JP2019113867A - Cylindrical mask exposure device - Google Patents

Abstract

To enable precisely exposing large mask patterns even when one or both of a mask and a substrate is arranged in a cylindrical surface shape.SOLUTION: A device has a rotation drum rotating around a second center line and sending a sheet substrate in a long size direction, a first projection optical system injecting a first image light flux generated from a first lighting area set on a cylindrical surface of a cylindrical mask and projecting the first image light flux to a diameter direction of the rotation drum toward a first projection area, a second projection optical system injecting a second image light flux generated in the diameter direction of the cylindrical mask from a second lighting area set on an outer periphery surface of the cylindrical mask and projecting a second image light flux to the diameter direction of the rotation drum toward a second projection area, a first lighting system including a first beam splitter penetrating the first image light flux from the first lighting area toward the first projection optical system and a second lighting system including a second beam splitter penetrating the second image light flux from the second lighting area toward the second projection optical system.SELECTED DRAWING: Figure 2

Description

The present invention relates to a cylindrical mask exposure apparatus.
Priority is claimed on Japanese Patent Application No. 2011-278290, filed Dec. 20, 2011, and Japanese Patent Application No. 2012-024058, filed Feb. 7, 2012, the contents of which are incorporated herein by reference. I will use it.

  A substrate processing apparatus such as an exposure apparatus is used to manufacture various devices as described in, for example, Patent Document 1 below. The substrate processing apparatus can project the image of the pattern formed on the mask M arranged in the illumination area onto the substrate etc. arranged in the projection area. The mask M used in the substrate processing apparatus may be planar or cylindrical.

  Further, as one of methods for manufacturing a device, a roll-to-roll method as described in, for example, Patent Document 2 below is known. The roll-to-roll method is a method of performing various types of processing on a substrate on a transport path while transporting a substrate such as a film from a delivery roll to a recovery roll. The substrate may be treated in a substantially planar manner, for example, between transport rollers. In addition, the substrate may be processed in a curved state, for example, on the surface of a roller.

Unexamined-Japanese-Patent No. 2007-299918 International Publication 2008/129819

  The substrate processing apparatus (exposure apparatus) as described above forms an image of a projection optical system used for exposure when, for example, one or both of the illumination area on the mask and the projection area on the substrate are curved at a predetermined curvature. Due to performance considerations, limitations arise in particular in the setting of the chief ray of the imaging light bundle. For example, the mask pattern formed on the outer peripheral cylindrical surface of a cylindrical rotary mask of radius R is projected onto the surface of a substrate (film, sheet, web, etc.) wound around a cylindrical rotary drum (roller) of radius R by a projection optical system. Let's assume the case of image formation and projection. In this case, generally, the principal ray of the imaging light flux from the mask pattern (cylindrical surface) to the surface of the substrate (cylindrical surface) is the rotation center axis of the cylindrical rotation mask and the rotation center axis of the cylindrical rotation drum. And a projection optical system that forms an optical path connecting the two linearly.

  However, in the case where the dimension of the mask pattern is large in the rotational axis direction of the cylindrical rotary mask, it may be necessary to provide a plurality of such projection optical systems in the direction of the rotational axis. In such a case, even if a plurality of projection optical systems are densely arranged in a line in the direction of the rotation axis, the projection fields (projection areas) of the respective projection optical systems correspond to the thickness of a metal object such as a lens barrel. Only, they are always separated, and it is no longer possible to faithfully expose large mask patterns.

  Further, in the substrate processing apparatus as described above, for example, when the configuration of the apparatus is complicated, the cost of the apparatus may be increased, and the size of the apparatus may be increased. As a result, the cost of manufacturing the device can be high.

  For example, when precise patterning needs to be performed, as a substrate processing apparatus, a mask on which a pattern of an electronic device or a display device is drawn is illuminated, and light from the pattern of the mask is formed as a photosensitive layer (photoresist etc.) An exposure apparatus is used which performs projection exposure on the substrate. Even when a mask pattern is repeatedly exposed on a flexible long substrate (film, sheet, web, etc.) continuously transported by a roll-to-roll method, the transport direction of the long substrate is the scanning direction It is expected that productivity can be dramatically improved by using a scanning exposure apparatus in which the mask is a cylindrical rotary mask.

  In such a rotating mask, a transmission method in which a pattern is formed by a light shielding layer on the outer peripheral surface of a transparent cylindrical body such as glass, and a reflecting portion and an absorbing portion on the outer peripheral surface of a metallic cylindrical body (may be a cylindrical body) And a reflection method in which a pattern is formed. In the transmission type cylindrical mask, it is necessary to incorporate an illumination optical system (optical member such as a mirror, a lens, etc.) for irradiating illumination light directed to the pattern of the outer peripheral surface inside the cylindrical mask. It is difficult to pass the rotation axis to the center, and the holding structure of the cylindrical mask and the configuration of the rotary drive system may be complicated.

  On the other hand, in the case of a reflection-type cylindrical mask, a metal cylindrical body (or a cylindrical body) can be used, so that although the mask can be inexpensively manufactured, illumination for irradiating the illumination light for exposure to the outer peripheral space of the cylindrical mask It is necessary to provide an optical system and a projection optical system for projecting the reflected light from the pattern formed on the outer peripheral surface toward the substrate, and the configuration of the exposure apparatus side to satisfy required resolution and transfer fidelity etc. Can be complicated.

  An aspect of the present invention is to make it possible to faithfully expose a large mask pattern even if one or both of a mask or a substrate (a flexible substrate such as a film, a sheet, a web, etc.) is disposed in a cylindrical shape. An object of the present invention is to provide a cylindrical mask exposure apparatus mounted with a projection optical system. Another object is to provide a cylindrical mask exposure apparatus capable of faithfully exposing a large mask pattern.

  Another object is to provide a cylindrical mask exposure apparatus which can simplify the apparatus configuration. Another object of the present invention is to provide a cylindrical mask exposure apparatus which can reduce the manufacturing cost.

  According to one aspect of the present invention, a cylindrical mask having a reflective mask pattern formed along a cylindrical surface having a predetermined radius from a first center line is rotated about the first center line, and the flexible long length is obtained. A cylindrical mask exposure apparatus for projecting and exposing the mask pattern onto the sheet substrate by moving the sheet substrate in the longitudinal direction along the longitudinal direction, the second center being set substantially parallel to the first center line A part of the sheet substrate is cylindrically supported by a cylindrical outer peripheral surface having a predetermined radius from a line, and the rotary drum is rotated about the second center line to feed the sheet substrate in the longitudinal direction; A first illumination disposed on one side of a central surface including a first central line and the second central line, and inclined at a predetermined angle less than 90 ° from the central surface and set on a cylindrical surface of the cylindrical mask First image generated from the region in the radial direction of the cylindrical mask The bundle is incident, and the first image light beam is rotated toward the first projection area set to be inclined by a predetermined angle less than 90 ° from the central plane on the sheet substrate supported by the rotating drum. A first projection optical system for projecting in a radial direction of the drum, and a second projection optical system disposed on the other side of the central surface and inclined on the outer peripheral surface of the cylindrical mask by a predetermined angle less than 90 ° from the central surface The second image light beam generated in the radial direction of the cylindrical mask from the two illumination areas is incident, and is set to be inclined by a predetermined angle less than 90 ° from the central plane on the sheet substrate supported by the rotating drum A second projection optical system for projecting the second image light beam in the radial direction of the rotary drum toward the second projection region, and a cylindrical light mask and the cylindrical light beam for illuminating the first illumination region. When it is reflected between the first projection optical system And a first illumination system including a first beam splitter for transmitting the first image light flux from the first illumination area toward the first projection optical system, and epi-illuminating the second illumination area. A second illumination beam from the second illumination area toward the second projection optical system, while reflecting an illumination beam for the second projection optical system between the cylindrical mask and the second projection optical system; And a second illumination system including a beam splitter of

  According to the aspect of the present invention, even when one or both of the mask and the substrate have a cylindrical surface shape, a large mask pattern can be faithfully exposed by a cylindrical mask exposure apparatus provided with a compact projection optical system. Also, according to the aspect of the present invention, it is possible to provide a cylindrical mask exposure apparatus capable of faithfully exposing a large mask pattern.

  Further, according to an aspect of the present invention, it is possible to provide a cylindrical mask exposure apparatus that can simplify the configuration of the apparatus. Further, according to the aspect of the present invention, it is possible to provide a cylindrical mask exposure apparatus capable of reducing the manufacturing cost.

It is a figure which shows the structure of the device manufacturing system by 1st Embodiment. It is a figure which shows the whole structure of the substrate processing apparatus (exposure apparatus) by 1st Embodiment. It is a figure which shows the structure of the mask holding | maintenance apparatus of the exposure apparatus shown in FIG. It is a figure which shows the structure of the 1st drum member of the exposure apparatus shown in FIG. 2, and an illumination optical system. It is a figure which shows arrangement | positioning of the illumination area | region and projection area | region in the exposure apparatus shown in FIG. It is a figure which shows the structure of the projection optical system applied to the exposure apparatus shown in FIG. It is a figure which shows the whole structure of the exposure apparatus by 2nd Embodiment. It is a figure which shows the whole structure of the exposure apparatus by 3rd Embodiment. It is a figure explaining the conditions of the positional relationship of the projection area | region of the illumination area | region in the exposure apparatus shown in FIG. It is a graph which shows that the conditions demonstrated in FIG. 9 change according to the radius of a cylindrical mask. It is a figure which shows the whole structure of the exposure apparatus by 4th Embodiment. It is a figure which shows the structure of the epi-illumination system of the exposure apparatus by 5th Embodiment. It is a figure which shows the structure of the projection optical system by 6th Embodiment. It is a figure which shows the structure at the time of making multi the projection optical system shown in FIG. It is the figure which looked at the multi-projected projection optical system shown in FIG. 14 from another direction. It is a figure which shows the structure of the projection optical system by 7th Embodiment. It is a figure which shows the structure of the projection optical system by 8th Embodiment. It is a figure which shows the structure of the projection optical system by 9th Embodiment. It is a figure which shows the structure of the projection optical system by 10th Embodiment. It is a figure which shows the structure of the device manufacturing system of 11th Embodiment. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) of 11th Embodiment. It is a figure which shows the structure of the optical member of 11th Embodiment. It is a schematic diagram which shows the optical path from an illumination area | region to a projection area | region. It is a figure which shows the structural example of the light source device of 11th Embodiment. It is a figure which shows the structural example of the fly eye lens array of 11th Embodiment. It is a figure which shows the structural example of the aperture_diaphragm | restriction in the illumination optical system of 11th Embodiment. It is a figure which shows the structural example of the optical member of 11th Embodiment. It is a figure which shows the structural example of the fly eye lens array of 12th Embodiment. It is a figure which shows the structural example of the fly eye lens array of 13th Embodiment. It is a figure which shows the structural example of the fly eye lens array of 14th Embodiment. It is a figure which shows the structural example of the light source image formation part of 15th Embodiment. It is a figure which shows the structural example of the illumination optical system of 16th Embodiment. It is a figure which shows the structural example of the illumination optical system of 16th Embodiment. It is a figure which shows each part of the illumination optical system of 16th Embodiment. It is a figure which shows each part of the illumination optical system of 16th Embodiment. It is a figure which shows each part of the illumination optical system of 16th Embodiment. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) of 17th Embodiment. It is a figure which shows arrangement | positioning of the illumination area | region and projection area | region of 17th Embodiment. It is a figure which shows the structural example of the exposure apparatus of 17th Embodiment. It is a figure which shows the structural example of the projection optical system of 18th Embodiment. It is a figure which shows the structural example of the projection optical system of 19th Embodiment. It is a flowchart which shows the device manufacturing method of this embodiment.

First Embodiment
FIG. 1 is a diagram showing the configuration of a device manufacturing system 1001 according to the present embodiment. The device manufacturing system 1001 shown in FIG. 1 is processed by a substrate supply apparatus 1002 for supplying a substrate P, a processing apparatus 1003 for performing predetermined processing on the substrate P supplied by the substrate supply apparatus 2, and a processing apparatus 1003. And a host control apparatus 1005 for controlling each part of the device manufacturing system 1001.

  In the present embodiment, the substrate P is a (sheet) substrate having flexibility as a so-called flexible substrate or the like. The device manufacturing system 1001 of this embodiment can manufacture a flexible device by the flexible substrate P. The substrate P is selected to have a degree of flexibility that does not break when it is bent, for example, in the device manufacturing system 1001.

  The flexibility of the substrate P at the time of device manufacture can be adjusted, for example, by the material, size, thickness and the like of the substrate P, and is adjusted by environmental conditions such as humidity and temperature at the time of device manufacture. It can also be done. Further, the substrate P may be a non-flexible substrate such as a so-called rigid substrate or the like. The substrate P may be a composite substrate in which a flexible substrate and a rigid substrate are combined.

  The flexible substrate P is, for example, a resin film, a foil made of metal or alloy such as stainless steel, or the like. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or contains two or more.

  The substrate P is set to have characteristics such as a thermal expansion coefficient so that, for example, the amount of deformation due to heat in various processing steps applied to the substrate P can be substantially ignored. As the substrate P, as an example, a substrate whose thermal expansion coefficient is not significantly large can be selected. The thermal expansion coefficient may be set smaller than the threshold according to the process temperature or the like, for example, by mixing an inorganic filler into the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass with a thickness of about 100 μm manufactured by the float method or the like, or a laminate obtained by bonding the above-mentioned resin film, foil or the like to this ultrathin glass. It may be

  In the present embodiment, the substrate P is a substrate for so-called multi-chamfering. The device manufacturing system 1001 of the present embodiment repeatedly performs various processes for manufacturing one device on the substrate P. The substrate P on which various processes have been performed is divided into devices (dicing) to become a plurality of devices. The dimensions of the substrate P are, for example, about 1 m to 2 m in the width direction (short direction), and 10 m or more in the length direction (long direction).

  The dimensions of the substrate P are appropriately set in accordance with the dimensions of the device to be manufactured. For example, in the dimension of the substrate P, the dimension in the width direction may be 1 m or less or 2 m or more, or the dimension in the longitudinal direction may be 10 m or less. Further, in the case where the substrate P is a substrate for multiple chamfers, it may be a single band-like substrate, or may be a substrate in which a plurality of substrates are joined. Also, the device manufacturing system 1001 may manufacture devices by an independent substrate for each device. In this case, the substrate P may be a substrate having a size corresponding to one device.

  The substrate supply apparatus 1002 of the present embodiment supplies the substrate P to the processing apparatus 1003 by drawing out the substrate P wound around the supply roll 1006. The substrate supply apparatus 1002 includes, for example, a shaft portion around which the substrate P is wound, and a rotational drive unit which rotates the shaft portion. In the present embodiment, the substrate P is transported in the longitudinal direction and sent to the processing apparatus 1003. That is, in the present embodiment, the transport direction of the substrate P is substantially the same as the longitudinal direction of the substrate P.

  The substrate supply device 1002 may include a cover or the like that covers the substrate P wound around the supply roll 1006. The substrate supply apparatus 1002 may also include a mechanism for sequentially feeding the substrate P in the longitudinal direction, such as a nip-type drive roller.

  The substrate recovery apparatus 1004 according to the present embodiment recovers the substrate P by winding the substrate P having passed through the processing apparatus 1003 around a recovery roll 1007. Similar to the substrate supply device 1002, the substrate recovery device 1004 includes, for example, a shaft portion around which the substrate P is wound, a rotational drive unit which rotates the shaft portion, and a cover portion covering the substrate P wound around the recovery roll 1007. including.

  The processed substrate P may be cut by a cutting device, and the substrate collection device 1004 may collect the cut substrate. In this case, the substrate recovery apparatus 1004 may be an apparatus for overlapping and recovering the substrates after cutting. The above-described cutting apparatus may be part of the processing apparatus 1003 or may be an apparatus different from the processing apparatus 1003, and may be part of the substrate recovery apparatus 1004, for example.

  The processing apparatus 1003 transports the substrate P supplied from the substrate supply apparatus 1002 to the substrate recovery apparatus 1004, and performs processing on the surface to be processed of the substrate P in the process of transport. The processing apparatus 1003 includes a processing apparatus 1010 for performing processing on the surface to be processed of the substrate P, and a transfer apparatus 1009 including a transfer roller 1008 for transferring the substrate P under conditions corresponding to the processing.

  The processing apparatus 1010 includes one or more apparatuses that execute various processes for forming elements constituting the device on the processing target surface of the substrate P. In the device manufacturing system 1001 of the present embodiment, an apparatus for executing various processes is appropriately provided along the transport path of the substrate P, and a device such as a flexible display can be produced by a so-called roll-to-roll method. According to the roll-to-roll method, devices can be produced efficiently.

  In the present embodiment, various apparatuses of the processing apparatus 1010 include a film forming apparatus, an exposure apparatus, a coater developer apparatus, and an etching apparatus. The film forming apparatus is, for example, a plating apparatus, a vapor deposition apparatus, a sputtering apparatus, or the like. The film forming apparatus forms functional films such as a conductive film, a semiconductor film, and an insulating film on the substrate P. The coater developer apparatus forms a photosensitive material such as a photoresist film on the substrate P on which the functional film is formed by the film forming apparatus. The exposure apparatus exposes the substrate P by projecting an image of a pattern corresponding to a film pattern constituting the device onto the substrate P on which the photosensitive material is formed. The coater developer apparatus develops the exposed substrate P. The etching apparatus etches the functional film using the photosensitive material of the developed substrate P as a mask M. Thus, the processing apparatus 1010 forms a functional film of a desired pattern on the substrate P.

  Note that the processing apparatus 1010 may be provided with an apparatus for directly forming a film pattern without etching, such as an imprint-type film forming apparatus, a droplet discharge apparatus, or the like. At least one of the various devices of processing device 1010 may be omitted.

  In the present embodiment, the host control device 1005 controls the substrate supply device 1002 to cause the substrate supply device 1002 to execute the process of supplying the substrate P to the processing apparatus 1010. The host control device 1005 controls the processing apparatus 1010 to cause the processing apparatus 1010 to execute various processes on the substrate P. The host control device 1005 controls the substrate recovery device 1004 to cause the substrate recovery device 1004 to execute a process of recovering the substrate P subjected to various processes by the processing apparatus 1010.

  Next, the configuration of the substrate processing apparatus of the present embodiment will be described with reference to FIGS. 2, 3 and 4. FIG. FIG. 2 is a view showing the overall configuration of a substrate processing apparatus 1011 of the present embodiment. The substrate processing apparatus 1011 shown in FIG. 2 is at least a part of the processing apparatus 1010 as described above. The substrate processing apparatus 1011 of the present embodiment includes an exposure apparatus EX that performs exposure processing, and at least a part of the transfer apparatus 1009.

  The exposure apparatus EX of this embodiment is a so-called scanning exposure apparatus, and is formed on the mask M while synchronously driving the rotation of the cylindrical mask (cylindrical mask) M and the feed of the flexible substrate P. The image of the pattern is projected onto the substrate P via a projection optical system PL (PL1001 to PL1006) having a projection magnification of 1 × (× 1). In FIGS. 2 to 4, the Y axis of the orthogonal coordinate system XYZ is set parallel to the rotation center line (first center line) AX1001 of the cylindrical mask M, and the X axis is the scanning exposure direction, that is, The transport direction of the substrate P at the exposure position is set.

  As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 1012, an illumination device 1013, a projection optical system PL, and a control device 1014. The substrate processing apparatus 1011 rotationally moves the mask M held by the mask holding apparatus 1012 and transports the substrate P by the transport apparatus 1009. The illumination device 1013 illuminates a part (illumination region IR) of the mask M held by the mask holding device 1012 by the illumination light beam EL1 with uniform brightness. The projection optical system PL projects the image of the pattern in the illumination area IR on the mask M onto a portion (projection area PA) of the substrate P being transported by the transport apparatus 1009. By moving the mask M, the portion on the mask M arranged in the illumination area IR changes, and as the substrate P moves, the portion on the substrate P arranged in the projection area PA changes An image of a predetermined pattern (mask pattern) on the mask M is projected onto the substrate P. The control device 1014 controls each part of the exposure apparatus EX to cause each part to execute processing. Further, in the present embodiment, the control device 1014 controls at least a part of the transfer device 1009.

  The control device 1014 may be part or all of the host control device 1005 of the device manufacturing system 1001. Further, the control device 1014 may be controlled by the host control device 1005 and may be a device different from the host control device 1005. The control device 1014 includes, for example, a computer system. The computer system includes, for example, a CPU and hardware such as various memories, an OS, and peripheral devices. The process of the operation of each part of the substrate processing apparatus 1011 is stored in a computer readable recording medium in the form of a program, and the computer system reads and executes this program to perform various processes. The computer system also includes a home page providing environment (or display environment) when it can connect to the Internet or an intranet system. Further, the computer readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, a CD-ROM, and a storage device such as a hard disk built in a computer system. The computer-readable recording medium is one that holds a program dynamically for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line, in that case Such as volatile memory in a computer system that is a server or a client of the above, including one that holds a program for a certain period of time. The program may be for realizing a part of the functions of the substrate processing apparatus 1011 or may be one which can realize the functions of the substrate processing apparatus 1011 in combination with a program already recorded in the computer system. Similar to the control device 1014, the host control device 1005 can be realized using a computer system.

  Next, each part of the exposure apparatus EX of FIG. 2 will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a view showing the configuration of the mask holding apparatus 1012, and FIG. 4 is a view showing the configuration of the first drum member 1021 and the illumination optical system IL.

  As shown in FIG. 3 (FIG. 2), the mask holding device 1012 includes a first member for holding the mask M (hereinafter referred to as a first drum member 1021), a guide roller 1023 for supporting the first drum member 1021, and a first member. A driving roller 1024 for driving the drum member 1021, a first detector 1025 for detecting the position of the first drum member 1021, and a first driving unit 1026 are provided.

  As shown in FIG. 4 (FIG. 2 or FIG. 3), the first drum member 1021 forms a first surface p1001 on which the illumination region IR on the mask M is disposed. In the present embodiment, the first surface p1001 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (generation line) around an axis (first center axis AX1001) parallel to the line segment. The cylindrical surface is, for example, the outer peripheral surface of a cylinder, the outer peripheral surface of a cylinder, or the like. The first drum member 1021 is made of, for example, glass, quartz or the like and is cylindrical with a certain thickness, and the outer peripheral surface (cylindrical surface) forms a first surface p1001. That is, in the present embodiment, the illumination region IR on the mask M is curved in a cylindrical shape having a constant radius r1001 (see FIG. 1) from the rotation center line AX1001. A portion of the first drum member 1021 that overlaps with the pattern of the mask M when viewed from the radial direction of the first drum member 1021, for example, central portions other than both end sides of the first drum member 1021 in the Y axis direction as shown in FIG. And the light transmission to the illumination light flux EL1001.

  The mask M is formed, for example, as a transmission-type flat sheet mask in which a pattern is formed by a light shielding layer such as chromium on one surface of a strip-like ultrathin glass plate (for example, 100 to 500 μm thick) having good flatness. It is used in a state of being curved along the outer peripheral surface of the first drum member 21 and wound (pasted) on the outer peripheral surface. The mask M has an unpatterned area where no pattern is formed, and is attached to the first drum member 1021 in the unpatterned area. The mask M is removable with respect to the first drum member 1021.

  The mask M is made of an extremely thin glass plate, and instead of winding the mask M around the first drum member 1021 made of a transparent cylindrical base material, the outer peripheral surface of the first drum member 1021 made of a transparent cylindrical base material is A mask pattern of the light shielding layer may be drawn and integrated. Also in this case, the first drum member 1021 functions as a support member for the mask (first object).

  The first drum member 1021 may have a structure in which a thin-plate shaped mask M is curved and attached to the inner peripheral surface thereof. In the mask M, all or part of a panel pattern corresponding to one display device may be formed, or a panel pattern corresponding to a plurality of display devices may be formed. Furthermore, a plurality of panel patterns may be repeatedly arranged in the circumferential direction around the first central axis AX1001 on the mask M, or small panel patterns may be repeatedly repeated in the direction parallel to the first central axis AX1001. You may arrange two or more. In addition, the mask M may include the panel pattern of the first display device and the panel pattern of the second display device different in size and the like from the first display device. In addition, a structure in which a plurality of separated thin plate masks M can be individually attached to the outer peripheral surface (or the inner peripheral surface) of the first drum member 1021 in the direction parallel to the first center axis AX1001 or in the circumferential direction You may provide.

  The guide roller 1023 and the drive roller 1024 shown in FIG. 3 extend in the Y-axis direction parallel to the first central axis AX1001 of the first drum member 1021. The guide roller 1023 and the drive roller 1024 are provided rotatably around an axis parallel to the first central axis AX1001. In the guide roller 1023 and the drive roller 1024, the outer diameter of the end in the axial direction is larger than the outer diameter of the other portion, and this end circumscribes the first drum member 1021. Thus, the guide roller 1023 and the drive roller 1024 are provided so as not to contact the mask M held by the first drum member 1021. The drive roller 1024 is connected to the first drive unit 1026. The driving roller 1024 rotates the first drum member 1021 around the first central axis AX1001 by transmitting the torque supplied from the first driving unit 1026 to the first drum member 1021.

