CN106185413A - Box device - Google Patents

Box device Download PDF

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Publication number
CN106185413A
CN106185413A CN201610622573.7A CN201610622573A CN106185413A CN 106185413 A CN106185413 A CN 106185413A CN 201610622573 A CN201610622573 A CN 201610622573A CN 106185413 A CN106185413 A CN 106185413A
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CN
China
Prior art keywords
substrate
unit
module
drive division
module portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610622573.7A
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Chinese (zh)
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CN106185413B (en
Inventor
浜田智秀
铃木智也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
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Publication date
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Publication of CN106185413A publication Critical patent/CN106185413A/en
Application granted granted Critical
Publication of CN106185413B publication Critical patent/CN106185413B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/182—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations
    • B65H23/185—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations motor-controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00—Function indicators
    • B65H2220/02—Function indicators indicating an entity which is controlled, adjusted or changed by a control process, i.e. output
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B65H2513/11—Speed angular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning In General (AREA)
  • Replacement Of Web Rolls (AREA)
  • Liquid Crystal (AREA)
  • Winding Of Webs (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Coating Apparatus (AREA)

Abstract

A kind of box device, has: first module portion, the side in carrying out the supply of substrate and reclaiming；With second unit portion, the opposing party in carrying out the supply of aforesaid substrate and reclaiming, above-mentioned first module portion and above-mentioned second unit portion can be closer to each other or separate.

Description

Box device
The application be PCT international application no be PCT/JP2012/082695, international filing date be December in 2012 17 days, The national applications number of National Phase in China is 201280072239.9, invention entitled " box device, base board delivery device, substrate Processing means and substrate processing method using same " the divisional application of Chinese invention patent application.
Technical field
The present invention relates to box (cassette) device, base board delivery device, substrate board treatment and substrate processing method using same.
The application is according to Japanese Patent Application 2012-092132 CLAIM OF PRIORITY filed in 13 days April in 2012, and by it Appearance is incorporated herein.
Background technology
As the display element of the display devices (display floater) such as composition display equipment, the most known liquid crystal display unit Part, organic electroluminescent (organic EL) element.At present, in these display elements, with each pixel the most on the surface of the substrate The active component (active device) forming thin film transistor (TFT) (Thin Film Transistor:TFT) is increasingly becoming master Stream.
Display element is above formed at the plate shape substrates (such as film member etc.) with flexibility in recent years it has been proposed that a kind of Technology.As this technology, the most known one is referred to as volume to volume (roll to roll) mode (hereinafter referred to as " volume side Formula ") maneuver (referring for example to patent documentation 1).Volume mode is by the supply cylinder being wound on substrate supply side Plate shape substrates (film member of such as banding) is sent, and is added by the recovery cylinder that the substrate sent reclaims side with substrate With winding, applied for being formed on substrate by the processing means being arranged between supply cylinder and recovery cylinder The desired processed of the electronic component such as display floater or solar panel.
And, at substrate from being sent until the period being wound, such as, use the conveyance bases such as multiple conveyance cylinders Plate, is producing in the case of display floater, uses multiple processing means (unit) to form the composition gate electrode of TFT, grid exhausted Velum, semiconductor film, source/drain etc., and in the processed surface of substrate, sequentially form the constitutive requirements of display element.Example As, in the case of forming organic EL element, substrate sequentially forms luminescent layer, anode, negative electrode, circuit etc..
Prior art literature
Patent documentation 1: international publication the 2006/100868th
Summary of the invention
But, in said structure, from being sent until period of being wound, owing to substrate rides over multiple process On device, so the total length of substrate is elongated, have the situation that the management of substrate is difficult to.
The purpose of mode of the present invention be to provide a kind of when can alleviate conveyance the box device of administrative burden of substrate, substrate remove Send device and substrate board treatment.
According to the 1st aspect of the present invention, it is provided that a kind of box device, have: first module portion, carry out substrate supply and The side reclaimed；And second unit portion, carry out the supply of substrate and the opposing party of recovery, first module portion and second unit portion Can closer to each other or separation.
According to the 2nd aspect of the present invention, it is provided that a kind of base board delivery device, have: first module portion, it is possible to movably It is located on the first mobile route, and carries out the supply of substrate and a side of recovery；Second unit portion, it is possible to be located at second movably On mobile route, and carry out the supply of substrate and the opposing party of recovery；And control portion, to being arranged in the first mobile route and First substrate process portion between two mobile routes, controls first module portion and makes it carry out a side of the supply of substrate and recovery, And control second unit portion make it carry out the opposing party of the supply of substrate and recovery, control portion to be arranged in the first mobile route with Between second mobile route and the second substrate process portion different from first substrate process portion, makes first module portion and second unit Portion moves, and controls first module portion and makes it carry out the opposing party of the supply of substrate and recovery, and control second unit portion makes it enter The supply of row aforesaid substrate and a side of recovery.
According to the 3rd aspect of the present invention, it is provided that a kind of substrate board treatment, have: multiple process portions, be arranged in first Between mobile route and the second mobile route, the substrate with flexibility is processed；And the substrate of second method of the present invention Carrying device.
According to the 4th aspect of the present invention, it is provided that a kind of substrate processing method using same, it is for the strip base by having flexibility Multiple processing means delivered to successively by plate, and forms the processing method of electronic component on aforesaid substrate, wherein, including: at first Science and engineering sequence, configures first module portion and second unit portion across above-mentioned first substrate process portion, and wherein, this first module portion wraps Including the feed roller being wound with the aforesaid substrate that should supply to first substrate process portion in the longitudinal direction, this second unit portion wraps Include the recovery cylinder of the aforesaid substrate that winding should reclaim in the longitudinal direction from above-mentioned first substrate process portion, by above-mentioned first Processing substrate portion processes and reclaims with above-mentioned recovery cylinder after the aforesaid substrate that above-mentioned feed roller supplies；First mobile process, Make above-mentioned first module portion above-mentioned along between above-mentioned feed roller and above-mentioned recovery cylinder together with above-mentioned second unit portion The first direction that substrate leaves from above-mentioned first substrate process portion moves；Second mobile process, in order to reduce above-mentioned feed roller And the interval that above-mentioned recovery cylinder is on above-mentioned length direction, makes at least the one of above-mentioned first module portion and above-mentioned second unit portion Side moves along the second direction intersected with above-mentioned first direction；With the 3rd mobile process, make at predetermined intervals relative to above-mentioned First module portion and above-mentioned second unit portion along with the translational motion of above-mentioned first direction, the translational motion of above-mentioned second direction, At least two motion in rotary motion within including the plane of above-mentioned first direction and second direction, and together towards with upper The second substrate process portion stating first substrate process portion different moves.
Invention effect
Mode according to the present invention, it is possible to the administrative burden of substrate when alleviating conveyance.
Accompanying drawing explanation
Fig. 1 is the integrally-built axonometric chart of the substrate board treatment representing the first embodiment.
Fig. 2 is the exploded perspective view of the structure of the side, first module portion representing present embodiment.
Fig. 3 is the figure of a part of structure of the box device representing present embodiment.
Fig. 4 is the exploded perspective view of the structure of the side, second unit portion representing present embodiment.
Fig. 5 is the figure of the structure of the box device representing present embodiment.
Fig. 6 is the figure of the structure in the process portion representing present embodiment.
Fig. 7 is the figure of a mode of the action of the substrate board treatment representing present embodiment.
Fig. 8 is the figure of a mode of the action of the substrate board treatment representing present embodiment.
Fig. 9 is the figure of a mode of the action of the substrate board treatment representing present embodiment.
Figure 10 is the figure of a mode of the action of the substrate board treatment representing present embodiment.
Figure 11 is the figure of a mode of the action of the substrate board treatment representing present embodiment.
Figure 12 is the figure of a mode of the action of the substrate board treatment representing present embodiment.
Figure 13 is the integrally-built axonometric chart of the substrate board treatment representing the second embodiment.
Figure 14 is the sectional view of a part of structure of the substrate board treatment representing present embodiment.
Figure 15 is the axonometric chart of the structure in the lifting portion representing present embodiment.
Figure 16 is the figure of another structure representing substrate board treatment.
Figure 17 is the figure of another structure representing substrate board treatment.
Figure 18 is the figure of another structure representing substrate board treatment.
Figure 19 is the figure of another structure representing substrate board treatment.
Figure 20 is the figure of another structure representing substrate board treatment.
Figure 21 is the figure of another structure representing substrate.
Figure 22 is another structure and the figure of operating state representing substrate board treatment.
Figure 23 is the figure of the next operating state of the substrate board treatment representing Figure 22.
Figure 24 is the figure of the next operating state of the substrate board treatment representing Figure 23.
Figure 25 is the figure of the next operating state of the substrate board treatment representing Figure 24.
Figure 26 is the figure of the next operating state of the substrate board treatment representing Figure 25.
Figure 27 is the figure of the next operating state of the substrate board treatment representing Figure 26.
Detailed description of the invention
[the first embodiment]
The first embodiment hereinafter, with reference to the accompanying drawings of the present invention.
Fig. 1 is the integrally-built axonometric chart of the substrate board treatment (base board delivery device) 100 representing present embodiment. As it is shown in figure 1, plate shape substrates (film member of the such as banding) S that substrate board treatment 100 has having flexibility advises Fixed process process portion (first substrate process portion, second substrate process portion) 10, the conveying unit (box device) 20 of conveyance substrate S, With pool control process portion 10 and the control portion CONT of box device 20.Substrate board treatment 100 is arranged on such as manufacturer's On the FL of ground.
Substrate board treatment 100 is volume to volume (the roll to that the process face (surface) to substrate S performs various process Roll) device of mode (hereinafter referred to as " volume mode ").Substrate board treatment 100 is the most organic for being formed on substrate S The situation of the display element such as EL element, liquid crystal display cells (electronic component).It is, of course, also possible to formed beyond these elements The system of element (such as, solaode, colored filter, touch panel etc.) uses substrate board treatment 100.
