CN106185413B - Box device - Google Patents

Box device Download PDF

Info

Publication number
CN106185413B
CN106185413B CN201610622573.7A CN201610622573A CN106185413B CN 106185413 B CN106185413 B CN 106185413B CN 201610622573 A CN201610622573 A CN 201610622573A CN 106185413 B CN106185413 B CN 106185413B
Authority
CN
China
Prior art keywords
substrate
unit
module
drive division
module portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610622573.7A
Other languages
Chinese (zh)
Other versions
CN106185413A (en
Inventor
浜田智秀
铃木智也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN106185413A publication Critical patent/CN106185413A/en
Application granted granted Critical
Publication of CN106185413B publication Critical patent/CN106185413B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/182—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations
    • B65H23/185—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations motor-controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00—Function indicators
    • B65H2220/02—Function indicators indicating an entity which is controlled, adjusted or changed by a control process, i.e. output
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B65H2513/11—Speed angular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning In General (AREA)
  • Replacement Of Web Rolls (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Winding Of Webs (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Coating Apparatus (AREA)
  • Liquid Crystal (AREA)

Abstract

A kind of box device, has：First module portion, carries out the side in the supply and recovery of substrate；With second unit portion, the opposing party in the supply and recovery of aforesaid substrate is carried out, above-mentioned first module portion and above-mentioned second unit portion can closer to each other or separation.

