JP2013213983A - Exposure apparatus and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus which can efficiently expose a sheet substrate while preventing complication of a structure.SOLUTION: An exposure apparatus transfers a pattern formed on a mask DM to a sheet substrate P. The exposure apparatus includes a mask holding part 12 that is formed in a cylindrical shape, holds the mask along a first cylindrical surface and is rotatable about a predetermined axis line AX1, a substrate holding part 22 that is formed in a cylindrical shape, holds the substrate along a second cylindrical surface and is rotatable about a predetermined axis line AX2, projection optical systems PL1-PL3 that project an image of the pattern onto the substrate under a predetermined magnification, and a drive unit for rotationally driving the mask holding part and the substrate holding part integrally.

Description

  The present invention relates to an exposure apparatus and a device manufacturing method.

  A substrate processing apparatus such as an exposure apparatus is used for manufacturing various devices as described in Patent Document 1 below, for example. The substrate processing apparatus can project an image of a pattern formed on the mask M arranged in the illumination area onto a substrate or the like arranged in the projection area. The mask M used in the substrate processing apparatus includes a planar one and a cylindrical one. When a cylindrical mask is used, it is not necessary to reciprocate the stage or use a plurality of stages for holding the mask, and the cost can be reduced.

  As one of the methods for manufacturing a device, for example, a roll-to-roll method as described in Patent Document 2 below is known. The roll-to-roll system is a system in which various processes are performed on a substrate on a transport path while a substrate such as a film is transported from a delivery roll to a collection roll. The substrate may be processed in a substantially flat state, for example, between transport rollers. Further, the substrate may be processed in a curved state, for example, on the surface of a roller.

JP 2007-299918 A International Publication No. 2008/1229819

However, the following problems exist in the conventional technology as described above.
It is necessary to synchronize the rotation of the cylindrical mask and the rotation of the conveyance roller that holds the substrate in a curved manner with high accuracy. To realize this, there arises a problem that the structure becomes complicated.

  The present invention has been made in consideration of the above points, and an object thereof is to provide an exposure apparatus and a device manufacturing method capable of efficiently exposing a sheet-like substrate while preventing the structure from becoming complicated. To do.

  According to a first aspect of the present invention, there is provided an exposure apparatus for transferring a pattern formed on a mask onto a sheet-like substrate, wherein the exposure apparatus is formed in a cylindrical shape and holds the mask along the first cylindrical surface. A mask holding portion that can rotate around an axis, a substrate holding portion that is formed in a cylindrical shape and holds the substrate along the second cylindrical surface and can rotate around a predetermined axis, and a pattern image on the substrate at a predetermined magnification An exposure apparatus is provided that includes a projection optical system for projecting, and a driving device that integrally rotates the mask holding unit and the substrate holding unit.

  According to a second aspect of the present invention, there is provided a device manufacturing method for processing a substrate to manufacture a device, using the exposure apparatus according to the first aspect of the present invention to transfer a pattern to the substrate; And processing a substrate on which the pattern has been transferred based on the pattern.

  In the present invention, it is possible to efficiently perform exposure processing on a sheet-like substrate while preventing the structure from becoming complicated.

1 is a schematic block diagram of an exposure apparatus EX according to a first embodiment. The schematic side view which looked at the exposure apparatus EX from the + Y side. The development view of mask holding part 12 and cylindrical mask DM. FIG. FIG. 10 is a schematic block diagram of an exposure apparatus EX according to a second embodiment. The development view of the mask holding part and cylindrical mask concerning a 2nd embodiment. The expanded view of the board | substrate holding | maintenance part 22 which concerns on 2nd Embodiment. FIG. 10 is a schematic block diagram of an exposure apparatus EX according to a third embodiment. FIG. 2 is a view showing an example of a projection optical system constituting the exposure apparatus. It is a flowchart which shows the device manufacturing method of this embodiment. FIG. 10 is a schematic block diagram of an exposure apparatus EX according to another embodiment.

Embodiments of the exposure apparatus and device manufacturing method of the present invention will be described below with reference to FIGS.
(First embodiment)
FIG. 1 is a schematic block diagram of an exposure apparatus EX according to the first embodiment, and FIG. 2 is a schematic side view of the exposure apparatus EX shown in FIG. 1 viewed from the + Y side.
The exposure apparatus EX is a so-called scanning exposure apparatus, and is illuminated with illumination light from the illumination optical systems IL1 to IL3 while synchronously driving rotation of the cylindrical mask (mask) DM and feeding of the flexible substrate P. The image of the pattern formed on the cylindrical mask DM is projected onto the substrate P via the erecting equal magnification projection optical system PL (PL1 to PL3). 1 to 11, the Y axis of the orthogonal coordinate system XYZ is set parallel to the rotation center line AX of the cylindrical cylindrical mask DM, and the Z axis is the direction of scanning exposure, that is, the substrate P in the exposure position. Set to the transport direction.

