JP2016122777A - Holder, object support device and exposure, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To receive a wafer from a conveyance device in a less space.SOLUTION: A wafer support part 74b of a wafer support unit 125 is rotated around one axis and thereby a wafer W conveyed to below a chuck unit 153 by a conveyance loader 149 is supported from below. Thereafter, the underside of the wafer W is sucked and held via a suction part 78. After the wafer W is held together with the chuck unit 153, the wafer W is placed on a wafer stage. Therefore, the rotation of the wafer support part 74b around the one axis makes it possible to receive the wafer W in a small space.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a holding apparatus, an object support apparatus, an exposure apparatus, and a device manufacturing method, and in particular, a holding apparatus that holds a plate-like object, an object support apparatus that includes a plurality of the holding apparatuses, and an exposure that includes the object support apparatus. The present invention relates to an apparatus and a device manufacturing method using the exposure apparatus.

  Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as semiconductor elements (integrated circuits, etc.), liquid crystal display elements, etc., step-and-repeat projection exposure apparatuses (so-called steppers), step-and- A scanning projection exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  Substrates such as wafers or glass plates used in this type of exposure apparatus are gradually becoming larger (for example, every 10 years in the case of wafers). Currently, 300 mm wafers with a diameter of 300 mm are the mainstream, but now the era of 450 mm wafers with a diameter of 450 mm is approaching.

  As a wafer transfer method, a transfer apparatus including a Bernoulli chuck or the like is known. (For example, refer to Patent Document 1).

  However, for example, when a wafer is held in a non-contact manner using a Bernoulli chuck as disclosed in Patent Document 1, the positional deviation may exceed a desired range during loading. Accordingly, there has been an urgent need to develop a holding device that reduces misalignment in a conveying member including a Bernoulli chuck and the like.

US Patent Application Publication No. 2007/0290517

  According to the first aspect of the present invention, there is provided a holding device that holds a plate-like object from below, and is provided with a bearing member, a shaft portion that extends in one axial direction, and the suction portion. A predetermined angle range including a first position where a part of the holding part including the suction part comes into contact with the object from below and a second position where the holding part is separated from the object. A holding unit supported by the bearing member via the shaft portion, and connected to the shaft portion of the holding unit so as to be rotatable between the first position and the second position. There is provided a holding device comprising: a driving device that rotationally drives the holding unit around the one axis.

  According to a second aspect of the present invention, there is provided an object support device for supporting a plate-like object from below, wherein the object support device is provided corresponding to a different position of the outer periphery of the object. Provided is an object support device including a plurality of holding devices, wherein the object is contact-supported from below by the plurality of holding devices when both of the holding units of the plurality of holding devices are in the first position.

  According to a third aspect of the present invention, there is provided an exposure apparatus for exposing a plate-shaped object with an energy beam, the object support apparatus according to the second aspect for supporting the object from below, and along a predetermined plane. A movable body provided with an object placement surface on which the object is placed, and the object before exposure is placed on the object placement surface prior to being placed on the object placement surface. An exposure apparatus supported by the object support apparatus is provided.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing an object using the exposure apparatus according to the third aspect and developing the exposed object. .

It is a figure which shows schematically the structure of the exposure apparatus which concerns on 1st Embodiment. FIG. 2 is a plan view showing the wafer stage of FIG. It is a figure which shows arrangement | positioning of the interferometer system with which the exposure apparatus of FIG. 1 is equipped, an alignment detection system, etc. 4A is a perspective view schematically showing a configuration of a carry-in unit provided in the exposure apparatus of FIG. 1, and FIG. 4B is a diagram showing a chuck unit that constitutes a part of the carry-in unit provided on the wafer stage. It is a figure shown with a center support member. FIG. 5A is a perspective view showing the configuration of the wafer support unit, and FIG. 5B is a perspective view showing the configuration of the holding unit provided in the wafer support unit. 6A and 6B are diagrams for explaining the configuration of the wafer support unit and for explaining the operation of the wafer support unit (part 1 and part 2). It is a figure for demonstrating the structure of a wafer support unit, Comprising: It is a figure which shows a part of wafer support unit in cross section. FIG. 2 is a block diagram showing an input / output relationship of a main controller that mainly constitutes a control system of the exposure apparatus according to the first embodiment. FIGS. 9A and 9B are views (No. 1 and No. 2) for explaining the wafer loading procedure. FIGS. 10A and 10B are views (No. 3 and No. 4) for explaining the wafer loading procedure. FIGS. 11A and 11B are views (No. 5 and No. 6) for explaining the wafer loading procedure. 12A and 12B are views (No. 3 and No. 4) for explaining the operation of the wafer support unit. It is a perspective view which shows roughly the structure of the wafer support unit which concerns on 2nd Embodiment. FIGS. 14A to 14C are views (No. 1, No. 2 and No. 3) for explaining the function and operation of the cleaner unit included in the wafer support unit according to the second embodiment. FIGS. 15A to 15C schematically show the configuration of a wafer support unit according to a modification of the second embodiment, and a method of fixing the wafer support portion of the wafer support unit by the cleaner unit. It is the figure for explaining (the 1-the 3). FIGS. 16A and 16B are diagrams for explaining the schematic configuration of the wafer support unit according to the third embodiment and for explaining the operation of the wafer support unit of the third embodiment (part 1). 1 and 2). It is FIG. (3) for demonstrating operation | movement of the wafer support unit which concerns on 3rd Embodiment. It is a perspective view which shows the structure of the wafer support unit with which the exposure apparatus which concerns on 4th Embodiment is provided. FIGS. 19A and 19B are diagrams for explaining the configuration of the wafer support unit shown in FIG. 18 and for explaining the operation of the wafer support unit (part 1 and part 2). is there. FIG. 19 is a cross-sectional view of a part of the wafer support unit shown in FIG. 18. It is a block diagram which shows the input / output relationship of the main controller which mainly comprises the control system of the exposure apparatus which concerns on 4th Embodiment.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 12B.

  FIG. 1 schematically shows a configuration of an exposure apparatus 100 according to the first embodiment. The exposure apparatus 100 is a step-and-scan projection exposure apparatus, a so-called scanner. As will be described later, in the present embodiment, a projection optical system PL is provided, and in the following, the direction parallel to the optical axis AX of the projection optical system PL is the Z-axis direction, and the reticle is in a plane perpendicular to the Z-axis direction. The direction in which the wafer and the wafer are relatively scanned is the Y-axis direction, the direction orthogonal to the Z-axis and the Y-axis is the X-axis direction, and the rotation (tilt) directions around the X-axis, Y-axis, and Z-axis are θx and θy, respectively. , And θz direction will be described.

  As shown in FIG. 1, the exposure apparatus 100 includes an exposure unit 200 disposed above the vicinity of the + Y side end of the base board 12, and a carry-in unit disposed at a predetermined distance from the exposure unit 200 to the −Y side. A transfer system 120 including 121 (see FIG. 8), a wafer stage WST that moves two-dimensionally independently within the XY plane on the base board 12, and a control system for these. The transport system 120 includes a carry-in unit 121 and a carry-out unit 122 (see FIG. 8).

  The base board 12 is supported almost horizontally (parallel to the XY plane) on the floor F by a plurality of vibration isolation devices (not shown). The base board 12 is made of a member having a flat outer shape. In FIG. 1, wafer W is held on wafer stage WST (more specifically, a wafer table WTB described later).

  The exposure unit 200 includes an illumination system 10, a reticle stage RST, a projection unit PU, and the like.

  The illumination system 10 includes a light source, an illuminance uniformizing optical system including an optical integrator, a reticle blind, and the like (both not shown) as disclosed in, for example, US Patent Application Publication No. 2003/0025890. And an illumination optical system. The illumination system 10 illuminates a slit-shaped illumination area IAR on the reticle R set (limited) with a reticle blind (also called a masking system) with illumination light (exposure light) IL with substantially uniform illuminance. Here, as an example of the illumination light IL, ArF excimer laser light (wavelength 193 nm) is used.

  On reticle stage RST, reticle R having a circuit pattern or the like formed on its pattern surface (lower surface in FIG. 1) is fixed, for example, by vacuum suction. The reticle stage RST can be finely driven in the XY plane by a reticle stage drive system 11 (not shown in FIG. 1, refer to FIG. 8) including a linear motor, for example, and in the scanning direction (left and right direction in FIG. 1). In the Y-axis direction) at a predetermined scanning speed.

  Position information of the reticle stage RST in the XY plane (including rotation information in the θz direction) is transferred by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 13 to a movable mirror 15 (actually fixed to the reticle stage RST). Is provided with a Y moving mirror (or a retroreflector) having a reflecting surface orthogonal to the Y-axis direction and an X moving mirror having a reflecting surface orthogonal to the X-axis direction), for example. It is always detected with a resolution of about 25 nm. The measurement value of reticle interferometer 13 is sent to main controller 20 (not shown in FIG. 1, refer to FIG. 8).

  Projection unit PU is arranged below reticle stage RST in FIG. The projection unit PU is supported by a main frame BD disposed horizontally above the base board 12 via a flange portion FLG provided on the outer peripheral portion thereof. As shown in FIGS. 1 and 3, the main frame BD is composed of a plate member having a hexagonal shape (a shape obtained by cutting off two corners of a rectangle) in which the dimension in the Y-axis direction is larger than the dimension in the X-axis direction. The plurality of support members (not shown) supported by the floor F are supported by vibration isolation devices, respectively.

  The projection unit PU includes a lens barrel 40 and a projection optical system PL held in the lens barrel 40. As the projection optical system PL, for example, a refractive optical system including a plurality of optical elements (lens elements) arranged along an optical axis AX parallel to the Z axis is used. The projection optical system PL is, for example, both-side telecentric and has a predetermined projection magnification (for example, 1/4 times, 1/5 times, or 1/8 times). For this reason, when the illumination area IAR on the reticle R is illuminated by the illumination light IL from the illumination system 10, the reticle R in which the first surface (object surface) of the projection optical system PL and the pattern surface are substantially coincided with each other is arranged. With the illumination light IL that has passed through the projection optical system PL (projection unit PU), a reduced image of the circuit pattern of the reticle R in the illumination area IAR (a reduced image of a part of the circuit pattern) is projected through the projection optical system PL (projection unit PU). Is formed in a region (hereinafter also referred to as an exposure region) IA that is conjugated to the illumination region IAR on the wafer W, which is disposed on the second surface (image surface) side of the wafer W, the surface of which is coated with a resist (sensitive agent). . Then, the reticle R is moved in the scanning direction (Y-axis) with respect to the illumination area IAR (illumination light IL) by synchronous driving of the reticle stage RST and the wafer stage WST (more precisely, a fine movement stage WFS which holds the wafer W, which will be described later). And moving the wafer W relative to the exposure area IA (illumination light IL) in the scanning direction (Y-axis direction) to scan one shot area (partition area) on the wafer W. Exposure is performed, and the pattern of the reticle R is transferred to the shot area. That is, in the present embodiment, the pattern of the reticle R is generated on the wafer W by the illumination system 10 and the projection optical system PL, and the sensitive layer (resist layer) on the wafer W is exposed on the wafer W by the illumination light IL. A pattern is formed.

  As can be seen from FIG. 1, wafer stage WST includes coarse movement stage WCS and fine movement stage WFS supported in a non-contact state with coarse movement stage WCS and relatively movable with respect to coarse movement stage WCS. .

  The coarse movement stage WCS is an electromagnetic force (Lorentz force) driving type planar motor (see US Pat. No. 5,196,745) or a coarse movement stage drive system 51A (see FIG. 8) composed of a linear motor or the like. It is driven with a predetermined stroke in the X-axis and Y-axis directions and finely driven in the θz direction.

