JP5494124B2 - Pattern forming method, color filter manufacturing method, and pattern forming apparatus - Google Patents

Description

  The present invention relates to a pattern forming method for forming a patterned photosensitive material layer on a plastic substrate, a method for manufacturing a color filter including this method, and a pattern forming apparatus, and more particularly, to a patterned photosensitive material layer. The present invention relates to a pattern forming method, a color filter manufacturing method, and a pattern forming apparatus.

  In recent years, a liquid crystal display panel has been developed using a plastic material instead of glass as a base material, and a patterned black matrix and a color filter having a plurality of red pixels, green pixels, and blue pixels arranged on one side. ing. Thus, by making the base material made of plastic, the color filter is reduced in thickness and cost, and the base material is prevented from cracking (see Patent Documents 1 to 5).

Japanese Patent No. 2786946 JP 2006-269802 A JP 2003-177551 A JP 2003-66423 A JP 2003-295170 A

  However, such plastic base materials are likely to change in dimensions under the influence of the surrounding environment such as humidity and temperature. For example, when a photosensitive material layer on a plastic substrate that has absorbed a large amount of moisture is exposed, the plastic substrate releases moisture from the inside during patterning and storage. This changes the dimensions of the plastic substrate and reduces the patterning accuracy. In addition, when the photosensitive material layer on the dried plastic substrate is exposed, moisture is absorbed thereafter, so that the patterning accuracy also decreases in this case.

  In order to cope with this, it is conceivable to store the plastic substrate in the ambient environment before the exposure so that the moisture content of the plastic substrate is balanced with the ambient environment. However, in this case, there is a problem that a lot of time is spent for storing the plastic substrate. Moreover, when the dried plastic base material is wound in roll shape, the moisture absorption speed | rate of a plastic base material differs in the inner peripheral side part and outer peripheral side part of this plastic base material. As a result, as shown in FIG. 10, the moisture content differs between the inner peripheral portion and the outer peripheral portion of the plastic substrate wound in a roll shape, and the moisture content of the plastic substrate becomes non-uniform. There is also.

  Further, an exposure machine that exposes by reducing or enlarging a mask pattern as shown in Patent Document 1 is known, and this mask is used to reduce the mask pattern in response to shrinkage or expansion of a plastic substrate. Alternatively, the exposure is performed with enlargement. However, in this case, the expansion / contraction ratio of the plastic substrate is calculated using a mark formed on the plastic substrate or perforation. For this reason, it is difficult to expose the mask pattern in accordance with the expansion / contraction ratio of the plastic substrate during the first exposure (first plate) in which such a mark or the like is not formed.

  Further, a direct drawing type exposure machine that exposes by reducing or enlarging a pattern as shown in Patent Document 2 is known, and this direct drawing type exposure machine is used to cope with shrinkage or expansion of a plastic substrate. The exposure is also performed by reducing or enlarging the pattern. However, even in this case, since the stretch rate of the plastic base material is calculated using the marks formed on the plastic base material, the pattern corresponding to the stretch rate of the plastic base material is obtained at the first exposure. Is difficult to expose.

  Patent Document 3 discloses a method of performing patterning after vacuum or heat dehydration. However, in this case, after the patterning is completed and stored, the plastic substrate absorbs moisture. For this reason, there exists a problem that a plastic base material changes in dimension and the precision of patterning falls.

  Patent Document 4 discloses a method in which a plastic substrate after dehydration is stored in a high-temperature and high-humidity environment, and the moisture content is accelerated and returned to an equilibrium moisture content in an assembly environment. However, in this case, there is a problem that the work process becomes complicated and takes time.

  Further, Patent Document 5 discloses a method of performing exposure by changing the size of a pattern of a plastic substrate by changing the temperature of the plastic substrate. However, there is a problem that it takes much time for the dimensions of the plastic substrate to follow the change in temperature. In addition, a method for adjusting the size of a pattern formed on a plastic substrate by exposing using a mask having a different pattern or pitch size is shown. There is a problem of spanning. Further, even in such Patent Document 5, since the expansion / contraction ratio of the plastic substrate is calculated using a mark or the like formed on the plastic substrate, at the first exposure when the mark or the like is not formed, It is difficult to expose the mask pattern in accordance with the expansion / contraction ratio of the plastic substrate.

  The present invention has been made in consideration of such points, and a pattern forming method and a color filter that can form a patterned photosensitive material layer on a plastic substrate with high accuracy and speed. It is an object to provide a method and a pattern forming apparatus.

  The present invention relates to a pattern forming method for forming a patterned photosensitive material layer on a plastic substrate, a step of preparing the plastic substrate, and applying and drying the photosensitive material on the plastic substrate. The step of forming the photosensitive material layer, the step of measuring the moisture content of the plastic substrate on which the photosensitive material layer is formed, using a moisture content measuring device, and the photosensitive material layer on the plastic substrate using an exposure device A step of exposing with a predetermined pattern, and a step of developing and patterning the exposed photosensitive material layer, and measured by a moisture content measuring device when exposing the photosensitive material layer on the plastic substrate. An exposure apparatus is controlled by a control device based on a moisture content, and a pattern to be exposed is enlarged or reduced.

  In the present invention, when exposing a photosensitive material layer on a plastic substrate, exposure light passing through a photomask of an exposure apparatus formed in a predetermined pattern is irradiated to the photosensitive material layer through a projection lens, The photosensitive material layer is exposed in a predetermined pattern, and the control device moves the projection lens relative to the photosensitive material layer based on the moisture content measured by the moisture content measuring device. The pattern forming method is characterized in that an exposure apparatus is controlled.

