CN107247388A - Exposure device, device inspection apparatus and device making method - Google Patents

Exposure device, device inspection apparatus and device making method Download PDF

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Publication number
CN107247388A
CN107247388A CN201710421666.8A CN201710421666A CN107247388A CN 107247388 A CN107247388 A CN 107247388A CN 201710421666 A CN201710421666 A CN 201710421666A CN 107247388 A CN107247388 A CN 107247388A
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China
Prior art keywords
light
substrate
projected
optical system
projection
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Granted
Application number
CN201710421666.8A
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Chinese (zh)
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CN107247388B (en
Inventor
加藤正纪
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Microscoopes, Condenser (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

A kind of exposure device, device inspection apparatus and device making method.Have：Projection optical system (PL), make the imaging of the 1st projected light beam (EL2a) from light shield (M) and form intermediary image, make the 2nd projected light beam (EL2b) of the intermediate image plane (P7) for carrying out self-forming intermediary image on substrate (P) reimaging and form projection image；Light quantity reduction portion, the light quantity for the leak light being projected on substrate (P) that will be produced from the 1st projected light (EL2a) is reduced, and projection optical system (PL) has：Partial optical system (61), is imaged the 1st projected light (EL2a) from light shield (M) and is projected to intermediate image plane (P7)；Reflective optics (62), the 1st projected light (EL2a) that will be projected from partial optical system (61) is guided to intermediate image plane (P7), and guide the 2nd projected light (EL2b) from intermediate image plane (P7) to partial optical system (61), partial optical system (61) makes the 2nd projected light (EL2b) reimaging from intermediate image plane (P2) and forms projection image on substrate (P).

Description

Exposure device, device inspection apparatus and device making method
The present patent application be international filing date be on November 29th, 2013, international application no be PCT/JP2013/082185, National applications number into National Phase in China is 201380066736.2, entitled " substrate board treatment, device manufacture The divisional application of the patent application of system and device making method ".
Technical field
The present invention relates to substrate board treatment, device inspection apparatus and device making method.
Background technology
In the past, as substrate board treatment, it is known that be configured with projection optical system between light shield and plate (substrate) Exposure device (for example, referring to patent document 1).The projection optical system includes lens group, plane mirror, two polarised lights point The wave plate of beam device, two speculums, λ/4 and field stop and constitute.In the exposure device, projected light is exposed to via light shield The projected light of the S-polarization light of system is reflected by the polarising beam splitter of a side.The projected light of the S-polarization light reflected is from λ/4 Wave plate passes through so as to be converted to circularly polarized light.The projected light of circularly polarized light reflexes to plane mirror by lens group.It is anti- The projected light for the circularly polarized light penetrated passes through to be converted to P polarization light from the wave plate of λ/4.The projected light of P polarization light is from the opposing party's Polarising beam splitter is passed through, and is reflected by the speculum of a side.The projected light of the P polarization light reflected by the speculum of a side is in visual field Intermediary image is formed in diaphragm.The projected light of the P polarization light passed through from field stop is reflected by the speculum of the opposing party, incident again To the polarising beam splitter of a side.The projected light of P polarization light is passed through from the polarising beam splitter of a side.P polarization light through after Projected light pass through to be converted to circularly polarized light from the wave plate of λ/4.The projected light of circularly polarized light passes through from lens group, and by plane Speculum reflects.The projected light of the circularly polarized light reflected passes through to be converted to S-polarization light from the wave plate of λ/4.The throwing of S-polarization light Shadow light is reflected and reached on plate by the polarising beam splitter of the opposing party.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 8-64501 publications
The content of the invention
Here, a part for the projected light for reflecting and passing through in polarising beam splitter turns into leak light.That is, in polarised light point The part separation of the projected light reflected in beam device, the part of the projected light of separation turn into leak light and from polarising beam splitter Through, or the projected light passed through in polarising beam splitter part separation, the part of the projected light of separation turns into leakage Light, is reflected by polarising beam splitter.In this case, have leak light to be imaged on substrate, so as to be formed not on substrate The possibility of good picture.In this case, on substrate, projection image is formed by projected light, is formed not by leak light Good picture, so having the possibility as double exposure.
The solution of the present invention be in view of above-mentioned problem and complete, its object is to there is provided a kind of substrate board treatment, device Part manufacture system and device making method, can reduce leak light to the influence for the projection image being formed on substrate, and will projection As being suitably projected on substrate.
According to the 1st mode of the present invention there is provided a kind of substrate board treatment, have：Projection optical system, its by from 1st projected light of the pattern of light shield part and the intermediary image that the pattern is formed in defined intermediate image plane, so that from described The 2nd projected light that intermediate image plane is advanced to defined substrate is turned back from the projection optical system by way of again, so that The projection image of the intermediary image reimaging is formed on the substrate；And light quantity reduction portion, it is by the one of the 1st projected light The light quantity that part is projected to as leak light on the substrate is reduced, and the projection optical system has：Incidence is from described The 1st projected light of pattern and the partial optical system for forming the intermediary image；And guide-lighting optical system, it will be from described The 1st projected light that partial optical system is projected is guided to the intermediate image plane, and by from described in the intermediate image plane 2nd projected light is redirected to the partial optical system, and the partial optical system makes from described in the intermediate image plane 2nd projected light reimaging, and the projection image is formed on the substrate.
In aforesaid way or, the partial optical system is included：Thrown for the 1st projected light and the described 2nd The incident lenticular unit of shadow light, and the 1st projected light and the 2nd projected light that have passed through the lenticular unit are reflected Reflection optics, the 1st projected light from the pattern is incident to the lenticular unit, by the reflection optics After reflection, projected from the lenticular unit, and reach the intermediate image plane, the 2nd projected light from the intermediate image plane The lenticular unit is incident to, after reflection optics reflection, is projected from the lenticular unit, and reach the substrate On, the light quantity reduction portion is the guide-lighting optical system, and the light quantity reduction portion is included：Make described from the pattern 1 projected light is incident to the 1st optical component of the lenticular unit；Make to enter from the 1st projected light that the lenticular unit is projected It is incident upon the 2nd optical component of the intermediate image plane；The 2nd projected light from the intermediate image plane is set to be incident to the lens 3rd optical component of part；Make the 4th light being incident to from the 2nd projected light that the lenticular unit is projected on the substrate Department of the Chinese Academy of Sciences's part, the light quantity reduction portion makes the 1st incident visual field of the 1st projected light for being incident to the lenticular unit, from described 1st outgoing visual field of the 1st projected light that lenticular unit is projected, the 2nd projected light for being incident to the lenticular unit 2nd incident visual field, the 2nd outgoing visual field of the 2nd projected light projected from the lenticular unit are separated from each other.
In aforesaid way or, the light quantity reduction portion make by formed by the 2nd projected light it is described throw The image space of image is different with the image space of bad picture formed by a part of leak light by the 1st projected light.
In aforesaid way or, the partial optical system is included：Thrown for the 1st projected light and the described 2nd The incident lenticular unit of shadow light, and the 1st projected light and the 2nd projected light that have passed through the lenticular unit are reflected Reflection optics, the 1st projected light from the pattern is incident to the lenticular unit, by the reflection optics After reflection, projected from the lenticular unit, and reach the intermediate image plane, the 2nd projected light from the intermediate image plane The lenticular unit is incident to, after reflection optics reflection, is projected from the lenticular unit, and reach the substrate On, the light quantity reduction portion is the guide-lighting optical system, and the light quantity reduction portion is included：1st polarising beam splitter, the 1st Polarising beam splitter makes the 1st projected light from the pattern reflect and be incident to the lenticular unit, and makes to come from institute The 2nd projected light for stating intermediate image plane passes through and is incident to the lenticular unit；Wave plate, the wave plate makes from the described 1st polarization The 1st projected light and the 2nd projection light polarization that beam splitter is projected；2nd polarising beam splitter, the 2nd polarised light point Beam device makes to project from the lenticular unit and is passed through by the 1st projected light of the wave plate and be incident to the intermediary image Face, and make to project from the lenticular unit and by the reflection of the 2nd projected light of the wave plate towards the substrate on； 1st optical component, it is described that the 1st optical component is incident to the 1st projected light for having passed through the 2nd polarising beam splitter Intermediate image plane；2nd optical component, it is described that the 2nd optical component is incident to the 2nd projected light from the intermediate image plane 1st polarising beam splitter；And the 1st shadow shield, the 1st shadow shield located at the 2nd polarising beam splitter and the substrate it Between, the light quantity reduction portion makes by being formed by the 2nd projected light that the 2nd polarising beam splitter reflects in the base The image space of the image space of the projection image on plate and the bad picture is on the scanning direction for making the substrate scanning Difference, it is described it is bad seem by not from the 2nd polarising beam splitter through and reflected by the 2nd polarising beam splitter A part of leak light of 1st projected light and form picture on the substrate, the 1st shadow shield is located at will be from described the The position that the leak light of 2 polarising beam splitters towards the substrate is blocked.
In aforesaid way or, the light quantity reduction portion also include the 2nd shadow shield, the 2nd shadow shield block from The leak light of 1st polarising beam splitter towards the 2nd polarising beam splitter.
In aforesaid way or, the partial optical system is included：Thrown for the 1st projected light and the described 2nd The incident lenticular unit of shadow light, and the 1st projected light and the 2nd projected light that have passed through the lenticular unit are reflected Reflection optics, the 1st projected light from the pattern is incident to the lenticular unit, by the reflection optics After reflection, projected from the lenticular unit, and reach the intermediate image plane, the 2nd projected light from the intermediate image plane The lenticular unit is incident to, after reflection optics reflection, is projected from the lenticular unit, and reach the substrate On, the light quantity reduction portion is the guide-lighting optical system, and the light quantity reduction portion is included：1st polarising beam splitter, the 1st Polarising beam splitter makes the 1st projected light from the pattern reflect and be incident to the lenticular unit, and makes to come from institute The 2nd projected light for stating intermediate image plane passes through and is incident to the lenticular unit；Wave plate, the wave plate makes from the described 1st polarization The 1st projected light and the 2nd projection light polarization that beam splitter is projected；2nd polarising beam splitter, the 2nd polarised light point Beam device makes to project from the lenticular unit and is passed through by the 1st projected light of the wave plate and be incident to the intermediary image Face, and make to project from the lenticular unit and by the reflection of the 2nd projected light of the wave plate towards the substrate on； 1st optical component, it is described that the 1st optical component is incident to the 1st projected light for having passed through the 2nd polarising beam splitter Intermediate image plane；And the 2nd optical component, the 2nd optical component is incident to the 2nd projected light from the intermediate image plane 1st polarising beam splitter, the light quantity reduction portion is projected by the reflected by the 2nd polarising beam splitter the described 2nd Light and form the image space of the projection image on the substrate and the image space of the bad picture in the depth of focus It is different on direction, it is described it is bad seem by not from the 2nd polarising beam splitter through and by the 2nd polarising beam splitter The picture that a part of leak light of the 1st projected light of reflection is formed.
In aforesaid way or, from the pattern to the 1st projected light of the 1st polarising beam splitter Optical path length of the light path than the 1st projected light from the 2nd polarising beam splitter to the intermediate image plane.
In aforesaid way or, the substrate is scanned relative to the projection image, and the projection image is limited Length ratio in width of the length with being orthogonal to the scanning direction for the scanning direction for making substrate scanning, sweep The length for retouching the length/width direction in direction is less than 1/4 such elongated region.
In aforesaid way or, also with the lamp optical system for guiding illumination light to the light shield part, The illumination light is laser.
In aforesaid way or, also with the light shield holding member for keeping the light shield part and pass through supporting The substrate supporting part of substrate described in surface bearing, the pattern plane of the light shield part has turns into the 1st song centered on the 1st axle 1st periphery of rate radius, the bearing-surface of the substrate supporting part has turns into the 2nd curvature centered on the 2nd axle 2nd periphery of radius, the 1st axle is parallel with the 2nd axle, and the projection optical system is with being configured at the pattern plane Multiple illumination regions be correspondingly provided with it is multiple, multiple projection optical systems by from the pattern plane it is multiple it is described shine Multiple 1st projected lights in area pellucida domain are guided to multiple intermediate image planes, by from the multiple of multiple intermediate image planes 2nd projected light is guided to configuration multiple view fields on the substrate, in multiple projection optical systems along institute The circumference for stating light shield part is configured to view field's phase of substrate described in 2 row and each projection optical system side by side For the pattern plane the illumination region in the case of circumferential offset, the light shield holding member and the substrate supporting In part, the 2nd axle turns into the view field relative to the illumination region in week relative to the position of the 1st axle Upward offset correspondingly different position, by the illumination region corresponding with the 1st row projection optical system The circumference centrally along the light shield part of the heart and the illumination region corresponding with the 2nd row projection optical system links The girth come, with arranging the projection by the center of the view field corresponding with the 1st row projection optical system and with the 2nd The Zhou Changwei identical length linked up centrally along the circumference of the substrate of the corresponding view field of optical system.
According to the 2nd mode of the present invention there is provided a kind of device inspection apparatus, have：At the substrate of the 1st mode of the present invention Manage device；The substrate feeding device of aforesaid substrate is supplied to aforesaid substrate processing unit.
According to the 3rd mode of the present invention there is provided a kind of device making method, comprising：Use the base of the 1st mode of the present invention Plate processing unit carries out projection exposure to aforesaid substrate；Above-mentioned light shield portion is formed through the aforesaid substrate of projection exposure by handling The pattern of part.
According to the 4th mode of the present invention there is provided a kind of substrate board treatment, by the visual field area of the slit-shaped on object plane The light beam projecting of pattern in domain, which is exposed to, to be exposed on body, and the substrate board treatment has：Projection optical system, it is included Make the incident imaging lens group of the light beam of the pattern in the field of view and be configured at the light of the imaging lens group Pupil face or the speculum of pupil plane neighbouring position, by the speculum make the light beam from the field of view towards it is described into As being reflected with lens group, the image planes being conjugated with the field of view are formed in the object plane side；And folding mirrors, it is by institute State the benchmark that field of view configuration intersects on edge comprising the object plane or the image planes and with the optical axis of the projection optical system 1st position in face, make the intermediary image of the slit-shaped of the field of view that is initially imaged by the projection optical system on Configured along the reference plane from width that the long side direction of the slit intersects the different with the 1st position the 2nd Position, makes the light beam of the generation intermediary image with from the width on the slit along the reference plane and the described 1st Any one of position and the 2nd position all different the 3rd positions are and towards by way of the projection optical system is turned back Reflection, the projection image being optically conjugated with the intermediary image by projection optical system formation.
In aforesaid way or, the projection optical system is included：1st reflection part, the 1st reflection part The 1st light beam of the pattern in the field of view of the slit-shaped on the object plane is set to reflect and be incident to the imaging and use Lens group；2nd reflection part, the 2nd reflection part makes to project from the projection optical system to generate the projection image The 2nd light beam be exposed reflection on body towards described, the reflecting part of the 1st light beam of the 1st reflection part and described The reflecting part of the 2nd light beam of 2nd reflection part on the width along the slit of the reference plane discretely Configuration.
In aforesaid way or, the folding mirrors have：3rd reflecting part, the 3rd reflecting part is for life Make to reflect on the direction along the reference plane from the light beam that the projection optical system is projected into the intermediary image；4th is anti- Portion is penetrated, the 4th reflecting part makes to be reflected towards the projection optical system by the light beam that the 3rd reflecting part reflects, the described 3rd Either one of reflecting part and the 4th reflecting part along the direction of the reference plane on being configured at the 1st reflection part Between reflecting part and the reflecting part of the 2nd reflection part.