  Although the mask holding device 1012 includes one guide roller 1023 and one drive roller 1024, the number of guide rollers 1023 may be two or more, and the number of drive rollers 1024 may be two or more. At least one of the guide roller 1023 and the drive roller 1024 may be disposed inside the first drum member 1021 and may be inscribed in the first drum member 1021. Further, portions of the first drum member 1021 which do not overlap the pattern of the mask M when viewed from the radial direction of the first drum member 1021 (both ends in the Y-axis direction) have translucency for the illumination light beam EL1. It does not need to have translucency. In addition, one or both of the guide roller 1023 and the drive roller 1024 may be, for example, a truncated cone, and the central axis (rotational axis) thereof may not be parallel to the first central axis AX1001.

  The first detector 1025 optically detects the rotational position of the first drum member 1021. The first detector 1025 includes, for example, a rotary encoder. The first detector 1025 supplies the controller 1014 with information indicating the detected rotational position of the first drum member 1021. A first drive unit 1026 including an actuator such as an electric motor adjusts torque for rotating the drive roller 1024 in accordance with a control signal supplied from the control device 1014. The control device 1014 controls the rotational position of the first drum member 1021 by controlling the first drive unit 1026 based on the detection result of the first detector 1025. In other words, the control device 1014 controls one or both of the rotational position and the rotational speed of the mask M held by the first drum member 1021.

  A sensor (hereinafter, referred to as a Y direction position measurement sensor) that optically measures the position of the first drum member 1021 in the Y axis direction in FIG. 3 can be added to the first detector 1025. Although the Y-direction position of the first drum member 1021 shown in FIGS. 2 and 3 is basically restrained so as not to change, the relative position between the exposed region on the substrate P and the alignment mark and the pattern of the mask M It is conceivable to incorporate a mechanism (actuator) for slightly moving the first drum member 1021 (mask M) in the Y direction for practical alignment. In such a case, the measurement information from the Y-direction position measurement sensor can also be used to control the Y-direction fine movement mechanism of the first drum member 1021.

  As shown in FIG. 2, the transport device 1009 is a second support member (hereinafter referred to as a second support member p1002) on which a first transport roller 1030, a first guide member 1031, and a second surface p1002 A two-drum member 1022), a second guide member 1033, a second transport roller 1034, a second detector 1035, and a second drive unit 1036 are provided. The conveyance roller 1008 shown in FIG. 1 includes a first conveyance roller 1030 and a second conveyance roller 1034.

  In the present embodiment, the substrate P transported to the first transport roller 1030 from the upstream of the transport path is transported to the first guide member 1031 via the first transport roller 1030. The substrate P having passed through the first guide member 1031 is supported by the surface of a cylindrical or cylindrical second drum member (cylindrical body) 1022 with a radius r 1002 and is transported to the second guide member 1033. The substrate P having passed through the second guide member 1033 is transported to the downstream of the transport path via the second transport roller 1034. The rotation center line (second center line) AX 1002 of the second drum member 1022 and the rotation center lines of the first conveyance roller 1030 and the second conveyance roller 1034 are all parallel to the Y axis. It is set.

  The first guide member 1031 and the second guide member 1033 move, for example, in the direction crossing the width direction of the substrate P (move in the XZ plane in FIG. 2), tension applied to the substrate P in the transport path, etc. Adjust the Also, the first guide member 1031 (and the first conveyance roller 1030) and the second guide member 1033 (and the second conveyance roller 1034) can be configured to be movable in the width direction (Y direction) of the substrate P, for example. Thus, the position in the Y direction of the substrate P wound around the outer periphery of the second drum member 1022 can be adjusted. In addition, the conveyance apparatus 1009 should just be able to convey the board | substrate P along the projection area | region PA of the projection optical system PL, and can change the structure suitably.

  The second drum member 1022 forms a second surface p 1002 that supports a part including the projection area PA on the substrate P on which the imaging light flux from the projection optical system PL is projected in an arc shape. In the present embodiment, the second drum member 1022 is a part of the transfer device 1009 and doubles as a support member (substrate stage) for supporting the substrate P to be exposed. That is, the second drum member 1022 may be part of the exposure apparatus EX.

  The second drum member 1022 is rotatable around its central axis (hereinafter referred to as the second central axis AX1002), and the substrate P has a cylindrical surface along the outer peripheral surface (cylindrical surface) on the second drum member 1022 The projection area PA is disposed on a part of the curved portion that is curved in a shape.

In the present embodiment, a radius r1001 of a portion of the outer peripheral surface of the first drum member 1021 to which the mask M is wound and a radius r1002 of a portion of the outer peripheral surface of the second drum member 1022 to which the substrate P is wound are It is set substantially the same. This is because it is assumed that the thickness of the thin-plate shaped mask M and the thickness of the substrate P are almost equal.
On the other hand, for example, when a pattern is directly formed of a chromium layer or the like on the outer peripheral surface of the first drum member 1021 (transmission cylinder base material), the thickness of the chromium layer can be ignored. On the other hand, if the thickness of the substrate P is about 200 μm, the radius of the surface of the substrate P in the projection area PA is r 100 2 + 200 μm. In such a case, the radius r1002 of the portion of the outer peripheral surface of the second drum member 102 to which the substrate P is wound may be reduced by the thickness of the substrate P.
From this, in order to set the conditions strictly, the radius of the pattern surface (cylindrical surface) of the mask supported on the outer peripheral surface of the first drum member 1021 is a substrate supported on the outer peripheral surface of the second drum member 1022 Each radius of the first drum member 1021 and the second drum member 1022 may be determined to be equal to the radius of the surface of P.

  In the present embodiment, the second drum member 1022 is rotated by the torque supplied from the second drive unit 1036 including an actuator such as an electric motor. The second detector 1035 includes, for example, a rotary encoder and the like, and optically detects the rotational position of the second drum member 1022. The second detector 1035 supplies the control device 1014 with information indicating the detected rotational position of the second drum member 1022. The second drive unit 1036 adjusts the torque for rotating the second drum member 1022 in accordance with the control signal supplied from the control device 1014. The control device 1014 controls the rotational position of the second drum member 1022 by controlling the second drive unit 1036 based on the detection result of the second detector 1035, and the first drum member 1021 and the second drum member 1022. And synchronous movement (synchronous rotation).

  By the way, when the substrate P is a thin flexible film, wrinkles or twist may occur when it is wound around the second drum member 1022. Therefore, it is important to make the substrate P approach as straight as possible to the contact position with the outer peripheral surface of the second drum member 1022, to make the tension in the transport direction (X direction) given to the substrate P as constant as possible. From such a point of view, the control device 1014 controls the second drive unit 1036 so that the rotational speed unevenness of the second drum member 1022 becomes extremely small.

  In the present embodiment, when a plane including the first central axis AX1001 of the first drum member 1021 and the second central axis AX1002 of the second drum member 1022 is taken as a central plane p1003 (parallel to the YZ plane), the central plane p1003 The central surface p1003 and the first surface p1001 are approximately orthogonal to each other in the vicinity of the intersection of the first surface p1001 and the cylindrical first surface p1001, and similarly, the central surface p1003 and the second surface p1002 of the cylindrical shape In the vicinity of the intersection point, the central plane p1003 and the second plane p1002 are approximately orthogonal to each other.

  The exposure apparatus EX of the present embodiment is an exposure apparatus that assumes mounting of a so-called multi-lens type projection optical system. The projection optical system PL includes a plurality of projection modules that project an image of a part of the pattern of the mask M. For example, in FIG. 2, three projection modules (projection optical systems) PL1001, PL1003, and PL1005 are disposed at regular intervals in the Y direction on the left side of the center plane p1003, and three projection modules (projection System) PL 1002, PL 1004, and PL 1006 are arranged at regular intervals in the Y direction.

  In such a multi-lens exposure apparatus EX, the Y-direction end portions of the areas (projection areas PA1001 to PA1006) exposed by the plurality of projection modules PL1001 to PL1006 are overlapped with each other by scanning to obtain a desired pattern. Project the whole picture. In such an exposure apparatus EX, even when the Y-direction size of the pattern on the mask M becomes large and the necessity of handling the substrate P having a large width in the Y-direction inevitably arises, the projection module and the corresponding illumination Since it is only necessary to add modules in the device 1013 side in the Y direction, there is an advantage that it can be easily applied to the enlargement of the panel size (the width of the substrate P).

  The exposure apparatus EX may not be a multi-lens system. For example, when the size in the width direction of the substrate P is somewhat small, the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module. Also, each of the plurality of projection modules PL <b> 1001 to PL <b> 1006 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project patterns for a plurality of devices in parallel by a plurality of projection modules.

  The illumination device 1013 of the present embodiment includes a light source device (not shown) and an illumination optical system IL. As shown in FIG. 4, the illumination optical system IL includes a plurality of (for example, six) illumination modules IL1001 to IL1006 aligned in the Y-axis direction corresponding to the plurality of projection modules PL1001 to PL1006. The light source device includes, for example, a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). The illumination light emitted from the light source device is, for example, a bright line (g line, h line, i line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (Wavelength 193 nm) or the like. The illumination light emitted from the light source device has a uniform illuminance distribution, and is distributed to the plurality of illumination modules IL1001 to IL1006 via a light guide member such as an optical fiber, for example.

  The light source device may be disposed inside the first drum member 1021 or may be disposed outside the first drum member 1021. The light source device may be a device (external device) different from the exposure device EX.

  Each of the plurality of illumination modules IL1001 to IL1006 includes a plurality of optical members such as a lens. In the present embodiment, light emitted from the light source device and passing through any of the plurality of illumination modules IL1001 to IL1006 is referred to as an illumination light flux EL1. Each of the plurality of illumination modules IL1001 to IL1006 includes, for example, an integrator optical system, a rod lens, a fly's eye lens, and the like, and illuminates the illumination region IR with the illumination light beam EL1 of uniform illuminance distribution. In the present embodiment, the plurality of illumination modules IL <b> 1001 to IL <b> 1006 are disposed inside the first drum member 1021. Each of the plurality of illumination modules IL1001 to IL1006 passes through the first drum member 1021 from the inside of the first drum member 1021, and illuminates each illumination area IR on the mask M held on the outer peripheral surface of the first drum member 1021. Illuminate IR 1006).

  In the present embodiment, the first illumination module IL1001, the second illumination module IL1002, the third illumination module are arranged in the order from the -Y side (the front side of FIG. 2) to the + Y side (the FIG. The lighting module IL1003, the fourth lighting module IL1004, the fifth lighting module IL1005, and the sixth lighting module IL1006. That is, among the plurality of lighting modules IL1001 to IL1006, the first lighting module IL1001 is arranged closest to the -Y side, and the sixth lighting module IL1006 is arranged closest to the + Y side. The number of projection modules included in the projection optical system PL may be one or more and five or less, or seven or more.

  The plurality of illumination modules IL1001 to IL1006 are spaced apart so as not to interfere with each other in a direction (for example, the X-axis direction) intersecting the first central axis AX1001. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are disposed at mutually overlapping positions as viewed from the Y-axis direction. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are disposed apart from each other in the Y-axis direction.

  In the present embodiment, the second illumination module IL1002 is disposed symmetrically with the first illumination module IL1001 with respect to the central plane p1003 when viewed from the Y-axis direction. The fourth lighting module IL1004 and the sixth lighting module IL1006 are disposed at a position overlapping with the second lighting module IL100 as viewed from the Y-axis direction. The second lighting module IL1002, the fourth lighting module IL1004, and the sixth lighting module IL1006 are disposed apart from each other in the Y-axis direction.

  Each of the plurality of illumination modules IL1001 to IL1006 is in the first radial direction D1001 or the second radial direction D1002 intersecting with the central plane p1003 in the radial direction (radial direction) about the first central axis AX1001 of the first drum member 1021 The illumination luminous flux EL1 is directed. The illumination direction of the illumination light flux EL1 of each illumination module changes alternately in the order in which the illumination modules are arranged in the Y-axis direction. For example, the irradiation direction (first radial direction D1001) of the illumination light flux from the first illumination module IL1 is inclined to the −X side with respect to the Z-axis direction, and the irradiation direction of the illumination light flux from the second illumination module IL1002 The two radial directions D1002) are inclined toward the + X side with respect to the −Z axis direction. Similarly, the irradiation direction of the illumination light flux from each of the third illumination module IL1003 and the fifth illumination module IL1005 is substantially parallel to the irradiation direction of the first illumination module IL1001, and the fourth illumination modules IL1004 and sixth The illumination direction of the illumination light flux from each of the illumination modules IL 1006 is substantially parallel to the illumination direction of the second illumination module IL 1002.

  FIG. 5 is a view showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. 5 is a plan view (left view in FIG. 5) of the illumination region IR on the mask M disposed on the first drum member 1021 as viewed from the −Z side and the second drum member 1022. A plan view (right view in FIG. 5) in which the projection area PA on the substrate P is viewed from the + Z side is illustrated. The code | symbol Xs in FIG. 5 shows the moving direction (rotation direction) of the 1st drum member 1021 or the 2nd drum member 1022. FIG.

  The first to sixth illumination modules IL1001 to IL1006 illuminate the first to sixth illumination areas IR1001 to IR1006 on the mask M, respectively. For example, the first illumination module IL1001 illuminates the first illumination area IR1001, and the second illumination module IL1002 illuminates the second illumination area IR1002.

  The first illumination area IR1001 in the present embodiment is described as a trapezoidal area elongated in the Y direction, but depending on the configuration of the projection optical system (projection module) PL described later, a rectangular area including the trapezoidal area As well. The third illumination area IR1003 and the fifth illumination area IR1005 are areas of the same shape as the first illumination area IR1001, respectively, and are arranged at regular intervals in the Y-axis direction. In addition, the second illumination area IR1002 is a trapezoidal (or rectangular) area symmetrical to the first illumination area IR1001 with respect to the central plane p1003. The fourth illumination region IR1004 and the sixth illumination region IR1006 are regions of the same shape as the second illumination region IR1002, respectively, and are arranged at regular intervals in the Y-axis direction.

  As shown in FIG. 5, when viewed along the circumferential direction of the first surface p1001, each of the first to sixth illumination regions IR1001 to IR1006 has triangular portions of oblique side portions of adjacent trapezoidal illumination regions. It is arranged to overlap (to overlap). Therefore, for example, the first area A1001 on the mask M passing the first illumination area IR1001 by the rotation of the first drum member 1021 is on the mask M passing the second illumination area IR1002 by the rotation of the first drum member 1021. It partially overlaps with the second area A1002.

  In the present embodiment, the mask M includes a pattern formation area A 1003 in which a pattern is formed and a non-pattern formation area A 1004 in which a pattern is not formed. The non-pattern formation area A 1004 is arranged to surround the pattern formation area A 1003 in a frame shape, and has a characteristic of shielding the illumination light beam EL 1. The pattern formation area A1003 of the mask M moves in the direction Xs as the first drum member 1021 rotates, and each partial area in the Y axis direction of the pattern formation area A1003 is a first to sixth illumination areas IR1001 to IR1001. Pass one of the IRs 1006. In other words, the first to sixth illumination areas IR <b> 1001 to IR <b> 1006 are arranged to cover the full width of the pattern formation area A <b> 1003 in the Y-axis direction.

  As shown in FIG. 2, the projection optical system PL includes a plurality of projection modules PL <b> 1001 to PL <b> 1006 aligned in the Y-axis direction. Each of the plurality of projection modules PL1001 to PL1006 has a one-to-one correspondence with each of the first to sixth illumination modules IL1006, and a partial of the mask M that appears in the illumination region IR illuminated by the corresponding illumination module An image of the above pattern is projected onto each projection area PA on the substrate P.

  For example, the first projection module PL1001 corresponds to the first illumination module IL1001, and the image of the pattern of the mask M in the first illumination area IR1001 (see FIG. 5) illuminated by the first illumination module IL1001 is displayed on the substrate P It projects on the first projection area PA1001. The third projection module PL1003 and the fifth projection module PL1005 correspond to the third illumination module IL1003 and the fifth illumination module IL1005, respectively. The third projection module PL1003 and the fifth projection module PL1005 are arranged at a position overlapping the first projection module PL1001 when viewed from the Y-axis direction.

  In addition, the second projection module PL1002 corresponds to the second illumination module IL1002, and the image of the pattern of the mask M in the second illumination area IR1002 (see FIG. 5) illuminated by the second illumination module IL1002 is displayed on the substrate P. It projects on the second projection area PA1002. The second projection module PL1002 is disposed at a symmetrical position with respect to the first projection module PL1001 with respect to the first projection module PL1001 with respect to the first projection module PL1001.

  The fourth projection module PL1004 and the sixth projection module PL1006 are arranged corresponding to the fourth illumination module IL1004 and the sixth illumination module IL1006, respectively, and the fourth projection module PL1004 and the sixth projection module PL1006 are arranged from the Y-axis direction. As seen, it is disposed at a position overlapping with the second projection module PL1002.

  In the present embodiment, the light reaching each of the illumination areas IR1001 to IR1006 on the mask M from the illumination modules IL1001 to IL1006 of the illumination device 1013 is the illumination light flux EL1, and a portion of the mask M appears in each of the illumination areas IR1001 to IR1006. The light which receives the intensity distribution modulation according to the pattern and enters each of the projection modules PL1001 to PL1006 to reach each of the projection areas PA1001 to PA1006 is taken as an imaging light beam EL2.

  As shown in the right figure in FIG. 5, the image of the pattern in the first illumination region IR1001 is projected on the first projection region PA1001, the image of the pattern in the third illumination region IR1003 is projected on the third projection region PA1003, The image of the pattern in the fifth illumination area IR1005 is projected onto the fifth projection area PA1005. In the present embodiment, the first projection area PA1001, the third projection area PA1003, and the fifth projection area PA1005 are arranged in a line in the Y-axis direction.

  Further, the image of the pattern in the second illumination area IR1002 is projected onto the second projection area PA1002. In the present embodiment, the second projection area PA1002 is disposed symmetrically to the first projection area PA1001 with respect to the central plane p1003 as viewed in the Y-axis direction. Also, the image of the pattern in the fourth illumination region IR1004 is projected to the fourth projection region PA1004 and the image of the pattern in the sixth illumination region IR1006 is projected to the sixth projection region PA1006. In the present embodiment, the second projection area PA1002, the fourth projection area PA1004, and the sixth projection area PA1006 are arranged in a line in the Y-axis direction.

Each of the first to sixth projection areas PA1001 to PA1006, when viewed along the circumferential direction of the second surface p1002, is an adjacent projection area adjacent to the second central axis AX1002 in a direction parallel to the second central axis AX1002, The triangles are arranged so as to overlap. Therefore, for example, the third area A1005 on the substrate P passing the first projection area PA1001 by the rotation of the second drum member 1022 is on the substrate P passing the second projection area PA1002 by the rotation of the second drum member 1022. It partially overlaps with the fourth area A1006.
The first projection area PA1001 and the second projection area PA1002 are such that the exposure amount in the area where the third area A1005 and the fourth area A1006 overlap is substantially the same as the exposure amount in the non-overlapping area. The shape etc. are set.

  In the present embodiment, the area to be exposed on the substrate P (hereinafter referred to as exposure area A 1007) moves in the direction Xs as the second drum member 1022 rotates, as shown in the right view in FIG. Each partial area in the Y-axis direction of the area A1007 passes any of the first to sixth projection areas PA1001 to PA1006. In other words, the first to sixth projection areas PA1001 to PA1006 are arranged to cover the entire width of the exposure area A1007 in the Y-axis direction.

  The irradiation direction of the illumination light beam EL1 with respect to the first projection module PL1001 may be, for example, the traveling direction of a chief ray passing through any position in the first illumination area IR1001, or the main direction passing the center of the first illumination area IR1001. It may be the traveling direction of the light beam. The same applies to the irradiation direction of the illumination light beam EL1 to the second to sixth projection modules PL1002 to PL1006.

  By the way, the first to sixth projection areas PA1001 to PA1006 may be arranged such that the areas on the substrate P passing through any of them do not overlap each other at the end. For example, the third area A1005 passing through the first projection area PA1001 may not partially overlap with the fourth area A1006 passing through the second projection area PA1002. That is, even if it is a multi-lens system, it is also possible not to perform stitch exposure by each projection module. In this case, the third area A1005 is an area on which the pattern corresponding to the first device is projected, and the fourth area A1006 is an area on which the pattern corresponding to the second device is projected Good. The second device described above is a device of the same type as the first device, and the same pattern as the third region A1005 may be projected on the fourth region A1006. The second device described above may be a device of a type different from the first device, and a pattern different from the third region A1005 may be projected on the fourth region A1006.

  Next, the detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. In the present embodiment, each of the second to sixth projection modules PL1001 to PL1006 has the same configuration as that of the first projection module PL1001. Therefore, as a representative of the projection optical system PL, the configuration of the first projection module PL1001 will be described.

  The first projection module PL1001 shown in FIG. 6 is formed by the first optical system 1041 for forming an image of the pattern of the mask M disposed in the first illumination region IR1001 on the intermediate image plane p1007, and the first optical system 1041. A second optical system 1042 re-forms at least a part of the intermediate image on a first projection area PA 1001 of the substrate P, and a first field stop 1043 disposed on an intermediate image plane p 1007 where the intermediate image is formed.

  Further, the first projection module PL1001 is provided with a focus correction optical member 1044 for finely adjusting the focus state of a pattern image (hereinafter referred to as a projected image) of a mask formed on the substrate P, and a minute projection image in the image plane. The image shift correction optical member 1045 for lateral shift, the magnification correction optical member 1047 for slightly correcting the magnification of the projected image, and the rotation correction mechanism 1046 for slightly rotating the projected image in the image plane.

  The focus correction optical member 1044 is disposed at a position where the imaging light beam EL2 emitted from the first illumination region IR1001 enters, and the image shift correction optical member 1045 receives the imaging light beam EL2 emitted from the focus correction optical member 1044 It is placed in position. The magnification correction optical member 1047 is disposed at a position where the imaging light beam EL2 emitted from the second optical system 1042 is incident.

  The imaging light beam EL2 from the pattern of the mask M exits in the normal direction from the first illumination region IR1001, passes through the focus correction optical member 1044, and enters the image shift correction optical member 1045. The imaging light beam EL2 transmitted through the image shift correction optical member 1045 is reflected by the first reflection surface (plane mirror) p1004 of the first deflection member 1050 which is an element of the first optical system 1041, and passes through the first lens group 1051. The light is reflected by the first concave mirror 1052, passes through the first lens group 1051 again, is reflected by the second reflecting surface (planar mirror) p 1005 of the first deflection member 1050, and enters the first field stop 1043.

The imaging light beam EL2 having passed through the first field stop 1043 is reflected by the third reflection surface (plane mirror) p1008 of the second deflection member 1057 which is an element of the second optical system 1042, and passes through the second lens group 1058 The light beam is reflected by the second concave mirror 1059, passes through the second lens group 1058 again, is reflected by the fourth reflecting surface (planar mirror) p1009 of the second deflection member 1057, and enters the magnification correction optical member 1047.
The imaging light beam EL2 emitted from the magnification correction optical member 1047 is incident on the first projection area PA1001 on the substrate P, and the image of the pattern appearing in the first illumination area IR1001 is equal-magnified in the first projection area PA1001 (× Projected in 1).

  The first optical system 1041 and the second optical system 1042 are, for example, telecentric catadioptric optical systems obtained by modifying the Dyson system. In the present embodiment, the optical axis of the first optical system 1041 (hereinafter, referred to as a first optical axis AX1003) is substantially orthogonal to the center plane p1003. The first optical system 1041 includes a first deflection member 1050, a first lens group 1051, and a first concave mirror 1052. The imaging light beam EL2 emitted from the image shift correction optical member 1045 is reflected by the first reflection surface p1004 of the first deflection member 1050 and travels toward one side (−X side) of the first optical axis AX1003. The light passes through the first lens group 1051 and enters the first concave mirror 1052 disposed in the pupil plane. The imaging light beam EL2 reflected by the first concave mirror 1052 travels to the other side (+ X side) of the first optical axis AX1003, passes through the first lens group 1051, and is reflected by the second reflective surface p1005 of the first deflection member 1050 The light then enters the first field stop 1043.

  The first deflection member 1050 is a triangular prism extending in the Y-axis direction. In the present embodiment, each of the first reflection surface p1004 and the second reflection surface p1005 includes a mirror surface (surface of the reflection film) formed on the surface of the triangular prism. The chief ray EL3 of the imaging light beam EL2 passing through the center of the first illumination region IR1001 travels along the first radial direction D1001 inclined in the XZ plane with respect to the central plane p1003 and is incident on the first projection module PL1001 Do.

