WO2013153706A1 - Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method - Google Patents

Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method Download PDF

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Publication number
WO2013153706A1
WO2013153706A1 PCT/JP2012/082695 JP2012082695W WO2013153706A1 WO 2013153706 A1 WO2013153706 A1 WO 2013153706A1 JP 2012082695 W JP2012082695 W JP 2012082695W WO 2013153706 A1 WO2013153706 A1 WO 2013153706A1
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WO
WIPO (PCT)
Prior art keywords
unit
substrate
moving
processing
recovery
Prior art date
Application number
PCT/JP2012/082695
Other languages
French (fr)
Japanese (ja)
Inventor
浜田　智秀
鈴木　智也
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to JP2014510021A priority Critical patent/JP6011615B2/en
Priority to KR1020177018378A priority patent/KR101787330B1/en
Priority to KR1020187036272A priority patent/KR102042952B1/en
Priority to KR1020177037338A priority patent/KR101868310B1/en
Priority to CN201280072239.9A priority patent/CN104203785B/en
Priority to KR1020147028039A priority patent/KR101816343B1/en
Priority to KR1020187011184A priority patent/KR101949113B1/en
Priority to KR1020197032482A priority patent/KR102126421B1/en
Publication of WO2013153706A1 publication Critical patent/WO2013153706A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/182—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations
    • B65H23/185—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations motor-controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00—Function indicators
    • B65H2220/02—Function indicators indicating an entity which is controlled, adjusted or changed by a control process, i.e. output
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B65H2513/11—Speed angular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention relates to a cassette apparatus, a substrate transfer apparatus, a substrate processing apparatus, and a substrate processing method.
  • This application claims priority based on Japanese Patent Application No. 2012-092132 for which it applied on April 13, 2012, and uses the content here.
  • a display element constituting a display device such as a display device, for example, a liquid crystal display element and an organic electroluminescence (organic EL) element are known.
  • organic EL organic electroluminescence
  • active elements active devices that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.
  • a technique for forming a display element on a flexible sheet-like substrate for example, a film member
  • a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1).
  • roll system a technique called a roll-to-roll system
  • one sheet-like substrate for example, a belt-like film member
  • the fed substrate is wound around the substrate collection side recovery roller
  • a desired processing for forming an electronic device such as a display panel or a solar cell panel is performed on a substrate by a processing apparatus installed between the supply roller and the collection roller.
  • the substrate is transported using, for example, a plurality of transport rollers, etc., and in the case of production of a display panel, the TFT is mounted using a plurality of processing devices (units).
  • a gate electrode, a gate insulating film, a semiconductor film, a source / drain electrode, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate.
  • a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on a substrate.
  • the total length of the substrate becomes long and it may be difficult to manage the substrate.
  • the first unit portion that performs one of substrate supply and recovery, and the second unit portion that performs the other of substrate supply and recovery, the first unit portion and The second unit part is provided with a cassette device that can approach or separate from each other.
  • the first movement path is provided so as to be movable
  • the first unit part that performs one of supply and recovery of the substrate
  • the second movement path is provided so as to be movable.
  • Substrate supply and recovery by controlling the first unit for the second unit that performs the other of supply and recovery, and the first substrate processing unit disposed between the first movement path and the second movement path And a controller that controls the second unit to perform the other of substrate supply and recovery, and the controller is disposed between the first movement path and the second movement path.
  • a substrate transport apparatus is provided to perform.
  • a plurality of processing units that are disposed between the first movement path and the second movement path and perform processing on a flexible substrate, and the second aspect of the present invention.
  • a substrate processing apparatus including the substrate transfer apparatus according to the above aspect is provided.
  • a processing method for sequentially sending a flexible long substrate to a plurality of processing apparatuses to form an electronic device on the substrate A first unit unit including a supply roll in which the substrate to be supplied to the processing unit is wound in the longitudinal direction; and a recovery unit in which the substrate to be recovered from the first substrate processing unit is wound in the longitudinal direction.
  • a substrate processing method including a third moving step of moving one unit portion and the second unit portion together toward a second substrate processing portion different from the first substrate processing portion.
  • FIG. 1 is a perspective view showing an overall configuration of a substrate processing apparatus according to a first embodiment. It is a disassembled perspective view which shows the structure by the side of the 1st unit part which concerns on this embodiment. It is a figure which shows the structure of a part of cassette apparatus which concerns on this embodiment. It is a disassembled perspective view which shows the structure by the side of the 2nd unit part which concerns on this embodiment. It is a figure which shows the structure of the cassette apparatus which concerns on this embodiment. It is a figure which shows the structure of the process part which concerns on this embodiment. It is a figure which shows one form of operation
  • FIG. 1 It is a figure which shows the other structure of a substrate processing apparatus. It is a figure which shows the other structure of a substrate processing apparatus. It is a figure which shows the other structure of a substrate processing apparatus. It is a figure which shows the other structure of a substrate processing apparatus. It is a figure which shows the other structure of a substrate processing apparatus. It is a figure which shows the other structure of a board
  • FIG. 1 is a perspective view showing an overall configuration of a substrate processing apparatus (substrate transport apparatus) 100 according to the present embodiment.
  • the substrate processing apparatus 100 includes a processing unit (first substrate processing unit, second processing unit) that performs a predetermined process on a flexible sheet-like substrate (for example, a strip-shaped film member) S.
  • Substrate processing unit) 10 transport unit (cassette device) 20 for transporting substrate S, and control unit CONT for overall control of processing unit 10 and cassette device 20.
  • the substrate processing apparatus 100 is provided, for example, on the floor surface FL of the manufacturing factory.
  • the substrate processing apparatus 100 is an apparatus of a roll-to-roll system (hereinafter simply referred to as “roll system”) that performs various processes on the processing surface (front surface) of the substrate S.
  • the substrate processing apparatus 100 is used when a display element (electronic device) such as an organic EL element or a liquid crystal display element is formed on the substrate S.
  • a display element electronic device
  • an XYZ orthogonal coordinate system is set, and the positional relationship of each member is described with reference to the XYZ orthogonal coordinate system.
  • a plane parallel to the floor surface FL in the XYZ orthogonal coordinate system is an XY plane.
  • a direction in which the substrate S moves in the XY plane is a Y-axis direction
  • a direction orthogonal to the Y-axis direction is an X-axis direction.
  • a direction perpendicular to the floor surface FL (XY plane) is taken as a Z-axis direction.
  • the direction around the Z axis is denoted as the ⁇ Z axis direction.
  • a foil such as a resin film or stainless steel
  • the resin film is polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene Materials such as naphthalate and stainless steel foil can be used.
  • the dimension in the short direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the long direction (size for one roll) is, for example, 10 m or more.
  • this dimension is only an example and is not limited thereto.
  • the dimension in the short direction of the substrate S may be 1 m or less, 50 cm or less, or 2 m or more.
  • substrate S may be 10 m or less.
  • the substrate S has a thickness of 1 mm or less, for example, and is formed to have flexibility.
  • the flexibility means a property that the substrate can be bent without being sheared or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility.
  • the flexibility varies depending on the material, size, thickness, temperature, ambient temperature, environment such as humidity, and the like of the substrate.
  • a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be employed.
  • the substrate S preferably has a relatively small coefficient of thermal expansion so that the dimensions do not substantially change even when subjected to heat at a relatively high temperature (for example, about 200 ° C.) (thermal deformation is small).
  • a relatively high temperature for example, about 200 ° C.
  • an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient.
  • the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
  • the substrate processing apparatus 100 is installed in a device manufacturing factory.
  • Guide rails (first movement path, second movement path) 30 are formed on a floor surface FL in the factory.
  • the guide rail 30 has a first rail 31, a second rail 32, and a third rail 33.
  • the first rail 31 and the second rail 32 are formed so as to extend in the arrangement direction (X-axis direction) of the plurality of processing units.
  • the first rail 31 is disposed on one side of the processing unit 10 with respect to the Y-axis direction
  • the second rail 32 is disposed on the other side of the processing unit 10 with respect to the Y-axis direction. That is, the first rail 31 and the second rail 32 are provided at positions that sandwich the processing unit 10 in the Y-axis direction.
  • the third rails 33 are respectively disposed between the plurality of processing units 10 in the X-axis direction.
  • the third rail 33 is formed in parallel to the Y-axis direction, and connects the first rail 31 and the second rail 32.
  • position information such as an X coordinate and a Y coordinate is set in the first rail 31, the second rail 32, and the third rail 33.
  • the position information is formed on each rail so that it can be read by a sensor such as an optical sensor or a magnetic sensor.
  • the substrate processing apparatus 100 includes a cassette device 20.
  • the cassette device 20 includes a first unit portion 21 that performs one of the supply and recovery of the substrate S and a second unit portion 22 that performs the other of the supply and recovery of the substrate S.
  • substrate S is conveyed from the one side of the 1st unit part 21 and the 2nd unit part 22 to the other side.
  • a plurality of first unit parts 21 and a plurality of second unit parts 22 are prepared.
  • the floor surface FL is provided with a buffer unit BF that waits for at least one of the first unit unit 21 and the second unit unit 22.
  • the buffer unit BF can make the first unit unit 21 and the second unit unit 22 stand by.
  • the buffer unit BF is connected to the first rail 31, the second rail 32, or the third rail 33 through a part of the guide rail 30.
  • FIG. 2 is an exploded perspective view showing the configuration of the cassette unit 20 on the first unit portion 21 side.
  • FIG. 3 is a diagram illustrating a partial configuration of the cassette device 20.
  • the cassette device 20 includes a moving mechanism 24 that moves the first unit portion 21 relative to the second unit portion 22.
  • the moving mechanism 24 includes a moving unit (first moving unit) 42 that moves the first unit unit 21.
  • the cassette apparatus 20 has the moving part side communication part 44 and the contact suppression part 47 which are mentioned later.
  • the first unit portion 21 includes a first wall portion 40a, a second wall portion 40b, a bottom portion 40c, and an external connection portion 40d.
  • the first unit portion 21 is provided with a power source portion (not shown) such as a battery.
  • the first wall portion 40a and the second wall portion 40b are each formed in a plate shape.
  • the first wall portion 40a is disposed, for example, at the end on the ⁇ X axis side.
  • the second wall portion 40b is disposed, for example, at the end on the + X axis side.
  • the first wall portion 40a and the second wall portion 40b are arranged in parallel to each other.
  • the 1st wall part 40a and the 2nd wall part 40b may be formed in the door shape.
  • the bottom 40c is formed in parallel to the XY plane (floor surface FL), and connects the first wall 40a and the second wall 40b.
  • the external connection portion 40d is formed of, for example, a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the + Y-axis side end portion of the first unit portion 21.
  • the + Y-axis side end portion of the first unit portion 21 functions as a connection portion connected to an external transport mechanism.
  • the external connection portion 40d is provided at, for example, two places in the height direction (Z-axis direction) of the first unit portion 21.
  • a notch portion 40f is formed at each corner portion on the connection portion side.
  • the cutout portion 40f is provided so as to be able to contact an external structure. Positioning is performed between the first unit portion 21 and the external structure by bringing the notch 40f into contact with the external structure.
  • the cutout portion 40f is formed at the + Y-axis side end portion. However, for example, the cutout portion 40f may be provided at the ⁇ Y-axis side end portion. In this case, positioning can be performed between the first unit portion 21 and the processing unit 10 by bringing the notch 40f into contact with a part of the processing unit 10.
  • a first connection portion 23a is formed at each end on the ⁇ Y axis side of the first wall portion 40a and the second wall portion 40b.
  • the first unit portion 21 is connected to the second unit portion 22 through the first connection portion 23a.
  • the 1st connection part 23a the structure which can switch an attachment / detachment state automatically, for example, an electromagnet etc., is used, for example.
  • the first unit portion 21 has a first accommodating portion 40 that accommodates a substrate.
  • the first accommodating portion 40 is provided with a substrate driving portion (first substrate driving portion) 41 to which a substrate supply roller (supply roll) 41c around which the substrate S is wound is attached.
  • the substrate driving unit 41 performs a supply operation of supplying the substrate S to the second unit unit 22 side by rotating the substrate S.
  • the substrate drive unit 41 includes a shaft portion (first shaft portion) 41a and a rotation drive portion (first drive portion) 41b.
  • the shaft portion 41a is formed in a cylindrical shape or a columnar shape, and is configured to be extendable and contractible.
  • the shaft portion 41a When the shaft portion 41a expands and contracts, it can be removed from between the first wall portion 40a and the second wall portion 40b, and the substrate supply roller 41c can be mounted.
  • the shaft portion 41a is arranged so that the axial direction of the central axis is parallel to the X-axis direction.
  • One end portion of the shaft portion 41a is supported by the second wall portion 40b of the first unit portion 21 so as to be rotatable in the circumferential direction.
  • the shaft portion 41a is provided with a holding portion (not shown) that can hold the end portion of the substrate supply roller 41c.
  • the rotation drive unit 41b rotates the shaft portion 41a.
  • the rotation operation part 41b rotates the shaft part 41a, so that the substrate S can be supplied (delivered).
  • the first accommodating portion 40 is provided with a protective substrate driving portion (first auxiliary portion) 48 to which the protective substrate supply roller 48c is attached.
  • a protective substrate (protective film) C that covers the surface to be processed of the substrate S is wound around the protective substrate supply roller 48c.
  • the protective substrate drive unit 48 performs a supply operation of supplying the protective substrate C to the second unit unit 22 side by rotating the protective substrate supply roller 48c.
  • the protective substrate C protects the surface to be processed by covering the surface to be processed of the substrate S.
  • the protective substrate C is formed in a strip shape using a flexible material like the substrate S, and has substantially the same dimensions as the substrate S.
  • the protective substrate drive unit 48 includes a shaft portion 48a and a rotation drive portion 48b.
  • the shaft portion 48a is formed in a cylindrical shape or a columnar shape, and is configured to be stretchable. When the shaft portion 48a expands and contracts, it can be removed from between the first wall portion 40a and the second wall portion 40b, and the protective substrate supply roller 48c can be attached.
  • the shaft portion 48a is arranged so that the axial direction of the central axis is parallel to the X-axis direction. That is, the shaft portion 41a and the shaft portion 48a are arranged so that the axial directions of the central axes are parallel to each other.
  • the shaft portion 48a is supported by the second wall portion 40b of the first unit portion 21 so as to be rotatable in the circumferential direction.
  • the shaft portion 48a is provided with a holding portion (not shown) that can hold the end portion of the protective substrate supply roller 48c.
  • the rotation driving part 48b rotates the shaft part 48a.
  • the rotation driving part 48b rotates the shaft part 48a, so that the supply operation (sending operation) of the protective substrate C is possible.
  • the protective substrate driving unit 48 is provided with a mechanism (not shown) for superimposing the sent protective substrate C on the substrate S.
  • the first unit unit 21 includes a substrate side communication unit (first communication unit) 43.
  • the board side communication part 43 is provided on the + Z-axis side end face of the first wall part 40a.
  • the board side communication unit 43 can communicate with the control unit CONT, the second unit unit 22, and the like, for example.
  • the first unit portion 21 has a contact suppressing portion 47.
  • the contact suppressing portion 47 is provided on the end surfaces on the + Y axis side of the first wall portion 40a and the second wall portion 40b.
  • the contact suppressing portion 47 suppresses the + Y-axis end surfaces of the first wall portion 40a and the second wall portion 40b from coming into contact with the external structure, and reduces the impact at the time of contact.
  • the contact suppressing portion 47 includes, for example, a rod-like member that protrudes from the first wall portion 40a and the second wall portion 40b to the + Y-axis side, and an elastic member that receives a force in the ⁇ Y-axis direction that acts on the rod-like member. .
  • the moving unit 42 described above supports the first unit unit 21 so as to be removable.
  • the moving unit 42 moves the first unit unit 21 in the X-axis direction, the Y-axis direction, and the Z-axis direction.
  • the moving unit 42 includes a housing 51, a caster 52, an elevating unit 53, and a caster driving unit 54.
  • the moving unit 42 is provided with a power supply unit (not shown) such as a battery.
  • the housing 51 has a movable part 51a and a base part 51b.
  • the movable portion 51 a is provided at the + Z-axis side end portion of the casing 51, and is provided so as to be movable in the Z-axis direction by driving the elevating portion 53.
  • the first unit portion 21 moves in the + Z-axis direction integrally with the movable portion 51a.
  • the base 51b supports the movable part 51a so as to be movable.
  • the four casters 52 are provided on the ⁇ Z-axis side end face of the base portion 51 b of the casing 51.
  • the caster 52 is rotatably provided by driving of the caster driving unit 54. As the caster 52 rotates, the casing 51 and the first unit unit 21 integrally move in the X-axis direction, the Y-axis direction, and the ⁇ Z-axis direction.
  • the groove part 50 is formed in the end surface 51c on the + Z-axis side of the movable part 51a.
  • the groove part 50 is formed in a V shape with respect to the end face 51c.
  • four spherical support portions 49 are formed on the end surface 40 e on the ⁇ Z-axis side of the first unit portion 21.
  • the four spherical support portions 49 are supported by the groove portions 50, respectively.
  • the number of the groove parts 50 and the spherical support parts 49 may be three, respectively.
  • the attachment / detachment detection part 46 is provided in the movable part 51a.
  • the attachment / detachment detection unit 46 detects whether or not the first unit unit 21 is attached to the housing 51.
  • various sensors such as a sensor for detecting an electric resistance value between the groove 50 and the spherical support 49 and a sensor for detecting a pressure in the groove 50 can be used.
  • the detection result by the attachment / detachment detection unit 46 is transmitted from the moving unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example.
  • the moving unit 42 includes a moving unit side communication unit (first communication unit) 44.
  • the mobile unit side communication unit 44 is provided inside the housing 51.
  • the moving unit side communication unit 44 can communicate with the control unit CONT, the substrate side communication unit 43, the second unit unit 22, and the like, for example.
  • the board-side communication unit 43 and the moving unit-side communication unit 44 can receive a first control signal for controlling the operation of the first unit unit 21.
  • the first control signal includes, for example, a signal for controlling the moving operation of the moving unit 42 and a signal for controlling the supply and recovery operations of the substrate S in the first unit unit 21.
  • a position detection unit (first detection unit) 55 is provided on the end surface 51 d (surface facing the floor surface FL) on the ⁇ Z axis side of the base 51 b of the housing 51.
  • the position detection unit 55 detects the position information of the first unit unit 21.
  • the position detector 55 detects, for example, position information set on the guide rail 30 (the first rail 31, the second rail 32, and the third rail 33) as the position information.
  • the detection result by the position detection unit 55 is transmitted from the moving unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example.
  • the control unit CONT moves the first unit unit 21 along the guide rail 30 by using the detection result of the position detection unit 55.
  • FIG. 4 is an exploded perspective view showing the configuration of the second unit portion 22 in the cassette device 20.
  • the second unit unit 22 includes a substrate driving unit (second substrate driving unit) 61, a substrate side communication unit 63, a contact suppressing unit 67, and a protective substrate driving unit (second auxiliary unit) 68.
  • the moving mechanism 24 provided in the cassette device 20 includes a moving unit (second moving unit) 62 that moves the second unit unit 22.
  • the second unit part 22 has a first wall part 60a, a second wall part 60b, a bottom part 60c, and an external connection part 60d.
  • the second unit 22 is provided with a power source (not shown) such as a battery.
  • the 1st unit part 21 and the 2nd unit part 22 have the mirror surface structure on the basis of XZ plane.
  • the first wall portion 60a and the second wall portion 60b are each formed in a plate shape.
  • the first wall portion 60a is disposed, for example, at the end on the ⁇ X axis side.
  • the second wall portion 60b is disposed, for example, at the end on the + X axis side.
  • the first wall portion 60a and the second wall portion 60b are arranged in parallel to each other.
  • the 1st wall part 60a and the 2nd wall part 60b may be formed in the door shape.
  • the bottom portion 60c is formed in parallel to the XY plane (floor surface FL), and connects the first wall portion 60a and the second wall portion 60b.
  • the external connection portion 60d is formed of, for example, a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the ⁇ Y-axis side end portion of the second unit portion 22.
  • the ⁇ Y-axis side end portion of the second unit portion 22 functions as a connection portion connected to an external transport mechanism.
  • the external connection portion 60d is provided at, for example, two places in the height direction (Z-axis direction) of the second unit portion 22.
  • a cutout portion 60f is formed at each corner on the connection portion side.
  • the cutout portion 60f is provided so as to be able to contact an external structure.
  • Positioning is performed between the second unit portion 22 and the external structure by bringing the notch 60f into contact with the external structure.
  • the notch 60f is formed at the ⁇ Y-axis side end, but for example, the notch 60f may be provided at the + Y-axis side end. In this case, positioning can be performed between the second unit portion 22 and the processing unit 10 by bringing the notch 60 f into contact with a part of the processing unit 10.
  • a second connection portion 23b is formed at each end on the + Y-axis side of the first wall portion 60a and the second wall portion 60b.
  • the second unit part 22 is connected to the first unit part 21 via the second connection part 23b.
  • the 2nd connection part 23b the structure which can switch an attachment / detachment state automatically, for example, an electromagnet etc., is used, for example.
  • the second unit part 22 has a second housing part 60 for housing the substrate.
  • the second storage unit 60 is provided with a substrate driving unit 61 to which a substrate collection roller (collection roll) 61c around which the substrate S is wound is attached.
  • the substrate driving unit 61 performs a recovery operation of recovering the substrate S supplied from the first unit unit 21 side by rotating the substrate S.
  • the substrate drive unit 61 includes a shaft part (second shaft part) 61a and a rotation drive part (second drive part) 61b.
  • the shaft portion 61a is formed in a cylindrical shape or a columnar shape, and is configured to be extendable.
  • the shaft portion 61a When the shaft portion 61a expands and contracts, it can be removed from between the first wall portion 60a and the second wall portion 60b, and the substrate recovery roller 61c can be mounted.
  • the shaft portion 61a is arranged so that the axial direction of the central axis is parallel to the X-axis direction, for example.
  • One end portion of the shaft portion 61a is supported by the second wall portion 60b of the second unit portion 22 so as to be rotatable in the circumferential direction.
  • the shaft portion 61a is provided with a holding portion (not shown) that can hold the end portion of the substrate collection roller 61c.
  • the rotation driving part 61b rotates the shaft part 61a.
  • the rotation driving part 61b rotates the shaft part 61a, whereby the supply operation (winding operation) of the substrate S is possible.
  • the second housing portion 60 is provided with a protective substrate driving portion (second auxiliary portion) 68 to which the protective substrate supply roller 68c is attached.
  • a protective substrate (protective film) C that covers the surface to be processed of the substrate S is wound around the protective substrate supply roller 68c.
  • the protective substrate driving unit 68 performs a recovery operation of recovering the protective substrate C supplied from the first unit unit 21 side by rotating the protective substrate supply roller 68c.
  • the protective substrate drive unit 68 includes a shaft portion 68a and a rotation drive portion 68b.
  • the shaft portion 68a is formed in a cylindrical shape or a columnar shape, and is configured to be stretchable. When the shaft portion 68a expands and contracts, it can be removed from between the first wall portion 60a and the second wall portion 60b, and the protective substrate supply roller 68c can be attached.
  • the shaft portion 68a is disposed so that, for example, the axial direction of the central axis is parallel to the X-axis direction. That is, the shaft portion 61a and the shaft portion 68a are arranged so that the axial directions of the central axes are parallel to each other.
  • the shaft portion 68a is supported by the second wall portion 60b of the second unit portion 22 so as to be rotatable in the circumferential direction.
  • the shaft portion 68a is provided with a holding portion (not shown) that can hold the end portion of the protective substrate supply roller 68c.
  • the rotation drive unit 68b rotates the shaft unit 68a.
  • the rotation driving portion 68b rotates the shaft portion 68a, whereby the supply operation (winding operation) of the protective substrate C is possible.
  • the protective substrate driving unit 68 is provided with a mechanism (not shown) for superimposing the sent protective substrate C on the substrate S. When the protective substrate C is wound on the substrate driving unit 61 in a state where the protective substrate C overlaps the substrate S, the protective substrate driving unit 68 on the second unit unit 22 side can be omitted.
  • the second unit section 22 has a board side communication section (second communication section) 63.
  • the board side communication part 63 is provided on the + Z-axis side end face of the second wall part 60b.
  • the board side communication unit 63 can communicate with the control unit CONT, the first unit unit 21 and the like, for example.
  • the second unit part 22 has a contact suppressing part 67.
  • the contact suppression portion 67 is provided on the end surfaces on the ⁇ Y axis side of the first wall portion 60a and the second wall portion 60b.
  • the contact suppressing portion 67 suppresses the ⁇ Y-axis side end surfaces of the first wall portion 60a and the second wall portion 60b from coming into contact with the external structure and mitigates an impact at the time of contact.
  • the contact suppressing portion 67 includes, for example, a rod-like member that protrudes from the first wall portion 60a and the second wall portion 60b to the ⁇ Y-axis side, and an elastic member that receives a force in the + Y-axis direction that acts on the rod-like member. .
  • a groove portion 70 is formed on the end surface 71c on the + Z-axis side of the movable portion 71a.
  • the groove portion 70 is formed in a V shape with respect to the end surface 71c.
  • four spherical support portions 69 are formed on the end surface 60 e on the ⁇ Z-axis side of the second unit portion 22.
  • the four spherical support portions 69 are supported by the groove portions 70, respectively.
  • the number of the groove part 70 and the spherical support part 69 may be three, respectively.
  • the movable part 71a is provided with an attachment / detachment detection part 66.
  • the attachment / detachment detection unit 66 detects whether or not the second unit unit 22 is attached to the housing 71.
  • various sensors such as a sensor for detecting an electric resistance value between the groove 70 and the spherical support 69 and a sensor for detecting a pressure in the groove 70 can be used.
  • the detection result by the attachment / detachment detection unit 66 is transmitted from the moving unit side communication unit 64 to the outside (the control unit CONT, the substrate side communication unit 63, etc.), for example.
  • the second unit unit 22 includes a connection detection unit (second detection unit) 65 in addition to the above configuration.
  • the connection detection unit 65 detects whether or not the first unit unit 21 and the second unit unit 22 are connected.
  • As the connection detection unit 65 a sensor that detects the electrical characteristics of the second connection unit 23b can be used.
  • the detection result by the connection detection unit 65 is transmitted from the mobile unit side communication unit 64 to the outside (control unit CONT, board side communication unit 63, etc.), for example.
  • the moving unit 62 described above supports the second unit unit 22 so as to be removable.
  • the moving unit 62 moves the second unit unit 22 in the X axis direction, the Y axis direction, and the Z axis direction.
  • the moving unit 62 includes a casing 71, casters 72, an elevating unit 73, and caster driving units 74.
  • the casing 71 has a movable part 71a and a base part 71b.
  • the control unit CONT controls the rotation speed of the caster 72. Thereby, the control part CONT can control the moving speed of the moving part 62.
  • the moving unit 62 is provided with a power supply unit (not shown) such as a battery.
  • the moving unit 62 of the second unit unit 22 and the moving unit 42 of the first unit unit 21 constitute a moving mechanism 24 that relatively moves the first unit unit 21 and the second unit unit 22.
  • the moving part 42 and the moving part 62 can drive the first unit part 21 and the second unit part 22 independently.
  • the moving unit 62 described above has a moving unit side communication unit (second communication unit) 64.
  • the moving unit side communication unit 64 is provided inside the casing 71.
  • the moving unit side communication unit 64 can communicate with, for example, the control unit CONT, the substrate side communication unit 63, the first unit unit 21, and the like.
  • the board-side communication unit 63 and the moving unit-side communication unit 64 can receive a second control signal for controlling the operation of the second unit unit 22.
  • the second control signal includes, for example, a signal for controlling the moving operation of the moving unit 62, a signal for controlling the supply operation of the substrate S in the second unit unit 22, and the like.
  • the moving unit 62 has a substrate transfer control unit 77.
  • the substrate transfer control unit 77 controls the transfer operation of the substrate S and the protective substrate C by the first unit unit 21 and the second unit unit 22.
  • the substrate transfer control unit 77 controls the rotation speeds of the shaft portion 61a and the shaft portion 68a via the moving unit side communication unit 64 and the substrate side communication unit 63.
  • substrate conveyance control part 77 can control the collection
  • the substrate transfer control unit 77 controls the rotational speeds of the shaft portion 41a and the shaft portion 48a via, for example, the moving portion side communication portion 64 and the substrate side communication portion 43 of the first unit portion 21. As a result, the substrate transfer control unit 77 can control the supply speed (feed-out speed) of the substrate S and the protective substrate C.
  • the substrate transfer control unit 77 controls the rotation speed of the caster 72 of the second unit unit 22. Thereby, the substrate conveyance control unit 77 can control the moving speed of the moving unit 62.
  • the substrate transfer control unit 77 controls the rotation speed of the casters 52 of the first unit unit 21 via the moving unit side communication unit 64 and the moving unit side communication unit 44 of the first unit unit 21. Thereby, the board
  • FIG. 5 is a perspective view showing a state in which the first unit portion 21 and the second unit portion 22 of the cassette apparatus 20 are connected.
  • the first unit portion 21 and the second unit portion 22 can be connected in a state where the first connection portion 23a and the second connection portion 23b face each other.
  • the first connection portion 23a and the second connection portion 23b are attracted by the magnetic force of the electromagnet.
  • the cassette device 20 includes the connection portion 23 that connects the first unit portion 21 and the second unit portion 22 by the first connection portion 23a and the second connection portion 23b.
  • the first unit unit 21 and the second unit unit 22 are supported. Are connected to each other to form the cassette device 20.
  • the moving part 42 and the moving part 62 can be integrally moved while the first unit part 21 and the second unit part 22 are connected.
  • connection terminal is provided in the 1st connection part 23a and the 2nd connection part 23b, for example, and by connecting the said connection terminals It is good also as a structure which can exchange information between the 1st unit part 21 and the 2nd unit part 22.
  • the cassette device 20 includes a mounting portion 81 that is provided in the first unit portion 21 and on which the cover member CV is mounted. Further, the cassette device 20 includes a mounting portion 82 that is provided in the second unit portion 22 and to which the cover member CV is mounted.
