TWI661464B - 被處理體之處理方法 - Google Patents
被處理體之處理方法 Download PDFInfo
- Publication number
- TWI661464B TWI661464B TW104132754A TW104132754A TWI661464B TW I661464 B TWI661464 B TW I661464B TW 104132754 A TW104132754 A TW 104132754A TW 104132754 A TW104132754 A TW 104132754A TW I661464 B TWI661464 B TW I661464B
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- processing
- film
- gas
- processing container
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6324—Formation by anodic treatments, e.g. anodic oxidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014206614A JP6382055B2 (ja) | 2014-10-07 | 2014-10-07 | 被処理体を処理する方法 |
| JP2014-206614 | 2014-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201626434A TW201626434A (zh) | 2016-07-16 |
| TWI661464B true TWI661464B (zh) | 2019-06-01 |
Family
ID=54199559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104132754A TWI661464B (zh) | 2014-10-07 | 2015-10-06 | 被處理體之處理方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9607811B2 (https=) |
| EP (1) | EP3007205B1 (https=) |
| JP (1) | JP6382055B2 (https=) |
| KR (1) | KR102311575B1 (https=) |
| CN (2) | CN112133630B (https=) |
| SG (1) | SG10201508134VA (https=) |
| TW (1) | TWI661464B (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6559430B2 (ja) | 2015-01-30 | 2019-08-14 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
| JP6462477B2 (ja) * | 2015-04-27 | 2019-01-30 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
| WO2017170411A1 (ja) | 2016-03-29 | 2017-10-05 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
| KR20170114579A (ko) | 2016-04-05 | 2017-10-16 | 주식회사 만도 | 전압 제어 방법 및 그 제어 시스템 |
| JP6541618B2 (ja) * | 2016-05-25 | 2019-07-10 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
| JP6832171B2 (ja) | 2017-01-24 | 2021-02-24 | 東京エレクトロン株式会社 | プラズマ処理装置のチャンバ本体の内部のクリーニングを含むプラズマ処理方法 |
| JP6895352B2 (ja) * | 2017-09-12 | 2021-06-30 | 東京エレクトロン株式会社 | 被加工物を処理する方法 |
| JP6886940B2 (ja) * | 2018-04-23 | 2021-06-16 | 東京エレクトロン株式会社 | プラズマ処理方法 |
| CN110581050B (zh) * | 2018-06-07 | 2024-06-11 | 东京毅力科创株式会社 | 处理方法和等离子体处理装置 |
| TWI820667B (zh) * | 2018-06-19 | 2023-11-01 | 美商應用材料股份有限公司 | 間隙填充物沉積方法及類金剛石之碳的間隙填充物材料 |
| CN116837349A (zh) * | 2018-07-26 | 2023-10-03 | 东京毅力科创株式会社 | 等离子体处理装置 |
| JP7345283B2 (ja) * | 2018-07-26 | 2023-09-15 | 東京エレクトロン株式会社 | プラズマ処理方法およびプラズマ処理装置 |
| JP7178918B2 (ja) | 2019-01-30 | 2022-11-28 | 東京エレクトロン株式会社 | エッチング方法、プラズマ処理装置、及び処理システム |
| JP7240946B2 (ja) * | 2019-04-26 | 2023-03-16 | 株式会社トリケミカル研究所 | 酸化珪素膜形成方法 |
| US11955318B2 (en) | 2021-03-12 | 2024-04-09 | Applied Materials, Inc. | Ash rate recovery method in plasma strip chamber |
| TW202308466A (zh) * | 2021-06-22 | 2023-02-16 | 日商東京威力科創股份有限公司 | 電漿處理方法、電漿處理裝置及電漿處理系統 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04137725A (ja) * | 1990-09-28 | 1992-05-12 | Tonen Corp | ガラス基板多結晶シリコン薄膜 |
| JP4137725B2 (ja) * | 2002-07-10 | 2008-08-20 | 松下電器産業株式会社 | 接合部材の加工寸法決定方法および装置 |
