JP2009032749A - Exposure apparatus and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable adjustment of the optical characteristics of exposure light to a photosensitive board in correspondence to the light quantity ratio between beams of exposure light emitted from a plurality of light sources. <P>SOLUTION: The exposure apparatus 100 includes driving mechanisms 51 to 56 which drive an optical element included in at least either of an illuminating optical system IL and a projection optical system to change the optical characteristics of exposure light on a conjugate surface of a pattern DP, and a main control system 20 which, based on information corresponding to the light quantities of beams of exposure light emitted from first and second light sources among a plurality of light sources 1, detects information corresponding to the light quantity ratio between the beams of exposure light and changes the optical characteristics of exposure light based on the result of the detection, using at least one of the driving mechanisms 51 to 56. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an exposure apparatus and a device manufacturing method for transferring a pattern onto a photosensitive substrate.

  Conventionally, in order to form a circuit pattern on a device such as a liquid crystal display element or a semiconductor element, an exposure apparatus using a photolithography technique has been used. In such an exposure apparatus, for example, a mask on which a pattern as an original image of a circuit pattern is illuminated with exposure light of a predetermined wavelength band, and an image of the illuminated pattern is formed on a photosensitive substrate which is a device substrate. The pattern is transferred.

  2. Description of the Related Art In recent years, an exposure apparatus is required to expand a transfer area (exposure area) of a pattern to be transferred onto a photosensitive substrate in accordance with a demand for a large area of a liquid crystal display element or the like. On the other hand, a step-and-scan type exposure apparatus that has a multi-lens type projection optical system and transfers a pattern while synchronously scanning a mask and a photosensitive substrate with respect to the projection optical system has been developed. (For example, refer to Patent Document 1).

  In the exposure apparatus described in Patent Document 1, a plurality of projection optical units are arranged along the pattern transfer surface (exposure surface) of the photosensitive substrate, and the exposure area is expanded by increasing the number of arrangement. At that time, when the exposure light amount is insufficient with one light source, the shortage of light amount can be solved by using a plurality of light sources and mixing the exposure light emitted from each light source to illuminate the mask. In this case, the exposure light emitted from each light source is mixed using, for example, a light guide configured by bundling a plurality of optical fibers randomly.

Japanese Patent Laid-Open No. 7-57986

  However, when a plurality of light sources are used, the ratio of the amount of exposure light emitted from each light source changes due to, for example, deterioration of the light source over time or change in the number of lighting. Therefore, in the exposure apparatus described in Patent Document 1, when the exposure light emitted from a plurality of light sources is mixed to illuminate the mask, the optical characteristics of the exposure light with respect to the photosensitive substrate are different for each projection optical unit and each projection optical unit. There was a risk of changing between. In addition, there is a problem in that the optical quality of the exposure light changes, so that the image quality of the pattern image formed on the photosensitive substrate deteriorates and the accuracy of the pattern transferred onto the photosensitive substrate decreases. .

  The present invention has been made in view of the above, and can adjust the optical characteristics of the exposure light with respect to the photosensitive substrate in accordance with the light intensity ratio of each exposure light emitted from a plurality of light sources. An object of the present invention is to provide an exposure apparatus and a device manufacturing method capable of transferring a pattern with high accuracy.

  In order to solve the above-described problems and achieve the object, an exposure apparatus according to the present invention mixes exposure light emitted from a plurality of light sources, and irradiates a pattern located on a predetermined surface, via the pattern. An exposure apparatus comprising: a projection unit that forms an image of the pattern on a photosensitive substrate located on a conjugate plane of the predetermined plane based on the exposure light; and at least one of the illumination unit and the projection unit Corresponding to the light quantity of each exposure light emitted from the first light source and the second light source of the plurality of light sources, and an adjusting means for driving the optical element included in the light source to change the optical characteristics of the exposure light on the conjugate plane. Detection means for detecting information corresponding to the light intensity ratio of each exposure light based on the information, adjustment control means for changing the optical characteristics using the adjustment means based on the detection result of the detection means, Be equipped Characterized in that was.

  The device manufacturing method according to the present invention includes an exposure step of transferring the pattern onto the photosensitive substrate using the exposure apparatus described above, and developing the photosensitive substrate to which the pattern has been transferred. A developing step for generating a mask layer having a corresponding shape on the surface of the photosensitive substrate; and a processing step for processing the surface of the photosensitive substrate through the mask layer.

  According to the exposure apparatus and the device manufacturing method according to the present invention, the optical characteristics of the exposure light with respect to the photosensitive substrate can be adjusted in accordance with the light intensity ratio of each exposure light emitted from the plurality of light sources. The pattern can be transferred with high accuracy.

  Exemplary embodiments of an exposure apparatus and a device manufacturing method according to the present invention will be explained below in detail with reference to the accompanying drawings. In addition, this invention is not limited by this embodiment. Moreover, in description of drawing, the same code | symbol is attached | subjected and shown to the same part.

(Embodiment)
FIG. 1 is a perspective view showing an overall configuration of an exposure apparatus 100 according to the present embodiment. As shown in this figure, the exposure apparatus 100 includes a plurality of light sources 1 (only one is shown in FIG. 1), an illumination optical system IL as an illumination unit, and projection optical units PL1 to PL1 as a plurality of projection units. And a projection optical system PL configured using PL5 (however, the projection optical unit PL2 is not shown). The illumination optical system IL illuminates five areas on the mask M corresponding to the projection optical units PL1 to PL5 based on the exposure light emitted from each light source 1. For each of the projection optical units PL1 to PL5, the projection optical system PL uses a pattern image formed on the lower surface of the mask M on the plate P as a photosensitive substrate based on the exposure light irradiated from the illumination optical system IL. To form.

  In the present embodiment, an XYZ coordinate system is set for the exposure apparatus 100 as shown in FIG. 1, and this XYZ coordinate system will be referred to as appropriate in the following description. In addition, the XYZ coordinate system is also illustrated as appropriate in each figure after FIG. Specifically, in the XYZ coordinate system, for example, the X axis and the Y axis are set in parallel with the horizontal plane, and the Z axis is set with the vertical direction as the positive direction.

  Here, the mask M is disposed so as to be exchangeable with respect to the exposure apparatus 100 so that the pattern formed on the lower surface is positioned on a predetermined surface set in advance between the illumination optical system IL and the projection optical system PL. Is done. In the exposure apparatus 100, the predetermined plane is set in parallel with the XY plane which is a horizontal plane. Further, the plate P is disposed so as to be exchangeable with respect to the exposure apparatus 100 so that the upper exposure surface, which is a pattern transfer surface, is located on a conjugate surface of the predetermined surface by the projection optical system PL. That is, the exposure surface of the plate P is disposed on the conjugate surface of the pattern formed on the mask M.

  The exposure apparatus 100 includes a mask stage MS and a plate stage PS (see FIG. 2). The mask stage MS holds the mask M on the top, and the plate stage PS holds the plate P on the top. Each of the mask stage MS and the plate stage PS is provided with a scanning drive mechanism (not shown). These scanning drive mechanisms scan the pattern projection area by the projection optical system PL on the plate P in the X-axis direction by moving the mask stage MS and the plate stage PS individually or synchronously in the X-axis direction.

