting the center end point of the entrance end face 2094a of the connecting rod lens 2094 in the YZ plane and the center point of the incident end surface 2094b in the YZ plane is the central axis AX2003, the central axis AX2003 and the projection optical system are used. The optical axis 2015a of PL (the optical axis 2014a of the lens system 2066) is parallel, but is biased toward the Z direction. heart. Further, although the emission end of the light guiding member 2060 is disposed on the optical axis 2093a of the collecting lens 2093, the optical axis 2093a is displaced in the -Y direction with respect to the central axis AX2003 of the rod lens 2094.

By the displacement in the -Y direction, the plurality of point light source images Sf generated in the reflection surface p2004 of the concave mirror 2040 can be arranged to be non-point symmetrical with respect to the center point 2044 (optical axis 2015a) of the reflection surface p2004. This matter will be described in detail based on Figs. 33A to 33C. 33A is a view of the condensing lens 2093 viewed from the side of the exit end face 2094b of the rod lens 2094 in the X-axis direction, and FIG. 33B is a view of the rod lens 2094 viewed from the lens system 2066 side in the X-axis direction, and FIG. 33C is from the X-axis direction. A view of the reflecting surface p2004 of the concave mirror 2040 is viewed.

As shown in Fig. 33A, the cross section of the rod lens 2094 is a rectangle defined by the side surface 2094d parallel to the XY plane and the side surface 2094c parallel to the XZ plane, and the central axis AX2003 of the rod lens 2094 is opposed to the optical axis 2093a of the collecting lens 2093. The ground is eccentric toward the Y direction. Further, as shown in Fig. 33B, the central axis AX2003 of the rod lens 2094 is eccentric to the Z direction with respect to the optical axis 2014a (2015a) of the lens system 2066.

In such a configuration, the concave lens and the lens system 2066, which are the base material of the concave mirror 2040, are formed on the reflecting surface p2004 of the concave mirror 2040 by the Fourier transform surface (the surface pd) of the surface 2014b on which the exit end surface 2094b of the rod lens 2094 is located. on. Therefore, as shown in FIG. 33C, on the reflecting surface p2004 of the concave mirror 2040, a plurality of point light source images Sf are formed at a pitch DSy in the Y direction and at a pitch DSz in the Z direction. The point light source image Sf appears as a virtual image of a point image of the illumination light beam EL0 that converges on the incident end surface 2094a of the rod lens 2094.

A plurality of point sources are like Sf, and since the section of the rod lens 2094 is rectangular, Therefore, the arrangement pitch DSy of the point light source image Sf in the direction parallel to the long side of the cross section (Y direction) is longer than the arrangement pitch DSz of the point light source image Sf in the direction parallel to the short side (Z direction). Further, as shown in Figs. 32A and 32B, since the number of internal reflections of the illumination light in the rod lens 2094 is larger than the Z direction in the Z direction, the number of point light source images Sf generated on the reflection surface p2004 of the concave mirror 2040 is also The Z direction is more than the Y direction. In the example of Fig. 33C, five point light source images Sf are arranged in the Z direction, and three point light source images Sf are arranged in the Y direction.

Further, the center axis AX2003 of the rod lens 2094 and the optical axis 2093a of the collecting lens 2093 are eccentrically opposed to each other in the Y direction, and the distribution of the point source image Sf formed on the reflecting surface p2004 of the concave mirror 2040 is opposite to the center point. 2044 (optical axis 2015a) is eccentric to the Y direction as a whole, and each of the point light source images Sf can be arranged such that the relative center point 2044 is not point-symmetric with respect to each other.

Similarly to the embodiment shown in FIG. 27, on the reflecting surface p2004 of the concave mirror 2040, a plurality of point light source images S204 arranged in a row in the Z direction are arranged in the Y direction by a pitch. The DSy is formed in three columns. The width of the window portion 2042 in the Y direction is set to be as small as possible within a range in which the illumination light beam having the point source image Sf as a source is not shielded. The groove-like window portions 2042 are also formed to be non-point-symmetrical with respect to each other with respect to the center point 2044.

In the configuration of FIG. 33C, the Y-direction eccentric amount of the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the collecting lens 2093 is set to be closest to the center point 2044 on the reflecting surface p2004 (the pupil surface pd) of the concave mirror 2040. The Y-direction distance (set to Yk) of the point light source image Sf to the center point 2044 (the optical axis 2015a) is set such that the interval (set to Yw) of the window portion 2042 arranged in the Y direction is less than one half, that is, Yk<( Yw/2).

As described above, when the point light source image Sf which is the source of the illumination light beam EL1 that illuminates the illumination region IR of the cylindrical mask M is disposed on the reflection surface p2004 (the pupil surface pd) of the concave mirror 2040, the cylindrical shape is obtained. The imaging beam EL2 generated by the illumination region IR on the mask M is a diffraction image Sf' of the point source image Sf (including 0-order light and ±1-order diffracted light, etc.) on the reflection surface p2004 as shown in FIG. 33C. And the distribution. On the reflecting surface p2004, the diffraction image Sf' is located at a point symmetrical with respect to the center point 2044, which is the source of the illumination light beam EL1, that is, the point light source image Sf.

In the present embodiment, since the relationship between the distance Yk and the interval Yw is set to Yk < (Yw/2), a plurality of diffraction images Sf' generated on the concave mirror 2040 (the pupil surface pd) by the imaging light beam EL2 are formed. Both are formed on the reflecting portion offset from the window portion 2042. Thus, the imaging light beam EL2 is reflected at the reflection portion of the concave mirror 2040 with little loss, and as shown in the previous FIG. 21, is projected onto the projection area PA on the substrate P held along the outer circumferential surface p2002.

As described above, even in the case where the lever lens 2094 is used, a plurality of point light sources can be imaged as Sf by shifting the convergence position of the illumination light beam EL0 on the incident end face 2094a of the lever lens 2094 from the central axis AX2003. Each of the center points 2044 set to the reflecting surface p2004 of the concave mirror 2040 is in a non-point symmetrical relationship with each other.

[17th embodiment]

Next, the configuration of the processing apparatus (exposure apparatus) U3 of the seventeenth embodiment will be described with reference to Figs. 34 and 35. In the exposure apparatus of the present embodiment, the Y-direction dimension of the pattern exposure region on the corresponding substrate P is larger than the Y-direction dimension of the illumination region IR or the projection region PA of the projection optical system PL shown in FIG. 21, and a plurality of Projection optics are arranged in the Y direction to expand in the Y direction Effective exposure may range.

