TWI643826B - Breaking device and breaking method - Google Patents

Breaking device and breaking method Download PDF

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Publication number
TWI643826B
TWI643826B TW104100584A TW104100584A TWI643826B TW I643826 B TWI643826 B TW I643826B TW 104100584 A TW104100584 A TW 104100584A TW 104100584 A TW104100584 A TW 104100584A TW I643826 B TWI643826 B TW I643826B
Authority
TW
Taiwan
Prior art keywords
substrate
support member
breaking
belt
brittle material
Prior art date
Application number
TW104100584A
Other languages
English (en)
Chinese (zh)
Other versions
TW201536701A (zh
Inventor
富永圭介
高松生芳
秀島護
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201536701A publication Critical patent/TW201536701A/zh
Application granted granted Critical
Publication of TWI643826B publication Critical patent/TWI643826B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
TW104100584A 2014-03-18 2015-01-08 Breaking device and breaking method TWI643826B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-054695 2014-03-18
JP2014054695A JP6289949B2 (ja) 2014-03-18 2014-03-18 ブレイク装置

Publications (2)

Publication Number Publication Date
TW201536701A TW201536701A (zh) 2015-10-01
TWI643826B true TWI643826B (zh) 2018-12-11

Family

ID=54112041

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104100584A TWI643826B (zh) 2014-03-18 2015-01-08 Breaking device and breaking method

Country Status (4)

Country Link
JP (1) JP6289949B2 (ja)
KR (1) KR20150108737A (ja)
CN (1) CN104924469B (ja)
TW (1) TWI643826B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102122427B1 (ko) * 2019-01-09 2020-06-12 한국미쯔보시다이아몬드공업(주) 단재 제거 장치
JP7469749B2 (ja) 2021-03-02 2024-04-17 株式会社Ihi ワーク切断装置及びワーク切断方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1269770A (zh) * 1998-08-28 2000-10-11 坂东机工株式会社 玻璃板的折断机械
JP2010128407A (ja) * 2008-12-01 2010-06-10 Seiko Epson Corp 基板の分割方法および基板の分割装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4227811B2 (ja) * 2003-01-15 2009-02-18 日本特殊陶業株式会社 セラミック配線基板の製造方法およびセラミック焼成品の分割装置
JP5277943B2 (ja) * 2007-12-26 2013-08-28 三菱マテリアル株式会社 分割体の製造装置及び製造方法
JP5330845B2 (ja) * 2009-01-30 2013-10-30 三星ダイヤモンド工業株式会社 基板ブレーク装置
KR101020682B1 (ko) * 2009-05-06 2011-03-11 세메스 주식회사 기판 브레이크 장치
JP5365390B2 (ja) * 2009-07-21 2013-12-11 三星ダイヤモンド工業株式会社 ブレイクユニット及びブレイク方法
JP5210409B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置
JP2012197225A (ja) * 2012-06-04 2012-10-18 Bando Kiko Co Ltd ガラス板の加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1269770A (zh) * 1998-08-28 2000-10-11 坂东机工株式会社 玻璃板的折断机械
JP2010128407A (ja) * 2008-12-01 2010-06-10 Seiko Epson Corp 基板の分割方法および基板の分割装置

Also Published As

Publication number Publication date
CN104924469A (zh) 2015-09-23
TW201536701A (zh) 2015-10-01
CN104924469B (zh) 2017-11-21
JP6289949B2 (ja) 2018-03-07
KR20150108737A (ko) 2015-09-30
JP2015174209A (ja) 2015-10-05

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MM4A Annulment or lapse of patent due to non-payment of fees