  Although not shown in FIG. 1, the fine movement stage WFS is inserted into a hole (not shown) formed in a wafer table WTB (and a wafer holder (not shown in FIG. 1, refer to FIG. 2)), which will be described later. A plurality of (for example, three) vertical movement pins 140 (see FIG. 4B) that can move are provided. A suction port (not shown) for vacuum suction is formed on the upper surface of each of the three vertical movement pins 140. Further, the lower end surfaces of the three vertical movement pins 140 are fixed to the upper surface of the base member 141. The three vertical movement pins 140 are arranged at the positions of the apexes of a regular triangle in plan view of the upper surface of the base member 141, respectively. The suction port formed in each of the three vertical movement pins 140 is connected to a vacuum pump (not shown) via a pipe line formed in the vertical movement pins 140 (and the base member 141) and a vacuum pipe (not shown). It is communicated. The pedestal member 141 is connected to the driving device 142 via a shaft 143 fixed to the center portion of the lower surface. That is, the three vertical movement pins 140 are driven in the vertical direction by the driving device 142 integrally with the base member 141. In the present embodiment, a wafer center support member (hereinafter abbreviated as a center support member) capable of supporting a part of the central region of the lower surface of the wafer from below by the base member 141, the three vertical movement pins 140, and the shaft 143. ) 150 is configured. Here, the displacement in the Z-axis direction from the reference position of the three vertical movement pins 140 (center support member 150) is, for example, a displacement sensor 145 (not shown in FIG. 4) such as an encoder system provided in the drive device 142. (See FIG. 8). Main controller 20 drives three vertical movement pins 140 (center support member 150) in the vertical direction via drive device 142 based on the measurement value of displacement sensor 145.

  Fine movement stage WFS is driven in directions of six degrees of freedom (X axis, Y axis, Z axis, θx, θy, and θz directions) with respect to coarse movement stage WCS by fine movement stage drive system 52A (see FIG. 8). Is done. Fine movement stage drive system 52A includes, for example, a magnet unit (not shown) and a coil unit (not shown), as in US 2010/0073652 and US 2010/0073653. The fine movement stage WFS is supported in a non-contact state with respect to the coarse movement stage WCS, and is driven in a direction of six degrees of freedom without contact.

  Fine movement stage WFS includes a main body 81 and a wafer table WTB fixed to the upper surface of main body 81. At the center of the upper surface of wafer table WTB, wafer W is fixed by vacuum suction or the like via wafer holder WH (not shown in FIG. 1, see FIG. 2) having a vacuum chuck (or electrostatic chuck) or the like. Although the wafer holder WH may be formed integrally with the wafer table WTB, in this embodiment, the wafer holder WH and the wafer table WTB are separately configured, and the wafer holder WH is fixed on the wafer table WTB by, for example, vacuum suction. . Further, as shown in FIG. 2, a measurement plate (also referred to as a reference mark plate) 30 is provided on the upper surface of wafer table WTB in the vicinity of the + Y side end. The measurement plate 30 is provided with a first reference mark FM at a center position coincident with the center line CL of the wafer table WTB, and a pair of reticle alignment second reference marks RM so as to sandwich the first reference mark FM. Is provided.

  In this embodiment, fine movement stage WFS has main body 81 and wafer table WTB. For example, even if main body 81 is not provided, wafer table WTB is driven by fine movement stage drive system 52A. good. Fine movement stage WFS only needs to have a mounting area for wafer W on a part of its upper surface, and can be referred to as a holding part, a table, or a movable part of wafer stage WST.

  On the wafer table WTB, a plurality of (for example, three) reflecting mirrors 86 are provided close to the wafer holder WH. The three reflecting mirrors 86 are arranged close to the outside of the wafer holder WH. One of the three reflecting mirrors 86 is positioned on the center line CL on the −Y side of the wafer holder WH (the position in the 6 o'clock direction with respect to the center of the wafer W in a plan view, that is, the notch of the wafer W faces. The remaining two are arranged at positions symmetrical with respect to the center line CL in the 2 o'clock and 10 o'clock directions with respect to the center of the wafer W in plan view. In FIG. 2, the outer diameter of the wafer holder WH is shown larger than the diameter of the wafer W for convenience of explanation, but in reality, the outer diameter of the wafer holder WH is the same as or slightly smaller than the diameter of the wafer W. .

  The -Y end surface and -X end surface of wafer table WTB are mirror-finished to form reflecting surface 17a and reflecting surface 17b shown in FIG. As described above, in the present embodiment, fine movement stage WFS includes wafer table WTB. Therefore, in the following description, fine movement stage WFS including wafer table WTB is also referred to as wafer table WTB.

  Position information of wafer table WTB (wafer stage WST) is measured by interferometer system 70 (see FIG. 8) including Y interferometer 16 shown in FIG.

  The interferometer system 70 includes a plurality of interferometers that measure position information of the wafer table WTB (wafer stage WST), specifically, the Y interferometer 16 and the three X interferometers 136 and 137 shown in FIG. 138 etc. are included. In the present embodiment, as each of the interferometers, a multi-axis interferometer having a plurality of length measuring axes is used except for some of the interferometers.

1 and 3, the Y interferometer 16 is parallel to the Y axis passing through the projection center of the projection optical system PL (the optical axis AX, which also coincides with the center of the exposure area IA in the present embodiment). The measurement beams B4 ₁ and B4 ₂ are irradiated onto the reflecting surface 17a of the wafer table WTB along the optical path in the Y-axis direction that is the same distance from the straight line (hereinafter referred to as the reference axis) LV to the −X side and + X side. Each reflected light is received. The Y interferometer 16 is spaced from the measurement beams B4 ₁ and B4 _{2 in the} −Z direction, and directs the measurement beam B3 toward the reflecting surface 17a along the optical path in the Y-axis direction passing on the reference axis LV. The length measuring beam B3 irradiated and reflected by the reflecting surface 17a is received.

The X interferometer 136 is a measurement beam B5 along the optical path in the X-axis direction that is separated from the straight line (reference axis) LH in the X-axis direction passing through the optical axis of the projection optical system PL by the same distance + Y side and −Y side. _1, B5 _2, and the reflected measurement beams B5 ₁ or B5 3 present X-axis direction of the measurement beam to wafer table WTB including measurement beam along the ₂ to the optical path of spaced X-axis direction in the -Z direction The surface 17b is irradiated and each reflected light is received.

  The X interferometer 137 receives a length measurement beam B6 and a length measurement beam passing through the optical path on the −Z side of the measurement beam B6 along a straight line LA parallel to the X axis passing through the detection center of an alignment detection system ALG described later. Irradiates the reflecting surface 17b of the table WTB and receives each reflected light.

  The X interferometer 138 irradiates the measuring surface Bb on the reflecting surface 17b of the wafer table WTB along the straight line LUL parallel to the X axis passing through the loading position LP where the wafer is loaded, and receives the reflected light.

  The measurement values (position information measurement results) of each interferometer of the interferometer system 70 are supplied to the main controller 20 (see FIG. 8). Main controller 20 obtains position information regarding the Y-axis direction, θx direction, and θz direction of wafer table WTB based on the measurement value of Y interferometer 16. Further, main controller 20 obtains position information regarding the X-axis direction of wafer table WTB based on the measurement value of any of X interferometers 136, 137, and 138. Main controller 20 obtains position information regarding the θy direction of wafer table WTB based on the measurement value of X interferometer 136. Main controller 20 may obtain position information regarding the θz direction of wafer table WTB based on the measurement value of X interferometer 136.

  In addition, the interferometer system 70 includes a pair of upper and lower movable mirrors (not shown) fixed on the side surface on the −Y side of the coarse movement stage WCS by measuring a pair of measurement beams parallel to the Y axis that are separated in the Z axis direction. Irradiates a pair of fixed mirrors (not shown) through the respective reflecting surfaces, and receives the return light from the pair of fixed mirrors through the reflecting surfaces, the same distance from the reference axis LV -X side, + X side A pair of Z interferometers arranged apart from each other may be provided. Based on the measurement values of the pair of Z interferometers, main controller 20 can obtain position information of wafer stage WST in at least three degrees of freedom including the directions of the Z axis, θy, and θz.

  Note that a detailed configuration of the interferometer system 70 and an example of the details of the measurement method are disclosed in detail in, for example, US Patent Application Publication No. 2008/0106722.

  In this embodiment, the interferometer system is used to measure the position information of wafer table WTB (wafer stage WST), but other means may be used. For example, it is possible to use an encoder system as described in US 2010/0297562.

  In the exposure apparatus 100, as shown in FIG. 1, an alignment detection system ALG for detecting the first reference mark FM and the alignment mark on the wafer W is provided on the side surface of the lower end of the barrel 40 of the projection unit PU. ing. For example, the alignment detection system ALG irradiates the target mark with a broadband detection light beam that does not sensitize the resist on the wafer, and the target mark image formed on the light receiving surface by the reflected light from the target mark is not shown. An image processing system FIA (Field Image Alignment) that captures an image of an index (an index pattern on an index plate provided in each alignment system) using an imaging device (CCD or the like) and outputs the imaged signals. A system is used. The imaging signal from the alignment detection system ALG is supplied to the main controller 20 (see FIG. 8).

  In place of the alignment detection system ALG, for example, an alignment apparatus including five alignment systems disclosed in US Patent Application Publication No. 2009/0233234 may be provided.

  In addition, in the exposure apparatus 100, a multipoint focal position having an irradiation system 54a that irradiates the surface of the wafer W with a plurality of measurement beams and a light receiving system 54b that receives the respective reflected beams in the vicinity of the projection optical system PL. A detection system (hereinafter referred to as a multi-point AF system) 54 (see FIG. 8) is provided. The detailed configuration of the multipoint AF system 54 is disclosed in, for example, US Pat. No. 5,448,332.

  Although not shown in FIG. 1, above the reticle R, projection optics of a pair of reticle alignment marks on the reticle R and a pair of second reference marks RM on the measurement plate 30 on the wafer table WTB corresponding thereto. A pair of reticle alignment detection systems 14 (see FIG. 8) of a TTR (Through The Reticle) system using light of an exposure wavelength for simultaneously observing an image via the system PL is arranged. The detection signals of the pair of reticle alignment detection systems 14 are supplied to the main controller 20.

  Next, the transport system 120 (see FIG. 8) will be described. Prior to loading the wafer before exposure onto the wafer table WTB, the carry-in unit 121 (see FIG. 1) constituting a part of the transfer system 120 holds the wafer on the wafer table WTB. It is for loading. Further, the carry-out unit 122 (see FIG. 8) constituting a part of the transfer system 120 is for unloading the exposed wafer from the wafer table WTB.

  As shown in FIGS. 3 and 4A, the carry-in unit 121 includes a chuck unit 153 that sucks the wafer W from above without contact, and a plurality of, for example, three Z voice coils that drive the chuck unit 153 in the vertical direction. A plurality of, for example, a pair of weight cancellation devices 131 that support the weight of the motor 144 and the chuck unit 153, a base member 22 on which three Z voice coil motors 144, a pair of weight cancellation devices 131, and the like are mounted. The base member 22 is suspended and supported by the main frame BD (see FIG. 1) via a support member (not shown) and a vibration isolator (both not shown) connected to both ends in the longitudinal direction (X-axis direction). ing.

  As shown in FIGS. 4A and 4B, the chuck unit 153 has, for example, a pair of projecting portions 44a and 44b at both ends in the longitudinal direction (as viewed from above) in the longitudinal direction (X-axis direction). A substantially circular plate member (plate) 44 having a predetermined thickness and a plurality of chuck members 124 embedded in a predetermined arrangement on the lower surface of the plate member 44 are provided. The chuck unit 153 according to the present embodiment further includes three wafer support units 125 (described later) housed in three stepped openings 25 formed in the plate member 44 at intervals of 120 °.

  Here, the plate member 44 is provided with a pipe or the like therein, and also serves as a cool plate for adjusting the temperature of the wafer to a predetermined temperature by flowing a liquid whose temperature is adjusted to a predetermined temperature in the pipe. However, the plate member 44 does not necessarily have to serve as a cool plate.

  As shown in FIG. 4A, the base member 22 is composed of a plate member in which a notch 22a having a shape corresponding to the shape of the plate member 44 is formed. That is, the plate member 44 is disposed in a state of facing the notch portion 22a of the base member 22 via a predetermined gap (gap, clearance).

