TW201810492A - Substrate transferring method - Google Patents

Abstract

A cassette apparatus includes a first unit which performs one of a supply and a recovery of the substrate, and a second unit which performs another of the supply and the recovery of the substrate, wherein the first unit and the second unit are capable to move close to each other and move away from each other.

Description

Method for transferring substrate

The present invention relates to a cassette device, a substrate transfer device, a substrate processing device, and a substrate processing method.

This application claims priority based on Japanese Patent Application No. 2012-092132 for which it applied on April 13, 2012, and uses the content here.

As a display element constituting a display device (display panel) such as a display device, a liquid crystal display element or an organic electroluminescence (organic EL) element is known, for example. At present, these display elements are mainly mainstreamed with active devices (Thin Film Transistor: TFT) formed on the substrate surface corresponding to each pixel.

In recent years, a technique for forming a display element on a flexible sheet-like substrate (such as a film member) has been proposed. As such a technique, for example, there is a method known as a roll to roll method (hereinafter, simply referred to as a “roll method”) (for example, refer to Patent Document 1). The reel method is a method in which a sheet-like substrate (for example, a film-like film member) wound around one of the supply rollers on the substrate supply side is sent out, and the sent-out substrate is wound by a recycling roller on the substrate recovery side It is applied to a substrate by a processing device provided between a supply roller and a recovery roller. The desired processing for forming electronic components such as display panels and solar cell panels.

In addition, during the period from when the substrate is delivered to when it is wound, for example, a plurality of conveyance rollers are used to convey the substrate. When a display panel is produced, a plurality of processing devices (units) are used to form the gate electrode and the gate insulation of the TFT. A film, a semiconductor film, a source-drain electrode, etc., sequentially form the constituent elements of a display element on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light emitting layer, an anode, a cathode, and a circuit are sequentially formed on a substrate.

Patent Document 1: International Publication No. 2006/100868

However, in the above-mentioned configuration, since the substrate holder is mounted on a plurality of processing apparatuses from the time when the substrate is taken out to the time when the substrate is wound, the overall length of the substrate becomes long, which may make it difficult to manage the substrate.

An object of the aspect of the present invention is to provide a cassette device, a substrate transfer device, and a substrate processing device capable of reducing a management burden on a substrate during transfer.

A cassette device according to a first aspect of the present invention includes: a first unit section for supplying and recovering a substrate; and a second unit section for supplying and recovering a substrate; a first unit section and a second unit section Can be approached or separated from each other.

A substrate conveying device according to a second aspect of the present invention includes: a first unit section which is provided so as to be movable on a first moving path to supply a substrate And recycling; the second unit is set to be movable on the second moving path to supply and recover the substrate; and the control unit is configured to move the first unit to the second moving path. The first substrate processing unit controls one of the first unit unit to supply and recover substrates, and controls the second unit unit to perform the other side of substrate supply and recovery; the control unit controls A second substrate processing section between the second moving path and different from the first substrate processing section moves the first unit section and the second unit section, and controls the first unit section to perform the other side of the supply and recovery of the substrate, And the second unit is controlled to perform one of the supply and recovery of the substrate.

A substrate processing apparatus according to a third aspect of the present invention includes a plurality of processing sections disposed between the first movement path and the second movement path to process a flexible substrate; and a substrate of the second aspect of the present invention. Transfer device.

The substrate processing method of the fourth aspect of the present invention is used to sequentially send a flexible long-ribbed substrate to a plurality of processing devices and form an electronic component on the substrate. The method includes: a first processing step A first unit including a supply roller including the substrate to be supplied to the first substrate processing section wound in the longitudinal direction, and a substrate including the substrate to be recovered from the first substrate processing section wound in the longitudinal direction The second unit portion of the recovery roller is configured to sandwich the first substrate processing portion, and the substrate supplied from the supply roller is processed by the first substrate processing portion to be recovered by the recovery roller; A moving step of moving the first unit portion together with the second unit portion along a first direction in which the substrate between the supply roller and the recovery roller leaves the first substrate processing portion; the second moving step, in order Reducing a distance between the supply roller and the recovery roller in the long-side direction, and moving at least one of the first unit portion and the second unit portion in a second direction crossing the first direction; and a third moving step , So that the first unit portion and the second unit portion that oppose each other at a predetermined interval move side by side with the first direction, move side by side in the second direction, and in a plane including the first direction and the second direction At least two of the rotational movements move together toward a second substrate processing section different from the first substrate processing section.

According to the aspect of the present invention, it is possible to reduce the management burden of the substrate during transportation.

S‧‧‧ substrate

CONT‧‧‧Control Department

BF‧‧‧Buffering Department

C‧‧‧protective substrate

CV‧‧‧ cover member

10‧‧‧ Processing Department

20‧‧‧box device

21‧‧‧First Unit

22‧‧‧Second Unit

23‧‧‧Connecting Department

24‧‧‧ Mobile agency

30‧‧‧rail

31‧‧‧ first track

32‧‧‧ second track

33‧‧‧ Third Track

34a, 35a

42,62‧‧‧Mobile

43,63‧‧‧Substrate side communication unit

44,64‧‧‧‧Mobile communication side

46, 66‧‧‧ Loading and unloading inspection department

47,67‧‧‧Contact suppression unit

51,71‧‧‧case

52,72‧‧‧casters

53,73‧‧‧Lift

54,74‧‧‧caster drive unit

55,75‧‧‧Position detection section

56,76‧‧‧Terminals

65‧‧‧connection detection department

100,200‧‧‧Substrate processing equipment

111 ~ 113‧‧‧Processing Room

160‧‧‧Lift

FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus according to a first embodiment.

FIG. 2 is an exploded perspective view showing the structure of the first unit portion side of the embodiment.

FIG. 3 is a diagram showing a part of the structure of the cassette device according to this embodiment.

Fig. 4 is an exploded perspective view showing the configuration of the second unit portion side of the embodiment.

Fig. 5 is a diagram showing the configuration of a cassette device according to this embodiment.

FIG. 6 is a diagram showing a configuration of a processing unit according to this embodiment.

FIG. 7 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

FIG. 8 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

FIG. 9 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

FIG. 10 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

FIG. 11 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

FIG. 12 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

FIG. 13 is a perspective view showing the overall configuration of a substrate processing apparatus according to a second embodiment.

FIG. 14 is a cross-sectional view showing a part of the structure of a substrate processing apparatus according to this embodiment.

Fig. 15 is a perspective view showing the structure of a raised portion in this embodiment.

FIG. 16 is a diagram showing another configuration of the substrate processing apparatus.

FIG. 17 is a diagram showing another configuration of the substrate processing apparatus.

18 (a) to (c) are diagrams showing another configuration of the substrate processing apparatus.

19 (a) and 19 (b) are diagrams showing another configuration of the substrate processing apparatus.

20 (a) and 20 (b) are diagrams showing another configuration of the substrate processing apparatus.

FIG. 21 is a diagram showing another configuration of the substrate.

FIG. 22 is a diagram showing another configuration and operation state of the substrate processing apparatus.

FIG. 23 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 22.

FIG. 24 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 23.

FIG. 25 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 24.

FIG. 26 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 25.

FIG. 27 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 26.

(First Embodiment)

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus (substrate transfer apparatus) 100 according to this embodiment. As shown in FIG. 1, the substrate processing apparatus 100 includes a processing unit (a first substrate processing unit and a second substrate processing unit) 10 that performs a predetermined process on a flexible sheet substrate (for example, a thin film member) S. 、 Transportation unit (box device) 20 that transports substrate S, and overall control The processing unit 10 and the control unit CONT of the cassette device 20. The substrate processing apparatus 100 is installed on the floor FL of a manufacturing plant, for example.

The substrate processing apparatus 100 is a roll-to-roll method (hereinafter, abbreviated as "roll method") that performs various processes on the inside (surface) of the substrate S. The substrate processing apparatus 100 is used when a display element (electronic element) such as an organic EL element or a liquid crystal display element is formed on the substrate S. Of course, the substrate processing apparatus 100 may be used in a system for forming elements other than these elements (for example, solar cells, color filters, touch panels, etc.).

Hereinafter, when describing the configuration of the substrate processing apparatus 100 according to this embodiment, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following figures, let the plane parallel to the ground FL in the XYZ orthogonal coordinate system be the XY plane. The direction in which the substrate S moves in the XY plane is the Y-axis direction, and the direction orthogonal to the Y-axis direction is the X-axis direction. The direction perpendicular to the ground FL (XY plane) is the Z-axis direction. The direction of rotation around the Z axis is described as θ Z axis direction.

As the substrate S to be processed in the substrate processing apparatus 100, for example, a foil such as a resin film or stainless steel can be used. For the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, Ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, Polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, Polyethylene naphthalate, stainless steel foil and other materials.

The dimension in the short-side direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the long-side direction (the size of one roll) is, for example, 10 m or more. Of course, this size is only an example, and it is not limited to this example. For example, the dimension in the short-side direction of the substrate S may be 1 m or less, or 50 cm or less, or may be 2 m or more. The size of the substrate S in the longitudinal direction may be 10 m or less.

The substrate S is formed to have a thickness of, for example, 1 mm or less and has flexibility. Here, the term "flexible" refers to a property that the substrate can be bent without applying a predetermined force of at least a degree of its own weight to the substrate without breaking or cracking. In addition, the property of bending due to the above-mentioned predetermined force is also included in the flexibility referred to. In addition, the flexibility described above may vary depending on the substrate material, size, thickness, temperature, ambient temperature, humidity, and the like. In addition, as the substrate S, a single strip-shaped substrate may be used, or a structure in which a plurality of unit substrates are connected to form a strip shape may be used.

