WO2006070748A1 - Maintenance method, exposure device, and maintenance member - Google Patents

Maintenance method, exposure device, and maintenance member Download PDF

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Publication number
WO2006070748A1
WO2006070748A1 PCT/JP2005/023796 JP2005023796W WO2006070748A1 WO 2006070748 A1 WO2006070748 A1 WO 2006070748A1 JP 2005023796 W JP2005023796 W JP 2005023796W WO 2006070748 A1 WO2006070748 A1 WO 2006070748A1
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WO
WIPO (PCT)
Prior art keywords
substrate
maintenance
convex portion
holder
holding
Prior art date
Application number
PCT/JP2005/023796
Other languages
French (fr)
Japanese (ja)
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2006550762A priority Critical patent/JPWO2006070748A1/en
Publication of WO2006070748A1 publication Critical patent/WO2006070748A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Definitions

  • the present invention relates to a holder maintenance method, an exposure apparatus, and a maintenance member.
  • an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. It is done. The substrate is exposed while being held by the substrate holder. However, if there is a foreign substance on the substrate holder, the held substrate may be contaminated or the substrate may be locally deformed. Therefore, it is necessary to periodically maintain (clean) the substrate holder.
  • the following patent document discloses an example of a technique for cleaning the holding surface of the substrate holder.
  • Patent Document 1 Japanese Patent No. 3441956
  • the conventional technique has a configuration in which a grindstone is pressed against a holding surface using a pressing means for cleaning, but the pressing means must be provided separately, which complicates the apparatus configuration.
  • the present invention has been made in view of such circumstances, and an object thereof is to provide a maintenance method capable of maintaining a holder with a simple configuration. It is another object of the present invention to provide an exposure apparatus including a holder that is maintained by the maintenance method. Moreover, it aims at providing the maintenance member used suitably for the maintenance method.
  • an object (80) having a front surface (80A) and a back surface (80B) is used in a maintenance method of the holder (PH) having the holding portion (PH1). ) So that the front surface (80A) of the object (80) is in contact with the holding portion (PH1), and the holder (PH) is driven in a state where the back surface (80B) is not pressed. ) Is provided on the holding part (PH1).
  • the holder can be maintained with a simple configuration.
  • a maintenance method is provided in which the holder (PH) is driven to move the object (80) on the convex portion (46) to move the foreign matter adhering to the convex portion (46) to the concave portion (47).
  • the holder can be maintained with a simple configuration.
  • the first movable member having the holding portion (PH1) capable of holding the first substrate (P) ( PH), and the second substrate (80) having the front surface (80A) and the back surface (80B) is transferred so that the front surface (80A) of the second substrate (80) is in contact with the holding portion (PH1).
  • An exposure apparatus (EX) comprising SD 1) is provided.
  • the first movable member maintained with a simple configuration is the first movable member.
  • SD1 drive device
  • the first movable member maintained with a simple configuration is the first movable member.
  • the maintenance member (80) performs maintenance of the holding portion (PH) that holds the object (P), and the outer shape of the maintenance member is the outer shape of the object (P). A smaller maintenance member (80) is provided.
  • the holder can be maintained with a simple configuration, and the substrate can be held in the maintained holder and exposed accurately.
  • FIG. 1 is a schematic block diagram showing an embodiment of an exposure apparatus.
  • FIG. 2 is a side sectional view showing an embodiment of a substrate holder.
  • FIG. 3 is a plan view showing an embodiment of a substrate holder in a state where a substrate is held.
  • FIG. 4 is a plan view showing an embodiment of a substrate holder.
  • FIG. 5 is a plan view showing the substrate holder with the plate member removed.
  • FIG. 6A is a view showing a maintenance member according to the first embodiment.
  • FIG. 6B is a diagram showing a maintenance member according to the first embodiment.
  • FIG. 7A is a diagram for explaining a maintenance method according to the first embodiment.
  • FIG. 7B is a diagram for explaining the maintenance method according to the first embodiment.
  • FIG. 8A is a diagram for explaining a maintenance method according to the first embodiment.
  • FIG. 8B is a diagram for explaining the maintenance method according to the first embodiment.
  • FIG. 9 is a diagram for explaining an example of operations of a substrate stage and a measurement stage.
  • FIG. 10A is a diagram for explaining an example of operations of a substrate stage and a measurement stage.
  • FIG. 10B is a diagram for explaining an example of operations of the substrate stage and the measurement stage.
  • FIG. 11A is a diagram for explaining an example of operations of a substrate stage and a measurement stage.
  • FIG. 11B is a diagram for explaining an example of operations of the substrate stage and the measurement stage.
  • FIG. 12A is a diagram for explaining a maintenance method according to a second embodiment.
  • FIG. 12B is a diagram for explaining a maintenance method according to the second embodiment.
  • FIG. 12C is a view for explaining a maintenance method according to the second embodiment.
  • FIG. 13A is a diagram for explaining a maintenance method according to a second embodiment.
  • FIG. 13B is a view for explaining a maintenance method according to the second embodiment.
  • FIG. 13C is a view for explaining a maintenance method according to the second embodiment.
  • FIG. 14A is a diagram for explaining a maintenance method according to a second embodiment.
  • FIG. 14B is a view for explaining a maintenance method according to the second embodiment.
  • FIG. 15 is a diagram for explaining a maintenance method according to a second embodiment.
  • FIG. 16A is a diagram for explaining a maintenance method according to a third embodiment.
  • FIG. 16B is a diagram for explaining a maintenance method according to the third embodiment.
  • FIG. 17A is a view for explaining a maintenance method according to the fourth embodiment.
  • FIG. 17B is a view for explaining a maintenance method according to the fourth embodiment.
  • FIG. 18A is a view for explaining a maintenance method according to the fourth embodiment.
  • FIG. 18B is a view for explaining a maintenance method according to the fourth embodiment.
  • FIG. 19 is a diagram for explaining a maintenance method according to the fourth embodiment.
  • FIG. 20 is a view showing an example of a maintenance member according to the fifth embodiment.
  • FIG. 21 is a view showing another example of the maintenance member according to the fifth embodiment.
  • FIG. 22 is a view showing another example of the maintenance member according to the fifth embodiment.
  • FIG. 23A is a view for explaining a maintenance method according to a sixth embodiment.
  • FIG. 23B is a view for explaining a maintenance method according to the sixth embodiment.
  • FIG. 24A is a view for explaining a maintenance method according to a seventh embodiment.
  • FIG. 24B is a view for explaining a maintenance method according to the seventh embodiment.
  • FIG. 25 is a flowchart for explaining an example of a manufacturing process of a micro device.
  • FIG. 1 is a schematic block diagram showing an embodiment of the exposure apparatus EX.
  • an exposure apparatus EX includes a mask holder MH that holds a mask M, a mask stage MST that can move the mask holder MH that holds a mask M, a substrate holder PH that holds a substrate P, The substrate stage ST1 that can move the substrate holder PH that holds the substrate P, and the measurement stage ST2 that can be moved with a measuring instrument that measures exposure, and the mask M on the mask stage MST are illuminated with exposure light EL.
  • Control system CONT that controls the overall operation of the projection optical system PL and the exposure apparatus EX that project and expose the pattern image of the mask M illuminated by the illumination optical system IL and exposure light EL onto the substrate P on the substrate stage ST1. It is equipped with.
  • the exposure apparatus EX includes a transfer device 300 that transfers the substrate P to the substrate holder PH.
  • the exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus.
  • an immersion apparatus 1 for forming an immersion area LR of the liquid LQ on the image plane side of the projection optical system PL is provided.
  • the liquid immersion device 1 is provided in the vicinity of the image plane side of the projection optical system PL, and is provided in the nozzle member 70 having a supply port 12 for supplying the liquid LQ and a recovery port 22 for recovering the liquid LQ, and the nozzle member 70.
  • the liquid supply unit 11 for supplying the liquid LQ to the image plane side of the projection optical system PL via the supply port 12 and the supply pipe 13, the recovery port 22 provided in the nozzle member 70 and the circuit
  • a liquid recovery unit 21 that recovers the liquid LQ on the image plane side of the projection optical system PL via the collecting tube 23 is provided.
  • the nozzle member 70 is formed in an annular shape so as to surround the image plane side tip of the projection optical system PL.
  • the liquid immersion device 1 transfers a part of the projection optical system PL including the projection area AR to a part of the substrate P by the liquid LQ supplied from the liquid supply unit 11 while at least transferring the pattern image of the mask M onto the substrate P.
  • the exposure apparatus EX includes a lower surface of the first optical element LSI closest to the image plane of the projection optical system PL and a part of the upper surface Pa of the substrate P arranged on the image plane side of the projection optical system PL.
  • the exposure light EL that has passed through the mask M via the liquid LQ that forms the immersion area LR and the projection optical system PL is applied to the substrate P.
  • the pattern of the mask M is projected and exposed to the substrate P by irradiation.
  • exposure apparatus EX a scanning type in which mask M and substrate P are synchronously moved in mutually different directions (reverse directions) in the scanning direction, and a pattern formed on mask M is exposed to the substrate.
  • a case where an exposure apparatus (so-called scanning stepper) is used will be described as an example.
  • the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the X axis direction
  • the direction orthogonal to the X axis direction is the Y axis direction (non-scanning direction) and the X axis in the horizontal plane.
  • the direction perpendicular to the Y-axis direction and coincident with the optical axis AX of the projection optical system PL is the Z-axis direction.
  • the rotation (tilt) directions around the X, Y, and Z axes are the ⁇ ⁇ ⁇ ⁇ , ⁇ , and ⁇ directions, respectively.
  • the “substrate” includes a substrate in which a photosensitive material (resist) is coated on a base material such as a semiconductor wafer
  • the “mask” includes a reticle on which a device pattern to be projected on the substrate is reduced. .
  • the illumination optical system IL includes an exposure light source, an optical cannula integrator that equalizes the illuminance of the light beam emitted from the exposure light source, a condenser lens that collects the exposure light EL from the optical cannula integrator, It has a relay lens system and a field stop for setting the illumination area on the mask ⁇ ⁇ ⁇ with exposure light EL.
  • the predetermined illumination area on the mask ⁇ is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL.
  • Illumination optical system IL force Emission exposure light EL includes, for example, mercury lamp force emission lines (g-line, h-line, i-line) and far ultraviolet light (DUV light such as KrF excimer laser light (wavelength 248 nm)) ) Or ArF excimer laser light ( Used for vacuum ultraviolet light (VUV light) such as wavelength 193 nm) and F laser light (wavelength 157 nm)
  • ArF excimer laser light is used.
  • pure water is used as the liquid LQ.
  • Pure water is not only ArF excimer laser light, but also far ultraviolet light (DUV light) such as bright lines emitted from mercury lamps (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm). Can also be transmitted.
  • DUV light far ultraviolet light
  • the mask stage MST can move a mask holder MH holding the mask M.
  • the mask holder MH holds the mask M by vacuum suction.
  • the mask stage MST moves the mask holder MH holding the mask M in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, XY by driving a drive device MD including a linear motor controlled by the control device CONT. It can move two-dimensionally in the plane and can rotate slightly in the ⁇ Z direction.
  • a movable mirror 31 is provided on the mask holder MH.
  • a laser interferometer 32 is provided at a position facing the movable mirror 31.
  • the position of the mask M on the mask holder MH in the two-dimensional direction and the rotation angle in the ⁇ Z direction are measured in real time by the laser interferometer 32.
  • the measurement result of the laser interferometer 32 is output to the control device CONT.
  • the control device CONT drives the drive device MD based on the measurement result of the laser interferometer 32, and controls the position of the mask M held by the mask holder MH.
  • the projection optical system PL projects and exposes the pattern of the mask M onto the substrate ⁇ at a predetermined projection magnification ⁇ , and is composed of a plurality of optical elements, which are held by a lens barrel Pice. ing.
  • the projection optical system PL is a reduction system having a projection magnification i3 of, for example, 1/4, 1/5, or 1/8.
  • the projection optical system PL may be a unity magnification system or an enlargement system.
  • the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element.
  • the first optical element LSI closest to the image plane of the projection optical system PL is exposed from the lens barrel PK.
  • Substrate stage ST1 can move substrate holder PH holding substrate P on the image plane side of projection optical system PL.
  • the substrate stage ST1 supports the substrate holder PH,
  • the base member BP is movably provided.
  • the substrate stage ST1 is driven by the substrate stage drive device SD1.
  • the substrate stage drive device SD1 is configured to include, for example, a linear motor, and includes an XY drive device that moves the substrate stage ST1 in the X axis direction, the Y axis direction, and the ⁇ Z direction, and a voice coil motor, for example. And a Z driving device that moves the substrate stage ST1 in the Z-axis direction, ⁇ X direction, and ⁇ Y direction.
  • the upper surface Pa of the substrate P held by the substrate holder PH can be moved in the direction of 6 degrees of freedom in the X axis, Y axis, Z axis, ⁇ ⁇ , ⁇ ⁇ , and ⁇ ⁇ directions. is there.
  • a movable mirror 33 is provided on the side surface of the substrate holder ⁇ .
  • a laser interferometer 34 is provided at a position facing the movable mirror 33. The position and rotation angle of the substrate ⁇ on the substrate holder ⁇ are measured in real time by the laser interferometer 34.
  • the exposure apparatus has an oblique incidence type for force that detects surface position information of the upper surface Pa of the substrate that is supported by the substrate holder, as disclosed in, for example, Japanese Patent Laid-Open No. 8-37149.
  • a leveling detection system 35 is provided.
  • the focus / leveling detection system 35 is arranged in a predetermined positional relationship with respect to the detection light La and a projection unit 35A that irradiates the detection light La onto the upper surface Pa of the substrate P held by the substrate holder PH.
  • a light receiving unit 35B that receives reflected light of the detection light La reflected by the upper surface Pa of the substrate P.
  • the control device CONT Based on the detection result of the light receiving unit 35B, surface position information (in the Z-axis direction) of the upper surface Pa of the substrate P Position information and inclination information in the ⁇ X and ⁇ Y directions).
  • the measurement result of the laser interferometer 34 is output to the control device CONT.
  • the detection result of the force leveling detection system 35 is also output to the control device CONT.
  • the control device CONT drives the substrate stage drive device SD1 based on the detection result of the focus / leveling detection system 35, and determines the focus position (Z position) and tilt angle ( ⁇ X, ⁇ Y) of the substrate P.
  • the measurement stage ST2 is equipped with various measuring instruments (including measurement members) that perform measurement related to exposure, and is movable on the image plane side of the projection optical system PL.
  • this measuring instrument as disclosed in, for example, Japanese Patent Publication No. 5-21314, a reference mark plate on which a plurality of reference marks are formed, for example, disclosed in Japanese Patent Application Laid-Open No. 57-117238.
  • To illuminance A non-uniformity sensor for measuring the amount of fluctuation in the transmittance of the exposure light EL of the projection optical system PL as disclosed in JP 2001-267239, disclosed in JP 2002-14005 A And a dose sensor (illuminance sensor) as disclosed in JP-A-11-16816.
  • Such a measurement stage ST2 is disclosed in detail, for example, in Japanese Patent Laid-Open No. 11-135400.
  • Measurement stage ST2 is a projection optical system on the image plane side of projection optical system PL in a state where a measurement instrument is mounted by driving measurement stage drive device SD2 including a linear motor and the like controlled by control device CONT. It can move two-dimensionally in the XY plane that is almost parallel to the image plane of the system PL, and can rotate slightly in the ⁇ Z direction. Furthermore, the measurement stage ST2 can move in the Z-axis direction, ⁇ X direction, and ⁇ Y direction. That is, the measurement stage ST2 can also move in the direction of six degrees of freedom in the X-axis, Y-axis, Z-axis, ⁇ , ⁇ , and ⁇ directions, similar to the substrate stage ST1.
  • a movable mirror 37 is provided on the side surface of the measurement stage ST2. Further, a laser interferometer 38 is provided at a position facing the moving mirror 37. The two-dimensional position and rotation angle of the measurement stage ST2 are measured in real time by the laser interferometer 38.
  • an off-axis type alignment system ALG that detects the alignment mark on substrate P and the reference mark on the reference mark plate provided on measurement stage ST2 is provided. Yes.
  • a target detection mark is irradiated with a broadband detection light beam that does not expose the photosensitive material on the substrate P as disclosed in, for example, Japanese Patent Laid-Open No. 4-65603, and the target mark is irradiated.
  • the FIA field 'image' alignment method, which measures the position of the mark by processing the image signals and processing these image signals, is used.
  • FIGS. 2 is a side sectional view of the substrate holder PH holding the substrate P
  • FIG. 3 is a plan view of the substrate holder PH holding the substrate P as viewed from above.
  • the substrate holder PH is formed on the base material PHB, the first holding portion PH1 formed on the base material PHB, and adsorbs and holds the substrate P, and formed on the base material PHB, and the first holding portion PH1.
  • a second holding portion PH2 for adsorbing and holding a plate member T that forms an upper surface Ta that is substantially flush with the upper surface Pa of the substrate P is provided around the substrate P held by the substrate P.
  • the plate member T is a member different from the base material PHB, and is provided so as to be detachable (replaceable) with respect to the base material PHB of the substrate holder PH. As shown in FIG.
  • a substantially circular hole TH in which the substrate P can be placed is formed at the center of the plate member T.
  • the plate member T held by the second holding part PH2 is disposed so as to surround the periphery of the substrate P held by the first holding part PH1.
  • the plate member T is liquid repellent with respect to the liquid LQ.
  • the plate member T is formed of a material having liquid repellency such as a fluorine-based resin such as polytetrafluoroethylene (Teflon (registered trademark)) or an acrylic resin.
  • the plate member T may be formed of metal or the like, and the surface thereof may be covered with a liquid repellent material such as a fluorine-based resin.
  • each of the upper surface Ta and the lower surface Tb of the plate member T is a flat surface (flat portion). Further, the plate member T has substantially the same thickness as the substrate P.
  • the upper surface (flat surface) Ta of the plate member T held by the second holding part PH2 and the upper surface Pa of the substrate P held by the first holding part PH1 are substantially flush.
  • the outer shape of the plate member T is formed in a rectangular shape in plan view, and is formed to be larger than the outer shape of the substrate PHB. That is, the peripheral edge portion of the plate member T held by the second holding portion PH2 is an overhang portion HI that protrudes outward from the side surface of the base material PHB.
  • the movable mirror 33 is located in the area below the overhang portion HI. Is provided. Thereby, even if the liquid LQ flows out from the upper surface Ta, it is possible to prevent the liquid LQ from adhering to the movable mirror 33 by the overhang portion H1.
  • the first holding portion PH1 of the substrate holder PH includes a plurality of first convex portions 46 formed on the base material PHB, and a plurality of first convex portions 46. And an annular first peripheral wall portion 42 formed on the base material PHB so as to surround the periphery.
  • the first protrusion 46 supports the lower surface Pb of the substrate P.
  • a first recess 47 is provided between the plurality of first protrusions 46.
  • the first peripheral wall portion 42 is formed in a substantially circular shape in plan view according to the shape of the substrate P, and the upper surface 42A of the first peripheral wall portion 42 is opposed to the peripheral region (edge region) of the lower surface Pb of the substrate P. Is formed.
  • a first space 131 surrounded by the base material PHB, the first peripheral wall portion 42, and the lower surface Pb of the substrate P is formed on the lower surface Pb side of the substrate P held by the first holding portion PH1.
  • a first suction port 41 is formed on the base material PHB inside the first peripheral wall portion 42.
  • the first suction port 41 is for holding the substrate P by suction, and is provided at a plurality of predetermined positions other than the first convex portion 46 on the upper surface of the base material PHB inside the first peripheral wall portion 42. ing.
  • Each of the first suction ports 41 is connected to a first pressure adjusting device 40 including a vacuum system via a flow path 45.
  • the control device CONT drives the first pressure adjusting device 40 and sucks the gas (air) inside the first space 131 surrounded by the base material PH B, the first peripheral wall portion 42 and the substrate P, and this first The substrate P is sucked and held on the first convex portion 46 by making the space 131 negative.
  • the first holding portion PH1 in the present embodiment constitutes a so-called pin chuck mechanism.
  • the second holding part PH2 of the substrate holder PH includes a substantially annular second peripheral wall part 62 formed on the base material PHB so as to surround the first peripheral wall part 42 of the first holding part PH1, and a second An annular third peripheral wall portion 63 formed on the substrate PHB so as to surround the second peripheral wall portion 62 and provided between the second peripheral wall portion 62 and the third peripheral wall portion 63. And a plurality of second convex portions 66 formed on the base material PHB. The second convex portion 66 supports the lower surface Tb of the plate member T. A second recess 67 is provided between the plurality of second protrusions 66.
  • the second peripheral wall 62 is formed in a substantially annular shape in plan view according to the shape of the hole TH of the plate member T.
  • the third peripheral wall 63 is formed so as to be inward of the outer edge portion of the plate member T and to be formed in a substantially rectangular shape in plan view.
  • the upper surface 62A of the second peripheral wall portion 62 is formed to face the inner edge region (inner edge region) in the vicinity of the hole TH in the lower surface Tb of the plate member T.
  • Upper surface of third peripheral wall 63 63A is formed so as to face a region slightly inside the outer edge region (outer edge region) of the lower surface Tb of the plate member T.
  • the second space 132 surrounded by the base material PHB, the second and third peripheral wall portions 62, 63, and the lower surface Tb of the plate member T 132 Is formed.
  • a second suction port 61 is formed on the base material PHB between the second peripheral wall 62 and the third peripheral wall 63.
  • the second suction port 61 is for adsorbing and holding the plate member T.
  • the second suction port 61 other than the second convex portion 66 on the upper surface of the base material PHB. It is provided at each of a plurality of predetermined positions.
  • Each of the second suction ports 61 is connected to a second pressure adjusting device 60 including a vacuum system via a flow path 65.
  • the control device C0 NT drives the second pressure adjusting device 60, and the gas (air) in the second space 132 surrounded by the base material PHB, the second and third peripheral walls 62 and 63, and the plate member T is provided. ) To create a negative pressure in the second space 132, the plate member T is sucked and held on the second convex portion 66.
  • the second holding portion PH2 also constitutes a so-called pin chuck mechanism.
  • the side surface Pc of the substrate P held by the first holding portion PH1, and the inner side surface Tc of the plate member T provided on the outside of the substrate P on the side of the hole TH A gap A of about 0.:! To 1 .Omm is formed between them.
  • the gap A By setting the gap A to about 0.:! To 1. Omm, the liquid LQ can be prevented from entering the substrate holder PH through the gap A.
  • the liquid LQ of the liquid immersion device 1 By moving the substrate holder PH in the XY direction with respect to the projection optical system PL while supplying and collecting, the liquid immersion region LR moves smoothly between the upper surface Pa of the substrate P and the upper surface Ta of the plate member T. be able to.
  • the first pressure adjustment device 40 that adjusts the pressure in the first space 131 and the second pressure adjustment device 60 that adjusts the pressure in the second space 132 are independent of each other.
  • the control device CONT can individually control the operations of the first pressure adjusting device 40 and the second pressure adjusting device 60, and the first pressure adjusting device 40 performs the suction operation on the first space 131 and the second pressure adjusting device.
  • the suction operation to the second space 132 by 60 can be performed independently of each other.
  • the control device CONT controls the first pressure adjustment device 40 and the second pressure adjustment device 60, respectively.
  • the pressure in the first space 131 and the pressure in the second space 132 can be made different from each other.
  • the substrate P is detachable from the first holding portion PH1, and the substrate P can be detached from the first holding portion PH1 by releasing the suction operation by the first pressure adjusting device 40. .
  • the plate member T can be attached to and detached from the second holding portion PH2, and the plate member T can be removed from the second holding portion PH2 by releasing the suction operation by the second pressure adjusting device 60. it can.
  • FIG. 4 shows a state where the substrate P is removed from the first holding part PH1.
  • FIG. 5 shows a state in which the substrate P and the plate member T are removed from the first and second holding portions PH1 and PH2, respectively.
  • the maintenance method will be described.
  • a case will be described in which the first holder PH1 that holds the substrate P among the substrate holder PH is maintained. More specifically, a case where foreign matter on the upper surface 46A of the first convex portion 46 of the first holding portion PH1 is removed will be described.
  • the foreign matter includes, for example, a resist peeling material generated from the substrate P, a foreign matter floating in the air, or a dry residue of the liquid LQ.
  • FIGS. 6A and 6B are views showing an example of the maintenance member, FIG. 6A is a side view, and FIG. 6B is a plan view.
  • the maintenance member 80 is a plate-like member, and has a front surface 8OA and a back surface 80B.
  • the maintenance member 80 has substantially the same shape as the substrate P, and is formed in a substantially circular shape in plan view.
  • the outer shape of the maintenance member 80 is substantially the same as or smaller than the outer shape of the substrate P.
  • the thickness of the maintenance member 80 is almost the same as the thickness of the substrate P.
  • the front surface 80A and the back surface 80B of the maintenance member 80 are substantially flat surfaces.
  • Maintenance member 80 is formed of, for example, ceramics or stainless steel.
  • the maintenance member 80 may be made of a fluorine resin such as Teflon (registered trademark).
  • Teflon registered trademark
  • the first convex portion 46 with less outgas is used as a material for forming the maintenance member 80. Accordingly, it is preferable that the first convex portion 46 has a strength equal to or less than that of the first convex portion 46. Prevent wear of first convex part 46 Because.
  • the maintenance member 80 may be formed of the same material (including silicon) as the substrate P.
  • FIGS. 7A and 7B are views for explaining a method of maintaining the first holding portion PH1 of the substrate holder PH.
  • the transfer device 300 can transfer the substrate P to the first holding part PH1 of the substrate holder PH, and loads (loads) the substrate P into the substrate holder PH (first holding part PH1). In addition, the substrate P can be unloaded from the substrate holder PH (first holding portion PH1).