  In the first deflecting member 1050, a principal ray EL3 reaching from the first illumination region IR1001 to the first reflecting surface p1004 and a principal ray EL3 (parallel to the central plane p1003) reaching from the second reflecting surface p1005 to the intermediate image surface p1007 The imaging light beam EL2 is deflected so as to be non-parallel (cross) in the XZ plane.

  In order to form the optical path as described above, in the present embodiment, a ridgeline where the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 intersect and the first optical axis AX1003 are included. When the parallel surface is p1006, the first reflective surface p1004 and the second reflective surface p1005 are disposed at an asymmetric angle with respect to the surface p1006.

  Assuming that the angle of the first reflection surface p1004 to the surface p1006 is θ1001 and the angle of the second reflection surface p1005 to the surface p1006 is θ1002, in the present embodiment, the angle (θ1001 + θ1002) is set to less than 90 °, and the angle θ1001 is 45 The angle θ 1002 is set to substantially 45 °, less than °.

By setting the principal ray EL3 reflected by the first reflecting surface p1004 and incident on the first lens group 1051 parallel to the optical axis AX1003, the principal ray EL3 is the center of the first concave mirror 1052, ie, the optical axis of the pupil plane It can be passed through the intersection with the AX 1003 to ensure a telecentric imaging state. For this purpose, when the inclination angle of the chief ray EL3 (first radial direction D1001) from the first illumination region IR1001 to the first reflection surface p1004 with respect to the central plane p1003 in FIG. 6 is θd, the first reflection surface p1004 is The angle θ1001 of H may be set to satisfy the following equation (1).
θ1001 = 45 ° − (θd / 2) (1)

  In the present embodiment, each of the plurality of lenses belonging to the first lens group 1051 has an axially symmetric shape around the first optical axis AX1003. The imaging light beam EL2 reflected by the first reflection surface p1004 is incident on the first lens group 1051 from one side (+ Z side) of the surface p1006. The first concave mirror 1052 is disposed at or near the position of the pupil plane of the first optical system 1041.

  The chief ray EL3 of the imaging light beam EL2 having passed through the first lens group 1051 is incident on the intersection of the first optical axis AX1003 and the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 travels in the first lens group 1051 along a light path symmetrical with respect to the surface p1006, as compared with before the incidence to the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 is emitted from the other side (−Z side) of the first lens group 1051 and is reflected by the second reflection surface p1005 of the first deflection member 1050 to form a central surface p1003. It travels along the parallel chief ray EL3.

  The first field stop 1043 has an opening that defines the shape of the first projection area PA1001. That is, the shape of the opening of the first field stop 1043 defines the shape of the first projection area PA1001. Therefore, as shown in FIG. 6, when the field stop 1043 can be disposed in the intermediate image plane p1007, the aperture shape of the field stop 1043 can be trapezoidal as shown in the right drawing of FIG. In that case, the shapes of the first to sixth illumination areas IR1001 to IR1006 may not be similar to the shapes (trapezoids) of the first to sixth projection areas PA1001 to PA1006, respectively. It can be rectangular so as to include the trapezoidal shape of the aperture of the field stop 1043).

  The second optical system 1042 has a configuration similar to that of the first optical system 1041 and is provided symmetrically to the first optical system 1041 with respect to an intermediate image plane p1007 including the first field stop 1043. The optical axis of the second optical system 1042 (hereinafter, referred to as a second optical axis AX1004) is substantially orthogonal to the central plane p1003. The second optical system 1042 includes a second deflection member 1057, a second lens group 1058, and a second concave mirror 1059. The imaging light beam EL2 emitted from the first optical system 1041 and passing through the first field stop 1043 is reflected by the third reflecting surface p1008 of the second deflecting member 1057, passes through the second lens group 1058, and the second concave mirror 1059 Incident to The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the second lens group 1058 again, is reflected by the fourth reflecting surface p1009 of the second deflection member 1057, and is incident on the magnification correction optical member 1047.

The second deflecting member 1057, the second lens group 1058, and the second concave mirror 1059 of the second optical system 1042 are the same as the first deflecting member 1050, the first lens group 1051, and the first concave mirror 1052 of the first optical system 1041, respectively. It is. The angle θ1003 that the third reflection surface p1008 of the second deflection member 1057 makes with the second optical axis AX1004 is substantially the same as the angle θ1002 where the second reflection surface p1005 of the first deflection member 1050 makes with the first light axis AX1003. is there. Further, an angle θ1004 formed by the fourth reflective surface p1009 of the second deflection member 1057 with the second optical axis AX1004 is substantially equal to an angle θ1001 formed by the first reflective surface p1004 of the first deflection member 1050 with the first optical axis AX1003. It is the same. Each of the plurality of lenses belonging to the second lens group 1058 has an axially symmetrical shape around the second optical axis AX1004.
The second concave mirror 1059 is disposed at or near the position of the pupil plane of the second optical system 1042.

  The imaging light beam EL2 having passed through the first field stop 1043 travels in a direction along the chief ray parallel to the central plane p1003 and is incident on the third reflection surface (plane) p1008. The inclination angle θ1003 of the third reflective surface p1008 with respect to the second optical axis AX1004 (or the surface p1006 and the intermediate image surface p1007) of the second optical system 1042 is 45 ° in the XZ plane, and the imaging light beam EL2 reflected here is , And enters the upper half of the field of view of the second lens group 1058. The chief ray EL3 of the imaging light beam EL2 incident on the second lens group 1058 is parallel to the second optical axis AX1004, and is incident on the intersection of the second optical axis AX1004 and the second concave mirror 1059.

  The imaging light beam EL2 reflected by the second concave mirror 1059 travels symmetrically with respect to the second optical axis AX1004 as compared with before entering the second concave mirror 1059. The imaging light beam EL2 reflected by the second concave mirror 1059 passes again through the lower half of the visual field area of the second lens group 1058, is reflected by the fourth reflection surface p1009 of the second deflection member 1057, and intersects the central plane p1003. Progress in the direction

The traveling direction of the chief ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 toward the first projection area PA1001 is the first illumination area IR1001 to the first with respect to the intermediate image plane p1007 including the first field stop 1043. It is set symmetrically to the traveling direction of the chief ray EL3 of the imaging light beam EL2 incident on the optical system 1041. That is, when viewed in the XZ plane, the angle θ 1004 with respect to the second optical axis AX 1004 of the fourth reflection surface p 1009 of the second deflection member 1057 satisfies the following equation (2) as in the above equation (1) Is set as
θ1004 = 45 ° − (θd / 2) (2)
Thereby, the chief ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 is directed to the normal line direction (rotation center line AX1002 in FIG. 2) of the first projection area PA1001 (cylindrical surface) on the substrate P. Direction).

  In the present embodiment, the focus correction optical member 1044, the image shift correction optical member 1045, the rotation correction mechanism 1046, and the magnification correction optical member 1047 constitute an imaging characteristic adjustment mechanism that adjusts the imaging characteristic of the first projection module PL1001. Do. By controlling the imaging characteristic adjustment mechanism, the projection conditions of the projection image on the substrate P can be adjusted for each projection module. The projection conditions mentioned here include one or more items of the translational position, rotational position, magnification, and focus of the projection area on the substrate P. The projection conditions can be set for each position of the projection area with respect to the substrate P at the time of synchronous scanning. By adjusting the projection conditions of the projection image, it is possible to correct the distortion of the projection image as compared to the pattern of the mask M. In addition, the imaging characteristic adjustment mechanism can change the structure suitably, and can abbreviate | omit the at least one part.

  The focus correction optical member 1044 is formed, for example, by superposing two wedge-shaped prisms in opposite directions (opposite directions in the X direction in FIG. 6) to form a transparent parallel plate as a whole. By sliding this pair of prisms in the direction of the slope without changing the distance between the faces facing each other, the thickness as a parallel flat plate can be made variable. As a result, the effective optical path length of the first optical system 1041 is finely adjusted, and the focus state of the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 is finely adjusted.

  The image shift correction optical member 1045 is composed of transparent parallel flat glass which can be tilted in the XZ plane in FIG. 6 and transparent parallel flat glass which can be tilted in the direction orthogonal thereto. The pattern image formed on the intermediate image plane p1007 and the projection area PA1001 can be slightly shifted in the X direction and the Y direction by adjusting the tilt amounts of the two parallel flat glass plates.

  For example, the magnification correction optical member 1047 coaxially arranges three lenses of a concave lens, a convex lens, and a concave lens at predetermined intervals, fixes the front and rear concave lenses, and moves the convex lens between them in the optical axis (principal ray) direction It was constructed in As a result, the pattern image formed in the projection area PA1001 is isotropically enlarged or reduced by a very small amount while maintaining the telecentric imaging state. The optical axes of the three lens groups constituting the magnification correction optical member 1047 are inclined in the XZ plane so as to be parallel to the inclined chief ray EL3 passing therethrough.

  The rotation correction mechanism 1046 slightly rotates the first deflection member 1050 about an axis parallel to the first optical axis AX 1003 by an actuator (not shown), for example. The rotation correction mechanism 1046 can slightly rotate the pattern image formed on the intermediate image plane p1007 in the intermediate image plane p1007.

  As described above, the imaging light beam EL2 emitted from the first projection module PL1001 appears in the first illumination area IR1001 in the first projection area PA1001 of the substrate P disposed on the outer peripheral surface of the second drum member 1022. Form an image. In the present embodiment, the chief ray EL3 of the imaging light beam EL2 that has passed through the center of the first illumination area IR1001 emits from the first illumination area IR1001 in the normal direction, and from the normal direction with respect to the first projection area PA1001. It will be incident. Thus, the image of the pattern of the mask M appearing in the cylindrical first illumination region IR1001 is projected onto the first projection region PA1001 on the cylindrical substrate P. Similarly, the image of the pattern of the mask M appearing in each of the second to sixth illumination areas IR1002 to IR1006 is projected onto each of the second to sixth projection areas PA1002 to PA1006 on the cylindrical substrate P. Be done.

  In this embodiment, as shown in FIGS. 2 and 5, odd-numbered illumination areas IR1001, IR1003, and IR1005 and even-numbered illumination areas IR1002, IR1004, and IR1006 are arranged at symmetrical distances with respect to the center plane p1003. The odd-numbered projection areas PA1001, PA1003, and PA1005 and the even-numbered projection areas PA1002, PA1004, and PA1006 are also disposed at symmetrical distances with respect to the central plane p1003. Therefore, each of the six projection modules can be made to have the same configuration, the parts of the projection optical system can be made common, the assembly process and inspection process are simplified, and the imaging characteristics (aberration of each projection module) Etc.) can be made uniform. In particular, when performing joint exposure between projection areas of individual projection modules according to the multi-lens method, the quality (transfer fidelity) of the panel pattern formed on the substrate P is the position or area in the panel. It is advantageous to keep constant regardless of

  In a general exposure apparatus, if the projection area is curved in a cylindrical surface, defocusing may be caused depending on the position of the projection area, for example, when the imaging light beam is incident from a direction non-perpendicular to the projection area. It can be large. As a result, an exposure failure may occur and a defective device may occur.

  In the present embodiment, the first deflection member 1050 (first reflection surface p1004) and the second deflection member 1057 (fourth reflection surface p1009) of the projection optical system PL (for example, the first projection module PL1001) receive the first illumination. The chief ray EL3 is deflected such that the chief ray EL3 emitted from the region IR1001 in the normal direction is projected to the first projection region PA1001 from the normal direction. Therefore, in the substrate processing apparatus 1011, the focus error of the projection image in the projection area PA 1001, in particular, the entire best focus plane of the projection image in each of the projection areas PA 1001 to PA 1006 shown in FIG. Large deviation from the width of the depth of focus of PL1006 can be reduced, and the occurrence of exposure failure and the like can be suppressed. As a result, the occurrence of defective devices by the device manufacturing system 1001 is suppressed.

  In the present embodiment, since the projection optical system PL includes the first field stop 1043 disposed at the position where the intermediate image is formed, the shape and the like of the projection image can be managed with high accuracy. Therefore, the substrate processing apparatus 1011 can reduce, for example, the overlay error of the first to sixth projection areas PA1001 to PA1006, and the occurrence of the exposure failure and the like can be suppressed. Further, the second reflective surface p1005 of the first deflection member 1050 deflects the chief ray EL3 from the first illumination region IR1001 so as to be orthogonal to the field stop 1043. Therefore, the substrate processing apparatus 1011 can manage the shape and the like of the projected image with higher accuracy.

  In the embodiment, each of the first to sixth projection modules PL1001 to PL1006 projects an image of the pattern of the mask M as an erect image. Therefore, when the substrate processing apparatus 1011 projects the pattern of the mask M into the first to sixth projection modules PL1001 to PL1006, for example, the area on which the projection image is projected (for example, the third area A1005 and the fourth area) Since it is possible to perform joint exposure in which A1006) is partially overlapped, it becomes easy to design the mask M.

  In the present embodiment, since the exposure apparatus EX exposes the substrate P while the transfer apparatus 1009 continuously transfers the substrate P at a constant speed along the second surface p 1002 in the present embodiment, the productivity of the exposure process is enhanced. be able to. As a result, the device manufacturing system 1001 can efficiently manufacture devices.

  In the present embodiment, the first reflection surface p1004 and the second reflection surface p1005 are disposed on the surface of the same deflection member (first deflection member 1050), but even if they are disposed on the surfaces of different members Good. Further, one or both of the first reflection surface p1004 and the second reflection surface p1005 may be disposed on the inner surface of the first deflection member 1050, and may have, for example, a characteristic of reflecting light according to a total reflection condition.

  Furthermore, the deformation relating to the first reflection surface p1004 and the second reflection surface p1005 as described above can also be applied to one or both of the third reflection surface p1008 and the fourth reflection surface p1009. For example, when the radius r1002 of the second surface p1002 is changed, the fourth reflection surface p1009 of the second deflecting member 1057 causes the imaging light beam EL2 to be incident on the first projection area PA1001 in the normal direction. , And sets an arc-like circumferential length between the center point of the first projection area PA1001 and the center point of the second projection area PA1002 to the corresponding illumination area IR1001 on the mask M (radius r1001). The arrangement is set to coincide with the arc-like circumferential length between the central point and the central point of the illumination region IR 1002.

Second Embodiment
Next, a second embodiment will be described. In the present embodiment, the same components as those of the above-described embodiment may be denoted by the same reference numerals as the above-described embodiment, and the description thereof may be simplified or omitted.

  FIG. 7 is a view showing the configuration of a substrate processing apparatus 1011 of the present embodiment. The conveyance device 1009 according to the present embodiment includes a first conveyance roller 1030, a first guide member (eg, an air turn bar) 1031, a fourth conveyance roller 1071, a fifth conveyance roller 1072, a sixth conveyance roller 1073, and a second guide. A member (air turn bar or the like) 1033 and a second conveyance roller 1034 are provided.

The substrate P transported to the first transport roller 1030 from the upstream of the transport path is transported to the first guide member 1031 via the first transport roller 1030. The substrate P having passed through the first guide member 1031 is transported to the fifth transport roller 1072 via the fourth transport roller 1071. The central axis of the fifth conveyance roller 1072 is disposed on the central plane p1003. The substrate P having passed the fifth conveyance roller 1072 is conveyed to the second guide member 1033 via the sixth conveyance roller 1073.
The sixth transport roller 1073 is disposed symmetrically to the fourth transport roller 1071 with respect to the center plane p1003. The substrate P having passed through the second guide member 1033 is transported to the downstream of the transport path via the second transport roller 1034. The first guide member 1031 and the second guide member 1033 adjust the tension acting on the substrate P in the transport path, similarly to the first guide member 1031 and the second guide member 1033 shown in FIG.

  The first projection area PA 1001 in FIG. 7 is set on the substrate P which is linearly transported between the fourth transport roller 1071 and the fifth transport roller 1072. The substrate P is supported between the fourth transport roller 1071 and the fifth transport roller 1072 so that a predetermined tension is applied in the transport direction, and the substrate P is sent along the planar second surface p1002.

  The first projection area PA1001 (second plane p1002) is inclined so as to be non-perpendicular to the central plane p1003. The normal direction (hereinafter referred to as the first normal direction D1003) of the first projection area PA1001 corresponds to the first radial direction D1001 with respect to a plane orthogonal to the central plane p1003, for example, the intermediate image plane p1007 also shown in FIG. It is arranged symmetrically. The chief ray EL3 of the imaging light beam EL2 emitted from the first projection module PL1001 enters the first projection area PA1001 from the first normal direction D1003. In other words, the first normal direction D1003 of the substrate P stretched around the fourth conveyance roller 1071 and the fifth conveyance roller 1072 is symmetrical to the first radial direction D1001 with respect to the intermediate image plane p1007 orthogonal to the central plane p1003. The fourth conveyance roller 1071 and the fifth conveyance roller 1072 are disposed so that

  The second projection area PA 1002 is set on the substrate P being transported between the fifth transport roller 1072 and the sixth transport roller 1073. The substrate P is supported so that a constant tension is applied between the fifth transport roller 1072 and the sixth transport roller 1073, and is sent along the planar second surface p1002.

  The second projection area PA 1002 is inclined so as to be non-perpendicular to the center plane p 1003. The normal direction (second normal direction D1004) of the second projection area PA1002 is symmetrical to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. The chief ray EL3 of the imaging light beam EL2 emitted from the second projection module PL1002 enters the second projection area PA1002 from the second normal direction D1004. In other words, the second normal direction D1004 of the substrate P stretched around the fifth conveyance roller 1072 and the sixth conveyance roller 1073 is symmetrical to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the central plane p1003. The fifth conveyance roller 1072 and the sixth conveyance roller 1073 are arranged to be as follows.

  The substrate processing apparatus 1011 according to the present embodiment uses the fourth conveyance roller 1071, the fifth conveyance roller 1072, and the sixth conveyance roller 1073 to approximate the cylindrical second surface p 1002 shown in FIG. The transfer fidelity of the pattern image projected onto the substrate P in each of the projection areas PA1001 to PA1006 is further improved from the viewpoint of depth of focus (DOF). In addition, the height in the Z direction of the entire transfer device 1009 can be reduced as compared to the case of using the second drum member 1022 of radius r 1002 for supporting and transferring the substrate P as shown in FIG. , The entire device can be miniaturized.

  Further, in the apparatus configuration of FIG. 7, the fourth conveyance roller 1071, the fifth conveyance roller 1072, and the sixth conveyance roller 1073 are a part of the conveyance device 1009 and a support member (supporting the substrate P to be exposed) It also serves as a substrate stage) on the exposure apparatus EX side. In addition, the bell / noise interface which supports the back surface side of the substrate P in a noncontact manner by the fluid bearing between the fourth conveyance roller 1071 and the fifth conveyance roller 1072 and between the fifth conveyance roller 1072 and the sixth conveyance roller 1073 A method of providing a pad plate may be used to further enhance the flatness of the partial area of the substrate P on which the projection areas PA1001 to PA1006 are located.

  Furthermore, at least one of the transport rollers of the transport apparatus 1009 shown in FIG. 7 may be fixed to the projection optical system PL or may be movable. For example, the fifth conveyance roller 1072 has three translation directions, ie, a translation direction parallel to the X axis direction, a translation direction parallel to the Y axis direction, and a translation direction parallel to the Z axis direction, and an axis parallel to the X axis direction. At least one of six directions (six degrees of freedom) including the direction of rotation, the direction of rotation around an axis parallel to the Y-axis direction, and the three directions of rotation around an axis parallel to the Z-axis direction ), It may be slightly movable. Alternatively, the first normal of the first projection area PA1001 may be finely adjusted by finely adjusting the relative position of one or both of the fourth conveyance roller 1071 and the sixth conveyance roller 1073 in the Z-axis direction with respect to the fifth conveyance roller 1072. It is possible to finely adjust the angle formed by the direction D1003 or the second normal direction D1004 of the second projection area PA1002 and the surface of the substrate P supported for planarization. As described above, by finely moving the selected roller, it is possible to accurately adjust the posture of the surface of the substrate P with respect to the pattern projection image plane in each of the projection areas PA1001 to PA1006.

Third Embodiment
Next, a third embodiment will be described with reference to FIG. In this embodiment, about the component similar to said each embodiment, the code | symbol same as said each embodiment may be attached | subjected, and the description may be simplified or abbreviate | omitted.

  FIG. 8 shows the configuration of an exposure apparatus EX as a substrate processing apparatus 1011 of the present embodiment, and the basic configuration is the same as FIG. 7 described above. However, as compared with the configuration of FIG. 7, the angle θ1004 with respect to the optical axis AX1004 of the fourth reflection surface p1009 of the second deflection member 1057 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL is set to 45 °. The point that the substrate P transported by the transport apparatus 1009 is supported so as to be a plane (parallel to the XY plane in FIG. 8) orthogonal to the central plane p1003 at the positions of the projection areas PA1001 to PA1006 is large. It is different.

In the configuration of FIG. 8, the substrate P is moved from the upstream of the conveyance path to the eighth conveyance roller 1076 via the first conveyance roller 1030, the first guide member 1031 (air turn bar, etc.), and the fourth conveyance roller 1071. It is transported. The substrate P having passed through the eighth conveyance roller 1076 is conveyed to the downstream of the conveyance path via the second guide member 1033 (air turn bar or the like) and the second conveyance roller 1034.
As shown in FIG. 8, the substrate P is supported and conveyed with a predetermined tension so as to be parallel to the XY plane between the fourth conveyance roller 1071 and the eighth conveyance roller 1076. In this case, the second surface p1002 on which the substrate P is supported is a flat surface, and the projection areas PA1001 to PA1006 are disposed in the second surface p1002.

  Further, in the second optical system 1042 constituting each of the projection modules PL1001 to PL1006, the third reflecting surface p1008 and the fourth reflecting surface p1009 of the second deflecting member 1057 form an image which is emitted to the substrate P from the second optical system 1042. The principal ray EL3 of the luminous flux EL2 is arranged substantially parallel to the central plane p1003. That is, in the first deflection member 1050 and the second deflection member 1057 of the projection optical system PL (projection modules PL1001 to PL1006), the respective chief rays EL3 emitted in the normal direction from the cylindrical illumination regions IR1001 to IR1006 are: The imaging optical path is deflected so as to be incident from the normal direction to the projection areas PA1001 to PA1006 set on the common plane.

  In this embodiment, in the XZ plane viewed from the direction parallel to the first central axis AX1001 of the mask M, the central point of the projection area PA1002 (and PA1004 and PA1006) from the central point of the projection area PA1001 (and PA1003 and PA1005) The distance DFx along the second surface p1002 (the surface of the substrate P) up to the first surface p1001 from the central point of the illumination region IR1001 (and IR1003, IR1005) to the central point of the illumination region IR1002 (and IR1004, IR1006) The distance (chord length or circumferential length) DMx along (the cylindrical surface of radius r) is set to be substantially equal.

  Here, the mutual positional relationship of the illumination regions IR and the mutual positional relationship of the projection regions PA will be described with reference to FIG. 9 schematically showing. In FIG. 9, symbol α indicates an angle (opening angle) [°] formed by the first radial direction D1001 and the second radial direction D1002, and symbol r indicates a radius [mm] of the first surface p1001. .

In FIG. 9, the perimeter DMx [mm] from the central point of illumination region IR1001 to the central point of illumination region IR1002 in the XZ plane is expressed by the following equation (3) using angle α and radius r .
DMx = π · α · r / 180 (3)
Further, a linear distance Ds from the central point of the illumination area IR1001 to the central point of the illumination area IR1002 is expressed by the following formula (4).
Ds = 2 · r · sin (π · α / 360) (4)

  For example, when the angle α is 30 ° and the radius r is 180 mm, the perimeter DMx is about 94.248 mm, and the distance Ds is about 93.175 mm. That is, if the X coordinate of the central point of illumination region IR1001 matches the X coordinate of the central point of projection region PA1001 and the X coordinate of the central point of illumination region IR1002 matches the X coordinate of the central point of projection region PA1002 Assuming that two points separated by circumferential length DMx in the circumferential direction in the pattern of mask M are projected onto substrate P via projection areas PA1001 and PA1002, respectively, the two points are separated by a distance Ds in the X direction on substrate P It will be exposed by (Ds <DMx). That is, according to the above numerical example, the pattern exposed on the substrate P through the odd numbered projection areas PA1001, PA1003 and PA1005 and the pattern exposed on the substrate P through the even numbered projection areas PA1002, PA1004 and PA1006 It means that the pattern to be set is shifted about 1.073 mm at the maximum in the X direction.

  In the present embodiment, therefore, on the planarized substrate P, the projection optics is set such that the linear distance DFx between the central point of the projection area PA1001 and the central point of the projection area PA1002 becomes substantially equal to the perimeter DMx. The arrangement condition of the specific optical member in the system PL is changed from the condition shown in FIG.