| JP4515278B2 (ja) * | 2005-02-16 | 2010-07-28 | 東京エレクトロン株式会社 | エッチング方法、エッチング方法を実行するための制御プログラム、制御プログラム記憶媒体及び処理装置 |
| JP2007123766A (ja) * | 2005-10-31 | 2007-05-17 | Tokyo Electron Ltd | エッチング方法、プラズマ処理装置及び記憶媒体 |
| KR101073858B1 (ko) * | 2007-06-08 | 2011-10-14 | 도쿄엘렉트론가부시키가이샤 | 패터닝 방법 |
| US7790531B2 (en) * | 2007-12-18 | 2010-09-07 | Micron Technology, Inc. | Methods for isolating portions of a loop of pitch-multiplied material and related structures |
| US8647722B2 (en) * | 2008-11-14 | 2014-02-11 | Asm Japan K.K. | Method of forming insulation film using plasma treatment cycles |
| JP5698950B2 (ja) * | 2009-10-23 | 2015-04-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4733214B1 (ja) * | 2010-04-02 | 2011-07-27 | 東京エレクトロン株式会社 | マスクパターンの形成方法及び半導体装置の製造方法 |
| US8252691B2 (en) * | 2010-04-14 | 2012-08-28 | Asm Genitech Korea Ltd. | Method of forming semiconductor patterns |
| KR20120001339A (ko) * | 2010-06-29 | 2012-01-04 | 삼성전자주식회사 | 반도체 소자의 미세 패턴 형성 방법 |
| JP5674375B2 (ja) * | 2010-08-03 | 2015-02-25 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US8298951B1 (en) * | 2011-04-13 | 2012-10-30 | Asm Japan K.K. | Footing reduction using etch-selective layer |
| US9666414B2 (en) * | 2011-10-27 | 2017-05-30 | Applied Materials, Inc. | Process chamber for etching low k and other dielectric films |
| US9922802B2 (en) * | 2012-02-20 | 2018-03-20 | Tokyo Electron Limited | Power supply system, plasma etching apparatus, and plasma etching method |
| WO2014042192A1 (ja) * | 2012-09-13 | 2014-03-20 | 東京エレクトロン株式会社 | 被処理基体を処理する方法、及びプラズマ処理装置 |
| KR102052936B1 (ko) * | 2012-11-13 | 2019-12-06 | 삼성전자 주식회사 | 반도체 소자 제조 방법 |
| JP6366454B2 (ja) * | 2014-10-07 | 2018-08-01 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
-
2014
- 2014-10-07 JP JP2014206614A patent/JP6382055B2/ja active Active
-
2015
- 2015-09-23 KR KR1020150134479A patent/KR102311575B1/ko active Active
- 2015-09-23 EP EP15186427.9A patent/EP3007205B1/en active Active
- 2015-09-25 US US14/866,467 patent/US9607811B2/en active Active
- 2015-09-29 CN CN202011049271.8A patent/CN112133630B/zh active Active
- 2015-09-29 CN CN201510634852.0A patent/CN105489483A/zh active Pending
- 2015-09-30 SG SG10201508134VA patent/SG10201508134VA/en unknown
- 2015-10-06 TW TW104132754A patent/TWI661464B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20160099131A1 (en) | 2016-04-07 |
| TW201626434A (zh) | 2016-07-16 |
| EP3007205A1 (en) | 2016-04-13 |
| KR20160041764A (ko) | 2016-04-18 |
| JP2016076621A (ja) | 2016-05-12 |
| EP3007205B1 (en) | 2017-08-16 |
| CN112133630A (zh) | 2020-12-25 |
| CN112133630B (zh) | 2024-08-13 |
| CN105489483A (zh) | 2016-04-13 |
| KR102311575B1 (ko) | 2021-10-08 |
| US9607811B2 (en) | 2017-03-28 |
| SG10201508134VA (en) | 2016-05-30 |
| JP6382055B2 (ja) | 2018-08-29 |
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