CN104952767B - 检查用夹具、切断装置以及切断方法 - Google Patents
检查用夹具、切断装置以及切断方法 Download PDFInfo
- Publication number
- CN104952767B CN104952767B CN201510104727.9A CN201510104727A CN104952767B CN 104952767 B CN104952767 B CN 104952767B CN 201510104727 A CN201510104727 A CN 201510104727A CN 104952767 B CN104952767 B CN 104952767B
- Authority
- CN
- China
- Prior art keywords
- unit
- absorbing unit
- per part
- absorbing
- multiple per
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 92
- 238000007689 inspection Methods 0.000 claims abstract description 58
- 238000001035 drying Methods 0.000 claims abstract description 44
- 230000000007 visual effect Effects 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims description 22
- 238000010521 absorption reaction Methods 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 17
- 230000002950 deficient Effects 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 abstract description 26
- 239000000758 substrate Substances 0.000 description 52
- 239000000463 material Substances 0.000 description 30
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 238000002347 injection Methods 0.000 description 17
- 239000007924 injection Substances 0.000 description 17
- 238000001179 sorption measurement Methods 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000004382 potting Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000007115 recruitment Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- NBGBEUITCPENLJ-UHFFFAOYSA-N Bunazosin hydrochloride Chemical compound Cl.C1CN(C(=O)CCC)CCCN1C1=NC(N)=C(C=C(OC)C(OC)=C2)C2=N1 NBGBEUITCPENLJ-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001717 pathogenic effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-065041 | 2014-03-27 | ||
| JP2014065041A JP6235391B2 (ja) | 2014-03-27 | 2014-03-27 | 検査用治具、切断装置及び切断方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104952767A CN104952767A (zh) | 2015-09-30 |
| CN104952767B true CN104952767B (zh) | 2018-05-22 |
Family
ID=54167334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510104727.9A Active CN104952767B (zh) | 2014-03-27 | 2015-03-10 | 检查用夹具、切断装置以及切断方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6235391B2 (enExample) |
| KR (1) | KR101659686B1 (enExample) |
| CN (1) | CN104952767B (enExample) |
| TW (1) | TWI613056B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6482454B2 (ja) * | 2015-12-18 | 2019-03-13 | Towa株式会社 | 電子部品の製造方法ならびに電子部品製造装置 |
| JP6785735B2 (ja) * | 2017-09-07 | 2020-11-18 | Towa株式会社 | 切断装置及び半導体パッケージの搬送方法 |
| JP6886379B2 (ja) * | 2017-09-28 | 2021-06-16 | Towa株式会社 | 保持部材、保持部材の製造方法、検査装置及び切断装置 |
| JP6746756B1 (ja) * | 2019-05-24 | 2020-08-26 | Towa株式会社 | 吸着プレート、切断装置および切断方法 |
| KR102066574B1 (ko) * | 2019-06-13 | 2020-01-15 | 박세준 | 동관 절단기 |
| JP7333741B2 (ja) * | 2019-11-05 | 2023-08-25 | 株式会社ディスコ | 加工装置 |
| CN112901986B (zh) * | 2020-12-09 | 2022-04-26 | 首都师范大学 | 一种虚拟现实视频播放装置 |
| KR102888135B1 (ko) * | 2021-03-18 | 2025-11-19 | 토와 가부시기가이샤 | 가공 장치 및 가공품의 제조 방법 |