  In the present invention, when exposing the photosensitive material layer on the plastic substrate, the plastic substrate is placed on the stage, and the stage is moved in a horizontal plane based on a predetermined pattern while irradiating the exposure light. The photosensitive material layer is exposed in a predetermined pattern. Based on the moisture content measured by the moisture content measuring device, the exposure device is controlled by the control device so as to change the moving amount of the stage. This is a pattern forming method.

  The present invention is the pattern forming method characterized in that the enlargement ratio or reduction ratio of the exposed pattern is linearly related to the measured moisture content.

  According to the present invention, in the step of forming the photosensitive material layer, a wiring material layer made of a conductive material is provided on a plastic substrate, the photosensitive material layer is formed on the wiring material layer, and the photosensitive material layer is After patterning, the wiring material layer is etched and patterned using the photosensitive material layer as a resist.

  The present invention provides a color filter comprising a step of forming a photosensitive material layer for pixels of a plurality of colors patterned so as to constitute pixels of a plurality of colors on a plastic substrate by the pattern forming method described above. A method for producing a color filter characterized by the following.

  The present invention relates to a pattern forming apparatus for forming a patterned photosensitive material layer on a plastic substrate, and applying the photosensitive material to the plastic substrate to form the photosensitive material layer. A moisture content measuring device for measuring the moisture content of the plastic substrate on which the photosensitive material layer is formed, an exposure device for exposing the photosensitive material layer on the plastic substrate in a predetermined pattern, and the exposed photosensitive material A developing device for developing and patterning the active material layer, and a control device for controlling the exposure device to enlarge or reduce the pattern to be exposed based on the moisture content measured by the moisture content measuring device. This is a pattern forming apparatus.

  According to the present invention, an exposure apparatus includes a light source that emits exposure light, a photomask formed in a predetermined pattern, a stage on which a plastic substrate is placed, and a position perpendicular to the stage between the photomask and the stage. A projection lens that is movably provided in the direction and that irradiates the photosensitive material layer with exposure light that has passed through a photomask; and a lens drive unit that moves the projection lens, and the moisture content measured by the moisture content measuring device Based on the rate, the control device controls the lens driving unit of the exposure device so as to move the projection lens relative to the photosensitive material layer.

  The present invention is a pattern forming apparatus characterized in that the control device controls the lens driving unit so that the enlargement ratio or reduction ratio of the exposed pattern has a linear relationship with the measured moisture content. .

  In the present invention, an exposure apparatus is provided between a light source that emits exposure light, a plastic substrate, a stage that is movable in a horizontal plane, and the light source. The exposure apparatus receives exposure light from the light source. A projection lens that irradiates the photosensitive material layer and a stage drive unit that moves the stage. The stage is moved in a horizontal plane based on a predetermined pattern while irradiating exposure light, so that the photosensitive material layer is predetermined. And the control device, based on the moisture content measured by the moisture content measuring device, changes the amount of movement of the stage corresponding to the pattern. It is a pattern forming apparatus characterized by controlling.

  The present invention is a pattern forming apparatus characterized in that the control device controls the stage drive unit so that the enlargement ratio or reduction ratio of the exposed pattern has a linear relationship with the measured moisture content. .

  According to the present invention, after measuring the moisture content of the plastic substrate, the pattern is enlarged or reduced based on the measured moisture content, and the photosensitive material layer on the plastic substrate is exposed. Thereby, the patterned photosensitive resin layer can be accurately formed on the plastic substrate regardless of the difference in the moisture content of the plastic substrate.

  In addition, according to the present invention, a color filter is obtained in which a photosensitive material layer for a plurality of color pixels patterned so as to constitute a plurality of color pixels is formed on a plastic substrate with high accuracy. Thereby, the accuracy of the display image of the color filter can be improved.

FIG. 1 is a diagram illustrating an example of a cross-sectional configuration of a color filter according to a first embodiment of the present invention. FIG. 2 is a diagram showing a pattern forming apparatus according to the first embodiment of the present invention. 3A, 3B, 3C, and 3D are plan views showing a plastic substrate in the first embodiment of the present invention. FIG. 4 is a diagram showing a relationship between a moisture content of a plastic substrate and a dimensional change in the pattern forming method according to the first embodiment of the present invention. FIG. 5 is a diagram showing a process of the pattern forming method according to the first embodiment of the present invention. FIG. 6 shows a pattern forming apparatus according to the second embodiment of the present invention. FIGS. 7A, 7B, and 7C are plan views showing a plastic substrate in the second embodiment of the present invention. FIG. 8 shows a pattern forming apparatus according to the third embodiment of the present invention. FIG. 9 is a diagram showing a process of a pattern forming method according to the third embodiment of the present invention. FIG. 10 is a view showing a moisture content of a plastic substrate wound in a roll shape.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment Hereinafter, an embodiment of the invention will be described with reference to the drawings. Here, FIGS. 1 to 5 are diagrams showing a pattern forming method and a color filter manufacturing method according to the first embodiment of the present invention.

  First, the cross-sectional configuration of the color filter 1 obtained by the pattern forming method and the color filter manufacturing method in the present embodiment will be described with reference to FIG. Among these, the pattern forming method is for forming the patterned photosensitive material layer 3 on the plastic substrate 2.

  As shown in FIG. 1, a color filter 1 obtained by the method for producing a color filter in the present embodiment includes a plastic substrate 2 and a plurality of banks (partition walls) 3b formed on the plastic substrate 2. And a black matrix 3. Among these, the black matrix 3 has a plurality of substantially rectangular openings 3c (see FIG. 6) formed by a plurality of banks 3b. Such a black matrix 3 is composed of a photosensitive material layer 3a patterned with a photosensitive material having photosensitivity.

