CN101445947B - 表面处理铜箔及其表面处理方法以及层叠电路基板 - Google Patents

表面处理铜箔及其表面处理方法以及层叠电路基板 Download PDF

Info

Publication number
CN101445947B
CN101445947B CN200810168887XA CN200810168887A CN101445947B CN 101445947 B CN101445947 B CN 101445947B CN 200810168887X A CN200810168887X A CN 200810168887XA CN 200810168887 A CN200810168887 A CN 200810168887A CN 101445947 B CN101445947 B CN 101445947B
Authority
CN
China
Prior art keywords
copper foil
surface treatment
content
untreated
basal board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200810168887XA
Other languages
English (en)
Chinese (zh)
Other versions
CN101445947A (zh
Inventor
藤泽哲
铃木裕二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN101445947A publication Critical patent/CN101445947A/zh
Application granted granted Critical
Publication of CN101445947B publication Critical patent/CN101445947B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/20—Zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
CN200810168887XA 2007-11-26 2008-09-27 表面处理铜箔及其表面处理方法以及层叠电路基板 Active CN101445947B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-304396 2007-11-26
JP2007304396 2007-11-26
JP2007304396 2007-11-26

Publications (2)

Publication Number Publication Date
CN101445947A CN101445947A (zh) 2009-06-03
CN101445947B true CN101445947B (zh) 2011-04-27

Family

ID=40741818

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810168887XA Active CN101445947B (zh) 2007-11-26 2008-09-27 表面处理铜箔及其表面处理方法以及层叠电路基板

Country Status (4)

Country Link
JP (1) JP5075099B2 (enExample)
KR (1) KR101112979B1 (enExample)
CN (1) CN101445947B (enExample)
TW (1) TW200934330A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650023B2 (ja) * 2011-03-03 2015-01-07 Jx日鉱日石金属株式会社 プリント配線板用銅箔及びそれを用いた積層板
KR101315364B1 (ko) * 2011-03-11 2013-10-07 엘에스엠트론 주식회사 내열성이 개선된 표면 처리 동박 및 그 제조방법
JP6487704B2 (ja) * 2015-02-12 2019-03-20 福田金属箔粉工業株式会社 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7085394B2 (ja) * 2018-04-13 2022-06-16 東洋鋼鈑株式会社 積層電解箔
JP7014884B1 (ja) * 2020-12-23 2022-02-01 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758479A (en) * 1987-03-30 1988-07-19 General Motors Corporation Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating
JP3032514B1 (ja) 1998-12-14 2000-04-17 株式会社日鉱マテリアルズ 光沢面の耐酸化性に優れた銅箔及びその製造方法
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP4202840B2 (ja) * 2003-06-26 2008-12-24 日鉱金属株式会社 銅箔及びその製造方法
JP2005064110A (ja) * 2003-08-08 2005-03-10 Tdk Corp 電子部品用部材並びにこれを用いた電子部品
KR100852863B1 (ko) * 2004-02-17 2008-08-18 닛코킨조쿠 가부시키가이샤 흑화 처리 면 또는 층을 가지는 동박
JP2005344174A (ja) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ
JP4652020B2 (ja) * 2004-11-16 2011-03-16 新日鐵化学株式会社 銅張り積層板

Also Published As

Publication number Publication date
KR101112979B1 (ko) 2012-04-18
TW200934330A (en) 2009-08-01
KR20090054368A (ko) 2009-05-29
CN101445947A (zh) 2009-06-03
JP5075099B2 (ja) 2012-11-14
JP2009149977A (ja) 2009-07-09
TWI376174B (enExample) 2012-11-01

Similar Documents

Publication Publication Date Title
CN101445947B (zh) 表面处理铜箔及其表面处理方法以及层叠电路基板
CN101662892B (zh) 带有载体的极薄铜箔及其制造方法及布线板
TWI645759B (zh) 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板
KR101318871B1 (ko) 표면 처리 동박 및 동장 적층판
TW201116653A (en) Heat-resistant copper foil and method for producing same, circuit board, and copper-clad laminate board and method for manufacturing same
JP2013174017A (ja) 印刷回路用銅箔
JPH0447038B2 (enExample)
MY152161A (en) Surface-treated copper foil, method for producing surface-treated copper foil, and surface-treated copper foil coated with extremely thin primer resin layer
TW201800242A (zh) 表面處理銅箔及使用其製成的覆銅積層板
CN102714915B (zh) 电子电路及其形成方法以及电子电路形成用覆铜层压板
JP4978456B2 (ja) 印刷回路用銅箔
CN101521996A (zh) 印刷电路的铜箔及其表面处理方法和制造铜箔的电镀设备
JP5475196B2 (ja) 銅箔複合体、並びに成形体及びその製造方法
US7217464B2 (en) Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method
JP4609850B2 (ja) 積層回路基板
CN102548202A (zh) 经粗化处理的铜箔及其制造方法
CN102076889A (zh) 电气电子部件用复合材料以及使用其的电气电子部件
US20140308538A1 (en) Surface treated aluminum foil for electronic circuits
EP0520640A1 (en) Metal foil with improved peel strength and method for making said foil
US6042711A (en) Metal foil with improved peel strength and method for making said foil
JP2007146258A (ja) 電解銅箔、プリント配線板および多層プリント配線板
TWI415742B (zh) A method for manufacturing fine grain copper foil with high peel strength and environmental protection for printed circuit board tool
JP4593331B2 (ja) 積層回路基板とその製造方法
JP2005042139A (ja) 表面処理銅箔及びその製造方法
JP4776217B2 (ja) 銅メタライズド積層板及びその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant