CN105633017B - 封装基板的分割方法 - Google Patents
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Abstract
提供封装基板的分割方法,能够较高地维持器件封装的生产性。一种切削封装基板(11)并将其分割成多个器件封装(25)的封装基板的分割方法,该封装基板在背面侧粘接有粘合带(31),且包含正面的被分割预定线(19)划分成多个器件封装区域(21)的器件部(15)以及围绕器件部的剩余部(17),该封装基板的分割方法包含如下的步骤:剩余部紫外线照射步骤,使与剩余部对应的区域的粘合带的粘合力降低;局部剥离步骤,将与剩余部对应的区域的粘合带从封装基板剥离;以及分割步骤,利用切削刀具(36)切削封装基板,并分割成多个器件封装,在分割步骤中,借助切削刀具的旋转使已从封装基板分离的剩余部飞散,从而从粘合带去除剩余部。
Description
技术领域
本发明涉及封装基板的分割方法,该封装基板中,利用树脂等将多个器件密封。
背景技术
在CSP(Chip Size Package:芯片尺寸封装)、QFN(Quad Flat Non-leadedPackage:方形扁平无引脚封装)等半导体封装技术中,使用利用树脂等将多个器件(或者,器件芯片)密封的封装基板。封装基板由分别包含多个器件的多个器件部和包围各器件部的剩余部构成。
各器件部中,通过正面侧的分割预定线划分有与各器件对应的多个器件封装区域。通过沿着该分割预定线分割封装基板而能够形成与各器件(器件芯片)对应的多个器件封装。
在利用切削等方法分割封装基板时,为了防止因分割而形成的器件封装的飞散等,而在封装基板的背面侧粘接有粘合带(例如,参照专利文献1)。然而,仅仅因为粘接粘合带,便必须与封装基板相匹配地专门设计用于对封装基板进行保持等的各种机构。
因此,通常在粘接于封装基板的背面侧的粘合带的外周部固定环状的框架(例如,参照专利文献2)。通过这样将框架固定在粘合带上,而能够在不变更切削装置的结构的情况下适当地分割不同种类的封装基板。
专利文献1:日本特开2000-208445号公报
专利文献2:日本特开2000-232080号公报
另外,在分割了封装基板之后,从粘合带拾取(剥离)器件封装。此时,如果想要拾取多个器件封装,则在粘合带上残存有剩余部的情况下有可能产生错误地拾取剩余部等错误,成为作业的妨碍。特别是在一次性剥离多个器件封装的情况下,作业的妨碍更明显。因此,预先拾取并去除剩余部。
然而,当沿着分割预定线分割封装基板时,剩余部也会被分割成小片。其结果为,因剩余部的拾取需要较长时间而导致器件封装的生产性降低。在器件封装的尺寸较小且分割预定线的数量较多的封装基板中,该问题是特别深刻的。
发明内容
本发明是鉴于该问题点而完成的,其目的在于提供一种封装基板的分割方法,能够较高地维持器件封装的生产性。
根据本发明,提供一种封装基板的分割方法,在该封装基板的背面侧粘接有紫外线硬化型的粘合带,该封装基板包含正面的被分割预定线划分成多个器件封装区域的器件部以及围绕该器件部的剩余部,在将该封装基板隔着该粘合带保持在卡盘工作台上的状态下沿着该分割预定线进行切削,将该封装基板分割成多个器件封装,该封装基板的分割方法的特征在于,其包含如下的步骤:剩余部紫外线照射步骤,在利用掩模部件将与该器件部对应的区域的该粘合带覆盖并使与该剩余部对应的区域的该粘合带露出之后,对该粘合带照射紫外线而使与该剩余部对应的区域的该粘合带的粘合力降低;局部剥离步骤,在该剩余部紫外线照射步骤之后,将与该剩余部对应的区域的该粘合带从封装基板剥离;以及分割步骤,在实施了该局部剥离步骤之后,利用被定位于切入到该粘合带的高度的切削刀具沿着该分割预定线切削封装基板,将封装基板分割成多个器件封装,在该分割步骤中,借助该切削刀具的旋转而使已从封装基板分离的该剩余部飞散,从而从该粘合带去除该剩余部。