It is preferable that the substrate S has a smaller coefficient of thermal expansion to withstand the heat of a higher temperature (for example, about 200 ° C.) and has no substantial change in size (small thermal deformation). For example, an inorganic filler may be mixed in a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide.

The substrate processing apparatus 100 is installed in a device manufacturing factory. A guide rail (first moving path, second moving path) 30 is formed on the floor FL in the factory. The guide rail 30 includes a first rail 31, a second rail 32, and a first rail 31. Three tracks 33. The first track 31 and the second track 32 are formed so as to extend in the arrangement direction (X-axis direction) of the plurality of processing sections. The first track 31 is arranged on one side of the processing unit 10 in the Y-axis direction, and the second track 32 is arranged on the other side of the processing unit 10 in the Y-axis direction. That is, the first rail 31 and the second rail 32 are provided at positions where the processing unit 10 is sandwiched in the Y-axis direction. The third rail 33 is disposed between the plurality of processing units 10 in the X-axis direction. The third rail 33 is formed parallel to the Y-axis direction, and connects the first rail 31 and the second rail 32. The first track 31, the second track 32, and the third track 33 are set with position information such as an X coordinate or a Y coordinate. The position information is formed on each track in such a manner that it can be read by a sensor such as a light sensor or a magnetic sensor.

The substrate processing apparatus 100 includes a cassette apparatus 20. This cassette device 20 has a first unit section 21 that performs one of the supply and recovery of the substrate S, and a second unit section 22 that performs the other one of the supply and recovery of the substrate S. The substrate S is carried from one side of the first unit portion 21 and the second unit portion 22 to the other side.

A plurality of first unit portions 21 and second unit portions 22 are prepared. The floor FL is provided with a buffer portion BF that makes at least one of the first unit portion 21 and the second unit portion 22 stand by. Here, the buffer unit BF can make the first unit unit 21 and the second unit unit 22 stand by. The buffer portion BF is connected to the first rail 31, the second rail 32, or the third rail 33 through a part of the guide rail 30.

FIG. 2 shows the first unit portion 21 side of the cassette device 20 An exploded perspective view of the composition. FIG. 3 is a diagram showing a part of the structure of the cassette device 20. Hereinafter, for convenience of explanation, the display in the X-axis direction, the Y-axis direction, and the Z-axis direction in FIGS. 2 and 3 corresponds to FIG. 1.

The cassette device 20 includes a moving mechanism 24 that moves the first unit portion 21 to the second moving portion 22. The moving mechanism 24 includes a moving section (first moving section) 42 that moves the first unit section 21. In addition, the cassette device 20 includes a moving portion-side communication portion 44 and a contact suppressing portion 47 described later.

The first unit portion 21 includes a first wall portion 40a, a second wall portion 40b, a bottom portion 40c, and an external connection portion 40d. A power source unit (not shown) such as a battery is provided in the first unit unit 21.

The first wall portion 40a and the second wall portion 40b are each formed in a plate shape. The first wall portion 40a is arranged at, for example, an end portion on the −X axis side. The second wall portion 40b is arranged, for example, at an end portion on the + X axis side. The first wall portion 40a and the second wall portion 40b are arranged parallel to each other. The first wall portion 40a and the second wall portion 40b may be formed in a door shape.

The bottom portion 40c is formed parallel to the XY plane (ground surface FL), and connects the first wall portion 40a and the second wall portion 40b. The external connection portion 40 d is formed, for example, as a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the + Y-axis side end portion of the first unit portion 21. The + Y-axis side end portion of the first unit portion 21 functions as a connection portion of an external transfer mechanism. The external connection portion 40 d is provided at, for example, two locations in the height direction (Z-axis direction) of the first unit portion 21.

Notch portions 40f are formed in corner portions on the connection portion side of the first wall portion 40a and the second wall portion 40b, respectively. The notch portion 40f is provided so as to be in contact with an external structure. Positioning the notch portion 40f against the external structure allows positioning between the first unit portion 21 and the external structure. In addition, although the notch part 40f is formed in the + Y-axis side end part in FIG. 2, for example, the notch part 40f may be provided in the -Y-axis side end part. In this case, positioning of the first unit portion 21 and the processing portion 10 can be performed by abutting the notch portion 40f on a portion of the processing portion 10.

A first connecting portion 23a is formed at each of the −Y-axis side end portions of the first wall portion 40a and the second wall portion 40b. The first unit portion 21 is connected to the second unit portion 22 through the first connection portion 23a. As the first connection portion 23a, for example, a structure capable of automatically switching the attachment / detachment state, for example, a magnet or the like is used.

The first unit section 21 includes a first storage section 40 that stores a substrate. Here, the first storage section 40 is provided with a substrate driving section (first substrate driving section) 41 on which a substrate supply roller (supply reel) 41c on which the substrate S is wound is mounted. The substrate driving section 41 rotates the substrate S to perform a supply operation for supplying the substrate S to the second unit section 22 side. The substrate driving section 41 includes a shaft section (first shaft section) 41 a and a rotation driving section (first driving section) 41 b. The shaft portion 41a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. The shaft portion 41a can be removed from between the first wall portion 40a and the second wall portion 40b by the expansion and contraction of the shaft portion 41a, and mounting of the substrate supply roller 41c becomes possible. The shaft part 41a is arrange | positioned so that the axial direction of a central axis may become parallel to an X-axis direction, for example. One end of the shaft portion 41a is connected by the first unit The second wall portion 40b of the portion 21 is rotatably supported in the circumferential direction. The shaft portion 41a is provided with a holding portion (not shown) that can hold an end portion of the substrate supply roller 41c. The rotation driving portion 41b rotates the shaft portion 41a. When the shaft portion 41a is rotated by the rotation driving portion 41b, the supply operation (feed-out operation) of the substrate S becomes possible.

The first storage portion 40 is provided with a protective substrate driving portion (first auxiliary portion) 48 on which a protective substrate supply roller 48c is mounted. A protective substrate (protective film) C covering the processing surface of the substrate S is wound around the protective substrate supply roller 48c. The protective substrate driving section 48 rotates the protective substrate supply roller 48 c to perform a supply operation of supplying the protective substrate C to the second unit section 22 side. The protective substrate C protects the processed surface by covering the processed surface of the substrate S. The protective substrate C is formed in a strip shape using the same flexible material as the substrate S, and has a size substantially the same as that of the substrate S.

The protective substrate driving portion 48 includes a shaft portion 48 a and a rotation driving portion 48 b. The shaft portion 48a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. As the shaft portion 48a expands and contracts, it can be removed from between the first wall portion 40a and the second wall portion 40b, and installation of the protective substrate supply roller 48c becomes possible. The shaft part 48a is arrange | positioned so that the axial direction of a central axis may become parallel to an X-axis direction, for example. That is, the shaft portion 41a and the shaft portion 48a are arranged so that the axial directions of the central axis become parallel to each other. One end portion of the shaft portion 48 a is rotatably supported in the circumferential direction by the second wall portion 40 b of the first unit portion 21. The shaft portion 48a is provided with a holding portion (not shown) that can hold an end portion of the protective substrate supply roller 48c. The rotation driving portion 48b rotates the shaft portion 48a. The shaft portion 48a is rotated by the rotation driving portion 48b to protect The supply operation (feed-out operation) of the substrate C is enabled. The protective substrate driving unit 48 is provided with a mechanism (not shown) for overlapping the sent-out protective substrate C on the substrate S.

The first unit section 21 includes a substrate-side communication section (first communication section) 43. The substrate-side communication portion 43 is provided on the + Z-axis side end surface of the first wall portion 40a. The board-side communication unit 43 can communicate with, for example, the control unit CONT, the second unit unit 22, and the like.

The first unit portion 21 includes a contact suppression portion 47. The contact suppressing portion 47 is provided on the + Y-side end faces of the first wall portion 40a and the second wall portion 40b. The contact suppressing portion 47 suppresses the + Y-side end surfaces of the first wall portion 40a and the second wall portion 40b from coming into contact with the external structure, and mitigates the impact during the contact. The contact suppressing portion 47 includes, for example, a rod-shaped member protruding from the first wall portion 40 a and the second wall portion 40 b toward the + Y-axis side, and an elastic member that receives a force in the −Y-axis direction acting on the rod-shaped member.

The moving portion 42 supports the first unit portion 21 so as to be removable. The moving section 42 moves the first unit section 21 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving section 42 includes a housing 51, a caster 52, a lifting section 53, and a caster driving section 54. A power supply unit (not shown) such as a battery is provided in the moving unit 42.

The casing 51 includes a movable portion 51a and a base portion 51b. The movable portion 51 a is provided at the + Z-axis side end portion of the casing 51 and is configured to be movable in the Z-axis direction by the driving of the lifting portion 53. When the movable portion 51a is moved in the + Z axis direction, the first unit portion 21 and the movable portion 51a are moved in the + Z axis direction integrally. base The portion 51b supports the movable portion 51a so as to be movable.

Four casters 52 are provided on the -Z axis side end surface of the base portion 51b of the casing 51. The caster 52 is provided so as to be rotatable by the drive of the caster driving portion 54. When the caster 52 rotates, the housing 51 and the first unit portion 21 are integrally moved in the X-axis direction, the Y-axis direction, and the θ Z-axis direction.

A groove portion 50 is formed on the end surface 51c on the + Z axis side of the movable portion 51a. The groove portion 50 is formed in a V shape on the end surface 51c. On the other hand, four spherical support portions 49 are formed on the end surface 40 e on the -Z axis side of the first unit portion 21. The four spherical support portions 49 are supported by the groove portions 50, respectively. The spherical support portion 49 is supported by the groove portion 50 to restrict relative movement in the X-axis direction and the Y-axis direction between the first unit portion 21 and the housing 51. The number of the groove portions 50 and the spherical support portions 49 may be three each.