In aforesaid way or, make each reflecting part of the 1st reflection part and the 2nd reflection part Position and the 3rd reflecting part of the folding mirrors and each position of the 4th reflecting part on the projection optics The direction of the optical axis of system is different.
In aforesaid way or, the reflecting part of the 1st reflection part, the reflection of the 2nd reflection part Partly and the 3rd reflecting part of the folding mirrors and the 4th reflecting part be all formed as with described in the slit-shaped The such rectangle of field of view correspondence, and match somebody with somebody separated from each other on the width of the slit along the reference plane Put.
In aforesaid way or, the 1st reflection part and the 2nd reflection part are by polarising beam splitter Constitute.
Invention effect
According to the mode of the present invention there is provided substrate board treatment, device inspection apparatus and device making method, it can reduce The light quantity for the leak light being projected on substrate, makes projection image suitably project on substrate.
Brief description of the drawings
Fig. 1 is the figure of the composition for the device inspection apparatus for representing the 1st embodiment.
Fig. 2 is the figure being monolithically fabricated for the exposure device (substrate board treatment) for representing the 1st embodiment.
Fig. 3 is the figure of the configuration for the illumination region and view field for representing the exposure device shown in Fig. 2.
Fig. 4 is the figure of the composition of the lamp optical system and projection optical system that represent the exposure device shown in Fig. 2.
Fig. 5 is the figure for deploying the circular full imaging viewing field based on Projection optics on YZ faces.
Fig. 6 is the flow chart for the device making method for representing the 1st embodiment.
Fig. 7 be the exposure device for representing the 2nd embodiment lamp optical system and projection optical system composition figure.
Fig. 8 is the figure of the composition of the projection optical system for the exposure device for representing the 3rd embodiment.
Fig. 9 is the figure being monolithically fabricated for the exposure device (substrate board treatment) for representing the 4th embodiment.
Embodiment
The mode (embodiment) for implementing the present invention is described in detail referring to the drawings.The present invention is not by following Embodiment described in content limit.In addition, the inscape recorded below can be easy comprising those skilled in the art The key element and substantially the same key element expected.Moreover, following described inscape can be appropriately combined.In addition, not Various inscapes can be omitted, replace or change in the range of disengaging present inventive concept.
[the 1st embodiment]
The substrate board treatment of 1st embodiment is the exposure device for implementing exposure-processed to substrate, and exposure device is by group Substrate after to exposure is implemented various processing and manufactured in the device inspection apparatus of device.First, to device inspection apparatus Illustrate.
＜ device inspection apparatus ＞
Fig. 1 is the figure of the composition for the device inspection apparatus for representing the 1st embodiment.Device inspection apparatus 1 shown in Fig. 1 is Manufacture the production line (flexible display production line) of the flexible display as device.It is as flexible display, such as organic EL display etc..The device inspection apparatus 1 is to send out the substrate from flexible substrate P being wound into the supply of roll with roller FR1 P, and the substrate P of submitting is continuously implemented after various processing, the substrate P after processing is wound in as with flexible device Reclaim with roller FR2, so-called volume to volume (Roll to Roll) mode.In the device inspection apparatus 1 of the 1st embodiment, show Go out the substrate P as the sheet material of film-form to be sent out from supply roller FR1, and the substrate P sent out from supply with roller FR1 is successively By n platform processing units U1, U2, U3, U4, U5 ... examples of the Un untill recovery roller FR2 is wound in.First, to making Substrate P for the process object of device inspection apparatus 1 is illustrated.
Substrate P is such as paper tinsel (foil) formed using resin film, the metal or alloy as stainless steel etc..It is thin as resin The material of film, such as comprising polyvinyl resin, acrylic resin, polyester resin, ethylene-vinyl alcohol copolymer resin, polyvinyl chloride Resin, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate It is more than one or both of resin.
Preferably, substrate P for example selectes the less notable big material of thermal coefficient of expansion, actually neglect The deflection for being heated and producing in the various processing that apparent is implemented to substrate P.Thermal coefficient of expansion for example can be by filling out by inorganic Material is mixed in resin film and is set as smaller than threshold value corresponding with technological temperature etc..Inorganic filler for example can be oxidation Titanium, zinc oxide, aluminum oxide, silica etc..In addition, it by the thickness of the manufactures such as float method is 100 μm or so that substrate P, which can be, The individual layers of very thin glass or the layered product that above-mentioned resin film, paper tinsel etc. are pasted on the very thin glass.
The substrate P so constituted, is wound into roll into roller FR1 for the supply, the supply is installed in device with roller FR1 Part manufacture system 1.Supply roller FR1 device inspection apparatus 1 is installed, the substrate P sent out from supply roller FR1 is repeated to hold Row is used for the various processing for manufacturing device.Therefore, the substrate P after processing turns into the state that multiple devices are connected.That is, from The substrate P that supply is sent out with roller FR1 turns into the substrate of more than one piece processing simultaneously.In addition, substrate P can be beforehand through defined The part that pre-treatment is modified to its surface and activates it, or or be formed with the surface for precision The part of the fine next door construction (sag and swell) of patterning.
Substrate P after processing is wound into roll, so as to be recovered as recovery roller FR2.Reclaim and installed with roller FR2 In cutter device (not shown).Recovery roller FR2 cutter device is installed by the substrate P after processing by each Device singulation (cutting) is so as to as multiple devices.The size of substrate P is, for example, that the size of width (direction for turning into short side) is 10cm ~2m or so, the size of length direction (direction for turning into long side) is more than 10m.In addition, the size of substrate P be not limited to it is above-mentioned Size.
Next, reference picture 1, is illustrated to device inspection apparatus.In Fig. 1, X-direction, Y-direction and Z-direction is just The rectangular coordinate system of friendship.X-direction is the direction in the horizontal plane linking supply roller FR1 and recovery roller FR2.Y-direction is The direction orthogonal with X-direction in the horizontal plane.Y-direction is supplied with the direction of principal axis with roller FR1 and recovery roller FR2.Z-direction be with X-direction and the orthogonal direction of Y-direction (vertical).
Device inspection apparatus 1 possess supplying substrate P substrate feeding device 2, to by substrate feeding device 2 supply Lai base Plate P implements processing unit U1~Un of various processing, the substrate P that processing is implemented by processing unit U1~Un is reclaimed The host control device 5 that substrate retracting device 4 and each device to device inspection apparatus 1 are controlled.
Supply roller FR1 can be rotatably installed in substrate feeding device 2.Substrate feeding device 2 has from installation The marginal position of the position on the driven roller R1 of substrate P and the width (Y-direction) for adjusting substrate P is sent out in supply with roller FR1 Controller EPC1.Driven roller R1 clamps the table back of the body two sides of substrate P while rotating, and substrate P is returned from supply with roller FR1 directions Receive and sent out with roller FR2 conveyance direction, thus supply substrate P to processing unit U1~Un.At this moment, marginal position controller EPC1, to cause substrate P to be located at ± more than ten μm~tens μ relative to target location in the position of the end (edge) of width Mode in the range of m or so makes substrate P move in the direction of the width, so as to correct the position on the width of substrate P.
Recovery roller FR2 can be rotatably installed on substrate retracting device 4.Substrate retracting device 4 has will processing Substrate P afterwards pulls to the side of the driven roller R2 of recovery roller FR2 sides and the position on the width (Y-direction) for adjusting substrate P Edge positioner EPC2.Substrate retracting device 4 carries on the back two sides while rotating by the driven roller R2 tables for clamping substrate P, will Substrate P pulls to conveyance direction and rotates recovery roller FR2, thus winds substrate P.At this moment, marginal position controller EPC2 Constituted in the same manner as marginal position controller EPC1, correct the position on the width of substrate P, in order to avoid the width side of substrate P To end (edge) produce inequality in the direction of the width.
Processing unit U1 is that photonasty functional liquid is coated on to the surface that the substrate P come is supplied from substrate feeding device 2 Applying device.As photonasty functional liquid, for example, resist, photonasty silane coupling agent material, UV solidified resin liquid can be used, Solution of other photonasty plating catalysis etc..Processing unit U1 is sequentially provided with since the upstream side of the conveyance direction of substrate P Applying mechanism Gp1 and drier Gp2.Applying mechanism Gp1 have make substrate P wind roller platen DR1 and with roller platen DR1 Relative application roll DR2.Applying mechanism Gp1 is wound in the substrate P being supplied in the state of roller platen DR1, passes through roller platen DR1 and application roll DR2 clamping substrate Ps.Moreover, applying mechanism Gp1 is by rotating roller platen DR1 and application roll DR2, while making Substrate P is moved along conveyance direction, while applying photonasty functional liquid by application roll DR2.Drier Gp2 blows out hot blast or dry The drying air such as dry air, removes solute (solvent or water) contained in photonasty functional liquid, and make to be coated with photonasty work( The substrate P of energy liquid is dried, and photonasty functional layer is thus formed in substrate P.
Processing unit U2 is heater, in order that the photonasty functional layer for being formed at the surface of substrate P is stable, will be from The substrate P that reason device U1 is moved is heated to set point of temperature (for example, tens DEG C~120 DEG C degree).Processing unit U2 is from substrate P The upstream side of conveyance direction start to be sequentially provided with heating chamber HA1 and cooling chamber HA2.Heating chamber HA1 is set inside it There are multiple rollers and multiple air turning-bars (air turn bar), multiple rollers and multiple air turning-bars constitute the conveyance of substrate P Path.Multiple rollers are set in the way of the back side of rotating contact substrate P, and multiple air turning-bars are arranged at base with not contact condition Plate P face side.Multiple rollers and multiple air turning-bars are, in order to lengthen the transport path of substrate P, and to form removing for snake shape Send the configuration in path.The transport path of the edge of the substrate P one snake shape passed through out of heating chamber HA1 is by conveyance while being heated To set point of temperature.Cooling chamber HA2 makes substrate P be cooled to environment temperature, so that the substrate P after heating chamber HA1 heating Temperature is consistent with the environment temperature of process (processing unit U3) afterwards.Cooling chamber HA2 is being internally provided with multiple rollers, with heating Similarly, multiple rollers are, in order to lengthen the transport path of substrate P, and to form the configuration of the transport path of snake shape to chamber HA1.From The substrate P passed through in cooling chamber HA2, the transport path of edge snake shape is transported while cooled.In cooling chamber HA2 Conveyance direction on downstream, provided with driven roller R3, driven roller R3 while substrate P of the clamping from cooling chamber HA2 after While rotation, thus supplies substrate P towards processing unit U3.
Processing unit (substrate board treatment) U3 is exposure device, and thoughts are formed to supplying the surface come from processing unit U2 Substrate (sensitive substrate) P of photosensitiveness functional layer, projection exposure is carried out by the pattern of the circuit of display or wiring etc..In in detail Appearance is reserved for later described, and processing unit U3 irradiates illuminating bundle to the light shield M of reflection-type, and illuminating bundle is obtained by light shield M reflection Projected light beam projection exposure in substrate P.There is processing unit U3 the substrate P that will come from processing unit U2 supplies to deliver to conveyance side To downstream driven roller R4 and adjust substrate P width (Y-direction) on position marginal position controller EPC3.Driven roller R4 clamps the table back of the body two sides of substrate P while rotating, and substrate P is sent to the downstream of conveyance direction, by This supplies substrate P towards exposure position.Marginal position controller EPC3 is constituted in the same manner as marginal position controller EPC1, is repaiied Position on the width of positive substrate P, so that the width of the substrate P on exposure position turns into target location.In addition, place Managing device U3 has in the state of the substrate P after to exposure assigns slackness, and substrate P is delivered to the downstream of conveyance direction Two groups of driven rollers R5, R6.Two groups of driven rollers R5, R6 are spaced and configured as defined in being separated by the conveyance direction of substrate P.Driven roller R5 clamps the upstream side of the substrate P of conveyance and rotated, and driven roller R6 clamps the downstream of the substrate P of conveyance and rotated, and thus will Substrate P is supplied towards processing unit U4.At this moment, because substrate P is endowed slackness, leaned on therefore, it is possible to absorb than driven roller R6 The variation of conveyance speed produced by the downstream of conveyance direction, to substrate caused by the variation so as to block conveyance speed The influence of P exposure-processed.In addition, in processing unit U3, in order to by the picture and substrate of a part for light shield M mask pattern P carries out relatively aligning (alignment), and the aligming microscope AM1 of alignment mark being previously formed in provided with detection in substrate P etc., AM2。
Processing unit U4 is wet type processing device, and it is carried out wet to the substrate P after the exposure that is moved from processing unit U3 Development treatment, electroless plating processing of formula etc..Processing unit U4 has inside it：3 be layered along vertical (Z-direction) Individual treatment trough BT1, BT2, BT3 and the multiple rollers for transporting substrate P.Multiple rollers with as substrate P successively from 3 treatment trough BT1, BT2, BT3 inside transport path by way of configure.Downstream in treatment trough BT3 conveyance direction, provided with drive The substrate P that dynamic roller R7, driven roller R7 clamps from treatment trough BT3 after is rotated on one side, and substrate P direction thus is handled into dress Put U5 supplies.
Though omitting diagram, processing unit U5 is drying device, and it from the processing unit U4 substrate Ps moved to being done It is dry.Processing unit U5 will be adjusted to defined water in processing unit U4 through the moisture accompanying by the substrate P of wet processed Divide content.Several processing units are passed through by the processing unit U5 substrate Ps dried, processing unit Un is transported to.Moreover, After being handled by processing unit Un, substrate P is rolled by the recovery of substrate retracting device 4 with roller FR2.
Host control device 5 is united to substrate feeding device 2, substrate retracting device 4 and multiple processing units U1~Un Include control.The control base board feedway 2 of host control device 5 and substrate retracting device 4, and make substrate P from substrate feeding device 2 Transported towards substrate retracting device 4.In addition, the one side of host control device 5 makes the conveyance of substrate P synchronous, while controlling multiple places Device U1~Un is managed, so as to perform the various processing to substrate P.
＜ exposure devices (substrate board treatment) ＞
Next, reference picture 2 is to Fig. 4, to the exposure device (processing substrate as processing unit U3 of the 1st embodiment Device) composition illustrate.Fig. 2 is that exposure device (substrate board treatment) for representing the 1st embodiment is monolithically fabricated Figure.Fig. 3 is the figure of the configuration for the illumination region and view field for representing the exposure device shown in Fig. 2.Fig. 4 is represented shown in Fig. 2 Exposure device lamp optical system and projection optical system composition figure.
Exposure device U3 as shown in Figure 2 is so-called scanning-exposure apparatus, while substrate P (is scanned along conveyance direction Direction) conveyance, while will be formed in the picture projection exposure of the mask pattern of the light shield M of cylindrical shape outer peripheral face to the table of substrate P Face.Be X-direction, Y-direction and the orthogonal rectangular coordinate system of Z-direction in addition, in Fig. 2 and Fig. 3, as with Fig. 1 identicals right angle Coordinate system.
First, illustrated on light shield used in exposure device U3 (light shield part) M.Light shield M for for example using The light shield of the reflection-type of metal cylinder.Light shield M, which is formed to have, turns into the 1st axle AX1 that will extend along Y-direction in The radius of curvature of the heart is the cylinder of Rm outer peripheral face (periphery), radially with certain wall thickness.Light shield M periphery into To be formed with light shield face (pattern plane) P1 of defined mask pattern (pattern).Light shield face P1 is included with high efficiency to prescribed direction The high reflection portion of the reflected beams and the reflection suppression portion reflected not to prescribed direction the reflected beams or with poor efficiency, mask pattern are led to Too high reflecting part and reflection suppression portion are formed.Because such light shield M is metal cylinder, so can be to make at a low price Into, by using high-precision laser beam drawing apparatus, and can make mask pattern (in addition to the various patterns of panel, Also reference mark, measuring scale of encoder that contraposition can be included etc.) it is deliberately formed on cylindric outer peripheral face.
