CN106211567B - 处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板 - Google Patents
处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板 Download PDFInfo
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- CN106211567B CN106211567B CN201510283536.3A CN201510283536A CN106211567B CN 106211567 B CN106211567 B CN 106211567B CN 201510283536 A CN201510283536 A CN 201510283536A CN 106211567 B CN106211567 B CN 106211567B
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- Prior art keywords
- copper foil
- copper
- clad laminated
- treatment layer
- laminated board
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 146
- 239000011889 copper foil Substances 0.000 title claims abstract description 128
- 238000012545 processing Methods 0.000 title claims abstract description 55
- 239000011347 resin Substances 0.000 claims abstract description 82
- 229920005989 resin Polymers 0.000 claims abstract description 82
- 238000007788 roughening Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 27
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 27
- 235000006708 antioxidants Nutrition 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000011164 primary particle Substances 0.000 claims abstract description 12
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 6
- 239000010941 cobalt Substances 0.000 claims abstract description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 6
- 239000011733 molybdenum Substances 0.000 claims abstract description 6
- 230000005611 electricity Effects 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 6
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 4
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 40
- 238000005530 etching Methods 0.000 abstract description 9
- 239000003595 mist Substances 0.000 abstract description 6
- 230000008595 infiltration Effects 0.000 description 24
- 238000001764 infiltration Methods 0.000 description 24
- 239000004020 conductor Substances 0.000 description 19
- 239000000243 solution Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 15
- 239000003792 electrolyte Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 11
- -1 cyclic olefin Chemical class 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000009719 polyimide resin Substances 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 4
- 229940044175 cobalt sulfate Drugs 0.000 description 4
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 4
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000007669 thermal treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 239000005864 Sulphur Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001869 cobalt compounds Chemical class 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 3
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 230000003026 anti-oxygenic effect Effects 0.000 description 2
- WHDPTDWLEKQKKX-UHFFFAOYSA-N cobalt molybdenum Chemical compound [Co].[Co].[Mo] WHDPTDWLEKQKKX-UHFFFAOYSA-N 0.000 description 2
- 230000010485 coping Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000010731 rolling oil Substances 0.000 description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
- RWVGQQGBQSJDQV-UHFFFAOYSA-M sodium;3-[[4-[(e)-[4-(4-ethoxyanilino)phenyl]-[4-[ethyl-[(3-sulfonatophenyl)methyl]azaniumylidene]-2-methylcyclohexa-2,5-dien-1-ylidene]methyl]-n-ethyl-3-methylanilino]methyl]benzenesulfonate Chemical compound [Na+].C1=CC(OCC)=CC=C1NC1=CC=C(C(=C2C(=CC(C=C2)=[N+](CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=2C(=CC(=CC=2)N(CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=C1 RWVGQQGBQSJDQV-UHFFFAOYSA-M 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- ICPIKPGERJWARK-UHFFFAOYSA-N cobalt copper molybdenum Chemical compound [Co][Cu][Mo] ICPIKPGERJWARK-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000004683 dihydrates Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical group NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940087562 sodium acetate trihydrate Drugs 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-025259 | 2015-02-12 | ||
| JP2015025259A JP6487704B2 (ja) | 2015-02-12 | 2015-02-12 | 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106211567A CN106211567A (zh) | 2016-12-07 |
| CN106211567B true CN106211567B (zh) | 2019-10-18 |
Family