Hereinafter, when the structure of substrate board treatment 100 of present embodiment is described, set XYZ orthogonal coordinate system, With reference to this XYZ orthogonal coordinate system while the position relationship of each component is illustrated.In following figure, by XYZ orthogonal coordinates Plane parallel with ground FL in system is as X/Y plane, and the direction moved by substrate S in X/Y plane, will be with Y-axis as Y direction Orthogonal direction, direction is as X-direction.It addition, direction that will be vertical with ground FL (X/Y plane) is as Z-direction.It addition, It is θ Z-direction by the bearing mark rotated about the z axis.
As becoming the substrate S processing object in substrate board treatment 100, it is possible to use such as resin film or stainless The paper tinsel (foil) of steel etc..Resin film such as can use polyvinyl resin, acrylic resin, polyester resin, vinyl-vinyl (Ethylene vinyl copolymer) copolymer resin, Corvic, celluosic resin, polyamide, polyamides Imide resin, polycarbonate resin, polystyrene resin, vinyl acetate base resin, polyethylene terephthalate, poly-naphthalene two The materials such as formic acid glycol ester, stainless steel foil.
The width of substrate S be dimensioned so as to such as about 50cm～2m, the size of length direction be (volume unit Size) be then formed as such as more than 10m.Certainly, this size is only an example, however it is not limited to this example.The such as width of substrate S Size can also is that below 1m or below 50cm, it is also possible to be more than 2m.It addition, the size of the length direction of substrate S also may be used To be below 10m.
Substrate S-shaped becomes and such as has the thickness of below 1mm and have flexibility.Herein, so-called flexibility refers to, even if such as The specified force that substrate imposes degree of at least conducting oneself with dignity also will not crack or fracture, and the character that aforesaid substrate can be bent.It addition, The character such as bent because of above-mentioned specified force is also included within flexibility.It addition, above-mentioned flexible can along with the material of aforesaid substrate, The environment such as size, thickness, temperature or temperature around, humidity etc. and change.Additionally, as substrate S, it is also possible to use one The substrate of banding, it is also possible to be set to multiple unit substrate be connected and be formed as the structure of banding.
Even if substrate S is preferably the heat bearing higher temperature (such as about 200 DEG C), its size is also without substantial variations (heat Deform little) the less substrate of thermal coefficient of expansion.For instance, it is possible to be mixed in inorganic filler in resin film to reduce thermal expansion system Number.As the example of inorganic filler, titanium oxide, zinc oxide, aluminium oxide, silicon oxide etc. can be enumerated.
Substrate board treatment 100 is arranged in the factory that element manufactures.Guide rail (it is formed with on ground FL in factory One mobile route, the second mobile route) 30.Guide rail 30 has the first track the 31, second track 32 and the 3rd track 33.First rail Road 31 and the second track 32 are formed as the upper extension of the orientation (X-direction) in multiple process portions.It addition, the first track 31 exists Being arranged in the side in process portion 10 in Y direction, the second track 32 is arranged in the opposite side in process portion 10 in the Y-axis direction.That is, First track 31 and the second track 32 are located on the position clipping process portion 10 in the Y-axis direction.3rd track 33 is in X-direction On be arranged respectively between multiple process portion 10.3rd track 33 is formed as parallel with Y direction, and by the first track 31 and Two tracks 32 connect.First track the 31, second track 32 and the 3rd track 33 are set with such as X-coordinate or Y coordinate equipotential Confidence ceases.Above-mentioned positional information is can be formed at each track in the way of being read by the sensor such as optical sensor or Magnetic Sensor On.
Substrate board treatment 100 has box device 20.This box device 20 have carry out substrate S supply and reclaim in one The first module portion 21 of side and the second unit portion 22 of the opposing party in carrying out the supply of substrate S and reclaiming.And, substrate S from The side in first module portion 21 and second unit portion 22 is transported to opposite side.
First module portion 21 and second unit portion 22 are prepared with multiple respectively.Ground FL be provided with make first module portion 21 and Buffer part BF that at least one party in second unit portion 22 is standby.This buffer part BF can make first module portion 21 and second unit Portion 22 is standby.Buffer part BF is connected with first track the 31, second track 32 or the 3rd track 33 via a part for guide rail 30.
Fig. 2 is the exploded perspective view of the structure representing the side, first module portion 21 in box device 20.Fig. 3 is to represent box device The figure of a part of structure of 20.Hereinafter, for convenience of explanation, the X-direction in Fig. 2 and Fig. 3, Y direction and Z-direction are made Represent corresponding with Fig. 1.
Box device 20 has the travel mechanism 24 making first module portion 21 move relative to second unit portion 22.Travel mechanism 24 have the moving part (the first moving part) 42 making first module portion 21 move.It addition, box device 20 has moving part described later Side communication unit 44 and contact inhibition portion 47.
First module portion 21 has the first wall portion 40a, the second wall portion 40b, bottom 40c and external connecting 40d.It addition, It is provided with the power supply units such as battery (not shown) in first module portion 21.
First wall portion 40a and the second wall portion 40b is respectively formed as tabular.First wall portion 40a is such as arranged in-X-axis side End.Second wall portion 40b is such as arranged in+end of X-axis side.First wall portion 40a and the second wall portion 40b joins in parallel with each other Put.Additionally, the first wall portion 40a and the second wall portion 40b may be formed as gate-shaped.
Bottom 40c is formed as parallel with X/Y plane (ground FL), and is linked by the first wall portion 40a and the second wall portion 40b.Outward Portion connecting portion 40d is such as formed by the rod member of the cylinder extended in the X-axis direction, and be located at first module portion 21+Y-axis Side end.First module portion 21+Y-axis side end plays a role as the connecting portion being connected with outside transport mechanism.Outward Portion connecting portion 40d is located on such as two positions of the short transverse (Z-direction) in first module portion 21.
On the corner of the connecting portion side in the first wall portion 40a and the second wall portion 40b, it is respectively formed with notch part 40f.Lack Oral area 40f is can arrange in the way of abutting with external structure thing.By making notch part 40f abut with external structure thing, and Position between first module portion 21 and said external works.Additionally, in fig. 2, although notch part 40f is formed at+Y-axis Side end, but such as can also is that the structure being provided with notch part 40f at-Y-axis side end.Under this situation, by making notch part 40f abuts with the part in process portion 10, it is possible to position between first module portion 21 and process portion 10.
The first wall portion 40a and the second wall portion 40b-Y-axis side end is respectively formed with the first connecting portion 23a.First is single Portion of unit 21 is connected with second unit portion 22 via above-mentioned first connecting portion 23a.As the first connecting portion 23a, using such as can be certainly The structure of dynamic conversion dismounting state, such as electric magnet etc..
First module portion 21 has the first incorporating section 40 of storage substrate.It is provided with substrate drive division in this first incorporating section 40 (first substrate drive division) 41, is mounted with to be wound with the substrate feed roller (donor rollers) of substrate S on substrate drive division 41 41c.The supply action that substrate drive division 41 is carried out side, second unit portion 22 supplying substrate S by making substrate S rotate.Substrate Drive division 41 has axle portion (the first axle part) 41a and rotary driving part (the first drive division) 41b.Axle portion 41a is formed as cylindric Or cylindric, and can telescopically constitute.Stretched by axle portion 41a, it is possible between the first wall portion 40a and the second wall portion 40b Dismounting, and the installation of substrate feed roller 41c can be realized.Axle portion 41a is such as so that the axis direction of central shaft and X-axis side Configure to parallel mode.The one end of axle portion 41a is with the most rotatably by first module portion 21 Second wall portion 40b supporting.The maintaining part (not shown) of the end that can keep substrate feed roller 41c it is provided with at axle portion 41a.Rotate Drive division 41b makes axle portion 41a rotate.Axle portion 41a is made to rotate by rotary driving part 41b, it is possible to achieve the supply action of substrate S (sending action).
Protective substrate drive division (the first auxiliary being provided with protective substrate feed roller 48c it is provided with in the first incorporating section 40 Portion) 48.Protective substrate feed roller 48c is wound with protective substrate (protecting film) C of the processed surface covering substrate S.Protect Protect substrate drive division 48 by making protective substrate feed roller 48c rotate, carry out side, second unit portion 22 is supplied protective substrate C Supply action.Protective substrate C protects above-mentioned processed surface by the processed surface covering substrate S.Protective substrate C use with Substrate S has the material of flexibility equally and is formed as banding, and has the size roughly the same with substrate S.
Protective substrate drive division 48 has axle portion 48a and rotary driving part 48b.Axle portion 48a is formed as cylindric or cylinder Shape, and can telescopically constitute.Stretched by axle portion 48a, it is possible to dismantle between the first wall portion 40a and the second wall portion 40b, can To realize the installation of protective substrate feed roller 48c.Axle portion 48a is such as so that the axis direction of central shaft is parallel with X-direction Mode configure.It is to say, the axis direction that axle portion 41a and axle portion 48a is configured to central shaft is parallel to each other.Axle portion 48a's One end is the most rotatably to support by the second wall portion 40b in first module portion 21.In axle portion, 48a sets There is the maintaining part (not shown) of the end that can keep protective substrate feed roller 48c.Rotary driving part 48b makes axle portion 48a rotate. Axle portion 48a is made to rotate by rotary driving part 48b, it is possible to achieve the supply action (sending action) of protective substrate C.In protection group Plate drive division 48 is provided with the mechanism (not shown) overlapping onto on substrate S by the protective substrate C sent.
First module portion 21 has substrate-side communication unit (the first communication unit) 43.Substrate-side communication unit 43 is located at the first wall portion 40a+Z axis side end face on.Substrate-side communication unit 43 such as can be carried out between control portion CONT or second unit portion 22 etc. Communication.
First module portion 21 has contact inhibition portion 47.Contact inhibition portion 47 is located at the first wall portion 40a and the second wall portion 40b + end face of Y-axis side on.Contact inhibition portion 47 suppress the first wall portion 40a and the second wall portion 40b+end face of Y-axis side is with outside Works contacts, and impact when relaxing contact.Contact inhibition portion 47 has such as from the first wall portion 40a and the second wall portion 40b The rod member prominent to+Y-axis side and bear to above-mentioned rod member effect-elastic component of the power of Y direction.
Above-mentioned moving part 42 supports first module portion 21 removably.Moving part 42 makes first module portion 21 to X Direction of principal axis, Y direction and Z-direction move.Moving part 42 has casing 51, castor 52, lifting unit 53 and castor drive division 54. It addition, be provided with the power supply units such as battery (not shown) at moving part 42.
