TWI666977B - 處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板 - Google Patents
處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板 Download PDFInfo
- Publication number
- TWI666977B TWI666977B TW104118618A TW104118618A TWI666977B TW I666977 B TWI666977 B TW I666977B TW 104118618 A TW104118618 A TW 104118618A TW 104118618 A TW104118618 A TW 104118618A TW I666977 B TWI666977 B TW I666977B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- copper
- layer
- treated
- resin substrate
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 136
- 239000011889 copper foil Substances 0.000 title claims abstract description 120
- 239000011347 resin Substances 0.000 claims abstract description 81
- 229920005989 resin Polymers 0.000 claims abstract description 81
- 238000011282 treatment Methods 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000002245 particle Substances 0.000 claims abstract description 30
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 230000003647 oxidation Effects 0.000 claims abstract description 11
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 11
- 239000011164 primary particle Substances 0.000 claims abstract description 11
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 9
- 239000010941 cobalt Substances 0.000 claims abstract description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 8
- 239000011733 molybdenum Substances 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 16
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 14
- 239000007864 aqueous solution Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- 150000002466 imines Chemical class 0.000 claims 1
- 229920002098 polyfluorene Polymers 0.000 claims 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims 1
- 229960000281 trometamol Drugs 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 43
- 238000005530 etching Methods 0.000 abstract description 15
- 238000007788 roughening Methods 0.000 abstract description 10
- 238000002834 transmittance Methods 0.000 abstract description 10
- 239000004020 conductor Substances 0.000 description 19
- 239000008151 electrolyte solution Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- -1 that is Substances 0.000 description 9
- 239000003792 electrolyte Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 238000005868 electrolysis reaction Methods 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- WHDPTDWLEKQKKX-UHFFFAOYSA-N cobalt molybdenum Chemical compound [Co].[Co].[Mo] WHDPTDWLEKQKKX-UHFFFAOYSA-N 0.000 description 4
- MEYVLGVRTYSQHI-UHFFFAOYSA-L cobalt(2+) sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Co+2].[O-]S([O-])(=O)=O MEYVLGVRTYSQHI-UHFFFAOYSA-L 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 3
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- HFTNNOZFRQLFQB-UHFFFAOYSA-N ethenoxy(trimethyl)silane Chemical compound C[Si](C)(C)OC=C HFTNNOZFRQLFQB-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 239000010731 rolling oil Substances 0.000 description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
- RWVGQQGBQSJDQV-UHFFFAOYSA-M sodium;3-[[4-[(e)-[4-(4-ethoxyanilino)phenyl]-[4-[ethyl-[(3-sulfonatophenyl)methyl]azaniumylidene]-2-methylcyclohexa-2,5-dien-1-ylidene]methyl]-n-ethyl-3-methylanilino]methyl]benzenesulfonate Chemical compound [Na+].C1=CC(OCC)=CC=C1NC1=CC=C(C(=C2C(=CC(C=C2)=[N+](CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=2C(=CC(=CC=2)N(CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=C1 RWVGQQGBQSJDQV-UHFFFAOYSA-M 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 208000032544 Cicatrix Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- LQPLDXQVILYOOL-UHFFFAOYSA-I pentasodium;2-[bis[2-[bis(carboxylatomethyl)amino]ethyl]amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC(=O)[O-])CCN(CC([O-])=O)CC([O-])=O LQPLDXQVILYOOL-UHFFFAOYSA-I 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 230000037387 scars Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940087562 sodium acetate trihydrate Drugs 0.000 description 1
- 229960000999 sodium citrate dihydrate Drugs 0.000 description 1
- KOUDKOMXLMXFKX-UHFFFAOYSA-N sodium oxido(oxo)phosphanium hydrate Chemical compound O.[Na+].[O-][PH+]=O KOUDKOMXLMXFKX-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015025259A JP6487704B2 (ja) | 2015-02-12 | 2015-02-12 | 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 |
| JP2015-025259 | 2015-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201630483A TW201630483A (zh) | 2016-08-16 |
| TWI666977B true TWI666977B (zh) | 2019-07-21 |
Family
ID=56691843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104118618A TWI666977B (zh) | 2015-02-12 | 2015-06-09 | 處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6487704B2 (enExample) |
| KR (1) | KR102097843B1 (enExample) |
| CN (1) | CN106211567B (enExample) |