In addition, light shield M both could be formed with the entirety or a part of panel pattern corresponding with a display device, It could be formed with panel pattern corresponding with multiple display devices.In addition, on light shield M, both can be along around the 1st axle AX1's Multiple panel patterns circumferentially have been concatenated to form, can also be concatenated to form along the direction parallel with the 1st axle AX1 multiple small-sized Panel pattern.Moreover, light shield M can also be formed with panel pattern and size of the 1st display device etc. and the 1st display device The panel pattern of the 2nd different display devices.As long as in addition, light shield M with using the 1st axle AX1 as center radius of curvature For Rm periphery, the shape of cylinder is not limited to.For example, light shield M can also be the arc-shaped with periphery Sheet material.In addition, light shield M both can be lamellar, or bend laminal light shield M and there is periphery.
Next, being illustrated on the exposure device U3 shown in Fig. 2.Exposure device U3 except above-mentioned driven roller R4~ Beyond R6, marginal position controller EPC3 and aligming microscope AM1, AM2, also with light shield maintaining body 11, substrate supporting machine Structure 12, lamp optical system IL, projection optical system PL, slave control device 16.Exposure device U3 passes through lamp optical system The illuminating bundle EL1 that IL and projection optical system PL guiding is projected from light supply apparatus 13, so that light shield maintaining body 11 will be passed through The picture of the light shield M of holding mask pattern is projected to the substrate P supported by base supporting mechanism 12.
The control exposure device of slave control device 16 U3 each several part, makes each several part perform processing.Slave control device 16 Can be part or all of the host control device 5 of device inspection apparatus 1.In addition, slave control device 16 can also be It is generalized control device 5 to control, the device different from host control device 5.Slave control device 16 is for example comprising computer.
Light shield maintaining body 11 has the light shield holding cylinder (light shield holding member) 21 for keeping light shield M and makes light shield holding cylinder 1st drive division 22 of 21 rotations.Light shield holding cylinder 21 keeps light shield in the way of light shield M the 1st axle AX1 turns into pivot M.1st drive division 22 is connected with slave control device 16, rotates light shield holding cylinder 21 as pivot the 1st axle AX1.
In addition, light shield maintaining body 11 keeps the light shield M of cylinder by light shield holding cylinder 21, but it is not limited to the structure Into.Light shield maintaining body 11 can also along the outer peripheral face rolled sheet shape of light shield holding cylinder 21 light shield M and keep.In addition, Light shield maintaining body 11 can also make to be maintained at light shield holding in the light shield M that the surface for being bent into the sheet material of arc-shaped forms pattern The outer peripheral face of cylinder 21.
Base supporting mechanism 12 has supporting substrates P substrate supporting cylinder 25, makes the 2nd driving of the rotation of substrate supporting cylinder 25 Portion 26, a pair of air turning-bar ATB1, ATB2 and a pair of guide reels 27,28.Substrate supporting cylinder 25 be formed as have will be along Y side Drum of the radius of curvature at center for Rfa outer peripheral face (periphery) is used as to the 2nd axle AX2 of extension.Here, the 1st axle AX1 is parallel to each other with the 2nd axle AX2, and using from the 1st axle AX1 and the 2nd axle AX2 by face be used as median plane CL.Substrate supporting cylinder A part for 25 periphery turns into supporting substrates P bearing-surface P2.That is, substrate supporting cylinder 25 makes substrate P be supported wound on it On the P2 of face, so that supporting substrates P.2nd drive division 26 is connected with slave control device 16, makes substrate supporting cylinder 25 with the 2nd axle AX2 Rotated for pivot.A pair of air turning-bars ATB1, ATB2 clip substrate supporting cylinder 25, are respectively arranged on the conveyance of substrate P The upstream side and downstream in direction.A pair of air turning-bars ATB1, ATB2 are located at the face side of substrate P, in vertical (Z side To) on substrate supporting cylinder 25 bearing-surface P2 compared to the configuration of side on the lower.A pair of guide reels 27,28 clip a pair of air steerings Bar ATB1, ATB2, are respectively arranged on the upstream side and downstream of the conveyance direction of substrate P.One of them of a pair of guide reels 27,28 Guide reel 27 will be guided to air turning-bar ATB1 from the driven roller R4 substrate Ps moved, and another guide reel 28 will be from air The substrate P that turning-bar ATB2 is moved is guided to driven roller R5.
Therefore, base supporting mechanism 12 will be guided to air from the driven roller R4 substrate Ps moved by guide reel 27 and turned To bar ATB1, the substrate P from air turning-bar ATB1 after is directed into substrate supporting cylinder 25.Base supporting mechanism 12 passes through 2nd drive division 26 and make substrate supporting cylinder 25 rotate so that on one side by substrate supporting cylinder 25 bearing-surface P2 support be directed into The substrate P of substrate supporting cylinder 25, while being transported to air turning-bar ATB2.Base supporting mechanism 12 passes through air turning-bar ATB2 And will transport to air turning-bar ATB2 substrate P and guide to guide reel 28, by the substrate P from guide reel 28 after guide to Driven roller R5.
At this moment, the slave control device 16 being connected with the 1st drive division 22 and the 2nd drive division 26 makes light shield holding cylinder 21 and base Plate supports cylinder 25 with defined rotary speed than synchronous rotary, so as to be formed at the picture of light shield M light shield face P1 mask pattern Continuously projection exposure is (curved along periphery in the surface of the substrate P for the bearing-surface P2 for being wound in substrate supporting cylinder 25 repeatedly Bent face).
Light supply apparatus 13 projects the illuminating bundle EL1 illuminated to light shield M.Light supply apparatus 13 has light source portion 31 and light guide section Part 32.Light source portion 31 is the light for the defined wavelength region that the exposure with the photonasty functional layer in substrate P is matched, and is to project Photolytic activity acts on the light source of the light of strong ultraviolet region.As light source portion 31, such as open-wire line with ultraviolet region can be used The lamp sources such as the mercury vapor lamp of (g lines, h lines, i lines etc.), in below wavelength 450nm ultraviolet region there is the laser two of oscillation peak The solid light sources such as pole pipe, light emitting diode (LED), or vibrate the KrF PRK (wavelength of extreme ultraviolet light (DUV light) 248nm), the gas laser source such as ArF PRKs (wavelength 193nm), XeCl PRKs (wavelength 308nm).
Here, the illuminating bundle EL1 projected from light supply apparatus 13 is incident to polarising beam splitter PBS described later.In order to press down Make the illuminating bundle EL1 separation caused by polarising beam splitter PBS and the energy loss that produces, preferably illuminating bundle EL1 is Make the light beam of the substantially the entirety of reflections of illuminating bundle EL1 of incidence in polarising beam splitter PBS.Polarising beam splitter PBS makes into Light beam for the rectilinearly polarized light of S-polarization light reflects, and becomes the light beam transmission of the rectilinearly polarized light of P polarization light.Therefore, light Preferably project following laser in the light source portion 31 of source device 13：The illuminating bundle EL1 for being incident to polarising beam splitter PBS is set to turn into straight The laser of the light beam of linearly polarized light (S-polarization light).Further, since laser energy density is high, so can suitably ensure projection The illumination of light beam on to substrate P.
Light guide member 32 guides the illuminating bundle EL1 projected from light source portion 31 to lamp optical system IL.Light guide member 32 are made up of optical fiber or the relay component (relay module) for having used reflective mirror (mirror) etc..In addition, provided with multiple In the case of lamp optical system IL, light guide member 32 the illuminating bundle EL1 from light source portion 31 is separated into it is multiple, will be multiple Illuminating bundle EL1 is guided to multiple lamp optical system IL.In addition, in the feelings that the light beam for example projected from light source portion 31 is laser Under condition, light guide member 32 can also keep polarized wave optical fiber (polarization corrugated preserves optical fiber) to be used as optical fiber, be protected by polarized wave Holding optical fiber maintains the polarization state of laser constant and guide-lighting.
Here, as shown in Figure 3, the exposure device U3 of the 1st embodiment is assumed that as the exposure of so-called poly-lens mode Electro-optical device.In addition, figure shows the illumination region IR on the light shield M that light shield holding cylinder 21 is kept from-Z sides in figure 3 Obtained from top view (Fig. 3 left figure) and be supported on from+Z sides substrate supporting cylinder 25 substrate P on view field PA Obtained from top view (Fig. 3 right figure).Fig. 3 reference Xs represents the movement of light shield holding cylinder 21 and substrate supporting cylinder 25 Direction (direction of rotation).The exposure device U3 of poly-lens mode is to multiple (for example, 6 in the 1st embodiment on light shield M It is individual) illumination region IR1~IR6 irradiates illuminating bundle EL1, each illuminating bundle EL1 quilt in each illumination region IR1~IR6 respectively Multiple projected light beam EL2 projection exposures obtained from reflection are to multiple (in the 1st embodiments be, for example, 6) in substrate P View field PA1~PA6.
First, on being illustrated by the lamp optical system IL multiple illumination region IR1~IR6 illuminated.Such as Fig. 3 Shown in left figure, multiple illumination region IR1~IR6 clip median plane CL and are configured to 2 row along direction of rotation, the upstream in direction of rotation The 1st illumination region IR1, the 3rd illumination region IR3 and the 5th illumination region IR5 of odd number are configured with the light shield M of side, in rotation The 2nd illumination region IR2, the 4th illumination region IR4 and the 6th illumination of even number are configured with the light shield M in the downstream for turning direction Region IR6.
Each illumination region IR1~IR6 is with the parallel short side and long side extended along light shield M axial direction (Y-direction) The region of elongated trapezoidal (rectangle).At this moment, trapezoidal each illumination region IR1~IR6 is that its short side is located at median plane CL sides, its Long side is located at the region in outside.The 1st illumination region IR1, the 3rd illumination region IR3 and the 5th illumination region IR5 edges of odd number Interval configuration as defined in axially-spaced.In addition, the 2nd illumination region IR2, the 4th illumination region IR4 of even number and the 6th illumination Interval configuration as defined in region IR6 is axially spaced.At this moment, the 2nd illumination region IR2 in the axial direction, is configured at the 1st illumination region Between IR1 and the 3rd illumination region IR3.Similarly, the 3rd illumination region IR3 in the axial direction, be configured at the 2nd illumination region IR2 with Between 4th illumination region IR4.4th illumination region IR4 in the axial direction, is configured at the 3rd illumination region IR3 and the 5th illumination region Between IR5.5th illumination region IR5 in the axial direction, is configured between the 4th illumination region IR4 and the 6th illumination region IR6.It is each to shine The side that the triangular part in the hypotenuse portion of the illumination region of adjacent trapezoidal is overlapped when area pellucida domain IR1~IR6 is with from light shield M circumference Formula (mode of overlapping (overlap)) is configured.In addition, in the 1st embodiment, each illumination region IR1~IR6 is set to step sector Domain, can also be set to rectangular region.
It is formed with the pattern forming region A3 of mask pattern in addition, light shield M has and does not form the pattern of mask pattern Non-forming region domain A4.Pattern non-forming region domain A4 is the region for being difficult to reflect for absorbing illuminating bundle EL1, is configured to pattern shape Surrounded into region A3 frame-shaped.1st~the 6th illumination region IR1~IR6 is whole with overlay pattern forming region A3 Y-direction The mode of width is configured.
Lamp optical system IL and multiple illumination region IR1~IR6 are correspondingly provided with multiple (in the 1st embodiment For example, 6).Illuminating bundle EL1 from light supply apparatus 13 is incident in multiple lamp optical system IL1~IL6 respectively.Respectively Lamp optical system IL1~IL6 will be separately directed to each illumination region IR1 from the incident each illuminating bundle EL1 of light supply apparatus 13 ~IR6.That is, the 1st lamp optical system IL1 guides illuminating bundle EL1 to the 1st illumination region IR1, similarly, the 2nd~the 6th Lamp optical system IL2~IL6 guides illuminating bundle EL to the 2nd~the 6th illumination region IR2~IR6.Multiple illumination optical systems It is 2 row that system IL1~IL6, which clips median plane CL along the arranged circumferentially of light shield M,.Multiple lamp optical system IL1~IL6 clip center Face CL, the 1st lamp optical system is configured with being configured with the 1st, the 3rd, the 5th illumination region IR1, IR3, IR5 sides (Fig. 2 left side) IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system IL5.1st lamp optical system IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system IL5 separates defined interval along Y-direction and configured.In addition, multiple lamp optical system IL1~ IL6 clips median plane CL, and the 2nd is configured with being configured with the 2nd, the 4th, the 6th illumination region IR2, IR4, IR6 sides (Fig. 2 right side) Lamp optical system IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6.2nd lamp optical system IL2, the 4th Lamp optical system IL4 and the 6th lamp optical system IL6 separates defined interval along Y-direction and configured.At this moment, the 2nd light optics System IL2 in the axial direction, is configured between the 1st lamp optical system IL1 and the 3rd lamp optical system IL3.Similarly, the 3rd shines Bright optical system IL3 in the axial direction, is configured between the 2nd lamp optical system IL2 and the 4th lamp optical system IL4.4th shines Bright optical system IL4 in the axial direction, is configured between the 3rd lamp optical system IL3 and the 5th lamp optical system IL5.5th shines Bright optical system IL5 in the axial direction, is configured between the 4th lamp optical system IL4 and the 6th lamp optical system IL6.In addition, 1st lamp optical system IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system IL5 and the 2nd lamp optical system IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6 are symmetrically matched somebody with somebody from the point of view of Y-direction centered on median plane CL Put.
Next, reference picture 4, is illustrated to each lamp optical system IL1~IL6.Further, since each illumination optical system IL1~the IL6 that unites is constituted for identical, so the 1st lamp optical system IL1 (hereinafter simply referred to as lamp optical system IL) is made Illustrated for example.
Lamp optical system IL in order to uniform illumination illumination illumination region IR (the 1st illumination region IR1), employ by The light source picture (real image or the virtual image) produced by light supply apparatus 13 forms the pupil location in lamp optical system IL (with Fourier change Change face suitable) Kohler illumination (Kohler illumination).In addition, lamp optical system IL is to have used polarised light Beam splitter PBS's falls to penetrate illuminator.Lamp optical system IL from the light incident side of the illuminating bundle EL1 from light supply apparatus 13 according to It is secondary that there is illumination optics ILM, polarising beam splitter PBS, quarter wave plate 41.
