JPWO2006070748A1 - Maintenance method, exposure apparatus, maintenance member - Google Patents

Abstract

The maintenance member (80) having the front surface (80A) and the back surface (80B) is transported so that the front surface (80A) is in contact with the first holding portion, and the substrate holder (80B) is pressed without pressing the back surface (80B). PH) is driven to slide the maintenance member (80) on the first holding part.

Description

The present invention relates to a holder maintenance method, an exposure apparatus, and a maintenance member.
This application claims priority based on Japanese Patent Application No. 2004-379341 for which it applied on December 28, 2004, and uses the content here.

In a photolithography process that is one of the manufacturing processes of microdevices such as semiconductor devices and liquid crystal display devices, an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. The substrate is exposed while being held by the substrate holder. However, if there is a foreign substance on the substrate holder, the held substrate may be contaminated or the substrate may be locally deformed. Therefore, it is necessary to periodically maintain (clean) the substrate holder. The following patent document discloses an example of a technique for cleaning the holding surface of the substrate holder.
Japanese Patent No. 3441195

  The conventional technique is a configuration in which the grindstone is pressed against the holding surface using the pressing means for cleaning, but the pressing means must be provided separately, which complicates the apparatus configuration.

  This invention is made | formed in view of such a situation, Comprising: It aims at providing the maintenance method which can maintain a holder with a simple structure. It is another object of the present invention to provide an exposure apparatus including a holder that is maintained by the maintenance method. Moreover, it aims at providing the maintenance member used suitably for the maintenance method.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, in the maintenance method of the holder (PH) having the holding portion (PH1), the object (80) having the front surface (80A) and the back surface (80B) is changed to the object (80). The front surface (80A) is conveyed so as to be in contact with the holding portion (PH1), and the object (80) is slid on the holding portion (PH1) by driving the holder (PH) without pressing the back surface (80B). A maintenance method is provided.

  According to the first aspect of the present invention, the holder can be maintained with a simple configuration.

  According to the second aspect of the present invention, in the maintenance method of the holder (PH) having the concave portion (47) and the convex portion (46), the object (80) is placed on the convex portion (46), and the holder (PH) A maintenance method is provided in which the object (80) is moved on the convex portion (46) to move the foreign matter adhering to the convex portion (46) to the concave portion (47).

  According to the second aspect of the present invention, the holder can be maintained with a simple configuration.

  According to the third aspect of the present invention, in the exposure apparatus for exposing the first substrate (P), the first movable member (PH) having a holding portion (PH1) capable of holding the first substrate (P); A transfer device (300) for transferring a second substrate (80) having a front surface (80A) and a back surface (80B) so that the front surface (80A) of the second substrate (80) is in contact with the holding portion (PH1). And an exposure apparatus (EX1) including a driving device (SD1) for driving the first movable member (PH) without sliding the back surface (80B) and sliding the second substrate (80) on the holding portion (PH1). ) Is provided.

  According to the third aspect of the present invention, exposure can be performed while the first substrate is satisfactorily held by the first movable member maintained with a simple configuration.

  According to the fourth aspect of the present invention, in the exposure apparatus that exposes the first substrate (P), the exposure apparatus has the concave portion (47) and the convex portion (46), and the convex portion (46) has the first substrate (P). ), A transfer device (300) for transferring a second substrate (80) different from the first substrate (P) to the convex portion (46), and a first movable member (PH). An exposure apparatus comprising: a driving device (SD1) for driving PH and moving the second substrate (80) on the convex portion (46) to move the foreign matter adhering to the convex portion (46) to the concave portion (47). (EX) is provided.

  According to the fourth aspect of the present invention, exposure can be performed while the first substrate is satisfactorily held by the first movable member maintained with a simple configuration.

  According to the fifth aspect of the present invention, the maintenance member (80) performs maintenance of the holding portion (PH) that holds the object (P), and the outer shape of the maintenance member is smaller than the outer shape of the object (P). A maintenance member (80) is provided.

  According to the fifth aspect of the present invention, it is possible to satisfactorily maintain the holding unit using a maintenance member smaller than the outer shape of the object held by the holding unit.

  According to the present invention, the holder can be maintained with a simple configuration, and the substrate can be held on the maintained holder for exposure with high accuracy.

It is a schematic block diagram which shows one Embodiment of exposure apparatus. It is a sectional side view showing one embodiment of a substrate holder. It is a top view which shows one Embodiment of the substrate holder of the state holding the board | substrate. It is a top view which shows one Embodiment of a substrate holder. It is a top view which shows the board | substrate holder of the state from which the plate member was removed. It is a figure which shows the maintenance member which concerns on 1st Embodiment. It is a figure which shows the maintenance member which concerns on 1st Embodiment. It is a figure for demonstrating the maintenance method which concerns on 1st Embodiment. It is a figure for demonstrating the maintenance method which concerns on 1st Embodiment. It is a figure for demonstrating the maintenance method which concerns on 1st Embodiment. It is a figure for demonstrating the maintenance method which concerns on 1st Embodiment. It is a figure for demonstrating an example of operation | movement of a substrate stage and a measurement stage. It is a figure for demonstrating an example of operation | movement of a substrate stage and a measurement stage. It is a figure for demonstrating an example of operation | movement of a substrate stage and a measurement stage. It is a figure for demonstrating an example of operation | movement of a substrate stage and a measurement stage. It is a figure for demonstrating an example of operation | movement of a substrate stage and a measurement stage. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 3rd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 3rd Embodiment. It is a figure for demonstrating the maintenance method which concerns on 4th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 4th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 4th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 4th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 4th Embodiment. It is a figure which shows an example of the maintenance member which concerns on 5th Embodiment. It is a figure which shows another example of the maintenance member which concerns on 5th Embodiment. It is a figure which shows another example of the maintenance member which concerns on 5th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 6th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 6th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 7th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 7th Embodiment. It is a flowchart figure for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Liquid immersion device, 11 ... Liquid supply part, 21 ... Liquid recovery part, 36 ... Detection apparatus, 46 ... 1st convex part, 47 ... 1st recessed part, 80 ... Maintenance member, 80A ... Front surface, 80B ... Back surface, 300 ... Conveyor, CONT ... Control device, EX ... Exposure device, PH ... Substrate holder (first movable member), PH1 ... First holder, ST1 ... Substrate stage (first movable member), ST2 ... Measurement stage (second) Movable member), SD1 ... substrate stage drive device, SD2 ... measurement stage drive device, T ... plate member (restriction member)

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<Exposure device>
First, an embodiment of an exposure apparatus according to the present invention will be described with reference to FIG. FIG. 1 is a schematic block diagram showing an embodiment of the exposure apparatus EX.

  In FIG. 1, an exposure apparatus EX holds a mask holder MH that holds a mask M, a mask stage MST that can move the mask holder MH that holds the mask M, a substrate holder PH that holds the substrate P, and a substrate P. The substrate stage ST1 that can move the substrate holder PH that has been moved, the measurement stage ST2 that can be moved by mounting a measuring instrument that measures exposure, and the illumination optical system IL that illuminates the mask M on the mask stage MST with the exposure light EL A projection optical system PL that projects and exposes a pattern image of the mask M illuminated with the exposure light EL onto the substrate P on the substrate stage ST1, and a control device CONT that controls the overall operation of the exposure apparatus EX. . Each of the substrate stage ST1 and the measurement stage ST2 is movable independently of each other on the base member BP on the image plane side of the projection optical system PL. Further, the exposure apparatus EX includes a transport apparatus 300 that transports the substrate P to the substrate holder PH.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially widen the depth of focus. An immersion apparatus 1 is provided for forming an immersion region LR of the liquid LQ on the image plane side of the PL. The liquid immersion device 1 is provided in the vicinity of the image plane side of the projection optical system PL. The nozzle member 70 includes a supply port 12 for supplying the liquid LQ and a recovery port 22 for recovering the liquid LQ. The liquid supply unit 11 that supplies the liquid LQ to the image plane side of the projection optical system PL via the supply port 12 and the supply tube 13, and the projection optical system via the recovery port 22 and the recovery tube 23 provided in the nozzle member 70. And a liquid recovery unit 21 that recovers the liquid LQ on the image plane side of the PL. The nozzle member 70 is formed in an annular shape so as to surround the image plane side tip of the projection optical system PL. The liquid immersion device 1 transfers at least a part of the pattern on the mask M onto the substrate P onto the substrate P including the projection area AR of the projection optical system PL by the liquid LQ supplied from the liquid supply unit 11. Then, an immersion region LR of the liquid LQ that is larger than the projection region AR and smaller than the substrate P is locally formed. Specifically, the exposure apparatus EX includes a lower surface of the first optical element LS1 closest to the image plane of the projection optical system PL and a part of the upper surface Pa of the substrate P disposed on the image plane side of the projection optical system PL. A local liquid immersion method is used to fill the optical path space between the liquid crystal LQ and the substrate P with the exposure light EL that has passed through the mask M via the liquid LQ forming the liquid immersion region LR and the projection optical system PL. Thus, the pattern of the mask M is projected and exposed onto the substrate P.