| TW (1) | TWI666977B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6687409B2 (ja) * | 2016-02-09 | 2020-04-22 | 福田金属箔粉工業株式会社 | 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法 |
| JP6471140B2 (ja) * | 2016-11-30 | 2019-02-13 | 福田金属箔粉工業株式会社 | 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法 |
| WO2018211951A1 (ja) * | 2017-05-19 | 2018-11-22 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
| KR102390417B1 (ko) * | 2017-12-05 | 2022-04-22 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판 |
| CN108289370A (zh) * | 2018-01-25 | 2018-07-17 | 江西景旺精密电路有限公司 | 一种pcb抗氧化表面处理工艺 |
| CN113795377A (zh) * | 2019-05-15 | 2021-12-14 | 松下知识产权经营株式会社 | 覆铜箔层压板、带树脂的铜箔以及使用它们的电路板 |
| JP2021095596A (ja) * | 2019-12-13 | 2021-06-24 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
| KR102349377B1 (ko) * | 2019-12-19 | 2022-01-12 | 일진머티리얼즈 주식회사 | 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판 |
| JP7421208B2 (ja) * | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
| KR102931323B1 (ko) * | 2020-03-24 | 2026-02-26 | 나믹스 가부시끼가이샤 | 복합 구리 배선 및 레지스트층을 갖는 적층체 |
| CN114828447B (zh) * | 2021-01-28 | 2024-08-16 | 鹏鼎控股(深圳)股份有限公司 | 线路板及其制作方法 |
| KR102495997B1 (ko) | 2021-03-11 | 2023-02-06 | 일진머티리얼즈 주식회사 | 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판 |
| CN114919254A (zh) * | 2022-05-27 | 2022-08-19 | 广州方邦电子股份有限公司 | 金属箔、挠性覆金属板、半导体、负极材料和电池 |
| JP7492090B1 (ja) * | 2022-11-28 | 2024-05-28 | 福田金属箔粉工業株式会社 | 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板 |
| CN122282621A (zh) * | 2026-05-09 | 2026-06-26 | 江西华创新材有限公司 | 一种高效评估铜箔抗氧化能力的方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206915A (ja) * | 2004-01-26 | 2005-08-04 | Fukuda Metal Foil & Powder Co Ltd | プリント配線板用銅箔及びその製造方法 |
| JP2011219790A (ja) * | 2010-04-06 | 2011-11-04 | Fukuda Metal Foil & Powder Co Ltd | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
| TWI376174B (enExample) * | 2007-11-26 | 2012-11-01 | Furukawa Electric Co Ltd |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW511408B (en) * | 2000-09-18 | 2002-11-21 | Nippon Denkai Kk | Method of producing copper foil for fine wiring |
| TWI267569B (en) | 2002-06-04 | 2006-12-01 | Mitsui Mining & Smelting Co | Surface-treated copper foil for low dielectric substrate, and copper clad laminate and printed wiring board both using the same |
| JP2006210689A (ja) * | 2005-01-28 | 2006-08-10 | Fukuda Metal Foil & Powder Co Ltd | 高周波プリント配線板用銅箔及びその製造方法 |
| JP4681936B2 (ja) * | 2005-05-20 | 2011-05-11 | 福田金属箔粉工業株式会社 | プラズマディスプレイ電磁波シールドフィルター用銅箔 |
| JP5871426B2 (ja) | 2012-01-31 | 2016-03-01 | 古河電気工業株式会社 | 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板 |
| JP5855259B2 (ja) * | 2012-09-10 | 2016-02-09 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板 |
| JP5362924B1 (ja) * | 2012-11-09 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板 |
| KR102116928B1 (ko) | 2013-02-28 | 2020-05-29 | 미쓰이금속광업주식회사 | 흑색화 표면 처리 구리박, 흑색화 표면 처리 구리박의 제조 방법, 구리 클래드 적층판 및 플렉시블 프린트 배선판 |
| JP2014224313A (ja) * | 2013-04-26 | 2014-12-04 | Jx日鉱日石金属株式会社 | 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法 |
-
2015
- 2015-02-12 JP JP2015025259A patent/JP6487704B2/ja active Active
- 2015-04-17 KR KR1020150054287A patent/KR102097843B1/ko active Active
- 2015-05-28 CN CN201510283536.3A patent/CN106211567B/zh active Active
- 2015-06-09 TW TW104118618A patent/TWI666977B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206915A (ja) * | 2004-01-26 | 2005-08-04 | Fukuda Metal Foil & Powder Co Ltd | プリント配線板用銅箔及びその製造方法 |
| TWI376174B (enExample) * | 2007-11-26 | 2012-11-01 | Furukawa Electric Co Ltd | |
| JP2011219790A (ja) * | 2010-04-06 | 2011-11-04 | Fukuda Metal Foil & Powder Co Ltd | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6487704B2 (ja) | 2019-03-20 |
| JP2016149438A (ja) | 2016-08-18 |
| KR20160099439A (ko) | 2016-08-22 |
| CN106211567B (zh) | 2019-10-18 |
| TW201630483A (zh) | 2016-08-16 |
| KR102097843B1 (ko) | 2020-04-06 |
| CN106211567A (zh) | 2016-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106211567B (zh) | 处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板 | |
| TWI663268B (zh) | 低介電常數樹脂基材用處理銅箔及使用該處理銅箔的覆銅層壓板、該處理銅箔的粗化處理層的處理方法、覆銅層壓板的製造方法、以及印刷配線板 | |
| TWI749123B (zh) | 表面處理銅箔及覆銅積層板 | |
| TWI745585B (zh) | 表面處理銅箔 | |
| TWI728012B (zh) | 高彩度處理銅箔及使用該處理銅箔的覆銅層壓板以及該處理銅箔的製造方法 | |
| CN105556004B (zh) | 铜箔、带有载体箔的铜箔及覆铜层压板 | |
| CN102215635B (zh) | 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板 | |
| JP5764700B2 (ja) | 高周波基板用銅張り積層板及び表面処理銅箔 | |
| JP6893572B2 (ja) | 表面処理銅箔の製造方法 | |
| KR101931895B1 (ko) | 고주파 신호 전송 회로 형성용 표면 처리 동박, 동장 적층판 및 프린트 배선판 | |
| JP2013155415A (ja) | 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板 | |
| KR20210002455A (ko) | 표면 처리 동박, 동 클래드 적층판 및, 프린트 배선판 | |
| TWI482882B (zh) | Surface treatment of copper foil and the use of its laminated board | |
| CN105874891A (zh) | 铜箔、包含该铜箔的电气部件以及电池 | |
| KR102638749B1 (ko) | 표면 처리 동박, 동클래드 적층판 및, 프린트 배선판 | |
| CN116762482A (zh) | 具有低表面粗糙度及低翘曲的表面处理铜箔、包括该铜箔的铜箔基板及包括该铜箔的印刷配线板 |