  A plurality of through holes (not shown) are formed in the plate member 44 at positions that do not interfere with the plurality of chuck members 124. Further, as shown in FIG. 4A, the plate member 44 has a position in the 6 o'clock direction, a position in the 2 o'clock direction, and 10 o'clock with respect to the center located on the reference axis LV in plan view. Stepped openings 25 are respectively formed at positions in the direction of. In each stepped opening 25, at least a part of a wafer support unit 125 described later is accommodated. The arrangement and number of the openings 25 (wafer support units 125) are not limited to this.

  As each chuck member 124, a so-called Bernoulli chuck (Bernoulli cup) is used. As is well known, the Bernoulli chuck is a chuck that uses the Bernoulli effect to locally increase the flow velocity of a fluid (for example, air) to be ejected and suck (hold non-contact) an object. Here, the Bernoulli effect means that the pressure of the fluid decreases as the flow velocity increases. In the Bernoulli chuck, suction is performed with the weight of the object to be sucked (held and fixed) and the flow velocity of the fluid ejected from the chuck. The state (holding / floating state) is determined. That is, when the size of the object is known, the dimension of the gap between the chuck and the holding object at the time of suction is determined according to the flow rate of the fluid ejected from the chuck. In the present embodiment, the chuck member 124 is used for sucking the wafer W by generating a gas flow (gas flow) around the wafer W. The degree of the suction force can be adjusted as appropriate. By moving the wafer W with the plurality of chuck members 124, movement in the Z-axis direction, θx and θy directions can be limited.

  The plurality of chuck members 124 are flown by the main controller 20 via the adjusting device 115 (see FIG. 8), the flow velocity of the gas flow ejected from each chuck member 124, the flow rate, and the ejection direction (gas ejection direction). By controlling at least one of these, the suction force of each chuck member 124 is individually set to an arbitrary value. The plurality of chuck members 124 may be configured to be able to set the suction force for each predetermined group. The main controller 20 may control the temperature of the gas.

  As will be described later, fluid (for example, air) ejected from the chuck member 124 when the wafer W is sucked by the chuck member 124 is externally (chucked) through a through hole (not shown) formed in the plate member 44. To the upper part of the unit 153).

  Here, as the gas (for example, compressed air) supplied to the chuck member 124, clean air from which dust and particles are removed at least at a constant temperature is supplied. That is, the wafer W sucked by the chuck member 124 is maintained at a predetermined temperature by the temperature-controlled compressed air. In addition, the temperature, cleanliness, etc. of the space where wafer stage WST and the like are arranged can be kept within the set range.

The plate member 44 is connected to one end of each of a plurality of, in this case, three support members 24 ₁ , 24 ₂ , 24 ₃ made of an L-shaped bar-like member.

Each of the three support members 24 ₁ , 24 ₂ , 24 ₃ has one end that is an end portion of the shorter side of the L-shaped portion fixed to the upper surface of the plate member 44. One end of each of the _two support members 24 ₁ , 24 ₂ is 3 with respect to a predetermined position on the upper surface of the projecting portions 44 a, 44 b of the plate member 44, here the center of the plate member 44 located on the reference axis LV in plan view. It is fixed at the 9 o'clock position. Further, the one end and the remaining support members 24 _3, than stepped opening 25 to be described later to a position of 6 o'clock with respect to the center of the plate member 44 in plan view (corresponding to the reference axis LV position) Somewhat fixed at the + Y position.

The longer side of each of the _two support members 24 ₁ , 24 ₂ is disposed along the X-axis direction, and the other end of each side is supported from below by the weight canceling device 131, and the Z voice coil The motor 144 is connected. In this case, a Z voice coil motor 144 is disposed outside the weight cancellation device 131. The larger dimension remainder of the support member 24 ₃ is arranged along a direction inclined at a predetermined angle with respect to the X-axis and Y-axis, the lower surface of the other end portion of the side is connected to the Z voice coil motors 144 .

Each of the three Z voice coil motors 144 sucks the chuck unit 153 up and down (Z-axis direction) with a predetermined stroke (first position where the chuck unit 153 starts sucking the wafer W and the chuck unit 153. The wafer W is driven in a range including a second position where the wafer W is placed on the wafer holder WH (wafer table WTB). Here, the three Z voice coil motors 144, Z voice coil motor 144 that is connected to the support member 24 ₃ is mainly used for the attitude control of the chuck unit 153 ([theta] x direction posture control). Each of the three Z voice coil motors 144 is controlled by the main controller 20 (see FIG. 8).

Each of the two weight cancellation devices 131 is a kind of air spring device, and includes a piston member (not shown) and a cylinder (not shown) in which the piston member is slidably provided. The pressure in the space inside the cylinder defined by the piston and the cylinder of the piston member includes the chuck unit 153 (the plate member 44, the plurality of chuck members 124, and three wafer support units 125 described later), and the support members 24 _{1 to} 24. _The value is set according to the weight of ₃ . As a result, the two weight cancellation devices 131 apply an upward force (+ Z direction) to the support members 24 ₁ , 24 ₂ , and the own weight (or part thereof) of the chuck unit 153 is supported. The pressure and amount of the gas supplied into the cylinder of the weight canceling device 131 are controlled by the main control device 20 (see FIG. 8). Here, since the weight cancellation device 131 includes a piston member that moves in the vertical direction along the cylinder, it also serves as a guide when the chuck unit 153 moves up and down.

  As described above, the three wafer support units 125 are individually housed in the three stepped openings 25 formed in the plate member 44 (see FIGS. 4A and 4B). FIG. 4B shows a state in which a part of a holding portion, which will be described later, that supports the wafer W is exposed from the lower surface of the plate member 44.

  Since the three wafer support units 125 have the same configuration except for different arrangements, the wafer support accommodated in the stepped opening 25 positioned in the −Y direction with respect to the center of the plate member 44 is described below. The unit 125 will be described as a representative example.

As shown in FIG. 5A, the wafer support unit 125 includes a flat plate member 62, two bearing members 66 ₁ , 66 ₂ disposed on the flat plate member 62 at predetermined intervals in the longitudinal direction, A holding unit 72 rotatably supported by bearing members 66 ₁ and 66 ₂ , and a rotation motor 68 connected to the holding unit 72 via a coupling 64 are provided.

  The flat plate member 62 is made of a thin plate-like member, and a rectangular opening 63 is formed at the center. The flat plate member 62 is fixed to the step portion of the stepped opening 25 of the plate member 44 in a state of being substantially parallel to the XY plane by, for example, bolt fastening.

The two bearing members 66 ₁ and 66 ₂ are each composed of a rectangular parallelepiped member, and the bearing member 66 ₁ located on the + X side is somewhat longer in the X-axis direction than the bearing member 66 ₂ located on the −X side. The two bearing members 66 ₁ and 66 ₂ are spaced apart in the X-axis direction so as to sandwich the opening 63 formed in the flat plate member 62 in the X-axis direction, and fixed to the upper surface of the flat plate member 62 by, for example, bolt fastening or the like. Has been. As shown in FIG. 7, the one bearing member 66 _1, leading to the end surface of the -X side from the end surface on the + X side, a circular through-hole 80 ₁ is formed. Similarly, the other bearing member 66 _2, + from X side end surface of the lead to the end surface of the -X side, circular through-hole 80 ₂ of the same diameter through-hole 80 ₁ concentrically it is formed.

  In the present embodiment, two bearing members are prepared. However, the number of bearing members is not limited to two, and may be one if the shaft portion can be supported.

As shown in FIG. 5B, the holding unit 72 includes three portions arranged along the longitudinal direction (X-axis direction), that is, shaft portions 73 ₁ and 73 ₂ and a holding portion 74. More specifically, the holding portion 74 is provided at the center in the longitudinal direction (X-axis direction) of the holding unit 72, and two shaft portions (shaft portions) that are concentric and have the same diameter on one end surface and the other end surface in the longitudinal direction of the holding portion 74. ) 73 ₁ and 73 ₂ are fixed at one end face in the longitudinal direction. Holding unit 72, as shown in FIG. 7, the shaft portion 73 ₁ is inserted into the bearing member 66 ₁ of the through-hole 80 _1, the shaft portion 73 _2, the bearing member 66 _{and second} through-holes 80 in the ₂ Has been inserted. That is, the holding unit 72 is supported by the two bearing members 66 ₁ , 66 _{2 in} such a manner as to be rotatable around a rotation axis parallel to the X-axis direction. The holding unit 72 will be described in detail later including the configuration of the holding unit 74.

On one of the bearing members 66 _1, as shown in FIG. 7, the through-holes 80 in the upper part of the _1, three conduits 81 ₁ for communicating the interior of the outer and the through-hole 80 ₁ of the bearing member 66 ₁ to 81 ₃ are formed spaced apart in the X-axis direction. Further, the other bearing member 66 _2, in the upper portion of the through-hole 80 _2, line 84 for communicating the interior of the bearing member 66 ₂ externally of the through-hole 80 ₂ is formed.

Of the three conduits 81 _{1-81 3} bearing member 66 _1, pipe 81 ₁ which is positioned on the most + X side through the gas supply pipe (not shown), a predetermined gas, for example gas supply compressed air It is connected to the supply device 102. The flow rate of the compressed air supplied from the gas supply device 102 is controlled by the main control device 20 (see FIG. 8). The through-hole 80 ₁ of the bearing member 66 _1, the inner diameter of the + X half is larger than the other portions. That is, the through-hole 80 _1, a circular opening stepped. The large diameter portion of the through-hole 80 _1, i.e. on the inner peripheral surface of the + X half of the bearing member 66 _1, the cylindrical porous member 82 is arranged, the inner peripheral surface of the porous member 82, through holes 80 ₁ It is flush with other parts. Compressed air supplied from the gas supply device 102 via line ₈₁₁ flows into the porous member 82, from the porous member 82, the facing surfaces throughout the porous member 82 and the shaft portion 73 ₁ towards being sprayed, the static pressure of the blown compressed air, between the porous member 82 and the shaft portion 73 _1, a predetermined clearance (gap clearance), for example, several μm order of gap is formed ing. That is, the static pressure air bearing (air bearing) is arranged between the + X side end portion of the bearing member 66 ₁ and a shaft portion 73 _1.

Of the three conduits ₈₁ 1-81 ₃ bearing member 66 _1, the conduit 81 ₃ positioned on the most -X side, the -X side end of the bearing member 66 ₁ (-X side of the pipe 81 ₂₎ Is formed. Line 81 ₃ is connected to a vacuum pump 104 via a vacuum pipe (not shown). The vacuum pump 104 is controlled by the main controller 20 (see FIG. 8).

Of the three conduits ₈₁ 1-81 ₃ bearing member 66 _1, pipe 81 ₂ located in the middle was placed on the bearing member 66 ₁ of the through hole 80 in the _first porous member 82 from the -X side Formed in position. The surface facing the shaft portion 73 ₁ of the bearing member 66 ₁ (inner peripheral surface), the portion pipe 81 ₂ is provided, all the recesses 83 over the circumference are formed, thereby, the bearing member 66 ₁ shaft portion 73 ₁ a cylindrical between the (annular) space (hereinafter, referred to as space 83 by using the same reference numerals as convenience recess 83) are formed. Then, the space 83 is communicated with the outer space of the bearing member 66 ₁ via line 81 _2. In other words, conduit 81 ₂ functions as air opening. Therefore, even if a vacuum pump 104 is in operation, is supplied from the gas supply device 102 described above, is ejected between the porous member 82 and the shaft portion 73 _1, the compressed air flowing in the -X side , flows into the space 83 is discharged to the outside (outer space of the bearing member 66 ₁₎ through line 81 _2. Therefore, the compressed air hardly flows into the −X side from the recess 83.

Conduit 84 is formed in a central portion of the bearing member 66 _{and second} longitudinal (X-axis direction). The pipe 84 is connected to a gas supply device 106 (see FIG. 8) for supplying a predetermined gas, for example, compressed air, through a gas supply pipe (not shown). The inner peripheral surface of the bearing member 66 ₂ (the surface facing the shaft portion 73 _2), a cylindrical porous member 85 is disposed over the X-axis direction the entire region of the bearing member 66 _2. That is, between the bearing member 66 ₂ and the shaft portion 73 _2, the same hydrostatic air bearing and configured aerostatic bearing (air bearing) between the bearing member 66 ₁ and the shaft portion 73 ₁ is configured Has been. The flow rate of compressed air supplied from the gas supply device 106 is controlled by the main controller 20 (see FIG. 8).