  In this embodiment, the board | substrate P is a board | substrate which has flexibility (flexibility) like what is called a flexible substrate. The exposure apparatus EX of the present embodiment can manufacture a flexible device by using the flexible substrate P. The substrate P is selected so as to be flexible enough not to be broken when bent in the exposure apparatus EX.

  The flexibility of the substrate P during the exposure process can be adjusted by, for example, the material, size, thickness, and the like of the substrate P, and is adjusted by environmental conditions such as humidity and temperature during the exposure process. You can also.

  The board | substrate P which has flexibility is foil (foil) etc. which consist of metals or alloys, such as a resin film and stainless steel, for example. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.

  For example, the substrate P is set with characteristics such as a coefficient of thermal expansion so that the amount of deformation caused by heat in various processes applied to the substrate P can be substantially ignored. The thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.

  The cylindrical mask DM is held by a mask holding unit (first cylindrical body) 12. The mask holding unit 12 holds the cylindrical mask DM in a cylindrical shape on the outer peripheral surface thereof, and rotates around the first rotation axis AX1 extending in the Y direction. The cylindrical mask DM is produced as a transmission type planar sheet mask in which a pattern is formed with a light-shielding layer such as chrome on one surface of a strip-shaped ultrathin glass plate having a good flatness (for example, a thickness of 100 to 500 μm). It is used in a state where it is curved along the outer peripheral surface of the mask holding portion 12 and wound (attached) around the outer peripheral surface. The cylindrical mask DM may be integrated by drawing a mask pattern made of a light shielding layer such as chrome directly on the outer peripheral surface of the mask holding portion 12 made of a transparent cylindrical base material. Also in this case, the mask holding part functions as a support member for the cylindrical mask DM.

The substrate P is pulled out from a supply roll (not shown), held on a substrate holding part (second cylindrical body) 22, and after being subjected to an exposure process, is wound up on a collection roll (not shown).
The substrate holding part 22 holds the substrate P in a cylindrical shape by a part of the outer peripheral surface, and rotates around the second rotation axis AX2 extending in the Y direction. The second rotation axis AX2 is coaxially connected to the first rotation axis AX1, and is connected to the coupling member (connection device) 14 so as to be integrally rotatable and detachable. The radius of the mask holding unit 12 and the radius of the substrate holding unit 22 are the same radius as the pattern surface of the cylindrical mask DM held by the mask holding unit 12 and the exposure surface of the substrate P held by the substrate holding unit 22. That is, the value is set to the same peripheral speed (rotational speed). In the present embodiment, the mask holding unit 12 and the substrate holding unit 22 are rotated by torque supplied from a driving unit (not shown) including an actuator such as an electric motor via the first and second rotating shafts AX1 and AX2. To do.

  The illumination optical systems IL1 to IL3 are separated in the direction around the first rotation axis AX1, as shown in FIG. 2, using a part of the cylindrical mask DM (illumination regions IR1 to IR3) held by the mask holding unit 12 as a pattern region. Illuminate with uniform brightness at the selected position. As a light source of illumination light, for example, bright lines (g line, h line, i line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength) 193 nm).

FIG. 3 is a development view of the mask holding unit 12 and the cylindrical mask DM. 3 indicates the moving direction (rotating direction) of the mask holding unit 12 and the cylindrical mask DM.
As shown in FIG. 3, each of the illumination areas IR1 to IR3 is arranged such that the triangular portions of the oblique sides of the trapezoidal illumination areas adjacent in the Y direction overlap (overlapping). Therefore, for example, a region on the cylindrical mask DM that passes through the illumination region IR1 due to the rotation of the mask holding unit 12 partially overlaps a region on the cylindrical mask DM that passes through the illumination region IR2 due to the rotation of the mask holding unit 12.

  In the present embodiment, the pattern formation area MA of the cylindrical mask DM moves in the direction Xs as the mask holding unit 12 rotates, and the partial areas in the Y-axis direction of the pattern formation areas are illumination areas IR1 to IR3. To go through either. In other words, the illumination areas IR1 to IR3 are arranged so as to cover the entire width of the pattern formation area in the Y-axis direction.