  • the cover member CV seals the inside of the first unit portion 21 and the second unit portion 22 so that foreign matter such as dust does not enter.
  • the cover member CV is mounted across the first unit portion 21 and the second unit portion 22.
  • the cover member CV in FIG. 5 is configured to be detachable in the Z-axis direction, for example, but is not limited thereto.
  • the cover member CV may be rotatably attached to the bottom portion 40 c of the first unit portion 21 and the bottom portion 60 c of the second unit portion 22.
  • the cover member CV may be formed of a sheet-like member that can be expanded and contracted, and a part of the cover member CV may be accommodated in the bottom portion 40c. In this case, the cover member CV is pulled out from the + Y-axis side end portion of the bottom portion 40c of the first unit portion 21, and is hung from the + Y-axis side surface of the first unit portion 21 to the + Z-axis side surface.
  • the part 21 can be covered.
  • the cover member CV is pulled out from the ⁇ Y-axis side end of the bottom portion 60c of the second unit portion 22 and hung from the ⁇ Y-axis side side surface of the second unit portion 22 to the + Z-axis side surface.
  • the two unit parts 22 can be covered.
  • the structure which winds the cover member CV from the 1st unit part 21 side to the 2nd unit part 22 side may be sufficient.
  • FIG. 6 is a side view showing the configuration of the processing unit 10.
  • illustration of the protective substrate C, the protective substrate driving unit 48, and the protective substrate driving unit 68 is omitted.
  • the first unit unit 21 is arranged on the upstream side and the second unit unit 22 is arranged on the downstream side with respect to the transport direction of the substrate S in the processing unit 10.
  • the processing unit 10 processes the surface Sa of the substrate S on the movement path of the substrate S supplied from the first unit unit 21 and transported to the second unit unit 22.
  • the processing unit 10 includes a processing device 15, a guide device 16, and an alignment measurement device 17.
  • the processing apparatus 15 includes various apparatuses for forming, for example, organic EL elements on the surface Sa to be processed of the substrate S.
  • an apparatus include a partition forming apparatus for forming a partition on the surface Sa, an electrode forming apparatus for forming an electrode, and a light emitting layer forming apparatus for forming a light emitting layer.
  • a droplet coating apparatus for example, an ink jet type coating apparatus
  • a film forming apparatus a film forming apparatus, for example, a vapor deposition apparatus, a sputtering apparatus
  • an exposure apparatus for example, a developing apparatus, a surface modifying apparatus, a cleaning apparatus, and a drying apparatus.
  • an apparatus and an inspection apparatus for inspecting a substrate is appropriately provided along the transport path of the substrate S.
  • the processing device 15 includes a developing device 11 including a developing solution container 11a for storing a developing solution 11b for performing a developing process on the substrate S, and a cleaning solution for storing a cleaning solution 12b for cleaning the substrate S. It has the washing
  • the processing apparatus 15 can accommodate the apparatus which performs the process using other than the liquid mentioned above.
  • the guide device 16 includes a development side guide unit 13 and a cleaning side guide unit 14.
  • the development side guide unit 13 includes a first pad 13a, a second pad 13d, a first roller 13b, and a second roller 13c.
  • the first pad 13a is fixed inside the processing apparatus 15, and guides the substrate S supplied from the first unit unit 21 to the developer container 11a.
  • the second pad 13d is fixed inside the processing apparatus 15, and guides the substrate S that has passed through the developer 11b to the outside of the developer container 11a.
  • the first roller 13b and the second roller 13c are provided so as to be movable in the vertical direction (Z-axis direction) with respect to the developer container 11a.
  • the first roller 13b and the second roller 13c are moved to the developer container 11a side.
  • the transport direction of the substrate S is changed to the ⁇ Z-axis direction by the first pad 13a, and the substrate S is immersed in the developer 11b. It can be guided to pass through the inside of the developer 11b.
  • the cleaning-side guide unit 14 includes a first pad 14a, a second pad 14d, a first roller 14b, and a second roller 14c. Since each roller of the cleaning side guide unit 14 has the same configuration as each roller of the development side guide unit 13, the description thereof is omitted.
  • each of the first pad 13a, the second pad 13d, the first pad 14a, and the second pad 14d of the cleaning side guide unit 14 guide the back surface of the processing surface Sa of the substrate S.
  • each of the first pad 13a, the second pad 13d, the first pad 14a, and the second pad 14d has a cylindrical guide surface, and has a plurality of jetting ports (not shown) that eject gas from the guide surface.
  • the gas layer can be formed on the guide surface.
  • the guide surface can be guided in a non-contact manner with respect to the back surface of the substrate S (the surface opposite to the surface Sa to be processed).
  • a rotating roller may be used instead of the first pad 13a and the second pad 13d. When the rotating roller is used, the rotating roller guides the substrate S in a state where the back surface of the substrate S is in contact with the guide surface of the rotating roller.
  • the alignment measuring device 17 measures an edge portion of the substrate S or an alignment mark provided on the substrate S, and performs an alignment operation on the substrate S based on the measurement result.
  • the alignment measurement device 17 is configured to detect an edge portion of the substrate S or an alignment camera that detects an alignment mark, and a position (for example, a position in the width direction of the substrate S) and posture (based on a detection result of the alignment camera).
  • a position for example, a position in the width direction of the substrate S
  • posture based on a detection result of the alignment camera.
  • an adjustment device that adjusts at least one of (tilt with respect to the conveyance direction) is included.
  • As the position measurement and speed measurement of the substrate S a method of projecting a laser beam on the substrate S by a method like an optical mouse and photoelectrically detecting a change in a speckle pattern generated on the substrate S can be used.
  • FIG. 7 to 12 are diagrams illustrating the operation of the substrate processing apparatus 100.
  • FIG. 7 to 12 the illustration of the protective substrate C, the protective substrate drive unit 48, and the protective substrate drive unit 68 is omitted.
  • the control unit CONT controls each unit by communicating with, for example, the substrate-side communication unit 43 and the substrate-side communication unit 63, or the mobile unit-side communication unit 44 and the mobile unit-side communication unit 64. Will be described.
  • the first unit unit 21 in which the first unit unit 21 is supported by the moving unit 42 and the second unit unit 22 in which the second unit unit 22 is supported by the moving unit 62 are respectively held in the plurality of buffer units BF.
  • the control part CONT makes the first storage part 40 and the second storage part 60 adsorb between the first connection part 23a and the second connection part 23b for the pair of the first unit part 21 and the second unit part 22. And connect. Thereby, the first unit part 21 and the second unit part 22 can be moved integrally.
  • the control unit CONT first moves the first unit unit 21 and the second unit unit 22 integrally from the buffer unit BF onto the guide rail 30. Thereafter, as shown in FIG. 7, the control unit CONT moves the first unit portion 21 and the second unit portion 22 along the guide rail 30, so that the + Y-axis side end portion of the third rail 33, that is, the first One rail 31 is disposed.
  • a roll-shaped substrate S is attached to the shaft portion 41 a of the first unit portion 21.
  • the reader Lf is attached to the tip Sf of the substrate S. However, the reader Lf may be omitted.
  • the control part CONT rotates the shaft part 41a by the rotation drive part 41b.
  • the tip Sf of the substrate S is sent to the shaft portion 61a side, and the tip Sf of the substrate S reaches the shaft portion 61a and is wound around the shaft portion 61a.
  • the operation of winding the tip Sf of the substrate S around the shaft portion 61a may be automated, but the tip Sf may be affixed to the shaft portion 61a using a fixing tape or the like manually.
  • the control unit CONT disconnects the connection between the first unit unit 21 and the second unit unit 22 after the tip Sf of the substrate S is hung on the shaft unit 61a. Thereby, the 1st unit part 21 and the 2nd unit part 22 become movable independently. Thereafter, the control part CONT moves the second unit part 22 along the third rail 33 in the ⁇ Y-axis direction while rotating the shaft part 41a to send out the substrate S.
  • the control unit CONT moves the second unit unit 22 until the second unit unit 22 reaches the ⁇ Y-axis side end of the third rail 33, that is, the second rail 32. While the 2nd unit part 22 moves, the 1st unit part 21 maintains the state arrange
  • FIG. 8 With this operation, as shown in FIG. 8, the first unit portion 21 is disposed on the first rail 31, and the second unit portion 22 is disposed on the second rail 32. Further, the front end Sf of the substrate S is pulled out in the ⁇ Y-axis direction in a state where it is hung on the shaft portion 61a.
  • the control unit CONT moves the first roller 13b and the second roller 13c of the developing side guide unit 13 of the processing apparatus 15 upward and the first roller 14b and the second roller 14c of the cleaning side guide unit 14 upward (+ Z-axis direction). ).
  • the control unit CONT moves the first roller 13b and the second roller 13c of the developing side guide unit 13 of the processing apparatus 15 upward and the first roller 14b and the second roller 14c of the cleaning side guide unit 14 upward (+ Z-axis direction).
  • the control unit CONT applies an appropriate tension in the Y-axis direction to the substrate S spanned between the shaft portion 41a and the shaft portion 61a so that the substrate S can pass through the gap.
  • the tension of the substrate S can be adjusted, for example, by controlling the second unit unit 22 side using the substrate transfer control unit 77.
  • the control part CONT synchronizes the first unit part 21 and the second unit part 22 with the rotation drive part 41b and the rotation drive part 61b, as shown in FIG.
  • the two rails 32 are moved to the processing device 15 side (+ X axis direction).
  • the substrate S is located between the first roller 13b and the second roller 13c and the developer container 11a in the Z-axis direction, and between the first roller 14b and the second roller 14c and the cleaning liquid container 12a, respectively. Will be placed.
  • the control part CONT rotates the shaft part 41a and the shaft part 61a to feed the substrate S in the -Y-axis direction, while moving the first roller 13b and the second roller 13c of the development side guide part 13 in the -Z-axis direction. Move. As a result, the substrate S is immersed in the developer 11b, and the substrate S is developed. Thereafter, the control part CONT rotates the shaft part 41a and the shaft part 61a to send the substrate S in the ⁇ Y-axis direction. By this operation, the portion of the substrate S that has passed the developing solution 11b reaches the cleaning device 12.
  • control unit CONT rotates the shaft portion 41a and the shaft portion 61a to feed the substrate S in the ⁇ Y axis direction, while moving the first roller 14b and the second roller 14c of the cleaning side guide portion 14 in the ⁇ Z axis direction. Move to. Accordingly, the substrate S is immersed in the cleaning liquid 12b, and the development process is performed on the substrate S.
  • development processing is performed on the upstream side in the transport direction ( ⁇ Y-axis direction) of the substrate S, and cleaning processing is performed on the downstream side in the transport direction.
  • the control part CONT rotates the shaft part 41a and the shaft part 61a to send the substrate S in the ⁇ Y-axis direction.
  • the portion of the substrate S that has passed the cleaning liquid 12b is sent out from the cleaning device 12 to the outside.
  • the substrate S can be conveyed in a non-contact state with respect to the back surface by the gas layer formed on the guide surfaces of the pads.
  • the control unit CONT adjusts the moving speed of the substrate S moving from the shaft portion 41a to the shaft portion 61a according to the processing speed of the developing device 11 and the cleaning device 12. Further, as shown in FIG. 11, the control unit CONT is driven to rotate according to the winding diameter R1 of the substrate S wound around the shaft portion 41a and the winding diameter R2 of the substrate S wound around the shaft portion 61a. The drive speed in the part 41b and the rotation drive part 61b is adjusted. By this operation, the substrate S is transported while the transport speed is constant. The speed of the substrate S is also monitored by the timing (time) at which the alignment measuring device 17 in FIG. 3 measures the alignment mark provided on the substrate S. Further, the elevating unit 53 and the elevating unit 73 may be adjusted by changing the winding diameter R1 of the substrate S and the winding diameter R2 of the substrate S.
  • control part CONT rotates the shaft part 41a and the shaft part 61a to feed the substrate S in the ⁇ Y-axis direction, while the first roller 13b and the second roller 13b of the development side guide part 13 are fed. While moving the roller 13c in the + Z-axis direction, the first roller 14b and the second roller 14c of the cleaning side guide unit 14 are moved in the + Z-axis direction.
  • the control part CONT synchronizes the first unit part 21 and the second unit part 22 by the synchronous control of the moving part 42 and the moving part 62, and the first rail 31 and the second rail, respectively. 32 along the + X axis direction.
  • the processing device 15 is retracted to the + X axis side.
  • the control part CONT stops the movement of the first unit part 21 and the second unit part 22 after the first unit part 21 and the second unit part 22 reach the third rail 33.
  • the control unit CONT stops the movement of the first unit unit 21 and the second unit unit 22, and then moves the second unit unit 22 in the + Y-axis direction while rotating the shaft unit 61a.
  • the shaft portion 61a winds up the substrate S, the shaft portion 41a and the shaft portion 61a approach again, and the first connection portion 23a of the first unit portion 21 and the second connection portion 23b of the second unit portion 22 Abut.
  • the control part CONT activates the electromagnet to attract the first connection part 23a and the second connection part 23b.
  • the 1st accommodating part 40 and the 2nd accommodating part 60 are connected again, and the 1st unit part 21 and the 2nd unit part 22 are integrated.
  • control unit CONT appropriately moves the integrated first unit unit 21 and second unit unit 22 along the first rail 31, the second rail 32, and the third rail 33.
  • control unit CONT has the position detection unit 55 and the position detection unit (first detection unit) so that the first unit unit 21 and the second unit unit 22 do not collide with each other or are congested.
  • the arrangement of the first unit portion 21 and the second unit portion 22 is appropriately arranged using the position information detected by 75.
  • the cassette apparatus of the present embodiment is detachable between the first unit unit 21 having the substrate driving unit 41 that supplies the flexible substrate S and the first unit unit 21. And a second unit unit 22 having a substrate driving unit 61 that collects the substrate S between the substrate driving unit 41 and the substrate driving unit 41. Therefore, the substrate between the first unit unit 21 and the second unit unit 22 is provided. The supply and recovery of S will be completed. Thereby, since it can suppress that the dimension of the board
  • FIG. 13 is a diagram schematically showing the configuration of the substrate processing apparatus 200 according to the present embodiment.
  • the substrate processing apparatus 200 is formed in a plurality of layers (three layers in FIG. 13) in the Z-axis direction.
  • the substrate processing apparatus 200 includes a processing unit 10 and a cassette device 20 on each floor.
  • guide rails 30 are formed along the processing unit 10 on the floor surface FL1, the floor surface FL2, and the floor surface FL3 of each floor.
  • the cassette device 20 has the same configuration as the above embodiment. That is, the first unit portion 21 and the housing 51 are detachably provided. Moreover, it is provided between the 2nd unit part 22 and the housing
  • FIG. 14 is a cross-sectional view showing the configuration of the substrate processing apparatus 200.
  • the substrate processing apparatus 200 includes three processing chambers 111 to 113.
  • the processing chambers 111 to 113 are partitioned by a partition 114.
  • the partition 114 includes a partition member 114a that forms the floor surface FL1 of the processing chamber 111, a ceiling member of the processing chamber 111 and a partition member 114b that forms the floor surface FL2 of the processing chamber 112, and the ceiling and processing of the processing chamber 112.
  • the partition member 114c which comprises the floor surface FL3 of the chamber 113, and the partition member 114d which comprises the ceiling part of the process chamber 113 are provided.
  • the processing chamber 111 is disposed at the lowermost portion (most on the ⁇ Z axis side) in the gravity direction among the plurality of processing chambers.
  • the processing chamber 111 forms a processing space for performing processing (wet processing) using a liquid on the substrate S.
  • the coating apparatus 141 including a resist solution storage container 141 a that stores a resist solution for applying to the substrate S, and the substrate S are subjected to development processing.
  • a developing device 142 including a developing solution storage container 142a for storing a developing solution for cleaning, a cleaning device 143 including a cleaning solution storage container 143a for storing a cleaning solution for cleaning the substrate S, and a substrate S after cleaning processing
  • a plating apparatus 144 including a plating solution storage container 144a for storing a plating solution for forming a pattern.
  • the processing chamber 111 can accommodate an apparatus that performs processing using a liquid other than the liquid described above.
  • the partition member 114a is provided with a plurality of recovery pipes 145 that constitute a part of a waste liquid recovery flow path connected to a recovery device (not shown).
  • One end of the recovery tube 145 is connected to each of the coating device 141, the developing device 142, and the cleaning device 143, and the other end is connected to a waste liquid recovery channel (not shown) connected to the recovery device.
  • Each recovery tube 145 discharges the resist solution, the developing solution, and the cleaning solution, which have become waste liquids in the coating device 141, the developing device 142, and the cleaning device 143, to the recovery device through the waste liquid recovery channel.
  • the recovery pipe 145 is provided with an open / close valve (not shown).
  • the control part CONT can control the opening / closing timing of the on-off valve.
  • the apparatus for wet processing is provided in the lowermost processing chamber 111 in the gravity direction, the length of the flow path system of the waste liquid recovery flow path between these apparatuses and the recovery apparatus is suppressed. be able to
  • the processing chamber 112 is disposed above the processing chamber 111 (+ Z axis side).
  • the processing chamber 112 forms a processing space for performing heat treatment on the substrate S.
  • the processing chamber 112 is provided with heating devices 151 to 153 for heating the substrate S as the processing device 110.
  • the heating device 151 heats the substrate S on which the resist solution is applied by the coating device 141, and dries the resist solution.
  • the heating device 152 heats the substrate S that has passed through the exposure apparatus EX in the processing chamber 113 again, and dries the resist solution.
  • the heating device 152 heats the substrate S at a temperature different from the heating temperature of the heating device 151, for example, a temperature higher than the heating temperature of the heating device 151.
  • the heating device 153 heats the substrate S that has been developed by the developing device 142 and has been cleaned by the cleaning device 143, and dries the surface of the substrate S.
  • the heating devices 151 to 153 have a configuration in which a plurality of substrates S are folded inside. Inside the heating devices 151 to 153, the substrates S are conveyed in a state of being folded and folded so as not to contact each other. Therefore, the substrate S is efficiently accommodated in the heating devices 151 to 153 while maintaining the state of the processing surface Sa of the substrate S.
  • the processing chamber 113 is disposed above the processing chamber 112 (+ Z axis side).
  • the processing chamber 113 is a processing space for performing an exposure process on the substrate S.
  • the processing chamber 113 is provided with an exposure apparatus EX as the processing apparatus 110.
  • the exposure apparatus EX irradiates the resist layer applied to the substrate S in the coating apparatus 141 with exposure light through a mask pattern.
  • the substrate processing apparatus 200 configured as described above is provided with a plurality of lift parts 160 (161 to 166).
  • the lift unit 160 conveys the first unit unit 21 and the second unit unit 22 between different floors.
  • the lift part 161, the lift part 164, the lift part 165, and the lift part 166 convey the 1st unit part 21 and the 2nd unit part 22 between the 1st floor and the 2nd floor.
  • the lift part 162 and the lift part 163 convey the 1st unit part 21 and the 2nd unit part 22 between a 2nd floor and a 3rd floor.
  • Each lift section 160 includes a lifting mechanism 160a that penetrates the partition member 114b and the partition member 114c in the Z-axis direction.
  • FIG. 15 is a perspective view illustrating a schematic configuration of the lift unit 160. As shown in FIG. 15, the lifting mechanism 160 a is connected to the external connection part 40 d of the first unit part 21 and the connection part 60 d of the second unit part 22.
  • the elevating mechanism 160a has a moving mechanism (not shown) that moves the first unit portion 21 and the second unit portion 22 in the Z-axis direction.
  • the lifting mechanism 160a can move the first unit portion 21 and the second unit portion 22 in an integrated state in the Z-axis direction.
  • the lift unit 160 causes the first unit unit 21 and the second unit unit 22 transported across the floors to be mounted on the casings 51 and 71 of the moving unit 42 and the moving unit 62 provided on the transport destination floor, respectively.
  • a mounting portion (not shown) is included. Thereby, the board
  • the control unit CONT loads the first unit unit 21 and the second unit unit 22 into the processing chamber 111 from a predetermined entrance, and moves them to the coating apparatus 141 along the guide rail 30.
  • the control unit CONT causes the first unit unit 21 to be disposed on the + Y axis side of the coating device 141 and the second unit unit 22 to be ⁇ Y of the coating device 141 in the coating device 141 by the same operation as in the first embodiment. Place on the shaft side. In this state, the control unit CONT causes the processing surface of the substrate S to be coated with the photosensitive agent while transporting the substrate S from the first unit unit 21 to the second unit unit 22.
  • the control unit CONT integrates the first unit unit 21 and the second unit unit 22 and moves them to the lift unit 161. After the first unit part 21 and the second unit part 22 arrive at the lift part 161, the control part CONT keeps the first unit part 21 and the second unit part 22 connected, for example, the second unit part 22 The connecting portion 60d is connected to the lifting mechanism 160a of the lift portion 161. Thereafter, the control part CONT transports the first unit part 21 and the second unit part 22 in the + Z-axis direction in a state of being integrated using the lifting mechanism 160a.
  • the control unit CONT causes the moving unit 42 and the moving unit 62 arranged in the processing chamber 112 to stand by in the vicinity of the lift unit 161 in advance.
  • the control unit CONT uses a mounting unit (not shown) to mount the first unit unit 21 and the second unit unit 22 conveyed to the processing chamber 112 to the moving unit 42 and the moving unit 62, respectively.
  • the control unit CONT uses the first unit unit 21 and the second unit unit 22 to carry the substrate S into the heating device 151 and to heat the substrate S.
  • the substrate S is transported in a state where the substrate S is bent, for example, a plurality of times, and the substrate S is heated in this transported state. For this reason, the heat processing using space efficiently is performed.
  • the heating device 151 the coating film formed on the substrate S by heating is dried.
  • control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 113 through the lift unit 162 by the same operation as described above.
  • control unit CONT carries the first unit unit 21 and the second unit unit 22 into the exposure apparatus EX, and causes the photosensitive agent applied to the substrate S to be exposed.
  • control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 via the lift unit 163.
  • the control unit CONT causes the first unit unit 21 and the second unit unit 22 to be carried into the heating device 152 and causes the substrate S to be subjected to heat processing.
  • the heating device 152 a heat treatment is performed on the exposed coating film.
  • the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 via the lift unit 164.
  • the control unit CONT loads the first unit unit 21 and the second unit unit 22 into the developing device 142, and causes the substrate S to be developed.
  • the substrate S is transported from the first unit unit 21 to the second unit unit 22 while being immersed in the developing solution, and development processing is performed in the transport process.
  • the control unit CONT moves to the cleaning device 143 with the first unit portion 21 and the second unit portion 22 integrated, and carries the substrate S into the cleaning device 143.
  • the substrate S is transported from the first unit unit 21 to the second unit unit 22 while being immersed in the cleaning liquid, and a cleaning process is performed in the transport process.
  • the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 via the lift unit 165.
  • the control unit CONT causes the first unit unit 21 and the second unit unit 22 to be carried into the heating device 153 and causes the substrate S to be subjected to heat treatment.
  • heat treatment for drying the cleaned substrate S, heat treatment for heating the coating film, and the like are performed.
  • the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 via the lift unit 166.
  • the control unit CONT moves the first unit unit 21 and the second unit unit 22 to the plating apparatus 144, and loads the substrate S into the plating apparatus 144.
  • the substrate S is transported from the first unit portion 21 to the second unit portion 22 while being immersed in the plating solution, and a plating process is performed in the transport process. A predetermined pattern is formed on the substrate S on which the plating process has been performed.
  • control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 via the lift unit 166.
  • control unit CONT carries the first unit unit 21 and the second unit unit 22 into a heating device (not shown), and causes the heating process to be performed.
  • the substrate processing apparatus 200 includes, for example, the coating apparatus 141 that performs different processes as the processing apparatus 110 between the first rail 31 and the second rail 32 in the processing chamber 111, and the development.
  • cleaning apparatus 143, and the plating apparatus 144 are provided,
  • the 1st unit part 21 and the 2nd unit are provided among these apparatuses (the coating apparatus 141, the developing device 142, the washing
  • the first unit unit 21 supplies the substrate S and the second unit unit 22 collects the substrate S for each apparatus, so that the single wafer processing can be performed in the plurality of processing apparatuses 110.
  • the first unit unit 21 and the second unit unit 22 can be divided from the moving unit 42 and the moving unit 62 and transported between different layers, which is efficient. Transport is possible.
  • first unit portion 21 and the second unit portion 22 may be configured to perform only proximity and separation without being attached to each other.
  • first unit 21 and the second unit 22 are not attached, but the moving unit 42 that supports the first unit 21 and the moving unit 62 that supports the second unit 22 are detachable. It may be a simple configuration.
  • the first unit portion 21 is used for supplying the substrate S and the second unit portion 22 is used for collecting the substrate S.
  • the present invention is not limited to this.
  • the first unit portion 21 may be used for collecting the substrate S
  • the second unit portion 22 may be used for supplying the substrate S.
  • the first unit portion 21 and the second unit portion 22 have the same configuration, the first unit portion 21 and the second unit portion 22 are interchanged with each other on the guide rail 30, and the substrate is switched while appropriately switching the supply operation and the recovery operation. S may be transported.
  • the configuration in which the substrate processing apparatus has a plurality of layers has been described as an example.
  • the present invention is not limited to this.
  • a configuration in which a plurality of lines are arranged in the Y-axis direction may be used.
  • the configuration of the processing unit 10 may be a configuration in which apparatuses that perform the same type of processing are arranged in the Y-axis direction.
  • the present invention is not limited thereto.
  • the structure provided with the terminals (electric power acquisition part) 56 and 76 which contact the guide rail 30 may be sufficient. In this case, electric power can be acquired via the terminals 56 and 76 by connecting the guide rail 30 to the power source.
  • FIG. 18A to FIG. 18C are diagrams showing an example of the movement operation of the first unit portion 21 and the second unit portion 22.
  • the control unit CONT pulls out the substrate S by separating the first unit unit 21 and the second unit unit 22 as shown in FIG. 18A, and the first unit unit 21 and the second unit unit 22 as shown in FIG.
  • the second unit unit 22 is carried into the processing unit 10 along the + X axis direction to perform processing. Thereafter, as shown in FIG. 18C, the first unit portion 21 and the second unit portion 22 may be moved back along the ⁇ X axis direction. Thereby, even if it is difficult for the substrate S to pass in the X-axis direction due to the configuration of the processing unit 10, the substrate S can be efficiently transported.
  • substrate S is moved by moving the 2nd unit part 22 to the 2nd rail 32 side.
  • the case of drawing out has been described as an example, but the present invention is not limited to this.
  • the substrate S may be pulled out by moving the first unit portion 21 from the second rail 32 side to the first rail 31 side.
  • the first unit portion 21 and the second unit portion 22 are arranged at the center portion in the Y-axis direction of the third rail 33, and thereafter, as shown in FIG. 19 (b), The substrate S may be pulled out by moving the first unit portion 21 in the + Y-axis direction and the second unit portion 22 in the ⁇ Y-axis direction.
  • the first unit portion 21 and the second unit portion 22 may be moved in the Y-axis direction in a state where they are arranged in the X-axis direction.
  • the first unit portion 21 and the second unit portion 22 are arranged at the intersections of two third rails 33 and second rails 32 that sandwich the processing unit 10 in the X-axis direction. Let At this time, the substrate S is pulled out. Thereafter, as shown in FIG. 20B, the substrate S is carried into the processing unit 10 by moving the first unit portion 21 and the second unit portion 22 in the + Y-axis direction. Thereby, even if it is difficult for the substrate S to be loaded in the X-axis direction due to the configuration of the processing unit 10, the substrate S can be efficiently transferred.
  • connection portion 23 has been described by taking the configuration in which the space between the first connection portion 23a and the second connection portion 23b is attracted by an electromagnet as an example. There may be a configuration that is connected by mechanical locking.
  • the axial direction of the central axis is parallel to the X-axis direction for the shaft portion 41a and the shaft portion 61a that drive the substrate S and the shaft portion 48a and the shaft portion 68a that drive the protective substrate C.
  • the configuration in which the substrate S and the protective substrate C are transported in parallel to the XY plane has been described as an example. However, the configuration is not limited thereto.
  • the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a are arranged so that the axial direction of the central axis is parallel to the Z-axis direction, and the substrate S and the protective substrate C are placed on the YZ plane or the ZX plane.
  • the structure conveyed in parallel may be sufficient.
  • the casings 51 and 71 of the moving part 42 and the moving part 62 are moved up and down in the Z-axis direction, whereby the shaft part 41a, the shaft part 61a, the shaft part 48a, and the shaft part 68a in the Z-axis direction.
  • the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a may be configured to be movable up and down in the Z-axis direction.
  • FIG. 21 is a diagram showing the configuration of the substrate S. As shown in FIG. As shown in FIG. 21, a configuration may be adopted in which a protective layer 90 is formed so as to surround a pattern formation region P in which, for example, a wiring, an electrode, an element, etc. are formed on the surface Sa to be processed of the substrate S.
  • the protective layer 90 is formed so as to have a layer thickness larger than that of the pattern formation region P. With this configuration, it is possible to prevent the protective substrate C from coming into contact with the pattern formation region P even when the protective substrate C is superimposed on the surface Sa.
  • the protective layer 90 may be formed on the protective substrate C side.
  • the moving unit 42 that is mounted with the first unit 21 and is capable of self-running can move in the X axis direction, the Y axis direction, and the ⁇ Z axis direction by the rotation of the caster 52. It is. The same applies to the moving unit 62 that can be self-propelled by mounting the second unit unit 22. Therefore, as shown in FIGS. 18 to 20, the conveyance guide mechanism constituted by the first rail 31 and the second rail 32 extending in the X-axis direction and the third rail 33 extending in the Y-axis direction, As shown in FIG. 22, annular rails 34a and 35a are laid as additional conveyance guide portions.
  • the annular rail 34a is laid in an annular shape with a constant radius from the center point TC1 where the first rail 31 and the third rail 33 intersect.
  • the annular rail 35a is laid in an annular shape with a constant radius from the center point TC2 where the second rail 32 and the third rail 33 intersect.
  • the annular rails 34a and 35a function as guide paths for rotating (turning) the moving unit 42 and the moving unit 62 around the center points TC1 and TC2.
