TW200934330A - Surface treated copper foil and method for surface treating the same, and stack circuit board - Google Patents
Surface treated copper foil and method for surface treating the same, and stack circuit boardInfo
- Publication number
- TW200934330A TW200934330A TW097134379A TW97134379A TW200934330A TW 200934330 A TW200934330 A TW 200934330A TW 097134379 A TW097134379 A TW 097134379A TW 97134379 A TW97134379 A TW 97134379A TW 200934330 A TW200934330 A TW 200934330A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- copper
- peel strength
- surface treated
- treatment
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 239000011889 copper foil Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 238000005868 electrolysis reaction Methods 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 33
- 239000010410 layer Substances 0.000 claims description 23
- 238000004381 surface treatment Methods 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 13
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 9
- 239000002335 surface treatment layer Substances 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 3
- 239000002253 acid Substances 0.000 abstract description 13
- 239000004642 Polyimide Substances 0.000 abstract description 12
- 229920001721 polyimide Polymers 0.000 abstract description 12
- 238000005530 etching Methods 0.000 abstract description 11
- 239000011701 zinc Substances 0.000 description 38
- 230000000052 comparative effect Effects 0.000 description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 238000011282 treatment Methods 0.000 description 15
- 238000005259 measurement Methods 0.000 description 13
- 238000010306 acid treatment Methods 0.000 description 10
- 239000011888 foil Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 7
- 229910000368 zinc sulfate Inorganic materials 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 101150049168 Nisch gene Proteins 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- OUFLLVQXSGGKOV-UHFFFAOYSA-N copper ruthenium Chemical compound [Cu].[Ru].[Ru].[Ru] OUFLLVQXSGGKOV-UHFFFAOYSA-N 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- JVKRKMWZYMKVTQ-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C=NN(C=1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JVKRKMWZYMKVTQ-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QAAXRTPGRLVPFH-UHFFFAOYSA-N [Bi].[Cu] Chemical compound [Bi].[Cu] QAAXRTPGRLVPFH-UHFFFAOYSA-N 0.000 description 1
- FHKNFXAIEAYRKQ-UHFFFAOYSA-N [Cu].[Ir] Chemical compound [Cu].[Ir] FHKNFXAIEAYRKQ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/20—Zinc
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/22—Nickel or cobalt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007304396 | 2007-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200934330A true TW200934330A (en) | 2009-08-01 |
| TWI376174B TWI376174B (enExample) | 2012-11-01 |
Family
ID=40741818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097134379A TW200934330A (en) | 2007-11-26 | 2008-09-08 | Surface treated copper foil and method for surface treating the same, and stack circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5075099B2 (enExample) |
| KR (1) | KR101112979B1 (enExample) |
| CN (1) | CN101445947B (enExample) |
| TW (1) | TW200934330A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5650023B2 (ja) * | 2011-03-03 | 2015-01-07 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層板 |
| KR101315364B1 (ko) * | 2011-03-11 | 2013-10-07 | 엘에스엠트론 주식회사 | 내열성이 개선된 표면 처리 동박 및 그 제조방법 |
| JP6487704B2 (ja) * | 2015-02-12 | 2019-03-20 | 福田金属箔粉工業株式会社 | 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 |
| JP6023367B1 (ja) * | 2015-06-17 | 2016-11-09 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP7085394B2 (ja) * | 2018-04-13 | 2022-06-16 | 東洋鋼鈑株式会社 | 積層電解箔 |
| JP7014884B1 (ja) * | 2020-12-23 | 2022-02-01 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4758479A (en) * | 1987-03-30 | 1988-07-19 | General Motors Corporation | Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating |
| JP3032514B1 (ja) | 1998-12-14 | 2000-04-17 | 株式会社日鉱マテリアルズ | 光沢面の耐酸化性に優れた銅箔及びその製造方法 |
| JP2000269637A (ja) * | 1999-03-18 | 2000-09-29 | Furukawa Circuit Foil Kk | 高密度超微細配線板用銅箔 |
| JP4202840B2 (ja) * | 2003-06-26 | 2008-12-24 | 日鉱金属株式会社 | 銅箔及びその製造方法 |
| JP2005064110A (ja) * | 2003-08-08 | 2005-03-10 | Tdk Corp | 電子部品用部材並びにこれを用いた電子部品 |
| KR100852863B1 (ko) * | 2004-02-17 | 2008-08-18 | 닛코킨조쿠 가부시키가이샤 | 흑화 처리 면 또는 층을 가지는 동박 |
| JP2005344174A (ja) * | 2004-06-03 | 2005-12-15 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ |
| JP4652020B2 (ja) * | 2004-11-16 | 2011-03-16 | 新日鐵化学株式会社 | 銅張り積層板 |
-
2008
- 2008-09-08 TW TW097134379A patent/TW200934330A/zh unknown
- 2008-09-27 CN CN200810168887XA patent/CN101445947B/zh active Active
- 2008-09-30 KR KR1020080095888A patent/KR101112979B1/ko active Active
- 2008-11-25 JP JP2008299671A patent/JP5075099B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101112979B1 (ko) | 2012-04-18 |
| CN101445947B (zh) | 2011-04-27 |
| KR20090054368A (ko) | 2009-05-29 |
| CN101445947A (zh) | 2009-06-03 |
| JP5075099B2 (ja) | 2012-11-14 |
| JP2009149977A (ja) | 2009-07-09 |
| TWI376174B (enExample) | 2012-11-01 |
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