TWI613056B - 檢查用治具、切斷裝置及切斷方法 - Google Patents
檢查用治具、切斷裝置及切斷方法 Download PDFInfo
- Publication number
- TWI613056B TWI613056B TW104107678A TW104107678A TWI613056B TW I613056 B TWI613056 B TW I613056B TW 104107678 A TW104107678 A TW 104107678A TW 104107678 A TW104107678 A TW 104107678A TW I613056 B TWI613056 B TW I613056B
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- Prior art keywords
- adsorption
- unit members
- adsorbing
- adsorption means
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- 238000005520 cutting process Methods 0.000 title claims description 106
- 238000007689 inspection Methods 0.000 title claims description 82
- 238000000034 method Methods 0.000 title claims description 28
- 238000001179 sorption measurement Methods 0.000 claims description 168
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- 230000003287 optical effect Effects 0.000 claims description 28
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- 238000011179 visual inspection Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 64
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- 238000004140 cleaning Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 6
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
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- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
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- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- 229910052594 sapphire Inorganic materials 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014065041A JP6235391B2 (ja) | 2014-03-27 | 2014-03-27 | 検査用治具、切断装置及び切断方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201540456A TW201540456A (zh) | 2015-11-01 |
| TWI613056B true TWI613056B (zh) | 2018-02-01 |
Family
ID=54167334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104107678A TWI613056B (zh) | 2014-03-27 | 2015-03-11 | 檢查用治具、切斷裝置及切斷方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6235391B2 (enExample) |
| KR (1) | KR101659686B1 (enExample) |
| CN (1) | CN104952767B (enExample) |
| TW (1) | TWI613056B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6482454B2 (ja) * | 2015-12-18 | 2019-03-13 | Ｔｏｗａ株式会社 | 電子部品の製造方法ならびに電子部品製造装置 |
| JP6785735B2 (ja) * | 2017-09-07 | 2020-11-18 | Ｔｏｗａ株式会社 | 切断装置及び半導体パッケージの搬送方法 |
| JP6886379B2 (ja) * | 2017-09-28 | 2021-06-16 | Ｔｏｗａ株式会社 | 保持部材、保持部材の製造方法、検査装置及び切断装置 |
| JP6746756B1 (ja) * | 2019-05-24 | 2020-08-26 | Ｔｏｗａ株式会社 | 吸着プレート、切断装置および切断方法 |
| KR102066574B1 (ko) * | 2019-06-13 | 2020-01-15 | 박세준 | 동관 절단기 |
| JP7333741B2 (ja) * | 2019-11-05 | 2023-08-25 | 株式会社ディスコ | 加工装置 |
| CN112901986B (zh) * | 2020-12-09 | 2022-04-26 | 首都师范大学 | 一种虚拟现实视频播放装置 |
| WO2022195931A1 (ja) * | 2021-03-18 | 2022-09-22 | Ｔｏｗａ株式会社 | 加工装置、及び加工品の製造方法 |
| JP7744834B2 (ja) * | 2022-01-13 | 2025-09-26 | Ｔｏｗａ株式会社 | 加工装置、及び、加工品の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003015491A1 (en) * | 2001-08-08 | 2003-02-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting electronic parts |
| TWM321029U (en) * | 2007-02-16 | 2007-10-21 | Gallant Prec Machining Co Ltd | Chip tray feeder |
| JP2013065603A (ja) * | 2011-09-15 | 2013-04-11 | Disco Abrasive Syst Ltd | 分割装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3824914B2 (ja) * | 2001-11-30 | 2006-09-20 | Ｔｏｗａ株式会社 | 基板の切断方法 |
| JP2003207455A (ja) * | 2002-01-15 | 2003-07-25 | Towa Corp | パッケージの保持用治具 |
| JP4162535B2 (ja) * | 2003-05-09 | 2008-10-08 | Ｔｏｗａ株式会社 | 封止済基板の切断方法及び装置 |
| JP5285217B2 (ja) | 2006-11-27 | 2013-09-11 | Ｔｏｗａ株式会社 | 電子部品の製造装置及び製造方法 |
| JP5215556B2 (ja) * | 2006-12-20 | 2013-06-19 | Ｔｏｗａ株式会社 | 電子部品製造用の個片化装置 |
| JP5192790B2 (ja) * | 2007-11-28 | 2013-05-08 | Ｔｏｗａ株式会社 | 基板の切断方法及び装置 |
| JP5108481B2 (ja) * | 2007-11-30 | 2012-12-26 | Ｔｏｗａ株式会社 | 個片化された電子部品の搬送装置及び搬送方法 |
| JP5511154B2 (ja) * | 2008-06-13 | 2014-06-04 | Ｔｏｗａ株式会社 | 電子部品製造用の個片化装置及び個片化方法 |
| SG183593A1 (en) * | 2011-03-02 | 2012-09-27 | Rokko Systems Pte Ltd | Improved system for substrate processing |
-
2014
- 2014-03-27 JP JP2014065041A patent/JP6235391B2/ja active Active
-
2015
- 2015-03-10 CN CN201510104727.9A patent/CN104952767B/zh active Active
- 2015-03-11 KR KR1020150033604A patent/KR101659686B1/ko active Active
- 2015-03-11 TW TW104107678A patent/TWI613056B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003015491A1 (en) * | 2001-08-08 | 2003-02-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting electronic parts |
| TWM321029U (en) * | 2007-02-16 | 2007-10-21 | Gallant Prec Machining Co Ltd | Chip tray feeder |
| JP2013065603A (ja) * | 2011-09-15 | 2013-04-11 | Disco Abrasive Syst Ltd | 分割装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6235391B2 (ja) | 2017-11-22 |
| KR20150112799A (ko) | 2015-10-07 |
| JP2015188024A (ja) | 2015-10-29 |
| KR101659686B1 (ko) | 2016-09-26 |
| TW201540456A (zh) | 2015-11-01 |
| CN104952767A (zh) | 2015-09-30 |
| CN104952767B (zh) | 2018-05-22 |
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