As shown in figure 4, illumination optics ILM includes collimation lens 51, compound eye successively from illuminating bundle EL1 light incident side Lens 52, multiple collector lenses 53, cylindrical lens 54, illuminated field diaphragm 55, multiple relay lens 56, and located at the 1st optical axis On BX1.Exiting side of the collimation lens 51 located at the light guide member 32 of light supply apparatus 13.The optical axis of collimation lens 51 is configured the 1st On optical axis BX.The face of the light incident side of the irradiation fly's-eye lens 52 of collimation lens 51 is overall.Fly's-eye lens 52 is located at collimation lens 51 Exiting side.The center configuration in the face of the exiting side of fly's-eye lens 52 is on the 1st optical axis BX1.It is made up of multiple rod-shaped lens etc. The illuminating bundle EL1 of fly's-eye lens self-focus lenses in 52 future 51 presses each rod-shaped lens sectionalization, makes multiple spot light pictures (poly- Luminous point) be created on fly's-eye lens 52 exiting side face, and as being entered by the illuminating bundle EL1 after rod-shaped lens sectionalization It is incident upon collector lens 53.At this moment, the face of the exiting side of the fly's-eye lens 52 of generation spot light picture is configured to：By from fly's-eye lens 52 reach the various lens of projection optical system PL described later the 1st concave mirror 72 via illuminated field diaphragm 55, and with it is the 1st recessed The pupil plane optical conjugate for the projection optical system PL (PLM) that the reflecting surface of face mirror 72 is located at.Collector lens 53 is located at compound eye The exiting side of lens 52.The optical axis of collector lens 53 is configured on the 1st optical axis BX1.Collector lens 53 makes to come from fly's-eye lens 52 Illuminating bundle EL1 be gathered on cylindrical lens 54.Cylindrical lens 54 is that light incident side is that plane, exiting side are convex piano convex cylindrical Lens.Cylindrical lens 54 is located at the exiting side of collector lens 53.The optical axis of cylindrical lens 54 is configured on the 1st optical axis BX1.Cylinder Lens 54 make illuminating bundle EL1 in XZ faces along the directional divergence orthogonal with the 1st optical axis BX1.Illuminated field diaphragm 55 and cylinder The exiting side of lens 54 is disposed adjacent.The opening portion of illuminated field diaphragm 55 is formed as the ladder with illumination region IR identical shapes Shape or rectangle, the center configuration of the opening portion of illuminated field diaphragm 55 is on the 1st optical axis BX1.At this moment, illuminated field diaphragm 55 By configured from illuminated field diaphragm 55 to light shield M various lens with the illumination region IR optical conjugates on light shield M Face.Relay lens 56 is located at the exiting side of illuminated field diaphragm 55.The optical axis of relay lens 56 is configured on the 1st optical axis BX1.In The illuminating bundle EL1 from illuminated field diaphragm 55 is set to be incident in polarising beam splitter PBS after lens 56.
After illuminating bundle EL1 is incident to illumination optics ILM, illuminating bundle EL1 turns into by collimation lens 51 Irradiate the overall light beam in the face of the light incident side of fly's-eye lens 52.Be incident to the illuminating bundle EL1 after fly's-eye lens 52 turn into come from The illuminating bundle EL1 of each of multiple spot light pictures, and it is incident to cylindrical lens 54 via collector lens 53.It is incident to cylinder The illuminating bundle EL1 of lens 54 is in XZ faces along the directional divergence orthogonal with the 1st optical axis BX1.Dissipated by cylindrical lens 54 Illuminating bundle EL1 be incident to illuminated field diaphragm 55.The illuminating bundle EL1 after illuminated field diaphragm 55 is incident to regard from illumination The opening portion of field diaphragm 55 passes through, so that as with the light beam with the intensity distribution of illumination region IR identical shapes.From photograph Illuminating bundle EL1 of the photopic vision field diaphragm 55 after is incident to polarising beam splitter PBS via relay lens 56.
Polarising beam splitter PBS is configured between illumination optics ILM and median plane CL on X-direction.Polarised light Beam splitter PBS is engaged with quarter wave plate 41, and the illuminating bundle EL1 from illumination optics ILM is reflected, and on the other hand, is made Passed through by the projected light beam EL2 after light shield M reflection.In other words, the illuminating bundle EL1 from illumination optics ILM is as anti- Irradiating light beam is incident to polarising beam splitter PBS, and projected light beam (reflected light) EL2 from light shield M is incident to as through light beam Polarising beam splitter PBS.That is, the illuminating bundle EL1 for being incident to polarising beam splitter PBS is the linear polarization as S-polarization light The reflected beams of light, the projected light beam EL2 for being incident to polarising beam splitter PBS is the saturating of the rectilinearly polarized light as P polarization light Cross light beam.
As shown in figure 4, polarising beam splitter PBS has the 1st prism 91, the 2nd prism 92, located at the 1st prism 91 and the 2nd rib Polarised light parting surface 93 between mirror 92.1st prism 91 and the 2nd prism 92 are made up of quartz glass, turn into triangle in XZ faces The triangular prism of shape.Then, polarising beam splitter PBS clips polarization by the 1st prism 91 of triangle and the 2nd prism 92 Light parting surface 93 is engaged, and turns into quadrilateral shape in XZ faces.
1st prism 91 is the prism of illuminating bundle EL1 and projected light beam EL2 institutes light incident side.2nd prism 92 is from polarised light The prism for the side emitted by projected light beam EL2 that parting surface 93 is passed through.It is incident to polarised light parting surface 93 from the court of the 1st prism 91 To the illuminating bundle EL1 and projected light beam EL2 of the 2nd prism 92.The reflection S-polarization light of polarised light parting surface 93 (rectilinearly polarized light) Illuminating bundle EL1, and pass through the projected light beam EL2 of P polarization light (rectilinearly polarized light).
Quarter wave plate 41 is configured between polarising beam splitter PBS and light shield M.Quarter wave plate 41 makes by polarising beam splitter The illuminating bundle EL1 of PBS is converted to circularly polarized light from rectilinearly polarized light (S-polarization light).Be converted to the illumination of circularly polarized light Light beam EL1 exposes to light shield M.Quarter wave plate 41 makes to be converted to straight line by the projected light beam EL2 of the circularly polarized light of light shield M reflection inclined Shake light (P polarization light).
Next, being illustrated on the multiple view field PA1~PA6 for being projected optical system PL projection exposures.Such as Shown in Fig. 3 right figure, multiple view field PA1~PA6 in substrate P and multiple illumination region IR1~IR6 phases on light shield M Correspondence configuration.That is, multiple view field PA1~PA6 in substrate P clip median plane CL and are configured to 2 row along conveyance direction, are removing Send direction upstream side substrate P on be configured with odd number the 1st view field PA1, the 3rd view field PA3 and the 5th projection Region PA5, is configured with the 2nd view field PA2, the 4th view field of even number in the substrate P in the downstream of conveyance direction PA4 and the 6th view field PA6.
Each view field PA1~PA6 be with along substrate P width (Y-direction) extend short side and long side it is thin Long trapezoidal region.At this moment, trapezoidal each view field PA1~PA6 is that its short side is located at median plane CL sides, and its long side is located at The region in outside.The 1st view field PA1, the 3rd view field PA3 and the 5th view field PA5 of odd number are in the width direction Separate predetermined distance configuration.In addition, the 2nd view field PA2, the 4th view field PA4 and the 6th view field PA6 of even number Predetermined distance configuration is separated in the width direction.At this moment, the 2nd view field PA2 in the axial direction, be configured at the 1st view field PA1 with Between 3rd view field PA3.Similarly, the 3rd view field PA3 in the axial direction, is configured at the 2nd view field PA2 and the 4th and thrown Between the PA4 of shadow zone domain.4th view field PA4 is configured between the 3rd view field PA3 and the 5th view field PA5.5th projection Region PA5 is configured between the 4th view field PA4 and the 6th view field PA6.Each view field PA1~PA6 and each lighting area Domain IR1~IR6 similarly, adjacent trapezoidal view field PA hypotenuse portion during with from the conveyance direction from substrate P Mode (overlapping mode) configuration that triangular part is overlapped.At this moment, view field PA is the area that adjacent view field PA is repeated Light exposure in domain turns into substantially the same shape with the light exposure in unduplicated region.Also, the 1st~the 6th projected area Configured in the way of the whole width of Y-directions of the domain PA1~PA6 to cover the exposure area A7 being exposed in substrate P.
Here, in fig. 2, when being observed in XZ faces, the central point from illumination region IR1 (and IR3, IR5) on light shield M To illumination region IR2 (and IR4, IR6) central point girth with bearing-surface P2 substrate P from view field PA1 The girth of the central point of (and PA3, PA5) to the 2nd view field PA2 (and PA4, PA6) central point is set as being substantially equal.
Projection optical system PL and 6 view field PA1~PA6 in the 1st embodiment above are correspondingly set to 6 It is individual.It is incident by respectively positioned at corresponding illumination region IR1~IR6 mask pattern respectively to projection optical system PL1~PL6 Multiple projected light beam EL2 of reflection.Each projection optical system PL1~PL6 will be distinguished by each projected light beam EL2 of light shield M reflection Guide to each view field PA1~PA6.That is, the 1st projection optical system PL1 is by the projected light beam from the 1st illumination region IR1 EL2 is guided to the 1st view field PA1, and similarly, the 2nd~the 6th projection optical system PL2~PL6 will be from the 2nd~the 6th illumination Region IR2~IR6 each projected light beam EL2 is guided to the 2nd~the 6th view field PA2~PA6.
It is 2 row that multiple projection optical system PL1~PL6, which clip median plane CL along the arranged circumferentially of light shield M,.Multiple projected lights System PL1~PL6 clips median plane CL, being configured with the 1st, the 3rd, a 5th view field PA1, PA3, PA5 side (Fig. 2 left side Side) it is configured with the 1st projection optical system PL1, the 3rd projection optical system PL3 and the 5th projection optical system PL5.1st projected light System PL1, the 3rd projection optical system PL3 and the 5th projection optical system PL5 separate defined interval along Y-direction and configured.Separately Outside, multiple lamp optical system IL1~IL6 clip median plane CL, being configured with the 2nd, the 4th, the 6th view field PA2, PA4, PA6 side (Fig. 2 right side) is configured with the 2nd projection optical system PL2, the 4th projection optical system PL4 and the 6th projection optics system Unite PL6.2nd projection optical system PL2, the 4th projection optical system PL4 and the 6th projection optical system PL6 separate rule along Y-direction Fixed interval configuration.At this moment, the 2nd projection optical system PL2 in the axial direction, is configured at the 1st projection optical system PL1 and the 3rd and thrown Between shadow optical system PL3.Similarly, the 3rd projection optical system PL3 in the axial direction, is configured at the 2nd projection optical system PL2 Between the 4th projection optical system PL4.4th projection optical system PL4 is configured at the projections of the 3rd projection optical system PL3 and the 5th Between optical system PL5.5th projection optical system PL5 is configured at the 4th projection optical system PL4 and the 6th projection optical system Between PL6.In addition, the 1st projection optical system PL1, the 3rd projection optical system PL3 and the 5th projection optical system PL5 and the 2nd are thrown Shadow optical system PL2, the 4th projection optical system PL4 and the 6th projection optical system PL6 are from the point of view of Y-direction using median plane CL in The heart is symmetrically configured.
With further reference to Fig. 4, illustrated on each projection optical system PL1~PL6.Further, since each projection optics System PL1~PL6 is that identical is constituted, so by the 1st projection optical system PL1 (hreinafter referred to as projection optical system PL) Illustrate as an example.
Projection optical system PL makes the throwing from light shield M light shield face P1 illumination region IR (the 1st illumination region IR1) reflections Shadow light beam EL2 is incident, and the intermediary image of light shield face P1 pattern is revealed in intermediate image plane P7 formation.In addition, will be from light shield face P1 The projected light beam EL2 for reaching intermediate image plane P7 is set to the 1st projected light beam EL2a.Being formed at intermediate image plane P7 intermediary image turns into phase It is the inverted image of 180 ° of point symmetries for the picture of illumination region IR mask pattern.
In addition, projection optical system PL makes the projected light beam EL2 that is projected from intermediate image plane P7 in the projection image planes of substrate P View field's PA reimagings and form projection image.In addition, by from intermediate image plane P7 reach substrate P projection image planes projected light beam EL2 is set to the 2nd projected light beam EL2b.Projection image is that the intermediary image relative to intermediate image plane P7 turns into the handstand of 180 ° of point symmetries Picture, is erect image of the picture as identical picture of the mask pattern relative to illumination region IR in other words.The projection optical system PL from the light incident side of the projected light beam EL2 from light shield M in order, with above-mentioned quarter wave plate 41, above-mentioned polarising beam splitter PBS, Projection optics PLM.
Quarter wave plate 41 and polarising beam splitter PBS dual-purpose lamp optical systems IL.In other words, lamp optical system IL and Projection optical system PL has quarter wave plate 41 and polarising beam splitter PBS.
The 1st projected light beam EL2a reflected in illumination region IR is directed towards the 1st axle AX1 of light shield holding cylinder 21 radial direction The light beam of the telecentricity in outside, is incident to projection optical system PL.When the 1st projection of the circularly polarized light reflected in illumination region IR When light beam EL2a is incident to projection optical system PL, rectilinearly polarized light (P polarization is converted to from circularly polarized light by quarter wave plate 41 Light) after, it is incident to polarising beam splitter PBS.The 1st projected light beam EL2a for being incident to polarising beam splitter PBS divides from polarised light After beam device PBS is passed through, Projection optics PLM is incident to.
As shown in figure 4, Projection optics PLM has：Intermediate image plane P7 be imaged intermediary image, and in substrate P into Partial optical system 61 as being projection image；The 1st projected light beam EL2a and the 2nd projected light beam EL2b is set to be incident to partial optical system The reflective optics (guide-lighting optical system) 62 of system 61；It is configured at the perspective view diaphragm for the intermediate image plane P7 for being formed with intermediary image 63.In addition, Projection optics PLM has：Focus amendment optical component 64, as skew optical component 65, multiplying power amendment use Optical component 66, rotation correction mechanism 67, polarised light adjustment mechanism 68.
Obtained from partial optical system 61 and reflective optics 62 are deformed will for example to wear gloomy (Dyson) system The reflection and refraction optical system of telecentricity.The optical axis (hereinafter referred to as the 2nd optical axis BX2) of partial optical system 61 is relative to median plane CL is substantially orthogonal.Partial optical system 61 has the 1st lens group 71 and the 1st concave mirror (reflection optics) 72.1st lens Group 71 has the multiple lenticular units for including refractor (lenticular unit) 71a located at median plane CL sides, multiple lenticular units Optical axis configure on the 2nd optical axis BX2.1st concave mirror 72 be configured at by the multiple spot lights generated by fly's-eye lens 52 from Fly's-eye lens 52 is reached via illuminated field diaphragm 55 on the pupil plane of the various lens imagings of the 1st concave mirror 72.
Reflective optics 62 has the 1st deflection component (the 1st optical component and the 1st reflection part) the 76, the 2nd deflection component (the 2nd optical component and the 3rd reflecting part) the 77, the 3rd deflection component (the 3rd optical component and the 4th reflecting part) the 78, the 4th deflection component (the 4th optical component and the 2nd reflection part) 79.1st deflection component 76 is the speculum with the 1st reflecting surface P3.1st reflecting surface P3 reflects the 1st projected light beam EL2a from polarising beam splitter PBS, is incident to the 1st projected light beam EL2a reflected The refractor 71a of 1st lens group 71.2nd deflection component 77 is the speculum with the 2nd reflecting surface P4.2nd reflecting surface P4 makes The 1st projected light beam EL2a reflections projected from refractor 71a, make during the 1st projected light beam EL2a reflected is incident to and is located at Between image planes P7 perspective view diaphragm 63.3rd deflection component 78 is the speculum with the 3rd reflecting surface P5.3rd reflecting surface P5 makes The 2nd projected light beam EL2b reflections from perspective view diaphragm 63, make the 2nd projected light beam EL2b reflected be incident to the 1st saturating The refractor 71a of microscope group 71.4th deflection component 79 is the speculum with the 4th reflecting surface P6.4th reflecting surface P6 makes from folding The 2nd projected light beam EL2b reflections of lens 71a injections are penetrated, the 2nd projected light beam EL2b reflected is incident in substrate P.Picture So, the 2nd deflection component 77 and the 3rd deflection component 78 as make the 1st projected light beam EL2a from partial optical system 61 with The folding mirrors that the mode turned back again towards partial optical system 61 reflects play a role.1st~the 4th deflection component 76, 77th, 78,79 each reflecting surface P3~P6 is the plane parallel with the Y-axis in Fig. 4, is tilted and matched somebody with somebody with predetermined angular in XZ faces Put.