  Usually, a plurality of color pixels are formed in each opening 3 c of the black matrix 3 on the plastic substrate 2. That is, a plurality of red pixels 4 are formed in each opening 3c of the black matrix 3 by a photosensitive material for red (R) pixels, a photosensitive material for green (G) pixels, and a photosensitive material for blue (B) pixels. , Green pixel 5 and blue pixel 6 are formed. The arrangement of the pixels 4, 5, 6 is not shown, but may be a known arrangement such as a stripe arrangement, a delta arrangement (triangle arrangement), a square arrangement (four pixel arrangement), or the like. Thus, one display pixel on the screen is formed by three adjacent pixels having different colors. Further, yellow pixels (not shown) or the like may be added to form four or more color pixels.

  Further, these pixels 4, 5, 6 are covered with a protective layer 7. A transparent electrode film 8 made of indium tin oxide (ITO) is formed on the protective layer 7.

  Such a color filter 1 is combined with, for example, a liquid crystal element including a switching element (for example, TFT) and a liquid crystal layer arranged corresponding to each of the pixels 4, 5, and 6, and a surface light source. LCD) or electronic paper. In this configuration, the liquid crystal is controlled by the switching element to function as a shutter, and emits light from the surface light source only through pixels of a desired color. In this way, a color image is displayed on the screen.

  Next, the material of each component of the color filter 1 will be described.

  As a material used for the plastic substrate 2, cycloolefin polymer and polycarbonate are preferable for LCD applications because of high heat resistance, low water absorption, and low retardation. For electronic paper applications, polyethylene terephthalate and polyethylene naphthalate are preferable because they are mass-produced products and low cost. Besides these, polyethersulfone, polyethylene naphthol, polyimide, and organic-inorganic composite resin can be used because of high heat resistance. Moreover, it is preferable that the thickness of the plastic base material 2 is 50-300 micrometers, and it is preferable that it is about 100 micrometers especially from the ease of handling. Thereby, it can wind around the supply roll 11 and the winding roll 19 of the pattern formation apparatus 10 mentioned later, and can ensure required intensity | strength.

  As the photosensitive material for forming the photosensitive material layer 3a, it is preferable to use a pigment-dispersed photosensitive resin composition containing a black pigment having a light shielding property, a solvent, and a bonding resin (binder). Similarly, it is preferable to use a photosensitive resin composition in which a pigment of each color is dispersed as the photosensitive material for each color pixel.

  Next, a pattern forming apparatus 10 for carrying out the pattern forming method in the present embodiment using the photolithography method will be described with reference to FIG.

  As shown in FIG. 2, the pattern forming apparatus 10 is provided on a supply roll 11 around which a continuous belt-shaped plastic substrate 2 is wound, and on the downstream side in the traveling direction of the supply roll 11, and is fed from the supply roll 11. It has a photosensitive material application part 12 for applying a photosensitive material in a film shape to the plastic substrate 2. The photosensitive material application unit 12 applies a photosensitive material onto the plastic substrate 2 by a die coater or a printing method (offset printing or the like) to form the photosensitive material layer 3a.

  Here, when the photosensitive material layer 3a is formed by continuously applying the photosensitive material on the plastic substrate 2 by the die coater, as shown in FIG. 3A, the side of the photosensitive material layer 3a is formed. An uncoated region 2a where no photosensitive material is coated is provided. This non-application area | region 2a becomes an area | region which infrared rays are irradiated by the sensor part 14a of the moisture content measuring apparatus 14 mentioned later, and it is preferable to have a width | variety of 5-300 mm, especially a width | variety of 10-100 mm. . Thereby, while ensuring the area | region of the photosensitive material layer 3a on the plastic base material 2, infrared rays remove | deviate from the plastic base material 2, and the photosensitive material layer 3a is irradiated, and a moisture content is measured. It is possible to prevent the accuracy from decreasing. In addition, although not shown in figure, this uncoated area | region 2a may be provided in the both sides of the photosensitive material layer 3a.

  Further, when the photosensitive material is intermittently applied on the plastic substrate 2 by offset printing or the like, the photosensitive material layer 3a is intermittently formed on the plastic substrate 2 as shown in FIG. Is formed, and an uncoated region 2a to which no photosensitive material is applied is provided between the photosensitive material layers 3a. Here, the dimension between the photosensitive material layers 3a is preferably 5 to 300 mm, more preferably 10 to 100 mm. As a result, the region of the photosensitive material layer 3a on the plastic substrate 2 can be secured, and the measurement accuracy of the moisture content can be prevented from being lowered by being irradiated to the photosensitive material layer 3a. The uncoated region 2a is not limited to be provided between the photosensitive material layers 3a, and is formed in a rectangular shape as shown in FIG. 3C in an arbitrary portion of the photosensitive material layer 3a. May be. In this case, each side of the rectangle is preferably 5 to 300 mm, particularly 10 to 100 mm. Further, the uncoated portion 2a may be formed in an elliptical shape or a circular shape as shown in FIG. 3 (d). In this case, the elliptical shape or the circular shape has a major axis or diameter of 5 to 300 mm, particularly 10 to 100 mm. It is preferable to have. Furthermore, such an unapplied portion 2a is not limited to the shape described above, and can be an arbitrary shape.

  A drying processing unit 13 for drying (pre-baking) the photosensitive material layer 3a on the plastic substrate 2 is provided on the downstream side of the photosensitive material application unit 12. The drying processing unit 13 is configured to dry the photosensitive material layer 3a at a temperature of about 50 to 120 ° C. for about 1 to 5 minutes.