Therefore, it is necessary to project the pattern of the cylindrical mask M as an erect image onto the substrate P. In the projection optical system PL shown in FIG. 21, the X-direction of the reticle pattern image projected on the substrate P is erect, but is reversed in the Y direction. Therefore, by arranging the projection optical system of the same configuration one after the other (in series), the projection image inverted in the Y direction can be reversed again in the Y direction, and the result is in the projection area PA on the substrate P. It is made into an erect image in both the X direction and the Z direction.

Fig. 34 is a view showing the overall configuration of the exposure apparatus of the embodiment, and Fig. 35 is a view showing the arrangement relationship between the illumination area IR and the projection area PA formed by each of the plurality of projection optical systems, and the orthogonal coordinate system XYZ of each figure, and the previous The coordinate system set in the embodiment of Fig. 21 is identical. In addition, the same reference numerals are given to the same members or elements as those of the exposure apparatus shown in Figs. 21 and 23.

The substrate P conveyed from the upstream side of the transport path is wound around a peripheral surface of the rotating reel 2030 through a transfer drum or a guide member (not shown), and then conveyed downstream through a guide member or a transfer drum (not shown). The second drive unit 2032 rotates the rotary reel 2030 clockwise about the rotation central axis AX2002, and the substrate P is transferred at a constant speed. Each of the projection areas PA2001 to PA2006 of the six projection optical systems PL2001 to PL2006 is located in a portion of the cylindrical outer peripheral surface of the rotary reel 2030 in which the substrate P is wound. Corresponding to each of the six projection areas PA2001 to PA2006, six illumination areas IR 2001 to PA2006 are set on the outer peripheral surface (cylindrical mask pattern surface) of the cylindrical mask M.

The six projection optical systems PL2001 to PL2006 are all of the same optical configuration, and are divided into a central plane pc (with a YZ plane) with respect to a central axis of rotation AX2001 including a cylindrical mask M and a central axis of rotation AX2002 of the rotating reel 2030. Projection optical systems PL2001, PL2003, and PL2005 (also collectively referred to as odd-numbered projection optical systems PLo) provided on the left side (-X direction) and projection optical systems PL2002, PL2004, and PL2006 (on the right side (+X direction)) Also commonly referred to as the even projection optical system PLe).

The projection optical systems PL2001 to PL2006 of the present embodiment include the projection optical system PL shown in Fig. 21 and the illumination optical systems IL2001 to IL2006 for oblique illumination. Since the configuration is the same as that of FIG. 21, the projection optical system PL2001 and the illumination optical system IL2001 will be briefly described representatively. The illumination optical system IL2001 is incident on the illumination light beam EL0 from the light source device 2055, and the concave mirror 2040 disposed on the back surface of the unit of the upper portion of the projection optical system PL2001 (the projection optical system PL similar to that of FIG. 21) is disposed on the back side of the reflection surface p2004. Generate a number of point sources like Sf. The illumination light beam EL1 having the point light source image Sf as a source is reflected by the reflection plane 2041a on the upper side of the pupil mirror 2041, and illuminates the illumination region IR2001 on the outer circumferential surface of the cylindrical mask M.

The imaging beam EL2 reflected from the mask pattern in the illumination region IR2001 is reflected by the reflection plane 2041a, reflected by the concave mirror 2040, and reflected by the reflection surface (2041b) on the lower side of the pupil mirror 2041, on the plane p2007 (middle image) Face p2007) forms a space image (intermediate image) of the reticle pattern.

The projection unit in the latter stage of the projection optical system PL2001 is also provided with a dome mirror, a plurality of lens elements, a half-field anti-reflection projection system of a concave mirror 2078 disposed on the pupil surface, and an intermediate image on the intermediate image plane p2007. After being reflected by the concave mirror 2078, the light beam EL2 is reflected by the reflection plane 2076b on the lower side of the 稜鏡 mirror (2076), reaches the projection area PA2001 on the substrate P, and generates an erect positive image of the reticle pattern in the projection area PA2001. Further, since the projection unit of the rear stage (intermediate image plane to the projection area) of the projection optical system PL2001 can re-image the intermediate image formed on the intermediate image plane p2007 on the projection area PA2001 on the substrate P, the reflection on the concave mirror 2078 is performed. The window portion 2042 formed on the reflecting surface p2004 of the concave mirror 2040 is not provided on the surface.

The projection optical system PL2001 having the above configuration (the same is true for the other projection optical systems PL2002 to PL2006) is a single projection system of the multi-lens method. Therefore, the illumination optical region cannot be passed through as in the projection optical system PL of FIG. The principal ray at the center point in the IR and the chief ray passing through the center point in the projection area PA2001 are disposed in the center plane pc.

Therefore, as shown in FIG. 34, the angle θ 2001 (see FIG. 21) of the reflection plane 2041a of the pupil mirror 2041 of the projection unit on the upper side of the projection optical system PL2001 (PL2003, PL2005 is the same) is set to a value other than 45°. The extension line D2001 of the chief ray passing through the center point in the illumination area IR2001 is directed to the central axis of rotation AX2001 of the cylindrical mask M. Similarly, the angle of the reflection plane 2076b of the pupil mirror 2076 of the projection unit on the lower side of the projection optical system PL2001 is set to a value other than 45° with respect to the XY plane, so that the chief ray passing through the center point in the projection area PA2001 is The extension line D2001 is directed to the central axis of rotation AX2002 of the cylindrical mask M.

Similarly to the projection optical system PL2002 (PL2004, PL2006) which is disposed symmetrically with respect to the projection optical system PL2001 with respect to the center plane pc, the angle θ 2001 of the reflection plane 2041a of the pupil mirror 2041 of the upper projection unit is also similar. The value is set to a value other than 45° so that the extension line D2002 of the chief ray passing through the center point in the illumination area IR2002 is directed to the rotation center axis AX2001 of the cylindrical mask M, and the projection unit 2076 of the projection unit at the rear stage. The angle of the reflection plane 2076b is set to a value other than 45° with respect to the XY plane so that the extension line D2002 of the chief ray passing through the center point in the projection area PA2002 is directed to the rotation center axis AX2002 of the cylindrical mask M.

As described above, the projection optical system PLo having an odd number of extension lines D2001 and D2002 obliquely inclined with respect to the center plane pc and the even projection optical system PLe are symmetrically arranged with respect to the center plane pc when viewed in the XZ plane. However, when viewed on the XY plane, it is offset in the Y direction. Specifically, each of the projection optical systems PL2001 to PL2006 is provided such that the illumination regions IR2001 to IR2006 formed on the pattern surface of the cylindrical mask M and the projection regions PA2001 to PA2006 formed on the substrate P are as shown in FIG. Configuration relationship.