在本发明中,优选该封装基板的分割方法包含如下的步骤:器件部紫外线照射步骤,在所述分割步骤之后,对与所述器件部对应的区域的该粘合带照射紫外线而使与该器件部对应的区域的该粘合带的粘合力降低;以及器件剥离步骤,在该器件部紫外线照射步骤之后,将该多个器件封装从该粘合带剥离。
在本发明的封装基板的分割方法中,由于在实施分割封装基板的分割步骤之前,实施将与剩余部对应的区域的粘合带从封装基板剥离的局部剥离步骤,因此能够使已在分割步骤中从封装基板分离的剩余部因切削刀具的旋转而飞散而从粘合带去除。即,由于不需要拾取剩余部,因此能够较高地维持器件封装的生产性。
附图说明
图1的(A)是示意性示出利用本实施方式的封装基板的分割方法进行分割的封装基板等的立体图,图1的(B)是示意性示出封装基板等的剖视图。
图2的(A)是示意性示出剩余部紫外线照射步骤的局部剖视侧视图,图2的(B)是示意性示出局部剥离步骤的剖视图。
图3是示意性示出在分割步骤中使用的切削装置的立体图。
图4的(A)是示意性示出分割步骤的局部剖视侧视图,图4的(B)是示意性示出在分割步骤中剩余部飞散的状态的局部剖视侧视图。
图5的(A)是示意性示出器件部紫外线照射步骤的局部剖视侧视图,图5的(B)是示意性示出器件剥离步骤的局部剖视侧视图。
标号说明
11:封装基板;13:框体;13a:正面;13b:背面;15:器件部;17:剩余部;19:分割预定线(间隔道);21:器件封装区域;23:密封部;23a:正面;25:器件封装;31:粘合带;33:基材层;35:糊层;37:框架;41:掩模部件;1:光源;3:吸引装置;3a:吸引槽;3b:流路;5:拾取装置;2:切削装置;4:基台;4a:开口;6:X轴移动工作台;8:防尘防滴罩;10:卡盘工作台;10a:保持面;12:夹具;14:切削单元(切削构件);16:支承构造;18:切削单元移动机构(分度进给构件);20:Y轴导轨;22:Y轴移动板;24:Y轴滚珠丝杠;26:Z轴导轨;28:Z轴移动板;30:Z轴滚珠丝杠;32:Z轴脉冲电动机;34:照相机;36:切削刀具。
具体实施方式
参照附图对本发明的实施方式进行说明。本实施方式的封装基板的分割方法包含剩余部紫外线照射步骤、局部剥离步骤、分割步骤、器件部紫外线照射步骤以及器件剥离步骤。
在剩余部紫外线照射步骤中,使粘接在与封装基板的剩余部对应的区域上的粘合带的粘合力降低。在局部剥离步骤中,从封装基板剥离与剩余部对应的区域的粘合带。在分割步骤中,沿着分割预定线切削封装基板,去除剩余部并且将封装基板分割成多个器件封装。
在器件部紫外线照射步骤中,使粘接在与封装基板的器件部对应的区域的粘合带的粘合力降低。在器件剥离步骤中,从粘合带剥离多个器件封装。以下,对本实施方式的封装基板的分割方法进行详细描述。
图1的(A)是示意性示出利用本实施方式的封装基板的分割方法分割的封装基板等的立体图,图1的(B)是示意性示出封装基板等的剖视图。如图1的(A)和图1的(B)所示,封装基板11包含俯视观察呈大致矩形形状的框体13。
框体13例如由42合金(铁与镍的合金)或铜等金属材料形成,其正面13a侧被分成多个器件部15(这里为3个器件部15)和包围各器件部15的剩余部17。