  A moisture content measuring device 14 for measuring the moisture content of the plastic substrate 2 on which the photosensitive material layer 3a is formed is provided on the downstream side of the drying processing unit 13. The moisture content measuring device 14 in the present embodiment irradiates the plastic substrate 2 with infrared rays, detects the absorption rate of the infrared rays absorbed by the plastic substrate 2, and obtains the absorption rate and moisture content obtained in advance. The water content is calculated from the relationship. That is, the moisture content measuring device 14 irradiates the uncoated area 2a of the plastic substrate 2 with infrared rays to detect the absorption rate of infrared rays absorbed by the plastic substrate 2, and the sensor unit 14a. A moisture meter 14b for determining the moisture content of the portion of the plastic substrate 2 irradiated with infrared rays based on the relationship between the absorption rate and the moisture content determined in advance based on the detected absorption rate. ing. As the moisture meter 14b, for example, a transmission infrared film thickness meter / moisture meter RX-100 manufactured by Kurabo Industries, Ltd. can be used.

  An exposure device 15 that exposes the photosensitive material layer 3a on the plastic substrate 2 in a predetermined pattern is provided downstream of the moisture content measuring device. The exposure apparatus 15 includes a light source (not shown) that emits exposure light (UV light), and a photomask 15a on which a predetermined reference pattern (a shape corresponding to the black matrix 3 and an alignment mark (not shown)) is formed. And a stage 15b on which the plastic substrate 2 is placed.

  Further, a projection lens 15c that projects exposure light that has passed through the photomask 15a onto the photosensitive material layer 3a is provided between the photomask 15a of the exposure apparatus 15 and the stage 15b. The projection lens 15c is movable in the vertical direction with respect to the stage 15b. Further, a lens driving unit 15d that moves the projection lens 15c is connected to the projection lens 15c. By moving the projection lens 15c by the lens driving unit 15d, the pattern exposed to the photosensitive material layer 3a is enlarged or reduced.

  A control device 16 is connected to the lens driving unit 15 d of the exposure device 15. The control device 16 controls the exposure device 15 so as to enlarge or reduce the pattern to be exposed based on the moisture content measured by the moisture content measuring device 14. That is, the control device 16 in the present embodiment controls the lens driving unit 15d of the exposure device 15 to move the projection lens 15c of the exposure device 15 based on the measured moisture content. In this case, the lens driving unit 15d is controlled so that the enlargement ratio or reduction ratio of the exposed pattern has a linear relationship with the measured moisture content.

  Here, when the room temperature is constant, the dimensions of the plastic substrate 2 are determined by the moisture content of the plastic substrate 2. The moisture content of the plastic substrate 2 and the dimensional change amount of the plastic substrate 2 are in a linear relationship as shown in FIG. FIG. 4 shows, as an example, the relationship between the moisture content and the dimensional change of a PEN (polyethylene naphthalate) film (manufactured by Teijin DuPont, product name: Q65FA, film thickness: 100 μm). Here, it is shown that the moisture content x and the dimensional change amount y of the plastic substrate 2 are approximated by y = 208.33x−59.649. Since the moisture content and the dimensional change amount are in a linear relationship in this way, the exposure pattern can be accurately adjusted according to the moisture content by making the magnification rate or reduction rate of the exposed pattern linear with respect to the moisture content. Can be enlarged or reduced.

  As shown in FIG. 2, a developing device 17 for developing and patterning the exposed photosensitive material layer 3 a is provided on the downstream side of the exposure device 15. The developing device 17 develops the photosensitive material layer 3a using, for example, a 0.05 to 10% solution of potassium hydroxide (KOH) as a developer. In this manner, the photosensitive material layer 3a is patterned to define a predetermined pattern, that is, a plurality of substantially rectangular openings 3c.

  A heat treatment unit 18 is provided on the downstream side of the developing device 17 to heat-treat the plastic substrate 2 on which the photosensitive material layer 3a is patterned. In this heat treatment part 18, it is preferable that the plastic base material 2 is heat-treated at a temperature below its glass transition point. That is, when polyethylene naphthalate is used for the plastic substrate 2, the plastic substrate 2 is heat-treated at about 50 to 160 ° C. for about 1 to 60 minutes together with the photosensitive material layer 3a. Thus, the photosensitive material layer 3a is cured (post-baked).

  A take-up roll 19 is provided on the downstream side of the heat treatment section 18 to take up the heat-treated plastic substrate 2. Further, a plurality of guide rolls 20 for guiding the plastic substrate 2 are provided at appropriate positions between the supply roll 11 and the take-up roll 19.

  Next, the operation of the present embodiment having such a configuration, that is, the pattern forming method and the color filter manufacturing method according to the present embodiment will be described with reference to FIGS.

  First, the plastic base material 2 is prepared (step S11). In this case, as shown in FIG. 2, a supply roll 11 around which a continuous belt-shaped plastic substrate 2 made of polyethylene naphthalate is wound is prepared.

  Next, the plastic base material 2 is unwound from the supply roll 11, and a photosensitive material is applied to the plastic base material 2 by the photosensitive material application unit 12 to form a photosensitive material layer 3 a. (Step S12).

  The photosensitive material layer 3a formed on the plastic substrate 2 is dried by the drying processing unit 13 (step S13). In this case, the photosensitive material layer 3a is pre-baked at a temperature of about 50 ° C. to 120 ° C. for about 1 to 5 minutes, the solvent contained in the photosensitive material layer 3a evaporates, and the plastic group of the photosensitive material layer 3a Adhesion to the material 2 can be improved.

  The moisture content of the plastic substrate 2 on which the photosensitive material layer 3a has been pre-baked is measured by the moisture content measuring device 14 (step S14). In this case, first, infrared rays are irradiated onto the plastic substrate 2 from the sensor unit 14a of the moisture content measuring device 14, and the absorption rate of infrared rays absorbed by the plastic substrate 2 is detected by the sensor unit 14a. Thereafter, the moisture content of the portion of the plastic substrate 2 irradiated with infrared rays is determined by the moisture meter 14b from the relationship between the absorption rate and the moisture content determined in advance. In addition, it is preferable that this moisture content measuring apparatus 14 measures the moisture content of the plastic base material 2 for every area | region exposed by the exposure apparatus 15 mentioned later. Thereby, each patterning of the photosensitive material layer 3a sequentially formed on the strip-shaped plastic substrate 2 can be accurately formed. However, the present invention is not limited to this, and the moisture content may be measured for each of a plurality of exposure areas.