35 is a view showing the arrangement of the illumination areas IR2001 to IR2006 and the projection areas PA2001 to PA2006 in the XY plane, and the left side view is the illumination on the cylindrical mask M from the side of the intermediate image plane p2007 forming the intermediate image. In the region IR2001 to IR2006, the image on the right side is the projection area PA2001 to PA2006 supported on the substrate P of the rotating reel 2030 from the intermediate image surface p2007 side. Moreover, the symbol Xs in FIG. 35 shows the moving direction (rotation direction) of the cylindrical mask M (rotary reel 2020) and the reel 2030.

In Fig. 35, each of the illumination regions IR2001 to IR2006 has an elongated trapezoidal shape with a bottom edge and a lower bottom edge from the center plane pc (parallel to the Y axis). This means that each of the illumination optical systems IL2001 to IL2006 shown in FIG. 34 has the illumination field stop 2064 as shown in FIG. 26 previously. In addition, each of the projection optical systems of FIG. Since PL2001 to PL2006 form an intermediate image on the intermediate image plane p2007, when the field of view pupil having a trapezoidal opening is disposed there, the shape of each illumination region IR2001 to IR2006 can be formed into a simple rectangular shape (including a trapezoidal opening). The size).

On the outer peripheral surface of the cylindrical mask M, the center points of the illumination regions IR2001, IR2003, and IR2005 formed by the odd projection optical system Plo are located on a plane Lo (perpendicular to the XY plane) parallel to the center plane pc. The center points of the illumination regions IR2002, IR2004, and IR2006 formed by the even projection optical system PLe are located on a plane Le (perpendicular to the XY plane) parallel to the center plane pc.

If each of the illumination regions IR2001~IR2006 is trapezoidal such that the Y-direction dimension of the lower base is A2002a, and the dimension of the upper base is Y2002, the center of each of the odd illumination regions IR2001, IR2003, and IR2005 is The Y direction is arranged at intervals (A2002a+A2002b), and the center points of the even illumination regions IR2002, IR2004, and IR2006 are also arranged at intervals (A2002a+A2002b) in the Y direction. However, the even illumination regions IR2002, IR2004, and IR2006 are relatively offset in the Y direction (A2002a+A2002b)/2 with respect to the odd illumination regions IR2001, IR2003, and IR2005. Further, the X-direction distances of the surface Lo and the surface Le from the center plane pc are set to be equal to each other.

In the present embodiment, each of the illumination regions IR2001 to IR2006 is configured such that the end portions of the illumination regions adjacent to the Y direction when viewed in the circumferential direction (Xs direction) of the outer peripheral surface of the cylindrical mask M (the trapezoidal bevel Department) overlap each other. Thereby, even if the size of the pattern area A2003 of the cylindrical mask M is large in the Y direction, it is possible to secure an effective exposure area. Further, the pattern area A2003 is surrounded by the frame-shaped pattern non-formation area A2004, but the pattern non-formation area A2004 is made of a material having an extremely low reflectance (or high light absorptivity) to the illumination light.

On the other hand, as shown in the right side of FIG. 35, the projection areas PA2001 to PA2006 on the substrate P are formed in the cylinder when the illumination field of view pupil 2064 is provided in each of the illumination optical systems IL2001 to IL2006. The arrangement and shape of the illumination areas IR2001 to IR2006 on the outer peripheral surface of the mask M are similar (similar relationship). Therefore, the center points of the odd projection areas PA2001, PA2003, and PA2005 are located on the plane Lo, and the center points of the even projection areas PA2002, PA2004, and PA2006 are located on the plane Le.

Further, in the figure on the right side of FIG. 35, the substrate P is transferred at a constant speed in the circumferential direction (Xs direction) along the outer circumferential surface of the rotating reel 2030, but the area A2007 indicated by the oblique line in the figure is by six projections. The area PA2001 to PA2006 is exposed at 100% with respect to the target exposure amount (dose).

Further, for example, the target exposure amount is not reached by the partial region A2005a in which the end portion (triangle portion) in the +Y direction is exposed in the region A2005 which is exposed corresponding to the projection region PA2001 of the illumination region IR2001. However, when the substrate P is transferred in the Xs direction (circumferential direction), when the area A006 is exposed by the projection area PA2002 corresponding to the illumination area IR2002, the insufficient exposure amount is added, and as a result, the partial area A2005a is also relative to the target exposure amount. (Dose) was exposed at 100%.

In this manner, the projection image of the entire pattern area A2003 formed on the outer peripheral surface of the cylindrical mask M is repeatedly rotated on the long side of the substrate P every time the cylindrical mask M is rotated. direction.

Further, the main ray of each of the imaging light beams EL2 of the projection optical systems PL2001 to PL2006 is emitted from the respective illumination regions IR2001 to IR2006 on the cylindrical mask M through the center points of the respective illumination regions IR2001 to IR2006. The extension line D2001, D2002 is set to intersect with the central axis of rotation AX2001 of the cylindrical mask M, but it is not necessarily necessary, as long as the principal ray and the central axis of rotation pass through any point in each illumination area IR2001~IR2006 AX2001 can be crossed. Similarly, the imaging light beam EL2 of each of the projection areas PA2001 to PA2006 that is incident on the substrate P from each of the projection optical systems PL2001 to PL2006 is similarly provided, and any one of the chief rays is matched with the rotating reel 2030. The extension axis D2001, D2002 of the rotation central axis AX2002 can be used.

Next, a specific configuration of the projection optical systems PL2001 to PL2006 and the illumination optical systems IL2001 to IL2006 shown in Fig. 34 will be described with reference to Fig. 36. 36 shows a detailed configuration of the projection optical system PL2001 and the illumination optical system IL2001. However, the other projection optical systems PL2002 to PL2006 and the illumination optical systems IL2002 to IL2006 have the same configuration.

As shown in FIG. 36, the illumination light beam EL0 from the light source device 2055 (see FIG. 24) including the light guiding member 2060 and the lens system 2061 is incident on the fly-eye lens 2062 of the illumination optical system IL2001 (see FIGS. 25 and 28 to 30). . The illumination beam of the source light generated by the plurality of point light source images generated on the surface Ep on the emission side of the fly-eye lens 2062 is uniformly illuminated by the condensing lens 2065 on the surface 2014b conjugated with the reticle arranging the illumination field stop 2064. distributed. The illumination beam of the opening of the illumination field stop 2064 is transmitted through the lens system 2066 and the concave mirror 2040 of the second optical system 2015 on the upper side (first stage) of the projection optical system PL2001. The base material (quartz or the like) is formed in the window portion (2042) of the reflecting surface p2004 of the concave mirror 2040, the second optical system 2015, and further, the reflection plane 2041a on the upper side of the 稜鏡 mirror 2041 is reflected in the direction along the extension line D2001. , reaching the illumination area IR on the cylindrical mask M.

