TWI643020B - 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 - Google Patents
圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 Download PDFInfo
- Publication number
- TWI643020B TWI643020B TW106111218A TW106111218A TWI643020B TW I643020 B TWI643020 B TW I643020B TW 106111218 A TW106111218 A TW 106111218A TW 106111218 A TW106111218 A TW 106111218A TW I643020 B TWI643020 B TW I643020B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- curable composition
- solvent
- substrate
- forming method
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D135/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D135/02—Homopolymers or copolymers of esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662315736P | 2016-03-31 | 2016-03-31 | |
US62/315,736 | 2016-03-31 | ||
US15/453,521 US10754245B2 (en) | 2016-03-31 | 2017-03-08 | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US15/453,521 | 2017-03-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201802582A TW201802582A (zh) | 2018-01-16 |
TWI643020B true TWI643020B (zh) | 2018-12-01 |
Family
ID=59961469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106111218A TWI643020B (zh) | 2016-03-31 | 2017-03-31 | 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10754245B2 (ja) |
JP (1) | JP7094878B2 (ja) |
KR (1) | KR102209277B1 (ja) |
CN (1) | CN109075033B (ja) |
TW (1) | TWI643020B (ja) |
WO (1) | WO2017170625A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170066208A1 (en) | 2015-09-08 | 2017-03-09 | Canon Kabushiki Kaisha | Substrate pretreatment for reducing fill time in nanoimprint lithography |
US10488753B2 (en) | 2015-09-08 | 2019-11-26 | Canon Kabushiki Kaisha | Substrate pretreatment and etch uniformity in nanoimprint lithography |
US10829644B2 (en) | 2016-03-31 | 2020-11-10 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10754243B2 (en) | 2016-03-31 | 2020-08-25 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10134588B2 (en) | 2016-03-31 | 2018-11-20 | Canon Kabushiki Kaisha | Imprint resist and substrate pretreatment for reducing fill time in nanoimprint lithography |
US10578965B2 (en) | 2016-03-31 | 2020-03-03 | Canon Kabushiki Kaisha | Pattern forming method |
US10754244B2 (en) | 2016-03-31 | 2020-08-25 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10845700B2 (en) | 2016-03-31 | 2020-11-24 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10883006B2 (en) * | 2016-03-31 | 2021-01-05 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10095106B2 (en) | 2016-03-31 | 2018-10-09 | Canon Kabushiki Kaisha | Removing substrate pretreatment compositions in nanoimprint lithography |
US10620539B2 (en) | 2016-03-31 | 2020-04-14 | Canon Kabushiki Kaisha | Curing substrate pretreatment compositions in nanoimprint lithography |
JP6983760B2 (ja) * | 2016-04-08 | 2021-12-17 | キヤノン株式会社 | 硬化物パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法、インプリントモールドの製造方法、およびインプリント前処理コート用材料 |
US10509313B2 (en) | 2016-06-28 | 2019-12-17 | Canon Kabushiki Kaisha | Imprint resist with fluorinated photoinitiator and substrate pretreatment for reducing fill time in nanoimprint lithography |
US10317793B2 (en) | 2017-03-03 | 2019-06-11 | Canon Kabushiki Kaisha | Substrate pretreatment compositions for nanoimprint lithography |
CN110392919B (zh) | 2017-03-08 | 2024-01-16 | 佳能株式会社 | 图案形成方法和加工基板、光学部件和石英模具复制品的制造方法以及用于压印预处理的涂覆材料及其与压印抗蚀剂的组合 |
WO2018164015A1 (ja) | 2017-03-08 | 2018-09-13 | キヤノン株式会社 | パターン形成方法、インプリント前処理コーティング材料、及び基板の前処理方法 |