| JP7744834B2 (ja) * | 2022-01-13 | 2025-09-26 | Towa株式会社 | 加工装置、及び、加工品の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479838A (zh) * | 2006-12-20 | 2009-07-08 | 东和株式会社 | 电子部件制造用单片化装置 |
| CN101878525A (zh) * | 2007-11-30 | 2010-11-03 | 东和株式会社 | 单片化电子元件的搬送装置及搬送方法 |
| CN101878523A (zh) * | 2007-11-28 | 2010-11-03 | 东和株式会社 | 基板的切断方法及装置 |
| CN102047399A (zh) * | 2008-06-13 | 2011-05-04 | 东和株式会社 | 电子部件制造用的切片装置及切片方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1229010C (zh) * | 2001-08-08 | 2005-11-23 | 松下电器产业株式会社 | 安装电子部件的设备和方法 |
| JP3824914B2 (ja) * | 2001-11-30 | 2006-09-20 | Towa株式会社 | 基板の切断方法 |
| JP2003207455A (ja) * | 2002-01-15 | 2003-07-25 | Towa Corp | パッケージの保持用治具 |
| JP4162535B2 (ja) * | 2003-05-09 | 2008-10-08 | Towa株式会社 | 封止済基板の切断方法及び装置 |
| JP5285217B2 (ja) | 2006-11-27 | 2013-09-11 | Towa株式会社 | 電子部品の製造装置及び製造方法 |
| TWM321029U (en) * | 2007-02-16 | 2007-10-21 | Gallant Prec Machining Co Ltd | Chip tray feeder |
| SG183593A1 (en) * | 2011-03-02 | 2012-09-27 | Rokko Systems Pte Ltd | Improved system for substrate processing |
| JP5947010B2 (ja) * | 2011-09-15 | 2016-07-06 | 株式会社ディスコ | 分割装置 |
-
2014
- 2014-03-27 JP JP2014065041A patent/JP6235391B2/ja active Active
-
2015
- 2015-03-10 CN CN201510104727.9A patent/CN104952767B/zh active Active
- 2015-03-11 KR KR1020150033604A patent/KR101659686B1/ko active Active
- 2015-03-11 TW TW104107678A patent/TWI613056B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479838A (zh) * | 2006-12-20 | 2009-07-08 | 东和株式会社 | 电子部件制造用单片化装置 |
| CN101878523A (zh) * | 2007-11-28 | 2010-11-03 | 东和株式会社 | 基板的切断方法及装置 |
| CN101878525A (zh) * | 2007-11-30 | 2010-11-03 | 东和株式会社 | 单片化电子元件的搬送装置及搬送方法 |
| CN102047399A (zh) * | 2008-06-13 | 2011-05-04 | 东和株式会社 | 电子部件制造用的切片装置及切片方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6235391B2 (ja) | 2017-11-22 |
| TW201540456A (zh) | 2015-11-01 |
| CN104952767A (zh) | 2015-09-30 |
| KR101659686B1 (ko) | 2016-09-26 |
| JP2015188024A (ja) | 2015-10-29 |
| KR20150112799A (ko) | 2015-10-07 |
| TWI613056B (zh) | 2018-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104952767B (zh) | 检查用夹具、切断装置以及切断方法 | |
| CN111834243B (zh) | 检查装置和加工装置 | |
| US10964555B2 (en) | Water jet processing apparatus | |
| CN101383277B (zh) | 扩展方法及扩展装置 | |
| TWI647865B (zh) | Processing method of package substrate | |
| CN105702627B (zh) | 切削装置 | |
| JP5580066B2 (ja) | 切削装置 | |
| TWI726230B (zh) | 保持構件、保持構件的製造方法、保持機構以及製品的製造裝置 | |
| KR102242827B1 (ko) | 박리 장치 | |
| CN105633017B (zh) | 封装基板的分割方法 | |
| KR20040019173A (ko) | 웨이퍼 테이블과, 이를 이용한 웨이퍼 쏘잉/소자 접착장치와, 웨이퍼 쏘잉/소자 분류 장치 | |
| CN103311114A (zh) | 切削装置 | |
| CN111341694A (zh) | 晶片制造装置 | |
| US11628515B2 (en) | Processing apparatus for processing workpiece | |
| JP6935131B2 (ja) | 板状の被加工物の切断方法 | |
| TWI769373B (zh) | 切割裝置 | |
| CN114800210A (zh) | 切削装置 | |
| JP7394664B2 (ja) | 被加工物の加工方法及びチップ搬送用治具 | |
| JP2016207820A (ja) | ウエーハの加工方法 | |
| CN100587932C (zh) | 导线键合的方法和装置 | |
| JP6804154B2 (ja) | パッケージ基板の加工方法及び切削装置 | |
| JP7191473B2 (ja) | キーパターンの検出方法、及び装置 | |
| CN117160745A (zh) | 固定部件和流体喷射喷嘴机构 | |
| TWI835120B (zh) | 樹脂成型品的製造方法 | |
| JP6976660B2 (ja) | 加工装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |