TWI604550B - Cassette apparatus, substrate transferring apparatus, substrate processing apparatus and substrate processing method - Google Patents

Cassette apparatus, substrate transferring apparatus, substrate processing apparatus and substrate processing method Download PDF

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TWI604550B
TWI604550B TW101147753A TW101147753A TWI604550B TW I604550 B TWI604550 B TW I604550B TW 101147753 A TW101147753 A TW 101147753A TW 101147753 A TW101147753 A TW 101147753A TW I604550 B TWI604550 B TW I604550B
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unit
substrate
moving
processing
unit portion
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TW201351528A (en
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濱田智秀
鈴木智也
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尼康股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/182—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations
    • B65H23/185—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations motor-controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00—Function indicators
    • B65H2220/02—Function indicators indicating an entity which is controlled, adjusted or changed by a control process, i.e. output
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B65H2513/11—Speed angular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Replacement Of Web Rolls (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning In General (AREA)
  • Liquid Crystal (AREA)
  • Coating Apparatus (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Winding Of Webs (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Description

匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法 Device, substrate transfer device, substrate processing device, and substrate processing method

本發明係關於一種匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法。 The present invention relates to a crucible device, a substrate transfer device, a substrate processing device, and a substrate processing method.

本申請根據2012年4月13日申請之日本特願2012-092132號主張優先權，將其內容援引於此。 Priority is claimed on Japanese Patent Application No. 2012-092132, filed on Apr.

作為構成顯示器裝置等顯示裝置(顯示面板)之顯示元件，例如已知有液晶顯示元件、有機電致發光(有機EL)元件。目前，此等顯示元件係以與各像素對應在基板表面形成薄膜電晶體(Thin Film Transistor：TFT)之主動元件(Active device)漸為主流。 As a display element constituting a display device (display panel) such as a display device, for example, a liquid crystal display element and an organic electroluminescence (organic EL) element are known. At present, such display elements are becoming mainstream with active devices that form thin film transistors (TFTs) on the surface of the substrate corresponding to the respective pixels.

近年來，提出了一種在具有可撓性之片狀之基板(例如薄膜構件等)上形成顯示元件之技術。作為此種技術，例如有一種被稱為捲軸對捲軸(roll to roll)方式(以下，簡記為「捲軸方式」)者廣為人知(例如，參照專利文獻1)。捲軸方式，係將捲繞在基板供應側之供應用滾筒之一片之片狀基板(例如，帶狀之薄膜構件)送出、並一邊將送出之基板以基板回收側之回收用滾筒加以捲繞一邊藉由設置在供應用滾筒與回收用滾筒之間之處理裝置施加用以在基板上形成顯示面板或太陽電池面板等之電子元件之所欲加工處理。 In recent years, a technique of forming a display element on a substrate having a flexible sheet shape (for example, a film member or the like) has been proposed. As such a technique, for example, a roll to roll method (hereinafter, abbreviated as "reel method") is widely known (for example, refer to Patent Document 1). In the reel method, a sheet-like substrate (for example, a strip-shaped film member) wound around one of the supply rollers on the substrate supply side is fed, and the fed substrate is wound on the substrate recovery side. A desired processing for forming an electronic component such as a display panel or a solar cell panel on a substrate is applied by a processing device provided between the supply roller and the recovery roller.

此外，在基板送出至被捲繞為止之期間，例如使用複數個搬送滾筒等搬送基板，在生產顯示面板之情形，使用複數個處理裝置(單元)來形成構成TFT之閘極電極、閘極絕 緣膜、半導體膜、源極-汲極電極等，在基板之被處理面上依序形成顯示元件之構成要件。例如，在形成有機EL元件之情形時，係於基板上依序形成發光層、陽極、陰極、電路等。 Further, during the period from the time the substrate is fed to being wound, for example, a plurality of transfer rollers are used to transport the substrate, and in the case of producing a display panel, a plurality of processing devices (units) are used to form a gate electrode and a gate electrode constituting the TFT. The edge film, the semiconductor film, the source-drain electrode, and the like form a constituent element of the display element sequentially on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a circuit, and the like are sequentially formed on a substrate.

專利文獻1：國際公開第2006/100868號 Patent Document 1: International Publication No. 2006/100868

然而，在上述構成，從送出至被捲繞為止之期間，由於基板掛架在複數個處理裝置，因此基板之全長變長，會有基板之管理不易之情形。 However, in the above configuration, since the substrate hanger is in a plurality of processing devices from the time of being sent to the time of being wound, the total length of the substrate is long, and management of the substrate may be difficult.

本發明形態之目的在於提供一種能減輕搬送時基板之管理負擔之匣裝置、基板搬送裝置、基板處理裝置。 An object of the present invention is to provide a device, a substrate transfer device, and a substrate processing device capable of reducing the management load of a substrate during transport.

本發明第一形態之匣裝置，具有：第一單元部，進行基板之供應及回收之一方；以及第二單元部，進行基板之供應及回收之另一方；第一單元部及第二單元部可彼此接近或分離。 The first aspect of the present invention includes: a first unit unit that performs one of supply and recovery of a substrate; and a second unit unit that performs supply and recovery of the substrate; the first unit unit and the second unit unit Can be close to or separated from each other.

本發明第二形態之基板搬送裝置，具有：第一單元部，係設成可在第一移動路徑移動，進行基板之供應及回收之一方；第二單元部，係設成可在第二移動路徑移動，進行基板之供應及回收之另一方；以及控制部，對配置在第一移動路徑與第二移動路徑之間之第一基板處理部，控制第一單元部使其進行基板之供應及回收之一方，且控制第二單元部使其進行基板之供應及回收之另一方；控制部對配置在第一移動路徑與第二移動路徑之間且與第一基板處理部不同之第二基板處理部，使第一單元部及第二單元部移 動，控制第一單元部使其進行基板之供應及回收之另一方，且控制第二單元部使其進行該基板之供應及回收之一方。 A substrate transfer apparatus according to a second aspect of the present invention includes: a first unit portion configured to be movable in a first movement path to supply and recover a substrate; and a second unit portion to be movable in a second movement The other side of the substrate is supplied and recovered; and the control unit controls the first unit processing unit to supply the substrate to the first substrate processing unit disposed between the first movement path and the second movement path; Recycling one side and controlling the second unit portion to perform the supply and recovery of the substrate; the control unit is configured to a second substrate disposed between the first movement path and the second movement path and different from the first substrate processing portion a processing unit that moves the first unit portion and the second unit portion The first unit is controlled to perform the supply and recovery of the substrate, and the second unit is controlled to perform one of the supply and recovery of the substrate.

本發明第三形態之基板處理裝置，具備：複數個處理部，係配置在第一移動路徑與第二移動路徑之間，對具有可撓性之基板進行處理；以及本發明第二形態之基板搬送裝置。 A substrate processing apparatus according to a third aspect of the present invention includes: a plurality of processing units disposed between the first movement path and the second movement path to process the flexible substrate; and the substrate of the second aspect of the present invention Transfer device.

本發明第四形態之基板處理方法，係用以將具有可撓性之長帶基板依序送至複數個處理裝置，並在該基板上形成電子元件，其特徵在於，包含：第一處理步驟，將包含在長邊方向捲繞有待供應至第一基板處理部之該基板之供應滾筒之第一單元部、與包含在長邊方向捲繞待從該第一基板處理部回收之該基板之回收滾筒之第二單元部配置成夾著該第一基板處理部，藉由該第一基板處理部處理從該供應滾筒供應之該基板後以該回收滾筒回收；第一移動步驟，使該第一單元部與該第二單元部一起沿著該供應滾筒與該回收滾筒之間之該基板從該第一基板處理部離開之第一方向移動；第二移動步驟，為了縮小該供應滾筒與該回收滾筒在該長邊方向之間隔，使該第一單元部與該第二單元部之至少一方沿著與該第一方向交叉之第二方向移動；以及第三移動步驟，使以既定間隔對向之該第一單元部與該第二單元部隨著該第一方向之並進運動、該第二方向之並進運動、在包含該第一方向與第二方向之面內之旋轉運動中之至少二個運動，一起朝向與該第一基板處理部不同 之第二基板處理部移動。 A substrate processing method according to a fourth aspect of the present invention is for sequentially feeding a flexible long-length substrate to a plurality of processing devices, and forming an electronic component on the substrate, comprising: a first processing step a first unit portion including a supply roller for winding the substrate to be supplied to the first substrate processing portion in a longitudinal direction, and a substrate including the substrate to be recovered from the first substrate processing portion in a longitudinal direction a second unit portion of the recovery drum is disposed to sandwich the first substrate processing portion, and the first substrate processing portion processes the substrate supplied from the supply roller to be recovered by the recovery roller; and the first moving step makes the first a unit portion and the second unit portion move along a first direction in which the substrate between the supply roller and the recovery roller leaves the first substrate processing portion; and a second moving step, in order to reduce the supply roller and the Between the longitudinal direction of the recovery drum, at least one of the first unit portion and the second unit portion moves in a second direction intersecting the first direction; and a third moving step a progressive movement of the first unit portion and the second unit portion along the first direction, a parallel movement of the second direction, and a rotational movement in a plane including the first direction and the second direction At least two of the movements are oriented differently from the first substrate processing unit The second substrate processing unit moves.

根據本發明之形態，能減輕搬送時基板之管理負擔。 According to the aspect of the present invention, the management load of the substrate during transportation can be reduced.

(第一實施形態) (First embodiment)

以下，參照圖式說明本發明之第一實施形態。 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

圖1係顯示本實施形態之基板處理裝置(基板搬送裝置)100之整體構成之立體圖。如圖1所示，基板處理裝置100具有對具有可撓性之片狀基板(例如，帶狀之薄膜構件)S進行既定處理之處理部(第一基板處理部、第二基板處理部)10、搬送基板S之搬送部(匣裝置)20、及統籌控制處理部10及匣裝置20之控制部CONT。基板處理裝置100係設在例如製造工廠之地面FL上。 Fig. 1 is a perspective view showing the overall configuration of a substrate processing apparatus (substrate conveying apparatus) 100 of the present embodiment. As shown in FIG. 1, the substrate processing apparatus 100 has a processing unit (first substrate processing unit and second substrate processing unit) 10 that performs predetermined processing on a flexible sheet substrate (for example, a strip-shaped film member) S. The transport unit (the apparatus) 20 that transports the substrate S, and the control unit CONT that integrates the control unit 10 and the unit 20. The substrate processing apparatus 100 is mounted on, for example, the floor FL of a manufacturing plant.

基板處理裝置100為對基板S之處裡面(表面)執行各種處理之捲軸對捲軸(roll to roll)方式(以下，簡記為「捲軸方式」)之裝置。基板處理裝置100係用在在基板S上形成例如有機EL元件、液晶顯示元件等之顯示元件(電子元件)之情形。當然，在形成此等元件以外之元件(例如，太陽電池、濾色器、觸碰面板等)之系統使用基板處理裝置100亦可。 The substrate processing apparatus 100 is a roll-to-roll method (hereinafter, abbreviated as "reel method") that performs various processes on the inside (surface) of the substrate S. The substrate processing apparatus 100 is used in the case where a display element (electronic element) such as an organic EL element or a liquid crystal display element is formed on the substrate S. Of course, the substrate processing apparatus 100 may be used in a system that forms components other than these components (for example, a solar cell, a color filter, a touch panel, etc.).

以下，說明本實施形態之基板處理裝置100之構成時，設定XYZ正交座標系統，一邊參照此XYZ正交座標系統一邊說明各構件之位置關係。以下之圖中，設XYZ正交座標系統中與地面FL平行之平面為XY平面。設XY平面中基板S移動之方向為Y軸方向、與Y軸方向正交之方向為X軸方向。又，設與地面FL(XY平面)垂直之方向為Z軸方向。 又，將繞Z軸旋轉之方向記載為θ Z軸方向。 Hereinafter, when the configuration of the substrate processing apparatus 100 of the present embodiment is described, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following figures, the plane parallel to the ground FL in the XYZ orthogonal coordinate system is assumed to be the XY plane. It is assumed that the direction in which the substrate S moves in the XY plane is the Y-axis direction, and the direction orthogonal to the Y-axis direction is the X-axis direction. Further, it is assumed that the direction perpendicular to the floor surface FL (XY plane) is the Z-axis direction. Further, the direction of rotation about the Z axis is described as the θ Z axis direction.

作為在基板處理裝置100作為處理對象之基板S，可使用例如樹脂膜或不鏽鋼等之箔(foil)。樹脂膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯基樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯基樹脂、聚對苯二甲酸乙二醇酯、聚奈二甲酸乙二醇酯、不鏽鋼箔等材料。 As the substrate S to be processed in the substrate processing apparatus 100, a foil such as a resin film or stainless steel can be used. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, or the like may be used. Polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene naphthalate, stainless steel foil and the like.

基板S之短邊方向之尺寸係形成為例如50cm~2m程度、長邊方向之尺寸(一捲軸量之尺寸)則形成為例如10m以上。當然，此尺寸僅為一例，並不限於此例。例如基板S之短邊方向之尺寸為1m以下、或50cm以下亦可、亦可為2m以上。又，基板S之長邊方向之尺寸亦可在10m以下。 The dimension of the short side direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the longitudinal direction (the size of one reel amount) is, for example, 10 m or more. Of course, this size is only an example and is not limited to this example. For example, the dimension of the short side direction of the substrate S may be 1 m or less, or 50 cm or less, or may be 2 m or more. Further, the dimension of the substrate S in the longitudinal direction may be 10 m or less.

基板S係形成為例如具有1mm以下之厚度且具有可撓性。此處，所謂可撓性，係指例如對基板施以至少自重程度之既定力亦不會斷裂或破裂、而能將該基板加以彎折之性質。此外，例如因上述既定力而彎折之性質亦包含於所指之可撓性。又，上述可撓性會隨著該基板材質、大小、厚度、温度、或周圍之溫度、溼度等之環境等而改變。再者，基板S可使用一片帶狀之基板、亦可使用將複數個單位基板加以連接而形成為帶狀之構成。 The substrate S is formed to have a thickness of, for example, 1 mm or less and has flexibility. Here, the term "flexibility" refers to a property in which the substrate can be bent without being broken or broken by applying a predetermined force to at least its own weight. Further, for example, the property of being bent by the predetermined force described above is also included in the flexibility indicated. Further, the flexibility may vary depending on the material, size, thickness, temperature, ambient temperature, humidity, and the like of the substrate. Further, as the substrate S, a strip-shaped substrate may be used, or a plurality of unit substrates may be connected to form a strip shape.

基板S，以承受較高溫度(例如200℃程度)之熱其尺寸亦無實質上變化(熱變形小)之熱膨脹係數較小者較佳。例如可將無機填料混於樹脂膜以降低熱膨脹係數。作為無機填 料，例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。 The substrate S is preferably one which is subjected to a relatively high temperature (for example, about 200 ° C) and whose thermal expansion coefficient is not substantially changed (small thermal deformation). For example, an inorganic filler may be mixed in the resin film to lower the coefficient of thermal expansion. As an inorganic fill For example, there are titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.

基板處理裝置100係設置在元件製造之工廠內。在工廠內之地面FL形成有導軌(第一移動路徑、第二移動路徑)30。導軌30具有第一軌道31、第二軌道32及第三軌道33。第一軌道31及第二軌道32係形成為在複數個處理部之排列方向(X軸方向)延伸。又，第一軌道31在Y軸方向配置在處理部10之一側，第二軌道32在Y軸方向配置在處理部10之另一側。亦即，第一軌道31及第二軌道32係設在於Y軸方向夾著處理部10之位置。第三軌道33在X軸方向分別配置在複數個處理部10之間。第三軌道33係形成為與Y軸方向平行，將第一軌道31與第二軌道32加以連接。在第一軌道31、第二軌道32及第三軌道33設定有例如X座標或Y座標等之位置資訊。上述位置資訊係以可藉由光感測器或磁感測器等感測器讀取之方式形成在各軌道。 The substrate processing apparatus 100 is installed in a factory where components are manufactured. A guide rail (first movement path, second movement path) 30 is formed on the floor FL in the factory. The guide rail 30 has a first rail 31, a second rail 32, and a third rail 33. The first rail 31 and the second rail 32 are formed to extend in the arrangement direction (X-axis direction) of the plurality of processing sections. Further, the first rail 31 is disposed on one side of the processing unit 10 in the Y-axis direction, and the second rail 32 is disposed on the other side of the processing unit 10 in the Y-axis direction. That is, the first rail 31 and the second rail 32 are disposed at positions sandwiching the processing unit 10 in the Y-axis direction. The third rails 33 are disposed between the plurality of processing units 10 in the X-axis direction. The third rail 33 is formed to be parallel to the Y-axis direction, and connects the first rail 31 and the second rail 32. Position information such as an X coordinate or a Y coordinate is set in the first track 31, the second track 32, and the third track 33. The above position information is formed on each track in such a manner that it can be read by a sensor such as a photo sensor or a magnetic sensor.

基板處理裝置100具備匣裝置20。此匣裝置20具有進行基板S之供應及回收中之一方之第一單元部21、進行基板S之供應及回收中之另一方之第二單元部22。此外，基板S從第一單元部21及第二單元部22之一側被搬送至另一側。 The substrate processing apparatus 100 is provided with a crucible apparatus 20. The crucible device 20 has a first unit portion 21 that performs one of supply and recovery of the substrate S, and a second unit portion 22 that performs supply and recovery of the substrate S. Further, the substrate S is transported from one side of the first unit portion 21 and the second unit portion 22 to the other side.

第一單元部21及第二單元部22係分別準備有複數個。在地面FL設有使第一單元部21及第二單元部22之至少一方待機之緩衝部BF。在此緩衝部BF能使第一單元部21及第二單元部22待機。緩衝部BF係透過導軌30之一部 分連接於第一軌道31、第二軌道32或第三軌道33。 The first unit portion 21 and the second unit portion 22 are each prepared in plurality. A buffer portion BF that allows at least one of the first unit portion 21 and the second unit portion 22 to stand by is provided on the floor surface FL. In this buffer portion BF, the first unit portion 21 and the second unit portion 22 can stand by. The buffer portion BF is transmitted through one of the guide rails 30 The minute is connected to the first track 31, the second track 32 or the third track 33.

圖2係顯示匣裝置20中之第一單元部21側之構成之分解立體圖。圖3係顯示匣裝置20之一部分構成之圖。以下，為了方便說明，使圖2及圖3中X軸方向、Y軸方向、Z軸方向之顯示與圖1對應。 Fig. 2 is an exploded perspective view showing the configuration of the first unit portion 21 side of the crucible device 20. Fig. 3 is a view showing a part of the structure of the crucible device 20. Hereinafter, for convenience of explanation, the display of the X-axis direction, the Y-axis direction, and the Z-axis direction in FIGS. 2 and 3 corresponds to FIG. 1 .

匣裝置20具備使第一單元部21對第二移動部22移動之移動機構24。移動機構24具備使第一單元部21移動之移動部(第一移動部)42。又，匣裝置20具有後述移動部側通訊部44及接觸抑制部47。 The crucible device 20 includes a moving mechanism 24 that moves the first unit portion 21 to the second moving portion 22. The moving mechanism 24 includes a moving unit (first moving unit) 42 that moves the first unit portion 21. Further, the cymbal device 20 has a moving unit side communication unit 44 and a contact suppressing unit 47 which will be described later.

第一單元部21具有第一壁部40a、第二壁部40b、底部40c及外部連接部40d。又，在第一單元部21設有電池等之電源部(未圖示)。 The first unit portion 21 has a first wall portion 40a, a second wall portion 40b, a bottom portion 40c, and an external connection portion 40d. Further, a power supply unit (not shown) such as a battery is provided in the first unit portion 21.

第一壁部40a及第二壁部40b分別形成為板狀。第一壁部40a例如配置在-X軸側之端部。第二壁部40b例如配置在+X軸側之端部。第一壁部40a及第二壁部40b彼此平行地配置。此外，第一壁部40a及第二壁部40b形成為門狀亦可。 The first wall portion 40a and the second wall portion 40b are each formed in a plate shape. The first wall portion 40a is disposed, for example, at the end on the -X axis side. The second wall portion 40b is disposed, for example, at the end on the +X axis side. The first wall portion 40a and the second wall portion 40b are arranged in parallel to each other. Further, the first wall portion 40a and the second wall portion 40b may be formed in a door shape.

底部40c係形成為與XY平面(地面FL)平行，將第一壁部40a及第二壁部40b加以連結。外部連接部40d例如以在X軸方向延伸之圓柱之棒狀構件形成，設在第一單元部21之+Y軸側端部。第一單元部21之+Y軸側端部係作為連接於外部之搬送機構之連接部作用。外部連接部40d係設在第一單元部21之高度方向(Z軸方向)之例如二個部位。 The bottom portion 40c is formed in parallel with the XY plane (floor FL), and connects the first wall portion 40a and the second wall portion 40b. The external connection portion 40d is formed, for example, by a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the +Y-axis side end portion of the first unit portion 21. The +Y-axis side end portion of the first unit portion 21 functions as a connection portion that is connected to the external transport mechanism. The external connection portion 40d is provided, for example, at two locations in the height direction (Z-axis direction) of the first unit portion 21.

