JP6245174B2 - 基板支持装置、及び露光装置 - Google Patents

基板支持装置、及び露光装置 Download PDF

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Publication number
JP6245174B2
JP6245174B2 JP2014532821A JP2014532821A JP6245174B2 JP 6245174 B2 JP6245174 B2 JP 6245174B2 JP 2014532821 A JP2014532821 A JP 2014532821A JP 2014532821 A JP2014532821 A JP 2014532821A JP 6245174 B2 JP6245174 B2 JP 6245174B2
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Japan
Prior art keywords
substrate
substrate support
support device
exposure
pattern
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JP2014532821A
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English (en)
Japanese (ja)
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JPWO2014034161A1 (ja
Inventor
加藤　正紀
正紀 加藤
義昭 鬼頭
義昭 鬼頭
正和 堀
堀　　正和
徹 木内
徹 木内
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
JP2014532821A 2012-08-28 2013-03-13 基板支持装置、及び露光装置 Active JP6245174B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012188116 2012-08-28
JP2012188116 2012-08-28
PCT/JP2013/057062 WO2014034161A1 (ja) 2012-08-28 2013-03-13 基板支持装置、及び露光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016234202A Division JP6229785B2 (ja) 2012-08-28 2016-12-01 基板支持装置、及びパターン形成装置

Publications (2)

Publication Number Publication Date
JPWO2014034161A1 JPWO2014034161A1 (ja) 2016-08-08
JP6245174B2 true JP6245174B2 (ja) 2017-12-13

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
JP2014532821A Active JP6245174B2 (ja) 2012-08-28 2013-03-13 基板支持装置、及び露光装置
JP2016234202A Active JP6229785B2 (ja) 2012-08-28 2016-12-01 基板支持装置、及びパターン形成装置
JP2017193366A Active JP6414308B2 (ja) 2012-08-28 2017-10-03 パターン形成装置
JP2018152568A Active JP6558484B2 (ja) 2012-08-28 2018-08-14 パターン形成装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2016234202A Active JP6229785B2 (ja) 2012-08-28 2016-12-01 基板支持装置、及びパターン形成装置
JP2017193366A Active JP6414308B2 (ja) 2012-08-28 2017-10-03 パターン形成装置
JP2018152568A Active JP6558484B2 (ja) 2012-08-28 2018-08-14 パターン形成装置

Country Status (7)

Country Link
JP (4) JP6245174B2 (enrdf_load_stackoverflow)
KR (4) KR101812857B1 (enrdf_load_stackoverflow)
CN (3) CN104583874B (enrdf_load_stackoverflow)
HK (1) HK1246408A1 (enrdf_load_stackoverflow)
IN (1) IN2015DN01909A (enrdf_load_stackoverflow)
TW (4) TWI624001B (enrdf_load_stackoverflow)
WO (1) WO2014034161A1 (enrdf_load_stackoverflow)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104583874B (zh) * 2012-08-28 2017-11-03 株式会社尼康 衬底支承装置及曝光装置
WO2015152217A1 (ja) * 2014-04-01 2015-10-08 株式会社ニコン 基板処理装置、デバイス製造方法及び基板処理装置の調整方法
TWI709006B (zh) * 2014-04-01 2020-11-01 日商尼康股份有限公司 圖案描繪裝置及圖案描繪方法
CN106687867B (zh) * 2014-09-04 2019-08-02 株式会社尼康 处理系统及元件制造方法
KR102345439B1 (ko) * 2015-01-15 2021-12-30 삼성디스플레이 주식회사 롤투롤 노광 시스템
JP6413784B2 (ja) * 2015-01-19 2018-10-31 株式会社ニコン 基板処理装置及びデバイス製造方法
TWI699624B (zh) * 2015-02-27 2020-07-21 日商尼康股份有限公司 基板處理裝置及元件製造方法
KR102195908B1 (ko) * 2015-03-20 2020-12-29 가부시키가이샤 니콘 패턴 묘화 장치 및 패턴 묘화 방법
JP2017058494A (ja) * 2015-09-16 2017-03-23 株式会社ニコン パターン描画装置、パターン描画方法、基板処理装置、および、デバイス製造方法
CN111781806B (zh) * 2015-10-30 2023-06-16 株式会社尼康 基板处理装置
JP6551175B2 (ja) * 2015-11-10 2019-07-31 株式会社ニコン 回転円筒体の計測装置、基板処理装置及びデバイス製造方法
US9918375B2 (en) * 2015-11-16 2018-03-13 Kla-Tencor Corporation Plasma based light source having a target material coated on a cylindrically-symmetric element
JP6589607B2 (ja) * 2015-12-04 2019-10-16 株式会社ニコン 描画装置および描画方法
CN110031968B (zh) 2016-03-30 2022-03-15 株式会社尼康 图案描绘装置、图案描绘方法、以及元件制造方法
JP7114459B2 (ja) * 2016-05-19 2022-08-08 株式会社ニコン パターニング装置
TWI736621B (zh) * 2016-10-04 2021-08-21 日商尼康股份有限公司 圖案描繪裝置及圖案描繪方法
JP6680330B2 (ja) * 2018-09-14 2020-04-15 株式会社ニコン パターン形成装置
JP6587026B2 (ja) * 2018-10-30 2019-10-09 株式会社ニコン パターン露光装置
CN112114499B (zh) * 2019-06-19 2022-02-11 上海微电子装备（集团）股份有限公司 一种曝光装置、光刻设备及太阳能电池电极的制备方法
JP6787447B2 (ja) * 2019-06-27 2020-11-18 株式会社ニコン 基板処理装置
JP6996580B2 (ja) * 2020-03-05 2022-01-17 株式会社ニコン 基板処理方法
JP7570826B2 (ja) * 2020-05-25 2024-10-22 キヤノン株式会社 露光装置、露光方法、及び物品の製造方法
US20220244631A1 (en) * 2021-02-03 2022-08-04 Visera Technologies Company Limited Exposure mask
EP4382870A1 (en) * 2022-12-08 2024-06-12 Kaunas University of Technology Anti-fogging incremental scales for optical encoders and fabrication method thereof

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776179A (en) * 1980-10-30 1982-05-13 Nippon Piston Ring Co Ltd Sliding member
JPS60134422A (ja) * 1983-12-23 1985-07-17 Nippon Telegr & Teleph Corp <Ntt> パタ−ン形成法
JPS61220428A (ja) * 1985-03-27 1986-09-30 Hitachi Ltd 露光装置
JP3095514B2 (ja) * 1992-01-29 2000-10-03 キヤノン株式会社 基板保持盤
JPH08139168A (ja) * 1994-11-10 1996-05-31 Toto Ltd 露光用保持治具
JP2000012452A (ja) * 1998-06-18 2000-01-14 Nikon Corp 露光装置
JP2000187428A (ja) * 1998-12-22 2000-07-04 Sharp Corp 画像形成装置
JP4803901B2 (ja) * 2001-05-22 2011-10-26 キヤノン株式会社 位置合わせ方法、露光装置、および半導体デバイス製造方法
JP2003094724A (ja) * 2001-09-21 2003-04-03 Fuji Photo Film Co Ltd 画像記録装置
JP2004128325A (ja) * 2002-10-04 2004-04-22 Toto Ltd 保持具
US7256811B2 (en) * 2002-10-25 2007-08-14 Kodak Graphic Communications Canada Company Method and apparatus for imaging with multiple exposure heads
CN101231476B (zh) * 2002-12-10 2010-11-17 株式会社尼康 曝光装置以及器件制造方法
JP2004317728A (ja) * 2003-04-15 2004-11-11 Seiko Epson Corp アライメントマーク付き基板及びその製造方法並びに電気光学装置用基板及び電気光学装置
JP2005086072A (ja) * 2003-09-10 2005-03-31 Nikon Corp アライメント方法、露光装置及び露光方法
US7121496B2 (en) * 2003-10-23 2006-10-17 Hewlett-Packard Development Company, L.P. Method and system for correcting web deformation during a roll-to-roll process
JP2005126769A (ja) * 2003-10-24 2005-05-19 Yoichi Yamagishi 黒色皮膜および黒色皮膜の形成方法
JP2005189366A (ja) * 2003-12-25 2005-07-14 Konica Minolta Medical & Graphic Inc シート状印刷版材料、印刷版及び画像記録装置
US7292308B2 (en) * 2004-03-23 2007-11-06 Asml Holding N.V. System and method for patterning a flexible substrate in a lithography tool
JP2005322846A (ja) * 2004-05-11 2005-11-17 Pioneer Electronic Corp 露光装置及び該露光装置を用いた平面型表示装置の製造方法
JP2005347332A (ja) * 2004-05-31 2005-12-15 Nikon Corp 位置計測装置、露光装置、デバイス製造方法
JP4502746B2 (ja) * 2004-08-26 2010-07-14 京セラ株式会社 液晶基板保持盤とその製造方法
JP2006098719A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 露光装置
JP2006330441A (ja) * 2005-05-27 2006-12-07 Nikon Corp 投影露光装置及びマイクロデバイスの製造方法
JP2007010785A (ja) * 2005-06-28 2007-01-18 Fujifilm Holdings Corp 永久パターン形成方法
US8383330B2 (en) * 2005-09-07 2013-02-26 Fujifilm Corporation Pattern exposure method and pattern exposure apparatus
JP4861778B2 (ja) * 2005-09-08 2012-01-25 富士フイルム株式会社 パターン露光方法及び装置
US20070084368A1 (en) * 2005-10-13 2007-04-19 Ryan Vest Dynamic UV-exposure and thermal development of relief image printing elements
JP2007114357A (ja) * 2005-10-19 2007-05-10 Mejiro Precision:Kk 投影露光装置
JP4542495B2 (ja) * 2005-10-19 2010-09-15 株式会社目白プレシジョン 投影露光装置及びその投影露光方法
JP4536033B2 (ja) * 2006-05-30 2010-09-01 三井金属鉱業株式会社 フレキシブルプリント配線基板の配線パターン検査方法および検査装置
NL1036125A1 (nl) * 2007-11-08 2009-05-11 Asml Netherlands Bv Lithographic apparatus and method.
JP5294141B2 (ja) * 2008-03-25 2013-09-18 株式会社ニコン 表示素子の製造装置
NL1036682A1 (nl) * 2008-04-01 2009-10-02 Asml Netherlands Bv Lithographic apparatus and contamination detection method.
DE102008022792A1 (de) * 2008-05-08 2009-11-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrostatisches Halteelement mit Antireflexbeschichtung, Vermessungsverfahren und Verwendung des Halteelementes
JPWO2010001537A1 (ja) 2008-06-30 2011-12-15 株式会社ニコン 表示素子の製造方法及び製造装置、薄膜トランジスタの製造方法及び製造装置、及び回路形成装置
NL2003299A (en) * 2008-08-28 2010-03-11 Asml Netherlands Bv Spectral purity filter and lithographic apparatus.
JP2010098143A (ja) * 2008-10-16 2010-04-30 Canon Inc 露光装置およびデバイス製造方法
WO2010095719A1 (ja) * 2009-02-23 2010-08-26 株式会社ソディック 着色セラミック真空チャックおよびその製造方法
US8541163B2 (en) * 2009-06-05 2013-09-24 Nikon Corporation Transporting method, transporting apparatus, exposure method, and exposure apparatus
JP2011221536A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスク移動装置、露光装置、基板処理装置及びデバイス製造方法
JP5858631B2 (ja) * 2011-03-28 2016-02-10 テクノクオーツ株式会社 液晶基板保持盤の製造方法
CN104583874B (zh) * 2012-08-28 2017-11-03 株式会社尼康 衬底支承装置及曝光装置