  • disc-shaped marker portions including an index mark and an induction signal generator
  • the processing apparatus 10 shown in FIG. 22 is, for example, an atmospheric pressure CVD apparatus, and includes an upper structure 10a and a lower structure 10b.
  • the lower structure 10b is installed on the floor (FL) of the factory, and the upper structure 10a is configured to move in the Z-axis direction with respect to the lower structure 10b.
  • the substrate S stretched between the shaft portion 41c of the first unit portion 21 and the shaft portion 61c of the second unit portion 22 is moved in the X-axis direction. And can be carried out of the processing apparatus 10 by translation.
  • FIG. 22 shows the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) in a state in which the processing of the substrate S by the processing apparatus 10 is completed and the upper structure 10a is positioned above. It shows a state in which it is moved synchronously in the X-axis direction.
  • the moving unit 42 (first unit unit 21) moves in the ⁇ X-axis direction toward the center point TC1 as the home position while being guided by the first rail 31, and the moving unit 62 (second unit unit 22) While being guided by the second rail 32, it moves in the ⁇ X-axis direction toward the center point TC2 as the home position.
  • both the moving part 42 (first unit part 21) and the moving part 62 (second unit part 22) reach the home positions (positions of the center points TC1 and TC2) in the X-axis direction. To do.
  • the third rail 33 extending just in the Y-axis direction is positioned between the moving unit 42 and the moving unit 62.
  • one of the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) moves in the Y-axis direction toward the other.
  • This state is shown in FIG. 24.
  • the moving part 42 (first unit part 21) moves while being guided by the third rail 33 toward the moving part 62 (second unit part 22).
  • the shaft portion 41c of the first unit portion 21 or the shaft portion 61c of the second unit portion 22 rotates in conjunction with the movement of the moving portion 42 (first unit portion 21) in the Y-axis direction. Wind it up so that it doesn't sag.
  • FIG. 25 shows a state in which the moving unit 42 (first unit unit 21) approaches the moving unit 62 (second unit unit 22) and is connected (connected) as shown in FIG. At this time, the moving part 62 (second unit part 22) is located on the center point TC2 (marker part 35b), and the moving part 42 (first unit part 21) is located on the annular rail 35a.
  • the caster 72 of the moving unit 62 generates a driving force that rotates (rotates) the moving unit 62 (second unit unit 22) around the center point TC2 in the ⁇ Z-axis direction.
  • the caster 52 of the moving unit 42 generates a driving force that rotates (turns) the moving unit 42 (first unit unit 21) along the circumferential direction of the annular rail 35a.
  • the caster 72 of the moving unit 62 or the caster 52 of the moving unit 42 has the rotation center of the moving unit 62 in the X-axis direction and the Y-axis direction from the center point TC2 based on the detection result of the marker unit 35b.
  • Direction control is also performed so that the position is not greatly displaced.
  • FIG. 26 shows that the connected moving unit 42 (first unit unit 21) and moving unit 62 (second unit unit 22) are rotated 90 degrees clockwise from the state of FIG. 25 about the center point TC2 in the XY plane.
  • the rotated state is shown.
  • the rotation direction here is 90 degrees clockwise, but it may be 90 degrees counterclockwise. Which direction is rotated is determined by how the substrate S is loaded into the next processing apparatus.
  • the second unit unit 22 (moving unit 62) that holds the roll of the substrate S formed by the processing apparatus 10 (for example, atmospheric pressure CVD apparatus), and the remaining unprocessed
  • the first unit portion 21 (moving portion 42) that holds the roll of the substrate S moves in translation in the + X-axis direction by the guide of the second rail 32, and passes through the side of the processing apparatus 10 to the next. Head to the processing equipment.
  • the home positions (center points TC1, TC2) are vacant, so that the moving unit 42-1 (first unit unit 21-1) and the moving unit 62-1 (second unit) on which the substrate S to be processed next is mounted.
  • the unit portion 22-1) is integrally sent to the home position on the center point TC1 side.
  • the first unit portion 21-1 (moving portion 42-1) holding the roll of the unprocessed substrate S is the center point TC1 (intersection portion of the first rail 31 and the third rail 33).
  • the second unit portion 22-1 (moving portion 62-1) for winding the processed substrate S into a roll shape moves along the third rail 33 toward the center point TC2. .
  • a space annular rails 34a, 35a, etc. in which the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) can freely rotate on the floor surface FL of the factory is provided.
  • the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) connected at regular intervals are rotated by 90 degrees.
  • the moving unit 42 ( The first unit portion 21) and the moving portion 62 (second unit portion 22) may be moved in the ⁇ Y-axis direction as they are, or after rotating 180 degrees around the center point TC2 from the state of FIG. It may be moved in the axial direction.
  • the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) move in a state where they are connected at regular intervals.
  • the two do not necessarily need to be in mechanical contact with each other, using a non-contact sensor or the like, while maintaining a certain spatial gap and within a certain displacement range (for example, 1 mm or less), the moving unit 42 and the moving unit.
  • a configuration may also be adopted in which the 62 follow each other.
  • the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) that have completed processing on the substrate S are transported to the next processing apparatus (second processing apparatus).
  • second processing apparatus For this purpose, the translational movement in the first direction (X-axis direction in FIGS. 22 to 27) in which the substrate S moves away from the processing apparatus that performed the above processing, and the second direction (FIGS. 22 to 27) intersecting with the first direction. (2 in the Y-axis direction) and rotational movement in the plane including the first direction and the second direction (XY plane in FIGS. 22 to 27) so that at least two movements are accompanied (2 Each caster 52, 72 is driven to move the moving part 42 and the moving part 62 together (so that two movements are continuous).
  • the translational movement is not necessarily limited to the X-axis direction or the Y-axis direction, and the moving unit 42 (first direction) is inclined in the direction (for example, 45 degrees) with respect to both the X-axis and the Y-axis in the XY plane. This includes the case where the one unit portion 21) and the moving portion 62 (second unit portion 22) move linearly.
  • each cassette device is provided with a temperature adjustment mechanism, a humidity adjustment mechanism, an ultraviolet irradiation mechanism, etc., and a temperature adjustment device, a humidity adjustment device, and an ultraviolet irradiation device are installed as one of the processing devices.
  • temperature adjustment, dehumidification, humidification, and UV irradiation may be performed on the substrate S at an appropriate timing during the processing step.
  • the substrate S as a base material is sent to various processing apparatuses and subjected to various processes.
  • a flexible film substrate such as PET or PEN
  • stress is accumulated in the film substrate for each processing step and the film substrate is deformed.
  • the film substrate to be processed, or the film material already deposited on the substrate needs to have an appropriate temperature, moisture content, wettability and the like for each processing step.
  • a temperature adjustment mechanism provided in the first unit portion 21 or the second unit portion 22 during the movement or standby of the cassette device 20 (the first unit portion 21 and the second unit portion 22) loaded with the substrate S. Then, the humidity adjusting mechanism or the ultraviolet irradiation mechanism is operated. Alternatively, the cassette device 20 is moved to a temperature adjusting device, a humidity adjusting device, and an ultraviolet irradiation device installed independently in the factory, and the substrate S is passed. In this way, the temperature, moisture content, wettability, internal stress, and other conditions of the substrate S (or film material on the surface) are adjusted in advance so as to suit the specifications of the processing apparatus for the next processing step. can do.
  • the cassette apparatus 20 holding the roll-shaped substrate S is configured to be movable with respect to various processing apparatuses, batch processing in units of cassette apparatuses is possible. Therefore, even if a process (corresponding to one processing process) for adjusting various states of the substrate S (or film material on the surface) is incorporated before the processing process, the production efficiency of the entire production line is greatly reduced. This makes it possible to produce with good yield.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning In General (AREA)
  • Replacement Of Web Rolls (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Winding Of Webs (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Coating Apparatus (AREA)
  • Liquid Crystal (AREA)

Abstract

This cassette apparatus has a first unit section that performs substrate supply or substrate recovery, and a second unit section that performs the substrate supply or the substrate recovery, which is not performed by the first unit section. The first unit section and the second unit section can be brought close to each other or separated from each other.

Description

カセット装置、基板搬送装置、基板処理装置及び基板処理方法Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method
　本発明は、カセット装置、基板搬送装置、基板処理装置及び基板処理方法に関する。
　本願は、２０１２年４月１３日に出願された日本国特願２０１２－０９２１３２号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a cassette apparatus, a substrate transfer apparatus, a substrate processing apparatus, and a substrate processing method.
This application claims priority based on Japanese Patent Application No. 2012-092132 for which it applied on April 13, 2012, and uses the content here.
　ディスプレイ装置などの表示装置（表示パネル）を構成する表示素子として、例えば液晶表示素子、有機エレクトロルミネッセンス（有機ＥＬ）素子が知られている。現在、これらの表示素子では、各画素に対応して基板表面に薄膜トランジスタ（Thin Film Transistor：ＴＦＴ）を形成する能動的素子（アクティブデバイス）が主流となってきている。 As a display element constituting a display device (display panel) such as a display device, for example, a liquid crystal display element and an organic electroluminescence (organic EL) element are known. Currently, in these display elements, active elements (active devices) that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.
　近年では、可撓性を有するシート状の基板（例えばフィルム部材など）上に表示素子を形成する技術が提案されている。このような技術として、例えばロール・トゥ・ロール方式（以下、単に「ロール方式」と表記する）と呼ばれる手法が知られている（例えば、特許文献１参照）。ロール方式は、基板供給側の供給用ローラーに巻かれた１枚のシート状の基板（例えば、帯状のフィルム部材）を送り出すと共に送り出された基板を基板回収側の回収用ローラーで巻き取りながら、供給用ローラーと回収用ローラーとの間に設置された処理装置により、基板上に表示パネルや太陽電池パネル等の電子デバイスを形成する為の所望の加工処理を施していくものである。 In recent years, a technique for forming a display element on a flexible sheet-like substrate (for example, a film member) has been proposed. As such a technique, for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1). In the roll method, one sheet-like substrate (for example, a belt-like film member) wound around a substrate supply side supply roller is sent out, and the fed substrate is wound around the substrate collection side recovery roller, A desired processing for forming an electronic device such as a display panel or a solar cell panel is performed on a substrate by a processing apparatus installed between the supply roller and the collection roller.
　そして、基板が送り出されてから巻き取られるまでの間に、例えば複数の搬送ローラー等を用いて基板が搬送され、表示パネルの生産の場合は、複数の処理装置(ユニット)を用いてＴＦＴを構成するゲート電極、ゲート絶縁膜、半導体膜、ソース・ドレイン電極等を形成し、基板の被処理面上に表示素子の構成要素を順次形成する。例えば、有機ＥＬの素子を形成する場合には、発光層、陽極、陰極、電気回路等を基板上に順次形成する。 Then, during the period from when the substrate is sent out to when it is wound up, the substrate is transported using, for example, a plurality of transport rollers, etc., and in the case of production of a display panel, the TFT is mounted using a plurality of processing devices (units). A gate electrode, a gate insulating film, a semiconductor film, a source / drain electrode, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on a substrate.
国際公開第２００６／１００８６８号International Publication No. 2006/100868
　しかしながら、上記の構成においては、送り出されてから巻き取られるまでの間、基板は、複数の処理装置に掛け渡されるため、基板の全長が長くなり、基板の管理が困難になる場合がある。 However, in the above configuration, since the substrate is passed over a plurality of processing apparatuses from the time it is sent out until it is wound up, the total length of the substrate becomes long and it may be difficult to manage the substrate.
　本発明の態様は、搬送時における基板の管理負担を低減することができるカセット装置、基板搬送装置及び基板処理装置を提供することを目的とする。 An object of an aspect of the present invention is to provide a cassette apparatus, a substrate transfer apparatus, and a substrate processing apparatus that can reduce the burden of managing a substrate during transfer.
　本発明の第一の態様に従えば、基板の供給及び回収の一方を行う第一ユニット部と、基板の供給及び回収の他方を行う第二ユニット部と、を有し、第一ユニット部及び第二ユニット部は、互いに接近又は離間可能であるカセット装置が提供される。 According to the first aspect of the present invention, the first unit portion that performs one of substrate supply and recovery, and the second unit portion that performs the other of substrate supply and recovery, the first unit portion and The second unit part is provided with a cassette device that can approach or separate from each other.
　本発明の第二の態様に従えば、第一移動経路を移動可能に設けられ、基板の供給及び回収の一方を行う第一ユニット部と、第二移動経路を移動可能に設けられ、基板の供給及び回収の他方を行う第二ユニット部と、第一移動経路と第二移動経路との間に配置された第一基板処理部に対し、第一ユニット部を制御して基板の供給及び回収の一方を行わせるともに、第二ユニット部を制御して基板の供給及び回収の他方を行わせる制御部とを有し、制御部は、第一移動経路と第二移動経路との間に配置され、かつ第一基板処理部とは異なる第二基板処理部に対して、第一ユニット部及び第二ユニット部を移動し、第一ユニット部を制御して基板の供給及び回収の他方を行わせるとともに、第二ユニット部を制御して前記基板の供給及び回収の一方を行わせる基板搬送装置が提供される。 According to the second aspect of the present invention, the first movement path is provided so as to be movable, the first unit part that performs one of supply and recovery of the substrate, and the second movement path is provided so as to be movable. Substrate supply and recovery by controlling the first unit for the second unit that performs the other of supply and recovery, and the first substrate processing unit disposed between the first movement path and the second movement path And a controller that controls the second unit to perform the other of substrate supply and recovery, and the controller is disposed between the first movement path and the second movement path. And moving the first unit part and the second unit part relative to the second substrate processing part different from the first substrate processing part, and controlling the first unit part to perform the other of substrate supply and recovery And controlling the second unit part to supply and recover the substrate. A substrate transport apparatus is provided to perform.
　本発明の第三の態様に従えば、第一移動経路と第二移動経路との間に配置され、可撓性を有する基板に対して処理を行う複数の処理部と、本発明の第二の態様に従う基板搬送装置とを備える基板処理装置が提供される。 According to the third aspect of the present invention, a plurality of processing units that are disposed between the first movement path and the second movement path and perform processing on a flexible substrate, and the second aspect of the present invention. A substrate processing apparatus including the substrate transfer apparatus according to the above aspect is provided.
　本発明の第四の態様に従えば、可撓性を有する長尺の基板を複数の処理装置に順次送って、前記基板上に電子デバイスを形成する為の処理方法であって、第一基板処理部に供給すべき前記基板が長尺方向に巻かれた供給ロールを含む第一ユニット部と、前記第一基板処理部から回収すべき前記基板が長尺方向に巻かれる回収ロールを含む第二ユニット部とを、前記第一基板処理部を挟むように配置し、前記供給ロールから供給される前記基板を前記第一基板処理部によって処理して前記回収ロールで回収する第一処理工程と、前記供給ロールと前記回収ロールの間の前記基板が前記第一基板処理部から離れるような第一方向に沿って、前記第一ユニット部と前記第二ユニット部を共に移動させる第一移動工程と、前記供給ロールと前記回収ロールの前記長尺方向の間隔を狭める為に、前記第一ユニット部と前記第二ユニット部の少なくとも一方を前記第一方向と交差する第二方向に沿って移動させる第二移動工程と、前記第二方向の並進運動、前記第二方向の並進運動、前記第一方向と第二方向を含む面内での回転運動のうち、少なくとも二つの運動を伴って、所定間隔で対向した前記第一ユニット部と前記第二ユニット部を、前記第一基板処理部と異なる第二基板処理部に向けて一緒に移動させる第三移動工程と、を含む基板処理方法が提供される。 According to a fourth aspect of the present invention, there is provided a processing method for sequentially sending a flexible long substrate to a plurality of processing apparatuses to form an electronic device on the substrate. A first unit unit including a supply roll in which the substrate to be supplied to the processing unit is wound in the longitudinal direction; and a recovery unit in which the substrate to be recovered from the first substrate processing unit is wound in the longitudinal direction. A first processing step in which two unit parts are disposed so as to sandwich the first substrate processing unit, and the substrate supplied from the supply roll is processed by the first substrate processing unit and recovered by the recovery roll; A first moving step of moving the first unit unit and the second unit unit together in a first direction such that the substrate between the supply roll and the recovery roll is separated from the first substrate processing unit. And the supply roll and the recovery A second moving step of moving at least one of the first unit part and the second unit part along a second direction intersecting the first direction in order to narrow the distance in the longitudinal direction of the tool; Of the translational motion in the second direction, the translational motion in the second direction, and the rotational motion in the plane including the first direction and the second direction, the first facing each other at a predetermined interval with at least two motions. There is provided a substrate processing method including a third moving step of moving one unit portion and the second unit portion together toward a second substrate processing portion different from the first substrate processing portion.
　本発明の態様によれば、搬送時における基板の管理負担を低減することができる。 According to the aspect of the present invention, it is possible to reduce the management burden of the substrate during transport.
第一実施形態に係る基板処理装置の全体構成を示す斜視図である。1 is a perspective view showing an overall configuration of a substrate processing apparatus according to a first embodiment. 本実施形態に係る第一ユニット部側の構成を示す分解斜視図である。It is a disassembled perspective view which shows the structure by the side of the 1st unit part which concerns on this embodiment. 本実施形態に係るカセット装置の一部の構成を示す図である。It is a figure which shows the structure of a part of cassette apparatus which concerns on this embodiment. 本実施形態に係る第二ユニット部側の構成を示す分解斜視図である。It is a disassembled perspective view which shows the structure by the side of the 2nd unit part which concerns on this embodiment. 本実施形態に係るカセット装置の構成を示す図である。It is a figure which shows the structure of the cassette apparatus which concerns on this embodiment. 本実施形態に係る処理部の構成を示す図である。It is a figure which shows the structure of the process part which concerns on this embodiment. 本実施形態に係る基板処理装置の動作の一形態を示す図である。It is a figure which shows one form of operation | movement of the substrate processing apparatus which concerns on this embodiment. 本実施形態に係る基板処理装置の動作の一形態を示す図である。It is a figure which shows one form of operation | movement of the substrate processing apparatus which concerns on this embodiment. 本実施形態に係る基板処理装置の動作の一形態を示す図である。It is a figure which shows one form of operation | movement of the substrate processing apparatus which concerns on this embodiment. 本実施形態に係る基板処理装置の動作の一形態を示す図である。It is a figure which shows one form of operation | movement of the substrate processing apparatus which concerns on this embodiment. 本実施形態に係る基板処理装置の動作の一形態を示す図である。It is a figure which shows one form of operation | movement of the substrate processing apparatus which concerns on this embodiment. 本実施形態に係る基板処理装置の動作の一形態を示す図である。It is a figure which shows one form of operation | movement of the substrate processing apparatus which concerns on this embodiment. 第二実施形態に係る基板処理装置の全体構成を示す斜視図である。It is a perspective view which shows the whole structure of the substrate processing apparatus which concerns on 2nd embodiment. 本実施形態に係る基板処理装置の一部の構成を示す断面図である。It is sectional drawing which shows a part of structure of the substrate processing apparatus which concerns on this embodiment. 本実施形態に係るリフト部の構成を示す斜視図である。It is a perspective view which shows the structure of the lift part which concerns on this embodiment. 基板処理装置の他の構成を示す図である。It is a figure which shows the other structure of a substrate processing apparatus. 基板処理装置の他の構成を示す図である。It is a figure which shows the other structure of a substrate processing apparatus. 基板処理装置の他の構成を示す図である。It is a figure which shows the other structure of a substrate processing apparatus. 基板処理装置の他の構成を示す図である。It is a figure which shows the other structure of a substrate processing apparatus. 基板処理装置の他の構成を示す図である。It is a figure which shows the other structure of a substrate processing apparatus. 基板の他の構成を示す図である。It is a figure which shows the other structure of a board | substrate. 基板処理装置の他の構成と動作状態を示す図である。It is a figure which shows the other structure and operation state of a substrate processing apparatus. 図２２の基板処理装置の次の動作状態を示す図である。It is a figure which shows the next operation state of the substrate processing apparatus of FIG. 図２３の基板処理装置の次の動作状態を示す図である。It is a figure which shows the next operation state of the substrate processing apparatus of FIG. 図２４の基板処理装置の次の動作状態を示す図である。It is a figure which shows the next operation state of the substrate processing apparatus of FIG. 図２５の基板処理装置の次の動作状態を示す図である。It is a figure which shows the next operation state of the substrate processing apparatus of FIG. 図２６の基板処理装置の次の動作状態を示す図である。It is a figure which shows the next operation state of the substrate processing apparatus of FIG.
　［第一実施形態］　
　以下、図面を参照して、本発明の第一実施形態を説明する。　
　図１は、本実施形態に係る基板処理装置（基板搬送装置）１００の全体構成を示す斜視図である。　図１に示すように、基板処理装置１００は、可撓性を有するシート状の基板（例えば、帯状のフィルム部材）Ｓに対して所定の処理を行う処理部（第一基板処理部、第二基板処理部）１０と、基板Ｓを搬送する搬送部（カセット装置）２０と、処理部１０及びカセット装置２０を統括的に制御する制御部ＣＯＮＴとを有する。基板処理装置１００は、例えば製造工場の床面ＦＬ上に設けられている。 [First embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an overall configuration of a substrate processing apparatus (substrate transport apparatus) 100 according to the present embodiment. As shown in FIG. 1, the substrate processing apparatus 100 includes a processing unit (first substrate processing unit, second processing unit) that performs a predetermined process on a flexible sheet-like substrate (for example, a strip-shaped film member) S. Substrate processing unit) 10, transport unit (cassette device) 20 for transporting substrate S, and control unit CONT for overall control of processing unit 10 and cassette device 20. The substrate processing apparatus 100 is provided, for example, on the floor surface FL of the manufacturing factory.
　基板処理装置１００は、基板Ｓの処理面（表面）に各種処理を実行するロール・トゥ・ロール方式（以下、単に「ロール方式」と表記する）の装置である。基板処理装置１００は、基板Ｓ上に例えば有機ＥＬ素子、液晶表示素子等の表示素子（電子デバイス）を形成する場合に用いられる。勿論、これらの素子以外の素子（例えば、ソーラーセル、カラーフィルター、タッチパネル等）を形成するシステムにおいて基板処理装置１００を用いても良い。 The substrate processing apparatus 100 is an apparatus of a roll-to-roll system (hereinafter simply referred to as “roll system”) that performs various processes on the processing surface (front surface) of the substrate S. The substrate processing apparatus 100 is used when a display element (electronic device) such as an organic EL element or a liquid crystal display element is formed on the substrate S. Of course, you may use the substrate processing apparatus 100 in the system which forms elements other than these elements (for example, a solar cell, a color filter, a touch panel, etc.).
　以下、本実施形態に係る基板処理装置１００の構成を説明するにあたり、ＸＹＺ直交座標系を設定し、このＸＹＺ直交座標系を参照しつつ各部材の位置関係について説明する。以下の図においては、ＸＹＺ直交座標系のうち床面ＦＬに平行な平面をＸＹ平面としている。ＸＹ平面のうち基板Ｓが移動する方向をＹ軸方向とし、Ｙ軸方向に直交する方向をＸ軸方向としている。また、床面ＦＬ（ＸＹ平面）に垂直な方向をＺ軸方向としている。また、Ｚ軸回りの方向をθＺ軸方向と表記する。 Hereinafter, in describing the configuration of the substrate processing apparatus 100 according to the present embodiment, an XYZ orthogonal coordinate system is set, and the positional relationship of each member is described with reference to the XYZ orthogonal coordinate system. In the following drawings, a plane parallel to the floor surface FL in the XYZ orthogonal coordinate system is an XY plane. A direction in which the substrate S moves in the XY plane is a Y-axis direction, and a direction orthogonal to the Y-axis direction is an X-axis direction. A direction perpendicular to the floor surface FL (XY plane) is taken as a Z-axis direction. The direction around the Z axis is denoted as the θZ axis direction.
　基板処理装置１００において処理対象となる基板Ｓとしては、例えば樹脂フィルムやステンレス鋼などの箔（フォイル）を用いることができる。例えば、樹脂フィルムは、ポリエチレン樹脂、ポリプロピレン樹脂、ポリエステル樹脂、エチレンビニル共重合体樹脂、ポリ塩化ビニル樹脂、セルロース樹脂、ポリアミド樹脂、ポリイミド樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、酢酸ビニル樹脂、ポリエチレンテレフタレート、ポリエチレンナフタレート、ステンレス箔などの材料を用いることができる。 As the substrate S to be processed in the substrate processing apparatus 100, for example, a foil such as a resin film or stainless steel can be used. For example, the resin film is polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene Materials such as naphthalate and stainless steel foil can be used.
　基板Ｓの短尺方向の寸法は例えば５０ｃｍ～２ｍ程度に形成されており、長尺方向の寸法（１ロール分の寸法）は例えば１０ｍ以上に形成されている。勿論、この寸法は一例に過ぎず、これに限られることは無い。例えば基板Ｓの短尺方向の寸法が１ｍ以下、又は５０ｃｍ以下であっても良いし、２ｍ以上であっても良い。また、基板Ｓの長尺方向の寸法が１０ｍ以下であっても良い。 The dimension in the short direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the long direction (size for one roll) is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the short direction of the substrate S may be 1 m or less, 50 cm or less, or 2 m or more. Moreover, the dimension of the elongate direction of the board | substrate S may be 10 m or less.
　基板Ｓは、例えば１ｍｍ以下の厚みを有し、可撓性を有するように形成されている。ここで可撓性とは、例えば基板に少なくとも自重程度の所定の力を加えても剪断したり破断したりすることはなく、前記基板を撓めることが可能な性質をいう。また、例えば上記所定の力によって屈曲する性質も可撓性に含まれる。また、上記可撓性は、前記基板の材質、大きさ、厚さ、温度、又は周囲の温度、湿度などの環境、等に応じて変わる。なお、基板Ｓとしては、１枚の帯状の基板を用いても良いが、複数の単位基板を接続して帯状に形成される構成としても良い。 The substrate S has a thickness of 1 mm or less, for example, and is formed to have flexibility. Here, the flexibility means a property that the substrate can be bent without being sheared or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility. In addition, the flexibility varies depending on the material, size, thickness, temperature, ambient temperature, environment such as humidity, and the like of the substrate. As the substrate S, a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be employed.
　基板Ｓは、比較的高温（例えば２００℃程度）の熱を受けても寸法が実質的に変わらない（熱変形が小さい）ように熱膨張係数が比較的小さい方が好ましい。例えば、無機フィラーを樹脂フィルムに混合して熱膨張係数を小さくすることができる。無機フィラーの例としては、酸化チタン、酸化亜鉛、アルミナ、酸化ケイ素などが挙げられる。 The substrate S preferably has a relatively small coefficient of thermal expansion so that the dimensions do not substantially change even when subjected to heat at a relatively high temperature (for example, about 200 ° C.) (thermal deformation is small). For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
　基板処理装置１００は、デバイス製造の工場内に設置される。工場内の床面ＦＬには、ガイドレール（第一移動経路、第二移動経路）３０が形成されている。ガイドレール３０は、第一レール３１、第二レール３２及び第三レール３３を有する。第一レール３１及び第二レール３２は、複数の処理部の配列方向（Ｘ軸方向）に延びるように形成されている。また、第一レール３１は、Ｙ軸方向に関して、処理部１０の一方側に配置され、第二レール３２は、Ｙ軸方向に関して、処理部１０の他方側に配置される。すなわち、第一レール３１及び第二レール３２は、処理部１０をＹ軸方向に挟む位置に設けられている。第三レール３３は、Ｘ軸方向において複数の処理部１０の間にそれぞれ配置されている。第三レール３３は、Ｙ軸方向に平行に形成されており、第一レール３１と第二レール３２とを接続している。第一レール３１、第二レール３２及び第三レール３３には、例えばＸ座標やＹ座標などの位置情報が設定されている。前記位置情報は、光センサや磁気センサなどのセンサによって読み取り可能となるように各レールに形成されている。 The substrate processing apparatus 100 is installed in a device manufacturing factory. Guide rails (first movement path, second movement path) 30 are formed on a floor surface FL in the factory. The guide rail 30 has a first rail 31, a second rail 32, and a third rail 33. The first rail 31 and the second rail 32 are formed so as to extend in the arrangement direction (X-axis direction) of the plurality of processing units. The first rail 31 is disposed on one side of the processing unit 10 with respect to the Y-axis direction, and the second rail 32 is disposed on the other side of the processing unit 10 with respect to the Y-axis direction. That is, the first rail 31 and the second rail 32 are provided at positions that sandwich the processing unit 10 in the Y-axis direction. The third rails 33 are respectively disposed between the plurality of processing units 10 in the X-axis direction. The third rail 33 is formed in parallel to the Y-axis direction, and connects the first rail 31 and the second rail 32. For example, position information such as an X coordinate and a Y coordinate is set in the first rail 31, the second rail 32, and the third rail 33. The position information is formed on each rail so that it can be read by a sensor such as an optical sensor or a magnetic sensor.
　基板処理装置１００は、カセット装置２０を備える。このカセット装置２０は、基板Ｓの供給及び回収のうち一方を行う第一ユニット部２１と、基板Ｓの供給及び回収のうち他方を行う第二ユニット部２２とを有する。そして、基板Ｓは、第一ユニット部２１及び第二ユニット部２２の一方側から他方側に搬送される。
　第一ユニット部２１及び第二ユニット部２２は、それぞれ複数用意されている。床面ＦＬには、第一ユニット部２１及び第二ユニット部２２の少なくとも一方を待機させるバッファ部ＢＦが設けられている。このバッファ部ＢＦに、第一ユニット部２１及び第二ユニット部２２を待機させることが可能である。バッファ部ＢＦは、ガイドレール３０の一部を介して第一レール３１、第二レール３２又は第三レール３３に接続されている。 The substrate processing apparatus 100 includes a cassette device 20. The cassette device 20 includes a first unit portion 21 that performs one of the supply and recovery of the substrate S and a second unit portion 22 that performs the other of the supply and recovery of the substrate S. And the board | substrate S is conveyed from the one side of the 1st unit part 21 and the 2nd unit part 22 to the other side.