Casing 51 has movable part 51a and base portion 51b.Movable part 51a be located at casing 51+Z axis side end, and be set as leading to The driving crossing lifting unit 53 can be moved to Z-direction.Being moved to+Z-direction by movable part 51a, first module portion 21 is with upper State movable part 51a to move to+Z-direction integratedly.Base portion 51b supports movable part 51a in a movable manner.
Casing 51 base portion 51b-Z axis side end face on be provided with four castors 52.Castor 52 is set as to be driven by castor Move the driving in portion 54 and rotate.Being rotated by castor 52, casing 51 and first module portion 21 are integratedly to X-direction, Y direction And θ Z-direction moves.
Movable part 51a+the end face 51c of Z axis side on be formed with groove portion 50.Groove portion 50 is V relative to above-mentioned end face 51c Shape is formed.On the other hand, first module portion 21-the end face 40e of Z axis side on be formed with four spherical supports 49.On State four spherical supports 49 to be supported by above-mentioned groove portion 50 respectively.Supported by groove portion 50 by spherical support 49, can limit To the X-direction between first module portion 21 and casing 51 and the relative movement of Y direction.Additionally, groove portion 50 and spherical supporting The quantity in portion 49 can also be respectively three.
It addition, be provided with dismounting test section 46 at movable part 51a.Dismounting test section 46 detects whether first module portion 21 installs On casing 51.As dismounting test section 46, it is possible to use the resistance value such as between detection groove portion 50 and spherical support 49 Sensor or detection groove portion 50 on the various sensors such as sensor of pressure.The testing result that dismounting test section 46 obtains Such as it is sent to outside (control portion CONT, substrate-side communication unit 43 etc.) from moving part side communication unit 44.
Moving part 42 has moving part side communication unit (the first communication unit) 44.Moving part side communication unit 44 is located in casing 51 Portion.Moving part side communication unit 44 such as can enter between control portion CONT or substrate-side communication unit 43, second unit portion 22 etc. Row communication.Substrate-side communication unit 43 and moving part side communication unit 44 can receive first of the action for controlling first module portion 21 Control signal.First control signal includes the signal such as controlling the shift action of moving part 42 or controls first module portion The supply of the substrate S in 21 and the signal etc. of recovery action.
As it is shown on figure 3, casing 51 base portion 51b-the end face 51d (face relative with ground FL) of Z axis side on, be provided with Position detection part (the first test section) 55.Position detection part 55 detects the positional information in first module portion 21.Position detection part 55 The positional information that detection is such as set on guide rail 30 (first track the 31, second track 32 and the 3rd track 33) is used as above-mentioned Positional information.The testing result that position detection part 55 obtains such as is sent to (control portion, outside from moving part side communication unit 44 CONT, substrate-side communication unit 43 etc.).Such as, control portion CONT makes first by the testing result using position detection part 55 Unit portion 21 moves along guide rail 30.
Fig. 4 is the exploded perspective view of the structure representing the second unit portion 22 in box device 20.Hereinafter, say for convenience Bright, the expression making the X-direction in Fig. 4, Y direction and Z-direction is corresponding with Fig. 1.
As shown in Figure 4, second unit portion 22 has substrate drive division (second substrate drive division) 61, substrate-side communication unit 63, contact inhibition portion 67, protective substrate drive division (the second assisted parts) 68.It addition, the travel mechanism 24 being located in box device 20 There is the moving part (the second moving part) 62 making second unit portion 22 move.
Second unit portion 22 has the first wall portion 60a, the second wall portion 60b, bottom 60c and external connecting 60d.It addition, It is provided with the power supply units such as battery (not shown) in second unit portion 22.First module portion 21 and second unit portion 22 have with XZ plane On the basis of mirror surface structure.
First wall portion 60a and the second wall portion 60b is respectively formed as tabular.First wall portion 60a is such as arranged in-X-axis side End.Second wall portion 60b is such as arranged in+end of X-axis side.First wall portion 60a and the second wall portion 60b joins in parallel with each other Put.Additionally, the first wall portion 60a and the second wall portion 60b may be formed as gate-shaped.
Bottom 60c is formed as parallel with X/Y plane (ground FL), and is linked by the first wall portion 60a and the second wall portion 60b.Outward Portion connecting portion 60d is such as formed by the rod member of the cylinder extended in the X-axis direction, and be located at second unit portion 22-Y-axis Side end.Second unit portion 22-Y-axis side end plays a role as the connecting portion being connected with outside transport mechanism.Outward Portion connecting portion 60d is located on such as two positions of the short transverse (Z-direction) in second unit portion 22.
On the corner of the connecting portion side in the first wall portion 60a and the second wall portion 60b, it is respectively formed with notch part 60f.Lack Oral area 60f is can arrange in the way of abutting with external structure thing.By making notch part 60f abut with external structure thing, and Position between second unit portion 22 and said external works.Additionally, in the diagram, although notch part 60f is formed at-Y-axis Side end, but such as can also is that the structure being provided with notch part 60f at+Y-axis side end.In this case, by making notch part 60f abuts with the part in process portion 10, it is possible to position between second unit portion 22 and process portion 10.
The first wall portion 60a and the second wall portion 60b+end of Y-axis side is respectively formed with the second connecting portion 23b.Second Unit portion 22 is connected with first module portion 21 via above-mentioned second connecting portion 23b.As the second connecting portion 23b, use and such as may be used Automatically the structure of dismounting state, such as electric magnet etc. are changed.
Second unit portion 22 has the second incorporating section 60 of storage substrate.It is provided with substrate drive division in this second incorporating section 60 61, this substrate drive division 61 is mounted with that the substrate being wound with substrate S reclaims cylinder (recycling roll) 61c.Substrate drive division 61 passes through Substrate S is made to rotate the recovery action carrying out reclaiming the substrate S from the supply of side, first module portion 21.Substrate drive division 61 has axle Portion (the second axle part) 61a and rotary driving part (the second drive division) 61b.Axle portion 61a is formed as cylindric or cylindric, and can Telescopically constitute.Stretched by axle portion 61a, it is possible to dismantle between the first wall portion 60a and the second wall portion 60b, and can be real Existing substrate reclaims the installation of cylinder 61c.Axle portion 61a such as joins in the way of the axis direction that makes central shaft is parallel with X-direction Put.The one end of axle portion 61a is the most rotatably to prop up by the second wall portion 60b in second unit portion 22 Hold.The maintaining part (not shown) of the end that can keep substrate recovery cylinder 61c it is provided with at axle portion 61a.Rotary driving part 61b makes axle Portion 61a rotates.Axle portion 61a is made to rotate by rotary driving part 61b, it is possible to achieve the supply action (coiling action) of substrate S.
Protective substrate drive division (the second auxiliary being provided with protective substrate feed roller 68c it is provided with in the second incorporating section 60 Portion) 68.Protective substrate feed roller 68c is wound with protective substrate (protecting film) C of the processed surface covering substrate S.Protect Protect substrate drive division 68 by making protective substrate feed roller 68c rotate, carry out reclaiming the guarantor from the supply of side, first module portion 21 Protect the recovery action of substrate C.
Protective substrate drive division 68 has axle portion 68a and rotary driving part 68b.Axle portion 68a is formed as cylindric or cylinder Shape, and can telescopically constitute.Stretched by axle portion 68a, it is possible to dismantle between the first wall portion 60a and the second wall portion 60b, and The installation of protective substrate feed roller 68c can be realized.Axle portion 68a is such as so that the axis direction of central shaft is put down with X-direction The mode of row is constituted.It is to say, the axis direction that axle portion 61a and axle portion 68a is configured to central shaft is parallel to each other.Axle portion 68a One end with the most rotatably by second unit portion 22 second wall portion 60b support.At axle portion 68a It is provided with the maintaining part (not shown) of the end that can keep protective substrate feed roller 68c.Rotary driving part 68b makes axle portion 68a revolve Turn.Axle portion 68a is made to rotate by rotary driving part 68b, it is possible to achieve the supply action (coiling action) of protective substrate C.Protecting Protect substrate drive division 68 and be provided with the mechanism (not shown) overlapping onto on substrate S by the protective substrate C sent.Additionally, in protection group In the case of plate C is wound up on substrate drive division 61 with the state overlapping with substrate S, it is also possible to omit side, second unit portion 22 Protective substrate drive division 68.
Second unit portion 22 has substrate-side communication unit (the second communication unit) 63.Substrate-side communication unit 63 is located at the second wall portion 60b+Z axis side end face on.Substrate-side communication unit 63 such as can be carried out between control portion CONT or first module portion 21 etc. Communication.
Second unit portion 22 has contact inhibition portion 67.Contact inhibition portion 67 is located at the first wall portion 60a and the second wall portion 60b -end face of Y-axis side on.Contact inhibition portion 67 suppress the first wall portion 60a and the second wall portion 60b-end face of Y-axis side is with outside Works contacts, and impact when relaxing contact.Contact inhibition portion 67 has such as from the first wall portion 60a and the second wall portion Rod member that 60b is prominent to-Y-axis side and bear to above-mentioned rod member effect+elastic component of the power of Y direction.
Movable part 71a+the end face 71c of Z axis side on be formed with groove portion 70.Groove portion 70 is V relative to above-mentioned end face 71c Shape is formed.On the other hand, second unit portion 22-the end face 60e of Z axis side on be formed with four spherical supports 69.On State four spherical supports 69 to be supported by above-mentioned groove portion 70 respectively.Supported by groove portion 70 by spherical support 69, can limit To the X-direction between second unit portion 22 and casing 71 and the relative movement of Y direction.Additionally, groove portion 70 and spherical supporting The quantity in portion 69 can also be respectively three.
It addition, be provided with dismounting test section 66 at movable part 71a.Dismounting test section 66 detects whether second unit portion 22 installs On casing 71.As dismounting test section 66, it is possible to use the resistance value such as between detection groove portion 70 and spherical support 69 Sensor or detection groove portion 70 on the various sensors such as sensor of pressure.The testing result that dismounting test section 66 obtains Such as it is sent to outside (control portion CONT, substrate-side communication unit 63 etc.) from moving part side communication unit 64.