  Specifically, the fourth reflective surface p1009 of the second deflection member 1057 is slightly shifted from the position as shown in FIG. 6 in the direction parallel to the optical axis AX 1004 (X axis), and as a result, the linear distance DFx Set to match the perimeter DMx. According to the numerical example described above, the difference between the perimeter DMx and the distance Ds is 1.073 mm, and, for example, the second deflection member 1057 included in each of the odd-numbered projection modules PL1001, PL1003, and PL1005 It is easy to parallelly move the position of the fourth reflecting surface p1009 by about 1 mm along the optical axis AX1004 toward the second concave mirror 1059 side.

However, this may require parts different from the even-numbered projection modules PL1002, PL1004, and PL1006 with respect to the configuration of the second deflection member 1057 (the arrangement of the fourth reflective surface p1009).
Therefore, the position of the fourth reflecting surface p1009 of the second deflecting member 1057 mounted on all the projection modules PL1001 to PL1006 is parallel to the second concave mirror 1059 side along the optical axis AX1004 by about 0.5 mm which is half of 1 mm. If it is moved, parts can be shared.

  FIG. 10 shows the difference between the circumferential length DMx along the pattern surface (first surface p1001) of the mask M described in FIG. 9 and the linear distance Ds between the centers of the odd and even illumination areas. It is a graph which shows correlation with angle alpha, a vertical axis expresses difference, and a horizontal axis expresses opening angle alpha. Further, a plurality of curves in the graph of FIG. 10 represent the case where the radius r of the pattern surface (cylindrical first surface p1001) of the mask M is changed to 180 mm, 210 mm, 240 mm, and 300 mm. Since the circumference DMx is about 94.248 mm and the distance Ds is about 93.175 mm when the angle α is 30 ° and the radius r is 180 mm, as described above with reference to the numerical example, The difference shown on the vertical axis of the graph of 10 is about 1.073 mm.

  As shown in FIG. 10, the difference between the circumferential length DMx on the pattern surface (first surface p1001) of the mask M and the linear distance Ds from the central point of the illumination region IR1001 to the central point of the illumination region IR1002 is Since it changes according to the radius r of the first surface p1001 and the angle α, the position of the fourth reflective surface p1009 of the second deflection member 1057 may be set based on the relationship of the graph of FIG.

  Even when the linear distance DFx on the substrate P and the circumferential length DMx on the mask M are substantially equal, the position of the fourth reflective surface p1009 of the second deflection member 1057 in the X direction may be optimally arranged. Finally, since submicron alignment may be difficult, residual components of several μm to several tens of μm or less are projected images using the image shift correction optical member 1045 shown in FIG. Can be made to match the linear distance DFx and the perimeter DMx with sufficient accuracy.

  In this manner, the projected image is slightly shifted in the X direction using the image shift correction optical member 1045, and the distance between two object points (peripheral length) in the scanning exposure direction in the mask pattern surface and the two object points The method of adjusting each of the projection modules PL1001 to PL1006 is equal to the previous figure so that the spacing distance (peripheral length) in the scanning exposure direction of each image point when projected onto the substrate P becomes equal in submicron order. The same applies to the device configurations of 2 to 6 and the device configuration of FIG. 7.

Fourth Embodiment
Next, a fourth embodiment will be described with reference to FIG. In FIG. 11, about the component similar to said each embodiment, the code | symbol same as said each embodiment may be attached | subjected, and the description may be simplified or abbreviate | omitted.

  FIG. 11 is a view showing the arrangement of an exposure apparatus EX as a substrate processing apparatus 1011. As shown in FIG. In the present embodiment, the configuration of the transfer apparatus 1009 for the substrate P is the same as the configuration of the transfer apparatus 1009 shown in FIG. The configuration of the substrate processing apparatus 1011 shown in FIG. 11 is different from the apparatus configurations shown in FIG. 2, FIG. 7 and FIG. 8 in that the mask M is not a rotating cylindrical mask but an ordinary transmission flat mask. The point is that the angle θ1001 with respect to the optical axis AX1003 (surface p1006) of the first reflection surface p1004 of the first deflection member 1050 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL is set to 45 °.

  In FIG. 11, a mask holding device 1012 includes a mask stage 1078 for holding a planar mask M and a moving device (not shown) for moving the mask stage 1078 along the X direction in a plane orthogonal to the central plane p1003. And

  Since the pattern surface of the mask M in FIG. 11 is a plane substantially parallel to the XY plane, each principal ray EL3 on the mask M side of the projection modules PL1001 to PL1006 is perpendicular to the XY plane, and each illumination on the mask M The optical axes (principal rays) of the illumination modules IL1001 to IL1006 for illuminating the regions IR1001 to IR1006 are also arranged to be perpendicular to the XY plane.

  In the present embodiment, the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 included in the first optical system 1041 of the projection modules PL1001 to PL1006 form an imaging light beam EL2 emitted from the first optical system 1041. Are arranged such that the chief ray EL3 of the lens is substantially parallel to the central plane p1003. That is, the first deflection member 1050 and the second deflection member 1057 included in each of the projection modules PL1001 to PL1006 are such that the chief ray EL3 traveling in the normal direction from the illumination regions IR1001 to IR1006 on the mask M is along the cylindrical surface. The imaging light beam EL2 is deflected so as to be incident on the projection areas PA1001 to PA1006 formed on the substrate P from the normal direction.

  Therefore, the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 are disposed to be orthogonal to each other, and both the first reflection surface p1004 and the second reflection surface p1005 have the first optical axis AX1003 (XY Plane) substantially at 45 °.

  Also, the third reflective surface p1008 of the second deflection member 1057 is non-planar symmetric to the fourth reflective surface p1009 with respect to a plane (parallel to the XY plane) that includes the second optical axis AX1004 and is orthogonal to the central plane p1003. It is arranged. The angle θ 1003 formed by the third reflective surface p 1008 with the second optical axis AX 1004 is substantially 45 °, and the angle θ 1004 formed by the fourth reflective surface p 1009 with the second optical axis AX 1004 is substantially less than 45 °. The setting of the angle θ1004 is as described in FIG.

  Furthermore, also in the present embodiment, as viewed in the XZ plane, the illumination area IR1002 from the center point of the illumination area IR1001 (and the IR1003 and IR1005) on the mask M (the first plane p1001) as in FIG. The distance to the center point of (and IR1004, IR1006) is from the center point of the projection area PA1001 (and PA1003, PA1005) on the cylindrical substrate P to the center point of the second projection area PA1002 (and PA1004, PA1006) The length (circumferential length) along the second cylindrical surface p1002 is set to be substantially equal.

  Also in the substrate processing apparatus 1011 shown in FIG. 11, the control device 1014 shown in FIG. 2 controls the moving device (a linear motor for scanning exposure, an actuator for fine movement, etc.) of the mask holding device 1012, The mask stage 1078 is driven in synchronization with the rotation of the drum member 1022. The substrate processing apparatus 1011 shown in FIG. 11 needs an operation (rewinding) to return the mask M to the initial position in the -X direction after performing scanning exposure by synchronous movement of the mask M in the + X direction. Therefore, when the second drum member 1022 is continuously rotated at a constant speed to continuously feed the substrate P at a constant speed, pattern exposure is not performed on the substrate P during the rewinding operation of the mask M, and the transport direction of the substrate P is The panel patterns are formed in a spattering (separating) manner. However, since the speed of the substrate P (in this case, the peripheral speed) at the time of scanning exposure and the speed of the mask M are assumed to be 50 to 100 mm / s in practice, the mask stage 1078 is used when the mask M is unwound. For example, by driving at the maximum speed of 500 mm / s, for example, it is possible to narrow the margin in the substrate transfer direction between the panel patterns formed on the substrate P.

Fifth Embodiment
Next, a fifth embodiment will be described with reference to FIG. In FIG. 12, about the component similar to said each embodiment, the code | symbol same as said each embodiment may be attached | subjected, and the description may be simplified or abbreviate | omitted.

  Although the mask M of FIG. 12 uses the cylindrical mask M similar to the previous FIG. 2, FIG. 7, and FIG. 8, a pattern is created with a high reflection portion and a low reflection (light absorption) portion for illumination light. It is configured as a reflective mask. Therefore, the transmission type illumination device 1013 (illumination optical system IL) as in each of the previous embodiments can not be used, and an incident light that projects illumination light from the projection modules PL1001 to PL1006 toward the reflective mask M. A configuration like an illumination system is required.

  In FIG. 12, the polarization beam splitter PBS and the 1⁄4 wavelength plate PK are provided between the first reflective surface p1004 of the first deflection member 1050 constituting the first optical system 1041 and the reflective mask M. In the configuration of each projection module shown in FIG. 6, the focus correction optical member 1044 and the image shift correction optical member 1045 are provided at that position, but in this embodiment, the focus correction optical member 1044 and the image shift correction The optical member 1045 is moved to the space in front of or behind the intermediate image plane p1007 (field stop 1043).

  The wavefront splitting surface of the polarization beam splitter PBS is at an angle α / 2 (θd) with respect to the central plane p1003 by an angle θ1001 (<45 °) with respect to the optical axis AX1003 (surface p6) of the first reflecting surface p1004 of the first deflection member 1050. ) Is disposed at about 45 ° with respect to the chief ray EL3 which is inclined in a radial direction (normal direction) from the illumination region IR1001 on the reflective mask M by tilting.

  The illumination light beam EL1 is emitted from, for example, a laser light source with good polarization characteristics, and becomes linearly polarized light (S-polarized light) through a beam shaping optical system, an illuminance equalizing optical system (fly eye lens, rod element, etc.), etc. It is incident on the beam splitter PBS. In the wavefront splitting surface of the polarization beam splitter PBS, most of the illumination light flux EL1 is reflected, and the illumination light flux EL1 is converted to circularly polarized light through the 1⁄4 wavelength plate PK to mount the illumination area IR1001 on the reflective mask M. Irradiate shape or rectangle.

  The light (imaging light flux) reflected by the pattern surface (first surface p1001) of the mask M is converted again into linearly polarized light (P polarized light) through the 1⁄4 wavelength plate PK, and wavefront division of the polarization beam splitter PBS Most of the light is transmitted through the surface toward the first reflective surface p 1004 of the first deflection member 1050. The configuration of the first reflective surface p1004 and subsequent components and the optical path of the imaging light beam (principal ray EL3) are the same as those described in FIG. 6 above, and the reflective portion appears in the illumination region IR1001 on the reflective mask M. The image of the pattern according to is projected into the projection area PA1001.

  As described above, in the present embodiment, only by adding the polarization beam splitter PBS and the quarter-wave plate PK to the first optical system 1041 of the projection module PL1001 (and PL1002 to PL1006), a reflective cylindrical mask can be obtained. Even then, the epi-illumination system can be easily realized. The illumination light beam EL1 is configured to be incident on the polarizing beam splitter PBS from a direction intersecting the direction of the chief ray EL3 of the imaging light beam reflected by the reflective mask M and directed to the reflective mask M. ing. Therefore, even if the extinction ratio (separation characteristics) of the P-polarized light and the S-polarized light of the polarization beam splitter PBS is somewhat small, a part of the illumination light flux EL1 as stray light is directly from the wavefront splitting surface of the polarization beam splitter PBS as the first deflection member The quality of the image (contrast etc.) projected and exposed onto the substrate P can be kept good and the faithful transfer of the mask pattern can be achieved without going to the first reflective surface p1004 of 1050 and the projection area PA1001 of the substrate P. .

Sixth Embodiment
FIG. 13 is a diagram showing the configuration of a projection optical system PL (first projection module PL1001) according to the sixth embodiment. The first projection module PL1001 includes a third deflection member (plane mirror) 1120, a first lens group (equal magnification projection) 1051, a first concave mirror 1052 disposed on the pupil plane, a fourth deflection member (plane mirror) 1121, and A fifth optical system (magnification projection system) 1122 is provided. The first surface p1001 on which the illumination region IR (first illumination region IR1001) is disposed is a pattern surface of the mask M (transmission or reflection) held by the cylindrical first drum member 1021, and It has become. In addition, the second surface p1002 on the substrate P on which the projection area PA (first projection area PA1001) is disposed is a plane here.
When the mask M held by the first drum member 1021 (mask support member) is of the reflection type as shown in FIG. 12, a polarization beam splitter and one between the mask M and the third deflection member 1120 are used. / A 4 wavelength plate is provided.

  In FIG. 13, the imaging light beam EL 2 emitted from the first illumination region IR 1001 is reflected by the fifth reflection surface p 1017 of the third deflection member 1120 and is incident on the first lens group 1051. The imaging light beam EL2 that has entered the first lens group 1051 is reflected by the first concave mirror 1052 and is turned back and emitted from the first lens group 1051 and enters the sixth reflective surface p1018 of the fourth deflection member 1121. The first lens group 1051 and the first concave mirror 1052 form an intermediate image of the pattern of the mask M appearing in the first illumination area IR1001 at the same magnification, as in the above embodiment.

  The imaging light beam EL2 reflected by the sixth reflection surface p1018 passes through the formation position of the intermediate image, enters the fifth optical system 1122, passes through the fifth optical system 1122, and reaches the first projection area PA1001. The fifth optical system 1122 re-forms an intermediate image formed by the first lens group 1051 and the first concave mirror 1052 on the first projection area PA 1001 with a predetermined magnification (for example, 2 times or more).

  13, the fifth reflection surface p1017 of the third deflection member 1120 corresponds to the first reflection surface p1004 of the first deflection member 1050 described in FIG. 6, and the sixth reflection surface p1018 of the fourth deflection member 1121 is: It corresponds to the second reflection surface p5 of the first deflection member 50 described in FIG.

  In the projection optical system shown in FIG. 13, the extension line of the chief ray EL3 between the third deflecting member 1120 and the mask M (cylindrical first surface p1001) is set to pass through the rotation center line AX1001 of the mask M. A principal ray EL3 of the imaging light beam EL2 between the second optical system 1122 having an optical axis AX1008 perpendicular to the surface (the second surface p1002) of the substrate P supported on a plane and the projection area PA1001 on the substrate P; It is set to be perpendicular to the two surfaces p1002, that is, to satisfy the telecentric imaging condition. In order to maintain such conditions, the projection optical system of FIG. 13 is provided with an adjusting mechanism which slightly rotates the third deflecting member 1120 or the fourth deflecting member 1121 in the XZ plane in FIG.

  The third deflecting member 1120 and the fourth deflecting member 1121 perform minute movement in the X-axis direction or Z-axis direction, and rotation about an axis parallel to the Z-axis, in addition to minute rotation in the YZ plane in FIG. You may make it the structure which enables micro rotation. In that case, the image projected in the projection area PA1001 can be slightly shifted in the X direction or can be slightly rotated in the XY plane.

  The projection module PL1001 is a magnification projection optical system as a whole, but may be an equal magnification projection optical system as a whole or may be a reduction projection optical system. In that case, since the first optical system including the first lens group 1051 and the first concave mirror 1052 is an equal magnification system, the projection magnification of the fifth optical system 1122 in the subsequent stage may be changed to equal magnification or reduction.

Modified Example of Sixth Embodiment
FIG. 14 is a view of the configuration of a modification using the projection optical system according to the sixth embodiment as viewed in the Y-axis direction, and FIG. 15 is a view of the configuration of FIG. 14 as viewed in the X-axis direction. The projection optical systems shown in FIG. 14 and FIG. 15 are arranged in the Y-axis direction, that is, in the axial direction of the rotation center axis AX1001 of the cylindrical mask M to arrange multiple images. It shows a modification.

  The projection optical system PL of the present modification includes a first projection module PL1001 and a second projection module PL1002, as shown in FIG. The second projection module PL1002 has a configuration similar to that of the first projection module PL1001, and is disposed in contrast to the first projection module PL1001 with respect to the central plane p1003 as shown in FIG. The directions are separated from each other as shown in FIG.

  The first projection module PL1001, as shown in FIG. 14, includes a third deflecting member 1120A, a first lens group 1051A, a first concave mirror 1052A, and a fourth deflecting member 1121A that receive the imaging light flux from the illumination region IR1001 on the mask M. And a fifth optical system (magnification imaging system) 1122A.

  In the projection module PL1001 shown in FIGS. 14 and 15, the inclination direction of the chief ray between the mask M and the third deflecting member 1120A is changed as compared with the respective projection optical systems (FIG. 6 and FIG. 13). . That is, the reflecting surface p1004 of the first deflecting member 1050 in FIG. 6 and the reflecting surface of the third deflecting member 1120 in FIG. 13 combine the chief ray EL3 from the illumination area IR1001 of the mask M with the first lens group 1051 (1051A). While the light is deflected at an obtuse angle (90 ° or more) so as to be parallel to the optical axis AX1003 of the first optical system configured by the first concave mirror 1052 (1052A), in the configuration of FIG. Is deflected at an acute angle (less than 90.degree.) Such that the chief ray EL3 from the lens is parallel to the optical axis of the first optical system.

  Similarly, as shown in FIG. 14, the second projection module PL1002 also receives a third deflecting member 1120B, a first lens group 1051B, a first concave mirror 1052B, a first concave group 1051B, which receives the imaging light flux from the illumination region IR1002 on the mask M. A fourth deflection member 1121B and a fifth optical system (magnification imaging system) 1122B are provided.

  The projection optical systems PL1001 and PL1002 shown in FIGS. 14 and 15 are, as a whole, a magnifying projection optical system, and as shown in FIG. 15, a mask M (first drum member 1021) on which the first illumination region IR1001 is disposed. The upper first area A1001 and the second area A1002 on the mask M (first drum member 1021) on which the second illumination area IR1002 is disposed are separated from each other in the Y direction. However, by appropriately setting the magnification of the projection optical systems PL1001 and PL1002, the third area A1005 (image area) of the first area A1001 projected onto the projection area PA1001 on the substrate P and the projection area on the substrate P The fourth area A 1006 (image area) of the second area A 1002 projected onto the PA 1002 is set to be partially superimposed in the Y direction when viewed in the YZ plane. As a result, the first area A1001 and the second area A1002 on the mask M (first drum member 1021) are formed to be connected in the Y direction on the substrate P, and a large panel pattern can be projected and exposed. .

  As described above, in the substrate processing apparatus provided with the projection optical system PL shown in FIGS. 14 and 15, the projection optical system shown in FIG. 13 is disposed symmetrically with respect to the central plane p1003 and the Y axis is The width dimension in the X direction of the entire projection optical system can be made compact, and the size in the X direction can be reduced as a processing device, as compared with the case where a plurality of directions are arranged.

  As described in FIG. 9 described above, in FIG. 14 viewed in the XZ plane, the circumferential length between the illumination area IR1001 and the illumination area IR1002 center points defined on the mask M (first drum member 1021) The distance DFx between DMx and the center points of the corresponding projection areas PA1001 and PA1002 on the substrate P is set to the relationship of DFx = Mp · DMx, where Mp is a magnification of the projection optical system.

Seventh Embodiment
FIG. 16 is a view showing the arrangement of a projection optical system according to the seventh embodiment. The imaging light beam EL2 from the first illumination region IR1001 formed on the cylindrical first surface p1001 (mask pattern surface) is incident on the sixth optical system 1131 and passes through the sixth optical system 1131 to the seventh deflection member The image forming light beam EL2 reflected by the ninth reflection surface p1022 of the (planar mirror) 1132 reaches an intermediate image surface p1007 where the first field stop 1043 is disposed, and an image of the pattern of the mask M is formed on the intermediate image surface p1007. Ru.

  The imaging light beam EL2 having passed through the intermediate image plane p1007 is reflected by the tenth reflecting surface p1023 of the eighth deflecting member (planar mirror) 1133, and is supported along the cylindrical second surface p1002 through the seventh optical system 1134. To the first projection area PA1001 on the substrate P. The first projection module PL1001 in FIG. 16 projects the image of the pattern of the mask M in the first illumination area IR1001 onto the first projection area PA1001 as an erected image.

  In FIG. 16, the sixth optical system 1131 is an equal magnification imaging optical system, and the optical axis AX1010 thereof is substantially coaxial with the chief ray of the imaging light beam EL2 passing through the center of the first illumination area IR1001. . In other words, the optical axis AX1010 is substantially parallel to the first radial direction D1001 shown in FIG. 4 or 7-9.

  The seventh optical system 1134 is an equal magnification imaging optical system, and re-forms an intermediate image formed by the sixth optical system 1131 on the first projection area PA1001. The optical axis AX1011 of the seventh optical system 1134 is substantially parallel to the first normal direction (radial direction) D1003 of the cylindrical second surface p1002 passing the center of the first projection area PA1001.

  In the present embodiment, the two deflection members 1132 and 1133 are arranged symmetrically with respect to the intermediate image plane p1007 in the XZ plane in FIG. For simplicity, an intermediate image plane can be formed at a position where the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 intersect, and a reflecting surface parallel to the YZ plane at the position of the intermediate image plane It is also conceivable to bend the light path by arranging a single plane mirror having. However, in the case where one plane mirror is used, the angle between the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 in the XZ plane in FIG. The angle between the reflection surface of one plane mirror and each of the optical axes AX1010 and AX1011 may be an acute angle of less than 45 °, and the imaging characteristics may be less preferable. For example, when the angle formed by the optical axes AX1010 and AX1011 is about 140 °, the angle formed by the reflection surface of one plane mirror and each of the optical axes AX1010 and AX1011 is 20 °. Therefore, when the light path is bent using two deflection members (plane mirrors) 1132 and 1133 as shown in FIG. 16, such a problem can be alleviated.

  In the configuration of FIG. 16, the sixth optical system 1131 may be an imaging lens with a magnifying power of Mf, and the seventh optical system 1134 may be an imaging lens with a demagnification of 1 / Mf, and the whole may be a projection system with equal magnification. . Conversely, the sixth optical system 1131 may be an imaging lens with a reduction ratio of 1 / Mf, and the seventh optical system 1134 may be an imaging lens with an enlargement ratio Mf, and may be a projection system with an equal magnification as a whole.

Eighth Embodiment
FIG. 17 is a view showing the arrangement of a projection optical system PL (first projection module PL1001) according to the eighth embodiment. The basic optical system configuration is the same as that of FIG. 16 above, except that two more deflecting members (plane mirrors) 1140 and 1143 are added.

  In FIG. 17, an eighth optical system 1135 corresponding to the imaging optical system 1131 in FIG. 16 is composed of the third lens 1139 and the fourth lens 1141 and the optical axis thereof is along the cylindrical first surface p1001. It is set to be substantially parallel to the chief ray of the imaging light beam EL2 emitted in the normal direction from the center of the first illumination area IR1001 on the mask M supported. A pupil plane of an eighth optical system 1135 is formed between the third lens 1139 and the fourth lens 1141, and an eleventh deflecting member (planar mirror) 1140 is provided at that position.

  The imaging light beam EL2 emitted from the first illumination region IR1001 and passing through the third lens 1139 is bent at an angle of 90 ° or close by the thirteenth reflecting surface p1026 of the eleventh deflecting member 1140 to form a fourth lens 1141. The incident light is reflected by the eleventh reflecting surface p1024 of the ninth deflecting member (plane mirror) 1136 corresponding to the deflecting member 1132 in FIG. 16 to reach the field stop 1043 disposed in the intermediate image plane p1007. Thereby, the eighth optical system 1135 forms an image of the pattern of the mask M appearing in the first illumination region IR1001 at the position of the intermediate image plane p1007.

  The eighth optical system 1135 is an equal magnification imaging optical system, and the intermediate image plane p1007 is configured to be orthogonal to the central plane p1003. Further, the optical axis of the third lens 1139 is substantially coaxial or coaxial with the chief ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (radial direction of the cylindrical first surface p1001). It is parallel.

  The ninth optical system 1138 in FIG. 17 has the same configuration as the eighth optical system 1135, and includes an eighth optical system 1135 and an intermediate image plane p1007 which includes the first field stop 1043 and which is substantially orthogonal to the central plane p1003. It is arranged symmetrically. The imaging light beam EL2 that has passed through the field stop 1043 via the eighth optical system 1135 and the ninth deflection member 1136 is reflected by the twelfth reflection surface p1025 of the tenth deflection member (plane mirror) 1137 to obtain the ninth optical system 1138 First projection area PA1001 on the substrate P supported along the cylindrical second surface p1002 through the fifth lens 1142 constituting, the twelfth deflection member 1143 arranged at the pupil position, and the sixth lens 1144 Reaching In the configuration of FIG. 17, the optical axis of the sixth lens 1144 substantially corresponds to the chief ray of the imaging light beam EL2 traveling in the normal direction (radial direction of the cylindrical second surface p1002) with respect to the first projection area PA1001. Set to be coaxial or parallel.

