TWI376174B - - Google Patents
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- Publication number
- TWI376174B TWI376174B TW097134379A TW97134379A TWI376174B TW I376174 B TWI376174 B TW I376174B TW 097134379 A TW097134379 A TW 097134379A TW 97134379 A TW97134379 A TW 97134379A TW I376174 B TWI376174 B TW I376174B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- surface treatment
- copper foil
- peel strength
- treated
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 87
- 239000011889 copper foil Substances 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 33
- 238000004381 surface treatment Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000002335 surface treatment layer Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 101100443631 Schizosaccharomyces pombe (strain 972 / ATCC 24843) dni2 gene Proteins 0.000 claims 1
- 229910052769 Ytterbium Inorganic materials 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 238000011282 treatment Methods 0.000 description 14
- 239000002253 acid Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 12
- 239000011888 foil Substances 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- 238000010306 acid treatment Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- JVKRKMWZYMKVTQ-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C=NN(C=1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JVKRKMWZYMKVTQ-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 241000282421 Canidae Species 0.000 description 1
- 235000009854 Cucurbita moschata Nutrition 0.000 description 1
- 240000001980 Cucurbita pepo Species 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 101100408384 Danio rerio piwil2 gene Proteins 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 101150049168 Nisch gene Proteins 0.000 description 1
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910000754 Wrought iron Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- -1 copper helium Chemical compound 0.000 description 1
- OUFLLVQXSGGKOV-UHFFFAOYSA-N copper ruthenium Chemical compound [Cu].[Ru].[Ru].[Ru] OUFLLVQXSGGKOV-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 235000020354 squash Nutrition 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/20—Zinc
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/22—Nickel or cobalt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007304396 | 2007-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200934330A TW200934330A (en) | 2009-08-01 |
| TWI376174B true TWI376174B (enExample) | 2012-11-01 |
Family
ID=40741818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097134379A TW200934330A (en) | 2007-11-26 | 2008-09-08 | Surface treated copper foil and method for surface treating the same, and stack circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5075099B2 (enExample) |
| KR (1) | KR101112979B1 (enExample) |
| CN (1) | CN101445947B (enExample) |
| TW (1) | TW200934330A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI666977B (zh) * | 2015-02-12 | 2019-07-21 | 日商福田金屬箔粉工業股份有限公司 | 處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5650023B2 (ja) * | 2011-03-03 | 2015-01-07 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層板 |
| KR101315364B1 (ko) * | 2011-03-11 | 2013-10-07 | 엘에스엠트론 주식회사 | 내열성이 개선된 표면 처리 동박 및 그 제조방법 |
| JP6023367B1 (ja) * | 2015-06-17 | 2016-11-09 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP7085394B2 (ja) * | 2018-04-13 | 2022-06-16 | 東洋鋼鈑株式会社 | 積層電解箔 |
| JP7014884B1 (ja) * | 2020-12-23 | 2022-02-01 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4758479A (en) * | 1987-03-30 | 1988-07-19 | General Motors Corporation | Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating |
| JP3032514B1 (ja) | 1998-12-14 | 2000-04-17 | 株式会社日鉱マテリアルズ | 光沢面の耐酸化性に優れた銅箔及びその製造方法 |
| JP2000269637A (ja) * | 1999-03-18 | 2000-09-29 | Furukawa Circuit Foil Kk | 高密度超微細配線板用銅箔 |
| JP4202840B2 (ja) * | 2003-06-26 | 2008-12-24 | 日鉱金属株式会社 | 銅箔及びその製造方法 |
| JP2005064110A (ja) * | 2003-08-08 | 2005-03-10 | Tdk Corp | 電子部品用部材並びにこれを用いた電子部品 |
| KR100852863B1 (ko) * | 2004-02-17 | 2008-08-18 | 닛코킨조쿠 가부시키가이샤 | 흑화 처리 면 또는 층을 가지는 동박 |
| JP2005344174A (ja) * | 2004-06-03 | 2005-12-15 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ |
| JP4652020B2 (ja) * | 2004-11-16 | 2011-03-16 | 新日鐵化学株式会社 | 銅張り積層板 |
-
2008
- 2008-09-08 TW TW097134379A patent/TW200934330A/zh unknown
- 2008-09-27 CN CN200810168887XA patent/CN101445947B/zh active Active
- 2008-09-30 KR KR1020080095888A patent/KR101112979B1/ko active Active
- 2008-11-25 JP JP2008299671A patent/JP5075099B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI666977B (zh) * | 2015-02-12 | 2019-07-21 | 日商福田金屬箔粉工業股份有限公司 | 處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101112979B1 (ko) | 2012-04-18 |
| CN101445947B (zh) | 2011-04-27 |
| TW200934330A (en) | 2009-08-01 |
| KR20090054368A (ko) | 2009-05-29 |
| CN101445947A (zh) | 2009-06-03 |
| JP5075099B2 (ja) | 2012-11-14 |
| JP2009149977A (ja) | 2009-07-09 |
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