  Returning to the description of the holding unit 72, as shown in FIG. 5B, the holding portion 74 of the holding unit 72 includes a main body portion 74a having a U-shape in plan view, and FIGS. 4B and 6B. And an L-shaped wafer support portion 74b protruding downward from the opening 63 of the flat plate member 62 when positioned at a support position for supporting the wafer W shown in FIG.

The holding unit 72 has at least a position shown in FIG. 6B where the wafer support part 74b of the holding part 74 supports the wafer W (that is, the above-mentioned support position) and a support shown in FIG. 6A. shaft portion 73 1 from _position 73 ₂ rotated 90 degrees to the plane in clockwise as a rotation axis, the position of the wafer support portion 74b and the wafer W is spaced (hereinafter, referred to as separated position) between the rotation motor 68.

  As shown in FIG. 5B, the main body 74a has a U-shaped bottom surface (a surface parallel to the XZ plane when the holding unit 72 (holding portion 74) is positioned at the support position). A rectangular opening is formed.

As shown in FIG. 6B, the wafer support portion 74b has a support surface (wafer support surface) that supports the wafer when the holding unit 72 (holding portion 74) is positioned at the support position. An adsorbing portion 78 that adsorbs the wafer W is provided at the + X side end of the wafer support surface. An opening 78a is formed at the center of the suction portion 78, and one end of a conduit 91 formed inside the wafer support portion 74b and the main body portion 74a communicates with the opening 78a. Conduit 91, as shown in FIG. 7, the other end is in communication with the conduit 92 extending in the X-axis direction, which is formed inside the shaft portion 73 _1. The shaft portion 73 _1, when located in the supporting position (when in a state where the holding is performed on the wafer) is provided with a first direction along the thickness direction of the wafer (in FIG. 6 Z direction) crossing It extends in the second direction (X direction in FIGS. 5 and 6).

The shaft portion 73 _1, the holding unit 72, when located in the supporting position, the conduit 81 ₃ opposite to the position, is conduit 93 which communicates with the outside of the conduit 92 and the shaft portion 73 ₁ is formed Yes. Therefore, the holding unit 72, when positioned in the support position, conduit 93 communicates with the conduit 81 _3. That is, the holding unit 72 when positioned in the support position, passage connecting the opening 78a formed with an external pipe 81 ₃ (i.e. vacuum pump 104) to the wafer support portion 74b (flow passage) is formed. In this state, when the wafer W is supported on the wafer support surface (upper surface of the suction portion 78) of the wafer support portion 74b and the vacuum pump 104 is operated by the main controller 20, the inside of the pipe line 92 and the pipe line 91 is negative pressure. A (vacuum) state is established, and the wafer W is sucked and held by the suction portion 78 of the wafer support portion 74b.

Here, the position of the holding unit 72 is non-support position, for example when located apart position, and a conduit 81 ₃ and the flow path 93 does not communicate, the vacuum pump 104 is operated by the main controller 20 However, suction by the suction part 78 is not performed.

Furthermore, whereas the shaft portion 73 ₁ of the (+ X side), as shown in FIGS. 5 (A) and FIG. 5 (B), the cross member 75 cross-shaped when viewed from the + X direction + X end is fixed Yes. In addition, a total of four magnetic bodies (for example, iron) 76 are fixed to the tip of the cross section on the + X side surface of the cross member 75, one each. On the other hand, as shown in FIG. 5A, a rod-like support member 67 extending in the Z-axis direction is fixed to the flat plate member 62 at a position facing the cross member 75. In the support member 67, one (total of two) magnets 61 (permanent magnets) are fixed in the vicinity of the upper end and the lower end of the surface on the -X side. The two magnets 61 are positioned so as to face two of the four magnetic bodies 76 when the holding unit 72 is located at each of the above-described support position and the separation position.

Rotary motor 68 is fixed on the flat plate member 62, and is connected via a coupling 64 to the shaft portion 73 ₂ of the -X end of the holding unit 72. As an example of the rotary motor 68, a brushless type DC motor is used. The rotary motor 68 is provided with an absolute position detection type sensor for detecting the rotation angle (position in the rotation direction) of the rotation shaft, for example, an absolute encoder 101 (see FIG. 8). The absolute encoder 101 is set from the off state to the on state when it is used or slightly before, that is, when the holding unit 72 is driven from the separated position to the support position and when it is driven from the support position to the separate position. Is done. The main controller 20 (see FIG. 8) places the holding unit 72 on the basis of the measurement value (the rotation angle of the rotation shaft of the rotation motor 68 (position (absolute position) in the rotation direction)) supplied from the absolute encoder 101. A fixed amount of rotation is driven to position the wafer support 74b at a predetermined position. Here, when the wafer support portion 74b is located at the support position or the separation position (when the absolute encoder 101 is in the OFF state), the two magnets 61 described above and two of the four magnetic bodies 76 are Therefore, the holding unit 72 (wafer support portion 74b) is fixed (positioned) by the magnetic force acting between the magnet 61 and the magnetic body 76. Further, when the holding unit 72 is driven, the rotation unit 68 generates a rotational force that overcomes the above-described magnetic force, thereby driving the holding unit 72 (wafer support portion 74b).

  Although description will be made before and after, as shown in FIG. 5B, the wafer support portion 74b has a reflecting mirror at the center of the upper surface (wafer support surface) when the holding unit 72 is located at the support position. 79 is provided. In this embodiment, one reflecting mirror 79 is actually provided for each of the three wafer support units 125, and illumination light can be irradiated from above to each of the three reflecting mirrors 79. A measurement system 123 (see FIG. 8) including three edge position detection systems of the epi-illumination system is provided.

  Each edge position detection system constituting the measurement system 123 includes, for example, an illumination light source, an optical path bending member such as a plurality of reflecting mirrors, a lens, and an imaging element such as a CCD, and position information of the edge portion of the wafer W is obtained. An edge position detection system of an image processing method for detection can be used. When the edge detection of the wafer W is performed by the measurement system 123, those image pickup signals are sent to the signal processing system 116 (see FIG. 8).

  The carry-in unit 121 further includes a chuck unit position detection system 148 (see FIG. 8) that detects the position of the chuck unit 153 in the Z-axis, θx, and θy directions. The chuck unit position detection system 148 includes, for example, a plurality of (for example, three) Z position detection systems (for example, a laser displacement meter and other optical displacement sensors) fixed to the main frame BD. A plurality of Z positions on the upper surface of the chuck unit 153 are detected by the chuck unit position detection system 148, and the detection results are sent to the main controller 20 (see FIG. 8).

  In addition, the carry-in unit 121 may include a wafer flatness detection system 147 (see FIG. 8). The wafer flatness detection system 147 has a plurality of, for example, four wafer W surfaces (upper surfaces) disposed at a plurality of positions on the plate member 44, for example, three positions above the outer periphery of the wafer W and one position above the center. Can be configured by a Z position detection system (not shown) that detects a position (Z position) in the Z-axis direction (for example, a displacement sensor such as a capacitance sensor). Main controller 20 detects a plurality of Z positions on the upper surface of wafer W based on the measurement values of a plurality of Z position detection systems, and obtains the flatness of wafer W from the detection result.

  FIG. 8 is a block diagram showing the input / output relationship of the main control device 20 that centrally configures the control system of the exposure apparatus 100 and performs overall control of each component. The main controller 20 includes a workstation (or a microcomputer) and the like, and comprehensively controls each part of the exposure apparatus 100.

  In the exposure apparatus 100 according to the present embodiment configured as described above, the main controller 20 performs the following series of processes.

  That is, main controller 20 first loads reticle R onto reticle stage RST using a reticle transport system (not shown). Main controller 20 loads wafer W onto wafer stage WST (wafer holder WH) as described later. After loading, preparation operations such as reticle alignment, baseline measurement of alignment detection system ALG, and wafer alignment (for example, EGA) are performed using a pair of reticle alignment detection system 14 and measurement plate 30 and alignment detection system ALG. Note that reticle alignment, baseline measurement, and the like are disclosed in detail in, for example, US Pat. No. 5,646,413. EGA is disclosed in detail in, for example, US Pat. No. 4,780,617. Here, the EGA means that all shot areas on the wafer W are subjected to statistical calculation using, for example, the least square method disclosed in the above-mentioned U.S. Patent Specification using the position detection data of a plurality of wafer alignment marks in the shot. This means an alignment method for obtaining array coordinates.

  Then, main controller 20 moves wafer stage WST to a scan start position (acceleration start position) for exposure of each shot area on wafer W based on the results of reticle alignment, baseline measurement, and wafer alignment. By repeating the movement operation between shots to be performed and the scanning exposure operation in which the pattern of the reticle R is transferred to each shot area by a scanning exposure method, exposure to a plurality of shot regions on the wafer W is performed by a step-and-scan method. Do. The focus / leveling control of the wafer W during exposure is performed in real time using the multi-point AF system 54 described above.

  Next, a procedure for loading (loading) wafer W onto wafer stage WST will be described with reference to FIGS. 9A to 11B and other drawings as appropriate.

  As a premise, for example, as shown in FIG. 9A, the chuck unit 153 includes three Z voice coil motors 144 (in FIG. 9A, etc., the Z voice coil motor 144 on the -Y side is not shown). 4 (A))) is moved to the vicinity of the movement upper limit position (the movement limit position on the + Z side) within the stroke range, that is, the first position described above, and is maintained at that position. At this time, it is assumed that the holding units 72 of the three wafer support units 125 are set at the separated positions (see FIG. 6A).

  In this state, first, as shown in FIG. 9A, the wafer W is transferred below the chuck unit 153 (above the loading position LP) with the lower surface supported by the transfer arm 149. Here, the transfer of the wafer W to the lower position of the chuck unit 153 by the transfer arm 149 is performed by performing an exposure process on a wafer to be exposed (hereinafter referred to as a previous wafer) immediately before the transferred wafer W. It may be performed when it is performed on wafer stage WST, or may be performed when alignment processing or the like is being performed on the previous wafer.

  Next, main controller 20 starts supplying fluid (air) to a plurality of chuck members 124 via adjustment device 115, as shown in FIG. The chuck unit 153 (a plurality of chuck members 124) is sucked without contact while maintaining a distance (gap). In FIG. 9A and the like, the wafer W is caused by the flow of the blown air (more precisely, by the negative pressure generated by the flow), which is indicated by the dot filling in the drawing in a simplified manner. It is assumed that the chuck unit 153 is sucked. However, the state of the air actually ejected is not necessarily limited to these.

  Next, as indicated by black arrows in FIGS. 6A and 9A, the main controller 20 includes a rotation motor 68 provided in each of the three wafer support units 125 (FIG. 5A). Each holding unit 72 is rotated via the reference position and is positioned at the support position. In FIG. 9A, the rotational drive operation of the pair of holding units 72 on one side and the other side in the X-axis direction is indicated by black arrows. When each holding unit 72 is driven to the support position, the suction portion 78 (opening 78a) of each wafer support portion 74b faces (contacts) the lower surface (back surface) of the wafer W (FIG. 9B and FIG. 6). B)). When the holding units 72 of the three wafer support units 125 are respectively positioned at the support positions, the reflecting mirrors 79 on the wafer support portions 74b are respectively predetermined positions (including notch positions) on the outer peripheral edge of the back surface of the wafer W. (See FIG. 6B).

The rear surface of the wafer W is, when it is supported by the adsorbing portion 78 of the wafer support portions 74b, the main controller 20, a vacuum pump 104 connected to the bearing member 66 ₁ of the wafer support portions 74b (FIGS. 7 and 8 ) And vacuum suction is performed. At this time, since the holding unit 72 (holding portion 74) is positioned in the supporting position, the channel from the conduit 81 ₃ vacuum pump 104 is connected to an opening 78a formed in the wafer support portion 74b is formed Has been. For this reason, when the vacuum pump 104 is operated, the back surface of the wafer W is sucked and held by the sucking portions 78 of the respective wafer support portions 74b.