[Ninth embodiment]
FIG. 18 is a view showing the configuration of a projection optical system PL (first projection module PL1001) according to the ninth embodiment. The first projection module PL1001 in FIG. 18 is a so-called in-line type catadioptric projection optical system. The first projection module PL1001 includes a tenth optical system 1145 having an equal magnification of two, a fourth concave mirror 1146 and a fifth concave mirror 1147, a first field stop 1043 (intermediate image plane p1007), and FIGS. A second optical system 1122 as shown is provided.

  The tenth optical system 1145 forms an intermediate image of a pattern appearing in the first illumination region IR1001 on the mask M supported along the cylindrical first surface p1001 at the position of the field stop 1043. In the present embodiment, the tenth optical system 1145 is an equal-magnification optical system. Each of the fourth concave mirror 1146 and the fifth concave mirror 1147 is configured, for example, as a part of a spheroid. The spheroidal surface is a surface formed by rotating the ellipse around the major axis (X-axis direction) or the minor axis (Z-axis direction) of the ellipse.

  In the configuration of FIG. 18, the chief ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (radial direction) of the cylindrical first surface p1001 is the first surface when viewed in the XZ plane. It is set to be directed to the rotation center axis AX1001 of p1001 (first drum member 1021). That is, the chief ray of the imaging light beam EL2 directed from the mask M (first surface p1001) to the fourth concave mirror 1146 of the projection module PL1001 is inclined in the XZ plane with respect to the central plane p1003.

  The fifth optical system 1122 is, for example, a dioptric projection optical system as described with reference to FIG. 13, and the intermediate image formed at the position of the field stop 1043 by the tenth optical system 1145 is a planar second surface It projects onto a first projection area PA1001 on a substrate P supported along p1002.

  In the fourth concave mirror 1146 and the fifth concave mirror 1147 of the tenth optical system, the imaging light beam EL2 emitted in the normal direction from the first illumination area IR1001 passes through the fifth optical system 1122 to the first projection area PA1001. The imaging light beam EL2 is deflected so as to be incident from the linear direction. Similar to the substrate processing apparatus 1011 described in the above embodiment, the substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of the exposure failure and enables faithful projection exposure. The fifth optical system 1122 may be an equal-magnification projection optical system or a reduction optical system.

Tenth Embodiment
FIG. 19 is a diagram showing the configuration of a projection optical system PL (first projection module PL1001) of the tenth embodiment. The first projection module PL1001 of FIG. 19 is a refractive optical system that does not include a reflective member having power. The first projection module PL1001 includes an eleventh optical system 1150, a thirteenth deflecting member 1151, a first field stop 1043, a fourteenth deflecting member 1152, and a twelfth optical system 1153.

  In the present embodiment, the imaging light beam EL2 emitted from the first illumination region IR1001 on the mask M held along the cylindrical first surface p1001 is composed of a prism in the form of a wedge through the eleventh optical system 1150. The light is deflected in the XZ plane by the thirteenth deflection member 1151 to reach the first field stop 1043 disposed in the intermediate image plane p1007, where an intermediate image of the mask pattern is formed. Further, the imaging light beam EL2 having passed through the first field stop 1043 is deflected in the XZ plane by the fourteenth deflection member 1152 formed of a wedge-like prism, enters the twelfth optical system 1153, and The first projection area PA1001 on the substrate P supported along the cylindrical second surface p1002 is reached through.

  The optical axis of the eleventh optical system 1150 is, for example, substantially coaxial or coaxial with the chief ray of the imaging light beam EL2 emitted in the normal direction (radial direction of the cylindrical first surface p1001) from the center of the first illumination region IR1001. It is parallel. The twelfth optical system 1153 has the same configuration as the eleventh optical system 1150, and is symmetrical to the eleventh optical system 1150 with respect to the intermediate image plane p1007 (perpendicular to the central plane p1003) on which the first field stop 1043 is disposed. Are arranged. The optical axis of the twelfth optical system 1153 is set to be substantially parallel to the chief ray of the imaging light beam EL2 incident on the first projection area PA1001 along the normal line of the planar second surface p1002.

  The thirteenth deflection member 1151 has a ninth surface p1028 on which the imaging light beam EL2 having passed through the eleventh optical system 1150 is incident, and a tenth surface p1029 on which the imaging light flux incident from the ninth surface p1028 is emitted. It is disposed in front of or in front of the first field stop 1043 (intermediate image plane p1007). In the present embodiment, each of the ninth surface p1028 and the tenth surface p1029 forming a predetermined apex angle is inclined with respect to a plane (XY plane) orthogonal to the central plane p1003 and is a plane extending in the Y-axis direction. Configured

  The fourteenth deflecting member 1152 is a prism member similar to the thirteenth deflecting member 1151 and is disposed symmetrically with the thirteenth deflecting member 1151 with respect to an intermediate image plane p1007 in which the first field stop 1043 is positioned. The fourteenth deflecting member 1152 has an eleventh surface p1030 on which the imaging light beam EL2 having passed through the first field stop 1043 is incident, and a twelfth surface p1031 on which the imaging light EL2 incident from the eleventh surface p1030 is emitted. , Or the first field stop 1043 (intermediate image plane p1007).

  In the present embodiment, the thirteenth deflecting member 1151 and the fourteenth deflecting member 1152 cause the imaging light beam EL2 emitted in the normal direction from the first illumination area IR1001 to be incident on the first projection area PA1001 in the normal direction. To be biased. Similar to the substrate processing apparatus 1011 described in the above embodiment, the substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of the exposure failure and enables faithful projection exposure.

  The eleventh optical system 1150 or the twelfth optical system 1153 may be an enlargement projection system or a reduction projection system, but any one of the mask M and the substrate P may have a cylindrical surface (or When performing projection exposure while supporting along a circular arc surface), the distance between the field of view on the object plane side (circumferential long distance) and the final image plane between two projection modules separated in the circumferential direction of the cylindrical surface The ratio to the side of the distance between the projected fields (perimeter long distance) may be set to coincide with the projection magnification.

Eleventh Embodiment
FIG. 20 is a diagram showing the configuration of part of the device manufacturing system (flexible display manufacturing line) of the eleventh embodiment. Here, the flexible substrate P (sheet, film, etc.) pulled out from the supply roll FR1 sequentially passes through n processing apparatuses U1, U2, U3, U4, U5,. An example is shown until it is wound up to FR2. The host control device 2005 centrally controls each of the processing devices U1 to Un that constitute a manufacturing line.

  In FIG. 20, the orthogonal coordinate system XYZ is set so that the front surface (or the back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is set to the Y direction. Shall be The substrate P may be one obtained by modifying and activating the surface in advance by a predetermined pretreatment, or one having a minute partition structure (concave and convex structure) for precise patterning on the surface.

  The substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and conveyed to the processing device U1, but the center of the substrate P in the Y direction (width direction) is the target by the edge position controller EPC1. It servo-controls so that it may be settled in the range of about ± dozens μm to several tens of μm with respect to the position.

  The processing unit U1 is configured to continuously print photosensitive functional liquid (photoresist, photosensitive silane coupling agent, UV curable resin liquid, etc.) on the surface of the substrate P in the printing method, in the transport direction (longitudinal direction) of the substrate P It is an application device which applies selectively. A coating mechanism including an impression cylinder roller DR2 around which the substrate P is wound, a coating roller for uniformly applying a photosensitive functional liquid on the surface of the substrate P on the impression cylinder roller DR2, and the like in the processing device U1 Gp1 and a drying mechanism Gp2 for rapidly removing the solvent or moisture contained in the photosensitive functional liquid applied to the substrate P are provided.

  The processing apparatus U2 is a heating apparatus for heating the substrate P transferred from the processing apparatus U1 to a predetermined temperature (for example, several tens to about 120 ° C.) to stabilize the photosensitive functional layer applied on the surface. It is. In the processing unit U2, a plurality of rollers and an air turn bar for conveying the substrate P back and forth, a heating chamber HA1 for heating the carried-in substrate P, and a temperature of the heated substrate P A cooling chamber portion HA2 for lowering the temperature to be in line with the environmental temperature of the post process (processing device U3), a nipped drive roller DR3 and the like are provided.

  The processing apparatus U3 as a substrate processing apparatus is an exposure apparatus that irradiates the photosensitive functional layer of the substrate P transported from the processing apparatus U2 with ultraviolet patterning light corresponding to a circuit pattern or a wiring pattern for a display. is there. In the processing unit U3, an edge position controller EPC for controlling the center of the substrate P in the Y direction (width direction) at a fixed position, the nipped drive roller DR4, and the substrate P are partially wound with a predetermined tension. A rotary drum DR5 for supporting a portion to be subjected to pattern exposure on P in a uniform cylindrical surface shape, and two sets of drive rollers DR6, DR7, etc. for giving predetermined slack (play) DL to the substrate P are provided. ing.

  Furthermore, in the processing unit U3, a projection optical system for projecting an image of a portion of the mask pattern of the cylindrical mask M onto the cylindrical mask M and the portion of the substrate P supported in a cylindrical surface by the rotary drum DR5. Alignment microscopes AM1 and AM2 for detecting alignment marks and the like formed in advance on the substrate P are provided to relatively align (align) the substrate P with the image of a portion of the projected mask pattern and the PL It is done.

  In the present embodiment, since the cylindrical mask M is of a reflective type (the pattern of the outer peripheral surface is formed of the high reflection portion and the non-reflection portion), the optical element of a part of the projection optical system PL is An epi-illumination optical system is also provided which irradiates the exposure illumination light onto the cylindrical mask M. The configuration of the epi-illumination optical system will be described in detail later.

  The processing unit U4 is a wet processing unit that performs a wet developing process, an electroless plating process, and the like on the photosensitive functional layer of the substrate P transported from the processing unit U3. In the processing unit U4, three processing tanks BT1, BT2, and BT3 hierarchized in the Z direction, a plurality of rollers for bending and transporting the substrate P, and a drive roller DR8 nipped are provided.

  The processing unit U5 is a heating / drying unit that warms the substrate P transferred from the processing unit U4 and adjusts the moisture content of the substrate P wet by a wet process to a predetermined value, but the details will be omitted. Thereafter, after passing through several processing devices, the substrate P which has passed through the last processing device Un of the series of processes is wound up on the recovery roll FR2 through the nipped drive roller DR1. The edge position controller EPC2 controls the Y position of the drive roller DR1 and the recovery roll FR2 so that the center of the substrate P in the Y direction (width direction) or the substrate end in the Y direction does not vary in the Y direction. The relative position of the direction is sequentially corrected and controlled.

  As the substrate P used in the present embodiment, the same one as that exemplified in the first embodiment can be used, and the description will be omitted here.

  The device manufacturing system 2001 of the present embodiment repeatedly performs various processes for manufacturing one device on the substrate P. The substrate P on which various processes have been performed is divided into devices (dicing) to become a plurality of devices. The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (Y direction to be short) and 10 m or more in the length direction (long X direction).

  Next, the configuration of the processing apparatus U3 (exposure apparatus) of the present embodiment will be described. Before that, the basic configuration of the exposure apparatus of the present embodiment will be described with reference to FIGS.

  An exposure apparatus U3 shown in FIG. 21 is a so-called scanning exposure apparatus, which is a reflective cylindrical mask M having a circumferential surface with a radius r2001 from a rotation center axis AX2001, and a circumferential surface with a radius r2002 from a rotation center axis AX2002. And a rotary drum 2030 (DR5 in FIG. 1). Then, by rotating the cylindrical mask M and the rotating drum 2030 synchronously at a predetermined rotational speed ratio, an image of a pattern formed on the outer periphery of the cylindrical mask M is a part of the outer peripheral surface of the rotating drum 2030 Is repeatedly and repeatedly exposed on the surface of the substrate P (curved surface along the cylindrical surface) wound around.

  The exposure apparatus U3 is provided with a transport mechanism 2009, a mask holding mechanism 2012, an illumination optical system IL, a projection optical system PL, and a control device 2013, and is cylindrically held by the mask holding mechanism 2012 by the control device 2013. Control of rotational drive of the mask M and fine movement in the direction of the rotational center axis AX2001, or rotational drive of the rotary drum 2030 constituting part of the transport mechanism 2009 for transporting the substrate P in the longitudinal direction and control of the fine movement in the direction of the rotational center axis AX2002 Be done.

  The mask holding mechanism 2012 applies a rotational driving force around the rotation center axis AX2001 to the rotating drum 2020 on the outer peripheral surface of which a reflective mask M (mask pattern) is formed on the outer peripheral surface, or the direction of the rotation center axis AX2001 parallel to the Y axis. The drive transmission mechanisms 2021 and 2022 such as rollers, gears, and belts for finely moving the rotary drum 2020, a rotation motor for applying a necessary driving force to these drive transmission mechanisms 2021 and 2022, and a linear for fine movement And a first drive unit 2024 including a motor, a piezo element, and the like. Further, the rotational angle position of the rotary drum 2020 (mask M) and the position in the direction of the rotation center axis AX2001 are measured by a first detector 2023 including a rotary encoder, a laser interferometer, a gap sensor, etc. It is sent to the control device 2013 and used to control the first drive unit 2024.

  Similarly, in the rotary drum 2030, the rotational drive force around the rotation center axis AX2002 parallel to the Y axis and the rotation center axis AX2002 by the second drive unit 2032 including a rotation motor, a linear motor for fine movement, a piezoelectric element, and the like. Micropower is given in the direction of The rotational angle position of the rotary drum 2030 and the position in the direction of the rotational center axis AX2002 are measured by the second detector 2031 including a rotary encoder, a laser interferometer, a gap sensor, etc., and the measurement information is sent to the control device 2013 in real time. Is used to control the second drive unit 2032.

Here, in this embodiment, the rotation center axis AX2001 of the cylindrical mask M and the rotation center axis AX2002 of the rotary drum 2030 are parallel to each other and located in a center plane pc parallel to the YZ plane.
Then, the illumination area IR of the illumination light for exposure is set in a portion intersecting with the central plane pc on the cylindrical pattern surface p2001 where the cylindrical mask M is formed, and the cylinder along the outer peripheral surface p2002 of the rotary drum 2030 A projection area PA for projecting an image of a part of the mask pattern appearing in the illumination area IR is set at a portion intersecting the central plane pc on the substrate P wound in a shape.

  In this embodiment, the projection optical system PL emits the illumination light flux EL1 toward the illumination area IR on the cylindrical mask M, and the light flux (imaging light flux) EL2 that is reflected and diffracted by the mask pattern in the illumination area IR. In order to form an image of a pattern on the projection area PA on the substrate P, the illumination optical system IL is configured by an epi-illumination system in which a part of the optical path of the projection optical system PL is shared.

  As shown in FIG. 21, the projection optical system PL is inclined 45 ° in the XZ plane with respect to the central plane pc, and a prism mirror 2041 having reflection planes 2041a and 2041b orthogonal to each other, and light orthogonal to the central plane pc It has an axis 2015a and is provided with a second optical system 2015 configured of a concave mirror 2040 disposed on the pupil plane pd and a plurality of lenses.

  Here, assuming that a plane parallel to the XY plane including the optical axis 2015a is p2005, the angle θ2001 of the reflection plane 2041a based on the plane p2005 is + 45 °, and the angle of the reflection plane 2041b based on the plane p2005 Theta 2002 is -45 degrees.

  The projection optical system PL is telecentric as, for example, a half image field type of catadioptric projection optical system (a deformation type of the Dyson optical system) in which a circular image field is divided by upper and lower reflection planes 2041a and 2041b of the prism mirror 2041. Configured Therefore, the imaging light beam EL2 reflected and diffracted by the pattern in the illumination area IR is reflected by the upper reflection plane 2041a of the prism mirror 2041, passes through the plurality of lenses, and is disposed on the pupil plane pd We reach 2040 (which may be a plane mirror). Then, the imaging light beam EL2 reflected by the concave mirror 2040 passes through an optical path symmetrical with respect to the plane p2005, reaches the reflection plane 2041b of the prism mirror 2041, is reflected there and reaches the projection area PA on the substrate P, and the mask An image of the pattern is imaged on the substrate P at the same magnification (× 1).

In order to apply the epi-illumination method to such a projection optical system PL, in this embodiment, a passing portion (window) is formed in a part of the reflection surface p2004 of the concave mirror 2040 disposed on the pupil surface pd. The illumination light beam EL1 is configured to be incident from the side of the surface p2003 (glass surface) through the passing portion.
FIG. 21 shows only a part of the first optical system 2014 disposed behind the concave mirror 2040 in the illumination optical system IL of the present embodiment, and illumination from a light source, a fly eye lens, an illumination field stop, etc. Among the light, only the illumination light flux EL1 related to one point light source image Sf of many point light source images generated on the pupil plane pd is shown.

  The point light source image Sf is set in an optically conjugate relationship with the point light source image (light emitting point of the light source) formed on each emission side of the plurality of lens elements constituting the fly's eye lens, for example. The illumination region IR on the mask M is illuminated with a uniform illuminance distribution by the Koehler illumination method by the illumination light beam EL1 via the second optical system 2015 of the projection optical system PL and the upper reflection plane 2041a of the prism mirror 2041. .

  In FIG. 21, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is disposed coaxially with the optical axis 2015a of the projection optical system PL, and the illumination region IR on the cylindrical mask M is cylindrical. The width of the pattern surface p2001 in the circumferential direction is narrow, and is set in the shape of a slit elongated in the direction of the rotation center axis AX2001.

  As an example, assuming that the radius r2001 of the pattern surface p2001 of the cylindrical mask M is 200 mm and the thickness tf of the substrate P is 0.2 mm, the conditions for projection exposure are: radius r2002 of the outer peripheral surface of the rotary drum 30; It can be set to be = r 2001-tf (199.8 mm).

  In addition, the narrower the width of the illumination area IR (or the projection area PA) in the circumferential direction (the width in the scanning exposure direction), the more precise patterns can be projected and exposed to a fine pattern. It is necessary to increase the illuminance per unit area of How large the width of the illumination area IR (or projection area PA) is to be set is the radius r2001 and r2002 of the cylindrical mask M and the rotary drum 2030, the fineness of the pattern to be transferred (line width etc.), projection optics It is determined by considering the focal depth of the system PL, and the like.

  Now, in FIG. 21, assuming that the position on the reflecting surface p2004 of the concave mirror 2040 through which the optical axis 2015a passes is the central point 2044, the point light source image Sf deviates from the central point 2044 in the paper surface (XZ plane) in the −Z direction. In the imaging light beam EL2 (including diffracted light) reflected by the illumination region IR on the cylindrical mask M, the regular reflected light (0th-order diffracted light) has a central point on the reflecting surface p2004. Convergence is performed to form a point light source image Sf 'at a point symmetrical position with respect to 2044. Therefore, if a region including the portion where the point light source image Sf 'is located on the reflective surface p2004 and the portion around which ± 1st order diffracted light is distributed is used as the reflective portion, the imaging light flux EL2 from the illumination region IR is The projection area PA is reached through the plurality of lenses of the second optical system 2015 and the reflection plane 2041 b of the prism mirror 2041 with almost no loss.

  The concave mirror 2040 is formed by depositing a metallic reflective film such as aluminum on the concave surface of a concave lens made of a transmissive optical glass material (such as quartz) to form a reflective surface p2004, and usually the light of the reflective film The transmittance is very small. So, in this embodiment, in order to make illumination light flux EL1 enter from surface p2003 of the back side of reflective surface p2004, a part of reflective film which constitutes reflective surface p2004 is removed by etching etc., and converged illumination light flux EL1 passes ( Transparent) form possible windows.

  FIG. 22 is a view of such a reflection surface p2004 of the concave mirror 2040 as viewed from the X direction. In FIG. 22, in order to simplify the description, three window portions 2042a and 2042b are located on the reflective surface p2004 at a position deviated from the plane p2005 (parallel to the XY plane) including the optical axis 2015a in the -Z direction. , 2042c are provided separately in the Y direction. The window portions 2042a, 2042b, and 2042c are formed by removing the reflective film forming the reflective surface p2004 by selective etching, and in this case, the point light source images Sfa, Sfb, and Sfc (illumination luminous flux EL1a , EL 1 b, and EL 1 c) have a small rectangular shape that does not block the light, but other shapes (such as a circle, an ellipse, and a polygon) may be used. The three point light source images Sfa, Sfb, Sfc are produced by, for example, three lens elements arranged in the Y direction among a plurality of lens elements of a fly's eye lens provided in the illumination optical system IL.

  When viewed in the reflecting surface p2004, the positional relationship between the windows 2042a, 2042b, and 2042c is determined to be non-point-symmetrical, that is, a point-symmetrical to the center point 2044 (optical axis 2015a). . Although only three windows are shown here, even if more windows are created, the windows are set in an astigmatic positional relationship with each other with respect to the center point 2044.

  Then, when the illumination light beam EL1a from the point light source image Sfa generated in the window portion 2042a is substantially collimated and irradiated onto the illumination region IR of the cylindrical mask M, an imaging light beam which is the reflected diffraction light The EL 2 a converges as a point light source image Sfa ′ at a position on the reflecting surface p 2004 of the concave mirror 2040 in point symmetry with the window portion 2042 a with respect to the center point 2044.

  Similarly, the illumination light beams EL1b and EL1c from the point light source images Sfb and Sfc generated in the window portions 2042b and 2042c are also converted into substantially parallel light beams and are applied to the illumination region IR of the cylindrical mask M. The imaging light beams EL2b and EL2c, which are reflected lights, are converged as point light source images Sfb 'and Sfc' at positions symmetrical with respect to the window portions 2042b and 2042c with respect to the center point 2044 on the reflecting surface p2004 of the concave mirror 2040. .

  Further, as shown in FIG. 22, the imaging light beams EL2a, EL2b, EL2c to be the point light source images Sfa ', Sfb', Sfc 'include zeroth order diffracted light (regular reflection light) and ± first order diffracted light. However, the respective ± 1st-order diffracted lights DLa, DLb and DLc spread and distribute in the Z-axis direction and the Y-axis direction with the 0th-order diffracted light interposed therebetween.

  Furthermore, the point light source images Sfa ′, Sfb ′, and Sfc ′ (particularly, zeroth-order diffracted light) formed on the reflecting surface p2004 have a cylindrical surface with the illumination region IR of the cylindrical mask M, as shown in FIG. In the plane of the drawing (YZ plane), the shapes of the point light source images Sfa, Sfb, and Sfc to be the illumination light flux EL1 are distributed in a shape as stretched in the Z direction (the circumferential direction of the cylindrical mask).

  As shown in FIG. 22, when the point light source images Sfa, Sfb, and Sfc are located below the plane p2005 including the center point 2044 (optical axis 2015a) (in the -Z direction), the sheet is in the plane of FIG. In (in the XZ plane), the illumination light beam EL1 (EL1a, EL1b, EL1c) reaches the cylindrical mask M via the second optical system 2015 and the upper reflection plane 2041a of the prism mirror 2041. The illumination luminous fluxes EL1 (EL1a, EL1b, and EL1c) are parallel luminous fluxes immediately before the cylindrical mask M, but are slightly inclined with respect to the central plane pc. The amount of inclination corresponds to the amount of displacement in the Z direction from the central point 2044 (optical axis 2015a) of the point light source image Sf (Sfa, Sfb, Sfc) in the reflective surface p2004 (in the pupil plane pd).

  The imaging light beam EL2 (EL2a, EL2b, EL2c) reflected and diffracted in the illumination region IR has a symmetrical inclination with respect to the illumination light beam EL1 (EL1a, EL1b, EL1c) with respect to the central plane pc in the XZ plane. The light reaches the upper reflection plane 2041 a of the mirror 2041, is reflected there and enters the second optical system 2015, and reaches the portion of the reflection surface p2004 of the concave mirror 2040 above the plane p2005 (center point 2044).

  In the example shown in FIGS. 21 and 22 above, in the reflecting surface p2004 of the concave mirror 2040, on the lower side (−Z direction) below the plane p2005 parallel to the XY plane including the optical axis 2015a of the projection optical system PL, Although the point light source image (focusing point) Sf of the illumination light flux EL1 is distributed, the condition described above, that is, the mutual positional relationship of the window portions 2042 in the reflecting surface p2004 through which the point light source image of the illumination light flux passes The position of the point light source image Sf (window portion 2042) on the reflecting surface p2004 can be freely set as long as it is determined in a non-point-symmetrical relationship (asymmetrical relationship) with respect to the central point 2044.

  Under at least such conditions, when the window portion 2042 through which a large number of point light source images Sf serving as the source of the illumination light beam EL1 pass is formed on the reflective surface p2004 of the concave mirror 2040, the illumination light flux on the reflective surface p2004 (pupil surface pd) And the imaging light flux can be efficiently separated in space.