  Next, the exposure device 15 exposes the photosensitive material layer 3a on the plastic substrate 2 in a predetermined pattern (step S15). In this case, exposure is performed using a black matrix 3 having a predetermined shape and a photomask 15a for forming alignment marks.

  Further, in this case, the lens driving unit 15d is controlled by the control device 16 so as to move the projection lens 15c of the exposure device 15 in the direction perpendicular to the photosensitive material layer 3a based on the measured moisture content. . In this case, for example, when the moisture content of the plastic substrate 2 is larger than the equilibrium state with the reference surrounding environment, the projection lens 15c is moved so as to enlarge the pattern. On the other hand, when the moisture content of the plastic substrate 2 is smaller than the equilibrium state with the surrounding environment, the projection lens 15c is moved so as to reduce the pattern. In this manner, the pattern exposed to the photosensitive material layer 3a is enlarged or reduced according to the moisture content of the plastic substrate 2.

  The exposed photosensitive material layer 3a is developed by the developing device 17 (step S16). Thus, the photosensitive material layer 3a can be patterned so as to define a predetermined pattern, that is, a plurality of substantially rectangular openings 3c.

  Next, heat treatment is performed on the photosensitive material layer 3a on the plastic substrate 2 by the heat treatment unit 18 (step S17). In this case, the photosensitive material layer 3a is heat-treated and cured (post-baked) at about 50 to 160 ° C. for about 1 to 60 minutes.

  In this way, the photosensitive material layer 3a on the plastic substrate 2 is patterned. Thereafter, the plastic substrate 2 is wound and collected by the winding roll 19 (step S18).

  Thereafter, a photosensitive material layer for a plurality of color pixels patterned to form a plurality of color pixels is formed on the plastic substrate 2. That is, by repeating steps S12 to S17 described above, the photosensitive material for red pixel, the photosensitive material for green pixel, and the photosensitive material for blue pixel are respectively applied on the plastic substrate 2, and the plastic substrate A plurality of red pixels 4, green pixels 5, and blue pixels 6 are formed in each opening 3 c of the black matrix 3 on 2. In this case, in step S12, the photosensitive material for red pixel, the photosensitive material for green pixel, and the photosensitive material for blue pixel containing the pigment of each color are applied on the plastic substrate 2, and in step S15, The exposure is performed using a photomask corresponding to the arrangement of the pixels 4, 5, 6. Thus, a photosensitive material layer for red pixels patterned so as to constitute a plurality of red pixels 4, a photosensitive material layer for green pixels patterned so as to constitute a plurality of green pixels 5, and a plurality of blue colors The photosensitive material layer for blue pixels patterned so as to constitute the pixel 6 is formed. In this way, the color filter 1 is obtained.

  As described above, according to the present embodiment, after the moisture content of the plastic substrate 2 is measured, the projection lens 15c of the exposure device 15 is moved on the plastic substrate 2 based on the measured moisture content. The photosensitive material layer 3a is exposed. In this case, the exposed pattern is enlarged or reduced according to the moisture content of the plastic substrate 2. Thereby, when the moisture content of the plastic substrate 2 is in equilibrium with the surrounding environment, the pattern of the photosensitive material layer 3a on the plastic substrate 2 is changed to the reference formed on the photomask 15a. Can be made to substantially match the pattern shape. For this reason, the patterned photosensitive material layer 3a can be accurately and rapidly formed on the plastic substrate 2.

  Further, according to the present embodiment, it is possible to obtain the color filter 1 using the plastic substrate 2 on which the black matrix 3, the red pixel 3, the green pixel 5, and the blue pixel 6 are patterned with high accuracy. Thereby, the accuracy of the display image of the color filter 1 can be improved.

  In the present embodiment, the moisture content measuring device 14 irradiates the uncoated area 2a of the plastic substrate 2 with infrared rays, detects the absorption rate of infrared rays absorbed by the plastic substrate 2, and obtains it in advance. An example in which the moisture content is determined from the relationship between the absorption rate and the moisture content described above has been described. However, the present invention is not limited to this. If the moisture content of the plastic substrate 2 can be measured, other methods (for example, a microwave on-line moisture meter (Malcam), an electric resistance moisture meter (Corporation) It is also possible to use a measuring device manufactured by Yamazaki Seiki Laboratory.

  In the present embodiment, the example in which the black matrix 3 and the pixels 4, 5, 6 of each color are patterned on the plastic substrate 2 to obtain the color filter 1 has been described. However, the present invention is not limited to this, and the photosensitive material for red pixel, the photosensitive material for green pixel, and the photosensitive material for blue pixel are applied without forming the black matrix 3 on the plastic substrate 2. A photosensitive material layer for red pixels patterned so as to constitute a plurality of red pixels, a photosensitive material layer for green pixels patterned so as to constitute a plurality of green pixels, and a plurality of blue pixels. The color filter 1 may be obtained by forming a patterned photosensitive material layer for blue pixels as described above. Even in this case, the red pixel, the green pixel, and the blue pixel can be formed with high accuracy, and the accuracy of the display image of the color filter 1 can be improved.

  Further, in the present embodiment, the example in which the red pixel 4, the green pixel 5, and the blue pixel 6 are formed as the pixels of each color of the color filter 1 has been described. However, the present invention is not limited to this, and yellow (Y) pixels, magenta (M) pixels, and cyan (C) pixels may be formed as pixels of each color of the color filter 1. That is, a yellow pixel photosensitive material, a magenta pixel photosensitive material, and a cyan pixel photosensitive material are coated on the plastic substrate 2 and patterned to form a plurality of yellow pixels. Forming a photosensitive material layer, a magenta pixel photosensitive material layer patterned to constitute a plurality of magenta pixels, and a cyan pixel photosensitive material layer patterned to constitute a plurality of cyan pixels; The color filter 1 may be obtained.