It addition, second unit portion 22 is in addition to said structure, also there is connection test section (the second test section) 65.Connect inspection Whether survey portion 65 detects and is connected between first module portion 21 with second unit portion 22.As connecting test section 65, it is possible to use inspection Survey the sensor etc. of the electrical characteristic of the second connecting portion 23b.The testing result that connection test section 65 obtains is such as from moving part side Communication unit 64 is sent to outside (control portion CONT, substrate-side communication unit 63 etc.).
Above-mentioned moving part 62 supports second unit portion 22 removably.Moving part 62 makes second unit portion 22 to X Direction of principal axis, Y direction and Z-direction move.Moving part 62 has casing 71, castor 72, lifting unit 73 and castor drive division 74. Casing 71 has movable part 71a and base portion 71b.Control portion CONT controls the rotary speed of castor 72.Thus, control portion CONT can Control the translational speed of moving part 62.It addition, be provided with the power supply units such as battery (not shown) at moving part 62.
The moving part 62 in above-mentioned second unit portion 22 is constituted with the moving part 42 in above-mentioned first module portion 21 makes first module The travel mechanism 24 of portion 21 and second unit portion 22 relative movement.Moving part 42 and moving part 62 respectively can be by first module portions 21 And second unit portion 22 drives independently.
Above-mentioned moving part 62 has moving part side communication unit (the second communication unit) 64.Moving part side communication unit 64 is located at casing 71 is internal.Moving part side communication unit 64 can with such as control portion CONT or substrate-side communication unit 63, first module portion 21 etc. it Between communicate.Substrate-side communication unit 63 and moving part side communication unit 64 can receive the action for controlling second unit portion 22 Second control signal.Second control signal includes the signal such as controlling the shift action of moving part 62 or controls the second list The signal etc. of the supply action of the substrate S in portion of unit 22.
Moving part 62 has substrate conveyance control portion 77.Substrate conveyance control portion 77 controls by first module portion 21 and second Substrate S that unit portion 22 is carried out and the transporting operation of protective substrate C.Substrate conveyance control portion 77 is via moving part side communication unit 64 And substrate-side communication unit 63 controls axle portion 61a and the rotary speed of axle portion 68a.Thus, substrate conveyance control portion 77 can control base The recovery speed (winding speed) of plate S and protective substrate C.
It addition, substrate conveyance control portion 77 leads to via the substrate-side in such as moving part side communication unit 64 and first module portion 21 Letter portion 43 controls axle portion 41a and the rotary speed of axle portion 48a.Thus, substrate conveyance control portion 77 can control substrate S and protection group The feed speed (rate of delivery) of plate C.
Substrate conveyance control portion 77 controls the rotary speed of the castor 72 in second unit portion 22.Thus, substrate conveyance controls Portion 77 can control the translational speed of moving part 62.It addition, substrate conveyance control portion 77 is via moving part side communication unit 64 and first The moving part side communication unit 44 in unit portion 21 controls the rotary speed of the castor 52 in first module portion 21.Thus, substrate conveyance control Portion 77 processed can control the translational speed of moving part 42.
Fig. 5 is the axonometric chart of the state after the first module portion 21 representing and making box device 20 is connected with second unit portion 22.
As it is shown in figure 5, first module portion 21 and second unit portion 22 can be at the first connecting portion 23a and the second connecting portion 23b Connect under relative state.Adsorbed by the magnetic force of electric magnet between first connecting portion 23a and the second connecting portion 23b.So, Box device 20 is had and is connected first module portion 21 and second unit portion 22 by the first connecting portion 23a and the second connecting portion 23b Connecting portion 23.
It is bearing on the casing 51 of moving part 42 in first module portion 21 and second unit portion 22 is bearing in moving part 62 In the case of on casing 71, it is connected with second unit portion 22 by first module portion 21 and constitutes box device 20.In this case, Moving part 42 and moving part 62 can make first module portion 21 move integratedly when maintaining and being connected with second unit portion 22 Dynamic.
It addition, in the case of first module portion 21 is connected with second unit portion 22, it is also possible to such as at the first connecting portion Arranging connection terminal on 23a and the second connecting portion 23b, becoming by making above-mentioned connection terminal be connected to each other can be in first module The structure received and sent messages between portion 21 and second unit portion 22.
Box device 20 has the installation portion 81 being located in first module portion 21 and being provided with cap assembly CV.Further, box Device 20 has the installation portion 82 being located in second unit portion 22 and being provided with cap assembly CV.Cap assembly CV is different with such as dust etc. The mode that thing will not enter seals first module portion 21 and the inside in second unit portion 22.Cap assembly CV first module portion athwart Install between 21 and second unit portion 22.
The cap assembly CV of Fig. 5 is though it is shown that the structure that such as can dismount in the Z-axis direction, but is not limited to this.Such as, Can also be at the bottom 40c in first module portion 21 and the bottom 60c in second unit portion 22, rotatably mounting cup parts CV.Furthermore it is also possible to form cap assembly CV with flat member that is scalable or that fold, and by the part composition of this cap assembly CV For being accommodated in the 40c of bottom.In this case, by from the bottom 40c in first module portion 21+Y-axis side end will cover portion Part CV draws, and from first module portion 21+side of Y-axis side is hanging to+side of Z axis side, it is possible to cover first module Portion 21.Similarly, by from the bottom 60c in second unit portion 22-cap assembly CV draws by Y-axis side end, and single from second Portion of unit 22-side of Y-axis side is hanging to+side of Z axis side on, it is possible to cover second unit portion 22.Furthermore it is also possible to be from Side, lateral second unit portion 22, first module portion 21 winding hangs the structure of cap assembly CV.
Fig. 6 is the side view of the structure representing process portion 10.In figure 6, protective substrate C, protective substrate drive division are omitted 48 and the diagram of protective substrate drive division 68.
As shown in Figure 6, about the conveyance direction of the substrate S in process portion 10, configure first module portion 21 at upstream side, and Second unit portion 22 is configured in downstream.And, process portion 10 is supplying from first module portion 21 and is removing to second unit portion 22 Processed surface Sa process on the mobile route of the substrate S sent, to aforesaid substrate S.Process portion 10 have processing means 15, Guide 16 and alignment measuring device 17.
Processing means 15 has the various dresses forming such as organic EL element for processed surface Sa relative to substrate S Put.As this device, can enumerate such as forming the partition wall formation device of partition wall in processed surface Sa, for shape The electrode becoming electrode forms device, for forming the luminescent layer formation device etc. of luminescent layer.More specifically, drop-coated can be enumerated Coating apparatus (such as ink jet type applying device etc.), film formation device (membrane formation device, such as evaporation coating device, sputter equipment), exposure Device, developing unit, surfaction device, cleaning device, drying device, the inspection device etc. of inspection substrate.These each devices Transport path along substrate S is suitably arranged.
In the present embodiment, processing means 15 has: developing unit 11, and it has storage for carrying out on substrate S The developer solution accommodating container of the developer solution 11b of development treatment
11a；With cleaning device 12, it has the cleanout fluid accommodating container of the cleanout fluid 12b for receiving cleaning base plate S 12a.Additionally, processing means 15 can be accommodated into the device of the process beyond enforcement aforesaid liquid.
Guide 16 has development side guide 13 and cleans side guide 14.Development side guide 13 has the first pad 13a, the second pad 13d, the first cylinder 13b and second tin roller 13c.
It is internal that first pad 13a is fixed on processing means 15, guides the substrate S supplied from first module portion 21 to developer solution Accommodating container 11a.It is internal that second pad 13d is fixed on processing means 15, and the substrate S after passing through from developer solution 11b guides Outside to developer solution accommodating container 11a.
First cylinder 13b and second tin roller 13c is set as can be in above-below direction (Z axis side relative to developer solution accommodating container 11a To) upper mobile.Transport into substrate S between the first pad 13a and the first cylinder 13b and between the second pad 13d and second tin roller 13c After, by making the first cylinder 13b and second tin roller 13c mobile to developer solution accommodating container 11a side (lower section, i.e.-Z-direction), From the first pad 13a, the conveyance direction of substrate S can be changed toward-Z-direction, and substrate S is dipped in developer solution 11b, can be by Substrate S guides into and passes through inside developer solution 11b.
Clean side guide 14 and there is the first pad 14a, the second pad 14d, the first cylinder 14b and second tin roller 14c.Clean side Each cylinder of guide portion 14 is identical structure with each cylinder of development side guide 13, therefore omits the description.
It addition, the first pad 13a of development side guide 13 and the second pad 13d and the first pad 14a cleaning side guide 14 And second pad 14d guide the back side of processed surface Sa of substrate S.Therefore, these first pads 13a, the second pad 13d, the first pad 14a And second pad 14d be respectively provided with columnar guide surface, and there is multiple not shown ejection from this guide surface ejection gas Mouthful, be formed as to be formed on guide surface the structure of the layer of gas.By the layer of this gas, it is possible on guide surface relative to The back side (face of the opposition side of processed surface Sa) of substrate S guides in a non-contact manner.Additionally, replace the first pad 13a And second pad 13d, it is also possible to use rotate cylinder.In the case of using rotation cylinder, with the back side and the rotation cylinder of substrate S The state that contacts of guide surface, rotate cylinder and guide substrate S.
Alignment measuring device 17 is measured the edge part of substrate S or is located at the alignment mark on substrate S, and measures according to it Result carries out alignment actions relative to substrate S.Alignment measuring device 17 has the edge part of detection substrate S or the right of alignment mark Quasi-camera or adjust position (such as, the width of substrate S of substrate S according to the testing result of above-mentioned alignment camera Position) and posture (such as, relative to the inclination of conveyance direction) in the adjusting apparatus etc. of at least one party.Position as substrate S Put measurement, tachometric survey, moreover it is possible to use in laser projections to substrate S in the way of optical mouse, and produce on substrate S The change of speckle patterns carry out the mode of Photoelectric Detection.
Then, the action of the substrate board treatment 100 constituted in the above described manner is described.Fig. 7～Figure 12 is to represent at substrate The figure of the action of reason device 100.In Fig. 7～Figure 12, omit protective substrate C, protective substrate drive division 48 and protective substrate and drive The diagram in dynamic portion 68.