  In the present embodiment, the exposure apparatus EX is a scanning exposure apparatus (so-called so-called exposure apparatus EX) that exposes the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in different directions (reverse directions) in the scanning direction. A case where a scanning stepper) is used will be described as an example. In the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis, and A direction perpendicular to the Y-axis direction and coincident with the optical axis AX of the projection optical system PL is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a substrate in which a photosensitive material (resist) is coated on a base material such as a semiconductor wafer, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

The illumination optical system IL includes an exposure light source, an optical integrator that uniformizes the illuminance of a light beam emitted from the exposure light source, a condenser lens that collects the exposure light EL from the optical integrator, a relay lens system, and the exposure light EL. A field stop for setting an illumination area on the mask M is provided. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. The exposure light EL emitted from the illumination optical system IL is, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp. Alternatively, vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, pure water is used as the liquid LQ. Pure water is not only ArF excimer laser light, but also, for example, far ultraviolet light (DUV light) such as emission lines (g-line, h-line, i-line) emitted from a mercury lamp and KrF excimer laser light (wavelength 248 nm). It can be transmitted.

  The mask stage MST can move the mask holder MH holding the mask M. The mask holder MH holds the mask M by vacuum suction. The mask stage MST moves the mask holder MH holding the mask M in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, XY by driving a drive device MD including a linear motor controlled by the control device CONT. It can move two-dimensionally in the plane and can rotate slightly in the θZ direction. A movable mirror 31 is provided on the mask holder MH. A laser interferometer 32 is provided at a position facing the moving mirror 31. The position of the mask M on the mask holder MH in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured by the laser interferometer 32 in real time. The measurement result of the laser interferometer 32 is output to the control device CONT. The control device CONT drives the drive device MD based on the measurement result of the laser interferometer 32 and controls the position of the mask M held by the mask holder MH.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements, which are held by a lens barrel PK. . In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Of the plurality of optical elements constituting the projection optical system PL, the first optical element LS1 closest to the image plane of the projection optical system PL is exposed from the lens barrel PK.

  The substrate stage ST1 can move a substrate holder PH that holds the substrate P on the image plane side of the projection optical system PL. The substrate stage ST1 is movably provided on the base member BP while supporting the substrate holder PH. The substrate stage ST1 is driven by the substrate stage driving device SD1. The substrate stage driving device SD1 is configured to include a linear motor, for example, and includes an XY driving device that moves the substrate stage ST1 in the X axis direction, the Y axis direction, and the θZ direction, and a voice coil motor, for example. And a Z driving device that moves the substrate stage ST1 in the Z-axis direction, the θX direction, and the θY direction. By driving the substrate stage ST1, the upper surface Pa of the substrate P held by the substrate holder PH can move in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. A movable mirror 33 is provided on the side surface of the substrate holder PH. A laser interferometer 34 is provided at a position facing the movable mirror 33. The two-dimensional position and rotation angle of the substrate P on the substrate holder PH are measured in real time by the laser interferometer 34. In addition, the exposure apparatus EX is an oblique incidence type focus leveling that detects surface position information of the upper surface Pa of the substrate P supported by the substrate holder PH as disclosed in, for example, Japanese Patent Application Laid-Open No. 8-37149. A detection system 35 is provided. The focus / leveling detection system 35 is disposed in a predetermined positional relationship with respect to the detection light La and a projection unit 35A that irradiates the detection light La on the upper surface Pa of the substrate P held by the substrate holder PH. A light receiving unit 35B that receives the reflected light of the detection light La reflected by Pa. Based on the detection result of the light receiving unit 35B, surface position information (position information in the Z-axis direction and θX) of the upper surface Pa of the substrate P And tilt information in the θY direction). The measurement result of the laser interferometer 34 is output to the control device CONT. The detection result of the focus / leveling detection system 35 is also output to the control device CONT. The control device CONT drives the substrate stage driving device SD1 based on the detection result of the focus / leveling detection system 35, and controls the focus position (Z position) and the tilt angles (θX, θY) of the substrate P to control the substrate P. Is aligned with the image plane of the projection optical system PL by the auto focus method and the auto leveling method, and based on the measurement result of the laser interferometer 34, the X axis direction, the Y axis direction, and the θZ direction of the substrate P Perform position control at.

  The measurement stage ST2 is mounted with various measuring instruments (including measurement members) that perform measurement related to exposure, and is movable on the image plane side of the projection optical system PL. As this measuring instrument, as disclosed in, for example, Japanese Patent Laid-Open No. 5-21314, a reference mark plate on which a plurality of reference marks are formed, for example, disclosed in Japanese Patent Laid-Open No. 57-117238. Non-uniformity sensor for measuring illuminance non-uniformity or measuring the variation of the transmittance of the exposure light EL of the projection optical system PL as disclosed in JP-A-2001-267239, JP-A-2002-14005 And a dose sensor (illuminance sensor) as disclosed in Japanese Patent Application Laid-Open No. 11-16816. Note that such a measurement stage ST2 is disclosed in detail, for example, in JP-A-11-135400.

  The measurement stage ST2 is an image of the projection optical system PL on the image plane side of the projection optical system PL in a state where the measurement instrument is mounted by driving the measurement stage driving device SD2 including a linear motor or the like controlled by the control device CONT. It can move two-dimensionally in an XY plane substantially parallel to the surface and can rotate in the θZ direction. Furthermore, the measurement stage ST2 can move in the Z-axis direction, the θX direction, and the θY direction. That is, the measurement stage ST2 can also move in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions, like the substrate stage ST1. A movable mirror 37 is provided on the side surface of the measurement stage ST2. A laser interferometer 38 is provided at a position facing the movable mirror 37. The position and rotation angle of the measurement stage ST2 in the two-dimensional direction are measured by the laser interferometer 38 in real time.

  An off-axis alignment system ALG for detecting an alignment mark on the substrate P and a reference mark on a reference mark plate provided on the measurement stage ST2 is provided near the tip of the projection optical system PL. In the alignment system ALG of the present embodiment, for example, as disclosed in Japanese Patent Laid-Open No. 4-65603, a target detection mark is irradiated with a broadband detection light beam that does not expose the photosensitive material on the substrate P, and the target mark is irradiated. An image of the target mark imaged on the light receiving surface by the reflected light and an image of an index (not shown) (an index pattern on an index plate provided in the alignment system ALG) are captured using an image sensor (CCD or the like). An FIA (Field Image Alignment) method is employed in which the position of the mark is measured by performing image processing on these image pickup signals.

  Further, in the vicinity of the mask stage MST, a TTR system using light of an exposure wavelength for simultaneously observing the alignment mark on the mask M and the corresponding reference mark on the reference mark plate via the projection optical system PL. A pair of mask alignment systems RAa and RAb made of an alignment system are provided at a predetermined distance in the Y-axis direction. In the mask alignment system of this embodiment, for example, as disclosed in Japanese Patent Laid-Open No. 7-176468, the mark is irradiated with light, and the mark image data captured by a CCD camera or the like is subjected to image processing and the mark is processed. A VRA (Visual Reticle Alignment) method for detecting the position is adopted.

<Board holder>
Next, the substrate holder PH will be described with reference to FIGS. 2 is a side sectional view of the substrate holder PH holding the substrate P, and FIG. 3 is a plan view of the substrate holder PH holding the substrate P as viewed from above.