  • the maintenance member 80 has a size and a shape that can be transferred by the transfer device 300 that transfers the substrate P. Even when the outer shape of the maintenance member 80 is smaller than the outer shape of the substrate P, the maintenance member 80 is large enough to be transported by the transport device 300.
  • the transfer device 300 moves the maintenance member 80 from the first holding portion P HI of the substrate holder PH so that the surface 80A of the maintenance member 80 contacts the upper surface 46A of the first convex portion 46 of the first holding portion PH1. Transport to. Then, the transport apparatus 300 places the maintenance member 80 on the first convex portion 46 of the first holding portion PH1 so that the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 are in contact with each other.
  • FIG. 7B shows a state in which the maintenance member 80 is placed on the first convex portion 46 of the first holding portion PH1.
  • the control device CONT drives the substrate stage ST1 using the substrate stage drive device SD1, and the substrate supported by the substrate stage ST1.
  • Drive holder PH At this time, the driving of the first pressure adjusting device 40 is stopped. That is, the first space 131 formed between the maintenance member 80 and the substrate holder PH is almost atmospheric pressure.
  • the substrate stage drive device SD1 places the maintenance member 80 on the first convex portion 46 of the first holding portion PH1 and drives the substrate holder PH (substrate stage ST1) without pressing the back surface 80B of the maintenance member 80. By its substrate The maintenance member 80 can be slid on the first convex portion 46 by the inertial force generated by driving the holder PH.
  • the substrate stage driving device SD1 is arranged in a horizontal plane (in the XY plane, the upper surface of the first convex portion 46 with the maintenance member 80 placed on the first convex portion 46.
  • the substrate holder PH is driven at a predetermined acceleration in a predetermined direction (within a plane substantially parallel to 46A), and then suddenly stopped, so that the maintenance member 80 is horizontal with respect to the upper surface 46A of the first convex portion 46. Can be slid into.
  • the upper surface of the first convex portion 46 is moved along with the movement of the maintenance member 80, as shown in the schematic diagram of FIG. 8B.
  • the force S can be moved by moving the foreign matter 46A to the first concave portion 47 provided at a position adjacent to the first convex portion 46.
  • the foreign matter attached to the upper surface 46A of the first convex portion 46 can be wiped off to the first concave portion 47 by sliding the maintenance member 80 on the first convex portion 46.
  • the maintenance member 80 When the maintenance member 80 is slid on the first convex portion 46, the maintenance member 80 is good on the first convex portion 46 according to at least one of the friction coefficient of the maintenance member 80 and the weight of the maintenance member 80.
  • the acceleration when driving the substrate holder PH is set so as to slide. Further, the substrate stage driving device SD1 may reciprocate (vibrate) the substrate holder PH in a predetermined direction in a horizontal plane. By doing so, the substrate holder PH repeatedly accelerates and stops, so that the maintenance member 80 can be satisfactorily slid on the first convex portion 46 by the inertia force generated by driving the substrate holder PH.
  • the surface 80A of the maintenance member 80 is in contact with the upper surface 46A of the first convex portion 46, and functions as a maintenance surface for maintaining the upper surface 46A. Therefore, specifically, in order to perform a good maintenance work, it is possible to slide well on the upper surface 46A of the first convex portion 46, and even if it slides on the upper surface 46A, foreign matter is generated from the upper surface 46A and the surface 80A. As such, the surface 80A condition such as friction coefficient and hardness is optimized.
  • the relative distance that the maintenance member 80 moves with respect to the upper surface 46A of the first convex portion 46 is preferably larger than the size of the upper surface 46A. Thereby, the foreign object on the first convex portion 46 can be smoothly moved to the first concave portion 47.
  • the plate member T held by the second holding portion PH2 is disposed outside the maintenance member 80 placed on the first convex portion 46 of the first holding portion PH1.
  • the maintenance member 80 is configured to slide inside the hole TH (inner side surface Tc) of the plate member T. That is, the sliding amount (movement amount) of the maintenance member 80 is limited by the inner surface Tc of the plate member T.
  • the plate member T is arranged as a limiting member for limiting the slip amount (movement amount) of the maintenance member 80 on the first convex portion 46, the above-described problem is not caused. Occurrence is prevented.
  • the maintenance member 80 can be arranged inside the hole TH of the plate member T by making the outer shape of the maintenance member 80 substantially the same as the outer shape of the substrate P or smaller than the outer shape of the substrate P.
  • the maintenance member 80 can be smoothly slid inside the hole TH of the plate member T by making the outer shape of the maintenance member 80 smaller than the outer shape of the substrate P.
  • the outer shape of the maintenance member 80 and the outer shape of the substrate P are substantially the same, when the maintenance member 80 is disposed inside the hole TH of the plate member T, the maintenance member 80 and the plate member T In the meantime, only the gap corresponding to the above gap A is secured.
  • the slip amount (movement amount) when the maintenance member 80 is slid on the first convex portion 46 is a slight distance corresponding to the gap A, the foreign matter on the upper surface 46A of the first convex portion 46 is removed from the first convex portion 46. It may be difficult to move smoothly to the recess 47. Therefore, by setting the outer shape of the maintenance member 80 to such an extent that a gap corresponding to the target slip amount (movement amount) of the maintenance member 80 on the first convex portion 46 can be secured with the plate member T, The maintenance member 80 can be smoothly slid inside the hole TH of the plate member T.
  • the control device COONT carries out the maintenance member 80 from the substrate holder PH by using the transport device 300.
  • the maintenance member 80 that has undergone maintenance work may have a foreign surface adhering to or contaminated on the surface 80A. preferable. Also, the contaminated maintenance member 80 may be replaced with a new one.
  • the maintenance member 80 is placed on the first convex portion 46, and the substrate holder PH is driven to slide on the first convex portion 46. Foreign matter on the first convex portion 46 can be removed.
  • the substrate P is held on the first convex portion 46 of the first holding portion PH1 from which the foreign matter has been removed, and contamination of the substrate P and local deformation (deterioration of flatness) of the substrate P are suppressed.
  • the substrate P can be exposed with high accuracy.
  • the maintenance member 80 is transported to the substrate holder PH by the transport device 300 for transporting the substrate P, maintenance work can be performed using an existing device configuration without providing a complicated mechanism for performing maintenance work. It can be performed.
  • the substrate holder PH can be maintained without removing the substrate holder PH provided with the movable mirror 33 from the substrate stage ST1, when the substrate holder PH is taken out of the exposure apparatus EX, the movable mirror due to a temperature change is taken. Maintenance time can be significantly reduced because there is no thermal change in the temperature and temperature change in the space around the substrate stage ST1.
  • FIG. 9 shows the substrate stage ST1 (substrate holder PH) and the measurement stage ST2 as viewed from above.
  • the controller CONT separates the substrate stage ST1 (substrate holder PH) from the measurement stage ST2, and performs projection exposure on the projection optical system PL and the substrate P on the substrate holder PH. Facing each other.
  • the control device CONT moves at least one of the substrate stage ST1 and the measurement stage ST2 using the driving devices SD1 and SD2, and is shown in FIG. 10A.
  • the upper surface F of the measurement stage ST2 is brought into contact with (or close to) the upper surface Ta of the plate member T of the substrate holder PH.
  • the upper surface F of the measurement stage ST2 is a flat surface similar to the upper surface Ta of the plate member T, and the control device CONT uses the drive devices SD1 and SD2 to measure the upper surface Ta of the plate member T of the substrate holder PH.
  • the control device CONT uses the drive devices SD1 and SD2 to measure the upper surface Ta of the plate member T of the substrate holder PH.
  • control device CONT uses the drive devices SD1 and SD2 to maintain the relative positional relationship between the substrate stage ST1 (substrate holder PH) and the measurement stage ST 2 in the Y-axis direction. Move stage ST1 and measurement stage ST2 together in the Y direction. control The apparatus CONT moves the substrate stage ST1 and the measurement stage ST2 together, so that the immersion area LR of the liquid LQ held between the first optical element LSI of the projection optical system PL and the substrate P Can be moved from the upper surface Ta of the plate member T of the substrate holder PH to the upper surface F of the measurement stage ST2.
  • the control device CONT uses the substrate stage driving device SD1 to move the substrate stage ST1 to a predetermined substrate exchange position RP.
  • the control device C0NT performs a predetermined measurement process using the measurement stage ST2 as necessary.
  • An example of this measurement is the baseline measurement of alignment ALG.
  • a pair of first reference marks on the reference mark plate FM provided on the measurement stage ST2 and a corresponding mask alignment mark on the mask M are connected to the mask alignment system described above. RAa and RAb are used for simultaneous detection and the positional relationship between the first reference mark and the corresponding mask alignment mark is detected.
  • the control device CONT detects the second reference mark on the reference mark plate FM with the alignment ALG to detect the positional relationship between the alignment reference position of the alignment ALG and the second reference mark. .
  • the control device CONT determines the positional relationship between the first reference mark and the corresponding mask alignment mark, the positional relationship between the alignment reference position of the alignment ALG and the second reference mark, the known first reference mark and the first reference mark. 2 Based on the positional relationship with the reference mark, the distance (positional relationship) between the projection center of the projection optical system PU and the detection reference position of the alignment system ALG, that is, the baseline information of the alignment system ALG Ask.
  • FIG. 11B shows this state.
  • the measurement operation is not limited to baseline measurement, but also includes illuminance measurement, illuminance unevenness measurement, and aerial image measurement using the measurement stage ST2, and the control device CONT performs projection based on the measurement result, for example.
  • Optical system You may make it reflect in exposure of the board
  • the control device CONT After moving the substrate stage ST1 (substrate holder PH) to the substrate replacement position RP, the control device CONT uses the transfer device 300 to transfer the exposed substrate P on the substrate holder PH at the substrate replacement position RP.
  • the above-described maintenance member 80 is loaded onto the first holding portion PH1 of the substrate holder PH using the transfer device 300.
  • the controller CONT drives the substrate stage driving device SD1 and the substrate holder PH at the substrate replacement position RP. That is, the control device CONT drives the substrate stage driving device SD1 when the substrate stage ST1 (substrate holder PH) is positioned in the vicinity of the transfer device 300, and drives the substrate holder PH on which the maintenance member 80 is mounted. .
  • the control device CONT performs a predetermined process by the measurement stage ST2. That is, in the present embodiment, the control device CONT drives the substrate stage at the substrate exchange position RP near the transfer device 300 while performing the predetermined processing by the measurement stage ST2 near the projection optical system PL. Device SD1 is driven to perform maintenance work using maintenance member 80.
  • the control device CONT After performing the maintenance work using the maintenance member 80 at the substrate replacement position RP, the control device CONT uses the transfer device 300 to carry out the maintenance member 80 from the substrate holder PH, and the carried maintenance member 80. If necessary, perform cleaning treatment. Then, the control device CONT loads the substrate P to be exposed using the transport device 300 to the maintained substrate holder PH.
  • the control device CONT After the loading of the substrate P to the substrate holder PH is completed and the measurement process by the measurement stage S T2 is completed, the control device CONT, for example, the upper surface F of the measurement stage ST2 and the plate member T of the substrate holder PH. With the upper surface Ta in contact with (or close to) the substrate, move in the XY plane while maintaining the relative positional relationship, and perform the alignment process on the replaced substrate P. Specifically, the control device CONT uses the alignment system ALG to detect the alignment mark on the substrate P after replacement, and the position coordinates of each of the plurality of shot areas provided on the substrate P ( Determine the array coordinates.
  • the control device CONT contrary to the previous case, the substrate holder PH (substrate stage ST1 ) And measurement stage ST2 while maintaining the relative positional relationship in the Y-axis direction, move both stages S Tl and ST2 together in the + ⁇ direction to move the substrate stage ST1 (substrate ⁇ ) to the projection optical system ⁇
  • measurement stage ST2 is retracted to a predetermined position.
  • the immersion region LR is arranged on the upper surface Ta of the plate member ⁇ of the substrate holder ⁇ .
  • control device CONT performs an exposure operation on the substrate P, and sequentially transfers the pattern of the mask M to each of the plurality of shot regions on the substrate P.
  • the alignment of each shot area on the substrate with respect to the mask M is measured immediately before the position coordinates of the plurality of shot areas on the substrate P obtained as a result of the alignment mark detection on the substrate P described above. Based on baseline information.
  • FIG. 12A is a diagram showing a detection device 36 that can detect the presence or absence of foreign matter on the first convex portion 46.
  • the detection device 36 includes a projection unit 36A for irradiating the back surface 80B of the maintenance member 80 held by the first holding unit PH1 of the substrate holder PH with the detection light Lb from an oblique direction, and a predetermined value for the detection light Lb.
  • a light receiving unit 36B capable of receiving the reflected light of the detection light Lb reflected by the back surface 80B of the maintenance member 80.
  • the detection device 36 is provided in the vicinity of the substrate replacement position RP as described with reference to FIG. 11B.
  • the detection process using the detection device 36 and the maintenance work using the maintenance member 80 at the board replacement position RP and at least a part of the measurement process by the measurement stage ST2 are performed in parallel.
  • the apparatus 300 places the maintenance member 80 on the first convex portion 46.
  • the control device CONT uses the first pressure adjusting device 40 to make the pressure in the first space 131 formed between the maintenance member 80 and the substrate holder PH negative, and to the first convex portion 46.
  • Maintenance member 80 is sucked and held.
  • the maintenance member 80 has such a size that the surface 80A and the upper surface 42A of the first peripheral wall portion 42 can face each other, the first space 131 can be set to a negative pressure.
  • the control device CONT irradiates the detection light Lb from an oblique direction to the back surface 80B of the maintenance member 80 held by the first convex portion 46 from the projection portion 36A of the detection device 36. Since the local shape of the back surface 80B of the maintenance member 80 is different between the case where there is a foreign object on the top surface 46A of the first convex portion 46 and the case where there is no foreign material, the back surface 80B is irradiated with the detection light Lb. The light receiving state (light receiving position) at the light receiving part 36B of the detection light Lb reflected by 80B is different. Thereby, the presence or absence of foreign matter on the upper surface 46A of the first convex portion 46 can be detected.
  • the detection device 36 is based on the surface information of the back surface 80B opposite to the front surface 80A facing the top surface 46A of the maintenance member 80 attracted and held on the top surface 46A of the first convex portion 46. It is possible to detect whether or not there is a foreign substance on the upper surface 46A of the first convex portion 46.
  • each of the front surface 80A and the back surface 80B of the maintenance member 80 is substantially flat, so that the detection device 36 can accurately detect the presence or absence of foreign matter.
  • the control device CONT releases the adsorption holding of the maintenance member 80 by the first holding portion PH1, as shown in FIG. 12B. After that, the substrate holder PH is driven, and maintenance work using the maintenance member 80 is executed. On the other hand, if it is determined that there is no foreign object, the controller CONT will not perform maintenance work using the maintenance member 80. As a result, it is possible to prevent the maintenance work from being performed even though there is no foreign object.
  • the maintenance member 80 After performing maintenance work using the maintenance member 80, as shown in FIG. 12C, the maintenance member 80 is again sucked and held by the first holding portion PH1, and foreign matter is removed using the detection device 36. You may make it perform the confirmation work whether it was done. When the removal of the foreign matter is confirmed, the maintenance member 80 is unloaded by the transfer device 300. On the other hand, when the removal of the foreign matter is not confirmed, maintenance work using the maintenance member 80 is performed again. Alternatively, a warning (alarm) may be issued to notify an operator or the like.
  • the control device CONT can determine the position of the foreign matter in the first holding unit PH1 based on the detection result of the detection device 36. Then, the control device CONT can determine the driving direction when driving the substrate holder PH using the substrate stage driving device SD1 according to the determined position of the foreign matter.
  • the substrate holder PH after rotating the substrate holder PH in the + ⁇ Z direction with a large acceleration, the substrate holder PH is slowly rotated in the _ ⁇ direction to return to the original position, and this may be repeated. Les. Thereby, the maintenance member 80 can be rotated in the ⁇ Z direction with respect to the substrate holder PH.
  • the movement limit by the plate member T functioning as the limiting member is not greatly limited, so the movement amount (sliding amount) with respect to the first convex portion 46 is increased. I can do it.
  • the maintenance member 80 when there is a foreign substance on the first convex portion 46 (see reference numeral 46M in FIG. 4) in the center in the plan view of the first holding portion PH1, as shown in the schematic diagram of FIG. It is preferable to drive the holder PH in the translation direction (X-axis direction or Y-axis direction). As a result, the maintenance member 80 also moves in the X-axis direction or the Y-axis direction. When the maintenance member 80 rotates in the ⁇ Z direction, the amount of movement (slip amount) relative to the first convex portion 46M located at the rotation center of the maintenance member 80 is small, so that the foreign matter on the upper surface of the first convex portion 46M It may be difficult to move smoothly to 47. By moving the maintenance member 80 in the X-axis direction or the Y-axis direction, the foreign matter on the upper surface of the first convex portion 46M can be moved to the first concave portion 47.
  • the position of the foreign matter in the first holding part PH1 is detected by the detection device 36, and the drive direction when driving the substrate holder PH is determined according to the detection result, thereby smoothly removing the foreign matter. Can be removed.
  • FIG. 14A when the maintenance member 80 is warped, even if the maintenance member 80 is placed on the first holding portion PH1, the surface 80A of the maintenance member 80 and the first protrusion If the upper surface 46A of the portion 46 cannot be brought into contact, there is a risk that inconvenience may occur. Therefore, as shown in FIG.
  • a convex portion 80T is provided in a part of the surface 80A of the maintenance member 80, and the conveying device 300 adheres to the convex portion 80T of the surface 80A of the maintenance member 80 and foreign matter adheres.
  • the foreign member can be removed by loading the maintenance member 80 to the first holding portion PH1 while aligning the first convex portion 46 with the first convex portion 46 in contact with each other.
  • a plurality of maintenance members 80 with different states of the surface 80A may be prepared, and the plurality of maintenance members 80 may be selectively brought into contact with the first convex portion 46 of the first holding portion PH1.
  • a plurality of maintenance members 80 having different positions where the convex portions 80T are provided on the surface 80A are prepared, and the first holding portion PH1 is provided.
  • a specific maintenance member 80 among the plurality of maintenance members 80 may be placed on the first convex portion 46.
  • the control device CONT performs (A) to (C) in FIG.
  • the maintenance member 80 having the convex portion 80T on the peripheral edge of the surface 80A that is, the maintenance member 80 of (A) in FIG. 15
  • the maintenance member 80 is transferred to the transfer device 300.
  • the transfer device 300 Use to load the first holding part PH1.
  • the foreign matter on the first convex portion 46 at the peripheral edge of the first holding portion PH1 can be brought into contact with the maintenance member 80 (convex portion 80T), and the foreign matter can be removed.
  • the control device CONT performs (A) to ( Among the plurality of maintenance members 80 shown in C), the maintenance member 80 having the convex portion 80T in the vicinity of the center of the surface 80A is selected (that is, the maintenance member 80 in FIG. 15C), and the maintenance member is selected. 80 is loaded into the first holding part PH1 using the transfer device 300. Thereby, the foreign matter on the first convex portion 46 in the vicinity of the central portion of the first holding portion PH1 can be brought into contact with the maintenance member 80 (the convex portion 80T), and the foreign matter can be removed.
  • the detection device 36 detects the position of the foreign matter in the first holding part PH1, and detects the position. Depending on the result, the foreign material can be smoothly removed by selecting the optimum maintenance member 80 from among the plurality of maintenance members 80 having different surfaces 80A.
  • the maintenance member 80 has such a size and shape that the surface 80A can be opposed to the upper surface 42A of the first peripheral wall portion 42, and the first space 131 can be formed.
  • the first pressure adjusting device 40 capable of adjusting the pressure in the first space 131 sucks the gas in the first space 131 through the first suction port 41 connected to the first space 131, or the first space 131.
  • a gas can be supplied to 131.
  • the first pressure adjusting device 40 can make the first space 131 negative or positive by sucking the gas in the first space 131 or supplying the gas to the first space 131.
  • the control device CONT uses the first pressure adjustment device 40 to set the pressure in the first space 131 formed between the maintenance member 80 and the substrate holder PH to a negative pressure.
  • the surface 80A of the maintenance member 80 and the first convex portion 46 of the first holding portion PH1 are adsorbed, and in this state, the substrate holder PH can be driven in the horizontal direction.
  • the weight of the maintenance member 80 is too light or the friction coefficient of the surface 80A of the maintenance member 80 is small
  • the substrate holder PH is driven and the maintenance member 80 is slid on the first convex portion 46, There is a possibility that it is too slippery or the foreign matter cannot be removed well.
  • the substrate holder PH is driven while the first space 131 is set to a negative pressure and the surface 80A of the maintenance member 80 and the first convex portion 46 of the first holding portion PH1 are slightly adsorbed. By sliding the maintenance member 80 on the first convex portion 46, foreign matters can be removed well.
  • the maintenance member 80 is prevented from being adsorbed to the extent that it does not slide on the first convex portion 46. Therefore, for example, by providing a groove (notch) or the like in a part of the surface 80A of the maintenance member 80 that faces the upper surface 42A of the first peripheral wall 42, the first through the groove. Since gas flows between the inside and the outside of the first space 131, it is possible to prevent the maintenance member 80 from being adsorbed to the extent that it does not slide on the first convex portion 46.
  • the first convex portion 46 is adjusted.
  • the force S can be adjusted to adjust the force acting between the upper surface 46A and the rear surface 80B of the maintenance member 80, and the foreign matter on the first convex portion 46 can be removed smoothly.
  • the adjustment of the pressure in the first space 131 and the adjustment of the acceleration when the substrate holder PH is driven may be used in combination.
  • the acceleration when driving the substrate holder PH is reduced.
  • the acceleration when driving the substrate holder PH is increased.
  • a plurality of maintenance members having different weights may be prepared, and the maintenance member 80 having a weight that can obtain an optimal sliding state may be selectively loaded on the first holding portion PH1.
  • the pressure in the first space 131 and the acceleration when driving the substrate holder PH may be adjusted, or the maintenance member 80 having an optimum weight may be loaded.
  • the acceleration when driving the substrate holder PH is increased, the pressure in the first space 131 and the weight of the maintenance member 80 are increased. Adjustments such as optimization can be performed.
  • the surface 80A of the maintenance member 80 is roughened. It is managed.
  • the maintenance member 80 is roughened by blasting.
  • the foreign matter on the first convex portion 46 can be favorably retained. Therefore, when the substrate holder PH is driven and slid on the first convex portion 46 with the maintenance member 80 placed on the first convex portion 46, the foreign matter is moved to the first concave portion as shown in FIG. It can move smoothly up to 47.
  • a plurality of maintenance members 80 having different roughness states (roughness counts) on the surface 80A are prepared, and the plurality of maintenance members 80 are set according to the state of foreign matter (for example, the size of the foreign matter). Alternatively, it may be selectively brought into contact with the first convex portion 46 of the first holding portion PH1. If the transfer device 300 is configured to hold and transfer the surface of the substrate P by vacuum suction, the roughness of the surface 80A is such that the maintenance member 80 can be sucked and held by the transfer device 300. It is desirable. That is, the roughness state of the surface 80A is selected within a range below the limit roughness to the extent that no air leaks from the surface 80A, which is the adsorption surface, during conveyance by the conveyance device 300.
  • the pressure in the first space 131 may be adjusted or the acceleration when driving the substrate holder PH may be adjusted according to the roughness state of the surface 80A.
  • the maintenance member 80 can hold the foreign matter on the roughened surface 80A. Therefore, the foreign material can be held on the surface 80A by placing the maintenance member 80 having the surface 80A having the optimum roughness according to the foreign material on the first holding portion PH1. In this case, the rough surface 80A is brought into contact with the first protrusion 46, and the substrate holder PH is not driven (the maintenance member 80 is not slid on the first protrusion 46). Can also be held. Of course, the substrate holder PH may be driven with the roughened surface 80A in contact with the first convex portion 46. In this way, the roughened surface 80A functions as a holding portion capable of holding foreign matter.
  • the transfer device 300 causes the maintenance member 80 holding the foreign matter to be opened together with the foreign matter from the substrate holder PH. Can be loaded.
  • the control device CONT places the maintenance member 80 having the roughened surface 80A on the first convex portion 46, and uses the first pressure adjusting device 40 to form the first space. 1 Set 31 to negative pressure.
  • the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 are brought into close contact with each other, and the foreign matter on the first convex portion 46 squeezes into the surface 80A of the roughened maintenance member 80. I can do it.
  • the maintenance member 80 can reliably hold foreign matter by the surface 80A.
  • the maintenance member 80 may have a porous body.
  • the porous body forms at least the surface 80A of the maintenance member 80.
  • the entire maintenance member 80 is formed of a porous body.
  • Examples of the porous body include porous ceramics.
  • the maintenance member 80 may have a fibrous material.
  • the fibrous material forms at least the surface 80A of the maintenance member 80.
  • the maintenance member 80 includes, for example, a base material 80G containing stainless steel and a fiber material that can be detached from (replaceable with) one surface 80Ga of the base material 80G. By having the fiber material, the maintenance member 80 can hold foreign matter on the surface 80A.
  • the maintenance member 80 may be charged and foreign matter may be retained by the force of static electricity.
  • the maintenance member 80 is formed of a synthetic resin (for example, nylon) or glass that can generate static electricity.
  • the surface 80A of the maintenance member 80 can hold foreign matter by the force of static electricity.
  • the maintenance work using the force maintenance member 80 described as an example in the case of maintaining the substrate holder that holds the substrate P to which the liquid LQ is supplied is usually performed.
  • the present invention can also be applied to the substrate holder provided in the dry exposure apparatus.
  • the dry exposure apparatus refers to an exposure apparatus that performs exposure without filling the liquid LQ on the optical path of the exposure light EL including the optical path space between the projection optical system PL and the substrate P.
  • the substrate holder PH ' has a holding surface 400 for holding the substrate P, and the holding surface 400 is formed with a ring-shaped recess 401 concentrically. .