Second Embodiment Next, a pattern forming method, a color filter manufacturing method, and a pattern forming apparatus according to a second embodiment of the present invention will be described with reference to FIGS.

  The second embodiment shown in FIGS. 6 and 7 is different only in that the photosensitive material layer is patterned on a single-wafer plastic substrate, and other configurations are shown in FIGS. This is substantially the same as the first embodiment shown. 6 and 7, the same parts as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the first embodiment shown in FIG. 1 to FIG. 5, an example is described in which a plastic base material 2 that is continuous in a strip shape is unwound from a supply roll 11 and is wound on a winding roll 19 by performing a process in each step. did. In the second embodiment shown in FIGS. 6 and 7, an example will be described in which the single-wafer plastic substrate 2 performs the process of each step in the first embodiment.

  That is, the pattern forming apparatus 30 shown in FIG. 6 includes a base material supply unit 31 on which single-sheet plastic base materials 2 are stacked. The plastic base material 2 is unloaded from the base material supply unit 31, and the process of each step is performed, and the plastic base material 2 is stacked on the base material recovery unit 32 and recovered.

  The photosensitive material application unit 12 is configured to apply a photosensitive material on the plastic substrate 2 by a die coater or a printing method (offset printing or the like) to form the photosensitive material layer 3a. Here, when the photosensitive material layer 3a is formed by applying a photosensitive material on the plastic substrate 2 with a die coater, as shown in FIG. 7A, the photosensitive material layer 3a is exposed laterally. An uncoated area 2a where no material is applied is provided. This non-application area | region 2a becomes an area | region where infrared rays are irradiated by the sensor part 14a of the moisture content measuring apparatus 14, and it is preferable to have a width | variety of 5-300 mm, especially a width | variety of 10-100 mm. Thereby, while ensuring the area | region of the photosensitive material layer 3a on the plastic base material 2, infrared rays remove | deviate from the plastic base material 2, and the photosensitive material layer 3a is irradiated, and a moisture content is measured. It is possible to prevent the accuracy from decreasing. In addition, although not shown in figure, this uncoated area | region 2a may be provided in the both sides of the photosensitive material layer 3a.

  Further, when the photosensitive material layer 3a is formed by applying a photosensitive material on the plastic substrate 2 by offset printing or the like, as shown in FIG. 7A, the photosensitive material layer 3a is exposed to the side. The non-application area | region 2a in which a conductive material is not apply | coated is provided. In addition, it is not restricted to this, You may form in a rectangular shape as shown in FIG.7 (b) in the arbitrary parts of the photosensitive material layer 3a. In this case, each side of the rectangle is preferably 5 to 300 mm, particularly 10 to 100 mm. Further, the uncoated portion 2a may be formed in an elliptical shape or a circular shape as shown in FIG. 7C. In this case, the elliptical shape or the circular shape has a major axis or diameter of 5 to 300 mm, particularly 10 to 100 mm. It is preferable to have. Furthermore, such an unapplied portion 2a is not limited to the shape described above, and can be an arbitrary shape.

  The process in each step is substantially the same as in the first embodiment. In the present embodiment, each plastic substrate 2 is preferably attached on a support substrate (not shown) formed of glass or the like. Thus, the single-wafer plastic substrate 2 can be conveyed in the pattern forming apparatus 30.

  As described above, according to the present embodiment, after the moisture content of the plastic substrate 2 is measured, the projection lens 15c of the exposure device 15 is moved on the plastic substrate 2 based on the measured moisture content. The photosensitive material layer 3a is exposed. In this case, the exposed pattern is enlarged or reduced according to the moisture content of the plastic substrate 2. Thereby, when the moisture content of the plastic substrate 2 is in equilibrium with the surrounding environment, the pattern of the photosensitive material layer 3a on the plastic substrate 2 is changed to the reference formed on the photomask 15a. Can be made to substantially match the pattern shape. For this reason, the patterned photosensitive material layer 3a can be accurately and rapidly formed on the plastic substrate 2.

  Further, according to the present embodiment, it is possible to obtain the color filter 1 using the plastic substrate 2 on which the black matrix 3, the red pixel 4, the green pixel 5, and the blue pixel 6 are patterned with high accuracy. Thereby, the accuracy of the display image of the color filter 1 can be improved.

Third Embodiment Next, a pattern forming method according to a third embodiment of the present invention will be described with reference to FIGS.

  The pattern forming method according to the third embodiment shown in FIGS. 8 and 9 is different in that a wiring material layer is patterned on a plastic substrate, and other configurations are shown in FIGS. This is substantially the same as the first embodiment shown. 8 and 9, the same parts as those in the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 8, in the pattern forming apparatus 40 in the present embodiment, a supply roll 11 around which a plastic substrate 2 is wound, and a photosensitive material application unit 12 that applies a photosensitive material onto the plastic substrate 2, In the meantime, a wiring material layer forming portion 41 for forming a film-like wiring material layer 45 made of a conductive material (for example, indium tin oxide (ITO)) is provided on the plastic substrate 2. The wiring material layer forming part 41 forms a wiring material layer 45 made of a conductive material on the plastic substrate 2 by sputtering or EB vapor deposition.

  In the present embodiment, the photosensitive material application unit 12 is made of a photosensitive material that can be used as a resist for etching via the wiring material layer 45 on the plastic substrate 2 by a die coater or a printing method (offset printing or the like). The photosensitive material layer 46 is formed by coating. Even in this case, as in the first and second embodiments, the uncoated region 2a where the photosensitive material is not coated is formed on the plastic substrate 2.