First, to the situation of the action of lodge substrate S between the axle portion 41a carried out in transport mechanism 24 and axle portion 61a Illustrate.In action afterwards, enumerate by control portion CONT such as substrate-side communication unit 43 and substrate-side communication unit 63 or moving part side communication unit 44 and moving part side communication unit 64 communicate in case of controlling each portion and illustrate.
First, first module portion 21 makes the first module portion 21 being bearing on moving part 42, second unit portion 22 make supporting Second unit portion 22 on moving part 62 is standby in multiple buffer part BF respectively.Control portion CONT makes one group of first module portion 21 And second unit portion 22 adsorbs between the first connecting portion 23a and the second connecting portion 23b, and the first incorporating section 40 and second is made to receive Receiving portion 60 connects.Thus, above-mentioned first module portion 21 and second unit portion 22 can move integratedly.
First control portion CONT makes first module portion 21 and second unit portion 22 move to guide rail integratedly from buffer part BF On 30.Afterwards, as it is shown in fig. 7, control portion CONT makes above-mentioned first module portion 21 move along guide rail 30 with second unit portion 22, Be arranged in the 3rd track 33+Y-axis side end, on the i.e. first track 31.Additionally, it is pre-on the axle portion 41a in first module portion 21 The substrate S of web-like is first installed.Although at the front end Sf of substrate S, such as, top guide Lf is installed in the structure shown in Fig. 7, but also It can be the structure eliminating above-mentioned top guide Lf.
Then, control portion CONT makes axle portion 41a rotate by rotary driving part 41b.By this action, before substrate S End Sf sends to 61a side, axle portion, and the front end Sf of substrate S to up to axle portion 61a is also winding on above-mentioned axle portion 61a.Though additionally, The operation being so wound up on axle portion 61a by the front end Sf of substrate S can be with automatization but it also may by manpower fixing band etc. Front end Sf is pasted on axle portion 61a.
Control portion CONT, after the front end Sf of substrate S is winding on axle portion 61a, cuts off first module portion 21 and second single The connection in portion of unit 22.Thus, first module portion 21 can independently move with second unit portion 22.Afterwards, control portion CONT makes axle Portion 41a rotates and is also sent by substrate S, and makes second unit portion 22 move along the 3rd track 33 to-Y direction simultaneously.
Control portion CONT makes second unit portion 22 move, until second unit portion the 22 to the up to the 3rd track 33-Y-axis side Till end, the i.e. second track 32.Move period in second unit portion 22, first module portion 21 maintains and is arranged in the first track 31 On state.By this action, as shown in Figure 8, first module portion 21 is arranged on the first track 31, and second unit portion 22 configures On the second track 32.It addition, the front end Sf of substrate S is drawn to-Y direction with the state that is wound on axle portion 61a.
Afterwards, control portion CONT makes first cylinder 13b and the second tin roller of development side guide 13 of processing means 15 The first cylinder 14b and second tin roller 14c (+Z-direction) upward of 13c and cleaning side guide 14 move in advance.Thus, Between the first cylinder 13b and second tin roller 13c and developer solution accommodating container 11a (that is, the first pad 13a and the second pad 13d), the Between one cylinder 14b and second tin roller 14c and cleanout fluid accommodating container 12a (that is, the 3rd pad 14a and the 4th pad 14d), form base The gap that plate S can pass through.
Control portion CONT gives appropriateness relative to hanger substrate S between axle portion 41a and axle portion 61a to Y direction Tension force, so that substrate S is by this gap.The tension force of substrate S such as can control second by using substrate conveyance control portion 77 Side, unit portion 22 is adjusted.
In this condition, as it is shown in figure 9, control portion CONT makes first by rotary driving part 41b and rotary driving part 61b Unit portion 21 and second unit portion 22 synchronize, and make its respectively on the first track 31 and on the second track 32 to processing means 15 Side (+X-direction) is mobile.In this condition, substrate S is arranged respectively at the first cylinder 13b and second tin roller in the Z-axis direction Between 13c and developer solution accommodating container 11a, between the first cylinder 14b and second tin roller 14c and cleanout fluid accommodating container 12a.
Control portion CONT first make axle portion 41a and axle portion 61a rotate with by substrate S to-Y direction conveyance, and make simultaneously The first cylinder 13b and second tin roller 13c of development side guide 13 move to-Z-direction.Thus, substrate S is dipped in developer solution In 11b, substrate S is carried out development treatment.Afterwards, control portion CONT makes axle portion 41a and axle portion 61a rotate and by substrate S to-Y Direction of principal axis is sent.By this action, the part passing through developer solution 11b in substrate S is to up to cleaning device 12.
Then, control portion CONT make axle portion 41a and axle portion 61a rotate with by substrate S to-Y direction conveyance, and make simultaneously The the first cylinder 14b and second tin roller 14c that clean side guide 14 move to-Z-direction.Thus, substrate S is dipped in cleanout fluid In 12b, it is carried out substrate S processing.
At this moment, as shown in Figure 10, the upstream side of the conveyance direction (-Y direction) in substrate S applies development treatment, The downstream of conveyance direction applies cleaning treatment.Afterwards, control portion CONT makes axle portion 41a and axle portion 61a rotate and by substrate S Send to-Y direction.By this action, being sent to outside from cleaning device 12 by the part of cleanout fluid 12b in substrate S Go out.
As shown in Figure 10, the component at the back side (face of the opposition side of processed surface Sa) of supporting substrates S guides in development side Portion 13 is the first pad 13a and second pad 13d, is the first pad 14a and second pad 14d cleaning side guide 14, therefore, passes through shape Become the gas blanket on these guide surfaces padded, it is possible to transport substrate S relative to the back side with non-contacting state.
Control portion CONT, according to developing unit 11 and the processing speed of cleaning device 12, adjusts and moves to axle from axle portion 41a The translational speed of the substrate S of portion 61a.It addition, as shown in figure 11, control portion CONT is according to the substrate S's being wound on axle portion 41a Coil diameter R1 and coil diameter R2 of the substrate S being wound on axle portion 61a, adjust rotary driving part 41b and the driving of rotary driving part 61b Speed.By this action, substrate S can be transported when transporting speed and being certain.The supervision of the speed of substrate S can also root The opportunity (time) measuring the alignment mark being located on substrate S according to the alignment measuring device 17 of Fig. 3 is carried out.Furthermore it is also possible to Coil diameter R1, the change of coil diameter R2 of substrate S according to substrate S adjust lifting unit 53 and lifting unit 73.
After development treatment and cleaning treatment terminate, control portion CONT makes axle portion 41a and axle portion 61a rotate with by substrate S To-Y direction conveyance, and make the first cylinder 13b and second tin roller 13c of development side guide 13 to+Z-direction shifting simultaneously Dynamic, and, make the first cylinder 14b and second tin roller 14c of cleaning side guide 14 move to+Z-direction.
Afterwards, as shown in figure 12, control portion CONT passes through moving part 42 and the Synchronization Control of moving part 62, makes first module Portion 21 and second unit portion 22 synchronize and move to+X-direction respectively along the first track 31 and the second track 32.Moved by this Make, become the state backed out to+X-axis side from processing means 15.Control portion CONT is in first module portion 21 and second unit portion After 22 arrive the 3rd track 33, make the mobile stopping in above-mentioned first module portion 21 and second unit portion 22.
Control portion CONT, after making the mobile stopping in first module portion 21 and second unit portion 22, makes axle portion 61a rotate also Make second unit portion 22 move to+Y direction simultaneously.By this action, while axle portion 61a winding substrate S, axle portion 41a with Axle portion 61a is again close to, and the first connecting portion 23a in first module portion 21 abuts with the second connecting portion 23b in second unit portion 22. Afterwards, control portion CONT makes electric magnet start and makes the first connecting portion 23a and the second connecting portion 23b absorption.Thus, the first storage Portion 40 is again coupled to the second incorporating section 60, and first module portion 21 is integrated with second unit portion 22.Afterwards, control portion CONT makes First module portion 21 and the second unit portion 22 of integration state fit along first track the 31, second track 32 and the 3rd track 33 Work as movement.In above action, control portion CONT is so that first module portion 21 and second unit portion 22 will not collide each other, mix Mode, use suitably arranged by position detection part 55 and position detection part (the first test section) 75 positional information detected First module portion 21 and the configuration in second unit portion 22.
As it has been described above, the box device of present embodiment has: first module portion 21, it has the substrate S carrying out there is flexibility The substrate drive division 41 of supply；With second unit portion 22, its have be set as between above-mentioned first module portion 21 dismantled and assembled And between substrate drive division 41, carry out the substrate drive division 61 of the recovery of substrate S, therefore, above-mentioned first module portion 21 with The supply of completing substrate S and recovery between second unit portion 22.Thereby, it is possible to suppression is from the base sent until winding lodge The size of plate S is elongated, therefore, it is possible to the administrative burden of substrate S when reducing conveyance.
[the second embodiment]
Then, the second embodiment is described.
Figure 13 is the figure of the structure of the substrate board treatment 200 schematically showing present embodiment.
As shown in figure 13, in the present embodiment, substrate board treatment 200 is formed as multiple stratum (figure in the Z-axis direction It is three stratum in 13).Substrate board treatment 200 has process portion 10 and box device 20 in each stratum.It addition, in each stratum It is formed with guide rail 30 respectively along process portion 10 on ground FL1, ground FL2 and ground FL3.
Box device 20 has the structure identical with above-mentioned embodiment.It is to say, first module portion 21 and casing 51 it Between can arrange removably.It addition, can arrange removably between second unit portion 22 and casing 71.It addition, first module portion Can arrange removably between 21 and second unit portion 22.
Figure 14 is the sectional view of the structure representing substrate board treatment 200.
As shown in figure 14, substrate board treatment 200 has three process chambers 111～113.Process chamber 111～113 is by dividing Separate every portion 114.Separating part 114 has the partition member 114a of the ground FL1 constituting process chamber 111, constitutes process chamber 111 The partition member 114b of the ground FL2 of top and process chamber 112, the top constituting process chamber 112 and the ground of process chamber 113 The partition member 114c of FL3, constitute the partition member 114d at the top of process chamber 113.