In addition, the movable unit 51a is provided with an attachment / detachment detection unit 46. The attachment / detachment detection section 46 detects whether or not the first unit section 21 is attached to the casing 51. As the attachment / detachment detection unit 46, for example, various sensors such as a sensor that detects a resistance value between the groove portion 50 and the spherical support portion 49 or a sensor that detects a pressure in the groove portion 50 can be used. The detection result of the attachment / detachment detection unit 46 is transmitted from the mobile unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example.

The moving section 42 includes a moving section-side communication section (first communication section) 44. The moving part side communication part 44 is provided inside the casing 51. The mobile-portion communication unit 44 can communicate with, for example, the control unit CONT, the board-side communication unit 43, the second unit unit 22, and the like. Board-side communication unit 43 or mobile The communication unit 44 on the side can receive a first control signal for controlling the operation of the first unit 21. The first control signal includes, for example, a signal that controls the movement operation of the mobile unit 42 or a signal that controls the supply and recovery operation of the substrate S in the first unit unit 21.

As shown in FIG. 3, a position detection section (first detection section) 55 is provided on the end surface 51d (the surface facing the ground FL) of the -Z side of the base portion 51b of the housing 51. The position detection section 55 detects the position information of the first unit section 21. The position detection unit 55 detects, as the position information, position information set on the guide rail 30 (the first rail 31, the second rail 32, and the third rail 33), for example. The detection result of the position detection unit 55 is transmitted from the mobile unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example. For example, the control unit CONT moves the first unit unit 21 along the guide rail 30 using the detection result of the position detection unit 55.

FIG. 4 is an exploded perspective view showing the configuration of the second unit portion 22 in the cassette device 20. Hereinafter, for convenience of explanation, the display in the X-axis direction, the Y-axis direction, and the Z-axis direction in FIG. 4 corresponds to FIG. 1.

As shown in FIG. 4, the second unit section 22 includes a substrate driving section (second substrate driving section) 61, a substrate-side communication section 63, a contact suppression section 67, and a protective substrate driving section (second auxiliary section) 68. The moving mechanism 24 provided in the cassette device 20 includes a moving portion (second moving portion) 62 that moves the second unit portion 22.

The second unit portion 22 includes a first wall portion 60a, a second wall portion 60b, a bottom portion 60c, and an external connection portion 60d. The second unit section 22 is provided There is a power supply unit (not shown) such as a battery. The first unit section 21 and the second unit section 22 have a mirror surface structure based on the XZ plane.

The first wall portion 60a and the second wall portion 60b are each formed in a plate shape. The first wall portion 60a is arranged at an end portion on the -X axis side, for example. The second wall portion 60b is disposed at, for example, an end portion on the + X axis side. The first wall portion 60a and the second wall portion 60b are arranged parallel to each other. The first wall portion 60a and the second wall portion 60b may be formed in a door shape.

The bottom 60c is formed parallel to the XY plane (ground plane FL), and connects the first wall portion 60a and the second wall portion 60b. The external connection portion 60 d is formed, for example, as a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the −Y-axis side end portion of the second unit portion 22. The -Y-axis side end portion of the second unit portion 22 functions as a connection portion of an external transfer mechanism. The external connection portion 60 d is provided at, for example, two portions in the height direction (Z-axis direction) of the second unit portion 22.

Notch portions 60f are formed in corner portions on the connection portion side of the first wall portion 60a and the second wall portion 60b, respectively. The notch portion 60f is provided so as to be in contact with an external structure. By positioning the cutout portion 60f on the external structure, positioning is performed between the second unit portion 22 and the external structure. In addition, although the notch portion 60f is formed at the −Y-axis side end portion in FIG. 4, for example, a configuration in which the notch portion 60f is provided at the + Y-axis side end portion may be used. In this case, it is possible to perform positioning between the second unit portion 22 and the processing portion 10 by abutting the cutout portion 60f on a portion of the processing portion 10.

A second connection portion 23b is formed at the + Y-axis side end portion of each of the first wall portion 60a and the second wall portion 60b. The second unit portion 22 is connected to the first unit portion 21 through the second connection portion 23b. As the second connection portion 23b, for example, a structure capable of automatically switching the attachment / detachment state, for example, a magnet or the like is used.

The second unit section 22 includes a second storage section 60 that stores a substrate. The second storage unit 60 is provided with a substrate driving unit 61 on which a substrate recovery roller (recycling reel) 61c on which the substrate S is wound is mounted. The substrate driving section 61 rotates the substrate S to perform a recovery operation for recovering the substrate S supplied from the first unit section 21 side. The substrate driving portion 61 includes a shaft portion (second shaft portion) 61 a and a rotation driving portion (second driving portion) 61 b. The shaft portion 61a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. The shaft portion 61a can be removed from between the first wall portion 60a and the second wall portion 60b by the expansion and contraction of the shaft portion 61a, and mounting of the substrate recovery roller 61c becomes possible. The shaft portion 61a is arranged such that, for example, the axial direction of the central axis is parallel to the X-axis direction. One end portion of the shaft portion 61 a is rotatably supported in the circumferential direction by the second wall portion 60 b of the second unit portion 22. The shaft portion 61a is provided with a holding portion (not shown) that can hold an end portion of the substrate recovery roller 61c. The rotation driving portion 61b rotates the shaft portion 61a. When the shaft portion 61a is rotated by the rotation driving portion 61b, the supply operation (winding operation) of the substrate S is enabled.

The second storage section 60 is provided with a protective substrate driving section (second auxiliary section) 68 on which a protective substrate supply roller 68c is mounted. A protective substrate (protective film) C covering the processing surface of the substrate S is wound around the protective substrate supply roller 68c. The protective substrate driving unit 68 supplies the protective substrate supply roller 68c. The rotation is performed to recover the protective substrate C supplied from the first unit portion 21 side.

The protective substrate driving portion 68 includes a shaft portion 68 a and a rotation driving portion 68 b. The shaft portion 68a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. The shaft portion 68a can be removed from between the first wall portion 60a and the second wall portion 60b by the expansion and contraction of the shaft portion 68a, and installation of the protective substrate supply roller 68c becomes possible. The shaft part 68a is arrange | positioned so that the axial direction of a central axis may become parallel to an X-axis direction, for example. That is, the shaft portion 61a and the shaft portion 68a are arranged so that the axial directions of the central axes are parallel to each other. One end portion of the shaft portion 68 a is rotatably supported in the circumferential direction by the second wall portion 60 b of the second unit portion 22. The shaft portion 68a is provided with a holding portion (not shown) that can hold an end portion of the protective substrate supply roller 68c. The rotation driving portion 68b rotates the shaft portion 68a. By rotating the shaft portion 68a by the rotation driving portion 68b, the supply operation (winding operation) of the protective substrate C is enabled. The protective substrate driving unit 68 is provided with a mechanism (not shown) for overlapping the sent-out protective substrate C on the substrate S. In addition, in a case where the protective substrate C is wound around the substrate driving portion 61 with the protective substrate C superposed on the substrate S, the protective substrate driving portion 68 on the second unit portion 22 side may be omitted.

The second unit section 22 includes a substrate-side communication section (second communication section) 63. The substrate-side communication portion 63 is provided on the + Z-axis side end surface of the second wall portion 60b. The substrate-side communication unit 63 can communicate with, for example, the control unit CONT, the first unit unit 21, and the like.

The second unit section 22 includes a contact suppression section 67. Contact suppression The part 67 is provided in the -Y side end surface of the 1st wall part 60a and the 2nd wall part 60b. The contact suppressing portion 67 suppresses the -Y-side end surfaces of the first wall portion 60a and the second wall portion 60b from coming into contact with the external structure, and mitigates the impact during the contact. The contact suppressing portion 67 includes, for example, a rod-shaped member protruding from the first wall portion 60a and the second wall portion 60b toward the -Y axis side, and an elastic member that receives a force in the + Y axis direction acting on the rod-shaped member.

A groove portion 70 is formed on the end surface 71c on the + Z axis side of the movable portion 71a. The groove portion 70 is formed in a V-shape on the end surface 71c. On the other hand, four spherical support portions 69 are formed on the end surface 60 e on the -Z axis side of the second unit portion 22. The four spherical support portions 69 are supported by the groove portions 70, respectively. The spherical support portion 69 is supported by the groove portion 70 to restrict relative movement in the X-axis direction and the Y-axis direction between the second unit portion 22 and the housing 71. The number of the groove portions 70 and the spherical support portions 69 may be three each.

In addition, the movable portion 71a is provided with an attachment / detachment detection portion 66. The attachment / detachment detection section 66 detects whether the second unit section 22 is attached to the casing 71. As the attachment / detachment detection unit 66, for example, various sensors such as a sensor that detects a resistance value between the groove portion 70 and the spherical support portion 69 or a sensor that detects a pressure in the groove portion 70 can be used. The detection result of the attachment / detachment detection unit 66 is transmitted from the mobile unit side communication unit 64 to the outside (the control unit CONT, the substrate side communication unit 63, etc.), for example.

The second unit section 22 includes a connection detection section (second detection section) 65 in addition to the above-mentioned configuration. The connection detection section 65 detects whether or not the first unit section 21 and the second unit section 22 are connected. As the connection detection section 65, A sensor or the like that detects the electrical characteristics of the second connection portion 23b can be used. The detection result of the connection detection unit 65 is transmitted from the mobile unit side communication unit 64 to the outside (the control unit CONT, the substrate side communication unit 63, etc.), for example.

The moving portion 62 supports the second unit portion 22 so as to be removable. The moving section 62 moves the second unit section 22 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving section 62 includes a housing 71, a caster 72, a lifting section 73, and a caster driving section 74. The casing 71 includes a movable portion 71a and a base portion 71b. The control unit CONT controls the rotation speed of the casters 72. Thereby, the control part CONT can control the moving speed of the moving part 62. A power supply unit (not shown) such as a battery is provided in the moving unit 62.