  In FIG. 2, the substrate holder PH is formed on the base material PHB, the base material PHB, the first holding portion PH1 that holds the substrate P by suction, and the base material PHB, and is held by the first holding portion PH1. Around the substrate P, there is provided a second holding portion PH2 that sucks and holds a plate member T that forms an upper surface Ta substantially flush with the upper surface Pa of the substrate P. The plate member T is a member different from the base material PHB, and is provided so as to be detachable (exchangeable) with respect to the base material PHB of the substrate holder PH. As shown in FIG. 3, a substantially circular hole portion TH in which the substrate P can be placed is formed in the central portion of the plate member T. And the plate member T hold | maintained at 2nd holding | maintenance part PH2 is arrange | positioned so that the circumference | surroundings of the board | substrate P hold | maintained at 1st holding | maintenance part PH1 may be enclosed.

  The plate member T has liquid repellency with respect to the liquid LQ. The plate member T is made of a material having liquid repellency such as a fluorine resin such as polytetrafluoroethylene (Teflon (registered trademark)) or an acrylic resin. The plate member T may be formed of metal or the like, and the surface thereof may be covered with a liquid repellent material such as a fluorine-based resin.

  In FIG. 2, each of the upper surface Ta and the lower surface Tb of the plate member T is a flat surface (flat portion). Further, the plate member T has substantially the same thickness as the substrate P. The upper surface (flat surface) Ta of the plate member T held by the second holding part PH2 and the upper surface Pa of the substrate P held by the first holding part PH1 are substantially flush.

  The outer shape of the plate member T is formed in a rectangular shape in plan view, and is larger than the outer shape of the base material PHB. That is, the peripheral edge portion of the plate member T held by the second holding portion PH2 is an overhang portion H1 that protrudes outward from the side surface of the base material PHB. In the present embodiment, the movable mirror 33 is provided in a region below the overhang portion H1. Thereby, even if the liquid LQ flows out from the upper surface Ta, it is possible to prevent the liquid LQ from adhering to the movable mirror 33 by the overhang portion H1.

  As shown in FIGS. 2 and 3, the first holding portion PH <b> 1 of the substrate holder PH surrounds the plurality of first convex portions 46 formed on the base material PHB and the plurality of first convex portions 46. And an annular first peripheral wall portion 42 formed on the base material PHB. The first convex portion 46 supports the lower surface Pb of the substrate P. A first concave portion 47 is provided between the plurality of first convex portions 46. The first peripheral wall portion 42 is formed in a substantially annular shape in plan view according to the shape of the substrate P, and the upper surface 42A of the first peripheral wall portion 42 is opposed to the peripheral region (edge region) of the lower surface Pb of the substrate P. Is formed. A first space 131 surrounded by the base material PHB, the first peripheral wall portion 42, and the lower surface Pb of the substrate P is formed on the lower surface Pb side of the substrate P held by the first holding portion PH1.

  A first suction port 41 is formed on the base material PHB inside the first peripheral wall portion 42. The first suction port 41 is for holding the substrate P by suction, and is provided at each of a plurality of predetermined positions other than the first convex portion 46 on the upper surface of the base material PHB inside the first peripheral wall portion 42. Yes. Each of the first suction ports 41 is connected to a first pressure adjusting device 40 including a vacuum system via a flow path 45. The control device CONT drives the first pressure adjusting device 40 and sucks the gas (air) inside the first space 131 surrounded by the base material PHB, the first peripheral wall portion 42 and the substrate P, and this first space. By making 131 a negative pressure, the substrate P is sucked and held on the first convex portion 46. The first holding portion PH1 in the present embodiment constitutes a so-called pin chuck mechanism.

  The second holder PH2 of the substrate holder PH includes a substantially annular second peripheral wall 62 formed on the base material PHB so as to surround the first peripheral wall 42 of the first holder PH1, and a second peripheral wall 62. An annular third peripheral wall portion 63 formed on the base material PHB so as to surround the second peripheral wall portion 62 and a base material PHB between the second peripheral wall portion 62 and the third peripheral wall portion 63. And a plurality of second convex portions 66 formed thereon. The second convex portion 66 supports the lower surface Tb of the plate member T. In addition, a second concave portion 67 is provided between the plurality of second convex portions 66. The second peripheral wall portion 62 is formed in a substantially annular shape in plan view according to the shape of the hole TH of the plate member T. The third peripheral wall portion 63 is formed in a substantially rectangular shape in plan view on the inner side of the outer edge portion of the plate member T. The upper surface 62A of the second peripheral wall portion 62 is formed to face an inner edge region (inner edge region) in the vicinity of the hole TH in the lower surface Tb of the plate member T. The upper surface 63A of the third peripheral wall 63 is formed so as to face a region slightly inside the outer edge region (outer edge region) of the lower surface Tb of the plate member T. On the lower surface Tb side of the plate member T held by the second holding portion PH2, a second space 132 surrounded by the base material PHB, the second and third peripheral wall portions 62 and 63, and the lower surface Tb of the plate member T is formed. It is formed.

  A second suction port 61 is formed on the base material PHB between the second peripheral wall portion 62 and the third peripheral wall portion 63. The second suction port 61 is for adsorbing and holding the plate member T, and a plurality of portions other than the second convex portion 66 on the upper surface of the base material PHB between the second peripheral wall portion 62 and the third peripheral wall portion 63. Are provided at predetermined positions. Each of the second suction ports 61 is connected to a second pressure adjusting device 60 including a vacuum system via a flow path 65. The control device CONT drives the second pressure adjusting device 60 and sucks the gas (air) inside the second space 132 surrounded by the base material PHB, the second and third peripheral wall portions 62 and 63, and the plate member T. Then, by making the second space 132 have a negative pressure, the plate member T is sucked and held on the second convex portion 66. In the present embodiment, the second holding portion PH2 also constitutes a so-called pin chuck mechanism.

  As shown in FIGS. 2 and 3, between the side surface Pc of the substrate P held by the first holding portion PH1 and the inner side surface Tc on the hole TH side of the plate member T provided outside the substrate P. Has a gap A of about 0.1 to 1.0 mm. By setting the gap A to about 0.1 to 1.0 mm, the liquid LQ can be prevented from entering the substrate holder PH through the gap A. Further, since the upper surface Pa of the substrate P held by the first holding unit PH1 and the upper surface Ta of the plate member T held by the second holding unit PH2 are substantially flush with each other, the supply of the liquid LQ by the liquid immersion device 1 is performed. In addition, by moving the substrate holder PH in the XY direction with respect to the projection optical system PL while performing recovery, the liquid immersion region LR can be smoothly moved between the upper surface Pa of the substrate P and the upper surface Ta of the plate member T. Can do.

  The first pressure adjusting device 40 that adjusts the pressure in the first space 131 and the second pressure adjusting device 60 that adjusts the pressure in the second space 132 are independent of each other. The control device CONT can individually control the operations of the first pressure adjusting device 40 and the second pressure adjusting device 60, the suction operation with respect to the first space 131 by the first pressure adjusting device 40, and the second pressure adjusting device. The suction operation for the second space 132 by 60 can be performed independently. Further, the control device CONT can control the first pressure adjusting device 40 and the second pressure adjusting device 60, respectively, so that the pressure in the first space 131 and the pressure in the second space 132 can be made different from each other.

  The substrate P is detachable from the first holding portion PH1, and the substrate P can be removed from the first holding portion PH1 by releasing the suction operation by the first pressure adjusting device 40. Similarly, the plate member T can be attached to and detached from the second holding portion PH2, and the plate member T can be removed from the second holding portion PH2 by releasing the suction operation by the second pressure adjusting device 60. it can. FIG. 4 shows a state where the substrate P is removed from the first holding part PH1. FIG. 5 shows a state in which the substrate P and the plate member T are removed from the first and second holding portions PH1 and PH2.

<First Embodiment of Maintenance Method>
Next, an embodiment of the maintenance method will be described. In the following description, the case where the 1st holding | maintenance part PH1 holding the board | substrate P among the board | substrate holders PH is maintained is demonstrated. More specifically, a case where foreign matter on the upper surface 46A of the first convex portion 46 of the first holding portion PH1 is removed will be described. Here, the foreign matter includes, for example, a resist strip generated from the substrate P, a foreign matter floating in the air, or a dry residue of the liquid LQ.