  At this time, the movement of the wafer W in the three-degree-of-freedom directions of Z, θx, and θy is restricted by suction from above by the chuck unit 153, and X wafer is supported by suction support from below by the three wafer support units 125. , Y, and θz are restricted to move in the three-degree-of-freedom direction, thereby restricting movement in the six-degree-of-freedom direction.

  The wafer W waits above the loading position LP in this state, that is, in a state where suction (non-contact holding) by the chuck unit 153 and suction (support) by the three wafer support units 125 are performed. A processing sequence of the exposure apparatus 100 is determined. In the exposure apparatus 100, while the wafer W stands by above the loading position LP, an exposure process (and an alignment process preceding it) for the previous wafer held on the wafer table WTB is performed. At this time, the vacuum suction of the wafer W by the transfer arm 149 may be stopped. Note that the suction of the wafer W by the above-described chuck unit 153 (the plurality of chuck members 124) and the support of the wafer from below by the three wafer support units 125 may be performed in the reverse order. Some operations may be performed in parallel.

  While waiting for wafer W above loading position LP, main controller 20 performs edge detection of wafer W using measurement system 123 (see FIG. 8). Detection signals (imaging signals) from the three edge position detection systems of the measurement system 123 are sent to the signal processing system 116 (see FIG. 8). The signal processing system 116 detects the position information of three positions of the peripheral portion including the notch of the wafer by a method disclosed in, for example, US Pat. No. 6,624,433, and the X axis of the wafer W Direction, a displacement in the Y-axis direction, and a rotation (θz rotation) error are obtained. Then, the information on the positional deviation and the rotation error is supplied to the main controller 20 (see FIG. 8).

  Before and after the start of the edge detection of the wafer W described above, the main controller 20 drives the transfer arm 149 downward as indicated by a black arrow in FIG. , The transfer arm 149 is retracted from above the loading position LP.

  When the exposure processing of the previous wafer is completed and the previous wafer is unloaded from the wafer table WTB by the carry-out unit 122 (see FIG. 8), the main controller 20 performs rough processing as shown in FIG. Wafer stage WST is moved below chuck unit 153 (loading position LP) via moving stage drive system 51A (see FIG. 8). 10A, the main controller 20 includes a center support member 150 having three vertical movement pins 140 (not shown in FIG. 10A, etc.). (See (B)) is driven upward via the driving device 142. Even at this time, the edge detection of the wafer W by the measurement system 123 is continued, and the main controller 20 uses the positional deviation and rotation error information of the wafer W so that the wafer W is mounted at a predetermined position of the wafer stage WST. Based on this, wafer stage WST is finely driven in the same direction by the same amount as the deviation amount (error) of wafer W.

  Then, as shown in FIG. 10B, when the upper surfaces of the three vertical movement pins 140 come into contact with the lower surface of the wafer W sucked by the chuck unit 153, the main controller 20 controls the center support member 150. Stop climbing. Thus, the wafer W is supported by the three vertical movement pins 140 in a state where the positional deviation and the rotation error are corrected.

  Here, the Z position of the wafer W sucked by the chuck unit 153 in the standby position can be accurately known to some extent. Therefore, the main controller 20 drives the center support member 150 from the reference position by a predetermined amount based on the measurement result of the displacement sensor 145, whereby the wafer W in which the three vertical movement pins 140 are sucked by the chuck unit 153. Can be brought into contact with the lower surface of the plate. However, the present invention is not limited to this, and the three vertical movement pins 140 are in contact with the lower surface of the wafer W sucked by the chuck unit 153 at the upper limit movement position of the center support member 150 (three vertical movement pins 140). Alternatively, it may be set in advance.

  Thereafter, main controller 20 operates a vacuum pump (not shown) and starts vacuum suction on the lower surface of wafer W by three vertical movement pins 140. Note that the suction of the wafer W by the plurality of chuck members 124 is continued even in this state. That is, the movement of the wafer W in the direction of 6 degrees of freedom is limited by the suction force by the plurality of chuck members 124 and the frictional force generated by the support from below the three vertical movement pins 140. Therefore, in this state, no problem occurs even if the adsorption (contact holding) of the wafer W by the wafer support portion 74b of the wafer support unit 125 is released.

  Therefore, when the wafer W is supported (adsorbed and held) by the three vertical movement pins 140, the main controller 20 stops the operation of the vacuum pump 104 (see FIG. 8), and then the FIG. 12 (A), the holding unit 72 is rotated to drive the holding units 72 included in the three wafer support units 125 from the support position to the separated position. As a result, as shown in FIG. 12B, the holding units 72 are positioned at the separated positions, and the support of the wafer W by the wafer support portions 74b is released.

  Next, as indicated by a black arrow and a white arrow in FIG. 11A, the main control unit 20 sucks and supports the wafer W and the three vertical movement pins 140 (center). The supporting member 150) is driven downward via the three Z voice coil motors 144 and the driving device 142, respectively. Thus, the chuck unit 153 and the three vertical movement pins 140 (center support) are maintained while maintaining the suction state by the chuck unit 153 (the plurality of chuck members 124) and the support state by the three vertical movement pins 140 with respect to the wafer W. Member 150) is driven downward. The chuck unit 153 and the three vertical movement pins 140 (center support member 150) may be driven synchronously or may be driven at different speeds. In the latter case, it is desirable to adjust the speeds of both so that the deformation of the wafer W is suppressed. In this case, the chuck unit 153 is driven by the main controller 20 driving the three Z voice coil motors 144 based on the detection result of the chuck unit position detection system 148.

  As shown in FIG. 11B, the chuck unit 153 and the three vertical movement pins 140 (center support member 150) are driven such that the lower surface of the wafer W is the upper surface of the wafer holder WH on the wafer table WTB (see FIG. 11B). This is performed until the wafer abuts on the wafer support surface.

  When the lower surface of the wafer W comes into contact with the wafer holder WH, the main controller 20 stops the flow of the high-pressure air flow from all the chuck members 124 via the adjustment device 115, and the wafer W is moved by the chuck unit 153. The suction is released, and the suction of the wafer W by the wafer holder WH is started.

  Next, main controller 20 moves chuck unit 153 to a predetermined standby position (first position or a position in the vicinity thereof) via three Z voice coil motors 144 as indicated by black arrows in FIG. ). Thereby, loading (carrying in) of wafer W onto wafer table WTB is completed.

  Here, when the chuck unit 153 is driven upward and stopped (or during ascending), the main controller 20 detects the edge position of the wafer W using the measurement system 123 described above. In this case, the edge detection of the wafer W is performed by irradiating the three reflection mirrors 86 on the wafer table WTB with the measurement beams from the three edge position detection systems of the measurement system 123, respectively. This is performed by receiving light from the image pickup elements of the three edge position detection systems. The detection signals of the three edge position detection systems of the measurement system 123 are sent to the signal processing system 116 (see FIG. 8), and information on the positional deviation and rotation error of the wafer W is supplied to the main controller 20. The main controller 20 stores the information of the positional deviation and the rotation error in the memory as an offset amount, and considers the offset amount at the time of subsequent wafer alignment or exposure, and the wafer table. Control the position of WTB. The wafer W is supported by the three vertical movement pins 140 in a state where the edge detection of the wafer W is performed during the above-described standby, and the positional deviation and the rotation error obtained as a result are corrected. Since the wafer W is mounted on the wafer table WTB, the edge detection of the wafer W after loading the wafer W onto the wafer table WTB may not necessarily be performed.

  As described above, according to the carry-in unit 121 and the exposure apparatus 100 including the carry-in unit 121 according to the present embodiment, the main controller 20 loads the wafer W onto the chuck unit 153 when loading the wafer W onto the wafer table WTB. The peripheral edge of the wafer W is supported from below by the three wafer support units 125 that can be sucked and held from above through at the same time and can be rotated (for example, also referred to as undulation rotation (reciprocal rotation around one axis in a horizontal plane)). . Thus, when the wafer W is sucked and held from above via the chuck unit 153, the wafer W is not only in the vertical direction but also in the horizontal plane until it is transferred to the three vertical movement pins 140 (center support member 150). But there is no misalignment. Further, when the chuck unit 153 is driven to rotate about one axis by the driving device and is positioned at the first position, a part of the holding unit including the suction unit comes into contact with the wafer W from below. Therefore, by using a plurality (for example, three sets) of the chuck units 153 and holding different positions of the wafer W from below by the respective suction portions, the wafer W can be held in a small space.

  Further, main controller 20 sets measurement system 123 during loading of wafer W onto wafer stage WST, specifically, when wafer W is supported by chuck unit 153 and three wafer support units 125. The wafer stage WST is driven so that the positional deviation and rotational deviation of the wafer W are measured, and the positional deviation and rotational deviation of the wafer W are corrected based on the measurement result. Therefore, the wafer W can be loaded on the wafer table WTB with good position reproducibility.

  Further, since the chuck unit 153 that can move up and down and includes three wafer support units 125 that can rotate is used, unlike the case of using a wafer support member that rotates in a horizontal plane, the wafer W can be moved even in a narrow space. Loading onto the wafer holder WH becomes possible.

  Further, when loading the wafer W onto the wafer table WTB, the main controller 20 determines the suction state of the wafer W by the chuck unit 153 (the plurality of chuck members 124) and the support state by the three vertical movement pins 140. The chuck unit 153 and the vertical movement pin 140 (center support member 150) can be moved up and down while maintaining. As a result, the wafer W can be loaded on the wafer stage WST while maintaining the flatness of the wafer W within a desired range.

  Further, since the chuck unit 153 and the wafer support unit 125 are driven in the Z-axis direction via the common Z voice coil motor 144, the number of parts can be reduced.

  Further, since the own weight of the chuck unit 153 is supported by the pair of weight cancellation devices 131, the force when driving the chuck unit 153 in the vertical direction can be reduced, and the size of each Z voice coil motor 144 can be reduced. can do.

  Further, according to the exposure apparatus 100 according to the present embodiment, the wafer W loaded with high flatness and good position reproducibility on the wafer table WTB is exposed by the stepping and scanning method. Therefore, it is possible to perform exposure with good overlay accuracy and no defocus for each of the plurality of shot areas on the wafer W, and the pattern of the reticle R can be transferred to the plurality of shot areas. it can.

  It should be noted that while the wafer W is sucked and held by the chuck unit 153, the positional deviation of the wafer W in the XY plane can be effectively suppressed by the three wafer support units 125, so the measurement system 123 is not necessarily provided. May be.

<< Second Embodiment >>
Next, an exposure apparatus according to the second embodiment will be described with reference to FIGS. 13 and 14A to 14C. In the exposure apparatus according to the second embodiment, a wafer support unit 125a shown in FIG. 13 is provided in place of each of the three wafer support units 125 included in the chuck unit 153 of the carry-in unit 121. The configuration of other parts of the chuck unit 153, the other configuration of the carry-in unit 121, the configuration of parts other than the carry-in unit 121, and the like are the same as those of the exposure apparatus 100 according to the first embodiment described above. Therefore, hereinafter, differences from the exposure apparatus 100 will be described with the wafer support unit 125a as a center.

  As can be seen by comparing FIG. 13 and FIG. 5A, the wafer support unit 125a includes a cleaner unit 152 shown in FIG. 13 in addition to the same components as the wafer support unit 125 described above. The cleaner unit 152 is for cleaning the resist and the like adhering to the suction portion 78. Since the three wafer support units 125a each having the cleaner unit 152 have the same configuration except for the different arrangement, in the following, in the stepped opening 25 positioned in the −Y direction with respect to the center of the plate member 44. The wafer support unit 125a housed in the above will be taken up as a representative, and the cleaner unit 152 will be mainly described.

As shown in FIG. 13, the cleaner unit 152 is disposed at the −Y side end portion (−Y side of the above-described holding unit 72 and the like) of the upper surface of the flat plate member 62. Cleaner unit 152, FIGS. 13 and 14 as shown in (A) or the like, the guide member 31 extended in the X axis direction to the vicinity of a position opposite from the + X end of the plate member 62 to the bearing member 66 _2, The air cylinder 32 fixed to the upper surface of the guide member 31, fixed to the tip (+ X side end) of a piston rod (not shown) of the air cylinder 32, and driven in the X axis direction by the air cylinder 32 along the guide member 31. A flat plate member 33 and a rod-shaped member 34 fixed to the −X side surface of the flat plate member 33 and having a grindstone 35 fixed to the tip are provided.