在第一壁部40a及第二壁部40b中之連接部側之角部分 別形成有缺口部40f。缺口部40f係設成可抵接於外部構造物。藉由使缺口部40f抵接於外部構造物，在第一單元部21與上述外部構造物之間進行定位。此外，圖2中，缺口部40f雖形成在+Y軸側端部，但例如為在-Y軸側端部設有缺口部40f之構成亦可。此情形，藉由使缺口部40f抵接於處理部10之一部分，可在第一單元部21與處理部10之間進行定位。 a corner portion on the side of the connecting portion in the first wall portion 40a and the second wall portion 40b A notch portion 40f is formed. The notch portion 40f is configured to be able to abut against the outer structure. The positioning of the first unit portion 21 and the external structure is performed by bringing the notch portion 40f into contact with the outer structure. In addition, in FIG. 2, the notch part 40f is formed in the +Y-axis side edge part, For example, you may comprise the notch part 40f in the - Y-axis side edge part. In this case, positioning can be performed between the first unit portion 21 and the processing portion 10 by bringing the notch portion 40f into contact with one of the processing portions 10.

在第一壁部40a及第二壁部40b之-Y軸側端部分別形成有第一連接部23a。第一單元部21係透過上述第一連接部23a連接於第二單元部22。作為第一連接部23a，使用例如可自動切換裝卸狀態之構成，例如電磁石等。 A first connecting portion 23a is formed at each of the first wall portion 40a and the second wall portion 40b at the Y-axis side end portion. The first unit portion 21 is connected to the second unit portion 22 through the first connecting portion 23a. As the first connecting portion 23a, for example, a configuration in which the detachable state can be automatically switched, for example, an electromagnet or the like is used.

第一單元部21具有收容基板之第一收容部40。在此第一收容部40設有安裝有捲繞有基板S之基板供應滾筒(供應捲軸)41c之基板驅動部(第一基板驅動部)41。基板驅動部41，藉由使基板S旋轉進行對第二單元部22側供應基板S之供應動作。基板驅動部41具有軸部(第一軸部)41a及旋轉驅動部(第一驅動部)41b。軸部41a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部41a伸縮，可從第一壁部40a與第二壁部40b之間移除，基板供應滾筒41c之安裝成為可能。軸部41a係配置成例如中心軸之軸線方向與X軸方向成為平行。軸部41a之一端部係藉由第一單元部21之第二壁部40b可旋轉地支承在圓周方向。在軸部41a設有可保持基板供應滾筒41c之端部之保持部(未圖示)。旋轉驅動部41b使軸部41a旋轉。藉由旋轉驅動部41b使軸部41a旋轉，基板 S之供應動作(送出動作)成為可能。 The first unit portion 21 has a first housing portion 40 that houses a substrate. The first housing portion 40 is provided with a substrate driving portion (first substrate driving portion) 41 on which a substrate supply roller (supply spool) 41c around which the substrate S is wound is mounted. The substrate driving unit 41 performs a supply operation of supplying the substrate S to the second unit portion 22 side by rotating the substrate S. The board drive unit 41 has a shaft portion (first shaft portion) 41a and a rotation drive unit (first drive unit) 41b. The shaft portion 41a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. By the expansion and contraction of the shaft portion 41a, it is possible to remove from between the first wall portion 40a and the second wall portion 40b, and the mounting of the substrate supply roller 41c becomes possible. The shaft portion 41a is disposed such that, for example, the axial direction of the central axis is parallel to the X-axis direction. One end of the shaft portion 41a is rotatably supported in the circumferential direction by the second wall portion 40b of the first unit portion 21. A holding portion (not shown) that can hold the end portion of the substrate supply roller 41c is provided in the shaft portion 41a. The rotation drive unit 41b rotates the shaft portion 41a. The shaft portion 41a is rotated by the rotation driving portion 41b, and the substrate The supply action (sending action) of S is possible.

在第一收容部40設有安裝有保護基板供應滾筒48c之保護基板驅動部(第一輔助部)48。在保護基板供應滾筒48c捲繞有覆蓋基板S之被處理面之保護基板(保護膜)C。保護基板驅動部48，藉由使保護基板供應滾筒48c旋轉，進行對第二單元部22側供應保護基板C之供應動作。保護基板C藉由覆蓋基板S之被處理面保護該被處理面。保護基板C係使用與基板S相同具有可撓性之材料形成為帶狀，具有與基板S大致相同之尺寸。 The first housing portion 40 is provided with a protective substrate driving portion (first auxiliary portion) 48 to which the protective substrate supply roller 48c is attached. A protective substrate (protective film) C covering the surface to be processed of the substrate S is wound around the protective substrate supply roller 48c. The protective substrate driving unit 48 rotates the protective substrate supply roller 48c to supply the protective substrate C to the second unit portion 22 side. The protective substrate C protects the processed surface by covering the processed surface of the substrate S. The protective substrate C is formed into a strip shape using a material having flexibility similar to the substrate S, and has substantially the same size as the substrate S.

保護基板驅動部48具有軸部48a及旋轉驅動部48b。軸部48a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部48a伸縮，可從第一壁部40a與第二壁部40b之間移除，保護基板供應滾筒48c之安裝成為可能。軸部48a係配置成例如中心軸之軸線方向與X軸方向成為平行。亦即，軸部41a及軸部48a係配置成中心軸之軸線方向成為彼此平行。軸部48a之一端部係藉由第一單元部21之第二壁部40b可旋轉地支承在圓周方向。在軸部48a設有可保持保護基板供應滾筒48c之端部之保持部(未圖示)。旋轉驅動部48b使軸部48a旋轉。藉由旋轉驅動部48b使軸部48a旋轉，保護基板C之供應動作(送出動作)成為可能。在保護基板驅動部48設有將送出之保護基板C重疊於基板S之機構(未圖示)。 The protective substrate driving unit 48 has a shaft portion 48a and a rotation driving portion 48b. The shaft portion 48a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. By the expansion and contraction of the shaft portion 48a, it is possible to remove from between the first wall portion 40a and the second wall portion 40b, and it is possible to protect the mounting of the substrate supply roller 48c. The shaft portion 48a is disposed such that, for example, the axial direction of the central axis is parallel to the X-axis direction. That is, the shaft portion 41a and the shaft portion 48a are arranged such that the axial directions of the central axes are parallel to each other. One end of the shaft portion 48a is rotatably supported in the circumferential direction by the second wall portion 40b of the first unit portion 21. A holding portion (not shown) that can hold the end portion of the protective substrate supply roller 48c is provided in the shaft portion 48a. The rotation drive unit 48b rotates the shaft portion 48a. By rotating the shaft portion 48a by the rotation driving portion 48b, it is possible to protect the supply operation (feeding operation) of the substrate C. The protective substrate driving unit 48 is provided with a mechanism (not shown) for superposing the supplied protective substrate C on the substrate S.

第一單元部21具有基板側通訊部(第一通訊部)43。基板側通訊部43係設在第一壁部40a之+Z軸側端面。基板側通訊部43例如可在與控制部CONT或第二單元部22等之 間進行通訊。 The first unit portion 21 has a substrate-side communication portion (first communication portion) 43. The substrate-side communication portion 43 is provided on the +Z-axis side end surface of the first wall portion 40a. The substrate-side communication unit 43 can be, for example, the control unit CONT or the second unit unit 22, and the like. Communicate between.

第一單元部21具有接觸抑制部47。接觸抑制部47係設在第一壁部40a及第二壁部40b之+Y側端面。接觸抑制部47抑制第一壁部40a及第二壁部40b之+Y側端面與外部構造物接觸，且緩和接觸時之衝擊。接觸抑制部47具有例如從第一壁部40a及第二壁部40b往+Y軸側突出之棒狀構件、及承受對該棒狀構件作用之-Y軸方向之力之彈性構件。 The first unit portion 21 has a contact suppressing portion 47. The contact suppressing portion 47 is provided on the +Y side end faces of the first wall portion 40a and the second wall portion 40b. The contact suppressing portion 47 suppresses the +Y side end faces of the first wall portion 40a and the second wall portion 40b from coming into contact with the external structure, and alleviates the impact at the time of contact. The contact suppressing portion 47 has, for example, a rod-shaped member that protrudes from the first wall portion 40a and the second wall portion 40b toward the +Y-axis side, and an elastic member that receives a force acting in the Y-axis direction acting on the rod-shaped member.

上述移動部42將第一單元部21支承成可移除。移動部42使第一單元部21往X軸方向、Y軸方向及Z軸方向移動。移動部42具有筐體51、腳輪52、升降部53、及腳輪驅動部54。又，在移動部42設有電池等之電源部(未圖示)。 The moving portion 42 supports the first unit portion 21 to be removable. The moving unit 42 moves the first unit portion 21 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving unit 42 has a casing 51, a caster 52, a lifting unit 53, and a caster driving unit 54. Further, a power supply unit (not shown) such as a battery is provided in the moving unit 42.

筐體51具有可動部51a及基部51b。可動部51a係設在筐體51之+Z軸側端部，設成藉由升降部53之驅動可往Z軸方向移動。藉由可動部51a往+Z軸方向移動，第一單元部21與上述可動部51a一體地往+Z軸方向移動。基部51b將可動部51a支承成可移動。 The casing 51 has a movable portion 51a and a base portion 51b. The movable portion 51a is provided at the +Z-axis side end portion of the casing 51, and is movable in the Z-axis direction by the driving of the lifting portion 53. The first unit portion 21 and the movable portion 51a move integrally in the +Z-axis direction by the movable portion 51a moving in the +Z-axis direction. The base portion 51b supports the movable portion 51a so as to be movable.

腳輪52在筐體51之基部51b之-Z軸側端面設有四個。腳輪52係設成可藉由腳輪驅動部54之驅動而旋轉。藉由腳輪52旋轉，筐體51及第一單元部21一體地往X軸方向、Y軸方向及θ Z軸方向移動。 The caster 52 is provided at four on the Z-axis side end surface of the base portion 51b of the casing 51. The caster 52 is rotatably driven by the caster drive unit 54. When the caster 52 rotates, the casing 51 and the first unit portion 21 integrally move in the X-axis direction, the Y-axis direction, and the θ Z-axis direction.

在可動部51a之+Z軸側之端面51c形成有槽部50。槽部50係V字狀形成在上述端面51c。另一方面，在第一單元部21之-Z軸側之端面40e形成有四個球狀支承部49。上 述四個球狀支承部49分別支承於上述槽部50。藉由球狀支承部49支承於槽部50，限制往在第一單元部21與筐體51之間之X軸方向及Y軸方向之相對移動。此外，槽部50及球狀支承部49之數量分別為三個亦可。 A groove portion 50 is formed in the end surface 51c on the +Z-axis side of the movable portion 51a. The groove portion 50 is formed in a V shape on the end surface 51c. On the other hand, four spherical support portions 49 are formed on the end surface 40e on the -Z-axis side of the first unit portion 21. on The four spherical support portions 49 are respectively supported by the groove portions 50. The spherical support portion 49 is supported by the groove portion 50 to restrict the relative movement between the first unit portion 21 and the casing 51 in the X-axis direction and the Y-axis direction. Further, the number of the groove portion 50 and the spherical support portion 49 may be three.

又，在可動部51a設有裝卸檢測部46。裝卸檢測部46檢測第一單元部21是否安裝在筐體51。作為裝卸檢測部46，可使用例如檢測在槽部50與球狀支承部49之間之電阻值之感測器或檢測在槽部50之壓力之感測器等之各種感測器。裝卸檢測部46之檢測結果例如從移動部側通訊部44傳送至外部(控制部CONT、基板側通訊部43等)。 Further, the detachable detecting portion 46 is provided in the movable portion 51a. The attaching and detaching detecting unit 46 detects whether or not the first unit portion 21 is attached to the casing 51. As the attaching and detaching detecting unit 46, for example, a sensor that detects a resistance value between the groove portion 50 and the spherical supporting portion 49 or a sensor that detects a pressure of the groove portion 50 or the like can be used. The detection result of the attachment/detachment detecting unit 46 is transmitted from the moving unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, and the like), for example.

移動部42具有移動部側通訊部(第一通訊部)44。移動部側通訊部44係設在筐體51之內部。移動部側通訊部44可在與例如控制部CONT或基板側通訊部43、第二單元部22等之間進行通訊。基板側通訊部43或移動部側通訊部44可接收用以控制第一單元部21之動作之第一控制訊號。在第一控制訊號包含例如控制移動部42之移動動作之訊號、或控制在第一單元部21之基板S之供應及回收動作之訊號等。 The moving unit 42 has a moving unit side communication unit (first communication unit) 44. The moving unit side communication unit 44 is provided inside the casing 51. The moving unit side communication unit 44 can communicate with, for example, the control unit CONT, the board side communication unit 43, the second unit unit 22, and the like. The substrate side communication unit 43 or the moving unit side communication unit 44 can receive the first control signal for controlling the operation of the first unit unit 21. The first control signal includes, for example, a signal for controlling the movement operation of the moving unit 42, or a signal for controlling the supply and recovery operation of the substrate S of the first unit portion 21.

如圖3所示，在筐體51之基部51b之-Z側之端面51d(與地面FL對向之面)設有位置檢測部(第一檢測部)55。位置檢測部55檢測第一單元部21之位置資訊。位置檢測部55，作為上述位置資訊，檢測例如設定在導軌30(第一軌道31、第二軌道32及第三軌道33)之位置資訊。位置檢測部55之檢測結果例如從移動部側通訊部44傳送至外部(控制部 CONT、基板側通訊部43等)。例如，控制部CONT使用位置檢測部55之檢測結果使第一單元部21沿著導軌30移動。 As shown in FIG. 3, a position detecting portion (first detecting portion) 55 is provided on the end surface 51d on the -Z side of the base portion 51b of the casing 51 (the surface facing the floor surface FL). The position detecting unit 55 detects the position information of the first unit unit 21. The position detecting unit 55 detects, for example, position information set on the guide rails 30 (the first rail 31, the second rail 32, and the third rail 33) as the position information. The detection result of the position detecting unit 55 is transmitted from the moving unit side communication unit 44 to the outside, for example (control unit). CONT, substrate side communication unit 43, and the like). For example, the control unit CONT moves the first unit portion 21 along the guide rail 30 using the detection result of the position detecting unit 55.

圖4係顯示匣裝置20中之第二單元部22之構成之分解立體圖。以下，為了方便說明，使圖4中X軸方向、Y軸方向、Z軸方向之顯示與圖1對應。 4 is an exploded perspective view showing the configuration of the second unit portion 22 in the crucible device 20. Hereinafter, for convenience of explanation, the display in the X-axis direction, the Y-axis direction, and the Z-axis direction in FIG. 4 corresponds to FIG. 1 .

如圖4所示，第二單元部22具有基板驅動部(第二基板驅動部)61、基板側通訊部63、接觸抑制部67、保護基板驅動部(第二輔助部)68。又，設在匣裝置20之移動機構24具有使第二單元部22移動之移動部(第二移動部)62。 As shown in FIG. 4, the second unit portion 22 includes a substrate driving portion (second substrate driving portion) 61, a substrate-side communication portion 63, a contact suppressing portion 67, and a protective substrate driving portion (second auxiliary portion) 68. Further, the moving mechanism 24 provided in the cymbal device 20 has a moving portion (second moving portion) 62 that moves the second unit portion 22.

第二單元部22具有第一壁部60a、第二壁部60b、底部60c及外部連接部60d。又，在第二單元部22設有電池等之電源部(未圖示)。第一單元部21及第二單元部22具有以XZ平面為基準之鏡面構造。 The second unit portion 22 has a first wall portion 60a, a second wall portion 60b, a bottom portion 60c, and an external connection portion 60d. Further, a power supply unit (not shown) such as a battery is provided in the second unit unit 22. The first unit portion 21 and the second unit portion 22 have a mirror structure based on the XZ plane.

第一壁部60a及第二壁部60b分別形成為板狀。第一壁部60a例如配置在-X軸側之端部。第二壁部60b例如配置在+X軸側之端部。第一壁部60a及第二壁部60b彼此平行地配置。此外，第一壁部60a及第二壁部60b形成為門狀亦可。 The first wall portion 60a and the second wall portion 60b are each formed in a plate shape. The first wall portion 60a is disposed, for example, at the end on the -X-axis side. The second wall portion 60b is disposed, for example, at the end on the +X-axis side. The first wall portion 60a and the second wall portion 60b are arranged in parallel to each other. Further, the first wall portion 60a and the second wall portion 60b may be formed in a door shape.

底部60c係形成為與XY平面(地面FL)平行，將第一壁部60a及第二壁部60b加以連結。外部連接部60d例如以在X軸方向延伸之圓柱之棒狀構件形成，設在第二單元部22之-Y軸側端部。第二單元部22之-Y軸側端部係作為連接於外部之搬送機構之連接部作用。外部連接部60d係設在第二單元部22之高度方向(Z軸方向)之例如二個部位。 The bottom portion 60c is formed in parallel with the XY plane (floor FL), and connects the first wall portion 60a and the second wall portion 60b. The external connection portion 60d is formed, for example, by a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the Y-axis side end portion of the second unit portion 22. The Y-axis side end portion of the second unit portion 22 functions as a connection portion that is connected to the external transfer mechanism. The external connection portion 60d is provided, for example, at two locations in the height direction (Z-axis direction) of the second unit portion 22.

在第一壁部60a及第二壁部60b中之連接部側之角部分別形成有缺口部60f。缺口部60f係設成可抵接於外部構造物。藉由使缺口部60f抵接於外部構造物，在第二單元部22與上述外部構造物之間進行定位。此外，圖4中，缺口部60f雖形成在-Y軸側端部，但例如為在+Y軸側端部設有缺口部60f之構成亦可。此情形，藉由使缺口部60f抵接於處理部10之一部分，可在第二單元部22與處理部10之間進行定位。 A notch portion 60f is formed in each of the corner portions on the side of the connecting portion of the first wall portion 60a and the second wall portion 60b. The notch portion 60f is provided to be able to abut against the outer structure. Positioning is performed between the second unit portion 22 and the external structure by bringing the notch portion 60f into contact with the outer structure. In addition, in FIG. 4, the notch part 60f is formed in the -Y-axis side edge part, For example, the notch part 60f may be provided in the end part of the + Y-axis side. In this case, positioning can be performed between the second unit portion 22 and the processing portion 10 by bringing the notch portion 60f into contact with one of the processing portions 10.

在第一壁部60a及第二壁部60b之+Y軸側端部分別形成有第二連接部23b。第二單元部22係透過上述第二連接部23b連接於第一單元部21。作為第二連接部23b，使用例如可自動切換裝卸狀態之構成，例如電磁石等。 A second connecting portion 23b is formed at each of the first wall portion 60a and the second wall portion 60b at the +Y-axis side end portion. The second unit portion 22 is connected to the first unit portion 21 through the second connecting portion 23b. As the second connecting portion 23b, for example, a configuration in which the detachable state can be automatically switched, for example, an electromagnet or the like is used.

第二單元部22具有收容基板之第二收容部60。在此第二收容部60設有安裝有捲繞有基板S之基板回收滾筒(回收捲軸)61c之基板驅動部61。基板驅動部61，藉由使基板S旋轉進行回收從第一單元部21側供應之基板S之回收動作。基板驅動部61具有軸部(第二軸部)61a及旋轉驅動部(第二驅動部)61b。軸部61a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部61a伸縮，可從第一壁部60a與第二壁部60b之間移除，基板回收滾筒61c之安裝成為可能。軸部61a係配置成例如中心軸之軸線方向與X軸方向成為平行。軸部61a之一端部係藉由第二單元部22之第二壁部60b可旋轉地支承在圓周方向。在軸部61a設有可保持基板回收滾筒61c之端部之保持部(未圖示)。旋轉驅動部61b使軸部61a 旋轉。藉由旋轉驅動部61b使軸部61a旋轉，基板S之供應動作(捲繞動作)成為可能。 The second unit portion 22 has a second housing portion 60 that houses the substrate. The second housing portion 60 is provided with a substrate driving portion 61 on which a substrate recovery roller (recycling reel) 61c around which the substrate S is wound is mounted. The substrate driving unit 61 recovers the substrate S supplied from the first unit portion 21 side by rotating the substrate S. The board drive unit 61 has a shaft portion (second shaft portion) 61a and a rotation drive unit (second drive unit) 61b. The shaft portion 61a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. By the expansion and contraction of the shaft portion 61a, it is possible to remove between the first wall portion 60a and the second wall portion 60b, and the mounting of the substrate recovery drum 61c becomes possible. The shaft portion 61a is disposed such that, for example, the axial direction of the central axis is parallel to the X-axis direction. One end of the shaft portion 61a is rotatably supported in the circumferential direction by the second wall portion 60b of the second unit portion 22. A holding portion (not shown) that can hold the end portion of the substrate recovery drum 61c is provided in the shaft portion 61a. The rotation driving portion 61b causes the shaft portion 61a Rotate. The rotation of the shaft portion 61a by the rotation driving portion 61b makes it possible to supply the substrate S (winding operation).