  Maintenance of the first holding portion PH1 is performed using a maintenance member. 6A and 6B are views showing an example of the maintenance member, FIG. 6A is a side view, and FIG. 6B is a plan view. As shown in FIGS. 6A and 6B, the maintenance member 80 is a plate-like member and has a front surface 80A and a back surface 80B. The maintenance member 80 has substantially the same shape as the substrate P, and is formed in a substantially circular shape in plan view. The outer shape of the maintenance member 80 is substantially the same as the outer shape of the substrate P or smaller than the outer shape of the substrate P. The thickness of the maintenance member 80 is substantially the same as the thickness of the substrate P. In the present embodiment, each of the front surface 80A and the back surface 80B of the maintenance member 80 is substantially flat.

  The maintenance member 80 is made of, for example, ceramics or stainless steel. Alternatively, the maintenance member 80 may be formed of a fluorine resin such as Teflon (registered trademark). As will be described later, when the maintenance work is performed, the maintenance member 80 is placed on the first convex portion 46 of the first holding portion PH1, and therefore, the material for forming the maintenance member 80 is less outgas and corresponds to the first convex portion 46. Thus, it is preferable that the first convex portion 46 has a hardness equal to or lower than that. This is to prevent the first protrusion 46 from being worn. The maintenance member 80 may be formed of the same material (including silicon) as the substrate P.

  7A and 7B are views for explaining a method of maintaining the first holding portion PH1 of the substrate holder PH.

  When the maintenance work of the first holding part PH1 is performed, the substrate P is not held by the first holding part PH1. On the other hand, the plate member T is held by the second holding portion PH2. When the maintenance work of the first holding part PH1 is performed using the maintenance member 80, as shown in FIG. 7A, the maintenance member 80 is transferred to the first holding part PH1 of the substrate holder PH by the transfer device 300. Here, as described above, the transfer apparatus 300 can transfer the substrate P to the first holding portion PH1 of the substrate holder PH, and carries (loads) the substrate P into the substrate holder PH (first holding portion PH1). And the substrate P can be unloaded from the substrate holder PH (first holding portion PH1). Thus, the maintenance member 80 has a size and shape that can be transported by the transport device 300 that transports the substrate P. Even when the outer shape of the maintenance member 80 is smaller than the outer shape of the substrate P, the maintenance member 80 is large enough to be transported by the transport device 300.

  The transfer device 300 transfers the maintenance member 80 to the first holding portion PH1 of the substrate holder PH so that the surface 80A of the maintenance member 80 is in contact with the upper surface 46A of the first convex portion 46 of the first holding portion PH1. And the conveying apparatus 300 mounts the maintenance member 80 on the 1st convex part 46 of 1st holding | maintenance part PH1 so that the surface 80A of the maintenance member 80 and the upper surface 46A of the 1st convex part 46 may contact. FIG. 7B shows a state where the maintenance member 80 is placed on the first convex portion 46 of the first holding portion PH1.

  With the maintenance member 80 placed on the first convex portion 46, the control device CONT drives the substrate stage ST1 using the substrate stage driving device SD1, and drives the substrate holder PH supported on the substrate stage ST1. At this time, the driving of the first pressure adjusting device 40 is stopped. That is, the first space 131 formed between the maintenance member 80 and the substrate holder PH is almost atmospheric pressure. The substrate stage driving device SD1 places the maintenance member 80 on the first convex portion 46 of the first holding portion PH1, and drives the substrate holder PH (substrate stage ST1) without pressing the back surface 80B of the maintenance member 80. Thus, the maintenance member 80 can be slid on the first convex portion 46 by the inertial force generated by driving the substrate holder PH. Specifically, as shown in FIG. 8A, the substrate stage driving device SD1 has the maintenance member 80 placed on the first convex portion 46, and is in a horizontal plane (in the XY plane, the upper surface 46A of the first convex portion 46. The substrate holder PH is driven at a predetermined acceleration in a predetermined direction (within a plane substantially parallel to the plane), and then suddenly stopped, whereby the maintenance member 80 is slid horizontally with respect to the upper surface 46A of the first protrusion 46. Can be made.

  By moving the maintenance member 80 by sliding on the upper surface 46A of the first convex portion 46, the foreign matter on the upper surface 46A of the first convex portion 46 as the maintenance member 80 moves, as shown in the schematic diagram of FIG. 8B. Can be moved to a first recess 47 provided at a position adjacent to the first protrusion 46. In other words, the foreign matter attached to the upper surface 46 </ b> A of the first convex portion 46 can be wiped off to the first concave portion 47 by sliding the maintenance member 80 on the first convex portion 46. As described above, the foreign matter on the upper surface 46A of the first convex portion 46 functioning as a holding surface for holding the substrate P can be removed.

  When the maintenance member 80 slides on the first convex portion 46, the maintenance member 80 slides well on the first convex portion 46 according to at least one of the friction coefficient of the maintenance member 80 and the weight of the maintenance member 80. The acceleration when driving the substrate holder PH is set. Further, the substrate stage driving device SD1 may reciprocate (vibrate) the substrate holder PH in a predetermined direction in a horizontal plane. By doing so, since the substrate holder PH repeats acceleration and stop, the maintenance member 80 can be satisfactorily slid on the first convex portion 46 by the inertial force generated by driving the substrate holder PH.

  Further, the surface 80A of the maintenance member 80 is in contact with the upper surface 46A of the first convex portion 46, and functions as a maintenance surface for maintaining the upper surface 46A. Therefore, specifically, it is possible to satisfactorily slide on the upper surface 46A of the first convex portion 46 so that maintenance work can be performed satisfactorily, and no foreign matter is generated from the upper surface 46A or the surface 80A even if the upper surface 46A slides. In addition, the state of the surface 80A, such as the coefficient of friction and hardness, is optimized.

  In addition, the relative distance that the maintenance member 80 moves with respect to the upper surface 46A of the first convex portion 46 is preferably larger than the size of the upper surface 46A. Thereby, the foreign matter on the first convex portion 46 can be smoothly moved to the first concave portion 47.

  In the present embodiment, the plate member T held by the second holding portion PH2 is disposed outside the maintenance member 80 placed on the first convex portion 46 of the first holding portion PH1, and the maintenance member Reference numeral 80 denotes a configuration that slides inside the hole portion TH (inner surface Tc) of the plate member T. That is, the sliding amount (movement amount) of the maintenance member 80 is limited by the inner surface Tc of the plate member T. Therefore, for example, the occurrence of problems such as the maintenance member 80 dropping from the substrate holder PH due to excessive sliding is prevented. As described above, since the plate member T is arranged as the limiting member for limiting the slippage (movement amount) of the maintenance member 80 on the first convex portion 46, the above-described problem occurs. Is prevented.

  Further, the maintenance member 80 can be disposed inside the hole TH of the plate member T by making the outer shape of the maintenance member 80 substantially the same as or smaller than the outer shape of the substrate P. In particular, the maintenance member 80 can be smoothly slid inside the hole TH of the plate member T by making the outer shape of the maintenance member 80 smaller than the outer shape of the substrate P. That is, when the outer shape of the maintenance member 80 and the outer shape of the substrate P are substantially the same, when the maintenance member 80 is disposed inside the hole TH of the plate member T, the space between the maintenance member 80 and the plate member T is reduced. Only a gap corresponding to the above-described gap A is secured. In this case, since the sliding amount (movement amount) when the maintenance member 80 is slid on the first convex portion 46 is a slight distance corresponding to the gap A, the foreign matter on the upper surface 46A of the first convex portion 46 is the first. It may be difficult to smoothly move to the recess 47. Therefore, maintenance is performed by setting the outer shape of the maintenance member 80 to such an extent that a gap corresponding to the target slip amount (movement amount) of the maintenance member 80 on the first convex portion 46 can be secured with the plate member T. The member 80 can be smoothly slid inside the hole portion TH of the plate member T.

  After the foreign matter removal work (maintenance work) of the first convex portion 46 is completed, the control device CONT uses the transport device 300 to carry out the maintenance member 80 from the substrate holder PH. Since the surface 80A of the maintenance member 80 that has undergone the maintenance work may have foreign matter attached or contaminated, it is preferable to perform a predetermined cleaning process on the maintenance member 80 carried out from the substrate holder PH. . Also, the contaminated maintenance member 80 may be replaced with a new one.