  The spatial separation between the illumination light flux and the imaging light flux is well maintained while uniformly distributing a large number of windows 2042 (point light source images Sfa, Sfb, Sfc... Of illumination light flux) in the reflecting surface p2004. Therefore, the sizes (±± first-order diffracted lights DLa, DLb, and DLc are also included on the reflecting surface p2004 of the point light source images Sfa ′, Sfb ′, and Sfc ′) formed by the convergence of the imaging light beam EL2. The size) may be set to be smaller than the distance between the adjacent windows 2042 in the Y and Z directions. In other words, the pupil plane pd of each of the point light source images Sfa, Sfb, Sfc,... Of the illumination light beam EL1 so as to make the individual dimensions of the window portions 2042a, 2042b, 2042c,. It is effective to reduce the internal dimensions as small as possible.

  In the present embodiment, a mercury discharge lamp, a metal halide lamp, an ultraviolet LED or the like can be used as a light source, but in order to narrow down the point light source images Sfa, Sfb, Sfc. A laser light source that emits light with a narrow oscillation wavelength band can be used.

  Here, an example of the configuration of the illumination optical system IL (first optical system 2014) shown in FIGS. 21 and 22 will be described with reference to FIG. Note that, in FIG. 23, the same members as the members and the like described in FIG. 21 and FIG. Further, in FIG. 23, the prism mirror 2041 in FIG. 21 is omitted, and the optical path between the illumination region IR on the cylindrical pattern surface p2001 of the cylindrical mask M and the second optical system 2015, and the rotating drum 2030. The optical path between the projection area PA on the outer peripheral surface (or the surface of the substrate P) p2002 and the second optical system 2015 is shown developed.

  As described above, the illumination optical system IL receives the light beam EL0 (illumination light beam EL0) from the light source to generate a large number of point light source images, and from each of the many point light source images Lens 2065 for superimposing the luminous flux of light on the illumination field stop (blind) 2064 and a lens system 2066 for guiding the illumination light passing through the aperture of the illumination field stop 2064 to the concave mirror 2040 of the projection optical system PL (second optical system 2015) And are provided. In order to apply the Koehler illumination method, the surface Ep on which the point light source image is generated on the exit side of the fly's eye lens 2062 depends on the glass material (concave lens shape) constituting the condenser lens 2065, the lens system 2066, and the concave mirror 2040. It is set to be conjugate to the pupil plane pd where the reflective surface is located.

  In the YZ plane, the center of the exit end of the fly's eye lens 2062 is disposed on the optical axis 2065a of the condenser lens 2065, and the center of the illumination field stop 2064 (opening) is disposed on the optical axis 2065a. Further, the illumination field stop 2064 is an illumination area IR (pattern surface p2001) on the cylindrical mask M by the lens system 2066, a glass material (concave lens shape) constituting the concave mirror 2040, and a plurality of lenses of the second optical system 2015. And optical conjugate plane 2014b.

  The optical axis 2014a of the first optical system 2014 of the illumination optical system IL is disposed coaxially with the optical axis 2015a of the projection optical system PL (second optical system 2015), but the optical axis 2065a of the condenser lens 2065 is the first With respect to the optical axis 2014a of the optical system 2014, it is decentered in the -Z direction in the paper surface (XZ plane) of FIG.

  Here, among the plurality of point light source images generated on the surface Ep on the exit side of the fly's eye lens 2062, two point light source images SPa and SPd located asymmetrically in the Z direction across the optical axis 2065a are taken as an example. Describe the behavior of the illumination light flux.

  The light flux from the point light source image SPa is collimated by the condenser lens 2065 into a substantially parallel light flux and illuminates the illumination field stop 2064. The illumination light beam EL1a transmitted through the opening (slit in the Y direction) of the illumination field stop 2064 converges as a point light source image Sfa in the window formed by the lens system 2066 on the reflection surface of the concave mirror 2040 of the projection optical system PL. Be done.

  The illumination light beam EL1a from the point light source image Sfa is, as described in FIG. 21, an illumination area IR on the cylindrical pattern surface p2001 of the cylindrical mask M via the second optical system 2015 of the projection optical system PL. To illuminate. The imaging light beam EL2a generated on the pattern surface p2001 by the irradiation of the illumination light beam EL1a from the point light source image Sfa reversely travels the second optical system 2015 to re-form the point light source image Sfa 'on the concave mirror 2040. In the pupil plane pd, the point light source image Sfa produced by the light beam from the illumination optical system IL and the point light source image Sfa ′ produced by the imaging light beam EL2a are located in a point-symmetrical relationship in the pupil plane pd.

  Similarly, the light flux from the point light source image SPd is converted into substantially parallel light flux by the condenser lens 2065 and illuminates the illumination field stop 2064. The illumination light beam EL1d transmitted through the opening of the illumination field stop 2064 is converged as a point light source image Sfd in the window formed on the reflection surface of the concave mirror 2040 by the lens system 2066. The illumination light beam EL1d from the point light source image Sfd illuminates the illumination region IR on the cylindrical pattern surface p2001 via the second optical system 2015. The imaging light beam EL2d generated on the pattern surface p2001 by the irradiation of the illumination light beam from the point light source image Sfd re-forms the point light source image Sfd 'on the concave mirror 2040 in the reverse direction of the second optical system 2015. In the pupil plane pd, the point light source image Sfd produced by the light beam from the illumination optical system IL and the point light source image Sfd 'produced by the imaging light beam EL2d are located in a point-symmetrical relationship in the pupil plane pd.

  The imaging light beams EL2a and EL2d formed point light source images Sfa 'and Sfd' on the reflection surface of the concave mirror 2040 are projected into the cylindrical projection area PA on the substrate P, and an image of the mask pattern in the illumination area IR Are imaged and projected into the projection area PA of the substrate P.

  FIG. 24 shows a configuration of a light source device 2055 for generating an illumination light beam EL0 incident on the fly's eye lens 2062 of the illumination optical system IL shown in FIG. The light source device 2055 includes a solid light source 2057, an expander lens (concave lens) 2058, a condenser lens 2059, and a light guide member 2060. The solid state light source 2057 includes, for example, a laser diode (LD), a light emitting diode (LED), and the like. The illumination light beam LB emitted from the solid state light source 2057 is converted into a divergent light beam by the expander lens 2058, and is condensed by the condensing lens 2059 on the incident end face 2060a of the light guide member 2060 with a predetermined convergence degree (NA).

  The light guiding member 2060 is, for example, an optical fiber or the like, and the illumination light beam LB incident on the incident end face 2060a preserves the NA (numerical aperture) and is emitted from the emission end face 2060b, and illumination approximately paralleled by the lens system 2061 (collimator) It is converted into luminous flux EL0. The lens system 2061 adjusts the light beam diameter of the illumination light beam EL0 so as to illuminate the entire incident side surface of the fly's eye lens 2062. The diameter of a single optical fiber is, for example, about 300 μm, but when the light intensity of the illumination light beam LB from the solid-state light source 2057 is large, a plurality of optical fibers may be tightly bundled.

  FIG. 25 is a view from the condenser lens 2065 side of the arrangement state of a large number of point light source images SP formed on the exit side surface Ep (parallel to the YZ plane) of the fly's eye lens 2062 in FIG. Assuming that the center point of the surface Ep on the exit side of the fly-eye lens 2062 in the YZ plane is 2062a, this center point 2062a is located on the optical axis 2065a of the condenser lens 2065.

  As shown in FIG. 25, the fly's eye lens 2062 of the present embodiment includes a plurality of lens elements 2062E arranged in a plane orthogonal to the optical axis 2065a of the condenser lens 2065. Each of the plurality of lens elements 2062E has a rectangular cross section elongated in the Y direction, and is tightly bundled in the Y direction and the Z direction. At the center of the exit end of each lens element 2062E, a point light source image (spot) SP is formed, which is a conjugate image of the exit end face 2060b of the light guide member 2060 (optical fiber) in FIG. Then, when viewed in the YZ plane, the plurality of lens elements 2062E are bundled so that the point light source images SP are astigmatically symmetrical with each other with respect to the center point 2062a (optical axis 2065a).

  In the example shown in FIG. 25, when the plane parallel to the XY plane is p2006 including the optical axis 2065a of the condenser lens 2065, the set of lens elements 2062E located on the + Z side of this plane p2006 is the upper lens element group When a set of lens elements 2062E located on the −Z side of the surface p2006 with 2062U is a lower lens element group 2062D, the dimension of the lens element 2062E in the Y direction is between the upper lens element group 2062U and the lower lens element group 2062D. The position is shifted by 1/2. As a result, the plurality of point light source images SP scattered in the upper lens element group 2062U and the plurality of point light source images SP scattered in the lower lens element group 2062D are parallel to the Y axis passing through the central point 2062a. The arrangement is also asymmetric with respect to the line.

  The sectional shape in the YZ plane of each lens element 2062E of the fly's eye lens 2062 is formed in a rectangular shape extending in the Y direction in order to match the slit shape of the illumination field stop 2064 in FIG. . This will be described with reference to FIG.

  FIG. 26 is a view of the illumination field stop 2064 in FIG. 23 as viewed in the YZ plane. A rectangular (or trapezoidal) opening 2064 A elongated in the Y direction is formed in the illumination field stop 2064, and a luminous flux from each point light source image SP of the fly's eye lens 2062 is illuminated by the condenser lens 2065. Above, it is superimposed as a rectangular illumination light flux EL1 including the opening 2064A. When the opening center of the opening 2064A is disposed on the optical axis 2065a of the condenser lens 2065, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is a position decentered in the + Z direction from the opening center of the opening 2064A. Pass through.

  FIG. 27 shows the state of the reflecting surface p2004 (arranged on the pupil plane pd) of the concave mirror 2040 that can be used for the distribution of the point light source image SP generated by the fly's eye lens 2062 of FIG. It is viewed from the optical system 2015 side. Since the reflecting surface p2004 of the concave mirror 2040 is conjugate with the surface Ep on the exit side of the fly's eye lens 2062, the distribution of the plurality of point light source images SP (lens elements 2062E) shown in FIG. In the pupil plane pd), the distribution of the point light source image Sf (black circle) in which the left and right and up and down are reversed is obtained.

  As described above with reference to FIG. 22, windows 2042 for transmitting a plurality of point light source images Sf are arranged on the reflecting surface p2004 of the concave mirror 2040 in a point-symmetrical manner with respect to the center point 2044 (optical axis 2015a). Be done. In the example of FIG. 27, the window portion 2042 is formed in a slit shape elongated in the Z direction so as to collectively transmit the illumination light beams from the plurality of point light source images Sf arranged in a line in the Z direction. Further, other than the slit-like window part 2042 in the reflective surface p2004, it is a high reflection part that efficiently reflects the imaging light flux from the pattern in the illumination area IR of the cylindrical mask M.

  The plurality of point light source images Sf are disposed non-symmetrically with respect to a plane p2005 that includes the optical axis 2015a of the second optical system 2015 and is orthogonal to the center plane pc (FIG. 21). The dimension of the direction is set narrow enough not to block the point light source image Sf. As described in FIG. 23, the luminous flux (illumination luminous flux EL1) from each of the plurality of point light source images Sf that has passed through the windows 2042 passes through the second optical system 2015 and the pattern surface p2001 of the cylindrical mask M The upper illumination area IR is superimposed and irradiated. Thereby, the illumination area IR is illuminated with a uniform illuminance distribution.

  The reflected light (imaging light beam EL2) from the mask pattern that appears in the illumination region IR of the pattern surface p2001 returns to the reflection surface p2004 of the concave mirror 2040, but the image formation light flux EL2 is again reflected by the reflection surface p2004. It becomes a light source image Sf 'and the separated distribution. As described in FIG. 22, the distribution of many point light source images Sf ′ (especially zero-order diffracted light) generated on the reflecting surface p2004 by the imaging light beam EL2 becomes many illumination light beams EL1 with respect to the central point 2044. The distribution of the point light source image Sf has a relationship of point symmetry.

  As shown in FIG. 27, the region on the reflecting surface p2004 in point-symmetrical relationship with the plurality of window portions 2042 in which a large number of point light source images Sf serving as a source of the illumination light beam EL1 are distributed is a high reflection portion. Therefore, the point light source image Sf ′ (including the first order diffracted light) re-imaged on the reflecting surface p2004 is reflected with almost no loss and reaches the substrate P.

Modification 1 of Eleventh Embodiment
Note that, in FIG. 27, the illumination light flux on the portion of the reflection surface p2004 of the concave mirror 2040 on the line intersecting the plane p2005 (parallel to the XY plane) including the optical axis 2015a of the projection optical system PL (second optical system 2015). Even when the point light source image Sf that is the source of the light source is located, the area where the point light source image Sf is located is the window 2042 as in the above arrangement condition, and the region symmetrical with the window 2042 with respect to the central point As a reflection part (light shielding part).

  However, when the point light source image Sf (window portion 2042) is located at the central point 2044, when the illumination light flux originating from the point light source image Sf illuminates the illumination area IR on the cylindrical mask M, the light is reflected there Since the formed imaging light beam converges to form a point light source image Sf 'at the center point 2044 (window portion 2042) of the reflecting surface p2004, it may not be an imaging light flux directed to the substrate P. From this, in order to prevent the point light source image Sf from being located near the center point 2044 of the reflecting surface p2004, the arrangement of the large number of lens elements 2062E constituting the fly's eye lens 2062 is changed. A light shielding film (inking) may be applied to the corresponding lens element 2062E.

  In this embodiment, as shown in FIGS. 25 and 27, the arrangement of the point light source image SP formed on the surface Ep on the exit side of the fly's eye lens 2062 (the arrangement of the lens elements 2062E) and the reflection of the concave mirror 2040 Although the arrangement of the window portions 2042 formed on the surface p2004 is matched on a one-on-one basis, this is not always necessary. That is, among a large number of point light source images SP formed on the surface Ep on the exit side of the fly-eye lens 2062, a part that can enter from the surface p2003 on the back side of the concave mirror 2040 and reach the reflective surface p2004 (pupil surface pd) With respect to the point light source image Sf, the light shielding surface may be left as it is, without providing the window portion 2042. The light shielding can also be realized similarly by forming a light shielding film or a light absorbing layer in the area on the rear surface p2003 of the concave mirror 2040 where the point light source image Sf to be shielded is located.

Modification 2 of Eleventh Embodiment
It is not necessary for the concave mirror 2040 to reflect all of the imaging light beam EL2 (a large number of point light source images Sf ′) incident on the concave mirror 2040 from the second optical system 2015 constituting the projection optical system PL. For example, in the reflecting surface p2004 of the concave mirror 2040, in addition to the transmissive window portion 2042 and the reflecting portion, a plurality of point light source images Sf serving as a source of the illumination light beam EL1 and a plurality of convergences of the imaging light beam EL2. A light shielding portion may be provided to shield a part of the point light source image of one or both of the point light source images Sf ′.

  The eleventh embodiment has been described above, but in the present embodiment, as shown in FIG. 21 or 22, illumination light from the illumination optical system IL is disposed on the pupil plane pd of the projection optical system PL. In the illumination area IR on the cylindrical mask M as the illumination light beam EL1 through the second optical system 2015 which is incident from the back side of the concave mirror 2040 and constitutes the projection optical system PL and the upper reflection plane 2041a of the prism mirror 2041 Reach.

  The imaging optical path of the projection optical system PL in this embodiment includes a first optical path from the illumination area IR (object plane) to the concave mirror 2040 (pupil plane pd) and a projection area PA (image plane) from the concave mirror 2040 (pupil plane pd) The first optical path doubles as an optical path for epi-illumination for guiding the illumination light flux from the illumination optical system IL to the illumination area IR.

  As described above, in the processing apparatus U3 (exposure apparatus) of the present embodiment, the illumination light flux and the imaging light flux are efficiently spatially separated by the reflecting mirror disposed in the pupil plane of the projection optical system PL or in the vicinity thereof. With such an epi-illumination system, the configuration of the apparatus can be simplified. Further, as compared with the system in which the illumination light flux and the imaging light flux are separated according to the difference in polarization state, there is no need to use a large polarization beam splitter, a wavelength plate or the like, and the apparatus configuration can be simplified.

  Furthermore, in the method of polarization separation of the illumination light flux and the imaging light flux, it is necessary to cope with the deterioration of the characteristic (contrast, aberration, etc.) of the projected image caused by the disturbance of the wave front by the wave plate and the problem of the extinction ratio in the polarization beam splitter. In the present embodiment, there is almost no characteristic deterioration of the projected image due to such a cause, and the occurrence of exposure failure can be suppressed. In addition, since the exposure apparatus U3 of this embodiment incorporates the epi-illumination method of irradiating the reflective mask M with the illumination light through a part of the optical path of the projection optical system, the illumination apparatus U3 illuminates the inside of the transmissive mask. In particular, the design freedom of the illumination optical system is increased as compared to the case where the optical system is incorporated.

  In this embodiment, since the light source device 2055 shown in FIG. 24 can reduce the size of the point light source image, it uses a laser light source (for example, excimer laser light such as KrF, ArF, XeF, etc.) having strong directivity of emitted light. Although it assumed that, it is not limited to it. For example, a lamp light source that emits bright line light such as g-line, h-line or i-line, or a laser diode or a light emitting diode (LED) with weak directivity of emitted light may be used.

  The device manufacturing system 2001 (FIG. 20) of this embodiment can simplify the configuration of the processing apparatus U3 (exposure apparatus), and therefore can reduce the manufacturing cost of the device. In addition, since the processing device U3 performs scanning exposure while transporting the substrate P along the outer peripheral surface p2002 of the rotary drum 2030, the exposure processing can be performed efficiently. As a result, the device manufacturing system 2001 can manufacture the device efficiently.

[12th embodiment]
Next, a twelfth embodiment will be described with reference to FIG. In this embodiment, the configuration of the fly's eye lens 2062 described in FIGS. 25 and 27 and the arrangement of the point light source image Sf formed in the reflecting surface p2004 of the concave mirror 2040 are modified. About the same component, the same numerals as the above-mentioned embodiment are attached, and the explanation is simplified or omitted.

  FIG. 28 shows, in the YZ plane orthogonal to the optical axis 2015a of the projection optical system PL, how the plurality of lens elements 2062E of the fly's eye lens 2062 are equivalently arranged in the reflective surface p2004 of the concave mirror 2040. It is the figure which looked at. The lens elements closest to the center point 2044 so that the plurality of lens elements 2062E (point light source image Sf) are in a point-symmetrical arrangement with each other with respect to the center point 2044 (optical axis 2015a) of the reflecting surface p2004 of the concave mirror 2040 The center of the 2062E is displaced from the center point 2044 in the Y and Z directions.

  Also in this embodiment, the cross-sectional shape (shape in the YZ plane) of each lens element 2062E of the fly's eye lens 2062 includes the rectangular opening 2064A of the illumination field stop 2064 as described in FIG. It is assumed that the ratio Py / Pz of the cross-sectional dimension Py in the Y direction to the cross-sectional dimension Pz in the Z direction is set to about 4 here. Therefore, a large number of point light source images Sf distributed in the reflective surface p2004 (the pupil plane pd) are also arranged at the pitch of the cross sectional dimension Py in the Y direction and at the pitch of the cross sectional dimension Pz in the Z direction.

  In the case of an ordinary fly eye lens, the centers of the respective lens elements 2062E are arranged in line in both the Y direction and the Z direction. However, in the present embodiment, the lens elements 2062E adjacent in the Z direction are ΔY in the Y direction. Displace one by one. When this displacement amount ΔY is about 1⁄4 of the cross-sectional dimension (arrangement pitch) Py of the lens element 2062E in the Y direction, each point light source image Sf is either ± 45 degrees or ± 135 degrees in the YZ plane. It will be located away in the direction of the sky.

  In FIG. 28, when four point light source images Sf located closest to the center point 2044 of the reflecting surface p2004 and surrounding the center point 2044 are specified, a region surrounded by the four point light source images Sf (in this case, an inclined rectangle ) Is displaced from the center point 2044. In other words, the barycentric position of the area surrounded by the four point light source images Sf is at a position different from that of the central point 2044. By setting the positional relationship between the concave mirror 2040 and the fly's eye lens 2062 in the YZ plane so that such a displacement occurs, each point light source image Sf is in an astigmatic relationship with each other with respect to the center point 2044. It can be arranged. This means that an area on the reflecting surface p2004, which has a point-symmetrical relationship with each point light source image Sf with respect to the center point 2044, can always be used as a reflecting portion.

  According to the distribution of the point light source image Sf arranged as described above, a window 2042 for transmitting each point light source image Sf is formed in the reflecting surface p2004 of the concave mirror 2040, but the shape of the window, Several forms are conceivable for the dimensions and arrangement. Simply, as shown in FIG. 28, circular window portion 2042H that transmits only one point light source image Sf is distributed over the entire surface of reflecting surface p2004 in accordance with the arrangement of point light source image Sf. .

  As another form, a slot-like window portion 2042 K may be used to collectively transmit all point light source images Sf aligned in a row in the 45 ° oblique direction with respect to the Y direction on the reflective surface p 2004. When the illumination light flux originating from a series of point light source images Sf located in the window portion 2042 K illuminates the illumination area IR of the cylindrical mask M, the reflected light flux (imaging light flux) is a reflection surface of the concave mirror 2040 On p2004, a point light source image Sf '(including a first-order diffraction image) is converged in the reflection area 2042K' displaced from the window part that transmits the point light source image Sf. Alternatively, the window portion 2042L may have an oval shape (or a gourd shape) in which two point light source images Sf aligned in the 45 ° oblique direction with respect to the Y direction are combined and collectively transmitted. The window portions 2042H, 2042K, and 2042L are formed as small as possible without partially blocking the illumination light from the point light source images Sf.

  In the above twelfth embodiment, the displacement amount ΔY of the lens element 2062E of the fly's eye lens 2062 in the Y direction can be set arbitrarily, and the ratio Py / Pz of the cross sectional dimensions of the lens element 2062E does not necessarily have to be an integral multiple. .

13th Embodiment
A thirteenth embodiment will now be described with reference to FIG. Similarly to FIG. 28, the present embodiment relates to the configuration of the fly's eye lens 2062 and modification of the arrangement of the point light source image Sf formed in the reflecting surface p2004 of the concave mirror 2040. In the configuration of FIG. 29, the centers of the plurality of lens elements 2062E of the fly's eye lens 2062 are linearly arranged in the Y and Z directions in the YZ plane.

  In the case of such a fly's eye lens 2062, point light source images Sf formed on the exit side of each lens element 2062E are arranged at a pitch of cross-sectional dimension Py in the Y direction and are arranged at a pitch of cross-sectional dimension Pz in the Z direction. Ru. Even in such a case, as described in the twelfth embodiment of FIG. 28, four point light source images located in the immediate vicinity of the center point 2044 (optical axis 2015 a) of the reflecting surface p2004 of the concave mirror 2040 and surrounding the center point 2044 When focusing on Sfv1, Sfv2, Sfv3 and Sfv4, the barycentric position Gc of the area (rectangle) surrounded by the four point light source images Sfv1 to Sfv4 is displaced from the central point 2044. In other words, the gravity center position Gc is at a position different from the center point 2044.

  By setting the positional relationship between the concave mirror 2040 and the fly's eye lens 2062 in the YZ plane so that such a displacement occurs, all point light source images Sf are in an astigmatic relationship with each other with respect to the central point 2044. It can be arranged. Therefore, the area on the reflecting surface p2004 which is in point-symmetrical relation with each point light source image Sf with respect to the center point 2044 can always be a reflecting portion.

  In the reflecting surface p2004 of the concave mirror 2040 of this embodiment, circular window portions 2042H for transmitting the point light source images Sf individually are formed in accordance with the arrangement pitch of the lens elements 2062E (point light source images Sf). It is done.

Fourteenth Embodiment
A fourteenth embodiment will now be described with reference to FIG. Similar to FIGS. 28 and 29, this embodiment also relates to a modification of the configuration of the fly's eye lens 2062 and the arrangement of the point light source image Sf formed in the reflecting surface p2004 of the concave mirror 2040. In the configuration of FIG. 30, a plurality of lens elements 2062E (a cross-sectional shape is a rectangle elongated in the Y direction) of the fly's eye lens 2062 are arranged in the Y direction at a pitch of cross sectional dimension Py, and densely in the Z direction at a pitch of cross sectional dimension Pz. Although arranged, the lens elements 2062E groups for one row arranged in the Y direction are arranged by changing (shifting) the positions in the Y direction alternately by Py / 2 for each row in the Z direction.

  In the case of the fly's eye lens 2062, the point light source image Sf is generated on the exit end side of all the lens elements 2062E that receive the illumination light (for example, EL0 in FIG. 24) from the light source. A light shielding body 2062s is formed on the corresponding lens element 2062E so as to shield one of the two point light source images Sf in a point-symmetrical arrangement relationship with each other with respect to the center point 2044 of the reflecting surface p2004 of the concave mirror 2040.

  In the configuration of FIG. 30, a light shielding member 2062s (a metal thin film or the like) corresponding to the lens element 2062E so that the selected point light source image Sf is randomly and uniformly distributed in the reflecting surface p2004 of the concave mirror 2040. Is formed. Also when using such a fly's eye lens 2062, as shown in FIG. 30, a circular window portion 2042H for transmitting the point light source image Sf is formed on the reflecting surface p2004 of the concave mirror 2040.