The moving portion 62 of the second unit portion 22 and the moving portion 42 of the first unit portion 21 constitute a moving mechanism 24 that relatively moves the first unit portion 21 and the second unit portion 22. The moving section 42 and the moving section 62 can drive the first unit section 21 and the second unit section 22 independently, respectively.

The moving section 62 includes a moving section-side communication section (second communication section) 64. The moving part side communication part 64 is provided inside the casing 71. The mobile-portion communication unit 64 can communicate with, for example, the control unit CONT, the substrate-side communication unit 63, the first unit unit 21, and the like. The substrate-side communication unit 63 and the mobile-unit communication unit 64 may receive a second control signal for controlling the operation of the second unit unit 22. The second control signal includes, for example, a signal that controls the movement operation of the moving unit 62 or a signal that controls the supply operation of the substrate S in the second unit unit 22.

The moving section 62 includes a substrate transfer control section 77. The substrate transfer control unit 77 controls the transfer operations of the substrate S and the protective substrate C of the first unit unit 21 and the second unit unit 22. The substrate transfer control unit 77 controls the rotation speed of the shaft portion 61 a and the shaft portion 68 a through the moving portion side communication portion 64 and the substrate side communication portion 63. Thereby, the substrate conveyance control unit 77 can control the recovery speed (winding speed) of the substrate S and the protective substrate C.

The substrate transfer control unit 77 controls the rotation speed of the shaft portion 41 a and the shaft portion 48 a via the substrate-side communication portion 43 of the moving portion-side communication portion 64 and the first unit portion 21, for example. Thereby, the board | substrate conveyance control part 77 can control the supply speed (feeding speed) of the board | substrate S and the protective board | substrate C.

The substrate transfer control section 77 controls the rotation speed of the casters 72 of the second unit section 22. Thereby, the board | substrate conveyance control part 77 can control the moving speed of the moving part 62. The substrate transfer control unit 77 controls the rotation speed of the caster 52 of the first unit 21 through the mobile unit-side communication unit 64 and the mobile unit-side communication unit 44 of the first unit unit 21. Thereby, the board | substrate conveyance control part 77 can control the moving speed of the moving part 42.

FIG. 5 is a perspective view showing a state where the first unit portion 21 and the second unit portion 22 of the cassette device 20 are connected.

As shown in FIG. 5, the first unit portion 21 and the second unit portion 22 may be connected in a state where the first connection portion 23 a and the second connection portion 23 b face each other. The first connection portion 23a and the second connection portion 23b are attracted by the magnetic force of the electromagnet. As described above, the cassette device 20 includes the first connection portion 23a and the second connection portion 23a. The connecting portion 23 b is a connecting portion 23 that connects the first unit portion 21 and the second unit portion 22.

In a case where the first unit portion 21 is supported by the casing 51 of the moving portion 42 and the second unit portion 22 is supported by the casing 71 of the moving portion 62, the first unit portion 21 and the second unit portion 22 are connected to form the cassette device 20 . In this case, the moving section 42 and the moving section 62 can move the first unit section 21 and the second unit section 22 integrally while maintaining the connection.

In the case where the first unit portion 21 and the second unit portion 22 are connected, for example, connection terminals are provided in the first connection portion 23a and the second connection portion 23b. A structure for transmitting and receiving information between 21 and the second unit 22 may be used.

The cassette device 20 includes a mounting portion 81 provided on the first unit portion 21 and mounting a cover member CV. Further, the cassette device 20 includes a mounting portion 82 provided on the second unit portion 22 and mounting a cover member CV. The cover member CV seals the inside of the first unit portion 21 and the second unit portion 22 so that foreign matter such as dust does not enter. The cover member CV is installed across the first unit portion 21 and the second unit portion 22.

Although the cover member CV in FIG. 5 shows a structure that can be attached and detached in the Z-axis direction, for example, it is not limited thereto. For example, the cover member CV may be rotatably attached to the bottom portion 40c of the first unit portion 21 and the bottom portion 60c of the second unit portion 22. Further, the cover member CV may be formed of a retractable or foldable sheet-like member, and a part of the cover member CV may be configured to be accommodated in the bottom portion 40c. this In some cases, the cover member CV is pulled out from the + Y-axis side end portion of the bottom portion 40c of the first unit portion 21, and is suspended from the + Y-axis side side of the first unit portion 21 to the + Z-axis side side. Covers the first unit section 21. Similarly, the cover member CV is pulled out from the -Y axis side end portion of the bottom 60c of the second unit portion 22, and is suspended from the side surface of the -Y axis side of the second unit portion 22 to the side surface of the + Z axis side. Covering the second unit section 22. A configuration in which the suspension cover member CV is wound from the first unit portion 21 side to the second unit portion 22 side may be adopted.

FIG. 6 is a side view showing the configuration of the processing unit 10. In FIG. 6, illustrations of the protective substrate C, the protective substrate driving section 48, and the protective substrate driving section 68 are omitted.

As shown in FIG. 6, in the conveying direction of the substrate S of the processing section 10, the first unit section 21 is disposed on the upstream side, and the second unit section 22 is disposed on the downstream side. In addition, the processing section 10 processes the processing surface Sa of the substrate S on the moving path of the substrate S supplied from the first unit section 21 and conveyed to the second unit section 22. The processing unit 10 includes a processing device 15, a guide device 16, and an alignment measurement device 17.

The processing device 15 includes various devices for forming, for example, an organic EL element on the processing surface Sa of the substrate S. Examples of such a device include a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode, and a light emitting layer forming device for forming a light emitting layer. More specifically, a droplet coating device (e.g., an inkjet type coating device, etc.), a film forming device (a film forming device, such as a vapor deposition device, a sputtering device, etc.) (Plating device), exposure device, developing device, surface modification device, cleaning device, drying device, inspection device for inspecting substrates, etc. Each of these devices is appropriately installed along the conveyance path of the substrate S.

In this embodiment, the processing device 15 includes a developing device 11 including a developing solution storage container 11a that contains a developing solution 11b for developing the substrate S, and a washing device 12b having a cleaning solution 12b that contains a cleaning substrate S. Washing device 12 of a clean liquid storage container 12a. In addition, the processing device 15 can accommodate a device that performs processing other than the above-mentioned liquid.

The guide device 16 includes a developing-side guide portion 13 and a washing-side guide portion 14. The developing-side guide 13 includes a first pad 13a, a second pad 13d, a first roller 13b, and a second roller 13c.

The first pad 13a is fixed inside the processing device 15 and guides the substrate S supplied from the first unit section 21 to the developer storage container 11a. The second pad 13d is fixed inside the processing device 15 and guides the substrate S passing through the developing solution 11b to the outside of the developing solution storage container 11a.

The first roller 13b and the second roller 13c are provided so as to be movable in the vertical direction (Z-axis direction) with respect to the developer storage container 11a. After the substrate S is carried between the first pad 13a and the first roller 13b, and between the second pad 13d and the second roller 13c, the first roller 13b and the second roller 13c are brought to the developer storage container 11a side (below, (I.e., -Z axis direction) movement, thereby changing the conveying direction of the substrate S of the first pad 13a to the -Z axis direction, and the substrate S is immersed in the developing solution 11b, and the substrate S can be guided to pass through the inside of the developing solution 11b. .

The washing-side guide portion 14 includes a first pad 14a, a second pad 14d, a first drum 14b, and a second drum 14c. Since the rollers of the washing-side guide portion 14 and the rollers of the developing-side guide portion 13 have the same configuration, description thereof is omitted.

The first pad 13 a and the second pad 13 d of the developing-side guide 13 and the first pad 14 a and the second pad 14 d of the cleaning-side guide 14 guide the back surface of the processed surface Sa of the substrate S. Therefore, the first pad 13a, the second pad 13d, the first pad 14a, and the second pad 14d each have a cylindrical guide surface and a plurality of unillustrated ejection ports for ejecting gas from the guide surface. A layer of gas can be formed on the guide surface. With this layer of gas, the back surface of the substrate S (the surface on the opposite side to the processed surface Sa) can be guided on the guide surface in a non-contact manner. In addition, instead of the first pad 13a and the second pad 13d, a rotary drum may be used. In the case of using a rotary roller, the rotary roller guides the substrate S in a state where the back surface of the substrate S is in contact with the guide surface of the rotary roller.

The alignment measurement device 17 measures an edge portion of the substrate S or an alignment mark provided on the substrate S, and performs an alignment operation on the substrate S according to the measurement result. The alignment measurement device 17 has an alignment camera that detects the edge portion of the substrate S or an alignment mark, or adjusts the position (for example, the position in the width direction of the substrate S) of the substrate S (for example, the position of the substrate S) based on the detection result of the alignment camera. An adjustment device or the like for at least one of the inclination with respect to the conveying direction). As the position measurement and the speed measurement of the substrate S, a method of projecting laser light on the substrate S by means of an optical mouse and detecting the change of the speckle pattern generated on the substrate S by photoelectricity can also be used.

Next, the operation of the substrate processing apparatus 100 configured as described above will be described. 7 to 12 are diagrams showing operations of the substrate processing apparatus 100. In FIGS. 7 to 12, illustrations of the protective substrate C, the protective substrate driving section 48, and the protective substrate driving section 68 are omitted.

First, the case where the operation | movement which mounts the board | substrate S between the shaft part 41a and the shaft part 61a in the conveyance mechanism 24 is demonstrated. In subsequent operations, a case where the control unit CONT communicates with, for example, the substrate-side communication unit 43 and the substrate-side communication unit 63 or the mobile-unit communication unit 44 and the mobile-unit communication unit 64 to control each unit will be described as an example.