  The mask stage MS and the plate stage PS are provided with an adjustment drive mechanism and a step drive mechanism (not shown), respectively. The adjustment driving mechanism adjusts the posture of the mask M with respect to the plate P along the XY plane by moving the mask stage MS slightly in the Y-axis direction and rotating it slightly around the Z-axis. The step driving mechanism moves the pattern projection region by the projection optical system PL in the Y-axis direction on the plate P by step-moving the plate stage PS in the Y-axis direction.

  Note that the position of the mask stage MS is controlled along the XY plane by using a body mirror (not shown) of the exposure apparatus 100 or a bar mirror 25 fixed to the mask stage MS and a laser interferometer (not shown). Similarly, the position of the plate stage PS is controlled along the XY plane using bar mirrors 26x and 26y fixed to the main body frame (not shown) of the exposure apparatus 100 or the plate stage PS and a laser interferometer (not shown).

  The exposure apparatus 100 also includes a focusing drive mechanism (not shown) that moves the plate stage PS in the Z-axis direction. The focusing drive mechanism moves the plate stage PS in the Z-axis direction so that the exposure surface of the plate P coincides with the image plane of the pattern image by the projection optical units PL1 to PL5, that is, the conjugate plane of the pattern. The position of the plate stage PS is controlled along the Z-axis direction using a focus detection device (not shown).

  Further, the exposure apparatus 100 includes a pair of alignment devices 27a and 27b that measure the relative positions of the mask M and the plate P along the XY plane. The alignment devices 27a and 27b are arranged above the mask M at a predetermined interval in the Y-axis direction. The alignment devices 27a and 27b use, for example, an image processing technique, and a predetermined mask alignment mark formed on the mask M and a reference provided at a predetermined position on the plate alignment mark or plate stage PS formed on the plate P. By measuring the relative position of the reference alignment mark on the member 28, the relative position of the mask M and the plate P along the XY plane is measured. As a result, the relative positions of the mask M and the plate P are controlled along the XY plane. The alignment devices 27a and 27b detect the plate alignment mark or the reference alignment mark via the corresponding projection optical units PL1 and PL5, respectively.

  The exposure apparatus 100 further includes an illuminance detection unit 29 that detects the illuminance of exposure light irradiated onto the plate P via the projection optical units PL1 to PL5 by the illumination optical system IL. The illuminance detection unit 29 includes a light limiting member in which an opening having a predetermined size, for example, a slit shape or a pinhole shape, and a photodetector that photoelectrically detects exposure light that has passed through the opening of the light limiting member. And the light limiting member is provided at the end of the plate stage PS in the X-axis direction with the same height as the plate P. The illuminance detection unit 29 is appropriately moved into each pattern projection area on the plate P by the projection optical units PL1 to PL5, and displays various information regarding illuminance such as illuminance distribution, illuminance unevenness, and average illuminance of exposure light in each pattern projection area. To detect.

  Further, the exposure apparatus 100 detects a pattern image formed on the plate P by the projection optical units PL1 to PL5 based on the exposure light irradiated by the illumination optical system IL and passed through the pattern of the mask M. An image detection unit 24 is provided. The aerial image detection unit 24 is configured using, for example, an index plate 60 that is a light transmission member on which a predetermined index is formed, and an image detection unit 61 that detects a pattern image formed on the index plate 60 as an image. Then, the upper surface of the indicator plate 60 is set to be almost the same height as the plate P, and is provided at the end of the plate stage PS in the X-axis direction. A plurality of image detection units 61 are provided corresponding to the projection optical units PL1 to PL5, and detect images of patterns formed by the corresponding projection optical units PL1 to PL5.

  In addition, the aerial image detection unit 24 detects the pattern image each time the plate stage PS is sequentially driven in the Z-axis direction by a predetermined amount by the focusing drive mechanism, so that the position of the plate stage PS in the Z-axis direction ( The position in the X-axis direction and the Y-axis direction of the pattern image with respect to (height) is detected. The exposure apparatus 100 detects the telecentricity of the exposure light on the conjugate plane of the pattern of the mask M based on this detection result.

  Next, the projection optical system PL will be described in detail. FIG. 2 is a diagram showing a main configuration of the projection optical unit PL1 provided in the projection optical system PL. The projection optical system PL is configured using the projection optical unit PL1 shown in this figure and projection optical units PL2 to PL5 configured in the same manner as the projection optical unit PL1. In the projection optical units PL1 to PL5, components are arranged along the XZ plane.

  As shown in FIG. 2, the projection optical unit PL1 includes imaging optical systems 30a and 30b and a field stop AS. The imaging optical system 30a includes a right-angle prism 31a and a catadioptric optical system 34a having a refractive optical system 32a and a concave reflecting mirror 33a. The imaging optical system 30a forms a primary image of the pattern DP based on the exposure light that passes through the pattern DP formed on the lower surface of the mask M. Similar to the imaging optical system 30a, the imaging optical system 30b is configured by using a right-angle prism 31b and a catadioptric optical system 34b having a refractive optical system 32b and a concave reflecting mirror 33b. A secondary image, which is an erect image of the pattern DP, is formed on the plate P based on the exposure light through the image.

  Here, the right-angle prism 31a has two orthogonal reflecting surfaces, and the exposure light incident from the + Z side along the axis AX10 parallel to the Z axis is -X side along the optical axis AX11 parallel to the X axis. Reflect to. Further, the exposure light incident from the −X side along the optical axis AX11 is reflected to the −Z side along the axis AX10. Note that the axis AX10 is an axis that coincides with an optical axis AX2 described later in the illumination optical system IL. In the catadioptric optical system 34a, the refractive optical system 32a and the concave reflecting mirror 33a are arranged in this order from the right-angle prism 31a side with the optical axis AX11 as a common optical axis, and the concave reflecting mirror 33a is disposed behind the refractive optical system 32a. It is arranged at the side focal position or in the vicinity thereof. The catadioptric optical system 34a emits exposure light incident from the + X side along the optical axis AX11 to the -X side along the optical axis AX11. The refractive optical system 32a has a positive refractive power, and the concave reflecting mirror 33a has the concave reflecting surface opposed to the refractive optical system 32a. The optical axis AX11 is orthogonal to the ridgeline formed by the two reflecting surfaces of the right-angle prism 31a.

  Similarly, the right-angle prism 31b has two reflecting surfaces orthogonal to each other, reflects exposure light incident from the + Z side along the axis AX10 to the −X side along the optical axis AX12 parallel to the X axis, and Exposure light incident from the −X side along the optical axis AX12 is reflected to the −Z side along the axis AX10. In the catadioptric optical system 34b, the refractive optical system 32b and the concave reflecting mirror 33b are arranged in this order from the right-angle prism 31b side with the optical axis AX12 as a common optical axis, and the concave reflecting mirror 33b is disposed behind the refractive optical system 32b. It is arranged at the side focal position or in the vicinity thereof. The catadioptric optical system 34b emits exposure light incident from the + X side along the optical axis AX12 to the -X side along the optical axis AX12. The refractive optical system 32b has a positive refractive power, and the concave reflecting mirror 33b has the concave reflecting surface opposed to the refractive optical system 32b. The optical axis AX12 is orthogonal to the ridge line formed by the two reflecting surfaces of the right-angle prism 31b.