  Each projection optical system PL1 to PL3 corresponds to each of the illumination optical systems IL1 to IL3, and FIG. 4 shows an image of the pattern of the cylindrical mask DM in the illumination areas IR1 to IR3 illuminated by the illumination optical systems IL1 to IL3. As shown in the figure, the image is projected on the substrate P to the corresponding projection areas PA1 to PA3 at an erecting equal magnification. Each of the projection optical systems PL1 to PL3 includes a first projection module PL11 to PL13 that is disposed to face the illumination areas IR1 to IR3 of the cylindrical mask DM, and a second projection module PL21 to PL that is disposed to face the projection areas PA1 to PA3. PL23, reflection members RF11 to RF13 and RF21 to RF23 disposed between the projection modules are provided.

  Each of the projection areas PA1 to PA3, when viewed along the circumferential direction around the second rotation axis AX2, the adjacent projection area in the direction of the second rotation axis AX2 and an end (a trapezoidal triangular portion) overlap each other. Has been placed. Therefore, for example, the area on the substrate P that passes through the projection area PA1 due to the rotation of the substrate holder 22 partially overlaps with the area on the substrate P that passes through the projection area PA2 due to the rotation of the substrate holder 22. The projection area PA1 and the projection area PA2 have respective shapes and the like so that the exposure amount in the overlapping area in the circumferential direction is substantially the same as the exposure amount in the non-overlapping area.

  In the exposure apparatus EX configured as described above, the first rotary shaft AX1 and the second rotary shaft AX2 are rotationally driven by the drive unit, whereby the mask holding unit 12 and the substrate holding unit 22 rotate integrally. The cylindrical mask DM held by the mask holding unit 12 is illuminated with illumination light from the illumination optical systems IL1 to IL3, and an image of the pattern of the cylindrical mask DM in each of the illumination regions IR1 to IR3 is transmitted to the projection optical system PL. Through the projection areas PA1 to PA3 on the substrate P.

  At this time, the mask holding unit 12 and the substrate holding unit 22 rotate at the same angular velocity because the first rotation axis AX1 and the second rotation axis AX2 are integrally connected and coupled. Since the pattern surface of the cylindrical mask DM and the photosensitive surface of the substrate P are on the same radius, the exposure process is performed with each surface rotated at the same peripheral speed, and three projections are applied to the substrate P. A pattern is formed by combining the images projected on the areas PA1 to PA3.

  In this embodiment, when exchanging the cylindrical mask DM, after the coupling between the first rotation axis AX1 and the second rotation axis AX2 by the coupling member 14 is released, the first rotation axis AX1 and the mask holding unit 12 are released. The cylindrical mask DM may be replaced integrally.

  As described above, in the present embodiment, since the first rotation axis AX1 and the second rotation axis AX2 are coupled and the mask holding unit 12 and the substrate holding unit 22 are integrally rotated, the mask holding unit 12 and It is possible to continuously expose the pattern of the cylindrical mask DM onto the substrate P without providing a separate mechanism for synchronizing the substrate holding part 22, that is, the cylindrical mask DM and the substrate P, while preventing the structure from becoming complicated. The pattern of the cylindrical mask DM can be efficiently formed on the substrate P.

  Further, in the present embodiment, since the first rotation axis AX1 and the second rotation axis AX2 are detachably connected by the coupling member 14, the cylindrical mask DM previously held in another mask holding portion can be easily attached. It becomes possible to exchange.

(Second Embodiment)
Next, a second embodiment of the exposure apparatus EX will be described with reference to FIGS.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.
In the first embodiment, the pattern of one cylindrical mask DM is exposed on the substrate P. However, in this embodiment, a plurality of (in this case, two) cylindrical masks are used and a larger pattern is exposed on the substrate P. The case where it does is demonstrated.

FIG. 5 is a schematic block diagram of an exposure apparatus EX according to the second embodiment.
In the exposure apparatus EX of the present embodiment, mask holding units 12A and 12B are disposed on both sides in the Y direction across the substrate holding unit 22, and projection optical systems PL1A to PL2A are provided corresponding to the mask holding unit 12A. Projection optical systems PL1B to PL2B are provided corresponding to the mask holding unit 12B.