Perspective view diaphragm 63 has the opening of regulation view field PA shape.That is, the opening of perspective view diaphragm 63 Shape provide view field PA shape.
The 1st projected light beam EL2a from polarising beam splitter PBS passes through from as skew optical component 65, inclined by the 1st The 1st reflecting surface P3 reflections of rotation member 76.1st lens group is incident to by the 1st projected light beam EL2a after the 1st reflecting surface P3 reflections 71, from multiple lenticular units comprising refractor 71a by rear, it is incident to the 1st concave mirror 72.At this moment, the 1st projected light beam EL2a is in the 1st lens group 71, from the visual field area of the refractor 71a upper side for being located at +Z direction relative to the 2nd optical axis BX2 Domain passes through.The 1st projected light beam EL2a for being incident to the 1st concave mirror 72 is reflected by the 1st concave mirror 72.Reflected by the 1st concave mirror 72 The 1st projected light beam EL2a afterwards is incident to the 1st lens group 71, from multiple lenticular units comprising refractor 71a by rear, from 1st lens group 71 is projected.At this moment, the 1st projected light beam EL2a is in the 1st lens group 71, from refractor 71a relative to the 2nd The field of view that optical axis BX2 is located at the lower side of -Z direction passes through.From the 1st lens group 71 project the 1st projected light beam EL2a by The 2nd reflecting surface P4 reflections of 2nd deflection component 77.Projection is incident to by the 1st projected light beam EL2a after the 2nd reflecting surface P4 reflections Field stop 63.The 1st projected light beam EL2a for being incident to perspective view diaphragm 63 is formed into light shield figure in illumination region IR The intermediary image of the inverted image of case.
The 2nd projected light beam EL2b from perspective view diaphragm 63 is reflected by the 3rd reflecting surface P5 of the 3rd deflection component 78. 1st lens group 71 is again incident on by the 2nd projected light beam EL2b after the 3rd reflecting surface P5 reflections, from including refractor 71a's Multiple lenticular units are incident to the 1st concave mirror 72 by rear.At this moment, the 2nd projected light beam EL2b is in the 1st lens group 71, from folding Penetrate light incident side and the outgoing of lens the 71a upper side and the 1st projected light beam EL2a that are located at +Z direction relative to the 2nd optical axis BX2 Field of view between side passes through.The 2nd projected light beam EL2b for being incident to the 1st concave mirror 72 is reflected by the 1st concave mirror 72.By The 2nd projected light beam EL2b after the reflection of 1 concave mirror 72 is incident to the 1st lens group 71, from multiple lens comprising refractor 71a Part is projected by rear from the 1st lens group 71.At this moment, the 2nd projected light beam EL2b is in the 1st lens group 71, from refractor 71a's is located at relative to the 2nd optical axis BX2 between the lower side of -Z direction and the 1st projected light beam EL2a light incident side and exiting side Field of view pass through.From the 1st lens group 71 project the 2nd projected light beam EL2b by the 4th deflection component 79 the 4th reflecting surface P6 Reflection.By the 2nd projected light beam EL2b after the 4th reflecting surface P6 reflections from focus amendment optical component 64 and multiplying power amendment optics Part 66 passes through, and is projected to the view field PA in substrate P.The 2nd projected light beam EL2b for being projected to view field PA is formed into For the projection image of the erect image of the mask pattern in illumination region IR.At this moment, the picture of the mask pattern in illumination region IR with etc. (× 1) is projected to view field PA again.
Here, reference picture 5 is simplyd illustrate by being constituted comprising refractor 71a the 1st lens group 71 and the 1st concave mirror 72 Projection optics PLM field of view.Fig. 5 is represented Projection optics PLM circular full imaging viewing field (benchmark Face) states of the CIF along the YZ faces expansion in Fig. 5, rectangular-shaped illumination region IR on light shield M, image in intermediate image plane P7's Intermediary image Img1 on perspective view diaphragm 63, intermediary image in echelon is adjusted by intermediate image plane P7 perspective view diaphragm 63 Trapezoidal view field PA in Img2 and substrate P is slenderly set along Y direction respectively, is discretely arranged along Z-direction.
First, the center of the rectangular-shaped illumination region IR on light shield M is set as the central point from full imaging viewing field CIF (optical axis BX2 is passed through) deviates image height value k1 position (the 1st position) to +Z direction.Therefore, by out of Projection optics PLM By initial imaging optical path (the 1st projected light beam EL2a) and be formed on perspective view diaphragm 63 (intermediate image plane P7) Between as Img1, when being observed in YZ faces, so that above and below illumination region IR (Z-direction) and the state of left and right (Y-direction) reversion, are imaged In the image height value k1 eccentric from position (the 2nd position) from full imaging viewing field CIF central point to -Z direction.
Intermediary image Img2 is with the picture of the trapezoidal opening limitation of perspective view diaphragm 63 by intermediary image Img1.Then, in Between as Img2 by two deflection components 77,78 being configured at before and after perspective view diaphragm 63 due to being bent light path, institute During being observed in YZ faces, the position of the image height value k2 (k2 ＜ k1) from from full imaging viewing field CIF central point to +Z direction is imaged on Put (the 3rd position).Moreover, the intermediary image Img2 limited by perspective view diaphragm 63 out of Projection optics PLM by passing through The 2nd imaging optical path (the 2nd projected light beam EL2b), and reimaging is in the view field PA being formed in substrate P.
When the central point of picture of the reimaging in view field PA is observed in YZ faces, positioned at from full imaging viewing field CIF's Image height value k2 (k2 ＜ k1) from central point to -Z direction.And reimaging is in the picture in view field PA relative to illumination region IR Interior mask pattern, left and right directions (Y-direction) is nonreversible, with equimultiple (× 1) formation.
Like this, in the present embodiment, by so that the imaging beam from mask pattern is easily in circular imaging The mode that is spatially separated in the CIF of visual field and illumination region IR is limited to elongated rectangular-shaped or trapezoidal region, and base In four deflection components 76,77,78,79 formed by common completely reflecting mirror, and make round trip (double pass) imaging Road is formed in Projection optics PLM.Therefore, it is possible to make the pattern on light shield M in substrate P at least with Y direction (base In the closure of Projection optics PL1~PL6 each projection image) it is projected as the erect image of equimultiple.
Like this, the 1st deflection component 76, the 2nd deflection component 77, the 3rd deflection component 78 and the 4th deflection component 79 make the 1st The visual field (the 1st incident visual field) of projected light beam EL2a light incident side, visual field (the 1st outgoing of the 1st projected light beam EL2a exiting side Visual field), the visual field of the 2nd projected light beam EL2b light incident side (the 2nd incident visual field), the 2nd projected light beam EL2b exiting side regard Field (the 2nd outgoing visual field) is separated in reflective optics 62.Therefore, reflective optics 62 turns into the 1st projected light beam EL2a is difficult to the composition for producing leak light when guide-lighting, so that reflective optics 62 is as making to be projected to the leak light in substrate P Light quantity reduction light quantity reduction portion and play a role.In addition, leak light is for example because the 1st projected light beam EL2a is scattered and produces Scattered light, because the 1st projected light beam EL2a separate and produces separation light, because the 1st projected light beam EL2a a part reflect and The reflected light of generation.
Here, reflective optics 62 is in z-direction, deflected in order provided with the 1st deflection component the 76, the 3rd from upper side Part 78, the 4th deflection component 79, the 2nd deflection component 77.Therefore, throw be incident to the refractor 71a of the 1st lens group 71 the 1st Shadow light beam EL2a is incident to close to illumination region IR sides (refractor 71a upper side).In addition, from the folding of the 1st lens group 71 The 2nd projected light beam EL2b for penetrating lens 71a injections is projected from close to view field PA sides (refractor 71a lower side).Cause This, can shorten the distance between illumination region IR and the 1st deflection component 76, in addition, it is inclined to shorten view field PA and the 4th The distance between rotation member 79, so projection optical system PL miniaturization can be realized.In addition, as shown in figure 4, the 3rd deflection Part 78 along full imaging viewing field CIF direction (Z-direction) on being configured between the 1st deflection component 76 and the 4th deflection component 79. In addition, the position of the position and the 2nd deflection component 77 and the 3rd deflection component 78 of the 1st deflection component 76 and the 4th deflection component 79 is closed Turn into different positions in the 2nd optical axis BX2 direction.
Further, since there is reflective optics 62 the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field, the 2nd to go out This 4 visual field (suitable with IR, Img1, Img2, PA shown in Fig. 5) of visual field are penetrated, so in order to not make projected light beam EL2 4 Repeated in individual visual field, view field PA is preferably sized to defined size.That is, view field PA sweeping along substrate P Retouch the length on direction and be along the length on the width of the substrate P orthogonal with scanning direction：The length of scanning direction/wide Spend length≤1/4 in direction.Therefore, reflective optics 62 can not make projected light beam EL2 repeatedly will in 4 visual fields Projected light beam EL2 is separated and guided to partial optical system 61.
Moreover, the 1st deflection component 76, the 2nd deflection component 77, the 3rd deflection component 78 and the 4th deflection component 79 are formed as With the 1st incident visual field of slit-shaped, the 1st outgoing visual field, the 2nd incident visual field and this 4 visual fields of the 2nd outgoing visual field (equivalent to figure IR, Img1, Img2, PA shown in 5) any one corresponding rectangle, and in the slit along full imaging viewing field CIF Width (Z-direction) is configured separated from each other.
Focus amendment optical component 64 is configured between the 4th deflection component 79 and substrate P.Focus amendment optical component 64 is adjusted The focus condition of the picture of the whole mask pattern projected in substrate P.Focus amendment optical component 64 for example makes the prism of 2 wedge-likes It is reversely relative (reversely relative on X-direction in Fig. 4), overlapped as entirety in the way of as transparent parallel flat.Make 1 pair of prism is slided in the way of the interval between not changing mutually relative face along bevel direction, and is changed as parallel flat The thickness of plate.Therefore, it is possible to finely tune the effective optical path length of partial optical system 61, to being formed at intermediate image plane P7 and projection The focus condition of the picture of region PA mask pattern is finely adjusted.
As skew optical component 65 is configured between polarising beam splitter PBS and the 1st deflection component 76.As skew is used up The picture that department of the Chinese Academy of Sciences's part 65 makes to project to the mask pattern in substrate P can be adjusted movably in image planes.As skew optical component 65 by being capable of inclined transparent parallel plate glass and can be inclined transparent in Fig. 4 YZ faces in Fig. 4 XZ faces Parallel plate glass is constituted.By adjusting each tilt quantity of 2 parallel plate glass, can make to be formed at intermediate image plane P7 and The picture of view field PA mask pattern is slightly offset in X-direction or Y-direction.
Multiplying power amendment optical component 66 is configured between the 4th deflection component 79 and substrate P.Multiplying power amendment optical component 66 are configured to for example make the arranged coaxial at predetermined intervals of concavees lens, convex lens, concavees lens this 3, and front and rear concavees lens are fixed, are allowed to Between convex lens along optical axis (chief ray) direction move.Therefore, the picture for being formed at view field PA mask pattern maintains telecentricity Image formation state, and isotropically only zoomed in or out with micro.In addition, constituting multiplying power amendment with the 3 of optical component 66 The optical axis of piece lens group is tilted in XZ faces in the mode parallel with projected light beam EL2 (the 2nd projected light beam EL2b) chief ray.
Correction mechanism 67 is rotated for example by actuator (diagram is omited), makes the 2nd deflection component 77 around flat with the 2nd optical axis BX2 The axle of row (or vertical) somewhat rotates.The rotation correction mechanism 67 rotates the 2nd deflection component 77, in making to be formed at Between the image planes P7 picture of mask pattern somewhat rotated in the P7 of its face.
Polarised light adjustment mechanism 68 for example by actuator (diagram is omited), makes quarter wave plate 41 be revolved around the axle orthogonal with plate face Turn to adjust direction of polarized light.Polarised light adjustment mechanism 68 can adjust by rotating quarter wave plate 41 and be projected to projected area Domain PA projected light beam EL2 (the 2nd projected light beam EL2b) illumination.
In the projection optical system PL constituted like this, the 1st projected light beam EL2a from light shield M is from illumination region IR Along light shield face P1 normal direction (using the 1st axle AX1 as center radial direction) project, from quarter wave plate 41, polarising beam splitter PBS and as skew optical component 65 by and be incident to reflective optics 62.Throw be incident to reflective optics 62 the 1st Shadow light beam EL2a is reflected by the 1st reflecting surface P3 of the 1st deflection component 76 of reflective optics 62, is incident to partial optical system 61.The 1st projected light beam EL2a for being incident to partial optical system 61 passes through from the 1st lens group 71 of partial optical system 61, by 1st concave mirror 72 reflects.By the 1st concave mirror 72 reflect after the 1st projected light beam EL2a again by the 1st lens group 71 from portion Spectroscopy system 61 is projected.The 1st projected light beam EL2a projected from partial optical system 61 is by the 2nd inclined of reflective optics 62 The 2nd reflecting surface P4 reflections of rotation member 77, are incident to perspective view diaphragm 63.The 2nd projection passed through from perspective view diaphragm 63 Light beam EL2b is reflected by the 3rd reflecting surface P5 of the 3rd deflection component 78 of reflective optics 62, is again incident on partial optical system System 61.Be incident to the 2nd projected light beam EL2b of partial optical system 61 from the 1st lens group 71 of partial optical system 61 by and Reflected by the 1st concave mirror 72.The 2nd projected light beam EL2b reflected by the 1st concave mirror 72 again from the 1st lens group 71 by and from Partial optical system 61 is projected.The 2nd projected light beam EL2b from the injection of partial optical system 61 is by the 4th of reflective optics 62 The 4th reflecting surface P6 reflections of deflection component 79, are incident to focus amendment optical component 64 and multiplying power amendment optical component 66.From The 2nd projected light beam EL2b that multiplying power amendment is projected with optical component 66 is incident to the view field PA in substrate P, illumination region IR The picture of interior shown mask pattern is projected to view field PA with equimultiple (× 1).
＜ device making methods ＞
Next, reference picture 6, is illustrated for device making method.Fig. 6 is the device system for representing the 1st embodiment Make the flow chart of method.
In the device making method shown in Fig. 6, first, the display formed such as the self-emission device as organic EL is carried out The function and performance design of panel, pass through the circuit pattern and/or wiring pattern (step S201) of the designs such as CAD.Then, Based on each layer of pattern in the various layers designed by CAD etc., come the light shield M (steps of the layer amount needed for making S202).In addition, preparing to be wound with substrate P (resin film, metal foil film, the modeling with flexibility of the base material as display panel Material etc.) supply roller FR1 (step S203).In addition, the substrate P of the roll prepared in step S203 as needed can be with It is the substrate being modified to its surface, is previously formed the base of basalis (such as the minute asperities based on impressing mode) Plate, it is laminated with the functional membrane of photoinduction and/or the substrate of hyaline membrane (insulating materials) in advance.