  The field stop AS has a predetermined opening and is provided on or near the image plane of the primary image of the pattern DP. The field stop AS defines a pattern area of the pattern DP that can be projected collectively by the projection optical unit PL1, and also defines a pattern projection area on the plate P of the pattern DP that is projected collectively by the projection optical unit PL1. . Specifically, the field stop AS has, for example, a trapezoidal opening, thereby defining the pattern region and the pattern projection region in a trapezoidal shape.

  The projection optical unit PL1 further includes a focus correction optical system 35, parallel plane plates 36 and 37, and a magnification correction optical system 38. The focus correction optical system 35 is configured by using two wedge-shaped prisms having equal wedge angles, and is provided between the mask M and the right-angle prism 31a. The two wedge-shaped prisms are arranged adjacent to each other along the axis AX10 with one surface orthogonal to the axis AX10 and the other surface opposed to each other. In the initial state, the two wedge-shaped prisms are arranged in a single parallel plane plate as a whole, with mutually facing surfaces being parallel.

  In the focus correction optical system 35 configured in this way, one of the two wedge-shaped prisms is moved relative to the other and in a direction inclined with respect to the axis AX10 along the surfaces facing each other. Thus, the in-focus position of the image of the pattern DP by the projection optical unit PL1 can be moved (moved up and down) in the direction of the axis AX10. Alternatively, one of the two wedge-shaped prisms may be moved in the vertical direction with respect to the axis AX10 so as to change the distance from each other relative to the other. The wedge-shaped prism in the focus correction optical system 35 can be moved by a drive mechanism 39.

  The pair of parallel flat plates 36 and 37 are provided between the mask M and the right-angle prism 31a, and are arranged orthogonal to the axis AX10 in the initial state. For example, the plane parallel plate 36 is rotatable around the X axis, and when rotated around the X axis, moves the image of the pattern DP formed on the plate P in the Y axis direction. Similarly, the plane-parallel plate 37 is rotatable around the Y axis, for example, and when rotated around the Y axis, moves the image of the pattern DP formed on the plate P in the X axis direction. The plane parallel plates 36 and 37 can be rotated about the corresponding axes by drive mechanisms 40 and 41, respectively.

  The magnification correction optical system 38 is a lens system configured by using, for example, two plano-concave lenses having curved surfaces with substantially the same curvature and a biconvex lens, the optical axis of which coincides with the axis AX10, and a right-angle prism 31b. It is provided between the plate P and the curved surface of each plano-concave lens and the curved surface of the biconvex lens are opposed to each other at a predetermined interval in the optical axis direction. In the magnification correction optical system 38 configured in this way, the projection magnification of the image of the pattern DP projected on the plate P can be changed by changing the distance between at least one plano-concave lens and the biconvex lens. . The lens interval in the magnification correction optical system 38 can be changed by the drive mechanism 42.

  In the projection optical unit PL1, the right-angle prism 31b can be rotated around the axis AX10 by the drive mechanism 43. When the right-angle prism 31b is rotated about the axis AX10, the image of the pattern DP projected on the plate P can be rotated about the axis AX10. Instead of the right-angle prism 31b, the right-angle prism 31a may be rotatable about the axis AX10, and both the right-angle prisms 31a and 31b may be rotatable. By rotating the right-angle prism 31a around the axis AX10, the image of the pattern DP can be rotated around the axis AX10 in the same manner as when the right-angle prism 31b is rotated.

  In the projection optical unit PL1 configured as described above, the pattern DP positioned in the pattern region on the mask M corresponding to the trapezoidal opening of the field stop AS is illuminated by the illumination optical system IL. An image (secondary image) of the pattern DP is formed as an erect image in the pattern projection area on the plate P corresponding to the trapezoidal opening of the field stop AS. At this time, the image of the pattern DP is projected on the plate P in a telecentric manner because the concave reflecting mirrors 33a and 33b are disposed at or near the rear focal positions of the refractive optical systems 32a and 32b, respectively.

  Further, the image of the pattern DP formed on the plate P is obtained by driving the focus correction optical system 35, the plane parallel plates 36 and 37, the magnification correction optical system 38, and the right-angle prism 31b, respectively, by driving mechanisms 39, 40, 41, 42 and 43. , The focus position on the plate P, the projection position, the projection magnification, and the attitude around the axis AX10 are adjusted as appropriate. At that time, each drive mechanism is driven and controlled by the main control system 20 provided in the exposure apparatus 100.

  Here, the main control system 20 is electrically connected to each part that is electrically operable in the exposure apparatus 100, and causes the storage device 19 provided in the exposure apparatus 100 to execute a predetermined processing program stored in advance. Thus, processing and operation in each part are controlled. At that time, the main control system 20 is configured by each unit based on instruction information input via an information input device (not shown) configured using, for example, a keyboard, a mouse, a touch panel, or the like, or a wired or wireless information communication device. Can be controlled. Moreover, each part can be controlled in response to changes in various illumination conditions in the illumination optical system IL.

  Next, the illumination optical system IL will be described in detail. FIG. 3 is a perspective view showing the overall configuration of the illumination optical system IL. As shown in this figure, the illumination optical system IL includes two sets of introduction optical systems ILa and ILb, a light guide 9 as an optical transmission member, and five sets of light guide optical systems IL1 to IL5. FIG. 4 is a side view showing a main configuration of the introduction optical system ILa, the light guide 9, and the light guide optical system IL1 as a configuration representative of the illumination optical system IL. The introduction optical systems ILa and ILb are configured using the same components, and the light guide optical systems IL1 to IL5 are configured using the same components.

  The introduction optical systems ILa and ILb are configured by using an elliptical mirror 2, a dichroic mirror 3, a shutter 4, a collimating lens 5, wavelength selection filters 6 and 7, and a relay lens 8, respectively, as shown in FIGS. Yes. For example, an ultrahigh pressure mercury lamp is used as the light source 1. The light source 1 has a light emitting portion provided at the first focal position of the elliptical mirror 2, and the elliptical mirror 2 condenses the exposure light emitted from the light source 1 at the second focal position via the dichroic mirror 3. The dichroic mirror 3 selectively reflects light in the wavelength band used as exposure light among the light emitted from the light source 1, for example, light in the wavelength band of at least i line (wavelength 365 nm) to g line (wavelength 436 nm). To reflect.

  The shutter 4 is configured using an aperture plate 4a and a shielding plate 4b. The aperture plate 4 a has an opening, and the shutter 4 is disposed so that the aperture of the aperture plate 4 a surrounds the second focal position of the elliptical mirror 2. The shielding plate 4b closes the opening of the opening plate 4a so as to be freely opened. The collimating lens 5 converts the light, which is a divergent light beam passed by the shutter 4, into a parallel light beam. The wavelength selection filters 6 and 7 selectively transmit light in a predetermined wavelength band used as exposure light from the light emitted from the collimator lens 5. The relay lens 8 condenses the exposure light transmitted by the wavelength selection filter 6 or 7 on the incident end face of the light guide 9 at the incident end 9a-1 or 9a-2. Here, the collimating lens 5 and the relay lens 8 are disposed with the optical axis AX1 as a common optical axis.

  The wavelength selection filter 6 selectively extracts, for example, i-line light from the light reflected by the dichroic mirror 3 and transmits the light. The wavelength selection filter 7 is, for example, light in the wavelength band of i-line to g-line. Is selectively transmitted. The wavelength selection filters 6 and 7 can be inserted into and removed from the optical path of the parallel light flux between the collimating lens 5 and the relay lens 8 by the driving device 18. The drive device 18 is electrically connected to the main control system 20 and is driven and controlled by the main control system 20.