  The mask holding part 12A holds the cylindrical mask DMA in a cylindrical shape on its outer peripheral surface, and rotates around the first rotation axis AX1A extending in the Y direction. Similarly, the mask holding part 12B holds the cylindrical mask DMB in a cylindrical shape on its outer peripheral surface, and rotates around the first rotation axis AX1B extending in the Y direction. The width of the substrate P in the Y direction is set to about twice that of the cylindrical masks DMA and DMB (about the total width of the cylindrical masks DMA and DMB).

  The second rotation axis AX2 is coaxially connected to the first rotation axis AX1A and is integrally and detachably connected by a coupling member (connection device) 14A, and is coaxially coupled to the first rotation axis AX1B. The member (connection device) 14B is integrally connected to be rotatable and detachable.

  As shown in FIG. 6, the cylindrical mask DMA is illuminated with illumination light from an illumination optical system having illumination areas IR1A and IR2A. The two illumination areas IR1A and IR2A are spaced apart from each other in the circumferential direction so that the triangular portions of the hypotenuses of the trapezoidal illumination areas adjacent in the Y direction overlap in the circumferential direction (so as to overlap). . Similarly, the cylindrical mask DMB is illuminated with illumination light from an illumination optical system having illumination areas IR1B and IR2B. The two illumination regions IR1B and IR2B are spaced apart from each other in the circumferential direction so that the triangular portions of the hypotenuses of adjacent trapezoidal illumination regions in the Y direction overlap in the circumferential direction (so as to overlap). .

  The projection optical system PL1A projects an image of the pattern of the cylindrical mask DMA in the illumination area IR1A onto the corresponding projection area PA1A on the substrate P at an equal magnification as shown in FIG. The projection optical system PL2A projects an image of the pattern of the cylindrical mask DMA in the illumination area IR2A onto the corresponding projection area PA2A on the substrate P at an erecting equal magnification. Similarly, the projection optical system PL1B projects an image of the pattern of the cylindrical mask DMB in the illumination area IR1B onto the corresponding projection area PA1B on the substrate P at an equal magnification, and the projection optical system PL2B is a cylinder in the illumination area IR2B. An image of the pattern of the mask DMB is projected onto the corresponding projection area PA2B on the substrate P at an erecting equal magnification.

  When viewed along the circumferential direction around the second rotation axis AX2, each of the projection areas PA1A to PA2B overlaps with an adjacent projection area in the second rotation axis AX2 direction and an end (trapezoidal triangular portion). Is arranged. Therefore, in the projection areas PA1A to PA2B, the exposure amount in the overlapping area in the circumferential direction is substantially the same as the exposure amount in the non-overlapping area.

  Therefore, in this embodiment, in addition to the same operation and effect as the first embodiment, the pattern of the cylindrical mask DMA and the pattern of the cylindrical mask DMB are synthesized and transferred onto the substrate P. As a result, a pattern having a larger area can be efficiently formed on the substrate P while preventing the structure from becoming complicated.

(Third embodiment)
Next, a third embodiment of the exposure apparatus EX will be described with reference to FIGS.
In these drawings, the same components as those in the first and second embodiments shown in FIGS. 1 to 7 are denoted by the same reference numerals, and the description thereof is omitted.
In the first and second embodiments, the mask holding unit 12 and the substrate holding unit 22 are separately provided. However, in the third embodiment, the mask holding unit 12 and the substrate holding unit 22 are one cylindrical member. The example comprised by is demonstrated.

FIG. 8A is a schematic view of the exposure apparatus EX viewed from the Y direction, FIG. 8B is a schematic view of the exposure apparatus EX viewed from the Z direction, and FIG. 9 is a schematic configuration diagram of a projection optical system that constitutes the exposure apparatus EX.
In the exposure apparatus EX of the present embodiment, the mask holding unit 12 that holds the cylindrical mask DM constitutes the substrate holding unit 22.

  That is, in the mask holding unit 12, a partial region of the −X side cylindrical surface (outer peripheral surface) constitutes a substrate holding unit 22 that holds the wound substrate P and the holding rod 19. The illumination optical system IL is disposed opposite to the area where the substrate P on the + X side of the mask holding unit 12 is not held, and the image of the pattern of the cylindrical mask DM in the illumination area IR of the illumination optical system IL is reflected by the projection optical system PL. Thus, the image is projected onto the substrate P held by the substrate holding unit 22 as an inverted image of the same magnification.