A plurality of first unit parts 21 and a plurality of second unit parts 22 are prepared. The floor surface FL is provided with a buffer unit BF that waits for at least one of the first unit unit 21 and the second unit unit 22. The buffer unit BF can make the first unit unit 21 and the second unit unit 22 stand by. The buffer unit BF is connected to the first rail 31, the second rail 32, or the third rail 33 through a part of the guide rail 30.
　図２は、カセット装置２０のうち、第一ユニット部２１側の構成を示す分解斜視図である。図３は、カセット装置２０の一部の構成を示す図である。以下、説明の便宜上、図２及び図３におけるＸ軸方向、Ｙ軸方向及びＺ軸方向の表示を図１に対応させるものとする。
　カセット装置２０は、第一ユニット部２１を第二ユニット部２２に対して、移動させる移動機構２４を備える。移動機構２４は、第一ユニット部２１を移動させる移動部（第一移動部）４２を備える。また、カセット装置２０は、後述する移動部側通信部４４及び接触抑制部４７を有する。 FIG. 2 is an exploded perspective view showing the configuration of the cassette unit 20 on the first unit portion 21 side. FIG. 3 is a diagram illustrating a partial configuration of the cassette device 20. Hereinafter, for convenience of description, the display in the X-axis direction, the Y-axis direction, and the Z-axis direction in FIGS. 2 and 3 is assumed to correspond to FIG.
The cassette device 20 includes a moving mechanism 24 that moves the first unit portion 21 relative to the second unit portion 22. The moving mechanism 24 includes a moving unit (first moving unit) 42 that moves the first unit unit 21. Moreover, the cassette apparatus 20 has the moving part side communication part 44 and the contact suppression part 47 which are mentioned later.
　第一ユニット部２１は、第一壁部４０ａ、第二壁部４０ｂ、底部４０ｃ及び外部接続部４０ｄを有する。また、第一ユニット部２１には、バッテリーなどの電源部（不図示）が設けられている。 The first unit portion 21 includes a first wall portion 40a, a second wall portion 40b, a bottom portion 40c, and an external connection portion 40d. The first unit portion 21 is provided with a power source portion (not shown) such as a battery.
　第一壁部４０ａ及び第二壁部４０ｂは、それぞれ板状に形成されている。第一壁部４０ａは、例えば－Ｘ軸側の端部に配置されている。第二壁部４０ｂは、例えば＋Ｘ軸側の端部に配置されている。第一壁部４０ａ及び第二壁部４０ｂは、互いに平行に配置されている。なお、第一壁部４０ａ及び第二壁部４０ｂが、扉状に形成されていても良い。 The first wall portion 40a and the second wall portion 40b are each formed in a plate shape. The first wall portion 40a is disposed, for example, at the end on the −X axis side. The second wall portion 40b is disposed, for example, at the end on the + X axis side. The first wall portion 40a and the second wall portion 40b are arranged in parallel to each other. In addition, the 1st wall part 40a and the 2nd wall part 40b may be formed in the door shape.
　底部４０ｃは、ＸＹ平面（床面ＦＬ）に平行に形成されており、第一壁部４０ａ及び第二壁部４０ｂを連結している。外部接続部４０ｄは、例えば、Ｘ軸方向に延びる円柱の棒状部材で形成され、第一ユニット部２１の＋Ｙ軸側端部に設けられている。第一ユニット部２１の＋Ｙ軸側端部は、外部の搬送機構に接続される接続部として機能する。外部接続部４０ｄは、第一ユニット部２１の高さ方向（Ｚ軸方向）の例えば２箇所に設けられている。 The bottom 40c is formed in parallel to the XY plane (floor surface FL), and connects the first wall 40a and the second wall 40b. The external connection portion 40d is formed of, for example, a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the + Y-axis side end portion of the first unit portion 21. The + Y-axis side end portion of the first unit portion 21 functions as a connection portion connected to an external transport mechanism. The external connection portion 40d is provided at, for example, two places in the height direction (Z-axis direction) of the first unit portion 21.
　第一壁部４０ａ及び第二壁部４０ｂのうち、接続部側の角部には、それぞれ切り欠き部４０ｆが形成されている。切り欠き部４０ｆは、外部構造物に当接可能に設けられている。切り欠き部４０ｆを外部構造物に当接させることにより、第一ユニット部２１と前記外部構造物との間で位置決めが行われる。なお、図２において切り欠き部４０ｆは＋Ｙ軸側端部に形成されているが、例えば－Ｙ軸側端部に切り欠き部４０ｆが設けられた構成であっても良い。この場合、切り欠き部４０ｆを処理部１０の一部に当接させることで、第一ユニット部２１と処理部１０との間で位置決めを行うことができる。 Of the first wall portion 40a and the second wall portion 40b, a notch portion 40f is formed at each corner portion on the connection portion side. The cutout portion 40f is provided so as to be able to contact an external structure. Positioning is performed between the first unit portion 21 and the external structure by bringing the notch 40f into contact with the external structure. In FIG. 2, the cutout portion 40f is formed at the + Y-axis side end portion. However, for example, the cutout portion 40f may be provided at the −Y-axis side end portion. In this case, positioning can be performed between the first unit portion 21 and the processing unit 10 by bringing the notch 40f into contact with a part of the processing unit 10.
　第一壁部４０ａ及び第二壁部４０ｂの－Ｙ軸側の端部には、それぞれ第一接続部２３ａが形成されている。第一ユニット部２１は、前記第一接続部２３ａを介して第二ユニット部２２に接続される。第一接続部２３ａとしては、例えば着脱状態を自動で切り替え可能な構成、例えば電磁石など、が用いられている。 A first connection portion 23a is formed at each end on the −Y axis side of the first wall portion 40a and the second wall portion 40b. The first unit portion 21 is connected to the second unit portion 22 through the first connection portion 23a. As the 1st connection part 23a, the structure which can switch an attachment / detachment state automatically, for example, an electromagnet etc., is used, for example.
　第一ユニット部２１は、基板を収容する第一収容部４０を有する。この第一収容部４０には、基板Ｓが巻き付けられた基板供給ローラー（供給ロール）４１ｃが取り付けられる基板駆動部（第一基板駆動部）４１が設けられる。基板駆動部４１は、基板Ｓを回転させることによって、第二ユニット部２２側に基板Ｓを供給する供給動作を行う。基板駆動部４１は、軸部（第一軸部）４１ａ及び回転駆動部（第一駆動部）４１ｂを有する。軸部４１ａは、円筒状又は円柱状に形成されており、伸縮可能に構成されている。軸部４１ａが伸縮することによって、第一壁部４０ａと第二壁部４０ｂの間から取り外すことができ、基板供給ローラー４１ｃの装着が可能になる。軸部４１ａは、例えば中心軸の軸線方向がＸ軸方向に平行となるように配置されている。軸部４１ａの一方の端部は、第一ユニット部２１の第二壁部４０ｂによって円周方向に回転可能に支持されている。軸部４１ａには、基板供給ローラー４１ｃの端部を保持可能な保持部（不図示）が設けられている。回転駆動部４１ｂは、軸部４１ａを回転させる。回転駆動部４１ｂが軸部４１ａを回転させることで、基板Ｓの供給動作（送り出し動作）が可能となっている。 The first unit portion 21 has a first accommodating portion 40 that accommodates a substrate. The first accommodating portion 40 is provided with a substrate driving portion (first substrate driving portion) 41 to which a substrate supply roller (supply roll) 41c around which the substrate S is wound is attached. The substrate driving unit 41 performs a supply operation of supplying the substrate S to the second unit unit 22 side by rotating the substrate S. The substrate drive unit 41 includes a shaft portion (first shaft portion) 41a and a rotation drive portion (first drive portion) 41b. The shaft portion 41a is formed in a cylindrical shape or a columnar shape, and is configured to be extendable and contractible. When the shaft portion 41a expands and contracts, it can be removed from between the first wall portion 40a and the second wall portion 40b, and the substrate supply roller 41c can be mounted. For example, the shaft portion 41a is arranged so that the axial direction of the central axis is parallel to the X-axis direction. One end portion of the shaft portion 41a is supported by the second wall portion 40b of the first unit portion 21 so as to be rotatable in the circumferential direction. The shaft portion 41a is provided with a holding portion (not shown) that can hold the end portion of the substrate supply roller 41c. The rotation drive unit 41b rotates the shaft portion 41a. The rotation operation part 41b rotates the shaft part 41a, so that the substrate S can be supplied (delivered).
　第一収容部４０には、保護基板供給ローラー４８ｃが取り付けられる保護基板駆動部（第一補助部）４８が設けられる。保護基板供給ローラー４８ｃには、基板Ｓの被処理面を覆う保護基板（保護フィルム）Ｃが巻き付けられている。保護基板駆動部４８は、保護基板供給ローラー４８ｃを回転させることによって、第二ユニット部２２側に保護基板Ｃを供給する供給動作を行う。保護基板Ｃは、基板Ｓの被処理面を覆うことで前記被処理面を保護する。保護基板Ｃは、基板Ｓと同様に可撓性を有する材料を用いて帯状に形成されており、基板Ｓとほぼ同一の寸法を有する。 The first accommodating portion 40 is provided with a protective substrate driving portion (first auxiliary portion) 48 to which the protective substrate supply roller 48c is attached. A protective substrate (protective film) C that covers the surface to be processed of the substrate S is wound around the protective substrate supply roller 48c. The protective substrate drive unit 48 performs a supply operation of supplying the protective substrate C to the second unit unit 22 side by rotating the protective substrate supply roller 48c. The protective substrate C protects the surface to be processed by covering the surface to be processed of the substrate S. The protective substrate C is formed in a strip shape using a flexible material like the substrate S, and has substantially the same dimensions as the substrate S.
　保護基板駆動部４８は、軸部４８ａ及び回転駆動部４８ｂを有する。軸部４８ａは、円筒状又は円柱状に形成されており、伸縮可能に構成されている。軸部４８ａが伸縮することによって、第一壁部４０ａと第二壁部４０ｂの間から取り外すことができ、保護基板供給ローラー４８ｃの装着が可能になる。軸部４８ａは、例えば中心軸の軸線方向がＸ軸方向に平行となるように配置されている。つまり、軸部４１ａ及び軸部４８ａは、中心軸の軸線方向が互いに平行となるように配置されている。軸部４８ａの一方の端部は、第一ユニット部２１の第二壁部４０ｂによって円周方向に回転可能に支持されている。軸部４８ａには、保護基板供給ローラー４８ｃの端部を保持可能な保持部（不図示）が設けられている。回転駆動部４８ｂは、軸部４８ａを回転させる。回転駆動部４８ｂが軸部４８ａを回転させることで、保護基板Ｃの供給動作（送り出し動作）が可能となっている。保護基板駆動部４８には、送り出した保護基板Ｃを基板Ｓに重ねる機構（不図示）が設けられている。 The protective substrate drive unit 48 includes a shaft portion 48a and a rotation drive portion 48b. The shaft portion 48a is formed in a cylindrical shape or a columnar shape, and is configured to be stretchable. When the shaft portion 48a expands and contracts, it can be removed from between the first wall portion 40a and the second wall portion 40b, and the protective substrate supply roller 48c can be attached. For example, the shaft portion 48a is arranged so that the axial direction of the central axis is parallel to the X-axis direction. That is, the shaft portion 41a and the shaft portion 48a are arranged so that the axial directions of the central axes are parallel to each other. One end portion of the shaft portion 48a is supported by the second wall portion 40b of the first unit portion 21 so as to be rotatable in the circumferential direction. The shaft portion 48a is provided with a holding portion (not shown) that can hold the end portion of the protective substrate supply roller 48c. The rotation driving part 48b rotates the shaft part 48a. The rotation driving part 48b rotates the shaft part 48a, so that the supply operation (sending operation) of the protective substrate C is possible. The protective substrate driving unit 48 is provided with a mechanism (not shown) for superimposing the sent protective substrate C on the substrate S.
　第一ユニット部２１は、基板側通信部（第一通信部）４３を有する。基板側通信部４３は、第一壁部４０ａの＋Ｚ軸側端面に設けられている。基板側通信部４３は、例えば制御部ＣＯＮＴや第二ユニット部２２などとの間で通信可能である。 The first unit unit 21 includes a substrate side communication unit (first communication unit) 43. The board side communication part 43 is provided on the + Z-axis side end face of the first wall part 40a. The board side communication unit 43 can communicate with the control unit CONT, the second unit unit 22, and the like, for example.
　第一ユニット部２１は、接触抑制部４７を有する。接触抑制部４７は、第一壁部４０ａ及び第二壁部４０ｂの＋Ｙ軸側の端面に設けられている。接触抑制部４７は、第一壁部４０ａ及び第二壁部４０ｂの＋Ｙ軸側の端面が外部構造物に接触するのを抑制すると共に、接触時の衝撃を緩和する。接触抑制部４７は、例えば第一壁部４０ａ及び第二壁部４０ｂから＋Ｙ軸側に突出した棒状部材と、前記棒状部材に対して作用する－Ｙ軸方向の力を受ける弾性部材とを有する。 The first unit portion 21 has a contact suppressing portion 47. The contact suppressing portion 47 is provided on the end surfaces on the + Y axis side of the first wall portion 40a and the second wall portion 40b. The contact suppressing portion 47 suppresses the + Y-axis end surfaces of the first wall portion 40a and the second wall portion 40b from coming into contact with the external structure, and reduces the impact at the time of contact. The contact suppressing portion 47 includes, for example, a rod-like member that protrudes from the first wall portion 40a and the second wall portion 40b to the + Y-axis side, and an elastic member that receives a force in the −Y-axis direction that acts on the rod-like member. .
　前述した移動部４２は、第一ユニット部２１を取り外し可能に支持する。移動部４２は、第一ユニット部２１をＸ軸方向、Ｙ軸方向及びＺ軸方向に移動させる。移動部４２は、筐体５１、キャスター５２、昇降部５３及びキャスター駆動部５４を有する。また、移動部４２には、バッテリーなどの電源部（不図示）が設けられている。 The moving unit 42 described above supports the first unit unit 21 so as to be removable. The moving unit 42 moves the first unit unit 21 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving unit 42 includes a housing 51, a caster 52, an elevating unit 53, and a caster driving unit 54. The moving unit 42 is provided with a power supply unit (not shown) such as a battery.
　筐体５１は、可動部５１ａ及び基部５１ｂを有する。可動部５１ａは、筐体５１の＋Ｚ軸側端部に設けられており、昇降部５３の駆動によってＺ軸方向に移動可能に設けられている。可動部５１ａが＋Ｚ軸方向に移動することで、第一ユニット部２１が前記可動部５１ａと一体的に＋Ｚ軸方向に移動する。基部５１ｂは、可動部５１ａを移動可能に支持する。 The housing 51 has a movable part 51a and a base part 51b. The movable portion 51 a is provided at the + Z-axis side end portion of the casing 51, and is provided so as to be movable in the Z-axis direction by driving the elevating portion 53. As the movable portion 51a moves in the + Z-axis direction, the first unit portion 21 moves in the + Z-axis direction integrally with the movable portion 51a. The base 51b supports the movable part 51a so as to be movable.
　キャスター５２は、筐体５１の基部５１ｂの－Ｚ軸側端面に４つ設けられている。キャスター５２は、キャスター駆動部５４の駆動により回転可能に設けられている。キャスター５２が回転することで、筐体５１及び第一ユニット部２１が一体的にＸ軸方向、Ｙ軸方向及びθＺ軸方向に移動する。 The four casters 52 are provided on the −Z-axis side end face of the base portion 51 b of the casing 51. The caster 52 is rotatably provided by driving of the caster driving unit 54. As the caster 52 rotates, the casing 51 and the first unit unit 21 integrally move in the X-axis direction, the Y-axis direction, and the θZ-axis direction.
　可動部５１ａの＋Ｚ軸側の端面５１ｃには、溝部５０が形成されている。溝部５０は、前記端面５１ｃに対してＶ字状に形成されている。一方、第一ユニット部２１の－Ｚ軸側の端面４０ｅには４つの球状支持部４９が形成されている。前記４つの球状支持部４９は、それぞれ上記溝部５０に支持される。球状支持部４９が溝部５０に支持されることにより、第一ユニット部２１と筐体５１との間におけるＸ軸方向及びＹ軸方向への相対的な移動が規制される。なお、溝部５０及び球状支持部４９の数は、それぞれ３つであってもよい。 The groove part 50 is formed in the end surface 51c on the + Z-axis side of the movable part 51a. The groove part 50 is formed in a V shape with respect to the end face 51c. On the other hand, four spherical support portions 49 are formed on the end surface 40 e on the −Z-axis side of the first unit portion 21. The four spherical support portions 49 are supported by the groove portions 50, respectively. By supporting the spherical support portion 49 in the groove portion 50, relative movement in the X-axis direction and the Y-axis direction between the first unit portion 21 and the housing 51 is restricted. In addition, the number of the groove parts 50 and the spherical support parts 49 may be three, respectively.
　また、可動部５１ａには、着脱検出部４６が設けられている。着脱検出部４６は、第一ユニット部２１が筐体５１に装着されているか否かを検出する。着脱検出部４６としては、例えば溝部５０と球状支持部４９との間における電気抵抗値を検出するセンサや溝部５０における圧力を検出するセンサなど、各種センサを用いることができる。着脱検出部４６による検出結果は、例えば移動部側通信部４４から外部（制御部ＣＯＮＴ、基板側通信部４３など）に送信されるようになっている。 Moreover, the attachment / detachment detection part 46 is provided in the movable part 51a. The attachment / detachment detection unit 46 detects whether or not the first unit unit 21 is attached to the housing 51. As the attachment / detachment detection unit 46, for example, various sensors such as a sensor for detecting an electric resistance value between the groove 50 and the spherical support 49 and a sensor for detecting a pressure in the groove 50 can be used. The detection result by the attachment / detachment detection unit 46 is transmitted from the moving unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example.
　移動部４２は、移動部側通信部（第一通信部）４４を有する。移動部側通信部４４は、筐体５１の内部に設けられている。移動部側通信部４４は、例えば制御部ＣＯＮＴや基板側通信部４３、第二ユニット部２２などとの間で通信可能である。基板側通信部４３及び移動部側通信部４４は、第一ユニット部２１の動作を制御するための第一制御信号を受信可能である。第一制御信号には、例えば移動部４２の移動動作を制御する信号や、第一ユニット部２１における基板Ｓの供給及び回収動作を制御する信号などが含まれる。 The moving unit 42 includes a moving unit side communication unit (first communication unit) 44. The mobile unit side communication unit 44 is provided inside the housing 51. The moving unit side communication unit 44 can communicate with the control unit CONT, the substrate side communication unit 43, the second unit unit 22, and the like, for example. The board-side communication unit 43 and the moving unit-side communication unit 44 can receive a first control signal for controlling the operation of the first unit unit 21. The first control signal includes, for example, a signal for controlling the moving operation of the moving unit 42 and a signal for controlling the supply and recovery operations of the substrate S in the first unit unit 21.
　図３に示すように、筐体５１の基部５１ｂの－Ｚ軸側の端面５１ｄ（床面ＦＬに対向する面）には、位置検出部（第一検出部）５５が設けられている。位置検出部５５は、第一ユニット部２１の位置情報を検出する。位置検出部５５は、前記位置情報として、例えばガイドレール３０（第一レール３１、第二レール３２及び第三レール３３）に設定された位置情報を検出する。位置検出部５５による検出結果は、例えば移動部側通信部４４から外部（制御部ＣＯＮＴ、基板側通信部４３など）に送信されるようになっている。例えば制御部ＣＯＮＴは、位置検出部５５の検出結果を用いることで、ガイドレール３０に沿って第一ユニット部２１を移動させる。 As shown in FIG. 3, a position detection unit (first detection unit) 55 is provided on the end surface 51 d (surface facing the floor surface FL) on the −Z axis side of the base 51 b of the housing 51. The position detection unit 55 detects the position information of the first unit unit 21. The position detector 55 detects, for example, position information set on the guide rail 30 (the first rail 31, the second rail 32, and the third rail 33) as the position information. The detection result by the position detection unit 55 is transmitted from the moving unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example. For example, the control unit CONT moves the first unit unit 21 along the guide rail 30 by using the detection result of the position detection unit 55.
　図４は、カセット装置２０のうち第二ユニット部２２の構成を示す分解斜視図である。以下、説明の便宜上、図４におけるＸ軸方向、Ｙ軸方向及びＺ軸方向の表示を図１に対応させるものとする。　
　図４に示すように、第二ユニット部２２は、基板駆動部（第二基板駆動部）６１、基板側通信部６３、接触抑制部６７、保護基板駆動部（第二補助部）６８を有する。また、カセット装置２０に設けられる移動機構２４は、第二ユニット部２２を移動させる移動部（第二移動部）６２を有する。 FIG. 4 is an exploded perspective view showing the configuration of the second unit portion 22 in the cassette device 20. Hereinafter, for convenience of description, the display in the X-axis direction, the Y-axis direction, and the Z-axis direction in FIG. 4 is assumed to correspond to FIG.
As shown in FIG. 4, the second unit unit 22 includes a substrate driving unit (second substrate driving unit) 61, a substrate side communication unit 63, a contact suppressing unit 67, and a protective substrate driving unit (second auxiliary unit) 68. . The moving mechanism 24 provided in the cassette device 20 includes a moving unit (second moving unit) 62 that moves the second unit unit 22.
　第二ユニット部２２は、第一壁部６０ａ、第二壁部６０ｂ、底部６０ｃ及び外部接続部６０ｄを有する。また、第二ユニット部２２には、バッテリーなどの電源部（不図示）が設けられている。第一ユニット部２１及び第二ユニット部２２は、ＸＺ平面を基準とした鏡面構造を有している。 The second unit part 22 has a first wall part 60a, a second wall part 60b, a bottom part 60c, and an external connection part 60d. The second unit 22 is provided with a power source (not shown) such as a battery. The 1st unit part 21 and the 2nd unit part 22 have the mirror surface structure on the basis of XZ plane.
　第一壁部６０ａ及び第二壁部６０ｂは、それぞれ板状に形成されている。第一壁部６０ａは、例えば－Ｘ軸側の端部に配置されている。第二壁部６０ｂは、例えば＋Ｘ軸側の端部に配置されている。第一壁部６０ａ及び第二壁部６０ｂは、互いに平行に配置されている。なお、第一壁部６０ａ及び第二壁部６０ｂが、扉状に形成されていても良い。 The first wall portion 60a and the second wall portion 60b are each formed in a plate shape. The first wall portion 60a is disposed, for example, at the end on the −X axis side. The second wall portion 60b is disposed, for example, at the end on the + X axis side. The first wall portion 60a and the second wall portion 60b are arranged in parallel to each other. In addition, the 1st wall part 60a and the 2nd wall part 60b may be formed in the door shape.
　底部６０ｃは、ＸＹ平面（床面ＦＬ）に平行に形成されており、第一壁部６０ａ及び第二壁部６０ｂを連結している。外部接続部６０ｄは、例えば、Ｘ軸方向に延びる円柱の棒状部材で形成され、第二ユニット部２２の－Ｙ軸側端部に設けられている。第二ユニット部２２の－Ｙ軸側端部は、外部の搬送機構に接続される接続部として機能する。外部接続部６０ｄは、第二ユニット部２２の高さ方向（Ｚ軸方向）の例えば２箇所に設けられている。 The bottom portion 60c is formed in parallel to the XY plane (floor surface FL), and connects the first wall portion 60a and the second wall portion 60b. The external connection portion 60d is formed of, for example, a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the −Y-axis side end portion of the second unit portion 22. The −Y-axis side end portion of the second unit portion 22 functions as a connection portion connected to an external transport mechanism. The external connection portion 60d is provided at, for example, two places in the height direction (Z-axis direction) of the second unit portion 22.
　第一壁部６０ａ及び第二壁部６０ｂのうち、接続部側の角部には、それぞれ切り欠き部６０ｆが形成されている。切り欠き部６０ｆは、外部構造物に当接可能に設けられている。切り欠き部６０ｆを外部構造物に当接させることにより、第二ユニット部２２と前記外部構造物との間で位置決めが行われる。なお、図４において切り欠き部６０ｆは－Ｙ軸側端部に形成されているが、例えば＋Ｙ軸側端部に切り欠き部６０ｆが設けられた構成であっても良い。この場合、切り欠き部６０ｆを処理部１０の一部に当接させることで、第二ユニット部２２と処理部１０との間で位置決めを行うことができる。 Of the first wall portion 60a and the second wall portion 60b, a cutout portion 60f is formed at each corner on the connection portion side. The cutout portion 60f is provided so as to be able to contact an external structure. Positioning is performed between the second unit portion 22 and the external structure by bringing the notch 60f into contact with the external structure. In FIG. 4, the notch 60f is formed at the −Y-axis side end, but for example, the notch 60f may be provided at the + Y-axis side end. In this case, positioning can be performed between the second unit portion 22 and the processing unit 10 by bringing the notch 60 f into contact with a part of the processing unit 10.
　第一壁部６０ａ及び第二壁部６０ｂの＋Ｙ軸側の端部には、それぞれ第二接続部２３ｂが形成されている。第二ユニット部２２は、前記第二接続部２３ｂを介して第一ユニット部２１に接続される。第二接続部２３ｂとしては、例えば着脱状態を自動で切り替え可能な構成、例えば電磁石など、が用いられている。 A second connection portion 23b is formed at each end on the + Y-axis side of the first wall portion 60a and the second wall portion 60b. The second unit part 22 is connected to the first unit part 21 via the second connection part 23b. As the 2nd connection part 23b, the structure which can switch an attachment / detachment state automatically, for example, an electromagnet etc., is used, for example.
　第二ユニット部２２は、基板を収容する第二収容部６０を有する。この第二収容部６０には、基板Ｓが巻きつけられた基板回収ローラー（回収ロール）６１ｃが取り付けられる基板駆動部６１が設けられる。基板駆動部６１は、基板Ｓを回転させることによって、第一ユニット部２１側から供給された基板Ｓを回収する回収動作を行う。基板駆動部６１は、軸部（第二軸部）６１ａ及び回転駆動部（第二駆動部）６１ｂを有する。軸部６１ａは、円筒状又は円柱状に形成されており、伸縮可能に構成されている。軸部６１ａが伸縮することによって、第一壁部６０ａと第二壁部６０ｂの間から取り外すことができ、基板回収ローラー６１ｃの装着が可能になる。軸部６１ａは、例えば中心軸の軸線方向がＸ軸方向に平行となるように配置されている。軸部６１ａの一方の端部は、第二ユニット部２２の第二壁部６０ｂによって円周方向に回転可能に支持されている。軸部６１ａには、基板回収ローラー６１ｃの端部を保持可能な保持部（不図示）が設けられている。回転駆動部６１ｂは、軸部６１ａを回転させる。回転駆動部６１ｂが軸部６１ａを回転させることで、基板Ｓの供給動作（巻き取り動作）が可能となっている。 The second unit part 22 has a second housing part 60 for housing the substrate. The second storage unit 60 is provided with a substrate driving unit 61 to which a substrate collection roller (collection roll) 61c around which the substrate S is wound is attached. The substrate driving unit 61 performs a recovery operation of recovering the substrate S supplied from the first unit unit 21 side by rotating the substrate S. The substrate drive unit 61 includes a shaft part (second shaft part) 61a and a rotation drive part (second drive part) 61b. The shaft portion 61a is formed in a cylindrical shape or a columnar shape, and is configured to be extendable. When the shaft portion 61a expands and contracts, it can be removed from between the first wall portion 60a and the second wall portion 60b, and the substrate recovery roller 61c can be mounted. The shaft portion 61a is arranged so that the axial direction of the central axis is parallel to the X-axis direction, for example. One end portion of the shaft portion 61a is supported by the second wall portion 60b of the second unit portion 22 so as to be rotatable in the circumferential direction. The shaft portion 61a is provided with a holding portion (not shown) that can hold the end portion of the substrate collection roller 61c. The rotation driving part 61b rotates the shaft part 61a. The rotation driving part 61b rotates the shaft part 61a, whereby the supply operation (winding operation) of the substrate S is possible.
　第二収容部６０は、保護基板供給ローラー６８ｃが取り付けられる保護基板駆動部（第二補助部）６８が設けられる。保護基板供給ローラー６８ｃには、基板Ｓの被処理面を覆う保護基板（保護フィルム）Ｃが巻き付けられている。保護基板駆動部６８は、保護基板供給ローラー６８ｃを回転させることによって、第一ユニット部２１側から供給される保護基板Ｃを回収する回収動作を行う。 The second housing portion 60 is provided with a protective substrate driving portion (second auxiliary portion) 68 to which the protective substrate supply roller 68c is attached. A protective substrate (protective film) C that covers the surface to be processed of the substrate S is wound around the protective substrate supply roller 68c. The protective substrate driving unit 68 performs a recovery operation of recovering the protective substrate C supplied from the first unit unit 21 side by rotating the protective substrate supply roller 68c.
　保護基板駆動部６８は、軸部６８ａ及び回転駆動部６８ｂを有する。軸部６８ａは、円筒状又は円柱状に形成されており、伸縮可能に構成されている。軸部６８ａが伸縮することによって、第一壁部６０ａと第二壁部６０ｂの間から取り外すことができ、保護基板供給ローラー６８ｃの装着が可能になる。軸部６８ａは、例えば中心軸の軸線方向がＸ軸方向に平行となるように配置されている。つまり、軸部６１ａ及び軸部６８ａは、中心軸の軸線方向が互いに平行となるように配置されている。軸部６８ａの一方の端部は、第二ユニット部２２の第二壁部６０ｂによって円周方向に回転可能に支持されている。軸部６８ａには、保護基板供給ローラー６８ｃの端部を保持可能な保持部（不図示）が設けられている。回転駆動部６８ｂは、軸部６８ａを回転させる。回転駆動部６８ｂが軸部６８ａを回転させることで、保護基板Ｃの供給動作（巻き取り動作）が可能となっている。保護基板駆動部６８には、送り出した保護基板Ｃを基板Ｓに重ねる機構（不図示）が設けられている。なお、保護基板Ｃが基板Ｓに重なった状態で基板駆動部６１に巻き取られる場合、第二ユニット部２２側の保護基板駆動部６８を省略することも可能である。 The protective substrate drive unit 68 includes a shaft portion 68a and a rotation drive portion 68b. The shaft portion 68a is formed in a cylindrical shape or a columnar shape, and is configured to be stretchable. When the shaft portion 68a expands and contracts, it can be removed from between the first wall portion 60a and the second wall portion 60b, and the protective substrate supply roller 68c can be attached. The shaft portion 68a is disposed so that, for example, the axial direction of the central axis is parallel to the X-axis direction. That is, the shaft portion 61a and the shaft portion 68a are arranged so that the axial directions of the central axes are parallel to each other. One end portion of the shaft portion 68a is supported by the second wall portion 60b of the second unit portion 22 so as to be rotatable in the circumferential direction. The shaft portion 68a is provided with a holding portion (not shown) that can hold the end portion of the protective substrate supply roller 68c. The rotation drive unit 68b rotates the shaft unit 68a. The rotation driving portion 68b rotates the shaft portion 68a, whereby the supply operation (winding operation) of the protective substrate C is possible. The protective substrate driving unit 68 is provided with a mechanism (not shown) for superimposing the sent protective substrate C on the substrate S. When the protective substrate C is wound on the substrate driving unit 61 in a state where the protective substrate C overlaps the substrate S, the protective substrate driving unit 68 on the second unit unit 22 side can be omitted.