Process chamber 111 is arranged in the foot (near-Z axis side) of gravity direction in multiple process chambers.Process chamber 111 It is formed with the process space carrying out using the process (wet processed) of liquid relative to substrate S.In process chamber 111, the most such as Shown in Figure 14, it is provided with as processing means 110: have and receive the welding resistance liquid storage for the welding resistance liquid of coating on substrate S The applying device 141 of container 141a, there is the developer solution accommodating container of the storage developer solution for substrate S carries out development treatment The developing unit 142 of 142a, there is the cleaning device of the cleanout fluid accommodating container 143a receiving the cleanout fluid for cleaning base plate S 143 and there is the electroplate liquid accommodating container 144a of electroplate liquid received for forming pattern relative to cleaned substrate S Electroplanting device 144.Additionally, the device of the process beyond enforcement aforesaid liquid can be accommodated in process chamber 111.
Partition member 114a is provided with the part constituting the devil liquor recovery stream being connected with not shown retracting device Multiple recovery tubes 145.The one end of recovery tube 145 is respectively with applying device 141, developing unit 142 and cleaning device 143 even Connecing, the not shown devil liquor recovery stream that the other end is connected with retracting device connects.Each recovery tube 145 will be at applying device 141, developing unit 142 and cleaning device 143 become welding resistance liquid, developer solution and the cleanout fluid of waste liquid via devil liquor recovery stream It is expelled to retracting device.Recovery tube 145 is provided with not shown open and close valve etc..Control portion CONT can control above-mentioned open and close valve Opening and closing opportunity.In the present embodiment, owing to being provided with the dress of wet processed in the process chamber 111 of the foot of gravity direction Put, it is possible to suppress the length of the flow path system of the devil liquor recovery stream between these device and retracting devices.
Process chamber 112 is arranged in the top (+Z axis side) of process chamber 111.Process chamber 112 is formed and heats substrate S The process space processed.In process chamber 112, be provided with as processing means 110 add hot substrate S heater 151～ 153.The substrate S being coated with welding resistance liquid by applying device 141 is heated by heater 151, makes welding resistance liquid be dried.Heating Device 152 to being heated by the substrate S of the exposure device EX of process chamber 113, makes welding resistance liquid be dried again.Heater 152 with the temperature different from the heating-up temperature of heater 151, such as with the temperature higher than the heating-up temperature of heater 151 Add hot substrate S.After heater 153 is to being carried out development treatment by developing unit 142 and cleaned by cleaning device 143 Substrate S heats, and makes the dry tack free of substrate S.Heater 151～153 has knot repeatedly of being turned back by substrate S in inside Structure.In the inside of heater 151～153, substrate S is to be transported when overlap is turned back in the way of not contacting each other. Therefore, maintain the state of processed surface Sa of substrate S, and substrate S is received into expeditiously heater 151～153 simultaneously In.
Process chamber 113 is arranged in the top (+Z axis side) of process chamber 112.Process chamber 113 is to be exposed substrate S processing Process space.In process chamber 113, as processing means 110, it is provided with exposure device EX.Exposure device EX is via mask The solder mask irradiation exposure being coated in applying device 141 on substrate S is used up by pattern.
Multiple lifting portion 160 (161～166) it is provided with in the substrate board treatment 200 of said structure.Lifting portion 160 exists First module portion 21 and second unit portion 22 is transported between different estate.Such as, lifting portion 161, lifting portion 164, lifting portion 165 And lifting portion 166 transports first module portion 21 and second unit portion 22 between the first stratum and the second stratum.It addition, such as lift Ascending part 162 and lifting portion 163 transport first module portion 21 and second unit portion 22 between the second stratum and third class.
Each lifting portion 160 is respectively provided with runs through partition member 114b and the elevator of partition member 114c in the Z-axis direction Structure 160a.
Figure 15 is the axonometric chart of the Sketch representing lifting portion 160.
As shown in figure 15, external connecting 40d in elevating mechanism 160a and first module portion 21 or second unit portion 22 Connecting portion 60d connects.Elevating mechanism 160a has makes first module portion 21 and second unit portion 22 move in the Z-axis direction not The travel mechanism of diagram.Elevating mechanism 160a can make the integration first module portion 21 of state and second unit portion 22 in Z axis side Move up.
It addition, lifting portion 160 has installation portion (not shown), this installation portion makes to cross over the first module portion of stratum's conveyance 21 and second unit portion 22 be respectively installed to be located at the moving part 42 in the stratum of conveyance object and the casing 51 of moving part 62 and On 71.Thus, the substrate S being accommodated in first module portion 21 and second unit portion 22 is with may span across stratum mobile.
Then, the action of aforesaid substrate processing means 200 is described.
Control portion CONT makes first module portion 21 and second unit portion 22 transport to process chamber 111 from regulation entrance, and makes It moves along guide rail 30 to applying device 141.Control portion CONT in applying device 141 by with above-mentioned first embodiment Identical action, first module portion 21 is arranged in applying device 141+Y-axis side, second unit portion 22 is arranged in coating dress Put 141-Y-axis side.In this condition, substrate S is transported to second unit portion 22 by control portion CONT from first module portion 21, and Processed surface to substrate S carries out the coating process of photosensitizer simultaneously.
After processing in applying device 141, control portion CONT makes first module portion 21 and second unit portion 22 one Change, and move to lifting portion 161.First module portion 21 and second unit portion 22 to after up to lifting portion 161, control portion CONT When making first module portion 21 keep being connected with second unit portion 22, such as, make the connecting portion 60d in second unit portion 22 It is connected with the elevating mechanism 160a in lifting portion 161.Afterwards, control portion CONT is using elevating mechanism 160a to make first module portion 21 And under the state after second unit portion 22 integration, to+Z-direction conveyance.By this action, and make first module portion 21 and case Installment state between body 51, between second unit portion 22 and casing 71 is released from, first module portion 21 and second unit portion 22 Separate from casing 51 and casing 71 and move to+Z-direction, be transported to process chamber 112 from process chamber 111.
Control portion CONT makes the moving part 42 being arranged in process chamber 112 and moving part 62 the most standby in lifting portion 161 Near.Control portion CONT uses not shown installation portion to make conveyance to the first module portion 21 in process chamber 112 and second unit Portion 22 is respectively installed on above-mentioned moving part 42 and moving part 62.
Afterwards, control portion CONT uses first module portion 21 and second unit portion 22 to transport substrate S to heater 151, and substrate S is carried out heat treated.In heater 151, transport substrate when substrate S such as bends repeatedly S, and under this conveyance state, carry out the heating of substrate S.Therefore, the heat treated in space can be utilized expeditiously.Adding In thermal 151, the coated film being formed on substrate S is made to be dried by heating.
After carrying out heat treated, control portion CONT is by above-mentioned identical action, via lifting portion 162 by first module Portion 21 and second unit portion 22 transport to process chamber 113.Control portion CONT in process chamber 113 by first module portion 21 and second Unit portion 22 transports to exposure device EX, is exposed the photosensitizer being coated on substrate S processing.
Be exposed process after, control portion CONT via lifting portion 163 by first module portion 21 and second unit portion 22 Conveyance is to process chamber 112.First module portion 21 and second unit portion 22 are transported to heating in process chamber 112 by control portion CONT Device 152, and substrate S is carried out heat treated.In heater 152, the coated film after photosensitive is carried out heat treated.
After carrying out heat treated, control portion CONT via lifting portion 164 by first module portion 21 and second unit portion 22 Conveyance is to process chamber 111.First module portion 21 and second unit portion 22 are transported to development in process chamber 111 by control portion CONT Device 142, and substrate S is carried out development treatment.In developing unit 142, substrate S is dipped in developer solution and simultaneously single from first Portion of unit 21 transports to second unit portion 22, carries out development treatment during conveyance.
After carrying out development treatment, control portion CONT makes first module portion 21 and second unit portion 22 in the state of integration Lower to clean device 143 move, by substrate S conveyance to clean device 143.In cleaning device 143, substrate S is dipped in cleanout fluid In and transport to second unit portion 22 from first module portion 21 simultaneously, be carried out processing during conveyance.
Be carried out process after, control portion CONT via lifting portion 165 by first module portion 21 and second unit portion 22 Conveyance is to process chamber 112.First module portion 21 and second unit portion 22 are transported to heating in process chamber 112 by control portion CONT Device 153, carries out heat treated to substrate S.In heater 153, carry out the heating that the substrate S after making cleaning is dried Process or for heating the heat treated etc. of coated film.
After carrying out heat treated, control portion CONT via lifting portion 166 by first module portion 21 and second unit portion 22 Conveyance is to process chamber 111.Control portion CONT makes first module portion 21 and second unit portion 22 move to plating in process chamber 111 Device 144, transports substrate S to electroplanting device 144.In electroplanting device 144, substrate S is dipped in electroplate liquid and simultaneously from the One unit portion 21 transports to second unit portion 22, carries out electroplating processes during conveyance.Substrate S after carrying out electroplating processes Upper formation predetermined pattern.
After carrying out electroplating processes, control portion CONT via lifting portion 166 by first module portion 21 and second unit portion 22 Conveyance is to process chamber 112.First module portion 21 and second unit portion 22 are transported to not scheming in process chamber 112 by control portion CONT The heater shown, and carry out heat treated.
As it has been described above, the substrate board treatment 200 of present embodiment is in such as process chamber 111, the first track 31 with Between second track 32, be provided with as processing means 110 carry out each other the applying device 141 of different disposal, developing unit 142, Clean device 143 and electroplanting device 144, at these each devices (applying device 141, developing unit 142, cleaning device 143 and electricity Plating appts 144) between, make first module portion 21 and second unit portion 22 move, first module portion 21 is to each unit feeding simultaneously Substrate S, and second unit portion 22 reclaims substrate S, therefore, it is possible to carry out single-wafer process in multiple processing meanss 110.
Thereby, it is possible to suppression is elongated, when therefore can alleviate conveyance from the size of the substrate S sent until winding lodge The administrative burden of substrate S.Even if it addition, including the feelings of multiple processing meanss 110 that processing speed is different at a production line Under condition, consistent, therefore, it is possible to utilize each processing means 110 expeditiously without making processing speed in whole production line.Enter One step ground, in the substrate board treatment 200 with multiple stratum, can be by first module portion 21 and second unit portion 22 from movement Portion 42 and moving part 62 are split and transport between different estate, therefore can carry out high efficiency conveyance.
