TWI627307B - 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板 - Google Patents

印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板 Download PDF

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Publication number
TWI627307B
TWI627307B TW105140618A TW105140618A TWI627307B TW I627307 B TWI627307 B TW I627307B TW 105140618 A TW105140618 A TW 105140618A TW 105140618 A TW105140618 A TW 105140618A TW I627307 B TWI627307 B TW I627307B
Authority
TW
Taiwan
Prior art keywords
copper foil
printed wiring
wiring board
coupling agent
silane coupling
Prior art date
Application number
TW105140618A
Other languages
English (en)
Chinese (zh)
Other versions
TW201739958A (zh
Inventor
Takahiro Saito
Takeshi Ezura
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201739958A publication Critical patent/TW201739958A/zh
Application granted granted Critical
Publication of TWI627307B publication Critical patent/TWI627307B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW105140618A 2015-12-09 2016-12-08 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板 TWI627307B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015240006A JP6182584B2 (ja) 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
TW201739958A TW201739958A (zh) 2017-11-16
TWI627307B true TWI627307B (zh) 2018-06-21

Family

ID=59013183

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105140618A TWI627307B (zh) 2015-12-09 2016-12-08 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板

Country Status (5)

Country Link
JP (1) JP6182584B2 (ja)
KR (1) KR102106924B1 (ja)
CN (1) CN107109664B (ja)
TW (1) TWI627307B (ja)
WO (1) WO2017099094A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111655908B (zh) * 2017-12-05 2022-03-29 古河电气工业株式会社 表面处理铜箔以及使用该表面处理铜箔的覆铜层叠板和印刷布线板
CN113383117A (zh) 2019-02-04 2021-09-10 松下知识产权经营株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜箔层压板、带树脂的铜箔和电路板
US11866536B2 (en) 2019-02-04 2024-01-09 Panasonic Intellectual Property Management Co., Ltd. Copper-clad laminate plate, resin-attached copper foil, and circuit board using same
CN110838408A (zh) * 2019-10-10 2020-02-25 深圳市峰泳科技有限公司 高剥离力高介电常数的平面电容及其制备方法
CN114555357A (zh) * 2019-10-25 2022-05-27 松下知识产权经营株式会社 覆金属箔层压板、布线板、带树脂的金属箔、以及树脂组合物
KR20220119391A (ko) * 2019-12-26 2022-08-29 나믹스 가부시끼가이샤 실란 커플링제로 처리된 복합 구리 부재
CN112708909A (zh) * 2020-12-18 2021-04-27 江西省江铜耶兹铜箔有限公司 一种复合电镀液及高频pcb用低轮廓电解铜箔的制备方法
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
WO2022244828A1 (ja) * 2021-05-20 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JPWO2022244826A1 (ja) * 2021-05-20 2022-11-24
JPWO2022244827A1 (ja) * 2021-05-20 2022-11-24

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
JP2015061757A (ja) * 2013-08-21 2015-04-02 Jx日鉱日石金属株式会社 キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2015061939A (ja) * 2013-08-20 2015-04-02 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いたキャリア付銅箔、積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
WO2015087941A1 (ja) * 2013-12-10 2015-06-18 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

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JPS4833556B1 (ja) 1968-10-12 1973-10-15
JPS57184295A (en) * 1981-05-08 1982-11-12 Furukawa Circuit Foil Copper foil for printed circuit and method of producing same
JP4090467B2 (ja) 2002-05-13 2008-05-28 三井金属鉱業株式会社 チップオンフィルム用フレキシブルプリント配線板
JP4470917B2 (ja) * 2006-06-29 2010-06-02 ソニー株式会社 電極集電体、電池用電極及び二次電池
EP2216427B1 (en) * 2007-09-28 2013-01-23 JX Nippon Mining & Metals Corporation Copper foil for printed circuit and copper clad laminate
JP2010212470A (ja) * 2009-03-11 2010-09-24 Hitachi Cable Ltd プリント配線板用銅箔およびその製造方法ならびにプリント配線板
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板
WO2011108467A1 (ja) * 2010-03-01 2011-09-09 古河電気工業株式会社 銅箔の表面処理方法、表面処理銅箔およびリチウムイオン二次電池の負極集電体用銅箔
JP5634103B2 (ja) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
KR101740092B1 (ko) * 2010-09-27 2017-05-25 제이엑스금속주식회사 프린트 배선판용 구리박, 그 제조 방법, 프린트 배선판용 수지 기판 및 프린트 배선판
JP5497808B2 (ja) 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた銅張積層板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
JP2015061939A (ja) * 2013-08-20 2015-04-02 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いたキャリア付銅箔、積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2015061757A (ja) * 2013-08-21 2015-04-02 Jx日鉱日石金属株式会社 キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
WO2015087941A1 (ja) * 2013-12-10 2015-06-18 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

Also Published As

Publication number Publication date
WO2017099094A1 (ja) 2017-06-15
JP6182584B2 (ja) 2017-08-16
KR102106924B1 (ko) 2020-05-06
KR20180037920A (ko) 2018-04-13
CN107109664A (zh) 2017-08-29
JP2017106068A (ja) 2017-06-15
CN107109664B (zh) 2019-03-26
TW201739958A (zh) 2017-11-16

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