  As described above, the first protrusion of the first holding portion PH1 has a simple configuration in which the maintenance member 80 is placed on the first protrusion 46 and the substrate holder PH is driven to slide on the first protrusion 46. Foreign matter on the portion 46 can be removed. Therefore, in a state where the substrate P is held on the first convex portion 46 of the first holding portion PH1 from which the foreign matter has been removed, and contamination of the substrate P and local deformation (deterioration of flatness) of the substrate P are suppressed, The substrate P can be exposed with high accuracy.

  Further, since the maintenance member 80 is transported to the substrate holder PH by the transport device 300 that transports the substrate P, the maintenance work is performed using the existing apparatus configuration without providing a complicated mechanism for performing the maintenance work. be able to. Further, since the maintenance of the substrate holder PH can be performed without removing the substrate holder PH provided with the movable mirror 33 from the substrate stage ST1, when the substrate holder PH is taken out of the exposure apparatus EX, the movable mirror is moved due to a temperature change. Since there is no thermal change or temperature change in the space around the substrate stage ST1, the maintenance time can be greatly reduced.

  Next, the relationship between the operations of the substrate stage ST1 and the measurement stage ST2 and the maintenance work will be described.

  FIG. 9 is a view of the substrate stage ST1 (substrate holder PH) and the measurement stage ST2 as viewed from above. When performing immersion exposure of the substrate P, the control device CONT separates the substrate stage ST1 (substrate holder PH) from the measurement stage ST2 as shown in FIG. 9, and the substrate P on the projection optical system PL and the substrate holder PH. Facing each other. After completing the immersion exposure on the substrate P in the substrate stage ST1, the control device CONT moves at least one of the substrate stage ST1 and the measurement stage ST2 using the driving devices SD1 and SD2, and as shown in FIG. 10A, The upper surface F of the measurement stage ST2 is brought into contact (or close proximity) with the upper surface Ta of the plate member T of the holder PH. Here, the upper surface F of the measurement stage ST2 is a flat surface like the upper surface Ta of the plate member T, and the control device CONT uses the driving devices SD1 and SD2 to measure the upper surface Ta of the plate member T of the substrate holder PH. When the upper surface F of the stage ST2 is brought into contact (or close proximity), the upper surface Ta and the upper surface F can be substantially flush with each other.

  Next, the control device CONT uses the driving devices SD1 and SD2 to measure the substrate stage ST1 while maintaining the relative positional relationship between the substrate stage ST1 (substrate holder PH) and the measurement stage ST2 in the Y-axis direction. The stage ST2 is moved together in the -Y direction. The control device CONT moves the substrate stage ST1 and the measurement stage ST2 together to move the liquid immersion area LR of the liquid LQ held between the first optical element LS1 of the projection optical system PL and the substrate P. The substrate holder PH can be moved from the upper surface Ta of the plate member T to the upper surface F of the measurement stage ST2. As the liquid immersion region LR of the liquid LQ moves from the upper surface Ta of the plate member T to the upper surface F of the measurement stage ST2, as shown in FIG. 10B, the upper surface Ta of the plate member T and the upper surface F2 of the measurement stage ST2 It is arranged at the same time so as to straddle. When the substrate stage ST1 and the measurement stage ST2 further move together in the −Y direction by a predetermined distance from the state of FIG. 10B, as shown in FIG. 11A, the first optical element LS1 and the measurement stage ST2 of the projection optical system PL In this state, the liquid LQ is held, and the liquid immersion area LR of the liquid LQ is disposed on the upper surface F of the measurement stage ST2.

  Next, the control device CONT moves the substrate stage ST1 to a predetermined substrate replacement position RP using the substrate stage driving device SD1. In parallel with this, the control device CONT executes a predetermined measurement process using the measurement stage ST2 as necessary. An example of this measurement is the baseline measurement of the alignment system ALG. Specifically, in the control apparatus CONT, the above-described mask alignment system RAa, a pair of first reference marks on the reference mark plate FM provided on the measurement stage ST2 and the corresponding mask alignment marks on the mask M are represented. Detection is performed simultaneously using RAb, and the positional relationship between the first reference mark and the corresponding mask alignment mark is detected. At the same time, the control device CONT detects the second reference mark on the reference mark plate FM by the alignment system ALG, thereby detecting the positional relationship between the detection reference position of the alignment system ALG and the second reference mark. Then, the control device CONT includes a positional relationship between the first reference mark and the corresponding mask alignment mark, a positional relationship between the detection reference position of the alignment system ALG and the second reference mark, a known first reference mark, Based on the positional relationship with the second reference mark, the distance (the positional relationship) between the projection center of the mask pattern by the projection optical system PL and the detection reference position of the alignment system ALG, that is, the baseline information of the alignment system ALG is obtained. . FIG. 11B shows the state at this time. Further, the measurement operation is not limited to the baseline measurement, and includes illuminance measurement, illuminance unevenness measurement, aerial image measurement, and the like using the measurement stage ST2, and the control device CONT performs, for example, projection based on the measurement result. You may make it reflect in the exposure of the board | substrate P performed after that, such as performing the calibration process of the optical system PL.

  After moving the substrate stage ST1 (substrate holder PH) to the substrate exchange position RP, the control device CONT unloads the exposed substrate P on the substrate holder PH using the transport device 300 at the substrate exchange position RP. At the same time, the above-described maintenance member 80 is loaded onto the first holding portion PH1 of the substrate holder PH using the transfer device 300. At this substrate exchange position RP, the control device CONT drives the substrate stage driving device SD1 to drive the substrate holder PH. That is, the control device CONT drives the substrate stage driving device SD1 when the substrate stage ST1 (substrate holder PH) is positioned in the vicinity of the transfer device 300, and drives the substrate holder PH on which the maintenance member 80 is placed. . At this time, the control device CONT performs a predetermined process by the measurement stage ST2. That is, in the present embodiment, the control device CONT performs the predetermined processing by the measurement stage ST2 in the vicinity of the projection optical system PL, and the substrate stage driving device SD1 at the substrate replacement position RP in the vicinity of the transfer device 300. To perform maintenance work using the maintenance member 80.

  After performing the maintenance work using the maintenance member 80 at the substrate replacement position RP, the control device CONT uses the transfer device 300 to carry out the maintenance member 80 from the substrate holder PH, and to the carried out maintenance member 80. If necessary, perform a cleaning process. And the control apparatus CONT loads the board | substrate P which should be exposed using the conveyance apparatus 300 with respect to the substrate holder PH maintained.

  Then, after the loading of the substrate P to the substrate holder PH is completed and the measurement process by the measurement stage ST2 is completed, the control device CONT, for example, includes the upper surface F of the measurement stage ST2 and the upper surface Ta of the plate member T of the substrate holder PH. Are moved in the XY plane while the relative positional relationship is maintained, and alignment processing is performed on the substrate P after replacement. Specifically, the control device CONT detects the alignment marks on the replaced substrate P by the alignment system ALG and determines the position coordinates (array coordinates) of each of the plurality of shot areas provided on the substrate P. .

  Thereafter, contrary to the previous case, the control device CONT maintains the relative positional relationship between the substrate holder PH (substrate stage ST1) and the measurement stage ST2 in the Y-axis direction, and moves both stages ST1 and ST2 in the + Y direction. After moving together and moving the substrate stage ST1 (substrate P) below the projection optical system PL, the measurement stage ST2 is retracted to a predetermined position. Thereby, the immersion region LR is disposed on the upper surface Ta of the plate member T of the substrate holder PH.

  Thereafter, the control device CONT performs an exposure operation on the substrate P, and sequentially transfers the pattern of the mask M to each of a plurality of shot regions on the substrate P. The alignment of each shot area on the substrate P with respect to the mask M is performed by adjusting the position coordinates of the plurality of shot areas on the substrate P obtained as a result of the detection of the alignment mark on the substrate P and the base measured immediately before. Based on the line information.