如图1的(A)所示,各器件部15被交叉的多条分割预定线(间隔道)19进一步划分成多个器件封装区域21(这里为36个器件封装区域21)。
在框体13的背面13b侧的与各器件封装区域21对应的位置上设置有IC、LED等器件(器件芯片)(未图示)。这些器件(器件芯片)被密封部23密封,该密封部23形成于与各器件部15对应的区域。
如图1的(B)所示,密封部23由树脂等材料形成为规定的厚度,从框体13的背面13b突出。在本实施方式中,将该密封部23的正面23a称作封装基板11的背面,将框体13的正面13a称作封装基板11的正面。
在相当于封装基板11的背面的密封部23的正面23a上粘接有比封装基板11大的大致圆形的粘合带31。如图1的(B)所示,粘合带31由树脂等材料所形成的膜状的基材层33和配置于基材层33的单面(上表面)的具有粘合力的糊层35构成。
通过使糊层35与封装基板11的背面(即,密封部23的正面23a)紧贴,而能够将粘合带31粘接于封装基板11。另外,糊层35包含紫外线硬化型的树脂。因此,如果对糊层35照射紫外线,能够使糊层35对封装基板11等的粘合力降低。
在粘合带31的外周部借助糊层35的粘合力固定有环状的框架37。即,封装基板11隔着粘合带31被支承于环状的框架37。
在本实施方式的封装基板的分割方法中,首先,实施剩余部紫外线照射步骤,使粘接于封装基板11的背面侧的粘合带31的与剩余部17对应的区域的粘合力降低。图2的(A)是示意性示出剩余部紫外线照射步骤的局部剖视侧视图。
如图2的(A)所示,在本实施方式的剩余部紫外线照射步骤中,首先,将限制紫外线的被照射区域的掩模部件41设置在粘合带31的下表面(与糊层35相反的面)侧。掩模部件41具有与器件部15对应的遮光部。因此,粘合带31的与器件部15对应的区域被掩模部件41覆盖,与剩余部17对应的区域露出。
接着,在粘合带31的下表面侧配置光源1,从该光源1放射紫外线(紫外光)。如上所述,由于粘合带31的与器件部15对应的区域被掩模部件41覆盖,因此从光源1放射的紫外线仅照射到粘合带31的与剩余部17对应的区域。其结果为,仅粘合带31的与剩余部17对应的区域的粘合力降低。
在剩余部紫外线照射步骤之后,实施局部剥离步骤,从封装基板11剥离与剩余部17对应的区域的粘合带31。图2的(B)是示意性示出局部剥离步骤的剖视图。
在本实施方式的局部剥离步骤中,使用图2的(B)所示的吸引装置3将粘合带31局部地剥离。吸引装置3形成为能够隔着粘合带31载置封装基板11的带状。在吸引装置3的载置面上形成有与封装基板11的剩余部17对应的吸引槽3a。
吸引槽3a通过形成在吸引装置3的内部的流路3b与吸引源(未图示)连接。通过隔着粘合带31将封装基板11载置于吸引装置3的载置面,并使吸引源的负压作用于吸引槽3a,能够将与剩余部17对应的区域的粘合带31从封装基板11剥离。
另外,在本实施方式的封装基板的分割方法中,由于在之前的剩余部紫外线照射步骤中使粘合带31的与剩余部17对应的区域的粘合力降低,因此能够利用上述这样的方法容易地剥离与剩余部17对应的区域的粘合带31。并且,由于在仅针对剩余部17进行剥离的状态下器件部15粘接于粘合带31,因此封装基板11保持为粘接于粘合带31的状态。另外,可以在局部地剥离了粘合带31之后去除掩模部件41。
在局部剥离步骤之后,实施分割步骤,沿着分割预定线19切削封装基板11,去除剩余部17,并且将封装基板11分割成多个器件封装。图3是示意性示出在分割步骤中使用的切削装置的立体图。如图3所示,切削装置2具有支承各构造的基台4。