  As the light guide 9, for example, a random light guide fiber configured by randomly bundling a plurality of optical fibers is used. The light guide 9 has incident end portions 9a-1 and 9a-2 respectively corresponding to the introduction optical systems ILa and ILb, and exit end portions 9b to 9f respectively corresponding to the light guide optical systems IL1 to IL5. In the light guide 9, the optical fiber group having one end bundled at the incident end 9a-1 is equally distributed to the exit ends 9b to 9f at the other end. Similarly, the optical fiber group in which one end is bundled at the incident end 9a-2 is equally distributed to the emission ends 9b to 9f at the other end. For this reason, the light guide 9 receives the respective exposure lights condensed by the introduction optical systems ILa and ILb from the corresponding incident end portions 9a-1 and 9a-2, and each of the received exposure lights is plural. It distributes and injects to the injection | emission end part 9b-9f. In other words, the light guide 9 emits the exposure light received from the different incident end portions 9a-1 and 9a-2 from the common exit end portion for each of the exit end portions 9b to 9f.

  The light guide optical systems IL1 to IL5 are respectively configured by using a neutral density filter 10, a collimating lens 11, a fly-eye lens 12, an aperture stop 13 and a condenser lens 14, and corresponding exit ends 9b to 9f and a mask M, respectively. It is arranged between. The neutral density filter 10 can change the attenuation rate of the exposure light emitted from the corresponding emission end portion among the emission end portions 9b to 9f within a predetermined range from 0%, that is, the transmittance is within the predetermined range from 100%. It is a filter that can be changed with. As the neutral density filter 10, for example, as shown in FIG. 5, a filter that changes the neutral density (transmittance) corresponding to the transmission position of the exposure light is used. In FIG. 5, the black portion indicates an opaque region (non-transmission region) for exposure light, and the white portion indicates a transparent region (transmission region) for exposure light. In the neutral density filter 10, the area of the opaque region continuously changes along the X-axis direction, so that the attenuation rate (transmittance) continuously changes corresponding to the exposure light transmission position in that direction. Let

  The collimating lens 11 converts the exposure light that is a divergent light beam transmitted by the neutral density filter 10 into a parallel light beam. The fly-eye lens 12 is a lens element in which a plurality of lens elements are densely two-dimensionally arranged around the optical axis AX2 parallel to the Z axis, and the exposure light emitted by the collimating lens 11 is emitted for each lens element. The light is condensed on the rear focal plane in the vicinity of the surface. As a result, the fly-eye lens 12 forms an image of the exit end face of the exit end corresponding to the exit end 9b to 9f for each lens element, and also serves as a surface light source composed of the images of the plurality of exit end faces. The next light source is formed.

  The aperture stop 13 has an opening whose aperture diameter can be changed, and is provided near the exit end face of the fly-eye lens 12. The aperture stop 13 regulates the numerical aperture (NA) of the exposure light applied to the mask M by limiting the beam diameter of the exposure light emitted from the fly-eye lens 12, that is, the aperture of the secondary light source, and the illumination condition. Is defined as the σ value. Here, the σ value is calculated as the ratio of the aperture of the secondary light source on the pupil plane to the pupil diameter of the corresponding projection optical unit among the projection optical units PL1 to PL5.

  The condenser lens 14 converts the exposure light passed through the aperture stop 13 out of the exposure light emitted from each point of the secondary light source into a parallel light beam, and converts the converted exposure light into the projection optical units PL1 to PL5. The pattern DP located in the pattern area on the mask M defined by the corresponding projection optical unit is irradiated. Thus, for each of the projection optical units PL1 to PL5, the pattern DP in the pattern region is illuminated with exposure light obtained by mixing exposure light emitted from the plurality of light sources 1.

  Here, the exit end portions 9b to 9f of the light guide 9 and the optical elements included in the light guide optical systems IL1 to IL5 are the optical characteristics of the exposure light on the plate P, that is, patterns by the projection optical units PL1 to PL5. In order to adjust the optical characteristics of the exposure light on the conjugate plane of the DP, each can be driven with respect to the optical axis AX2.

  Specifically, each of the exit ends 9b to 9f is provided with a drive mechanism 51, and the drive mechanism 51 can be driven to tilt (tilt drive) in the X-axis direction and the Y-axis direction with respect to the optical axis AX2. Yes. The drive mechanism 51 drives the exit end portions 9b to 9f to be inclined with respect to the optical axis AX2 around the axis including the intersection of the exit end surface and the optical axis AX2, respectively, so that the incident end surfaces of the corresponding fly-eye lenses 12 respectively. The light flux of the exposure light at, that is, the illuminance distribution of the exposure light can be moved in the direction orthogonal to the optical axis AX2. Accordingly, the drive mechanism 51 can change the illuminance distribution inclination component of the exposure light on the mask M and the plate P conjugate with the incident end face of the fly-eye lens 12, that is, the illuminance unevenness accompanying the inclination of the illuminance distribution. .

  FIG. 6 is a diagram illustrating a driving state of the ejection end portion 9 b by the driving mechanism 51. In this figure, (a) shows that the drive mechanism 51 does not drive the exit end 9b, and the exit end face of the exit end 9b is in an initial state perpendicular to the optical axis AX2. Further, (b) shows a state in which the drive mechanism 51 tilts the ejection end portion 9b to the + X side. As shown in this figure, the exposure light at the entrance end face of the fly-eye lens 12 moves in the X-axis direction as the exit end 9b is tilted in the X-axis direction.

  FIG. 7 is a diagram showing an illuminance distribution of exposure light. In this figure, (a) shows the illuminance distribution of the exposure light on the incident end face of the fly-eye lens 12, and (b) shows the conjugate plane of the pattern DP by the projection optical unit PL1 on the plate P conjugate with the incident end face. The illuminance distribution above is shown. When the exit end 9b is in the state shown in FIG. 6A, the illuminance distribution of the exposure light on the incident end face of the fly-eye lens 12 becomes the illuminance distribution PF10 shown in FIG. Is an illuminance distribution PF20 shown in FIG.

  On the other hand, when the exit end 9b is in the state shown in FIG. 6B, the illuminance distribution of the exposure light on the incident end face of the fly-eye lens 12 is as shown in the illuminance distribution PF11 shown in FIG. Thus, the illuminance distribution of the exposure light on the plate P is as shown in an illuminance distribution PF21 shown in FIG. That is, by tilting the exit end portion 9b between the state shown in FIG. 6A and the state shown in FIG. 6B, the slope component of the illuminance distribution of the exposure light on the plate P is shown in FIG. It can be changed between the illuminance distribution PF20 and the illuminance distribution PF21 shown in b).

  The collimating lens 11 is provided with a drive mechanism 53, and the drive mechanism 53 can be linearly driven (shifted) in a direction perpendicular to the optical axis AX2 (X-axis direction and Y-axis direction). The drive mechanism 53 linearly drives the collimator lens 11 with respect to the optical axis AX2, so that the illuminance distribution of the exposure light on the incident end face of the fly-eye lens 12 is orthogonal to the optical axis AX2 relative to the incident end face. It can be moved in the direction. As a result, the drive mechanism 53 can change the slope component of the illuminance distribution of the exposure light on the mask M and the plate P, similarly to the drive mechanism 51.