[Fifteenth embodiment]
Next, a fifteenth embodiment will be described with reference to FIG. In this embodiment, a large number of point light source images Sf are formed in the reflecting surface p2004 of the concave mirror 2040 by the light source image forming unit without using the fly's eye lens 2062 described so far. FIG. 31 shows a cross section of the concave mirror 2040 in a plane parallel to the XZ plane and including the optical axis 2015a (center point 2044), and on the reflective surface p2004 on which the point light source image Sf (Sfa) is located, window portions 2042H respectively. Is formed.

  The concave mirror 2040 has a reflection film formed on the concave side of a base material made of, for example, fine ceramics or glass ceramics having a low coefficient of thermal expansion. A plurality of windows 2042H are formed on the reflection film according to the same conditions as the previous embodiments, and in this embodiment, the base material behind the windows 2042H is a part of the illumination optical system IL A through hole (diameter of about 1 mm) for passing the optical fiber Fbs is formed.

  The exit end of each optical fiber Fbs functions as a point light source image, and is installed on substantially the same plane as the reflective surface p2004. The illumination light (e.g., EL1a) projected from the exit end of the optical fiber Fbs is set such that the illumination light emitted to the incident end of each optical fiber Fbs has a predetermined numerical aperture (divergence angle characteristic). Also, the direction of the illumination light flux from the exit end of each optical fiber Fbs is set to match the direction of the chief ray passing through the exit end (point light source image).

  In the configuration shown in FIG. 31, in order to generate each of a large number of point light source images Sf at the exit end of the optical fiber Fbs without using the fly eye lens 2062, an optical fiber corresponding to the number of windows 2042H is required. The system from the light source to the concave mirror 2040, that is, the entire illumination optical system IL can be made compact.

  The concave mirror 2040 is provided with small holes through which the exit end of the optical fiber Fbs passes. In each of the small holes, a thin light pipe (cylindrical rod) made of quartz or the like is embedded and each of the light pipes is An ultraviolet light emitting diode (LED) with a condenser lens may be installed on the incident end side of the light source, and the emission end side of each light pipe may be aligned with the reflecting surface p2004 of the concave mirror 2040.

Sixteenth Embodiment
A sixteenth embodiment will now be described with reference to FIGS. 32A and 32B and FIGS. 33A, 33B and 33C. In the present embodiment, instead of the fly's eye lens 2062 in the illumination optical system IL, a rod lens (prismic glass or quartz) is used to uniformly illuminate the illumination region IR on the cylindrical mask M.

  32A is a plan view of an optical path from a light guide member 2060 (optical fiber) for guiding light of a light source to the projection optical system PL (second optical system 2015) as viewed from the Y-axis direction. FIG. 32B is an optical path of FIG. Is a plan view from the Z-axis direction. In FIGS. 32A and 32B, the optical path configuration from the illumination field stop 2064 to the projection optical system PL is the same as the configuration of FIG. 23 described above, and thus the description thereof will be omitted.

  The illumination optical system IL shown in FIGS. 32A and 32B includes the light guide member 2060, the condenser lens 2093, the rod lens 2094, the illumination field stop 2064, the lens system 2066 and the like described in FIG. The configuration of the projection optical system PL (second optical system 2015) after the concave mirror 2040 is the same as that shown in FIGS.

  The illumination light beam EL 0 emitted from the light guide member (optical fiber) 2060 is converged by the condensing lens 2093 to the incident end face 2094 a of the rod lens 2094 or in the vicinity thereof. The sectional shape (incident end face 2094a, exit end face 2094b) along the YZ plane of the rod lens 2094 is formed in a rectangular shape including the trapezoidal or rectangular opening 2064A (FIG. 26) of the illumination field stop 2064. The cross-sectional shape is substantially similar to the cross-sectional shape of the lens element 2062E of the fly's-eye lens 2062 shown in FIGS. 25 and 28 to 30 described above.

  In the case of using the rod lens 2094, the illumination light beam EL0 converged at the incident end face 2094a is internally formed many times between the side surface 2094c parallel to the XZ plane and the side surface 2094d parallel to the XY plane inside the rod lens 2094 The reflection is repeated to advance to the exit end face 2094 b. In the case of a rod lens, it is the exit end face 2094b that the illuminance distribution of the illumination light is most uniform, but the uniformity becomes better as the number of repetitions of internal reflection increases. Therefore, the exit end face 2094 b is arranged in agreement with the plane 2014 b conjugate with the illumination area IR on the cylindrical mask M.

  Since the rod lens 2094 of the present embodiment has a rectangular cross section, the number of reflections of the illumination light between the opposing side surfaces 2094 c is smaller than the number of reflections of the illumination light between the opposing side surfaces 2094 d. The length or the like of the rod lens 2094 is set such that the number of times the illumination light beam EL0 is reflected by the inner surface of the rod lens 2094 is twice or more from the viewpoint of improving the illuminance uniformity. In addition, since the shape of the emission end face 2094 b of the rod lens 2094 defines the outer edge of the illumination area IR, the illumination field stop 2064 may be omitted.

  Assuming that a line connecting a central point of the incident end face 2094a of the rod lens 2094 in the YZ plane and a central point of the exit end face 2094b in the YZ plane is a central axis AX2003, the central axis AX2003 is a projection optical system PL Is parallel to the optical axis 2015a (the optical axis 2014a of the lens system 2066), but decentered in the Z direction. Furthermore, the exit end of the light guide member 2060 is disposed on the optical axis 2093a of the condensing lens 2093, but the optical axis 2093a is disposed displaced in the -Y direction with respect to the central axis AX2003 of the rod lens 2094 Be done.

  Due to the displacement in the -Y direction, a large number of point light source images Sf generated in the reflecting surface p2004 of the concave mirror 2040 can be arranged astigmatically with respect to the center point 2044 (optical axis 2015a) of the reflecting surface p2004. . That is described in detail in FIGS. 33A to 33C. 33A shows the condenser lens 2093 in the X-axis direction from the exit end face 2094b side of the rod lens 2094, FIG. 33B shows the rod lens 2094 in the X-axis direction from the lens system 2066 side, and FIG. It is the figure which looked at the reflective surface p2004 of from the X-axis direction.

  As shown in FIG. 33A, the cross section of the rod lens 2094 is a rectangle defined by the side surface 2094d parallel to the XY plane and the side surface 2094c parallel to the XZ plane, and the central axis AX2003 of the rod lens 2094 and the condenser lens 2093 The optical axis 2093a of is relatively decentered in the Y direction. Further, as shown in FIG. 33B, the central axis AX2003 of the rod lens 2094 is decentered in the Z direction with respect to the optical axis 2014a (2015a) of the lens system 2066.

  In such a configuration, the concave lens serving as the base material of the concave mirror 2040 and the lens system 2066 are the Fourier transform surface (pupil surface pd) of the surface 2014b on which the exit end face 2094b of the rod lens 2094 is located, the reflecting surface p2004 of the concave mirror 2040 To form. Therefore, as shown in FIG. 33C, many point light source images Sf are formed with a pitch DSy in the Y direction and a pitch DSz in the Z direction on the reflective surface p2004 of the concave mirror 2040. The point light source images Sf appear as virtual images of spot images of the illumination light flux EL0 converged at the incident end face 2094a of the rod lens 2094.

  The plurality of point light source images Sf have a rectangular cross section of the rod lens 2094, so the pitch DSy of the arrangement of the point light source images Sf in the direction (Y direction) parallel to the long side of the cross section is parallel to the short side. The pitch DSz of the array of point light source images Sf in the direction (Z direction) is longer. Further, as shown in FIGS. 32A and 32B, since the number of internal reflections of the illumination light in the rod lens 2094 is larger in the Z direction than in the Y direction, it is generated on the reflective surface p2004 of the concave mirror 2040. The number of point light source images Sf is also greater in the Z direction than in the Y direction. In the example of FIG. 33C, five point light source images Sf are arranged in the Z direction, and three point light source images Sf are arranged in the Y direction.

  Furthermore, the distribution of the point light source image Sf generated on the reflecting surface p2004 of the concave mirror 2040 by decentering the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condensing lens 2093 relatively in the Y direction is As a whole, the center point 2044 (optical axis 2015a) is decentered in the Y direction, and each of the point light source images Sf can be arranged in an astigmatic relationship with each other with respect to the center point 2044.

  Similar to the embodiment shown in FIG. 27, in the reflection surface p2004 of the concave mirror 2040, a slot-like window portion 2042 for transmitting a plurality of point light source images Sf aligned in a line in the Z direction collectively in the Y direction Three rows are formed at a pitch DSy. The width in the Y direction of each window portion 2042 is set as small as possible without blocking the illumination light flux having the point light source image Sf as a source. The slot-like windows 2042 are also formed in a point-symmetrical arrangement with respect to the center point 2044.

  In the configuration of FIG. 33C, the distance (Yk) from the point light source image Sf closest to the center point 2044 (optical axis 2015a) to the center point 2044 on the reflective surface p2004 (pupil plane pd) of the concave mirror 2040 (Yk) Is less than half of the interval (Yw) between the window portions 2042 aligned in the Y direction, that is, Yk <(Yw / 2), the light of the central axis AX2003 of the rod lens 2094 and the light of the condenser lens 2093 The amount of eccentricity of the shaft 2093a in the Y direction is set.

  As described above, when the point light source image Sf serving as the source of the illumination light beam EL1 for irradiating the illumination region IR of the cylindrical mask M is disposed on the reflection surface p2004 (pupil surface pd) of the concave mirror 2040, the cylindrical light source M As shown in FIG. 33C, on the reflecting surface p2004, the imaging light beam EL2 generated from the illumination area IR of the second light source is a diffracted image Sf ′ of the point light source image Sf (including 0th-order light and ± 1st-order diffracted light). Distribution. On the reflective surface p2004, the diffraction image Sf 'and the point light source image Sf that is the source of the illumination light beam EL1 are point symmetric with respect to the central point 2044.

  In the present embodiment, since the relationship between the distance Yk and the interval Yw is set to Yk <(Yw / 2), a plurality of light beams generated on the concave mirror 2040 (pupil surface pd) by the imaging light beam EL2 Diffraction images Sf ′ are formed on the reflecting portions which are both deviated from the window portion 2042. In this manner, the imaging light beam EL2 is reflected by the reflection portion of the concave mirror 2040 with almost no loss, and as shown in FIG. 21, the projection area on the substrate P held along the outer peripheral surface p2002 Projected to PA.

  As described above, even in the case of using the rod lens 2094, the convergence position of the illumination light beam EL0 on the incident end face 2094a of the rod lens 2094 is displaced from the central axis AX2003, whereby each of the multiple point light source images Sf can be The center point 2044 of the reflecting surface p2004 of the concave mirror 2040 can be set in an astigmatic relationship with each other.

Seventeenth Embodiment
Next, the configuration of a processing apparatus (exposure apparatus) U3 according to the seventeenth embodiment will be described with reference to FIGS. 34 and 35. In the exposure apparatus of the present embodiment, the dimension of the pattern area of the cylindrical mask M in the Y direction and the dimension of the pattern exposure area on the substrate P in the Y direction are illuminated by the projection optical system PL shown in FIG. In order to correspond to being larger than the dimension of the region IR and the projection region PA in the Y direction, the plurality of projection optical systems are arranged in the Y direction to widen the effective exposable range in the Y direction.
For that purpose, it is necessary to project the pattern of the cylindrical mask M on the substrate P as an erect image. In the projection optical system PL shown in FIG. 21, the X direction of the mask pattern image projected onto the substrate P is erected, but is reversed with respect to the Y direction. Therefore, by providing projection optical systems of the same configuration in tandem (serial), the projection image in which the Y direction is reversed is again inverted in the Y direction, and as a result, in the projection area PA on the substrate P Make an erect image in both the direction and the Y direction.

  FIG. 34 shows a schematic configuration of the entire exposure apparatus according to the present embodiment, and FIG. 35 shows an arrangement relationship between the illumination area IR and the projection area PA by each of the plurality of projection optical systems. , And the coordinate system set in the embodiment of FIG. 21 above. The same reference numerals are given to the members equivalent to the members and elements of the exposure apparatus shown in FIG. 21 and FIG.

  The substrate P conveyed from the upstream of the conveyance path is wound around a part of the outer peripheral surface of the rotary drum 2030 via a conveyance roller, a guide member, etc. (not shown), and then a guide member, conveyance roller, etc. It is transported downstream via The second driving unit 2032 rotationally drives the rotating drum 2030 clockwise around the rotation center axis AX 2002, and the substrate P is sent at a constant speed. The projection areas PA2001 to PA2006 of the six projection optical systems PL2001 to PL2006 are located on the portion of the cylindrical outer peripheral surface of the rotary drum 2030 where the substrate P is wound. Six illumination areas IR2001 to IR2006 are set on the outer peripheral surface (cylindrical mask pattern surface) of the cylindrical mask M corresponding to each of the six projection areas PA2001 to PA2006.

  The six projection optical systems PL2001 to PL2006 all have the same optical configuration, and are parallel to a central plane pc (YZ plane parallel to the YZ plane) including the rotation center axis AX2001 of the cylindrical mask M and the rotation center axis AX2002. ), The projection optical systems PL2001, PL2003, PL2005 (collectively referred to as odd-numbered projection optical systems PLo) installed on the left side (−X direction) and the projection optical systems installed on the right side (+ X direction) It is divided into PL 2002, PL 2004, and PL 2006 (collectively referred to as even-numbered projection optical system PLe).

  The projection optical systems PL2001 to PL2006 of the present embodiment include the projection optical systems PL shown in FIG. 21 and the illumination optical systems IL2001 to IL2006 for epi-illumination. Since the configuration is the same as that of FIG. 21, the projection optical system PL2001 and the illumination optical system IL2001 will be briefly described as a representative. The illumination optical system IL2001 receives the illumination light beam EL0 from the light source device 2055 from the back side of the concave mirror 2040 disposed on the pupil plane of the upper unit of the projection optical system PL2001 (the projection optical system PL similar to FIG. 21). , And generates many point light source images Sf on the reflection surface p2004. The illumination light beam EL1 whose source is the point light source image Sf is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041 and illuminates the illumination region IR2001 on the outer peripheral surface of the cylindrical mask M.

The imaging light beam EL2 reflected from the mask pattern in the illumination area IR 2001 is reflected by the reflection plane 2041a, then reflected by the concave mirror 2040, and reflected by the lower reflection surface (2041b) of the prism mirror 2041. An aerial image (intermediate image) of the mask pattern is formed on the plane p2007 (intermediate image plane p2007).
The projection unit at the rear stage of the projection optical system PL2001 is also a half field equal magnification catadioptric projection system provided with a prism mirror, a plurality of lens elements, a concave mirror 2078 arranged on the pupil plane, etc. The imaging light beam EL2 on which the intermediate image is formed is reflected by the concave mirror 2078 and then reflected by the reflection plane 2076b on the lower side of the prism mirror (2076) to reach the projection area PA2001 on the substrate P and into the projection area PA2001. Produces an erect image of the mask pattern. It is to be noted that the projection unit on the rear stage of the projection optical system PL2001 (from the intermediate image plane to the projection area) only needs to re-form the intermediate image formed on the intermediate image plane p2007 on the projection area PA2001 on the substrate P. On the reflection surface of the concave mirror 2078, the window portion 2042 formed on the reflection surface p2004 of the concave mirror 2040 is not provided.

  Since the projection optical system PL2001 having the above configuration (same as the other projection optical systems PL2002 to PL2006) is a projection system of a so-called multi-lens system, illumination is performed as shown in the projection optical system PL of FIG. The chief ray passing through the central point in the region IR and the chief ray passing through the central point in the projection region PA 2001 may not be able to be arranged in the central plane pc.

  Therefore, as shown in FIG. 34, the projection optical system PL2001 (PL2003, PL2005 is also the same, so that the extension line D2001 of the chief ray passing through the center point in the illumination region IR2001 is directed to the rotation center axis AX2001 of the cylindrical mask M. The angle θ 2001 (see FIG. 21) of the reflection plane 2041 a of the prism mirror 2041 of the upper projection unit of the above is set to a value other than 45 °. Similarly, the reflection plane 2076 b of the prism mirror 2076 of the lower projection unit of the projection optical system PL 2001 so that the extension line D 2001 of the chief ray passing through the center point in the projection area PA 2001 is directed to the rotation center axis AX 2002 of the rotary drum 2030. The angle of is set to a value other than 45.degree. With respect to the XY plane.

  The same applies to the projection optical system PL2002 (the same as PL2004 and PL2006) arranged symmetrically with respect to the projection optical system PL2001 with respect to the central plane pc, and the extension line D2002 of the chief ray passing through the central point in the illumination region IR2002 is a cylinder. Θ of the reflection plane 2041a of the reflection plane 2041a of the prism mirror 2041 of the upper projection unit is set to a value other than 45 ° toward the rotation center axis AX2001 of the mask M and a chief ray passing through the center point in the projection area PA2002 The angle of the reflection plane 2076 b of the prism mirror 2076 in the projection unit in the rear stage is set to a value other than 45 ° with respect to the XY plane so that the extension line D 2002 of the light beam is directed to the rotation center axis AX 2002 of the rotary drum 2030.

  As described above, the odd-numbered projection optical system PLo and the even-numbered projection optical system PLe in which the extension lines D2001 and D2002 of the chief ray are symmetrically inclined with respect to the central plane pc are viewed in the XZ plane. Are arranged symmetrically with respect to Y. However, when viewed in the XY plane, they are arranged offset in the Y direction. Specifically, each projection is performed so that the illumination areas IR2001 to IR2006 formed on the pattern surface of the cylindrical mask M and the projection areas PA2001 to PA2006 formed on the substrate P have the arrangement relationship shown in FIG. Optical systems PL2001 to PL2006 are installed.

  FIG. 35 is a view of the arrangement of the illumination areas IR2001 to IR2006 and the projection areas PA2001 to PA2006 in the XY plane, and the figure on the left shows the illumination areas IR2001 to IR2006 on the cylindrical mask M and an intermediate image The view on the side of the intermediate image plane p2007 to be formed is as seen from the side of the intermediate image plane p2007 of the projection areas PA2001 to PA2006 on the substrate P supported by the rotary drum 2030. The symbol Xs in FIG. 35 indicates the moving direction (rotational direction) of the cylindrical mask M (rotating drum 2020) and the rotating drum 2030.

  In FIG. 35, each of the illumination regions IR2001 to IR2006 has an upper base and a lower base parallel to the center plane pc (parallel to the Y axis), and has a trapezoidal shape elongated in the Y direction. This means that each of the illumination optical systems IL2001 to IL2006 shown in FIG. 34 includes the illumination field stop 2064 as shown in FIG. Since each projection optical system PL2001 to PL2006 in FIG. 34 forms an intermediate image on the intermediate image plane p2007, when a field stop having a trapezoidal opening is arranged there, the shape of each illumination area IR2001 to IR2006 May be a mere rectangular shape (size including a trapezoidal opening).

  On the outer peripheral surface of the cylindrical mask M, the central point of each of the illumination regions IR2001, IR2003, IR2005 formed by the odd-numbered projection optical systems PLo is a plane Lo parallel to the central plane pc (perpendicular to the XY plane) The central point of each of the illumination regions IR2002, IR2004, IR2006 located on the upper side and formed by the even-numbered projection optical system PLe is located on a plane Le (perpendicular to the XY plane) parallel to the central plane pc.

  Assuming that each illumination area IR2001 to IR2006 has a trapezoidal shape, and the dimension of the lower base in the Y direction is A2002a, and the dimension of the upper base in the Y direction is A2002b, the central points of each of the odd illumination areas IR2001, IR2003, IR2005 are The center points of the even-numbered illumination regions IR2002, IR2004, and IR2006 are also disposed at intervals (A2002a + A2002b) in the Y direction. However, the even-numbered illumination regions IR2002, IR2004, IR2006 are shifted relative to the odd-numbered illumination regions IR2001, IR2003, IR2005 by the dimension (A2002a + A2002b) / 2 in the Y direction. The distances in the X direction from the central plane pc of the plane Lo and the plane Le are set equal to each other.

  In the present embodiment, when viewed along the circumferential direction (Xs direction) of the outer peripheral surface of the cylindrical mask M, each of the illumination regions IR2001 to IR2006, the end portions of the illumination regions adjacent to each other in the Y direction (trapezoidal The hypotenuses are configured to overlap each other. Thereby, even when the dimension of the pattern area A2003 of the cylindrical mask M in the Y direction is large, it is possible to secure an effective exposure area for covering the same. Although the pattern area A2003 is surrounded by the frame-like pattern non-formation area A2004, the pattern non-formation area A2004 is made of a material having extremely low reflectance (or high light absorption rate) to the illumination light. ing.

  On the other hand, as shown on the right side of FIG. 35, the projection areas PA2001 to PA2006 on the substrate P are cylindrical if the illumination field stop 2064 as shown in FIG. 26 is provided in each of the illumination optical systems IL2001 to IL2006. The arrangement and shape of the illumination regions IR2001 to IR2006 formed on the outer peripheral surface of the mask M are reflected (similar relationship). Therefore, the center points of the odd-numbered projection areas PA2001, PA2003, PA2005 are located on the plane Lo, and the center points of the even-numbered projection areas PA2002, PA2004, PA2006 are located on the plane Le.

  In the drawing on the right side of FIG. 35, the substrate P is sent at a constant speed in the circumferential direction (Xs direction) along the outer peripheral surface of the rotary drum 2030, but the hatched area A2007 in FIG. The portion exposed by 100% with respect to the target exposure amount (tonse amount) by one projection area PA2001 to PA2006.

  Further, for example, of the area A2005 exposed by the projection area PA2001 corresponding to the illumination area IR2001, the partial area A2005a exposed at the end (triangular portion) in the + Y direction has not reached the target exposure amount. However, when the substrate P is sent in the Xs direction (circumferential direction) and the exposure of the area A2006 by the projection area PA2002 corresponding to the illumination area IR2002, the insufficient exposure amount is integrated, and as a result, the partial area A2005a is also exposed at 100% of the target exposure amount.

  In this manner, the entire projected image of the pattern area A2003 formed on the outer peripheral surface of the cylindrical mask M is repeatedly repeated in the longitudinal direction on the substrate P at every rotation of the cylindrical mask M at equal magnification. It will be transferred.

  Of the chief rays of the respective imaging light beams EL2 directed from the respective illumination areas IR2001 to IR2006 on the cylindrical mask M to the projection optical system PL2001 to PL2006, the chief rays passing through the central points in the respective illumination areas IR2001 to IR2006 The extension lines D2001 and D2002 are made to intersect the rotation center axis AX2001 of the cylindrical mask M, but this is not always necessary, and the chief ray passing through any point in each illumination area IR2001 to IR2006 is the rotation center It suffices to intersect with the axis AX2001. Similarly, with regard to the imaging light beam EL2 directed from the projection optical systems PL2001 to PL2006 to the projection areas PA2001 to PA2006 on the substrate P, any chief ray of the chief rays is used as the central axis of rotation of the rotary drum 2030 It may be made to coincide with extension lines D2001 and D2002 intersecting with AX2002.

  Next, specific configurations of projection optical systems PL2001 to PL2006 and illumination optical systems IL2001 to IL2006 shown in FIG. 34 will be described with reference to FIG. FIG. 36 representatively shows the detailed configurations of the projection optical system PL2001 and the illumination optical system IL2001, but the configurations of the other projection optical systems PL2002 to PL2006 and the illumination optical systems IL2002 to IL2006 are the same.

  As shown in FIG. 36, the illumination light beam EL0 from the light source device 2055 (see FIG. 24) including the light guide member 2060 and the lens system 2061 is the fly's eye lens 2062 of the illumination optical system IL 2001 (see FIGS. 25 and 28-30). Incident to). The illumination luminous flux generated from a large number of point light source images generated on the surface Ep on the exit side of the fly's eye lens 2062 has uniform illumination on the surface 2014b conjugate with the mask on which the illumination field stop 2064 is disposed by the condenser lens 2065 Be distributed. The illumination light beam passing through the opening of the illumination field stop 2064 is reflected by the lens system 2066, the base material (such as quartz) of the concave mirror 2040 of the second optical system 2015 on the upper side (first stage) of the projection optical system PL2001, and the reflection of the concave mirror 2040 The light is transmitted through the window (2042) formed on the surface p2004 and the second optical system 2015, and is reflected by the upper reflection plane 2041a of the prism mirror 2041 in the direction along the extended line D2001 and on the cylindrical mask M. The illumination area IR is reached.

  Similar to the configuration of FIG. 23, the reflecting surface p2004 of the concave mirror 2040 is disposed on the pupil surface pd in the imaging light path of the projection optical system PL2001, and the reflecting surface p2004 is the surface Ep on the exit side of the fly's eye lens 2062 Because they are disposed substantially conjugately, a relay of many point light source images generated on the surface Ep on the exit end side of the fly's eye lens 2062 is generated in the window portion 2042 formed on the reflective surface p2004. Ru.