Description

Box device
The application be PCT international application no be PCT/JP2012/082695, international filing date be on December 17th, 2012, The national applications number of National Phase in China is 201280072239.9, entitled " box device, base board delivery device, substrate The divisional application of the Chinese invention patent application of processing unit and substrate processing method using same ".
Technical field
The present invention relates to box (cassette) device, base board delivery device, substrate board treatment and substrate processing method using same.
The application Japanese Patent Application 2012-092132 CLAIM OF PRIORITYs according to filed in 13 days April in 2012, and by it Appearance is incorporated herein.
Background technology
It is used as the display element for constituting the display devices (display panel) such as display equipment, such as known liquid crystal display member Part, organic electroluminescent (organic EL) element.At present, in these display elements, with each pixel accordingly on the surface of the substrate Form thin film transistor (TFT) (Thin Film Transistor：TFT active component (active device)) is increasingly becoming master Stream.
In recent years it has been proposed that a kind of form display element on flexible plate shape substrates (such as film member) Technology.As this technology, such as known one kind is referred to as volume to volume (roll to roll) mode (hereinafter referred to as " volume side Formula ") gimmick (referring for example to patent document 1).Volume mode is by one on the supply roller of substrate supply side Plate shape substrates (film member of such as banding) are sent out, and while the recovery that the substrate of submitting is reclaimed into side with substrate is added with roller To wind, while being applied by the processing unit being arranged between supply roller and recovery roller for being formed on substrate The desired working process of the electronic component such as display panel or solar panel.
Moreover, transporting base such as using multiple conveyance rollers from being sent during being wound as only in substrate Plate, in the case where producing display panel, gate electrode, the grid that composition TFT is formed using multiple processing units (unit) are exhausted Velum, semiconductor film, source/drain etc., and sequentially form in the processed surface of substrate the constitutive requirements of display element.Example Such as, in the case where forming organic EL element, luminescent layer, anode, negative electrode, circuit etc. are sequentially formed on substrate.
Prior art literature
Patent document 1：International publication the 2006/100868th
The content of the invention
However, in said structure, from being sent during being wound as only, because substrate rides over multiple processing On device, so the total length of substrate is elongated, the situation that the management of substrate is difficult is had.
The purpose of mode of the present invention is that providing a kind of box device, substrate that can mitigate the administrative burden of substrate when transporting removes Send device and substrate board treatment.
According to the 1st aspect of the present invention there is provided a kind of box device, have：First module portion, carry out substrate supply and The side reclaimed；And second unit portion, the opposing party for carrying out supply and the recovery of substrate, first module portion and second unit portion Being capable of closer to each other or separation.
According to the 2nd aspect of the present invention there is provided a kind of base board delivery device, have：First module portion, can be movably It is located on the first mobile route, and carries out a side of supply and the recovery of substrate；Second unit portion, can movably be located at second On mobile route, and carry out the opposing party of supply and the recovery of substrate；And control unit, to configuring in the first mobile route and First substrate processing unit between two mobile routes, control first module portion makes the side that it carries out supply and the recovery of substrate, And control second unit portion makes the opposing party that it carries out supply and the recovery of substrate, control unit to configure the first mobile route with Between second mobile route and the second substrate processing unit different from first substrate processing unit, make first module portion and second unit Portion is moved, and control first module portion makes the opposing party that it carries out supply and the recovery of substrate, and control second unit portion enters it One side of supply and the recovery of row aforesaid substrate.
According to the 3rd aspect of the present invention there is provided a kind of substrate board treatment, have：Multiple processing units, are configured first Between mobile route and the second mobile route, to being handled with flexible substrate；And the substrate of second method of the present invention Carrying device.
According to the 4th aspect of the present invention there is provided a kind of substrate processing method using same, it is for by with flexible strip base Plate delivers to multiple processing units successively, and forms the processing method of electronic component on aforesaid substrate, wherein, including：At first Science and engineering sequence, first module portion and second unit portion are configured across above-mentioned first substrate processing unit, wherein, first module portion bag The feed roller for being wound with the aforesaid substrate that should be supplied to first substrate processing unit in the longitudinal direction is included, second unit portion bag The recovery roller of the aforesaid substrate that winding should be reclaimed from above-mentioned first substrate processing unit in the longitudinal direction is included, passes through above-mentioned first Reclaimed after the aforesaid substrate that the processing of processing substrate portion is supplied from above-mentioned feed roller with above-mentioned recovery roller；First mobile process, Make above-mentioned first module portion and above-mentioned second unit portion together along above-mentioned between above-mentioned feed roller and above-mentioned recovery roller The first direction movement that substrate leaves from above-mentioned first substrate processing unit；Second mobile process, in order to reduce above-mentioned feed roller With interval of the above-mentioned recovery roller on above-mentioned length direction, make at least the one of above-mentioned first module portion and above-mentioned second unit portion Side is moved along the second direction intersected with above-mentioned first direction；With the 3rd mobile process, make relative above-mentioned at predetermined intervals First module portion and above-mentioned second unit portion with the translational motion of above-mentioned first direction, the translational motion of above-mentioned second direction, At least two motions in rotary motion in the plane including above-mentioned first direction and second direction, and together towards with it is upper State the different second substrate processing unit movement of first substrate processing unit.
Invention effect
According to the mode of the present invention, the administrative burden of substrate when can mitigate conveyance.
Brief description of the drawings
Fig. 1 is the integrally-built stereogram for the substrate board treatment for representing first embodiment.
Fig. 2 is the exploded perspective view of the structure for the first module portion side for representing present embodiment.
Fig. 3 is the figure of a part of structure for the box device for representing present embodiment.
Fig. 4 is the exploded perspective view of the structure for the second unit portion side for representing present embodiment.
Fig. 5 is the figure of the structure for the box device for representing present embodiment.
Fig. 6 is the figure of the structure for the processing unit for representing present embodiment.
Fig. 7 is the figure of a mode of the action for the substrate board treatment for representing present embodiment.
Fig. 8 is the figure of a mode of the action for the substrate board treatment for representing present embodiment.
Fig. 9 is the figure of a mode of the action for the substrate board treatment for representing present embodiment.
Figure 10 is the figure of a mode of the action for the substrate board treatment for representing present embodiment.
Figure 11 is the figure of a mode of the action for the substrate board treatment for representing present embodiment.
Figure 12 is the figure of a mode of the action for the substrate board treatment for representing present embodiment.
Figure 13 is the integrally-built stereogram for the substrate board treatment for representing second embodiment.
Figure 14 is the sectional view of a part of structure for the substrate board treatment for representing present embodiment.
Figure 15 is the stereogram of the structure in the lifting portion for representing present embodiment.
Figure 16 is the figure for another structure for representing substrate board treatment.
Figure 17 is the figure for another structure for representing substrate board treatment.
Figure 18 is the figure for another structure for representing substrate board treatment.
Figure 19 is the figure for another structure for representing substrate board treatment.
Figure 20 is the figure for another structure for representing substrate board treatment.
Figure 21 is the figure for another structure for representing substrate.
Figure 22 is the figure for another structure and operating state for representing substrate board treatment.
Figure 23 is the figure of the next operating state for the substrate board treatment for representing Figure 22.
Figure 24 is the figure of the next operating state for the substrate board treatment for representing Figure 23.
Figure 25 is the figure of the next operating state for the substrate board treatment for representing Figure 24.
Figure 26 is the figure of the next operating state for the substrate board treatment for representing Figure 25.
Figure 27 is the figure of the next operating state for the substrate board treatment for representing Figure 26.
Embodiment
[first embodiment]
Hereinafter, with reference to the accompanying drawings of the first embodiment of the present invention.
Fig. 1 is the integrally-built stereogram for the substrate board treatment (base board delivery device) 100 for representing present embodiment. As shown in figure 1, substrate board treatment 100 has to entering professional etiquette with flexible plate shape substrates (such as the film member of banding) S Surely the processing unit (first substrate processing unit, second substrate processing unit) 10 that handles, conveyance substrate S conveying unit (box device) 20, With the control unit CONT for planning as a whole control process portion 10 and box device 20.Substrate board treatment 100 is arranged on such as manufacturing works On the FL of ground.
Substrate board treatment 100 is volume to volume (the roll to that various processing are performed to substrate S process face (surface) Roll) the device of mode (hereinafter referred to as " volume mode ").Substrate board treatment 100 is used to form for example organic on substrate S The situation of the display elements such as EL element, liquid crystal display cells (electronic component).It is, of course, also possible to formed beyond these elements Substrate board treatment 100 is used in the system of element (for example, solar cell, colored filter, touch panel etc.).
Hereinafter, when illustrating the structure of substrate board treatment 100 of present embodiment, XYZ orthogonal coordinate system is set, on one side With reference to the XYZ orthogonal coordinate system while being illustrated to the position relationship of each component.In following figure, by XYZ orthogonal coordinates The plane parallel with ground FL is as X/Y plane in system, and the direction that substrate S in X/Y plane is moved, will be with Y-axis as Y direction The orthogonal direction in direction is used as X-direction.In addition, direction that will be vertical with ground FL (X/Y plane) is used as Z-direction.In addition, It is θ Z-directions by the bearing mark rotated about the z axis.
As the substrate S of process object is turned into substrate board treatment 100, such as resin film or stainless can be used The paper tinsel (foil) of steel etc..Resin film can for example use polyvinyl resin, acrylic resin, polyester resin, vinyl-vinyl (Ethylene vinyl copolymer) copolymer resin, Corvic, celluosic resin, polyamide, polyamides Imide resin, polycarbonate resin, polystyrene resin, vinyl acetate base resin, polyethylene terephthalate, poly- naphthalene two The materials such as formic acid glycol ester, stainless steel foil.
Substrate S width is dimensioned so as to such as 50cm~2m or so, and the size of length direction be (a roll of unit Size) be then formed as such as more than 10m.Certainly, the size is only one, however it is not limited to this example.Such as substrate S width Size can also be below 1m or below 50cm or more than 2m.In addition, the size of substrate S length direction may be used also To be below 10m.
Substrate S-shaped turns into the thickness for example with below 1mm and with flexibility.Herein, so-called flexibility refers to, even if for example The specified force of at least deadweight degree is imposed to substrate will not also crack or fracture, and the property that can bend aforesaid substrate.In addition, The property for example bent by above-mentioned specified force is also included within flexibility.In addition, the above-mentioned flexible material understood with aforesaid substrate, Environment such as size, thickness, temperature, the humidity of temperature or surrounding etc. and change.In addition, as substrate S, one can also be used The substrate of banding, can also be set to that multiple unit substrates are connected and are formed as the structure of banding.
Even if substrate S is preferably the heat for bearing higher temperature (such as 200 DEG C or so), its size is also without substantial variations (heat Deformation it is small) the less substrate of thermal coefficient of expansion.For example, inorganic filler can be mixed in resin film to reduce thermal expansion system Number.As the example of inorganic filler, titanium oxide, zinc oxide, aluminum oxide, silica etc. can be enumerated.
Substrate board treatment 100 is arranged in the factory of element manufacture.Guide rail (is formed with ground FL in factory One mobile route, the second mobile route) 30.Guide rail 30 has the first track 31, the second track 32 and the 3rd track 33.First rail The track 32 of road 31 and second is formed as extending in the orientation (X-direction) of multiple processing units.In addition, the first track 31 exists Configured in Y direction in the side of processing unit 10, the second track 32 configures the opposite side in processing unit 10 in the Y-axis direction.That is, First track 31 and the second track 32 are located to be clipped on the position of processing unit 10 in the Y-axis direction.3rd track 33 is in X-direction On be arranged respectively between multiple processing units 10.3rd track 33 is formed as parallel with Y direction, and by the first track 31 and Two tracks 32 are connected.Such as X-coordinate or Y-coordinate equipotential are set with the first track 31, the second track 32 and the 3rd track 33 Confidence ceases.Above-mentioned positional information with can the sensor such as optical sensor or Magnetic Sensor reading by way of be formed in each track On.
Substrate board treatment 100 has box device 20.The box device 20 has one in the supply and recovery for carrying out substrate S The first module portion 21 of side and progress substrate S supply and the second unit portion 22 of the opposing party in recovery.Moreover, substrate S from The side in first module portion 21 and second unit portion 22 is transported to opposite side.
First module portion 21 and second unit portion 22 are prepared with multiple respectively.On ground FL provided with make first module portion 21 and The standby buffer part BF of at least one party in second unit portion 22.It can make first module portion 21 and second unit on buffer part BF Portion 22 is standby.Buffer part BF is connected via a part for guide rail 30 with the first track 31, the second track 32 or the 3rd track 33.
Fig. 2 is the exploded perspective view for the structure for representing the side of first module portion 21 in box device 20.Fig. 3 is to represent box device The figure of 20 a part of structure.Hereinafter, for convenience of explanation, X-direction in Fig. 2 and Fig. 3, Y direction and Z-direction are made Represent corresponding with Fig. 1.
Box device 20, which has, makes first module portion 21 relative to the travel mechanism 24 that second unit portion 22 is moved.Travel mechanism 24 have the move portion (the first move portion) 42 for moving first module portion 21.In addition, box device 20 has move portion described later Side communication unit 44 and contact inhibition portion 47.
First module portion 21 has the first wall portion 40a, the second wall portion 40b, bottom 40c and external connecting 40d.In addition, In first module portion 21 provided with power supply units (not shown) such as batteries.
First wall portion 40a and the second wall portion 40b are respectively formed as tabular.First wall portion 40a is such as disposed in-X-axis side End.End of second wall portion 40b such as disposed in+X-axis side.First wall portion 40a and the second wall portion 40b match somebody with somebody in parallel with each other Put.In addition, the first wall portion 40a and the second wall portion 40b may be formed as gate-shaped.
Bottom 40c is formed as parallel with X/Y plane (ground FL), and the first wall portion 40a and the second wall portion 40b is linked.Outside Portion connecting portion 40d is for example formed by the rod member of the cylinder extended in the X-axis direction, and be located at first module portion 21+Y-axis Side end.First module portion 21+Y-axis side end plays a role as the connecting portion being connected with outside transport mechanism.Outside Portion connecting portion 40d is located on such as two positions of the short transverse in first module portion 21 (Z-direction).
On the corner of connecting portion side in the first wall portion 40a and the second wall portion 40b, notch part 40f is respectively formed with.Lack Oral area 40f is set in the way of it can be abutted with external structure thing.By making notch part 40f be abutted with external structure thing, and Positioned between first module portion 21 and said external works.In addition, in fig. 2, although notch part 40f formation is in+Y-axis Side end, but for example can also be in-structure of the Y-axis side end provided with notch part 40f.Under this situation, by making notch part 40f is abutted with a part for processing unit 10, can be positioned between first module portion 21 and processing unit 10.