The condenser lens 14 is provided with a drive mechanism 56, by which an optical member such as at least one lens (hereinafter referred to as a movable lens) included in the condenser lens 14 is X-axis with respect to the optical axis AX2. In the direction and the Y-axis direction, the tilt drive is possible, and the linear drive is possible in the optical axis AX2 direction. The drive mechanism 56 tilts the movable lens of the condenser lens 14 with respect to the optical axis AX2, and thus, similar to the drive mechanisms 51 and 53, the tilt component of the illuminance distribution of the exposure light on the mask M and the plate P is obtained. Can be changed. Further, the drive mechanism 56 linearly drives the movable lens of the condenser lens 14 in the direction of the optical axis AX2, so that the illuminance distribution of the exposure light on the mask M and the plate P is symmetrical about the optical axis AX2 or the axis AX10. The illuminance unevenness associated with the component, that is, the secondary component of the illuminance distribution can be changed. The movable lens that is driven to be tilted by the drive mechanism 56 and the movable lens that is driven linearly are the same member or individual members depending on the configuration of the condenser lens 14 and the like.

  FIG. 8 is a diagram showing the illuminance distribution on the plate P, that is, on the conjugate plane of the pattern DP by the projection optical unit PL1. When the movable lens of the condenser lens 14 is at the reference position in the direction of the optical axis AX2, the illuminance distribution of the exposure light on the plate P is uniform as shown as the illuminance distribution PF20 in FIG. On the other hand, when the drive mechanism 56 drives the movable lens by a predetermined amount from the reference position in the direction of the optical axis AX2, the illuminance distribution on the plate P is axially symmetric about the axis AX10, for example, as shown as the illuminance distribution PF22. To have the following components. That is, by driving the movable lens of the condenser lens 14 by a predetermined amount from the reference position in the optical axis AX2 direction, the axially symmetric components of the illuminance distribution of the exposure light on the plate P are the illuminance distribution PF20 and the illuminance distribution PF22 shown in FIG. Can vary between.

  The neutral density filter 10 is provided with a drive mechanism 52, and the drive mechanism 52 can be linearly driven in a direction perpendicular to the optical axis AX <b> 2 (for example, the X-axis direction). The drive mechanism 52 linearly drives the neutral density filter 10 in a direction perpendicular to the optical axis AX2, thereby changing the extinction ratio (transmittance) of the exposure light transmitted through the neutral density filter 10, and the mask The illuminance (average illuminance, maximum illuminance, minimum illuminance, etc.) of the exposure light on M and the plate P can be changed. Further, the light reducing filter 10 is appropriately linearly driven by the drive mechanism 52 for each of the light guide optical systems IL1 to IL5, that is, for each of the projection optical units PL1 to PL5. It is possible to change the illuminance ratio of the exposure light irradiated on the plate and the illuminance ratio of the exposure light irradiated on the plate P for each of the projection optical units PL1 to PL5.

  The fly-eye lens 12 is provided with a drive mechanism 54, and the drive mechanism 54 can be linearly driven in a direction perpendicular to the optical axis AX2 (X-axis direction and Y-axis direction). The drive mechanism 54 can change the telecentricity of the exposure light on the mask M and the plate P by linearly driving the fly-eye lens 12 in the direction perpendicular to the optical axis AX2. In this case, in particular, the overall inclination component of the telecentricity of the exposure light can be changed in the linear drive direction. Further, the fly-eye lens 12 can be driven in the direction of the optical axis AX2 by the drive mechanism 54. The drive mechanism 54 drives the fly-eye lens 12 in the direction of the optical axis AX2, so that the telecentricity of the exposure light. In particular, the axially symmetric component with respect to the optical axis AX2 can be changed.

  The aperture stop 13 is provided with a drive mechanism 55, and the drive mechanism 55 can be linearly driven in a direction perpendicular to the optical axis AX <b> 2 (X-axis direction and Y-axis direction). The drive mechanism 55 linearly drives the aperture stop 13 in the direction perpendicular to the optical axis AX2, so that the overall inclination of the telecentricity of the exposure light on the mask M and the plate P is the same as that of the drive mechanism 54. The ingredients can be changed. Further, the aperture stop 13 can be driven in the direction of the optical axis AX2 by the drive mechanism 55. The drive mechanism 55 drives the aperture stop 13 in the direction of the optical axis AX2, thereby exposing similarly to the drive mechanism 54. The axially symmetric component with respect to the optical axis AX2 in the telecentricity of light can be changed.

  The drive mechanisms 51 to 56 are electrically connected to the main control system 20 and are driven and controlled by the main control system 20. In addition to the drive mechanisms 51 to 56, the main control system 20 is electrically connected to a light amount detection sensor 16 provided corresponding to each light source 1 and a light source control device 17 that controls electric power supplied to each light source 1. It is connected and controls processing and operations in the light quantity detection sensor 16 and the light source control device 17 together with the drive mechanisms 51 to 56. The main control system 20 controls the drive mechanisms 51 to 56 based on detection information or control information from the light quantity detection sensor 16 or the light source control device 17.

  Here, for example, a light detector is used as the light amount detection sensor 16, and is provided on the back side (light transmission side) of the dichroic mirror 3 with respect to the light source 1 (see FIG. 4). The light quantity detection sensor 16 is disposed at or near the second focal position of the elliptical mirror 2 on the back side of the dichroic mirror 3, and receives the light transmitted through the dichroic mirror 3 out of the light emitted from the light source 1, and calculates the light quantity. To detect. The light transmitted through the dichroic mirror 3 includes light in a wavelength band other than the exposure light, in addition to light in the wavelength band used as exposure light. The light amount detection sensor 16 detects at least one of these lights, and outputs light amount information as a detection result to the main control system 20.

  The light source control device 17 is electrically connected to each light source 1 and a power supply device (not shown) that supplies power to each light source 1. The light source control device 17 controls each power supplied from the power supply device to each light source 1 by controlling the power supply device, and outputs control information corresponding to the control result of this power to the main control system 20. The light source control device 17 detects each power supplied from the power supply device to each light source 1 and outputs power information as a detection result to the main control system 20. Here, the power supply device is provided separately from the light source control device 17, but may be provided integrally with the light source control device 17.

  The main control system 20 detects information corresponding to the light amount ratio of the exposure light emitted by each light source 1 (hereinafter referred to as light amount ratio information) based on the light amount information as the detection result of the light amount detection sensor 16. Specifically, for example, as the light amount information, the light amount detection sensor 16 detects a detection value of each light amount detected for each light source 1, and the light amount ratio information is detected by dividing the detection value of each light amount.

  Further, the main control system 20 detects the light amount ratio information based on the control information corresponding to the control result of the light source control device 17. Specifically, for example, as control information, the light source control device 17 acquires instruction information for turning on or off each light source 1, and detects light amount ratio information corresponding to the instruction information for each light source 1. In this case, the main control system 20 corresponds to the instruction information and the light quantity ratio of each light source 1 is, for example, “1: 1”, “1: 0”, “0: 1”, or “0: 0”. It detects that it is.

  Further, the main control system 20 detects the light amount ratio information based on the power information as the detection result of the light source control device 17. Specifically, as the power information, for example, the detected value of each power detected for each light source 1 by the light source control device 17 is acquired, and the detected light amount ratio information is detected by dividing the detected value of each power. Alternatively, the obtained detection value of each power can be divided into a light amount value by a predetermined calculation to obtain light amount ratio information.