  The projection optical system PL includes a first partial optical system PP1 that receives the pattern image of the cylindrical mask DM illuminated by the illumination optical system IL, a second partial optical system PP2 that projects the pattern image of the cylindrical mask DM onto the substrate P, and these Is provided with a third partial optical system PP3. FIG. 9 shows an example of the first and second partial optical systems PP1 and PP2. Since the first and second partial optical systems PP1 and PP2 have substantially the same configuration, in FIG. 9, the side that receives the pattern image from the cylindrical mask DM is the first partial optical system PP1, and the substrate P The side on which the pattern image is projected is defined as a second partial optical system PP2.

  The first partial optical system PP1 has a concave mirror or the like that returns a light beam incident from the cylindrical mask DM and traveling along the first optical axis AX11 parallel to the X direction to the second optical axis AX12 parallel to the first optical axis AX. Then, a first intermediate image is formed at the image plane position MI1 between the third partial optical system PP3. The third partial optical system PP3 receives a light beam that has passed through the first partial optical system PP1, and forms a second intermediate image at an image plane position MI2 with the second partial optical system PP2. In the second partial optical system PP2, a light beam that has passed through the third partial optical system PP3 is incident along the second optical axis AX12, and is turned back into a light beam along the first optical axis AX1 by a concave mirror or the like. Project.

  In the exposure apparatus EX configured as described above, the pattern image of the cylindrical mask DM held by the mask holding unit 12 illuminated by the illumination optical system IL is transferred to the substrate P held by the mask holding unit 12 via the projection optical system PL. Projected on. Therefore, in this embodiment, in addition to obtaining the same operation and effect as the above embodiment, it is not necessary to separately provide a drum for holding the substrate P, which contributes to downsizing and cost reduction of the apparatus. be able to.

  In the present embodiment, the optical axis AX11 in the first partial optical system PP1 and the second partial optical system PP2 is coaxial, and the first partial optical system PP1 and the second partial optical system with the first rotation axis AX1 interposed therebetween. By arranging the PP2 so as to face each other at the same distance, for example, even when the mask holding unit 12 is displaced in the X direction, a change in the imaging position between the image plane side and the object side due to the displacement of the mask holding unit 12 Are canceled (cancelled), and it is possible to avoid a reduction in exposure accuracy due to the displacement of the mask holding unit 12 in advance.

(Device manufacturing method)
Next, a device manufacturing method will be described. FIG. 10 is a flowchart showing the device manufacturing method of this embodiment.

  In the device manufacturing method shown in FIG. 10, first, function / performance design of a device such as an organic EL display panel is performed (step 201). Next, a cylindrical mask DM is manufactured based on the design of the device (step 202). In addition, a substrate such as a transparent film or sheet, which is a base material of the device, or an extremely thin metal foil is prepared by purchase or manufacture (step 203).

  Next, the prepared substrate is put into a roll type or patch type production line, and TFT backplane layers such as electrodes, wiring, insulating film, semiconductor film, etc. constituting the device on the substrate, and organic EL light emission that becomes a pixel portion A layer is formed (step 204). Step 204 typically includes a step of forming a resist pattern on a film on the substrate and a step of etching the film using the resist pattern as a mask. For the formation of the resist pattern, a step of uniformly forming a resist film on the substrate surface, a step of exposing the resist film of the substrate with exposure light patterned through the cylindrical mask DM according to each of the above embodiments, A step of developing the resist film on which the latent image of the mask pattern is formed by the exposure is performed.

  In the case of flexible device manufacturing using printing technology, etc., a process of forming a functional photosensitive layer (photosensitive silane coupling material, etc.) on the substrate surface by a coating method, via the cylindrical mask DM according to each of the above embodiments The step of irradiating the functional photosensitive layer with patterned exposure light to form a hydrophilic portion and a water-repellent portion according to the pattern shape on the functional photosensitive layer, the hydrophilicity of the functional photosensitive layer A step of applying a plating base solution or the like to a high portion and depositing and forming a metallic pattern by electroless plating is performed.