Similarly to the configuration of the previous FIG. 23, since the reflecting surface p2004 of the concave mirror 2040 is disposed on the pupil plane pd of the imaging beam of the projection optical system PL2001, the reflecting surface p2004 is disposed substantially in common with the emitting surface Ep of the fly-eye lens 2062. In the yoke, a plurality of point light source images generated on the surface Ep on the emission side of the fly-eye lens 2062 are formed in the window portion 2042 formed on the reflection surface p2004.

Further, in the specific configuration of Fig. 36, between the reflection plane 2041a on the upper side of the 稜鏡 mirror 2041 and the pattern surface p2001 of the cylindrical mask M, the focus correction optical member 2080 and the image are provided along the oblique extension line D2001. The optical member 2081 is moved. The focus correcting optical member 2080 is, for example, a stack of two wedge-shaped turns (reverse in the X direction in Fig. 36) to form a transparent parallel plate as a whole. By sliding the pair of cymbals, the thickness of the parallel flat plate can be changed to image the effective optical path length of the light beam, and the focus state of the pattern image formed on the intermediate image surface p2007 and the projection area PA2001 can be finely adjusted.

The image shift correcting optical member 2081 is composed of a transparent parallel plate glass which can be inclined in the XZ plane in Fig. 36 and a transparent parallel plate glass which can be inclined in a direction orthogonal thereto. By adjusting the respective tilt amounts of the two parallel flat glass sheets, the pattern images formed on the intermediate image plane p2007 and the projection area PA2001 can be slightly displaced in the X direction or the Y direction.

Then, the image of the reticle pattern appearing in the illumination area IR2001 is transmitted through The focus correction optical member 2080, the image shift correction optical member 2081, the reflection plane 2041a of the 稜鏡 mirror 2041, the second optical system 2015 of the upper side (first stage) of the projection optical system PL2001, and the reflection plane 2041b of the 稜鏡 mirror 2041, The image is formed on the intermediate image plane p2007, and the intermediate image plane p2007 can be disposed such that the projection area PA201 has a trapezoidal field of view pupil 2075 as shown in FIG. In this case, the opening of the illumination field stop 2064 provided in the illumination optical system IL2001 may be a rectangle (rectangular) including the trapezoidal opening of the field stop 2075.

An imaging beam that becomes an intermediate image in the opening of the field stop 2075 passes through a reflection plane 2076a, a second optical system 2077, and a pupil mirror 2076 that constitute the lower side (second stage) of the projection optical system PL2001. The reflection plane 2076b is projected onto the projection area PA2001 wound on the substrate P of the outer peripheral surface p2002 of the rotating reel 2030. The reflecting surface of the concave mirror 2078 included in the second optical system 2077 is disposed on the pupil plane pd, and the reflection plane 2076b on the lower side of the pupil mirror 2076 is set at an angle of 45° with respect to the XY plane to make the chief ray of the imaging beam. It travels along an extension line D2001 inclined with respect to the center plane pc.

Next, in the specific configuration of Fig. 36, a magnification correcting optical member 2083 is provided between the reflecting plane 2076b on the lower side of the 稜鏡 mirror 2076 and the projection area PA2001 wound on the substrate P of the rotating reel 2030, which will be a concave lens. Three pieces of the convex lens and the concave lens are coaxially arranged at a predetermined interval, and the front and rear concave lenses are fixed, and the convex lens between them is moved in the optical axis (principal light) direction. Thereby, the pattern image formed in the projection area PA2001 can be expanded or reduced by a small amount while maintaining the imaging state of the telecentric.

In addition, although not shown in FIG. 36, it is also provided to enable the 稜鏡 mirror 2041. Or one of the 稜鏡 mirrors 2076 is slightly rotated about a rotation correcting mechanism that rotates about an axis parallel to the Z axis. This rotation correcting mechanism, for example, causes each of the plurality of projection areas PA2001 to PA2006 (and the projected reticle pattern image) shown in FIG. 35 to slightly rotate in the XY plane.

As described above, in the seventeenth embodiment, as shown in FIGS. 34 and 36, each of the six sets of projection optical systems PL2001 to PL2006 can have a chief ray that intersects with the central axis of rotation AX2001 of the cylindrical mask M. The illumination light is obliquely illuminated by the illumination areas IR2001 to IR2006 on the outer peripheral surface (pattern surface) of the cylindrical mask M.

Further, the imaging light beam is deflected, and the principal ray traveling from the respective illumination regions IR2001 to IR2006 to the normal direction of the pattern surface p2001 of the cylindrical mask M is also incident on the substrate P along the outer peripheral surface p2002 from the normal direction. Projection area PA2001~PA2006. Therefore, it is possible to reduce the defocus of the projection image and suppress the occurrence of processing failure such as exposure failure, and as a result, it is possible to suppress the occurrence of defective components.

Further, each of the projection optical systems PL2001 to PL2006 is configured such that the principal ray of the imaging beam is inclined with respect to the center plane pc between the peripheral surface of the cylindrical mask M and the pupil mirror 2041 (reflection plane 2041a). Therefore, the conditions in which the projections of the respective projection optical systems PL2001 to PL2006 interfere with each other (collision) are alleviated.

Further, the reflection plane 2076b on the lower side of the 稜鏡 mirror 2041 and the reflection plane 2076a on the upper side of the 稜鏡 mirror 2076 are set at an angle of 45° with respect to the XY plane to form an image of the intermediate image plane p2007 of each of the projection optical systems PL2001 to PL2006. The chief ray of the beam is parallel to the center plane pc.

[Modification of the seventeenth embodiment]

In the exposure apparatus including the multi-lens projection optical system shown in FIGS. 34 to 36, the image of the cylindrical mask pattern is projected and exposed to the surface of the substrate P supported by the cylindrical surface. However, the mask M or the substrate P may be formed to support either one of the planes or may be supported by the two planes. For example, the detachable substrate P is wound around the rotating reel 2030 to be supported in a cylindrical shape as shown in FIG. 34, and the reticle M is formed in a parallel plane glass (quartz) and linearly moved in the X direction as is conventionally known. The exposure mode, or conversely, the reticle M can be supported by the rotating reel 2020 as shown in FIG. 34, and the substrate P can be supported by a flat plane stage or an air cushion type holder and linearly transferred in the X direction scanning exposure mode. It is either of the above two methods.

Further, the projection optical system and the illumination optical system of the previous embodiments can be applied regardless of whether the support form of the mask M or the substrate P is a cylindrical surface or a planar shape, but it is supported as a plane parallel to the XY plane. On the side of the shape, the angle of inclination of the reflection plane 2041a on the upper side of the 稜鏡 mirror 2041 or the reflection plane 2076b on the lower side of the 稜鏡 mirror 2076 may be 45°. In other words, as long as the normal line passing through the center of the illumination area IR (object surface) on the mask M or the normal line passing through the center of the projection area PA (image plane) on the substrate P is used, the chief ray of the object side of the projection optical system is matched. Or the main light on the image side can be tilted in the XZ plane.