  The main control system 20 thus drives the driving mechanisms 51 to 56 based on at least one of the light quantity ratio information detected based on the light quantity information by the light quantity detection sensor 16 or the control information or power information by the light source control device 17 as described above. Is appropriately controlled to change and adjust the optical characteristics of the exposure light on the plate P, that is, the optical characteristics of the exposure light on the conjugate plane of the pattern DP by the projection optical units PL1 to PL5.

  Thus, the main control system 20 turns on the light source 1 when the lighting state of the light sources 1 is changed, for example, by turning on only one light source among the plurality of light sources 1 and turning off the other light sources. The drive mechanisms 51 to 56 can be appropriately driven and controlled according to the state. The main control system 20 can optimize the optical characteristics of the exposure light on the plate P with respect to the lighting states of the plurality of light sources 1. In addition, for example, when one of the plurality of light sources 1 is turned off due to a lifetime or the like, the main control system 20 controls the drive mechanisms 51 to 56 based on the light amount ratio information detected based on the light amount information. By appropriately controlling the drive, the optical characteristics of the exposure light on the plate P can be optimized.

  At that time, the main control system 20 calculates the driving amount of the optical element corresponding to each of the driving mechanisms 51 to 56 based on the detected light quantity ratio information, for example, and drives the optical element by this calculated driving amount. At least one of the drive mechanisms 51 to 56 is controlled to be driven. Alternatively, the main control system 20 refers to the storage device 19 based on the detected light amount ratio information, acquires the driving amount of each optical element stored in the storage device 19 in association with the light amount ratio information, and It is also possible to drive and control at least one of the driving mechanisms 51 to 56 so that the optical element is driven by the acquired driving amount. In this case, the storage device 19 stores in advance the drive amounts of the optical elements corresponding to the drive mechanisms 51 to 56 for different light quantity ratio information.

  The main control system 20 can also drive control the drive mechanisms 51 to 56 based on the detection result of at least one of the illuminance detection unit 29 and the aerial image detection unit 24. In this case, for example, the detection value of the illuminance for each of the projection optical units PL1 to PL5 by the illuminance detection unit 29 or the detection value of the telecentricity for each of the projection optical units PL1 to PL5 by the aerial image detection unit 24 converges within a predetermined range. As described above, at least one of the drive mechanisms 51 to 56 can be driven.

  Accordingly, the main control system 20 changes the lighting state of the plurality of light sources 1 such as turning on only one light source among the plurality of light sources 1 and turning off the other light sources, or a plurality of light sources 1. When one of the light sources 1 is extinguished due to factors such as lifetime, the optical characteristics of the exposure light on the plate P can be corrected as appropriate, and changes in the optical characteristics can be suppressed. Note that drive control of the drive mechanisms 51 to 56 based on the detection result of at least one of the illuminance detection unit 29 and the aerial image detection unit 24 can be performed in combination with drive control based on the light amount ratio information or individually.

  Here, the main control system 20 detects the light amount ratio information based on the light amount information by the light amount detection sensor 16 and the control information and power information by the light source control device 17. The light amount ratio information may be detected based on any one of information, control information, and power information. Alternatively, the main control system 20 may detect the light amount ratio information based on instruction information input from an operator of the exposure apparatus 100 via an information input unit (not shown). Here, the instruction information includes, for example, information that instructs to turn on or off each light source 1. Further, here, the main control system 20 acquires the respective drive amounts of the optical elements corresponding to the drive mechanisms 51 to 56, but acquires only the drive amounts of the optical elements that are predetermined or appropriately selected. It doesn't matter.

  Next, a procedure for exposing the plate P by the exposure apparatus 100 will be described. FIG. 9 is a flowchart showing the exposure processing procedure. The exposure processing procedure shown in this figure is processed by the main control system 20 executing a predetermined processing program stored in the storage device 19. First, the main control system 20 reads an exposure data file stored in advance in the storage device 19 (step S10), and switches the wavelength selection filters 6 and 7 according to the contents of the exposure data file (step S11).

  In step S10, the main control system 20 acquires various information necessary for the exposure processing of the plate P based on the exposure data file. This exposure data file includes, for example, information on the characteristics (eg, sensitivity characteristics) of a photosensitive material such as a resist applied to the plate P to be exposed, the resolution required for transferring the pattern DP, the mask M to be used, and the wavelength selection. This includes selection instruction information for the filters 6 and 7, adjustment information for the illumination optical system IL, adjustment information for the projection optical system PL, information about the flatness of the plate P, and the like.

  Subsequently, the main control system 20 illuminates the mask M with the illumination optical system IL, and detects optical characteristics such as illuminance unevenness of each exposure light irradiated on the plate P via the projection optical units PL1 to PL5. The light amount ratio information of the light source 1 is detected (step S12), and the illumination optical system IL is adjusted based on the detected value of the optical characteristic, the light amount ratio information, the adjustment information of the illumination optical system IL in the exposure data file, and the like (step S12). Step S13).

  In step S12, the main control system 20 uses the illuminance detection unit 29 to detect various types of information relating to illuminance such as the illuminance distribution, illuminance unevenness, and average illuminance of the exposure light on the conjugate plane of the pattern DP by the projection optical units PL1 to PL5. The aerial image detector 24 detects the telecentricity of the exposure light on the conjugate plane of the pattern DP. Further, the main control system 20 detects the light amount ratio information by acquiring at least one of the light amount information by the light amount detection sensor 16 and the control information and power information by the light source control device 17.

  In step S13, the main control system 20 appropriately drives and controls the drive mechanisms 51 to 56 based on the detected values of the optical characteristics, the light amount ratio information, the adjustment information of the illumination optical system IL, and the like, for each of the projection optical units PL1 to PL5. The illuminance unevenness and telecentricity of the exposure light on the conjugate plane of the pattern DP and the illuminance ratio of the exposure light between the projection optical units in the projection optical units PL1 to PL5 are appropriately adjusted. The main control system 20 can converge the optical characteristics of the exposure light on the conjugate plane of the pattern DP within a desired range by appropriately repeating steps S12 and S13.

  Subsequently, the main control system 20 detects projection images of the reference pattern (not shown) formed on the mask stage MS by the projection optical units PL1 to PL5 (step S14), and the detection result and the projection in the exposure data file. The projection optical system PL is adjusted based on the adjustment information of the optical system PL (step S15).

  In step S <b> 14, the main control system 20 detects the projection images of the reference pattern projection optical units PL <b> 1 to PL <b> 5 by the aerial image detection unit 24, and their size, projection position, focus position, rotation amount, array Measure errors. In step S15, the main control system 20 appropriately drives and controls the drive mechanisms 39 to 43 based on the measurement result and the adjustment information of the projection optical system PL, and projects the projection image by the projection optical units PL1 to PL5. The magnification, projection position, focus position, and rotation are adjusted as appropriate. Note that the main control system 20 can converge the projection magnification, projection position, focus position, and rotation of the projected image within a desired range by appropriately repeating steps S14 and S15.