The first wall portion 40a and the second wall portion 40b-Y-axis side end is respectively formed with first connecting portion 23a.First is single First portion 21 is connected via above-mentioned first connecting portion 23a with second unit portion 22.As first connecting portion 23a, using for example can from The structure of dynamic conversion dismounting state, such as electromagnet.
First module portion 21 has the first incorporating section 40 for storing substrate.Substrate drive division is provided with first incorporating section 40 (first substrate drive division) 41, is mounted with to be wound with substrate S substrate feed roller (donor rollers) on substrate drive division 41 41c.Substrate drive division 41 is by making substrate S rotations be acted to carry out the supply to the side supplying substrate S of second unit portion 22.Substrate Drive division 41 has axle portion (the first axle part) 41a and rotary driving part (the first drive division) 41b.Axle portion 41a is formed as cylindric Or it is cylindric, and can telescopically constitute.It is flexible by axle portion 41a, can be between the first wall portion 40a and the second wall portion 40b Dismounting, and substrate feed roller 41c installation can be realized.Axle portion 41a is for example so that the axis direction of central shaft and X-axis side Configured to parallel mode.Axle portion 41a one end rotatably to pass through first module portion 21 in a circumferential direction Second wall portion 40b is supported.The maintaining part (not shown) for the end that can keep substrate feed roller 41c is provided with axle portion 41a.Rotation Drive division 41b rotates axle portion 41a.Axle portion 41a is rotated by rotary driving part 41b, it is possible to achieve substrate S supply action (submitting action).
Protective substrate drive division (the first auxiliary for being provided with protective substrate feed roller 48c is provided with the first incorporating section 40 Portion) 48.Protective substrate (diaphragm) C of covering substrate S processed surface is wound with protective substrate feed roller 48c.Protect Shield substrate drive division 48 carries out supplying protective substrate C to the side of second unit portion 22 by rotating protective substrate feed roller 48c Supply action.Protective substrate C protects above-mentioned processed surface by covering substrate S processed surface.Protective substrate C use with Equally there is substrate S flexible material to be formed as banding, and with the size roughly the same with substrate S.
Protective substrate drive division 48 has axle portion 48a and rotary driving part 48b.Axle portion 48a is formed as cylindric or cylinder Shape, and can telescopically constitute.It is flexible by axle portion 48a, it can be dismantled between the first wall portion 40a and the second wall portion 40b, can To realize protective substrate feed roller 48c installation.Axle portion 48a is for example so that the axis direction of central shaft is parallel with X-direction Mode configure.That is, the axis direction that axle portion 41a and axle portion 48a are configured to central shaft is parallel to each other.Axle portion 48a's One end by the second wall portion 40b in first module portion 21 rotatably to be supported in a circumferential direction.Set in axle portion 48a There is the maintaining part (not shown) for the end that can keep protective substrate feed roller 48c.Rotary driving part 48b rotates axle portion 48a. Axle portion 48a is rotated by rotary driving part 48b, it is possible to achieve protective substrate C supply action (submitting action).In protection group Plate drive division 48 is provided with the mechanism (not shown) overlapped onto the protective substrate C of submitting on substrate S.
First module portion 21 has substrate-side communication unit (the first communication unit) 43.Substrate-side communication unit 43 is located at the first wall portion 40a+Z axis side end face on.Substrate-side communication unit 43 such as can in control unit CONT or second unit portion 22 between carry out Communication.
First module portion 21 has contact inhibition portion 47.Contact inhibition portion 47 is located at the first wall portion 40a and the second wall portion 40b + end face of Y-axis side on.Contact inhibition portion 47 suppress the first wall portion 40a and the second wall portion 40b+end face of Y-axis side with it is outside Works is contacted, and impact when relaxing contact.Contact inhibition portion 47 has for example from the first wall portion 40a and the second wall portion 40b The rod member prominent to+Y-axis side and bearing above-mentioned rod member is acted on-elastic component of the power of Y direction.
Above-mentioned move portion 42 removably supports first module portion 21.Move portion 42 makes first module portion 21 to X Direction of principal axis, Y direction and Z-direction movement.Move portion 42 has casing 51, castor 52, lifting unit 53 and castor drive division 54. In addition, in move portion 42 provided with power supply units (not shown) such as batteries.
Casing 51 has movable part 51a and base portion 51b.Movable part 51a be located at casing 51+Z axis side end, and be set as leading to Crossing the driving of lifting unit 53 can move to Z-direction.Moved by movable part 51a to+Z-direction, first module portion 21 with it is upper Movable part 51a is stated integratedly to+Z-direction movement.Base portion 51b supports movable part 51a in a movable manner.
Casing 51 base portion 51b-Z axis side end face on provided with four castors 52.Castor 52 is set as to drive by castor Move the driving in portion 54 and rotate.Rotated by castor 52, casing 51 and first module portion 21 are integratedly to X-direction, Y direction And the movement of θ Z-directions.
Movable part 51a+the end face 51c of Z axis side on be formed with groove portion 50.Groove portion 50 is in V relative to above-mentioned end face 51c Shape is formed.On the other hand, first module portion 21-the end face 40e of Z axis side on be formed with four spherical supports 49.On Four spherical supports 49 are stated to be supported by above-mentioned groove portion 50 respectively.Supported, can be limited by groove portion 50 by spherical support 49 To the relative movement of X-direction and Y direction between first module portion 21 and casing 51.In addition, groove portion 50 and spherical supporting The quantity in portion 49 can also be respectively three.
In addition, in movable part 51a provided with dismounting test section 46.Whether the dismounting detection first module of test section 46 portion 21 installs On casing 51.As dismounting test section 46, the resistance value between such as detect tank portion 50 and spherical support 49 can be used Sensor or detection groove portion 50 on the various sensors such as the sensor of pressure.The testing result that dismounting test section 46 is obtained It is sent to outside (control unit CONT, substrate-side communication unit 43) such as from move portion side communication unit 44.
Move portion 42 has move portion side communication unit (the first communication unit) 44.Move portion side communication unit 44 is located in casing 51 Portion.Move portion side communication unit 44 such as can in control unit CONT or substrate-side communication unit 43, second unit portion 22 between enter Row communication.Substrate-side communication unit 43 and move portion side communication unit 44 can receive first of the action for controlling first module portion 21 Control signal.First control signal includes such as signal of the shift action of control move portion 42 or control first module portion Signal of supply and recovery action of substrate S in 21 etc..
As shown in figure 3, casing 51 base portion 51b-the end face 51d (face relative with ground FL) of Z axis side on, be provided with Position detection part (the first test section) 55.The positional information in the detection first module of position detection part 55 portion 21.Position detection part 55 Detect that the positional information being for example set on guide rail 30 (the first track 31, the second track 32 and the 3rd track 33) is used as above-mentioned Positional information.The testing result that position detection part 55 is obtained for example is sent to outside (control unit from move portion side communication unit 44 CONT, substrate-side communication unit 43 etc.).For example, control unit CONT makes first by using the testing result of position detection part 55 Moved along guide rail 30 in unit portion 21.
Fig. 4 is the exploded perspective view for the structure for representing the second unit portion 22 in box device 20.Hereinafter, say for convenience It is bright, make the expression of X-direction in Fig. 4, Y direction and Z-direction corresponding with Fig. 1.
As shown in figure 4, second unit portion 22 has substrate drive division (second substrate drive division) 61, substrate-side communication unit 63rd, contact inhibition portion 67, protective substrate drive division (the second assisted parts) 68.In addition, the travel mechanism 24 being located in box device 20 With the move portion (the second move portion) 62 for moving second unit portion 22.
Second unit portion 22 has the first wall portion 60a, the second wall portion 60b, bottom 60c and external connecting 60d.In addition, In second unit portion 22 provided with power supply units (not shown) such as batteries.First module portion 21 and second unit portion 22 have with XZ planes On the basis of mirror surface structure.
First wall portion 60a and the second wall portion 60b are respectively formed as tabular.First wall portion 60a is such as disposed in-X-axis side End.End of second wall portion 60b such as disposed in+X-axis side.First wall portion 60a and the second wall portion 60b match somebody with somebody in parallel with each other Put.In addition, the first wall portion 60a and the second wall portion 60b may be formed as gate-shaped.
Bottom 60c is formed as parallel with X/Y plane (ground FL), and the first wall portion 60a and the second wall portion 60b is linked.Outside Portion connecting portion 60d is for example formed by the rod member of the cylinder extended in the X-axis direction, and be located at second unit portion 22-Y-axis Side end.Second unit portion 22-Y-axis side end plays a role as the connecting portion being connected with outside transport mechanism.Outside Portion connecting portion 60d is located on such as two positions of the short transverse in second unit portion 22 (Z-direction).
On the corner of connecting portion side in the first wall portion 60a and the second wall portion 60b, notch part 60f is respectively formed with.Lack Oral area 60f is set in the way of it can be abutted with external structure thing.By making notch part 60f be abutted with external structure thing, and Positioned between second unit portion 22 and said external works.In addition, in Fig. 4, although notch part 60f formation is in-Y-axis Side end, but for example can also be in+structure of the Y-axis side end provided with notch part 60f.In this case, by making notch part 60f is abutted with a part for processing unit 10, can be positioned between second unit portion 22 and processing unit 10.
The first wall portion 60a and the second wall portion 60b+end of Y-axis side is respectively formed with second connecting portion 23b.Second Unit portion 22 is connected via above-mentioned second connecting portion 23b with first module portion 21.As second connecting portion 23b, using for example may be used Automatic conversion dismounts the structure of state, such as electromagnet.
Second unit portion 22 has the second incorporating section 60 for storing substrate.Substrate drive division is provided with second incorporating section 60 61, the substrate drive division 61 is mounted with that the substrate for being wound with substrate S reclaims roller (recycling roll) 61c.Substrate drive division 61 passes through Make substrate S rotations to be reclaimed the substrate S supplied from the side of first module portion 21 recovery action.Substrate drive division 61 has axle Portion (the second axle part) 61a and rotary driving part (the second drive division) 61b.Axle portion 61a is formed as cylindric or cylindric, and can Telescopically constitute.It is flexible by axle portion 61a, it can be dismantled between the first wall portion 60a and the second wall portion 60b, and can be real Existing substrate reclaims roller 61c installation.Axle portion 61a is for example matched somebody with somebody in the mode for making the axis direction of central shaft parallel with X-direction Put.Axle portion 61a one end rotatably to pass through the second wall portion 60b branch in second unit portion 22 in a circumferential direction Hold.The maintaining part (not shown) for the end that substrate can be kept to reclaim roller 61c is provided with axle portion 61a.Rotary driving part 61b makes axle Portion 61a rotates.Axle portion 61a is rotated by rotary driving part 61b, it is possible to achieve substrate S supply action (coiling action).
Protective substrate drive division (the second auxiliary for being provided with protective substrate feed roller 68c is provided with the second incorporating section 60 Portion) 68.Protective substrate (diaphragm) C of covering substrate S processed surface is wound with protective substrate feed roller 68c.Protect Shield substrate drive division 68 is reclaimed the guarantor supplied from the side of first module portion 21 by rotating protective substrate feed roller 68c Protect substrate C recovery action.
Protective substrate drive division 68 has axle portion 68a and rotary driving part 68b.Axle portion 68a is formed as cylindric or cylinder Shape, and can telescopically constitute.It is flexible by axle portion 68a, it can be dismantled between the first wall portion 60a and the second wall portion 60b, and Protective substrate feed roller 68c installation can be realized.Axle portion 68a is for example so that the axis direction of central shaft is put down with X-direction Capable mode is constituted.That is, the axis direction that axle portion 61a and axle portion 68a are configured to central shaft is parallel to each other.Axle portion 68a One end rotatably to be supported in a circumferential direction by the second wall portion 60b in second unit portion 22.In axle portion 68a Maintaining part (not shown) provided with the end that can keep protective substrate feed roller 68c.Rotary driving part 68b revolves axle portion 68a Turn.Axle portion 68a is rotated by rotary driving part 68b, it is possible to achieve protective substrate C supply action (coiling action).Protecting Shield substrate drive division 68 is provided with the mechanism (not shown) overlapped onto the protective substrate C of submitting on substrate S.In addition, in protection group In the case that plate C is wound up on substrate drive division 61 with the state overlapping with substrate S, the side of second unit portion 22 can also be omitted Protective substrate drive division 68.
Second unit portion 22 has substrate-side communication unit (the second communication unit) 63.Substrate-side communication unit 63 is located at the second wall portion 60b+Z axis side end face on.Substrate-side communication unit 63 such as can in control unit CONT or first module portion 21 between carry out Communication.
Second unit portion 22 has contact inhibition portion 67.Contact inhibition portion 67 is located at the first wall portion 60a and the second wall portion 60b - end face of Y-axis side on.Contact inhibition portion 67 suppress the first wall portion 60a and the second wall portion 60b-end face of Y-axis side with it is outside Works is contacted, and impact when relaxing contact.Contact inhibition portion 67 has for example from the first wall portion 60a and the second wall portion Prominent to-Y-axis side 60b rod member and bearing above-mentioned rod member is acted on+elastic component of the power of Y direction.
Movable part 71a+the end face 71c of Z axis side on be formed with groove portion 70.Groove portion 70 is in V relative to above-mentioned end face 71c Shape is formed.On the other hand, second unit portion 22-the end face 60e of Z axis side on be formed with four spherical supports 69.On Four spherical supports 69 are stated to be supported by above-mentioned groove portion 70 respectively.Supported, can be limited by groove portion 70 by spherical support 69 To the relative movement of X-direction and Y direction between second unit portion 22 and casing 71.In addition, groove portion 70 and spherical supporting The quantity in portion 69 can also be respectively three.
In addition, in movable part 71a provided with dismounting test section 66.Whether the dismounting detection second unit of test section 66 portion 22 installs On casing 71.As dismounting test section 66, the resistance value between such as detect tank portion 70 and spherical support 69 can be used Sensor or detection groove portion 70 on the various sensors such as the sensor of pressure.The testing result that dismounting test section 66 is obtained It is sent to outside (control unit CONT, substrate-side communication unit 63) such as from move portion side communication unit 64.
In addition, second unit portion 22 is in addition to said structure, also with connecting detection portion (the second test section) 65.Connection inspection Whether connected between detection first module portion of survey portion 65 21 and second unit portion 22.As connecting detection portion 65, inspection can be used Survey second connecting portion 23b sensor of electrical characteristic etc..The testing result that connecting detection portion 65 is obtained is for example from move portion side Communication unit 64 is sent to outside (control unit CONT, substrate-side communication unit 63 etc.).
Above-mentioned move portion 62 removably supports second unit portion 22.Move portion 62 makes second unit portion 22 to X Direction of principal axis, Y direction and Z-direction movement.Move portion 62 has casing 71, castor 72, lifting unit 73 and castor drive division 74. Casing 71 has movable part 71a and base portion 71b.Control unit CONT controls the rotary speed of castor 72.Thus, control unit CONT can Control the translational speed of move portion 62.In addition, in move portion 62 provided with power supply units (not shown) such as batteries.