  The control of the air cylinder 32 (control of the pressure in the space inside the cylinder defined by the cylinder constituting the air cylinder and the piston sliding inside the air cylinder) is performed by the main controller 20, whereby the grindstone 35 is A standby position (see FIGS. 14A and 14B) located on the + X side of the holding portion 74 in the X-axis direction and a polishing end position located on the −X side of the suction portion 78 (see FIG. 14C). ). The grindstone 35 is made of, for example, silicon carbide.

  Next, the operation of the carry-in unit 121 in the exposure apparatus according to the second embodiment, particularly when holding and holding the wafer above the loading position LP, is centered on the operation of the cleaner unit 152. The operation before and after waiting will be described with reference to FIGS. 14 (A) to 14 (C). As a premise, for example, in the wafer support unit 125a, as shown in FIG. 14A, the holding unit 72 is positioned at the support position, and the wafer W (not shown in FIG. 14A, FIG. 6B), etc. Reference) is supported from below. At this time, main controller 20 positions grindstone 35 at the standby position via air cylinder 32.

  As described in the above embodiment, when the wafer W is supported from below by the three vertical movement pins 140 (see FIG. 12A), the wafer W is supported by the wafer support portion 74b (the suction portion 78). The suction is released, and the main controller 20 drives the holding unit 72 from the support position to the separation position via the rotation motor 68, as indicated by a white arrow in FIG.

  Then, after wafer W is loaded on wafer table WTB in the above-described procedure, when wafer stage WST moves away from loading position LP, main controller 20 is indicated by a white arrow in FIG. In this manner, the grindstone 35 is driven in the −X direction from the standby position toward the polishing end position via the air cylinder 32. In the middle of this movement, the grindstone 35 contacts the suction part 78 of the wafer support part 74b, and is driven in the −X direction while maintaining the contact state. That is, the grindstone 35 is driven in the −Y direction while sliding along the wafer support surface of the wafer support portion 74 b including the suction portion 78. The wafer support surface is polished by the sliding of the grindstone 35. Accordingly, at this time, if a resist or the like is attached to the suction portion 78, the resist or the like is peeled off from the suction portion 78 by the grindstone 35. As described above, the polishing operation by the grindstone 35 is performed when the wafer stage WST is not positioned at the loading position LP, for example, during alignment or exposure with respect to the wafer W.

  Then, when the polishing of the suction portion 78 by the grindstone 35 is completed, the main controller 20 waits for the grindstone 35 from the polishing end position via the air cylinder 32 as indicated by the white arrow in FIG. Drive in the + X direction to the position. Thereafter, a new wafer is transferred above the loading position LP by the transfer arm 149, sucked from above by the chuck unit 153, and sucked and held by the three wafer support units 125 from below. In this state, the exposure (transfer of the pattern of the reticle R) to the previous wafer W is completed, and the wafer is unloaded by the unloading unit 122 (see FIG. 8), and the new wafer is loaded onto the wafer table WTB. It will wait until it becomes possible.

  According to the exposure apparatus of the second embodiment, the same effects as those of the first embodiment described above can be obtained. In addition, the resist applied to the wafer W hangs down to the lower surface of the wafer W, and the resist has three Even if it adheres to the suction part 78 of the wafer support part 74b of the wafer support unit 125a, the suction part 78 is polished by the grindstone 35, so there is a risk that the resist attached to the suction part 78 will adhere to a new wafer. Therefore, the exposure accuracy can be kept good. Further, since the polishing operation by the grindstone 35 is performed when the wafer stage WST is not arranged at the loading position LP (below the chuck unit 153), the resist that has been peeled off adheres to the wafer holder WH and the like, and is on the wafer holder WH. There is no possibility of adversely affecting the exposure result due to the deterioration of the flatness of the newly placed wafer W.

<< Modification of Second Embodiment >>
In the exposure apparatus according to the second embodiment, a wafer support unit 125b according to the modification shown in FIGS. 15A to 15C may be provided in place of each of the three wafer support units 125a. good. In the wafer support unit 125 b according to this modification, a cleaner unit 152 a is used instead of the cleaner unit 152. In addition to the configuration of the cleaner unit 152 described above, the cleaner unit 152a is provided with an elastic body (elastic member) that constantly urges the flat plate member 33 in the -X direction, for example, a compression spring (compression coil spring) 36.

  The compression spring 36 is provided between the flat plate member 33 and a support member 37 fixed to the + X side end of the upper surface of the flat plate member 62. In the present modification, when the holding unit 72 of the three wafer support units 125b is in the wafer support position, the air cylinder 32 is controlled by the main controller 20 (see FIG. 8), and the −X direction is generated by the elastic force of the compression spring 36. The flat plate member 33 is driven in the + X direction against the urging force, and the grindstone 35 waits at the standby position described above (see FIG. 15A).

  When the holding unit 72 of the three wafer support units 125b is in the wafer support position and the grindstone 35 is in the standby position, for some reason, including the supply of compressed air into the air cylinder 32, the wafer support unit 125b When the supply of utility force is stopped, the flat plate member 33, the rod-shaped member 34 and the grindstone 35 are driven in the -X direction by the biasing force of the compression spring 36 as shown in FIG. The side surface is in pressure contact with the + X side surface of the main body 74a. As a result, even if the cause of the supply stop of the utility force is an earthquake or the like, and it becomes difficult to maintain the wafer support state with only the magnetic force acting between the magnet 61 and the magnetic body 76, The support state of the wafer W by the three wafer support units 125b can be maintained by the magnetic force and the frictional force between the grindstone 35 and the main body 74a.

  On the other hand, when the holding unit 72 of the three wafer support units 125b is in the separated position and the grindstone 35 is in the standby position, the wafer support unit 125b includes supply of compressed air into the air cylinder 32 for some reason. When the supply of the working force to is stopped, the flat plate member 33, the rod-shaped member 34, and the grindstone 35 are driven in the -X direction by the biasing force of the compression spring 36, and as shown in FIG. The grindstone 35 is inserted between the wafer support portion 74b and the main body portion 74a, and the grindstone 35 is located at the polishing end position. That is, in the state of FIG. 15C, the rod-shaped member 34 and the grindstone 35 are in contact with the surface (wafer support surface) on which the suction portion 78 of the wafer support portion 74b is provided. As a result, the factor for stopping the supply of utility power is, for example, an earthquake, and it is difficult to maintain the holding unit 72 in the separated position with only the magnetic force acting between the magnet 61 and the magnetic body 76. However, the grindstone 35 is in the polishing end position by the elastic force of the compression spring 36, and the rod-shaped member 34 and the grindstone 35 can be kept in contact with the wafer support surface of the wafer support portion 74b. Prepared rotation can be prevented.

  As described above, in the wafer support unit 125b according to this modification, even if the supply of utility force is stopped due to other factors such as an earthquake and the supply of compressed air into the air cylinder 32 is stopped, the holding is maintained. The unit 72 can be maintained in the state at the time when the utility power supply is stopped. Therefore, when the holding unit 72 of the three wafer support units 125b is at the wafer support position and the wafer support part 74b sucks and supports the wafer W, the supply of utility force is stopped due to an earthquake or other factors. In addition, the wafer W can be prevented from falling. In addition, when the holding unit 72 of the three wafer support units 125b is in the separated position, even if the supply of utility force is stopped due to some factor such as an earthquake, the wafer support unit 74b or the like comes into contact with the wafer stage WST and is damaged. There is no fear.

  In this modification, the driving of the grindstone 35 during polishing is performed so that the main controller 20 causes the air cylinder 32 to have a somewhat lower internal pressure in the air chamber 32 than the inability of the compression spring 36. It is done by controlling.

  In the above modification, the holding unit 72 is prevented from rotating by the frictional force between the grindstone 35 and the main body 74a by pressing the grindstone 35 against the main body 74a by the urging force of the compression spring 36. However, another member different from the grindstone 35 may be used to prevent the holding unit 72 from rotating by the frictional force between the other member and the main body 74a. When the holding unit 72 is in the separated position, only the rod-like member 34 may be used to prevent the holding unit 72 from rotating, and it is not necessary to use the grindstone 35 in particular.

  In the modification, the holding unit 72 is prevented from rotating by the frictional force between the compression spring 36 and the main body 74a or the grindstone 35 being inserted between the wafer support 74b and the main body 74a. However, the present invention is not limited to this. For example, when the supply of compressed air into the air cylinder 32 is stopped due to an earthquake or the like, the wafer support portion 74b is generated by the magnetic force between the magnet 61 and the magnetic body 76. If it does not rotate, the compression spring 36 and the like need not be provided.

<< Third Embodiment >>
Next, a third embodiment will be described with reference to FIGS. Here, the same reference numerals are used for the same or equivalent components as those in the exposure apparatus according to the first embodiment described above, and the description thereof is omitted. In the exposure apparatus according to the third embodiment, the configuration of the carry-in unit 121 is partially different from the exposure apparatus 100 according to the first embodiment described above, but the configuration of other parts is the same. . Below, it demonstrates centering around difference.

  In the first embodiment described above, the three wafer support units 125 are fixed to the plate member 44 constituting a part of the chuck unit 153 and constitute a part of the chuck unit 153. However, in the third embodiment, the three wafer support units 125c do not constitute a part of the chuck unit, and as shown in FIG. 16A and the like, the support member 26 outside the chuck unit 153 ′. Further, it is attached to a rotating portion 27 having an S-shape in a side view, which is rotatably supported via a shaft member 21. The support member 26 is suspended and supported by the main frame BD via a support member (not shown). The wafer support unit 125c is basically configured in the same manner as the wafer support unit 125 described above, but the flat plate member 62 is removed. The chuck unit 153 'has a structure in which the three wafer support units 125 are removed from the chuck unit 153 described above. The plate member 44 ′ constituting a part of the chuck unit 153 ′ is not provided with three stepped openings for accommodating the wafer support unit.

  The three wafer support units 125c are slightly separated from the outer periphery of the plate member 44 in the direction of 2 o'clock, 6 o'clock, and 10 o'clock with respect to the center of the plate member 44, as in the first embodiment. Placed in position. Since the three wafer support units 125c have the same configuration except for different arrangements, the following is representative of the wafer support unit 125c positioned on the −Y side (6 o'clock direction with respect to the center) of the plate member 44. Take it up and explain.

  As shown in FIG. 16A, the wafer support unit 125 c is attached to the −Z side and + Y side positions of the rotation shaft (shaft member 21) of the rotation unit 27. The shaft member 21 is fixed to the support member 26 with the X-axis direction as the longitudinal direction. Here, the rotating portion 27 is attached to the shaft member 21 so as to be rotatable around the shaft member 21.

Similar to the wafer support unit 125 described above, the wafer support unit 125c includes two bearing members 66 ₁ and 66 ₂ (not shown in FIGS. 16A to 17, see FIG. 5A), and the two bearings. A holding unit 72 supported by members 66 ₁ and 66 _{2 so} as to be rotatable about an axis parallel to the X axis, and a coupling 64 (not shown in FIGS. 16A to 17, FIG. 5A ), And a rotary motor 68 connected via

The rotating portion 27 is rotatably attached to the shaft member 21, and a connecting member 28 made of a plate member extending in the X-axis direction is fixed to one end portion of the rotating portion 27. (in FIG. 16 (a) or the like, the plate member ₂₇ 2, 27 _3, are hidden on the far side of the plate member 27 _1.) shaped plate member _{27 1,} 27 2, 27 ₃ and a. Is + X side surface of the casing of the rotary motor 68 is fixed to a surface of the plate member 27 ₁ of the -X side, the rotation shaft of the rotary motor 68, the plate member 27 ₁ through the opening formed in the plate member 27 ₁ The tip is exposed on the + X side. One end (shaft portion 73 ₁ ) of the holding unit 72 is connected to the rotating shaft via a coupling 64. The two bearing members ₆₆ rotatably supporting the holding unit 72 1, 66 ₂ is inserted into the respective plate member ₂₇ 2, 27 rectangular opening formed in the _3, individually to the plate member ₂₇ 2, 27 ₃ It is fixed to. That is, in the wafer support unit 125 c, the two bearing members 66 ₁ and 66 ₂ and the rotation motor 68 are fixed to the rotating unit 27 in this way, and the holding unit 72 is driven by the driving force of the rotation motor 68. The rotating portion 27 is configured to be rotatable about an axis coaxial with the rotating shaft of the rotating motor 68.