  Subsequently, the main control system 20 measures the position of the reference member 28 using the alignment devices 27a and 27b (step S16), and then, based on information on the mask M to be used in the exposure data file, etc. M is carried in and placed on the mask stage MS, and the plate P is carried in and placed on the plate stage PS (step S17). Then, the main control system 20 uses the alignment devices 27a and 27b and the focus detection device, and performs relative alignment between the mask M and the plate P based on the detection result (step S18).

  In step S18, the main control system 20 positions a shot area to which the pattern DP of the mask M is to be transferred among a plurality of preset areas set on the plate P in the vicinity of the pattern projection area by the projection optical system PL. As described above, the relative alignment between the mask M and the plate P is performed. Further, the alignment of the conjugate plane of the pattern DP and the exposure surface of the plate P by the projection optical system PL, that is, focusing is performed.

Subsequently, the main control system 20 transfers the pattern DP of the mask M to the shot area on the plate P (step S19), and determines whether there is another shot area to be exposed (step S20). If it is determined that there is a shot area to be exposed (step S
20: Yes), the shot area corresponding to the pattern transfer area is switched (step S).
21) The processing from step S18 is repeated.

  On the other hand, if it is determined that there is no shot area to be exposed (step S20: No), the main control system 20 determines whether or not the exposure has been completed for all the plates P to be exposed (step S22). ) If all the plates P have not been exposed (step S22: No), the plates P are exchanged (step S23), and the processing from step S18 is repeated. If exposure has been completed for all the plates P (step S22: Yes), the main control system 20 ends a series of exposure processes.

  In step S19, the main control system 20 irradiates a part of the pattern DP with the exposure light by the illumination optical system IL, and scans the mask M and the plate P in synchronization with the X-axis direction by the scanning drive mechanism. The entire pattern DP is transferred to one shot area on the plate P. In step S21, the main control system 20 switches the shot area corresponding to the pattern projection area by moving the plate P using at least one of the scanning drive mechanism and the step drive mechanism. The main control system 20 transfers the pattern DP to each shot area on the plate P by repeating these steps S19 and S21. In steps S21 and S22, the main control system 20 can also replace the mask M as necessary.

  Next, a device manufacturing method using the exposure apparatus 100 will be described. FIG. 10 is a flowchart showing a manufacturing process of a semiconductor device. As shown in this figure, in the semiconductor device manufacturing process, a metal film is vapor-deposited on a wafer to be a substrate of a semiconductor device (step S40), and a photoresist, which is a photosensitive material, is applied onto the vapor-deposited metal film ( Step S42). Subsequently, by using the exposure apparatus 100, the pattern DP formed on the mask M is transferred to each shot area on the wafer (step S44: exposure process), and the development of the wafer after the transfer, that is, the pattern DP is transferred. The developed photoresist is developed (step S46: development step). Thereafter, using the resist pattern generated on the wafer surface in step S46 as a mask, processing such as etching is performed on the wafer surface (step S48: processing step).

  Here, the resist pattern is a photoresist layer in which unevenness having a shape corresponding to the pattern DP transferred by the exposure apparatus 100 is generated, and the recess penetrates the photoresist layer. In step S48, the wafer surface is processed through this resist pattern. The processing performed in step S48 includes at least one of etching of the wafer surface or film formation of a metal film, for example. In step S44, the exposure apparatus 100 transfers the pattern DP using the wafer coated with the photoresist as the photosensitive substrate, that is, the plate P.

  FIG. 11 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. As shown in this figure, in the liquid crystal device manufacturing process, a pattern forming process (step S50), a color filter forming process (step S52), a cell assembling process (step S54) and a module assembling process (step S56) are sequentially performed.

  In the pattern forming process of step S50, a predetermined pattern such as a circuit pattern and an electrode pattern is formed on the glass substrate coated with a photoresist as the plate P using the exposure apparatus 100. In this pattern formation step, an exposure step of transferring the pattern DP to the photoresist layer using the exposure apparatus 100, development of the plate P to which the pattern DP has been transferred, that is, development of the photoresist layer on the glass substrate, A development step for generating a photoresist layer having a shape corresponding to the pattern DP and a processing step for processing the surface of the glass substrate through the developed photoresist layer are included.

  In the color filter forming step in step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three of R, G, and B are arranged. A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction.

  In the cell assembly process in step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate on which the predetermined pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter.

  In the module assembling process in step S56, various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.

  As described above, in the exposure apparatus 100 according to the present embodiment, the exposure light emitted from the plurality of light sources 1 is mixed, and the mixed exposure light is irradiated onto the pattern DP positioned on a predetermined plane set in advance. A plurality of projection optical units PL1 to PL5 that form an image of a pattern DP on a plate P as a photosensitive substrate positioned on a conjugate plane of the optical system IL and exposure light via the pattern DP. Driving mechanisms 51 to 56 as adjustment means for driving an optical element included in at least one of the illumination optical system IL or the projection optical units PL1 to PL5 and changing the optical characteristics of the exposure light on the conjugate plane of the pattern DP; The information corresponding to the amount of each exposure light emitted from one light source 1 as the first light source and the other light source 1 as the second light source among the plurality of light sources 1 is also included. In addition, information corresponding to the light intensity ratio of each exposure light is detected, and at least one of the driving mechanisms 51 to 56 is used to change the optical characteristics of the exposure light based on the detection result. Therefore, the optical characteristics of the exposure light with respect to the plate P can be adjusted in accordance with the light quantity ratio of each exposure light emitted from the plurality of light sources 1, and the plate P has high accuracy. The pattern DP can be transferred to the surface.

  So far, the best mode for carrying out the present invention has been described as an embodiment. However, the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the spirit of the present invention. Is possible.

  For example, in the above-described embodiment, the exposure apparatus 100 includes the drive mechanisms 51 to 56, and the emission ends 9 b to 9 f of the light guide 9, the neutral density filter 10, the collimator lens 11, and the fly-eye lens by the drive mechanisms. 12, the aperture stop 13 and the movable lens of the condenser lens 14 can be driven. However, it is not always necessary to provide all the driving mechanisms 51 to 56, and only a part of them may be provided. Specifically, for example, any one of the drive mechanisms 51, 53, and 56 can be provided as a mechanism for adjusting the inclination component of the illuminance distribution of the exposure light.

  In the above-described embodiment, the light amount detection sensor 16 detects light transmitted through the dichroic mirror 3 out of light emitted from the light source 1, but is not limited to light transmitted through the dichroic mirror 3. A part of the exposure light reflected by the dichroic mirror 3 may be detected. In this case, for example, a part of the exposure light is branched in the optical path from the dichroic mirror 3 to the mask M, and the branched exposure light can be detected by the light amount detection sensor 16. Alternatively, the illuminance detection unit 29 may be used as a light amount detection sensor to detect the light amount of exposure light via the projection optical system PL.

  In the above-described embodiment, the projection optical system PL includes the projection optical units PL1 to PL5. That is, the projection optical system PL includes five sets of projection optical units. It is good also as a structure provided. Specifically, for example, only one set of projection optical units may be provided. The projection optical units PL1 to PL5 are catadioptric imaging optical systems. However, the projection optical units PL1 to PL5 are not limited to the catadioptric system, and are not limited to a catadioptric system. A reflective imaging optical system that is not used may be used.

  In the above-described embodiment, the light source 1 is described as a lamp light source using an ultra-high pressure mercury lamp or the like, but is not limited to the lamp light source, and may be a laser light source such as an excimer laser. In this case, the illumination optical system IL may use a beam expander or the like that enlarges and shapes the beam emitted from the laser light source, instead of the elliptical mirror 2 and the collimating lens 5.

