TWI631012B - 帶有保護薄膜的透明導電性薄膜 - Google Patents

帶有保護薄膜的透明導電性薄膜 Download PDF

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Publication number
TWI631012B
TWI631012B TW103124898A TW103124898A TWI631012B TW I631012 B TWI631012 B TW I631012B TW 103124898 A TW103124898 A TW 103124898A TW 103124898 A TW103124898 A TW 103124898A TW I631012 B TWI631012 B TW I631012B
Authority
TW
Taiwan
Prior art keywords
protective film
transparent conductive
conductive film
value
film
Prior art date
Application number
TW103124898A
Other languages
English (en)
Chinese (zh)
Other versions
TW201505826A (zh
Inventor
渡邊卓三
佐藤慶一
大類知生
所司悟
Original Assignee
琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 琳得科股份有限公司 filed Critical 琳得科股份有限公司
Publication of TW201505826A publication Critical patent/TW201505826A/zh
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Publication of TWI631012B publication Critical patent/TWI631012B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Surface Treatment Of Optical Elements (AREA)
TW103124898A 2013-08-05 2014-07-21 帶有保護薄膜的透明導電性薄膜 TWI631012B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-162003 2013-08-05
JP2013162003A JP6227321B2 (ja) 2013-08-05 2013-08-05 プロテクトフィルム付き透明導電性フィルム

Publications (2)

Publication Number Publication Date
TW201505826A TW201505826A (zh) 2015-02-16
TWI631012B true TWI631012B (zh) 2018-08-01

Family

ID=52496574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103124898A TWI631012B (zh) 2013-08-05 2014-07-21 帶有保護薄膜的透明導電性薄膜

Country Status (4)

Country Link
JP (1) JP6227321B2 (ko)
KR (1) KR102155123B1 (ko)
CN (1) CN104339734B (ko)
TW (1) TWI631012B (ko)

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JP5957133B2 (ja) * 2014-11-20 2016-07-27 日東電工株式会社 保護フィルム付き透明導電性フィルム
TWI582873B (zh) * 2015-02-26 2017-05-11 Hitachi Maxell A masking method for manufacturing the same, and a method of manufacturing the solder bump
WO2016151908A1 (ja) * 2015-03-26 2016-09-29 富士フイルム株式会社 タッチパネル
JP6587405B2 (ja) * 2015-03-30 2019-10-09 リンテック株式会社 透明導電性フィルム
JP6563228B2 (ja) * 2015-03-30 2019-08-21 リンテック株式会社 透明導電性フィルム
CN104793826B (zh) * 2015-05-01 2022-06-03 张家港康得新光电材料有限公司 双面硬化膜与包括该双面硬化膜的电容式触摸屏
JP2016225270A (ja) * 2015-05-27 2016-12-28 日東電工株式会社 透明導電性フィルム
JP6688033B2 (ja) 2015-05-27 2020-04-28 日東電工株式会社 透明導電性フィルム
CN104991671B (zh) * 2015-06-23 2017-09-29 广州聚达光电有限公司 一种柔性触控屏传感薄膜及其制备方法
JP6552099B2 (ja) * 2015-08-24 2019-07-31 日東電工株式会社 キャリアフィルム付き透明導電性フィルム及びそれを用いたタッチパネル
JP6553451B2 (ja) * 2015-08-25 2019-07-31 日東電工株式会社 透明樹脂フィルム、透明導電性フィルムおよびそれを用いたタッチパネル
US10391750B2 (en) 2015-09-03 2019-08-27 Dongwoo Fine-Chem Co., Ltd. Cover window plate and image display device including the same
CN105045456A (zh) * 2015-09-07 2015-11-11 张家港康得新光电材料有限公司 金属网格透明导电体、其制备方法与电容式触摸屏
CN105045455A (zh) * 2015-09-07 2015-11-11 张家港康得新光电材料有限公司 金属网格透明导电膜、其制备方法与电容式触摸屏
JP6669468B2 (ja) * 2015-10-26 2020-03-18 積水化学工業株式会社 光透過性導電フィルム、及び、アニール処理された光透過性導電フィルムの製造方法
JP6560622B2 (ja) * 2016-01-07 2019-08-14 積水化学工業株式会社 光透過性導電フィルム積層体
TWI610376B (zh) * 2016-01-19 2018-01-01 日立麥克賽爾股份有限公司 配列用遮罩及其製造方法、焊料凸塊之形成方法
JP6650770B2 (ja) * 2016-01-29 2020-02-19 日東電工株式会社 導電性積層フィルム
WO2017159381A1 (ja) * 2016-03-17 2017-09-21 東洋紡株式会社 導電性皮膜およびレーザーエッチング加工用導電性ペースト
KR102545339B1 (ko) * 2016-06-10 2023-06-19 닛토덴코 가부시키가이샤 투명 도전성 필름 및 터치 패널
JP6216907B1 (ja) * 2016-08-23 2017-10-18 リンテック株式会社 ハードコートフィルム
KR102666083B1 (ko) * 2016-10-31 2024-05-13 엘지디스플레이 주식회사 접촉 감응 소자 및 이를 포함하는 표시 장치
CN108062176B (zh) * 2016-11-09 2021-07-09 东友精细化工有限公司 触摸传感器层叠体及其制造方法
JP6378743B2 (ja) * 2016-12-07 2018-08-22 リンテック株式会社 電池用粘着シートおよびリチウムイオン電池
JP6875842B2 (ja) * 2016-12-12 2021-05-26 住友化学株式会社 有機電子デバイスの製造方法、電極付き基板及び有機電子デバイス
TWI633563B (zh) * 2016-12-15 2018-08-21 日商日東電工股份有限公司 Transparent conductive film with carrier film and touch panel using the same
JP7270334B2 (ja) * 2017-10-27 2023-05-10 日東電工株式会社 透明導電性フィルムおよびその製造方法
CN108376042A (zh) * 2018-05-04 2018-08-07 蓝思科技（长沙）有限公司 金属网格传感器和触摸屏及其制备方法与设备
JP7395244B2 (ja) * 2018-06-12 2023-12-11 日東電工株式会社 ハードコートフィルムおよび透明導電性フィルム
CN109765647A (zh) * 2018-12-28 2019-05-17 张家港康得新光电材料有限公司 一种透明聚酰亚胺膜
JP7150628B2 (ja) * 2019-01-31 2022-10-11 日東電工株式会社 透明導電性フィルム積層体
JP7294819B2 (ja) * 2019-01-31 2023-06-20 日東電工株式会社 透明導電性フィルム用基材および透明導電性フィルム
JP7223586B2 (ja) * 2019-01-31 2023-02-16 日東電工株式会社 透明導電性フィルム積層体
JP6816236B1 (ja) * 2019-10-07 2021-01-20 日東電工株式会社 印刷層付フィルム積層体、該印刷層付フィルム積層体を含む光学積層体、およびこれらを用いた画像表示装置
JP6816237B1 (ja) * 2019-10-07 2021-01-20 日東電工株式会社 印刷層付フィルム積層体の製造方法
JP2020104520A (ja) * 2020-02-27 2020-07-09 積水化学工業株式会社 光透過性導電フィルム、及び、アニール処理された光透過性導電フィルムの製造方法
CN115280428A (zh) * 2020-03-19 2022-11-01 日东电工株式会社 透明导电层和透明导电性薄膜