在第二收容部60設有安裝有保護基板供應滾筒68c之保護基板驅動部(第二輔助部)68。在保護基板供應滾筒68c捲繞有覆蓋基板S之被處理面之保護基板(保護膜)C。保護基板驅動部68，藉由使保護基板供應滾筒68c旋轉，進行回收從第一單元部21側供應之保護基板C之回收動作。 The second housing portion 60 is provided with a protective substrate driving portion (second auxiliary portion) 68 to which the protective substrate supply roller 68c is attached. A protective substrate (protective film) C covering the surface to be processed of the substrate S is wound around the protective substrate supply roller 68c. The protective substrate driving unit 68 rotates the protective substrate supply roller 68c to recover the protective substrate C supplied from the first unit portion 21 side.

保護基板驅動部68具有軸部68a及旋轉驅動部68b。軸部68a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部68a伸縮，可從第一壁部60a與第二壁部60b之間移除，保護基板供應滾筒68c之安裝成為可能。軸部68a係配置成例如中心軸之軸線方向與X軸方向成為平行。亦即，軸部61a及軸部68a係配置成中心軸之軸線方向成為彼此平行。軸部68a之一端部係藉由第二單元部22之第二壁部60b可旋轉地支承在圓周方向。在軸部68a設有可保持保護基板供應滾筒68c之端部之保持部(未圖示)。旋轉驅動部68b使軸部68a旋轉。藉由旋轉驅動部68b使軸部68a旋轉，保護基板C之供應動作(捲繞動作)成為可能。在保護基板驅動部68設有將送出之保護基板C重疊於基板S之機構(未圖示)。此外，在保護基板C重疊於基板S之狀態下捲繞於基板驅動部61之情形，亦可省略第二單元部22側之保護基板驅動部68。 The protective substrate driving unit 68 has a shaft portion 68a and a rotation driving portion 68b. The shaft portion 68a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. By the expansion and contraction of the shaft portion 68a, it is possible to remove from between the first wall portion 60a and the second wall portion 60b, and it is possible to protect the mounting of the substrate supply roller 68c. The shaft portion 68a is disposed such that, for example, the axial direction of the central axis is parallel to the X-axis direction. That is, the shaft portion 61a and the shaft portion 68a are arranged such that the axial directions of the central axes are parallel to each other. One end of the shaft portion 68a is rotatably supported in the circumferential direction by the second wall portion 60b of the second unit portion 22. A holding portion (not shown) that can hold the end portion of the protective substrate supply roller 68c is provided in the shaft portion 68a. The rotation drive unit 68b rotates the shaft portion 68a. By rotating the shaft portion 68a by the rotation driving portion 68b, it is possible to protect the supply operation (winding operation) of the substrate C. The protective substrate drive unit 68 is provided with a mechanism (not shown) for superposing the supplied protective substrate C on the substrate S. In addition, in the case where the protective substrate C is wound around the substrate drive unit 61, the protective substrate driving unit 68 on the second unit portion 22 side may be omitted.

第二單元部22具有基板側通訊部(第二通訊部)63。基板側通訊部63係設在第二壁部60b之+Z軸側端面。基板側 通訊部63例如可在與控制部CONT或第一單元部21等之間進行通訊。 The second unit portion 22 has a substrate-side communication portion (second communication portion) 63. The substrate-side communication portion 63 is provided on the +Z-axis side end surface of the second wall portion 60b. Substrate side The communication unit 63 can communicate with the control unit CONT, the first unit unit 21, and the like, for example.

第二單元部22具有接觸抑制部67。接觸抑制部67係設在第一壁部60a及第二壁部60b之-Y側端面。接觸抑制部67抑制第一壁部60a及第二壁部60b之-Y側端面與外部構造物接觸，且緩和接觸時之衝擊。接觸抑制部67具有例如從第一壁部60a及第二壁部60b往-Y軸側突出之棒狀構件、及承受對該棒狀構件作用之+Y軸方向之力之彈性構件。 The second unit portion 22 has a contact suppressing portion 67. The contact suppressing portion 67 is provided on the -Y side end surface of the first wall portion 60a and the second wall portion 60b. The contact suppressing portion 67 suppresses the end faces on the -Y side of the first wall portion 60a and the second wall portion 60b from coming into contact with the external structure, and alleviates the impact at the time of contact. The contact suppressing portion 67 has, for example, a rod-shaped member that protrudes from the first wall portion 60a and the second wall portion 60b toward the -Y-axis side, and an elastic member that receives a force in the +Y-axis direction acting on the rod-shaped member.

在可動部71a之+Z軸側之端面71c形成有槽部70。槽部70係V字狀形成在上述端面71c。另一方面，在第二單元部22之-Z軸側之端面60e形成有四個球狀支承部69。上述四個球狀支承部69分別支承於上述槽部70。藉由球狀支承部69支承於槽部70，限制往在第二單元部22與筐體71之間之X軸方向及Y軸方向之相對移動。此外，槽部70及球狀支承部69之數量分別為三個亦可。 A groove portion 70 is formed in the end surface 71c on the +Z-axis side of the movable portion 71a. The groove portion 70 is formed in a V shape on the end surface 71c. On the other hand, four spherical support portions 69 are formed on the end face 60e on the -Z-axis side of the second unit portion 22. The four spherical support portions 69 are supported by the groove portions 70, respectively. The spherical support portion 69 is supported by the groove portion 70 to restrict the relative movement between the second unit portion 22 and the casing 71 in the X-axis direction and the Y-axis direction. Further, the number of the groove portion 70 and the spherical support portion 69 may be three, respectively.

又，在可動部71a設有裝卸檢測部66。裝卸檢測部66檢測第二單元部22是否安裝在筐體71。作為裝卸檢測部66，可使用例如檢測在槽部70與球狀支承部69之間之電阻值之感測器或檢測在槽部70之壓力之感測器等之各種感測器。裝卸檢測部66之檢測結果例如從移動部側通訊部64傳送至外部(控制部CONT、基板側通訊部63等)。 Further, the detachable detecting portion 66 is provided in the movable portion 71a. The attaching and detaching detecting unit 66 detects whether or not the second unit portion 22 is attached to the casing 71. As the attaching and detaching detecting unit 66, for example, a sensor that detects a resistance value between the groove portion 70 and the spherical supporting portion 69 or a sensor that detects a pressure of the groove portion 70 or the like can be used. The detection result of the detachment detecting unit 66 is transmitted from the moving unit side communication unit 64 to the outside (the control unit CONT, the substrate side communication unit 63, etc.), for example.

又，第二單元部22，除了上述構成外，具有連接檢測部(第二檢測部)65。連接檢測部65檢測第一單元部21與第二單元部22之間是否連接。作為連接檢測部65，可使用檢 測第二連接部23b之電氣特性之感測器等。連接檢測部65之檢測結果例如從移動部側通訊部64傳送至外部(控制部CONT、基板側通訊部63等)。 Further, the second unit portion 22 has a connection detecting portion (second detecting portion) 65 in addition to the above configuration. The connection detecting unit 65 detects whether or not the first unit portion 21 and the second unit portion 22 are connected. As the connection detecting unit 65, it is possible to use the check A sensor or the like that measures the electrical characteristics of the second connecting portion 23b. The detection result of the connection detecting unit 65 is transmitted from the moving unit side communication unit 64 to the outside (the control unit CONT, the board side communication unit 63, etc.), for example.

上述移動部62將第二單元部22支承成可移除。移動部62使第二單元部22往X軸方向、Y軸方向及Z軸方向移動。移動部62具有筐體71、腳輪72、升降部73、及腳輪驅動部74。筐體71具有可動部71a及基部71b。控制部CONT控制腳輪72之旋轉速度。藉此，控制部CONT可控制移動部62之移動速度。又，在移動部62設有電池等之電源部(未圖示)。 The moving portion 62 supports the second unit portion 22 to be removable. The moving unit 62 moves the second unit portion 22 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving unit 62 has a casing 71, casters 72, a lifting portion 73, and a caster driving portion 74. The casing 71 has a movable portion 71a and a base portion 71b. The control unit CONT controls the rotational speed of the caster 72. Thereby, the control unit CONT can control the moving speed of the moving unit 62. Further, a power supply unit (not shown) such as a battery is provided in the moving unit 62.

上述第二單元部22之移動部62與上述第一單元部21之移動部42構成使第一單元部21及第二單元部22相對移動之移動機構24。移動部42及移動部62分別可將第一單元部21及第二單元部22獨立地驅動。 The moving portion 62 of the second unit portion 22 and the moving portion 42 of the first unit portion 21 constitute a moving mechanism 24 that relatively moves the first unit portion 21 and the second unit portion 22. The moving unit 42 and the moving unit 62 can drive the first unit unit 21 and the second unit unit 22 independently.

上述移動部62具有移動部側通訊部(第二通訊部)64。移動部側通訊部64係設在筐體71之內部。移動部側通訊部64可在與例如控制部CONT或基板側通訊部63、第一單元部21等之間進行通訊。基板側通訊部63及移動部側通訊部64可接收用以控制第二單元部22之動作之第二控制訊號。在第二控制訊號包含例如控制移動部62之移動動作之訊號、或控制在第二單元部22之基板S之供應動作之訊號等。 The moving unit 62 has a moving unit side communication unit (second communication unit) 64. The moving unit side communication unit 64 is provided inside the casing 71. The moving unit side communication unit 64 can communicate with, for example, the control unit CONT, the board side communication unit 63, the first unit unit 21, and the like. The substrate-side communication unit 63 and the moving-side communication unit 64 can receive a second control signal for controlling the operation of the second unit unit 22. The second control signal includes, for example, a signal for controlling the movement operation of the moving unit 62, or a signal for controlling the supply operation of the substrate S of the second unit portion 22.

移動部62具有基板搬送控制部77。基板搬送控制部77控制第一單元部21及第二單元部22之基板S及保護基 板C之搬送動作。基板搬送控制部77係透過移動部側通訊部64及基板側通訊部63控制軸部61a及軸部68a之旋轉速度。藉此，基板搬送控制部77可控制基板S及保護基板C之回收速度(捲繞速度)。 The moving unit 62 has a substrate conveyance control unit 77. The substrate transfer control unit 77 controls the substrate S and the protective substrate of the first unit portion 21 and the second unit portion 22 The movement of the board C. The substrate transport control unit 77 controls the rotational speeds of the shaft portion 61a and the shaft portion 68a through the moving unit side communication unit 64 and the board side communication unit 63. Thereby, the substrate conveyance control unit 77 can control the recovery speed (winding speed) of the substrate S and the protective substrate C.

又，基板搬送控制部77係透過例如移動部側通訊部64及第一單元部21之基板側通訊部43控制軸部41a及軸部48a之旋轉速度。藉此，基板搬送控制部77可控制基板S及保護基板C之供應速度(送出速度)。 Further, the substrate transport control unit 77 controls the rotational speeds of the shaft portion 41a and the shaft portion 48a through, for example, the moving portion side communication portion 64 and the substrate side communication portion 43 of the first unit portion 21. Thereby, the substrate conveyance control unit 77 can control the supply speed (feeding speed) of the substrate S and the protective substrate C.

基板搬送控制部77控制第二單元部22之腳輪72之旋轉速度。藉此，基板搬送控制部77可控制移動部62之移動速度。又，基板搬送控制部77係透過移動部側通訊部64及第一單元部21之移動部側通訊部44控制第一單元部21之腳輪52之旋轉速度。藉此，基板搬送控制部77可控制移動部42之移動速度。 The substrate conveyance control unit 77 controls the rotation speed of the casters 72 of the second unit portion 22. Thereby, the substrate conveyance control unit 77 can control the moving speed of the moving portion 62. Further, the substrate transport control unit 77 controls the rotational speed of the casters 52 of the first unit portion 21 through the moving unit side communication unit 64 and the moving unit side communication unit 44 of the first unit unit 21. Thereby, the substrate conveyance control unit 77 can control the moving speed of the moving unit 42.

圖5係顯示使匣裝置20之第一單元部21與第二單元部22連接後之狀態之立體圖。 FIG. 5 is a perspective view showing a state in which the first unit portion 21 of the crucible device 20 is connected to the second unit portion 22.

如圖5所示，第一單元部21及第二單元部22可在第一連接部23a與第二連接部23b對向之狀態下連接。第一連接部23a與第二連接部23b之間係藉由電磁石之磁力吸附。如上述，匣裝置20具備藉由第一連接部23a及第二連接部23b將第一單元部21與第二單元部22加以連接之連接部23。 As shown in FIG. 5, the first unit portion 21 and the second unit portion 22 can be connected in a state in which the first connecting portion 23a and the second connecting portion 23b face each other. The first connecting portion 23a and the second connecting portion 23b are magnetically attracted by the magnetic force of the electromagnet. As described above, the crucible device 20 includes the connection portion 23 that connects the first unit portion 21 and the second unit portion 22 by the first connection portion 23a and the second connection portion 23b.

第一單元部21係支承在移動部42之筐體51且第二單元部22係支承在移動部62之筐體71之情形，第一單元部 21與第二單元部22連接構成匣裝置20。此情形，移動部42及移動部62能使第一單元部21與第二單元部22在維持連接之狀態下一體地移動。 The first unit portion 21 is supported by the casing 51 of the moving portion 42 and the second unit portion 22 is supported by the casing 71 of the moving portion 62, and the first unit portion The second unit unit 22 is connected to the second unit unit 22 to constitute the crucible device 20. In this case, the moving unit 42 and the moving unit 62 can integrally move the first unit portion 21 and the second unit portion 22 while maintaining the connection.

又，在第一單元部21與第二單元部22連接之情形，例如在第一連接部23a及第二連接部23b設置連接端子，藉由使上述連接端子彼此連接成為可在第一單元部21與第二單元部22之間收發資訊之構成亦可。 Further, when the first unit portion 21 is connected to the second unit portion 22, for example, connection terminals are provided in the first connection portion 23a and the second connection portion 23b, and the connection terminals are connected to each other to be in the first unit portion. The configuration of transmitting and receiving information between the 21 and the second unit unit 22 is also possible.

匣裝置20具有設在第一單元部21且安裝蓋構件CV之安裝部81。再者，匣裝置20具有設在第二單元部22且安裝蓋構件CV之安裝部82。蓋構件CV以例如塵埃等異物不進入之方式將第一單元部21及第二單元部22之內部加以密封。蓋構件CV係橫跨第一單元部21與第二單元部22之間安裝。 The crucible device 20 has a mounting portion 81 that is provided in the first unit portion 21 and that mounts the cover member CV. Further, the crucible device 20 has a mounting portion 82 that is provided in the second unit portion 22 and that mounts the cover member CV. The lid member CV seals the inside of the first unit portion 21 and the second unit portion 22 so that foreign matter such as dust does not enter. The cover member CV is mounted between the first unit portion 21 and the second unit portion 22.

圖5之蓋構件CV，例如雖顯示可在Z軸方向裝卸之構成，但並不限於此。例如，在第一單元部21之底部40c及第二單元部22之底部60c將蓋構件CV可旋轉地安裝亦可。又，以可伸縮或折疊之片狀構件形成蓋構件CV，將此蓋構件CV之一部分構成為可收容於底部40c亦可。此情形，從在第一單元部21之底部40c之+Y軸側端部將蓋構件CV引出，從第一單元部21之+Y軸側之側面往+Z軸側之側面懸掛，藉此可覆蓋第一單元部21。同樣地，從第二單元部22之底部60c之-Y軸側端部將蓋構件CV引出，從第二單元部22之-Y軸側之側面往+Z軸側之側面懸掛，藉此可覆蓋第二單元部22。又，從第一單元部21側往第二單元部 22側捲繞懸掛蓋構件CV之構成亦可。 The cover member CV of Fig. 5 is configured to be detachable from the Z-axis direction, for example, but is not limited thereto. For example, the cover member CV may be rotatably attached to the bottom portion 40c of the first unit portion 21 and the bottom portion 60c of the second unit portion 22. Further, the cover member CV is formed by a stretchable or folded sheet member, and one of the cover members CV may be configured to be housed in the bottom portion 40c. In this case, the cover member CV is taken out from the +Y-axis side end portion of the bottom portion 40c of the first unit portion 21, and is suspended from the side surface of the first unit portion 21 on the +Y-axis side toward the side on the +Z-axis side. The first unit portion 21 can be covered. Similarly, the cover member CV is taken out from the -Y-axis side end portion of the bottom portion 60c of the second unit portion 22, and is suspended from the side surface on the -Y-axis side of the second unit portion 22 toward the side on the +Z-axis side. The second unit portion 22 is covered. Further, from the first unit portion 21 side to the second unit portion The configuration of the 22-side winding suspension cover member CV is also possible.

圖6係顯示處理部10之構成之側視圖。圖6中，省略保護基板C、保護基板驅動部48及保護基板驅動部68之圖示。 Fig. 6 is a side view showing the configuration of the processing unit 10. In FIG. 6, the illustration of the protective substrate C, the protective substrate driving portion 48, and the protective substrate driving portion 68 is omitted.

如圖6所示，在處理部10之基板S之搬送方向，在上游側配置第一單元部21，在下游側配置第二單元部22。此外，處理部10在從第一單元部21供應且往第二單元部22搬送之基板S之移動路徑上，對上述基板S之被處理面Sa進行處理。處理部10具有處理裝置15、導引裝置16及對準測量裝置17。 As shown in FIG. 6, in the transport direction of the substrate S of the processing unit 10, the first unit portion 21 is disposed on the upstream side, and the second unit portion 22 is disposed on the downstream side. Further, the processing unit 10 processes the processed surface Sa of the substrate S on the moving path of the substrate S supplied from the first unit portion 21 and transported to the second unit portion 22. The processing unit 10 has a processing device 15, a guiding device 16, and an alignment measuring device 17.

處理裝置15具有用以對基板S之被處理面Sa形成例如有機EL元件之各種裝置。作為此種裝置，可舉出例如用以在被處理面Sa上形成分隔壁之分隔壁形成裝置、用以形成電極之電極形成裝置、用以形成發光層之發光層形成裝置等。更具體而言，可舉出液滴塗布裝置(例如噴墨型塗布裝置等)、成膜裝置(膜形成裝置，例如蒸鍍裝置、濺鍍裝置)、曝光裝置、顯影裝置、表面改質裝置、洗淨裝置、乾燥裝置、檢查基板之檢查裝置等。此等各裝置係沿著基板S之搬送路徑適當設置。 The processing device 15 has various means for forming, for example, an organic EL element on the processed surface Sa of the substrate S. As such a device, for example, a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode, a light-emitting layer forming device for forming a light-emitting layer, and the like can be given. More specifically, a droplet application device (for example, an inkjet coating device), a film formation device (film formation device such as a vapor deposition device, a sputtering device), an exposure device, a developing device, and a surface modification device are mentioned. , cleaning device, drying device, inspection device for inspecting the substrate, and the like. These devices are appropriately disposed along the transport path of the substrate S.

本實施形態中，處理裝置15具有具備收容用以對基板S進行顯影處理之顯影液11b之顯影液收容容器11a之顯影裝置11、及具備用以收容洗淨基板S之洗淨液12b之洗淨液收容容器12a之洗淨裝置12。此外，處理裝置15可收容進行使用上述液體以外之處理之裝置。 In the present embodiment, the processing device 15 includes a developing device 11 including a developing solution storage container 11a for developing the developing solution 11b for the substrate S, and a washing device 12b for storing the washing substrate S. The cleaning device 12 of the cleaning solution storage container 12a. Further, the processing device 15 can accommodate a device that performs processing other than the above-described liquid.

導引裝置16具有顯影側導引部13、洗淨側導引部14。顯影側導引部13具有第一墊13a、第二墊13d、第一滾筒13b及第二滾筒13c。 The guiding device 16 has a developing side guiding portion 13 and a cleaning side guiding portion 14. The developing-side guide portion 13 has a first pad 13a, a second pad 13d, a first roller 13b, and a second roller 13c.

第一墊13a係固定在處理裝置15之內部，將從第一單元部21供應之基板S導引至顯影液收容容器11a。第二墊13d係固定在處理裝置15之內部，將通過顯影液11b之基板S導引至顯影液收容容器11a之外部。 The first pad 13a is fixed inside the processing device 15, and guides the substrate S supplied from the first unit portion 21 to the developer storage container 11a. The second pad 13d is fixed inside the processing apparatus 15, and guides the substrate S passing through the developing solution 11b to the outside of the developing solution storage container 11a.