The move portion 62 in above-mentioned second unit portion 22 and the move portion 42 in above-mentioned first module portion 21, which are constituted, makes first module The travel mechanism 24 that portion 21 and second unit portion 22 are relatively moved.Move portion 42 and move portion 62 respectively can be by first module portions 21 And second unit portion 22 independently drives.
Above-mentioned move portion 62 has move portion side communication unit (the second communication unit) 64.Move portion side communication unit 64 is located at casing Inside 71.Move portion side communication unit 64 can with such as control unit CONT or substrate-side communication unit 63, first module portion 21 it Between communicated.Substrate-side communication unit 63 and move portion side communication unit 64 can receive the action for controlling second unit portion 22 Second control signal.It is single that second control signal includes such as signal of the shift action of control move portion 62 or control second Signal of supply action of substrate S in first portion 22 etc..
There is move portion 62 substrate to transport control unit 77.Substrate conveyance control unit 77 is controlled by first module portion 21 and second Substrate S and protective substrate C transporting operation that unit portion 22 is carried out.Substrate transports control unit 77 via move portion side communication unit 64 And substrate-side communication unit 63 controls axle portion 61a and axle portion 68a rotary speed.Thus, substrate conveyance control unit 77 can control base Plate S and protective substrate C recovery speed (winding speed).
Lead in addition, substrate transports control unit 77 via the substrate-side in such as move portion side communication unit 64 and first module portion 21 Letter portion 43 controls axle portion 41a and axle portion 48a rotary speed.Thus, substrate conveyance control unit 77 can control substrate S and protection group Plate C feed speed (submitting speed).
The rotary speed of the castor 72 in the substrate conveyance control second unit of control unit 77 portion 22.Thus, substrate conveyance control Portion 77 can control the translational speed of move portion 62.In addition, substrate transports control unit 77 via move portion side communication unit 64 and first The rotary speed of the castor 52 in the control first module of move portion side communication unit 44 portion 21 in unit portion 21.Thus, substrate conveyance control Portion 77 processed can control the translational speed of move portion 42.
Fig. 5 be represent to make box device 20 first module portion 21 be connected with second unit portion 22 after state stereogram.
As shown in figure 5, first module portion 21 and second unit portion 22 can be in first connecting portion 23a and second connecting portion 23b Connected in the state of relative.Adsorbed between first connecting portion 23a and second connecting portion 23b by the magnetic force of electromagnet.So, Box device 20 has connects first module portion 21 and second unit portion 22 by first connecting portion 23a and second connecting portion 23b Connecting portion 23.
It is supported in first module portion 21 on the casing 51 of move portion 42 and second unit portion 22 is supported on move portion 62 In the case of on casing 71, it is connected to constitute box device 20 with second unit portion 22 by first module portion 21.In this case, Move portion 42 and move portion 62 can be such that first module portion 21 is integratedly moved in the state of maintaining to be connected with second unit portion 22 It is dynamic.
In addition, in the case of being connected in first module portion 21 with second unit portion 22, can also be for example in first connecting portion Connection terminal is set on 23a and second connecting portion 23b, by making above-mentioned connection terminal be connected to each other as can be in first module The structure received and sent messages between portion 21 and second unit portion 22.
Box device 20 has the installation portion 81 for being located in first module portion 21 and being provided with cap assembly CV.Further, box Device 20 has the installation portion 82 for being located in second unit portion 22 and being provided with cap assembly CV.Cap assembly CV is with different such as dust The mode that thing will not enter seals the inside in first module portion 21 and second unit portion 22.Cap assembly CV athwart first module portions Installed between 21 and second unit portion 22.
Fig. 5 cap assembly CV is not limited to this though it is shown that the structure that can for example dismount in the Z-axis direction.For example, Can also first module portion 21 bottom 40c and the bottom 60c in second unit portion 22, cap assembly is rotatably installed CV.Furthermore it is also possible to use flat member formation cap assembly CV that is scalable or folding, and a cap assembly CV part is constituted For that can be accommodated in the 40c of bottom.In this case, by the bottom 40c from first module portion 21+Y-axis side end is by cover portion Part CV is drawn, and from first module portion 21+side of Y-axis side is hanging to+side of Z axis side on, first module can be covered Portion 21.Similarly, by the bottom 60c from second unit portion 22-Y-axis side end draws cap assembly CV, and single from second First portion 22-side of Y-axis side is hanging to+side of Z axis side on, second unit portion 22 can be covered.Furthermore it is also possible to be from The lateral side of the second unit portion 22 winding suspension cap assembly CV in first module portion 21 structure.
Fig. 6 is the side view for the structure for representing processing unit 10.In figure 6, protective substrate C, protective substrate drive division are omitted 48 and the diagram of protective substrate drive division 68.
As shown in fig. 6, the conveyance direction on the substrate S in processing unit 10, in upstream side configuration first module portion 21, and In downstream configuration second unit portion 22.Moreover, processing unit 10 is being supplied from first module portion 21 and removed to second unit portion 22 On the substrate S sent mobile route, the processed surface Sa processing to aforesaid substrate S.Processing unit 10 have processing unit 15, Guide device 16 and alignment measuring device 17.
Processing unit 15 has the various dresses for being used for the processed surface Sa formation such as organic EL element relative to substrate S Put.As this device, it can enumerate for example for forming the partition wall forming apparatus of partition wall on processed surface Sa, for shape Electrode forming apparatus into electrode, luminescent layer forming apparatus for forming luminescent layer etc..More specifically, drop-coated can be enumerated Coating apparatus (such as ink jet type applying device), film formation device (membrane formation device, such as evaporation coating device, sputter equipment), exposure Device, developing apparatus, surfaction device, cleaning device, drying device, check device of inspection substrate etc..These each devices Suitably set along substrate S transport path.
In the present embodiment, processing unit 15 has：Developing apparatus 11, it, which has to store, is used to carry out on substrate S The developer solution 11b of development treatment development liquid accommodation container
11a；With cleaning device 12, it has the cleaning liquid accommodation container for the cleaning fluid 12b for being used to store cleaning base plate S 12a.In addition, processing unit 15 can be accommodated into the device of the processing beyond enforcement aforesaid liquid.
Guide device 16 has development side guide 13 and cleaning side guide 14.Side guide 13 of developing has the first pad 13a, the second pad 13d, the first roller 13b and second tin roller 13c.
First pad 13a is fixed on inside processing unit 15, and the substrate S supplied from first module portion 21 is guided to developer solution Accommodating container 11a.Second pad 13d is fixed on inside processing unit 15, and the substrate S from developer solution 11b after is guided To development liquid accommodation container 11a outside.
First roller 13b and second tin roller 13c are set as can be in above-below direction (Z axis side relative to development liquid accommodation container 11a To) on move.Transported between the first pad 13a and the first roller 13b between the second pad 13d and second tin roller 13c into substrate S Afterwards, by making the first roller 13b and second tin roller 13c mobile to development liquid accommodation container 11a sides (lower section, i.e. ,-Z-direction), Substrate S conveyance direction can be changed toward-Z-direction from the first pad 13a, and substrate S is dipped in developer solution 11b, can be by Substrate S is guided into be passed through inside developer solution 11b.
Cleaning side guide 14 has the first pad 14a, the second pad 14d, the first roller 14b and second tin roller 14c.Clean side Each roller of guide portion 14 is identical structure with each roller for side guide 13 of developing, therefore is omitted the description.
In addition, the first pad 13a and the second pad 13d of development side guide 13 and the first pad 14a of cleaning side guide 14 And second pad 14d guiding substrate S processed surface Sa the back side.Therefore, these first pads 13a, the second pad 13d, the first pad 14a And second pad 14d respectively have columnar guide surface, and with it is multiple from the guide surface spray gas ejections (not shown) Mouthful, it is formed to be formed the structure of the layer of gas on guide surface.By the layer of the gas, can on guide surface relative to The substrate S back side (face of processed surface Sa opposite side) is guided in a non-contact manner.In addition, replacing first pads 13a And second pad 13d, rotating cylinder can also be used.In the case of using rotating cylinder, with the substrate S back side and rotating cylinder The state that is in contact of guide surface, rotating cylinder guiding substrate S.
The measurement substrate of alignment measuring device 17 S edge part or the alignment mark being located on substrate S, and according to its measurement As a result alignment actions are carried out relative to substrate S.Alignment measuring device 17 has detection substrate S edge part or pair of alignment mark Quasi- video camera adjusts substrate S position (for example, substrate S width according to the testing result of above-mentioned alignment video camera Position) and posture (for example, relative to inclination of conveyance direction) in the adjusting apparatus of at least one party etc..It is used as substrate S position Put measurement, tachometric survey, moreover it is possible to use on laser projection to substrate S in the way of optical mouse, and to being produced on substrate S Speckle patterns change carry out Photoelectric Detection mode.
Then, the action of substrate board treatment 100 constituted in the above described manner is illustrated.Fig. 7~Figure 12 is represented at substrate Manage the figure of the action of device 100.In Fig. 7~Figure 12, omit protective substrate C, protective substrate drive division 48 and protective substrate and drive The diagram in dynamic portion 68.
First, to carrying out the situation of lodge substrate S action between the axle portion 41a in transport mechanism 24 and axle portion 61a Illustrate.In action afterwards, enumerate by control unit CONT to such as substrate-side communication unit 43 and substrate-side communication unit 63 or move portion side communication unit 44 and move portion side communication unit 64 communicated with illustrating in case of controlling each portion.
First, first module portion 21 makes the first module portion 21 being supported in move portion 42, second unit portion 22 make supporting Second unit portion 22 in move portion 62 is standby in multiple buffer part BF respectively.Control unit CONT makes one group of first module portion 21 And second unit portion 22 is adsorbed between first connecting portion 23a and second connecting portion 23b, and receive the first incorporating section 40 and second Receiving portion 60 connects.Thus, above-mentioned first module portion 21 and second unit portion 22 can integratedly be moved.
Control unit CONT makes first module portion 21 integratedly be moved to guide rail from buffer part BF with second unit portion 22 first On 30.Afterwards, as shown in fig. 7, control unit CONT makes above-mentioned first module portion 21 be moved with second unit portion 22 along guide rail 30, Configure the 3rd track 33+Y-axis side end, i.e. the first track 31 on.In addition, pre- on the axle portion 41a in first module portion 21 The substrate S of web-like is first installed.Although in substrate S front end Sf, being such as provided with top guide Lf in the structure shown in Fig. 7, It can be the structure for eliminating above-mentioned top guide Lf.
Then, control unit CONT rotates axle portion 41a by rotary driving part 41b.By the action, before substrate S Sf is held to be sent out to axle portion 61a sides, substrate S front end Sf is to reaching axle portion 61a and be winding on above-mentioned axle portion 61a.Though in addition, So the substrate S front end Sf operations being wound up on axle portion 61a can also be automated, but it is also possible to pass through manpower fixing band etc. Front end Sf is pasted on axle portion 61a.
Control unit CONT is after substrate S front end Sf is winding on axle portion 61a, and cut-out first module portion 21 and second is single The connection in first portion 22.Thus, first module portion 21 can be independently moved with second unit portion 22.Afterwards, control unit CONT makes axle Portion 41a, which rotates, simultaneously sends out substrate S, and second unit portion 22 is moved along the 3rd track 33 to-Y direction simultaneously.
Control unit CONT moves second unit portion 22, until second unit portion 22 to reach the 3rd track 33-Y-axis side Untill end, i.e. the second track 32.During second unit portion 22 is moved, first module portion 21 maintains configuration in the first track 31 On state.By the action, as shown in figure 8, first module portion 21 is configured on the first track 31, second unit portion 22 is configured On the second track 32.In addition, substrate S front end Sf is drawn with the state on axle portion 61a to-Y direction.
Afterwards, control unit CONT makes the first roller 13b and second tin roller of the development side guide 13 of processing unit 15 13c and the first roller 14b and second tin roller the 14c (+Z-direction) movement in advance upward for cleaning side guide 14.Thus, Between the first roller 13b and second tin roller 13c and development liquid accommodation container 11a (that is, the first pad 13a and the second pad 13d), the Between one roller 14b and second tin roller 14c and cleaning liquid accommodation container 12a (that is, the 3rd pad 14a and the 4th pad 14d), base is formed The gap that plate S can pass through.
Control unit CONT assigns appropriateness relative to substrate S of the hanger between axle portion 41a and axle portion 61a to Y direction Tension force, so that substrate S passes through the gap.Substrate S tension force for example can be by using substrate conveyance control unit 77 control second Unit portion 22 side is adjusted.
In this condition, as shown in figure 9, control unit CONT makes first by rotary driving part 41b and rotary driving part 61b Unit portion 21 and second unit portion 22 are synchronous, and make it respectively on the first track 31 and on the second track 32 to processing unit 15 Side (+X-direction) is mobile.In this condition, substrate S is arranged respectively at the first roller 13b and second tin roller in the Z-axis direction Between 13c and development liquid accommodation container 11a, between the first roller 14b and second tin roller 14c and cleaning liquid accommodation container 12a.
Control unit CONT first rotates axle portion 41a and axle portion 61a substrate S is transported to-Y direction, and simultaneously made The the first roller 13b and second tin roller 13c for side guide 13 of developing are moved to-Z-direction.Thus, substrate S is dipped in developer solution In 11b, development treatment is carried out to substrate S.Afterwards, control unit CONT makes axle portion 41a and axle portion 61a rotate and by substrate S to-Y Direction of principal axis is sent out.By the action, part by developer solution 11b in substrate S is to reaching cleaning device 12.
Then, control unit CONT rotates axle portion 41a and axle portion 61a substrate S is transported to-Y direction, and simultaneously made The the first roller 14b and second tin roller 14c for cleaning side guide 14 are moved to-Z-direction.Thus, substrate S is dipped in cleaning fluid In 12b, cleaning treatment is carried out to substrate S.
At this moment, the upstream side of conveyance direction (- Y direction) as shown in Figure 10, in substrate S applies development treatment, The downstream of conveyance direction applies cleaning treatment.Afterwards, control unit CONT makes axle portion 41a and axle portion 61a rotate and by substrate S To-Y direction submitting.By the action, being sent by cleaning fluid 12b part from cleaning device 12 to outside in substrate S Go out.
As shown in Figure 10, the component at the supporting substrates S back side (face of processed surface Sa opposite side) is in the guiding of development side Portion 13 is the first pad 13a and the second pad 13d, is the first pad 14a and the second pad 14d in cleaning side guide 14, therefore, passes through shape , can be relative to the back side with non-contacting state conveyance substrate S into the gas blanket on the guide surface that these are padded.
Control unit CONT is adjusted according to the processing speed of developing apparatus 11 and cleaning device 12 and is moved to axle from axle portion 41a Portion 61a substrate S translational speed.In addition, as shown in figure 11, control unit CONT is according to the substrate S's on axle portion 41a Coil diameter R1 and the substrate S on axle portion 61a coil diameter R2, adjust rotary driving part 41b and rotary driving part 61b driving Speed.By the action, substrate S can be transported in the state of conveyance speed is certain.The monitoring of substrate S speed can be with root Measure the opportunity (time) for the alignment mark being located on substrate S to carry out according to Fig. 3 alignment measuring device 17.Furthermore it is also possible to Lifting unit 53 and lifting unit 73 are adjusted according to substrate S coil diameter R1, substrate S coil diameter R2 change.
After development treatment and cleaning treatment terminate, control unit CONT rotates axle portion 41a and axle portion 61a with by substrate S To the conveyance of-Y direction, and the first roller 13b and second tin roller 13c of development side guide 13 is set to be moved to+Z-direction simultaneously It is dynamic, also, the first roller 14b and second tin roller 14c of cleaning side guide 14 is moved to+Z-direction.