<Second Embodiment of Maintenance Method>
Next, a second embodiment of the maintenance method will be described. In the present embodiment, an example of maintenance work including an operation using a detection device capable of detecting the presence or absence of a foreign object on the first convex portion 46 will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 12A is a diagram illustrating a detection device 36 that can detect the presence or absence of foreign matter on the first convex portion 46. In FIG. 12A, the detection device 36 has a projection unit 36 </ b> A that irradiates the back surface 80 </ b> B of the maintenance member 80 held by the first holding unit PH <b> 1 of the substrate holder PH with the detection light Lb from an oblique direction, and a predetermined value for the detection light Lb. And a light receiving unit 36B that can receive the reflected light of the detection light Lb reflected by the back surface 80B of the maintenance member 80. The detection device 36 is provided in the vicinity of the substrate replacement position RP as described with reference to FIG. 11B. The detection process using the detection device 36 and the maintenance work using the maintenance member 80 at the substrate exchange position RP and at least a part of the measurement process by the measurement stage ST2 are performed in parallel. When detecting the presence / absence of a foreign object using the detection device 36, first, the transport device 300 is maintained at the substrate replacement position RP so that the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 face each other. 80 is placed on the first convex portion 46. Then, the control device CONT uses the first pressure adjusting device 40 to make the pressure in the first space 131 formed between the maintenance member 80 and the substrate holder PH negative, and the maintenance member on the first convex portion 46. 80 is held by suction. Here, since the maintenance member 80 has such a size that the surface 80A and the upper surface 42A of the first peripheral wall portion 42 can face each other, the first space 131 can be set to a negative pressure.

  The control device CONT irradiates the detection light Lb from an oblique direction to the back surface 80B of the maintenance member 80 held by the first convex portion 46 from the projection portion 36A of the detection device 36. Since the local shape of the back surface 80B of the maintenance member 80 differs depending on whether or not there is a foreign object on the top surface 46A of the first convex portion 46, the back surface 80B is reflected by the back surface 80B when the detection light Lb is irradiated. The light receiving state (light receiving position) of the detected light Lb at the light receiving unit 36B is different. Thereby, the presence or absence of foreign matter on the upper surface 46A of the first convex portion 46 can be detected. As described above, the detection device 36 is based on the surface information of the back surface 80B opposite to the surface 80A facing the top surface 46A among the maintenance members 80 attracted and held on the top surface 46A of the first convex portion 46. It is possible to detect whether or not there is a foreign substance on the upper surface 46A of the first convex portion 46. In the present embodiment, since each of the front surface 80A and the back surface 80B of the maintenance member 80 is a substantially flat surface, the detection device 36 can accurately detect the presence or absence of foreign matter.

  Then, when it is determined that there is a foreign substance based on the detection result of the detection device 36, as shown in FIG. 12B, the control device CONT cancels the suction holding of the maintenance member 80 by the first holding portion PH1, and then the substrate The holder PH is driven, and maintenance work using the maintenance member 80 is executed. On the other hand, when determining that there is no foreign object, the control device CONT does not perform the maintenance work using the maintenance member 80. Thereby, it is possible to prevent the maintenance work from being performed even though there is no foreign matter.

  In addition, after performing the maintenance work using the maintenance member 80, as shown in FIG. 12C, the maintenance member 80 is again sucked and held by the first holding portion PH1 and whether or not the foreign matter has been removed using the detection device 36. The confirmation work may be performed. When the removal of the foreign matter is confirmed, the maintenance member 80 is unloaded by the transfer device 300. On the other hand, when the removal of the foreign matter is not confirmed, maintenance work using the maintenance member 80 is performed again, Or you may make it alert | report to an operator etc. by issuing a warning (alarm).

  In addition, the control device CONT irradiates the detection light Lb from the projection unit 36A of the detection device 36 over a wide area of the back surface 80B of the maintenance member 80, so that the control device CONT is based on the detection result of the detection device 36. The position of the foreign matter in can be obtained. And the control apparatus CONT can determine the drive direction when driving the substrate holder PH using the substrate stage drive apparatus SD1 according to the calculated position of the foreign matter.

  For example, when there is a foreign object on the first convex portion 46 (see 46E in FIG. 4) at the peripheral edge in a plan view of the first holding portion PH1, as shown in the schematic diagram of FIG. It is preferable to drive in the rotation direction (θZ direction). As a result, the maintenance member 80 also rotates in the θZ direction. When the maintenance member 80 rotates in the θZ direction, the amount of movement (slip amount) with respect to the first convex portion 46E increases, so that the foreign matter on the upper surface of the first convex portion 46E can be smoothly moved to the first concave portion 47. . Alternatively, as shown in FIG. 13B, after rotating the substrate holder PH in the + θZ direction with a large acceleration, the substrate holder PH may be slowly rotated in the −θZ direction to return to the original position, and this may be repeated. Accordingly, the maintenance member 80 can be rotated in the −θZ direction with respect to the substrate holder PH. Further, by rotating the maintenance member 80 in the θZ direction, the movement of the first convex portion 46 (sliding amount) can be increased because the movement of the plate member T functioning as a limiting member is not greatly limited. .

  On the other hand, when there is a foreign object on the first convex portion 46 (see reference numeral 46M in FIG. 4) in the center in the plan view of the first holding portion PH1, as shown in the schematic diagram of FIG. It is preferable to drive in the translation direction (X-axis direction or Y-axis direction). Thereby, the maintenance member 80 also moves in the X-axis direction or the Y-axis direction. When the maintenance member 80 rotates in the θZ direction, the movement amount (slip amount) with respect to the first convex portion 46M located at the rotation center of the maintenance member 80 is small, and therefore foreign matter on the upper surface of the first convex portion 46M is removed from the first concave portion 47. It may be difficult to move smoothly. By moving the maintenance member 80 in the X-axis direction or the Y-axis direction, the foreign matter on the upper surface of the first convex portion 46M can be moved to the first concave portion 47.

  In this way, the foreign substance can be smoothly removed by detecting the position of the foreign substance in the first holding part PH1 by the detection device 36 and determining the driving direction when driving the substrate holder PH according to the detection result. Can do.

  Incidentally, as shown in FIG. 14A, when the maintenance member 80 is warped, even if the maintenance member 80 is placed on the first holding portion PH1, the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 are provided. There is a possibility that inconvenience that cannot be brought into contact with each other may occur. Therefore, as shown in FIG. 14B, a convex portion 80T is provided in a part of the surface 80A of the maintenance member 80, and the conveying device 300 adheres to the convex portion 80T on the surface 80A of the maintenance member 80 and foreign matter adheres. The foreign material can be removed by loading the maintenance member 80 onto the first holding portion PH1 while aligning the first convex portion 46 with the first convex portion 46 in contact with each other.

  Alternatively, a plurality of maintenance members 80 having different states of the surface 80A may be prepared, and the plurality of maintenance members 80 may be selectively brought into contact with the first convex portion 46 of the first holding portion PH1. Specifically, as shown in FIGS. 15A to 15C, a plurality of maintenance members 80 having different positions where the convex portions 80T are provided on the surface 80A are prepared, and foreign substances in the first holding portion PH1 are removed. Depending on the position, a specific maintenance member 80 among the plurality of maintenance members 80 may be placed on the first convex portion 46. For example, when it is determined based on the detection result of the detection device 36 that there is a foreign object in the peripheral edge portion of the first holding portion PH1 in plan view, the control device CONT performs (A) to (C) in FIG. Among the plurality of maintenance members 80 shown in FIG. 5A, the maintenance member 80 having the convex portion 80T on the peripheral edge of the surface 80A (that is, the maintenance member 80 in FIG. 15A) is selected, and the maintenance member 80 is transferred to the transfer device 300. To load the first holding unit PH1. Thereby, the foreign material on the 1st convex part 46 in the peripheral part of 1st holding | maintenance part PH1 and the maintenance member 80 (convex part 80T) can be made to contact, and a foreign material can be removed. On the other hand, if it is determined based on the detection result of the detection device 36 that there is a foreign object in the vicinity of the center portion of the first holding portion PH1 in plan view, the control device CONT displays (A) to (C) in FIG. ), A maintenance member 80 having a convex portion 80T in the vicinity of the center of the surface 80A (that is, the maintenance member 80 in FIG. 15C) is selected, and the maintenance member 80 is transferred to the transport device. 300 is loaded into the first holding unit PH1. Thereby, the foreign material on the 1st convex part 46 in the center part vicinity of 1st holding | maintenance part PH1 and the maintenance member 80 (convex part 80T) can be made to contact, and a foreign material can be removed.