  • a suction port connected to the vacuum system is provided inside the recess 401.
  • a plurality of limiting members 402 that limit the amount of movement of the maintenance member 80 on the holding surface 400 are provided on the outside of the substrate holder PH ′. In the example shown in FIG. 23A, three limiting members 402 are provided at substantially equal intervals so as to surround the substrate holder PH outside the substrate holder PH ′.
  • the transfer device 300 places the maintenance member 80 on the holding surface 400 of the substrate holder PH'. Then, as shown in FIG. 23B, the substrate holder PH ′ is driven. Thereby, the holding surface 400 is maintained.
  • the plate member T having the inner side surface Tc that continuously surrounds the maintenance member 80 is used as the limiting member that limits the movement amount of the maintenance member 80.
  • the plate member T for holding the immersion area LR of the liquid LQ may be omitted, and therefore the limiting member 402 as shown in FIGS. 23A and 23B may be used.
  • the substrate holder of the dry exposure apparatus may include the plate member T.
  • the force described by taking as an example the maintenance of a substrate holder provided with a so-called pin chuck mechanism.
  • FIGS. 24A and 24B are a side sectional views of the mask holder MH that holds the mask M
  • FIG. 24B is the mask holder MH. It is the top view which looked at from the top.
  • the mask holder MH that holds the mask M includes a base material MH B, a plurality of third convex portions 146 formed on the base material MHB, and a base material MHB. Double peripheral wall portions 142, 143 formed to surround the plurality of third convex portions 146, and a plurality of suction ports formed on the base material MHB between the peripheral wall portion 142 and the peripheral wall portion 143 141.
  • the mask holder MH sucks the gas from the suction port 141 and creates a negative pressure in the space surrounded by the base material MHB, the peripheral wall parts 142, 143, and the mask M. 14 Adsorb and hold on 6.
  • the third convex portion 146 of the mask holder MH can also be maintained by placing a maintenance member on the third convex portion 146 and driving the mask holder MH.
  • the second convex portion 66 that holds the plate member T by suction can also be maintained by placing a maintenance member on the second convex portion 66 and driving the substrate holder PH.
  • the substrate holder PH is driven in the direction along the horizontal plane.
  • the substrate holder PH may be driven in the vertical direction (Z-axis direction) or in the inclined direction. Good.
  • the substrate P in each of the above embodiments is not limited to a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or a mask used in an exposure apparatus.
  • Reticle masters synthetic quartz, silicon wafers, etc. are applied.
  • an exposure apparatus EX in addition to a step-and-scan type scanning exposure apparatus (scanning stepper) that performs mask exposure by scanning the mask M and the substrate P in synchronization with each other, the mask M and substrate P are used.
  • the present invention can also be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.
  • a reduced image of the first pattern is projected in a state where the first pattern and the substrate P are substantially stationary (for example, a refraction that does not include a reflective element at a 1/8 reduction magnification). It can also be applied to an exposure apparatus that performs batch exposure on the substrate P using a mold projection optical system. In this case, after that, with the second pattern and the substrate P almost stationary, a reduced image of the second pattern is collectively overlapped on the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus for exposure. In addition, the stitch type exposure apparatus can also be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.
  • the present invention relates to JP-A-10-163099, JP-A-10_214783, special table.
  • the present invention can also be applied to a twin stage type exposure apparatus disclosed in 2000-505958.
  • the type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, It can be widely applied to an exposure device for manufacturing an image sensor (CCD) or a reticle or mask.
  • CCD image sensor
  • the exposure apparatus EX of the present embodiment assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by.
  • various optical systems are adjusted to achieve optical accuracy
  • various mechanical systems are adjusted, and mechanical accuracy is adjusted. Adjustments are made to achieve electrical accuracy for various electrical systems.
  • the assembly process from various subsystems to the exposure system includes mechanical connections, electrical circuit wiring connections, and pneumatic circuit piping connections between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustments are performed to ensure various accuracies as the entire exposure apparatus. Exposure equipment should be manufactured in a clean room with controlled temperature and cleanliness.
  • a microdevice such as a semiconductor device includes a step 201 for performing a microdevice function performance design, a step 202 for manufacturing a mask (reticle) based on the design step, Step 203 for manufacturing a substrate as a base material, Step 204 having a process for exposing a mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, a device assembly step (including a dicing process, a bonding process, and a packaging process) ) Produced after 205, inspection step 206, etc.

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Abstract

A maintenance method, an exposure device, and a maintenance member. In the method, the maintenance member (80) having a front surface (80A) and a rear surface (80B) is carried so that the front surface (80A) is brought into contact with a first holding part, and a substrate holder (PH) is driven in the non-pressed state of the maintenance member on the rear surface (80B) to slide the maintenance member (80) on the first holding part.

Description

明 細 書  Specification
メンテナンス方法、露光装置、メンテナンス部材  Maintenance method, exposure apparatus, maintenance member
技術分野  Technical field
[0001] 本発明は、ホルダのメンテナンス方法、露光装置、メンテナンス部材に関するもので ある。  The present invention relates to a holder maintenance method, an exposure apparatus, and a maintenance member.
本願は、 2004年 12月 28日に出願された特願 2004— 379341号に基づき優先権 を主張し、その内容をここに援用する。  This application claims priority based on Japanese Patent Application No. 2004-379341 filed on December 28, 2004, the contents of which are incorporated herein by reference.
背景技術  Background art
[0002] 半導体デバイスや液晶表示デバイス等のマイクロデバイスの製造工程の一つであ るフォトリソグラフイエ程では、マスク上に形成されたパターンを感光性の基板上に投 影露光する露光装置が用いられる。基板は基板ホルダに保持された状態で露光され るが、基板ホルダ上に異物があると、保持した基板を汚染したり、基板を局所的に変 形させる虞がある。そのため、基板ホルダを定期的にメンテナンス（クリーニング)する 必要がある。下記特許文献には、基板ホルダの保持面をクリーニングする技術の一 例が開示されている。  In the photolithographic process, which is one of the manufacturing processes of microdevices such as semiconductor devices and liquid crystal display devices, an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. It is done. The substrate is exposed while being held by the substrate holder. However, if there is a foreign substance on the substrate holder, the held substrate may be contaminated or the substrate may be locally deformed. Therefore, it is necessary to periodically maintain (clean) the substrate holder. The following patent document discloses an example of a technique for cleaning the holding surface of the substrate holder.
特許文献 1 :特許第 3441956号公報  Patent Document 1: Japanese Patent No. 3441956
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0003] 従来の技術は、押付け手段を使って砥石を保持面に押し付けてクリーニングする 構成であるが、押付け手段を別途設けなければならず、装置構成が複雑化する。  [0003] The conventional technique has a configuration in which a grindstone is pressed against a holding surface using a pressing means for cleaning, but the pressing means must be provided separately, which complicates the apparatus configuration.
[0004] 本発明はこのような事情に鑑みてなされたものであって、簡易な構成でホルダをメ ンテナンスできるメンテナンス方法を提供することを目的とする。また、そのメンテナン ス方法によりメンテナンスされるホルダを備える露光装置を提供することを目的とする 。また、そのメンテナンス方法に好適に使用されるメンテナンス部材を提供することを 目的とする。  The present invention has been made in view of such circumstances, and an object thereof is to provide a maintenance method capable of maintaining a holder with a simple configuration. It is another object of the present invention to provide an exposure apparatus including a holder that is maintained by the maintenance method. Moreover, it aims at providing the maintenance member used suitably for the maintenance method.
課題を解決するための手段  Means for solving the problem
[0005] 上記の課題を解決するため、本発明は実施の形態に示す各図に対応付けした以 下の構成を採用している。但し、各要素に付した括弧付き符号はその要素の例示に 過ぎず、各要素を限定するものではない。 [0005] In order to solve the above problems, the present invention is associated with each diagram shown in the embodiment. The following configuration is adopted. However, the reference numerals in parentheses attached to each element are merely examples of the element and do not limit each element.
[0006] 本発明の第 1の態様に従えば、保持部（PH1)を有するホルダ (PH)のメンテナンス 方法にぉレ、て、表面（80A)と裏面（80B)とを有した物体（80)を該物体（80)の表面 (80A)が保持部（PH1)と接触するように搬送し、裏面（80B)を押圧しなレ、状態でホ ルダ (PH)を駆動して物体（80)を保持部（PH1)上で滑らせるメンテナンス方法が提 供される。  [0006] According to the first aspect of the present invention, an object (80) having a front surface (80A) and a back surface (80B) is used in a maintenance method of the holder (PH) having the holding portion (PH1). ) So that the front surface (80A) of the object (80) is in contact with the holding portion (PH1), and the holder (PH) is driven in a state where the back surface (80B) is not pressed. ) Is provided on the holding part (PH1).
[0007] 本発明の第 1の態様によれば、簡易な構成でホルダをメンテナンスすることができる  [0007] According to the first aspect of the present invention, the holder can be maintained with a simple configuration.
[0008] 本発明の第 2の態様に従えば、凹部（47)と凸部（46)とを有するホルダ（PH)のメ ンテナンス方法において、凸部（46)に物体（80)を載せ、ホルダ（PH)を駆動して物 体（80)を凸部（46)上で移動させて凸部（46)に付着した異物を凹部（47)に移動さ せるメンテナンス方法が提供される。 [0008] According to the second aspect of the present invention, in the maintenance method of the holder (PH) having the concave portion (47) and the convex portion (46), the object (80) is placed on the convex portion (46), A maintenance method is provided in which the holder (PH) is driven to move the object (80) on the convex portion (46) to move the foreign matter adhering to the convex portion (46) to the concave portion (47).
[0009] 本発明の第 2の態様によれば、簡易な構成でホルダをメンテナンスすることができる  [0009] According to the second aspect of the present invention, the holder can be maintained with a simple configuration.
[0010] 本発明の第 3の態様に従えば、第 1基板 (P)を露光する露光装置において、第 1基 板 (P)を保持可能な保持部（PH1)を有する第 1可動部材 (PH)と、表面（80A)と裏 面（80B)とを有した第 2基板（80)を該第 2基板（80)の表面（80A)が保持部（PH1) と接触するように搬送する搬送装置（300)と、裏面（80B)を押圧しなレ、状態で第 1可 動部材 (PH)を駆動して第 2基板 (80)を保持部 (PH1 )上で滑らせる駆動装置 (SD 1)とを備える露光装置 (EX)が提供される。 [0010] According to the third aspect of the present invention, in the exposure apparatus that exposes the first substrate (P), the first movable member having the holding portion (PH1) capable of holding the first substrate (P) ( PH), and the second substrate (80) having the front surface (80A) and the back surface (80B) is transferred so that the front surface (80A) of the second substrate (80) is in contact with the holding portion (PH1). The transport device (300) and the drive device that slides the second substrate (80) on the holding portion (PH1) by driving the first movable member (PH) without pressing the back surface (80B). An exposure apparatus (EX) comprising SD 1) is provided.
[0011] 本発明の第 3の態様によれば、簡易な構成でメンテナンスされた第 1可動部材で第  [0011] According to the third aspect of the present invention, the first movable member maintained with a simple configuration is the first movable member.
1基板を良好に保持した状態で露光することができる。  It is possible to perform exposure while holding one substrate well.
[0012] 本発明の第 4の態様に従えば、第 1基板（P)を露光する露光装置において、凹部（  [0012] According to the fourth aspect of the present invention, in the exposure apparatus for exposing the first substrate (P), the recess (
47)と凸部 (46)とを有し、凸部 (46)に第 1基板 (P)を保持可能な第 1可動部材 (PH )と、第 1基板 (P)とは異なる第 2基板 (80)を凸部 (46)に搬送する搬送装置 (300)と 、第 1可動部材 (PH)を駆動して第 2基板（80)を凸部（46)上で移動させて凸部（46 )に付着した異物を凹部 (47)に移動させる駆動装置 (SD1)とを備える露光装置 (E X)が提供される。 47) and a convex portion (46), a first movable member (PH) capable of holding the first substrate (P) on the convex portion (46), and a second substrate different from the first substrate (P) A conveying device (300) for conveying (80) to the convex portion (46), and the first movable member (PH) is driven to move the second substrate (80) on the convex portion (46) to thereby project the convex portion ( 46) an exposure device (E) having a drive device (SD1) for moving the foreign matter adhering to the recess (47). X) is provided.
[0013] 本発明の第 4の態様によれば、簡易な構成でメンテナンスされた第 1可動部材で第 [0013] According to the fourth aspect of the present invention, the first movable member maintained with a simple configuration is the first movable member.
1基板を良好に保持した状態で露光することができる。 It is possible to perform exposure while holding one substrate well.
[0014] 本発明の第 5の態様に従えば、物体 (P)を保持する保持部（PH)のメンテナンスを 行うメンテナンス部材（80)であって、メンテナンス部材の外形は物体（P)の外形より も小さいメンテナンス部材（80)が提供される。 [0014] According to the fifth aspect of the present invention, the maintenance member (80) performs maintenance of the holding portion (PH) that holds the object (P), and the outer shape of the maintenance member is the outer shape of the object (P). A smaller maintenance member (80) is provided.
[0015] 本発明の第 5の態様に従えば、保持部に保持される物体の外形よりも小さいメンテ ナンス部材を使って保持部を良好にメンテナンスすることができる。 [0015] According to the fifth aspect of the present invention, it is possible to satisfactorily maintain the holding unit using a maintenance member smaller than the outer shape of the object held by the holding unit.
発明の効果  The invention's effect
[0016] 本発明によれば、簡易な構成でホルダをメンテナンスすることができ、そのメンテナ ンスされたホルダに基板を保持して精度良く露光することができる。  [0016] According to the present invention, the holder can be maintained with a simple configuration, and the substrate can be held in the maintained holder and exposed accurately.
図面の簡単な説明  Brief Description of Drawings
[0017] [図 1]露光装置の一実施形態を示す概略構成図である。  FIG. 1 is a schematic block diagram showing an embodiment of an exposure apparatus.
[図 2]基板ホルダの一実施形態を示す側断面図である。  FIG. 2 is a side sectional view showing an embodiment of a substrate holder.
[図 3]基板を保持した状態の基板ホルダの一実施形態を示す平面図である。  FIG. 3 is a plan view showing an embodiment of a substrate holder in a state where a substrate is held.
[図 4]基板ホルダの一実施形態を示す平面図である。  FIG. 4 is a plan view showing an embodiment of a substrate holder.
[図 5]プレート部材が外された状態の基板ホルダを示す平面図である。  FIG. 5 is a plan view showing the substrate holder with the plate member removed.
[図 6A]第 1実施形態に係るメンテナンス部材を示す図である。  FIG. 6A is a view showing a maintenance member according to the first embodiment.
[図 6B]第 1実施形態に係るメンテナンス部材を示す図である。  FIG. 6B is a diagram showing a maintenance member according to the first embodiment.
[図 7A]第 1実施形態に係るメンテナンス方法を説明するための図である。  FIG. 7A is a diagram for explaining a maintenance method according to the first embodiment.
[図 7B]第 1実施形態に係るメンテナンス方法を説明するための図である。  FIG. 7B is a diagram for explaining the maintenance method according to the first embodiment.
[図 8A]第 1実施形態に係るメンテナンス方法を説明するための図である。  FIG. 8A is a diagram for explaining a maintenance method according to the first embodiment.
[図 8B]第 1実施形態に係るメンテナンス方法を説明するための図である。  FIG. 8B is a diagram for explaining the maintenance method according to the first embodiment.
[図 9]基板ステージ及び計測ステージの動作の一例を説明するための図である。  FIG. 9 is a diagram for explaining an example of operations of a substrate stage and a measurement stage.
[図 10A]基板ステージ及び計測ステージの動作の一例を説明するための図である。  FIG. 10A is a diagram for explaining an example of operations of a substrate stage and a measurement stage.
[図 10B]基板ステージ及び計測ステージの動作の一例を説明するための図である。  FIG. 10B is a diagram for explaining an example of operations of the substrate stage and the measurement stage.
[図 11A]基板ステージ及び計測ステージの動作の一例を説明するための図である。  FIG. 11A is a diagram for explaining an example of operations of a substrate stage and a measurement stage.
[図 11B]基板ステージ及び計測ステージの動作の一例を説明するための図である。 [図 12A]第 2実施形態に係るメンテナンス方法を説明するための図である。 FIG. 11B is a diagram for explaining an example of operations of the substrate stage and the measurement stage. FIG. 12A is a diagram for explaining a maintenance method according to a second embodiment.
[図 12B]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 12B is a diagram for explaining a maintenance method according to the second embodiment.
[図 12C]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 12C is a view for explaining a maintenance method according to the second embodiment.
[図 13A]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 13A is a diagram for explaining a maintenance method according to a second embodiment.
[図 13B]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 13B is a view for explaining a maintenance method according to the second embodiment.
[図 13C]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 13C is a view for explaining a maintenance method according to the second embodiment.
[図 14A]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 14A is a diagram for explaining a maintenance method according to a second embodiment.
[図 14B]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 14B is a view for explaining a maintenance method according to the second embodiment.
[図 15]第 2実施形態に係るメンテナンス方法を説明するための図である。  FIG. 15 is a diagram for explaining a maintenance method according to a second embodiment.
[図 16A]第 3実施形態に係るメンテナンス方法を説明するための図である。  FIG. 16A is a diagram for explaining a maintenance method according to a third embodiment.
[図 16B]第 3実施形態に係るメンテナンス方法を説明するための図である。  FIG. 16B is a diagram for explaining a maintenance method according to the third embodiment.
[図 17A]第 4実施形態に係るメンテナンス方法を説明するための図である。  FIG. 17A is a view for explaining a maintenance method according to the fourth embodiment.
[図 17B]第 4実施形態に係るメンテナンス方法を説明するための図である。  FIG. 17B is a view for explaining a maintenance method according to the fourth embodiment.
[図 18A]第 4実施形態に係るメンテナンス方法を説明するための図である。  FIG. 18A is a view for explaining a maintenance method according to the fourth embodiment.
[図 18B]第 4実施形態に係るメンテナンス方法を説明するための図である。  FIG. 18B is a view for explaining a maintenance method according to the fourth embodiment.
[図 19]第 4実施形態に係るメンテナンス方法を説明するための図である。  FIG. 19 is a diagram for explaining a maintenance method according to the fourth embodiment.
[図 20]第 5実施形態に係るメンテナンス部材の一例を示す図である。  FIG. 20 is a view showing an example of a maintenance member according to the fifth embodiment.
[図 21]第 5実施形態に係るメンテナンス部材の別の例を示す図である。  FIG. 21 is a view showing another example of the maintenance member according to the fifth embodiment.
[図 22]第 5実施形態に係るメンテナンス部材の別の例を示す図である。  FIG. 22 is a view showing another example of the maintenance member according to the fifth embodiment.
[図 23A]第 6実施形態に係るメンテナンス方法を説明するための図である。  FIG. 23A is a view for explaining a maintenance method according to a sixth embodiment.
[図 23B]第 6実施形態に係るメンテナンス方法を説明するための図である。  FIG. 23B is a view for explaining a maintenance method according to the sixth embodiment.
[図 24A]第 7実施形態に係るメンテナンス方法を説明するための図である。  FIG. 24A is a view for explaining a maintenance method according to a seventh embodiment.
[図 24B]第 7実施形態に係るメンテナンス方法を説明するための図である。  FIG. 24B is a view for explaining a maintenance method according to the seventh embodiment.
[図 25]マイクロデバイスの製造工程の一例を説明するためのフローチャート図である 符号の説明  FIG. 25 is a flowchart for explaining an example of a manufacturing process of a micro device.
1…液浸装置、 11…液体供給部、 21…液体回収部、 36…検出装置、 46…第 1凸 部、 47…第 1凹部、 80…メンテナンス部材、 80A…表面、 80B…裏面、 300…搬送 装置、 CONT…制御装置、 EX…露光装置、 PH…基板ホルダ（第 1可動部材）、 PH 1…第 1保持部、 ST1…基板ステージ (第 1可動部材）、 ST2…計測ステージ (第 2可 動部材）、 SD1…基板ステージ駆動装置、 SD2…計測ステージ駆動装置、 T…プレ 一ト部材 (制限部材） DESCRIPTION OF SYMBOLS 1 ... Immersion apparatus, 11 ... Liquid supply part, 21 ... Liquid recovery part, 36 ... Detection apparatus, 46 ... First convex part, 47 ... First concave part, 80 ... Maintenance member, 80A ... Front surface, 80B ... Back surface, 300 ... conveyance Equipment, CONT ... Control equipment, EX ... Exposure equipment, PH ... Substrate holder (first movable member), PH1 ... First holding part, ST1 ... Substrate stage (first movable member), ST2 ... Measurement stage (second possible) Moving member), SD1 ... Substrate stage drive device, SD2 ... Measurement stage drive device, T ... Plate member (restricting member)
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0019] 以下、本発明の実施形態について図面を参照しながら説明するが、本発明はこれ に限定されない。  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.
[0020] <露光装置 >  [0020] <Exposure apparatus>
まず、本発明に係る露光装置の一実施形態について図 1を参照しながら説明する 。図 1は露光装置 EXの一実施形態を示す概略構成図である。  First, an embodiment of an exposure apparatus according to the present invention will be described with reference to FIG. FIG. 1 is a schematic block diagram showing an embodiment of the exposure apparatus EX.
[0021] 図 1において、露光装置 EXは、マスク Mを保持するマスクホルダ MHと、マスク Mを 保持したマスクホルダ MHを移動可能なマスクステージ MSTと、基板 Pを保持する基 板ホルダ PHと、基板 Pを保持した基板ホルダ PHを移動可能な基板ステージ ST1と 、露光に関する計測を行う計測器を搭載して移動可能な計測ステージ ST2と、マスク ステージ MST上のマスク Mを露光光 ELで照明する照明光学系 ILと、露光光 ELで 照明されたマスク Mのパターン像を基板ステージ ST1上の基板 Pに投影露光する投 影光学系 PLと、露光装置 EX全体の動作を統括制御する制御装置 CONTとを備え ている。基板ステージ ST1及び計測ステージ ST2のそれぞれは、投影光学系 PLの 像面側で、ベース部材 BP上において互いに独立して移動可能となっている。また、 露光装置 EXは、基板ホルダ PHに対して基板 Pを搬送する搬送装置 300を備えてレ、 る。  In FIG. 1, an exposure apparatus EX includes a mask holder MH that holds a mask M, a mask stage MST that can move the mask holder MH that holds a mask M, a substrate holder PH that holds a substrate P, The substrate stage ST1 that can move the substrate holder PH that holds the substrate P, and the measurement stage ST2 that can be moved with a measuring instrument that measures exposure, and the mask M on the mask stage MST are illuminated with exposure light EL. Control system CONT that controls the overall operation of the projection optical system PL and the exposure apparatus EX that project and expose the pattern image of the mask M illuminated by the illumination optical system IL and exposure light EL onto the substrate P on the substrate stage ST1. It is equipped with. Each of the substrate stage ST1 and the measurement stage ST2 can move independently of each other on the base member BP on the image plane side of the projection optical system PL. Further, the exposure apparatus EX includes a transfer device 300 that transfers the substrate P to the substrate holder PH.
[0022] 本実施形態の露光装置 EXは、露光波長を実質的に短くして解像度を向上するとと もに焦点深度を実質的に広くするために液浸法を適用した液浸露光装置であって、 投影光学系 PLの像面側に液体 LQの液浸領域 LRを形成するための液浸装置 1を 備えている。液浸装置 1は、投影光学系 PLの像面側近傍に設けられ、液体 LQを供 給する供給口 12及び液体 LQを回収する回収口 22を有するノズル部材 70と、ノズル 部材 70に設けられた供給口 12及び供給管 13を介して投影光学系 PLの像面側に 液体 LQを供給する液体供給部 11と、ノズノレ部材 70に設けられた回収口 22及び回 収管 23を介して投影光学系 PLの像面側の液体 LQを回収する液体回収部 21とを 備えている。ノズル部材 70は、投影光学系 PLの像面側先端部を囲むように環状に 形成されている。液浸装置 1は、少なくともマスク Mのパターン像を基板 P上に転写し ている間、液体供給部 11から供給した液体 LQにより投影光学系 PLの投影領域 AR を含む基板 P上の一部に、投影領域 ARよりも大きく且つ基板 Pよりも小さい液体 LQ の液浸領域 LRを局所的に形成する。具体的には、露光装置 EXは、投影光学系 PL の像面に最も近い第 1光学素子 LSIの下面と、投影光学系 PLの像面側に配置され た基板 Pの上面 Paの一部との間の光路空間を液体 LQで満たす局所液浸方式を採 用し、液浸領域 LRを形成する液体 LQと投影光学系 PLとを介してマスク Mを通過し た露光光 ELを基板 Pに照射することによって、マスク Mのパターンを基板 Pに投影露 光する。 The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus. In addition, an immersion apparatus 1 for forming an immersion area LR of the liquid LQ on the image plane side of the projection optical system PL is provided. The liquid immersion device 1 is provided in the vicinity of the image plane side of the projection optical system PL, and is provided in the nozzle member 70 having a supply port 12 for supplying the liquid LQ and a recovery port 22 for recovering the liquid LQ, and the nozzle member 70. The liquid supply unit 11 for supplying the liquid LQ to the image plane side of the projection optical system PL via the supply port 12 and the supply pipe 13, the recovery port 22 provided in the nozzle member 70 and the circuit A liquid recovery unit 21 that recovers the liquid LQ on the image plane side of the projection optical system PL via the collecting tube 23 is provided. The nozzle member 70 is formed in an annular shape so as to surround the image plane side tip of the projection optical system PL. The liquid immersion device 1 transfers a part of the projection optical system PL including the projection area AR to a part of the substrate P by the liquid LQ supplied from the liquid supply unit 11 while at least transferring the pattern image of the mask M onto the substrate P. Then, an immersion region LR of the liquid LQ that is larger than the projection region AR and smaller than the substrate P is locally formed. Specifically, the exposure apparatus EX includes a lower surface of the first optical element LSI closest to the image plane of the projection optical system PL and a part of the upper surface Pa of the substrate P arranged on the image plane side of the projection optical system PL. The exposure light EL that has passed through the mask M via the liquid LQ that forms the immersion area LR and the projection optical system PL is applied to the substrate P. The pattern of the mask M is projected and exposed to the substrate P by irradiation.