JP7328888B2 (ja) | 2017-03-08 | 2023-08-17 | キヤノン株式会社 | 硬化物パターンの製造方法、光学部品、回路基板および石英モールドレプリカの製造方法、ならびにインプリント前処理コート用材料およびその硬化物 |
KR102265572B1 (ko) | 2017-03-08 | 2021-06-17 | 캐논 가부시끼가이샤 | 광 나노임프린트 기술을 사용한 패턴 형성 방법, 임프린트 장치 및 경화성 조성물 |
WO2019031409A1 (ja) | 2017-08-10 | 2019-02-14 | キヤノン株式会社 | パターン形成方法 |
US11752519B2 (en) | 2020-06-19 | 2023-09-12 | Canon Kabushiki Kaisha | Planarization method and photocurable composition |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013254783A (ja) * | 2012-06-05 | 2013-12-19 | Canon Inc | インプリント方法およびインプリント装置、それを用いた物品の製造方法 |
TW201610594A (zh) * | 2014-08-21 | 2016-03-16 | Fujifilm Corp | 底層膜形成用樹脂組成物、積層體、圖案形成方法、壓印形成用套組及元件的製造方法 |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7307118B2 (en) | 2004-11-24 | 2007-12-11 | Molecular Imprints, Inc. | Composition to reduce adhesion between a conformable region and a mold |
US20060108710A1 (en) | 2004-11-24 | 2006-05-25 | Molecular Imprints, Inc. | Method to reduce adhesion between a conformable region and a mold |
US20050160934A1 (en) | 2004-01-23 | 2005-07-28 | Molecular Imprints, Inc. | Materials and methods for imprint lithography |
US7157036B2 (en) | 2003-06-17 | 2007-01-02 | Molecular Imprints, Inc | Method to reduce adhesion between a conformable region and a pattern of a mold |
US8142703B2 (en) | 2005-10-05 | 2012-03-27 | Molecular Imprints, Inc. | Imprint lithography method |
JP4467611B2 (ja) * | 2007-09-28 | 2010-05-26 | 株式会社日立製作所 | 光インプリント方法 |
US8119052B2 (en) * | 2007-11-02 | 2012-02-21 | Molecular Imprints, Inc. | Drop pattern generation for imprint lithography |
JP5065101B2 (ja) * | 2008-03-05 | 2012-10-31 | 東洋合成工業株式会社 | パターン形成方法 |
JP2010106185A (ja) | 2008-10-31 | 2010-05-13 | Fujifilm Corp | 光インプリント用硬化性組成物およびそれを用いたパターン形成方法 |
WO2011027845A1 (en) | 2009-09-02 | 2011-03-10 | Canon Kabushiki Kaisha | Manufacturing method for plastic member and plastic member |
JP2011066074A (ja) * | 2009-09-15 | 2011-03-31 | Fujifilm Corp | インプリント用硬化性組成物 |
JP5511415B2 (ja) * | 2010-02-02 | 2014-06-04 | 富士フイルム株式会社 | インプリント用硬化性組成物、パターン形成方法およびパターン |
JP5767615B2 (ja) * | 2011-10-07 | 2015-08-19 | 富士フイルム株式会社 | インプリント用下層膜組成物およびこれを用いたパターン形成方法 |
JP6012344B2 (ja) | 2011-10-24 | 2016-10-25 | キヤノン株式会社 | 膜の形成方法 |
JP5959865B2 (ja) | 2012-02-09 | 2016-08-02 | キヤノン株式会社 | 光硬化物及びその製造方法 |
KR20150003158A (ko) * | 2012-04-09 | 2015-01-08 | 아사히 가라스 가부시키가이샤 | 미세 패턴을 표면에 갖는 물품의 제조 방법 |
JP5930832B2 (ja) | 2012-04-27 | 2016-06-08 | キヤノン株式会社 | 光硬化物の製造方法 |
JP6071255B2 (ja) | 2012-06-04 | 2017-02-01 | キヤノン株式会社 | 光硬化物 |
JP5827180B2 (ja) | 2012-06-18 | 2015-12-02 | 富士フイルム株式会社 | インプリント用硬化性組成物と基板の密着用組成物およびこれを用いた半導体デバイス |
JP6000712B2 (ja) | 2012-07-24 | 2016-10-05 | キヤノン株式会社 | 樹脂の製造方法及び樹脂の製造装置 |
JP6278645B2 (ja) * | 2012-09-24 | 2018-02-14 | キヤノン株式会社 | 光硬化性組成物及びこれを用いた膜の製造方法 |
JP6305058B2 (ja) | 2013-03-05 | 2018-04-04 | キヤノン株式会社 | 感光性ガス発生剤、光硬化性組成物 |
JP6029506B2 (ja) | 2013-03-26 | 2016-11-24 | 富士フイルム株式会社 | インプリント用下層膜形成組成物およびパターン形成方法 |
JP6327948B2 (ja) * | 2013-06-26 | 2018-05-23 | キヤノン株式会社 | 光硬化性組成物、硬化物、これを用いた、膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法 |
JP6328001B2 (ja) | 2013-08-30 | 2018-05-23 | キヤノン株式会社 | インプリント用硬化性組成物、膜、膜の製造方法 |
JP6460672B2 (ja) | 2013-09-18 | 2019-01-30 | キヤノン株式会社 | 膜の製造方法、光学部品の製造方法、回路基板の製造方法及び電子部品の製造方法 |
US10073341B2 (en) * | 2014-07-08 | 2018-09-11 | Canon Kabushiki Kaisha | Adhesion layer composition, method for forming film by nanoimprinting, methods for manufacturing optical component, circuit board and electronic apparatus |