Citations (1)

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US20040033735A1 (en) * 2002-07-31 2004-02-19 Shinichi Takada Surface protective film for transparent conductive film and method for manufacturing the same, and transparent conductive film with surface protective film

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JP3995141B2 (ja) * 2000-06-12 2007-10-24 日東電工株式会社 透明導電性フィルムおよびタッチパネル電極
JP5506011B2 (ja) * 2007-03-02 2014-05-28 日東電工株式会社 粘着剤層付き透明導電性フィルムおよびその製造方法
JP2010032795A (ja) * 2008-07-29 2010-02-12 Fujifilm Corp ハードコートフィルム、ハードコートフィルムの製造方法、反射防止フィルム、偏光板および表示装置
JP5359656B2 (ja) 2009-07-31 2013-12-04 東洋紡株式会社 ハードコートフィルムおよびそれを用いた透明導電性フィルム
JP5516089B2 (ja) * 2010-06-01 2014-06-11 王子ホールディングス株式会社 導電性シート、タッチパネル用導電性積層体、及びタッチパネル
JP5903820B2 (ja) * 2011-09-28 2016-04-13 凸版印刷株式会社 透明導電性フィルムの製造方法及びタッチパネルの製造方法
JP2013123825A (ja) * 2011-12-13 2013-06-24 Keiwa Inc ハードコートフィルム、透明導電性積層体及びタッチパネル
JP6074144B2 (ja) * 2012-02-06 2017-02-01 リンテック株式会社 光学用フィルム、並びにディスプレイ装置

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US20040033735A1 (en) * 2002-07-31 2004-02-19 Shinichi Takada Surface protective film for transparent conductive film and method for manufacturing the same, and transparent conductive film with surface protective film

Also Published As

Publication number Publication date
CN104339734B (zh) 2018-02-13
TW201505826A (zh) 2015-02-16
CN104339734A (zh) 2015-02-11
KR102155123B1 (ko) 2020-09-11
KR20150016893A (ko) 2015-02-13
JP2015030213A (ja) 2015-02-16
JP6227321B2 (ja) 2017-11-08

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