KR102106924B1 - 프린트 배선판용 표면 처리 동박, 프린트 배선판용 구리 피복 적층판 및 프린트 배선판 - Google Patents

프린트 배선판용 표면 처리 동박, 프린트 배선판용 구리 피복 적층판 및 프린트 배선판 Download PDF

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Publication number
KR102106924B1
KR102106924B1 KR1020177032936A KR20177032936A KR102106924B1 KR 102106924 B1 KR102106924 B1 KR 102106924B1 KR 1020177032936 A KR1020177032936 A KR 1020177032936A KR 20177032936 A KR20177032936 A KR 20177032936A KR 102106924 B1 KR102106924 B1 KR 102106924B1
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KR
South Korea
Prior art keywords
copper foil
printed wiring
silane coupling
coupling agent
wiring board
Prior art date
Application number
KR1020177032936A
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English (en)
Korean (ko)
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KR20180037920A (ko
Inventor
다카히로 사이토
다케시 에주라
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20180037920A publication Critical patent/KR20180037920A/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
KR1020177032936A 2015-12-09 2016-12-06 프린트 배선판용 표면 처리 동박, 프린트 배선판용 구리 피복 적층판 및 프린트 배선판 KR102106924B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015240006A JP6182584B2 (ja) 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
JPJP-P-2015-240006 2015-12-09
PCT/JP2016/086282 WO2017099094A1 (ja) 2015-12-09 2016-12-06 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
KR20180037920A KR20180037920A (ko) 2018-04-13
KR102106924B1 true KR102106924B1 (ko) 2020-05-06

Family

ID=59013183

Family Applications (1)

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KR1020177032936A KR102106924B1 (ko) 2015-12-09 2016-12-06 프린트 배선판용 표면 처리 동박, 프린트 배선판용 구리 피복 적층판 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6182584B2 (ja)
KR (1) KR102106924B1 (ja)
CN (1) CN107109664B (ja)
TW (1) TWI627307B (ja)
WO (1) WO2017099094A1 (ja)

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CN111655908B (zh) * 2017-12-05 2022-03-29 古河电气工业株式会社 表面处理铜箔以及使用该表面处理铜箔的覆铜层叠板和印刷布线板
CN113383117A (zh) 2019-02-04 2021-09-10 松下知识产权经营株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜箔层压板、带树脂的铜箔和电路板
US11866536B2 (en) 2019-02-04 2024-01-09 Panasonic Intellectual Property Management Co., Ltd. Copper-clad laminate plate, resin-attached copper foil, and circuit board using same
CN110838408A (zh) * 2019-10-10 2020-02-25 深圳市峰泳科技有限公司 高剥离力高介电常数的平面电容及其制备方法
CN114555357A (zh) * 2019-10-25 2022-05-27 松下知识产权经营株式会社 覆金属箔层压板、布线板、带树脂的金属箔、以及树脂组合物
KR20220119391A (ko) * 2019-12-26 2022-08-29 나믹스 가부시끼가이샤 실란 커플링제로 처리된 복합 구리 부재
CN112708909A (zh) * 2020-12-18 2021-04-27 江西省江铜耶兹铜箔有限公司 一种复合电镀液及高频pcb用低轮廓电解铜箔的制备方法
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
WO2022244828A1 (ja) * 2021-05-20 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JPWO2022244826A1 (ja) * 2021-05-20 2022-11-24
JPWO2022244827A1 (ja) * 2021-05-20 2022-11-24

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JP2010212470A (ja) * 2009-03-11 2010-09-24 Hitachi Cable Ltd プリント配線板用銅箔およびその製造方法ならびにプリント配線板
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板

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WO2015087941A1 (ja) * 2013-12-10 2015-06-18 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

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Publication number Priority date Publication date Assignee Title
JP2010212470A (ja) * 2009-03-11 2010-09-24 Hitachi Cable Ltd プリント配線板用銅箔およびその製造方法ならびにプリント配線板
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板

Also Published As

Publication number Publication date
WO2017099094A1 (ja) 2017-06-15
JP6182584B2 (ja) 2017-08-16
KR20180037920A (ko) 2018-04-13
CN107109664A (zh) 2017-08-29
JP2017106068A (ja) 2017-06-15
CN107109664B (zh) 2019-03-26
TW201739958A (zh) 2017-11-16
TWI627307B (zh) 2018-06-21

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