Then, the electrode of composition display panel device is formed in substrate P and (film is partly led by wiring, dielectric film, TFT Body) etc. composition baseplane layer, and form in the way of being laminated in the baseplane hair based on self-emission devices such as organic EL Photosphere (display pixel portion) (step S204).In step S204, also comprising illustrating in each embodiment before use The conventional photo-mask process that exposure device U3 is exposed to photoresist layer, but also include the place based on following process etc. Reason：To being coated with the substrate P progress pattern exposure of photonasty silane coupling agent material instead of photoresist in surface shape Into the exposure process of hydrophilic pattern；Pattern exposure is carried out to the catalyst layer of photoinduction and passes through non-electrolytic plating method shape Into the wet type operation of the pattern (wiring, electrode etc.) of metal film；Or described using conductive ink containing Nano silver grain etc. Printing process of pattern etc..
Then, base is cut by each display panel device being continuously manufactured by by roller mode in the substrate P of strip Plate P pastes protective film (resistance to environmental barrier layer) and colorized optical filtering sheet etc. on the surface of each display panel device, from And assembly device (step S205).Then, carry out inspection operation, check display panel device whether normally function, be It is no to meet desired performance and characteristic (step S206).By described above, display panel (flexible display) can be manufactured.
More than, in the 1st embodiment, due to can be by matching somebody with somebody with projection optical system PL (Projection optics PLM) The reflective optics 62 of conjunction and the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field and the 2nd outgoing visual field are divided each other From so the generation of the leak light from the 1st projected light beam EL2a can be suppressed.Therefore, reflective optics 62 is formed as letting out Exposure is difficult to project the composition in substrate P, so the deterioration of picture of the projection exposure to substrate P can be prevented.
In addition, in the 1st embodiment, due to view field PA can be made to be set to the length/width direction of scanning direction Length≤1/4, so regarding for the 1st projected light beam EL2a in reflective optics 62 and the 2nd projected light beam EL2b can be made , i.e. the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field and the 2nd outgoing visual field are not repeatedly separated.
In addition, in the 1st embodiment, due to illuminating bundle EL1 can be made to be laser, so can suitably ensure to throw It is incident upon view field PA the 2nd projected light beam EL2b illumination.
In addition, in the 1st embodiment, making the 1st projected light beam EL2a and the 2nd projected light for being incident to refractor 71a Beam EL2b is located at refractor 71a upper side, makes from refractor 71a the 1st projected light beam EL2a projected and the 2nd projected light Beam EL2b is located at refractor 71a lower side.As long as however, the 1st incident visual field, the 1st outgoing visual field, the 2nd incidence can be made Visual field and the 2nd outgoing visual field are separated from each other, just relative without being particularly limited to the 1st projected light beam EL2a and the 2nd projected light beam EL2b In refractor 71a incoming position and Exit positions.
[the 2nd embodiment]
Next, reference picture 7, is illustrated for the exposure device U3 of the 2nd embodiment.In addition, in the 2nd embodiment In, in order to avoid the record repeated with the 1st embodiment, illustrated only for the part different from the 1st embodiment, for With the 1st embodiment identical inscape, mark is illustrated with the 1st embodiment identical reference.Fig. 7 is to represent The figure of the lamp optical system of the exposure device of 2nd embodiment and the composition of projection optical system.The exposure of 1st embodiment Device U3 carries out visual field separation in projection optical system PL reflective optics 62, so as to be difficult to produce leak light.2nd is real Applying the exposure device U3 of mode makes in projection optical system PL reflective optics 100, is formed by projected light beam EL2 The image space of the image space of projection image and the bad picture formed by leak light is different on the scanning direction of substrate P.
In the exposure device U3 of the 2nd embodiment, projection optical system PL is from the projected light beam EL2's from light shield M Light incident side has quarter wave plate 41, polarising beam splitter PBS, Projection optics PLM in order, and Projection optics PLM is included Partial optical system 61, reflective optics (guide-lighting optical system) 100, perspective view diaphragm 63.In addition, Projection optics PLM includes focus amendment optical component 64, as skew is used up with optical component 65, multiplying power amendment in a same manner as in the first embodiment Department of the Chinese Academy of Sciences's part 66, rotation correction mechanism 67 and polarised light adjustment mechanism 68.Further, since quarter wave plate 41, polarising beam splitter PBS, Partial optical system 61, perspective view diaphragm 63, focus amendment optical component 64, as skew optical component 65, multiplying power amendment It is that identical is constituted with optical component 66, rotation correction mechanism 67 and polarised light adjustment mechanism 68, so omitting the description.
Reflective optics 100 has the 1st polarising beam splitter (the 1st reflection part) PBS1, the 2nd polarising beam splitter (the 2nd reflection part) PBS2,1/2 wave plate 104, the 1st deflection component (the 1st optical component and the 3rd reflecting part) the 105, the 2nd deflector Part (the 2nd optical component and the 4th reflecting part) the 106, the 1st shadow shield 111, the 2nd shadow shield 112.1st polarising beam splitter PBS1 has There is the 1st polarised light parting surface P10.1st polarised light parting surface P10 makes the 1st projected light beam from polarising beam splitter PBS1 EL2a reflects, and the 1st projected light beam EL2a reflected is incident to the refractor 71a of the 1st lens group 71.In addition, the 1st polarization Light parting surface P10 passes through the 2nd projected light beam EL2b from intermediate image plane P7, makes the 2nd projected light beam EL2b of transmission incident To the refractor 71a of the 1st lens group 71.2nd polarising beam splitter PBS2 has the 2nd polarised light parting surface P11.2nd polarization Light parting surface P11 passes through the 1st projected light beam EL2a of the refractor 71a from the 1st lens group 71, makes the 1st after passing through Projected light beam EL2a is incident to the 1st deflection component 105.In addition, the 2nd polarised light parting surface P11 makes the folding from the 1st lens group 71 Lens 71a the 2nd projected light beam EL2b reflections are penetrated, the 2nd projected light beam EL2b reflected is incident in substrate P.1/2 wave plate 104 will be converted to the 1st of P polarization light by the 1st projected light beam EL2a of the 1st polarising beam splitter PBS1 S-polarization light reflected throws Shadow light beam EL2a.In addition, 1/2 wave plate 104 is by from the 2nd projected light beam of the 1st polarising beam splitter PBS1 P polarization light passed through EL2b is converted to the 2nd projected light beam EL2b of S-polarization light.1st deflection component 105 is the speculum with the 1st reflecting surface P12. 1st reflecting surface P12 makes the 1st projected light beam EL2a reflections passed through from the 2nd polarising beam splitter PBS2, makes the reflected the 1st to throw Shadow light beam EL2a is incident to the perspective view diaphragm 63 located at intermediate image plane P7.2nd deflection component 106 is that have the 2nd reflecting surface P13 speculum.2nd reflecting surface P13 reflects the 2nd projected light beam EL2b from perspective view diaphragm 63, makes after reflection 2nd projected light beam EL2b is incident to the 1st polarising beam splitter PBS1.Like this, the 1st deflection component 105 and the 2nd deflection component 106 as making sides of the 1st projected light beam EL2a from partial optical system 61 to be turned back again towards partial optical system 61 The folding mirrors of formula reflection play a role.
Further, since the 1st polarising beam splitter PBS1 is provided with reflective optics 100, so in order that from inclined The projected light beam of P polarization light after the beam splitter PBS that shakes transmissions is reflected by the 1st polarising beam splitter PBS1, in polarized light beam splitting 1/2 wave plate 107 is provided between device PBS and the 1st polarising beam splitter PBS1.
1st shadow shield 111 is located between the 2nd polarising beam splitter PBS2 and substrate P.1st shadow shield 111 is located at and can hidden Gear is incident to the 2nd polarising beam splitter PBS2 a 1st projected light beam EL2a part not from the 2nd polarising beam splitter PBS2's Positions of the 2nd polarised light parting surface P11 through the reflected light (leak light) of ground reflection.
2nd shadow shield 112 is located between the 1st polarising beam splitter PBS1 and the 2nd polarising beam splitter PBS2.2nd shading Plate 112 blocks the leak light that the 2nd polarising beam splitter PBS2 is leaked to from the 1st polarising beam splitter PBS1.
1st projected light beam EL2a of the P polarization light from polarising beam splitter PBS leads to from as skew optical component 65 Cross, and passed through from 1/2 wave plate 107.The 1st projected light beam EL2a passed through from 1/2 wave plate 107 is converted to after S-polarization light, is incident to 1st polarising beam splitter PBS1.The 1st polarising beam splitter PBS1 the 1st projected light beam EL2a of S-polarization light is incident to by the 1st Polarising beam splitter PBS1 the 1st polarised light parting surface P10 reflections.By the 1st polarised light parting surface P10 S-polarization light reflected 1st projected light beam EL2a is passed through from 1/2 wave plate 104.The 1st projected light beam EL2a passed through from 1/2 wave plate 104 is converted to P polarization After light, the 1st lens group 71 is incident to.The 1st projected light beam EL2a of the 1st lens group 71 is incident to from comprising refractor 71a's Multiple lenticular units are incident to the 1st concave mirror 72 by rear.At this moment, the 1st projected light beam EL2a is in the 1st lens group 71, from folding The field of view (the 1st incident visual field) for penetrating lens 71a upper side passes through.It is incident to the 1st projected light beam of the 1st concave mirror 72 EL2a is reflected by the 1st concave mirror 72.The 1st projected light beam EL2a reflected by the 1st concave mirror 72 is incident to the 1st lens group 71, from Multiple lenticular units comprising refractor 71a are projected by rear from the 1st lens group 71.At this moment, the 1st projected light beam EL2a exists In 1st lens group 71, pass through from the field of view (the 1st outgoing visual field) of refractor 71a lower side.From the 1st lens group 71 The 1st projected light beam EL2a projected is incident to the 2nd polarising beam splitter PBS2.The P for being incident to the 2nd polarising beam splitter PBS2 is inclined The 1st projected light beam EL2a of light of shaking is passed through from the 2nd polarised light parting surface P11.The 1st throwing passed through from the 2nd polarised light parting surface P11 Shadow light beam EL2 is incident to the 1st deflection component 105, is reflected by the 1st reflecting surface P12 of the 1st deflection component 105.By the 1st reflecting surface 1st projected light beam EL2a of P12 reflections is incident to perspective view diaphragm 63.It is incident to the 1st projected light of perspective view diaphragm 63 Beam EL2a is formed into the intermediary image of the inverted image of the mask pattern in illumination region IR.
The 2nd projected light beam EL2b from perspective view diaphragm 63 is anti-by the 2nd reflecting surface P13 of the 2nd deflection component 106 Penetrate.1st polarising beam splitter PBS1 is incident to by the 2nd reflecting surface P13 the 2nd projected light beam EL2b reflected.It is incident to the 1st polarization 2nd projected light beam EL2b of beam splitter PBS1 P polarization light is passed through from the 1st polarised light parting surface P10.From the 1st polarised light point The 2nd projected light beam EL2b from the face P10 P polarization light passed through is passed through from 1/2 wave plate 104.The 2nd throwing passed through from 1/2 wave plate 104 Shadow light beam EL2b is converted to after S-polarization light, is incident to the 1st lens group 71.It is incident to the 2nd projected light beam of the 1st lens group 71 EL2b, by rear, is incident to the 1st concave mirror 72 from multiple lenticular units comprising refractor 71a.At this moment, the 2nd projected light beam EL2b passes through in the 1st lens group 71 from the field of view (the 2nd incident visual field) of refractor 71a upper side.It is incident to 2nd projected light beam EL2b of 1 concave mirror 72 is reflected by the 1st concave mirror 72.The 2nd projected light beam reflected by the 1st concave mirror 72 EL2b is incident to the 1st lens group 71, from multiple lenticular units comprising refractor 71a by rear, is penetrated from the 1st lens group 71 Go out.At this moment, the 2nd projected light beam EL2b is in the 1st lens group 71, and from the field of view of refractor 71a lower side, (the 2nd goes out Penetrate visual field) pass through.The 2nd projected light beam EL2b projected from the 1st lens group 71 is incident to the 2nd polarising beam splitter PBS2.It is incident The 2nd projected light beam EL2b to the 2nd polarising beam splitter PBS2 S-polarization light is reflected by the 2nd polarised light parting surface P11.By the 2nd 2nd projected light beam EL2b of polarised light parting surface P11 reflections is from focus amendment optical component 64 and multiplying power amendment optical component 66 pass through, and are projected to the view field PA in substrate P.The 2nd projected light beam EL2b for being projected to view field PA is formed into photograph The projection image of the erect image of mask pattern in the IR of area pellucida domain.At this moment, the picture of the mask pattern in illumination region IR with equimultiple (× 1) project to view field PA.
Here, the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component the 105 and the 2nd are deflected Part 106 be configured to make by by the 2nd polarising beam splitter PBS2 the 2nd projected light beam EL2b reflected the projection images formed into Image position and formed as the leak light of a part by the 2nd polarising beam splitter PBS2 the 1st projected light beam EL2a reflected The image space of bad picture is different on the scanning direction of substrate P.Specifically, so that relative to the 1st polarising beam splitter PBS1 the 1st polarised light parting surface P10, the 1st projected light beam EL2a incoming position and the 2nd projected light beam EL2b incoming position Different modes configures the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the deflection of the 1st deflection component the 105 and the 2nd Part 106.By being set to such configuration, the 2nd polarised light parting surface P11 that can be relative to the 2nd polarising beam splitter PBS2, Make the 2nd projected light beam EL2b incoming position and the 1st projected light beam EL2a incoming position difference.It is inclined by the 2nd therefore, it is possible to make The light parting surface P11 that shakes reflection the 2nd projected light beam EL2b projection image image space and as by the 2nd polarised light parting surface The image space of the bad picture of the leak light of 1st projected light beam EL2a of a P11 reflections part is on the scanning direction of substrate P It is different.
In this case, the 1st shadow shield 111 is located at the leakage blocked from the 2nd polarising beam splitter PBS2 towards substrate P The position of light.Therefore, the 1st shadow shield 111 allows the 2nd projected light beam EL2b from the 2nd polarising beam splitter PBS2 towards substrate P The projection to substrate P, and block the leak light from the 2nd polarising beam splitter PBS2 towards substrate P.
Like this, the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the deflection of the 1st deflection component the 105, the 2nd The shadow shield 111 of part 106 and the 1st makes the image space of projection image and the image space of bad picture on the scanning direction of substrate P Difference, leak light is blocked by the 1st shadow shield 111.Therefore, reflective optics 100 is used as the leakage that will be projected in substrate P The light quantity reduction portion of the light quantity reduction of light and play a role.
In addition, the incidence of the 1st projected light beam EL2a in the 1st polarising beam splitter PBS1 the 1st polarised light parting surface P10 Position and the 1st projected light beam EL2a in the 2nd polarising beam splitter PBS2 the 2nd polarised light parting surface P11 incoming position into To clip the 2nd symmetrical positions of optical axis BX2.In addition, in the 1st polarising beam splitter PBS1 the 1st polarised light parting surface P10 The 2nd projected light in 2 projected light beam EL2b incoming position and the 2nd polarising beam splitter PBS2 the 2nd polarised light parting surface P11 Beam EL2b incoming position, which turns into, clips the 2nd symmetrical positions of optical axis BX2.In other words, the 1st of the 1st polarising beam splitter PBS1 The incoming position and the 2nd polarising beam splitter PBS2 the 2nd polarised light of the 1st projected light beam EL2a in polarised light parting surface P10 The incoming position of the 2nd projected light beam EL2b in parting surface P11, which turns into, clips the 2nd asymmetrical positions of optical axis BX2.