第一滾筒13b及第二滾筒13c係設成可相對於顯影液收容容器11a在上下方向(Z軸方向)移動。在第一墊13a與第一滾筒13b之間、及第二墊13d與第二滾筒13c之間搬入基板S後，使第一滾筒13b及第二滾筒13c往顯影液收容容器11a側(下方，亦即-Z軸方向)移動，藉此在第一墊13a基板S之搬送方向往-Z軸方向變更，且基板S浸入顯影液11b，且可將基板S導引成通過顯影液11b之內部。 The first roller 13b and the second roller 13c are configured to be movable in the vertical direction (Z-axis direction) with respect to the developer storage container 11a. After the substrate S is loaded between the first pad 13a and the first roller 13b and between the second pad 13d and the second roller 13c, the first roller 13b and the second roller 13c are moved toward the developer liquid storage container 11a (downward, That is, the movement in the -Z-axis direction is performed, whereby the transfer direction of the substrate S of the first pad 13a is changed in the -Z-axis direction, and the substrate S is immersed in the developer 11b, and the substrate S can be guided to pass through the inside of the developer 11b. .

洗淨側導引部14具有第一墊14a、第二墊14d、第一滾筒14b及第二滾筒14c。洗淨側導引部14之各滾筒與顯影側導引部13之各滾筒構成相同，因此省略說明。 The cleaning side guide portion 14 has a first pad 14a, a second pad 14d, a first roller 14b, and a second roller 14c. Since the respective rollers of the cleaning side guide portion 14 and the respective rollers of the development side guide portion 13 have the same configuration, the description thereof will be omitted.

又，顯影側導引部13之第一墊13a及第二墊13d與洗淨側導引部14之第一墊14a及第二墊14d導引基板S之被處理面Sa之背面。是以，此等第一墊13a、第二墊13d、第一墊14a及第二墊14d分別具有圓柱狀之導引面，具有複數個從此導引面噴出氣體之未圖示之噴出口，在導引面上可形成氣體之層。藉由此氣體之層，可在導引面以非接觸方式導引基板S之背面(被處理面Sa之相反側之面)。此外， 替換第一墊13a及第二墊13d，使用旋轉滾筒亦可。使用旋轉滾筒之情形，在基板S之背面接觸旋轉滾筒之導引面之狀態下，旋轉滾筒導引基板S。 Further, the first pad 13a and the second pad 13d of the developing-side guide portion 13 and the first pad 14a and the second pad 14d of the cleaning-side guide portion 14 guide the back surface of the processed surface Sa of the substrate S. Therefore, the first pad 13a, the second pad 13d, the first pad 14a, and the second pad 14d each have a cylindrical guiding surface, and have a plurality of ejection ports (not shown) for ejecting gas from the guiding surface. A layer of gas can be formed on the guiding surface. By the layer of the gas, the back surface of the substrate S (the surface on the opposite side to the surface to be processed Sa) can be guided in a non-contact manner on the guiding surface. In addition, It is also possible to use the rotary drum instead of the first pad 13a and the second pad 13d. In the case of using the rotary drum, the substrate is rotated by the guide roller S in a state where the back surface of the substrate S contacts the guide surface of the rotary drum.

對準測量裝置17測量基板S之邊緣部或設在基板S之對準標記，根據其測量結果，對基板S進行對準動作。對準測量裝置17具有檢測基板S之邊緣部或對準標記之對準攝影機或根據上述對準攝影機之檢測結果調整基板S之位置(例如，基板S之寬度方向之位置)及姿勢(例如，相對於搬送方向之傾斜)之至少一方之調整裝置等。作為基板S之位置測量、速度測量，亦可使用以光學滑鼠之方式將雷射光投射在基板S上，光電檢測在基板S上產生之散斑圖案之變化之方式。 The alignment measuring device 17 measures the edge portion of the substrate S or the alignment mark provided on the substrate S, and performs an alignment operation on the substrate S based on the measurement result. The alignment measuring device 17 has an alignment camera that detects an edge portion or an alignment mark of the substrate S or adjusts a position of the substrate S (for example, a position in the width direction of the substrate S) and a posture according to the detection result of the alignment camera (for example, An adjustment device or the like for at least one of the inclination with respect to the conveyance direction. As the position measurement and the speed measurement of the substrate S, it is also possible to project the laser light onto the substrate S by means of an optical mouse, and to photoelectrically detect the change of the speckle pattern generated on the substrate S.

接著，說明以上述方式構成之基板處理裝置100之動作。圖7~圖12係顯示基板處理裝置100之動作之圖。圖7~圖12中，省略保護基板C、保護基板驅動部48及保護基板驅動部68之圖示。 Next, the operation of the substrate processing apparatus 100 configured as described above will be described. 7 to 12 are views showing the operation of the substrate processing apparatus 100. In FIGS. 7 to 12, illustration of the protective substrate C, the protective substrate driving portion 48, and the protective substrate driving portion 68 is omitted.

首先，說明進行將基板S掛架在搬送機構24中之軸部41a與軸部61a之間之動作之情形。在以後之動作，以控制部CONT對例如基板側通訊部43及基板側通訊部63或移動部側通訊部44及移動部側通訊部64進行通訊以控制各部之情形為例進行說明。 First, the operation of arranging the substrate S between the shaft portion 41a and the shaft portion 61a in the transport mechanism 24 will be described. In the subsequent operation, the control unit CONT communicates with, for example, the board-side communication unit 43 and the board-side communication unit 63, the moving unit side communication unit 44, and the moving unit side communication unit 64 to control the respective units.

首先，第一單元部21使支承在移動部42之第一單元部21、第二單元部22使支承在移動部62之第二單元部22分別在複數個緩衝部BF待機。控制部CONT使一組第一單 元部21及第二單元部22吸附在第一連接部23a與第二連接部23b之間以使第一收容部40與第二收容部60連接。藉此，上述第一單元部21及第二單元部22可一體地移動。 First, the first unit portion 21 causes the first unit portion 21 and the second unit portion 22 supported by the moving portion 42 to stand by the plurality of buffer portions BF in the second unit portion 22 supported by the moving portion 62. Control unit CONT makes a group of first orders The element portion 21 and the second unit portion 22 are attracted between the first connecting portion 23a and the second connecting portion 23b to connect the first housing portion 40 and the second housing portion 60. Thereby, the first unit portion 21 and the second unit portion 22 can be integrally moved.

控制部CONT，首先使第一單元部21與第二單元部22從緩衝部BF往導軌30上一體地移動。之後，控制部CONT，如圖7所示，使上述第一單元部21與第二單元部22沿著導軌30移動，配置在第二軌道33之+Y側端部、亦即第一軌道31。此外，在第一單元部21之軸部41a預先安裝捲軸狀之基板S。在基板S之前端Sf，例如圖7所示之構成中安裝有導頭Lf，但為省略上述導頭Lf之構成亦可。 The control unit CONT first integrally moves the first unit portion 21 and the second unit portion 22 from the buffer portion BF to the guide rail 30. Thereafter, as shown in FIG. 7, the control unit CONT moves the first unit portion 21 and the second unit portion 22 along the guide rail 30, and is disposed on the +Y side end portion of the second rail 33, that is, the first rail 31. . Further, a reel-shaped substrate S is mounted in advance on the shaft portion 41a of the first unit portion 21. The lead Lf is attached to the front end Sf of the substrate S, for example, as shown in Fig. 7, but the configuration of the lead Lf may be omitted.

接著，控制部CONT藉由旋轉驅動部41b使軸部41a旋轉。藉由此動作，基板S之前端Sf往軸部61a側送出，基板S之前端Sf到達軸部61a捲掛在上述軸部61a。此外，將基板S之前端Sf捲掛在軸部61a之操作為自動化亦可，但藉由人力使用固定帶等將前端Sf黏貼在軸部61a亦可。 Next, the control unit CONT rotates the shaft portion 41a by the rotation driving unit 41b. By this operation, the front end Sf of the substrate S is fed toward the shaft portion 61a side, and the front end Sf of the substrate S reaches the shaft portion 61a and is wound around the shaft portion 61a. Further, the operation of winding the front end Sf of the substrate S on the shaft portion 61a may be automated, but the front end Sf may be adhered to the shaft portion 61a by a human using a fixing tape or the like.

控制部CONT，在基板S之前端Sf捲掛在軸部61a後，切斷第一單元部21與第二單元部22之連接。藉此，第一單元部21與第二單元部22可獨立地移動。之後，控制部CONT，使軸部41a旋轉將基板S送出並同時使第二單元部22沿著第三軌道33往-Y軸方向移動。 The control unit CONT cuts off the connection between the first unit portion 21 and the second unit portion 22 after the front end Sf of the substrate S is wound around the shaft portion 61a. Thereby, the first unit portion 21 and the second unit portion 22 are independently movable. Thereafter, the control unit CONT rotates the shaft portion 41a to feed the substrate S while moving the second unit portion 22 in the -Y-axis direction along the third rail 33.

控制部CONT，在第二單元部22到達第三軌道33之-Y軸側端部、亦即第二軌道32為止，使第二單元部22移動。在第二單元部22移動之期間，第一單元部21維持配置在第一軌道31之狀態。藉由此動作，如圖8所示，第一單元 部21配置在第一軌道31，第二單元部22配置在第二軌道32。又，基板S之前端Sf在捲掛在軸部61a之狀態下往-Y軸方向引出。 The control unit CONT moves the second unit unit 22 until the second unit unit 22 reaches the Y-axis side end portion of the third rail 33, that is, the second rail 32. While the second unit portion 22 is moving, the first unit portion 21 is maintained in a state of being disposed on the first rail 31. By this action, as shown in Figure 8, the first unit The portion 21 is disposed on the first rail 31, and the second unit portion 22 is disposed on the second rail 32. Further, the front end Sf of the substrate S is taken out in the -Y-axis direction while being wound around the shaft portion 61a.

之後，控制部CONT使處理裝置15之顯影側導引部13之第一滾筒13b及第二滾筒13c、及洗淨側導引部14之第一滾筒14b及第二滾筒14c往上方(+Z軸方向)預先移動。藉此，在第一滾筒13b及第二滾筒13c與顯影液收容容器11a(亦即，第一墊13a及第二墊13d)之間、第一滾筒14b及第二滾筒14c與洗淨液收容容器12a(亦即，第三墊14a及第四墊14d)之間形成基板S可通過之間隙。 Thereafter, the control unit CONT brings the first roller 13b and the second roller 13c of the developing-side guide portion 13 of the processing device 15 and the first roller 14b and the second roller 14c of the cleaning-side guide portion 14 upward (+Z The axis direction) moves in advance. Thereby, between the first roller 13b and the second roller 13c and the developer storage container 11a (that is, the first pad 13a and the second pad 13d), the first roller 14b and the second roller 14c and the cleaning liquid are accommodated. A gap is formed between the container 12a (i.e., the third pad 14a and the fourth pad 14d) through which the substrate S can pass.

控制部CONT對掛架在軸部41a與軸部61a之間之基板S往Y軸方向賦予適當之張力，以使基板S通過該間隙。基板S之張力能使用例如基板搬送控制部77控制第二單元部22側來調整。 The control unit CONT applies an appropriate tension to the substrate S between the shaft portion 41a and the shaft portion 61a in the Y-axis direction so that the substrate S passes through the gap. The tension of the substrate S can be adjusted by, for example, controlling the second unit portion 22 side by the substrate conveyance control unit 77.

在此狀態下，控制部CONT，如圖9所示，藉由旋轉驅動部41b及旋轉驅動部61b使第一單元部21及第二單元部22同步，分別在第一軌道31上及第二軌道32上往處理裝置15側(+X軸方向)移動。在此狀態下，基板S在Z軸方向分別配置在第一滾筒13b及第二滾筒13c與顯影液收容容器11a之間、第一滾筒14b及第二滾筒14c與洗淨液收容容器12a之間。 In this state, as shown in FIG. 9, the control unit CONT synchronizes the first unit unit 21 and the second unit unit 22 by the rotation driving unit 41b and the rotation driving unit 61b, and is respectively on the first rail 31 and the second unit. The rail 32 moves toward the processing device 15 side (+X axis direction). In this state, the substrate S is disposed between the first roller 13b and the second roller 13c and the developer storage container 11a, and between the first roller 14b and the second roller 14c and the cleaning liquid storage container 12a in the Z-axis direction. .

控制部CONT，首先，使軸部41a及軸部61a旋轉以將基板S往-Y軸方向傳送並同時使顯影側導引部13之第一滾筒13b及第二滾筒13c往-Z軸方向移動。藉此，基板S浸 於顯影液11b，對基板S進行顯影處理。之後，控制部CONT，使軸部41a及軸部61a旋轉以將基板S往-Y軸方向送出。藉由此動作，基板S中之已通過顯影液11b之部分到達洗淨裝置12。 The control unit CONT first rotates the shaft portion 41a and the shaft portion 61a to transport the substrate S in the -Y-axis direction while moving the first roller 13b and the second roller 13c of the developing-side guide portion 13 in the -Z-axis direction. . Thereby, the substrate S dip The substrate S is subjected to development processing in the developer 11b. Thereafter, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to feed the substrate S in the -Y-axis direction. By this action, the portion of the substrate S that has passed through the developing solution 11b reaches the cleaning device 12.

接著，控制部CONT，使軸部41a及軸部61a旋轉以將基板S往-Y軸方向傳送並同時使洗淨側導引部14之第一滾筒14b及第二滾筒14c往-Z軸方向移動。藉此，基板S浸於洗淨液12b，對基板S進行洗淨處理。 Next, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to transport the substrate S in the -Y-axis direction while simultaneously moving the first roller 14b and the second roller 14c of the cleaning-side guide portion 14 in the -Z-axis direction. mobile. Thereby, the substrate S is immersed in the cleaning liquid 12b, and the substrate S is washed.

此時，如圖10所示，在基板S中之搬送方向(-Y軸方向)之上游側施加顯影處理，在搬送方向之下游側施加洗淨處理。之後，控制部CONT使軸部41a及軸部61a旋轉以將基板S往-Y軸方向送出。藉由此動作，基板S中之已通過洗淨液12b之部分從洗淨裝置12往外部送出。 At this time, as shown in FIG. 10, development processing is applied to the upstream side in the conveyance direction (-Y-axis direction) in the substrate S, and the cleaning process is applied to the downstream side in the conveyance direction. Thereafter, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to feed the substrate S in the -Y-axis direction. By this operation, the portion of the substrate S that has passed through the cleaning liquid 12b is sent out from the cleaning device 12 to the outside.

如圖10所示，支承基板S之背面(被處理面Sa之相反側之面)者，在顯影側導引部13為第一墊13a及第二墊13d，在洗淨側導引部14為第一墊14a及第二墊14d，因此藉由形成在此等墊之導引面上之氣體層，能在對背面非接觸之狀態下搬送基板S。 As shown in FIG. 10, the back surface of the support substrate S (the surface on the opposite side to the surface to be processed Sa) is the first pad 13a and the second pad 13d on the development side guide portion 13, and the cleaning side guide portion 14 is provided. Since the first pad 14a and the second pad 14d are formed by the gas layer formed on the guiding faces of the pads, the substrate S can be conveyed without being in contact with the back surface.

控制部CONT依據顯影裝置11及洗淨裝置12之處理速度，調整從軸部41a往軸部61a移動之基板S之移動速度。又，控制部CONT，如圖11所示，依據捲繞於軸部41a之基板S之捲繞徑R1、與捲繞於軸部61a之基板S之捲繞徑R2，調整在旋轉驅動部41b及旋轉驅動部61b之驅動速度。藉由此動作，搬送速度在一定之狀態下搬送基板S。基 板S之速度之監測，亦可藉由圖3之對準測量裝置17測量設在基板S之對準標記之時序(時間)進行。又，藉由基板S之捲繞徑R1、基板S之捲繞徑R2之變化調整升降部53及升降部73亦可。 The control unit CONT adjusts the moving speed of the substrate S moving from the shaft portion 41a to the shaft portion 61a in accordance with the processing speed of the developing device 11 and the cleaning device 12. Further, as shown in FIG. 11, the control unit CONT is adjusted to the rotation drive unit 41b in accordance with the winding diameter R1 of the substrate S wound around the shaft portion 41a and the winding diameter R2 of the substrate S wound around the shaft portion 61a. And the driving speed of the rotation driving portion 61b. By this operation, the substrate S is transported at a constant speed. base The monitoring of the speed of the board S can also be performed by measuring the timing (time) of the alignment marks provided on the substrate S by the alignment measuring device 17 of FIG. Further, the lifting portion 53 and the lifting portion 73 may be adjusted by the winding diameter R1 of the substrate S and the winding diameter R2 of the substrate S.

在顯影處理及洗淨處理結束後，控制部CONT使軸部41a及軸部61a旋轉以將基板S往-Y軸方向傳送並同時使顯影側導引部13之第一滾筒13b及第二滾筒13c往+Z軸方向移動，且使洗淨側導引部14之第一滾筒14b及第二滾筒14c往+Z軸方向移動。 After the development processing and the cleaning processing are completed, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to convey the substrate S in the -Y-axis direction while simultaneously the first roller 13b and the second roller of the development-side guiding portion 13. 13c moves in the +Z-axis direction, and the first roller 14b and the second roller 14c of the cleaning side guide 14 are moved in the +Z-axis direction.

之後，控制部CONT，如圖12所示，藉由移動部42及移動部62之同步控制使第一單元部21及第二單元部22同步，分別沿著第一軌道31及第二軌道32往+X軸方向移動。藉由此動作，成為從處理裝置15往+X軸側退開之狀態。控制部CONT，在第一單元部21及第二單元部22到達第三軌道33為止後，使上述第一單元部21及第二單元部22之移動停止。 Thereafter, as shown in FIG. 12, the control unit CONT synchronizes the first unit unit 21 and the second unit unit 22 by the synchronous control of the moving unit 42 and the moving unit 62, and follows the first track 31 and the second track 32, respectively. Move to the +X axis. By this operation, the processing device 15 is retracted from the +X-axis side. The control unit CONT stops the movement of the first unit portion 21 and the second unit portion 22 after the first unit portion 21 and the second unit portion 22 reach the third rail 33.

控制部CONT，在使第一單元部21及第二單元部22之移動停止後，使軸部61a旋轉並同時使第二單元部22往+Y軸方向移動。藉由此動作，軸部61a捲繞基板S同時軸部41a與軸部61a再次接近，第一單元部21之第一連接部23a與第二單元部22之第二連接部23b抵接。之後，控制部CONT，使電磁石啟動以吸附第一連接部23a與第二連接部23b。藉此，第一收容部40與第二收容部60再次連接，第一單元部21與第二單元部22一體化。之後，控制部CONT 使一體化狀態之第一單元部21及第二單元部22沿著第一軌道31、第二軌道32及第三軌道33適當移動。在以上之動作，控制部CONT，以第一單元部21及第二單元部22彼此不會碰撞、混雜之方式，使用位置檢測部55及位置檢測部(第一檢測部)75所檢測之位置資訊適當地整理第一單元部21及第二單元部22之配置。 After stopping the movement of the first unit portion 21 and the second unit portion 22, the control unit CONT rotates the shaft portion 61a and simultaneously moves the second unit portion 22 in the +Y-axis direction. By this operation, the shaft portion 61a is wound around the substrate S, and the shaft portion 41a and the shaft portion 61a are brought close to each other, and the first connection portion 23a of the first unit portion 21 abuts against the second connection portion 23b of the second unit portion 22. Thereafter, the control unit CONT activates the electromagnet to adsorb the first connecting portion 23a and the second connecting portion 23b. Thereby, the first housing portion 40 and the second housing portion 60 are connected again, and the first unit portion 21 and the second unit portion 22 are integrated. After that, the control unit CONT The first unit portion 21 and the second unit portion 22 in an integrated state are appropriately moved along the first rail 31, the second rail 32, and the third rail 33. In the above operation, the control unit CONT uses the position detected by the position detecting unit 55 and the position detecting unit (first detecting unit) 75 so that the first unit portion 21 and the second unit portion 22 do not collide and mix with each other. The information appropriately arranges the arrangement of the first unit portion 21 and the second unit portion 22.