  In the exposure apparatus according to the third embodiment, the configuration of other parts of the carry-in unit 121 other than the wafer support unit 125c and the chuck unit 153 ′ and the configuration of parts other than the carry-in unit 121 are the same as those in the first embodiment. It is the same as the exposure apparatus 100 according to the embodiment.

  In the exposure apparatus according to the third embodiment, in response to the difference in configuration described above, a part of the procedure for loading (loading) the wafer W onto the wafer stage WST is related to the first embodiment. Different from the exposure apparatus 100. Hereinafter, the difference will be described with reference to FIGS. As a premise, it is assumed that the chuck unit 153 ′ is moved to the vicinity of the movement upper limit position (+ Z side movement limit position) within the stroke range, that is, the first position described above, and is maintained at that position. At this time, in the three wafer support units 125c, the respective wafer support portions 74b are located at the separated positions, and the wafer W is transferred below the chuck unit 153 ′ by the transfer arm 149 (FIG. 16 (A)).

  In this state, main controller 20 moves each holding unit 72 to the separated position via rotation motor 68 provided in each of three wafer support units 125c, as indicated by black arrows in FIG. To the support position. In the third embodiment, since the rotating unit 27 that supports each wafer support unit 125c can rotate around the shaft member 21, each wafer support unit 125c is caused by the inertial force when each holding unit 72 rotates. Each rotating portion 27 (hereinafter simply referred to as each rotating portion 27, etc.) to which the wafer support unit 125c is attached is formed on the surface of the shaft member 21 as indicated by a white arrow in FIG. Inside, it turns slightly counterclockwise.

  Then, when the rotational drive by the rotary motor 68 of each wafer support unit 125c is stopped, each rotary unit 27 and the like is caused by the moment action due to its own weight, as shown by the white arrow in FIG. Rotate clockwise around the paper. Then, as shown in FIG. 17, when the wafer support unit 125c (suction unit 78) and the lower surface of the wafer W come into contact with each other, the main controller 20 uses the suction unit 78 in the same manner as in the first embodiment. The suction holding of the wafer W is started. Thereafter, the main controller 20 executes the same sequence as in the first embodiment described above.

  According to the exposure apparatus according to the third embodiment described above, the same effects as those of the exposure apparatus 100 according to the first embodiment described above can be obtained, and the wafer can be transported below the chuck unit 153 by the transport arm 149. Even when the outer edge portion of the wafer W is warped downward due to its own weight or the like, the three wafer support units 125c can reliably and stably support the wafer W from below.

  In the third embodiment, the rotating portion 27 is rotatably supported with respect to the shaft member 21. However, the present invention is not limited to this, and the shaft member 21 is fixed to the rotating portion 27, and the shaft member 21. May be supported by the support member 26 in a rotatable state via an air bearing or the like. Even in such a case, the operations of the wafer support unit 125c and the rotating unit 27 when the holding units 72 are driven from the separated position to the support position via the rotation motor 68 provided in each of the three wafer support units 125c. Is the same as in the third embodiment.

<< Fourth Embodiment >>
Next, an exposure apparatus according to the fourth embodiment will be described with reference to FIGS. In the exposure apparatus according to the fourth embodiment, a wafer support unit 125d shown in FIGS. 18 to 20 is provided in place of each of the three wafer support units 125 provided in the chuck unit 153 of the carry-in unit 121. . The configuration of other parts of the chuck unit 153, the other configuration of the carry-in unit 121, the configuration of parts other than the carry-in unit 121, and the like are the same as those of the exposure apparatus 100 according to the first embodiment described above. Therefore, hereinafter, differences from the exposure apparatus 100 will be described with the wafer support unit 125d as a center. Since the three wafer support units 125d have the same configuration except for different arrangements, the wafer support accommodated in the stepped opening 25 positioned in the −Y direction with respect to the center of the plate member 44 is described below. The unit 125d will be described as a representative example.

As can be seen from a comparison between FIG. 18 and FIG. 5A, in the wafer support unit 125d, instead of the rotary motor 68 described above, an air cylinder is used as a drive source for rotationally driving the holding unit 72 provided in the wafer support unit 125d. 168 is provided. One end of the shaft portion 73 ₂ of the holding unit 72 is connected to the motion converter 164 provided on the flat plate member 62.

  The air cylinder 168 has a cylinder part and a piston part that slides along the longitudinal direction of the cylinder part, and is in the Y-axis direction at a position near the −X side end of the −Y side end of the flat plate member 62. Is fixed through a base 169. The piston part is composed of a circular plate member whose outer peripheral surface is substantially in contact with the inner peripheral surface of the cylinder part, and one end (−Y side end) is fixed to the center part of one surface of the piston, and the longitudinal direction of the cylinder part ( And a piston rod 168a (see FIGS. 18, 19A, and 19B) extending in the Y-axis direction.

  One end of a tube 180 is connected to the bottom (−Y end) of the cylinder portion of the air cylinder 168, and the other end of the tube 180 is connected to a compressor 202 via a solenoid valve 201 (both in FIGS. 18 and 19). A) and FIG. 19B (not shown, see FIG. 21). The solenoid valve 201 has three ports, and two of the ports (for convenience, referred to as a first port and a second port) are alternatively opened and closed by a valve included in the solenoid valve 201. Since the remaining one doorway (hereinafter referred to as the third doorway) is not provided with a valve, it is always open.

  In a state where voltage is not applied to the solenoid included in 201 (hereinafter referred to as an off state), the valve closes the first doorway by the biasing force of a biasing member such as a spring. Therefore, the second doorway is normally open. On the other hand, when a voltage is applied to the solenoid included in the solenoid valve 201, the valve is driven against the urging force of a urging member such as a spring to close the second entrance and open the first entrance. . Hereinafter, a state in which a voltage is applied to the solenoid is referred to as an on state.

  The compressor 202 is connected to the first inlet / outlet of the solenoid valve 201 via an air supply tube (not shown), and the third inlet / outlet is connected to the air cylinder 168 via a tube 180 (see FIG. 18 etc.). Yes. The remaining second doorway is open to the atmosphere. Below, this 2nd entrance / exit is called an air release port.

  Therefore, when the compressor 202 is operated with the solenoid valve 201 turned on, the compressed air generated by the compressor 202 flows into the air supply tube, the internal space of the solenoid valve, and the cylinder portion of the air cylinder 168 via the tube 180. Supplied inside. On the other hand, when the solenoid valve 201 is in the OFF state, the internal space of the cylinder portion of the air cylinder 168 and the external space of the solenoid valve 201 are communicated with each other through the atmosphere opening. Therefore, in this state, as will be described later, when the piston portion of the air cylinder 168 is pressed to the −Y side by the elastic force of the compression spring, the air inside the cylinder portion is discharged to the outside from the atmosphere opening port.

  Since the three wafer support units 125d have the same configuration, each of the three wafer support units 125d includes an air cylinder 168, and three solenoid valves 201 individually connected to the air cylinders 168 are provided. However, these three solenoid valves 201 are connected to the same compressor 202 via air supply tubes (not shown), respectively.

The motion conversion unit 164 converts the linear motion of the piston portion of the air cylinder 168 into the rotational motion of the holding unit 72. The motion converting unit 164, as shown in simplified form in FIG. 19 (A), having a cam 165 which is integrally fixed to the outer peripheral portion of the shaft portion 73 _2, and a slide member 166 that engages the cam 165 Includes cam mechanism. Cam 165 has one end portion slightly smaller than the outer diameter of the shaft portion 73 ₂ (for example, about several microns smaller) diameter opening is formed in a state where the shaft portion 73 ₂ is inserted into the opening, the shaft portion 73 ₂ is integrated with. The shaft portion 73 ₂ and the cam 165, respectively keyway (not shown) are formed on opposite sides, the cam 165 to the shaft portion 73 ₂ via a key (not shown) to be fitted in these keyways attached It has been. At the other end of the cam 165, a U-shaped recess 165a is formed.

In the wafer support unit 125d, the slide member 166 is integrally provided at the tip of the piston rod 168a of the air cylinder 168. The slide member 166 is provided with a columnar convex portion 166a that engages with the U-shaped concave portion 165a of the cam 165 on one surface. Therefore, the sliding member 166, when driven in the longitudinal direction of the air cylinder 168 (Y-axis direction) in the piston portion integral with the cam 165, the central axis of the shaft portion 73 ₂ and the shaft portion 73 ₂ integrally ,Rotate. Thus, the holding unit 72 is rotated about the central axis of the shaft portion 73 ₂ and the shaft portion 73 _1.

  A cam mechanism including a cam 165 and a slide member 166 is housed in the housing 164a (see FIG. 18) of the motion conversion unit 164.

  In the wafer support unit 125d, as shown in FIGS. 19A and 19B, a support block 190 is provided at a position opposite to the air cylinder 168 across the motion conversion portion 164 on the upper surface of the flat plate member 62. It is fixed. Between the support block 190 and the slide member 166, the compression coil spring (compression spring) 192 which makes an expansion-contraction direction the Y-axis direction is arrange | positioned. One end of the compression spring 192 is connected to the surface on the −Y side of the support block 190, and the other end is inserted into a cylindrical convex portion provided on the + Y side end surface of the slide member 166.

  In the wafer support unit 125d, when the solenoid valve 201 is set to the on state and the compressor 202 is operated, the compressor 202 is added to the inside of the cylinder portion of the air cylinder 168 via the air supply tube, the solenoid valve 201, and the tube 180. When pressurized air is supplied and the pressure in the cylinder portion increases, the slide member 166 is driven in the + Y direction against the urging force of the compression spring 192. While the pressurized air continues to be supplied into the cylinder portion and the pressure rises, the slide member 166 is driven in the + Y direction, but a stopper member (not fixed) provided inside the housing 164a of the motion conversion portion 164 is used. It stops at the first movement limit position where the slide member 166 contacts (shown). After that, while the pressurized air is supplied, the slide member 166 is maintained in the state of being positioned at the first movement limit position. FIG. 19A shows a state in which the slide member 166 is positioned at the first movement limit position. In the state shown in FIG. 19A, the holding unit 72 is in the above-described separation position where the wafer support portion 74b and the wafer W are separated from each other.

On the other hand, in the wafer support unit 125d, when the slide member 166 is positioned at the first movement limit position, the solenoid valve 201 is switched from the on state to the off state, and the compressor 202 is stopped. The supply of pressurized air from 202 to the cylinder part is stopped, and the internal space of the cylinder part of the air cylinder 168 and the external space of the solenoid valve 201 are communicated with each other through the atmosphere opening port. As a result, as indicated by the white arrow in FIG. 19A, the slide member 166 and the piston portion of the air cylinder 168 are pressed to the −Y side by the elastic force of the compression spring 192, and the air inside the cylinder portion is Is discharged to the outside from the air opening of the solenoid valve 201. The slide member 166 stops at a second movement limit position where the slide member 166 abuts against a stopper member (not shown) provided inside the housing 164a of the motion conversion unit 164. By movement in the -Y side of the piston portion of the slide member 166 and the air cylinder 168, the holding unit 72, FIG illustrated in FIG. 19 (A), the shaft portion ₇₃ 1, 73 ₂ from the spaced position of the above as a rotary shaft As shown by a black arrow in FIG. 19A, the wafer rotates 90 degrees clockwise in the drawing, and the wafer W shown in FIG. It is positioned at the aforementioned support position. That is, the second movement limit position of the slide member 166 corresponds to the support position of the holding unit 72.

  As described above, in the wafer support unit 125d, the holding unit 72 is shown in FIG. 19A by the air cylinder 168, the motion conversion unit 164, and the compression spring 192, and in FIG. 19B. It is rotationally driven between the support positions.