The incoming position and the 2nd polarised light parting surface P11 of the 1st projected light beam EL2a in the 1st polarised light parting surface P10 In the 2nd projected light beam EL2b incoming position turn into clip the 2nd asymmetrical positions of optical axis BX2 in the case of, view field PA turns into relative to the illumination region IR positions that (the 2nd optical axis direction) is offset in X direction.In this case, in order that from light Cover M on illumination region IR1 (and IR3, IR5) central point to illumination region IR2 (and IR4, IR6) central point girth with From the central point of the view field PA1 (and PA3, PA5) in substrate P to the 2nd view field PA2 (and PA4, PA6) central point Girth be set to identical length, make the 1st projection optical system PL1 (and PL3, PL5) and the 2nd projection optical system PL2 (and PL4, PL6) it is set to the different composition in part.
1st projection optical system PL1 (and PL3, PL5) of odd number (Fig. 7 left side) is so that in the 1st polarized light beam splitting In device PBS1 the 1st polarised light parting surface P10, the incidence of the 1st projected light beam EL2a incoming position and the 2nd projected light beam EL2b Position compare positioned at Z-direction upper side and positioned at X-direction central side mode, be configured with the 1st polarising beam splitter PBS1, 2nd polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd deflection component 106.Therefore, in the 2nd polarising beam splitter PBS2 The 2nd polarised light parting surface P11 in, the incoming position phase of the 2nd projected light beam EL2b incoming position and the 1st projected light beam EL2a Than the upper side positioned at Z-direction and the outside positioned at X-direction.
That is, the 1st projection optical system PL1 in z-direction, the reflecting part as the 1st polarising beam splitter PBS1, the 2nd The reflecting part of deflection component 106, the 2nd polarising beam splitter PBS2 reflecting part, the reflecting part of the 1st deflection component 105 Order.Therefore, as shown in fig. 7, the 2nd deflection component 106 is on along full imaging viewing field CIF direction (Z-direction), being configured at Between 1 polarising beam splitter PBS1 reflecting part and the 2nd polarising beam splitter PBS2 reflecting part.In addition, in the 1st projection In optical system PL1, the position of the 1st polarising beam splitter PBS1 and the 2nd polarising beam splitter PBS2 reflecting part and the 1st inclined The position of the deflection component 106 of rotation member 105 and the 2nd turns into diverse location on the 2nd optical axis BX2 direction.
2nd projection optical system PL2 (and PL4, PL6) of even number (Fig. 7 right side) is so that in the 1st polarized light beam splitting In device PBS1 the 1st polarised light parting surface P10, the incidence of the 1st projected light beam EL2a incoming position and the 2nd projected light beam EL2b The lower side positioned at Z-direction and the mode in the outside positioned at X-direction are compared in position, are configured with the 1st polarising beam splitter PBS1, the 2 polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd deflection component 106.Therefore, the 2nd polarising beam splitter PBS2's In 2nd polarised light parting surface P11, the incoming position of incoming position and the 1st projected light beam EL2a as the 2nd projected light beam EL2b Compare, the lower side positioned at Z-direction and the central side positioned at X-direction.
That is, the 2nd projection optical system PL2 is in Z-direction, reflecting part, the 1st polarised light as the 2nd deflection component 106 Beam splitter PBS1 reflecting part, the reflecting part of the 1st deflection component 105, the 2nd polarising beam splitter PBS2 reflecting part Sequentially.Therefore, as shown in fig. 7, the 1st deflection component 105 is on along full imaging viewing field CIF direction (Z-direction), being configured at the 1st Between polarising beam splitter PBS1 reflecting part and the 2nd polarising beam splitter PBS2 reflecting part.In addition, in the 2nd projection In optical system PL2, in the same manner as the 1st projection optical system PL1, the 1st polarising beam splitter PBS1 and the 2nd polarising beam splitter The side of the position of PBS2 reflecting part and the position of the 1st deflection component 105 and the 2nd deflection component 106 on the 2nd optical axis BX2 To as diverse location.
Moreover, the 1st polarising beam splitter PBS1 reflecting part, the 2nd polarising beam splitter PBS2 reflecting part, the 1st The deflection component 106 of deflection component 105 and the 2nd is formed as regarding with the 1st incident visual field, the 1st outgoing visual field, the 2nd incidence of slit-shaped Any one of field and this 4 visual field (equivalent to IR, Img1, Img2, PA shown in Fig. 5) of the 2nd outgoing visual field are corresponding rectangular Shape, and be separately from each other on the width (Z-direction) of the slit along full imaging viewing field CIF.In addition, in Figure 5, the 1st projection optical system PL1 (and PL3, PL5) of odd number situation is, from the top of Z-direction in order, as lighting area Domain IR, intermediary image Img2, view field PA, intermediary image Img1.On the other hand, the 2nd projection optical system PL2 of even number The situation of (and PL4, PL6) is, turn into order from the top of Z-direction intermediary image Img2, illumination region IR, intermediary image Img1, View field PA.
As described above, make the 1st projection optical system PL1 (and PL3, PL5) and the 2nd projection optical system PL2 (and PL4, PL6) be set to the different composition in part, so as to make from the central point of the illumination region IR1 (and IR3, IR5) on light shield M to The girth Δ Dm of illumination region IR2 (and IR4, IR6) central point and from the view field PA1's (and PA3, PA5) in substrate P The girth Δ Ds of central point to the 2nd view field PA2 (and PA4, PA6) central point is identical length.At this moment, due to projection Region PA is relative to the position of illumination region IR (the 2nd optical axis BX2 directions) skews in X direction, so light shield holding cylinder 21 1st axle AX1 and substrate supporting cylinder 25 the 2nd axle AX2 and offsets of the view field PA relative to illumination region IR in the circumferential Correspondingly offset along the 2nd optical axis BX2 directions.
More than, the 2nd embodiment is in reflective optics 100, to make the projection by the 2nd projected light beam EL2b formation The image space of the image space of picture and the bad picture for passing through the leak light formation from the 1st projected light beam EL2a is in substrate P It is different on scanning direction, so as to block leak light by the 1st shadow shield 111.Therefore, reflective optics 100 can hide Gear is projected to the leak light in substrate P, so projection image can be made suitably to project in substrate P.
In addition, the 2nd embodiment is in reflective optics 100, the 1st projected light beam EL2a and can be both partitioned into 2 projected light beam EL2b visual field, i.e. the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field and the 2nd outgoing visual field, also may be used Repeated with a part.That is, the 2nd embodiment is, due to that need not make the 1st projected light beam EL2a's and the 2nd projected light beam EL2b Visual field is separated as the 1st embodiment, so the configuration phase with the various optical components of reflective optics 100 can be improved The free degree of pass.
In addition, in the 2nd embodiment, 1/2 ripple is provided between the 1st polarising beam splitter PBS1 and refractor 71a Piece 104, but it is not limited to this composition.For example, it is also possible to set the 1st between the 1st polarising beam splitter PBS1 and refractor 71a Individual quarter wave plate, and the 2nd quarter wave plate of setting between the 2nd polarising beam splitter PBS2 and refractor 71a.In such case Under, the 1st quarter wave plate and the 2nd quarter wave plate integration can also be made.
[the 3rd embodiment]
Next, reference picture 8, is illustrated for the exposure device U3 of the 3rd embodiment.In addition, in the 3rd embodiment In, it is also to be illustrated only for the part different from the 2nd embodiment in order to avoid the record repeated with the 2nd embodiment, For with the 2nd embodiment identical inscape, mark illustrated with the 2nd embodiment identical reference.Fig. 8 is Represent the figure of the composition of the projection optical system of the exposure device of the 3rd embodiment.The exposure device U3 of 2nd embodiment is being thrown In shadow optical system PL reflective optics 100, make by the 2nd projected light beam EL2b formation projection image image space and The image space of the bad picture formed by leak light is different on the scanning direction of substrate P.The exposure device of 3rd embodiment U3 makes the image space by the projected light beam EL2 projection images formed in projection optical system PL reflective optics 130 It is different in depth direction (focus direction) with the image space of the bad picture formed by leak light.In addition, in fig. 8, in order to Simplify the explanation in the 3rd embodiment, only depicted portion optical system 131 and reflective optics 130.In addition, in fig. 8, Light shield face P1 and substrate P are abreast configured along XY faces, make the chief ray and XY of the 1st projected light beam EL2a from light shield face P1 Face is vertical, makes the chief ray of the 2nd projected light beam EL2b to substrate P vertical with XY faces.
In the projection optical system PL of the 3rd embodiment, partial optical system 131 has refractor 71a and the 1st recessed Face mirror 72.Further, since refractor 71a and the 1st concave mirror 72 are and the 1st embodiment and the 2nd embodiment identical structure Into so omitting the description.In addition, in partial optical system 131, it is identical with the 2nd embodiment, can also be in refractor Multiple lenticular units are configured between 71a and the 1st concave mirror 72.
Reflective optics 130 has the 1st polarising beam splitter (the 1st reflection part) PBS1, the 2nd polarising beam splitter (the 2nd reflection part) PBS2,1/2 wave plate 104, the 1st deflection component (the 1st optical component and the 3rd reflecting part) the 105 and the 2nd are deflected Part (the 2nd optical component and the 4th reflecting part) 106.In addition, the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, Although differences such as 1/2 wave plate 104, the 1st deflection component 105 and the 2nd deflection component 106 and the 2nd a part of angles of embodiment, Due to being roughly the same composition so omitting the description.
Here, in fig. 8, it is illustrated that send as an envoy to and the 1st polarising beam splitter PBS1 the 1st projected light beam is incident to from light shield face P1 EL2a centered on the 1st polarising beam splitter PBS1 the 1st polarised light parting surface P10 and face is symmetrically obtained the virtual 1st throws Shadow light beam EL3.At this moment, being imaged out the face of the 1st virtual projected light beam EL3 turns into imaginary light shield face P15.In addition, in Fig. 8 In, it is illustrated that the 1st projected light beam EL2a for being incident to the 1st deflection component 105 from the 2nd polarising beam splitter PBS2 that sends as an envoy to is inclined with the 1st Face is symmetrically obtained virtual the 1st projected light beam EL4 centered on 1st reflecting surface P12 of rotation member 105.At this moment, it is imaged out void The 1st projected light beam EL4 intended face turns into imaginary intermediate image plane P16.
1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd deflection component 106 are configured to：Pass through the imaging of projection image formed by the 2nd projected light beam EL2b that is reflected as the 2nd polarising beam splitter PBS2 Position and the shape by the leak light as the part by the 2nd polarising beam splitter PBS2 the 1st projected light beam EL2a reflected Into bad picture image space focus depth direction (that is, along imaging beam chief ray direction) it is different.It is specific next Say, so that the image space of the projection image in the virtual light shield face P15 of the 1st virtual projected light beam EL3 is in the depth direction Deepen, make the image space of bad picture in the virtual intermediate image plane P16 of the 1st virtual projected light beam EL4 in depth direction On the mode that shoals to configure the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd inclined Rotation member 106.
By being set to such configuration, pass through the 2nd polarised light parting surface P11 reflections by the 2nd polarising beam splitter PBS2 The 2nd projected light beam EL2b, good projection image is formed in substrate P.In addition, as by the 2nd polarising beam splitter PBS2's The leak light of 1st projected light beam EL2a of a 2nd polarised light parting surface P11 reflections part forms light in the nearby side of substrate P The bad picture of cover pattern.That is, the projection in substrate P is turned into by the image space of the projection image of the 2nd projected light beam EL2b formation Region PA, the image space of the bad picture formed by leak light turns into the position between the 2nd polarising beam splitter PBS2 and substrate P Put.Therefore, because the image space of bad picture is located between the 2nd polarising beam splitter PBS2 and substrate P, so by being projected to The bad picture of leakage photogenerated in substrate P turns into extremely unsharp state.
Like this, due to the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component the 105, the 2nd Deflection component 106 in the depth direction, makes the image space of projection image different with the image space of bad picture, so reflection optics The light quantity reduction portion of the light quantity for the leak light that system 130 is projected in substrate P as reducing plays a role.
In addition, making the image space of the projection image in the virtual light shield face P15 of the 1st virtual projected light beam EL3 in depth Degree is deepened on direction, the image space of the bad picture in the virtual intermediate image plane P16 of the 1st virtual projected light beam EL4 is existed Shoal, so as to extend the light path from light shield face P1 to the 1st polarising beam splitter PBS1, shorten from the 2nd polarised light on depth direction Beam splitter PBS2 to intermediate image plane P7 light path.Therefore, it is possible to shorten from the 2nd polarising beam splitter PBS2 via intermediate image plane P7 The light path turned back to the 1st polarising beam splitter PBS1.
More than, the 3rd embodiment can make the throwing by the 2nd projected light beam EL2b formation in reflective optics 130 The image space of the image space of image and the bad picture for passing through the leak light formation from the 1st projected light beam EL2a is in focus depth The direction (along the direction of the chief ray of imaging beam) of degree is different.Therefore, because reflective optics 130 can make to be projected to base Leak light on plate P turns into extremely unsharp state, so the light quantity for the leak light being projected in substrate P can be reduced, can Reduce the influence brought to the projection image being projected in substrate P.
Further, since the 3rd embodiment need not separate visual field as the 1st embodiment, or such as the 2nd embodiment Make the incoming position to the 2nd polarised light parting surface P11 different like that, so can further improve in reflective optics 130 Design the free degree.
[the 4th embodiment]
Next, reference picture 9, the exposure device U3 on the 4th embodiment is illustrated.In addition, in the 4th embodiment In, it is also to be illustrated only for the part different from the 1st embodiment in order to avoid the record repeated, for implementing with the 1st Mode identical inscape, mark is illustrated with the 1st embodiment identical reference.Fig. 9 is to represent the 4th embodiment party The figure being monolithically fabricated of the exposure device (substrate board treatment) of formula.The exposure device U3 of 1st embodiment is to make substrate P by having There is the composition of the supporting of substrate supporting cylinder 25 of the bearing-surface P2 as periphery, but the exposure device U3 of the 4th embodiment turns into It is plane composition by substrate P supporting.
In the exposure device U3 of the 4th embodiment, base supporting mechanism 150 has a pair of drivings that substrate P is set up Roller 151.A pair of driven rollers 151 are rotated by the 2nd drive division 26, so that substrate P is moved along scanning direction.
Therefore, base supporting mechanism 150 make the substrate P moved from driven roller R4 from the driven roller 151 of a side guide to The driven roller 151 of the opposing party, so that substrate P is ridden upon in a pair of driven rollers 151.Base supporting mechanism 150 passes through the 2nd driving Portion 26 rotates a pair of driven rollers 151, so that the substrate P ridden upon in a pair of driven rollers 151 is guided to driven roller R5.
At this moment, because Fig. 9 substrate P is as plane substantially parallel with XY faces, so being projected to the 2nd in substrate P Projected light beam EL2b chief ray turns into vertical with XY faces.The chief ray for the 2nd projected light beam EL2b being projected in substrate P turns into In the case of vertical with XY faces, with the 2nd projected light beam EL2b chief ray correspondingly, projection optical system PL the 2nd polarised light Angle in beam splitter PBS2 the 2nd polarised light parting surface P11 is also suitably changed.
It is also identical with Fig. 2 before in addition, in the 4th embodiment, when being observed in XZ faces, on light shield M from illumination The girth of region IR1 (and IR3, IR5) central point to illumination region IR2 (and IR4, IR6) central point be set as with along The central point from view field PA1 (and PA3, PA5) in bearing-surface P2 substrate P to the 2nd view field PA2 (and PA4, PA6 the girth of central point) is substantially equal.
In Fig. 9 exposure device U3, make light shield holding cylinder 21 and a pair of driven rollers 151 also by slave control device 16 With defined rotary speed than synchronous rotary, make the picture of mask pattern that is formed on light shield M light shield face P1 continuously repeatedly Projection exposure is on the surface for riding upon the substrate P in a pair of driven rollers 151.