  In this way, the position of the foreign matter in the first holding portion PH1 is detected by the detection device 36, and the optimum maintenance member 80 is selected from among the plurality of maintenance members 80 whose surfaces 80A are different from each other according to the detection result. By doing so, foreign matters can be removed smoothly.

<Third Embodiment of Maintenance Method>
Next, a third embodiment of the maintenance method will be described. In the present embodiment, an example of maintenance work including an operation of adjusting the pressure of the first space 131 formed between the maintenance member 80 and the substrate holder PH when the substrate holder PH is driven will be described. In the present embodiment, the maintenance member 80 has such a size and shape that the surface 80 </ b> A can be opposed to the upper surface 42 </ b> A of the first peripheral wall portion 42, and the first space 131 can be formed. Shall. The first pressure adjusting device 40 that can adjust the pressure in the first space 131 sucks the gas in the first space 131 through the first suction port 41 connected to the first space 131, or the first space 131. It is assumed that gas can be supplied. The first pressure adjusting device 40 can make the first space 131 negative or positive by sucking the gas in the first space 131 or supplying the gas to the first space 131.

  As shown in FIG. 16A, the control device CONT uses the first pressure adjusting device 40 to make the pressure in the first space 131 formed between the maintenance member 80 and the substrate holder PH negative, thereby maintaining the maintenance member. The surface 80A of 80 and the first convex portion 46 of the first holding portion PH1 are adsorbed, and in this state, the substrate holder PH can be driven in the horizontal direction. For example, when the weight of the maintenance member 80 is too light or the friction coefficient of the surface 80A of the maintenance member 80 is small, when the substrate holder PH is driven and the maintenance member 80 is slid on the first convex portion 46, it is too slippery. Or foreign matter may not be removed well. In such a case, the substrate holder PH is driven in a state in which the first space 131 is set to a negative pressure and the surface 80A of the maintenance member 80 and the first convex portion 46 of the first holding portion PH1 are slightly adsorbed. By sliding the maintenance member 80 on the first convex portion 46, the foreign matter can be removed satisfactorily.

  On the other hand, when the maintenance member 80 is too heavy, or the friction coefficient of the surface 80A of the maintenance member 80 is large and the maintenance member 80 is difficult to slide on the first convex portion 46, as shown in FIG. By slightly setting 131 to a positive pressure, the substrate holder PH can be driven and the maintenance member 80 can be smoothly slid on the first convex portion 46, and foreign matters can be removed.

  In order to prevent the maintenance member 80 from being attracted to the extent that it does not slide on the first convex portion 46 even when the substrate holder PH is driven when the first space 131 is set to a negative pressure, for example, maintenance is performed. By providing a groove (notch) or the like in a part of the surface 80A of the member 80 that faces the upper surface 42A of the first peripheral wall portion 42, the inside and the outside of the first space 131 are connected via the groove. Therefore, it is possible to prevent the maintenance member 80 from being adsorbed to such an extent that the maintenance member 80 does not slip on the first convex portion 46.

  Thus, by adjusting the pressure of the first space 131 according to the state of the maintenance member 80 (at least one of the friction coefficient of the surface 80A and the weight of the maintenance member 80), the upper surface 46A of the first convex portion 46 and The force acting between the back surface 80B of the maintenance member 80 can be adjusted, and the foreign matter on the first convex portion 46 can be removed smoothly.

  Moreover, you may use together adjustment of the pressure of the 1st space 131, and adjustment of the acceleration when driving the substrate holder PH. For example, when the maintenance member 80 slips too much on the first convex portion 46, the acceleration when driving the substrate holder PH is reduced. On the other hand, when the maintenance member 80 is difficult to slide on the first convex portion 46, the acceleration when driving the substrate holder PH is increased. Furthermore, a plurality of maintenance members having different weights may be prepared, and the maintenance member 80 having a weight that can obtain an optimal sliding state may be selectively loaded on the first holding portion PH1.

  Further, the pressure in the first space 131 and the acceleration when driving the substrate holder PH may be adjusted according to the state of the foreign matter, or the maintenance member 80 having an optimum weight may be loaded. For example, when the size of the foreign matter on the upper surface 46A of the first convex portion 46 is difficult to move, the acceleration when driving the substrate holder PH is increased, the pressure in the first space 131 and the weight of the maintenance member 80 are optimized. Adjustments can be made.

<Fourth Embodiment of Maintenance Method>
Next, a fourth embodiment will be described. In the present embodiment, an example of maintenance work using the maintenance member 80 having the roughened surface 80A will be described.

  As shown in FIG. 17A, the surface 80A of the maintenance member 80 according to the present embodiment is roughened. The maintenance member 80 is roughened by blasting. Since the surface 80A is roughened, the foreign matter on the first convex portion 46 can be favorably retained. Accordingly, when the substrate holder PH is driven and slid on the first convex portion 46 with the maintenance member 80 placed on the first convex portion 46, foreign matter is removed from the first concave portion 47 as shown in FIG. 17B. Can move smoothly.

  Also, a plurality of maintenance members 80 having different roughness states (roughness counts) on the surface 80A are prepared, and the plurality of maintenance members 80 are selectively selected according to the state of foreign matter (for example, the size of the foreign matter). You may make it contact with the 1st convex part 46 of 1st holding | maintenance part PH1. In addition, when the conveyance apparatus 300 has the structure which hold | maintains and conveys the surface of the board | substrate P by vacuum suction, the roughness state of the surface 80A is the roughness of the range which can carry out the adsorption | suction holding of the maintenance member 80 by the conveyance apparatus 300. Is desirable. That is, the roughness state of the surface 80A is selected within a range of less than the limit roughness to the extent that no air leaks from the surface 80A that is the suction surface during conveyance by the conveyance device 300.

  Further, the pressure in the first space 131 may be adjusted or the acceleration when driving the substrate holder PH may be adjusted according to the roughness state of the surface 80A.

  By the way, since the surface 80A is roughened, the maintenance member 80 can hold the foreign matter on the roughened surface 80A. Therefore, the foreign material can be held on the surface 80A by placing the maintenance member 80 having the surface 80A having the optimum roughness according to the foreign material on the first holding portion PH1. In this case, the roughened surface 80A is brought into contact with the first convex portion 46, and the substrate holder PH is not driven (the maintenance member 80 is not slid on the first convex portion 46). Can also be held. Of course, the substrate holder PH may be driven in a state in which the roughened surface 80A is in contact with the first convex portion 46. As described above, the roughened surface 80A functions as a holding unit capable of holding foreign matter.

  Since the maintenance member 80 having the roughened surface 80A can hold foreign matter, the maintenance member 80 is placed on the first convex portion 46 as shown in FIG. 18A, and the foreign matter is removed from the roughened surface 80A. By holding, as shown in FIG. 18B, the transfer apparatus 300 can unload the maintenance member 80 in a state of holding the foreign matter from the substrate holder PH together with the foreign matter.

  Further, as shown in FIG. 19, the control device CONT places the maintenance member 80 having the roughened surface 80 </ b> A on the first convex portion 46, and uses the first pressure adjustment device 40 to depress the first space 131. Pressure. Thereby, the surface 80A of the maintenance member 80 and the upper surface 46A of the first convex portion 46 are brought into close contact with each other, and the foreign matter on the first convex portion 46 is allowed to bite into the surface 80A of the roughened maintenance member 80. it can. Thereby, the maintenance member 80 can hold | maintain a foreign material reliably by the surface 80A.

  Further, by making negative pressure in the first space 131, the operation of adsorbing the roughened surface 80A of the maintenance member 80 to the upper surface 46A of the first convex portion 46, and releasing the adsorption, the maintenance member 80 is You may make it perform alternately the operation | movement to slide on the 1st convex part 46. FIG.

<Fifth Embodiment of Maintenance Method>
Next, as a fifth embodiment of the maintenance method, a modified example of the maintenance member 80 will be described with reference to FIGS.

  As shown in FIG. 20, the maintenance member 80 can have a porous body. The porous body forms at least the surface 80A of the maintenance member 80. In the example shown in FIG. 20, the entire maintenance member 80 is formed of a porous body. Examples of the porous body include porous ceramics. By having the porous body, the maintenance member 80 can hold foreign matter on the surface 80A.