  Further, an etching processing unit 42 that etches the wiring material layer 45 using the patterned photosensitive material layer 46 as a resist is provided on the downstream side of the heat treatment unit 18. Further, a resist removal portion 43 for removing the photosensitive material layer 46 is provided on the downstream side of the etching processing portion 42.

  In the pattern forming method shown in FIGS. 8 and 9, first, a supply roll 11 around which a continuous belt-shaped plastic substrate 2 is wound is prepared (step S41).

  A wiring material layer 45 made of a conductive material is formed on the plastic base material 2 fed from the supply roll 11 by the wiring material layer forming unit 41 (step S42).

  Next, a photosensitive material is applied in the form of a film by the photosensitive material application unit 12 via the wiring material layer 45 on the plastic substrate 2 (step S43). As a result, a photosensitive material layer 46 is formed on the wiring material layer 45.

  The photosensitive material layer 46 applied on the wiring material layer 45 is dried by the drying processing unit 13 (step S44). In this case, the photosensitive material layer 46 is pre-baked at a temperature of about 50 ° C. to 120 ° C. for about 1 to 5 minutes, the solvent contained in the photosensitive material layer 46 is evaporated, and the photosensitive material layer 46 is wired. It can be adhered to the plastic substrate 2 via the material layer 45.

  The moisture content of the plastic substrate 2 on which the photosensitive material layer 46 has been pre-baked is measured by the moisture content measuring device 14 (step S45).

  Next, the photosensitive material layer 46 is exposed with a predetermined pattern by the exposure device 15 (step S46). In this case, exposure is performed using a photomask 15a for forming a wiring pattern having a predetermined shape.

  Further, in this case, the lens driving unit 15d is controlled by the control device 16 so as to move the projection lens 15c of the exposure device 15 in a direction perpendicular to the photosensitive material layer 46 based on the measured moisture content. . In this way, the pattern exposed to the photosensitive material layer 46 is enlarged or reduced according to the moisture content of the plastic substrate 2.

  The exposed photosensitive material layer 46 is developed by the developing device 17 (step S47). Thereby, the photosensitive material layer 46 can be patterned on the wiring material layer 45 in the shape of the wiring pattern described above.

  Next, heat treatment is performed on the photosensitive material layer 46 by the heat treatment unit 18 (step S48). In this case, the photosensitive material layer 46 is heat-treated at about 50 to 160 ° C. for about 1 to 60 minutes to be photocured (post-baked).

  Thereafter, the wiring portion 45 is etched by the etching processing unit 42 using the photosensitive material layer 46 as a resist (step S49). Thereby, the wiring material layer 45 can be patterned corresponding to the pattern of the photosensitive material layer 46.

  Next, the photosensitive material layer 46 is removed from the wiring material layer 45 by the resist removing unit 43 (step S50). Thereafter, the plastic substrate 2 is wound and collected by the winding roll 19 together with the patterned wiring material layer 45 (step S51).

  As described above, according to the present embodiment, after the moisture content of the plastic substrate 2 is measured, the projection lens 15c of the exposure device 15 is moved on the plastic substrate 2 based on the measured moisture content. The photosensitive material layer 46 applied to the wiring material layer 45 is exposed. In this case, the exposed pattern is enlarged or reduced according to the moisture content of the plastic substrate 2. As a result, when the moisture content of the plastic substrate 2 is in equilibrium with the surrounding environment, the pattern of the photosensitive material layer 46 on the wiring material layer 45 is the reference that has been formed on the photomask 15a. The pattern shape can be substantially matched. Therefore, the patterned photosensitive material layer 46 can be accurately and quickly formed on the wiring material layer 45. As a result, the wiring material layer 45 can be patterned on the plastic substrate 2 with high accuracy and speed by etching the wiring material layer 45 using the photosensitive material layer 46 as a resist.

  As mentioned above, although embodiment by this invention has been described, naturally, within the scope of the gist of this invention, these embodiment can also be combined suitably partially. Further, in the present embodiment, various modifications are possible within the scope of the gist of the present invention. Hereinafter, typical modifications will be described.

  In the above-described embodiment, the example in which the photosensitive material layer 3a is exposed using the photomask formed in a predetermined pattern has been described. However, the present invention is not limited to this, and when the plastic substrate 2 is in the form of a single wafer, the photosensitive material layer 3a is moved in the horizontal plane while irradiating exposure light without using a photomask. The conductive material layer 3a may be exposed in a predetermined pattern. The exposure apparatus in this case is configured as follows although not shown.

  That is, the exposure apparatus is provided between a light source that emits exposure light (laser light, LED, etc.), a stage on which the plastic substrate 2 is mounted and movable in a horizontal plane, and the light source. A projection lens that irradiates the photosensitive material layer 3a with the exposure light from the vertical direction, and a stage drive unit that moves the stage in a horizontal plane. In this way, the exposure apparatus is configured to expose the photosensitive material layer 3a in a predetermined pattern by moving the stage in a horizontal plane based on the predetermined pattern while irradiating the exposure light.

  A control device is connected to the stage drive unit of the exposure apparatus. In this control device, drawing data for creating a predetermined pattern as a reference is stored, and in general, the stage driving unit of the exposure apparatus is used to move the stage using this drawing data. I have control. Therefore, the control device in the present modification controls the stage drive unit of the exposure apparatus so as to change the amount of movement of the stage corresponding to the predetermined pattern based on the moisture content measured by the moisture content measurement unit. In this case, the stage drive unit is controlled so that the enlargement ratio or reduction ratio of the exposed pattern has a linear relationship with the measured moisture content.