[18th embodiment]

Fig. 37 is a view showing the configuration of a projection optical system PL (in the case of a multi-lens method, PL2001) of the eighteenth embodiment. The projection optical system PL (PL2001) of the present embodiment is an imaging light beam EL2 (the chief ray is set to EL6) from the mask pattern in the illumination region IR (IR2001) of the outer peripheral surface of the cylindrical mask M. The second optical system 2015 (a half-field type catadioptric imaging system) having a concave mirror 2040 having a reflecting surface p2004 disposed on the side surface is reflected by the reflecting surface 2100a of the plane mirror 2100, and is formed on the reflecting surface 2101a of the plane mirror 2101. The reflection forms an equal-magnitude intermediate image of the reticle pattern appearing in the illumination region IR (IR2001) at the intermediate image plane Im.

Further, an intermediate image formed on the intermediate image plane Im is projected by being projected on the outer peripheral surface p2002 parallel to the XY plane by an enlarged imaging system 2102 having a magnification of, for example, twice or more (having an optical axis 2102a parallel to the Z axis) Projection area PA on the substrate P (PA2001). The substrate P is supported by a fluid bearing layer on a planar holder HH having a pad for a fluid bearing having a flat surface. Similarly, in the present embodiment, a plurality of point light source images generated by the illumination light from the backlight illumination system IL (IL2001) are formed on the reflection surface p2004 of the concave mirror 2040 constituting the projection optical system PL (PL2001). Sf transmits window portion 2042.

When the enlarged projection optical system of FIG. 37 is multi-lensed, when the reticle pattern having a large size in the Y direction is exposed, the projection optical system PL (PL1) including the illumination optical system IL (IL2001) and the planar mirrors 2100 and 2101 is included. The group is arranged symmetrically with respect to the center plane pc in the XZ plane as shown in the previous FIGS. 34 and 35, and is arranged to be projected in the Y direction at the end (triangle portion) in the Y direction of the projection area PA (PA2001). Like a part of the overlap.

In the present embodiment, when the center plane pc is a plane including the rotation center axis AX2001 of the cylindrical mask M and perpendicular to the XY plane (outer peripheral surface p2002), the illumination of the odd projection optical system PL2001, PL2003... The center point of the region IR2001, IR2003... (for example, the point where the chief ray EL6 passes), due to the mask Since the main light ray EL6 on the side is inclined with respect to the center plane pc, the distance DMx is separated from the circumference from the intersection of the outer peripheral surface of the cylindrical mask M and the center plane pc. Therefore, the center points of the illumination areas IR2002, IR2004, ... of the even projection optical systems PL2002, PL2004... are also separated from the circumference from the intersection of the outer peripheral surface of the cylindrical mask M and the center plane pc Distance DMx. Therefore, the odd-numbered illumination regions IR2001... and the even-numbered illumination regions IR2002 are separated by a circumferential distance (2DMx) in the circumferential direction of the cylindrical mask M.

On the other hand, since the center points of the projection areas PA2001, PA2003, ... of the odd projection optical system PL2001, PL2003, ... (for example, the point at which the chief ray EL6 passes) are separated from the center plane pc to the X direction on the substrate P. The distance DFx is such that the odd projection area PA2001... and the even projection area PA2002... are separated by a distance (2DFx) in the X direction on the substrate P. Therefore, when the reticle patterns of the respective illumination regions IR2001, IR2002, ... formed on the cylindrical mask M are uniformly formed in the circumferential direction, if the projection optical systems PL2001, PL2002, ... are enlarged When the magnification is set to Mp, it is set to satisfy the relationship of MP‧(2DMx)=2DFx. If it is impossible to form the above conditions due to a problem in the mechanism, the illuminating pattern of the odd-numbered illumination regions IR2001, IR2003, and the even-numbered illumination region IR2002 formed on the cylindrical mask M, The reticle pattern used in IR2004... is relatively staggered in the circumferential direction.

[19th embodiment]

Fig. 38 is a view showing the configuration of a projection optical system PL of the nineteenth embodiment. The projection optical system PL of the present embodiment is composed of a lens system 2103, a lens system 2104, a concave mirror (reflecting optical member) 2040 disposed on a facet, deflection mirrors 2106 and 2107, and a lens system 2108.

In the present embodiment, the imaging light beam EL2 from the illumination region IR on the outer circumferential surface of the cylindrical mask M is incident on the optical axis 2103a of the lens system 2103, and is incident on the lens system 2103 through one half field of the -X side. The lens system 2104 is incident (the optical axis 2104a is coaxial with the optical axis 2103a). The imaging beam EL2 of the lens system 2103 is reflected by the reflecting surface p2004 of the concave mirror 2040 (the optical axis of which is 2104a), and is reflected by the reflecting surface p2106a of the deflecting mirror 2106 in the -X direction, and is guided to the lens system 2103, 2104 and the concave mirror 2040. After the formed optical path is outside, it is reflected toward the -Z direction by the reflecting surface 2107a of the deflecting mirror 2107.

The imaging beam EL2 reflected by the deflecting mirror 2107 is irradiated to the projection area PA through the lens system 2108. The projection optical system PL images the image of the reticle pattern appearing in the illumination region IR on the reticle M by the above optical path, and the projection region on the substrate P which is planarly supported by the same configuration as that of FIG. Within the PA. The projection optical system of the present embodiment is designed not to form an intermediate image surface, in particular, in order to realize enlargement projection by a small system. Further, the extension line D2001 of the chief ray EL6 on the cylindrical mask M side of the projection optical system PL is set to intersect the rotation central axis AX2001 of the cylindrical mask M, and the chief ray EL6 on the substrate P side is set. It is perpendicular to the surface of the substrate P supported by the plane.

In Fig. 38, the imaging beam EL2 from the illumination region IR can be designed to pass the -X side of the optical axis 2108a (parallel to the Z axis and perpendicular to the substrate P) of the lens system 2108 imparting the main magnification. Therefore, the portion from the optical axis 2108a of the lens system 2108 from the +X side is cut off and is not useful for the projection of the reticle pattern. Thereby, the size of the X direction of the projection optical system PL (the scanning direction of the substrate P) can be reduced.

This embodiment is also the same as the previous FIG. 21, FIG. 23, FIG. 31, FIG. 32A, 32B, 37, in the same manner, the illumination optical system IL and the light source device 2055 are disposed on the back side of the concave mirror 2040, and a plurality of point light source images Sf are generated in the window portion (2042) formed on the reflection surface p2004 (disposed on the kneading surface) of the concave mirror 2040. . The distribution on the reflecting surface p2004 of the point source image and the shape or arrangement of the window portion in the reflecting surface p2004 are set as shown in Figs. 27 to 30 or 33A to 33C in accordance with the conditions described in Fig. 22 previously.