  As shown in FIG. 21, the maintenance member 80 can have a fiber material. The fibrous material forms at least the surface 80A of the maintenance member 80. In the example illustrated in FIG. 21, the maintenance member 80 includes, for example, a base material 80G including stainless steel, and a fiber that can be detached from (replaceable with) one surface 80Ga of the base material 80G. By having the fiber material, the maintenance member 80 can hold foreign matter on the surface 80A.

  As shown in FIG. 22, the maintenance member 80 may be charged and foreign matter may be held by electrostatic force. In this case, the maintenance member 80 is formed of a synthetic resin (for example, nylon) or glass that can generate static electricity. As described above, the surface 80A of the maintenance member 80 can hold foreign matter by the force of static electricity.

<Sixth Embodiment of Maintenance Method>
Next, a sixth embodiment of the maintenance method will be described with reference to FIGS. 23A and 23B. In the first to fourth embodiments described above, the case of maintaining the substrate holder that holds the substrate P to which the liquid LQ is supplied has been described as an example. However, the maintenance work using the maintenance member 80 is a normal operation. The present invention can also be applied to a substrate holder provided in a dry exposure apparatus. Here, the dry exposure apparatus refers to an exposure apparatus that performs exposure without filling the liquid LQ on the optical path of the exposure light EL including the optical path space between the projection optical system PL and the substrate P.

  As shown in FIG. 23A, the substrate holder PH ′ has a holding surface 400 that holds the substrate P, and a ring-shaped recess 401 is formed concentrically on the holding surface 400. A suction port connected to a vacuum system is provided inside the recess 401. In addition, a plurality of limiting members 402 that limit the amount of movement of the maintenance member 80 on the holding surface 400 are provided outside the substrate holder PH ′. In the example shown in FIG. 23A, three limiting members 402 are provided at substantially equal intervals so as to surround the substrate holder PH outside the substrate holder PH '.

  When performing the maintenance work of the substrate holder PH ′, the transfer device 300 places the maintenance member 80 on the holding surface 400 of the substrate holder PH ′. Then, as shown in FIG. 23B, the substrate holder PH 'is driven. Thereby, the holding surface 400 is maintained.

  In the first to fourth embodiments described above, the plate member T having the inner side surface Tc that continuously surrounds the maintenance member 80 is used as the limiting member that limits the movement amount of the maintenance member 80. However, dry exposure is used. In the case of the apparatus, the plate member T for holding the liquid immersion region LR of the liquid LQ may not be provided, and thus the limiting member 402 as illustrated in FIGS. 23A and 23B may be used. The substrate holder of the dry exposure apparatus may include the plate member T.

  In the first to fourth embodiments described above, the case where a substrate holder having a so-called pin chuck mechanism is maintained has been described as an example. However, the substrate holder PH ′ having a configuration as shown in FIGS. 23A and 23B is used. Maintenance is also possible.

<Seventh Embodiment of Maintenance Method>
Next, a seventh embodiment of the maintenance method will be described with reference to FIGS. 24A and 24B. 24A is a side sectional view of the mask holder MH that holds the mask M, and FIG. 24B is a plan view of the mask holder MH viewed from above.

  As shown in FIGS. 24A and 24B, the mask holder MH that holds the mask M is formed on the base MHB, the plurality of third protrusions 146 formed on the base MHB, and on the base MHB. Double peripheral wall portions 142 and 143 formed so as to surround the third convex portion 146, and a plurality of suction ports 141 formed on the base material MHB between the peripheral wall portion 142 and the peripheral wall portion 143. ing. The mask holder MH sucks the gas from the suction port 141 and creates a negative pressure in the space surrounded by the base material MHB, the peripheral wall portions 142 and 143, and the mask M, thereby making the mask M the third convex portion 146. Adsorb and hold. The third convex portion 146 of the mask holder MH can also be maintained by placing a maintenance member on the third convex portion 146 and driving the mask holder MH.

  The second convex portion 66 that holds the plate member T by suction can also be maintained by placing a maintenance member on the second convex portion 66 and driving the substrate holder PH.

  In the first to seventh embodiments described above, the substrate holder PH is driven in a direction along a horizontal plane, but may be driven in a vertical direction (Z-axis direction) or an inclined direction.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention can also be applied to a twin stage type exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 10-163099, Japanese Patent Application Laid-Open No. 10-214783, and Japanese Translation of PCT International Publication No. 2000-505958.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  The exposure apparatus EX according to the embodiment of the present application is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 25, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, step 204 having processing of exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured through.

Claims (28)

In the maintenance method of the holder having the holding part,
Conveying an object having a front surface and a back surface so that the front surface of the object is in contact with the holding unit;
A maintenance method, wherein the holder is driven to slide the object on the holding portion without pressing the back surface.   The maintenance method according to claim 1, wherein the object is slid by an inertial force generated by driving the holder. The holder has the holding part having a convex part and a concave part,
The maintenance method according to claim 1, wherein the foreign matter on the convex portion is moved to the concave portion by sliding the object.   The maintenance method according to any one of claims 1 to 3, wherein a driving direction for driving the holder is determined according to a position of a foreign substance in the holding portion.   The maintenance method according to claim 1, wherein the amount of slippage of the object is limited using a limiting member.   The maintenance method according to any one of claims 1 to 5, wherein when the holder is driven, a pressure in a space formed between the surface and the holding portion is adjusted.   The maintenance method according to claim 6, wherein the space and the holding portion are adsorbed with a negative pressure in the space.   The maintenance method according to claim 6, wherein the pressure in the space is adjusted according to the state of the object.   The maintenance method according to claim 1, wherein the surface is roughened.   The maintenance method according to claim 1, wherein a plurality of the objects having different surface states are prepared, and the plurality of objects are selectively brought into contact with the holding unit. In the maintenance method of the holder having a concave portion and a convex portion,
A maintenance method, wherein an object is placed on the convex part, the holder is driven to move the object on the convex part, and foreign matter attached to the convex part is moved to the concave part.   The maintenance method according to claim 11, wherein the moving amount of the object is limited using a limiting member.   The maintenance method according to claim 11 or 12, wherein a driving direction for driving the holder is determined according to a position of a foreign matter on the convex portion.   The maintenance method according to any one of claims 11 to 13, wherein when the holder is driven, a pressure in a space formed between the object and the holder is adjusted.   The maintenance method according to claim 11, wherein the object is roughened. In an exposure apparatus that exposes a first substrate,
A first movable member having a holding portion capable of holding the first substrate;
A transport device for transporting a second substrate having a front surface and a back surface so that the front surface of the second substrate is in contact with the holding unit;
An exposure apparatus comprising: a driving device that drives the first movable member without sliding the back surface and slides the second substrate on the holding unit.   The exposure apparatus according to claim 16, further comprising a limiting member that limits a slip amount of the second substrate on the holding unit. In an exposure apparatus that exposes a first substrate,
A first movable member having a concave portion and a convex portion, and capable of holding the first substrate on the convex portion;
A transfer device for transferring a second substrate different from the first substrate to the convex portion;
An exposure apparatus comprising: a driving device that drives the first movable member to move the second substrate on the convex portion and moves foreign matter attached to the convex portion to the concave portion.   19. The exposure apparatus according to claim 18, further comprising a limiting member that limits a movement amount of the second substrate on the convex portion. A second movable member different from the first movable member;
The exposure apparatus according to any one of claims 16 to 19, further comprising a control device that drives the drive device while performing a predetermined process by the second movable member.   The exposure apparatus according to any one of claims 16 to 20, further comprising a measuring instrument mounted on the second movable member and performing measurement related to exposure.   The exposure apparatus according to any one of claims 16 to 21, further comprising a control device that drives the drive device when the first movable member is positioned in the vicinity of the transport device.   The exposure apparatus according to any one of claims 16 to 22, further comprising a detection device that detects the presence or absence of foreign matter on the first movable member.   24. The exposure apparatus according to claim 16, further comprising a liquid supply apparatus that supplies a liquid to the first substrate. A maintenance member that performs maintenance of a holding unit that holds an object,
The maintenance member according to claim 1, wherein an outer shape of the maintenance member is smaller than an outer shape of the object.   26. The maintenance member according to claim 25, wherein the maintenance member is roughened by blasting.   The maintenance member according to claim 25 or 26, wherein the maintenance member has a porous body.   The maintenance member according to any one of claims 25 to 27, wherein the maintenance member includes a holding portion that holds foreign matter.

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