TWI624001B - Substrate support device - Google Patents
Substrate support device Download PDFInfo
- Publication number
- TWI624001B TWI624001B TW106108716A TW106108716A TWI624001B TW I624001 B TWI624001 B TW I624001B TW 106108716 A TW106108716 A TW 106108716A TW 106108716 A TW106108716 A TW 106108716A TW I624001 B TWI624001 B TW I624001B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- light
- pattern
- base layer
- outer peripheral
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 193
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000012545 processing Methods 0.000 claims abstract description 26
- 230000002093 peripheral effect Effects 0.000 claims description 95
- 239000011651 chromium Substances 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 24
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 19
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 19
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 6
- 238000002310 reflectometry Methods 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium(II) oxide Chemical compound [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052845 zircon Inorganic materials 0.000 claims description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 106
- 238000005286 illumination Methods 0.000 description 86
- 238000003384 imaging method Methods 0.000 description 38
- 210000003128 head Anatomy 0.000 description 31
- 238000012937 correction Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 17
- 239000010408 film Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000005259 measurement Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 230000008859 change Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 238000009434 installation Methods 0.000 description 6
- 101100111453 Arabidopsis thaliana BHLH57 gene Proteins 0.000 description 5
- 101100111459 Arabidopsis thaliana BHLH67 gene Proteins 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 210000001747 pupil Anatomy 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000010191 image analysis Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- FMRHJJZUHUTGKE-UHFFFAOYSA-N Ethylhexyl salicylate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1O FMRHJJZUHUTGKE-UHFFFAOYSA-N 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012188116 | 2012-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201727818A TW201727818A (zh) | 2017-08-01 |
| TWI624001B true TWI624001B (zh) | 2018-05-11 |
Family
ID=50182989
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106108716A TWI624001B (zh) | 2012-08-28 | 2013-04-12 | Substrate support device |
| TW107111761A TWI658535B (zh) | 2012-08-28 | 2013-04-12 | Pattern forming device |
| TW102112961A TWI581362B (zh) | 2012-08-28 | 2013-04-12 | A substrate supporting device, and an exposure device |
| TW108109820A TWI729366B (zh) | 2012-08-28 | 2013-04-12 | 圖案形成裝置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107111761A TWI658535B (zh) | 2012-08-28 | 2013-04-12 | Pattern forming device |
| TW102112961A TWI581362B (zh) | 2012-08-28 | 2013-04-12 | A substrate supporting device, and an exposure device |
| TW108109820A TWI729366B (zh) | 2012-08-28 | 2013-04-12 | 圖案形成裝置 |
Country Status (7)
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104583874B (zh) * | 2012-08-28 | 2017-11-03 | 株式会社尼康 | 衬底支承装置及曝光装置 |
| WO2015152217A1 (ja) * | 2014-04-01 | 2015-10-08 | 株式会社ニコン | 基板処理装置、デバイス製造方法及び基板処理装置の調整方法 |
| TWI709006B (zh) * | 2014-04-01 | 2020-11-01 | 日商尼康股份有限公司 | 圖案描繪裝置及圖案描繪方法 |
| CN106687867B (zh) * | 2014-09-04 | 2019-08-02 | 株式会社尼康 | 处理系统及元件制造方法 |
| KR102345439B1 (ko) * | 2015-01-15 | 2021-12-30 | 삼성디스플레이 주식회사 | 롤투롤 노광 시스템 |
| JP6413784B2 (ja) * | 2015-01-19 | 2018-10-31 | 株式会社ニコン | 基板処理装置及びデバイス製造方法 |
| TWI699624B (zh) * | 2015-02-27 | 2020-07-21 | 日商尼康股份有限公司 | 基板處理裝置及元件製造方法 |
| KR102195908B1 (ko) * | 2015-03-20 | 2020-12-29 | 가부시키가이샤 니콘 | 패턴 묘화 장치 및 패턴 묘화 방법 |
| JP2017058494A (ja) * | 2015-09-16 | 2017-03-23 | 株式会社ニコン | パターン描画装置、パターン描画方法、基板処理装置、および、デバイス製造方法 |
| CN111781806B (zh) * | 2015-10-30 | 2023-06-16 | 株式会社尼康 | 基板处理装置 |
| JP6551175B2 (ja) * | 2015-11-10 | 2019-07-31 | 株式会社ニコン | 回転円筒体の計測装置、基板処理装置及びデバイス製造方法 |
| US9918375B2 (en) * | 2015-11-16 | 2018-03-13 | Kla-Tencor Corporation | Plasma based light source having a target material coated on a cylindrically-symmetric element |
| JP6589607B2 (ja) * | 2015-12-04 | 2019-10-16 | 株式会社ニコン | 描画装置および描画方法 |
| CN110031968B (zh) | 2016-03-30 | 2022-03-15 | 株式会社尼康 | 图案描绘装置、图案描绘方法、以及元件制造方法 |
| JP7114459B2 (ja) * | 2016-05-19 | 2022-08-08 | 株式会社ニコン | パターニング装置 |
| TWI736621B (zh) * | 2016-10-04 | 2021-08-21 | 日商尼康股份有限公司 | 圖案描繪裝置及圖案描繪方法 |
| JP6680330B2 (ja) * | 2018-09-14 | 2020-04-15 | 株式会社ニコン | パターン形成装置 |
| JP6587026B2 (ja) * | 2018-10-30 | 2019-10-09 | 株式会社ニコン | パターン露光装置 |
| CN112114499B (zh) * | 2019-06-19 | 2022-02-11 | 上海微电子装备（集团）股份有限公司 | 一种曝光装置、光刻设备及太阳能电池电极的制备方法 |
| JP6787447B2 (ja) * | 2019-06-27 | 2020-11-18 | 株式会社ニコン | 基板処理装置 |
| JP6996580B2 (ja) * | 2020-03-05 | 2022-01-17 | 株式会社ニコン | 基板処理方法 |
| JP7570826B2 (ja) * | 2020-05-25 | 2024-10-22 | キヤノン株式会社 | 露光装置、露光方法、及び物品の製造方法 |
| US20220244631A1 (en) * | 2021-02-03 | 2022-08-04 | Visera Technologies Company Limited | Exposure mask |
| EP4382870A1 (en) * | 2022-12-08 | 2024-06-12 | Kaunas University of Technology | Anti-fogging incremental scales for optical encoders and fabrication method thereof |
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|---|---|---|---|---|
| JPH05205997A (ja) * | 1992-01-29 | 1993-08-13 | Canon Inc | 基板保持盤 |
| JP2006064992A (ja) * | 2004-08-26 | 2006-03-09 | Kyocera Corp | 液晶基板保持盤とその製造方法 |
| TW200728931A (en) * | 2005-09-07 | 2007-08-01 | Fujifilm Corp | Pattern exposure method and pattern exposure apparatus |
| US20090279101A1 (en) * | 2008-05-08 | 2009-11-12 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Electrostatic Chuck With Anti-Reflective Coating, Measuring Method and Use of Said Chuck |
| US20110149262A1 (en) * | 2008-08-28 | 2011-06-23 | Asml Netherlands B.V. | Spectral purity filter and lithographic apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5776179A (en) * | 1980-10-30 | 1982-05-13 | Nippon Piston Ring Co Ltd | Sliding member |
| JPS60134422A (ja) * | 1983-12-23 | 1985-07-17 | Nippon Telegr & Teleph Corp <Ntt> | パタ−ン形成法 |
| JPS61220428A (ja) * | 1985-03-27 | 1986-09-30 | Hitachi Ltd | 露光装置 |
| JPH08139168A (ja) * | 1994-11-10 | 1996-05-31 | Toto Ltd | 露光用保持治具 |
| JP2000012452A (ja) * | 1998-06-18 | 2000-01-14 | Nikon Corp | 露光装置 |
| JP2000187428A (ja) * | 1998-12-22 | 2000-07-04 | Sharp Corp | 画像形成装置 |
| JP4803901B2 (ja) * | 2001-05-22 | 2011-10-26 | キヤノン株式会社 | 位置合わせ方法、露光装置、および半導体デバイス製造方法 |
| JP2003094724A (ja) * | 2001-09-21 | 2003-04-03 | Fuji Photo Film Co Ltd | 画像記録装置 |
| JP2004128325A (ja) * | 2002-10-04 | 2004-04-22 | Toto Ltd | 保持具 |
| US7256811B2 (en) * | 2002-10-25 | 2007-08-14 | Kodak Graphic Communications Canada Company | Method and apparatus for imaging with multiple exposure heads |
| CN101231476B (zh) * | 2002-12-10 | 2010-11-17 | 株式会社尼康 | 曝光装置以及器件制造方法 |
| JP2004317728A (ja) * | 2003-04-15 | 2004-11-11 | Seiko Epson Corp | アライメントマーク付き基板及びその製造方法並びに電気光学装置用基板及び電気光学装置 |
| JP2005086072A (ja) * | 2003-09-10 | 2005-03-31 | Nikon Corp | アライメント方法、露光装置及び露光方法 |
| US7121496B2 (en) * | 2003-10-23 | 2006-10-17 | Hewlett-Packard Development Company, L.P. | Method and system for correcting web deformation during a roll-to-roll process |
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