More than, in the 4th embodiment, even if substrate P be supported to it is plane in the case of, due to leak light can be reduced Influence to forming the projection image in substrate P, so also can suitably project projection image to substrate P.
In addition, in each embodiment more than, reflection-type or thoroughly has been used as cylindric light shield M Cross the cylinder light shield of type.In this case, if on the outer peripheral face of the transmission cylinder (quartz ampoule etc.) of certain wall thickness shape Into the pattern based on photomask, multiple it will be shone to such shown in Fig. 3 left side from the inside through cylinder towards outer peripheral face The lamp optical system of area pellucida domain IR1~IR6 difference projection illumination light and light source portion are located at the inside through cylinder.Enter In the case of the such a transmission illumination of row, the deflection polarising beam splitter PBS and 1/4 shown in Fig. 2, Fig. 4, Fig. 7 can be omitted Wave plate 41 etc..
And, although the light shield M of cylindrical shape has been used in each embodiment but it is also possible to be typical plane light shield. In this case, it is believed that the radius Rm for the cylindric light shield M being illustrated in Figure 2 is infinitely great, as long as so that from mask pattern Chief ray and the light shield face of imaging beam turn into the reflecting surface that vertical mode sets the 1st deflection component 76 in such as Fig. 2 P3 angle.
In addition, in each embodiment more than, used be formed with it is corresponding with the pattern that project to substrate P The light shield (hard light shield) of static pattern is but it is also possible to be as follows without light shield Exposure mode：Multiple Projection optics PL1~ Configured on PL6 each illumination region IR1~IR6 position (the object plane positions of each Projection optics) by multiple movable pettiness mirrors DMD (Micro Mirror Device) and/or SLM (spatial optical modulation element) of composition etc., while being moved with the conveyance of substrate P It is dynamic that dynamic pattern light is synchronously generated by DMD or SLM, while pattern is transferred into substrate P.In this case, generate dynamic The DMD and SLM of state pattern are equivalent to light shield part.
Description of reference numerals
1 device inspection apparatus
2 substrate feeding devices
4 substrate retracting devices
5 host control devices
11 light shield maintaining bodies
12 base supporting mechanisms
13 light supply apparatuses
16 slave control devices
21 light shield holding cylinder
25 substrate supportings cylinder
31 light source portions
32 light guide members
41 quarter wave plates
51 collimation lenses
52 fly's-eye lenses
53 collector lenses
54 cylindrical lenses
55 illuminated field diaphragms
56 relay lens
61 partial optical systems
62 reflective optics
63 perspective view diaphragms
64 focus amendment optical components
65 as skew optical component
66 multiplying power amendment optical components
67 rotation correction mechanisms
68 polarised light adjustment mechanisms
71 the 1st lens groups
72 the 1st concave mirrors
76 the 1st deflection components
77 the 2nd deflection components
78 the 3rd deflection components
79 the 4th deflection components
91 the 1st prisms
92 the 2nd prisms
93 polarised light parting surfaces
100 reflective optics (the 2nd embodiment)
104 1/2 wave plates (the 2nd embodiment)
105 the 1st deflection components (the 2nd embodiment)
106 the 2nd deflection components (the 2nd embodiment)
107 1/2 wave plates (the 2nd embodiment)
111 the 1st shadow shields (the 2nd embodiment)
112 the 2nd shadow shields (the 2nd embodiment)
130 reflective optics (the 3rd embodiment)
131 partial optical systems (the 3rd embodiment)
150 base supporting mechanisms (the 4th embodiment)
151 driven rollers (the 4th embodiment)
P substrates
FR1 supply rollers
FR2 recovery rollers
U1~Un processing units
U3 exposure devices (substrate board treatment)
M light shields
The axles of AX1 the 1st
The axles of AX2 the 2nd
P1 light shields face
P2 bearing-surfaces
The reflectings surface of P3 the 1st
The reflectings surface of P4 the 2nd
The reflectings surface of P5 the 3rd
The reflectings surface of P6 the 4th
P7 intermediate image planes
The polarised light parting surfaces of P10 the 1st (the 2nd embodiment)
The polarised light parting surfaces of P11 the 2nd (the 2nd embodiment)
The reflectings surface of P12 the 1st (the 2nd embodiment)
The reflectings surface of P13 the 2nd (the 2nd embodiment)
Light shield face (the 3rd embodiment) virtual P15
Intermediate image plane (the 3rd embodiment) virtual P16
EL1 illuminating bundles
The projected light beams of EL2a the 1st
The projected light beams of EL2b the 2nd
The 1st projected light beam (the 3rd embodiment) virtual EL3
The 1st projected light beam (the 3rd embodiment) virtual EL4
Rm radius of curvature
Rfa radius of curvature
CL median planes
PBS polarising beam splitters
The polarising beam splitters of PBS1 the 1st (the 2nd embodiment)
The polarising beam splitters of PBS2 the 2nd (the 2nd embodiment)
IR1~IR6 illumination regions
IL1~IL6 lamp optical systems
ILM illumination optics
PA1~PA6 view fields
PL1~PL6 projection optical systems
PLM Projection optics
The optical axises of BX1 the 1st
The optical axises of BX2 the 2nd

Claims (19)

1. a kind of exposure device, projection exposure goes out mask pattern on the substrate with flexible strip, and it has：
Light shield holding cylinder, its be arranged to around the 1st axle rotate, and along relative to the 1st axle with certain radius of curvature Cylindric pattern plane keep the mask pattern；
Substrate supporting cylinder, it is arranged to around parallel with the 1st axle the 2nd axle rotation, by relative to the 2nd axle with A part for the cylindric bearing-surface of certain radius of curvature supports the substrate, and makes the substrate along strip Move in direction；
Projection optical system, it has partial optical system and guide-lighting optical system, and partial optical system incidence, which comes from, to be protected The 1st projected light of the mask pattern in the light shield holding cylinder is held, and forms in defined intermediate image plane the light The intermediary image of cover pattern, the guide-lighting optical system guides the 1st projected light projected from the partial optical system to institute Intermediate image plane is stated, and institute will be redirected to as the 2nd projected light by the 1st projected light after the intermediate image plane Partial optical system is stated, by the partial optical system of incident 2nd projected light by the intermediary image re-imaging Obtained projection image is projected on the substrate by substrate supporting cylinder supporting；And
Light quantity reduction portion, it as leak light using a part for the 1st projected light in order to be projected to the light on the substrate Amount is reduced, and makes the image space by the projection image of the 2nd projected light formation and one by the 1st projected light Divide the image space of bad picture formed by leak light different.
2. exposure device according to claim 1, wherein,
The partial optical system is included：For the incident lenticular unit of the 1st projected light and the 2nd projected light and will be logical The 1st projected light of the lenticular unit and the reflection optics of the 2nd projected light reflection have been crossed,
The 1st projected light from the mask pattern is incident to the lenticular unit, is reflected by the reflection optics Afterwards, projected from the lenticular unit, and reach the intermediate image plane, the 2nd projected light from the intermediate image plane is incident To the lenticular unit, after reflection optics reflection, projected from the lenticular unit, and reach on the substrate.
3. exposure device according to claim 2, wherein,
The light quantity reduction portion is configured to the guide-lighting optical system,
The light quantity reduction portion is included：
1st polarising beam splitter, the 1st projected light from the mask pattern of the 1st polarising beam splitter making reflect and The lenticular unit is incident to, and the 2nd projected light from the intermediate image plane is passed through and is incident to the lens section Part；
Wave plate, the wave plate makes the 1st projected light projected from the 1st polarising beam splitter and the 2nd projection light polarization；
2nd polarising beam splitter, the 2nd polarising beam splitter makes the institute that the wave plate is projected and passed through from the lenticular unit State the 1st projected light to pass through and be incident to the intermediate image plane, and make the wave plate is projected and passed through from the lenticular unit 2nd projected light reflection and towards on the substrate；
1st optical component, the 1st optical component is incident to the 1st projected light for having passed through the 2nd polarising beam splitter The intermediate image plane；And
2nd optical component, it is inclined that the 2nd optical component makes the 2nd projected light from the intermediate image plane be incident to the described 1st Shake beam splitter.
4. exposure device according to claim 3, wherein,
The light quantity reduction portion includes the 1st shadow shield, and the 1st shadow shield is located at the 2nd polarising beam splitter and the substrate Between,
The light quantity reduction portion makes by being formed by the 2nd projected light that the 2nd polarising beam splitter reflects described Direction of the image space of the image space of the projection image on substrate and the bad picture on the surface along the substrate Upper difference, it is described it is bad seem by not from the 2nd polarising beam splitter through and by the 2nd polarising beam splitter reflect The 1st projected light a part of leak light formation picture on the substrate,
1st shadow shield is located at the position that will be blocked from the leak light of the 2nd polarising beam splitter towards the substrate Put.
5. exposure device according to claim 4, wherein,
The light quantity reduction portion also includes the 2nd shadow shield, and the 2nd shadow shield is blocked from the 1st polarising beam splitter towards institute State the leak light of the 2nd polarising beam splitter.
6. exposure device according to claim 3, wherein,
The light quantity reduction portion makes by being formed by the 2nd projected light that the 2nd polarising beam splitter reflects described The image space of the image space of the projection image on substrate and the bad picture is different on the direction of the depth of focus, described Bad seems by not thrown from the 2nd polarising beam splitter through and by the 2nd polarising beam splitter reflects the described 1st The picture that a part of leak light of shadow light is formed.
7. exposure device according to claim 6, wherein,
From the mask pattern to the light path ratio of the 1st projected light of the 1st polarising beam splitter from the 2nd polarised light Optical path length of the beam splitter to the 1st projected light of the intermediate image plane.
8. exposure device according to any one of claim 1 to 7, wherein,
The substrate is scanned relative to the projection image by the rotation of substrate supporting cylinder,
The projection image is restricted to the length for making the scanning direction of the substrate scanning and the width for being orthogonal to the scanning direction It is less than 1/4 such elongated region to spend the length ratio in direction, the i.e. length in the length/width direction of scanning direction.
9. exposure device according to any one of claim 1 to 7, wherein,
Also there is the photograph that the laser of self-excitation light source in future is guided as illumination light to the pattern plane of the light shield holding cylinder Bright optical system.
10. exposure device according to any one of claim 1 to 7, wherein,
Multiple illumination regions of the pattern plane of the projection optical system with being configured at the light shield holding cylinder are accordingly set Have multiple,
Multiple projection optical systems are by multiple 1st projected lights of multiple illumination regions from the pattern plane Guided to multiple intermediate image planes, by multiple 2nd projected lights from multiple intermediate image planes to configuration described Multiple view fields guiding on substrate.
11. exposure device according to claim 10, wherein,
The light shield holding cylinder and substrate supporting cylinder are configured to：Protected in multiple projection optical systems along the light shield The circumference for holding the pattern plane of cylinder is configured to the projection of substrate described in 2 row and each projection optical system side by side Region relative to the pattern plane the illumination region in the case of circumferential offset, the light shield holding cylinder and the substrate Support in cylinder, the 2nd axle turns into relative to the position of the 1st axle to exist with the view field relative to the illumination region Offset in circumference correspondingly different position,
The projection optics system is arranged by the center of the illumination region corresponding with the 1st row projection optical system and with the 2nd The girth that the center for the corresponding illumination region of uniting circumferentially is linked up in the pattern plane of the light shield holding cylinder, With arranging the projection optical system by the center of the view field corresponding with the 1st row projection optical system and with the 2nd The center of the corresponding view field by the substrate supporting cylinder the supporting surface bearing the substrate on circumferentially The girth linked up is set as identical length.
12. a kind of exposure device, projection exposure goes out mask pattern on the substrate with flexible strip, it is characterised in that tool Have：
Light shield holding cylinder, its be arranged to around the 1st axle rotate, and along relative to the 1st axle with certain radius of curvature Cylindric pattern plane keep the mask pattern；
Substrate supporting cylinder, it is arranged to around parallel with the 1st axle the 2nd axle rotation, by relative to the 2nd axle with A part for the cylindric bearing-surface of certain radius of curvature supports the substrate, and makes the substrate along strip Move in direction；
Projection optical system, it is included：Imaging lens group, the imaging lens group makes the light of the pattern in field of view Beam is incident, the field of view is parallel with the 1st axle and slit-shaped be located in the pattern plane of the light shield holding cylinder；With The pupil plane of the imaging lens group or the speculum of pupil plane neighbouring position are configured at, makes to come from institute by the speculum The light beam for stating field of view reflects towards the imaging lens group, is formed and is conjugated with the field of view in the pattern surface side Image planes；And
Folding mirrors, its by the field of view configure along comprising the pattern plane or the image planes and with the projected light 1st position of the reference plane that the optical axis of system intersects, makes the visual field area being initially imaged by the projection optical system The intermediary image of the slit-shaped in domain is configured on the width that the long side direction along the reference plane and the slit intersects 2nd position different from the 1st position, makes the light beam of the generation intermediary image with from along the described narrow of the reference plane Any one of the width of seam and the 1st position and the 2nd position all different the 3rd positions and towards the projected light The mode that system is turned back reflects,
It is set as and institute on by the substrate of the supporting surface bearing of substrate supporting cylinder by the projection optical system State the projection image for being formed and being optically conjugated with the intermediary image in the view field of the parallel slit-shaped of the 2nd axle.
13. exposure device according to claim 12, wherein,
The projection optical system is included：1st reflection part, the 1st reflection part makes the slit-shaped in the pattern plane The field of view in pattern the 1st light beam reflection and be incident to the imaging lens group；2nd reflection part, the 2nd Reflection part makes the 2nd light beam court from projection optical system injection to generate the projection image on the substrate Reflected on to the substrate,
The reflecting part of the 1st light beam of 1st reflection part and the 2nd light beam of the 2nd reflection part it is anti- Part is penetrated discretely to configure on the width along the slit of the reference plane.
14. exposure device according to claim 13, wherein,
The folding mirrors have：3rd reflecting part, the 3rd reflecting part makes from the projection to generate the intermediary image The light beam that optical system is projected reflects on the direction along the reference plane；4th reflecting part, the 4th reflecting part makes anti-by the 3rd The light beam for penetrating portion's reflection reflects towards the projection optical system,
Either one of 3rd reflecting part and the 4th reflecting part along the direction of the reference plane on being configured at the described 1st Between the reflecting part of reflection part and the reflecting part of the 2nd reflection part.
15. exposure device according to claim 14, wherein,
Make position and the institute of the folding mirrors of each reflecting part of the 1st reflection part and the 2nd reflection part The direction for stating optical axis of the 3rd reflecting part with each position of the 4th reflecting part on the projection optical system is different.
16. the exposure device according to any one of claim 13 to 15, wherein,
1st reflection part and the 2nd reflection part are made up of polarising beam splitter.
17. the exposure device according to claims 14 or 15, wherein,
The institute of the reflecting part of 1st reflection part, the reflecting part of the 2nd reflection part and the folding mirrors State the 3rd reflecting part and the 4th reflecting part be all formed as such rectangle corresponding with the field of view of the slit-shaped, And the width on the slit along the reference plane is configured separated from each other.
18. a kind of device inspection apparatus, has：
Exposure device any one of claim 1 to 17；And
The substrate feeding device of the substrate is supplied to the exposure device by roller mode.
19. a kind of device making method, comprising：
Exposure device any one of usage right requirement 1 to 17 goes out the mask pattern in the substrate projection exposure；
Device corresponding with the mask pattern is formed by being handled the substrate through projection exposure.
CN201710421666.8A 2012-12-18 2013-11-29 Exposure device, device inspection apparatus and device making method Active CN107247388B (en)

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