First, the first unit portion 21 causes the first unit portion 21 and the second unit portion 22 supported by the moving portion 42 to cause the second unit portion 22 supported by the moving portion 62 to stand by in each of the plurality of buffer portions BF. The control unit CONT attracts a group of the first unit portion 21 and the second unit portion 22 between the first connection portion 23 a and the second connection portion 23 b to connect the first storage portion 40 and the second storage portion 60. Thereby, the said 1st unit part 21 and the 2nd unit part 22 can move integrally.

The control unit CONT first moves the first unit unit 21 and the second unit unit 22 integrally from the buffer unit BF onto the guide rail 30. After that, the control unit CONT moves the first unit portion 21 and the second unit portion 22 along the guide rail 30 as shown in FIG. 7, and is disposed at the + Y side end portion of the second rail 33, that is, the first rail 31 . In addition, a roll-shaped substrate S is mounted on the shaft portion 41 a of the first unit portion 21 in advance. At the front end Sf of the substrate S, as shown in FIG. 7 The guide Lf is attached to the structure, but the structure of the guide Lf may be omitted.

Next, the control unit CONT rotates the shaft portion 41a by the rotation driving portion 41b. With this operation, the front end Sf of the substrate S is sent out to the shaft portion 61a, and the front end Sf of the substrate S reaches the shaft portion 61a and is wound around the shaft portion 61a. In addition, the operation of winding the front end Sf of the substrate S on the shaft portion 61a may be automated, but the front end Sf may be adhered to the shaft portion 61a by using a fixing tape or the like by human power.

The control unit CONT cuts the connection between the first unit portion 21 and the second unit portion 22 after the front end Sf of the substrate S is wound around the shaft portion 61a. Thereby, the first unit part 21 and the second unit part 22 can move independently. After that, the control unit CONT rotates the shaft portion 41 a to send out the substrate S, and at the same time moves the second unit portion 22 along the third rail 33 in the -Y axis direction.

The control unit CONT moves the second unit portion 22 until the second unit portion 22 reaches the -Y-axis side end portion of the third rail 33, that is, the second rail 32. While the second unit section 22 is moving, the first unit section 21 is maintained in a state of being arranged on the first rail 31. With this operation, as shown in FIG. 8, the first unit portion 21 is disposed on the first rail 31 and the second unit portion 22 is disposed on the second rail 32. In addition, the front end Sf of the substrate S is drawn out in the -Y axis direction while being wound on the shaft portion 61a.

After that, the control unit CONT moves the first roller 13b and the second roller 13c of the developing-side guide 13 of the processing device 15 and the first roller 14b and the second roller 14c of the cleaning-side guide 14 upward (+ Z (Axis direction) mobile. Thereby, between the first roller 13b and the second roller 13c and the developer storage container 11a (that is, the first pad 13a and the second pad 13d), the first roller 14b and the second roller 14c and the cleaning liquid are stored. The container 12a (that is, the third pad 14a and the fourth pad 14d) forms a gap through which the substrate S can pass.

The control unit CONT applies a proper tension to the substrate S between the shaft portion 41a and the shaft portion 61a in the Y-axis direction so that the substrate S passes through the gap. The tension of the substrate S can be adjusted by, for example, controlling the side of the second unit section 22 using the substrate transfer control section 77.

In this state, the control unit CONT, as shown in FIG. 9, synchronizes the first unit unit 21 and the second unit unit 22 by the rotation driving unit 41 b and the rotation driving unit 61 b, respectively on the first rail 31 and the second unit 31. The rail 32 moves toward the processing device 15 side (+ X axis direction). In this state, the substrate S is disposed between the first roller 13b and the second roller 13c and the developer storage container 11a, and between the first roller 14b and the second roller 14c and the cleaning liquid storage container 12a in the Z-axis direction. .

The control unit CONT first rotates the shaft portion 41a and the shaft portion 61a to convey the substrate S in the -Y axis direction and simultaneously moves the first roller 13b and the second roller 13c of the developing-side guide portion 13 in the -Z axis direction. . Thereby, the substrate S is immersed in the developing solution 11b, and the substrate S is subjected to a development process. After that, the control unit CONT rotates the shaft portion 41 a and the shaft portion 61 a to send the substrate S in the −Y axis direction. With this operation, the portion of the substrate S that has passed through the developer 11 b reaches the cleaning device 12.

Next, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to transfer the substrate S in the -Y axis direction and simultaneously moves the first roller 14b and the second roller 14c of the cleaning side guide portion 14 in the -Z axis direction. mobile. Thereby, the substrate S is immersed in the cleaning liquid 12b, and the substrate S is subjected to a cleaning process.

At this time, as shown in FIG. 10, the developing process is applied to the upstream side in the transport direction (-Y axis direction) in the substrate S, and the cleaning process is applied to the downstream side in the transport direction. After that, the control unit CONT rotates the shaft portion 41 a and the shaft portion 61 a to send the substrate S in the −Y axis direction. With this operation, the portion of the substrate S that has passed through the cleaning solution 12b is sent from the cleaning device 12 to the outside.

As shown in FIG. 10, those who support the back surface of the substrate S (the surface opposite to the processed surface Sa) are the first pad 13 a and the second pad 13 d on the development side guide 13, and the clean side guide 14 Since they are the first pad 14a and the second pad 14d, the substrate S can be transported without contacting the back surface by the gas layer formed on the guide surfaces of these pads.

The control unit CONT adjusts the moving speed of the substrate S moving from the shaft portion 41 a to the shaft portion 61 a according to the processing speed of the developing device 11 and the cleaning device 12. As shown in FIG. 11, the control unit CONT adjusts the rotation driving unit 41 b based on the winding diameter R1 of the substrate S wound around the shaft portion 41 a and the winding diameter R2 of the substrate S wound around the shaft portion 61 a. And the driving speed of the rotation driving section 61b. With this operation, the substrate S is conveyed at a constant speed. The monitoring of the speed of the substrate S can also be performed by measuring the timing (time) of the alignment mark provided on the substrate S by the alignment measurement device 17 of FIG. 3. Again, borrow The lifting portion 53 and the lifting portion 73 may be adjusted by changing the winding diameter R1 of the substrate S and the winding diameter R2 of the substrate S.

After the development process and the cleaning process are completed, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to transfer the substrate S to the -Y axis direction and simultaneously causes the first roller 13b and the second roller of the developing-side guide 13 13c moves in the + Z axis direction, and moves the first roller 14b and the second roller 14c of the washing-side guide portion 14 in the + Z axis direction.

After that, as shown in FIG. 12, the control unit CONT synchronizes the first unit unit 21 and the second unit unit 22 by the synchronization control of the movement unit 42 and the movement unit 62, and respectively follows the first track 31 and the second track 32. Move in the + X axis direction. As a result of this operation, the state is retracted from the processing device 15 toward the + X axis side. The control unit CONT stops the movement of the first unit unit 21 and the second unit unit 22 after the first unit unit 21 and the second unit unit 22 reach the third rail 33.

The control unit CONT stops the movement of the first unit unit 21 and the second unit unit 22, and then rotates the shaft unit 61a and simultaneously moves the second unit unit 22 in the + Y-axis direction. With this operation, the shaft portion 61 a is wound around the substrate S while the shaft portion 41 a and the shaft portion 61 a approach again, and the first connection portion 23 a of the first unit portion 21 and the second connection portion 23 b of the second unit portion 22 abut. After that, the control unit CONT activates the electromagnet to attract the first connection portion 23a and the second connection portion 23b. Thereby, the first storage portion 40 and the second storage portion 60 are connected again, and the first unit portion 21 and the second unit portion 22 are integrated. After that, control The section CONT moves the first unit section 21 and the second unit section 22 in an integrated state appropriately along the first rail 31, the second rail 32, and the third rail 33. In the above operations, the control unit CONT uses the positions detected by the position detection unit 55 and the position detection unit (first detection unit) 75 so that the first unit unit 21 and the second unit unit 22 do not collide with each other. The information appropriately arranges the configurations of the first unit section 21 and the second unit section 22.

As described above, the cassette device according to this embodiment includes the first unit section 21 having a substrate driving section 41 for supplying a flexible substrate S, and the first unit section 21 is detachably provided to the first unit section 21. In addition, the second unit portion 22 of the substrate driving portion 61 that recovers the substrate S between the substrate driving portion 41 and the substrate driving portion 41 completes the supply and recovery of the substrate S between the first unit portion 21 and the second unit portion 22. With this, it is possible to prevent the size of the substrate S in the rack from being extended from the delivery to the winding, and thus it is possible to reduce the management burden of the substrate S during transportation.

(Second Embodiment)

Next, a second embodiment will be described.

FIG. 13 is a diagram schematically showing the configuration of a substrate processing apparatus 200 according to this embodiment.

As shown in FIG. 13, in the present embodiment, the substrate processing apparatus 200 is formed in a plurality of levels in the Z-axis direction (three levels in FIG. 13). The substrate processing apparatus 200 includes a processing unit 10 and a cassette device 20 at each stage. Further, the ground FL1, the ground FL2, and the ground FL3 of each step are along the processing unit 10, respectively. A guide rail 30 is formed.

The cassette device 20 has the same structure as the above-mentioned embodiment. That is, the first unit portion 21 and the casing 51 are detachably provided. The second unit portion 22 is detachably provided between the housing 71 and the case 71. The first unit portion 21 and the second unit portion 22 are detachably provided.

FIG. 14 is a cross-sectional view showing the configuration of the substrate processing apparatus 200.

As shown in FIG. 14, the substrate processing apparatus 200 includes three processing chambers 111 to 113. The processing chambers 111 to 113 are partitioned by a partition 114. The partition 114 includes a partition member 114a constituting the floor FL1 of the processing chamber 111, a partition member 114b constituting the top of the processing chamber 111 and the floor FL2 of the processing chamber 112, and a partition member constituting the top of the processing chamber 112 and the floor FL3 of the processing chamber 113. 114c. A partition member 114d constituting the top of the processing chamber 113.