US10488753B2 (en) | 2015-09-08 | 2019-11-26 | Canon Kabushiki Kaisha | Substrate pretreatment and etch uniformity in nanoimprint lithography |
US20170066208A1 (en) | 2015-09-08 | 2017-03-09 | Canon Kabushiki Kaisha | Substrate pretreatment for reducing fill time in nanoimprint lithography |
JP6141500B2 (ja) | 2015-09-08 | 2017-06-07 | キヤノン株式会社 | ナノインプリントリソグラフィーにおける充填時間を短縮するための基板の前処理 |
KR102097225B1 (ko) | 2015-09-08 | 2020-04-03 | 캐논 가부시끼가이샤 | 나노임프린트 리소그래피에서의 기재 전처리 및 식각 균일성 |
US20170068159A1 (en) * | 2015-09-08 | 2017-03-09 | Canon Kabushiki Kaisha | Substrate pretreatment for reducing fill time in nanoimprint lithography |
CN108602238B (zh) | 2016-01-25 | 2021-04-13 | 佳能株式会社 | 图案形成方法、加工基板的生产方法、光学组件的生产方法、电路基板的生产方法、电子组件的生产方法和压印模具的生产方法 |
US10754244B2 (en) | 2016-03-31 | 2020-08-25 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10845700B2 (en) | 2016-03-31 | 2020-11-24 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10829644B2 (en) | 2016-03-31 | 2020-11-10 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10754243B2 (en) | 2016-03-31 | 2020-08-25 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10883006B2 (en) | 2016-03-31 | 2021-01-05 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
US10578965B2 (en) | 2016-03-31 | 2020-03-03 | Canon Kabushiki Kaisha | Pattern forming method |
JP6983760B2 (ja) | 2016-04-08 | 2021-12-17 | キヤノン株式会社 | 硬化物パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法、インプリントモールドの製造方法、およびインプリント前処理コート用材料 |
-
2017
- 2017-03-08 US US15/453,521 patent/US10754245B2/en active Active
- 2017-03-29 WO PCT/JP2017/012779 patent/WO2017170625A1/ja active Application Filing
- 2017-03-29 JP JP2018508116A patent/JP7094878B2/ja active Active
- 2017-03-29 KR KR1020187030398A patent/KR102209277B1/ko active IP Right Grant
- 2017-03-29 CN CN201780022158.0A patent/CN109075033B/zh active Active
- 2017-03-31 TW TW106111218A patent/TWI643020B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013254783A (ja) * | 2012-06-05 | 2013-12-19 | Canon Inc | インプリント方法およびインプリント装置、それを用いた物品の製造方法 |
TW201610594A (zh) * | 2014-08-21 | 2016-03-16 | Fujifilm Corp | 底層膜形成用樹脂組成物、積層體、圖案形成方法、壓印形成用套組及元件的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2017170625A1 (ja) | 2017-10-05 |
KR102209277B1 (ko) | 2021-01-29 |
TW201802582A (zh) | 2018-01-16 |
CN109075033A (zh) | 2018-12-21 |
JPWO2017170625A1 (ja) | 2019-02-07 |
JP7094878B2 (ja) | 2022-07-04 |
US10754245B2 (en) | 2020-08-25 |
CN109075033B (zh) | 2024-04-02 |
US20170285464A1 (en) | 2017-10-05 |
KR20180126027A (ko) | 2018-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI643020B (zh) | 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 | |
TWI632047B (zh) | 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 | |
TWI632046B (zh) | 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 | |
TWI629160B (zh) | 圖型形成方法、加工基板之製造方法、光學零件之製造方法、電路基板之製造方法、電子零件之製造方法、轉印模具之製造方法 | |
TWI666685B (zh) | 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 | |
TWI629161B (zh) | 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 | |
TWI644181B (zh) | 圖型形成方法、加工基板之製造方法、光學元件之製造方法、電路基板之製造方法、電子元件之製造方法、轉印模具之製造方法 | |
TWI667117B (zh) | 圖型形成方法、壓印前處理塗覆材料及基板之前處理方法 | |
CN109075034B (zh) | 固化物图案的形成方法和压印预处理涂布用材料 | |
TWI642533B (zh) | 圖型形成方法、加工基板之製造方法、光學零件之製造方法、電路基板之製造方法、電子零件之製造方法、壓印模之製造方法 | |
TWI666108B (zh) | 硬化物圖型之製造方法、光學零件、電路基板及石英模複製品之製造方法、與壓印前處理塗佈用材料及其硬化物 | |
TWI680349B (zh) | 圖型形成方法、以及加工基板、光學零件及石英複製模的製造方法、以及壓印前處理塗佈材料及其與壓印抗蝕劑的套組 | |
TWI681862B (zh) | 使用光奈米壓印技術之圖型形成方法、壓印裝置及硬化性組成物 | |
TWI584068B (zh) | 光可固化組成物,及使用該組成物形成固化產物圖案與製造光學組件、電路板及壓印模具的方法 |