In each of the above-described embodiments and modifications (FIGS. 12, 21, and 34 to 38), the cylindrical mask M is assumed to be formed directly on the metal or ceramic, and the pattern formed by the reflecting portion and the non-reflecting portion is directly formed. a surface of a cylindrical base material such as glass, but may be formed as a reflective sheet-like reflective mask formed by a reflective film on one side of a short strip-shaped ultra-thin glass plate (for example, a thickness of 100 to 500 μm) having a good flatness. It is bent and wound along the outer peripheral surface of the metallic rotating reel 2020.

The sheet-shaped reflective mask can also be attached to the outer peripheral surface of the rotating reel 2020 for a long time, or can be fixed to be released (exchangeable). Such a sheet-shaped reflective mask includes, for example, a film having a material having a high reflectance for the illumination light beam EL1 such as aluminum, or a dielectric multilayer film. In this case, the rotating reel 2020 may be provided with a light shielding layer (film) that absorbs the illumination light beam EL1 passing through the transparent portion of the sheet-shaped reflective mask, and the light shielding layer also suppresses generation of stray light.

Further, the cylindrical mask M may cover a pattern in which only one element (one display element) is formed over the entire circumference, or a plurality of patterns corresponding to one element (one display element) may be formed. Further, the element pattern on the cylindrical mask M may be arranged in the circumferential direction of the outer peripheral surface, or may be arranged in a plurality of directions parallel to the central axis of rotation AX2001. Further, a pattern for manufacturing the first element and a first element for manufacturing the first element may be provided in the cylindrical mask M. A pattern of different second components.

[Component manufacturing method]

Next, a method of manufacturing a component will be described. Fig. 39 is a flow chart showing the method of manufacturing the device of the embodiment.

In the device manufacturing method shown in FIG. 39, for example, a component function and a performance design of a display panel such as an organic EL such as a self-luminous element are designed, and a necessary circuit pattern or wiring pattern is designed by CAD or the like (step 201). Next, a mask M (cylindrical or planar) of each layer portion necessary for each layer is formed according to the design of elements such as patterns of various layers designed by CAD or the like (step 202). Further, a substrate such as a transparent film or sheet which is a component substrate, or an extremely thin metal foil, or a flexible substrate (resin film, metal foil film, or plastic) which is a substrate of a display element is prepared by purchasing or manufacturing. A reel of (etc.).

Further, in the reel-shaped substrate prepared in step 203, it is also possible to modify the surface of the substrate in advance, and to form a base layer (for example, minute irregularities formed by imprinting) in advance, and to preliminarily laminate a light-sensitive function. Film or transparent film (insulating material).

Then, the prepared substrate is placed in a reel type or batch type manufacturing line, and an electrode or a wiring constituting a display panel element or the like, an insulating film, a TFT such as a semiconductor film (thin film semiconductor), or the like is formed on the substrate. In the bottom layer, a light-emitting layer of a self-luminous element such as an organic EL which is a display pixel portion is formed so as to be laminated on the bottom layer (step 204). In step 204, the step of forming a resist pattern on the film on the substrate is typically performed, and the film is etched using the resist pattern as a mask. The formation of the resist pattern is a step of uniformly forming a resist film on the surface of the substrate, according to the above embodiments. The step of exposing the resist film of the substrate by the exposure light patterned by the mask M, and the step of forming the latent image of the mask pattern by the exposure.

In the case where a flexible element such as a printing technique is used in combination, a step of forming a functional photosensitive layer (photosensitive decane coupling material) by coating on a surface of a substrate, and passing through the mask M according to each embodiment described above An exposure step in which the patterned exposure light is irradiated onto the functional photosensitive layer and the functional photosensitive layer forms a hydrophilic portion and a water-repellent portion to form a pattern, and the hydrophilicity of the functional photosensitive layer is high. A step of partially coating a plating base liquid or the like and depositing a metallic pattern by electroless plating.

Moreover, in the step 204, the conventional lithography step of exposing the photoresist layer using the exposure apparatus described in the previous embodiments is also included, but the pattern exposure of the photo-sensitive catalyst layer is also included. The electrolytic plating method is a wet step of forming a pattern (wiring, electrode, or the like) of a metal film, or a printing step of drawing a pattern with a conductive ink containing silver nanoparticles or the like.

Next, depending on the manufactured component, each substrate, such as a protective film, which is manufactured by cutting or cutting the substrate, or other substrates manufactured in other steps, is performed on each of the display elements continuously formed on the long substrate, for example, in a reel manner. The environmental shielding layer), the sheet-like color filter having a sealing function, or a thin glass substrate or the like is attached to the surface of each display panel element or the like to assemble the component (step 205). Next, a post-processing (step) of whether or not the display panel element functions normally, or whether the desired performance or characteristics is satisfied, etc. (step 206) is performed. In the above manner, an element such as a display panel (flexible display) can be manufactured.

Further, the technical scope of the present invention is not limited to the above embodiment or variation. The shape. For example, one or more of the constituent elements described in the above embodiment or modification may be omitted. Further, the constituent elements described in the above embodiment or modification may be combined as appropriate.

1001‧‧‧Component Manufacturing System

1009‧‧‧Transporting device

1011‧‧‧Substrate processing device

1021‧‧‧1st reel member

1022‧‧‧2nd reel member

1050‧‧‧1st deflecting member

1057‧‧‧2nd deflecting member

1078‧‧‧Photomask stage

1120‧‧‧3rd deflecting member

1121‧‧‧4th deflecting member

1132‧‧‧7th deflecting member

1133‧‧‧8th deflecting member

1136‧‧‧9th deflecting member

1137‧‧‧10th deflecting member

1140‧‧‧11th deflecting member

1143‧‧‧12th deflecting member

1151‧‧‧13th deflecting member

1152‧‧‧14th deflecting member

AX1001‧‧‧1st central axis

AX1002‧‧‧2nd central axis

D1001‧‧‧1st direction

D1002‧‧‧2nd direction

D1003‧‧‧1st normal direction

D1004‧‧‧2nd normal direction

DFx‧‧‧ distance

DMx‧‧‧Week

IR‧‧‧Lighting area

M‧‧‧Photo Mask

P‧‧‧Substrate

PA‧‧‧Projection area

PL‧‧‧Projection Optics

PL1001~PL1006‧‧‧Projection Module

P1001‧‧‧ first side

P1002‧‧‧2nd side

P1003‧‧‧ center face

P1007‧‧‧ intermediate image

2001‧‧‧Component Manufacturing System

2005‧‧‧Upper control device

2013‧‧‧Control device

2014‧‧‧1st Optical Department

2015‧‧‧2nd Optical Department

2020‧‧‧Rotating reel

2030‧‧‧Rotating reel

2040‧‧‧ concave mirror

2094‧‧‧ rod lens

U3‧‧‧Processing device (substrate processing device, exposure device)

Fig. 1 is a view showing the configuration of a component manufacturing system of the first embodiment.