[0023] 本実施形態では、露光装置 EXとしてマスク Mと基板 Pとを走查方向における互い に異なる向き（逆方向）に同期移動しつつマスク Mに形成されたパターンを基板 に 露光する走査型露光装置 (所謂スキャニングステツパ）を使用する場合を例にして説 明する。以下の説明において、水平面内においてマスク Mと基板 Pとの同期移動方 向（走査方向）を X軸方向、水平面内において X軸方向と直交する方向を Y軸方向（ 非走査方向）、 X軸及び Y軸方向に垂直で投影光学系 PLの光軸 AXと一致する方向 を Z軸方向とする。また、 X軸、 Y軸、及び Z軸まわりの回転 (傾斜)方向をそれぞれ、 Θ Χ、 θ Υ、及び Θ Ζ方向とする。なお、ここでいう「基板」は半導体ウェハ等の基材上 に感光材（レジスト）を塗布したものを含み、「マスク」は基板上に縮小投影されるデバ イスパターンを形成されたレチクルを含む。  In the present embodiment, as exposure apparatus EX, a scanning type in which mask M and substrate P are synchronously moved in mutually different directions (reverse directions) in the scanning direction, and a pattern formed on mask M is exposed to the substrate. A case where an exposure apparatus (so-called scanning stepper) is used will be described as an example. In the following explanation, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the X axis direction, and the direction orthogonal to the X axis direction is the Y axis direction (non-scanning direction) and the X axis in the horizontal plane. The direction perpendicular to the Y-axis direction and coincident with the optical axis AX of the projection optical system PL is the Z-axis direction. The rotation (tilt) directions around the X, Y, and Z axes are the Θ と す る, θΥ, and ΘΖ directions, respectively. Here, the “substrate” includes a substrate in which a photosensitive material (resist) is coated on a base material such as a semiconductor wafer, and the “mask” includes a reticle on which a device pattern to be projected on the substrate is reduced. .
[0024] 照明光学系 ILは、露光用光源、露光用光源から射出された光束の照度を均一化 するォプティカノレインテグレータ、ォプティカノレインテグレータからの露光光 ELを集 光するコンデンサレンズ、リレーレンズ系、及び露光光 ELによるマスク Μ上の照明領 域を設定する視野絞り等を有している。マスク Μ上の所定の照明領域は照明光学系 I Lにより均一な照度分布の露光光 ELで照明される。照明光学系 IL力 射出される露 光光 ELとしては、例えば水銀ランプ力 射出される輝線 (g線、 h線、 i線)及び KrFェ キシマレーザ光（波長 248nm)等の遠紫外光（DUV光）や、 ArFエキシマレーザ光（ 波長 193nm)及び Fレーザ光（波長 157nm)等の真空紫外光 (VUV光）などが用 [0024] The illumination optical system IL includes an exposure light source, an optical cannula integrator that equalizes the illuminance of the light beam emitted from the exposure light source, a condenser lens that collects the exposure light EL from the optical cannula integrator, It has a relay lens system and a field stop for setting the illumination area on the mask に よ る with exposure light EL. The predetermined illumination area on the mask Μ is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. Illumination optical system IL force Emission exposure light EL includes, for example, mercury lamp force emission lines (g-line, h-line, i-line) and far ultraviolet light (DUV light such as KrF excimer laser light (wavelength 248 nm)) ) Or ArF excimer laser light ( Used for vacuum ultraviolet light (VUV light) such as wavelength 193 nm) and F laser light (wavelength 157 nm)
2  2
レ、られる。本実施形態においては ArFエキシマレーザ光が用いられる。  It is done. In this embodiment, ArF excimer laser light is used.
[0025] 本実施形態においては、液体 LQとして純水が用いられている。純水は、 ArFェキ シマレーザ光のみならず、例えば、水銀ランプから射出される輝線 (g線、 h線、 i線） 及び KrFエキシマレーザ光（波長 248nm)等の遠紫外光（DUV光)も透過可能であ る。 In this embodiment, pure water is used as the liquid LQ. Pure water is not only ArF excimer laser light, but also far ultraviolet light (DUV light) such as bright lines emitted from mercury lamps (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm). Can also be transmitted.
[0026] マスクステージ MSTは、マスク Mを保持したマスクホルダ MHを移動可能である。  The mask stage MST can move a mask holder MH holding the mask M.
マスクホルダ MHは、マスク Mを真空吸着により保持する。マスクステージ MSTは、 制御装置 CONTにより制御されるリニアモータ等を含む駆動装置 MDの駆動により、 マスク Mを保持したマスクホルダ MHを、投影光学系 PLの光軸 AXに垂直な平面内 、すなわち XY平面内で 2次元移動可能及び θ Z方向に微少回転可能である。マスク ホルダ MH上には移動鏡 31が設けられている。また、移動鏡 31に対向する位置に はレーザ干渉計 32が設けられている。マスクホルダ MH上のマスク Mの 2次元方向 の位置、及び Θ Z方向の回転角（場合によっては Θ X、 Θ Y方向の回転角も含む）は レーザ干渉計 32によりリアルタイムで計測される。レーザ干渉計 32の計測結果は制 御装置 CONTに出力される。制御装置 CONTは、レーザ干渉計 32の計測結果に 基づいて駆動装置 MDを駆動し、マスクホルダ MHに保持されているマスク Mの位置 制御を行う。  The mask holder MH holds the mask M by vacuum suction. The mask stage MST moves the mask holder MH holding the mask M in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, XY by driving a drive device MD including a linear motor controlled by the control device CONT. It can move two-dimensionally in the plane and can rotate slightly in the θZ direction. A movable mirror 31 is provided on the mask holder MH. A laser interferometer 32 is provided at a position facing the movable mirror 31. The position of the mask M on the mask holder MH in the two-dimensional direction and the rotation angle in the ΘZ direction (including rotation angles in the ΘX and ΘY directions in some cases) are measured in real time by the laser interferometer 32. The measurement result of the laser interferometer 32 is output to the control device CONT. The control device CONT drives the drive device MD based on the measurement result of the laser interferometer 32, and controls the position of the mask M held by the mask holder MH.
[0027] 投影光学系 PLは、マスク Mのパターンを所定の投影倍率 βで基板 Ρに投影露光 するものであって、複数の光学素子で構成されており、それら光学素子は鏡筒 Pice 保持されている。本実施形態において、投影光学系 PLは、投影倍率 i3が例えば 1 /4、 1/5、あるいは 1/8の縮小系である。なお、投影光学系 PLは等倍系及び拡 大系のいずれでもよい。また、投影光学系 PLは、反射光学素子を含まない屈折系、 屈折光学素子を含まない反射系、反射光学素子と屈折光学素子とを含む反射屈折 系のいずれであってもよい。投影光学系 PLを構成する複数の光学素子のうち、投影 光学系 PLの像面に最も近い第 1光学素子 LSIは、鏡筒 PKより露出している。  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate で at a predetermined projection magnification β, and is composed of a plurality of optical elements, which are held by a lens barrel Pice. ing. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification i3 of, for example, 1/4, 1/5, or 1/8. The projection optical system PL may be a unity magnification system or an enlargement system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Of the plurality of optical elements constituting the projection optical system PL, the first optical element LSI closest to the image plane of the projection optical system PL is exposed from the lens barrel PK.
[0028] 基板ステージ ST1は、基板 Pを保持する基板ホルダ PHを投影光学系 PLの像面側 において移動可能である。基板ステージ ST1は、基板ホルダ PHを支持した状態で、 ベース部材 BP上に移動可能に設けられている。基板ステージ ST1は基板ステージ 駆動装置 SD1により駆動される。基板ステージ駆動装置 SD1は、例えばリニアモー タ等を含んで構成され、基板ステージ ST1を X軸方向、 Y軸方向、及び Θ Z方向に移 動する XY駆動装置と、例えばボイスコイルモータ等を含んで構成され、基板ステー ジ ST1を Z軸方向、 Θ X方向、及び Θ Y方向に移動する Z駆動装置とを備えている。 基板ステージ ST1の駆動により、基板ホルダ PHに保持された基板 Pの上面 Paは、 X 軸、 Y軸、 Z軸、 Θ Χ、 Θ Υ、及び Θ Ζ方向の 6自由度の方向に移動可能である。基板 ホルダ ΡΗの側面には移動鏡 33が設けられている。また、移動鏡 33に対向する位置 にはレーザ干渉計 34が設けられている。基板ホルダ ΡΗ上の基板 Ρの 2次元方向の 位置、及び回転角はレーザ干渉計 34によりリアルタイムで計測される。また、露光装 置 ΕΧは、例えば特開平 8— 37149号公報に開示されているような、基板ホルダ ΡΗ に支持されている基板 Ρの上面 Paの面位置情報を検出する斜入射方式のフォー力 ス'レべリング検出系 35を備えている。フォーカス'レべリング検出系 35は、基板ホル ダ PHに保持された基板 Pの上面 Paに検出光 Laを照射する投射部 35 Aと、検出光 L aに対して所定の位置関係で配置され、基板 Pの上面 Paで反射した検出光 Laの反 射光を受光する受光部 35Bとを有し、受光部 35Bの検出結果に基づいて、基板 Pの 上面 Paの面位置情報（Z軸方向の位置情報、及び θ X及び θ Y方向の傾斜情報）を 検出する。レーザ干渉計 34の計測結果は制御装置 CONTに出力される。フォー力 ス'レべリング検出系 35の検出結果も制御装置 CONTに出力される。制御装置 CO NTは、フォーカス'レべリング検出系 35の検出結果に基づいて、基板ステージ駆動 装置 SD1を駆動し、基板 Pのフォーカス位置 (Z位置)及び傾斜角（ Θ X、 θ Y)を制 御して基板 Pの上面 Paをオートフォーカス方式、及びオートレべリング方式で投影光 学系 PLの像面に合わせ込むとともに、レーザ干渉計 34の計測結果に基づいて、基 板 Pの X軸方向、 Y軸方向、及び Θ Z方向における位置制御を行う。 [0028] Substrate stage ST1 can move substrate holder PH holding substrate P on the image plane side of projection optical system PL. The substrate stage ST1 supports the substrate holder PH, The base member BP is movably provided. The substrate stage ST1 is driven by the substrate stage drive device SD1. The substrate stage drive device SD1 is configured to include, for example, a linear motor, and includes an XY drive device that moves the substrate stage ST1 in the X axis direction, the Y axis direction, and the ΘZ direction, and a voice coil motor, for example. And a Z driving device that moves the substrate stage ST1 in the Z-axis direction, ΘX direction, and ΘY direction. By driving the substrate stage ST1, the upper surface Pa of the substrate P held by the substrate holder PH can be moved in the direction of 6 degrees of freedom in the X axis, Y axis, Z axis, Θ Χ, Θ Υ, and Θ Ζ directions. is there. A movable mirror 33 is provided on the side surface of the substrate holder ΡΗ. A laser interferometer 34 is provided at a position facing the movable mirror 33. The position and rotation angle of the substrate ΡΗ on the substrate holder ΡΗ are measured in real time by the laser interferometer 34. In addition, the exposure apparatus has an oblique incidence type for force that detects surface position information of the upper surface Pa of the substrate that is supported by the substrate holder, as disclosed in, for example, Japanese Patent Laid-Open No. 8-37149. A leveling detection system 35 is provided. The focus / leveling detection system 35 is arranged in a predetermined positional relationship with respect to the detection light La and a projection unit 35A that irradiates the detection light La onto the upper surface Pa of the substrate P held by the substrate holder PH. And a light receiving unit 35B that receives reflected light of the detection light La reflected by the upper surface Pa of the substrate P. Based on the detection result of the light receiving unit 35B, surface position information (in the Z-axis direction) of the upper surface Pa of the substrate P Position information and inclination information in the θ X and θ Y directions). The measurement result of the laser interferometer 34 is output to the control device CONT. The detection result of the force leveling detection system 35 is also output to the control device CONT. The control device CONT drives the substrate stage drive device SD1 based on the detection result of the focus / leveling detection system 35, and determines the focus position (Z position) and tilt angle (Θ X, θ Y) of the substrate P. Control and align the upper surface Pa of the substrate P with the image plane of the projection optical system PL using the auto focus method and auto leveling method, and based on the measurement result of the laser interferometer 34, the X axis of the substrate P Position control in direction, Y-axis direction, and ΘZ direction.
計測ステージ ST2は、露光に関する計測を行う各種計測器 (計測用部材を含む)を 搭載して投影光学系 PLの像面側で移動可能である。この計測器としては、例えば特 開平 5— 21314号公報などに開示されているような、複数の基準マークが形成され た基準マーク板、例えば特開昭 57— 117238号公報に開示されているように照度ム ラを計測したり、特開 2001— 267239号公報に開示されているように投影光学系 PL の露光光 ELの透過率の変動量を計測するためのムラセンサ、特開 2002— 14005 号公報に開示されているような空間像計測センサ、及び特開平 11— 16816号公報 に開示されているような照射量センサ（照度センサ）が挙げられる。なお、このような計 測ステージ ST2については、例えば特開平 11 _ 135400号公報により詳細に開示 されている。 The measurement stage ST2 is equipped with various measuring instruments (including measurement members) that perform measurement related to exposure, and is movable on the image plane side of the projection optical system PL. As this measuring instrument, as disclosed in, for example, Japanese Patent Publication No. 5-21314, a reference mark plate on which a plurality of reference marks are formed, for example, disclosed in Japanese Patent Application Laid-Open No. 57-117238. To illuminance A non-uniformity sensor for measuring the amount of fluctuation in the transmittance of the exposure light EL of the projection optical system PL as disclosed in JP 2001-267239, disclosed in JP 2002-14005 A And a dose sensor (illuminance sensor) as disclosed in JP-A-11-16816. Such a measurement stage ST2 is disclosed in detail, for example, in Japanese Patent Laid-Open No. 11-135400.
[0030] 計測ステージ ST2は、制御装置 CONTにより制御されるリニアモータ等を含む計 測ステージ駆動装置 SD2の駆動により、計測器を搭載した状態で、投影光学系 PL の像面側において、投影光学系 PLの像面とほぼ平行な XY平面内で 2次元移動可 能及び θ Z方向に微小回転可能である。更に計測ステージ ST2は、 Z軸方向、 θ X 方向、及び θ Y方向にも移動可能である。すなわち、計測ステージ ST2も、基板ステ ージ ST1と同様、 X軸、 Y軸、 Z軸、 Θ Χ、 Θ Υ、及び Θ Ζ方向の 6自由度の方向に移 動可能である。計測ステージ ST2の側面には移動鏡 37が設けられている。また、移 動鏡 37に対向する位置にはレーザ干渉計 38が設けられている。計測ステージ ST2 の 2次元方向の位置、及び回転角はレーザ干渉計 38によりリアルタイムで計測される  [0030] Measurement stage ST2 is a projection optical system on the image plane side of projection optical system PL in a state where a measurement instrument is mounted by driving measurement stage drive device SD2 including a linear motor and the like controlled by control device CONT. It can move two-dimensionally in the XY plane that is almost parallel to the image plane of the system PL, and can rotate slightly in the θZ direction. Furthermore, the measurement stage ST2 can move in the Z-axis direction, θ X direction, and θ Y direction. That is, the measurement stage ST2 can also move in the direction of six degrees of freedom in the X-axis, Y-axis, Z-axis, ΘΧ, ΘΥ, and ΘΖ directions, similar to the substrate stage ST1. A movable mirror 37 is provided on the side surface of the measurement stage ST2. Further, a laser interferometer 38 is provided at a position facing the moving mirror 37. The two-dimensional position and rotation angle of the measurement stage ST2 are measured in real time by the laser interferometer 38.
[0031] 投影光学系 PLの先端近傍には、基板 P上のァライメントマークと計測ステージ ST2 に設けられた基準マーク板上の基準マークとを検出するオファクシス方式のァラィメ ント系 ALGが設けられている。本実施形態のァライメント系 ALGでは、例えば特開平 4— 65603号公報に開示されているような、基板 P上の感光材を感光させないブロー ドバンドな検出光束を対象マークに照射し、その対象マークからの反射光により受光 面に結像された対象マークの像と不図示の指標（ァライメント系 ALG内に設けられた 指標板上の指標パターン)の像とを撮像素子 (CCD等）を用レ、て撮像し、それらの撮 像信号を画像処理することでマークの位置を計測する FIA (フィールド'イメージ'ァラ ィメント）方式が採用されてレ、る。 [0031] In the vicinity of the tip of projection optical system PL, an off-axis type alignment system ALG that detects the alignment mark on substrate P and the reference mark on the reference mark plate provided on measurement stage ST2 is provided. Yes. In the alignment system ALG of the present embodiment, a target detection mark is irradiated with a broadband detection light beam that does not expose the photosensitive material on the substrate P as disclosed in, for example, Japanese Patent Laid-Open No. 4-65603, and the target mark is irradiated. Using an image sensor (CCD, etc.), the image of the target mark imaged on the light-receiving surface by the reflected light and the image of the index (not shown) (index pattern on the index plate provided in the alignment system ALG) The FIA (field 'image' alignment) method, which measures the position of the mark by processing the image signals and processing these image signals, is used.
[0032] また、マスクステージ MSTの近傍には、投影光学系 PLを介してマスク M上のァライ メントマークと対応する基準マーク板上の基準マークとを同時に観察するための露光 波長の光を用いた TTR方式のァライメント系力 なる一対のマスクァライメント系 RAa 、 RAb力 軸方向に所定距離隔てて設けられている。本実施形態のマスクァライメン ト系では、例えば特開平 7— 176468号公報に開示されているような、マークに対し て光を照射し、 CCDカメラ等で撮像したマークの画像データを画像処理してマーク 位置を検出する VRA (ビジュアル ·レチクノレ ·ァライメント）方式が採用されてレ、る。 [0032] Further, in the vicinity of the mask stage MST, light having an exposure wavelength for simultaneously observing the alignment mark on the mask M and the corresponding reference mark on the reference mark plate is used via the projection optical system PL. A pair of mask alignment system RAa The RAb force is provided at a predetermined distance in the axial direction. In the mask alignment system of this embodiment, for example, as disclosed in Japanese Patent Laid-Open No. 7-176468, the mark is irradiated with light, and the mark image data captured by a CCD camera or the like is subjected to image processing and the mark processed. The VRA (Visual Reticle Alignment) method is used to detect the position.
[0033] <基板ホルダ >  [0033] <Board holder>
次に、図 2及び図 3を参照しながら、基板ホルダ PHについて説明する。図 2は基板 Pを保持した基板ホルダ PHの側断面図、図 3は基板 Pを保持した基板ホルダ PHを 上方から見た平面図である。  Next, the substrate holder PH will be described with reference to FIGS. 2 is a side sectional view of the substrate holder PH holding the substrate P, and FIG. 3 is a plan view of the substrate holder PH holding the substrate P as viewed from above.
[0034] 図 2において、基板ホルダ PHは、基材 PHBと、基材 PHBに形成され、基板 Pを吸 着保持する第 1保持部 PH1と、基材 PHBに形成され、第 1保持部 PH1に保持された 基板 Pの周囲に、基板 Pの上面 Paとほぼ面一の上面 Taを形成するプレート部材 Tを 吸着保持する第 2保持部 PH2とを備えている。プレート部材 Tは、基材 PHBとは別の 部材であって、基板ホルダ PHの基材 PHBに対して脱着（交換）可能に設けられてレヽ る。また、図 3に示すように、プレート部材 Tの中央部には、基板 Pを配置可能な略円 形状の穴部 THが形成されている。そして、第 2保持部 PH2に保持されたプレート部 材 Tは、第 1保持部 PH1に保持された基板 Pの周囲を囲むように配置される。  In FIG. 2, the substrate holder PH is formed on the base material PHB, the first holding portion PH1 formed on the base material PHB, and adsorbs and holds the substrate P, and formed on the base material PHB, and the first holding portion PH1. A second holding portion PH2 for adsorbing and holding a plate member T that forms an upper surface Ta that is substantially flush with the upper surface Pa of the substrate P is provided around the substrate P held by the substrate P. The plate member T is a member different from the base material PHB, and is provided so as to be detachable (replaceable) with respect to the base material PHB of the substrate holder PH. As shown in FIG. 3, a substantially circular hole TH in which the substrate P can be placed is formed at the center of the plate member T. The plate member T held by the second holding part PH2 is disposed so as to surround the periphery of the substrate P held by the first holding part PH1.
[0035] プレート部材 Tは、液体 LQに対して撥液性を有してレ、る。プレート部材 Tは、例え ばポリ四フッ化工チレン (テフロン (登録商標） )等のフッ素系樹脂やアクリル系樹脂等 の撥液性を有する材料によって形成されている。なお、プレート部材 Tを金属等で形 成し、その表面にフッ素系樹脂などの撥液性材料を被覆するようにしてもよい。  [0035] The plate member T is liquid repellent with respect to the liquid LQ. The plate member T is formed of a material having liquid repellency such as a fluorine-based resin such as polytetrafluoroethylene (Teflon (registered trademark)) or an acrylic resin. The plate member T may be formed of metal or the like, and the surface thereof may be covered with a liquid repellent material such as a fluorine-based resin.
[0036] 図 2において、プレート部材 Tの上面 Ta及び下面 Tbのそれぞれは平坦面（平坦部 )となっている。また、プレート部材 Tは基板 Pとほぼ同じ厚さである。そして、第 2保持 部 PH2に保持されたプレート部材 Tの上面（平坦面) Taと、第 1保持部 PH1に保持さ れた基板 Pの上面 Paとはほぼ面一となる。  In FIG. 2, each of the upper surface Ta and the lower surface Tb of the plate member T is a flat surface (flat portion). Further, the plate member T has substantially the same thickness as the substrate P. The upper surface (flat surface) Ta of the plate member T held by the second holding part PH2 and the upper surface Pa of the substrate P held by the first holding part PH1 are substantially flush.
[0037] プレート部材 Tの外形は平面視矩形状に形成されており、基材 PHBの外形よりも大 きく形成されている。すなわち、第 2保持部 PH2に保持されたプレート部材 Tの周縁 部は、基材 PHBの側面よりも外側に向かって突出したオーバーハング部 HIとなって いる。本実施形態においては、移動鏡 33は、オーバーハング部 HIの下側の領域に 設けられている。これにより、液体 LQが上面 Taから流出しても、オーバーハング部 H 1によって、移動鏡 33に液体 LQが付着することを防止できる。 [0037] The outer shape of the plate member T is formed in a rectangular shape in plan view, and is formed to be larger than the outer shape of the substrate PHB. That is, the peripheral edge portion of the plate member T held by the second holding portion PH2 is an overhang portion HI that protrudes outward from the side surface of the base material PHB. In the present embodiment, the movable mirror 33 is located in the area below the overhang portion HI. Is provided. Thereby, even if the liquid LQ flows out from the upper surface Ta, it is possible to prevent the liquid LQ from adhering to the movable mirror 33 by the overhang portion H1.
[0038] 図 2及び図 3に示すように、基板ホルダ PHの第 1保持部 PH1は、基材 PHB上に形 成された複数の第 1凸部 46と、複数の第 1凸部 46の周囲を囲むように基材 PHB上 に形成された環状の第 1周壁部 42とを備えている。第 1凸部 46は、基板 Pの下面 Pb を支持する。また、複数の第 1凸部 46どうしの間には第 1凹部 47が設けられる。第 1 周壁部 42は基板 Pの形状に応じて平面視略円環状に形成されており、その第 1周壁 部 42の上面 42Aは基板 Pの下面 Pbの周縁領域（エッジ領域）に対向するように形成 されている。第 1保持部 PH1に保持された基板 Pの下面 Pb側には、基材 PHBと第 1 周壁部 42と基板 Pの下面 Pbとで囲まれた第 1空間 131が形成される。  [0038] As shown in FIGS. 2 and 3, the first holding portion PH1 of the substrate holder PH includes a plurality of first convex portions 46 formed on the base material PHB, and a plurality of first convex portions 46. And an annular first peripheral wall portion 42 formed on the base material PHB so as to surround the periphery. The first protrusion 46 supports the lower surface Pb of the substrate P. A first recess 47 is provided between the plurality of first protrusions 46. The first peripheral wall portion 42 is formed in a substantially circular shape in plan view according to the shape of the substrate P, and the upper surface 42A of the first peripheral wall portion 42 is opposed to the peripheral region (edge region) of the lower surface Pb of the substrate P. Is formed. A first space 131 surrounded by the base material PHB, the first peripheral wall portion 42, and the lower surface Pb of the substrate P is formed on the lower surface Pb side of the substrate P held by the first holding portion PH1.
[0039] 第 1周壁部 42の内側の基材 PHB上には第 1吸引口 41が形成されている。第 1吸 引口 41は基板 Pを吸着保持するためのものであって、第 1周壁部 42の内側において 基材 PHBの上面のうち第 1凸部 46以外の複数の所定位置にそれぞれ設けられてい る。第 1吸引口 41のそれぞれは、流路 45を介して、真空系を含む第 1圧力調整装置 40に接続されている。制御装置 CONTは、第 1圧力調整装置 40を駆動し、基材 PH Bと第 1周壁部 42と基板 Pとで囲まれた第 1空間 131内部のガス（空気）を吸引してこ の第 1空間 131を負圧にすることによって、第 1凸部 46に基板 Pを吸着保持する。本 実施形態における第 1保持部 PH1は所謂ピンチャック機構を構成している。  A first suction port 41 is formed on the base material PHB inside the first peripheral wall portion 42. The first suction port 41 is for holding the substrate P by suction, and is provided at a plurality of predetermined positions other than the first convex portion 46 on the upper surface of the base material PHB inside the first peripheral wall portion 42. ing. Each of the first suction ports 41 is connected to a first pressure adjusting device 40 including a vacuum system via a flow path 45. The control device CONT drives the first pressure adjusting device 40 and sucks the gas (air) inside the first space 131 surrounded by the base material PH B, the first peripheral wall portion 42 and the substrate P, and this first The substrate P is sucked and held on the first convex portion 46 by making the space 131 negative. The first holding portion PH1 in the present embodiment constitutes a so-called pin chuck mechanism.