如上述，本實施形態之匣裝置，具備具有進行具有可撓性之基板S之供應之基板驅動部41之第一單元部21、及具有在與上述第一單元部21之間設成可裝卸且在與基板驅動部41之間進行基板S之回收之基板驅動部61之第二單元部22，因此在上述第一單元部21與第二單元部22之間完成基板S之供應及回收。藉此，可抑制從送出至捲繞為止掛架之基板S之尺寸變長，因此可降低搬送時之基板S之管理負擔。 As described above, the crucible device of the present embodiment includes the first unit portion 21 having the substrate driving portion 41 for supplying the flexible substrate S, and has a detachable connection with the first unit portion 21 Further, since the second unit portion 22 of the substrate driving portion 61 that recovers the substrate S is performed between the substrate driving portion 41, the supply and recovery of the substrate S are completed between the first unit portion 21 and the second unit portion 22. Thereby, the size of the substrate S from the feeding to the winding can be suppressed from becoming long, and the management load of the substrate S at the time of conveyance can be reduced.

(第二實施形態) (Second embodiment)

接著，說明第二實施形態。 Next, a second embodiment will be described.

圖13係以示意方式顯示本實施形態之基板處理裝置200之構成之圖。 Fig. 13 is a view schematically showing the configuration of the substrate processing apparatus 200 of the present embodiment.

如圖13所示，本實施形態中，基板處理裝置200在Z軸方向形成為複數個階層(圖13中為3階層)。基板處理裝置200在各階具有處理部10及匣裝置20。又，在各階之地面FL1、地面FL2及地面FL3分別沿著處理部10形成有導軌30。 As shown in FIG. 13, in the present embodiment, the substrate processing apparatus 200 is formed in a plurality of levels (three levels in FIG. 13) in the Z-axis direction. The substrate processing apparatus 200 has the processing unit 10 and the cymbal apparatus 20 at each stage. Further, the guide rails 30 are formed along the treatment portion 10 on the floor FL1, the floor surface FL2, and the floor surface FL3 of each step.

匣裝置20具有與上述實施形態相同之構成。亦即，第 一單元部21與筐體51之間係設成可裝卸。又，第二單元部22與筐體71之間係設成可裝卸。又，第一單元部21與第二單元部22之間係設成可裝卸。 The crucible device 20 has the same configuration as that of the above embodiment. That is, the first A unit portion 21 and the casing 51 are detachably coupled to each other. Further, the second unit portion 22 and the casing 71 are detachably coupled to each other. Further, the first unit portion 21 and the second unit portion 22 are detachably coupled to each other.

圖14係顯示基板處理裝置200之構成之剖面圖。 FIG. 14 is a cross-sectional view showing the configuration of the substrate processing apparatus 200.

如圖14所示，基板處理裝置200具有三個處理室111~113。處理室111~113係藉由分隔部114分隔。分隔部114具備構成處理室111之地面FL1之分隔構件114a、構成處理室111之頂部及處理室112之地面FL2之分隔構件114b、構成處理室112之頂部及處理室113之地面FL3之分隔構件114c、構成處理室113之頂部之分隔構件114d。 As shown in FIG. 14, the substrate processing apparatus 200 has three processing chambers 111 to 113. The processing chambers 111 to 113 are separated by a partition portion 114. The partition portion 114 includes a partition member 114a constituting the floor surface FL1 of the processing chamber 111, a partition member 114b constituting the top of the processing chamber 111 and the floor surface FL2 of the processing chamber 112, a partition member constituting the top of the processing chamber 112 and the floor FL3 of the processing chamber 113. 114c, a partition member 114d constituting the top of the processing chamber 113.

處理室111，在複數個處理室中，配置在重力方向之最下部(最靠-Z軸側)。處理室111，形成對基板S進行使用液體之處理(濕式處理)之處理空間。在處理室111，例如圖14所示，作為處理裝置110，設有具備收容用以塗布基板S之光阻液之光阻液收容容器141a之塗布裝置141、具備收容用以對基板S進行顯影處理之顯影液之顯影液收容容器142a之顯影裝置142、具備收容用以洗淨基板S之洗淨液之洗淨液收容容器143a之洗淨裝置143、具備收容用以對洗淨處理後之基板S形成圖案之鍍金液之鍍金液收容容器144a之鍍金裝置144。此外，在處理室111可收容進行使用上述液體以外之處理之裝置。 The processing chamber 111 is disposed at the lowermost portion in the gravity direction (most on the -Z-axis side) in the plurality of processing chambers. The processing chamber 111 forms a processing space for performing processing (wet processing) using the liquid on the substrate S. In the processing chamber 111, as shown in FIG. 14, for example, a processing device 110 is provided with a coating device 141 including a photoresist liquid storage container 141a for applying a photoresist liquid for the substrate S, and a housing device 141 for housing the substrate S. The developing device 142 of the developing solution storage container 142a of the developer for processing, and the cleaning device 143 including the cleaning liquid storage container 143a for storing the cleaning liquid for cleaning the substrate S, and the storage device 143 for storing the cleaning solution The substrate S forms a gold plating device 144 of the gold plating liquid storage container 144a of the gold plating liquid of the pattern. Further, the processing chamber 111 can accommodate a device that performs processing other than the above liquid.

在分隔構件114a設有構成連接於未圖示之回收裝置之廢液回收流路之一部分之複數個回收管145。回收管145之一端部連接於塗布裝置141、顯影裝置142及洗淨裝置143 之各個，另一端部連接於回收裝置所連接之未圖示之廢液回收流路。各回收管145將在塗布裝置141、顯影裝置142及洗淨裝置143成為廢液之光阻液、顯影液及洗淨液透過廢液回收流路排出至回收裝置。在回收管145設有未圖示之開閉閥等。控制部CONT可控制上述開閉閥之開閉之時序。本實施形態中，由於在重力方向之最下部之處理室111設有濕式處理用之裝置，因此可抑制此等裝置與回收裝置之間之廢液回收流路之流路系之長度。 The partition member 114a is provided with a plurality of recovery pipes 145 constituting one of the waste liquid recovery flow paths connected to the recovery device (not shown). One end of the recovery tube 145 is connected to the coating device 141, the developing device 142, and the cleaning device 143. Each of the other ends is connected to a waste liquid recovery flow path (not shown) to which the recovery device is connected. Each of the recovery tubes 145 discharges the photoresist liquid, the developer solution, and the cleaning liquid which are the waste liquid in the coating device 141, the developing device 142, and the cleaning device 143 through the waste liquid recovery flow path to the recovery device. An opening/closing valve or the like (not shown) is provided in the recovery pipe 145. The control unit CONT can control the timing of opening and closing of the above-described opening and closing valve. In the present embodiment, since the processing chamber 111 at the lowermost portion in the gravity direction is provided with the apparatus for wet processing, the length of the flow path of the waste liquid recovery flow path between the apparatus and the recovery apparatus can be suppressed.

處理室112係配置在處理室111之上方(+Z軸側)。處理室112，形成對基板S進行加熱處理之處理空間。在處理室112，作為處理裝置110，設有加熱基板S之加熱裝置151~153。加熱裝置151加熱藉由塗布裝置141塗布有光阻液之基板S，使光阻液乾燥。加熱裝置152再次加熱已通過處理室113之曝光裝置EX之基板S，使光阻液乾燥。加熱裝置152以與加熱裝置151之加熱溫度不同溫度、例如較加熱裝置151之加熱溫度高之溫度加熱基板S。加熱裝置153加熱藉由顯影裝置142進行顯影處理且藉由洗淨裝置143洗淨後之基板S，使基板S之表面乾燥。加熱裝置151~153具有在內部使基板S折返複數次之構成。在加熱裝置151~153之內部，基板S以彼此不接觸之方式在重疊折返之狀態下被搬送。因此，可維持基板S之被處理面Sa之狀態並同時將基板S高效率地收容在加熱裝置151~153。 The processing chamber 112 is disposed above the processing chamber 111 (+Z-axis side). The processing chamber 112 forms a processing space for heat-treating the substrate S. In the processing chamber 112, as the processing device 110, heating devices 151 to 153 for heating the substrate S are provided. The heating device 151 heats the substrate S coated with the photoresist by the coating device 141 to dry the photoresist. The heating device 152 heats the substrate S that has passed through the exposure device EX of the processing chamber 113 again to dry the photoresist. The heating device 152 heats the substrate S at a temperature different from the heating temperature of the heating device 151, for example, higher than the heating temperature of the heating device 151. The heating device 153 heats the substrate S which has been subjected to development processing by the developing device 142 and is cleaned by the cleaning device 143 to dry the surface of the substrate S. The heating devices 151 to 153 have a configuration in which the substrate S is folded back a plurality of times. Inside the heating devices 151 to 153, the substrates S are conveyed in a state of being folded back without being in contact with each other. Therefore, the state of the processed surface Sa of the substrate S can be maintained while the substrate S can be efficiently accommodated in the heating devices 151 to 153.

處理室113係配置在處理室112之上方(+Z軸側)。處理室113，係對基板S進行曝光處理之處理空間。在處理室 113，作為處理裝置110，設有曝光裝置EX。曝光裝置EX透過光罩之圖案對在塗布裝置141塗布於基板S之光阻層照射曝光用光。 The processing chamber 113 is disposed above the processing chamber 112 (+Z-axis side). The processing chamber 113 is a processing space for performing exposure processing on the substrate S. In the processing room 113. As the processing device 110, an exposure device EX is provided. The exposure device EX transmits the exposure light to the photoresist layer applied to the substrate S by the coating device 141 through the pattern of the photomask.

在上述構成之基板處理裝置200設有複數個升起部160(161~166)。升起部160在不同階之間搬送第一單元部21及第二單元部22。例如，升起部161、升起部164、升起部165及升起部166在第一階與第二階之間搬送第一單元部21及第二單元部22。又，例如升起部162及升起部163在第二階與第三階之間搬送第一單元部21及第二單元部22。 The substrate processing apparatus 200 having the above configuration is provided with a plurality of raised portions 160 (161 to 166). The raised portion 160 transports the first unit portion 21 and the second unit portion 22 between different stages. For example, the raised portion 161, the raised portion 164, the raised portion 165, and the raised portion 166 transport the first unit portion 21 and the second unit portion 22 between the first stage and the second stage. Further, for example, the raised portion 162 and the raised portion 163 transport the first unit portion 21 and the second unit portion 22 between the second stage and the third stage.

各升起部160分別具有在Z軸方向貫通分隔構件114b及分隔構件114c之升降機構160a。 Each of the raised portions 160 has an elevating mechanism 160a that penetrates the partition member 114b and the partition member 114c in the Z-axis direction.

圖15係顯示升起部160之概略構成之立體圖。 FIG. 15 is a perspective view showing a schematic configuration of the raised portion 160.

如圖15所示，升降機構160a連接於第一單元部21之外部連接部40d或第二單元部22之連接部60d。升降機構160a具有使第一單元部21及第二單元部22往Z軸方向移動之未圖示之移動機構。升降機構160a能使一體化狀態之第一單元部21及第二單元部22往Z軸方向移動。 As shown in FIG. 15, the elevating mechanism 160a is connected to the outer connecting portion 40d of the first unit portion 21 or the connecting portion 60d of the second unit portion 22. The elevating mechanism 160a has a moving mechanism (not shown) that moves the first unit portion 21 and the second unit portion 22 in the Z-axis direction. The elevating mechanism 160a can move the first unit portion 21 and the second unit portion 22 in an integrated state in the Z-axis direction.

又，升起部160具有使已跨階搬送之第一單元部21及第二單元部22分別安裝在設在搬送對象之階之移動部42及移動部62之筐體51及71之安裝部(未圖示)。藉此，收容於第一單元部21及第二單元部22之基板S可跨階移動。 Further, the raised portion 160 has a first unit portion 21 and a second unit portion 22 that have been transported in a stepped manner, and are attached to the mounting portions of the housings 51 and 71 of the moving portion 42 and the moving portion 62 provided in the step of transporting the steps. (not shown). Thereby, the substrate S accommodated in the first unit portion 21 and the second unit portion 22 can be moved in an order.

接著，說明上述基板處理裝置200之動作。 Next, the operation of the substrate processing apparatus 200 will be described.

控制部CONT，將第一單元部21及第二單元部22從既 定入口搬入處理室111，沿著導軌30往塗布裝置141移動。控制部CONT，在塗布裝置141，藉由與上述第一實施形態相同之動作，將第一單元部21配置在塗布裝置141之+Y側，將第二單元部22配置在塗布裝置141之-Y側。在此狀態下，控制部CONT，將基板S從第一單元部21往第二單元部22搬送，並同時對基板S之被處理面進行感光劑之塗布處理。 The control unit CONT takes the first unit portion 21 and the second unit portion 22 from The inlet is moved into the processing chamber 111 and moved along the guide rail 30 toward the coating device 141. In the control unit CONT, the first unit portion 21 is disposed on the +Y side of the coating device 141 and the second unit portion 22 is disposed in the coating device 141 by the operation similar to that of the first embodiment described above. Y side. In this state, the control unit CONT transports the substrate S from the first unit portion 21 to the second unit portion 22, and simultaneously applies a photosensitive agent coating treatment to the surface to be processed of the substrate S.

在塗布裝置141進行處理後，控制部CONT，使第一單元部21及第二單元部22一體化，往升起部161移動。第一單元部21及第二單元部22到達升起部161之後，控制部CONT，在使第一單元部21與第二單元部22連接之狀態下，例如使第二單元部22之連接部60d連接於升起部161之升降機構160a。之後，控制部CONT，在使用升降機構160a使第一單元部21及第二單元部22一體化之狀態下，往+Z軸方向搬送。藉由此動作，解除第一單元部21與筐體51之間、第二單元部22與筐體71之間之安裝狀態，第一單元部21及第二單元部22從筐體51及筐體71分離，往+Z軸方向移動，從處理室111往處理室112搬送。 After the coating device 141 performs the process, the control unit CONT integrates the first unit portion 21 and the second unit portion 22 and moves to the raised portion 161. After the first unit portion 21 and the second unit portion 22 reach the raised portion 161, the control portion CONT connects the first unit portion 21 and the second unit portion 22, for example, the connection portion of the second unit portion 22 60d is connected to the lifting mechanism 160a of the raised portion 161. After that, the control unit CONT conveys the first unit portion 21 and the second unit portion 22 in the +Z-axis direction while being integrated by the elevating mechanism 160a. By this operation, the mounting state between the first unit portion 21 and the casing 51 and between the second unit portion 22 and the casing 71 is released, and the first unit portion 21 and the second unit portion 22 are separated from the casing 51 and the basket. The body 71 is separated and moved in the +Z-axis direction, and is transported from the processing chamber 111 to the processing chamber 112.

控制部CONT，使配置在處理室112之移動部42及移動部62預先待機在升起部161之附近。控制部CONT，使用未圖示之安裝部使搬送至處理室112之第一單元部21及第二單元部22分別安裝在上述移動部42及移動部62。 The control unit CONT causes the moving unit 42 and the moving unit 62 disposed in the processing chamber 112 to stand by in the vicinity of the raised portion 161 in advance. The control unit CONT attaches the first unit unit 21 and the second unit unit 22 that are transported to the processing chamber 112 to the moving unit 42 and the moving unit 62, respectively, using an attachment unit (not shown).

之後，控制部CONT使用第一單元部21及第二單元部22將基板S搬入加熱裝置151，對基板S進行加熱處理。 在加熱裝置151，在基板S例如彎折複數次之狀態下搬送基板S，在此搬送狀態下進行基板S之加熱。因此，可進行有效率地利用空間之加熱處理。在加熱裝置151，藉由加熱使形成在基板S之塗布膜乾燥。 Thereafter, the control unit CONT carries the substrate S into the heating device 151 using the first unit portion 21 and the second unit portion 22, and heats the substrate S. In the heating device 151, the substrate S is conveyed in a state in which the substrate S is bent, for example, a plurality of times, and the substrate S is heated in this transport state. Therefore, heat treatment using space efficiently can be performed. In the heating device 151, the coating film formed on the substrate S is dried by heating.

在進行加熱處理後，控制部CONT，藉由上述相同之動作，透過升起部162將第一單元部21及第二單元部22搬送至處理室113。控制部CONT，在處理室113，將第一單元部21及第二單元部22搬入曝光裝置EX，對塗布在基板S之感光劑進行曝光處理。 After the heat treatment, the control unit CONT transfers the first unit portion 21 and the second unit portion 22 to the processing chamber 113 through the raising portion 162 by the same operation as described above. The control unit CONT carries the first unit portion 21 and the second unit portion 22 into the exposure device EX in the processing chamber 113, and exposes the photosensitive agent applied to the substrate S.

在進行曝光處理後，控制部CONT，透過升起部163將第一單元部21及第二單元部22搬送至處理室112。控制部CONT，在處理室112，將第一單元部21及第二單元部22搬入加熱裝置152，對基板S進行加熱處理。在加熱裝置152，進行對感光後之塗布膜之加熱處理。 After the exposure processing, the control unit CONT transfers the first unit portion 21 and the second unit portion 22 to the processing chamber 112 through the raising portion 163. The control unit CONT carries the first unit portion 21 and the second unit portion 22 into the heating device 152 in the processing chamber 112, and heats the substrate S. In the heating device 152, heat treatment of the photosensitive coating film is performed.

在進行加熱處理後，控制部CONT，透過升起部164將第一單元部21及第二單元部22搬送至處理室111。控制部CONT，在處理室111，將第一單元部21及第二單元部22搬入顯影裝置142，對基板S進行顯影處理。在顯影裝置142，基板S浸於顯影液並同時從第一單元部21往第二單元部22搬送，在搬送之過程進行顯影處理。 After the heat treatment, the control unit CONT transfers the first unit portion 21 and the second unit portion 22 to the processing chamber 111 through the raising portion 164. The control unit CONT carries the first unit portion 21 and the second unit portion 22 into the developing device 142 in the processing chamber 111, and performs development processing on the substrate S. In the developing device 142, the substrate S is immersed in the developing solution and simultaneously transported from the first unit portion 21 to the second unit portion 22, and development processing is performed during the transfer.

在進行顯影處理後，控制部CONT，使第一單元部21及第二單元部22在一體化之狀態下往洗淨裝置143移動，將基板S搬入洗淨裝置143。在洗淨裝置143，基板S浸於洗淨液並同時從第一單元部21往第二單元部22搬送，在 搬送之過程進行洗淨處理。 After the development processing, the control unit CONT moves the first unit portion 21 and the second unit portion 22 to the cleaning device 143 in an integrated state, and carries the substrate S into the cleaning device 143. In the cleaning device 143, the substrate S is immersed in the cleaning liquid and simultaneously transported from the first unit portion 21 to the second unit portion 22, The process of transportation is washed.

在進行洗淨處理後，控制部CONT，透過升起部165將第一單元部21及第二單元部22搬送至處理室112。控制部CONT，在處理室112，將第一單元部21及第二單元部22搬入加熱裝置153，對基板S進行加熱處理。在加熱裝置153，進行用以使洗淨後之基板S乾燥之加熱處理或用以加熱塗布膜之加熱處理等。 After the cleaning process, the control unit CONT transfers the first unit portion 21 and the second unit portion 22 to the processing chamber 112 through the raising portion 165. The control unit CONT carries the first unit portion 21 and the second unit portion 22 into the heating device 153 in the processing chamber 112, and heats the substrate S. The heating device 153 performs heat treatment for drying the washed substrate S or heat treatment for heating the coating film.

在進行加熱處理後，控制部CONT，透過升起部166將第一單元部21及第二單元部22搬送至處理室111。控制部CONT，在處理室111，使第一單元部21及第二單元部22移動至鍍金裝置144，將基板S搬入鍍金裝置144。在鍍金裝置144，基板S浸於鍍金液並同時從第一單元部21往第二單元部22搬送，在搬送之過程進行鍍金處理。在進行鍍金處理後之基板S形成既定圖案。 After the heat treatment, the control unit CONT transfers the first unit portion 21 and the second unit portion 22 to the processing chamber 111 through the raising portion 166. The control unit CONT moves the first unit portion 21 and the second unit portion 22 to the gold plating device 144 in the processing chamber 111, and carries the substrate S into the gold plating device 144. In the gold plating apparatus 144, the substrate S is immersed in the gold plating liquid and simultaneously transported from the first unit portion 21 to the second unit portion 22, and gold plating is performed during the transfer. The substrate S after the gold plating treatment is formed into a predetermined pattern.

在進行鍍金處理後，控制部CONT，透過升起部166將第一單元部21及第二單元部22搬送至處理室112。控制部CONT，在處理室112，將第一單元部21及第二單元部22搬入未圖示之加熱裝置，進行加熱處理。 After the gold plating process, the control unit CONT transfers the first unit portion 21 and the second unit portion 22 to the processing chamber 112 through the raising portion 166. The control unit CONT carries the first unit portion 21 and the second unit portion 22 into a heating device (not shown) in the processing chamber 112, and performs heat treatment.