  Further, in the specific configuration of FIG. 36, the focus correction optical member 2080 and the image shift optical member 2081 are inclined between the reflection plane 2041a on the upper side of the prism mirror 2041 and the pattern surface p2001 of the cylindrical mask M. It is provided along the extended line D2001. The focus correction optical member 2080 is formed, for example, by overlapping two wedge-shaped prisms in opposite directions (opposite directions in the X direction in FIG. 36) so as to form a transparent parallel flat plate as a whole. The effective optical path length of the imaging optical path is finely adjusted by sliding the pair of prisms to make the thickness of the parallel plate variable, and a pattern formed on the intermediate image plane p2007 and the projection area PA2001 The focus condition of the image is finely adjusted.

  The image shift optical member 2081 is composed of transparent parallel flat glass which can be tilted in the XZ plane in FIG. 36, and transparent parallel flat glass which can be tilted in the direction orthogonal to that. By adjusting the tilt amounts of the two parallel flat glass sheets, the pattern image formed on the intermediate image plane p2007 and the projection area PA2001 can be slightly shifted in the X direction and the Y direction.

  The image of the mask pattern that appears in the illumination area IR 2001 has a second optical system on the upper side (first stage) of the focus correction optical member 2080, the image shift optical member 2081, the reflection plane 2041a of the prism mirror 2041, and the projection optical system PL2001. In 2015, an image is formed on the intermediate image plane p2007 via the reflection plane 2041b of the prism mirror 2041. In the intermediate image plane p2007, a field stop 2075 which makes the shape of the projection area PA2001 trapezoidal as shown in FIG. 35 can be arranged. In that case, the opening of the illumination field stop 2064 provided in the illumination optical system IL 2001 may be a rectangle (rectangle) including the trapezoidal opening of the field stop 2075.

  The image forming light flux that has become an intermediate image at the opening of the field stop 2075 is reflected by the reflection plane 2076 a of the lower (second) prism mirror 2076 that constitutes the projection optical system PL 2001, the second optical system 2077, and the prism mirror 2076. The projection area PA 2001 on the substrate P wound around the outer peripheral surface p 2002 of the rotary drum 2030 is projected via the reflection plane 2076 b. The reflection surface of the concave mirror 2078 included in the second optical system 2077 is disposed on the pupil plane pd, and the reflection plane 2076 b on the lower side of the prism mirror 2076 is an extension line in which the chief ray of the imaging light beam is inclined to the center plane pc. The angle with respect to the XY plane is set to be less than 45 ° so as to advance along D2001.

  In the specific configuration of FIG. 36, three concave lenses, a convex lens, and a concave lens are disposed between the lower reflection plane 2076 b of the prism mirror 2076 and the projection area PA 2001 on the substrate P wound around the rotating drum 2030. Are coaxially arranged at predetermined intervals, and the front and rear concave lenses are fixed, and a magnification correction optical member 2083 for moving the convex lenses in the direction of the optical axis (principal ray) is provided. As a result, the pattern image formed on the projection area PA 2001 is isotropically enlarged or reduced by a very small amount while maintaining the telecentric imaging state.

  Although not shown in FIG. 36, a rotation correction mechanism is also provided which allows any one of the prism mirrors 2041 and 2076 to be slightly rotated around an axis parallel to the Z axis. This rotation correction mechanism, for example, minutely rotates each of the plurality of projection areas PA2001 to PA2006 (and the mask pattern image to be projected) shown in FIG. 35 in the XY plane.

  As described above, in the seventeenth embodiment, as shown in FIG. 34 and FIG. 36, each of the six sets of projection optical systems PL2001 to PL2006 is each illumination on the outer peripheral surface (pattern surface) of the cylindrical mask M. The area IR2001 to IR2006 can be epi-illuminated with illumination light having a chief ray that intersects the rotation center axis AX2001 of the cylindrical mask M.

  Furthermore, a principal ray traveling in the normal direction of the pattern surface p2001 of the cylindrical mask M from each illumination region IR2001 to IR2006 is normal to each of the projection regions PA2001 to PA2006 on the substrate P along the outer peripheral surface p2002. The imaging beam is deflected so as to be incident from. Therefore, the defocus of the projected image can be reduced, the occurrence of processing defects such as exposure defects is suppressed, and as a result, the generation of defective devices is suppressed.

  In each of the projection optical systems PL2001 to PL2006, the chief ray of the imaging light beam is inclined with respect to the central plane pc between the outer peripheral surface of the cylindrical mask M and the prism mirror 2041 (reflection plane 2041a). Since it comprised, in the spatial arrangement | positioning of each projection optical system PL2001-PL2006, the conditions which mutually interfere (collide) are relieve | moderated.

  The lowermost reflecting plane 2041 b of the prism mirror 2041 and the prism mirror 2076 are arranged such that the chief ray of the imaging light flux passing through the intermediate image plane p2007 of each of the projection optical systems PL2001 to PL2006 is parallel to the central plane pc. The upper reflection plane 2076 a is set at an angle of 45 ° with respect to the XY plane.

[Modification of the seventeenth embodiment]
In the exposure apparatus provided with the multi-lens type projection optical system shown in FIGS. 34 to 36, the image of the mask pattern in the cylindrical surface shape is projected and exposed onto the surface of the substrate P supported in the cylindrical surface shape. Either M or the substrate P may be planarly supported, or both may be planarly supported. For example, as shown in FIG. 34, the substrate P is wound around a rotating drum 2030 and supported in a cylindrical shape, and the mask M is formed on a parallel flat glass (quartz) as in the prior art and is moved linearly in the X direction Exposure method On the contrary, the mask M is supported on a rotating drum 2020 as shown in FIG. 34, and the substrate P is supported by a flat plane stage or an air pad type holder and is a scanning exposure method in which the substrate P is linearly fed in the X direction. It may be any of the above.

  In addition, regardless of whether the support form of the mask M or the substrate P is cylindrical or planar, the projection optical system and the illumination optical system according to each of the above embodiments can be applied, but they are parallel to the XY plane As for the side supported in a planar manner, the inclination angle of the upper reflection plane 2041 a of the prism mirror 2041 and the lower reflection plane 2076 b of the prism mirror 2076 with respect to the XY plane may be 45 °. In other words, the object plane of the projection optical system according to the normal passing through the center of the illumination area IR (object plane) on the mask M and the normal passing through the center of the projection area PA (image plane) on the substrate P The chief ray on the side and the chief ray on the image plane side may be inclined in the XZ plane.

Eighteenth Embodiment
FIG. 37 is a view showing the configuration of a projection optical system PL (PL2001 in the case of a multi-lens system) according to the eighteenth embodiment. The projection optical system PL (PL 2001) of the present embodiment is a plane mirror that forms an imaging light beam EL2 (principal ray is EL6) from the mask pattern in the illumination area IR (IR 2001) of the outer peripheral surface of the cylindrical mask M. The reflecting surface of the plane mirror 2101 via the second optical system 2015 (half-field type catadioptric imaging system) having a concave mirror 2040 that is reflected by the reflecting surface 2100 a of the lens 2100 and whose reflecting surface p 2004 is arranged on the pupil surface The light beam is reflected by 2101 a to form an intermediate image equal to the size of the mask pattern appearing in the illumination area IR (IR 2001) on the intermediate image plane Im.

  Further, the intermediate image formed on the intermediate image plane Im is, for example, formed on the outer peripheral surface p2002 parallel to the XY plane by the magnifying imaging system 2102 (having the optical axis 2102a parallel to the Z axis) having a magnification of 2 or more. It is projected onto the projection area PA (PA 2001) on the substrate P supported along. The substrate P is supported via a fluid bearing layer on a flat holder HH provided with pads for fluid bearings having a flat surface. Also in the case of the present embodiment, a large number of point light source images Sf generated by the illumination light from the illumination optical system IL (IL 2001) on the back are formed on the reflective surface p 2004 of the concave mirror 2040 that constitutes the projection optical system PL (PL 2001). A window portion 2042 for transmission is formed.

  When an expansion projection optical system as shown in FIG. 37 is multilensed to expose a mask pattern having a large dimension in the Y direction, a projection optical system PL (PL1) including an illumination optical system IL (IL 2001) and flat mirrors 2100 and 2101 34 are arranged symmetrically with respect to the central plane pc in the XZ plane, and the Y-direction end (triangular portion) of the projection area PA (PA 2001) in the Y-direction. ), And the projected images are arranged so as to partially overlap with each other.

  In the present embodiment, assuming that the central plane pc is a plane including the rotation center axis AX2001 of the cylindrical mask M and perpendicular to the XY plane (peripheral plane p2002), the odd-numbered projection optical systems PL2001, PL2003 ... The central point (for example, the point through which the chief ray EL6 passes) of the illumination regions IR2001, IR2003,... Is the outer peripheral face and the center plane of the cylindrical mask M because the chief ray EL6 on the mask side is inclined with respect to the center plane pc. It is separated from the intersection with pc by the distance DMx in the perimeter. Therefore, each central point of the illumination areas IR2002, IR2004,... Of the even-numbered projection optical systems PL2002, PL2004,... Is also a distance from the intersection line between the outer peripheral surface of the cylindrical mask M and the central surface pc Only DMx will be away. For this reason, the illumination areas IR 2001 in the odd number and the illumination areas IR 2002 in the even number are separated by a distance (2DMx) in the circumferential direction on the cylindrical mask M.

  On the other hand, the central points of the projection areas PA2001, PA2003,... Of odd-numbered projection optical systems PL2001, PL2003,... (Points through which chief ray EL6 passes) are distance DFx in the X direction from central plane pc on substrate P. Since the odd numbered projection areas PA2001... And the even numbered projection areas PA2002... Are separated by a distance (2DFx) in the X direction on the substrate P. Therefore, when forming mask patterns for each of the illumination regions IR2001, IR2002,... Formed on the cylindrical mask M in the circumferential direction, the magnification of the projection optical system PL2001, PL2002,. It is necessary to set Mp to satisfy the relationship of Mp · (2DMx) = 2DFx. If it can not be configured under such conditions due to mechanical reasons, mask patterns for odd numbered illumination areas IR2001, IR2003... Formed on cylindrical mask M, and even numbered illumination areas IR2002, The mask pattern for IR 2004... May be formed to be relatively shifted in the circumferential direction.

Nineteenth Embodiment
FIG. 38 is a view showing the configuration of the projection optical system PL of the nineteenth embodiment. The projection optical system PL of this embodiment includes a lens system 2103, a lens system 2104, a concave mirror (reflection optical member) 2040 disposed on the pupil plane, deflection mirrors 2106 and 2107, and a lens system 2108.

  In the present embodiment, the imaging light beam EL2 from the illumination region IR on the outer peripheral surface of the cylindrical mask M is incident on the lens system 2103 through the half field on the −X side with respect to the optical axis 2103a of the lens system 2103. And enters the lens system 2104 (the optical axis 2104a is coaxial with the optical axis 2103a). The imaging light beam EL2 having passed through the lens system 2104 is reflected by the reflecting surface p2004 of the concave mirror 2040 (whose optical axis is 2104a), and is reflected in the −X direction by the reflecting surface 2106a of the deflecting mirror 2106, and lens systems 2103 and 2104, After being guided out of the optical path formed by the concave mirror 2040, it is reflected in the -Z direction by the reflection surface 2107a of the deflection mirror 2107.

  The imaging light beam EL2 reflected by the deflection mirror 2107 is irradiated to the projection area PA through the lens system 2108. By the above optical path, the projection optical system PL sets the image of the mask pattern appearing in the illumination area IR on the cylindrical mask M into the projection area PA on the substrate P supported flat by the same configuration as FIG. Imagine. The projection optical system of this embodiment is designed so as not to form an intermediate image plane, in particular in order to realize magnified projection in a compact system. The extension line D2001 of the principal ray EL6 on the cylindrical mask M side of the projection optical system PL is set to intersect the rotation center axis AX2001 of the cylindrical mask M, and the principal ray EL6 on the substrate P side is It is set perpendicular to the surface of the substrate P supported flat.

  In FIG. 38, the imaging light beam EL2 from within the illumination region IR is designed to pass through the −X side of the optical axis 2108a (parallel to the Z axis and perpendicular to the substrate P) of the lens system 2108 giving the main magnification. can do. Therefore, in the part on the + X side from the optical axis 2108a of the lens system 2108, the part not contributing to the projection of the mask pattern is cut out. As a result, the size of the projection optical system PL in the X direction (the scanning direction of the substrate P) can be reduced.

  Also in this modification, the illumination optical system IL and the light source device 2055 are disposed on the back side of the concave mirror 2040 as in FIGS. 21, 23, 31, 32A, 32B, and 37, and the reflection surface of the concave mirror 2040 A large number of point light source images Sf are generated in the window (2042) formed in p2004 (arranged in the pupil plane). The distribution of the point light source image on the reflective surface p2004 and the shape and arrangement of the windows in the reflective surface p2004 are as shown in FIGS. 27 to 30 or 33A to 33C according to the conditions described in FIG. Set to

  In each embodiment and each modification as described above (FIG. 12, FIG. 21, FIGS. 34 to 38), the cylindrical mask M has a reflective portion and a non-reflective portion on the surface of a cylindrical base material such as metal, ceramics, and glass. Although it is assumed that the pattern by the reflective portion is directly formed, a sheet-like reflective type in which a pattern is formed by a reflective film on one surface of a strip-like ultrathin glass plate (for example, 100 to 500 μm thick) having good flatness. As a mask, it may be curved and wound along the outer peripheral surface of the metallic rotary drum 2020.

  Such a sheet-like reflective mask may be permanently affixed to the outer peripheral surface of the rotary drum 2020 or may be releasably (replaceable) fixed. The reflective film of the sheet-like reflective mask includes, for example, a film of a material having a high reflectance to the illumination light beam EL1, such as aluminum, a dielectric multilayer film, and the like. In that case, the rotary drum 2020 may be provided with a light shielding layer (film) that absorbs the illumination light beam EL1 that has passed through the transparent portion of the sheet-like reflective mask, and the light shielding layer also suppresses the generation of stray light.

  In addition, the cylindrical mask M may have only a pattern corresponding to one device (one display panel) formed over the entire circumference, or corresponds to one device (one display panel). A plurality of patterns may be formed. Furthermore, the device pattern on the cylindrical mask M may be repeatedly disposed in the circumferential direction of the outer circumferential surface, or a plurality of device patterns may be disposed in a direction parallel to the rotation center axis AX2001. In addition, the cylindrical mask M may be provided with a pattern for manufacturing a first device and a pattern for manufacturing a second device different from the first device.

[Device manufacturing method]
Next, a device manufacturing method will be described. FIG. 39 is a flowchart showing the device manufacturing method of this embodiment.

  In the device manufacturing method shown in FIG. 39, first, for example, function / performance design of a device such as a display panel by a self light emitting element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD (step 201). . Next, the mask M (cylindrical or planar) for the necessary layers is manufactured based on the design of devices such as patterns for each of various layers designed by CAD or the like (step 202). In addition, a substrate such as a transparent film or sheet as a substrate of the device, or an extremely thin metal foil, or a flexible substrate (resin film, metal foil film, plastic, etc.) as a substrate of a display panel is wound The roll is prepared by purchasing, manufacturing, etc. (step 203).

  The roll-like substrate prepared in this step 203 has its surface modified as required, a base layer (for example, micro-concavities and convexities by imprinting method) formed in advance, and photosensitivity It may be a laminate of a functional film or a transparent film (insulating material) in advance.

  Next, the prepared substrate is introduced into a roll-type or patch-type production line, and the substrate is constituted by electrodes such as electrodes and wirings that constitute devices such as display panel devices, TFTs such as insulating films and semiconductor films (thin film semiconductors), etc. And forming a light emitting layer by a self light emitting element such as an organic EL to be a display pixel portion so as to be stacked on the back layer (step 204). Step 204 typically includes forming a resist pattern on the film on the substrate and etching the film using the resist pattern as a mask. In the formation of the resist pattern, a step of uniformly forming a resist film on the substrate surface, a step of exposing the resist film of the substrate with exposure light patterned through the mask M according to each of the above embodiments, Developing the resist film on which the latent image of the mask pattern has been formed by exposure.

  In the case of flexible device manufacturing using printing technology etc., a step of forming a functional photosensitive layer (photosensitive silane coupling material etc.) on the substrate surface by a coating method, via the mask M according to each of the above embodiments Exposing a functional photosensitive layer to a patterned exposure light, forming a hydrophilicized portion and a water-repellent portion according to the pattern shape on the functional photosensitive layer to form a pattern, and forming a functional photosensitive layer; A step of applying a plating base solution or the like to the highly hydrophilic part of the layer and depositing and forming a metallic pattern by electroless plating is carried out.

  In addition, although this step 204 includes the conventional photolithography process of exposing the photoresist layer using the exposure apparatus described in each of the previous embodiments, the photosensitive catalyst layer is pattern-exposed and electrolessly etched. It also includes processing by a wet process of forming a pattern (wiring, electrode, etc.) of a metal film by a plating method, or a printing process of drawing a pattern by a conductive ink containing silver nanoparticles, etc.

  Then, depending on the device to be manufactured, dicing or cutting the substrate for each display panel device continuously manufactured on a long substrate by, for example, a roll method, or another substrate manufactured in a separate process For example, a step of bonding a protective film (anti-environment barrier layer), a sheet-like color filter having a sealing function, a thin glass substrate or the like to the surface of each display panel device etc. is performed to assemble the device (step 205) ). Next, the device is subjected to post-processing such as inspection (step 206), such as whether the display panel device functions properly or satisfies the desired performance and characteristics. As described above, devices such as display panels (flexible displays) can be manufactured.

  The technical scope of the present invention is not limited to the above embodiment or modification. For example, one or more of the components described in the above embodiments or variations may be omitted. Further, the components described in the above embodiment or modification can be combined as appropriate.

  1001 ... device manufacturing system, 1009 ... transport device, 1011 ... substrate processing device, 1021 ... first drum member, 1022 ... second drum member, 1050 ... first deflection member, 1057: second deflection member, 1078: stage, 1120: third deflection member, 1121: fourth deflection member, 1132: seventh deflection member, 1133: eighth deflection member , 1136: ninth deflection member, 1137: tenth deflection member, 1140: eleventh deflection member, 1143: twelfth deflection member, 1151: thirteenth deflection member, 1152: 1152 14th deflection member, AX1001 ... first central axis, AX1002 ... second central axis, D1001 ... first radial direction, D1002 ... second radial direction, D1003 ... first normal direction , D 004 ... second normal direction, DFx ... distance, DMx ... circumferential length, IR ... illumination area, M ... mask, P ... substrate, PA ... projection area, PL ... Projection optical system, PL 1001 to PL 1006 ... Projection module, p 1001 ... First surface, p 1002 ... Second surface, p 1003 ... Central surface, p 1007 ... Intermediate image surface, 2001 · · · Device manufacturing system 2005 Higher-order controller 2013 Controller 2014 first optical system 2015 second optical system 2020 rotating drum 2030 rotation Drum, 2040 ... concave mirror, 2094 rod lens, U3 ... processing apparatus (substrate processing apparatus, exposure apparatus).

Claims (10)

A cylindrical mask on which a reflective mask pattern is formed along a cylindrical surface of a predetermined radius from a first center line is rotated about the first center line, and the flexible long sheet substrate is elongated in a longitudinal direction. A cylindrical mask exposure apparatus for projecting and exposing the mask pattern onto the sheet substrate by moving along the same.
A portion of the sheet substrate is cylindrically supported by a cylindrical outer peripheral surface having a predetermined radius from a second center line set substantially parallel to the first center line, and rotated around the second center line A rotary drum for feeding the sheet substrate in the longitudinal direction;
A first center line disposed on one side of a center plane including the first center line and the second center line, and inclined at a predetermined angle less than 90 ° from the center plane and set on a cylindrical surface of the cylindrical mask The first image light beam generated in the radial direction of the cylindrical mask from the illumination area is incident, and is set to be inclined at a predetermined angle less than 90 ° from the central plane on the sheet substrate supported by the rotating drum A first projection optical system that projects the first image light beam in a radial direction of the rotary drum toward a first projection area;
A second illumination area, which is disposed on the other side of the central surface and is set on the outer peripheral surface of the cylindrical mask at a predetermined angle less than 90 ° from the central surface, is generated in the radial direction of the cylindrical mask And the second image light beam toward a second projection area which is set to be inclined by a predetermined angle less than 90.degree. From the center plane on the sheet substrate supported by the rotating drum. A second projection optical system that projects the light in the radial direction of the rotating drum;
An illumination light flux for epi-illuminating the first illumination area is reflected between the cylindrical mask and the first projection optical system, and the first image light flux from the first illumination area is projected to the first projection. A first illumination system including a first beam splitter for transmitting towards the optical system;
An illumination light flux for epi-illuminating the second illumination area is reflected between the cylindrical mask and the second projection optical system, and the second image light flux from the second illumination area is projected as the second projection A second illumination system including a second beam splitter for transmitting towards the optical system;
Cylindrical mask exposure apparatus comprising: The cylindrical mask exposure apparatus according to claim 1, wherein
Each of the first and second beam splitters is configured of a polarization beam splitter having a wavefront splitting surface that splits incident light into light reflected and light transmitted according to a polarization state,
Each of the first illumination system and the second illumination system is provided between the cylindrical mask and the polarization beam splitter, and has a quarter-wave plate that converts linearly polarized light into circularly polarized light. And
The illumination light beam incident on the polarization beam splitter for epi-illuminating each of the first illumination area and the second illumination area is set to be linearly polarized light reflected by the wavefront splitting surface.
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to claim 2, wherein
The first projection optical system and the second projection optical system are
The first illumination area and the second illumination area are offset in the direction of the first center line on the cylindrical surface of the cylindrical mask, and the first projection area and the second projection area are the rotary drum. Disposed on the sheet substrate supported on the second substrate so as to be offset in the direction of the second center line,
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to claim 3, wherein
The first projection optical system and the second projection optical system are
The projection image of the mask pattern exposed on the sheet substrate in the first projection area and the projection image of the mask pattern exposed on the sheet substrate in the second projection area are the second center line Are arranged to be exposed in the direction of
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to any one of claims 1 to 4, wherein
Each of the first projection optical system and the second projection optical system is
One of a projection magnification for forming an image of the mask pattern at the same magnification on the sheet substrate in a telecentric state and a projection magnification for forming an enlarged image of the mask pattern on the sheet substrate in a telecentric state Have one,
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to any one of claims 1 to 5, wherein
In the illumination light beam irradiated from the first illumination system to the first illumination area, an extension line of a chief ray of the illumination light flux passing through the center point of the first illumination area is the first center line of the cylindrical mask Set to head to
In the illumination light beam irradiated from the second illumination system to the second illumination area, the extension line of the chief ray of the illumination light flux passing through the center point of the second illumination area is the first center line of the cylindrical mask Set to head towards
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to any one of claims 1 to 6, wherein
The first image light beam projected from the first projection optical system to the first projection area passes the center point of the first projection area corresponding to the center point of the first illumination area. An extension of the chief ray of the luminous flux is set to be directed to the second center line of the rotary drum,
The second image light beam projected from the second projection optical system to the second projection area passes through the center point of the second projection area corresponding to the center point of the second illumination area. The extension of the chief ray of the luminous flux is set to be directed to the second center line of the rotating drum,
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to claim 5, wherein
The circumferential length along the cylindrical surface of the cylindrical mask between the center point of the first illumination area and the center point of the second illumination area is DMx, and the center point of the first projection area and the second projection area Assuming that the circumferential length between the center point and the outer circumferential surface of the rotary drum is DFx, and the projection magnification of the first projection optical system and the second projection optical system is Mp,
An adjustment mechanism that adjusts an optical path of the first image light beam or the second image light beam so that at least one of the first projection optical system and the second projection optical system satisfies a relationship of DFx = Mp · DMx. Equipped with
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to any one of claims 1 to 8, wherein
The inclination angle of the cylindrical surface of the cylindrical mask from the central plane to the central point of the first illumination area and the circumference of the cylindrical surface of the cylindrical mask from the central plane to the central point of the second illumination area The inclination angle with respect to the direction is set to an equal angle less than 90 ° symmetrically with respect to the central plane,
Cylindrical mask exposure system. The cylindrical mask exposure apparatus according to any one of claims 1 to 9, wherein
The inclination angle of the outer peripheral surface of the rotary drum from the central plane to the central point of the first projection area with respect to the circumferential direction of the outer peripheral surface, and the outer peripheral surface of the rotary drum from the central plane to the central point of the second projection area The inclination angle with respect to the direction is set to an equal angle less than 90 ° symmetrically with respect to the central plane,
Cylindrical mask exposure system.

Images