在基台4的上表面形成有在X轴方向(前后方向,加工进给方向)上较长的矩形形状的开口4a。在该开口4a内设置有X轴移动工作台6、使X轴移动工作台6在X轴方向上移动的X轴移动机构(加工进给构件)(未图示)以及覆盖X轴移动机构的防尘防滴罩8。
X轴移动机构具有在X轴方向上平行的一对X轴导轨(未图示),X轴移动工作台6以能够滑动的方式设置在X轴导轨上。在X轴移动工作台6的下表面侧设置有螺母部(未图示),与X轴导轨平行的X轴滚珠丝杠(未图示)与该螺母部螺合。
在X轴滚珠丝杠的一端部连结有X轴脉冲电动机(未图示)。通过利用X轴脉冲电动机使X轴滚珠丝杠旋转,而使X轴移动工作台6沿着X轴导轨在X轴方向上移动。
在X轴移动工作台6上设置有吸引保持封装基板11的卡盘工作台10。在卡盘工作台10的周围设置有从四方将环状的框架37夹持固定的4个夹具12。
卡盘工作台10与电动机等旋转驱动源(未图示)连结,绕与Z轴方向(铅垂方向)平行的旋转轴旋转。并且,利用上述的X轴移动机构在X轴方向上对卡盘工作台10进行加工进给。
卡盘工作台10的表面(上表面)成为吸引保持封装基板11的保持面10a。该保持面10a通过形成在卡盘工作台10的内部的流路(未图示)与吸引源(未图示)连接。
在基台4的上表面以跨越开口4a的方式配置有门型的支承构造16,该支承构造16对切削封装基板11的切削单元(切削构件)14进行支承。在支承构造16的前表面上部设置有使切削单元14在Y轴方向(分度进给方向)和Z轴方向(铅垂方向)上移动的切削单元移动机构(分度进给构件)18。
切削单元移动机构18具有配置在支承构造16的前表面且在Y轴方向上平行的一对Y轴导轨20。在Y轴导轨20上以能够滑动的方式设置有构成切削单元移动机构18的Y轴移动板22。
在Y轴移动板22的背面侧(后面侧)设置有螺母部(未图示),与Y轴导轨20平行的Y轴滚珠丝杠24与该螺母部螺合。在Y轴滚珠丝杠24的一端部连结有Y轴脉冲电动机(未图示)。如果利用Y轴脉冲电动机使Y轴滚珠丝杠24旋转,则Y轴移动板22沿着Y轴导轨20在Y轴方向上移动。
在Y轴移动板22的正面(前表面)设置有在Z轴方向上平行的一对Z轴导轨26。在Z轴导轨26上以能够滑动的方式设置有Z轴移动板28。
在Z轴移动板28的背面侧(后面侧)设置有螺母部(未图示),与Z轴导轨26平行的Z轴滚珠丝杠30与该螺母部螺合。在Z轴滚珠丝杠30的一端部连结有Z轴脉冲电动机32。如果利用Z轴脉冲电动机32使Z轴滚珠丝杠30旋转,则Z轴移动板28沿着Z轴导轨26在Z轴方向上移动。
在Z轴移动板28的下部设置有对封装基板11进行切削的切削单元14。在与切削单元14相邻的位置上设置有对封装基板11的正面侧进行拍摄的照相机34。如果利用切削单元移动机构18使Y轴移动板22在Y轴方向上移动,则对切削单元14和照相机34进行分度进给,如果使Z轴移动板28在Z轴方向上移动,则切削单元14和照相机34升降。
切削单元14具有安装于主轴(未图示)的一端侧的圆环状的切削刀具36,该主轴构成与Y轴方向平行的旋转轴。在主轴的另一端侧连结有电动机等旋转驱动源(未图示),使安装于主轴的切削刀具36旋转。
图4的(A)是示意性示出分割步骤的局部剖视侧视图,图4的(B)是示意性示出在分割步骤中剩余部17飞散的状态的局部剖视侧视图。在分割步骤中,首先,以正面侧向上方露出的方式将封装基板11载置于卡盘工作台10,利用夹具12将框架37夹持固定。接着,使吸引源的负压作用于保持面10a,而利用卡盘工作台10吸引保持封装基板11。