　第二ユニット部２２は、基板側通信部（第二通信部）６３を有する。基板側通信部６３は、第二壁部６０ｂの＋Ｚ軸側端面に設けられている。基板側通信部６３は、例えば制御部ＣＯＮＴや第一ユニット部２１などとの間で通信可能である。 The second unit section 22 has a board side communication section (second communication section) 63. The board side communication part 63 is provided on the + Z-axis side end face of the second wall part 60b. The board side communication unit 63 can communicate with the control unit CONT, the first unit unit 21 and the like, for example.
　第二ユニット部２２は、接触抑制部６７を有する。接触抑制部６７は、第一壁部６０ａ及び第二壁部６０ｂの－Ｙ軸側の端面に設けられている。接触抑制部６７は、第一壁部６０ａ及び第二壁部６０ｂの－Ｙ軸側の端面が外部構造物に接触するのを抑制すると共に、接触時の衝撃を緩和する。接触抑制部６７は、例えば第一壁部６０ａ及び第二壁部６０ｂから－Ｙ軸側に突出した棒状部材と、前記棒状部材に対して作用する＋Ｙ軸方向の力を受ける弾性部材とを有する。 The second unit part 22 has a contact suppressing part 67. The contact suppression portion 67 is provided on the end surfaces on the −Y axis side of the first wall portion 60a and the second wall portion 60b. The contact suppressing portion 67 suppresses the −Y-axis side end surfaces of the first wall portion 60a and the second wall portion 60b from coming into contact with the external structure and mitigates an impact at the time of contact. The contact suppressing portion 67 includes, for example, a rod-like member that protrudes from the first wall portion 60a and the second wall portion 60b to the −Y-axis side, and an elastic member that receives a force in the + Y-axis direction that acts on the rod-like member. .
　可動部７１ａの＋Ｚ軸側の端面７１ｃには、溝部７０が形成されている。溝部７０は、前記端面７１ｃに対してＶ字状に形成されている。一方、第二ユニット部２２の－Ｚ軸側の端面６０ｅには４つの球状支持部６９が形成されている。前記４つの球状支持部６９は、それぞれ上記溝部７０に支持される。球状支持部６９が溝部７０に支持されることにより、第二ユニット部２２と筐体７１との間におけるＸ軸方向及びＹ軸方向への相対的な移動が規制される。なお、溝部７０及び球状支持部６９の数は、それぞれ３つであってもよい。 A groove portion 70 is formed on the end surface 71c on the + Z-axis side of the movable portion 71a. The groove portion 70 is formed in a V shape with respect to the end surface 71c. On the other hand, four spherical support portions 69 are formed on the end surface 60 e on the −Z-axis side of the second unit portion 22. The four spherical support portions 69 are supported by the groove portions 70, respectively. By supporting the spherical support portion 69 in the groove portion 70, relative movement in the X-axis direction and the Y-axis direction between the second unit portion 22 and the housing 71 is restricted. In addition, the number of the groove part 70 and the spherical support part 69 may be three, respectively.
　また、可動部７１ａには、着脱検出部６６が設けられている。着脱検出部６６は、第二ユニット部２２が筐体７１に装着されているか否かを検出する。着脱検出部６６としては、例えば溝部７０と球状支持部６９との間における電気抵抗値を検出するセンサや溝部７０における圧力を検出するセンサなど、各種センサを用いることができる。着脱検出部６６による検出結果は、例えば移動部側通信部６４から外部（制御部ＣＯＮＴ、基板側通信部６３など）に送信されるようになっている。 Further, the movable part 71a is provided with an attachment / detachment detection part 66. The attachment / detachment detection unit 66 detects whether or not the second unit unit 22 is attached to the housing 71. As the attachment / detachment detection unit 66, for example, various sensors such as a sensor for detecting an electric resistance value between the groove 70 and the spherical support 69 and a sensor for detecting a pressure in the groove 70 can be used. The detection result by the attachment / detachment detection unit 66 is transmitted from the moving unit side communication unit 64 to the outside (the control unit CONT, the substrate side communication unit 63, etc.), for example.
　また、第二ユニット部２２は、上記構成の他に、接続検出部（第二検出部）６５を有する。接続検出部６５は、第一ユニット部２１と第二ユニット部２２との間が接続されているか否かを検出する。接続検出部６５としては、第二接続部２３ｂの電気的特性を検出するセンサなどを用いることができる。接続検出部６５による検出結果は、例えば移動部側通信部６４から外部（制御部ＣＯＮＴ、基板側通信部６３など）に送信されるようになっている。 The second unit unit 22 includes a connection detection unit (second detection unit) 65 in addition to the above configuration. The connection detection unit 65 detects whether or not the first unit unit 21 and the second unit unit 22 are connected. As the connection detection unit 65, a sensor that detects the electrical characteristics of the second connection unit 23b can be used. The detection result by the connection detection unit 65 is transmitted from the mobile unit side communication unit 64 to the outside (control unit CONT, board side communication unit 63, etc.), for example.
　前述した移動部６２は、第二ユニット部２２を取り外し可能に支持する。移動部６２は、第二ユニット部２２をＸ軸方向、Ｙ軸方向及びＺ軸方向に移動させる。移動部６２は、筐体７１、キャスター７２、昇降部７３及びキャスター駆動部７４を有する。筐体７１は、可動部７１ａ及び基部７１ｂを有する。制御部ＣＯＮＴは、キャスター７２の回転速度を制御する。これにより、制御部ＣＯＮＴは、移動部６２の移動速度を制御可能である。また、移動部６２には、バッテリーなどの電源部（不図示）が設けられている。 The moving unit 62 described above supports the second unit unit 22 so as to be removable. The moving unit 62 moves the second unit unit 22 in the X axis direction, the Y axis direction, and the Z axis direction. The moving unit 62 includes a casing 71, casters 72, an elevating unit 73, and caster driving units 74. The casing 71 has a movable part 71a and a base part 71b. The control unit CONT controls the rotation speed of the caster 72. Thereby, the control part CONT can control the moving speed of the moving part 62. The moving unit 62 is provided with a power supply unit (not shown) such as a battery.
　前記第二ユニット部２２の移動部６２と、上記第一ユニット部２１の移動部４２とは、第一ユニット部２１及び第二ユニット部２２を相対移動させる移動機構２４を構成する。移動部４２及び移動部６２は、それぞれ第一ユニット部２１及び第二ユニット部２２を独立して駆動可能である。 The moving unit 62 of the second unit unit 22 and the moving unit 42 of the first unit unit 21 constitute a moving mechanism 24 that relatively moves the first unit unit 21 and the second unit unit 22. The moving part 42 and the moving part 62 can drive the first unit part 21 and the second unit part 22 independently.
　前述した移動部６２は、移動部側通信部（第二通信部）６４を有する。移動部側通信部６４は、筐体７１の内部に設けられている。移動部側通信部６４は、例えば制御部ＣＯＮＴや基板側通信部６３、第一ユニット部２１などとの間で通信可能である。基板側通信部６３及び移動部側通信部６４は、第二ユニット部２２の動作を制御するための第二制御信号を受信可能である。第二制御信号には、例えば移動部６２の移動動作を制御する信号や、第二ユニット部２２における基板Ｓの供給動作を制御する信号などが含まれる。 The moving unit 62 described above has a moving unit side communication unit (second communication unit) 64. The moving unit side communication unit 64 is provided inside the casing 71. The moving unit side communication unit 64 can communicate with, for example, the control unit CONT, the substrate side communication unit 63, the first unit unit 21, and the like. The board-side communication unit 63 and the moving unit-side communication unit 64 can receive a second control signal for controlling the operation of the second unit unit 22. The second control signal includes, for example, a signal for controlling the moving operation of the moving unit 62, a signal for controlling the supply operation of the substrate S in the second unit unit 22, and the like.
　移動部６２は、基板搬送制御部７７を有する。基板搬送制御部７７は、第一ユニット部２１及び第二ユニット部２２による基板Ｓ及び保護基板Ｃの搬送動作を制御する。基板搬送制御部７７は、移動部側通信部６４及び基板側通信部６３を介して軸部６１ａ及び軸部６８ａの回転速度を制御する。これにより、基板搬送制御部７７は、基板Ｓ及び保護基板Ｃの回収速度（巻き取り速度）を制御可能である。 The moving unit 62 has a substrate transfer control unit 77. The substrate transfer control unit 77 controls the transfer operation of the substrate S and the protective substrate C by the first unit unit 21 and the second unit unit 22. The substrate transfer control unit 77 controls the rotation speeds of the shaft portion 61a and the shaft portion 68a via the moving unit side communication unit 64 and the substrate side communication unit 63. Thereby, the board | substrate conveyance control part 77 can control the collection | recovery speed (winding speed) of the board | substrate S and the protective substrate C. FIG.
　また、基板搬送制御部７７は、例えば移動部側通信部６４及び第一ユニット部２１の基板側通信部４３を介して軸部４１ａ及び軸部４８ａの回転速度を制御する。これにより、基板搬送制御部７７は、基板Ｓ及び保護基板Ｃの供給速度（送り出し速度）を制御可能である。 Further, the substrate transfer control unit 77 controls the rotational speeds of the shaft portion 41a and the shaft portion 48a via, for example, the moving portion side communication portion 64 and the substrate side communication portion 43 of the first unit portion 21. As a result, the substrate transfer control unit 77 can control the supply speed (feed-out speed) of the substrate S and the protective substrate C.
　基板搬送制御部７７は、第二ユニット部２２のキャスター７２の回転速度を制御する。これにより、基板搬送制御部７７は、移動部６２による移動速度を制御可能である。また、基板搬送制御部７７は、移動部側通信部６４及び第一ユニット部２１の移動部側通信部４４を介して第一ユニット部２１のキャスター５２の回転速度を制御する。これにより、基板搬送制御部７７は、移動部４２の移動速度を制御可能である。 The substrate transfer control unit 77 controls the rotation speed of the caster 72 of the second unit unit 22. Thereby, the substrate conveyance control unit 77 can control the moving speed of the moving unit 62. The substrate transfer control unit 77 controls the rotation speed of the casters 52 of the first unit unit 21 via the moving unit side communication unit 64 and the moving unit side communication unit 44 of the first unit unit 21. Thereby, the board | substrate conveyance control part 77 can control the moving speed of the moving part 42. FIG.
　図５は、カセット装置２０の第一ユニット部２１と第二ユニット部２２とを接続させた状態を示す斜視図である。　
　図５に示すように、第一ユニット部２１及び第二ユニット部２２は、第一接続部２３ａと第二接続部２３ｂとが対向した状態で接続可能である。第一接続部２３ａと第二接続部２３ｂとの間は、電磁石の磁気力によって吸着されている。このように、カセット装置２０は、第一接続部２３ａ及び第二接続部２３ｂにより、第一ユニット部２１と第二ユニット部２２とを接続する接続部２３を備える。 FIG. 5 is a perspective view showing a state in which the first unit portion 21 and the second unit portion 22 of the cassette apparatus 20 are connected.
As shown in FIG. 5, the first unit portion 21 and the second unit portion 22 can be connected in a state where the first connection portion 23a and the second connection portion 23b face each other. The first connection portion 23a and the second connection portion 23b are attracted by the magnetic force of the electromagnet. As described above, the cassette device 20 includes the connection portion 23 that connects the first unit portion 21 and the second unit portion 22 by the first connection portion 23a and the second connection portion 23b.
　第一ユニット部２１が移動部４２の筐体５１に支持され、かつ、第二ユニット部２２が移動部６２の筐体７１に支持されている場合、第一ユニット部２１と第二ユニット部２２とが接続されることで、カセット装置２０が構成される。この場合、移動部４２及び移動部６２は、第一ユニット部２１と第二ユニット部２２とを接続した状態のまま一体的に移動させることができる。 When the first unit unit 21 is supported by the casing 51 of the moving unit 42 and the second unit unit 22 is supported by the casing 71 of the moving unit 62, the first unit unit 21 and the second unit unit 22 are supported. Are connected to each other to form the cassette device 20. In this case, the moving part 42 and the moving part 62 can be integrally moved while the first unit part 21 and the second unit part 22 are connected.
　また、第一ユニット部２１と第二ユニット部２２とが接続されている場合において、例えば第一接続部２３ａ及び第二接続部２３ｂに接続端子が設けられ、前記接続端子同士を接続することによって第一ユニット部２１と第二ユニット部２２との間で情報のやり取りが可能な構成としても良い。 Moreover, when the 1st unit part 21 and the 2nd unit part 22 are connected, a connection terminal is provided in the 1st connection part 23a and the 2nd connection part 23b, for example, and by connecting the said connection terminals It is good also as a structure which can exchange information between the 1st unit part 21 and the 2nd unit part 22. FIG.
　カセット装置２０は、第一ユニット部２１に設けられ、かつカバー部材ＣＶが装着される装着部８１を有する。さらに、カセット装置２０は、第二ユニット部２２に設けられ、かつカバー部材ＣＶが装着される装着部８２を有する。カバー部材ＣＶは、例えば埃などの異物が入らないように、第一ユニット部２１及び第二ユニット部２２の内部を封止する。カバー部材ＣＶは、第一ユニット部２１と第二ユニット部２２との間に跨って装着される。 The cassette device 20 includes a mounting portion 81 that is provided in the first unit portion 21 and on which the cover member CV is mounted. Further, the cassette device 20 includes a mounting portion 82 that is provided in the second unit portion 22 and to which the cover member CV is mounted. The cover member CV seals the inside of the first unit portion 21 and the second unit portion 22 so that foreign matter such as dust does not enter. The cover member CV is mounted across the first unit portion 21 and the second unit portion 22.
　図５のカバー部材ＣＶは、例えばＺ軸方向に着脱可能な構成が示されているが、これに限られることは無い。例えば、第一ユニット部２１の底部４０ｃ及び第二ユニット部２２の底部６０ｃに、カバー部材ＣＶを回転可能に取り付けてもよい。また、カバー部材ＣＶを伸縮又は折り畳み可能なシート状部材で形成し、このカバー部材ＣＶの一部を底部４０ｃに収容可能に構成しても良い。この場合、第一ユニット部２１の底部４０ｃにおける＋Ｙ軸側端部からカバー部材ＣＶを引き出し、第一ユニット部２１の＋Ｙ軸側の側面から＋Ｚ軸側の側面へと掛けることにより、第一ユニット部２１を覆うことができる。同様に、第二ユニット部２２の底部６０ｃの－Ｙ軸側端部からカバー部材ＣＶを引き出し、第二ユニット部２２の－Ｙ軸側の側面から＋Ｚ軸側の側面へと掛けることにより、第二ユニット部２２を覆うことができる。また、第一ユニット部２１側から第二ユニット部２２側へカバー部材ＣＶを巻き掛ける構成であっても良い。 The cover member CV in FIG. 5 is configured to be detachable in the Z-axis direction, for example, but is not limited thereto. For example, the cover member CV may be rotatably attached to the bottom portion 40 c of the first unit portion 21 and the bottom portion 60 c of the second unit portion 22. Further, the cover member CV may be formed of a sheet-like member that can be expanded and contracted, and a part of the cover member CV may be accommodated in the bottom portion 40c. In this case, the cover member CV is pulled out from the + Y-axis side end portion of the bottom portion 40c of the first unit portion 21, and is hung from the + Y-axis side surface of the first unit portion 21 to the + Z-axis side surface. The part 21 can be covered. Similarly, the cover member CV is pulled out from the −Y-axis side end of the bottom portion 60c of the second unit portion 22 and hung from the −Y-axis side side surface of the second unit portion 22 to the + Z-axis side surface. The two unit parts 22 can be covered. Moreover, the structure which winds the cover member CV from the 1st unit part 21 side to the 2nd unit part 22 side may be sufficient.
　図６は、処理部１０の構成を示す側面図である。図６では、保護基板Ｃ、保護基板駆動部４８及び保護基板駆動部６８の図示を省略する。　
　図６に示すように、処理部１０における基板Ｓの搬送方向に関し、上流側に第一ユニット部２１を配置し、下流側に第二ユニット部２２を配置する。そして、処理部１０は、第一ユニット部２１から供給され第二ユニット部２２へと搬送される基板Ｓの移動経路上で、前記基板Ｓの被処理面Ｓａに対して処理を行う。処理部１０は、処理装置１５、案内装置１６及びアライメント計測装置１７を有する。 FIG. 6 is a side view showing the configuration of the processing unit 10. In FIG. 6, illustration of the protective substrate C, the protective substrate driving unit 48, and the protective substrate driving unit 68 is omitted.
As shown in FIG. 6, the first unit unit 21 is arranged on the upstream side and the second unit unit 22 is arranged on the downstream side with respect to the transport direction of the substrate S in the processing unit 10. Then, the processing unit 10 processes the surface Sa of the substrate S on the movement path of the substrate S supplied from the first unit unit 21 and transported to the second unit unit 22. The processing unit 10 includes a processing device 15, a guide device 16, and an alignment measurement device 17.
　処理装置１５は、基板Ｓの被処理面Ｓａに対して例えば有機ＥＬ素子を形成するための各種装置を有する。このような装置としては、例えば被処理面Ｓａ上に隔壁を形成するための隔壁形成装置、電極を形成するための電極形成装置、発光層を形成するための発光層形成装置などが挙げられる。より具体的には、液滴塗布装置（例えばインクジェット型塗布装置など）、成膜装置（膜形成装置、例えば蒸着装置、スパッタリング装置）、露光装置、現像装置、表面改質装置、洗浄装置、乾燥装置、基板を検査する検査装置などが挙げられる。これらの各装置は、基板Ｓの搬送経路に沿って適宜設けられる。 The processing apparatus 15 includes various apparatuses for forming, for example, organic EL elements on the surface Sa to be processed of the substrate S. Examples of such an apparatus include a partition forming apparatus for forming a partition on the surface Sa, an electrode forming apparatus for forming an electrode, and a light emitting layer forming apparatus for forming a light emitting layer. More specifically, a droplet coating apparatus (for example, an ink jet type coating apparatus), a film forming apparatus (a film forming apparatus, for example, a vapor deposition apparatus, a sputtering apparatus), an exposure apparatus, a developing apparatus, a surface modifying apparatus, a cleaning apparatus, and a drying apparatus. Examples thereof include an apparatus and an inspection apparatus for inspecting a substrate. Each of these apparatuses is appropriately provided along the transport path of the substrate S.
　本実施形態では、処理装置１５は、基板Ｓに現像処理を行うための現像液１１ｂを収容する現像液収容容器１１ａを備える現像装置１１と、基板Ｓを洗浄する洗浄液１２ｂを収容するために洗浄液収容容器１２ａを備える洗浄装置１２とを有する。なお、処理装置１５は、上述した液体以外を用いた処理を行う装置を収容することが可能である。 In the present embodiment, the processing device 15 includes a developing device 11 including a developing solution container 11a for storing a developing solution 11b for performing a developing process on the substrate S, and a cleaning solution for storing a cleaning solution 12b for cleaning the substrate S. It has the washing | cleaning apparatus 12 provided with the storage container 12a. In addition, the processing apparatus 15 can accommodate the apparatus which performs the process using other than the liquid mentioned above.
　案内装置１６は、現像側案内部１３と、洗浄側案内部１４とを有する。現像側案内部１３は、第一パッド１３ａ、第二パッド１３ｄ、第一ローラー１３ｂ及び第二ローラー１３ｃを有する。 The guide device 16 includes a development side guide unit 13 and a cleaning side guide unit 14. The development side guide unit 13 includes a first pad 13a, a second pad 13d, a first roller 13b, and a second roller 13c.
　第一パッド１３ａは、処理装置１５の内部に固定されており、第一ユニット部２１から供給された基板Ｓを現像液収容容器１１ａに案内する。第二パッド１３ｄは、処理装置１５の内部に固定されており、現像液１１ｂを通過した基板Ｓを現像液収容容器１１ａの外部に案内する。 The first pad 13a is fixed inside the processing apparatus 15, and guides the substrate S supplied from the first unit unit 21 to the developer container 11a. The second pad 13d is fixed inside the processing apparatus 15, and guides the substrate S that has passed through the developer 11b to the outside of the developer container 11a.
　第一ローラー１３ｂ及び第二ローラー１３ｃは、現像液収容容器１１ａに対して上下方向（Ｚ軸方向）に移動可能に設けられている。第一パッド１３ａと第一ローラー１３ｂとの間、及び第二パッド１３ｄと第二ローラー１３ｃとの間に基板Ｓを搬入した後、第一ローラー１３ｂ及び第二ローラー１３ｃを現像液収容容器１１ａ側（下方、すなわち－Ｚ軸方向）に移動させることで、第一パッド１３ａで基板Ｓの搬送方向が－Ｚ軸方向に変更され、かつ基板Ｓが現像液１１ｂに浸される共に、基板Ｓが現像液１１ｂの内部を通過するように案内されることが可能になる。 The first roller 13b and the second roller 13c are provided so as to be movable in the vertical direction (Z-axis direction) with respect to the developer container 11a. After loading the substrate S between the first pad 13a and the first roller 13b and between the second pad 13d and the second roller 13c, the first roller 13b and the second roller 13c are moved to the developer container 11a side. By moving downward (ie, in the −Z-axis direction), the transport direction of the substrate S is changed to the −Z-axis direction by the first pad 13a, and the substrate S is immersed in the developer 11b. It can be guided to pass through the inside of the developer 11b.
　洗浄側案内部１４は、第一パッド１４ａ、第二パッド１４ｄ、第一ローラー１４ｂ及び第二ローラー１４ｃを有する。洗浄側案内部１４の各ローラーは、現像側案内部１３の各ローラーと同様の構成であるため、説明を省略する。 The cleaning-side guide unit 14 includes a first pad 14a, a second pad 14d, a first roller 14b, and a second roller 14c. Since each roller of the cleaning side guide unit 14 has the same configuration as each roller of the development side guide unit 13, the description thereof is omitted.
　また、現像側案内部１３の第一パッド１３ａ及び第二パッド１３ｄと、洗浄側案内部１４の第一パッド１４ａ及び第二パッド１４ｄは、基板Ｓの被処理面Ｓａの裏面を案内する。したがって、これら第一パッド１３ａ、第二パッド１３ｄ、第一パッド１４ａ及び第二パッド１４ｄは、それぞれシリンドリカル状の案内面を有し、この案内面から気体を噴出する不図示の噴出口を複数有しており、案内面上に気体の層を形成することができる構成となっている。この気体の層により、案内面において基板Ｓの裏面（被処理面Ｓａの反対側の面）に対して非接触で案内することができるようになっている。なお、第一パッド１３ａ及び第二パッド１３ｄに交替して、回転ローラーを用いてもよい。回転ローラーを用いる場合には、回転ローラーの案内面に基板Ｓの裏面が接触した状態で、回転ローラーが基板Ｓを案内することになる。 Further, the first pad 13a and the second pad 13d of the developing side guide unit 13 and the first pad 14a and the second pad 14d of the cleaning side guide unit 14 guide the back surface of the processing surface Sa of the substrate S. Accordingly, each of the first pad 13a, the second pad 13d, the first pad 14a, and the second pad 14d has a cylindrical guide surface, and has a plurality of jetting ports (not shown) that eject gas from the guide surface. The gas layer can be formed on the guide surface. By this gas layer, the guide surface can be guided in a non-contact manner with respect to the back surface of the substrate S (the surface opposite to the surface Sa to be processed). A rotating roller may be used instead of the first pad 13a and the second pad 13d. When the rotating roller is used, the rotating roller guides the substrate S in a state where the back surface of the substrate S is in contact with the guide surface of the rotating roller.
　アライメント計測装置１７は、基板Ｓのエッジ部、又は基板Ｓに設けられているアライメントマークを計測し、その計測結果に基づいて、基板Ｓに対してアライメント動作を行う。アライメント計測装置１７は、基板Ｓのエッジ部、又はアライメントマークを検出するアライメントカメラや、前記アライメントカメラの検出結果に基づいて基板Ｓの位置（例えば、基板Ｓの幅の方向の位置）及び姿勢（例えば、搬送方向に対する傾き）の少なくとも一方を調整する調整装置などを有する。基板Ｓの位置計測、速度計測として、光学マウスのような方式で、基板Ｓ上にレーザ光を投射し、基板Ｓ上に生じるスペックルパターンの変化を光電検出する方式を用いることもできる。 The alignment measuring device 17 measures an edge portion of the substrate S or an alignment mark provided on the substrate S, and performs an alignment operation on the substrate S based on the measurement result. The alignment measurement device 17 is configured to detect an edge portion of the substrate S or an alignment camera that detects an alignment mark, and a position (for example, a position in the width direction of the substrate S) and posture (based on a detection result of the alignment camera). For example, an adjustment device that adjusts at least one of (tilt with respect to the conveyance direction) is included. As the position measurement and speed measurement of the substrate S, a method of projecting a laser beam on the substrate S by a method like an optical mouse and photoelectrically detecting a change in a speckle pattern generated on the substrate S can be used.
　次に、上記のように構成された基板処理装置１００の動作を説明する。図７～図１２は、基板処理装置１００の動作を示す図である。図７～図１２では、保護基板Ｃ、保護基板駆動部４８及び保護基板駆動部６８の図示を省略する。　
　まず、搬送機構２４のうち軸部４１ａと軸部６１ａとの間に基板Ｓを掛け渡す動作を行う場合について説明する。以降の動作では、制御部ＣＯＮＴが例えば基板側通信部４３及び基板側通信部６３や、移動部側通信部４４及び移動部側通信部６４に対して通信することで各部を制御する場合を例に挙げて説明する。 Next, the operation of the substrate processing apparatus 100 configured as described above will be described. 7 to 12 are diagrams illustrating the operation of the substrate processing apparatus 100. FIG. 7 to 12, the illustration of the protective substrate C, the protective substrate drive unit 48, and the protective substrate drive unit 68 is omitted.
First, the case where the operation | movement which spans the board | substrate S between the axial part 41a and the axial part 61a among the conveyance mechanisms 24 is demonstrated. In the subsequent operations, for example, the control unit CONT controls each unit by communicating with, for example, the substrate-side communication unit 43 and the substrate-side communication unit 63, or the mobile unit-side communication unit 44 and the mobile unit-side communication unit 64. Will be described.
　まず、第一ユニット部２１が移動部４２に支持された第一ユニット部２１と、第二ユニット部２２が移動部６２に支持された第二ユニット部２２とを、それぞれ複数バッファ部ＢＦに待機させる。制御部ＣＯＮＴは、一組の第一ユニット部２１及び第二ユニット部２２について、第一接続部２３ａと第二接続部２３ｂとの間を吸着させて第一収容部４０と第二収容部６０とを接続させる。これにより、前記第一ユニット部２１及び第二ユニット部２２は一体的に移動可能となる。 First, the first unit unit 21 in which the first unit unit 21 is supported by the moving unit 42 and the second unit unit 22 in which the second unit unit 22 is supported by the moving unit 62 are respectively held in the plurality of buffer units BF. Let The control part CONT makes the first storage part 40 and the second storage part 60 adsorb between the first connection part 23a and the second connection part 23b for the pair of the first unit part 21 and the second unit part 22. And connect. Thereby, the first unit part 21 and the second unit part 22 can be moved integrally.
　制御部ＣＯＮＴは、まずバッファ部ＢＦからガイドレール３０上へと第一ユニット部２１と第二ユニット部２２とを一体的に移動させる。その後、制御部ＣＯＮＴは、図７に示すように、前記第一ユニット部２１と第二ユニット部２２とをガイドレール３０に沿って移動させ、第三レール３３の＋Ｙ軸側端部、すなわち第一レール３１に配置させる。なお、第一ユニット部２１の軸部４１ａにはロール状の基板Ｓを取り付けておく。基板Ｓの先端Ｓｆには、例えば図７に示す構成ではリーダＬｆが取り付けられているが、前記リーダＬｆが省略された構成であっても良い。 The control unit CONT first moves the first unit unit 21 and the second unit unit 22 integrally from the buffer unit BF onto the guide rail 30. Thereafter, as shown in FIG. 7, the control unit CONT moves the first unit portion 21 and the second unit portion 22 along the guide rail 30, so that the + Y-axis side end portion of the third rail 33, that is, the first One rail 31 is disposed. A roll-shaped substrate S is attached to the shaft portion 41 a of the first unit portion 21. For example, in the configuration shown in FIG. 7, the reader Lf is attached to the tip Sf of the substrate S. However, the reader Lf may be omitted.
　次に、制御部ＣＯＮＴは、回転駆動部４１ｂによって軸部４１ａを回転させる。この動作により、基板Ｓの先端Ｓｆが軸部６１ａ側へ送り出され、基板Ｓの先端Ｓｆが軸部６１ａに到達して前記軸部６１ａに巻き掛けられる。なお、基板Ｓの先端Ｓｆを軸部６１ａに巻きかける操作は、自動化されていてもよいが、人手によって、先端Ｓｆを軸部６１ａに、固定テープ等を用いて貼り付けてもよい。 Next, the control part CONT rotates the shaft part 41a by the rotation drive part 41b. By this operation, the tip Sf of the substrate S is sent to the shaft portion 61a side, and the tip Sf of the substrate S reaches the shaft portion 61a and is wound around the shaft portion 61a. Note that the operation of winding the tip Sf of the substrate S around the shaft portion 61a may be automated, but the tip Sf may be affixed to the shaft portion 61a using a fixing tape or the like manually.