  Then, depending on the device to be manufactured, for example, the substrate is diced or cut, or another substrate manufactured in a separate process, for example, a sheet-like color filter having a sealing function or a thin glass substrate is pasted. The combining process is performed to assemble the device (step 205). Next, post-processing such as inspection is performed on the device (step 206). A device can be manufactured as described above.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the third embodiment, the configuration in which one rotating drum includes the mask holding unit 12 and the substrate holding unit 22 is exemplified. However, the present invention is not limited to this. For example, as shown in FIG. It is also applicable to a configuration in which the portion 12 and the substrate holding portion 22 are provided apart from each other in the Y direction and the first rotation axis AX1 and the second rotation axis AX2 are connected by the coupling member 14.
In this configuration, the first inverted equal magnification projection optical system PP11 that forms the first projection optical system PL1 and the pattern image of the cylindrical mask DM illuminated by the first illumination region IR1 enters, and the first illumination region IR1 illuminates. A second inverted equal magnification projection optical system PP12 that projects the patterned image of the cylindrical mask DM onto the first projection area PA1 of the substrate P is provided at a position on the opposite side across the rotation axes AX1 and AX2. A pattern image of the third inverted equal magnification projection optical system PP21 that forms the system PL2 and is incident on the pattern image of the cylindrical mask DM illuminated by the second illumination region IR2, and the pattern image of the cylindrical mask DM that is illuminated by the second illumination region IR2. And the fourth inverted equal magnification projection optical system PP22 for projecting the image onto the second projection area PA2 of the substrate P may be provided at a position on the opposite side across the rotation axes AX1 and AX2.

In the above embodiment, the pattern image of the cylindrical mask DM held by the mask holding unit 12 is projected onto the substrate P held by the substrate holding unit 22 at the same magnification. However, the present invention is not limited thereto. Instead of this, it may be configured to project an enlarged image or a reduced image. For example, if the projection magnification of the projection optical system is β, the radius of the cylindrical mask DM is r, and the radius of the substrate holder 22 is R,
R = β × r
Each radius may be set to satisfy the above.

  12, 12A, 12B ... Mask holding part (first cylindrical body), 14, 14A, 14B coupling member (connecting device), 22 ... Substrate holding part (second cylindrical body), AX1, AX1A, AX1B ... First rotating shaft AX2 ... second rotation axis, DM, DMA, DMB ... cylindrical mask (mask), EX ... exposure apparatus, P ... substrate, PL, PL1, PL2 ... projection optical system, PP1 ... first partial optical system, PP2 ... first Two-part optical system

Claims (10)

An exposure apparatus for transferring a pattern formed on a mask to a sheet-like substrate,
A mask holding part which is formed in a cylindrical shape and holds the mask along the first cylindrical surface and is rotatable around a predetermined axis;
A substrate holding portion that is formed in a cylindrical shape and holds the substrate along the second cylindrical surface and is rotatable about the predetermined axis;
A projection optical system that projects the image of the pattern onto the substrate at a predetermined magnification;
A driving device that integrally rotates the mask holding unit and the substrate holding unit;
An exposure apparatus comprising: The mask holding part is provided in a first cylindrical body that is rotatable around a first rotation axis,
The substrate holding part is rotatable around a second rotation axis disposed on the same axis as the first rotation axis, and is disposed away from the first cylindrical body in the first rotation axis direction. The exposure apparatus according to claim 1, wherein the exposure apparatus is provided on the second cylindrical body.   The ratio of the radius of the second cylindrical surface about the second rotational axis to the radius of the first cylindrical surface about the first rotational axis is a size corresponding to the predetermined magnification. The exposure apparatus described in 1.   The exposure apparatus according to claim 2, further comprising a connection device that detachably connects the first cylindrical body and the second cylindrical body. The mask holding portion is provided on a cylindrical surface of a cylindrical body rotatable around a predetermined rotation axis,
2. The exposure apparatus according to claim 1, wherein the substrate holding unit is provided in an area different from an illumination area that illuminates the pattern on a cylindrical surface provided with the mask holding part. The projection optical system is
A first partial optical system for receiving light emitted from the pattern;
A second partial optical system that projects light through the first partial optical system onto the substrate;
The first partial optical system and the second partial optical system are arranged to face each other with the mask holding unit and the substrate holding unit interposed therebetween,
6. The optical axis of the first partial optical system and the optical axis of the second partial optical system are arranged in parallel to each other and at the same distance from the predetermined axis. The exposure apparatus described. The mask has a plurality of pattern regions along the predetermined axial direction,
The exposure apparatus according to claim 1, wherein a plurality of the projection optical systems are provided for each of the plurality of pattern areas.   The exposure apparatus according to claim 7, wherein the plurality of projection optical systems project images of patterns respectively positioned in the plurality of pattern regions onto the substrate along the predetermined axis direction.   The exposure apparatus according to claim 7 or 8, wherein the plurality of projection optical systems are arranged at positions shifted from each other in a direction around the predetermined axis. A device manufacturing method for manufacturing a device by processing a substrate,
Using the exposure apparatus according to any one of claims 1 to 9, transferring a pattern to the substrate;
Processing the substrate to which the pattern is transferred based on the pattern;
A device manufacturing method including:

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