Also Published As

Publication number Publication date
CN106886133A (zh) 2017-06-23
TW201926542A (zh) 2019-07-01
JPWO2014034161A1 (ja) 2016-08-08
JP6558484B2 (ja) 2019-08-14
JP2017083855A (ja) 2017-05-18
KR20180035950A (ko) 2018-04-06
KR20180112115A (ko) 2018-10-11
IN2015DN01909A (enrdf_load_stackoverflow) 2015-08-07
TW201727818A (zh) 2017-08-01
CN104583874A (zh) 2015-04-29
CN104583874B (zh) 2017-11-03
TW201409603A (zh) 2014-03-01
KR101812857B1 (ko) 2017-12-27
KR20160143892A (ko) 2016-12-14
CN106886133B (zh) 2018-06-29
CN107656427B (zh) 2020-07-03
KR20150048113A (ko) 2015-05-06
HK1246408A1 (zh) 2018-09-07
JP6414308B2 (ja) 2018-10-31
JP2018013805A (ja) 2018-01-25
JP6229785B2 (ja) 2017-11-15
TW201828405A (zh) 2018-08-01
KR101855612B1 (ko) 2018-05-04
TWI624001B (zh) 2018-05-11
KR101907365B1 (ko) 2018-10-11
TWI658535B (zh) 2019-05-01
TWI581362B (zh) 2017-05-01
TWI729366B (zh) 2021-06-01
CN107656427A (zh) 2018-02-02
WO2014034161A1 (ja) 2014-03-06
KR101999497B1 (ko) 2019-07-11
HK1207694A1 (en) 2016-02-05
JP2018189989A (ja) 2018-11-29

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