[0040] 基板ホルダ PHの第 2保持部 PH2は、第 1保持部 PH1の第 1周壁部 42を囲むよう に基材 PHB上に形成された略円環状の第 2周壁部 62と、第 2周壁部 62の外側に設 けられ、第 2周壁部 62を囲むように基材 PHB上に形成された環状の第 3周壁部 63と 、第 2周壁部 62と第 3周壁部 63との間の基材 PHB上に形成された複数の第 2凸部 6 6とを備えている。第 2凸部 66は、プレート部材 Tの下面 Tbを支持する。また、複数の 第 2凸部 66どうしの間には第 2凹部 67が設けられる。第 2周壁部 62は、プレート部材 Tの穴部 THの形状に応じて平面視略円環状に形成されている。第 3周壁部 63は、 プレート部材 Tの外側のエッジ部よりも内側にぉレ、て、平面視略矩形に形成されてレヽ る。第 2周壁部 62の上面 62Aは、プレート部材 Tの下面 Tbのうち、穴部 TH近傍の内 縁領域（内側のエッジ領域）に対向するように形成されている。第 3周壁部 63の上面 63Aは、プレート部材 Tの下面 Tbのうち、外縁領域（外側のエッジ領域）よりもやや内 側の領域に対向するように形成されている。第 2保持部 PH2に保持されたプレート部 材 Tの下面 Tb側には、基材 PHBと第 2、第 3周壁部 62、 63とプレート部材 Tの下面 Tbとで囲まれた第 2空間 132が形成される。 [0040] The second holding part PH2 of the substrate holder PH includes a substantially annular second peripheral wall part 62 formed on the base material PHB so as to surround the first peripheral wall part 42 of the first holding part PH1, and a second An annular third peripheral wall portion 63 formed on the substrate PHB so as to surround the second peripheral wall portion 62 and provided between the second peripheral wall portion 62 and the third peripheral wall portion 63. And a plurality of second convex portions 66 formed on the base material PHB. The second convex portion 66 supports the lower surface Tb of the plate member T. A second recess 67 is provided between the plurality of second protrusions 66. The second peripheral wall 62 is formed in a substantially annular shape in plan view according to the shape of the hole TH of the plate member T. The third peripheral wall 63 is formed so as to be inward of the outer edge portion of the plate member T and to be formed in a substantially rectangular shape in plan view. The upper surface 62A of the second peripheral wall portion 62 is formed to face the inner edge region (inner edge region) in the vicinity of the hole TH in the lower surface Tb of the plate member T. Upper surface of third peripheral wall 63 63A is formed so as to face a region slightly inside the outer edge region (outer edge region) of the lower surface Tb of the plate member T. On the lower surface Tb side of the plate member T held by the second holding portion PH2, the second space 132 surrounded by the base material PHB, the second and third peripheral wall portions 62, 63, and the lower surface Tb of the plate member T 132 Is formed.
[0041] 第 2周壁部 62と第 3周壁部 63との間における基材 PHB上には第 2吸引口 61が形 成されている。第 2吸引口 61はプレート部材 Tを吸着保持するためのものであって、 第 2周壁部 62と第 3周壁部 63との間において基材 PHBの上面のうち第 2凸部 66以 外の複数の所定位置にそれぞれ設けられている。第 2吸引口 61のそれぞれは、流 路 65を介して、真空系を含む第 2圧力調整装置 60に接続されている。制御装置 C〇 NTは、第 2圧力調整装置 60を駆動し、基材 PHBと第 2、第 3周壁部 62、 63とプレー ト部材 Tとで囲まれた第 2空間 132内部のガス（空気）を吸引してこの第 2空間 132を 負圧にすることによって、第 2凸部 66にプレート部材 Tを吸着保持する。本実施形態 におレ、ては、第 2保持部 PH2も所謂ピンチャック機構を構成してレ、る。  [0041] A second suction port 61 is formed on the base material PHB between the second peripheral wall 62 and the third peripheral wall 63. The second suction port 61 is for adsorbing and holding the plate member T. Between the second peripheral wall portion 62 and the third peripheral wall portion 63, the second suction port 61 other than the second convex portion 66 on the upper surface of the base material PHB. It is provided at each of a plurality of predetermined positions. Each of the second suction ports 61 is connected to a second pressure adjusting device 60 including a vacuum system via a flow path 65. The control device C0 NT drives the second pressure adjusting device 60, and the gas (air) in the second space 132 surrounded by the base material PHB, the second and third peripheral walls 62 and 63, and the plate member T is provided. ) To create a negative pressure in the second space 132, the plate member T is sucked and held on the second convex portion 66. In this embodiment, the second holding portion PH2 also constitutes a so-called pin chuck mechanism.
[0042] 図 2及び図 3に示すように、第 1保持部 PH1に保持された基板 Pの側面 Pcと、基板 Pの外側に設けられたプレート部材 Tの穴部 TH側の内側面 Tcとの間には、 0. ：!〜 1 . Omm程度のギャップ Aが形成されている。ギャップ Aを 0. ：!〜 1. Omm程度に設定 することにより、ギャップ Aを介して基板ホルダ PHの内部に液体 LQが浸入することを 防止できる。また、第 1保持部 PH1に保持された基板 Pの上面 Paと第 2保持部 PH2 に保持されたプレート部材 Tの上面 Taとはほぼ面一であるため、液浸装置 1による液 体 LQの供給及び回収を行いつつ投影光学系 PLに対して基板ホルダ PHを XY方向 に移動することで、基板 Pの上面 Paとプレート部材 Tの上面 Taとの間で液浸領域 LR を円滑に移動することができる。  [0042] As shown in FIGS. 2 and 3, the side surface Pc of the substrate P held by the first holding portion PH1, and the inner side surface Tc of the plate member T provided on the outside of the substrate P on the side of the hole TH A gap A of about 0.:! To 1 .Omm is formed between them. By setting the gap A to about 0.:! To 1. Omm, the liquid LQ can be prevented from entering the substrate holder PH through the gap A. Further, since the upper surface Pa of the substrate P held by the first holding part PH1 and the upper surface Ta of the plate member T held by the second holding part PH2 are substantially flush with each other, the liquid LQ of the liquid immersion device 1 By moving the substrate holder PH in the XY direction with respect to the projection optical system PL while supplying and collecting, the liquid immersion region LR moves smoothly between the upper surface Pa of the substrate P and the upper surface Ta of the plate member T. be able to.
[0043] 第 1空間 131の圧力を調整する第 1圧力調整装置 40と、第 2空間 132の圧力を調 整する第 2圧力調整装置 60とは互いに独立している。制御装置 CONTは、第 1圧力 調整装置 40及び第 2圧力調整装置 60それぞれの動作を個別に制御可能であり、第 1圧力調整装置 40による第 1空間 131に対する吸引動作と、第 2圧力調整装置 60よ る第 2空間 132に対する吸引動作とをそれぞれ独立して行うことができる。また、制御 装置 CONTは、第 1圧力調整装置 40と第 2圧力調整装置 60とをそれぞれ制御し、 第 1空間 131の圧力と第 2空間 132の圧力とを互いに異ならせることもできる。 The first pressure adjustment device 40 that adjusts the pressure in the first space 131 and the second pressure adjustment device 60 that adjusts the pressure in the second space 132 are independent of each other. The control device CONT can individually control the operations of the first pressure adjusting device 40 and the second pressure adjusting device 60, and the first pressure adjusting device 40 performs the suction operation on the first space 131 and the second pressure adjusting device. The suction operation to the second space 132 by 60 can be performed independently of each other. The control device CONT controls the first pressure adjustment device 40 and the second pressure adjustment device 60, respectively. The pressure in the first space 131 and the pressure in the second space 132 can be made different from each other.
[0044] 基板 Pは第 1保持部 PH1に対して脱着可能となっており、第 1圧力調整装置 40に よる吸引動作を解除することにより、第 1保持部 PH1より基板 Pを外すことができる。 同様に、プレート部材 Tは第 2保持部 PH2に対して脱着可能となっており、第 2圧力 調整装置 60による吸引動作を解除することにより、第 2保持部 PH2よりプレート部材 Tを外すことができる。図 4には、第 1保持部 PH1より基板 Pを外した状態が示されて いる。また、図 5には、第 1、第 2保持部 PH1、 PH2のそれぞれより基板 P及びプレー ト部材 Tを外した状態が示されてレ、る。  [0044] The substrate P is detachable from the first holding portion PH1, and the substrate P can be detached from the first holding portion PH1 by releasing the suction operation by the first pressure adjusting device 40. . Similarly, the plate member T can be attached to and detached from the second holding portion PH2, and the plate member T can be removed from the second holding portion PH2 by releasing the suction operation by the second pressure adjusting device 60. it can. FIG. 4 shows a state where the substrate P is removed from the first holding part PH1. FIG. 5 shows a state in which the substrate P and the plate member T are removed from the first and second holding portions PH1 and PH2, respectively.
[0045] <メンテナンス方法の第 1実施形態 >  <First Embodiment of Maintenance Method>
次に、メンテナンス方法の一実施形態について説明する。以下の説明においては 、基板ホルダ PHのうち、基板 Pを保持する第 1保持部 PH1をメンテナンスする場合に ついて説明する。より具体的には、第 1保持部 PH1の第 1凸部 46の上面 46Aの異物 を除去する場合について説明する。ここで異物とは、例えば基板 Pから発生したレジ スト剥離物や空中に浮遊していた異物、あるいは液体 LQの乾燥残渣を含む。  Next, an embodiment of the maintenance method will be described. In the following description, a case will be described in which the first holder PH1 that holds the substrate P among the substrate holder PH is maintained. More specifically, a case where foreign matter on the upper surface 46A of the first convex portion 46 of the first holding portion PH1 is removed will be described. Here, the foreign matter includes, for example, a resist peeling material generated from the substrate P, a foreign matter floating in the air, or a dry residue of the liquid LQ.
[0046] 第 1保持部 PH1のメンテナンスは、メンテナンス部材を使って行われる。図 6A及び 6Bはメンテナンス部材の一例を示す図であり、図 6Aは側面図、図 6Bは平面図であ る。図 6A及び図 6Bに示すように、メンテナンス部材 80は板状部材であって、表面 8 OAと裏面 80Bとを有している。メンテナンス部材 80は、基板 Pとほぼ同じ形状を有し ており、平面視略円形状に形成されている。メンテナンス部材 80の外形は、基板 Pの 外形とほぼ同じ、あるいは基板 Pの外形よりも小さくなつている。なおメンテナンス部材 80の厚みは、基板 Pの厚みとほぼ同じである。また本実施形態においては、メンテナ ンス部材 80の表面 80A及び裏面 80Bのそれぞれはほぼ平坦面となっている。  [0046] Maintenance of the first holding portion PH1 is performed using a maintenance member. 6A and 6B are views showing an example of the maintenance member, FIG. 6A is a side view, and FIG. 6B is a plan view. As shown in FIGS. 6A and 6B, the maintenance member 80 is a plate-like member, and has a front surface 8OA and a back surface 80B. The maintenance member 80 has substantially the same shape as the substrate P, and is formed in a substantially circular shape in plan view. The outer shape of the maintenance member 80 is substantially the same as or smaller than the outer shape of the substrate P. The thickness of the maintenance member 80 is almost the same as the thickness of the substrate P. In the present embodiment, the front surface 80A and the back surface 80B of the maintenance member 80 are substantially flat surfaces.
[0047] メンテナンス部材 80は、例えばセラミックスあるいはステンレス鋼によって形成され ている。あるいは、メンテナンス部材 80は、テフロン (登録商標）等のフッ素系樹脂に よって形成されていてもよい。後述するように、メンテナンス作業を行うときにはメンテ ナンス部材 80を第 1保持部 PH1の第 1凸部 46上に載せるので、メンテナンス部材 8 0の形成材料としては、アウトガスが少なぐ第 1凸部 46に応じて、第 1凸部 46と同等 力、それ以下の硬度を有するものであることが好ましい。第 1凸部 46の磨耗を防止する ためである。またメンテナンス部材 80は、基板 Pと同じ材料 (シリコンを含む）で形成さ れてもよい。 [0047] Maintenance member 80 is formed of, for example, ceramics or stainless steel. Alternatively, the maintenance member 80 may be made of a fluorine resin such as Teflon (registered trademark). As will be described later, since the maintenance member 80 is placed on the first convex portion 46 of the first holding portion PH1 during maintenance work, the first convex portion 46 with less outgas is used as a material for forming the maintenance member 80. Accordingly, it is preferable that the first convex portion 46 has a strength equal to or less than that of the first convex portion 46. Prevent wear of first convex part 46 Because. The maintenance member 80 may be formed of the same material (including silicon) as the substrate P.
[0048] 図 7A及び 7Bは、基板ホルダ PHの第 1保持部 PH1をメンテナンスする方法を説明 するための図である。  FIGS. 7A and 7B are views for explaining a method of maintaining the first holding portion PH1 of the substrate holder PH.
[0049] 第 1保持部 PH1のメンテナンス作業を行うときには、第 1保持部 PH1に基板 Pは保 持されていない。一方、第 2保持部 PH2にはプレート部材 Tが保持されている。メン テナンス部材 80を使って第 1保持部 PH1のメンテナンス作業を行うとき、図 7Aに示 すように、メンテナンス部材 80は、搬送装置 300によって、基板ホルダ PHの第 1保持 部 PH1に搬送される。ここで、上述のように、搬送装置 300は、基板ホルダ PHの第 1 保持部 PH1に対して基板 Pを搬送可能であり、基板 Pを基板ホルダ PH (第 1保持部 PH1)に搬入（ロード）可能であるとともに、基板 Pを基板ホルダ PH (第 1保持部 PH1 )より搬出（アンロード）可能である。このように、メンテナンス部材 80は、基板 Pを搬送 する搬送装置 300によって搬送可能な大きさ及び形状を有している。メンテナンス部 材 80の外形が基板 Pの外形よりも小さい場合においても、メンテナンス部材 80は搬 送装置 300によって搬送可能な程度の大きさとなっている。  [0049] When the maintenance work of the first holding part PH1 is performed, the substrate P is not held in the first holding part PH1. On the other hand, the plate member T is held by the second holding portion PH2. When maintenance work of the first holding part PH1 is performed using the maintenance member 80, the maintenance member 80 is transferred to the first holding part PH1 of the substrate holder PH by the transfer device 300 as shown in FIG. 7A. . Here, as described above, the transfer device 300 can transfer the substrate P to the first holding part PH1 of the substrate holder PH, and loads (loads) the substrate P into the substrate holder PH (first holding part PH1). In addition, the substrate P can be unloaded from the substrate holder PH (first holding portion PH1). As described above, the maintenance member 80 has a size and a shape that can be transferred by the transfer device 300 that transfers the substrate P. Even when the outer shape of the maintenance member 80 is smaller than the outer shape of the substrate P, the maintenance member 80 is large enough to be transported by the transport device 300.
[0050] 搬送装置 300は、メンテナンス部材 80の表面 80Aが第 1保持部 PH1の第 1凸部 4 6の上面 46Aと接触するように、メンテナンス部材 80を基板ホルダ PHの第 1保持部 P HIに搬送する。そして、搬送装置 300は、第 1保持部 PH1の第 1凸部 46に、メンテ ナンス部材 80の表面 80Aと第 1凸部 46の上面 46Aとが接触するように、メンテナン ス部材 80を載せる。図 7Bには、第 1保持部 PH1の第 1凸部 46にメンテナンス部材 8 0が載ってレ、る状態が示されてレ、る。  [0050] The transfer device 300 moves the maintenance member 80 from the first holding portion P HI of the substrate holder PH so that the surface 80A of the maintenance member 80 contacts the upper surface 46A of the first convex portion 46 of the first holding portion PH1. Transport to. Then, the transport apparatus 300 places the maintenance member 80 on the first convex portion 46 of the first holding portion PH1 so that the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 are in contact with each other. FIG. 7B shows a state in which the maintenance member 80 is placed on the first convex portion 46 of the first holding portion PH1.
[0051] 第 1凸部 46にメンテナンス部材 80を載せた状態で、制御装置 CONTは、基板ステ ージ駆動装置 SD1を使って基板ステージ ST1を駆動し、基板ステージ ST1に支持さ れている基板ホルダ PHを駆動する。このとき、第 1圧力調整装置 40の駆動は停止し ている。すなわち、メンテナンス部材 80と基板ホルダ PHとの間で形成された第 1空間 131はほぼ大気圧となっている。基板ステージ駆動装置 SD1は、第 1保持部 PH1の 第 1凸部 46上にメンテナンス部材 80を載せ、メンテナンス部材 80の裏面 80Bを押圧 しない状態で、基板ホルダ PH (基板ステージ ST1)を駆動することにより、その基板 ホルダ PHの駆動により生じた慣性力によって、メンテナンス部材 80を第 1凸部 46上 で滑らせることができる。具体的には、図 8Aに示すように、基板ステージ駆動装置 S D1は、第 1凸部 46上にメンテナンス部材 80を載せた状態で、水平面内（XY平面内 、第 1凸部 46の上面 46Aとほぼ平行な平面内）における所定方向に所定の加速度 で基板ホルダ PHを駆動し、その後、急激に停止させることにより、メンテナンス部材 8 0を第 1凸部 46の上面 46Aに対して水平方向に滑らせることができる。 [0051] With the maintenance member 80 placed on the first convex portion 46, the control device CONT drives the substrate stage ST1 using the substrate stage drive device SD1, and the substrate supported by the substrate stage ST1. Drive holder PH. At this time, the driving of the first pressure adjusting device 40 is stopped. That is, the first space 131 formed between the maintenance member 80 and the substrate holder PH is almost atmospheric pressure. The substrate stage drive device SD1 places the maintenance member 80 on the first convex portion 46 of the first holding portion PH1 and drives the substrate holder PH (substrate stage ST1) without pressing the back surface 80B of the maintenance member 80. By its substrate The maintenance member 80 can be slid on the first convex portion 46 by the inertial force generated by driving the holder PH. Specifically, as shown in FIG. 8A, the substrate stage driving device SD1 is arranged in a horizontal plane (in the XY plane, the upper surface of the first convex portion 46 with the maintenance member 80 placed on the first convex portion 46. The substrate holder PH is driven at a predetermined acceleration in a predetermined direction (within a plane substantially parallel to 46A), and then suddenly stopped, so that the maintenance member 80 is horizontal with respect to the upper surface 46A of the first convex portion 46. Can be slid into.
[0052] メンテナンス部材 80を第 1凸部 46の上面 46Aで滑らせて移動させることにより、図 8Bの模式図に示すように、メンテナンス部材 80の移動に伴って、第 1凸部 46の上面 46Aの異物をその第 1凸部 46に隣り合う位置に設けられた第 1凹部 47に移動させる こと力 Sできる。換言すれば、メンテナンス部材 80を第 1凸部 46上で滑らせることにより 、第 1凸部 46の上面 46Aに付着した異物を、第 1凹部 47に払い落とすことができる。 以上により、基板 Pを保持する保持面として機能する第 1凸部 46の上面 46Aの異物 を除去すること力 Sできる。  [0052] By moving the maintenance member 80 by sliding on the upper surface 46A of the first convex portion 46, the upper surface of the first convex portion 46 is moved along with the movement of the maintenance member 80, as shown in the schematic diagram of FIG. 8B. The force S can be moved by moving the foreign matter 46A to the first concave portion 47 provided at a position adjacent to the first convex portion 46. In other words, the foreign matter attached to the upper surface 46A of the first convex portion 46 can be wiped off to the first concave portion 47 by sliding the maintenance member 80 on the first convex portion 46. As described above, it is possible to remove force S from the upper surface 46A of the first convex portion 46 that functions as a holding surface that holds the substrate P.
[0053] メンテナンス部材 80を第 1凸部 46上で滑らせるときには、メンテナンス部材 80の摩 擦係数及びメンテナンス部材 80の重量の少なくとも一方に応じて、第 1凸部 46上で メンテナンス部材 80が良好に滑るように、基板ホルダ PHを駆動するときの加速度が 設定される。また、基板ステージ駆動装置 SD1は、基板ホルダ PHを水平面内にお ける所定方向に往復動（振動）させてもよい。こうすることにより、基板ホルダ PHは加 速と停止とを繰り返すので、基板ホルダ PHの駆動により生じた慣性力によって、メン テナンス部材 80を第 1凸部 46上で良好に滑らせることができる。  [0053] When the maintenance member 80 is slid on the first convex portion 46, the maintenance member 80 is good on the first convex portion 46 according to at least one of the friction coefficient of the maintenance member 80 and the weight of the maintenance member 80. The acceleration when driving the substrate holder PH is set so as to slide. Further, the substrate stage driving device SD1 may reciprocate (vibrate) the substrate holder PH in a predetermined direction in a horizontal plane. By doing so, the substrate holder PH repeatedly accelerates and stops, so that the maintenance member 80 can be satisfactorily slid on the first convex portion 46 by the inertia force generated by driving the substrate holder PH.
[0054] また、メンテナンス部材 80の表面 80Aは、第 1凸部 46の上面 46Aと接触し、その上 面 46Aをメンテナンスするメンテナンス面として機能している。そのため、良好にメン テナンス作業できるように、具体的には、第 1凸部 46の上面 46Aで良好に滑ることが でき、且つ上面 46A上で滑っても上面 46Aや表面 80Aから異物を発生させなレ、よう に、摩擦係数や硬度など、表面 80Aの状態が最適化される。  [0054] Further, the surface 80A of the maintenance member 80 is in contact with the upper surface 46A of the first convex portion 46, and functions as a maintenance surface for maintaining the upper surface 46A. Therefore, specifically, in order to perform a good maintenance work, it is possible to slide well on the upper surface 46A of the first convex portion 46, and even if it slides on the upper surface 46A, foreign matter is generated from the upper surface 46A and the surface 80A. As such, the surface 80A condition such as friction coefficient and hardness is optimized.
[0055] また、メンテナンス部材 80が第 1凸部 46の上面 46Aに対して移動する相対的な距 離は、上面 46Aの大きさよりも大きいことが好ましい。これにより、第 1凸部 46上の異 物を第 1凹部 47まで円滑に移動することができる。 [0056] 本実施形態においては、第 1保持部 PH1の第 1凸部 46上に載っているメンテナン ス部材 80の外側には、第 2保持部 PH2に保持されたプレート部材 Tが配置されてお り、メンテナンス部材 80は、プレート部材 Tの穴部 TH (内側面 Tc)の内側で滑る構成 である。すなわち、メンテナンス部材 80は、プレート部材 Tの内側面 Tcによって、そ の滑り量 (移動量)を制限されている。したがって、例えば滑り過ぎることによってメン テナンス部材 80が基板ホルダ PH上から落下する等の不具合の発生が防止されて いる。このように、第 1凸部 46上でのメンテナンス部材 80の滑り量 (移動量）を制限す るための制限部材として、プレート部材 Tが配置されていることにより、上述のような不 具合の発生が防止される。 [0055] The relative distance that the maintenance member 80 moves with respect to the upper surface 46A of the first convex portion 46 is preferably larger than the size of the upper surface 46A. Thereby, the foreign object on the first convex portion 46 can be smoothly moved to the first concave portion 47. [0056] In the present embodiment, the plate member T held by the second holding portion PH2 is disposed outside the maintenance member 80 placed on the first convex portion 46 of the first holding portion PH1. The maintenance member 80 is configured to slide inside the hole TH (inner side surface Tc) of the plate member T. That is, the sliding amount (movement amount) of the maintenance member 80 is limited by the inner surface Tc of the plate member T. Therefore, for example, the occurrence of problems such as the maintenance member 80 dropping from the substrate holder PH due to excessive sliding is prevented. As described above, since the plate member T is arranged as a limiting member for limiting the slip amount (movement amount) of the maintenance member 80 on the first convex portion 46, the above-described problem is not caused. Occurrence is prevented.
[0057] また、メンテナンス部材 80の外形を基板 Pの外形とほぼ同じ、あるいは基板 Pの外 形よりも小さくすることにより、プレート部材 Tの穴部 THの内側に配置することができ る。特に、メンテナンス部材 80の外形を基板 Pの外形よりも小さくすることで、メンテナ ンス部材 80をプレート部材 Tの穴部 THの内側において円滑に滑らせることができる 。すなわち、メンテナンス部材 80の外形と基板 Pの外形とをほぼ同じにした場合には 、メンテナンス部材 80をプレート部材 Tの穴部 THの内側に配置したとき、メンテナン ス部材 80とプレート部材 Tとの間には上述のギャップ Aに相当するギャップしか確保 されなレ、。この場合、メンテナンス部材 80を第 1凸部 46上で滑らせたときの滑り量 (移 動量）は、ギャップ Aに応じた僅かな距離なので、第 1凸部 46の上面 46Aの異物を第 1凹部 47まで円滑に移動することが困難となる可能性がある。したがって、第 1凸部 4 6上でのメンテナンス部材 80の目標滑り量 (移動量）に応じたギャップをプレート部材 Tとの間で確保できる程度に、メンテナンス部材 80の外形を設定することで、メンテナ ンス部材 80をプレート部材 Tの穴部 THの内側で円滑に滑らせることができる。  Further, the maintenance member 80 can be arranged inside the hole TH of the plate member T by making the outer shape of the maintenance member 80 substantially the same as the outer shape of the substrate P or smaller than the outer shape of the substrate P. In particular, the maintenance member 80 can be smoothly slid inside the hole TH of the plate member T by making the outer shape of the maintenance member 80 smaller than the outer shape of the substrate P. In other words, when the outer shape of the maintenance member 80 and the outer shape of the substrate P are substantially the same, when the maintenance member 80 is disposed inside the hole TH of the plate member T, the maintenance member 80 and the plate member T In the meantime, only the gap corresponding to the above gap A is secured. In this case, since the slip amount (movement amount) when the maintenance member 80 is slid on the first convex portion 46 is a slight distance corresponding to the gap A, the foreign matter on the upper surface 46A of the first convex portion 46 is removed from the first convex portion 46. It may be difficult to move smoothly to the recess 47. Therefore, by setting the outer shape of the maintenance member 80 to such an extent that a gap corresponding to the target slip amount (movement amount) of the maintenance member 80 on the first convex portion 46 can be secured with the plate member T, The maintenance member 80 can be smoothly slid inside the hole TH of the plate member T.
[0058] 第 1凸部 46の異物の除去作業 (メンテナンス作業）が完了した後、制御装置 C〇N Tは、搬送装置 300を使って、メンテナンス部材 80を基板ホルダ PHより搬出する。メ ンテナンス作業を終えたメンテナンス部材 80の表面 80Aには異物が付着していたり 汚染している可能性があるため、基板ホルダ PHより搬出したメンテナンス部材 80に 対して所定の洗浄処理を行うことが好ましい。また、汚染されたメンテナンス部材 80を 新たなものと交換してもよい。 [0059] 以上説明したように、メンテナンス部材 80を第 1凸部 46上に載せて基板ホルダ PH を駆動して第 1凸部 46上で滑らせるといった簡易な構成で、第 1保持部 PH1の第 1 凸部 46上の異物を除去することができる。したがって、異物が除去された第 1保持部 PH1の第 1凸部 46に基板 Pを保持し、基板 Pの汚染や、基板 Pの局所的な変形 (フラ ットネスの劣化）を抑えた状態で、基板 Pを精度良く露光することができる。 [0058] After the foreign matter removal work (maintenance work) on the first convex portion 46 is completed, the control device COONT carries out the maintenance member 80 from the substrate holder PH by using the transport device 300. The maintenance member 80 that has undergone maintenance work may have a foreign surface adhering to or contaminated on the surface 80A. preferable. Also, the contaminated maintenance member 80 may be replaced with a new one. [0059] As described above, the maintenance member 80 is placed on the first convex portion 46, and the substrate holder PH is driven to slide on the first convex portion 46. Foreign matter on the first convex portion 46 can be removed. Therefore, the substrate P is held on the first convex portion 46 of the first holding portion PH1 from which the foreign matter has been removed, and contamination of the substrate P and local deformation (deterioration of flatness) of the substrate P are suppressed. The substrate P can be exposed with high accuracy.
[0060] また、メンテナンス部材 80は、基板 Pを搬送する搬送装置 300によって基板ホルダ PHに搬送されるので、メンテナンス作業を行うための複雑な機構を設けることなぐ 既存の装置構成を使ってメンテナンス作業を行うことができる。また、移動鏡 33が設 けられた基板ホルダ PHを基板ステージ ST1より取り外すこと無ぐ基板ホルダ PHの メンテナンスができるため、基板ホルダ PHを露光装置 EXの外部に持ち出した際に 温度変化による移動鏡の熱的変化や、基板ステージ ST1周辺の空間の温度変化が ないので、メンテナンス時間を大幅に縮小することができる。  [0060] Further, since the maintenance member 80 is transported to the substrate holder PH by the transport device 300 for transporting the substrate P, maintenance work can be performed using an existing device configuration without providing a complicated mechanism for performing maintenance work. It can be performed. In addition, since the substrate holder PH can be maintained without removing the substrate holder PH provided with the movable mirror 33 from the substrate stage ST1, when the substrate holder PH is taken out of the exposure apparatus EX, the movable mirror due to a temperature change is taken. Maintenance time can be significantly reduced because there is no thermal change in the temperature and temperature change in the space around the substrate stage ST1.
[0061] 次に、基板ステージ ST1及び計測ステージ ST2の動作とメンテナンス作業との関 係について説明する。  [0061] Next, the relationship between the operation of the substrate stage ST1 and the measurement stage ST2 and the maintenance work will be described.
[0062] 図 9は基板ステージ ST1 (基板ホルダ PH)及び計測ステージ ST2を上方から見た 図である。制御装置 CONTは、基板 Pの液浸露光を行うとき、図 9に示すように、基板 ステージ ST1 (基板ホルダ PH)と計測ステージ ST2とを離し、投影光学系 PLと基板 ホルダ PH上の基板 Pとを対向させる。制御装置 CONTは、基板ステージ ST1にお いて基板 Pに対する液浸露光を終了した後、駆動装置 SD1、 SD2を使って基板ステ ージ ST1及び計測ステージ ST2の少なくとも一方を移動し、図 10Aに示すように、基 板ホルダ PHのプレート部材 Tの上面 Taに対して計測ステージ ST2の上面 Fを接触（ 又は近接）させる。ここで、計測ステージ ST2の上面 Fは、プレート部材 Tの上面 Taと 同様、平坦面であり、制御装置 CONTは、駆動装置 SD1、 SD2を使って基板ホルダ PHのプレート部材 Tの上面 Taと計測ステージ ST2の上面 Fとを接触（又は近接）さ せたとき、上面 Taと上面 Fとをほぼ面一にすることができる。  FIG. 9 shows the substrate stage ST1 (substrate holder PH) and the measurement stage ST2 as viewed from above. As shown in Fig. 9, the controller CONT separates the substrate stage ST1 (substrate holder PH) from the measurement stage ST2, and performs projection exposure on the projection optical system PL and the substrate P on the substrate holder PH. Facing each other. After completing the immersion exposure for the substrate P in the substrate stage ST1, the control device CONT moves at least one of the substrate stage ST1 and the measurement stage ST2 using the driving devices SD1 and SD2, and is shown in FIG. 10A. As described above, the upper surface F of the measurement stage ST2 is brought into contact with (or close to) the upper surface Ta of the plate member T of the substrate holder PH. Here, the upper surface F of the measurement stage ST2 is a flat surface similar to the upper surface Ta of the plate member T, and the control device CONT uses the drive devices SD1 and SD2 to measure the upper surface Ta of the plate member T of the substrate holder PH. When the upper surface F of the stage ST2 is brought into contact (or close proximity), the upper surface Ta and the upper surface F can be substantially flush with each other.
[0063] 次に、制御装置 CONTは、基板ステージ ST1 (基板ホルダ PH)と計測ステージ ST 2との Y軸方向における相対的な位置関係を維持しつつ、駆動装置 SD1、 SD2を使 つて、基板ステージ ST1と計測ステージ ST2とを—Y方向に一緒に移動する。制御 装置 CONTは、基板ステージ ST1と計測ステージ ST2とを一緒に移動することによ つて、投影光学系 PLの第 1光学素子 LSIと基板 Pとの間に保持されている液体 LQ の液浸領域 LRを、基板ホルダ PHのプレート部材 Tの上面 Taから計測ステージ ST2 の上面 Fへ移動することができる。液体 LQの液浸領域 LRが、プレート部材 Tの上面 Taから計測ステージ ST2の上面 Fに移動する途中におレ、ては、図 10Bに示すように 、プレート部材 Tの上面 Taと計測ステージ ST2の上面 F2とに跨るようにして同時に 配置される。そして、図 10Bの状態から、更に基板ステージ ST1及び計測ステージ S T2がー緒に一 Y方向に所定距離移動すると、図 11Aに示すように、投影光学系 PL の第 1光学素子 LSIと計測ステージ ST2との間に液体 LQが保持された状態となり、 液体 LQの液浸領域 LRが計測ステージ ST2の上面 Fに配置される。 [0063] Next, the control device CONT uses the drive devices SD1 and SD2 to maintain the relative positional relationship between the substrate stage ST1 (substrate holder PH) and the measurement stage ST 2 in the Y-axis direction. Move stage ST1 and measurement stage ST2 together in the Y direction. control The apparatus CONT moves the substrate stage ST1 and the measurement stage ST2 together, so that the immersion area LR of the liquid LQ held between the first optical element LSI of the projection optical system PL and the substrate P Can be moved from the upper surface Ta of the plate member T of the substrate holder PH to the upper surface F of the measurement stage ST2. While the liquid LQ immersion area LR is moving from the upper surface Ta of the plate member T to the upper surface F of the measurement stage ST2, as shown in FIG. 10B, the upper surface Ta of the plate member T and the measurement stage ST2 It is arranged at the same time so as to straddle the upper surface F2. 10B, when the substrate stage ST1 and the measurement stage ST2 are further moved by a predetermined distance in the Y direction, the first optical element LSI and the measurement stage of the projection optical system PL are shown in FIG. 11A. Liquid LQ is held between ST2 and liquid immersion area LR of liquid LQ is placed on top surface F of measurement stage ST2.
次いで、制御装置 CONTは、基板ステージ駆動装置 SD1を使って、基板ステージ ST1を所定の基板交換位置 RPに移動する。また、これと並行して、制御装置 C〇N Tは、計測ステージ ST2を使った所定の計測処理を必要に応じて実行する。この計 測としては、ァライメント系 ALGのベースライン計測が一例として挙げられる。具体的 には、制御装置 CONTでは、計測ステージ ST2上に設けられた基準マーク板 FM上 の一対の第 1基準マークとそれに対応するマスク M上のマスクァライメントマークとを 上述のマスクァライメント系 RAa、 RAbを用いて同時に検出し、第 1基準マークとそれ に対応するマスクァライメントマークとの位置関係を検出する。これと同時に、制御装 置 CONTは、基準マーク板 FM上の第 2基準マークをァライメント系 ALGで検出する ことで、ァライメント系 ALGの検出基準位置と第 2基準マークとの位置関係を検出す る。そして、制御装置 CONTは、上記第 1基準マークとそれに対応するマスクァラィメ ントマークとの位置関係と、ァライメント系 ALGの検出基準位置と第 2基準マークとの 位置関係と、既知の第 1基準マークと第 2基準マークとの位置関係とに基づいて、投 影光学系 PUこよるマスクパターンの投影中心とァライメント系 ALGの検出基準位置 との距離 (位置関係）、すなわち、ァライメント系 ALGのベースライン情報を求める。 図 11Bには、このときの状態が示されている。また、計測動作としては、ベースライン 計測に限らず、計測ステージ ST2を使って、照度計測、照度ムラ計測、空間像計測 なども挙げられ、制御装置 CONTは、その計測結果に基づいて、例えば投影光学系 PLのキャリブレーション処理を行う等、その後に行われる基板 Pの露光に反映させる ようにしてもよい。 Next, the control device CONT uses the substrate stage driving device SD1 to move the substrate stage ST1 to a predetermined substrate exchange position RP. In parallel with this, the control device C0NT performs a predetermined measurement process using the measurement stage ST2 as necessary. An example of this measurement is the baseline measurement of alignment ALG. Specifically, in the control device CONT, a pair of first reference marks on the reference mark plate FM provided on the measurement stage ST2 and a corresponding mask alignment mark on the mask M are connected to the mask alignment system described above. RAa and RAb are used for simultaneous detection and the positional relationship between the first reference mark and the corresponding mask alignment mark is detected. At the same time, the control device CONT detects the second reference mark on the reference mark plate FM with the alignment ALG to detect the positional relationship between the alignment reference position of the alignment ALG and the second reference mark. . The control device CONT then determines the positional relationship between the first reference mark and the corresponding mask alignment mark, the positional relationship between the alignment reference position of the alignment ALG and the second reference mark, the known first reference mark and the first reference mark. 2 Based on the positional relationship with the reference mark, the distance (positional relationship) between the projection center of the projection optical system PU and the detection reference position of the alignment system ALG, that is, the baseline information of the alignment system ALG Ask. FIG. 11B shows this state. In addition, the measurement operation is not limited to baseline measurement, but also includes illuminance measurement, illuminance unevenness measurement, and aerial image measurement using the measurement stage ST2, and the control device CONT performs projection based on the measurement result, for example. Optical system You may make it reflect in exposure of the board | substrate P performed after that, such as performing the calibration process of PL.
[0065] 制御装置 CONTは、基板ステージ ST1 (基板ホルダ PH)を基板交換位置 RPに移 動した後、この基板交換位置 RPにおいて、基板ホルダ PH上の露光済みの基板 Pを 搬送装置 300を使ってアンロードするとともに、上述のメンテナンス部材 80を搬送装 置 300を使って基板ホルダ PHの第 1保持部 PH1にロードする。制御装置 CONTは 、この基板交換位置 RPにおいて、基板ステージ駆動装置 SD1を駆動させ、基板ホ ルダ PHを駆動する。すなわち、制御装置 CONTは、基板ステージ ST1 (基板ホルダ PH)が搬送装置 300の近傍に位置している際に基板ステージ駆動装置 SD1を駆動 させ、メンテナンス部材 80が載っている基板ホルダ PHを駆動する。このとき、制御装 置 CONTは、計測ステージ ST2により所定の処理を行っている。すなわち、本実施 形態においては、制御装置 CONTは、投影光学系 PL近傍で計測ステージ ST2によ る所定の処理を行っている間に、搬送装置 300の近傍の基板交換位置 RPにおいて 、基板ステージ駆動装置 SD1を駆動して、メンテナンス部材 80を使ったメンテナンス 作業を行う。  [0065] After moving the substrate stage ST1 (substrate holder PH) to the substrate replacement position RP, the control device CONT uses the transfer device 300 to transfer the exposed substrate P on the substrate holder PH at the substrate replacement position RP. The above-described maintenance member 80 is loaded onto the first holding portion PH1 of the substrate holder PH using the transfer device 300. The controller CONT drives the substrate stage driving device SD1 and the substrate holder PH at the substrate replacement position RP. That is, the control device CONT drives the substrate stage driving device SD1 when the substrate stage ST1 (substrate holder PH) is positioned in the vicinity of the transfer device 300, and drives the substrate holder PH on which the maintenance member 80 is mounted. . At this time, the control device CONT performs a predetermined process by the measurement stage ST2. That is, in the present embodiment, the control device CONT drives the substrate stage at the substrate exchange position RP near the transfer device 300 while performing the predetermined processing by the measurement stage ST2 near the projection optical system PL. Device SD1 is driven to perform maintenance work using maintenance member 80.
[0066] 基板交換位置 RPにおいてメンテナンス部材 80を使ったメンテナンス作業を行った 後、制御装置 CONTは、搬送装置 300を使って、メンテナンス部材 80を基板ホルダ PHより搬出し、その搬出したメンテナンス部材 80に対して、必要に応じて洗浄処理 を行う。そして、制御装置 CONTは、メンテナンスされた基板ホルダ PHに対して、搬 送装置 300を使って、露光されるべき基板 Pをロードする。  [0066] After performing the maintenance work using the maintenance member 80 at the substrate replacement position RP, the control device CONT uses the transfer device 300 to carry out the maintenance member 80 from the substrate holder PH, and the carried maintenance member 80. If necessary, perform cleaning treatment. Then, the control device CONT loads the substrate P to be exposed using the transport device 300 to the maintained substrate holder PH.
[0067] そして、基板ホルダ PHに対する基板 Pのロードが完了するとともに、計測ステージ S T2による計測処理が終了した後、制御装置 CONTは、例えば計測ステージ ST2の 上面 Fと基板ホルダ PHのプレート部材 Tの上面 Taとを接触（又は近接）させ、その相 対的な位置関係を維持した状態で、 XY平面内で移動し、交換後の基板 Pに対して ァライメント処理を行う。具体的には、制御装置 CONTは、ァライメント系 ALGによつ て交換後の基板 P上のァライメントマークの検出を行レ、、基板 P上に設けられた複数 のショット領域それぞれの位置座標（配列座標）を決定する。  [0067] After the loading of the substrate P to the substrate holder PH is completed and the measurement process by the measurement stage S T2 is completed, the control device CONT, for example, the upper surface F of the measurement stage ST2 and the plate member T of the substrate holder PH. With the upper surface Ta in contact with (or close to) the substrate, move in the XY plane while maintaining the relative positional relationship, and perform the alignment process on the replaced substrate P. Specifically, the control device CONT uses the alignment system ALG to detect the alignment mark on the substrate P after replacement, and the position coordinates of each of the plurality of shot areas provided on the substrate P ( Determine the array coordinates.
[0068] その後、制御装置 CONTは、先ほどとは逆に、基板ホルダ PH (基板ステージ ST1 )と計測ステージ ST2との Y軸方向の相対的な位置関係を維持しつつ、両ステージ S Tl、 ST2を +Υ方向に一緒に移動して、基板ステージ ST1 (基板 Ρ)を投影光学系 Ρ Lの下方に移動した後、計測ステージ ST2を所定の位置に退避させる。これにより、 液浸領域 LRが基板ホルダ ΡΗのプレート部材 Τの上面 Taに配置される。 [0068] After that, the control device CONT, contrary to the previous case, the substrate holder PH (substrate stage ST1 ) And measurement stage ST2 while maintaining the relative positional relationship in the Y-axis direction, move both stages S Tl and ST2 together in the + Υ direction to move the substrate stage ST1 (substrate Ρ) to the projection optical system Ρ After moving below L, measurement stage ST2 is retracted to a predetermined position. As a result, the immersion region LR is arranged on the upper surface Ta of the plate member ΡΗ of the substrate holder ΡΗ.
[0069] その後、制御装置 CONTは、基板 Pに対する露光動作を実行し、基板 P上の複数 のショット領域のそれぞれにマスク Mのパターンを順次転写する。なお、基板 上の 各ショット領域のマスク Mに対する位置合わせは、上述の基板 P上のァライメントマー クの検出の結果得られた基板 P上の複数のショット領域の位置座標と、直前に計測し たベースライン情報とに基づいて行われる。  [0069] After that, the control device CONT performs an exposure operation on the substrate P, and sequentially transfers the pattern of the mask M to each of the plurality of shot regions on the substrate P. The alignment of each shot area on the substrate with respect to the mask M is measured immediately before the position coordinates of the plurality of shot areas on the substrate P obtained as a result of the alignment mark detection on the substrate P described above. Based on baseline information.
[0070] <メンテナンス方法の第 2実施形態 >  <Second Embodiment of Maintenance Method>
次に、メンテナンス方法の第 2実施形態について説明する。本実施形態において は、第 1凸部 46上の異物の有無を検出可能な検出装置を使った動作を含むメンテ ナンス作業の一例について説明する。以下の説明において、上述の実施形態と同一 又は同等の構成部分については同一の符号を付し、その説明を簡略若しくは省略 する。  Next, a second embodiment of the maintenance method will be described. In the present embodiment, an example of maintenance work including an operation using a detection device capable of detecting the presence or absence of a foreign matter on the first convex portion 46 will be described. In the following description, components that are the same as or equivalent to those in the above-described embodiment are denoted by the same reference numerals, and description thereof is simplified or omitted.
[0071] 図 12Aは、第 1凸部 46上の異物の有無を検出可能な検出装置 36を示す図である 。図 12Aにおいて、検出装置 36は、基板ホルダ PHの第 1保持部 PH1に保持された メンテナンス部材 80の裏面 80Bに検出光 Lbを斜め方向から照射する投射部 36Aと 、検出光 Lbに対して所定の位置関係で配置され、メンテナンス部材 80の裏面 80B で反射した検出光 Lbの反射光を受光可能な受光部 36Bとを有してレ、る。検出装置 3 6は、図 11Bを参照して説明したような、基板交換位置 RP近傍に設けられている。基 板交換位置 RPにおける検出装置 36を使った検出処理及びメンテナンス部材 80を 使ったメンテナンス作業と、計測ステージ ST2による計測処理の少なくとも一部とは 並行して行われる。検出装置 36を使って異物の有無を検出するときには、まず、基 板交換位置 RPにおレ、て、メンテナンス部材 80の表面 80Aと第 1凸部 46の上面 46A とが対向するように、搬送装置 300がメンテナンス部材 80を第 1凸部 46上に載せる。 そして、制御装置 CONTは、第 1圧力調整装置 40を使って、メンテナンス部材 80と 基板ホルダ PHとの間で形成される第 1空間 131の圧力を負圧にし、第 1凸部 46にメ ンテナンス部材 80を吸着保持する。ここで、メンテナンス部材 80は、その表面 80Aと 第 1周壁部 42の上面 42Aとが対向できる程度の大きさを有しているため、第 1空間 1 31を負圧にすることができる。 FIG. 12A is a diagram showing a detection device 36 that can detect the presence or absence of foreign matter on the first convex portion 46. In FIG. 12A, the detection device 36 includes a projection unit 36A for irradiating the back surface 80B of the maintenance member 80 held by the first holding unit PH1 of the substrate holder PH with the detection light Lb from an oblique direction, and a predetermined value for the detection light Lb. And a light receiving unit 36B capable of receiving the reflected light of the detection light Lb reflected by the back surface 80B of the maintenance member 80. The detection device 36 is provided in the vicinity of the substrate replacement position RP as described with reference to FIG. 11B. The detection process using the detection device 36 and the maintenance work using the maintenance member 80 at the board replacement position RP and at least a part of the measurement process by the measurement stage ST2 are performed in parallel. When detecting the presence / absence of a foreign object using the detection device 36, first, transfer it so that the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 face each other at the board replacement position RP. The apparatus 300 places the maintenance member 80 on the first convex portion 46. Then, the control device CONT uses the first pressure adjusting device 40 to make the pressure in the first space 131 formed between the maintenance member 80 and the substrate holder PH negative, and to the first convex portion 46. Maintenance member 80 is sucked and held. Here, since the maintenance member 80 has such a size that the surface 80A and the upper surface 42A of the first peripheral wall portion 42 can face each other, the first space 131 can be set to a negative pressure.
[0072] 制御装置 CONTは、検出装置 36の投射部 36Aより、第 1凸部 46に保持されたメン テナンス部材 80の裏面 80Bに対して検出光 Lbを斜め方向から照射する。第 1凸部 4 6の上面 46Aに異物が有る場合と無レ、場合とでは、メンテナンス部材 80の裏面 80B の局所的な形状が異なるため、裏面 80Bに検出光 Lbを照射した際、その裏面 80B で反射した検出光 Lbの受光部 36Bでの受光状態（受光位置）が異なる。これにより、 第 1凸部 46の上面 46Aの異物の有無を検出することができる。このように、検出装置 36は、第 1凸部 46の上面 46Aに吸着保持されたメンテナンス部材 80のうち上面 46 Aに対向している表面 80Aとは反対側の裏面 80Bの面情報に基づいて、第 1凸部 4 6の上面 46Aに異物が有るか否かを検出することができる。本実施形態においては、 メンテナンス部材 80の表面 80A及び裏面 80Bのそれぞれはほぼ平坦面となってい るため、検出装置 36は異物の有無を精度良く検出できる。  The control device CONT irradiates the detection light Lb from an oblique direction to the back surface 80B of the maintenance member 80 held by the first convex portion 46 from the projection portion 36A of the detection device 36. Since the local shape of the back surface 80B of the maintenance member 80 is different between the case where there is a foreign object on the top surface 46A of the first convex portion 46 and the case where there is no foreign material, the back surface 80B is irradiated with the detection light Lb. The light receiving state (light receiving position) at the light receiving part 36B of the detection light Lb reflected by 80B is different. Thereby, the presence or absence of foreign matter on the upper surface 46A of the first convex portion 46 can be detected. Thus, the detection device 36 is based on the surface information of the back surface 80B opposite to the front surface 80A facing the top surface 46A of the maintenance member 80 attracted and held on the top surface 46A of the first convex portion 46. It is possible to detect whether or not there is a foreign substance on the upper surface 46A of the first convex portion 46. In the present embodiment, each of the front surface 80A and the back surface 80B of the maintenance member 80 is substantially flat, so that the detection device 36 can accurately detect the presence or absence of foreign matter.
[0073] そして、検出装置 36の検出結果に基づいて、異物が有ると判断した場合、図 12B に示すように、制御装置 CONTは、第 1保持部 PH1によるメンテナンス部材 80の吸 着保持を解除した後、基板ホルダ PHを駆動し、メンテナンス部材 80を使ったメンテ ナンス作業を実行する。一方、異物が無いと判断した場合、制御装置 CONTは、メン テナンス部材 80を使ったメンテナンス作業を行わなレ、。これにより、異物が無いにも かかわらずメンテナンス作業を行ってしまうことを防止できる。  [0073] Then, when it is determined that there is a foreign object based on the detection result of the detection device 36, the control device CONT releases the adsorption holding of the maintenance member 80 by the first holding portion PH1, as shown in FIG. 12B. After that, the substrate holder PH is driven, and maintenance work using the maintenance member 80 is executed. On the other hand, if it is determined that there is no foreign object, the controller CONT will not perform maintenance work using the maintenance member 80. As a result, it is possible to prevent the maintenance work from being performed even though there is no foreign object.
[0074] また、メンテナンス部材 80を使ったメンテナンス作業を実行した後、図 12Cに示す ように、再びメンテナンス部材 80を第 1保持部 PH1で吸着保持し、検出装置 36を使 つて、異物が除去されたかどうかの確認作業を行うようにしてもよい。そして、異物の 除去が確認された場合には、メンテナンス部材 80は搬送装置 300によってアンロー ドされ、一方、異物の除去が確認されない場合には、再びメンテナンス部材 80を使つ たメンテナンス作業を行ったり、あるいは警報 (アラーム）を発して、作業者などに報知 するようにしてもよい。  [0074] After performing maintenance work using the maintenance member 80, as shown in FIG. 12C, the maintenance member 80 is again sucked and held by the first holding portion PH1, and foreign matter is removed using the detection device 36. You may make it perform the confirmation work whether it was done. When the removal of the foreign matter is confirmed, the maintenance member 80 is unloaded by the transfer device 300. On the other hand, when the removal of the foreign matter is not confirmed, maintenance work using the maintenance member 80 is performed again. Alternatively, a warning (alarm) may be issued to notify an operator or the like.