如上述，本實施形態之基板處理裝置200，在例如處理室111，在第一軌道31與第二軌道32之間，作為處理裝置110設有彼此進行不同處理之塗布裝置141、顯影裝置142、洗淨裝置143及鍍金裝置144，在此等各裝置(塗布裝置141、顯影裝置142、洗淨裝置143及鍍金裝置144)之間，使第一單元部21及第二單元部22移動，同時第一單元部 21對各裝置供應基板S，第二單元部22回收基板S，因此可在複數個處理裝置110進行單晶圓處理。 As described above, in the substrate processing apparatus 200 of the present embodiment, for example, between the first rail 31 and the second rail 32, the processing apparatus 110 is provided with the coating apparatus 141 and the developing apparatus 142 which perform different processing from each other, for example. The cleaning device 143 and the gold plating device 144 move the first unit portion 21 and the second unit portion 22 between the respective devices (the coating device 141, the developing device 142, the cleaning device 143, and the gold plating device 144). First unit Since the substrate S is supplied to each of the devices 21 and the substrate S is recovered by the second unit portion 22, the single processing can be performed in the plurality of processing devices 110.

藉此，可抑制從送出至捲繞為止掛架之基板S之尺寸變長，因此能減輕搬送時基板S之管理負擔。又，即使在一個生產線包含處理速度不同之複數個處理裝置110之情形，亦無須在生產線整體使處理速度一致，因此可有效率地利用各處理裝置110。再者，在具有複數個階層之基板處理裝置200，能將第一單元部21及第二單元部22從移動部42及移動部62分割並在不同階層之間搬送，因此能進行有效率之搬送。 Thereby, it is possible to suppress the size of the substrate S from the feeding to the winding up to be long, and it is possible to reduce the management load of the substrate S during transportation. Further, even in the case where one production line includes a plurality of processing apparatuses 110 having different processing speeds, it is not necessary to make the processing speeds uniform in the entire production line, so that each processing apparatus 110 can be utilized efficiently. Further, in the substrate processing apparatus 200 having a plurality of levels, the first unit portion 21 and the second unit portion 22 can be divided from the moving unit 42 and the moving unit 62 and transported between different levels, so that efficient operation can be performed. Transfer.

本發明之技術範圍並不限於上述實施形態，在不脫離本發明趣旨之範圍內可施加適當變更。 The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the scope of the present invention.

例如，上述實施形態中，以第一單元部21及第二單元部22之間設成可裝卸之構成為例進行說明，但並不限於此。 For example, in the above-described embodiment, the configuration in which the first unit portion 21 and the second unit portion 22 are detachably provided is described as an example, but the invention is not limited thereto.

例如，為第一單元部21及第二單元部22彼此未安裝而僅進行接近及分離之構成亦可。又，並非第一單元部21與第二單元部22安裝，而是支承第一單元部21之移動部42與支承第二單元部22之移動部62可裝卸之構成亦可。 For example, the first unit portion 21 and the second unit portion 22 may be configured to be close to and separated from each other without being attached to each other. Further, the first unit portion 21 and the second unit portion 22 are not attached, but the moving portion 42 that supports the first unit portion 21 and the moving portion 62 that supports the second unit portion 22 may be detachably attached.

又，例如，上述實施形態中，以第一單元部21為基板S供應用、第二單元部22為基板S回收用為例進行說明，但並不限於此。例如，以第一單元部21為基板S回收用、第二單元部22為基板S供應用亦可。又，使第一單元部21及第二單元部22為相同構成，在導軌30上使第一單元部21與第二單元部22彼此替換，適當地切換供應動作與回收 動作並同時進行基板S之搬送亦可。 Further, for example, in the above-described embodiment, the first unit portion 21 is supplied as the substrate S, and the second unit portion 22 is used as the substrate S for collection. However, the present invention is not limited thereto. For example, the first unit portion 21 may be used for the substrate S recovery, and the second unit portion 22 may be used for the substrate S. Further, the first unit portion 21 and the second unit portion 22 have the same configuration, and the first unit portion 21 and the second unit portion 22 are replaced with each other on the guide rail 30, and the supply operation and recovery are appropriately switched. It is also possible to carry out the transfer of the substrate S at the same time.

又，上述第二實施形態中，以基板處理裝置具有複數個階層之構成為例進行說明，但並不限於此。例如，如圖16所示，在Y軸方向配置有複數個生產線之構成亦可。此情形，作為處理部10之構成，在Y軸方向配置進行相同種類之處理之裝置之構成亦可。 Further, in the second embodiment described above, the configuration in which the substrate processing apparatus has a plurality of levels is described as an example, but the invention is not limited thereto. For example, as shown in FIG. 16, a configuration in which a plurality of production lines are arranged in the Y-axis direction may be employed. In this case, as the configuration of the processing unit 10, a configuration of a device that performs the same type of processing in the Y-axis direction may be employed.

又，上述實施形態中，以在基部51b及基部71b之-Z軸側之端面51d及71d設有位置檢測部55及75之構成為例進行說明，但並不限於此。例如，如圖17所示，設有接觸於導軌30之端子(電力取得部)56及76之構成亦可。此情形，使電源預先連接於導軌30，藉此可透過端子56及76取得電力。 In the above-described embodiment, the configuration in which the position detecting portions 55 and 75 are provided on the end faces 51d and 71d on the -Z-axis side of the base portion 51b and the base portion 71b will be described as an example. However, the present invention is not limited thereto. For example, as shown in FIG. 17, the terminals (power acquisition units) 56 and 76 that are in contact with the guide rails 30 may be provided. In this case, the power source is previously connected to the guide rail 30, whereby power can be obtained through the terminals 56 and 76.

又，例如，上述實施形態中，以第一單元部21及第二單元部22單方向通過處理部10而移動之情形為例進行說明，但並不限於此。 Further, for example, in the above-described embodiment, the case where the first unit portion 21 and the second unit portion 22 are moved in one direction by the processing unit 10 will be described as an example, but the invention is not limited thereto.

圖18(a)~圖18(c)係顯示第一單元部21及第二單元部22之移動動作之一例之圖。 18(a) to 18(c) are views showing an example of the movement operation of the first unit portion 21 and the second unit portion 22.

例如，控制部CONT，如圖18(a)所示，將第一單元部21與第二單元部22拉離以引出基板S，如圖18(b)所示，使第一單元部21及第二單元部22沿著+X軸方向搬入處理部10並進行處理。之後，如圖18(c)所示，使第一單元部21及第二單元部22沿著-X軸方向返回移動亦可。藉此，處理部10之構成上，即使有基板S不易通過X軸方向之情形，亦可有效率地搬送基板S。 For example, as shown in FIG. 18(a), the control unit CONT pulls off the first unit portion 21 and the second unit portion 22 to take out the substrate S, and as shown in FIG. 18(b), the first unit portion 21 and The second unit portion 22 is carried into the processing unit 10 in the +X-axis direction and processed. Thereafter, as shown in FIG. 18(c), the first unit portion 21 and the second unit portion 22 may be moved back in the -X-axis direction. Thereby, in the configuration of the processing unit 10, even if the substrate S is less likely to pass through the X-axis direction, the substrate S can be efficiently transported.

又，上述實施形態中，以在第一導軌31側配置第一單元部21及第二單元部22之後、使第二單元部22往第二導軌32側移動以引出基板S之情形為例進行說明，但並不限於此。例如，使第一單元部21從第二導軌32側往第一導軌31側移動，藉此引出基板S亦可。 Further, in the above-described embodiment, the first unit portion 21 and the second unit portion 22 are disposed on the first rail 31 side, and the second unit portion 22 is moved toward the second rail 32 side to take out the substrate S. Description, but not limited to this. For example, the first unit portion 21 is moved from the second rail 32 side toward the first rail 31 side, whereby the substrate S may be taken out.

又，如圖19(a)所示，將第一單元部21及第二單元部22配置在第三軌道33之Y軸方向之中央部，之後，如圖19(b)所示，藉由使第一單元部21往+Y軸方向移動且第二單元部22往-Y軸方向移動，藉此引出基板S亦可。 Further, as shown in FIG. 19(a), the first unit portion 21 and the second unit portion 22 are disposed at the central portion of the third rail 33 in the Y-axis direction, and then, as shown in FIG. 19(b), The first unit portion 21 is moved in the +Y-axis direction and the second unit portion 22 is moved in the -Y-axis direction, whereby the substrate S may be taken out.

又，上述實施形態中，以第一單元部21及第二單元部22在Y軸方向排列之狀態下往X軸方向移動之情形為例進行說明，但並不限於此。例如，使第一單元部21及第二單元部22在X軸方向排列之狀態下往Y軸方向移動亦可。 In the above-described embodiment, the case where the first unit portion 21 and the second unit portion 22 are moved in the X-axis direction while being aligned in the Y-axis direction will be described as an example, but the invention is not limited thereto. For example, the first unit portion 21 and the second unit portion 22 may be moved in the Y-axis direction while being aligned in the X-axis direction.

例如，如圖20(a)所示，在X軸方向夾著處理部10之二個第三軌道33與第二軌道32之交叉點分別配置第一單元部21與第二單元部22。此時，設基板S為引出之狀態。之後，如圖20(b)所示，使第一單元部21及第二單元部22往+Y軸方向移動，藉此將基板S搬入處理部10。藉此，處理部10之構成上，即使有基板S不易在X軸方向搬入之情形，亦可有效率地搬送基板S。 For example, as shown in FIG. 20(a), the first unit portion 21 and the second unit portion 22 are disposed at intersections of the two third rails 33 and the second rail 32 sandwiching the processing unit 10 in the X-axis direction. At this time, it is assumed that the substrate S is in a state of being drawn. Thereafter, as shown in FIG. 20(b), the first unit portion 21 and the second unit portion 22 are moved in the +Y-axis direction, whereby the substrate S is carried into the processing portion 10. Thereby, in the configuration of the processing unit 10, even if the substrate S is less likely to be carried in the X-axis direction, the substrate S can be efficiently transported.

又，上述實施形態中，作為連接部23之構成，以第一連接部23a與第二連接部23b之間被電磁石吸附之構成為例進行說明，但並不限於此，為機械性鎖固以連接之構成亦可。 Further, in the above-described embodiment, the configuration of the connecting portion 23 is described by taking the configuration in which the first connecting portion 23a and the second connecting portion 23b are adsorbed by the electromagnet. However, the present invention is not limited thereto, and is mechanically locked. The composition of the connection is also possible.

又，上述實施形態中，針對驅動基板S之軸部41a及軸部61a或驅動保護基板C之軸部48a及軸部68a，以例如中心軸之軸線方向配置成與X軸方向平行、基板S或保護基板C與XY平面平行地搬送之構成為例進行說明，但並不限於此。例如，針對軸部41a及軸部61a或軸部48a及軸部68a，為中心軸之軸線方向配置成與Z軸方向平行、基板S或保護基板C與YZ平面或ZX平面平行地搬送之構成亦可。 In the above-described embodiment, the shaft portion 41a and the shaft portion 61a of the drive substrate S or the shaft portion 48a and the shaft portion 68a of the drive protection substrate C are arranged in the axial direction of the central axis, for example, in parallel with the X-axis direction, and the substrate S The configuration in which the protective substrate C is transported in parallel with the XY plane will be described as an example, but the invention is not limited thereto. For example, the shaft portion 41a and the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a are arranged in the axial direction of the central axis so as to be parallel to the Z-axis direction, and the substrate S or the protective substrate C is transported in parallel with the YZ plane or the ZX plane. Also.

又，上述實施形態中，以移動部42及移動部62之筐體51及71在Z軸方向升降而可調整軸部41a、軸部61a、軸部48a及軸部68a之Z軸方向之位置之形態為例進行說明，但並不限於此。例如，為軸部41a、軸部61a、軸部48a及軸部68a可在Z軸方向升降之構成亦可。 Further, in the above-described embodiment, the positions of the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a in the Z-axis direction can be adjusted by moving up and down the housings 51 and 71 of the moving portion 42 and the moving portion 62 in the Z-axis direction. The form is described as an example, but is not limited thereto. For example, the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a may be configured to be movable up and down in the Z-axis direction.

又，可使用與上述實施形態不同構成之基板S。 Further, the substrate S having a configuration different from that of the above embodiment can be used.

圖21係顯示基板S之構成之圖。 Fig. 21 is a view showing the configuration of the substrate S.

如圖21所示，為形成有保護層90之構成亦可，該保護層90包圍基板S之被處理面Sa中之例如形成配線或電極、元件等之圖案形成區域P。 As shown in FIG. 21, in order to form the protective layer 90, the protective layer 90 surrounds the pattern forming region P in which the wiring, the electrode, the element, and the like are formed, for example, in the processed surface Sa of the substrate S.

上述保護層90形成為層厚大於圖案形成區域P。藉由此構成，即使保護基板C重疊於被處理面Sa之情形，亦可防止保護基板C接觸圖案形成區域P。此外，保護層90形成在保護基板C側亦可。 The protective layer 90 is formed to have a layer thickness larger than the pattern formation region P. With this configuration, even if the protective substrate C is superposed on the surface to be processed Sa, the protective substrate C can be prevented from contacting the pattern forming region P. Further, the protective layer 90 may be formed on the side of the protective substrate C.

圖22~圖27係顯示基板搬送裝置之另一實施形態之立體圖。如上述圖2、圖3所說明，可搭載第一單元部21且 自走之移動部42可藉由腳輪52之旋轉往X軸方向、Y軸方向及θ Z軸方向移動。此點在可搭載第二單元部22且自走之移動部62亦相同。因此，如上述圖18~圖20所示，對在X軸方向延伸之第一軌道31與第二軌道32、在Y軸方向延伸之第三軌道33所構成之搬送導引機構，如圖22所示，鋪設作為附加搬送導引部之環狀軌道34a,35a。 22 to 27 are perspective views showing another embodiment of the substrate transfer device. As described above with reference to FIGS. 2 and 3, the first unit portion 21 can be mounted and The self-propelled moving portion 42 is movable in the X-axis direction, the Y-axis direction, and the θ Z-axis direction by the rotation of the caster 52. This point is also the same in the moving portion 62 in which the second unit portion 22 can be mounted and self-propelled. Therefore, as shown in FIGS. 18 to 20, the transport guide mechanism including the first rail 31 and the second rail 32 extending in the X-axis direction and the third rail 33 extending in the Y-axis direction is as shown in FIG. As shown, the annular rails 34a, 35a as the additional transport guides are laid.

環狀軌道34a係鋪設成從第一軌道31與第三軌道33交叉之中心點TC1起一定半徑之圓環狀。又，環狀軌道35a係鋪設成從第二軌道32與第三軌道33交叉之中心點TC2起一定半徑之圓環狀。環狀軌道34a,35a作用為用以使移動部42或移動部62繞中心點TC1或TC2之周圍旋動(旋轉)之導引路徑。又，在中心點TC1,TC2之各個舖設有用以正確地定位移動部42,62之圓板狀之標示部(包含作為指標之標記或感應訊號產生器等)34b,35b。 The annular rail 34a is laid in an annular shape having a certain radius from the center point TC1 where the first rail 31 and the third rail 33 intersect. Further, the annular rail 35a is laid in an annular shape having a constant radius from the center point TC2 where the second rail 32 and the third rail 33 intersect. The annular rails 34a, 35a function as guide paths for rotating (rotating) the moving portion 42 or the moving portion 62 around the center point TC1 or TC2. Further, each of the center points TC1 and TC2 is provided with a disc-shaped indicating portion (including a mark or an inductive signal generator or the like) 34b, 35b for accurately positioning the moving portions 42, 62.

接著，圖22所示之處理裝置10為例如大氣壓CVD裝置，以上部構造體10a與下部構造體10b構成。下部構造體10b係設置在工廠之地面(FL)，上部構造體10a相對於下部構造體10b在Z軸方向可動。 Next, the processing apparatus 10 shown in FIG. 22 is, for example, an atmospheric pressure CVD apparatus, and the upper structure 10a and the lower structure 10b are comprised. The lower structure 10b is provided on the floor (FL) of the factory, and the upper structure 10a is movable in the Z-axis direction with respect to the lower structure 10b.

藉由使上部構造體10a在Z軸方向之上方移動，可將掛架在第一單元部21之軸部41c與第二單元部22之軸部61c之間之基板S在X軸方向並進移動並搬出處理裝置10外。 By moving the upper structure 10a above the Z-axis direction, the substrate S between the shaft portion 41c of the first unit portion 21 and the shaft portion 61c of the second unit portion 22 can be moved in the X-axis direction. And moving out of the processing device 10.

圖22係顯示處理裝置10之基板S之處理結束、上部構造體10a位於上方之狀態下、使移動部42(第一單元部21) 與移動部62(第二單元部22)往X軸方向同步移動之狀態。移動部42(第一單元部21)被第一軌道31導引並同時朝向作為原位置之中心點TC1往-X軸方向移動，移動部62(第二單元部22)被第二軌道32導引並同時朝向作為原位置之中心點TC2往-X軸方向移動。 22 is a view showing that the processing of the substrate S of the processing apparatus 10 is completed, and the upper structure 10a is positioned upward, and the moving unit 42 is caused (the first unit portion 21). A state in which the moving unit 62 (second unit unit 22) moves in synchronization with the X-axis direction. The moving portion 42 (the first unit portion 21) is guided by the first rail 31 while moving toward the -X-axis direction toward the center point TC1 as the home position, and the moving portion 62 (the second unit portion 22) is guided by the second rail 32 At the same time, the direction is moved toward the -X axis direction toward the center point TC2 of the original position.

之後，如圖23所示，移動部42(第一單元部21)與移動部62(第二單元部22)皆到達X軸方向之原位置(中心點TC1,TC2之位置)。此時，在Y軸方向延伸之第三軌道33正好位於移動部42與移動部62之間。 Thereafter, as shown in FIG. 23, the moving portion 42 (first unit portion 21) and the moving portion 62 (second unit portion 22) both reach the original position (the position of the center point TC1, TC2) in the X-axis direction. At this time, the third rail 33 extending in the Y-axis direction is located between the moving portion 42 and the moving portion 62.

之後，移動部42(第一單元部21)與移動部62(第二單元部22)之任一方朝向另一方在Y軸方向移動。之狀態如圖24所示，此處，移動部42(第一單元部21)朝向移動部62(第二單元部22)，被第三軌道33導引移動。此時，第一單元部21之軸部41c或第二單元部22之軸部61c，與移動部42(第一單元部21)之Y軸方向之移動連動旋轉，將基板S捲繞。 Thereafter, either of the moving unit 42 (first unit portion 21) and the moving unit 62 (second unit portion 22) moves in the Y-axis direction toward the other. The state is as shown in Fig. 24. Here, the moving portion 42 (first unit portion 21) is guided to move by the third rail 33 toward the moving portion 62 (second unit portion 22). At this time, the shaft portion 41c of the first unit portion 21 or the shaft portion 61c of the second unit portion 22 rotates in conjunction with the movement of the moving portion 42 (the first unit portion 21) in the Y-axis direction, and the substrate S is wound.

圖25係顯示移動部42(第一單元部21)接近移動部62(第二單元部22)、如上述圖5所示連結(連接)之狀態。此時，移動部62(第二單元部22)位於中心點TC2(標示部35b)上，移動部42(第一單元部21)位於環狀軌道35a上。 Fig. 25 shows a state in which the moving portion 42 (the first unit portion 21) approaches the moving portion 62 (the second unit portion 22) and is connected (connected) as shown in Fig. 5 described above. At this time, the moving portion 62 (the second unit portion 22) is located at the center point TC2 (the indicator portion 35b), and the moving portion 42 (the first unit portion 21) is located on the annular rail 35a.

移動部62之腳輪72從此狀態在中心點TC2之周圍產生往θ Z軸方向使移動部62(第二單元部22)旋動(自轉)之驅動力。一併地，移動部42之腳輪52產生沿著環狀軌道35a之周方向使移動部42(第一單元部21)旋動(旋轉)之驅動 力。再者，此時，移動部62之腳輪72或移動部42之腳輪52，根據標示部35b之檢測結果，進行移動部62之自轉中心不會從中心點TC2往X軸方向與Y軸方向大幅地位置偏移之方向控制。 From this state, the caster 72 of the moving portion 62 generates a driving force for rotating (rotating) the moving portion 62 (second unit portion 22) in the θ Z-axis direction around the center point TC2. At the same time, the casters 52 of the moving portion 42 generate a drive for rotating (rotating) the moving portion 42 (the first unit portion 21) along the circumferential direction of the annular rail 35a. force. Further, at this time, the caster 72 of the moving portion 62 or the caster 52 of the moving portion 42 performs the rotation center of the moving portion 62 from the center point TC2 to the X-axis direction and the Y-axis direction, based on the detection result of the indicator portion 35b. Direction control of the ground position offset.

圖26係顯示連結之移動部42(第一單元部21)與移動部62(第二單元部22)從圖25之狀態在XY面內以中心點TC2作為中心順時針旋轉90度之狀態。其旋轉方向在此處雖為順時針旋轉90度，但逆時針旋轉90度亦可。往哪個方向旋轉係依據對下一個處理裝置如何裝填基板S來決定。 Fig. 26 shows a state in which the moving portion 42 (first unit portion 21) and the moving portion 62 (second unit portion 22) are rotated clockwise by 90 degrees from the center of the XY plane with the center point TC2 as a center. The direction of rotation here is 90 degrees clockwise, but 90 degrees counterclockwise. The direction of rotation is determined by how the next processing device is loaded with the substrate S.