Fig. 2 is a view showing the overall configuration of a substrate processing apparatus (exposure apparatus) according to the first embodiment.

Fig. 3 is a view showing the configuration of a mask holding device of the exposure apparatus shown in Fig. 2.

Fig. 4 is a view showing the configuration of a first reel member and an illumination optical system of the exposure apparatus shown in Fig. 2;

Fig. 5 is a view showing the arrangement of an illumination area and a projection area of the exposure apparatus shown in Fig. 2.

Fig. 6 is a view showing the configuration of a projection optical system which is applied to the exposure apparatus shown in Fig. 2.

Fig. 7 is a view showing the overall configuration of an exposure apparatus according to a second embodiment.

Fig. 8 is a view showing the overall configuration of an exposure apparatus according to a third embodiment.

Fig. 9 is a view for explaining the positional relationship condition of the projection area of the illumination area of the exposure apparatus shown in Fig. 8.

Fig. 10 is a graph showing the conditions described with reference to Fig. 9 as a function of the radius of the cylindrical mask.

Fig. 11 is a view showing the overall configuration of an exposure apparatus according to a fourth embodiment.

Figure 12 is a view showing the oblique illumination mode of the exposure apparatus of the fifth embodiment; The map of the composition.

Fig. 13 is a view showing the configuration of a projection optical system according to a sixth embodiment.

Fig. 14 is a view showing a configuration of a case where the projection optical system shown in Fig. 13 is pluralized.

Fig. 15 is a view showing the complex projection optical system shown in Fig. 14 viewed from other directions.

Fig. 16 is a view showing the configuration of a projection optical system according to a seventh embodiment.

Fig. 17 is a view showing the configuration of a projection optical system according to the eighth embodiment.

Fig. 18 is a view showing the configuration of a projection optical system according to a ninth embodiment.

Fig. 19 is a view showing the configuration of a projection optical system according to a tenth embodiment.

Fig. 20 is a view showing the configuration of a component manufacturing system of the eleventh embodiment.

Fig. 21 is a view showing the configuration of a substrate processing apparatus (exposure apparatus) according to the eleventh embodiment.

Fig. 22 is a view showing the configuration of an optical member of the eleventh embodiment.

Figure 23 is a schematic diagram showing the optical path from the illumination area to the projection area.

Fig. 24 is a view showing a configuration example of a light source device according to the eleventh embodiment.

Fig. 25 is a view showing a configuration example of a fly-eye lens array according to the eleventh embodiment.

Fig. 26 is a view showing an example of the configuration of an aperture in the illumination optical system of the eleventh embodiment.

Fig. 27 is a view showing an example of the configuration of an optical member according to the eleventh embodiment.

Fig. 28 is a view showing a configuration example of a fly-eye lens array according to a twelfth embodiment.

Fig. 29 is a view showing a configuration example of a fly-eye lens array according to a thirteenth embodiment.

Fig. 30 is a view showing a configuration example of a fly-eye lens array of a fourteenth embodiment.

Fig. 31 is a view showing a configuration example of a light source image forming portion in the fifteenth embodiment.

Fig. 32A is a view showing a configuration example of an illumination optical system of a sixteenth embodiment.

Fig. 32B is a view showing a configuration example of the illumination optical system of the sixteenth embodiment.

Fig. 33A is a view showing each part of the illumination optical system of the sixteenth embodiment.

Fig. 33B is a view showing each part of the illumination optical system of the sixteenth embodiment.

Fig. 33C is a view showing each part of the illumination optical system of the sixteenth embodiment.

Fig. 34 is a view showing the configuration of a substrate processing apparatus (exposure apparatus) according to a seventeenth embodiment.

Fig. 35 is a view showing the arrangement of an illumination area and a projection area in the seventeenth embodiment.

Fig. 36 is a view showing an example of the configuration of an exposure apparatus according to a seventeenth embodiment.

Fig. 37 is a view showing a configuration example of a projection optical system of the eighteenth embodiment.

Fig. 38 is a view showing a configuration example of a projection optical system according to a nineteenth embodiment.

Fig. 39 is a flow chart showing the method of manufacturing the device of the embodiment.

1008‧‧‧Transport roller

1009‧‧‧Transporting device

1011‧‧‧Substrate processing device

1012‧‧‧Photomask holder

1013‧‧‧Lighting device

1014‧‧‧Control device

1021‧‧‧1st reel member

1022‧‧‧2nd reel member

1023‧‧‧Guide roller

1024‧‧‧ drive roller

1025‧‧‧1st detector

1026‧‧‧1st drive department

1030‧‧‧1st transport roller

1031‧‧‧1st guiding member

1033‧‧‧2nd guiding member

1034‧‧‧2nd transport roller

1035‧‧‧2nd detector

1036‧‧‧2nd drive department

EL1‧‧‧ illumination beam

EL2‧‧‧ imaging beam

EX‧‧‧Exposure device

IL‧‧‧Lighting Optics

IR‧‧‧Lighting area

M‧‧‧Photo Mask

PA (PA1001~PA1006)‧‧‧Projection area

PL‧‧‧Projection Optics

PL1001~PL1006‧‧‧Projection Module

Claims (17)