  When exposing the photosensitive material layer 3a with such an exposure apparatus, for example, when the moisture content of the plastic substrate 2 is larger than the equilibrium state with the reference surrounding environment, the pattern is enlarged. Increase the amount of stage movement. On the other hand, when the moisture content of the plastic substrate 2 is smaller than the equilibrium state with the surrounding environment, the moving amount of the stage is reduced so as to reduce the pattern. In this manner, the pattern exposed to the photosensitive material layer 3a is enlarged or reduced according to the moisture content of the plastic substrate 2. Accordingly, when the water content of the plastic substrate 2 is in equilibrium with the surrounding environment, the pattern of the photosensitive material layer 3a on the plastic substrate 2 is made to substantially match the reference pattern shape. Can do. For this reason, the patterned photosensitive material layer 3a can be accurately and rapidly formed on the plastic substrate 2.

1 Color filter 2 Plastic substrate 2a Uncoated area 3 Black matrix 3a Photosensitive material layer 3b Bank (partition)
3c Opening 4 Red pixel 5 Green pixel 6 Blue pixel 7 Protective layer 8 Transparent electrode film 10 Pattern forming device 11 Supply roll 12 Photosensitive material application unit 13 Drying processing unit 14 Moisture content measuring device 14a Sensor unit 14b Moisture meter 15 Exposure device 15a Photomask 15b Stage 15c Projection lens 15d Lens drive unit 16 Control device 17 Development device 18 Heat treatment unit 19 Winding roll 20 Guide roll 30 Pattern forming device 31 Base material supply unit 32 Base material recovery unit 40 Pattern formation device 41 Wiring material layer Formation part 42 Etching part 43 Resist removal part 45 Wiring material layer 46 Photosensitive material layer

Claims (11)

In a pattern forming method for forming a patterned photosensitive material layer on a plastic substrate,
Preparing a plastic substrate;
Applying a photosensitive material to a plastic substrate and drying to form a photosensitive material layer;
A step of measuring the moisture content of the plastic substrate on which the photosensitive material layer is formed by a moisture content measuring device;
Exposing the photosensitive material layer on the plastic substrate in a predetermined pattern by an exposure device;
And developing and patterning the exposed photosensitive material layer,
When exposing the photosensitive material layer on the plastic substrate, the exposure device is controlled by the control device based on the moisture content measured by the moisture content measuring device to enlarge or reduce the exposed pattern. A pattern forming method. When exposing the photosensitive material layer on the plastic substrate, exposure light passing through the photomask of the exposure apparatus formed in a predetermined pattern is irradiated to the photosensitive material layer through the projection lens, and the photosensitive material layer Is exposed to a predetermined pattern,
2. The pattern according to claim 1, wherein the exposure device is controlled by the control device to move the projection lens relative to the photosensitive material layer based on the moisture content measured by the moisture content measuring device. Forming method. When exposing the photosensitive material layer on the plastic substrate, the plastic substrate is placed on the stage, and the stage is moved in a horizontal plane based on a predetermined pattern while irradiating the exposure light. Is exposed to a predetermined pattern,
2. The pattern forming method according to claim 1, wherein the exposure apparatus is controlled by the control device so as to change the moving amount of the stage based on the moisture content measured by the moisture content measuring device.   4. The pattern forming method according to claim 1, wherein an enlargement ratio or a reduction ratio of the exposed pattern is linearly related to the measured moisture content. In the step of forming the photosensitive material layer, a wiring material layer made of a conductive material is provided on the plastic substrate, and the photosensitive material layer is formed on the wiring material layer.
5. The pattern forming method according to claim 1, wherein after the photosensitive material layer is patterned, the wiring material layer is etched and patterned using the photosensitive material layer as a resist. A step of forming a photosensitive material layer for a plurality of color pixels patterned so as to constitute a plurality of color pixels on a plastic substrate by the pattern forming method according to claim 1,
A method for producing a color filter, comprising obtaining a color filter. In a pattern forming apparatus for forming a patterned photosensitive material layer on a plastic substrate,
A photosensitive material application part for applying a photosensitive material to a plastic substrate to form a photosensitive material layer;
A moisture content measuring device for measuring the moisture content of the plastic substrate on which the photosensitive material layer is formed;
An exposure apparatus that exposes the photosensitive material layer on the plastic substrate in a predetermined pattern;
A developing device for developing and patterning the exposed photosensitive material layer; and
A pattern forming apparatus comprising: a control device that controls an exposure device so as to enlarge or reduce an exposed pattern based on a moisture content measured by a moisture content measuring device. The exposure apparatus is movable in a direction perpendicular to the stage between a light source that emits exposure light, a photomask formed in a predetermined pattern, a stage on which a plastic substrate is placed, and the photomask and the stage. A projection lens that irradiates the photosensitive material layer with exposure light passing through a photomask, and a lens driving unit that moves the projection lens,
The control device controls the lens driving unit of the exposure device to move the projection lens relative to the photosensitive material layer based on the moisture content measured by the moisture content measuring device. The pattern forming apparatus as described.   9. The pattern forming apparatus according to claim 8, wherein the control device controls the lens driving unit so that the enlargement ratio or reduction ratio of the exposed pattern has a linear relationship with the measured moisture content. . An exposure apparatus is provided between a light source that emits exposure light, a plastic substrate, a stage that is movable in a horizontal plane, and the light source and the stage. A projection lens that irradiates the light source and a stage drive unit that moves the stage, and the photosensitive material layer is exposed in a predetermined pattern by moving the stage in a horizontal plane based on a predetermined pattern while irradiating exposure light. Is supposed to be
The control device controls the stage driving unit of the exposure apparatus so as to change the amount of movement of the stage corresponding to the pattern based on the moisture content measured by the moisture content measuring device. The pattern forming apparatus as described.   The pattern forming apparatus according to claim 10, wherein the control device controls the stage driving unit so that an enlargement ratio or a reduction ratio of the exposed pattern is linearly related to the measured moisture content. .

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