Afterwards, as shown in figure 12, control unit CONT makes first module by move portion 42 and the Synchronization Control of move portion 62 Portion 21 and second unit portion 22 are synchronous and moved respectively along the first track 31 and the second track 32 to+X-direction.It is dynamic by this Make, as the state backed out from processing unit 15 to+X-axis side.Control unit CONT is in first module portion 21 and second unit portion 22 reach after the 3rd track 33, make the mobile stopping in above-mentioned first module portion 21 and second unit portion 22.
Control unit CONT makes axle portion 61a rotations simultaneously after the mobile stopping in first module portion 21 and second unit portion 22 is made Make second unit portion 22 simultaneously to+Y direction movement.By the action, while axle portion 61a winding substrate S, axle portion 41a with Axle portion 61a is again close to, and the first connecting portion 23a in first module portion 21 is abutted with the second connecting portion 23b in second unit portion 22. Afterwards, control unit CONT starts electromagnet and adsorbs first connecting portion 23a and second connecting portion 23b.Thus, first store Portion 40 is again coupled to the second incorporating section 60, and first module portion 21 is integrated with second unit portion 22.Afterwards, control unit CONT makes The first module portion 21 and second unit portion 22 of integrated state are suitable along the first track 31, the second track 32 and the 3rd track 33 Work as movement.In being acted more than, control unit CONT is so that first module portion 21 and second unit portion 22 will not collide, mix each other Mode, suitably arranged using by position detection part 55 and the positional information detected of position detection part (the first test section) 75 First module portion 21 and the configuration in second unit portion 22.
As described above, the box device of present embodiment has：First module portion 21, it has the substrate S for carrying out having flexibility Supply substrate drive division 41；With second unit portion 22, it is dismantled and assembled with being set as between above-mentioned first module portion 21 And the substrate drive division 61 of substrate S recovery is carried out between substrate drive division 41, therefore, above-mentioned first module portion 21 with Completing substrate S supply and recovery between second unit portion 22.Thereby, it is possible to suppress from the base for sending out the lodge untill winding Plate S size is elongated, therefore, it is possible to reduce the administrative burden of substrate S during conveyance.
[second embodiment]
Then, second embodiment is illustrated.
Figure 13 is the figure of the structure for the substrate board treatment 200 for schematically showing present embodiment.
As shown in figure 13, in the present embodiment, substrate board treatment 200 is formed as multiple stratum (figure in the Z-axis direction It is three stratum in 13).Substrate board treatment 200 has processing unit 10 and box device 20 in each stratum.In addition, in each stratum On ground FL1, ground FL2 and ground FL3 guide rail 30 is formed with respectively along processing unit 10.
Box device 20 has and above-mentioned embodiment identical structure.That is, first module portion 21 and casing 51 it Between can removably set.In addition, can removably be set between second unit portion 22 and casing 71.In addition, first module portion Can removably it be set between 21 and second unit portion 22.
Figure 14 is the sectional view for the structure for representing substrate board treatment 200.
As shown in figure 14, substrate board treatment 200 has three process chambers 111~113.Process chamber 111~113 is by dividing Separate every portion 114.Lattice 114 has the partition member 114a for the ground FL1 for constituting process chamber 111, constitutes process chamber 111 The ground FL2 of top and process chamber 112 partition member 114b, the top for constituting process chamber 112 and process chamber 113 ground FL3 partition member 114c, the partition member 114d at the top of composition process chamber 113.
Process chamber 111 configures the foot in gravity direction in multiple process chambers (near-Z axis side).Process chamber 111 It is formed with the processing space that the processing (wet processed) using liquid is carried out relative to substrate S.In process chamber 111, for example such as Shown in Figure 14, it is provided with as processing unit 110：Stored with the welding resistance liquid for storing the welding resistance liquid for being used for being applied on substrate S Container 141a applying device 141, the development liquid accommodation container with storage for the developer solution to substrate S progress development treatments 142a developing apparatus 142, the cleaning device for cleaning liquid accommodation container 143a with the cleaning fluid stored for cleaning base plate S The 143 and plating liquid accommodation container 144a with storage for the electroplate liquid relative to cleaned substrate S formation patterns Electroplanting device 144.In addition, the device for the processing that can be accommodated into process chamber 111 beyond enforcement aforesaid liquid.
Provided with the part for constituting the devil liquor recovery stream being connected with retracting device (not shown) on partition member 114a Multiple recovery tubes 145.The one end of recovery tube 145 connects with applying device 141, developing apparatus 142 and cleaning device 143 respectively Connect, the devil liquor recovery stream (not shown) connection that the other end is connected with retracting device.Each recovery tube 145 will be in applying device 141st, welding resistance liquid, developer solution and the cleaning fluid of waste liquid are turned into via devil liquor recovery stream in developing apparatus 142 and cleaning device 143 It is expelled to retracting device.Provided with open and close valve (not shown) etc. on recovery tube 145.Control unit CONT can control above-mentioned open and close valve Opening and closing opportunity.In the present embodiment, due to the dress provided with wet processed in the process chamber 111 of the foot in gravity direction Put, so the length of the flow path system of the devil liquor recovery stream between these devices and retracting device can be suppressed.
Process chamber 112 is configured in the top (+Z axis side) of process chamber 111.Process chamber 112 is formed with to be heated to substrate S The processing space of processing.In process chamber 112, be provided with as processing unit 110 heating substrate S heater 151~ 153.151 couples of substrate S for being coated with welding resistance liquid by applying device 141 of heater are heated, and dry welding resistance liquid.Heating Device 152 to being heated by the exposure device EX of process chamber 113 substrate S, dries welding resistance liquid again.Heater 152 with the temperature different from the heating-up temperature of heater 151, for example with the temperature higher than the heating-up temperature of heater 151 To heat substrate S.After 153 pairs of heater carries out development treatment by developing apparatus 142 and cleaned by cleaning device 143 Substrate S is heated, and makes substrate S dry tack free.Heater 151~153 has multiple knot that internally substrate S turns back Structure.In the inside of heater 151~153, substrate S is transported in the way of not contacting each other in the state of overlapping turn back. Therefore, substrate S processed surface Sa state is maintained, and substrate S is expeditiously received into heater 151~153 simultaneously It is interior.
Process chamber 113 is configured in the top (+Z axis side) of process chamber 112.Process chamber 113 is to be exposed processing to substrate S Processing space.In process chamber 113, as processing unit 110, provided with exposure device EX.Exposure device EX is via mask Pattern is used up to the solder mask irradiation exposure being coated in applying device 141 on substrate S.
Multiple lifting portions 160 (161~166) are provided with the substrate board treatment 200 of said structure.Lifting portion 160 exists First module portion 21 and second unit portion 22 are transported between different estate.For example, lifting portion 161, lifting portion 164, lifting portion 165 And lifting portion 166 transports first module portion 21 and second unit portion 22 between the first stratum and the second stratum.In addition, for example lifting Ascending part 162 and lifting portion 163 transport first module portion 21 and second unit portion 22 between the second stratum and third class.
Each lifting portion 160 has the lift for running through partition member 114b and partition member 114c in the Z-axis direction respectively Structure 160a.
Figure 15 is the stereogram for the Sketch for representing lifting portion 160.
As shown in figure 15, the external connecting 40d in elevating mechanism 160a and first module portion 21 or second unit portion 22 Connecting portion 60d connections.Elevating mechanism 160a, which has, makes first module portion 21 and second unit portion 22 move in the Z-axis direction not The travel mechanism of diagram.Elevating mechanism 160a can make the first module portion 21 and second unit portion 22 of integrated state in Z axis side Move up.
In addition, lifting portion 160 has installation portion (not shown), the installation portion makes the first module portion transported across stratum 21 and second unit portion 22 be respectively installed to be located at conveyance object stratum on move portion 42 and move portion 62 casing 51 and On 71.Thus, the substrate S being accommodated in first module portion 21 and second unit portion 22 is with may span across stratum mobile.
Then, the action of aforesaid substrate processing unit 200 is illustrated.
Control unit CONT makes first module portion 21 and second unit portion 22 be transported from regulation entrance to process chamber 111, and makes It is moved along guide rail 30 to applying device 141.Control unit CONT in applying device 141 by with above-mentioned first embodiment Identical act, by first module portion 21 configure applying device 141+Y-axis side, by second unit portion 22 configure coating fill Put 141-Y-axis side.In this condition, control unit CONT transports substrate S from first module portion 21 to second unit portion 22, and The processed surface to substrate S carries out the coating processing of emulsion simultaneously.
After being handled in applying device 141, control unit CONT makes first module portion 21 and the one of second unit portion 22 Change, and be moved to lifting portion 161.First module portion 21 and second unit portion 22 are to after reaching lifting portion 161, control unit CONT In the state of making first module portion 21 keep being connected with second unit portion 22, for example, make the connecting portion 60d in second unit portion 22 It is connected with the elevating mechanism 160a in lifting portion 161.Afterwards, control unit CONT makes first module portion 21 using elevating mechanism 160a And after the integration of second unit portion 22 in the state of, transported to+Z-direction.By the action, and make first module portion 21 and case Installment state between body 51, between second unit portion 22 and casing 71 is released from, first module portion 21 and second unit portion 22 Separated from casing 51 and casing 71 and to+Z-direction movement, process chamber 112 is transported to from process chamber 111.
Control unit CONT makes move portion 42 and move portion 62 of the configuration in process chamber 112 standby in lifting portion 161 in advance Near.Control unit CONT makes the first module portion 21 in conveyance to process chamber 112 and second unit using installation portion (not shown) Portion 22 is respectively installed in above-mentioned move portion 42 and move portion 62.
Afterwards, control unit CONT is transported substrate S to heater using first module portion 21 and second unit portion 22 151, and substrate S is heated.In heater 151, substrate is transported in the state of substrate S is for example bent repeatedly S, and carry out under the conveyance state substrate S heating.Therefore, the heating of expeditiously utilization space can be carried out.Adding In thermal 151, the coated film for making to be formed on substrate S by heating is dried.
After being heated, control unit CONT is acted by above-mentioned identical, via lifting portion 162 by first module Portion 21 and second unit portion 22 are transported to process chamber 113.Control unit CONT is in process chamber 113 by first module portion 21 and second Unit portion 22 is transported to exposure device EX, and processing is exposed to the emulsion being coated on substrate S.
After processing is exposed, control unit CONT is via lifting portion 163 by first module portion 21 and second unit portion 22 Transport to process chamber 112.Control unit CONT transports in first module portion 21 and second unit portion 22 to heating in process chamber 112 Device 152, and substrate S is heated.In heater 152, the coated film after photosensitive is heated.
After being heated, control unit CONT is via lifting portion 164 by first module portion 21 and second unit portion 22 Transport to process chamber 111.Control unit CONT transports in first module portion 21 and second unit portion 22 to development in process chamber 111 Device 142, and development treatment is carried out to substrate S.In developing apparatus 142, substrate S is dipped in developer solution and simultaneously single from first First portion 21 is transported to second unit portion 22, and development treatment is carried out during conveyance.
After development treatment is carried out, control unit CONT makes first module portion 21 and second unit portion 22 in the state of integration It is lower to be moved to cleaning device 143, substrate S is transported to cleaning device 143.In cleaning device 143, substrate S is dipped in cleaning fluid In and simultaneously transported from first module portion 21 to second unit portion 22, cleaning treatment is carried out during conveyance.
After cleaning treatment is carried out, control unit CONT is via lifting portion 165 by first module portion 21 and second unit portion 22 Transport to process chamber 112.Control unit CONT transports in first module portion 21 and second unit portion 22 to heating in process chamber 112 Device 153, heats to substrate S.In heater 153, the heating for drying the substrate S after cleaning is carried out Processing or heating for heating coated film etc..
After being heated, control unit CONT is via lifting portion 166 by first module portion 21 and second unit portion 22 Transport to process chamber 111.Control unit CONT makes first module portion 21 and second unit portion 22 be moved to plating in process chamber 111 Device 144, substrate S is transported to electroplanting device 144.In electroplanting device 144, substrate S is dipped in electroplate liquid and simultaneously from the One unit portion 21 is transported to second unit portion 22, and electroplating processes are carried out during conveyance.Substrate S after electroplating processes are carried out Upper formation predetermined pattern.
After electroplating processes are carried out, control unit CONT is via lifting portion 166 by first module portion 21 and second unit portion 22 Transport to process chamber 112.Control unit CONT transports in first module portion 21 and second unit portion 22 to not scheming in process chamber 112 The heater shown, and heated.
As described above, the substrate board treatment 200 of present embodiment is in such as process chamber 111, the first track 31 with Between second track 32, as processing unit 110 provided with carry out each other the applying device 141 of different disposal, developing apparatus 142, Cleaning device 143 and electroplanting device 144, in these each device (applying device 141, developing apparatus 142, cleaning device 143 and electricity Plating appts 144) between, move first module portion 21 and second unit portion 22, while each unit feeding in 21 pairs of first module portion Substrate S, and second unit portion 22 reclaims substrate S, therefore, it is possible to carry out single-wafer processing in multiple processing units 110.
Thereby, it is possible to suppress elongated from the substrate S of the lodge size untill winding is sent out, therefore when can mitigate conveyance Substrate S administrative burden.In addition, including the feelings of the different multiple processing units 110 of processing speed even in a production line It is consistent without processing speed is made in whole production line under condition, therefore, it is possible to expeditiously utilize each processing unit 110.Enter One step, can be by first module portion 21 and second unit portion 22 from movement in the substrate board treatment 200 with multiple stratum Portion 42 and move portion 62 are split and transported between different estate, therefore can carry out efficient conveyance.
The technical scope of the present invention is not limited to above-mentioned embodiment, without departing from the scope of the subject in the invention can Apply appropriate change.
For example, in above-mentioned embodiment, with what can removably be set between first module portion 21 and second unit portion 22 It is illustrated exemplified by structure, but is not limited to this.
For example, it is also possible to be that first module portion 21 and second unit portion 22 do not install and only carry out close to and separate each other Structure.Furthermore it is also possible to be, not first module portion 21 is installed with second unit portion 22, but supporting first module portion 21 Move portion 42 and the removable structure of move portion 62 in supporting second unit portion 22.
In addition, for example, in the above-described embodiment, enumerating with first module portion 21 as substrate S supplies use, second unit Portion 22 is illustrated as the example of substrate S recovery, but is not limited to this.For example, it is also possible to be made with first module portion 21 Use, second unit portion 22 are reclaimed for substrate S to supply and use as substrate S.Furthermore it is also possible to make first module portion 21 and second unit Portion 22 is identical structure, makes first module portion 21 and second unit portion 22 substituted for one another on guide rail 30, suitably conversion supply Action acts with recovery and carries out substrate S conveyance simultaneously.