The technical scope of the present invention is not limited to above-mentioned embodiment, without departing from the scope of the subject in the invention can Apply suitable change.
Such as, in above-mentioned embodiment, with can arrange removably between first module portion 21 and second unit portion 22 It is illustrated as a example by structure, but is not limited to this.
For example, it is also possible to be first module portion 21 and second unit portion 22 does not installs each other and only carries out close to and separate Structure.Furthermore it is also possible to be, not first module portion 21 installs with second unit portion 22, but supporting first module portion 21 Moving part 42 and the removable structure of moving part 62 supporting second unit portion 22.
It addition, such as, in the above-described embodiment, use first module portion 21 is enumerated as substrate S supply use, second unit The example that portion 22 reclaims as substrate S is illustrated, but is not limited to this.For example, it is also possible to make with first module portion 21 Use for substrate S recovery, second unit portion 22 uses as substrate S supply.Furthermore it is also possible to make first module portion 21 and second unit Portion 22 is identical structure, makes first module portion 21 substituted for one another with second unit portion 22, suitably change supply on guide rail 30 Action and recovery action also carry out the conveyance of substrate S simultaneously.
It addition, in the above-described 2nd embodiment, have as a example by the structure of multiple stratum by substrate board treatment and carry out Illustrate, but be not limited to this.Such as, as shown in figure 16, it is also possible to be the structure being configured with a plurality of production line in the Y-axis direction. In this case, as the structure in process portion 10, it is also possible to be the device configuring the process carrying out identical type in the Y-axis direction Structure.
It addition, in the above-described embodiment, with base portion 51b and base portion 71b-end face 51d and 71d of Z axis side on set It is illustrated as a example by having the structure of position detection part 55 and 75, but is not limited to this.Such as, as shown in figure 17, it is also possible to be It is provided with the structure of the terminal (power acquisition portion) 56 and 76 contacted with guide rail 30.In this case, by make power supply in advance with lead Rail 30 connects, it is possible to obtain electric power via terminal 56 and 76.
It addition, such as, in the above-described embodiment, pass through to process with first module portion 21 and second unit portion 22 one direction Portion 10 and mobile in case of be illustrated, but be not limited to this.
Figure 18 (a)～Figure 18 (c) is the figure of an example of the shift action representing first module portion 21 and second unit portion 22.
Such as, as shown in Figure 18 (a), first module portion 21 and second unit portion 22 are pulled away to draw base by control portion CONT Plate S, as shown in Figure 18 (b), makes first module portion 21 and second unit portion 22 transport go forward side by side along+X-direction into process portion 10 Row processes.Afterwards, as shown in Figure 18 (c), it is also possible to make first module portion 21 and second unit portion 22 to return along-X-direction The mode returned moves.Thus, structure based on process portion 10, even if in the case of substrate S is difficult to pass through in the X-axis direction, Also substrate S can be transported expeditiously.
It addition, in the above-described embodiment, to configure first module portion 21 and second unit portion 22 in the first guide rail 31 side Afterwards, by making second unit portion 22 be illustrated in case of the second guide rail 32 side shifting draws substrate S, but also It is not limited to this.For example, it is also possible to by making first module portion 21 draw from lateral first guide rail 31 side shifting of the second guide rail 32 Substrate S.
Furthermore it is also possible to be, as shown in Figure 19 (a), first module portion 21 and second unit portion 22 are arranged in the 3rd rail The central part of the Y direction in road 33, afterwards, as shown in Figure 19 (b), by making first module portion 21 move to+Y direction respectively And second unit portion 22 moves to-Y direction, and draws substrate S.
It addition, in the above-described embodiment, the shape arranged in the Y-axis direction with first module portion 21 and second unit portion 22 It is illustrated in case of X-direction moves under state, but is not limited to this.For example, it is also possible to make first module portion 21 And move to Y direction under the state that arranges in the X-axis direction of second unit portion 22.
Such as, as shown in Figure 20 (a), clip two the 3rd tracks 33 and second tracks in process portion 10 in the X-axis direction On the cross point of 32, it is respectively configured first module portion 21 and second unit portion 22.At this moment, if substrate S is the state drawn.It After, as shown in Figure 20 (b), by making first module portion 21 and second unit portion 22 move to+Y direction, substrate S is transported extremely Process portion 10.Thus, structure based on process portion 10, even if in the case of substrate S is difficult to transport in the X-axis direction, also can Conveyance substrate S expeditiously.
It addition, in the above-described embodiment, as the structure of connecting portion 23, with the first connecting portion 23a and the second connecting portion It is illustrated as a example by the structure adsorbed by electric magnet between 23b, but is not limited to this, it is also possible to be by mechanically locking The fixed structure connected.
It addition, in the above-described embodiment, about driving the axle portion 41a and axle portion 61a of substrate S or driving protective substrate C Axle portion 48a and axle portion 68a, such as configure in the way of the axis direction that makes central shaft is parallel with X-direction, substrate S or guarantor It is illustrated as a example by protecting the structure that substrate C and X/Y plane transport abreast, but is not limited to this.Such as, about axle portion 41a and Axle portion 61a or axle portion 48a and axle portion 68a, it is also possible to be to join in the way of making the axis direction of central shaft parallel with Z-direction Put, the structure that substrate S or protective substrate C transports abreast with YZ plane or ZX plane.
It addition, in the above-described embodiment, with by the casing 51 and 71 of moving part 42 and moving part 62 in the Z-axis direction Lift and carry out as a example by the mode of adjustable axle portion 41a, axle portion 61a, axle portion 48a and axle portion 68a position in the Z-axis direction Illustrate, but be not limited to this.For example, it is also possible to be that axle portion 41a, axle portion 61a, axle portion 48a and axle portion 68a can be in the Z-axis direction The structure of lifting.
It addition, the substrate S of structure different from the embodiment described above can be used.
Figure 21 is the figure of the structure representing substrate S.
As shown in figure 21, it is also possible to be the structure being formed with protective layer 90, this protective layer 90 surrounds the processed surface of substrate S The pattern such as forming wiring or electrode, element etc. in Sa forms region P.
Above-mentioned protective layer 90 is formed as thickness and forms region P more than pattern.By this structure, though protective substrate C with In the case of processed surface Sa overlap, also can prevent protective substrate C contact patterns from forming region P.Additionally, protective layer 90 is all right It is formed at protective substrate C side.
Figure 22～Figure 27 is the axonometric chart of another embodiment representing base board delivery device.As described in above-mentioned Fig. 2, Fig. 3 Brightly, the moving part 42 that can carry first module portion 21 and automatically move can be by the rotation of castor 52 to X-direction, Y-axis side To and θ Z-direction move.It is identical for this moving part 62 automatically moved for second unit portion 22 can be carried. Therefore, as shown in above-mentioned Figure 18～Figure 20, for by the first track 31 extended in the X-axis direction and the second track 32, in Y-axis The conveyance that upwardly extending 3rd track 33 in side is constituted guides mechanism, as shown in figure 22, lays as additional conveyance guide portion Annular orbit 34a, 35a.
Annular orbit 34a is laid to from the central point TC1 that the first track 31 and the 3rd track 33 intersect as certain radius Circular.It addition, annular orbit 35a is laid to from the central point TC2 that the second track 32 and the 3rd track 33 intersect be one Determine the circular of radius.Annular orbit 34a, 35a are as being used for making moving part 42 or moving part 62 around central point TC1 or TC2 The path of navigation of surrounding's rotation (rotation) play a role.It addition, be equipped with respectively for correctly on central point TC1, TC2 Discoideus labeling section (include the labelling as index or the guide signal generator etc.) 34b of location, ground moving part 42,62, 35b。
Then, for example, atmospheric pressure CVD device of the processing means 10 shown in Figure 22, by upper structure 10a and lower junction Structure body 10b is constituted.Lower structures 10b is arranged on the ground (FL) of factory, and upper structure 10a is relative to lower structures 10b is the most movable.
By making upper structure 10a move to the top of Z-direction, it is possible to by lodge in the axle portion in first module portion 21 Substrate S between the axle portion 6lc in 4lc and second unit portion 22 translates mobile in the X-axis direction and takes out of outside processing means 10.
Figure 22 represents that the process at the substrate S carried out by processing means 10 terminates, and upper structure 10a is above Under state, make moving part 42 (first module portion 21) and moving part 62 (second unit portion 22) to the synchronization-moving shape of X-direction State.Moving part 42 (first module portion 21) is guided by the first track 31 and simultaneously towards the central point TC1 as original position at-X Moving on direction of principal axis, moving part 62 (second unit portion 22) is guided and simultaneously towards the center as original position by the second track 32 Point TC2 moves in-X-direction.
Afterwards, as shown in figure 23, moving part 42 (first module portion 21) and moving part 62 (second unit portion 22) all arrive X Axial original position (position of central point TC1, TC2).At this moment, the 3rd track 33 extended in the Y-axis direction is placed exactly in Between moving part 42 and moving part 62.
Afterwards, moving part 42 (first module portion 21) and either one in moving part 62 (second unit portion 22) are towards another Side moves in the Y-axis direction.This state as shown in figure 24, here, moving part 42 (first module portion 21) is towards moving part 62 ( Two unit portions 22) guided movement by the 3rd track 33.At this moment, the axle portion 41c in first module portion 21 or the axle in second unit portion 22 The mobile gearing in the Y-axis direction of portion 61c and moving part 42 (first module portion 21) rotates, by substrate S with the side that will not get loose Formula winds.
Figure 25 represents that moving part 42 (first module portion 21) is close to moving part 62 (second unit portion 22), and such as above-mentioned figure The state after (connection) is linked shown in 5.At this moment, moving part 62 (second unit portion 22) is positioned at central point TC2 (labeling section 35b) On, moving part 42 (first module portion 21) is positioned on annular orbit 35a.
The castor 72 of moving part 62 produces the week making moving part 62 (second unit portion 22) at central point TC2 from this state Enclose the driving force rotating (rotation) along θ Z-direction.Together, the castor 52 of moving part 42 produces and makes moving part 42 (the first list Portion of unit 21) along annular orbit 35a circumferencial direction rotate (rotation) driving force.Further, at this moment, the foot of moving part 62 The castor 52 of wheel 72 or moving part 42 is according to the testing result of labeling section 35b, and the rotation center with moving part 62 will not be from center The mode travel direction that some TC2 offsets to X-direction and Y direction position significantly controls.