The processing chamber 111 is disposed at the lowermost position (most near the -Z axis side) in the gravity direction among the plurality of processing chambers. The processing chamber 111 forms a processing space for processing the substrate S using a liquid (wet processing). In the processing chamber 111, for example, as shown in FIG. 14, as the processing device 110, there is provided a coating device 141 including a photoresist storage container 141a for storing a photoresist liquid for coating the substrate S, and a container for developing the substrate S. A developing device 142 of the processed developer, a developer storage container 142a, a cleaning device 143 including a cleaning liquid storage container 143a that stores a cleaning liquid for cleaning the substrate S, and a cleaning device 143 Gold plating solution for patterning the substrate S Gold-plated device 144 for containing container 144a. In addition, the processing chamber 111 can accommodate a device that performs processing other than the above-mentioned liquid.

The partition member 114a is provided with a plurality of recovery pipes 145 constituting a part of a waste liquid recovery flow path connected to a recovery device (not shown). One end portion of the recovery tube 145 is connected to each of the coating device 141, the developing device 142, and the cleaning device 143, and the other end portion is connected to a waste liquid recovery flow path (not shown) connected to the recovery device. Each recovery tube 145 discharges the photoresist liquid, the developing liquid, and the cleaning liquid that become waste liquid in the coating device 141, the developing device 142, and the cleaning device 143 through the waste liquid recovery flow path to the recovery device. The recovery pipe 145 is provided with an on-off valve and the like (not shown). The control unit CONT can control the timing of opening and closing the on-off valve. In this embodiment, since the processing chamber 111 in the lowermost direction of gravity is provided with a device for wet processing, the length of the flow path system of the waste liquid recovery flow path between these devices and the recovery device can be suppressed.

The processing chamber 112 is disposed above the processing chamber 111 (+ Z axis side). The processing chamber 112 forms a processing space for heating the substrate S. In the processing chamber 112, as the processing device 110, heating devices 151 to 153 for heating the substrate S are provided. The heating device 151 heats the substrate S coated with the photoresist liquid by the coating device 141 to dry the photoresist liquid. The heating device 152 heats the substrate S of the exposure device EX that has passed through the processing chamber 113 again to dry the photoresist liquid. The heating device 152 heats the substrate S at a temperature different from the heating temperature of the heating device 151, for example, a temperature higher than the heating temperature of the heating device 151. The heating device 153 heats the developing processing by the developing device 142 and cleans the device by washing The cleaned substrate S is set at 143 to dry the surface of the substrate S. The heating devices 151 to 153 have a structure in which the substrate S is folded back several times. Inside the heating devices 151 to 153, the substrates S are conveyed in a state of being overlapped and folded back so as not to contact each other. Therefore, the substrate S can be efficiently stored in the heating devices 151 to 153 while maintaining the state of the processing surface Sa of the substrate S.

The processing chamber 113 is disposed above the processing chamber 112 (+ Z axis side). The processing chamber 113 is a processing space for exposing the substrate S. In the processing chamber 113, an exposure device EX is provided as the processing device 110. The exposure device EX irradiates light for exposure to the photoresist layer coated on the substrate S by the coating device 141 through the pattern of the photomask.

The substrate processing apparatus 200 configured as described above is provided with a plurality of raised portions 160 (161 to 166). The lifting section 160 transports the first unit section 21 and the second unit section 22 between different steps. For example, the raised portion 161, the raised portion 164, the raised portion 165, and the raised portion 166 transport the first unit portion 21 and the second unit portion 22 between the first stage and the second stage. For example, the raised portion 162 and the raised portion 163 transport the first unit portion 21 and the second unit portion 22 between the second and third steps.

Each of the raised portions 160 includes a lifting mechanism 160 a that penetrates the partition member 114 b and the partition member 114 c in the Z-axis direction.

FIG. 15 is a perspective view showing a schematic configuration of the raised portion 160.

As shown in FIG. 15, the lifting mechanism 160 a is connected to the external connection portion 40 d of the first unit portion 21 or the connection portion 60 d of the second unit portion 22. Rise The lowering mechanism 160a includes a moving mechanism (not shown) that moves the first unit portion 21 and the second unit portion 22 in the Z-axis direction. The lifting mechanism 160a can move the first unit portion 21 and the second unit portion 22 in the integrated state in the Z-axis direction.

In addition, the lifting section 160 has mounting sections for the first unit section 21 and the second unit section 22 that have been transported across steps to be mounted on the casings 51 and 71 of the moving section 42 and the moving section 62 provided at the stage to be transported, respectively. (Not shown). Thereby, the substrate S accommodated in the first unit portion 21 and the second unit portion 22 can be moved in steps.

Next, the operation of the substrate processing apparatus 200 will be described.

The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the processing chamber 111 from a predetermined entrance, and moves the coating unit 141 along the guide rail 30. The control unit CONT arranges the first unit portion 21 on the + Y side of the coating device 141 and the second unit portion 22 on the coating device 141- Y side. In this state, the control unit CONT transports the substrate S from the first unit unit 21 to the second unit unit 22, and at the same time performs a coating process of the photosensitive agent on the processed surface of the substrate S.

After the coating device 141 performs the processing, the control unit CONT integrates the first unit unit 21 and the second unit unit 22 and moves to the raised portion 161. After the first unit portion 21 and the second unit portion 22 reach the raised portion 161, the control unit CONT connects the first unit portion 21 and the second unit portion 22, for example, the connection portion of the second unit portion 22 60d connected to liter Lifting mechanism 160a of the rising portion 161. After that, the control unit CONT transports the first unit unit 21 and the second unit unit 22 in the state of integrating the first unit unit 21 and the second unit unit 22 using the lifting mechanism 160a, and then transports the unit unit 21 in the + Z axis direction. With this operation, the installation state between the first unit portion 21 and the casing 51 and between the second unit portion 22 and the casing 71 is released, and the first unit portion 21 and the second unit portion 22 are removed from the casing 51 and the basket. The body 71 is separated, moves in the + Z axis direction, and is transported from the processing chamber 111 to the processing chamber 112.

The control unit CONT causes the moving unit 42 and the moving unit 62 disposed in the processing chamber 112 to stand by in the vicinity of the raised portion 161 in advance. The control unit CONT uses a mounting unit (not shown) to mount the first unit unit 21 and the second unit unit 22 that are transported to the processing chamber 112 to the moving unit 42 and the moving unit 62, respectively.

After that, the control unit CONT carries the substrate S into the heating device 151 using the first unit unit 21 and the second unit unit 22, and heats the substrate S. In the heating device 151, the substrate S is conveyed in a state where the substrate S is bent multiple times, for example, and the substrate S is heated in the conveyed state. Therefore, a heat treatment using space efficiently can be performed. In the heating device 151, the coating film formed on the substrate S is dried by heating.

After the heat treatment is performed, the control unit CONT transfers the first unit unit 21 and the second unit unit 22 to the processing chamber 113 through the lifting unit 162 through the same operation as described above. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the exposure apparatus EX in the processing chamber 113, and performs exposure processing on the photosensitive agent applied to the substrate S.

After performing the exposure processing, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 through the lifting unit 163. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the heating device 152 in the processing chamber 112 to heat-process the substrate S. In the heating device 152, a heat treatment is performed on the photosensitive coating film.

After the heat treatment, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 through the lifting unit 164. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the developing device 142 in the processing chamber 111 and performs a development process on the substrate S. In the developing device 142, the substrate S is immersed in a developing solution and is transferred from the first unit portion 21 to the second unit portion 22 at the same time, and the developing process is performed during the transfer.

After the development process is performed, the control unit CONT moves the first unit unit 21 and the second unit unit 22 to the cleaning device 143 in an integrated state, and carries the substrate S into the cleaning device 143. In the cleaning device 143, the substrate S is immersed in a cleaning solution and is simultaneously transported from the first unit portion 21 to the second unit portion 22, and a cleaning process is performed during the transportation.

After the cleaning process is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 through the lifting unit 165. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the heating device 153 in the processing chamber 112 to heat-process the substrate S. In the heating device 153, a heat treatment for drying the cleaned substrate S or a heat treatment for heating the coating film is performed.

After the heat treatment is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 through the lifting unit 166. The control unit CONT moves the first unit portion 21 and the second unit portion 22 to the gold plating device 144 in the processing chamber 111, and carries the substrate S into the gold plating device 144. In the gold plating device 144, the substrate S is immersed in a gold plating solution and is simultaneously transferred from the first unit portion 21 to the second unit portion 22, and is subjected to gold plating processing during the transfer. The substrate S after the gold plating process is formed into a predetermined pattern.

After performing the gold plating process, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 through the lifting unit 166. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into a heating device (not shown) in the processing chamber 112 and performs heating processing.

As described above, the substrate processing apparatus 200 of this embodiment is provided with, for example, the processing chamber 111 between the first rail 31 and the second rail 32 as the processing apparatus 110. The coating apparatus 141, the developing apparatus 142, and The cleaning device 143 and the gold plating device 144 move the first unit portion 21 and the second unit portion 22 between these devices (the coating device 141, the developing device 142, the cleaning device 143, and the gold plating device 144). Since the first unit section 21 supplies the substrate S to each device, and the second unit section 22 recovers the substrate S, a single wafer process can be performed in the plurality of processing devices 110.