In addition, in the above-described 2nd embodiment, being carried out by taking the structure that substrate board treatment has multiple stratum as an example Illustrate, but be not limited to this.For example, as shown in figure 16, can also be the structure for being configured with a plurality of production line in the Y-axis direction. In this case, as the structure of processing unit 10, it can also be that configuration in the Y-axis direction carries out the device of the processing of identical type Structure.
In addition, in the above-described embodiment, with base portion 51b and base portion 71b-the end face 51d and 71d of Z axis side on set It is illustrated exemplified by the structure for having position detection part 55 and 75, but is not limited to this.For example, as shown in figure 17, can also be Structure provided with the terminal (power acquisition portion) 56 and 76 contacted with guide rail 30.In this case, by making power supply in advance with leading Rail 30 is connected, and can obtain electric power via terminal 56 and 76.
In addition, for example, in the above-described embodiment, processing is passed through with first module portion 21 and the one direction of second unit portion 22 Portion 10 and be illustrated in case of moving, but be not limited to this.
Figure 18 (a)~Figure 18 (c) is the figure of one of the shift action for representing first module portion 21 and second unit portion 22.
For example, as shown in Figure 18 (a), first module portion 21 and second unit portion 22 are pulled away to draw base by control unit CONT Shown in plate S, such as Figure 18 (b), first module portion 21 and second unit portion 22 is set to transport and be gone forward side by side into processing unit 10 along+X-direction Row processing.Afterwards, as first module portion 21 and second unit portion 22 shown in Figure 18 (c), can also be made to be returned along-X-direction The mode returned is moved.Thus, the structure based on processing unit 10, is difficult in the X-axis direction in the case of even in substrate S, Also substrate S can expeditiously be transported.
In addition, in the above-described embodiment, with the side of the first guide rail 31 configuration first module portion 21 and second unit portion 22 Afterwards, it is illustrated by making second unit portion 22 be moved to the side of the second guide rail 32 in case of drawing substrate S, but simultaneously Not limited to this.For example, it is also possible to be drawn by making first module portion 21 from the lateral side of first guide rail 31 movement of the second guide rail 32 Substrate S.
Furthermore it is also possible to be that such as shown in Figure 19 (a), first module portion 21 and second unit portion 22 are configured in the 3rd rail The central portion of the Y direction in road 33, afterwards, such as shown in Figure 19 (b), by making first module portion 21 respectively to+Y direction movement And second unit portion 22 is to-Y direction movement, and draw substrate S.
In addition, in the above-described embodiment, the shape arranged in the Y-axis direction with first module portion 21 and second unit portion 22 It is illustrated in case of being moved under state to X-direction, but is not limited to this.For example, it is also possible to make first module portion 21 And second unit portion 22 arrange in the X-axis direction in the state of moved to Y direction.
For example, as shown in Figure 20 (a), two the 3rd tracks 33 and the second track of processing unit 10 are clipped in the X-axis direction On 32 crosspoint, first module portion 21 and second unit portion 22 is respectively configured.At this moment, if substrate S is the state drawn.It Afterwards, as shown in Figure 20 (b), by making first module portion 21 and second unit portion 22 be moved to+Y direction, by substrate S transport to Processing unit 10.Thus, the structure based on processing unit 10, in the case that substrate S is difficult to transport in the X-axis direction, also can Expeditiously transport substrate S.
In addition, in the above-described embodiment, as the structure of connecting portion 23, with first connecting portion 23a and second connecting portion It is illustrated exemplified by the structure adsorbed between 23b by electromagnet, but is not limited to this, is can also be by mechanically locking The fixed structure to connect.
In addition, in the above-described embodiment, axle portion 41a and axle portion 61a or driving protective substrate C on driving substrate S Axle portion 48a and axle portion 68a, for example configured in the mode for making the axis direction of central shaft parallel with X-direction, substrate S or guarantor It is illustrated exemplified by the structure that shield substrate C is abreast transported with X/Y plane, but is not limited to this.For example, on axle portion 41a and Axle portion 61a or axle portion 48a and axle portion 68a, can also be and matched somebody with somebody in the mode for making the axis direction of central shaft parallel with Z-direction Put, the structure that substrate S or protective substrate C are abreast transported with YZ planes or ZX planes.
In addition, in the above-described embodiment, with by the casing 51 and 71 of move portion 42 and move portion 62 in the Z-axis direction Lift and carried out exemplified by adjustable axle portion 41a, axle portion 61a, the mode of the position of axle portion 48a and axle portion 68a in the Z-axis direction Illustrate, but be not limited to this.For example, it is also possible to be that axle portion 41a, axle portion 61a, axle portion 48a and axle portion 68a can be in the Z-axis direction The structure of lifting.
In addition, the substrate S of structure different from the embodiment described above can be used.
Figure 21 is the figure for the structure for representing substrate S.
As shown in figure 21, the structure to form matcoveredn 90 is can also be, the protective layer 90 surrounds substrate S processed surface The pattern forming region P such as forming wiring or electrode, element in Sa.
Above-mentioned protective layer 90 is formed as thickness more than pattern forming region P.By the structure, even in protective substrate C with In the case that processed surface Sa is overlapping, protective substrate C contact patterns forming regions P can be also prevented.In addition, protective layer 90 can be with Formed in protective substrate C sides.
Figure 22~Figure 27 is the stereogram for another embodiment for representing base board delivery device.As described in above-mentioned Fig. 2, Fig. 3 Brightly, the move portion 42 that can be carried first module portion 21 and automatically move can be by the rotation of castor 52 to X-direction, Y-axis side To and θ Z-directions movement.This is identical for the move portion 62 that can be carried second unit portion 22 and automatically move. Therefore, as shown in above-mentioned Figure 18~Figure 20, for the first track 31 and the second track 32 by extending in the X-axis direction, in Y-axis The conveyance guide mechanism that the 3rd track 33 that side is upwardly extended is constituted, as shown in figure 22, lays as additional conveyance guide portion Annular orbit 34a, 35a.
Annular orbit 34a is laid to from the central point TC1 that the first track 31 intersects with the 3rd track 33 as certain radius Annular shape.In addition, annular orbit 35a is laid to from the central point TC2 that the second track 32 intersects with the 3rd track 33 as one Determine the annular shape of radius.Annular orbit 34a, 35a are as making move portion 42 or move portion 62 around central point TC1 or TC2 Around rotate the path of navigation of (rotation) and play a role.In addition, being equipped with respectively for correct on central point TC1, TC2 Discoideus labeling section (including the mark or guiding signal generator as index etc.) 34b of ground positioning move portion 42,62, 35b。
Then, the processing unit 10 shown in Figure 22 is, for example, atmospheric pressure CVD device, by upper structure 10a and lower junction Structure body 10b is constituted.Lower structures 10b is arranged on the ground of factory (FL), and upper structure 10a is relative to lower structures 10b is movable in the Z-axis direction.
By make top from upper structure 10a to Z-direction move, can by lodge first module portion 21 axle portion Substrate S between 4lc and the axle portion 6lc in second unit portion 22 translational movement and is taken out of outside processing unit 10 in the X-axis direction.
Figure 22 represents to terminate in the substrate S carried out by processing unit 10 processing, and upper structure 10a is above Under state, make move portion 42 (first module portion 21) and move portion 62 (second unit portion 22) to the synchronization-moving shape of X-direction State.Move portion 42 (first module portion 21) is guided by the first track 31 and simultaneously towards the central point TC1 as original position in-X Moved on direction of principal axis, move portion 62 (second unit portion 22) is guided by the second track 32 and simultaneously towards the center as original position Point TC2 is moved in-X-direction.
Afterwards, as shown in figure 23, move portion 42 (first module portion 21) all reaches X with move portion 62 (second unit portion 22) The original position (central point TC1, TC2 position) of direction of principal axis.At this moment, the 3rd track 33 extended in the Y-axis direction is placed exactly in Between move portion 42 and move portion 62.
Afterwards, move portion 42 (first module portion 21) and either one in move portion 62 (second unit portion 22) are towards another Side is moved in the Y-axis direction.The state as shown in figure 24, here, move portion 42 (first module portion 21) is towards move portion 62 (the Two unit portions 22) movement is guided by the 3rd track 33.At this moment, the axle portion 41c in first module portion 21 or the axle in second unit portion 22 Mobile gearings of the portion 61c with move portion 42 (first module portion 21) in the Y-axis direction rotates, the side by substrate S that will not release Formula is wound.
Figure 25 represents that move portion 42 (first module portion 21) is close to move portion 62 (second unit portion 22), and schemes as described above Link the state after (connection) shown in 5.At this moment, move portion 62 (second unit portion 22) is located at central point TC2 (labeling section 35b) On, move portion 42 (first module portion 21) is located on annular orbit 35a.
The castor 72 of move portion 62 is produced under the state makes move portion 62 (second unit portion 22) in central point TC2 week Enclose the driving force that (rotation) is rotated along θ Z-directions.Together, the castor 52 of move portion 42, which is produced, makes (the first list of move portion 42 First portion 21) along annular orbit 35a circumferencial direction rotate (rotation) driving force.Further, at this moment, the pin of move portion 62 Wheel 72 or the castor 52 of move portion 42, will not be from centers with the rotation center of move portion 62 according to labeling section 35b testing result Point TC2 is controlled to X-direction and the Y direction mode travel direction that significantly position is offset.
Figure 26 represents the move portion 42 (first module portion 21) linked and move portion 62 (second unit portion 22) from Figure 25 In the state of turn 90 degrees in XY faces using central point TC2 as center dextrorotation after state.Though the direction of rotation is here It is turn 90 degrees for dextrorotation but it is also possible to be 90 degree of rotate counterclockwise.Rotated to which direction, filled according to next processing Put and how to load substrate S to determine.
Afterwards, as shown in figure 27, keep by processing unit 10 (for example, atmospheric pressure CVD device) into the substrate S after film process The second unit portion 22 (move portion 62) of volume and the first module portion 21 (move portion 42) for keeping remaining untreated S volumes of substrate It is integrally formed and translational movement in+X-direction by the guiding of the second track 32, and laterally across the direction of processing unit 10 Next processing unit.
Thus, original position (central point TC1, TC2) is vacated, therefore is equipped with next substrate S that should be handled move portion 42-1 (first module portion 21-1) and move portion 62-1 (second unit portion 22-1) are integrally formed and are sent to central point TC1 sides Original position.
Afterwards, as shown in figure 27, the first module portion 21-1 (move portion 42-1) of untreated S volumes of substrate is being kept to be located at In the state of central point TC1 (the crosspoint portion of the first track 31 and the 3rd track 33), for processed substrate S to be wound into The second unit portion 22-1 (move portion 62-1) of web-like is moved towards central point TC2 along the 3rd track 33.
As described above, by setting move portion 42 (first module portion 21) or move portion 62 (second unit portion 22) can be in work The space (annular orbit 34a, 35a etc.) of motion is rotated freely through on the ground FL of factory, the configuration of processing unit oneself can be made Improved by degree, the free degree of substrate S (web-like) conveyance direction, conveyance efficiency.
In embodiment of above, (the first module portion of the move portion after linking at certain intervals 42 is made in Figure 25, Figure 26 21) it is rotated by 90 ° with move portion 62 (second unit portion 22).However, being arranged on the place in such as Figure 25 in next processing unit Manage device 10-Y-axis side in the case of, move portion 42 (first module portion 21) and (the second unit portion of move portion 62 can also be made 22) directly moved along the 3rd track 33 extended in-Y direction to-Y direction, its state from Figure 25 can also be made Rotate after 180 degree and moved in-Y direction around central point TC2.
In addition, in Figure 25~Figure 27, move portion 42 (first module portion 21) and move portion 62 (second unit portion 22) exist Moved in the state of after linking at certain intervals.Mechanically contacted however, both are not necessary, noncontact can also be used to sense Device etc. keeps certain spatial joint clearance, and simultaneously in certain position deviation range (such as below 1mm) make move portion 42 with Move portion 62 mutually follows movement.
Anyway, for the move portion 42 (first module portion 21) and move portion 62 by the processing to substrate S has been completed (second unit portion 22) conveyance is to next processing unit (second processing device), along with substrate S to above-mentioned from having been carried out The translational motion of first direction that the processing unit of processing is left (being X-direction in Figure 22~Figure 27), to above-mentioned first party To the translational motion of the second direction (being Y direction in Figure 22~Figure 27) of intersection, including first direction and second direction At least two motions (two motions are continuous) in plane in the rotary motion of (being XY faces in Figure 22~Figure 27), and drive each pin Wheel 52,72, makes move portion 42 and move portion 62 move together.In addition, translational motion is not limited to X-direction or Y direction, also Including move portion 42 (first module portion 21) or move portion 62 (second unit portion 22) along in XY faces relative to X-axis and Y-axis The situation of the inclined direction of both sides (for example, 45 degree of directions) rectilinear movement.
It this concludes the description of what is carried out using the box device (first module portion 21, second unit portion 22) shown in Fig. 2~Fig. 5 Substrate S (or protective substrate C) conveyance mode.However, it is also possible to set in each box device substrate S temperature adjusting mechanism, Humidity adjustment mechanism, ultraviolet irradiation machine structure etc., or set temperature adjustment device, humidity adjustment to fill as one of processing unit Put, ultraviolet lamp, and opportune moment in treatment process temperature adjustment, dehumidifying, humidification, UV irradiations are carried out to substrate S.
In general, in the case where producing large-scale fine flat-panel monitor etc., it is various that mother metal is that substrate S is sent to Processing unit, receives various processing.Especially, in volume to volume (roll to roll) mode to flexible thin films such as PET or PEN In the case that substrate carries out continuous processing, it may be considered that understand cumulative stress on film substrate into throughout science and engineering sequence, and make Film substrate is deformed.Further, the membrane material for receiving the film substrate of processing or being deposited on substrate is also required to throughout Temperature, water content, wettability etc. are preset into appropriate state in science and engineering sequence.
Therefore, in the substrate S movement of box device 20 (first module portion 21, second unit portion 22) is filled with or treat In machine, make to be located at first module portion 21 or temperature adjusting mechanism, humidity adjustment mechanism or ultraviolet in second unit portion 22 shine Penetrate mechanism work.Or, temperature adjustment device, humidity adjusting apparatus, the ultraviolet for box device 20 is independently arranged in factory Moved in irradiation unit so that substrate S passes through.So, can be by the temperature of substrate S (or the membrane material on its surface), water content, wet The state of lubricant nature, internal stress etc. is adjusted to the specification of the processing unit suitable for next treatment process in advance.
In embodiments of the present invention, the box device 20 for keeping the substrate S of web-like is can relative to various processing units Mobile structure, therefore the batch processing of box device unit can be carried out.Thus, before treatment process, even if adding adjustment base The process (equivalent to one treatment process) of plate S (or the membrane material on its surface) various states, will not also make whole production line Production efficiency be greatly reduced, the production of yield rate well can be carried out.
Description of reference numerals
S- substrates, CONT- control units, BF- buffer parts, C- protective substrates, CV- cap assemblies, 10- processing units, 20- is box-packed Put, 21- first modules portion, 22- second units portion, 23- connecting portions, 24- travel mechanisms, 30- guide rails, the tracks of 31- first, 32- Second track, the tracks of 33- the 3rd, 34a, 35a- annular orbit, 42,62- move portions, 43,63- substrate-side communication units, 44,64- Move portion side communication unit, 46,66- dismounting test sections, 47,67- contact inhibition portion, 51,71- casings, 52,72- castors, 53,73- Lifting unit, 54,74- castor drive divisions, 55,75- position detection parts, 56,76- terminals, 65- connecting detections portion, 100,200- bases Plate processing unit, 111~113- process chambers, 160- liftings portion.

Claims (8)

1. a kind of box device, keeps donor rollers and recycling roll, the donor rollers, which are wound with, should supply to the strip of processing unit Plate shape substrates, the recycling roll is wound with the plate shape substrates taken out of from the processing unit, it is characterised in that described box-packed Put including：
First module portion, the first module portion keeps the donor rollers, and can be by the first drive division in two dimensional surface Interior movement；
Second unit portion, the second unit portion keeps the recycling roll, and can be by the second drive division in the two dimension Moved in plane；
Control unit, it controls first drive division and second drive division, to cause on the long side with the plate shape substrates On the short side direction that direction intersects, joint translation motion in the first module portion and the second unit portion is flat in the two dimension On direction of rotation in face, the first module portion and second unit portion common pivoting movement.
2. box device according to claim 1, it is characterised in that
The control unit controls first drive division or second drive division, to cause in the plate shape substrates hanger in institute In the state of stating between donor rollers and the recycling roll, on the long side direction of the plate shape substrates, the first module portion and Moved to close to each other or direction that is being separated from each other translational motion or to same direction joint translation in the second unit portion.
3. box device according to claim 2, it is characterised in that
The control unit controls first drive division and second drive division, to cause in the first module portion and described It is adjoint when second unit portion state close at predetermined intervals on the long side direction of the plate shape substrates or the state being connected The translational motion to the long side direction, at least two into the translational motion and the rotary motion of the short side direction Plant motion and the first module portion and the second unit portion is together moved.
4. according to box device according to any one of claims 1 to 3, it is characterised in that
The first module portion and the second unit portion have the connecting portion that can link with elevating mechanism, the lifting respectively Mechanism is used to make the first module portion and the second unit portion move to the direction vertical with the two dimensional surface.
5. according to box device according to any one of claims 1 to 3, it is characterised in that
The first module portion has energy and the first communication unit communicated between the control unit, the second unit portion tool There are energy and the second communication unit communicated between the control unit.
6. box device according to claim 5, it is characterised in that
First communication unit receive shift action for controlling the first module portion based on first drive division and First control signal of the supply action of the plate shape substrates based on the donor rollers,
Second communication unit receive shift action for controlling the second unit portion based on second drive division and Second control signal of the recovery action of the plate shape substrates based on the recycling roll.
7. according to box device according to any one of claims 1 to 3, it is characterised in that
First drive division in the first module portion is configured to dismantle relative to the first module portion, and described the Second drive division in two unit portions is configured to dismantle relative to the second unit portion.
8. according to box device according to any one of claims 1 to 3, it is characterised in that
The first module portion includes be arrangeding in parallel with the donor rollers and for the rolling for the flexible protective substrate for winding banding Cylinder, the flexible protective substrate of the banding covers the surface of the plate shape substrates,
The second unit portion includes be arrangeding in parallel with the recycling roll and for the rolling for the flexible protective substrate for winding banding Cylinder, the flexible protective substrate of the banding covers the surface of the plate shape substrates.
CN201610622573.7A 2012-04-13 2012-12-17 Box device Active CN106185413B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-092132 2012-04-13
JP2012092132 2012-04-13
CN201280072239.9A CN104203785B (en) 2012-04-13 2012-12-17 Box device, base board delivery device, substrate board treatment and substrate processing method using same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201280072239.9A Division CN104203785B (en) 2012-04-13 2012-12-17 Box device, base board delivery device, substrate board treatment and substrate processing method using same

