KR102097843B1 - 처리 동박 및 그 처리 동박을 사용한 구리 피복 적층판 그리고 프린트 배선판 - Google Patents

처리 동박 및 그 처리 동박을 사용한 구리 피복 적층판 그리고 프린트 배선판 Download PDF

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KR102097843B1
KR102097843B1 KR1020150054287A KR20150054287A KR102097843B1 KR 102097843 B1 KR102097843 B1 KR 102097843B1 KR 1020150054287 A KR1020150054287 A KR 1020150054287A KR 20150054287 A KR20150054287 A KR 20150054287A KR 102097843 B1 KR102097843 B1 KR 102097843B1
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South Korea
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copper
copper foil
clad laminate
treated
treatment layer
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Korean (ko)
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KR20160099439A (ko
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다케시 오카모토
히사노리 마나베
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후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020150054287A 2015-02-12 2015-04-17 처리 동박 및 그 처리 동박을 사용한 구리 피복 적층판 그리고 프린트 배선판 Active KR102097843B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015025259A JP6487704B2 (ja) 2015-02-12 2015-02-12 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
JPJP-P-2015-025259 2015-02-12

Publications (2)

Publication Number Publication Date
KR20160099439A KR20160099439A (ko) 2016-08-22
KR102097843B1 true KR102097843B1 (ko) 2020-04-06

Family

ID=56691843

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150054287A Active KR102097843B1 (ko) 2015-02-12 2015-04-17 처리 동박 및 그 처리 동박을 사용한 구리 피복 적층판 그리고 프린트 배선판

Country Status (4)

Country Link
JP (1) JP6487704B2 (enExample)
KR (1) KR102097843B1 (enExample)
CN (1) CN106211567B (enExample)
TW (1) TWI666977B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6687409B2 (ja) * 2016-02-09 2020-04-22 福田金属箔粉工業株式会社 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
WO2018211951A1 (ja) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2019111914A1 (ja) * 2017-12-05 2019-06-13 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
CN108289370A (zh) * 2018-01-25 2018-07-17 江西景旺精密电路有限公司 一种pcb抗氧化表面处理工艺
US12233621B2 (en) * 2019-05-15 2025-02-25 Panasonic Intellectual Property Management Co., Ltd. Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil
JP2021095596A (ja) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
CN114982389A (zh) * 2020-03-24 2022-08-30 纳美仕有限公司 复合铜布线以及具有抗蚀层的层压体
CN114828447B (zh) * 2021-01-28 2024-08-16 鹏鼎控股(深圳)股份有限公司 线路板及其制作方法
KR102495997B1 (ko) * 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판
CN114919254A (zh) * 2022-05-27 2022-08-19 广州方邦电子股份有限公司 金属箔、挠性覆金属板、半导体、负极材料和电池
US20250327203A1 (en) * 2022-11-28 2025-10-23 Fukuda Metal Foil & Power Co., Ltd. Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014038717A1 (ja) 2012-09-10 2014-03-13 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
JP2014224313A (ja) 2013-04-26 2014-12-04 Jx日鉱日石金属株式会社 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法

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TW511408B (en) * 2000-09-18 2002-11-21 Nippon Denkai Kk Method of producing copper foil for fine wiring
US6969557B2 (en) 2002-06-04 2005-11-29 Mitsui Mining & Smelting Co., Ltd. Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same
JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
JP4681936B2 (ja) * 2005-05-20 2011-05-11 福田金属箔粉工業株式会社 プラズマディスプレイ電磁波シールドフィルター用銅箔
TW200934330A (en) * 2007-11-26 2009-08-01 Furukawa Electric Co Ltd Surface treated copper foil and method for surface treating the same, and stack circuit board
JP5634103B2 (ja) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5871426B2 (ja) 2012-01-31 2016-03-01 古河電気工業株式会社 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板
JP5362924B1 (ja) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
WO2014133164A1 (ja) 2013-02-28 2014-09-04 三井金属鉱業株式会社 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014038717A1 (ja) 2012-09-10 2014-03-13 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
JP2014224313A (ja) 2013-04-26 2014-12-04 Jx日鉱日石金属株式会社 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
JP6487704B2 (ja) 2019-03-20
TWI666977B (zh) 2019-07-21
CN106211567A (zh) 2016-12-07
JP2016149438A (ja) 2016-08-18
TW201630483A (zh) 2016-08-16
CN106211567B (zh) 2019-10-18
KR20160099439A (ko) 2016-08-22

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