Thereby, it is possible to suppress the length of the substrate S in the rack from being delivered to the winding, and therefore, it is possible to reduce the management load of the substrate S during the transportation. Moreover, even if a plurality of processing devices having different processing speeds are included in one production line, In the case of 110, it is not necessary to make the processing speed uniform in the entire production line. Therefore, each processing device 110 can be efficiently used. Furthermore, in the substrate processing apparatus 200 having a plurality of levels, the first unit portion 21 and the second unit portion 22 can be divided from the moving portion 42 and the moving portion 62 and transferred between different levels, so that it can be efficiently performed. Transport.

The technical scope of the present invention is not limited to the above-mentioned embodiments, and appropriate changes can be made without departing from the scope of the present invention.

For example, in the embodiment described above, the configuration in which the first unit section 21 and the second unit section 22 are detachably mounted is taken as an example for description, but it is not limited thereto.

For example, a configuration in which the first unit portion 21 and the second unit portion 22 are not attached to each other and only approach and separate may be adopted. In addition, instead of attaching the first unit portion 21 and the second unit portion 22, the moving portion 42 supporting the first unit portion 21 and the moving portion 62 supporting the second unit portion 22 may be detachable.

For example, in the above-mentioned embodiment, the first unit portion 21 is used for the supply of the substrate S and the second unit portion 22 is used for the recovery of the substrate S. However, the present invention is not limited to this. For example, the first unit portion 21 may be used for recovering the substrate S, and the second unit portion 22 may be used for supplying the substrate S. In addition, the first unit portion 21 and the second unit portion 22 have the same configuration, and the first unit portion 21 and the second unit portion 22 are replaced with each other on the guide rail 30, and the supply operation and the recovery operation are appropriately switched and the substrate S is simultaneously performed It can also be transported.

In the second embodiment described above, the substrate processing apparatus has a plurality of layers as an example, but it is not limited to this. For example, as shown in FIG. 16, a configuration in which a plurality of production lines are arranged in the Y-axis direction may be used. In this case, as the configuration of the processing unit 10, a configuration in which a device that performs the same kind of processing is arranged in the Y-axis direction may be used.

Moreover, in the said embodiment, although the structure provided with the position detection parts 55 and 75 in the end surface 51d and 71d of the -Z axis side of the base part 51b and the base part 71b was demonstrated as an example, it is not limited to this. For example, as shown in FIG. 17, a configuration may be provided in which terminals (electric power acquisition units) 56 and 76 contacting the guide rail 30 are provided. In this case, the power source is connected to the guide rail 30 in advance, and thereby power can be obtained through the terminals 56 and 76.

In addition, for example, in the embodiment described above, the case where the first unit portion 21 and the second unit portion 22 are moved by the processing unit 10 in one direction is described as an example, but it is not limited thereto.

18 (a) to 18 (c) are diagrams showing an example of a movement operation of the first unit portion 21 and the second unit portion 22.

For example, as shown in FIG. 18 (a), the control unit CONT pulls the first unit portion 21 and the second unit portion 22 apart to pull out the substrate S. As shown in FIG. The second unit section 22 is carried into the processing section 10 along the + X axis direction and processed. After that, as shown in FIG. 18 (c), the first unit portion 21 and the second unit portion 22 may be moved back in the -X axis direction. This makes it difficult for the processing unit 10 to pass through the X-axis direction even with the substrate S. In this case, the substrate S can be efficiently transferred.

In the above embodiment, the case where the first unit portion 21 and the second unit portion 22 are arranged on the first rail 31 side, the second unit portion 22 is moved to the second rail 32 side, and the substrate S is pulled out is taken as an example. Explanation, but not limited to this. For example, the first unit portion 21 may be moved from the side of the second rail 32 to the side of the first rail 31 to thereby pull out the substrate S.

As shown in FIG. 19 (a), the first unit portion 21 and the second unit portion 22 are arranged at the center portion in the Y-axis direction of the third rail 33. Thereafter, as shown in FIG. 19 (b), The first unit portion 21 may be moved in the + Y-axis direction and the second unit portion 22 may be moved in the -Y-axis direction, thereby drawing the substrate S.

Moreover, in the said embodiment, although the case where the 1st unit part 21 and the 2nd unit part 22 moved to the X-axis direction in the state arrange | positioned in the Y-axis direction is demonstrated as an example, it is not limited to this. For example, the first unit portion 21 and the second unit portion 22 may be moved in the Y-axis direction in a state in which the X-axis direction is aligned.

For example, as shown in FIG. 20 (a), the first unit portion 21 and the second unit portion 22 are respectively disposed at the intersections of the two third rails 33 and the second rails 32 of the processing unit 10 in the X-axis direction. At this time, the substrate S is taken out. Thereafter, as shown in FIG. 20 (b), the first unit unit 21 and the second unit unit 22 are moved in the + Y-axis direction, thereby carrying the substrate S into the processing unit 10. Thereby, even if the board | substrate S is difficult to carry in the X-axis direction in the structure of the processing part 10, the board | substrate S can be efficiently conveyed.

In the above embodiment, as the configuration of the connection portion 23, the configuration in which the first connection portion 23a and the second connection portion 23b are adsorbed by the electromagnet will be described as an example, but it is not limited to this. A connection structure is also possible.

Further, in the above-mentioned embodiment, the shaft portion 41a and the shaft portion 61a of the drive substrate S or the shaft portion 48a and the shaft portion 68a of the drive protection substrate C are arranged parallel to the X-axis direction and the substrate S, for example, in the axial direction of the central axis. The configuration in which the protective substrate C is transported in parallel with the XY plane is described as an example, but it is not limited to this. For example, the shaft portion 41a and the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a are arranged in such a manner that the axis direction of the central axis is parallel to the Z-axis direction, and the substrate S or the protective substrate C is transported in parallel with the YZ plane or the ZX plane. Yes.

Further, in the above-mentioned embodiment, the positions of the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a in the Z-axis direction can be adjusted by moving the housings 51 and 71 of the moving portion 42 and the moving portion 62 in the Z-axis direction. The form is described as an example, but it is not limited to this. For example, the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a may be configured to be movable in the Z-axis direction.

A substrate S having a structure different from that of the above embodiment can be used.

FIG. 21 is a diagram showing the structure of the substrate S. FIG.

As shown in FIG. 21, it is also possible to have a configuration in which a protective layer 90 is formed, and the protective layer 90 surrounds, for example, a pattern forming region P in which a wiring, an electrode, an element, or the like is formed in the processing surface Sa of the substrate S.

The protective layer 90 is formed to have a layer thickness larger than that of the pattern formation region P. With this configuration, even when the protective substrate C overlaps the processing surface Sa, the protective substrate C can be prevented from contacting the pattern formation region P. The protective layer 90 may be formed on the protective substrate C side.

22 to 27 are perspective views showing another embodiment of the substrate transfer apparatus. As described in FIG. 2 and FIG. 3 described above, the first unit portion 21 can be mounted and the self-propelled moving portion 42 can be moved in the X-axis direction, the Y-axis direction, and the θ Z-axis direction by the rotation of the caster 52. This is also the same with the self-propelled moving section 62 in which the second unit section 22 can be mounted. Therefore, as shown in FIG. 18 to FIG. 20 described above, the transport guide mechanism composed of the first rail 31 and the second rail 32 extending in the X-axis direction and the third rail 33 extending in the Y-axis direction is shown in FIG. 22 As shown, loop tracks 34a, 35a are laid as additional transport guides.

The ring-shaped track 34a is laid in a ring shape with a certain radius from the center point TC1 where the first track 31 and the third track 33 intersect. Further, the ring-shaped track 35a is laid in a ring shape with a certain radius from the center point TC2 where the second track 32 and the third track 33 intersect. The orbits 34a and 35a serve as a guide path for rotating (rotating) the moving part 42 or the moving part 62 around the center point TC1 or TC2. In addition, each of the laying points at the center points TC1 and TC2 is used to accurately locate the circular plate-shaped marking portions (including markers or induction signal generators, etc.) 34b, 35b of the moving portions 42,62.

Next, the processing apparatus 10 shown in FIG. 22 is, for example, an atmospheric pressure CVD apparatus, and includes an upper structure 10a and a lower structure 10b. under The partial structure 10b is installed on the floor (FL) of the factory, and the upper structure 10a is movable in the Z-axis direction with respect to the lower structure 10b.

By moving the upper structure 10a above the Z-axis direction, the substrate S suspended between the shaft portion 41c of the first unit portion 21 and the shaft portion 61c of the second unit portion 22 can be moved in the X-axis direction. And carried out of the processing device 10.

FIG. 22 shows that the processing of the substrate S of the processing device 10 is completed, and the moving part 42 (the first unit part 21) and the moving part 62 (the second unit part 22) are moved in the X-axis direction with the upper structure body 10a positioned upward. Status of synchronous movement. The moving part 42 (the first unit part 21) is guided by the first track 31 and simultaneously moves toward the -X axis toward the center point TC1 as the original position, and the moving part 62 (the second unit part 22) is guided by the second track 32 At the same time, it moves towards the -X axis direction toward the center point TC2 which is the original position.

Thereafter, as shown in FIG. 23, both the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) reach the original positions (positions of the center points TC1 and TC2) in the X-axis direction. At this time, the third rail 33 extending in the Y-axis direction is located exactly between the moving portion 42 and the moving portion 62.

After that, either one of the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) moves in the Y-axis direction toward the other side. The state is shown in FIG. 24. Here, the moving part 42 (the first unit part 21) faces the moving part 62 (the second unit part 22) and is guided and moved by the third rail 33. At this time, the shaft portion 41c of the first unit portion 21 or the shaft portion 61c of the second unit portion 22 moves with The movement in the Y-axis direction of the portion 42 (the first unit portion 21) is rotated in conjunction with the movement of the substrate S so that the substrate S is not loosened.

FIG. 25 shows a state where the moving section 42 (first unit section 21) approaches the moving section 62 (second unit section 22) and is connected (connected) as shown in FIG. 5 described above. At this time, the moving part 62 (the second unit part 22) is located on the center point TC2 (the marking part 35b), and the moving part 42 (the first unit part 21) is located on the ring-shaped rail 35a.