Further, in the wafer support unit 125d, as shown in FIG. 20, the bearing members 66 ₁ and 66 ₂ are provided with heaters 300. Since between the bearing member 66 ₁ and the shaft portion 73 _1, and between the bearing member 66 ₂ and the shaft portion 73 _2, respectively hydrostatic air bearings (air bearings) are formed, the gas supply device 102 and the gas The compressed air supplied from the supply device 106 and ejected from the porous members 82 and 85 toward the shaft portions 73 ₁ and 73 ₂ , respectively, adiabatically expands and thereby the shaft portions 73 ₁ and 73 ₂ and the shaft portion 73. _1, in some cases 73 to lower the temperature of the ₂ connected to the holding portion 74 (that is, the holding unit 72). In the present embodiment, the temperature is adjusted by heating the shaft portions 73 ₁ and 73 ₂ with the heater 300, and the temperature of the holding portion 74 is prevented from decreasing beyond a predetermined allowable value, for example. Can do. Note that the mechanism for adjusting the temperature of the holding portion 74 is not limited to the heater. In the present embodiment, the heater is heated to reduce the temperature of the holding unit 74. However, when the temperature of the holding unit 74 rises, the holding unit is cooled by a cooling device such as a Peltier element. You may make it do.

  In the wafer support unit 125d, the magnet 61 and the magnetic body 76 are not provided, unlike the wafer support unit 125 described above, because the rotational drive unit of the holding unit 72 is configured as described above.

  The other configuration of the wafer support unit 125d is the same as that of the wafer support unit 125.

  The above-described operation and stop of the compressor 202 and switching setting of the three solenoid valves 201 between the on state and the off state are performed by the main controller 50 (see FIG. 21).

  In the exposure apparatus according to the fourth embodiment configured as described above, an effect equivalent to that of the first embodiment described above can be obtained. In addition, in the three wafer support units 125d, the air cylinder 168 has a force. The wafer support state can be maintained in a state in which no occurs. In addition, it is possible to prevent the temperature of the holding unit 72 from falling beyond an allowable value.

  The first, second, third, and fourth embodiments described above and modifications of the second embodiment (hereinafter referred to as the above-described embodiments) are arbitrarily selected as long as the configurations do not contradict each other. You may employ in combination.

  In each of the above embodiments, the reflecting mirror 79 is provided on the wafer support 74b. However, the present invention is not limited to this, and a light guide plate may be provided. In this case, instead of the epi-illumination measurement system 123, for example, a measurement system that irradiates measurement light in a direction parallel to a horizontal plane can be employed. Further, the wafer support 74b is not limited to vacuum chucking, and may hold the wafer by electrostatic chucking or may hold the wafer using frictional force.

  In each of the above embodiments, the case where the exposure apparatus is a dry type exposure apparatus that exposes the wafer W without using liquid (water) is described. However, the present invention is not limited thereto, and the optical system and the liquid are used. Of course, the above-described embodiments may be applied to an immersion type exposure apparatus that exposes a wafer via the above.

  In each of the above embodiments, the case where the alignment detection system ALG and the multipoint AF system are provided in the vicinity of the projection optical system has been described. However, the present invention is not limited to this, and for example, the exposure station provided with the projection optical system and the alignment detection system The carry-in unit according to each of the above embodiments may be provided in or near the measurement station where the ALG and the multipoint AF system are provided. In this case, as disclosed in, for example, US Patent Application Publication No. 2008/0088843, a measurement stage provided with various measurement members in addition to the wafer stage is provided, and between the wafer stage and the measurement stage. The immersion area may be transferred. In this case, another wafer stage may be provided instead of the measurement stage. In this way, it is possible to perform parallel processing of exposure processing on a wafer on one wafer stage and predetermined measurement processing such as alignment measurement using the other wafer stage. The exposure apparatus including a wafer stage and a measurement stage or two wafer stages may be a dry type exposure apparatus.

  In each of the above embodiments, the case where the exposure apparatus is a scanning stepper has been described. However, the present invention is not limited to this, and the above embodiment may be applied to a stationary exposure apparatus such as a stepper. Each of the above embodiments can also be applied to a step-and-stitch reduction projection exposure apparatus that synthesizes a shot area and a shot area.

  In addition, the projection optical system of the projection exposure apparatus of each of the above embodiments may be not only a reduction system but also an equal magnification and an enlargement system, and the projection optical system is not only a refraction system but also a reflection system or a catadioptric system. The projected image may be either an inverted image or an erect image.

The illumination light IL is not limited to ArF excimer laser light (wavelength 193 nm), but may be ultraviolet light such as KrF excimer laser light (wavelength 248 nm) or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). good. For example, as disclosed in US Pat. No. 7,023,610, single-wavelength laser light in the infrared region or visible region oscillated from a DFB semiconductor laser or fiber laser is used as vacuum ultraviolet light, for example, erbium. A harmonic which is amplified by a fiber amplifier doped with (or both erbium and ytterbium) and wavelength-converted into ultraviolet light using a nonlinear optical crystal may be used.

  In each of the above embodiments, the illumination light IL of the exposure apparatus is not limited to light with a wavelength of 100 nm or more, and it is needless to say that light with a wavelength of less than 100 nm may be used. For example, the above embodiment can be applied to an EUV exposure apparatus that uses EUV (Extreme Ultraviolet) light in a soft X-ray region (for example, a wavelength region of 5 to 15 nm). In addition, the above embodiments can also be applied to an exposure apparatus that uses charged particle beams such as an electron beam or an ion beam.

  In each of the above embodiments, a light transmissive mask (reticle) in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate is used. Instead of this reticle, For example, as disclosed in US Pat. No. 6,778,257, an electronic mask (variable shaping mask, which forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed, as disclosed in US Pat. No. 6,778,257. For example, a non-light emitting image display element (spatial light modulator) including a DMD (Digital Micro-mirror Device) may be used.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that forms a line-and-space pattern on a wafer W by forming interference fringes on the wafer W. Also, the above embodiments can be applied.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two reticle patterns are synthesized on a wafer via a projection optical system, and 1 on the wafer by one scan exposure. The above embodiments can also be applied to an exposure apparatus that performs double exposure of two shot areas almost simultaneously.

  Note that the object on which a pattern is to be formed (the object to be exposed to the energy beam) in each of the above embodiments is not limited to the wafer, but other objects such as a glass plate, a ceramic substrate, a film member, or a mask blank. But it ’s okay.

  The use of the exposure apparatus is not limited to the exposure apparatus for semiconductor manufacturing, but for example, an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, an organic EL, a thin film magnetic head, an image sensor (CCD, etc.), micromachines, DNA chips and the like can also be widely applied to exposure apparatuses. Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates or silicon wafers, etc. The embodiments described above can also be applied to an exposure apparatus that transfers a circuit pattern.

  An electronic device such as a semiconductor element includes a step of designing a function / performance of a device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and an exposure apparatus (pattern) according to each of the above-described embodiments. Forming apparatus) and a lithography step for transferring a mask (reticle) pattern to the wafer by the exposure method, a developing step for developing the exposed wafer, and etching for removing exposed members other than the portions where the resist remains by etching. It is manufactured through a step, a resist removal step that removes a resist that has become unnecessary after etching, a device assembly step (including a dicing process, a bonding process, and a packaging process), an inspection step, and the like. In this case, in the lithography step, the exposure method described above is executed using the exposure apparatus of each of the above embodiments, and a device pattern is formed on the wafer. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the holding device and the object support device of the present invention are suitable for temporarily supporting a plate-shaped object before loading it on a moving body. The exposure apparatus of the present invention is suitable for exposing a plate-like object with an energy beam. The device manufacturing method of the present invention is suitable for manufacturing a micro device.

20 ... main control unit, 21 ... shaft member, 27 ... rotary unit, 32 ... air cylinder, 35 ... grinding wheel, 36 ... compression spring, 61 ... magnet, ₆₆ 1, 66 2 _... bearing member, 68 ... rotary motor, 72 ... Holding unit, 73 ₁ , 73 ₂ ... Shaft portion, 78... Adsorbing portion, 74... Holding portion, 81 ₁ .. Pipe line, 81 ₂ ... Pipe line, 81 ₃ ... Pipe line, 84. DESCRIPTION OF SYMBOLS ... Pipe line, 100 ... Exposure apparatus, 101 ... Absolute encoder, 102 ... Gas supply apparatus, 104 ... Vacuum pump, 106 ... Gas supply apparatus, 125 ... Wafer support unit, 76 ... Magnetic body, 121 ... Loading unit, IL ... Illumination Light, W ... wafer, WST ... wafer stage.

Claims (15)

A holding device for holding a plate-like object from below,
A bearing member;
A first position including a shaft portion extending in one axial direction and a holding portion provided on the shaft portion and having a suction portion formed thereon, wherein a part of the holding portion including the suction portion comes into contact with the object from below; A holding unit supported by the bearing member via the shaft so that the holding portion can rotate within a predetermined angular range including a second position separated from the object;
A driving device that is connected to the shaft portion of the holding unit and that rotates the holding unit around the one axis between the first position and the second position;
A holding device.   2. The holding device according to claim 1, wherein the shaft portion extends in a second direction intersecting a first direction along a thickness direction of the object in the state where the holding is performed.   The holding unit communicates with an opening provided in the suction portion when the holding unit is in the first position, and forms a negative pressure space that does not communicate with the opening when the holding unit is in the second position. The holding device according to claim 2.   The said opening is formed in the said axial part, The holding | maintenance of Claim 3 electrically connected to the pipe line connected to an evacuation apparatus via the said bearing member when the said holding unit exists in the said 1st position. apparatus.   5. The gas supply pipe according to claim 1, wherein the bearing member is provided with a gas supply pipe having one end opened to face the shaft portion and the other end connected to a pressurized gas supply device. The holding device as described.   The holding device according to claim 5, further comprising an adjustment mechanism for adjusting a temperature of the holding unit. A measurement system for measuring the rotation state of the holding unit;
The holding device according to any one of claims 1 to 6, further comprising a control device that controls the driving device using a measurement result of the measurement system. An object support device for supporting a plate-like object from below,
A plurality of holding devices according to any one of claims 1 to 6 are provided corresponding to different positions of the outer peripheral portion of the object, and both of the holding units of the plurality of holding devices are the first. An object support device in which the object is contact-supported from below by the plurality of holding devices when in position.   Each of the plurality of holding devices includes a cleaning member that is movable in the uniaxial direction while being in contact with the suction portion when the holding unit is located at the second position, and driving the cleaning member in the uniaxial direction. The object support device according to claim 8, further comprising a cleaning member driving device. Each of the plurality of holding devices includes a fixing member that can be driven in a predetermined stroke in the uniaxial direction, an urging member that urges the fixing member to one side in the uniaxial direction, and a position that is separated from the holding portion. A fixing member driving device that drives the fixing member to the other side in the uniaxial direction against the urging force of the urging member;
When the supply of utility force to the fixing member driving device stops when the holding unit is located at the first position, the attachment unit moves from a position away from the holding portion to a position where the fixing member contacts the holding portion. The object support device according to claim 8, which is driven by the urging force of the urging member.   When the holding unit included in each of the plurality of holding devices is located at the second position, when the supply of the working force to the fixing member driving device stops, the fixing member moves in the other direction of the holding portion in the uniaxial direction. The object support device according to claim 10, wherein the object support device is driven by an urging force of the urging member on one side in the uniaxial direction from a position positioned on the side to a position passing through the suction portion.   The fixing member includes a cleaning member, and the cleaning member attaches the biasing member to one side in the uniaxial direction from a position located on the other side in the uniaxial direction of the holding portion to a position passing through the suction portion. The object support device according to claim 11, which is driven by a force. A rotation unit provided corresponding to each of the plurality of holding devices, and further rotatable around another axis parallel to the rotation axis of each holding unit;
The object holding device according to claim 8, wherein each holding unit is supported by the corresponding rotating portion via the bearing member. An exposure apparatus that exposes a plate-like object with an energy beam,
The object support device according to any one of claims 8 to 13, which supports the object from below.
A movable body that is movable along a predetermined plane and provided with an object placement surface on which the object is placed;
An exposure apparatus that is supported by the object support device before the object before exposure is placed on the object placement surface. Exposing an object using the exposure apparatus of claim 14;
Developing the exposed object.

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