　制御部ＣＯＮＴは、基板Ｓの先端Ｓｆが軸部６１ａに掛けられた後、第一ユニット部２１と第二ユニット部２２との接続を切り離す。これにより、第一ユニット部２１と第二ユニット部２２とが、独立して移動可能となる。その後、制御部ＣＯＮＴは、軸部４１ａを回転させて基板Ｓを送り出しつつ、第二ユニット部２２を第三レール３３に沿って－Ｙ軸方向へ移動させる。 The control unit CONT disconnects the connection between the first unit unit 21 and the second unit unit 22 after the tip Sf of the substrate S is hung on the shaft unit 61a. Thereby, the 1st unit part 21 and the 2nd unit part 22 become movable independently. Thereafter, the control part CONT moves the second unit part 22 along the third rail 33 in the −Y-axis direction while rotating the shaft part 41a to send out the substrate S.
　制御部ＣＯＮＴは、第二ユニット部２２が第三レール３３の－Ｙ軸側端部、すなわち、第二レール３２に到達するまで、第二ユニット部２２を移動させる。第二ユニット部２２が移動する間、第一ユニット部２１は第一レール３１に配置された状態を維持する。この動作により、図８に示すように、第一ユニット部２１が第一レール３１に配置され、第二ユニット部２２が第二レール３２に配置される。また、基板Ｓの先端Ｓｆが軸部６１ａに掛けられた状態で－Ｙ軸方向へ引き出されることになる。 The control unit CONT moves the second unit unit 22 until the second unit unit 22 reaches the −Y-axis side end of the third rail 33, that is, the second rail 32. While the 2nd unit part 22 moves, the 1st unit part 21 maintains the state arrange | positioned at the 1st rail 31. FIG. With this operation, as shown in FIG. 8, the first unit portion 21 is disposed on the first rail 31, and the second unit portion 22 is disposed on the second rail 32. Further, the front end Sf of the substrate S is pulled out in the −Y-axis direction in a state where it is hung on the shaft portion 61a.
　その後、制御部ＣＯＮＴは、処理装置１５の現像側案内部１３の第一ローラー１３ｂ及び第二ローラー１３ｃと、洗浄側案内部１４の第一ローラー１４ｂ及び第二ローラー１４ｃとを上方（＋Ｚ軸方向）へ移動させておく。これにより、第一ローラー１３ｂ及び第二ローラー１３ｃと現像液収容容器１１ａ（すなわち、第一パッド１３ａ及び第二パッド１３ｄ）との間、第一ローラー１４ｂ及び第二ローラー１４ｃと洗浄液収容容器１２ａ（すなわち、第三パッド１４ａ及び第四パッド１４ｄ）との間に、基板Ｓが通過可能な隙間が形成される。 Thereafter, the control unit CONT moves the first roller 13b and the second roller 13c of the developing side guide unit 13 of the processing apparatus 15 upward and the first roller 14b and the second roller 14c of the cleaning side guide unit 14 upward (+ Z-axis direction). ). Thereby, between the 1st roller 13b and the 2nd roller 13c, and the developing solution storage container 11a (namely, the 1st pad 13a and the 2nd pad 13d), the 1st roller 14b and the 2nd roller 14c, and the washing | cleaning liquid storage container 12a ( That is, a gap through which the substrate S can pass is formed between the third pad 14a and the fourth pad 14d).
　制御部ＣＯＮＴは、軸部４１ａと軸部６１ａとの間に掛け渡された基板Ｓに対して、Ｙ軸方向に適度なテンションを与え、基板Ｓがその隙間を通れるようにする。基板Ｓのテンションは、例えば基板搬送制御部７７を用いて第二ユニット部２２側を制御することで調整することができる。 The control unit CONT applies an appropriate tension in the Y-axis direction to the substrate S spanned between the shaft portion 41a and the shaft portion 61a so that the substrate S can pass through the gap. The tension of the substrate S can be adjusted, for example, by controlling the second unit unit 22 side using the substrate transfer control unit 77.
　この状態で、制御部ＣＯＮＴは、図９に示すように、回転駆動部４１ｂ及び回転駆動部６１ｂによって第一ユニット部２１及び第二ユニット部２２を同期させて、それぞれ第一レール３１上及び第二レール３２上を処理装置１５側（＋Ｘ軸方向）に移動させる。この状態で、基板ＳはＺ軸方向において第一ローラー１３ｂ及び第二ローラー１３ｃと現像液収容容器１１ａとの間、第一ローラー１４ｂ及び第二ローラー１４ｃと洗浄液収容容器１２ａとの間に、それぞれ配置されることになる。 In this state, the control part CONT synchronizes the first unit part 21 and the second unit part 22 with the rotation drive part 41b and the rotation drive part 61b, as shown in FIG. The two rails 32 are moved to the processing device 15 side (+ X axis direction). In this state, the substrate S is located between the first roller 13b and the second roller 13c and the developer container 11a in the Z-axis direction, and between the first roller 14b and the second roller 14c and the cleaning liquid container 12a, respectively. Will be placed.
　制御部ＣＯＮＴは、まず、軸部４１ａ及び軸部６１ａを回転させて基板Ｓを－Ｙ軸方向に送りつつ、現像側案内部１３の第一ローラー１３ｂ及び第二ローラー１３ｃを－Ｚ軸方向に移動させる。これにより、基板Ｓが現像液１１ｂに浸され、基板Ｓに対して現像処理が行われる。その後、制御部ＣＯＮＴは、軸部４１ａ及び軸部６１ａを回転させて基板Ｓを－Ｙ軸方向に送り出す。この動作により、基板Ｓのうち現像液１１ｂを通過した部分が洗浄装置１２に到達する。 First, the control part CONT rotates the shaft part 41a and the shaft part 61a to feed the substrate S in the -Y-axis direction, while moving the first roller 13b and the second roller 13c of the development side guide part 13 in the -Z-axis direction. Move. As a result, the substrate S is immersed in the developer 11b, and the substrate S is developed. Thereafter, the control part CONT rotates the shaft part 41a and the shaft part 61a to send the substrate S in the −Y-axis direction. By this operation, the portion of the substrate S that has passed the developing solution 11b reaches the cleaning device 12.
　次に、制御部ＣＯＮＴは、軸部４１ａ及び軸部６１ａを回転させて基板Ｓを－Ｙ軸方向に送りつつ、洗浄側案内部１４の第一ローラー１４ｂ及び第二ローラー１４ｃを－Ｚ軸方向に移動させる。これにより、基板Ｓが洗浄液１２ｂに浸され、基板Ｓに対して現像処理が行われる。 Next, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to feed the substrate S in the −Y axis direction, while moving the first roller 14b and the second roller 14c of the cleaning side guide portion 14 in the −Z axis direction. Move to. Accordingly, the substrate S is immersed in the cleaning liquid 12b, and the development process is performed on the substrate S.
　このとき、図１０に示すように、基板Ｓのうち搬送方向（－Ｙ軸方向）の上流側には現像処理が施され、搬送方向の下流側には洗浄処理が施される。その後、制御部ＣＯＮＴは、軸部４１ａ及び軸部６１ａを回転させて基板Ｓを－Ｙ軸方向に送り出す。この動作により、基板Ｓのうち洗浄液１２ｂを通過した部分が洗浄装置１２から外部に送り出される。 At this time, as shown in FIG. 10, development processing is performed on the upstream side in the transport direction (−Y-axis direction) of the substrate S, and cleaning processing is performed on the downstream side in the transport direction. Thereafter, the control part CONT rotates the shaft part 41a and the shaft part 61a to send the substrate S in the −Y-axis direction. By this operation, the portion of the substrate S that has passed the cleaning liquid 12b is sent out from the cleaning device 12 to the outside.
　図１０に示すように、基板Ｓの裏面（被処理面Ｓａの反対側の面）を支持するのは、現像側案内部１３においては第一パッド１３ａ及び第二パッド１３ｄであり、洗浄側案内部１４においては第一パッド１４ａ及び第二パッド１４ｄであるため、それらのパッドの案内面上に形成される気体層によって、裏面に対して非接触の状態で基板Ｓを搬送することができる。 As shown in FIG. 10, it is the first pad 13a and the second pad 13d that support the back surface of the substrate S (the surface opposite to the surface Sa to be processed). Since the portion 14 is the first pad 14a and the second pad 14d, the substrate S can be conveyed in a non-contact state with respect to the back surface by the gas layer formed on the guide surfaces of the pads.
　制御部ＣＯＮＴは、現像装置１１及び洗浄装置１２の処理速度に応じて、軸部４１ａから軸部６１ａへと移動する基板Ｓの移動速度を調整する。また、制御部ＣＯＮＴは、図１１に示すように、軸部４１ａに巻かれた基板Ｓの巻き径Ｒ１と、軸部６１ａに巻かれた基板Ｓの巻き径Ｒ２と、に応じて、回転駆動部４１ｂ及び回転駆動部６１ｂにおける駆動速度を調整させる。この動作により、搬送速度が一定のまま基板Ｓが搬送されることになる。基板Ｓの速度のモニターは、図３のアライメント計測装置１７が、基板Ｓに設けられているアライメントマークを計測するタイミング（時間）によっても行われる。また、基板Ｓの巻き径Ｒ１、基板Ｓの巻き径Ｒ２の変化により昇降部５３及び昇降部７３を調整してもよい。 The control unit CONT adjusts the moving speed of the substrate S moving from the shaft portion 41a to the shaft portion 61a according to the processing speed of the developing device 11 and the cleaning device 12. Further, as shown in FIG. 11, the control unit CONT is driven to rotate according to the winding diameter R1 of the substrate S wound around the shaft portion 41a and the winding diameter R2 of the substrate S wound around the shaft portion 61a. The drive speed in the part 41b and the rotation drive part 61b is adjusted. By this operation, the substrate S is transported while the transport speed is constant. The speed of the substrate S is also monitored by the timing (time) at which the alignment measuring device 17 in FIG. 3 measures the alignment mark provided on the substrate S. Further, the elevating unit 53 and the elevating unit 73 may be adjusted by changing the winding diameter R1 of the substrate S and the winding diameter R2 of the substrate S.
　現像処理及び洗浄処理が終了した後、制御部ＣＯＮＴは、軸部４１ａ及び軸部６１ａを回転させて基板Ｓを－Ｙ軸方向に送りつつ、現像側案内部１３の第一ローラー１３ｂ及び第二ローラー１３ｃを＋Ｚ軸方向に移動させると共に、洗浄側案内部１４の第一ローラー１４ｂ及び第二ローラー１４ｃを＋Ｚ軸方向に移動させる。 After the development process and the cleaning process are completed, the control part CONT rotates the shaft part 41a and the shaft part 61a to feed the substrate S in the −Y-axis direction, while the first roller 13b and the second roller 13b of the development side guide part 13 are fed. While moving the roller 13c in the + Z-axis direction, the first roller 14b and the second roller 14c of the cleaning side guide unit 14 are moved in the + Z-axis direction.
　その後、制御部ＣＯＮＴは、図１２に示すように、移動部４２及び移動部６２の同期制御によって第一ユニット部２１及び第二ユニット部２２を同期させて、それぞれ第一レール３１及び第二レール３２に沿って＋Ｘ軸方向へ移動させる。この動作により、処理装置１５から＋Ｘ軸側へ退避した状態となる。制御部ＣＯＮＴは、第一ユニット部２１及び第二ユニット部２２が第三レール３３まで到達した後、前記第一ユニット部２１及び第二ユニット部２２の移動を停止させる。 Thereafter, as shown in FIG. 12, the control part CONT synchronizes the first unit part 21 and the second unit part 22 by the synchronous control of the moving part 42 and the moving part 62, and the first rail 31 and the second rail, respectively. 32 along the + X axis direction. By this operation, the processing device 15 is retracted to the + X axis side. The control part CONT stops the movement of the first unit part 21 and the second unit part 22 after the first unit part 21 and the second unit part 22 reach the third rail 33.
　制御部ＣＯＮＴは、第一ユニット部２１及び第二ユニット部２２の移動を停止させた後、軸部６１ａを回転させつつ第二ユニット部２２を＋Ｙ軸方向へ移動させる。この動作により、軸部６１ａが基板Ｓを巻き取りながら軸部４１ａと軸部６１ａとが再び近づき、第一ユニット部２１の第一接続部２３ａと第二ユニット部２２の第二接続部２３ｂとが当接する。その後、制御部ＣＯＮＴは、電磁石を起動させて第一接続部２３ａと第二接続部２３ｂとを吸着させる。これにより、第一収容部４０と第二収容部６０とが再度接続され、第一ユニット部２１と第二ユニット部２２とが一体化される。その後、制御部ＣＯＮＴは、一体化された状態の第一ユニット部２１及び第二ユニット部２２を、第一レール３１、第二レール３２及び第三レール３３に沿って適宜移動させる。以上の動作において、制御部ＣＯＮＴは、第一ユニット部２１及び第二ユニット部２２同士が衝突したり混雑したりすることが無いように、位置検出部５５及び位置検出部（第一検出部）７５によって検出された位置情報を用いて適宜第一ユニット部２１及び第二ユニット部２２の配置を整理させる。 The control unit CONT stops the movement of the first unit unit 21 and the second unit unit 22, and then moves the second unit unit 22 in the + Y-axis direction while rotating the shaft unit 61a. By this operation, the shaft portion 61a winds up the substrate S, the shaft portion 41a and the shaft portion 61a approach again, and the first connection portion 23a of the first unit portion 21 and the second connection portion 23b of the second unit portion 22 Abut. Thereafter, the control part CONT activates the electromagnet to attract the first connection part 23a and the second connection part 23b. Thereby, the 1st accommodating part 40 and the 2nd accommodating part 60 are connected again, and the 1st unit part 21 and the 2nd unit part 22 are integrated. Thereafter, the control unit CONT appropriately moves the integrated first unit unit 21 and second unit unit 22 along the first rail 31, the second rail 32, and the third rail 33. In the above operation, the control unit CONT has the position detection unit 55 and the position detection unit (first detection unit) so that the first unit unit 21 and the second unit unit 22 do not collide with each other or are congested. The arrangement of the first unit portion 21 and the second unit portion 22 is appropriately arranged using the position information detected by 75.
　以上のように、本実施形態のカセット装置は、可撓性を有する基板Ｓの供給を行う基板駆動部４１を有する第一ユニット部２１と、前記第一ユニット部２１との間で着脱可能に設けられ、基板駆動部４１との間で基板Ｓの回収を行う基板駆動部６１を有する第二ユニット部２２とを備えるので、前記第一ユニット部２１と第二ユニット部２２との間で基板Ｓの供給及び回収が完結することになる。これにより、送り出されてから巻き取られるまで掛け渡される基板Ｓの寸法が長くなるのを抑えることができるため、搬送時の基板Ｓの管理負担を低減することができる。 As described above, the cassette apparatus of the present embodiment is detachable between the first unit unit 21 having the substrate driving unit 41 that supplies the flexible substrate S and the first unit unit 21. And a second unit unit 22 having a substrate driving unit 61 that collects the substrate S between the substrate driving unit 41 and the substrate driving unit 41. Therefore, the substrate between the first unit unit 21 and the second unit unit 22 is provided. The supply and recovery of S will be completed. Thereby, since it can suppress that the dimension of the board | substrate S spanned from sending out to winding up can be suppressed, the management burden of the board | substrate S at the time of conveyance can be reduced.
　［第二実施形態］　
　次に、第二実施形態を説明する。　
　図１３は、本実施形態に係る基板処理装置２００の構成を模式的に示す図である。　
　図１３に示すように、本実施形態では、基板処理装置２００がＺ軸方向に複数階層（図１３では３階層）に形成されている。基板処理装置２００は、各階に処理部１０及びカセット装置２０を有する。また、各階の床面ＦＬ１、床面ＦＬ２及び床面ＦＬ３には、それぞれ処理部１０に沿ってガイドレール３０が形成されている。 [Second Embodiment]
Next, a second embodiment will be described.
FIG. 13 is a diagram schematically showing the configuration of the substrate processing apparatus 200 according to the present embodiment.
As shown in FIG. 13, in this embodiment, the substrate processing apparatus 200 is formed in a plurality of layers (three layers in FIG. 13) in the Z-axis direction. The substrate processing apparatus 200 includes a processing unit 10 and a cassette device 20 on each floor. In addition, guide rails 30 are formed along the processing unit 10 on the floor surface FL1, the floor surface FL2, and the floor surface FL3 of each floor.
　カセット装置２０は、上記実施形態と同様の構成を有する。つまり、第一ユニット部２１と筐体５１との間は着脱可能に設けられている。また、第二ユニット部２２と筐体７１との間は着脱可能に設けられている。また、第一ユニット部２１と第二ユニット部２２との間は、着脱可能に設けられている。 The cassette device 20 has the same configuration as the above embodiment. That is, the first unit portion 21 and the housing 51 are detachably provided. Moreover, it is provided between the 2nd unit part 22 and the housing | casing 71 so that attachment or detachment is possible. Moreover, it is provided between the 1st unit part 21 and the 2nd unit part 22 so that attachment or detachment is possible.
　図１４は、基板処理装置２００の構成を示す断面図である。　
　図１４に示すように、基板処理装置２００は、３つの処理室１１１～１１３を有する。処理室１１１～１１３は、仕切り部１１４によって仕切られている。仕切り部１１４は、処理室１１１の床面ＦＬ１を構成する仕切り部材１１４ａと、処理室１１１の天井部及び処理室１１２の床面ＦＬ２を構成する仕切り部材１１４ｂと、処理室１１２の天井部及び処理室１１３の床面ＦＬ３を構成する仕切り部材１１４ｃと、処理室１１３の天井部を構成する仕切り部材１１４ｄとを備える。 FIG. 14 is a cross-sectional view showing the configuration of the substrate processing apparatus 200.
As shown in FIG. 14, the substrate processing apparatus 200 includes three processing chambers 111 to 113. The processing chambers 111 to 113 are partitioned by a partition 114. The partition 114 includes a partition member 114a that forms the floor surface FL1 of the processing chamber 111, a ceiling member of the processing chamber 111 and a partition member 114b that forms the floor surface FL2 of the processing chamber 112, and the ceiling and processing of the processing chamber 112. The partition member 114c which comprises the floor surface FL3 of the chamber 113, and the partition member 114d which comprises the ceiling part of the process chamber 113 are provided.
　処理室１１１は、複数の処理室の中で、重力方向の最下部（最も－Ｚ軸側）に配置されている。処理室１１１は、基板Ｓに対して液体を用いた処理（ウェット処理）を行う処理空間を形成している。処理室１１１には、例えば図１４に示すように、処理装置１１０として、基板Ｓに塗布するためのレジスト液を収容するレジスト液収容容器１４１ａを備える塗布装置１４１と、基板Ｓに現像処理を行うための現像液を収容する現像液収容容器１４２ａを備える現像装置１４２と、基板Ｓを洗浄する洗浄液を収容するために洗浄液収容容器１４３ａを備える洗浄装置１４３と、洗浄処理後の基板Ｓに対してパターンを形成するための鍍金液を収容する鍍金液収容容器１４４ａを備える鍍金装置１４４と、が設けられている。なお、処理室１１１には、上述した液体以外を用いた処理を行う装置を収容することが可能である。 The processing chamber 111 is disposed at the lowermost portion (most on the −Z axis side) in the gravity direction among the plurality of processing chambers. The processing chamber 111 forms a processing space for performing processing (wet processing) using a liquid on the substrate S. In the processing chamber 111, for example, as shown in FIG. 14, as a processing apparatus 110, the coating apparatus 141 including a resist solution storage container 141 a that stores a resist solution for applying to the substrate S, and the substrate S are subjected to development processing. A developing device 142 including a developing solution storage container 142a for storing a developing solution for cleaning, a cleaning device 143 including a cleaning solution storage container 143a for storing a cleaning solution for cleaning the substrate S, and a substrate S after cleaning processing And a plating apparatus 144 including a plating solution storage container 144a for storing a plating solution for forming a pattern. Note that the processing chamber 111 can accommodate an apparatus that performs processing using a liquid other than the liquid described above.
　仕切り部材１１４ａには、不図示の回収装置に接続された廃液回収流路の一部を構成する複数の回収管１４５が設けられている。回収管１４５の一端部は、塗布装置１４１、現像装置１４２及び洗浄装置１４３のそれぞれに接続され、他端部は、回収装置に接続された不図示の廃液回収流路に接続されている。各回収管１４５は、塗布装置１４１、現像装置１４２及び洗浄装置１４３において廃液となったレジスト液、現像液及び洗浄液を、廃液回収流路を介して回収装置に排出する。回収管１４５には、不図示の開閉弁などが設けられている。制御部ＣＯＮＴは、前記開閉弁の開閉のタイミングを制御可能である。本実施形態では、重力方向の最下部の処理室１１１にウェット処理用の装置が設けられているため、これらの装置と回収装置との間の廃液回収流路の流路系の長さを抑えることができる。 The partition member 114a is provided with a plurality of recovery pipes 145 that constitute a part of a waste liquid recovery flow path connected to a recovery device (not shown). One end of the recovery tube 145 is connected to each of the coating device 141, the developing device 142, and the cleaning device 143, and the other end is connected to a waste liquid recovery channel (not shown) connected to the recovery device. Each recovery tube 145 discharges the resist solution, the developing solution, and the cleaning solution, which have become waste liquids in the coating device 141, the developing device 142, and the cleaning device 143, to the recovery device through the waste liquid recovery channel. The recovery pipe 145 is provided with an open / close valve (not shown). The control part CONT can control the opening / closing timing of the on-off valve. In this embodiment, since the apparatus for wet processing is provided in the lowermost processing chamber 111 in the gravity direction, the length of the flow path system of the waste liquid recovery flow path between these apparatuses and the recovery apparatus is suppressed. be able to.
　処理室１１２は、処理室１１１の上方（＋Ｚ軸側）に配置されている。処理室１１２は、基板Ｓに対して加熱処理を行う処理空間を形成している。処理室１１２には、処理装置１１０として、基板Ｓを加熱する加熱装置１５１～１５３が設けられている。加熱装置１５１は、塗布装置１４１によってレジスト液が塗布された基板Ｓを加熱し、レジスト液を乾燥させる。加熱装置１５２は、処理室１１３の露光装置ＥＸを通過した基板Ｓを再び加熱し、レジスト液を乾燥させる。加熱装置１５２は、加熱装置１５１の加熱温度と異なる温度、例えば、加熱装置１５１の加熱温度よりも高い温度で基板Ｓを加熱している。加熱装置１５３は、現像装置１４２によって現像処理が行われ、かつ洗浄装置１４３によって洗浄された後の基板Ｓを加熱し、基板Ｓの表面を乾燥させる。加熱装置１５１～１５３は、内部に基板Ｓを複数回折り返す構成を有している。加熱装置１５１～１５３の内部では、基板Ｓが互いに接触しないように重ねて折り返された状態で搬送される。このため、基板Ｓの被処理面Ｓａの状態を維持しつつ、基板Ｓが加熱装置１５１～１５３に効率的に収容される。 The processing chamber 112 is disposed above the processing chamber 111 (+ Z axis side). The processing chamber 112 forms a processing space for performing heat treatment on the substrate S. The processing chamber 112 is provided with heating devices 151 to 153 for heating the substrate S as the processing device 110. The heating device 151 heats the substrate S on which the resist solution is applied by the coating device 141, and dries the resist solution. The heating device 152 heats the substrate S that has passed through the exposure apparatus EX in the processing chamber 113 again, and dries the resist solution. The heating device 152 heats the substrate S at a temperature different from the heating temperature of the heating device 151, for example, a temperature higher than the heating temperature of the heating device 151. The heating device 153 heats the substrate S that has been developed by the developing device 142 and has been cleaned by the cleaning device 143, and dries the surface of the substrate S. The heating devices 151 to 153 have a configuration in which a plurality of substrates S are folded inside. Inside the heating devices 151 to 153, the substrates S are conveyed in a state of being folded and folded so as not to contact each other. Therefore, the substrate S is efficiently accommodated in the heating devices 151 to 153 while maintaining the state of the processing surface Sa of the substrate S.
　処理室１１３は、処理室１１２の上方（＋Ｚ軸側）に配置されている。処理室１１３は、基板Ｓに対して露光処理を行う処理空間である。処理室１１３には、処理装置１１０として、露光装置ＥＸが設けられている。露光装置ＥＸは、塗布装置１４１において基板Ｓに塗布されたレジスト層に、マスクのパターンを介した露光光を照射する。 The processing chamber 113 is disposed above the processing chamber 112 (+ Z axis side). The processing chamber 113 is a processing space for performing an exposure process on the substrate S. The processing chamber 113 is provided with an exposure apparatus EX as the processing apparatus 110. The exposure apparatus EX irradiates the resist layer applied to the substrate S in the coating apparatus 141 with exposure light through a mask pattern.
　上記構成の基板処理装置２００には、複数のリフト部１６０（１６１～１６６）が設けられている。リフト部１６０は、異なる階の間で第一ユニット部２１及び第二ユニット部２２を搬送する。例えば、リフト部１６１、リフト部１６４、リフト部１６５及びリフト部１６６は、第一階と第二階との間で第一ユニット部２１及び第二ユニット部２２を搬送する。また、例えばリフト部１６２及びリフト部１６３は、第二階と第三階との間で第一ユニット部２１及び第二ユニット部２２を搬送する。 The substrate processing apparatus 200 configured as described above is provided with a plurality of lift parts 160 (161 to 166). The lift unit 160 conveys the first unit unit 21 and the second unit unit 22 between different floors. For example, the lift part 161, the lift part 164, the lift part 165, and the lift part 166 convey the 1st unit part 21 and the 2nd unit part 22 between the 1st floor and the 2nd floor. For example, the lift part 162 and the lift part 163 convey the 1st unit part 21 and the 2nd unit part 22 between a 2nd floor and a 3rd floor.
　各リフト部１６０は、それぞれ仕切り部材１１４ｂ及び仕切り部材１１４ｃをＺ軸方向に貫通する昇降機構１６０ａを有する。　
　図１５は、リフト部１６０の概略構成を示す斜視図である。　
　図１５に示すように、昇降機構１６０ａは、第一ユニット部２１の外部接続部４０ｄや第二ユニット部２２の接続部６０ｄに接続される。昇降機構１６０ａは、第一ユニット部２１及び第二ユニット部２２をＺ軸方向に移動させる不図示の移動機構を有する。昇降機構１６０ａは、一体化された状態の第一ユニット部２１及び第二ユニット部２２をＺ軸方向に移動可能である。 Each lift section 160 includes a lifting mechanism 160a that penetrates the partition member 114b and the partition member 114c in the Z-axis direction.
FIG. 15 is a perspective view illustrating a schematic configuration of the lift unit 160.
As shown in FIG. 15, the lifting mechanism 160 a is connected to the external connection part 40 d of the first unit part 21 and the connection part 60 d of the second unit part 22. The elevating mechanism 160a has a moving mechanism (not shown) that moves the first unit portion 21 and the second unit portion 22 in the Z-axis direction. The lifting mechanism 160a can move the first unit portion 21 and the second unit portion 22 in an integrated state in the Z-axis direction.
　また、リフト部１６０は、階を跨いで搬送した第一ユニット部２１及び第二ユニット部２２を、搬送先の階に設けられる移動部４２及び移動部６２の筐体５１及び７１にそれぞれ装着させる装着部（不図示）を有する。これにより、第一ユニット部２１及び第二ユニット部２２に収容される基板Ｓが階を跨いで移動可能となる。 In addition, the lift unit 160 causes the first unit unit 21 and the second unit unit 22 transported across the floors to be mounted on the casings 51 and 71 of the moving unit 42 and the moving unit 62 provided on the transport destination floor, respectively. A mounting portion (not shown) is included. Thereby, the board | substrate S accommodated in the 1st unit part 21 and the 2nd unit part 22 becomes movable across a floor.
　次に、上記基板処理装置２００の動作を説明する。　
　制御部ＣＯＮＴは、第一ユニット部２１及び第二ユニット部２２を所定の入り口から処理室１１１に搬入させ、ガイドレール３０に沿って塗布装置１４１へ移動させる。制御部ＣＯＮＴは、塗布装置１４１において、上記第一実施形態と同様の動作により、第一ユニット部２１を塗布装置１４１の＋Ｙ軸側に配置させ、第二ユニット部２２を塗布装置１４１の－Ｙ軸側に配置させる。この状態で、制御部ＣＯＮＴは、第一ユニット部２１から第二ユニット部２２へ基板Ｓを搬送しつつ、基板Ｓの被処理面に対して感光剤の塗布処理を行わせる。 Next, the operation of the substrate processing apparatus 200 will be described.
The control unit CONT loads the first unit unit 21 and the second unit unit 22 into the processing chamber 111 from a predetermined entrance, and moves them to the coating apparatus 141 along the guide rail 30. The control unit CONT causes the first unit unit 21 to be disposed on the + Y axis side of the coating device 141 and the second unit unit 22 to be −Y of the coating device 141 in the coating device 141 by the same operation as in the first embodiment. Place on the shaft side. In this state, the control unit CONT causes the processing surface of the substrate S to be coated with the photosensitive agent while transporting the substrate S from the first unit unit 21 to the second unit unit 22.