之後，如圖27所示，保持由處理裝置10(例如，大氣壓CVD裝置)成膜處理後之基板S之捲軸之第二單元部22(移動部62)、與保持其餘之未處理之基板S之捲軸之第一單元部21(移動部42)係藉由第二軌道32之導引在+X軸方向成為一體且並進移動，橫向通過處理裝置10朝向下一個處理裝置。 Thereafter, as shown in FIG. 27, the second unit portion 22 (moving portion 62) of the reel of the substrate S formed by the processing apparatus 10 (for example, the atmospheric pressure CVD apparatus) is held, and the remaining unprocessed substrate S is held. The first unit portion 21 (moving portion 42) of the reel is integrated in the +X-axis direction by the guidance of the second rail 32, and moves in parallel, and passes through the processing device 10 in the lateral direction toward the next processing device.

藉此，原位置(中心點TC1,TC2)空出，因此搭載下一個待處理基板S之移動部42-1(第一單元部21-1)與移動部62-1(第二單元部22-1)成為一體送往中心點TC1側之原位置。 Thereby, since the home position (center point TC1, TC2) is vacated, the moving portion 42-1 (first unit portion 21-1) and the moving portion 62-1 (second unit portion 22) of the next substrate S to be processed are mounted. -1) It is sent to the original position on the TC1 side of the center point.

之後，如圖27所示，在保持未處理之基板S之捲軸之第一單元部21-1(移動部42-1)位於中心點TC1(第一軌道31與第三軌道33之交叉點部)之狀態下，用以將已處理之基板S捲繞成捲軸狀之第二單元部22-1(移動部62-1)朝向中心點TC2沿著第三軌道33移動。 Thereafter, as shown in FIG. 27, the first unit portion 21-1 (moving portion 42-1) of the reel holding the unprocessed substrate S is located at the center point TC1 (the intersection of the first rail 31 and the third rail 33) In the state of the second unit portion 22-1 (moving portion 62-1) for winding the processed substrate S into a reel shape, it moves along the third rail 33 toward the center point TC2.

如上述，移動部42(第一單元部21)或移動部62(第二單元部22)，藉由在工廠之地面FL上設置可自由地旋轉運動之空間(環狀軌道34a,35a等)，能使處理裝置之配置之自由度、基板S(捲軸狀)之搬送方向之自由度、搬送效率提升。 As described above, the moving portion 42 (the first unit portion 21) or the moving portion 62 (the second unit portion 22) is provided with a space that can freely rotate (the annular rails 34a, 35a, etc.) on the floor FL of the factory. The degree of freedom in the arrangement of the processing apparatus, the degree of freedom in the transport direction of the substrate S (reel-like shape), and the transport efficiency can be improved.

以上之實施形態中，圖25、圖26中，使以一定間隔連結之移動部42(第一單元部21)與移動部62(第二單元部22)旋轉90度。然而，下一個處理裝置設置在例如圖25中之處理裝置10之-Y軸側之情形，沿著在-Y軸方向延伸之第三軌道33，使移動部42(第一單元部21)與移動部62(第二單元部22)直接往-Y軸方向移動亦可，從圖25之狀態繞中心點TC2周圍旋轉180度後往-Y軸方向移動亦可。 In the above embodiment, in FIGS. 25 and 26, the moving portion 42 (first unit portion 21) and the moving portion 62 (second unit portion 22) which are connected at regular intervals are rotated by 90 degrees. However, the next processing device is disposed, for example, on the Y-axis side of the processing device 10 in Fig. 25, and the moving portion 42 (first unit portion 21) is caused along the third track 33 extending in the -Y-axis direction. The moving portion 62 (the second unit portion 22) may be directly moved in the -Y-axis direction, and may be rotated 180 degrees around the center point TC2 from the state of FIG. 25 and then moved in the -Y-axis direction.

此外，圖25~圖27中，移動部42(第一單元部21)與移動部62(第二單元部22)在以一定間隔連結之狀態下移動。然而，兩者未必要機械性接觸，使用非接觸感測器等保持一定之空間間隙並同時在一定之位置偏移範圍內(例如1mm以下)使移動部42與移動部62相互追隨移動亦可。 In addition, in FIGS. 25 to 27, the moving portion 42 (first unit portion 21) and the moving portion 62 (second unit portion 22) are moved in a state of being connected at regular intervals. However, the two do not need mechanical contact, and the non-contact sensor or the like maintains a certain spatial gap and simultaneously moves the moving portion 42 and the moving portion 62 in a certain range of positional deviation (for example, 1 mm or less). .

不論如何，為了將對基板S之處理已完成之移動部42(第一單元部21)與移動部62(第二單元部22)搬送至下一個處理裝置(第二處理裝置)，伴隨著基板S往從已進行上述處理之處理裝置離開之第一方向(圖22~圖27中為X軸方向)之並進運動、往與上述第一方向交叉之第二方向(圖22~圖27中為Y軸方向)之並進運動、在包含第一方向與第二方向之面內(圖22~圖27中為XY面)之旋轉運動中之至少二個運動(二個運動連續)，驅動各腳輪52,72，使移動部42與 移動部62一起移動。此外，並進運動未必限於X軸方向或Y軸方向，亦包含移動部42(第一單元部21)或移動部62(第二單元部22)在XY面內相對於X軸與Y軸之兩方傾斜之方向(例如，45度方向)直線移動之情形。 In any case, in order to transport the moving portion 42 (first unit portion 21) and the moving portion 62 (second unit portion 22) that have been processed to the substrate S to the next processing device (second processing device), the substrate is accompanied S moves in the first direction (the X-axis direction in FIGS. 22 to 27) away from the processing device that has been subjected to the above processing, and goes to the second direction intersecting the first direction (FIG. 22 to FIG. 27 The parallel motion of the Y-axis direction, at least two of the rotational motions (two motions continuous) in the plane including the first direction and the second direction (the XY plane in FIGS. 22 to 27), driving each caster 52, 72, the moving part 42 and The moving portion 62 moves together. Further, the parallel motion is not necessarily limited to the X-axis direction or the Y-axis direction, and includes the moving portion 42 (first unit portion 21) or the moving portion 62 (second unit portion 22) in the XY plane with respect to the X-axis and the Y-axis. The case where the direction of the square tilt (for example, the direction of 45 degrees) moves linearly.

以上，說明了使用圖2~圖5所示之匣裝置(第一單元部21、第二單元部22)之基板S(或保護基板C)之搬送形態。然而，在各匣裝置內設置基板S之溫度之調整機構、濕度之調整機構、紫外線之照射機構等，作為處理裝置之一，設置溫度調整裝置、濕度調整裝置、紫外線照射裝置，在處理步驟中之適當時序對基板S進行調溫、除濕、加濕、UV照射亦可。 The transport form of the substrate S (or the protective substrate C) using the crucible device (the first unit portion 21 and the second unit portion 22) shown in FIGS. 2 to 5 has been described above. However, an adjustment mechanism for the temperature of the substrate S, a humidity adjustment mechanism, an ultraviolet irradiation mechanism, and the like are provided in each of the devices, and a temperature adjustment device, a humidity adjustment device, and an ultraviolet irradiation device are provided as one of the processing devices, and the processing step is performed. The substrate S may be subjected to temperature adjustment, dehumidification, humidification, or UV irradiation at an appropriate timing.

一般而言，生產大型之高精細平板顯示器等之情形，母材即基板S被送往各種處理裝置，接受各種處理。尤其是，以捲軸對捲軸(roll to roll)方式對PET或PEN等之可撓性薄膜基板進行連續處理之情形，考量在各處理步驟應力累積在薄膜基板，薄膜基板變形。再者，接受處理之薄膜基板、或已堆積在基板上之膜材料，亦必須在各處理步驟將溫度、含有水分量、濕潤性等預先設定成適當狀態。 In general, in the case of producing a large-scale high-definition flat panel display or the like, the base material S, which is a base material, is sent to various processing apparatuses to receive various treatments. In particular, in the case of continuously processing a flexible film substrate such as PET or PEN in a roll-to-roll manner, it is considered that stress is accumulated on the film substrate at each processing step, and the film substrate is deformed. Further, it is necessary to preset the temperature, the moisture content, the wettability, and the like to an appropriate state in each of the processing steps of the film substrate to be processed or the film material deposited on the substrate.

因此，在裝填有基板S之匣裝置20(第一單元部21、第二單元部22)之移動中、或待機中，使設在第一單元部21或第二單元部22內之溫度調整機構、濕度調整機構、或紫外線照射機構作動。或者，使匣裝置20在工廠內獨立設置之溫度調整裝置、濕度調整裝置、紫外線照射裝置移動以使基板S通過。如此，能將基板S(或其表面之膜材料)之溫 度、水分含有量、濕潤性、內部應力等之狀態事先調整成適於下一個處理步驟用之處理裝置之規格。 Therefore, the temperature adjustment in the first unit portion 21 or the second unit portion 22 is performed during the movement of the crucible device 20 (the first unit portion 21 and the second unit portion 22) loaded with the substrate S or during standby. The mechanism, the humidity adjustment mechanism, or the ultraviolet irradiation mechanism actuate. Alternatively, the temperature adjustment device, the humidity adjustment device, and the ultraviolet irradiation device, which are independently provided in the factory, are moved to pass the substrate S. In this way, the temperature of the substrate S (or the film material of its surface) can be The state of the degree, the moisture content, the wettability, the internal stress, and the like are adjusted in advance to the specifications of the processing apparatus suitable for the next processing step.

本發明之實施形態中，保持捲軸狀之基板S之匣裝置20可對各種處理裝置移動，因此可進行匣裝置單位之批量處理。因此，在處理步驟之前，即使加入調整基板S(或其表面之膜材料)之各種狀態之步驟(相當於一個處理步驟)，亦不會使生產線整體之產率大幅降低，可進行產率良好之生產。 In the embodiment of the present invention, the apparatus 20 for holding the substrate S in the form of a reel can be moved to various processing apparatuses, so that batch processing of the unit of the apparatus can be performed. Therefore, even before the processing step, even if the steps of adjusting the various states of the substrate S (or the film material of the surface thereof) (corresponding to one processing step), the yield of the entire production line is not greatly reduced, and the yield can be improved. Production.

S‧‧‧基板 S‧‧‧Substrate

CONT‧‧‧控制部 CONT‧‧‧Control Department

BF‧‧‧緩衝部 BF‧‧‧ buffer

C‧‧‧保護基板 C‧‧‧protective substrate

CV‧‧‧蓋構件 CV‧‧‧ cover components

10‧‧‧處理部 10‧‧‧Processing Department

20‧‧‧匣裝置 20‧‧‧匣Device

21‧‧‧第一單元部 21‧‧‧First Unit

22‧‧‧第二單元部 22‧‧‧Second Unit

23‧‧‧連接部 23‧‧‧Connecting Department

24‧‧‧移動機構 24‧‧‧Mobile agencies

30‧‧‧導軌 30‧‧‧rails

31‧‧‧第一軌道 31‧‧‧First track

32‧‧‧第二軌道 32‧‧‧second track

33‧‧‧第三軌道 33‧‧‧ third track

34a,35a‧‧‧環狀軌道 34a, 35a‧‧‧cyclic orbit

42,62‧‧‧移動部 42,62‧‧‧moving department

43,63‧‧‧基板側通訊部 43,63‧‧‧Base side communication department

44,64‧‧‧移動部側通訊部 44,64‧‧‧Mobile Ministry of Communications

46,66‧‧‧裝卸檢測部 46,66‧‧‧Loading and Unloading Inspection Department

47,67‧‧‧接觸抑制部 47,67‧‧‧Contact Suppression Department

51,71‧‧‧筐體 51,71‧‧‧Shell

52,72‧‧‧腳輪 52,72‧‧‧ casters

53,73‧‧‧升降部 53,73‧‧‧ Lifting Department

54,74‧‧‧腳輪驅動部 54,74‧‧‧ caster drive

55,75‧‧‧位置檢測部 55,75‧‧‧Location Detection Department

56,76‧‧‧端子 56,76‧‧‧terminal

65‧‧‧連接檢測部 65‧‧‧Connection Detection Department

100,200‧‧‧基板處理裝置 100,200‧‧‧ substrate processing device

111~113‧‧‧處理室 111~113‧‧‧Processing room

160‧‧‧升起部 160‧‧‧Ups

圖1係顯示第一實施形態之基板處理裝置之整體構成之立體圖。 Fig. 1 is a perspective view showing the overall configuration of a substrate processing apparatus according to a first embodiment.

圖2係顯示本實施形態之第一單元部側之構成之分解立體圖。 Fig. 2 is an exploded perspective view showing the configuration of the first unit portion side of the embodiment.

圖3係顯示本實施形態之匣裝置之一部分構成之圖。 Fig. 3 is a view showing a part of the configuration of the crucible device of the embodiment.

圖4係顯示本實施形態之第二單元部側之構成之分解立體圖。 Fig. 4 is an exploded perspective view showing the configuration of the second unit portion side of the embodiment.

圖5係顯示本實施形態之匣裝置之構成之圖。 Fig. 5 is a view showing the configuration of the crucible device of the embodiment.

圖6係顯示本實施形態之處理部之構成之圖。 Fig. 6 is a view showing the configuration of a processing unit of the embodiment.

圖7係顯示本實施形態之基板處理裝置之動作之一形態之圖。 Fig. 7 is a view showing an aspect of the operation of the substrate processing apparatus of the embodiment.

圖8係顯示本實施形態之基板處理裝置之動作之一形態之圖。 Fig. 8 is a view showing an aspect of the operation of the substrate processing apparatus of the embodiment.

圖9係顯示本實施形態之基板處理裝置之動作之一形態之圖。 Fig. 9 is a view showing an aspect of the operation of the substrate processing apparatus of the embodiment.

圖10係顯示本實施形態之基板處理裝置之動作之一形態之圖。 Fig. 10 is a view showing an aspect of the operation of the substrate processing apparatus of the embodiment.

圖11係顯示本實施形態之基板處理裝置之動作之一形態之圖。 Fig. 11 is a view showing an aspect of the operation of the substrate processing apparatus of the embodiment.

圖12係顯示本實施形態之基板處理裝置之動作之一形態之圖。 Fig. 12 is a view showing an aspect of the operation of the substrate processing apparatus of the embodiment.

圖13係顯示第二實施形態之基板處理裝置之整體構成之立體圖。 Fig. 13 is a perspective view showing the overall configuration of a substrate processing apparatus according to a second embodiment.

圖14係顯示本實施形態之基板處理裝置之一部分構成之剖面圖。 Fig. 14 is a cross-sectional view showing a part of the structure of the substrate processing apparatus of the embodiment.

圖15係顯示本實施形態之升起部之構成之立體圖。 Fig. 15 is a perspective view showing the configuration of the raised portion of the embodiment.

圖16係顯示基板處理裝置之另一構成之圖。 Fig. 16 is a view showing another configuration of the substrate processing apparatus.

圖17係顯示基板處理裝置之另一構成之圖。 Fig. 17 is a view showing another configuration of the substrate processing apparatus.

圖18(a)~(c)係顯示基板處理裝置之另一構成之圖。 18(a) to (c) are views showing another configuration of the substrate processing apparatus.

圖19(a)、(b)係顯示基板處理裝置之另一構成之圖。 19(a) and 19(b) are views showing another configuration of the substrate processing apparatus.

圖20(a)、(b)係顯示基板處理裝置之另一構成之圖。 20(a) and (b) are views showing another configuration of the substrate processing apparatus.

圖21係顯示基板之另一構成之圖。 Fig. 21 is a view showing another configuration of the substrate.

圖22係顯示基板處理裝置之另一構成與動作狀態之圖。 Fig. 22 is a view showing another configuration and an operation state of the substrate processing apparatus.

圖23係顯示圖22之基板處理裝置之下一個動作狀態之圖。 Fig. 23 is a view showing the next operational state of the substrate processing apparatus of Fig. 22.

圖24係顯示圖23之基板處理裝置之下一個動作狀態之圖。 Fig. 24 is a view showing the next operational state of the substrate processing apparatus of Fig. 23.

圖25係顯示圖24之基板處理裝置之下一個動作狀態 之圖。 Figure 25 is a diagram showing the next action state of the substrate processing apparatus of Figure 24. Picture.

圖26係顯示圖25之基板處理裝置之下一個動作狀態之圖。 Figure 26 is a diagram showing the next operational state of the substrate processing apparatus of Figure 25.

圖27係顯示圖26之基板處理裝置之下一個動作狀態之圖。 Figure 27 is a diagram showing the next operational state of the substrate processing apparatus of Figure 26.

S‧‧‧基板 S‧‧‧Substrate

CONT‧‧‧控制部 CONT‧‧‧Control Department

BF‧‧‧緩衝部 BF‧‧‧ buffer

10‧‧‧處理部 10‧‧‧Processing Department

20‧‧‧匣裝置 20‧‧‧匣Device

21‧‧‧第一單元部 21‧‧‧First Unit

22‧‧‧第二單元部 22‧‧‧Second Unit

24‧‧‧移動機構 24‧‧‧Mobile agencies

30‧‧‧導軌 30‧‧‧rails

31‧‧‧第一軌道 31‧‧‧First track

32‧‧‧第二軌道 32‧‧‧second track

33‧‧‧第三軌道 33‧‧‧ third track

100‧‧‧基板處理裝置 100‧‧‧Substrate processing unit

Claims (33)