[0075] また、検出装置 36の投射部 36Aからの検出光 Lbを、メンテナンス部材 80の裏面 8 OBの広範囲に照射することにより、制御装置 CONTは、検出装置 36の検出結果に 基づいて、第 1保持部 PH1における異物の位置を求めることができる。そして、制御 装置 CONTは、求めた異物の位置に応じて、基板ステージ駆動装置 SD1を使って 基板ホルダ PHを駆動するときの駆動方向を決定することができる。 In addition, the detection light Lb from the projection unit 36 A of the detection device 36 is used as the back surface 8 of the maintenance member 80. By irradiating a wide range of OB, the control device CONT can determine the position of the foreign matter in the first holding unit PH1 based on the detection result of the detection device 36. Then, the control device CONT can determine the driving direction when driving the substrate holder PH using the substrate stage driving device SD1 according to the determined position of the foreign matter.
[0076] 例えば、第 1保持部 PH1の平面視における周縁部の第 1凸部 46 (図 4中、符号 46 E参照）に異物が有る場合には、図 13Aの模式図に示すように、基板ホルダ PHを回 転方向（ θ Z方向）に駆動することが好ましい。これにより、メンテナンス部材 80も θ Z 方向に回転する。メンテナンス部材 80が θ Z方向に回転した場合、第 1凸部 46Eに 対する移動量 (滑り量）は大きくなるので、第 1凸部 46Eの上面の異物を第 1凹部 47 まで円滑に移動することができる。また、図 13Bに示すように、基板ホルダ PHを + Θ Z方向に大きな加速度で回転した後、 _ Θ Ζ方向にゆっくりと回転して元の位置に戻 し、これを繰り返すようにしてもよレ、。これにより、メンテナンス部材 80を基板ホルダ P Hに対して一 θ Z方向に回転させることができる。また、メンテナンス部材 80を Θ 方 向に回転することによって、制限部材として機能するプレート部材 Tによる移動の制 限を大きく受けないので、第 1凸部 46に対する移動量 (滑り量)を大きくすることがで きる。 [0076] For example, when there is a foreign object on the first convex portion 46 (see reference numeral 46E in FIG. 4) at the peripheral edge in a plan view of the first holding portion PH1, as shown in the schematic diagram of FIG. 13A, It is preferable to drive the substrate holder PH in the rotation direction (θZ direction). As a result, the maintenance member 80 also rotates in the θZ direction. When the maintenance member 80 rotates in the θZ direction, the amount of movement (sliding amount) relative to the first convex portion 46E increases, so that the foreign matter on the upper surface of the first convex portion 46E can smoothly move to the first concave portion 47. Can do. As shown in FIG. 13B, after rotating the substrate holder PH in the + ΘZ direction with a large acceleration, the substrate holder PH is slowly rotated in the _ΘΖ direction to return to the original position, and this may be repeated. Les. Thereby, the maintenance member 80 can be rotated in the θZ direction with respect to the substrate holder PH. In addition, by rotating the maintenance member 80 in the Θ direction, the movement limit by the plate member T functioning as the limiting member is not greatly limited, so the movement amount (sliding amount) with respect to the first convex portion 46 is increased. I can do it.
[0077] 一方、第 1保持部 PH1の平面視における中央部の第 1凸部 46 (図 4中、符号 46M 参照）に異物が有る場合には、図 13Cの模式図に示すように、基板ホルダ PHを並進 方向（X軸方向又は Y軸方向））に駆動することが好ましい。これにより、メンテナンス 部材 80も X軸方向又は Y軸方向に移動する。メンテナンス部材 80が θ Z方向に回転 した場合、メンテナンス部材 80の回転中心に位置する第 1凸部 46Mに対する移動 量（滑り量）は小さいので、第 1凸部 46Mの上面の異物を第 1凹部 47まで円滑に移 動することが困難となる可能性がある。メンテナンス部材 80を X軸方向又は Y軸方向 に移動することにより、第 1凸部 46Mの上面の異物を第 1凹部 47まで移動することが できる。  [0077] On the other hand, when there is a foreign substance on the first convex portion 46 (see reference numeral 46M in FIG. 4) in the center in the plan view of the first holding portion PH1, as shown in the schematic diagram of FIG. It is preferable to drive the holder PH in the translation direction (X-axis direction or Y-axis direction). As a result, the maintenance member 80 also moves in the X-axis direction or the Y-axis direction. When the maintenance member 80 rotates in the θZ direction, the amount of movement (slip amount) relative to the first convex portion 46M located at the rotation center of the maintenance member 80 is small, so that the foreign matter on the upper surface of the first convex portion 46M It may be difficult to move smoothly to 47. By moving the maintenance member 80 in the X-axis direction or the Y-axis direction, the foreign matter on the upper surface of the first convex portion 46M can be moved to the first concave portion 47.
[0078] このように、検出装置 36によって第 1保持部 PH1の異物の位置を検出し、その検出 結果に応じて基板ホルダ PHを駆動する際の駆動方向を決定することにより、異物を 円滑に除去することができる。 [0079] ところで、図 14Aに示すように、メンテナンス部材 80に反りが生じている場合、メン テナンス部材 80を第 1保持部 PH1に載せたとしても、メンテナンス部材 80の表面 80 Aと第 1凸部 46の上面 46Aとを接触させることができなレ、不都合が生じる虞がある。 そこで、図 14Bに示すように、メンテナンス部材 80の表面 80Aのうち一部の領域に凸 部 80Tを設け、搬送装置 300が、メンテナンス部材 80の表面 80Aの凸部 80Tと、異 物が付着している第 1凸部 46とを接触させるように、位置あわせしつつ、メンテナンス 部材 80を第 1保持部 PH1にロードすることで、異物を除去することができる。 As described above, the position of the foreign matter in the first holding part PH1 is detected by the detection device 36, and the drive direction when driving the substrate holder PH is determined according to the detection result, thereby smoothly removing the foreign matter. Can be removed. By the way, as shown in FIG. 14A, when the maintenance member 80 is warped, even if the maintenance member 80 is placed on the first holding portion PH1, the surface 80A of the maintenance member 80 and the first protrusion If the upper surface 46A of the portion 46 cannot be brought into contact, there is a risk that inconvenience may occur. Therefore, as shown in FIG. 14B, a convex portion 80T is provided in a part of the surface 80A of the maintenance member 80, and the conveying device 300 adheres to the convex portion 80T of the surface 80A of the maintenance member 80 and foreign matter adheres. The foreign member can be removed by loading the maintenance member 80 to the first holding portion PH1 while aligning the first convex portion 46 with the first convex portion 46 in contact with each other.
[0080] また、表面 80Aの状態が異なるメンテナンス部材 80を複数用意し、複数のメンテナ ンス部材 80を選択的に第 1保持部 PH1の第 1凸部 46に接触させてもよい。具体的 には、図 15における（A)〜（C)に示すように、表面 80Aにおいて凸部 80Tが設けら れた位置が互いに異なるメンテナンス部材 80を複数用意し、第 1保持部 PH1におけ る異物の位置に応じて、それら複数のメンテナンス部材 80のうち特定のメンテナンス 部材 80を第 1凸部 46に載せるようにしてもよい。例えば、検出装置 36の検出結果に 基づいて、第 1保持部 PH1の平面視における周縁部に異物が有ると判断された場合 には、制御装置 CONTは、図 15における (A)〜（C)に示す複数のメンテナンス部材 80のうち、表面 80Aの周縁部に凸部 80Tがあるメンテナンス部材 80 (すなわち図 15 における (A)のメンテナンス部材 80)を選択し、そのメンテナンス部材 80を搬送装置 300を使って第 1保持部 PH1にロードする。これにより、第 1保持部 PH1の周縁部に ある第 1凸部 46上の異物とメンテナンス部材 80 (凸部 80T)とを接触させることができ 、異物を除去することができる。一方、検出装置 36の検出結果に基づいて、第 1保持 部 PH1の平面視における中央部近傍に異物が有ると判断された場合には、制御装 置 CONTは、図 15における（A)〜（C)に示す複数のメンテナンス部材 80のうち、表 面 80Aの中央部近傍に凸部 80Tがあるメンテナンス部材 80 (すなわち図 15におけ る（C)のメンテナンス部材 80)を選択し、そのメンテナンス部材 80を搬送装置 300を 使って第 1保持部 PH1にロードする。これにより、第 1保持部 PH1の中央部近傍にあ る第 1凸部 46上の異物とメンテナンス部材 80 (凸部 80T)とを接触させることができ、 異物を除去することができる。  [0080] Alternatively, a plurality of maintenance members 80 with different states of the surface 80A may be prepared, and the plurality of maintenance members 80 may be selectively brought into contact with the first convex portion 46 of the first holding portion PH1. Specifically, as shown in (A) to (C) of FIG. 15, a plurality of maintenance members 80 having different positions where the convex portions 80T are provided on the surface 80A are prepared, and the first holding portion PH1 is provided. Depending on the position of the foreign object, a specific maintenance member 80 among the plurality of maintenance members 80 may be placed on the first convex portion 46. For example, if it is determined based on the detection result of the detection device 36 that there is a foreign object at the peripheral edge of the first holding portion PH1 in plan view, the control device CONT performs (A) to (C) in FIG. Among the plurality of maintenance members 80 shown in FIG. 1, the maintenance member 80 having the convex portion 80T on the peripheral edge of the surface 80A (that is, the maintenance member 80 of (A) in FIG. 15) is selected, and the maintenance member 80 is transferred to the transfer device 300. Use to load the first holding part PH1. Thereby, the foreign matter on the first convex portion 46 at the peripheral edge of the first holding portion PH1 can be brought into contact with the maintenance member 80 (convex portion 80T), and the foreign matter can be removed. On the other hand, if it is determined based on the detection result of the detection device 36 that there is a foreign object in the vicinity of the central portion of the first holding portion PH1 in plan view, the control device CONT performs (A) to ( Among the plurality of maintenance members 80 shown in C), the maintenance member 80 having the convex portion 80T in the vicinity of the center of the surface 80A is selected (that is, the maintenance member 80 in FIG. 15C), and the maintenance member is selected. 80 is loaded into the first holding part PH1 using the transfer device 300. Thereby, the foreign matter on the first convex portion 46 in the vicinity of the central portion of the first holding portion PH1 can be brought into contact with the maintenance member 80 (the convex portion 80T), and the foreign matter can be removed.
[0081] このように、検出装置 36によって第 1保持部 PH1の異物の位置を検出し、その検出 結果に応じて、表面 80Aの状態が互いに異なる複数のメンテナンス部材 80のうちか ら最適なメンテナンス部材 80を選択することにより、異物を円滑に除去することができ る。 [0081] In this way, the detection device 36 detects the position of the foreign matter in the first holding part PH1, and detects the position. Depending on the result, the foreign material can be smoothly removed by selecting the optimum maintenance member 80 from among the plurality of maintenance members 80 having different surfaces 80A.
[0082] <メンテナンス方法の第 3実施形態 >  <Third Embodiment of Maintenance Method>
次に、メンテナンス方法の第 3実施形態について説明する。本実施形態において は、基板ホルダ PHを駆動する際に、メンテナンス部材 80と基板ホルダ PHとの間で 形成される第 1空間 131の圧力を調整する動作を含むメンテナンス作業の一例につ いて説明する。本実施形態においては、メンテナンス部材 80は、その表面 80Aを第 1周壁部 42の上面 42Aと対向させることができる程度の大きさ及び形状を有しており 、第 1空間 131を形成可能であるものとする。また、第 1空間 131の圧力を調整可能 な第 1圧力調整装置 40は、第 1空間 131に接続する第 1吸引口 41を介して、第 1空 間 131のガスを吸引、もしくは第 1空間 131にガスを供給することができるものとする。 そして、第 1圧力調整装置 40は、第 1空間 131のガスを吸引もしくは第 1空間 131に ガスを供給することによって、第 1空間 131を負圧もしくは陽圧にできるものとする。  Next, a third embodiment of the maintenance method will be described. In the present embodiment, an example of maintenance work including an operation of adjusting the pressure of the first space 131 formed between the maintenance member 80 and the substrate holder PH when the substrate holder PH is driven will be described. . In the present embodiment, the maintenance member 80 has such a size and shape that the surface 80A can be opposed to the upper surface 42A of the first peripheral wall portion 42, and the first space 131 can be formed. Shall. The first pressure adjusting device 40 capable of adjusting the pressure in the first space 131 sucks the gas in the first space 131 through the first suction port 41 connected to the first space 131, or the first space 131. A gas can be supplied to 131. The first pressure adjusting device 40 can make the first space 131 negative or positive by sucking the gas in the first space 131 or supplying the gas to the first space 131.
[0083] 図 16Aに示すように、制御装置 CONTは、第 1圧力調整装置 40を使って、メンテ ナンス部材 80と基板ホルダ PHとの間で形成される第 1空間 131の圧力を負圧にして 、メンテナンス部材 80の表面 80Aと第 1保持部 PH1の第 1凸部 46とを吸着し、その 状態で、基板ホルダ PHを水平方向に駆動することができる。例えば、メンテナンス部 材 80の重量が軽すぎたり、メンテナンス部材 80の表面 80Aの摩擦係数が小さい場 合、基板ホルダ PHを駆動してメンテナンス部材 80を第 1凸部 46上で滑らせたとき、 滑り過ぎたり、あるいは異物を良好に除去できない可能性がある。そのような場合に は、第 1空間 131を負圧にし、メンテナンス部材 80の表面 80Aと第 1保持部 PH1の 第 1凸部 46とを僅かに吸着した状態で、基板ホルダ PHを駆動してメンテナンス部材 80を第 1凸部 46上で滑らすことで、異物を良好に除去することができる。  As shown in FIG. 16A, the control device CONT uses the first pressure adjustment device 40 to set the pressure in the first space 131 formed between the maintenance member 80 and the substrate holder PH to a negative pressure. Thus, the surface 80A of the maintenance member 80 and the first convex portion 46 of the first holding portion PH1 are adsorbed, and in this state, the substrate holder PH can be driven in the horizontal direction. For example, when the weight of the maintenance member 80 is too light or the friction coefficient of the surface 80A of the maintenance member 80 is small, when the substrate holder PH is driven and the maintenance member 80 is slid on the first convex portion 46, There is a possibility that it is too slippery or the foreign matter cannot be removed well. In such a case, the substrate holder PH is driven while the first space 131 is set to a negative pressure and the surface 80A of the maintenance member 80 and the first convex portion 46 of the first holding portion PH1 are slightly adsorbed. By sliding the maintenance member 80 on the first convex portion 46, foreign matters can be removed well.
[0084] 逆に、メンテナンス部材 80の重量が重すぎたり、メンテナンス部材 80の表面 80Aの 摩擦係数が大きぐメンテナンス部材 80が第 1凸部 46上で滑り難い場合、図 16Bに 示すように、第 1空間 131を僅かに陽圧にすることで、基板ホルダ PHを駆動してメン テナンス部材 80を第 1凸部 46上で円滑に滑らすことができ、異物を除去することが できる。 [0084] Conversely, when the maintenance member 80 is too heavy or the maintenance member 80 having a large friction coefficient on the surface 80A of the maintenance member 80 is difficult to slide on the first convex portion 46, as shown in FIG. By making the first space 131 slightly positive, the substrate holder PH can be driven and the maintenance member 80 can be smoothly slid on the first convex portion 46, and foreign matter can be removed. it can.
[0085] なお、第 1空間 131を負圧にするとき、基板ホルダ PHを駆動しても、メンテナンス部 材 80が第 1凸部 46上で滑らなレ、程度まで吸着されてしまうことを防止するために、例 えばメンテナンス部材 80の表面 80Aのうち第 1周壁部 42の上面 42Aと対向する領 域の一部に溝 (切り欠き)などを設けておくことにより、その溝を介して第 1空間 131の 内部と外部とで気体が流通するので、メンテナンス部材 80が第 1凸部 46上で滑らな い程度まで吸着されてしまうことを防止することができる。  [0085] When the first space 131 is set to a negative pressure, even if the substrate holder PH is driven, the maintenance member 80 is prevented from being adsorbed to the extent that it does not slide on the first convex portion 46. Therefore, for example, by providing a groove (notch) or the like in a part of the surface 80A of the maintenance member 80 that faces the upper surface 42A of the first peripheral wall 42, the first through the groove. Since gas flows between the inside and the outside of the first space 131, it is possible to prevent the maintenance member 80 from being adsorbed to the extent that it does not slide on the first convex portion 46.
[0086] このように、メンテナンス部材 80の状態（表面 80Aの摩擦係数及びメンテナンス部 材 80の重量の少なくとも一方）に応じて、第 1空間 131の圧力を調整することで、第 1 凸部 46の上面 46Aとメンテナンス部材 80の裏面 80Bとの間で作用する力を調整す ること力 Sでき、第 1凸部 46の異物を円滑に除去することができる。  [0086] In this way, by adjusting the pressure of the first space 131 in accordance with the state of the maintenance member 80 (at least one of the friction coefficient of the surface 80A and the weight of the maintenance member 80), the first convex portion 46 is adjusted. The force S can be adjusted to adjust the force acting between the upper surface 46A and the rear surface 80B of the maintenance member 80, and the foreign matter on the first convex portion 46 can be removed smoothly.
[0087] また、第 1空間 131の圧力の調整と、基板ホルダ PHを駆動するときの加速度の調 整とを併用してもよい。例えばメンテナンス部材 80が第 1凸部 46上で滑り過ぎる場合 、基板ホルダ PHを駆動するときの加速度を小さくする。一方、メンテナンス部材 80が 第 1凸部 46上で滑り難い場合、基板ホルダ PHを駆動するときの加速度を大きくする 。更に、重量が互いに異なるメンテナンス部材を複数用意し、最適な滑り状態を得ら れる重量のメンテナンス部材 80を選択的に第 1保持部 PH1にロードするようにしても よい。  [0087] Further, the adjustment of the pressure in the first space 131 and the adjustment of the acceleration when the substrate holder PH is driven may be used in combination. For example, when the maintenance member 80 slides too much on the first convex portion 46, the acceleration when driving the substrate holder PH is reduced. On the other hand, when the maintenance member 80 is difficult to slide on the first convex portion 46, the acceleration when driving the substrate holder PH is increased. Further, a plurality of maintenance members having different weights may be prepared, and the maintenance member 80 having a weight that can obtain an optimal sliding state may be selectively loaded on the first holding portion PH1.
[0088] また、異物の状態に応じて、第 1空間 131の圧力や基板ホルダ PHを駆動するとき の加速度を調整したり、最適な重量のメンテナンス部材 80をロードするようにしてもよ レ、。例えば、第 1凸部 46の上面 46Aの異物の大きさが大きく移動し難い場合、基板 ホルダ PHを駆動するときの加速度を大きくしたり、第 1空間 131の圧力やメンテナン ス部材 80の重量を最適化するなどの調整を行うことができる。  [0088] Depending on the state of the foreign matter, the pressure in the first space 131 and the acceleration when driving the substrate holder PH may be adjusted, or the maintenance member 80 having an optimum weight may be loaded. . For example, if the size of the foreign matter on the upper surface 46A of the first convex portion 46 is difficult to move, the acceleration when driving the substrate holder PH is increased, the pressure in the first space 131 and the weight of the maintenance member 80 are increased. Adjustments such as optimization can be performed.
[0089] <メンテナンス方法の第 4実施形態 >  [0089] <Fourth Embodiment of Maintenance Method>
次に、第 4実施形態について説明する。本実施形態においては、粗面処理された 表面 80Aを有するメンテナンス部材 80を使ったメンテナンス作業の一例について説 明する。  Next, a fourth embodiment will be described. In the present embodiment, an example of maintenance work using the maintenance member 80 having the roughened surface 80A will be described.
[0090] 図 17Aに示すように、本実施形態に係るメンテナンス部材 80の表面 80Aは粗面処 理されている。メンテナンス部材 80は、ブラスト加工により粗面処理されている。表面 80Aが粗面処理されていることにより、第 1凸部 46上の異物を良好に保持することが できる。したがって、そのメンテナンス部材 80を第 1凸部 46に載せた状態で基板ホル ダ PHを駆動して、第 1凸部 46上で滑らせた場合、図 17Bに示すように、異物を第 1 凹部 47まで円滑に移動することができる。 [0090] As shown in FIG. 17A, the surface 80A of the maintenance member 80 according to the present embodiment is roughened. It is managed. The maintenance member 80 is roughened by blasting. By roughening the surface 80A, the foreign matter on the first convex portion 46 can be favorably retained. Therefore, when the substrate holder PH is driven and slid on the first convex portion 46 with the maintenance member 80 placed on the first convex portion 46, the foreign matter is moved to the first concave portion as shown in FIG. It can move smoothly up to 47.
[0091] また、表面 80Aの粗さ状態（粗さの番手）が互いに異なるメンテナンス部材 80を複 数用意し、これら複数のメンテナンス部材 80を、異物の状態（例えば異物の大きさ） に応じて、選択的に第 1保持部 PH1の第 1凸部 46と接触させるようにしてもよい。な お、搬送装置 300が基板 Pの表面を真空吸着により保持して搬送する構成を有する 場合、表面 80Aの粗さ状態は、搬送装置 300によってメンテナンス部材 80を吸着保 持できる範囲の粗さであるのが望ましい。すなわち、表面 80Aの粗さ状態は、搬送装 置 300による搬送時に吸着面である表面 80Aから空気もれが生じない程度を限界の 粗さとしてそれ以下の範囲で選択する。  [0091] Further, a plurality of maintenance members 80 having different roughness states (roughness counts) on the surface 80A are prepared, and the plurality of maintenance members 80 are set according to the state of foreign matter (for example, the size of the foreign matter). Alternatively, it may be selectively brought into contact with the first convex portion 46 of the first holding portion PH1. If the transfer device 300 is configured to hold and transfer the surface of the substrate P by vacuum suction, the roughness of the surface 80A is such that the maintenance member 80 can be sucked and held by the transfer device 300. It is desirable. That is, the roughness state of the surface 80A is selected within a range below the limit roughness to the extent that no air leaks from the surface 80A, which is the adsorption surface, during conveyance by the conveyance device 300.
[0092] また、表面 80Aの粗さ状態に応じて、第 1空間 131の圧力を調整したり、基板ホル ダ PHを駆動するときの加速度を調整するようにしてもよい。  Further, the pressure in the first space 131 may be adjusted or the acceleration when driving the substrate holder PH may be adjusted according to the roughness state of the surface 80A.
[0093] ところで、表面 80Aが粗面処理されたことにより、メンテナンス部材 80は、粗面処理 された表面 80Aで異物を保持することができる。したがって、異物に応じた最適な粗 さ状態の表面 80Aを有するメンテナンス部材 80を第 1保持部 PH1に載せることにより 、表面 80Aで異物を保持することができる。この場合、粗面処理された表面 80Aを第 1凸部 46に接触させ、基板ホルダ PHを駆動することなく（メンテナンス部材 80を第 1 凸部 46上で滑らせることなく）、表面 80Aで異物を保持することもできる。もちろん、 粗面処理された表面 80Aを第 1凸部 46に接触させた状態で、基板ホルダ PHを駆動 してもよレ、。このように、粗面処理された表面 80Aは、異物を保持可能な保持部とし て機能する。  By the way, since the surface 80A is roughened, the maintenance member 80 can hold the foreign matter on the roughened surface 80A. Therefore, the foreign material can be held on the surface 80A by placing the maintenance member 80 having the surface 80A having the optimum roughness according to the foreign material on the first holding portion PH1. In this case, the rough surface 80A is brought into contact with the first protrusion 46, and the substrate holder PH is not driven (the maintenance member 80 is not slid on the first protrusion 46). Can also be held. Of course, the substrate holder PH may be driven with the roughened surface 80A in contact with the first convex portion 46. In this way, the roughened surface 80A functions as a holding portion capable of holding foreign matter.
[0094] そして、粗面処理された表面 80Aを有するメンテナンス部材 80は異物を保持可能 なので、図 18Aに示すように、メンテナンス部材 80を第 1凸部 46に載せ、粗面処理さ れた表面 80Aで異物を保持することにより、図 18Bに示すように、搬送装置 300は、 異物を保持した状態のメンテナンス部材 80を、異物とともに基板ホルダ PHよりアン口 ードすることができる。 [0094] Since the maintenance member 80 having the roughened surface 80A can hold foreign matter, the maintenance member 80 is placed on the first convex portion 46 and the roughened surface as shown in FIG. 18A. By holding the foreign matter with 80A, as shown in FIG. 18B, the transfer device 300 causes the maintenance member 80 holding the foreign matter to be opened together with the foreign matter from the substrate holder PH. Can be loaded.
[0095] また、図 19に示すように、制御装置 CONTは、粗面処理された表面 80Aを有する メンテナンス部材 80を第 1凸部 46に載せ、第 1圧力調整装置 40を使って第 1空間 1 31を負圧にする。これにより、メンテナンス部材 80の表面 80Aと第 1凸部 46の上面 4 6Aとを密着させ、第 1凸部 46上の異物を、粗面処理されたメンテナンス部材 80の表 面 80Aに嚙み込ませることができる。これにより、メンテナンス部材 80は、表面 80Aに よって異物を確実に保持することができる。  Further, as shown in FIG. 19, the control device CONT places the maintenance member 80 having the roughened surface 80A on the first convex portion 46, and uses the first pressure adjusting device 40 to form the first space. 1 Set 31 to negative pressure. As a result, the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 are brought into close contact with each other, and the foreign matter on the first convex portion 46 squeezes into the surface 80A of the roughened maintenance member 80. I can do it. As a result, the maintenance member 80 can reliably hold foreign matter by the surface 80A.
