TWI640413B - Resin molding device, method for producing resin molded article, and method for producing product - Google Patents
Resin molding device, method for producing resin molded article, and method for producing product Download PDFInfo
- Publication number
- TWI640413B TWI640413B TW106115977A TW106115977A TWI640413B TW I640413 B TWI640413 B TW I640413B TW 106115977 A TW106115977 A TW 106115977A TW 106115977 A TW106115977 A TW 106115977A TW I640413 B TWI640413 B TW I640413B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- fluid resin
- fluid
- volume
- discharged
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 782
- 239000011347 resin Substances 0.000 title claims abstract description 782
- 238000000465 moulding Methods 0.000 title claims abstract description 143
- 238000004519 manufacturing process Methods 0.000 title claims description 103
- 239000012530 fluid Substances 0.000 claims abstract description 383
- 230000007246 mechanism Effects 0.000 claims abstract description 264
- 238000000576 coating method Methods 0.000 claims abstract description 133
- 239000011248 coating agent Substances 0.000 claims abstract description 132
- 238000000748 compression moulding Methods 0.000 claims abstract description 92
- 238000007599 discharging Methods 0.000 claims abstract description 41
- 238000004364 calculation method Methods 0.000 claims description 62
- 238000005259 measurement Methods 0.000 claims description 53
- 238000003860 storage Methods 0.000 claims description 42
- 238000005520 cutting process Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 description 91
- 238000006073 displacement reaction Methods 0.000 description 79
- 239000007789 gas Substances 0.000 description 52
- 235000012431 wafers Nutrition 0.000 description 52
- 239000000047 product Substances 0.000 description 43
- 230000002093 peripheral effect Effects 0.000 description 25
- 239000013067 intermediate product Substances 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 18
- 239000007788 liquid Substances 0.000 description 16
- 238000004590 computer program Methods 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 11
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 238000012805 post-processing Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000009969 flowable effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000013215 result calculation Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016126068A JP6218891B1 (ja) | 2016-06-24 | 2016-06-24 | 樹脂成形装置、樹脂成形品の製造方法及び製品の製造方法 |
| JP2016-126068 | 2016-06-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201800206A TW201800206A (zh) | 2018-01-01 |
| TWI640413B true TWI640413B (zh) | 2018-11-11 |
Family
ID=60156868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106115977A TWI640413B (zh) | 2016-06-24 | 2017-05-15 | Resin molding device, method for producing resin molded article, and method for producing product |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6218891B1 (ja) |
| KR (1) | KR102010643B1 (ja) |
| CN (1) | CN107538667B (ja) |
| TW (1) | TWI640413B (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6923503B2 (ja) * | 2018-11-27 | 2021-08-18 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
| JP7312452B2 (ja) * | 2020-01-24 | 2023-07-21 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法 |
| JP7291660B2 (ja) * | 2020-04-17 | 2023-06-15 | Ｔｏｗａ株式会社 | 樹脂成形品の製造方法、樹脂成形装置 |
| JP7003184B2 (ja) * | 2020-06-22 | 2022-01-20 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び、樹脂成形品の製造方法 |
| WO2022254656A1 (ja) * | 2021-06-03 | 2022-12-08 | アピックヤマダ株式会社 | 圧縮成形装置 |
| JP7564792B2 (ja) | 2021-09-24 | 2024-10-09 | Ｔｏｗａ株式会社 | 樹脂成形品の製造方法、フィルム固定部材、液状樹脂拡大機構、及び樹脂成形装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003165133A (ja) * | 2001-11-30 | 2003-06-10 | Apic Yamada Corp | 液材吐出装置及び樹脂封止装置 |
| JP2003231145A (ja) * | 2001-12-04 | 2003-08-19 | Sainekkusu:Kk | 樹脂封止装置及びその方法 |
| JP2007083473A (ja) * | 2005-09-21 | 2007-04-05 | Apic Yamada Corp | ディスペンサおよび樹脂モールド装置 |
| JP2009253128A (ja) * | 2008-04-09 | 2009-10-29 | Sumitomo Heavy Ind Ltd | 樹脂量決定装置、および、当該樹脂量決定装置を備えた樹脂封止装置 |
| JP2009260180A (ja) * | 2008-04-21 | 2009-11-05 | Sumitomo Heavy Ind Ltd | 樹脂量決定装置、および、当該樹脂量決定装置を備えた樹脂封止装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3501441B2 (ja) * | 1998-05-12 | 2004-03-02 | 松下電器産業株式会社 | 電子部品の製造方法及び製造装置 |
| JP2006134917A (ja) * | 2004-11-02 | 2006-05-25 | Apic Yamada Corp | 樹脂封止方法 |
| JP5261261B2 (ja) * | 2009-03-31 | 2013-08-14 | Ｔｏｗａ株式会社 | 圧縮樹脂封止成形に用いられる液状樹脂材料供給方法及び装置 |
| JP5520612B2 (ja) * | 2010-01-04 | 2014-06-11 | 東芝機械株式会社 | ディスペンサを備えた転写装置、ディスペンサの吐出量検出方法、及びディスペンサの吐出量制御方法 |
| JP6039198B2 (ja) * | 2012-03-07 | 2016-12-07 | Ｔｏｗａ株式会社 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
| JP5488850B2 (ja) * | 2012-07-07 | 2014-05-14 | Ｔｄｋ株式会社 | 液体材料吐出装置及び方法 |
| JP6284764B2 (ja) * | 2013-12-24 | 2018-02-28 | Ｔｏｗａ株式会社 | 樹脂撒布方法、被樹脂封止部品の樹脂封止方法、樹脂撒布装置、被樹脂封止部品の樹脂封止装置、および樹脂封止成形品製造装置 |
| JP6169516B2 (ja) * | 2014-03-31 | 2017-07-26 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法 |
-
2016
- 2016-06-24 JP JP2016126068A patent/JP6218891B1/ja active Active
-
2017
- 2017-03-24 KR KR1020170037684A patent/KR102010643B1/ko active IP Right Grant
- 2017-05-15 TW TW106115977A patent/TWI640413B/zh active
- 2017-06-13 CN CN201710442301.3A patent/CN107538667B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003165133A (ja) * | 2001-11-30 | 2003-06-10 | Apic Yamada Corp | 液材吐出装置及び樹脂封止装置 |
| JP2003231145A (ja) * | 2001-12-04 | 2003-08-19 | Sainekkusu:Kk | 樹脂封止装置及びその方法 |
| JP2007083473A (ja) * | 2005-09-21 | 2007-04-05 | Apic Yamada Corp | ディスペンサおよび樹脂モールド装置 |
| JP2009253128A (ja) * | 2008-04-09 | 2009-10-29 | Sumitomo Heavy Ind Ltd | 樹脂量決定装置、および、当該樹脂量決定装置を備えた樹脂封止装置 |
| JP2009260180A (ja) * | 2008-04-21 | 2009-11-05 | Sumitomo Heavy Ind Ltd | 樹脂量決定装置、および、当該樹脂量決定装置を備えた樹脂封止装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6218891B1 (ja) | 2017-10-25 |
| KR20180001434A (ko) | 2018-01-04 |
| CN107538667A (zh) | 2018-01-05 |
| JP2017226202A (ja) | 2017-12-28 |
| CN107538667B (zh) | 2019-12-06 |
| TW201800206A (zh) | 2018-01-01 |
| KR102010643B1 (ko) | 2019-10-21 |
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