一種匣裝置，具有：第一單元部，進行長帶基板往既定之處理裝置之供應、及已於該處理裝置被處理之該長帶基板之回收的一方；以及第二單元部，進行該長帶基板往既定之處理裝置之供應、及該長帶基板從該處理裝置之回收的另一方；該第一單元部及該第二單元部可在該長帶基板橫跨於該第一單元部與該第二單元部之間的狀態下彼此接近或分離，並且可以彼此接近或連結的狀態一起移動。 A crucible device comprising: a first unit portion, a supply of a long-length substrate to a predetermined processing device, and a recovery of the long-band substrate processed by the processing device; and a second unit portion that performs the length The supply of the substrate to the predetermined processing device and the recovery of the long substrate from the processing device; the first unit portion and the second unit portion may span the first unit portion of the long substrate The state between the second unit portion is close to or separated from each other, and can move together in a state of being close to or connected to each other. 如申請專利範圍第1項之匣裝置，其具有移動機構，該移動機構係設在該第一單元部及該第二單元部之至少一方，使該第一單元部及該第二單元部之一方相對於該第一單元部及該第二單元部之另一方移動。 The device of claim 1, wherein the device has a moving mechanism, and the moving mechanism is disposed on at least one of the first unit portion and the second unit portion, such that the first unit portion and the second unit portion One of the ones moves relative to the other of the first unit portion and the second unit portion. 如申請專利範圍第2項之匣裝置，其中，該移動機構具有使該第一單元部移動之第一移動部與使該第二單元部移動之第二移動部。 The apparatus of claim 2, wherein the moving mechanism has a first moving portion that moves the first unit portion and a second moving portion that moves the second unit portion. 如申請專利範圍第3項之匣裝置，其中，該移動機構可將該第一移動部及該第二移動部分別獨立地驅動。 The device of claim 3, wherein the moving mechanism can drive the first moving portion and the second moving portion independently. 如申請專利範圍第4項之匣裝置，其具有檢測該第一移動部及該第二移動部中至少一方之位置資訊之第一檢測部。 The device of claim 4, further comprising a first detecting unit that detects position information of at least one of the first moving portion and the second moving portion. 如申請專利範圍第5項之匣裝置，其中，該位置資訊包含在該第一移動部及該第二移動部中至少一方之移動路 徑之位置。 The device of claim 5, wherein the location information includes a mobile path of at least one of the first moving portion and the second moving portion The location of the trail. 如申請專利範圍第3至6項中任一項之匣裝置，其具有設在該第一單元部或該第一移動部、能在與外部之間進行通訊之第一通訊部；具有設在該第二單元部或該第二移動部、能在與外部之間進行通訊之第二通訊部。 A device according to any one of claims 3 to 6, which has a first communication unit provided in the first unit portion or the first moving portion and capable of communicating with the outside; The second unit portion or the second moving portion is a second communication unit capable of communicating with the outside. 如申請專利範圍第7項之匣裝置，其中，該第一通訊部接收用以控制該第一移動部之移動動作、與在該第一單元部之該基板之供應及回收之一方之動作之第一控制訊號；該第二通訊部接收用以控制該第二移動部之移動動作、與在該第二單元部之該基板之供應及回收之另一方之動作之第二控制訊號。 The apparatus of claim 7, wherein the first communication unit receives an action of controlling a movement of the first moving unit and one of supplying and recovering the substrate in the first unit. a first control signal; the second communication unit receives a second control signal for controlling a movement operation of the second mobile unit and an operation of the other side of the substrate in the second unit. 如申請專利範圍第8項之匣裝置，其進一步具有控制裝置，該控制裝置發送該第一控制訊號，透過該第一通訊部控制該第一移動部與該第一單元部，且發送該第二控制訊號，透過該第二通訊部控制該第二移動部與該第二單元部。 The device of claim 8 further includes a control device, wherein the control device transmits the first control signal, and the first mobile unit controls the first mobile unit and the first unit, and transmits the first The second control signal controls the second moving unit and the second unit by the second communication unit. 如申請專利範圍第3項之匣裝置，其中，該第一移動部將該第一單元部支承成可移除；該第二移動部將該第二單元部支承成可移除。 The apparatus of claim 3, wherein the first moving portion supports the first unit portion to be removable; and the second moving portion supports the second unit portion to be removable. 如申請專利範圍第10項之匣裝置，其具有檢測該第一單元部對該第一移動部之裝卸狀態及該第二單元部對該第二移動部之裝卸狀態之至少一方之第二檢測部。 The apparatus according to claim 10, further comprising: detecting a second detection of at least one of a loading and unloading state of the first moving unit and the loading and unloading state of the second moving unit; unit. 如申請專利範圍第1至6項中任一項之匣裝置，其中，該長帶基板係具有可撓性之長帶的片狀基板；該第一單元部，具有：第一軸部，供捲繞該片狀基板；以及第一驅動部，控制該第一軸部之旋轉，以進行捲繞回收該片狀基板之動作及送出供應該片狀基板之動作的一方；該第二單元部，具有：第二軸部，供捲繞該片狀基板；以及第二驅動部，控制該第二軸部之旋轉，以進行捲繞回收該片狀基板之該動作及送出供應該片狀基板之該動作的另一方。 The apparatus according to any one of claims 1 to 6, wherein the long-length substrate is a sheet-like substrate having a flexible long strip; the first unit portion has a first shaft portion for Winding the sheet-like substrate; and controlling, by the first driving unit, the rotation of the first shaft portion to perform an operation of winding and collecting the sheet substrate, and transmitting one of the operations of supplying the sheet substrate; the second unit portion And a second shaft portion for winding the sheet substrate; and a second driving portion that controls rotation of the second shaft portion to perform winding and recovery of the sheet substrate and feeding and feeding the sheet substrate The other side of the action. 如申請專利範圍第12項之匣裝置，其中，該第一單元部具有進行保護該片狀基板表面之保護基板之供應及回收之一方之第一輔助部；該第二單元部具有進行該保護基板之供應及回收之另一方之第二輔助部。 The device of claim 12, wherein the first unit portion has a first auxiliary portion for performing supply and recovery of the protective substrate for protecting the surface of the sheet substrate; the second unit portion has the protection The second auxiliary part of the other side of the supply and recovery of the substrate. 如申請專利範圍第1至6項中任一項之匣裝置，其中，該第一單元部及該第二單元部中之至少一方具有安裝用以覆蓋該長帶基板之蓋構件之安裝部。 The apparatus according to any one of claims 1 to 6, wherein at least one of the first unit portion and the second unit portion has a mounting portion to which a cover member for covering the long-length substrate is mounted. 如申請專利範圍第1至6項中任一項之匣裝置，其中，該第一單元部及該第二單元部之至少一方具有連接於外部之搬送機構之連接部。 The device according to any one of claims 1 to 6, wherein at least one of the first unit portion and the second unit portion has a connection portion connected to an external transfer mechanism. 如申請專利範圍第1至6項中任一項之匣裝置，其 中，該第一單元部及該第二單元部中之至少一方具有抑制與外部接觸之抑制部。 A device according to any one of claims 1 to 6, wherein At least one of the first unit portion and the second unit portion has a suppressing portion that suppresses contact with the outside. 一種基板搬送裝置，具有：第一單元部，係設成可在第一移動路徑移動，進行長帶基板之供應及回收之一方；第二單元部，係設成可在第二移動路徑移動，進行該長帶基板之供應及回收之另一方；以及第一控制部，對配置在該第一移動路徑與該第二移動路徑之間之第一基板處理部，控制該第一單元部使其進行該長帶基板之供應及回收之一方，且控制該第二單元部使其進行該長帶基板之供應及回收之另一方；該第一控制部，對配置在該第一移動路徑與該第二移動路徑之間、且與該第一基板處理部不同之第二基板處理部，使該第一單元部及該第二單元部以彼此接近或連結的狀態一起移動，控制該第一單元部使其進行該長帶基板之供應及回收之另一方，且控制該第二單元部使其進行該長帶基板之供應及回收之一方。 A substrate transfer device comprising: a first unit portion configured to be movable in a first movement path to supply and recover a long-length substrate; and a second unit portion configured to be movable in a second movement path And supplying the other of the long-board substrates; and the first control unit controls the first unit processing unit to the first substrate processing unit disposed between the first movement path and the second movement path Performing one of supply and recovery of the long-band substrate, and controlling the second unit portion to perform supply and recovery of the long-band substrate; the first control unit is disposed on the first movement path and the The second substrate processing unit between the second movement paths and the first substrate processing unit moves the first unit portion and the second unit portion together in a state of being close to or connected to each other, and controls the first unit The other unit performs the supply and recovery of the long-length substrate, and controls the second unit to perform one of supply and recovery of the long-band substrate. 如申請專利範圍第17項之基板搬送裝置，其進一步具有：第一移動部，係設在該第一單元部，使該第一單元部沿著該第一移動路徑移動；以及第二移動部，係設在該第二單元部，使該第二單元部沿著該第二移動路徑移動。 The substrate transfer device of claim 17, further comprising: a first moving portion that is disposed in the first unit portion to move the first unit portion along the first moving path; and a second moving portion And being disposed in the second unit portion to move the second unit portion along the second movement path. 如申請專利範圍第18項之基板搬送裝置，其進一步 具備：第一軌道，係設在該第一移動路徑，導引該第一移動部；以及第二軌道，係設在該第二移動路徑，導引該第二移動部。 Such as the substrate transfer device of claim 18, further The first track is disposed on the first moving path to guide the first moving portion, and the second track is disposed on the second moving path to guide the second moving portion. 如申請專利範圍第19項之基板搬送裝置，其進一步具有：第一通訊部，係設在該第一單元部或該第一移動部、能在與外部之間進行通訊；第二通訊部，係設在該第二單元部或該第二移動部、能在與外部之間進行通訊；以及第二控制部，將用以控制該第一移動部之移動動作、與在該第一單元部之該長帶基板之供應或回收之動作之第一控制訊號透過該第一通訊部傳送至該第一單元部及該第一移動部，且將用以控制該第二移動部之移動動作、與在該第二單元部之該長帶基板之供應或回收之動作之第二控制訊號透過該第二通訊部傳送。 The substrate transfer device of claim 19, further comprising: a first communication unit, configured to be in the first unit or the first moving unit, capable of communicating with the outside; and a second communication unit; And the second unit or the second moving unit can communicate with the outside; and the second control unit controls the movement of the first moving unit and the first unit The first control signal of the operation of supplying or reclaiming the long substrate is transmitted to the first unit and the first moving portion through the first communication unit, and is used for controlling the movement of the second moving portion, And a second control signal for the operation of supplying or recovering the long-band substrate in the second unit portion is transmitted through the second communication portion. 如申請專利範圍第17至20項中任一項之基板搬送裝置，其進一步具備使該第一單元部及該第二單元部之至少一方待機之緩衝部。 The substrate transfer apparatus according to any one of claims 17 to 20, further comprising a buffer portion that waits for at least one of the first unit portion and the second unit portion. 如申請專利範圍第17至20項中任一項之基板搬送裝置，其中，該第一單元部及該第二單元部之至少一方設有複數個。 The substrate transfer device according to any one of claims 17 to 20, wherein at least one of the first unit portion and the second unit portion is provided in plurality. 一種基板處理裝置，用於處理長帶基板，該長帶基 板係具有可撓性之長帶的片狀基板，該基板處理裝置具備：複數個處理部，係包含配置在第一移動路徑與第二移動路徑之間的第一處理部及第二處理部；以及申請專利範圍第17至22項中任一項之基板搬送裝置；該複數個處理部之各個，連續地處理於長帶方向搬送之該片狀基板。 A substrate processing apparatus for processing a long strip substrate, the long strip base A plate-shaped substrate having a flexible long strip, the substrate processing apparatus including: a plurality of processing units including a first processing unit and a second processing unit disposed between the first movement path and the second movement path And a substrate transfer device according to any one of claims 17 to 22, wherein each of the plurality of processing units continuously processes the sheet substrate conveyed in the elongate direction. 如申請專利範圍第23項之基板處理裝置，其中，複數個該處理部中所包含的該第一處理部與該第二處理部，係配置在該第一移動路徑與該第二移動路徑之間之不同區域。 The substrate processing apparatus according to claim 23, wherein the first processing unit and the second processing unit included in the plurality of processing units are disposed in the first movement path and the second movement path Different areas between. 如申請專利範圍第23或24項之基板處理裝置，其中，該第一處理部與該第二處理部，分別包含在該長帶基板形成膜之膜形成裝置、加熱該基板之加熱裝置、洗淨該基板之洗淨裝置、使該基板曝光之曝光裝置、及檢查該基板之檢查裝置中之至少一者。 The substrate processing apparatus according to claim 23, wherein the first processing unit and the second processing unit respectively include a film forming device for forming the long-length substrate forming film, a heating device for heating the substrate, and washing At least one of a cleaning device for the substrate, an exposure device for exposing the substrate, and an inspection device for inspecting the substrate. 一種基板處理方法，係用以將具有可撓性之長帶基板依序送至複數個處理裝置，並在該基板上形成電子元件，其特徵在於，包含：第一處理步驟，將包含捲繞有待供應至第一基板處理部之該基板之供應滾筒之第一單元部、與包含捲繞待從該第一基板處理部回收之該基板之回收滾筒之第二單元部，配置成夾著該第一基板處理部，藉由該第一基板處理部處理從該供應滾筒供應之該基板後以該回收滾筒回收，其中，該基板係於該長邊方向被捲繞在該供應滾筒且於該長 邊方向捲繞至該回收滾筒；第一移動步驟，使該第一單元部與該第二單元部一起沿著該供應滾筒與該回收滾筒之間之該基板從該第一基板處理部離開之第一方向移動；第二移動步驟，為了縮小該供應滾筒與該回收滾筒在該長邊方向之間隔，使該第一單元部與該第二單元部之至少一方沿著與該第一方向交叉之第二方向移動；以及第三移動步驟，使以既定間隔對向或連結之狀態之該第一單元部與該第二單元部隨著該第一方向之並進運動、該第二方向之並進運動、在包含該第一方向與第二方向之面內之旋轉運動中之至少二個運動，一起朝向與該第一基板處理部不同之第二基板處理部移動。 A substrate processing method for sequentially feeding a flexible long strip substrate to a plurality of processing devices, and forming an electronic component on the substrate, comprising: a first processing step, including winding a first unit portion of the supply roller to be supplied to the substrate of the first substrate processing portion, and a second unit portion including a recovery roller including the substrate to be wound from the first substrate processing portion, configured to sandwich the a first substrate processing unit that processes the substrate supplied from the supply roller by the first substrate processing unit, and recovers the substrate by the recovery roller, wherein the substrate is wound around the supply roller in the longitudinal direction and long Winding to the recovery drum in a side direction; the first moving step is such that the first unit portion and the second unit portion are separated from the first substrate processing portion along the substrate between the supply roller and the recovery roller Moving in a first direction; in order to reduce the distance between the supply roller and the recovery roller in the longitudinal direction, at least one of the first unit portion and the second unit portion intersects the first direction Moving in a second direction; and a third moving step of moving the first unit portion and the second unit portion in a state of being aligned or joined at a predetermined interval along with the first direction, and the second direction The movement, at least two of the rotational movements in the plane including the first direction and the second direction, move toward the second substrate processing portion different from the first substrate processing portion. 如申請專利範圍第26項之基板處理方法，其中，該第一基板處理部與該第二基板處理部，分別包含在該基板形成膜之膜形成裝置、加熱該基板之加熱裝置、洗淨該基板之洗淨裝置、使該基板曝光之曝光裝置、及檢查該基板之檢查裝置中之至少一者。 The substrate processing method according to claim 26, wherein the first substrate processing portion and the second substrate processing portion respectively include a film forming device for forming the substrate, a heating device for heating the substrate, and cleaning the substrate At least one of a substrate cleaning device, an exposure device for exposing the substrate, and an inspection device for inspecting the substrate. 如申請專利範圍第27項之基板處理方法，其中，該第一移動步驟、該第二移動步驟及該第三移動步驟，分別藉由使該第一單元部與該第二單元部沿著沿既定的移動路徑設置的軌道或導引路徑移動的移動機構而進行。 The substrate processing method of claim 27, wherein the first moving step, the second moving step, and the third moving step are respectively performed along the edge of the first unit portion and the second unit portion The moving path set by the predetermined moving path or the moving mechanism of the guiding path moves. 如申請專利範圍第27或28項之基板處理方法，其中，該第一移動步驟、該第二移動步驟及該第三移動步驟，分別藉由根據由位置檢測部檢測之該第一單元部與該第二 單元部之各個的位置資訊控制該第一單元部與該第二單元部之移動而進行。 The substrate processing method of claim 27 or 28, wherein the first moving step, the second moving step, and the third moving step are respectively performed by the first unit portion detected by the position detecting portion The second The position information of each unit unit controls the movement of the first unit unit and the second unit unit. 一種匣裝置，係保持將被供應至既定處理裝置之具有可撓性之長帶基板於長帶方向捲繞之供應滾筒、或將已由該處理裝置處理之該長帶基板於長帶方向捲繞並回收之回收滾筒，其特徵在於，具備：收容部，將該供應滾筒或該回收滾筒以可繞中心軸旋轉之方式收容；以及移動部，在以既定之正交座標系統之一個軸線平行於該中心軸之方式決定該正交座標系統時，使該收容部於該正交座標系統之至少二個軸線之方向並進移動並且繞該正交座標系統之一個軸線旋轉移動。 A crucible device for holding a supply roller that is supplied to a predetermined processing device and having a flexible long-length substrate wound in a long-belt direction, or for winding the long-length substrate that has been processed by the processing device in a long-belt direction A recycling drum that is wound and recovered, comprising: a housing portion that accommodates the supply roller or the recovery roller in a rotatable manner about a central axis; and a moving portion that is parallel to an axis of a predetermined orthogonal coordinate system When the orthogonal coordinate system is determined in the manner of the central axis, the receiving portion is moved in the direction of at least two axes of the orthogonal coordinate system and rotationally moved about one axis of the orthogonal coordinate system. 如申請專利範圍第30項之匣裝置，其中，該收容部，以該中心軸平行於以該正交座標系統中相互正交之軸線X與軸線Y所決定之XY平面之方式收容該供應滾筒或該回收滾筒；該移動部，使該收容部沿該XY平面並進運動並且繞與該XY平面垂直之軸線Z旋轉運動。 The apparatus of claim 30, wherein the accommodating portion accommodates the supply roller in such a manner that the central axis is parallel to an XY plane determined by an axis X and an axis Y orthogonal to each other in the orthogonal coordinate system. Or the recovery roller; the moving portion moves the receiving portion along the XY plane and rotates about an axis Z perpendicular to the XY plane. 如申請專利範圍第31項之匣裝置，其中，在使設置該匣裝置之地面平行於該XY平面時，該移動部具有以相對於該地面進行該並進運動與該旋轉運動之方式自走的驅動機構。 The device of claim 31, wherein when the ground on which the device is disposed is parallel to the XY plane, the moving portion has a self-propelled manner in which the parallel motion and the rotational motion are performed with respect to the ground. Drive mechanism. 如申請專利範圍第32項之匣裝置，其中，在收容該供應滾筒之該匣裝置設為第一之該匣裝置，收容該回收滾 筒之該匣裝置設為第二之該匣裝置時，在已將該長帶基板從該供應滾筒於長帶方向橫跨於該回收滾筒之狀態下，同步控制該第一之該匣裝置之驅動機構與該第二之該匣裝置之驅動機構。 The device of claim 32, wherein the device for accommodating the supply roller is set to be the first device, and the recycling roller is accommodated. When the crucible device is set to be the second crucible device, the first ejecting device is synchronously controlled in a state in which the elongate substrate is traversed from the supply roller in the long belt direction across the recovery roller. a drive mechanism and a drive mechanism of the second device.
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011615B2 (en) * 2012-04-13 2016-10-19 株式会社ニコン Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method
JP6264619B2 (en) * 2015-02-09 2018-01-24 三菱重工機械システム株式会社 Front stop device, sheet stacking device, counter ejector and box making machine
CN110773536B (en) * 2018-07-31 2021-10-22 台湾积体电路制造股份有限公司 Die container workstation, system and method for processing die container
CN110449432B (en) * 2019-07-25 2024-02-23 老肯医疗科技股份有限公司 Automatic vehicle entering and exiting control system of cleaning machine and use method
WO2024105976A1 (en) * 2022-11-15 2024-05-23 村田機械株式会社 Transport vehicle system

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225380A (en) * 1986-03-27 1987-10-03 Minolta Camera Co Ltd Ink film cassette of thermal transfer printer
DE3713170A1 (en) * 1987-04-17 1988-11-03 Agfa Gevaert Ag PHOTOGRAPHIC DEVICE FOR THE PROCESSING OF PHOTOGRAPHIC REEL MATERIAL THAT CAN BE PLACED IN MOBILE CASSETTE
JPH03256629A (en) * 1990-03-08 1991-11-15 Canon Inc Commodity feeding method by transfer of commodity feeding member
DE59107083D1 (en) * 1991-06-24 1996-01-25 Gretag Imaging Ag Photographic copier
JPH0910446A (en) * 1995-06-30 1997-01-14 Aprica Kassai Inc Drawing toy for infants
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
JP3278714B2 (en) * 1996-08-30 2002-04-30 東京エレクトロン株式会社 Coating film forming equipment
US6451145B1 (en) * 1998-03-09 2002-09-17 Frontier Industrial Technology, Inc. Web splicing system
JP2000159099A (en) * 1998-11-27 2000-06-13 Nkk Corp Track-equipped dolly
JP3376935B2 (en) * 1999-01-25 2003-02-17 ウシオ電機株式会社 Exposure equipment for strip-shaped workpieces
JP2000303178A (en) * 1999-04-16 2000-10-31 Sanyo Electric Co Ltd Thin film forming device
JP4491779B2 (en) * 2004-06-28 2010-06-30 ノーリツ鋼機株式会社 magazine
JP4542836B2 (en) * 2004-06-29 2010-09-15 ルネサスエレクトロニクス株式会社 Transport cart
JP5157440B2 (en) * 2005-03-18 2013-03-06 コニカミノルタホールディングス株式会社 Manufacturing method of organic EL element
JP4969138B2 (en) * 2006-04-17 2012-07-04 大日本スクリーン製造株式会社 Substrate processing equipment
JP4409552B2 (en) * 2006-09-08 2010-02-03 住友重機械工業株式会社 Automatic roll feeder
KR101699983B1 (en) * 2007-11-15 2017-01-26 가부시키가이샤 니콘 Mask case, transfer apparatus, exposure apparatus, mask transfer method and device manufacturing method
JP5294141B2 (en) * 2008-03-25 2013-09-18 株式会社ニコン Display element manufacturing equipment
JP5407514B2 (en) * 2009-04-21 2014-02-05 株式会社明電舎 Method and apparatus for steering drive of automatic guided vehicle
JP2011098808A (en) 2009-11-05 2011-05-19 Nikon Corp Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element
JP5063712B2 (en) * 2010-01-26 2012-10-31 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
KR101816327B1 (en) * 2010-02-12 2018-01-08 가부시키가이샤 니콘 Substrate processing device
JP5494124B2 (en) * 2010-03-30 2014-05-14 大日本印刷株式会社 Pattern forming method, color filter manufacturing method, and pattern forming apparatus
KR101756628B1 (en) * 2010-04-09 2017-07-26 가부시키가이샤 니콘 Substrate processing device
JP5724564B2 (en) * 2010-04-13 2015-05-27 株式会社ニコン Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method
WO2011158584A1 (en) * 2010-06-18 2011-12-22 コニカミノルタホールディングス株式会社 Conveyance device and conveyance method for thin film glass
JP4691205B1 (en) * 2010-09-03 2011-06-01 日東電工株式会社 Method for producing optical film laminate including thin high-performance polarizing film
JP6011615B2 (en) * 2012-04-13 2016-10-19 株式会社ニコン Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method

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