Publications (2)

Publication Number Publication Date
CN106185413A CN106185413A (en) 2016-12-07
CN106185413B true CN106185413B (en) 2017-11-07

Family

ID=49327304

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201280072239.9A Active CN104203785B (en) 2012-04-13 2012-12-17 Box device, base board delivery device, substrate board treatment and substrate processing method using same
CN201610622573.7A Active CN106185413B (en) 2012-04-13 2012-12-17 Box device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201280072239.9A Active CN104203785B (en) 2012-04-13 2012-12-17 Box device, base board delivery device, substrate board treatment and substrate processing method using same

Country Status (5)

Country Link
JP (5) JP6011615B2 (en)
KR (6) KR102126421B1 (en)
CN (2) CN104203785B (en)
TW (3) TWI661498B (en)
WO (1) WO2013153706A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011615B2 (en) * 2012-04-13 2016-10-19 株式会社ニコン Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method
JP6264619B2 (en) * 2015-02-09 2018-01-24 三菱重工機械システム株式会社 Front stop device, sheet stacking device, counter ejector and box making machine
CN110773536B (en) * 2018-07-31 2021-10-22 台湾积体电路制造股份有限公司 Die container workstation, system and method for processing die container
CN110449432B (en) * 2019-07-25 2024-02-23 老肯医疗科技股份有限公司 Automatic vehicle entering and exiting control system of cleaning machine and use method
WO2024105976A1 (en) * 2022-11-15 2024-05-23 村田機械株式会社 Transport vehicle system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1076207A (en) * 1996-08-30 1998-03-24 Tokyo Electron Ltd Coating film forming apparatus
US6451145B1 (en) * 1998-03-09 2002-09-17 Frontier Industrial Technology, Inc. Web splicing system
CN101060066A (en) * 2006-04-17 2007-10-24 大日本网目版制造株式会社 Substrate processing apparatus
WO2011126132A1 (en) * 2010-04-09 2011-10-13 株式会社ニコン Substrate processing device
JP2011221538A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask case, mask unit, exposure equipment, substrate processing apparatus and device manufacturing method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225380A (en) * 1986-03-27 1987-10-03 Minolta Camera Co Ltd Ink film cassette of thermal transfer printer
DE3713170A1 (en) * 1987-04-17 1988-11-03 Agfa Gevaert Ag PHOTOGRAPHIC DEVICE FOR THE PROCESSING OF PHOTOGRAPHIC REEL MATERIAL THAT CAN BE PLACED IN MOBILE CASSETTE
JPH03256629A (en) * 1990-03-08 1991-11-15 Canon Inc Commodity feeding method by transfer of commodity feeding member
DE59107083D1 (en) * 1991-06-24 1996-01-25 Gretag Imaging Ag Photographic copier
JPH0910446A (en) * 1995-06-30 1997-01-14 Aprica Kassai Inc Drawing toy for infants
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
JP2000159099A (en) * 1998-11-27 2000-06-13 Nkk Corp Track-equipped dolly
JP3376935B2 (en) * 1999-01-25 2003-02-17 ウシオ電機株式会社 Exposure equipment for strip-shaped workpieces
JP2000303178A (en) 1999-04-16 2000-10-31 Sanyo Electric Co Ltd Thin film forming device
JP4491779B2 (en) * 2004-06-28 2010-06-30 ノーリツ鋼機株式会社 magazine
JP4542836B2 (en) * 2004-06-29 2010-09-15 ルネサスエレクトロニクス株式会社 Transport cart
WO2006100868A1 (en) * 2005-03-18 2006-09-28 Konica Minolta Holdings, Inc. Method of forming organic compound layer, process for producing organic el device, and organic el device
JP4409552B2 (en) * 2006-09-08 2010-02-03 住友重機械工業株式会社 Automatic roll feeder
CN101809709B (en) * 2007-11-15 2014-04-30 株式会社尼康 Mask case, transfer apparatus, exposure apparatus, mask transfer method and device manufacturing method
JP5294141B2 (en) 2008-03-25 2013-09-18 株式会社ニコン Display element manufacturing equipment
JP5407514B2 (en) * 2009-04-21 2014-02-05 株式会社明電舎 Method and apparatus for steering drive of automatic guided vehicle
JP2011098808A (en) 2009-11-05 2011-05-19 Nikon Corp Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element
JP5063712B2 (en) * 2010-01-26 2012-10-31 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
CN102741754B (en) * 2010-02-12 2015-12-02 株式会社尼康 Substrate board treatment
JP5494124B2 (en) * 2010-03-30 2014-05-14 大日本印刷株式会社 Pattern forming method, color filter manufacturing method, and pattern forming apparatus
WO2011158584A1 (en) * 2010-06-18 2011-12-22 コニカミノルタホールディングス株式会社 Conveyance device and conveyance method for thin film glass
JP4691205B1 (en) * 2010-09-03 2011-06-01 日東電工株式会社 Method for producing optical film laminate including thin high-performance polarizing film
JP6011615B2 (en) * 2012-04-13 2016-10-19 株式会社ニコン Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1076207A (en) * 1996-08-30 1998-03-24 Tokyo Electron Ltd Coating film forming apparatus
US6451145B1 (en) * 1998-03-09 2002-09-17 Frontier Industrial Technology, Inc. Web splicing system
CN101060066A (en) * 2006-04-17 2007-10-24 大日本网目版制造株式会社 Substrate processing apparatus
WO2011126132A1 (en) * 2010-04-09 2011-10-13 株式会社ニコン Substrate processing device
JP2011221538A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask case, mask unit, exposure equipment, substrate processing apparatus and device manufacturing method

Also Published As

Publication number Publication date
TWI604550B (en) 2017-11-01
TWI695445B (en) 2020-06-01
JP6384580B2 (en) 2018-09-05
TW201351528A (en) 2013-12-16
CN104203785B (en) 2016-08-24
KR101816343B1 (en) 2018-02-21
KR102126421B1 (en) 2020-06-24
KR20180003639A (en) 2018-01-09
CN104203785A (en) 2014-12-10
TW201929123A (en) 2019-07-16
JP2017175161A (en) 2017-09-28
JP6304331B2 (en) 2018-04-04
JP6011615B2 (en) 2016-10-19
KR20180136574A (en) 2018-12-24
KR101949113B1 (en) 2019-02-15
TW201810492A (en) 2018-03-16
KR20150002647A (en) 2015-01-07
KR20170081752A (en) 2017-07-12
JP2016172645A (en) 2016-09-29
JPWO2013153706A1 (en) 2015-12-17
KR20180049114A (en) 2018-05-10
JP6156555B2 (en) 2017-07-05
KR20190126455A (en) 2019-11-11
JP6249127B2 (en) 2017-12-20
JP2018011065A (en) 2018-01-18
KR102042952B1 (en) 2019-11-08
WO2013153706A1 (en) 2013-10-17
CN106185413A (en) 2016-12-07
KR101868310B1 (en) 2018-07-17
JP2017004007A (en) 2017-01-05
KR101787330B1 (en) 2017-10-18
TWI661498B (en) 2019-06-01

Similar Documents

Publication Publication Date Title
CN106185413B (en) Box device
CN106919003B (en) Pattern forming method and device, pattern exposure method and manufacturing method
CN101902903B (en) Electronic parts installation apparatus
KR20140007382A (en) Substrate processing apparatus
JP6132060B2 (en) Exposure equipment
JP5735809B2 (en) Substrate processing equipment
CN103855328B (en) Organic el sealing device
CN104802498B (en) Detaching device and detaching method
CN103380483A (en) Substrate processing device
JP5929761B2 (en) Substrate processing system and display element manufacturing method
JP6065954B2 (en) Manufacturing system

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant