JP5075099B2 - 表面処理銅箔及びその表面処理方法、並びに積層回路基板 - Google Patents

表面処理銅箔及びその表面処理方法、並びに積層回路基板 Download PDF

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Publication number
JP5075099B2
JP5075099B2 JP2008299671A JP2008299671A JP5075099B2 JP 5075099 B2 JP5075099 B2 JP 5075099B2 JP 2008299671 A JP2008299671 A JP 2008299671A JP 2008299671 A JP2008299671 A JP 2008299671A JP 5075099 B2 JP5075099 B2 JP 5075099B2
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Japan
Prior art keywords
copper foil
content
peel strength
treatment
circuit board
Prior art date
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JP2008299671A
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English (en)
Japanese (ja)
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JP2009149977A (ja
Inventor
哲 藤澤
裕二 鈴木
岳夫 宇野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2008299671A priority Critical patent/JP5075099B2/ja
Publication of JP2009149977A publication Critical patent/JP2009149977A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/20—Zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP2008299671A 2007-11-26 2008-11-25 表面処理銅箔及びその表面処理方法、並びに積層回路基板 Active JP5075099B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008299671A JP5075099B2 (ja) 2007-11-26 2008-11-25 表面処理銅箔及びその表面処理方法、並びに積層回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007304396 2007-11-26
JP2007304396 2007-11-26
JP2008299671A JP5075099B2 (ja) 2007-11-26 2008-11-25 表面処理銅箔及びその表面処理方法、並びに積層回路基板

Publications (2)

Publication Number Publication Date
JP2009149977A JP2009149977A (ja) 2009-07-09
JP5075099B2 true JP5075099B2 (ja) 2012-11-14

Family

ID=40741818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008299671A Active JP5075099B2 (ja) 2007-11-26 2008-11-25 表面処理銅箔及びその表面処理方法、並びに積層回路基板

Country Status (4)

Country Link
JP (1) JP5075099B2 (enExample)
KR (1) KR101112979B1 (enExample)
CN (1) CN101445947B (enExample)
TW (1) TW200934330A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650023B2 (ja) * 2011-03-03 2015-01-07 Jx日鉱日石金属株式会社 プリント配線板用銅箔及びそれを用いた積層板
KR101315364B1 (ko) * 2011-03-11 2013-10-07 엘에스엠트론 주식회사 내열성이 개선된 표면 처리 동박 및 그 제조방법
JP6487704B2 (ja) * 2015-02-12 2019-03-20 福田金属箔粉工業株式会社 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7085394B2 (ja) * 2018-04-13 2022-06-16 東洋鋼鈑株式会社 積層電解箔
JP7014884B1 (ja) * 2020-12-23 2022-02-01 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758479A (en) * 1987-03-30 1988-07-19 General Motors Corporation Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating
JP3032514B1 (ja) 1998-12-14 2000-04-17 株式会社日鉱マテリアルズ 光沢面の耐酸化性に優れた銅箔及びその製造方法
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP4202840B2 (ja) * 2003-06-26 2008-12-24 日鉱金属株式会社 銅箔及びその製造方法
JP2005064110A (ja) * 2003-08-08 2005-03-10 Tdk Corp 電子部品用部材並びにこれを用いた電子部品
KR100852863B1 (ko) * 2004-02-17 2008-08-18 닛코킨조쿠 가부시키가이샤 흑화 처리 면 또는 층을 가지는 동박
JP2005344174A (ja) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ
JP4652020B2 (ja) * 2004-11-16 2011-03-16 新日鐵化学株式会社 銅張り積層板

Also Published As

Publication number Publication date
KR101112979B1 (ko) 2012-04-18
CN101445947B (zh) 2011-04-27
TW200934330A (en) 2009-08-01
KR20090054368A (ko) 2009-05-29
CN101445947A (zh) 2009-06-03
JP2009149977A (ja) 2009-07-09
TWI376174B (enExample) 2012-11-01

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