然后,使卡盘工作台10与切削单元14相对地移动、旋转,而使对象的分割预定线19与X轴方向平行地匹配,将切削刀具36定位在包含对象的分割预定线19的直线上。并且,将旋转的切削刀具36的下端定位在比封装基板11的背面(即,密封部23的正面23a)低的位置,使卡盘工作台10在X轴方向上移动(加工进给)。
这样,通过将切削刀具36定位在切入粘合带31的高度,并使封装基板11与切削刀具36相对地移动,而如图4的(A)所示,能够沿着对象的分割预定线19切断封装基板11。
在本实施方式中,在局部剥离步骤中从封装基板11剥离与剩余部17对应的区域的粘合带31。因此,在分割步骤中从封装基板11分离的剩余部17如图4的(B)所示那样因切削刀具36的旋转而飞散。
另一方面,与器件部15对应的区域的粘合力得以维持,器件部15不飞散。这样,在本实施方式中,由于在分割步骤中仅将剩余部17从粘合带31去除,因此此后不需要拾取剩余部17。
另外,粘合带31的与剩余部17对应的区域的粘合力因从封装基板11的剥离而大幅降低。因此,即使在局部剥离步骤后封装基板11与粘合带31再次紧贴,也不妨碍剩余部17的去除。另一方面,在不实施局部剥离步骤的情况下,无法使粘合带31的与剩余部17对应的区域的粘合力充分地降低,无法适当地去除剩余部17。同样,仅凭剩余部紫外线照射步骤,无法充分地降低粘合带31的与剩余部17对应的区域的粘合力,无法适当地去除剩余部17。
当沿着所有的分割预定线19切削封装基板11,并将其分割成多个器件封装25(参照图5的(A)等)时,分割步骤结束。
在分割步骤后,实施器件部紫外线照射步骤,使粘合带31的与器件部15对应的区域的粘合力降低。图5的(A)是示意性示出器件部紫外线照射步骤的局部剖视侧视图。
如图5的(A)所示,在本实施方式的器件部紫外线照射步骤中,在粘合带31的下表面侧配置光源1,从该光源1放射紫外线(紫外光)。由此,向粘合带31的与器件部15对应的区域照射紫外线,而能够使该区域的粘合力降低。
在器件部紫外线照射步骤之后,实施器件剥离步骤,从粘合带31剥离多个器件封装25。图5的(B)是示意性示出器件剥离步骤的局部剖视侧视图。
如图5的(B)所示,在器件剥离步骤中,利用拾取装置5吸附多个器件封装25而从粘合带31剥离。在本实施方式中,由于在器件部紫外线照射步骤中使粘合带31的与器件部15对应的区域的粘合力降低,因此能够从粘合带31容易地拾取器件封装25。
并且,在本实施方式中,由于在分割步骤中将剩余部17从粘合带31去除,因此不会在拾取多个器件封装25时错误地拾取剩余部17。将所拾取的器件封装25收纳在任意的箱体(未图示)等中。
如上所述,在本实施方式的封装基板的分割方法中,由于在实施分割封装基板11的分割步骤之前,实施从封装基板11剥离与剩余部17对应的区域的粘合带31的局部剥离步骤,因此在分割步骤中能够借助切削刀具36的旋转使从封装基板11分离的剩余部17飞散而从粘合带31去除。即,由于不需要拾取剩余部17,因此能够较高地维持器件封装25的生产性。
另外,本发明不限于上述实施方式的记载,可以进行各种变更而实施。例如,在上述实施方式中,在将粘合带31局部地剥离之后去除掩模部件41,但只要在剩余部紫外线照射步骤之后且在器件部紫外线照射步骤之前去除掩模部件41即可。
并且,在上述实施方式中,在粘合带31的外周部固定有环状的框架37,但也可以不必在粘合带上固定环状的框架。当不在粘合带上固定环状的框架的情况下,例如将与封装基板11相同程度的大小的粘合带粘接于封装基板11。
在该情况下,在剩余部紫外线照射步骤中,使粘接于与封装基板11的剩余部17对应的区域的粘合带的粘合力降低,在局部剥离步骤中,从封装基板11将与剩余部17对应的区域的粘合带剥离。
在分割步骤中,例如利用与封装基板11对应的卡盘工作台(未图示)吸引保持封装基板11并沿着分割预定线19进行切断。由此,能够借助切削刀具的旋转使从封装基板11分离的剩余部17飞散而去除。
然后,在器件部紫外线照射步骤中,使粘接于与封装基板11的器件部15对应的区域的粘合带硬化而使粘合力降低,在器件剥离步骤中从粘合带剥离多个器件封装25。在该情况下,由于在分割步骤中从粘合带去除剩余部17,因此不会在拾取多个器件封装25时错误地拾取剩余部17。
此外,上述实施方式的结构、方法等在不脱离本发明的目的的范围内可以适当地变更而实施。
Claims (2)
1.一种封装基板的分割方法,在该封装基板的背面侧粘接有紫外线硬化型的粘合带,该封装基板包含正面的被分割预定线划分成多个器件封装区域的器件部以及围绕该器件部的剩余部,在将该封装基板隔着该粘合带保持在卡盘工作台上的状态下沿着该分割预定线进行切削,将该封装基板分割成多个器件封装,该封装基板的分割方法的特征在于,其包含如下的步骤:
剩余部紫外线照射步骤,在利用掩模部件将与该器件部对应的区域的该粘合带覆盖并使与该剩余部对应的区域的该粘合带露出之后,对该粘合带照射紫外线而使与该剩余部对应的区域的该粘合带的粘合力降低;
局部剥离步骤,在该剩余部紫外线照射步骤之后,将与该剩余部对应的区域的该粘合带从封装基板剥离;以及
分割步骤,在实施了该局部剥离步骤之后,利用被定位于切入到该粘合带的高度的切削刀具从封装基板的正面沿着该分割预定线切削封装基板,将封装基板分割成多个器件封装,
在该分割步骤中,借助该切削刀具的旋转而使已从封装基板分离的该剩余部飞散,从而从该粘合带去除该剩余部。
2.根据权利要求1所述的封装基板的分割方法,其特征在于,该封装基板的分割方法包含如下的步骤:
器件部紫外线照射步骤,在所述分割步骤之后,对与所述器件部对应的区域的该粘合带照射紫外线而使与该器件部对应的区域的该粘合带的粘合力降低;以及
器件剥离步骤,在该器件部紫外线照射步骤之后,将该多个器件封装从该粘合带剥离。
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US7135385B1 (en) * | 2004-04-23 | 2006-11-14 | National Semiconductor Corporation | Semiconductor devices having a back surface protective coating |
CN103547905A (zh) * | 2011-05-20 | 2014-01-29 | 奥林巴斯株式会社 | 基板片的制造方法 |
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US20160148843A1 (en) | 2016-05-26 |
TWI641033B (zh) | 2018-11-11 |
TW201624552A (zh) | 2016-07-01 |
JP6351490B2 (ja) | 2018-07-04 |
CN105633017A (zh) | 2016-06-01 |
JP2016100586A (ja) | 2016-05-30 |
MY175661A (en) | 2020-07-03 |
US9431299B2 (en) | 2016-08-30 |
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