Figure 26 represents that the moving part 42 (first module portion 21) linked and moving part 62 (second unit portion 22) are from Figure 25 State under turn 90 degrees using central point TC2 as center dextrorotation in XY face after state.Though this direction of rotation is herein It turn 90 degrees for dextrorotation but it also may be 90-degree rotation counterclockwise.To which direction rotate, be to process dress according to the next one Put and how to load what substrate S determined.
Afterwards, as shown in figure 27, the substrate S after being processed is kept by processing means 10 (such as, atmospheric pressure CVD device) film forming The second unit portion 22 (moving part 62) rolled up and the first module portion 21 (moving part 42) keeping remaining untreated substrate S volume In+X-direction, be integrally forming and translate movement by the guiding of the second track 32, and laterally across processing means 10 towards Next processing means.
Thus, original position (central point TC1, TC2) is vacated, and is therefore equipped with the moving part of the substrate S that the next one should process 42-1 (first module portion 21-1) and moving part 62-1 (second unit portion 22-1) is integrally forming and is sent to central point TC1 side Original position.
Afterwards, as shown in figure 27, it is positioned at the first module portion 21-1 (moving part 42-1) keeping untreated substrate S volume Under the state of central point TC1 (first track 31 and the cross point portion of the 3rd track 33), for processed substrate S is wound into The second unit portion 22-1 (moving part 62-1) of web-like moves towards central point TC2 along the 3rd track 33.
As it has been described above, can be in work by arranging moving part 42 (first module portion 21) or moving part 62 (second unit portion 22) Rotate freely through the space (annular orbit 34a, 35a etc.) of motion on the ground FL of factory, it is possible to make processing means configuration from Improved by degree, the degree of freedom of the conveyance direction of substrate S (web-like), conveyance efficiency.
In embodiment of above, Figure 25, Figure 26 make the moving part after linking at certain intervals 42 (first module portion 21) and moving part 62 (second unit portion 22) 90-degree rotation.But, it is arranged on the place in such as Figure 25 in next processing means Reason device 10-Y-axis side in the case of, it is also possible to make moving part 42 (first module portion 21) and moving part 62 (second unit portion 22) directly move to-Y direction along the 3rd track 33 extended in-Y direction, it is possible to so that it is from the state of Figure 25 Revolve around central point TC2 and move in-Y direction after turnback.
Additionally, in Figure 25～Figure 27, moving part 42 (first module portion 21) and moving part 62 (second unit portion 22) exist Move under state after linking at certain intervals.But, both mechanically contact non-necessity, it is also possible to use noncontact sensing Devices etc. keep certain spatial joint clearance, and simultaneously in certain position deviation range (such as below 1mm) make moving part 42 with Moving part 62 mutually follows movement.
Anyway, moving part 42 (first module portion 21) and the moving part 62 of the process in order to will complete substrate S (second unit portion 22) conveyance is to next processing means (the second processing means), along with substrate S to above-mentioned from having been carried out The translational motion of the first direction (in Figure 22～Figure 27 for X-direction) that the processing means processed is left, to above-mentioned first party To the translational motion of the second direction (being Y direction in Figure 22～Figure 27) intersected, including first direction and second direction At least two in the rotary motion of (being XY face in Figure 22～Figure 27) motion in plane (two motions are continuously), and drive each foot Wheel 52,72, makes moving part 42 move together with moving part 62.Additionally, translational motion is not limited to X-direction or Y direction, also Including moving part 42 (first module portion 21) or moving part 62 (second unit portion 22) along in XY face relative to X-axis and Y-axis The situation that the direction (such as, 45 degree of directions) that both sides tilt moves linearly.
This concludes the description of and use the box device (first module portion 21, second unit portion 22) shown in Fig. 2～Fig. 5 to carry out The conveyance mode of substrate S (or protective substrate C).However, it is also possible to arrange in each box device the temperature adjusting mechanism of substrate S, Humidity guiding mechanism, ultraviolet irradiation machine structure etc., or temperature adjustment device, humidity adjustment dress are set as one of processing means Put, ultraviolet lamp, and the opportune moment in treatment process substrate S is carried out homoiothermic, dehumidify, humidify, UV irradiates.
It is said that in general, in the case of producing large-scale fine flat faced display etc., mother metal i.e. substrate S is sent to various Processing means, accepts various process.Especially, in volume to volume (roll to roll) mode to flexible thin films such as PET or PEN In the case of substrate carries out continuous processing, it may be considered that understand cumulative stress in science and engineering sequence throughout on film substrate, and make Film substrate deforms.Further, acceptance processes film substrate or the membrane material that has been deposited on substrate are also required to throughout Temperature, water content, wettability etc. are preset into suitable state by science and engineering sequence.
Therefore, in being filled with the movement of box device 20 (first module portion 21, second unit portion 22) of substrate S or treat In machine, the temperature adjusting mechanism, humidity guiding mechanism or the ultraviolet that are located in first module portion 21 or second unit portion 22 is made to shine Penetrate mechanism's work.Or, make temperature adjustment device that box device 20 is independently arranged in factory, humidity adjusting apparatus, ultraviolet Irradiation unit moves so that substrate S passes through.So, can be by the temperature of substrate S (or the membrane material on its surface), water content, wet The state of lubricant nature, internal stress etc. is adjusted to be suitable to the specification of the processing means of next treatment process in advance.
In embodiments of the present invention, the box device 20 keeping the substrate S of web-like is can relative to various processing meanss The structure of movement, therefore can carry out the batch processing of box device unit.Thus, before treatment process, adjust base even if adding The operation (being equivalent to a treatment process) of the various states of plate S (or the membrane material on its surface), also will not make whole production line Production efficiency be greatly reduced, the production that yield rate is good can be carried out.
Description of reference numerals
S-substrate, CONT-control portion, BF-buffer part, C-protective substrate, CV-cap assembly, 10-process portion, 20-is box-packed Put, 21-first module portion, 22-second unit portion, 23-connecting portion, 24-travel mechanism, 30-guide rail, 31-the first track, 32- Second track, 33-the 3rd track, 34a, 35a-annular orbit, 42,62-moving part, 43,63-substrate-side communication unit, 44,64- Moving part side communication unit, 46,66-dismount test section, 47,67-contact inhibition portion, 51,71-casing, 52,72-castor, 53,73- Lifting unit, 54,74-castor drive division, 55,75-position detection part, 56,76-terminal, 65-connect test section, and 100,200-base Plate processing means, 111～113-process chambers, 160-lifting portion.

Claims (8)

1. a box device, keeps donor rollers and recycling roll, and described donor rollers is wound with and should supply the strip to processing means Plate shape substrates, described recycling roll is wound with the described plate shape substrates taken out of from described processing means, it is characterised in that described box-packed Put and include:
First module portion, described first module portion keeps described donor rollers, and can be by the first drive division at two dimensional surface Interior movement；
Second unit portion, described second unit portion keeps described recycling roll, and can be by the second drive division in described two dimension Move in plane；
Control portion, its described first drive division of control and described second drive division, so that on the long limit with described plate shape substrates On the short side direction that direction intersects, described first module portion and the motion of described second unit portion joint translation, put down in described two dimension In direction of rotation in face, described first module portion and the motion of described second unit portion joint translation.
Box device the most according to claim 1, it is characterised in that
Described control portion controls described first drive division and described second drive division, so that at described plate shape substrates hanger in institute State under the state between donor rollers and described recycling roll, on the long side direction of described plate shape substrates, described first module portion and Described second unit portion moves to close to each other or direction that is that be separated from each other translational motion or to same direction joint translation.
Box device the most according to claim 1, it is characterised in that
Described control portion controls described first drive division and described second drive division, so that in described first module portion and described State that second unit portion is the most close on the long side direction of described plate shape substrates or be connected state time, adjoint The translational motion to described long side direction, in the translational motion of described short side direction and the motion of described rotation at least Two kinds are moved and make described first module portion and described second unit portion together move.
4. according to the box device according to any one of claims 1 to 3, it is characterised in that
Described first module portion and described second unit portion are respectively provided with the connecting portion that can link, described lifting with elevating mechanism Mechanism is for making described first module portion move to the direction vertical with described two dimensional surface with described second unit portion.
5. according to the box device according to any one of claims 1 to 3, it is characterised in that
Described first module portion has the first communication unit communicated between energy and described control portion, and described second unit portion has There is the second communication unit communicated between energy and described control portion.
Box device the most according to claim 5, it is characterised in that
Described first communication unit receive for control described first module portion based on described first drive division shift action and First control signal of the supply action of described plate shape substrates based on described donor rollers,
Described second communication unit receive for control described second unit portion based on described second drive division shift action and Second control signal of the recovery action of described plate shape substrates based on described recycling roll.
7. according to the box device according to any one of claims 1 to 3, it is characterised in that
Described first drive division in described first module portion is configured to dismantle relative to described first module portion, and described the Described second drive division in two unit portions is configured to dismantle relative to described second unit portion.
8. according to the box device according to any one of claims 1 to 3, it is characterised in that
Described first module portion includes be arrangeding in parallel with described donor rollers and for winding the rolling of the flexible protective substrate of banding Cylinder, the flexible protective substrate of described banding covers the surface of described plate shape substrates,
Described second unit portion includes be arrangeding in parallel with described recycling roll and for winding the rolling of the flexible protective substrate of banding Cylinder, the flexible protective substrate of described banding covers the surface of described plate shape substrates.
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KR20180136574A (en) 2018-12-24
KR20150002647A (en) 2015-01-07
TW201810492A (en) 2018-03-16
KR20180049114A (en) 2018-05-10
KR20190126455A (en) 2019-11-11
CN104203785A (en) 2014-12-10
KR101816343B1 (en) 2018-02-21
KR20170081752A (en) 2017-07-12
KR102042952B1 (en) 2019-11-08
JPWO2013153706A1 (en) 2015-12-17
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JP2017004007A (en) 2017-01-05
JP6249127B2 (en) 2017-12-20
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TW201929123A (en) 2019-07-16
CN106185413B (en) 2017-11-07
JP2018011065A (en) 2018-01-18
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KR101868310B1 (en) 2018-07-17

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