[0096] また、第 1空間 131を負圧にすることによって、メンテナンス部材 80の粗面処理され た表面 80Aを第 1凸部 46の上面 46Aに吸着する動作と、吸着を解除した後、メンテ ナンス部材 80を第 1凸部 46上で滑らせる動作とを交互に行うようにしてもょレ、。  [0096] Further, by making negative pressure in the first space 131, the operation of adsorbing the roughened surface 80A of the maintenance member 80 to the upper surface 46A of the first convex portion 46, and the maintenance after releasing the adsorption. It is also possible to alternately perform the operation of sliding the nonce member 80 on the first convex portion 46.
[0097] <メンテナンス方法の第 5実施形態 >  <Fifth Embodiment of Maintenance Method>
次に、メンテナンス方法の第 5実施形態として、メンテナンス部材 80の変形例につ いて図 20〜図 22を参照して説明する。  Next, as a fifth embodiment of the maintenance method, a modified example of the maintenance member 80 will be described with reference to FIGS.
[0098] 図 20に示すように、メンテナンス部材 80は多孔体を有することができる。多孔体は 、メンテナンス部材 80の少なくとも表面 80Aを形成している。図 20に示す例では、メ ンテナンス部材 80全体が多孔体で形成されている。多孔体としては、例えば多孔質 セラミックスが挙げられる。多孔体を有することにより、メンテナンス部材 80は、表面 8 OAで異物を保持することができる。  [0098] As shown in FIG. 20, the maintenance member 80 may have a porous body. The porous body forms at least the surface 80A of the maintenance member 80. In the example shown in FIG. 20, the entire maintenance member 80 is formed of a porous body. Examples of the porous body include porous ceramics. By having the porous body, the maintenance member 80 can hold foreign matter with the surface 8 OA.
[0099] 図 21に示すように、メンテナンス部材 80は繊維物を有することができる。繊維物は 、メンテナンス部材 80の少なくとも表面 80Aを形成している。図 21に示す例では、メ ンテナンス部材 80は、例えばステンレス鋼を含む基材 80Gと、その基材 80Gの一方 の面 80Gaに脱着可能（交換可能）な繊維物とを有している。繊維物を有することによ り、メンテナンス部材 80は、表面 80Aで異物を保持することができる。  [0099] As shown in FIG. 21, the maintenance member 80 may have a fibrous material. The fibrous material forms at least the surface 80A of the maintenance member 80. In the example shown in FIG. 21, the maintenance member 80 includes, for example, a base material 80G containing stainless steel and a fiber material that can be detached from (replaceable with) one surface 80Ga of the base material 80G. By having the fiber material, the maintenance member 80 can hold foreign matter on the surface 80A.
[0100] 図 22に示すように、メンテナンス部材 80を帯電させ、静電気の力で異物を保持す るようにしてもよレ、。この場合、メンテナンス部材 80は静電気を生成可能な合成樹脂（ 例えばナイロン）やガラスによって形成されている。このように、メンテナンス部材 80の 表面 80Aは、静電気の力によって異物を保持することができる。  [0100] As shown in FIG. 22, the maintenance member 80 may be charged and foreign matter may be retained by the force of static electricity. In this case, the maintenance member 80 is formed of a synthetic resin (for example, nylon) or glass that can generate static electricity. As described above, the surface 80A of the maintenance member 80 can hold foreign matter by the force of static electricity.
[0101] <メンテナンス方法の第 6実施形態 > 次に、メンテナンス方法の第 6実施形態を図 23A及び 23Bを参照して説明する。上 述の第 1〜第 4の実施形態においては、液体 LQが供給される基板 Pを保持する基板 ホルダをメンテナンスする場合を例にして説明した力 メンテナンス部材 80を使ったメ ンテナンス作業は、通常のドライ露光装置が備えている基板ホルダについても適用 可能である。ここで、ドライ露光装置とは、投影光学系 PLと基板 Pとの間の光路空間 を含む露光光 ELの光路上に液体 LQを満たさないで露光する露光装置を指す。 [0101] <Sixth Embodiment of Maintenance Method> Next, a sixth embodiment of the maintenance method will be described with reference to FIGS. 23A and 23B. In the first to fourth embodiments described above, the maintenance work using the force maintenance member 80 described as an example in the case of maintaining the substrate holder that holds the substrate P to which the liquid LQ is supplied is usually performed. The present invention can also be applied to the substrate holder provided in the dry exposure apparatus. Here, the dry exposure apparatus refers to an exposure apparatus that performs exposure without filling the liquid LQ on the optical path of the exposure light EL including the optical path space between the projection optical system PL and the substrate P.
[0102] 図 23Aに示すように、基板ホルダ PH'は、基板 Pを保持する保持面 400を有してお り、その保持面 400にはリング状の凹部 401が同心円状に形成されている。そして、 その凹部 401の内側に、真空系に接続する吸引口が設けられている。また、基板ホ ノレダ PH'の外側には、保持面 400上でのメンテナンス部材 80の移動量を制限する 複数の制限部材 402が設けられている。図 23Aに示す例では、制限部材 402は、基 板ホルダ PH'の外側において、基板ホルダ PHを囲むように、 3つほぼ等間隔で設け られている。 [0102] As shown in Fig. 23A, the substrate holder PH 'has a holding surface 400 for holding the substrate P, and the holding surface 400 is formed with a ring-shaped recess 401 concentrically. . A suction port connected to the vacuum system is provided inside the recess 401. In addition, a plurality of limiting members 402 that limit the amount of movement of the maintenance member 80 on the holding surface 400 are provided on the outside of the substrate holder PH ′. In the example shown in FIG. 23A, three limiting members 402 are provided at substantially equal intervals so as to surround the substrate holder PH outside the substrate holder PH ′.
[0103] 基板ホルダ PH'のメンテナンス作業を行う場合には、搬送装置 300が基板ホルダ P H'の保持面 400にメンテナンス部材 80を載せる。そして、図 23Bに示すように、基板 ホルダ PH'が駆動される。これにより、保持面 400がメンテナンスされる。  [0103] When performing maintenance work on the substrate holder PH ', the transfer device 300 places the maintenance member 80 on the holding surface 400 of the substrate holder PH'. Then, as shown in FIG. 23B, the substrate holder PH ′ is driven. Thereby, the holding surface 400 is maintained.
[0104] 上述の第 1〜第 4実施形態においては、メンテナンス部材 80の移動量を制限する 制限部材として、メンテナンス部材 80を連続的に囲む内側面 Tcを有するプレート部 材 Tが用いられているが、ドライ露光装置の場合、液体 LQの液浸領域 LRを保持す るためのプレート部材 Tは無くてもよいので、図 23A及び 23Bに示すような制限部材 402であってもよレ、。なお、ドライ露光装置の基板ホルダがプレート部材 Tを備えてい てもよい。  [0104] In the first to fourth embodiments described above, the plate member T having the inner side surface Tc that continuously surrounds the maintenance member 80 is used as the limiting member that limits the movement amount of the maintenance member 80. However, in the case of a dry exposure apparatus, the plate member T for holding the immersion area LR of the liquid LQ may be omitted, and therefore the limiting member 402 as shown in FIGS. 23A and 23B may be used. Note that the substrate holder of the dry exposure apparatus may include the plate member T.
[0105] また、上述の第 1〜第 4実施形態においては、所謂ピンチャック機構を備えた基板 ホルダをメンテナンスする場合を例にして説明した力 図 23A及び 23Bに示すような 形態の基板ホルダ PH'をメンテナンスすることもできる。  [0105] In the first to fourth embodiments described above, the force described by taking as an example the maintenance of a substrate holder provided with a so-called pin chuck mechanism. The substrate holder PH as shown in Figs. 23A and 23B 'Can also be maintained.
[0106] <メンテナンス方法の第 7実施形態 >  <Seventh Embodiment of Maintenance Method>
次に、メンテナンス方法の第 7実施形態を図 24A及び 24Bを参照して説明する。図 24Aはマスク Mを保持するマスクホルダ MHの側断面図、図 24Bはマスクホルダ MH を上から見た平面図である。 Next, a seventh embodiment of the maintenance method will be described with reference to FIGS. 24A and 24B. 24A is a side sectional view of the mask holder MH that holds the mask M, and FIG. 24B is the mask holder MH. It is the top view which looked at from the top.
[0107] 図 24A及び 24Bに示すように、マスク Mを保持するマスクホルダ MHは、基材 MH Bと、基材 MHB上に形成された複数の第 3凸部 146と、基材 MHB上に形成され、 複数の第 3凸部 146を囲むように形成された二重の周壁部 142、 143と、周壁部 142 と周壁部 143との間における基材 MHB上に形成された複数の吸引口 141とを備え ている。マスクホルダ MHは、吸引口 141よりガスを吸引し、基材 MHBと、周壁部 14 2、 143と、マスク Mとで囲まれた空間を負圧にすることにより、マスク Mを第 3凸部 14 6に吸着保持する。このようなマスクホルダ MHの第 3凸部 146についても、第 3凸部 146にメンテナンス部材を載せ、マスクホルダ MHを駆動することでメンテナンスする こと力 Sできる。 [0107] As shown in Figs. 24A and 24B, the mask holder MH that holds the mask M includes a base material MH B, a plurality of third convex portions 146 formed on the base material MHB, and a base material MHB. Double peripheral wall portions 142, 143 formed to surround the plurality of third convex portions 146, and a plurality of suction ports formed on the base material MHB between the peripheral wall portion 142 and the peripheral wall portion 143 141. The mask holder MH sucks the gas from the suction port 141 and creates a negative pressure in the space surrounded by the base material MHB, the peripheral wall parts 142, 143, and the mask M. 14 Adsorb and hold on 6. The third convex portion 146 of the mask holder MH can also be maintained by placing a maintenance member on the third convex portion 146 and driving the mask holder MH.
[0108] また、プレート部材 Tを吸着保持する第 2凸部 66についても、第 2凸部 66にメンテ ナンス部材を載せ、基板ホルダ PHを駆動することでメンテナンスすることができる。  [0108] Further, the second convex portion 66 that holds the plate member T by suction can also be maintained by placing a maintenance member on the second convex portion 66 and driving the substrate holder PH.
[0109] なお、上述の第 1〜第 7実施形態においては、基板ホルダ PHは水平面に沿った方 向に駆動しているが、鉛直方向（Z軸方向）や、傾斜方向に駆動してもよい。  [0109] In the first to seventh embodiments, the substrate holder PH is driven in the direction along the horizontal plane. However, the substrate holder PH may be driven in the vertical direction (Z-axis direction) or in the inclined direction. Good.
[0110] なお、上記各実施形態の基板 Pとしては、半導体デバイス製造用の半導体ウェハ のみならず、ディスプレイデバイス用のガラス基板や、薄膜磁気ヘッド用のセラミック ウェハ、あるいは露光装置で用いられるマスクまたはレチクルの原版（合成石英、シリ コンウエノヽ）等が適用される。  [0110] The substrate P in each of the above embodiments is not limited to a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or a mask used in an exposure apparatus. Reticle masters (synthetic quartz, silicon wafers, etc.) are applied.
[0111] 露光装置 EXとしては、マスク Mと基板 Pとを同期移動してマスク Mのパターンを走 查露光するステップ 'アンド'スキャン方式の走査型露光装置 (スキャニングステツパ） の他に、マスク Mと基板 Pとを静止した状態でマスク Mのパターンを一括露光し、基 板 Pを順次ステップ移動させるステップ'アンド'リピート方式の投影露光装置 (ステツ パ）にも適用することができる。  [0111] As an exposure apparatus EX, in addition to a step-and-scan type scanning exposure apparatus (scanning stepper) that performs mask exposure by scanning the mask M and the substrate P in synchronization with each other, the mask M and substrate P are used. The present invention can also be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.
[0112] また、露光装置 EXとしては、第 1パターンと基板 Pとをほぼ静止した状態で第 1パタ ーンの縮小像を投影光学系（例えば 1/8縮小倍率で反射素子を含まない屈折型投 影光学系）を用いて基板 P上に一括露光する方式の露光装置にも適用できる。この 場合、更にその後に、第 2パターンと基板 Pとをほぼ静止した状態で第 2パターンの 縮小像をその投影光学系を用いて、第 1パターンと部分的に重ねて基板 P上に一括 露光するスティツチ方式の一括露光装置にも適用できる。また、ステイッチ方式の露 光装置としては、基板 P上で少なくとも 2つのパターンを部分的に重ねて転写し、基 板 Pを順次移動させるステップ ·アンド'ステイッチ方式の露光装置にも適用できる。 [0112] In addition, as the exposure apparatus EX, a reduced image of the first pattern is projected in a state where the first pattern and the substrate P are substantially stationary (for example, a refraction that does not include a reflective element at a 1/8 reduction magnification). It can also be applied to an exposure apparatus that performs batch exposure on the substrate P using a mold projection optical system. In this case, after that, with the second pattern and the substrate P almost stationary, a reduced image of the second pattern is collectively overlapped on the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus for exposure. In addition, the stitch type exposure apparatus can also be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.
[0113] また、本発明は、特開平 10— 163099号公報、特開平 10_ 214783号公報、特表 [0113] Further, the present invention relates to JP-A-10-163099, JP-A-10_214783, special table.
2000— 505958号公報などに開示されているツインステージ型の露光装置にも適 用できる。  The present invention can also be applied to a twin stage type exposure apparatus disclosed in 2000-505958.
[0114] 露光装置 EXの種類としては、基板 Pに半導体素子パターンを露光する半導体素 子製造用の露光装置に限られず、液晶表示素子製造用又はディスプレイ製造用の 露光装置や、薄膜磁気ヘッド、撮像素子（CCD)あるいはレチクル又はマスクなどを 製造するための露光装置などにも広く適用できる。  [0114] The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, It can be widely applied to an exposure device for manufacturing an image sensor (CCD) or a reticle or mask.
[0115] 本願実施形態の露光装置 EXは、本願特許請求の範囲に挙げられた各構成要素 を含む各種サブシステムを、所定の機械的精度、電気的精度、光学的精度を保つよ うに、組み立てることで製造される。これら各種精度を確保するために、この組み立て の前後には、各種光学系については光学的精度を達成するための調整、各種機械 系につレ、ては機械的精度を達成するための調整、各種電気系につレ、ては電気的精 度を達成するための調整が行われる。各種サブシステムから露光装置への組み立て 工程は、各種サブシステム相互の、機械的接続、電気回路の配線接続、気圧回路の 配管接続等が含まれる。この各種サブシステムから露光装置への組み立て工程の前 に、各サブシステム個々の組み立て工程があることはいうまでもない。各種サブシス テムの露光装置への組み立て工程が終了したら、総合調整が行われ、露光装置全 体としての各種精度が確保される。なお、露光装置の製造は温度およびクリーン度等 が管理されたクリーンルームで行うことが望ましレ、。  [0115] The exposure apparatus EX of the present embodiment assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted, and mechanical accuracy is adjusted. Adjustments are made to achieve electrical accuracy for various electrical systems. The assembly process from various subsystems to the exposure system includes mechanical connections, electrical circuit wiring connections, and pneumatic circuit piping connections between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustments are performed to ensure various accuracies as the entire exposure apparatus. Exposure equipment should be manufactured in a clean room with controlled temperature and cleanliness.
[0116] 半導体デバイス等のマイクロデバイスは、図 25に示すように、マイクロデバイスの機 能'性能設計を行うステップ 201、この設計ステップに基づいたマスク（レチクル）を製 作するステップ 202、デバイスの基材である基板を製造するステップ 203、前述した 実施形態の露光装置 EXによりマスクのパターンを基板に露光する処理を有するステ ップ 204、デバイス組み立てステップ（ダイシング工程、ボンディング工程、パッケージ 工程を含む） 205、検查ステップ 206等を経て製造される。  [0116] As shown in FIG. 25, a microdevice such as a semiconductor device includes a step 201 for performing a microdevice function performance design, a step 202 for manufacturing a mask (reticle) based on the design step, Step 203 for manufacturing a substrate as a base material, Step 204 having a process for exposing a mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, a device assembly step (including a dicing process, a bonding process, and a packaging process) ) Produced after 205, inspection step 206, etc.

Claims

請求の範囲  The scope of the claims
[I] 保持部を有するホルダのメンテナンス方法にぉレ、て、  [I] The maintenance method of the holder having the holding part
表面と裏面とを有した物体を該物体の前記表面が前記保持部と接触するように搬 送し、  Carrying an object having a front surface and a back surface so that the front surface of the object is in contact with the holding unit;
前記裏面を押圧しない状態で前記ホルダを駆動して前記物体を前記保持部上で 滑らせることを特徴とするメンテナンス方法。  A maintenance method, wherein the holder is driven without sliding the back surface to slide the object on the holding portion.
[2] 前記ホルダの駆動により生じた慣性力によって前記物体を滑らせることを特徴とす る請求項 1記載のメンテナンス方法。  2. The maintenance method according to claim 1, wherein the object is slid by an inertial force generated by driving the holder.
[3] 前記ホルダは、凸部を有する前記保持部と、凹部とを有し、 [3] The holder includes the holding portion having a convex portion and a concave portion,
前記物体を滑らせることにより前記凸部の異物を前記凹部に移動させることを特徴 とする請求項 1又は 2記載のメンテナンス方法。  The maintenance method according to claim 1, wherein the foreign matter on the convex portion is moved to the concave portion by sliding the object.
[4] 前記保持部の異物の位置に応じて前記ホルダを駆動する際の駆動方向を決定す ることを特徴とする請求項:!〜 3のいずれか一項記載のメンテナンス方法。 [4] The maintenance method according to any one of [1] to [3] above, wherein a driving direction for driving the holder is determined according to a position of the foreign matter in the holding portion.
[5] 制限部材を用いて前記物体の滑り量を制限することを特徴とする請求項 1〜4のい ずれか一項記載のメンテナンス方法。 [5] The maintenance method according to any one of [1] to [4], wherein the amount of slippage of the object is limited using a limiting member.
[6] 前記ホルダを駆動する際に、前記表面と前記保持部との間で形成される空間の圧 力を調整することを特徴とする請求項 1〜5のいずれか一項記載のメンテナンス方法 6. The maintenance method according to any one of claims 1 to 5, wherein when the holder is driven, a pressure of a space formed between the surface and the holding portion is adjusted.
[7] 前記空間を負圧にして前記表面と前記保持部とを吸着することを特徴とする請求 項 6記載のメンテナンス方法。 7. The maintenance method according to claim 6, wherein the space and the holding portion are adsorbed with a negative pressure in the space.
[8] 前記物体の状態に応じて前記空間の圧力を調整することを特徴とする請求項 6記 載のメンテナンス方法。 8. The maintenance method according to claim 6, wherein the pressure in the space is adjusted according to the state of the object.
[9] 前記表面は粗面処理されていることを特徴とする請求項 1〜8のいずれか一項記載 のメンテナンス方法。  [9] The maintenance method according to any one of claims 1 to 8, wherein the surface is roughened.
[10] 前記表面の状態が異なる前記物体を複数用意し、該複数の物体を選択的に前記 保持部と接触させることを特徴とする請求項 1〜9のいずれか一項記載のメンテナン ス方法。  [10] The maintenance method according to any one of [1] to [9], wherein a plurality of the objects having different surface states are prepared, and the plurality of objects are selectively brought into contact with the holding portion. .
[II] 凹部と凸部とを有するホルダのメンテナンス方法において、 前記凸部に物体を載せ、前記ホルダを駆動して前記物体を前記凸部上で移動さ せて前記凸部に付着した異物を前記凹部に移動させることを特徴とするメンテナンス 方法。 [II] In a maintenance method for a holder having a concave portion and a convex portion, A maintenance method, wherein an object is placed on the convex part, the holder is driven to move the object on the convex part, and foreign matter attached to the convex part is moved to the concave part.
[12] 制限部材を用いて前記物体の移動量を制限することを特徴とする請求項 11記載 のメンテナンス方法。  12. The maintenance method according to claim 11, wherein the moving amount of the object is limited using a limiting member.
[13] 前記凸部の異物の位置に応じて前記ホルダを駆動する際の駆動方向を決定するこ とを特徴とする請求項 11又は 12記載のメンテナンス方法。  13. The maintenance method according to claim 11 or 12, wherein a driving direction for driving the holder is determined according to a position of the foreign matter on the convex portion.
[14] 前記ホルダを駆動する際に、前記物体と前記ホルダとの間で形成される空間の圧 力を調整することを特徴とする請求項 11〜： 13のいずれか一項記載のメンテナンス方 法。 [14] The maintenance method according to any one of [11] to [13], wherein when the holder is driven, a pressure of a space formed between the object and the holder is adjusted. Law.
[15] 前記物体は粗面処理されていることを特徴とする請求項 11〜： 14のいずれか一項 記載のメンテナンス方法。  [15] The maintenance method according to any one of [11] to [14], wherein the object is roughened.
[16] 第 1基板を露光する露光装置において、 [16] In an exposure apparatus for exposing a first substrate,
前記第 1基板を保持可能な保持部を有する第 1可動部材と、  A first movable member having a holding portion capable of holding the first substrate;
表面と裏面とを有した第 2基板を該第 2基板の前記表面が前記保持部と接触するよ うに搬送する搬送装置と、  A transport device for transporting a second substrate having a front surface and a back surface so that the front surface of the second substrate is in contact with the holding unit;
前記裏面を押圧しない状態で前記第 1可動部材を駆動して前記第 2基板を前記保 持部上で滑らせる駆動装置とを備えることを特徴とする露光装置。  An exposure apparatus comprising: a driving device that drives the first movable member without sliding the back surface and slides the second substrate on the holding portion.
[17] 前記保持部上での前記第 2基板の滑り量を制限する制限部材を備えたことを特徴 とする請求項 16記載の露光装置。 17. The exposure apparatus according to claim 16, further comprising a limiting member that limits a slip amount of the second substrate on the holding unit.
[18] 第 1基板を露光する露光装置において、 [18] In an exposure apparatus for exposing a first substrate,
凹部と凸部とを有し、前記凸部に前記第 1基板を保持可能な第 1可動部材と、 前記第 1基板とは異なる第 2基板を前記凸部に搬送する搬送装置と、  A first movable member having a concave portion and a convex portion and capable of holding the first substrate on the convex portion; and a transport device for transporting a second substrate different from the first substrate to the convex portion;
前記第 1可動部材を駆動して前記第 2基板を前記凸部上で移動させて前記凸部に 付着した異物を前記凹部に移動させる駆動装置とを備えることを特徴とする露光装 置。  An exposure apparatus comprising: a driving device that drives the first movable member to move the second substrate on the convex portion and moves foreign matter adhering to the convex portion to the concave portion.
[19] 前記凸部上での前記第 2基板の移動量を制限する制限部材を備えたことを特徴と する請求項 18記載の露光装置。 19. The exposure apparatus according to claim 18, further comprising a limiting member that limits a movement amount of the second substrate on the convex portion.
[20] 前記第 1可動部材とは異なる第 2可動部材と、 [20] a second movable member different from the first movable member;
前記第 2可動部材により所定の処理を行っている間に、前記駆動装置を駆動させ る制御装置とを備えたことを特徴とする請求項 16〜： 19のいずれか一項記載の露光 装置。  The exposure apparatus according to any one of claims 16 to 19, further comprising: a control device that drives the drive device while a predetermined process is performed by the second movable member.
[21] 前記第 2可動部材に搭載され、露光に関する計測を行う計測器を備えたことを特徴 とする請求項 16〜20のいずれか一項記載の露光装置。  [21] The exposure apparatus according to any one of [16] to [20], further comprising a measuring instrument mounted on the second movable member and performing measurement related to exposure.
[22] 前記第 1可動部材が前記搬送装置の近傍に位置している際に前記駆動装置を駆 動させる制御装置を備えたことを特徴とする請求項 16〜21のいずれか一項記載の 露光装置。 [22] The control device according to any one of [16] to [21], further comprising a control device that drives the drive device when the first movable member is positioned in the vicinity of the transport device. Exposure device.
[23] 前記第 1可動部材の異物の有無を検出する検出装置を備えたことを特徴とする請 求項 16〜22のいずれか一項記載の露光装置。  [23] The exposure apparatus according to any one of [16] to [22], further comprising a detection device that detects the presence or absence of foreign matter on the first movable member.
[24] 前記第 1基板に液体を供給する液体供給装置を備えたことを特徴とする請求項 1624. A liquid supply device for supplying a liquid to the first substrate.
〜23のいずれか一項記載の露光装置。 The exposure apparatus according to any one of -23.
[25] 物体を保持する保持部のメンテナンスを行うメンテナンス部材であって、 [25] A maintenance member that performs maintenance of the holding unit that holds the object,
前記メンテナンス部材の外形は前記物体の外形よりも小さいことを特徴とするメンテ ナンス部材。  The maintenance member according to claim 1, wherein an outer shape of the maintenance member is smaller than an outer shape of the object.
[26] 前記メンテナンス部材はブラスト加工により粗面処理されていることを特徴とする請 求項 25記載のメンテナンス部材。  [26] The maintenance member according to claim 25, wherein the maintenance member is roughened by blasting.
[27] 前記メンテナンス部材は多孔体を有していることを特徴とする請求項 25又は 26記 載のメンテナンス部材。 27. The maintenance member according to claim 25 or 26, wherein the maintenance member has a porous body.
[28] 前記メンテナンス部材は異物を保持する保持部を備えていることを特徴とする請求 項 25〜27のいずれか一項記載のメンテナンス部材。  28. The maintenance member according to any one of claims 25 to 27, wherein the maintenance member includes a holding portion that holds a foreign substance.
PCT/JP2005/023796 2004-12-28 2005-12-26 Maintenance method, exposure device, and maintenance member WO2006070748A1 (en)

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