KR101659686B1 - 검사용 지그, 절단 장치 및 절단 방법 - Google Patents

검사용 지그, 절단 장치 및 절단 방법 Download PDF

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KR101659686B1
KR101659686B1 KR1020150033604A KR20150033604A KR101659686B1 KR 101659686 B1 KR101659686 B1 KR 101659686B1 KR 1020150033604 A KR1020150033604 A KR 1020150033604A KR 20150033604 A KR20150033604 A KR 20150033604A KR 101659686 B1 KR101659686 B1 KR 101659686B1
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KR20150112799A (ko
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유야 이즈미
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토와 가부시기가이샤
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    • H01L22/30—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6831—
    • H01L21/78—
    • H01L24/799—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • Dicing (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020150033604A 2014-03-27 2015-03-11 검사용 지그, 절단 장치 및 절단 방법 Active KR101659686B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014065041A JP6235391B2 (ja) 2014-03-27 2014-03-27 検査用治具、切断装置及び切断方法
JPJP-P-2014-065041 2014-03-27

Publications (2)

Publication Number Publication Date
KR20150112799A KR20150112799A (ko) 2015-10-07
KR101659686B1 true KR101659686B1 (ko) 2016-09-26

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ID=54167334

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KR1020150033604A Active KR101659686B1 (ko) 2014-03-27 2015-03-11 검사용 지그, 절단 장치 및 절단 방법

Country Status (4)

Country Link
JP (1) JP6235391B2 (enExample)
KR (1) KR101659686B1 (enExample)
CN (1) CN104952767B (enExample)
TW (1) TWI613056B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6482454B2 (ja) * 2015-12-18 2019-03-13 Ｔｏｗａ株式会社 電子部品の製造方法ならびに電子部品製造装置
JP6785735B2 (ja) * 2017-09-07 2020-11-18 Ｔｏｗａ株式会社 切断装置及び半導体パッケージの搬送方法
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
KR102066574B1 (ko) * 2019-06-13 2020-01-15 박세준 동관 절단기
JP7333741B2 (ja) * 2019-11-05 2023-08-25 株式会社ディスコ 加工装置
CN112901986B (zh) * 2020-12-09 2022-04-26 首都师范大学 一种虚拟现实视频播放装置
JP7678083B2 (ja) * 2021-03-18 2025-05-15 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP7744834B2 (ja) * 2022-01-13 2025-09-26 Ｔｏｗａ株式会社 加工装置、及び、加工品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168697A (ja) 2001-11-30 2003-06-13 Towa Corp 基板の切断方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10296993T5 (de) * 2001-08-08 2004-08-05 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung und Verfahren zum Montieren elektronischer Bauteile
JP2003207455A (ja) * 2002-01-15 2003-07-25 Towa Corp パッケージの保持用治具
JP4162535B2 (ja) * 2003-05-09 2008-10-08 Ｔｏｗａ株式会社 封止済基板の切断方法及び装置
JP5285217B2 (ja) 2006-11-27 2013-09-11 Ｔｏｗａ株式会社 電子部品の製造装置及び製造方法
JP5215556B2 (ja) * 2006-12-20 2013-06-19 Ｔｏｗａ株式会社 電子部品製造用の個片化装置
TWM321029U (en) * 2007-02-16 2007-10-21 Gallant Prec Machining Co Ltd Chip tray feeder
JP5192790B2 (ja) * 2007-11-28 2013-05-08 Ｔｏｗａ株式会社 基板の切断方法及び装置
JP5108481B2 (ja) * 2007-11-30 2012-12-26 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
JP5511154B2 (ja) * 2008-06-13 2014-06-04 Ｔｏｗａ株式会社 電子部品製造用の個片化装置及び個片化方法
SG183593A1 (en) * 2011-03-02 2012-09-27 Rokko Systems Pte Ltd Improved system for substrate processing
JP5947010B2 (ja) * 2011-09-15 2016-07-06 株式会社ディスコ 分割装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168697A (ja) 2001-11-30 2003-06-13 Towa Corp 基板の切断方法

Also Published As

Publication number Publication date
TW201540456A (zh) 2015-11-01
CN104952767A (zh) 2015-09-30
JP2015188024A (ja) 2015-10-29
KR20150112799A (ko) 2015-10-07
JP6235391B2 (ja) 2017-11-22
CN104952767B (zh) 2018-05-22
TWI613056B (zh) 2018-02-01

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