　塗布装置１４１において処理が行われた後、制御部ＣＯＮＴは、第一ユニット部２１及び第二ユニット部２２を一体化させ、リフト部１６１へと移動させる。第一ユニット部２１及び第二ユニット部２２がリフト部１６１へ到着した後、制御部ＣＯＮＴは、第一ユニット部２１と第二ユニット部２２とを接続させたまま、例えば第二ユニット部２２の接続部６０ｄをリフト部１６１の昇降機構１６０ａに接続させる。その後、制御部ＣＯＮＴは、昇降機構１６０ａを用いて第一ユニット部２１及び第二ユニット部２２を一体化させた状態で＋Ｚ軸方向に搬送する。この動作により、第一ユニット部２１と筐体５１との間、第二ユニット部２２と筐体７１との間の装着状態が解除され、第一ユニット部２１及び第二ユニット部２２が筐体５１及び筐体７１から分離されて＋Ｚ軸方向に移動し、処理室１１１から処理室１１２へと搬送される。 After the processing is performed in the coating apparatus 141, the control unit CONT integrates the first unit unit 21 and the second unit unit 22 and moves them to the lift unit 161. After the first unit part 21 and the second unit part 22 arrive at the lift part 161, the control part CONT keeps the first unit part 21 and the second unit part 22 connected, for example, the second unit part 22 The connecting portion 60d is connected to the lifting mechanism 160a of the lift portion 161. Thereafter, the control part CONT transports the first unit part 21 and the second unit part 22 in the + Z-axis direction in a state of being integrated using the lifting mechanism 160a. By this operation, the mounting state between the first unit portion 21 and the housing 51 and between the second unit portion 22 and the housing 71 is released, and the first unit portion 21 and the second unit portion 22 are removed from the housing. 51 and the casing 71, move in the + Z-axis direction, and are transferred from the processing chamber 111 to the processing chamber 112.
　制御部ＣＯＮＴは、処理室１１２に配置された移動部４２及び移動部６２を予めリフト部１６１の近傍に待機させておく。制御部ＣＯＮＴは、不図示の装着部を用いて、処理室１１２に搬送された第一ユニット部２１及び第二ユニット部２２を前記移動部４２及び移動部６２にそれぞれ装着させる。 The control unit CONT causes the moving unit 42 and the moving unit 62 arranged in the processing chamber 112 to stand by in the vicinity of the lift unit 161 in advance. The control unit CONT uses a mounting unit (not shown) to mount the first unit unit 21 and the second unit unit 22 conveyed to the processing chamber 112 to the moving unit 42 and the moving unit 62, respectively.
　その後、制御部ＣＯＮＴは、第一ユニット部２１及び第二ユニット部２２を用いて基板Ｓを加熱装置１５１に搬入させ、基板Ｓに対して加熱処理を行わせる。加熱装置１５１では、基板Ｓが例えば複数回折り曲げられた状態で基板Ｓが搬送され、この搬送状態で基板Ｓの加熱が行われる。このため、スペースを効率的に利用した加熱処理が行われることになる。加熱装置１５１では、加熱により基板Ｓに形成された塗布膜を乾燥させる。 After that, the control unit CONT uses the first unit unit 21 and the second unit unit 22 to carry the substrate S into the heating device 151 and to heat the substrate S. In the heating device 151, the substrate S is transported in a state where the substrate S is bent, for example, a plurality of times, and the substrate S is heated in this transported state. For this reason, the heat processing using space efficiently is performed. In the heating device 151, the coating film formed on the substrate S by heating is dried.
　加熱処理が行われた後、制御部ＣＯＮＴは、上記同様の動作により、リフト部１６２を介して第一ユニット部２１及び第二ユニット部２２を処理室１１３に搬送する。制御部ＣＯＮＴは、処理室１１３において、第一ユニット部２１及び第二ユニット部２２を露光装置ＥＸに搬入させ、基板Ｓに塗布された感光剤に対して露光処理を行わせる。 After the heat treatment is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 113 through the lift unit 162 by the same operation as described above. In the processing chamber 113, the control unit CONT carries the first unit unit 21 and the second unit unit 22 into the exposure apparatus EX, and causes the photosensitive agent applied to the substrate S to be exposed.
　露光装置を行った後、制御部ＣＯＮＴは、リフト部１６３を介して第一ユニット部２１及び第二ユニット部２２を処理室１１２に搬送する。制御部ＣＯＮＴは、処理室１１２において、第一ユニット部２１及び第二ユニット部２２を加熱装置１５２に搬入させ、基板Ｓに対して加熱処理を行わせる。加熱装置１５２では、感光された塗布膜に対する加熱処理が行われる。 After performing the exposure apparatus, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 via the lift unit 163. In the processing chamber 112, the control unit CONT causes the first unit unit 21 and the second unit unit 22 to be carried into the heating device 152 and causes the substrate S to be subjected to heat processing. In the heating device 152, a heat treatment is performed on the exposed coating film.
　加熱処理が行われた後、制御部ＣＯＮＴは、リフト部１６４を介して第一ユニット部２１及び第二ユニット部２２を処理室１１１に搬送する。制御部ＣＯＮＴは、処理室１１１において、第一ユニット部２１及び第二ユニット部２２を現像装置１４２に搬入させ、基板Ｓに対して現像処理を行わせる。現像装置１４２では、基板Ｓは現像液に浸されながら第一ユニット部２１から第二ユニット部２２へ搬送され、搬送の過程で現像処理が行われる。 After the heat treatment is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 via the lift unit 164. In the processing chamber 111, the control unit CONT loads the first unit unit 21 and the second unit unit 22 into the developing device 142, and causes the substrate S to be developed. In the developing device 142, the substrate S is transported from the first unit unit 21 to the second unit unit 22 while being immersed in the developing solution, and development processing is performed in the transport process.
　現像処理が行われた後、制御部ＣＯＮＴは、第一ユニット部２１及び第二ユニット部２２を一体化させたまま洗浄装置１４３へ移動し、基板Ｓを洗浄装置１４３に搬入させる。洗浄装置１４３では、基板Ｓは洗浄液に浸されながら第一ユニット部２１から第二ユニット部２２へ搬送され、搬送の過程で洗浄処理が行われる。 After the development processing is performed, the control unit CONT moves to the cleaning device 143 with the first unit portion 21 and the second unit portion 22 integrated, and carries the substrate S into the cleaning device 143. In the cleaning device 143, the substrate S is transported from the first unit unit 21 to the second unit unit 22 while being immersed in the cleaning liquid, and a cleaning process is performed in the transport process.
　洗浄処理が行われた後、制御部ＣＯＮＴは、リフト部１６５を介して第一ユニット部２１及び第二ユニット部２２を処理室１１２に搬送する。制御部ＣＯＮＴは、処理室１１２において、第一ユニット部２１及び第二ユニット部２２を加熱装置１５３に搬入させ、基板Ｓに対して加熱処理を行わせる。加熱装置１５３では、洗浄された基板Ｓを乾燥させるための加熱処理や、塗布膜を加熱するための加熱処理などが行われる。 After the cleaning process is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 via the lift unit 165. In the processing chamber 112, the control unit CONT causes the first unit unit 21 and the second unit unit 22 to be carried into the heating device 153 and causes the substrate S to be subjected to heat treatment. In the heating device 153, heat treatment for drying the cleaned substrate S, heat treatment for heating the coating film, and the like are performed.
　加熱処理が行われた後、制御部ＣＯＮＴは、リフト部１６６を介して第一ユニット部２１及び第二ユニット部２２を処理室１１１に搬送する。制御部ＣＯＮＴは、処理室１１１において、第一ユニット部２１及び第二ユニット部２２を鍍金装置１４４に移動させ、基板Ｓを鍍金装置１４４に搬入させる。鍍金装置１４４では、基板Ｓは鍍金液に浸されながら第一ユニット部２１から第二ユニット部２２へ搬送され、搬送の過程で鍍金処理が行われる。鍍金処理が行われた基板Ｓには、所定のパターンが形成される。 After the heat treatment is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 via the lift unit 166. In the processing chamber 111, the control unit CONT moves the first unit unit 21 and the second unit unit 22 to the plating apparatus 144, and loads the substrate S into the plating apparatus 144. In the plating apparatus 144, the substrate S is transported from the first unit portion 21 to the second unit portion 22 while being immersed in the plating solution, and a plating process is performed in the transport process. A predetermined pattern is formed on the substrate S on which the plating process has been performed.
　鍍金処理が行われた後、制御部ＣＯＮＴは、リフト部１６６を介して第一ユニット部２１及び第二ユニット部２２を処理室１１２に搬送する。制御部ＣＯＮＴは、処理室１１２において、第一ユニット部２１及び第二ユニット部２２を不図示の加熱装置に搬入され、加熱処理を行わせる。 After the plating process is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 via the lift unit 166. In the processing chamber 112, the control unit CONT carries the first unit unit 21 and the second unit unit 22 into a heating device (not shown), and causes the heating process to be performed.
　以上のように、本実施形態に係る基板処理装置２００は、例えば処理室１１１において、第一レール３１と第二レール３２との間に、処理装置１１０として互いに異なる処理を行う塗布装置１４１、現像装置１４２、洗浄装置１４３及び鍍金装置１４４が設けられており、これらの各装置（塗布装置１４１、現像装置１４２、洗浄装置１４３及び鍍金装置１４４）の間で、第一ユニット部２１及び第二ユニット部２２を移動させつつ、装置ごとに第一ユニット部２１が基板Ｓを供給し、第二ユニット部２２が基板Ｓを回収するので、複数の処理装置１１０において枚葉処理を行うことができる。 As described above, the substrate processing apparatus 200 according to this embodiment includes, for example, the coating apparatus 141 that performs different processes as the processing apparatus 110 between the first rail 31 and the second rail 32 in the processing chamber 111, and the development. The apparatus 142, the washing | cleaning apparatus 143, and the plating apparatus 144 are provided, The 1st unit part 21 and the 2nd unit are provided among these apparatuses (the coating apparatus 141, the developing device 142, the washing | cleaning apparatus 143, and the plating apparatus 144). While the unit 22 is moved, the first unit unit 21 supplies the substrate S and the second unit unit 22 collects the substrate S for each apparatus, so that the single wafer processing can be performed in the plurality of processing apparatuses 110.
　これにより、送り出されてから巻き取られるまで掛け渡される基板Ｓの寸法が長くなってしまうことを抑えることができるため、搬送時の基板Ｓの管理負担を低減することができる。また、一の製造ラインに処理速度の異なる複数の処理装置１１０が含まれる場合であっても、ライン全体で処理速度を合わせる必要が無いため、各処理装置１１０を効率的に利用することができる。更に、複数階層を有する基板処理装置２００において、第一ユニット部２１及び第二ユニット部２２を移動部４２及び移動部６２から分割させて異なる階層の間を搬送させることができるため、効率的な搬送が可能となる。 Thereby, it is possible to prevent the length of the substrate S to be stretched from being sent out until it is wound, so that the management burden of the substrate S during transport can be reduced. Further, even when a plurality of processing apparatuses 110 having different processing speeds are included in one production line, it is not necessary to match the processing speeds in the entire line, so that each processing apparatus 110 can be used efficiently. . Furthermore, in the substrate processing apparatus 200 having a plurality of layers, the first unit unit 21 and the second unit unit 22 can be divided from the moving unit 42 and the moving unit 62 and transported between different layers, which is efficient. Transport is possible.
　本発明の技術範囲は上記実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で適宜変更を加えることができる。　
　例えば、上記実施形態では、第一ユニット部２１と第二ユニット部２２との間が着脱可能に設けられた構成を例に挙げて説明したが、これに限られることは無い。 The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the said embodiment, although the structure provided detachably between the 1st unit part 21 and the 2nd unit part 22 was mentioned as an example, it demonstrated and it is not restricted to this.
　例えば、第一ユニット部２１及び第二ユニット部２２が互いに装着されずに近接及び離間のみを行う構成であっても良い。また、第一ユニット部２１と第二ユニット部２２とが装着されるのではなく、第一ユニット部２１を支持する移動部４２と、第二ユニット部２２を支持する移動部６２とが着脱可能な構成であっても良い。 For example, the first unit portion 21 and the second unit portion 22 may be configured to perform only proximity and separation without being attached to each other. In addition, the first unit 21 and the second unit 22 are not attached, but the moving unit 42 that supports the first unit 21 and the moving unit 62 that supports the second unit 22 are detachable. It may be a simple configuration.
　また、例えば、上記実施形態では、第一ユニット部２１を基板Ｓの供給用とし、第二ユニット部２２を基板Ｓの回収用として用いる例を挙げて説明したが、これに限られることは無い。例えば、第一ユニット部２１を基板Ｓの回収用とし、第二ユニット部２２を基板Ｓの供給用として用いても良い。また、第一ユニット部２１及び第二ユニット部２２を同一構成とし、ガイドレール３０上で第一ユニット部２１と第二ユニット部２２とを互いに入れ替え、適宜供給動作と回収動作とを切り替えながら基板Ｓの搬送を行っても良い。 For example, in the above embodiment, the first unit portion 21 is used for supplying the substrate S and the second unit portion 22 is used for collecting the substrate S. However, the present invention is not limited to this. . For example, the first unit portion 21 may be used for collecting the substrate S, and the second unit portion 22 may be used for supplying the substrate S. Further, the first unit portion 21 and the second unit portion 22 have the same configuration, the first unit portion 21 and the second unit portion 22 are interchanged with each other on the guide rail 30, and the substrate is switched while appropriately switching the supply operation and the recovery operation. S may be transported.
　また、上記第二実施形態では、基板処理装置が複数階層を有する構成を例に挙げて説明したが、これに限られることは無い。例えば、図１６に示すように、Ｙ軸方向に複数のラインが配置された構成であっても良い。この場合、処理部１０の構成として、Ｙ軸方向には同一種類の処理を行う装置を配置させる構成であっても良い。 In the second embodiment, the configuration in which the substrate processing apparatus has a plurality of layers has been described as an example. However, the present invention is not limited to this. For example, as shown in FIG. 16, a configuration in which a plurality of lines are arranged in the Y-axis direction may be used. In this case, the configuration of the processing unit 10 may be a configuration in which apparatuses that perform the same type of processing are arranged in the Y-axis direction.
　また、上記実施形態では、基部５１ｂ及び基部７１ｂの－Ｚ軸側の端面５１ｄ及び７１ｄに位置検出部５５及び７５が設けられた構成を例に挙げて説明したが、これに限られることは無い。例えば、図１７に示すように、ガイドレール３０に接触させる端子（電力取得部）５６及び７６が設けられた構成であっても良い。この場合、ガイドレール３０を電源に接続させておくことで、端子５６及び７６を介して電力を取得することができる。 In the above-described embodiment, the configuration in which the position detection units 55 and 75 are provided on the end surfaces 51d and 71d on the −Z-axis side of the base 51b and the base 71b has been described as an example. However, the present invention is not limited thereto. . For example, as shown in FIG. 17, the structure provided with the terminals (electric power acquisition part) 56 and 76 which contact the guide rail 30 may be sufficient. In this case, electric power can be acquired via the terminals 56 and 76 by connecting the guide rail 30 to the power source.
　また、例えば上記実施形態においては、第一ユニット部２１及び第二ユニット部２２が処理部１０を一方向に通過するように移動する場合を例に挙げて説明したが、これに限られることは無い。 For example, in the above-described embodiment, the case where the first unit unit 21 and the second unit unit 22 move so as to pass through the processing unit 10 in one direction has been described as an example. No.
　図１８（ａ）～図１８（ｃ）は、第一ユニット部２１及び第二ユニット部２２の移動動作の一例を示す図である。　
　例えば制御部ＣＯＮＴは、図１８（ａ）に示すように第一ユニット部２１と第二ユニット部２２とを引き離して基板Ｓを引き出し、図１８（ｂ）に示すように第一ユニット部２１及び第二ユニット部２２を＋Ｘ軸方向に沿って処理部１０に搬入させて処理を行わせる。その後、図１８（ｃ）に示すように、第一ユニット部２１及び第二ユニット部２２を－Ｘ軸方向に沿って戻すように移動させても良い。これにより、処理部１０の構成上、基板ＳがＸ軸方向に通過することが困難な場合であっても、効率的に基板Ｓを搬送させることができる。 FIG. 18A to FIG. 18C are diagrams showing an example of the movement operation of the first unit portion 21 and the second unit portion 22.
For example, the control unit CONT pulls out the substrate S by separating the first unit unit 21 and the second unit unit 22 as shown in FIG. 18A, and the first unit unit 21 and the second unit unit 22 as shown in FIG. The second unit unit 22 is carried into the processing unit 10 along the + X axis direction to perform processing. Thereafter, as shown in FIG. 18C, the first unit portion 21 and the second unit portion 22 may be moved back along the −X axis direction. Thereby, even if it is difficult for the substrate S to pass in the X-axis direction due to the configuration of the processing unit 10, the substrate S can be efficiently transported.
　また、上記実施形態においては、第一レール３１側に第一ユニット部２１及び第二ユニット部２２を配置させた後、第二ユニット部２２を第二レール３２側に移動させることで基板Ｓを引き出す場合を例に挙げて説明したが、これに限られることは無い。例えば第二レール３２側から第一レール３１側に第一ユニット部２１を移動させることで基板Ｓを引き出すようにしても良い。 Moreover, in the said embodiment, after arrange | positioning the 1st unit part 21 and the 2nd unit part 22 to the 1st rail 31 side, the board | substrate S is moved by moving the 2nd unit part 22 to the 2nd rail 32 side. The case of drawing out has been described as an example, but the present invention is not limited to this. For example, the substrate S may be pulled out by moving the first unit portion 21 from the second rail 32 side to the first rail 31 side.
　また、図１９（ａ）に示すように、第一ユニット部２１及び第二ユニット部２２を第三レール３３のＹ軸方向の中央部に配置させ、その後図１９（ｂ）に示すように、第一ユニット部２１を＋Ｙ軸方向に、第二ユニット部２２を－Ｙ軸方向にそれぞれ移動させることにより、基板Ｓを引き出すようにしても良い。 Further, as shown in FIG. 19 (a), the first unit portion 21 and the second unit portion 22 are arranged at the center portion in the Y-axis direction of the third rail 33, and thereafter, as shown in FIG. 19 (b), The substrate S may be pulled out by moving the first unit portion 21 in the + Y-axis direction and the second unit portion 22 in the −Y-axis direction.
　また、上記実施形態においては、第一ユニット部２１及び第二ユニット部２２をＹ軸方向に並べた状態でＸ軸方向に移動させる場合を例に挙げて説明したが、これに限られることは無い。例えば第一ユニット部２１と第二ユニット部２２とをＸ軸方向に並べた状態でＹ軸方向に移動させるようにしても良い。 Moreover, in the said embodiment, although the case where it moved to the X-axis direction in the state which arranged the 1st unit part 21 and the 2nd unit part 22 in the Y-axis direction was mentioned as an example, it is limited to this. No. For example, the first unit portion 21 and the second unit portion 22 may be moved in the Y-axis direction in a state where they are arranged in the X-axis direction.
　例えば図２０（ａ）に示すように、処理部１０をＸ軸方向に挟む２つの第三レール３３と第二レール３２との交点に第一ユニット部２１と第二ユニット部２２とをそれぞれ配置させる。このとき、基板Ｓを引き出した状態とする。その後、図２０（ｂ）に示すように、第一ユニット部２１及び第二ユニット部２２を＋Ｙ軸方向に移動させることで基板Ｓを処理部１０に搬入させる。これにより、処理部１０の構成上、基板ＳがＸ軸方向に搬入することが困難な場合であっても、効率的に基板Ｓを搬送させることができる。 For example, as shown in FIG. 20 (a), the first unit portion 21 and the second unit portion 22 are arranged at the intersections of two third rails 33 and second rails 32 that sandwich the processing unit 10 in the X-axis direction. Let At this time, the substrate S is pulled out. Thereafter, as shown in FIG. 20B, the substrate S is carried into the processing unit 10 by moving the first unit portion 21 and the second unit portion 22 in the + Y-axis direction. Thereby, even if it is difficult for the substrate S to be loaded in the X-axis direction due to the configuration of the processing unit 10, the substrate S can be efficiently transferred.
　また、上記実施形態においては、接続部２３の構成として、第一接続部２３ａと第二接続部２３ｂとの間が電磁石によって吸着する構成を例に挙げて説明したが、これに限られることは無く、機械的にロックすることで接続される構成であっても良い。 In the above-described embodiment, the configuration of the connection portion 23 has been described by taking the configuration in which the space between the first connection portion 23a and the second connection portion 23b is attracted by an electromagnet as an example. There may be a configuration that is connected by mechanical locking.
　また、上記実施形態においては、基板Ｓを駆動する軸部４１ａ及び軸部６１ａや、保護基板Ｃを駆動する軸部４８ａ及び軸部６８ａについて、例えば中心軸の軸線方向がＸ軸方向に平行となるように配置され、基板Ｓや保護基板ＣがＸＹ平面に平行に搬送される構成を例に挙げて説明したが、これに限られることは無い。例えば、軸部４１ａ及び軸部６１ａや軸部４８ａ及び軸部６８ａについて、中心軸の軸線方向がＺ軸方向に平行となるように配置され、基板Ｓや保護基板ＣがＹＺ平面やＺＸ平面に平行に搬送される構成であっても良い。 In the above-described embodiment, for example, the axial direction of the central axis is parallel to the X-axis direction for the shaft portion 41a and the shaft portion 61a that drive the substrate S and the shaft portion 48a and the shaft portion 68a that drive the protective substrate C. The configuration in which the substrate S and the protective substrate C are transported in parallel to the XY plane has been described as an example. However, the configuration is not limited thereto. For example, the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a are arranged so that the axial direction of the central axis is parallel to the Z-axis direction, and the substrate S and the protective substrate C are placed on the YZ plane or the ZX plane. The structure conveyed in parallel may be sufficient.
　また、上記実施形態においては、移動部４２及び移動部６２の筐体５１及び７１がＺ軸方向に昇降することで軸部４１ａ、軸部６１ａ、軸部４８ａ及び軸部６８ａのＺ軸方向の位置が調整可能な形態を例に挙げて説明したが、これに限られることは無い。例えば、軸部４１ａ、軸部６１ａ、軸部４８ａ及び軸部６８ａがＺ軸方向に昇降可能な構成であっても良い。 In the above embodiment, the casings 51 and 71 of the moving part 42 and the moving part 62 are moved up and down in the Z-axis direction, whereby the shaft part 41a, the shaft part 61a, the shaft part 48a, and the shaft part 68a in the Z-axis direction. Although the embodiment in which the position can be adjusted has been described as an example, the present invention is not limited to this. For example, the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a may be configured to be movable up and down in the Z-axis direction.
　また、上記実施形態とは異なる構成の基板Ｓを用いることができる。　
　図２１は、基板Ｓの構成を示す図である。　
　図２１に示すように、基板Ｓの被処理面Ｓａのうち、例えば配線や電極、素子などを形成するパターン形成領域Ｐを囲むように保護層９０が形成された構成であっても良い。 Further, a substrate S having a configuration different from that of the above embodiment can be used.
FIG. 21 is a diagram showing the configuration of the substrate S. As shown in FIG.
As shown in FIG. 21, a configuration may be adopted in which a protective layer 90 is formed so as to surround a pattern formation region P in which, for example, a wiring, an electrode, an element, etc. are formed on the surface Sa to be processed of the substrate S.
　前記保護層９０は、パターン形成領域Ｐよりも層厚が大きくなるように形成する。この構成により、被処理面Ｓａに保護基板Ｃを重ねた場合であっても、保護基板Ｃがパターン形成領域Ｐに接触するのを防ぐことができる。なお、保護層９０は保護基板Ｃ側に形成されていても良い。 The protective layer 90 is formed so as to have a layer thickness larger than that of the pattern formation region P. With this configuration, it is possible to prevent the protective substrate C from coming into contact with the pattern formation region P even when the protective substrate C is superimposed on the surface Sa. The protective layer 90 may be formed on the protective substrate C side.
　図２２～図２７は、基板搬送装置の他の実施形態を示す斜視図である。先の図２、図３で説明したように、第１ユニット部２１を搭載して自走可能な移動部４２は、キャスター５２の回転によってＸ軸方向、Ｙ軸方向及びθＺ軸方向に移動可能である。このことは、第２ユニット部２２を搭載して自走可能な移動部６２についても同様である。そこで、先の図１８～２０で示したような、Ｘ軸方向に延びる第１レール３１と第２レール３２、Ｙ軸方向に延びる第３レール３３とによって構成される搬送ガイド機構に対して、図２２に示すように、付加的な搬送ガイド部としての環状レール３４ａ、３５ａを敷設する。 22 to 27 are perspective views showing other embodiments of the substrate transfer apparatus. As described with reference to FIGS. 2 and 3 above, the moving unit 42 that is mounted with the first unit 21 and is capable of self-running can move in the X axis direction, the Y axis direction, and the θZ axis direction by the rotation of the caster 52. It is. The same applies to the moving unit 62 that can be self-propelled by mounting the second unit unit 22. Therefore, as shown in FIGS. 18 to 20, the conveyance guide mechanism constituted by the first rail 31 and the second rail 32 extending in the X-axis direction and the third rail 33 extending in the Y-axis direction, As shown in FIG. 22, annular rails 34a and 35a are laid as additional conveyance guide portions.
　環状レール３４ａは、第１レール３１と第３レール３３とが交差する中心点ＴＣ１から一定半径の円環状に敷設される。また、環状レール３５ａは、第２レール３２と第３レール３３とが交差する中心点ＴＣ２から一定半径の円環状に敷設される。環状レール３４ａ、３５ａは、移動部４２や移動部６２を中心点ＴＣ１やＴＣ２の周りに回動（旋回）させる為の案内路として機能する。また、中心点ＴＣ１、ＴＣ２の各々には、移動部４２、６２を正確に位置決めする為の円板状のマーカー部（指標となるマークや誘導信号発生器等を含む）３４ｂ、３５ｂが敷設されている。 The annular rail 34a is laid in an annular shape with a constant radius from the center point TC1 where the first rail 31 and the third rail 33 intersect. The annular rail 35a is laid in an annular shape with a constant radius from the center point TC2 where the second rail 32 and the third rail 33 intersect. The annular rails 34a and 35a function as guide paths for rotating (turning) the moving unit 42 and the moving unit 62 around the center points TC1 and TC2. In addition, disc-shaped marker portions (including an index mark and an induction signal generator) 34b and 35b for accurately positioning the moving portions 42 and 62 are laid at each of the center points TC1 and TC2. ing.
　さて、図２２に示す処理装置１０は、例えば、大気圧ＣＶＤ装置であり、上部構造体１０ａと下部構造体１０ｂで構成される。下部構造体１０ｂは工場の床面（ＦＬ）に設置され、上部構造体１０ａは下部構造体１０ｂに対して、Ｚ軸方向に可動するように構成される。
　上部構造体１０ａをＺ軸方向の上方に移動させることによって、第１ユニット部２１の軸部４１ｃと第２ユニット部２２の軸部６１ｃとの間に掛け渡された基板Ｓを、Ｘ軸方向に並進移動させて処理装置１０外に搬出することができる。 Now, the processing apparatus 10 shown in FIG. 22 is, for example, an atmospheric pressure CVD apparatus, and includes an upper structure 10a and a lower structure 10b. The lower structure 10b is installed on the floor (FL) of the factory, and the upper structure 10a is configured to move in the Z-axis direction with respect to the lower structure 10b.
By moving the upper structure 10a upward in the Z-axis direction, the substrate S stretched between the shaft portion 41c of the first unit portion 21 and the shaft portion 61c of the second unit portion 22 is moved in the X-axis direction. And can be carried out of the processing apparatus 10 by translation.
　図２２は、処理装置１０による基板Ｓの処理が終了し、上部構造体１０ａが上方に位置した状態で、移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）をＸ軸方向に同期移動させている状態を示したものである。移動部４２（第１ユニット部２１）は、第１レール３１に案内されつつ、ホームポジションとしての中心点ＴＣ１に向かって－Ｘ軸方向に移動し、移動部６２（第２ユニット部２２）は、第２レール３２に案内されつつ、ホームポジションとしての中心点ＴＣ２に向かって－Ｘ軸方向に移動する。 FIG. 22 shows the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) in a state in which the processing of the substrate S by the processing apparatus 10 is completed and the upper structure 10a is positioned above. It shows a state in which it is moved synchronously in the X-axis direction. The moving unit 42 (first unit unit 21) moves in the −X-axis direction toward the center point TC1 as the home position while being guided by the first rail 31, and the moving unit 62 (second unit unit 22) While being guided by the second rail 32, it moves in the −X-axis direction toward the center point TC2 as the home position.
　その後、図２３に示すように、移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）は、共にＸ軸方向のホームポジション（中心点ＴＣ１、ＴＣ２の位置）に到達する。このとき、移動部４２と移動部６２との間には、丁度、Ｙ軸方向に延びた第３レール３３が位置する。 Thereafter, as shown in FIG. 23, both the moving part 42 (first unit part 21) and the moving part 62 (second unit part 22) reach the home positions (positions of the center points TC1 and TC2) in the X-axis direction. To do. At this time, the third rail 33 extending just in the Y-axis direction is positioned between the moving unit 42 and the moving unit 62.
　その後、移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）のいずれか一方が他方に向けて、Ｙ軸方向に移動する。その状態が図２４であり、ここでは、移動部４２（第１ユニット部２１）が移動部６２（第２ユニット部２２）に向かって、第３レール３３に案内されて移動する。その際、第１ユニット部２１の軸部４１ｃ、又は第２ユニット部２２の軸部６１ｃが、移動部４２（第１ユニット部２１）のＹ軸方向の移動に連動して回転し、基板Ｓがたるまないように巻き取っていく。 Thereafter, one of the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) moves in the Y-axis direction toward the other. This state is shown in FIG. 24. Here, the moving part 42 (first unit part 21) moves while being guided by the third rail 33 toward the moving part 62 (second unit part 22). At that time, the shaft portion 41c of the first unit portion 21 or the shaft portion 61c of the second unit portion 22 rotates in conjunction with the movement of the moving portion 42 (first unit portion 21) in the Y-axis direction. Wind it up so that it doesn't sag.
　図２５は、移動部４２（第１ユニット部２１）が移動部６２（第２ユニット部２２）に接近して、先の図５のように連結（連接）した状態を示す。このとき、移動部６２（第２ユニット部２２）は中心点ＴＣ２（マーカー部３５ｂ）上に位置し、移動部４２（第１ユニット部２１）は、環状レール３５ａ上に位置する。 FIG. 25 shows a state in which the moving unit 42 (first unit unit 21) approaches the moving unit 62 (second unit unit 22) and is connected (connected) as shown in FIG. At this time, the moving part 62 (second unit part 22) is located on the center point TC2 (marker part 35b), and the moving part 42 (first unit part 21) is located on the annular rail 35a.