From this state, the caster 72 of the moving part 62 generates a driving force for rotating (rotating) the moving part 62 (the second unit part 22) in the direction of the θZ axis around the center point TC2. Together, the casters 52 of the moving portion 42 generate a driving force that rotates (rotates) the moving portion 42 (first unit portion 21) along the circumferential direction of the ring-shaped rail 35a. Furthermore, at this time, the caster 72 of the moving part 62 or the caster 52 of the moving part 42 performs the rotation center of the moving part 62 from the center point TC2 in the X-axis direction and the Y-axis direction based on the detection result of the indicator 35b. Direction control of ground position offset.

FIG. 26 shows a state where the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) that are connected are rotated 90 degrees clockwise from the state of FIG. 25 with the center point TC2 as the center in the XY plane. The rotation direction here is 90 degrees clockwise, but 90 degrees counterclockwise may be used. The rotation direction is determined by how the substrate S is loaded in the next processing apparatus.

After that, as shown in FIG. 27, the second unit section holding the reel of the substrate S after the film formation process by the processing apparatus 10 (for example, an atmospheric pressure CVD apparatus) is held. 22 (moving part 62) and the first unit part 21 (moving part 42) holding the reel of the remaining unprocessed substrate S are integrated and moved in parallel in the + X axis direction by the guidance of the second rail 32, The transverse processing device 10 faces the next processing device.

Thereby, the original positions (center points TC1, TC2) are vacated, so the moving part 42-1 (first unit part 21-1) and moving part 62-1 (second unit part 22) of the next substrate S to be processed are mounted -1) It becomes the original position that is sent to the center point TC1 as a whole.

Thereafter, as shown in FIG. 27, the first unit portion 21-1 (moving portion 42-1) holding the reel of the unprocessed substrate S is located at the center point TC1 (the intersection portion of the first track 31 and the third track 33) ) State, the second unit portion 22-1 (moving portion 62-1) for winding the processed substrate S into a reel shape moves along the third track 33 toward the center point TC2.

As described above, the moving part 42 (first unit part 21) or the moving part 62 (second unit part 22) is provided with a space (ring rails 34a, 35a, etc.) that can freely rotate on the floor FL of the factory. , Can improve the degree of freedom in the arrangement of the processing device, the degree of freedom in the direction of the substrate S (reel-shaped), and the efficiency of the transfer.

In the above embodiment, in FIGS. 25 and 26, the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) connected at a certain interval are rotated by 90 degrees. However, in the case where the next processing device is provided, for example, on the -Y axis side of the processing device 10 in Fig. 25, it is along the -Y axis direction. The extended third rail 33 may move the moving portion 42 (first unit portion 21) and the moving portion 62 (second unit portion 22) directly in the -Y axis direction, and rotate around the center point TC2 from the state shown in FIG. 25 After 180 degrees, it can be moved in the -Y direction.

In addition, in FIGS. 25 to 27, the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) are moved while being connected at a certain interval. However, it is not necessary for the two to be in mechanical contact. It is also possible to use a non-contact sensor or the like to maintain a certain spatial gap and simultaneously move the moving part 42 and the moving part 62 within a certain position offset range (for example, 1 mm or less). .

In any case, in order to transfer the moving section 42 (first unit section 21) and moving section 62 (second unit section 22) for which the processing of the substrate S has been completed to the next processing apparatus (second processing apparatus), the substrate S moves in parallel to the first direction (X-axis direction in FIG. 22 to FIG. 27) away from the processing device that has undergone the above processing, and to the second direction (FIG. 22 to FIG. 27) that intersects the first direction. Y axis direction), at least two motions (two motions are continuous) among the rotation motions in the plane including the first direction and the second direction (XY plane in Fig. 22 to Fig. 27), driving each caster 52, 72 to move the moving part 42 together with the moving part 62. In addition, the parallel movement is not necessarily limited to the X-axis direction or the Y-axis direction, and also includes the moving portion 42 (the first unit portion 21) or the moving portion 62 (the second unit portion 22) in the XY plane with respect to both the X-axis and the Y-axis. In the case of a rectilinear oblique direction (for example, a 45-degree direction).

The above has explained the handling of the substrate S (or the protective substrate C) using the cassette device (the first unit portion 21 and the second unit portion 22) shown in Figs. 2 to 5. Send form. However, the temperature adjustment mechanism of the substrate S, the humidity adjustment mechanism, and the ultraviolet irradiation mechanism are provided in each cassette device. As one of the processing devices, a temperature adjustment device, a humidity adjustment device, and an ultraviolet irradiation device are provided. It is also possible to perform temperature adjustment, dehumidification, humidification, and UV irradiation on the substrate S at an appropriate timing.

Generally speaking, in the production of large-scale, high-definition flat panel displays, etc., the substrate S, which is the base material, is sent to various processing apparatuses and subjected to various processes. In particular, when a flexible film substrate such as PET or PEN is continuously processed by a roll-to-roll method, it is considered that stress is accumulated on the film substrate in each processing step, and the film substrate is deformed. Furthermore, the film substrate to be processed or the film material that has been deposited on the substrate must also be set to an appropriate state in advance in each processing step, such as temperature, moisture content, and wettability.

Therefore, the temperature of the cassette device 20 (the first unit section 21 and the second unit section 22) in which the substrate S is loaded is adjusted during the movement or standby of the cassette device 20 (the first unit section 21 and the second unit section 22). The mechanism, the humidity adjustment mechanism, or the ultraviolet irradiation mechanism operates. Alternatively, the temperature adjustment device, humidity adjustment device, and ultraviolet irradiation device independently provided in the factory of the cassette device 20 are moved to pass the substrate S. In this way, the temperature of the substrate S (or the film material on its surface), the state of the water content, the wettability, and the internal stress can be adjusted in advance to the specifications of the processing device suitable for the next processing step.

In the embodiment of the present invention, since the cassette device 20 holding the reel-shaped substrate S can be moved to various processing devices, it is possible to perform a cassette device unit. Batch processing. Therefore, even if a step (equivalent to a processing step) for adjusting various states of the substrate S (or a film material on the surface thereof) is added before the processing step, the yield of the entire production line will not be greatly reduced, and a good yield can be achieved. Of production.

S‧‧‧ substrate

CONT‧‧‧Control Department

BF‧‧‧Buffering Department

10‧‧‧ Processing Department

20‧‧‧box device

21‧‧‧First Unit

22‧‧‧Second Unit

24‧‧‧ Mobile agency

30‧‧‧rail

31‧‧‧ first track

32‧‧‧ second track

33‧‧‧ Third Track

100‧‧‧ substrate processing equipment

Claims (8)

A substrate conveying method is to supply a long-tape sheet substrate to a processing device in a reel-to-reel manner, and recover the substrate from the processing device. The method includes preparing two cassette devices, which are provided to be rotatably driven and wound. The unit portion of the reel of the sheet-like substrate, and the moving portion that moves the unit portion along the parallel surface by supporting the unitary movement and rotation movement in a plane parallel to the rotation axis of the reel; Arranging the two cassette devices in such a manner that the reels of the unit sections of the two cassette devices are parallel to each other, and suspending the sheet substrate between the reels of the two cassette devices; And each of the unit sections of the two cassette devices with the sheet substrate being suspended is arranged in a first state sandwiching the processing device at a predetermined interval and a second state arranged to be connected or close to each other This method controls the control stage of the moving part. For example, the method for transporting a substrate according to item 1 of the patent scope further includes: after the control stage becomes the second state, along with the side-by-side movement of the sheet substrate by the moving section, The moving stages of the two cassette devices are moved together in a parallel movement in a short side direction orthogonal to the long side direction, and at least two movements in the rotation movement. For example, the method for transferring substrates in the scope of patent application No. 2 The unit portion of the cassette device is detachable from the moving portion, and when the second portion is in the second state, each of the unit portions of the two cassette devices is removed from the moving portion and transported in an interconnected state . For example, the method for transferring a substrate according to any one of claims 1 to 3, wherein the unit section or the moving section of the cassette device has a communication section capable of communicating with the control section, and the moving section is provided with A caster driving unit for performing the parallel movement and the rotary movement, and each of the moving units of the two cassette devices is controlled by a control signal from the control unit through the communication unit. For example, in the method for transferring a substrate according to item 4 of the scope of patent application, one of the two cassette devices has a first unit section mounted with a supply roller around which the sheet substrate supplied to the processing device is wound. The other one of the two cassette devices has a second unit section on which a recovery roller wound with the sheet substrate recovered from the processing device is mounted, and the first unit section is capable of communicating with the control section. A first communication section, and the second unit section has a second communication section capable of communicating with the control section. For example, the method for transporting a substrate according to item 5 of the patent application, wherein the first communication unit receives the The first control signal of the movement operation of the first unit section by the moving section and the supply operation of the sheet substrate by the supply roller is received by the second communication section for controlling the movement of the second unit section by the supporting section. The second control signal of the moving operation of the second unit section performed by the moving section and the recovery operation of the sheet substrate by the recovery drum. For example, the method for transferring substrates in the scope of patent application No. 1 or 2, wherein each of the unit parts of the two cassette devices is detachable to the moving part, and the unit part removed from the moving part is by A lifting portion having a lifting mechanism is transported toward another processing device provided at a place different from the processing device. For example, the method for transferring a substrate according to any one of claims 1 to 7, wherein the unit portion of the cassette device has a function for controlling the rotation of the reel for feeding out or winding the sheet substrate. The rotary drive unit that is in operation is switched by the rotary drive unit in such a way that the sheet-like substrate hanging between the reels of the two cassette devices is not loosened while switching from the first state to the second state. Rotate the reel.