CN106211567B - 处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板 - Google Patents

处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板 Download PDF

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Publication number
CN106211567B
CN106211567B CN201510283536.3A CN201510283536A CN106211567B CN 106211567 B CN106211567 B CN 106211567B CN 201510283536 A CN201510283536 A CN 201510283536A CN 106211567 B CN106211567 B CN 106211567B
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copper foil
copper
treatment layer
clad laminated
laminated board
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CN106211567A (zh
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冈本健
真锅久德
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Fukuda Metal Foil and Powder Co Ltd
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Fukuda Metal Foil and Powder Co Ltd
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201510283536.3A 2015-02-12 2015-05-28 处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板 Active CN106211567B (zh)

Applications Claiming Priority (2)

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JP2015025259A JP6487704B2 (ja) 2015-02-12 2015-02-12 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
JP2015-025259 2015-02-12

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CN106211567A CN106211567A (zh) 2016-12-07
CN106211567B true CN106211567B (zh) 2019-10-18

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JP (1) JP6487704B2 (enExample)
KR (1) KR102097843B1 (enExample)
CN (1) CN106211567B (enExample)
TW (1) TWI666977B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6687409B2 (ja) * 2016-02-09 2020-04-22 福田金属箔粉工業株式会社 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
WO2018211951A1 (ja) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR102390417B1 (ko) * 2017-12-05 2022-04-22 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판
CN108289370A (zh) * 2018-01-25 2018-07-17 江西景旺精密电路有限公司 一种pcb抗氧化表面处理工艺
CN113795377A (zh) * 2019-05-15 2021-12-14 松下知识产权经营株式会社 覆铜箔层压板、带树脂的铜箔以及使用它们的电路板
JP2021095596A (ja) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
KR102931323B1 (ko) * 2020-03-24 2026-02-26 나믹스 가부시끼가이샤 복합 구리 배선 및 레지스트층을 갖는 적층체
CN114828447B (zh) * 2021-01-28 2024-08-16 鹏鼎控股(深圳)股份有限公司 线路板及其制作方法
KR102495997B1 (ko) 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판
CN114919254A (zh) * 2022-05-27 2022-08-19 广州方邦电子股份有限公司 金属箔、挠性覆金属板、半导体、负极材料和电池
JP7492090B1 (ja) * 2022-11-28 2024-05-28 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
CN122282621A (zh) * 2026-05-09 2026-06-26 江西华创新材有限公司 一种高效评估铜箔抗氧化能力的方法

Citations (4)

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JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法
JP2006324546A (ja) * 2005-05-20 2006-11-30 Fukuda Metal Foil & Powder Co Ltd プラズマディスプレイ電磁波シールドフィルター用銅箔及びその製造方法
CN102215635A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板
CN103946425A (zh) * 2012-11-09 2014-07-23 Jx日矿日石金属株式会社 表面处理铜箔及使用了它的层叠板

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TW511408B (en) * 2000-09-18 2002-11-21 Nippon Denkai Kk Method of producing copper foil for fine wiring
TWI267569B (en) 2002-06-04 2006-12-01 Mitsui Mining & Smelting Co Surface-treated copper foil for low dielectric substrate, and copper clad laminate and printed wiring board both using the same
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
TW200934330A (en) * 2007-11-26 2009-08-01 Furukawa Electric Co Ltd Surface treated copper foil and method for surface treating the same, and stack circuit board
JP5871426B2 (ja) 2012-01-31 2016-03-01 古河電気工業株式会社 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板
JP5855259B2 (ja) * 2012-09-10 2016-02-09 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
KR102116928B1 (ko) 2013-02-28 2020-05-29 미쓰이금속광업주식회사 흑색화 표면 처리 구리박, 흑색화 표면 처리 구리박의 제조 방법, 구리 클래드 적층판 및 플렉시블 프린트 배선판
JP2014224313A (ja) * 2013-04-26 2014-12-04 Jx日鉱日石金属株式会社 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法
JP2006324546A (ja) * 2005-05-20 2006-11-30 Fukuda Metal Foil & Powder Co Ltd プラズマディスプレイ電磁波シールドフィルター用銅箔及びその製造方法
CN102215635A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板
CN103946425A (zh) * 2012-11-09 2014-07-23 Jx日矿日石金属株式会社 表面处理铜箔及使用了它的层叠板

Also Published As

Publication number Publication date
TWI666977B (zh) 2019-07-21
JP6487704B2 (ja) 2019-03-20
JP2016149438A (ja) 2016-08-18
KR20160099439A (ko) 2016-08-22
TW201630483A (zh) 2016-08-16
KR102097843B1 (ko) 2020-04-06
CN106211567A (zh) 2016-12-07

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