　この状態から、移動部６２のキャスター７２は、中心点ＴＣ２の周りにθＺ軸方向に移動部６２（第２ユニット部２２）を回動（自転）させるような駆動力を発生する。併せて、移動部４２のキャスター５２は、環状レール３５ａの周方向に沿って移動部４２（第１ユニット部２１）を回動（旋回）させるような駆動力を発生する。さらにこのとき、移動部６２のキャスター７２、又は移動部４２のキャスター５２は、マーカー部３５ｂの検出結果に基づいて、移動部６２の自転中心が中心点ＴＣ２から、Ｘ軸方向とＹ軸方向に大きく位置ずれしないような方向制御も行なう。 From this state, the caster 72 of the moving unit 62 generates a driving force that rotates (rotates) the moving unit 62 (second unit unit 22) around the center point TC2 in the θZ-axis direction. In addition, the caster 52 of the moving unit 42 generates a driving force that rotates (turns) the moving unit 42 (first unit unit 21) along the circumferential direction of the annular rail 35a. Further, at this time, the caster 72 of the moving unit 62 or the caster 52 of the moving unit 42 has the rotation center of the moving unit 62 in the X-axis direction and the Y-axis direction from the center point TC2 based on the detection result of the marker unit 35b. Direction control is also performed so that the position is not greatly displaced.
　図２６は、連結した移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）が、図２５の状態から、ＸＹ面内で中心点ＴＣ２を中心として時計回りに９０度回転した状態を示す。その回転方向は、ここでは時計回りに９０度としたが、反時計回りに９０度であっても構わない。どちらの方向に回転させるかは、次の処理装置に対して、基板Ｓをどのように装填するかによって決められる。 26 shows that the connected moving unit 42 (first unit unit 21) and moving unit 62 (second unit unit 22) are rotated 90 degrees clockwise from the state of FIG. 25 about the center point TC2 in the XY plane. The rotated state is shown. The rotation direction here is 90 degrees clockwise, but it may be 90 degrees counterclockwise. Which direction is rotated is determined by how the substrate S is loaded into the next processing apparatus.
　その後、図２７に示すように、処理装置１０（例えば、大気圧ＣＶＤ装置）によって成膜処理された基板Ｓのロールを保持する第２ユニット部２２（移動部６２）と、残存の未処理の基板Ｓのロールを保持する第１ユニット部２１（移動部４２）とが、第２レール３２の案内によって、＋Ｘ軸方向に一体となって並進移動し、処理装置１０の横を通って次の処理装置に向かう。 Thereafter, as shown in FIG. 27, the second unit unit 22 (moving unit 62) that holds the roll of the substrate S formed by the processing apparatus 10 (for example, atmospheric pressure CVD apparatus), and the remaining unprocessed The first unit portion 21 (moving portion 42) that holds the roll of the substrate S moves in translation in the + X-axis direction by the guide of the second rail 32, and passes through the side of the processing apparatus 10 to the next. Head to the processing equipment.
　それによって、ホームポジション（中心点ＴＣ１、ＴＣ２）が空くことから、次に処理すべき基板Ｓを搭載した移動部４２-１（第１ユニット部２１-１）と移動部６２-１（第２ユニット部２２-１）が、一体となって中心点ＴＣ１側のホームポジションに送られてくる。
　その後、図２７のように、未処理の基板Ｓのロールを保持する第１ユニット部２１-１（移動部４２-１）が中心点ＴＣ１（第１レール３１と第３レール３３の交点部）に位置した状態で、処理済みの基板Ｓをロール状に巻き取る為の第２ユニット部２２-１（移動部６２-１）が、中心点ＴＣ２に向かって第３レール３３に沿って移動する。 As a result, the home positions (center points TC1, TC2) are vacant, so that the moving unit 42-1 (first unit unit 21-1) and the moving unit 62-1 (second unit) on which the substrate S to be processed next is mounted. The unit portion 22-1) is integrally sent to the home position on the center point TC1 side.
Thereafter, as shown in FIG. 27, the first unit portion 21-1 (moving portion 42-1) holding the roll of the unprocessed substrate S is the center point TC1 (intersection portion of the first rail 31 and the third rail 33). The second unit portion 22-1 (moving portion 62-1) for winding the processed substrate S into a roll shape moves along the third rail 33 toward the center point TC2. .
　以上のように、移動部４２（第１ユニット部２１）や移動部６２（第２ユニット部２２）が、工場の床面ＦＬ上で自由に回転運動できるスペース（環状レール３４ａ、３５ａ等）を設けることにより、処理装置の配置の自由度、基板Ｓ（ロール状）の搬送方向の自由度、搬送効率を向上させることができる。 As described above, a space ( annular rails 34a, 35a, etc.) in which the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) can freely rotate on the floor surface FL of the factory is provided. By providing, the freedom degree of arrangement | positioning of a processing apparatus, the freedom degree of the conveyance direction of board | substrate S (roll shape), and conveyance efficiency can be improved.
　以上の実施形態において、図２５、図２６では、一定間隔で連結した移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）を９０度回転させるようにした。しかし、次の処理装置が、例えば図２５中の処理装置１０の－Ｙ軸側に設置されている場合は、－Ｙ軸方向に延設される第３レール３３に沿って、移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）をそのまま－Ｙ軸方向に移動させても良いし、図２５の状態から中心点ＴＣ２の回りに１８０度回転させてから－Ｙ軸方向に移動させても良い。 In the embodiment described above, in FIGS. 25 and 26, the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) connected at regular intervals are rotated by 90 degrees. However, when the next processing apparatus is installed, for example, on the −Y axis side of the processing apparatus 10 in FIG. 25, the moving unit 42 ( The first unit portion 21) and the moving portion 62 (second unit portion 22) may be moved in the −Y-axis direction as they are, or after rotating 180 degrees around the center point TC2 from the state of FIG. It may be moved in the axial direction.
　尚、図２５～２７において、移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）は一定間隔で連結した状態で移動する。しかし、両者は必ずしも機械的に接触している必要はなく、非接触センサー等を使って、一定の空間ギャップを保ちつつ、一定の位置ずれ範囲内（例えば１ｍｍ以下）で移動部４２と移動部６２が相互に追従移動するような構成であっても良い。 25 to 27, the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) move in a state where they are connected at regular intervals. However, the two do not necessarily need to be in mechanical contact with each other, using a non-contact sensor or the like, while maintaining a certain spatial gap and within a certain displacement range (for example, 1 mm or less), the moving unit 42 and the moving unit. A configuration may also be adopted in which the 62 follow each other.
　いずれにしても、基板Ｓへの処理が完了した移動部４２（第１ユニット部２１）と移動部６２（第２ユニット部２２）とを、次の処理装置（第２処理装置）に搬送する為には、基板Ｓが前記処理を行なった処理装置から離れる第１方向（図２２～２７ではＸ軸方向）への並進運動と、その第１方向と交差する第２方向（図２２～２７ではＹ軸方向）への並進運動と、第１方向と第２方向を含む面内（図２２～２７ではＸＹ面）での回転運動のうち、少なくとも２つの運動が伴なうように（２つの運動が連続するように）、各キャスター５２、７２を駆動して、移動部４２と移動部６２を一緒に移動させることになる。尚、並進運動とは、必ずしもＸ軸方向やＹ軸方向に限られず、ＸＹ面内でＸ軸とＹ軸の両方に対して傾いた方向（例えば、４５度方向）に、移動部４２（第１ユニット部２１）や移動部６２（第２ユニット部２２）が直線的に移動する場合も含む。 In any case, the moving unit 42 (first unit unit 21) and the moving unit 62 (second unit unit 22) that have completed processing on the substrate S are transported to the next processing apparatus (second processing apparatus). For this purpose, the translational movement in the first direction (X-axis direction in FIGS. 22 to 27) in which the substrate S moves away from the processing apparatus that performed the above processing, and the second direction (FIGS. 22 to 27) intersecting with the first direction. (2 in the Y-axis direction) and rotational movement in the plane including the first direction and the second direction (XY plane in FIGS. 22 to 27) so that at least two movements are accompanied (2 Each caster 52, 72 is driven to move the moving part 42 and the moving part 62 together (so that two movements are continuous). The translational movement is not necessarily limited to the X-axis direction or the Y-axis direction, and the moving unit 42 (first direction) is inclined in the direction (for example, 45 degrees) with respect to both the X-axis and the Y-axis in the XY plane. This includes the case where the one unit portion 21) and the moving portion 62 (second unit portion 22) move linearly.
　以上、図２～図５に示したカセット装置（第１ユニット部２１、第２ユニット部２２）を用いた基板Ｓ（又は保護基板Ｃ）の搬送形態を説明した。しかし、各カセット装置内に、基板Ｓの温度の調整機構、湿度の調整機構、紫外線の照射機構等を設けたり、処理装置の一つとして、温度調整装置、湿度調整装置、紫外線照射装置を設置したりして、処理工程中の適当なタイミングで、基板Ｓに対して、温調、除湿、加湿、ＵＶ照射を行なうようしても良い。 As described above, the transport mode of the substrate S (or the protective substrate C) using the cassette apparatus (the first unit portion 21 and the second unit portion 22) shown in FIGS. 2 to 5 has been described. However, each cassette device is provided with a temperature adjustment mechanism, a humidity adjustment mechanism, an ultraviolet irradiation mechanism, etc., and a temperature adjustment device, a humidity adjustment device, and an ultraviolet irradiation device are installed as one of the processing devices. Alternatively, temperature adjustment, dehumidification, humidification, and UV irradiation may be performed on the substrate S at an appropriate timing during the processing step.
　一般に、大型の高精細なフラットパネルディスプレー等を生産する場合、母材である基板Ｓは、様々な処理装置に送られ、多様な処理を受ける。特に、ロール・ツー・ロール方式で、ＰＥＴやＰＥＮ等のフレキシブルなフィルム基板を連続的に処理する場合、各処理工程毎にフィルム基板に応力が溜まって、フィルム基板が変形することが考えられる。さらに、処理を受けるフィルム基板、又は基板上に既に堆積された膜材料は、各処理工程毎に温度、含有水分量、濡れ性等を適切な状態に設定しておくことも必要である。 Generally, when producing a large, high-definition flat panel display or the like, the substrate S as a base material is sent to various processing apparatuses and subjected to various processes. In particular, when a flexible film substrate such as PET or PEN is continuously processed by the roll-to-roll method, it is conceivable that stress is accumulated in the film substrate for each processing step and the film substrate is deformed. Furthermore, the film substrate to be processed, or the film material already deposited on the substrate, needs to have an appropriate temperature, moisture content, wettability and the like for each processing step.
　そこで、基板Ｓを装填したカセット装置２０（第１ユニット部２１、第２ユニット部２２）の移動中、又は待機中に、第１ユニット部２１又は第２ユニット部２２内に設けた温度調整機構、湿度調整機構、或いは紫外線照射機構を作動させる。或いは、工場内に独立して設置された温度調整装置、湿度調整装置、紫外線照射装置にカセット装置２０を移動させて基板Ｓを通す。このようにすると、基板Ｓ（又はその表面の膜材料）の温度、水分含有量、濡れ性、内部応力等の状態を、次の処理工程用の処理装置の仕様に適するように、事前に調整することができる。 Therefore, a temperature adjustment mechanism provided in the first unit portion 21 or the second unit portion 22 during the movement or standby of the cassette device 20 (the first unit portion 21 and the second unit portion 22) loaded with the substrate S. Then, the humidity adjusting mechanism or the ultraviolet irradiation mechanism is operated. Alternatively, the cassette device 20 is moved to a temperature adjusting device, a humidity adjusting device, and an ultraviolet irradiation device installed independently in the factory, and the substrate S is passed. In this way, the temperature, moisture content, wettability, internal stress, and other conditions of the substrate S (or film material on the surface) are adjusted in advance so as to suit the specifications of the processing apparatus for the next processing step. can do.
　本発明の実施形態では、ロール状の基板Ｓを保持するカセット装置２０が、各種の処理装置に対して移動可能な構成となっている為、カセット装置単位でのバッチ処理が可能である。その為、処理工程の前に、基板Ｓ（又はその表面の膜材料）の各種状態を調整する工程（１つの処理工程に相当）を組み入れたとしても、製造ライン全体での生産効率を大きく低下させること無く、歩留まりの良い生産が可能となる。 In the embodiment of the present invention, since the cassette apparatus 20 holding the roll-shaped substrate S is configured to be movable with respect to various processing apparatuses, batch processing in units of cassette apparatuses is possible. Therefore, even if a process (corresponding to one processing process) for adjusting various states of the substrate S (or film material on the surface) is incorporated before the processing process, the production efficiency of the entire production line is greatly reduced. This makes it possible to produce with good yield.
　Ｓ…基板　ＣＯＮＴ…制御部　ＢＦ…バッファ部　Ｃ…保護基板　ＣＶ…カバー部材　１０…処理部　２０…カセット装置　２１…第一ユニット部　２２…第二ユニット部　２３…接続部　２４…移動機構　３０…ガイドレール　３１…第一レール　３２…第二レール　３３…第三レール　３４ａ、３５ａ…環状レール　４２、６２…移動部　４３、６３…基板側通信部　４４、６４…移動部側通信部　４６、６６…着脱検出部　４７、６７…接触抑制部　５１、７１…筐体　５２、７２…キャスター　５３、７３…昇降部　５４、７４…キャスター駆動部　５５、７５…位置検出部　５６、７６…端子　６５…接続検出部　１００、２００…基板処理装置　１１１～１１３…処理室　１６０…リフト部 S ... Substrate CONT ... Control part BF ... Buffer part C ... Protective board CV ... Cover member 10 ... Processing part 20 ... Cassette unit 21 ... First unit part 22 ... Second unit part 23 ... Connection part 24 ... Moving mechanism 30 ... Guide Rail 31 ... first rail 32 ... second rail 33 ... third rail 34a, 35a ... annular rails 42, 62 ... moving part 43, 63 ... board side communication part 44, 64 ... moving part side communication part 46, 66 ... detachable Detection unit 47, 67 ... Contact suppression unit 51, 71 ... Casing 52, 72 ... Caster 53, 73 ... Lifting unit 54, 74 ... Caster drive unit 55, 75 ... Position detection unit 56, 76 ... Terminal 65 ... Connection detection unit 100, 200 ... substrate processing apparatus 111-113 ... processing chamber 160 ... lift section

Claims (26)

  1. 　基板の供給及び回収の一方を行う第一ユニット部と、
    　前記基板の供給及び回収の他方を行う第二ユニット部と、
    　を有し、
    　前記第一ユニット部及び前記第二ユニット部は、互いに接近又は離間可能である
    　カセット装置。     A first unit that performs one of substrate supply and recovery;
    A second unit for performing the other of supply and recovery of the substrate;
    Have
    The first unit part and the second unit part are capable of approaching or separating from each other.
  2. 　前記第一ユニット部及び前記第二ユニット部の少なくとも一方に設けられ、前記第一ユニット部及び前記第二ユニット部の一方に対し、前記第一ユニット部及び前記第二ユニット部の他方を相対移動させる移動機構を有する
    　請求項１に記載のカセット装置。     It is provided in at least one of the first unit part and the second unit part, and the other of the first unit part and the second unit part is moved relative to one of the first unit part and the second unit part. The cassette apparatus according to claim 1, further comprising a moving mechanism that moves the cassette apparatus.
  3. 　前記移動機構は、前記第一ユニット部を移動させる第一移動部と、前記第二ユニット部を移動させる第二移動部と、を有する
    　請求項２に記載のカセット装置。     The cassette apparatus according to claim 2, wherein the moving mechanism includes a first moving unit that moves the first unit unit and a second moving unit that moves the second unit unit.
  4. 　前記移動機構は、前記第一移動部及び前記第二移動部をそれぞれ独立に駆動可能である
    　請求項２又は請求項３に記載のカセット装置。     The cassette apparatus according to claim 2, wherein the moving mechanism is capable of independently driving the first moving unit and the second moving unit.
  5. 　前記第一移動部及び前記第二移動部のうち少なくとも一方の位置情報を検出する第一検出部を有する
    　請求項２から請求項４のうちいずれか一項に記載のカセット装置。     5. The cassette device according to claim 2, further comprising: a first detection unit configured to detect position information of at least one of the first moving unit and the second moving unit.
  6. 　前記位置情報は、前記第一移動部及び前記第二移動部のうち少なくとも一方の移動経路における位置を含む
    　請求項５に記載のカセット装置。     The cassette apparatus according to claim 5, wherein the position information includes a position on at least one movement path of the first moving unit and the second moving unit.
  7. 　前記第一ユニット部又は前記第一移動部に設けられ、外部との間で通信可能な第一通信部を有し、
    　前記第二ユニット部又は前記第二移動部に設けられ、外部との間で通信可能な第二通信部を有する
    　請求項３から請求項６のうちいずれか一項に記載のカセット装置。     Provided in the first unit part or the first moving part, having a first communication part capable of communicating with the outside,
    The cassette device according to any one of claims 3 to 6, further comprising a second communication unit that is provided in the second unit unit or the second moving unit and capable of communicating with the outside.
  8. 　前記第一通信部は、前記第一移動部の移動動作と、前記第一ユニット部における前記基板の供給及び回収の一方の動作と、を制御するための第一制御信号を受信し、
    　前記第二通信部は、前記第二移動部の移動動作と、前記第二ユニット部における前記基板の供給及び回収の他方の動作と、を制御するための第二制御信号を受信する
    　請求項７に記載のカセット装置。     The first communication unit receives a first control signal for controlling the movement operation of the first movement unit and one of the supply and recovery operations of the substrate in the first unit unit,
    The second communication unit receives a second control signal for controlling the moving operation of the second moving unit and the other operation of supplying and collecting the substrate in the second unit unit. The cassette apparatus as described in.
  9. 　前記第一制御信号を発信し、前記第一通信部を介して前記第一移動部と前記第一ユニット部とを制御するとともに、前記第二制御信号を発信し、前記第二通信部を介して前記第二移動部と前記第二ユニット部とを制御する制御装置をさらに有する
    　請求項８に記載のカセット装置。     Transmitting the first control signal, controlling the first moving unit and the first unit unit via the first communication unit, transmitting the second control signal, and via the second communication unit The cassette device according to claim 8, further comprising a control device that controls the second moving unit and the second unit unit.
  10. 　前記第一移動部は、前記第一ユニット部を取外し可能に支持し、
    　前記第二移動部は、前記第二ユニット部を取外し可能に支持する
    　請求項３から９のいずれか一項に記載のカセット装置。     The first moving part supports the first unit part so as to be removable,
    The cassette device according to any one of claims 3 to 9, wherein the second moving unit detachably supports the second unit unit.
  11. 　前記第一移動部に対する前記第一ユニット部の着脱状態及び前記第二移動部に対する前記第二ユニット部の着脱状態の少なくとも一方を検出する第二検出部を有する
    　請求項３から請求項１０のうちいずれか一項に記載のカセット装置。     The second detection unit that detects at least one of an attachment / detachment state of the first unit part with respect to the first movement unit and an attachment / detachment state of the second unit part with respect to the second movement unit. The cassette apparatus as described in any one.
  12. 　前記第一ユニット部は、
    　前記基板が巻かれる第一軸部と、
    　前記第一軸部の回転を制御し、前記基板を巻き取って回収する動作及び前記基板を送り出して供給する動作の一方を行う第一駆動部と、
    　前記第二ユニット部は、
    　前記基板が巻かれる第二軸部と、
    　前記第二軸部の回転を制御し、前記基板を巻き取って回収する前記動作及び前記基板を送り出して供給する前記動作の他方を行う第二駆動部と
    　を有する
    　請求項１から請求項１１のうちいずれか一項に記載のカセット装置。     The first unit part is
    A first shaft around which the substrate is wound;
    A first drive unit that controls the rotation of the first shaft part and performs one of an operation of winding and collecting the substrate and an operation of feeding and supplying the substrate;
    The second unit part is
    A second shaft around which the substrate is wound;
    The second drive unit that controls the rotation of the second shaft portion and performs the other of the operation of winding and collecting the substrate and the operation of feeding and supplying the substrate. The cassette apparatus as described in any one of them.
  13. 　前記第一ユニット部は、前記基板の表面を保護する保護基板の供給及び回収の一方を行う第一補助部を有し、
    　前記第二ユニット部は、前記保護基板の供給及び回収の他方を行う第二補助部を有する
    　請求項１２に記載のカセット装置。     The first unit portion has a first auxiliary portion that performs one of supply and recovery of a protective substrate that protects the surface of the substrate,
    The cassette device according to claim 12, wherein the second unit portion includes a second auxiliary portion that performs the other of supply and recovery of the protective substrate.
  14. 　前記第一ユニット部及び前記第二ユニット部のうち少なくとも一方は、前記基板を覆うカバー部材を装着する装着部を有する
    　請求項１から請求項１３のうちいずれか一項に記載のカセット装置。     The cassette device according to any one of claims 1 to 13, wherein at least one of the first unit portion and the second unit portion has a mounting portion for mounting a cover member that covers the substrate.
  15. 　前記第一ユニット部及び前記第二ユニット部の少なくとも一方は、外部の搬送機構に接続される接続部を有する
    　請求項１から請求項１４のうちいずれか一項に記載のカセット装置。     The cassette device according to any one of claims 1 to 14, wherein at least one of the first unit portion and the second unit portion has a connection portion connected to an external transport mechanism.
  16. 　前記第一ユニット部及び前記第二ユニット部のうち少なくとも一方は、外部との接触を抑制する抑制部を有する
    　請求項１から請求項１５のうちいずれか一項に記載のカセット装置。     The cassette device according to any one of claims 1 to 15, wherein at least one of the first unit portion and the second unit portion has a suppressing portion that suppresses contact with the outside.
  17. 　第一移動経路を移動可能に設けられ、基板の供給及び回収の一方を行う第一ユニット部と、
    　第二移動経路を移動可能に設けられ、前記基板の供給及び回収の他方を行う第二ユニット部と、
    　前記第一移動経路と前記第二移動経路との間に配置された第一基板処理部に対し、前記第一ユニット部を制御して前記基板の供給及び回収の一方を行わせるともに、前記第二ユニット部を制御して前記基板の供給及び回収の他方を行わせる制御部と、を有し、
    　前記制御部は、前記第一移動経路と前記第二移動経路との間に配置され、かつ前記第一基板処理部とは異なる第二基板処理部に対して、前記第一ユニット部及び前記第二ユニット部を移動し、前記第一ユニット部を制御して前記基板の供給及び回収の他方を行わせるとともに、前記第二ユニット部を制御して前記基板の供給及び回収の一方を行わせる
    　基板搬送装置。     A first unit that is movably provided in the first movement path and performs one of supply and recovery of the substrate;
    A second unit that is movably provided in the second movement path and performs the other of supply and recovery of the substrate;
    The first substrate processing unit disposed between the first moving path and the second moving path controls the first unit unit to perform one of supply and recovery of the substrate, and A control unit for controlling the two unit units to perform the other of the supply and recovery of the substrate,
    The control unit is disposed between the first movement path and the second movement path, and the second unit is different from the first substrate processing unit. Two unit parts are moved, the first unit part is controlled to perform the other of the supply and recovery of the substrate, and the second unit part is controlled to perform one of the supply and recovery of the substrate. Conveying device.
  18. 　前記第一ユニット部に設けられ、前記第一移動経路に沿って前記第一ユニットを移動する第一移動部と、
    　前記第二ユニット部に設けられ、前記第二移動経路に沿って前記第二ユニットを移動する第二移動部と、をさらに有する
    　請求項１７に記載の基板搬送装置。     A first moving part that is provided in the first unit part and moves the first unit along the first moving path;
    The substrate transfer apparatus according to claim 17, further comprising: a second moving unit that is provided in the second unit unit and moves the second unit along the second moving path.
  19. 　前記第一移動経路に設けられ、前記第一移動部を案内する第一レールと、
    　前記第二移動経路に設けられ、前記第二移動部を案内する第二レールと、をさらに備える
    　請求項１８に記載の基板搬送装置。     A first rail provided in the first movement path and guiding the first movement unit;
    The substrate transfer apparatus according to claim 18, further comprising: a second rail provided on the second movement path and guiding the second movement unit.
  20. 　前記第一ユニット部又は前記第一移動部に設けられ、外部との間で通信可能な第一通信部と、
    　前記第二ユニット部又は前記第二移動部に設けられ、外部との間で通信可能な第二通信部と、
    　前記第一通信部を介して、前記第一移動部の移動動作と、前記第一ユニット部における前記基板の供給又は回収の動作と、を制御するための第一制御信号を前記第一ユニット部及び前記第一移動部に送信するとともに、前記第二通信部を介して、前記第二移動部の移動動作と、前記第二ユニット部における前記基板の供給又は回収の動作と、を制御するための第二制御信号を送信する制御部と、を更に有する
    　請求項１９に記載の基板搬送装置。     A first communication unit provided in the first unit unit or the first moving unit and capable of communicating with the outside;
    A second communication unit provided in the second unit unit or the second moving unit and capable of communicating with the outside;
    Via the first communication unit, a first control signal for controlling the moving operation of the first moving unit and the operation of supplying or collecting the substrate in the first unit unit is sent to the first unit unit. And for controlling the movement operation of the second movement unit and the operation of supplying or collecting the substrate in the second unit unit via the second communication unit. The substrate transfer apparatus according to claim 19, further comprising: a control unit that transmits the second control signal.
  21. 　前記第一ユニット部及び前記第二ユニット部の少なくとも一方を待機させるバッファ部を更に備える
    　請求項１７から請求項２０のいずれか一項に記載の基板搬送装置。     21. The substrate transfer apparatus according to claim 17, further comprising a buffer unit that waits for at least one of the first unit unit and the second unit unit.
  22. 　前記第一ユニット部及び前記第二ユニット部の少なくとも一方は、複数設けられている
    　請求項１７から請求項２１のいずれか一項に記載の基板搬送装置。     The substrate transfer apparatus according to any one of claims 17 to 21, wherein a plurality of at least one of the first unit part and the second unit part is provided.
  23. 　第一移動経路と第二移動経路との間に配置され、可撓性を有する基板に対して処理を行う複数の処理部と、
    　請求項１７から請求項２２のいずれか一項に記載の基板搬送装置と、
    　を備える基板処理装置。     A plurality of processing units arranged between the first movement path and the second movement path and performing processing on a flexible substrate;
    The substrate transfer device according to any one of claims 17 to 22,
    A substrate processing apparatus comprising:
  24. 　複数の前記処理部は、互いに異なる処理を行う前記第一基板処理部及び前記第基板二処理部を含み、
    　前記第一処理部と前記第二処理部とは、前記第一移動経路と前記第二移動経路との間における異なる領域に配置されている
    　請求項２３に記載の基板処理装置。     The plurality of processing units include the first substrate processing unit and the second substrate second processing unit that perform different processes.
    The substrate processing apparatus according to claim 23, wherein the first processing unit and the second processing unit are arranged in different regions between the first movement path and the second movement path.
  25. 　複数の前記処理部は、前記基板に膜を形成する膜形成装置、前記基板を加熱する加熱装置、前記基板を洗浄する洗浄装置、前記基板を露光する露光装置及び前記基板を検査する検査装置のうち少なくとも一つを含む
    　請求項２３又は請求項２４に記載の基板処理装置。     The plurality of processing units include: a film forming apparatus that forms a film on the substrate; a heating apparatus that heats the substrate; a cleaning apparatus that cleans the substrate; an exposure apparatus that exposes the substrate; and an inspection apparatus that inspects the substrate The substrate processing apparatus according to claim 23 or 24, comprising at least one of them.
  26. 　可撓性を有する長尺の基板を複数の処理装置に順次送って、前記基板上に電子デバイスを形成する為の処理方法であって、
    　第一基板処理部に供給すべき前記基板が長尺方向に巻かれた供給ロールを含む第一ユニット部と、前記第一基板処理部から回収すべき前記基板が長尺方向に巻かれる回収ロールを含む第二ユニット部とを、前記第一基板処理部を挟むように配置し、前記供給ロールから供給される前記基板を前記第一基板処理部によって処理して前記回収ロールで回収する第一処理工程と、
    　前記供給ロールと前記回収ロールの間の前記基板が前記第一基板処理部から離れるような第一方向に沿って、前記第一ユニット部と前記第二ユニット部を共に移動させる第一移動工程と、
    　前記供給ロールと前記回収ロールの前記長尺方向の間隔を狭める為に、前記第一ユニット部と前記第二ユニット部の少なくとも一方を前記第一方向と交差する第二方向に沿って移動させる第二移動工程と、
    　前記第二方向の並進運動、前記第二方向の並進運動、前記第一方向と第二方向を含む面内での回転運動のうち、少なくとも二つの運動を伴って、所定間隔で対向した前記第一ユニット部と前記第二ユニット部を、前記第一基板処理部と異なる第二基板処理部に向けて一緒に移動させる第三移動工程と、
    　を含む基板処理方法。     A processing method for sequentially sending a long substrate having flexibility to a plurality of processing apparatuses to form an electronic device on the substrate,
    A first unit unit including a supply roll in which the substrate to be supplied to the first substrate processing unit is wound in the longitudinal direction, and a recovery roll in which the substrate to be recovered from the first substrate processing unit is wound in the longitudinal direction And a second unit portion including the first substrate processing unit, the first substrate processing unit processing the substrate supplied from the supply roll, and collecting the first substrate processing unit with the recovery roll Processing steps;
    A first moving step of moving the first unit part and the second unit part together in a first direction such that the substrate between the supply roll and the recovery roll is separated from the first substrate processing part; ,
    In order to narrow the gap between the supply roll and the collection roll in the longitudinal direction, at least one of the first unit part and the second unit part is moved along a second direction intersecting the first direction. Two transfer processes;
    Of the translational motion in the second direction, the translational motion in the second direction, and the rotational motion in the plane including the first direction and the second direction, the first facing each other at a predetermined interval with at least two motions. A third moving step of moving one unit part and the second unit part together toward a second substrate processing unit different from the first substrate processing unit;
    A substrate processing method.
PCT/JP2012/082695 2012-04-13 2012-12-17 Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method WO2013153706A1 (en)

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