  In the above-described embodiment, the exposure apparatus 100 transfers the pattern DP formed on the transmission mask M that transmits the exposure light onto the plate P. The pattern DP formed on the mask M of the mold may be transferred. Furthermore, the exposure apparatus 100 is not limited to using a mask on which a fixed pattern is formed, and a variable pattern mask capable of changing the pattern shape as appropriate can be used. Examples of the variable pattern mask include a programmable LCD array (see US Pat. No. 5,229,872), a programmable mirror array such as DMD (see US Pat. No. 5,296,891), or a matrix (array). A variable pattern generator such as a self-luminous mask having a light emitting point can be used. Here, the variable pattern generator has a matrix addressable surface that transmits, reflects or emits exposure light only in the addressed region, and the exposure light is patterned according to the addressing pattern on the matrix addressable surface. Yes. The necessary addressing is performed using suitable electronic means. At this time, the matrix addressable surface is positioned on a predetermined surface set between the illumination optical system IL and the projection optical system PL.

  In the above-described embodiment, the exposure apparatus 100 is a movable lens in the neutral density filter 10, the collimator lens 11, the fly-eye lens 12, the aperture stop 13, or the condenser lens 14 provided in each of the light guide optical systems L1 to L5. The optical characteristic of the exposure light on the plate P is changed by using at least one, so that, for example, the exposure amount on the plate P is made uniform in each shot area, but the optical characteristic of the exposure light is changed. Instead, the exposure amount in each shot area can be made uniform by changing the pattern transfer area by the projection optical units PL1 to PL5. Specifically, for example, when an inclination component occurs in the illuminance distribution of the exposure light in the direction orthogonal to the scanning direction of the plate P by the scanning drive mechanism, the size of each field stop AS provided in the projection optical units PL1 to PL5 is set. The exposure amount in the shot area can be made uniform by appropriately making it asymmetrical with respect to the scanning direction of the plate P corresponding to the degree of the gradient component of the illuminance distribution. In this case, the width in the scanning direction of the field stop AS corresponding to the side with the high illuminance distribution in the direction orthogonal to the scanning direction may be narrower than the width corresponding to the side with the low illuminance distribution.

It is a figure which shows the structure of the exposure apparatus concerning embodiment of this invention. It is a figure which shows the structure of the projection optical unit with which a projection optical system is provided. It is a figure which shows the structure of an illumination optical system. It is a figure which shows the structure of the introduction optical system with which an illumination optical system is provided, and a light guide optical system. It is a figure which shows the structure of the neutral density filter with which a light guide optical system is provided. It is a figure which shows the inclination drive state of the injection | emission end part of a writer guide. It is a figure which shows the illumination intensity distribution of the exposure light on a fly eye lens and a plate. It is a figure which shows the illumination intensity distribution of the exposure light on a plate. It is a flowchart which shows the exposure process procedure which the exposure apparatus concerning Embodiment performs. It is a flowchart which shows the manufacturing process of the semiconductor device manufactured using the exposure apparatus concerning embodiment. It is a flowchart which shows the manufacturing process of the liquid crystal device manufactured using the exposure apparatus concerning embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light source 9 Light guide 10 Neutralizing filter 11 Collimating lens 12 Fly eye lens 13 Aperture stop 14 Condenser lens 16 Light quantity detection sensor 17 Light source control device 18 Drive device 19 Storage device 20 Main control system 24 Spatial image detection unit 29 Illuminance detection unit 51 -56 Drive mechanism 100 Exposure apparatus DP pattern IL Illumination optical system IL1-IL5 Light guide optical system ILa, ILb Introduction optical system M Mask P plate PL Projection optical system PL1-PL5 Projection optical unit

Claims (13)

An illumination unit that mixes exposure light emitted from a plurality of light sources and irradiates a pattern positioned on a predetermined surface, and a photosensitive substrate positioned on a conjugate plane of the predetermined surface based on the exposure light via the pattern In an exposure apparatus comprising a projection means for forming an image of the pattern
Adjusting means for driving an optical element included in at least one of the illuminating means or the projecting means to change the optical characteristics of the exposure light on the conjugate plane;
Detecting means for detecting information corresponding to the light quantity ratio of each exposure light based on information corresponding to the light quantity of each exposure light emitted from the first light source and the second light source of the plurality of light sources;
Adjustment control means for changing the optical characteristics using the adjustment means based on the detection result of the detection means;
An exposure apparatus comprising: A light amount detecting means for detecting a light amount of each exposure light emitted from the first light source and the second light source;
The exposure apparatus according to claim 1, wherein the detection unit detects information corresponding to the light amount ratio based on a detection result of the light amount detection unit. Power detection means for detecting each power supplied to the first light source and the second light source;
The exposure apparatus according to claim 1, wherein the detection unit detects information corresponding to the light amount ratio based on a detection result of the power detection unit. Power control means for controlling each power supplied to the first light source and the second light source;
The exposure apparatus according to claim 1, wherein the detection unit detects information corresponding to the light amount ratio based on control information of the power control unit. Storage means for storing in advance the driving amount of the optical element in association with information corresponding to the light amount ratio;
2. The adjustment control unit changes the optical characteristic based on the driving amount stored in the storage unit in association with information corresponding to the light amount ratio detected by the detection unit. The exposure apparatus according to any one of -4.   The adjustment control unit calculates a driving amount of the optical element based on information corresponding to the light amount ratio detected by the detecting unit, and changes the optical characteristics based on the calculated driving amount. The exposure apparatus according to any one of claims 1 to 4. An optical property detecting means for detecting the optical property;
The said adjustment control means changes the said optical characteristic so that the detected value of the said optical characteristic by the said optical characteristic detection means may be in a predetermined range, The Claim 1 characterized by the above-mentioned. Exposure device. The illumination means includes
A light transmission member that receives each exposure light emitted from the plurality of light sources from a different incident end and emits the light from a common exit end;
A light guide optical system that includes the optical element and guides the exposure light emitted from the emission end to the pattern;
The exposure apparatus according to claim 1, wherein the exposure apparatus includes: The illumination means includes
A light transmission member that receives each exposure light emitted from the plurality of light sources from different incident end portions, distributes the received exposure light to the plurality of exit end portions, and emits the light;
A light guide optical system group that includes the optical element for each of a plurality of the emission ends, and guides the exposure light emitted from the emission ends to the pattern,
The exposure apparatus according to claim 1, wherein the exposure apparatus includes:   The exposure apparatus according to claim 1, wherein the optical characteristic is illuminance unevenness or telecentricity of the exposure light on the conjugate plane.   The exposure apparatus according to claim 9, wherein the optical characteristic is an illuminance ratio at the conjugate plane of each exposure light emitted for each of the plurality of exit end portions.   The exposure apparatus according to claim 1, wherein the number of the light sources is two. An exposure step of transferring the pattern onto the photosensitive substrate using the exposure apparatus according to any one of claims 1 to 12,
Developing the photosensitive substrate to which the pattern is transferred, and developing a mask layer having a shape corresponding to the pattern on the surface of the photosensitive substrate;
A processing step of processing the surface of the photosensitive substrate through the mask layer;
A device manufacturing method comprising:

Images