A substrate processing apparatus that rotates a cylindrical mask having a cylindrical pattern surface with a constant radius from a first center line around the first center line to form a flexible long sheet substrate Moving along the strip direction to expose a pattern formed on the pattern surface of the cylindrical mask to the sheet substrate, comprising: a rotating reel having a second center line parallel to the first center line The cylindrical substrate is formed into a cylindrical shape with a constant radius, and one of the sheet-like substrates is partially supported in a cylindrical shape, and the sheet-like substrate is transported in the longitudinal direction while rotating around the second center line; the first projection optics And disposed on a side including a center plane of the first center line and the second center line, and is incident on the pattern surface of the cylindrical mask by a predetermined angle inclined by 90° from the center plane The first image beam generated in the first illumination region is projected on the sheet substrate supported by the rotating reel by projecting the first image beam onto a predetermined angle inclined by 90° from the center plane. First projection area And the second projection optical system is disposed on the other side of the center surface, and is incident on the second illumination region set on the pattern surface of the cylindrical mask by a predetermined angle inclined by 90° from the center plane. a second image beam that is generated, and the second image beam is projected on a second projection area that is disposed on the sheet substrate supported by the rotating reel at a predetermined angle that is less than 90° from the center plane; The first projection optical system and the second projection optical system respectively have The first deflecting member is provided in the first image beam that is generated from the first illumination region toward the radial direction of the cylindrical mask, and is generated from the second illumination region toward the radial direction of the cylindrical mask. The second image beam is incident at an acute angle to the center plane; and the second deflecting member is provided to the first image beam projected onto the first projection region and the second image beam pair projected on the second projection region The center surface is ejected at an acute angle toward the radial direction of the rotating drum. The substrate processing apparatus according to claim 1, wherein each of the first deflecting member and the second deflecting member is disposed along the first illumination region along the pattern surface of the cylindrical mask and the first a ratio of a circumferential distance of the illumination region to a circumferential distance between the first projection region and the second projection region along the outer circumferential surface of the rotating reel; the first projection region and the second projection region Projection magnification. The substrate processing apparatus according to claim 1 or 2, wherein the first projection optical system and the second projection optical system are arranged to be partially overlapped in a direction of the first center line or the second center line And being symmetrical with respect to the center surface when viewed from the direction of the first center line or the second center line. The substrate processing apparatus according to claim 3, wherein the first deflecting member includes a first reflecting surface provided on the first projection optical system to reflect the first image beam, and a second projection optical And reflecting the second reflection surface of the second image beam, wherein the first reflection surface and the second reflection surface are arranged symmetrically with respect to the center surface, and the second deflection member is provided in the first projection optical system Reflecting the aforementioned a third reflecting surface of the first image beam and a fourth reflecting surface provided on the second projection optical system and reflecting the second image beam, wherein the third reflecting surface and the fourth reflecting surface are disposed obliquely with respect to the center surface symmetry. The substrate processing apparatus according to claim 4, further comprising: disposed between each of the first reflecting surface and the second reflecting surface and the cylindrical mask, and illuminating the first illumination region with illumination light a first beam splitter that faces the first image beam from the first illumination region toward the first reflection surface, and a second beam that emits illumination light from the second illumination region to generate the second illumination region The second beam splitter like the light beam facing the second reflecting surface. The substrate processing apparatus according to claim 5, wherein the illumination light has a polarization characteristic, and the first beam splitter includes a wavefront divider that reflects the illumination light and transmits the first image beam, and the second The beam splitter has a wavefront divider that reflects the illumination light and transmits the second image beam. The substrate processing apparatus according to claim 4, wherein the first reflection is set when a radius of a pattern surface of the cylindrical mask is different from a radius of a surface of the sheet substrate supported by the rotating drum The angle between the surface and each of the second reflecting surfaces or the arrangement of the first reflecting surface and the second reflecting surface in a direction perpendicular to the center plane. The substrate processing apparatus according to claim 4, wherein the first projection optical system and the second projection optical system each include a first imaging optical system that forms an intermediate image of the pattern of the cylindrical mask, and The second imaging optical system of the intermediate image is again imaged on the sheet substrate. The substrate processing apparatus according to claim 8, wherein the first imaging optical system includes illumination light for emitting illumination to the first illumination region or the second illumination region on the cylindrical mask. An optical member that is projected through the first reflecting surface or the second reflecting surface in an optical path between the surface on which the intermediate image is formed and the pattern surface of the cylindrical mask. The substrate processing apparatus according to claim 9, wherein the first imaging optical system of the first projection optical system has an optical path disposed between a surface on which the intermediate image is formed and a pattern surface of the cylindrical mask a mirror on the back surface, and the first image beam reflected on the first reflecting surface and incident on the mirror, and the first image beam reflected by the mirror is again incident to form the foregoing a lens group of the intermediate image; and the first imaging optical system of the second projection optical system: a mirror disposed on a surface of the optical path between the surface on which the intermediate image is formed and the pattern surface of the cylindrical mask, And a lens group that is incident on the second image beam reflected on the second reflecting surface and that is incident on the mirror and that reproduces the second image beam reflected by the mirror to form the intermediate image. The substrate processing apparatus according to claim 10, wherein the optical member for performing the epi-illumination is formed in a light transmitting portion constituting one of the mirrors of the first imaging optical system. The substrate processing apparatus according to the first aspect of the invention, wherein the first projection optical system and the second projection optical system each include: a first imaging optical system having a first optical axis perpendicular to the center plane; The first image beam or the second image beam that is deflected by the first deflecting member is incident to form an intermediate image of the pattern; and the second imaging optical system has a second optical axis that is perpendicular to the center plane. The first image beam or the second image beam that is the intermediate image is incident on the second deflecting member, and the intermediate image is again imaged on each of the first projection region and the second projection region. The substrate processing apparatus of claim 12, wherein a principal ray of the first image beam from the first illumination region and the first surface are in a plane perpendicular to the first center line and the second center line An angle between the optical axis and an angle between the chief ray of the second image beam from the second illumination region and the first optical axis is set to an obtuse angle greater than 90°; and the first image is incident on the first projection region The angle between the chief ray of the light beam and the second optical axis, and the angle between the chief ray of the second image beam that is incident on the second projection region and the second optical axis are set to an obtuse angle of more than 90°. The substrate processing apparatus according to claim 13, wherein the first projection optical system and the second projection optical system each have a magnification of magnification, and each of the first deflecting member and the second deflecting member is disposed. a circumferential distance between the first illumination region and the second illumination region along the pattern surface of the cylindrical mask, and the first surface on the sheet substrate along the outer circumferential surface of the rotating reel 1 The circumferential distance between the projection area and the second projection area is equal. The substrate processing apparatus of claim 14, wherein The cylindrical reticle is a reflective reticle, and includes a polarization beam splitter, and each of the first illumination region and the second illumination region disposed on a pattern surface of the cylindrical reticle and the first deflecting member Injecting the linearly polarized illumination light into the first illumination region and the second illumination region, and reflecting the first image beam reflected by each of the first illumination region and the second illumination region The second image beam is transmitted separately. The substrate processing apparatus according to any one of claims 12 to 15, wherein the outer peripheral surface radius of the rotating reel is the same as the first surface of the cylindrical mask, and the first state is set Any one of the second states in which the surface radius of the sheet-like substrate supported by the outer circumferential surface of the rotating drum is the same as the radius of the pattern surface of the cylindrical reticle. In a method of manufacturing a device, a sheet-shaped substrate is conveyed in a longitudinal direction by a plurality of flexible sheet-like substrates processed by a plurality of processing apparatuses to form an electronic component on the sheet substrate. The substrate processing apparatus according to any one of claims 1 to 16 is used as one of the plurality of processing apparatuses, and the step of exposing the pattern of the electronic component to the sheet substrate on which the photosensitive layer is formed; The step of wet processing the sheet substrate exposed by the substrate processing apparatus.