ID=56691843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510283536.3A Active CN106211567B (zh) | 2015-02-12 | 2015-05-28 | 处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6487704B2 (enExample) |
| KR (1) | KR102097843B1 (enExample) |
| CN (1) | CN106211567B (enExample) |
| TW (1) | TWI666977B (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6687409B2 (ja) * | 2016-02-09 | 2020-04-22 | 福田金属箔粉工業株式会社 | 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法 |
| JP6471140B2 (ja) * | 2016-11-30 | 2019-02-13 | 福田金属箔粉工業株式会社 | 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法 |
| KR102297790B1 (ko) * | 2017-05-19 | 2021-09-06 | 미쓰이금속광업주식회사 | 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판 |
| KR102390417B1 (ko) * | 2017-12-05 | 2022-04-22 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판 |
| CN108289370A (zh) * | 2018-01-25 | 2018-07-17 | 江西景旺精密电路有限公司 | 一种pcb抗氧化表面处理工艺 |
| WO2020230870A1 (ja) * | 2019-05-15 | 2020-11-19 | パナソニックＩｐマネジメント株式会社 | 銅張積層板、樹脂付銅箔、および、それらを用いた回路基板 |
| JP2021095596A (ja) * | 2019-12-13 | 2021-06-24 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
| KR102349377B1 (ko) * | 2019-12-19 | 2022-01-12 | 일진머티리얼즈 주식회사 | 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판 |
| JP7421208B2 (ja) * | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
| CN114982389A (zh) * | 2020-03-24 | 2022-08-30 | 纳美仕有限公司 | 复合铜布线以及具有抗蚀层的层压体 |
| CN114828447B (zh) * | 2021-01-28 | 2024-08-16 | 鹏鼎控股(深圳)股份有限公司 | 线路板及其制作方法 |
| KR102495997B1 (ko) | 2021-03-11 | 2023-02-06 | 일진머티리얼즈 주식회사 | 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판 |
| CN114919254A (zh) * | 2022-05-27 | 2022-08-19 | 广州方邦电子股份有限公司 | 金属箔、挠性覆金属板、半导体、负极材料和电池 |
| JP7492090B1 (ja) * | 2022-11-28 | 2024-05-28 | 福田金属箔粉工業株式会社 | 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206915A (ja) * | 2004-01-26 | 2005-08-04 | Fukuda Metal Foil & Powder Co Ltd | プリント配線板用銅箔及びその製造方法 |
| JP2006324546A (ja) * | 2005-05-20 | 2006-11-30 | Fukuda Metal Foil & Powder Co Ltd | プラズマディスプレイ電磁波シールドフィルター用銅箔及びその製造方法 |
| CN102215635A (zh) * | 2010-04-06 | 2011-10-12 | 福田金属箔粉工业株式会社 | 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板 |
| CN103946425A (zh) * | 2012-11-09 | 2014-07-23 | Jx日矿日石金属株式会社 | 表面处理铜箔及使用了它的层叠板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW511408B (en) * | 2000-09-18 | 2002-11-21 | Nippon Denkai Kk | Method of producing copper foil for fine wiring |
| KR100602896B1 (ko) | 2002-06-04 | 2006-07-19 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 저유전성 기재용 표면처리 동박과 그것을 사용한 동클래드적층판 및 프린트 배선판 |
| JP2006210689A (ja) * | 2005-01-28 | 2006-08-10 | Fukuda Metal Foil & Powder Co Ltd | 高周波プリント配線板用銅箔及びその製造方法 |
| TW200934330A (en) * | 2007-11-26 | 2009-08-01 | Furukawa Electric Co Ltd | Surface treated copper foil and method for surface treating the same, and stack circuit board |
| JP5871426B2 (ja) | 2012-01-31 | 2016-03-01 | 古河電気工業株式会社 | 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板 |
| TWI532592B (zh) | 2012-09-10 | 2016-05-11 | Jx Nippon Mining & Metals Corp | Surface treatment of copper foil and the use of its laminated board |
| JP5705381B2 (ja) | 2013-02-28 | 2015-04-22 | 三井金属鉱業株式会社 | 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板 |
| JP2014224313A (ja) | 2013-04-26 | 2014-12-04 | Jx日鉱日石金属株式会社 | 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法 |
-
2015
- 2015-02-12 JP JP2015025259A patent/JP6487704B2/ja active Active
- 2015-04-17 KR KR1020150054287A patent/KR102097843B1/ko active Active
- 2015-05-28 CN CN201510283536.3A patent/CN106211567B/zh active Active
- 2015-06-09 TW TW104118618A patent/TWI666977B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206915A (ja) * | 2004-01-26 | 2005-08-04 | Fukuda Metal Foil & Powder Co Ltd | プリント配線板用銅箔及びその製造方法 |
| JP2006324546A (ja) * | 2005-05-20 | 2006-11-30 | Fukuda Metal Foil & Powder Co Ltd | プラズマディスプレイ電磁波シールドフィルター用銅箔及びその製造方法 |
| CN102215635A (zh) * | 2010-04-06 | 2011-10-12 | 福田金属箔粉工业株式会社 | 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板 |
| CN103946425A (zh) * | 2012-11-09 | 2014-07-23 | Jx日矿日石金属株式会社 | 表面处理铜箔及使用了它的层叠板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6487704B2 (ja) | 2019-03-20 |
| KR102097843B1 (ko) | 2020-04-06 |
| TWI666977B (zh) | 2019-07-21 |
| TW201630483A (zh) | 2016-08-16 |
| JP2016149438A (ja) | 2016-08-18 |
| KR20160099439A (ko) | 2016-08-22 |
| CN106211567A (zh) | 2016-12-07 |
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