CN104952767B - It checks with fixture, disconnecting device and cutting-off method - Google Patents
It checks with fixture, disconnecting device and cutting-off method Download PDFInfo
- Publication number
- CN104952767B CN104952767B CN201510104727.9A CN201510104727A CN104952767B CN 104952767 B CN104952767 B CN 104952767B CN 201510104727 A CN201510104727 A CN 201510104727A CN 104952767 B CN104952767 B CN 104952767B
- Authority
- CN
- China
- Prior art keywords
- unit
- absorbing unit
- per part
- absorbing
- multiple per
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention, which provides, to be carried out electronic unit to carry out the inspection fixture, disconnecting device and the cutting-off method that disperse collecting after visual examination.Possess in disconnecting device：Drying workbench adsorbs multiple electronic units；Suction pump is connected with dry the first pipelines multiple possessed by workbench；Drying unit dries multiple electronic units on drying workbench；Mechanism is temporarily held, received from drying workbench and adsorbs multiple electronic units；Plate is positioned on drying workbench；Multiple 3rd pipelines, are arranged at plate, and are placed in plate dry with being connected with multiple first pipelines in the state of on workbench；Lid, is positioned on plate, and can be loaded and unloaded compared with plate；Screw fixes plate and lid；And containing case, multiple electronic units are by scattered collecting.Lid is dismantled from plate by operator, and multiple electronic units are checked using microscope etc..
Description
Technical field
The present invention relates to by cut off be cut off object come used inspection fixture when manufacturing multiple per parts, cut
Disconnected device and cutting-off method.
Background technology
Cut-out is carried out by using disconnecting device so as to the mechanograph list that will be produced by being molded with resin together
Piece turns to multiple per parts (separation, singulation) and is widely implemented.Hereinafter, enumerate by using with rotating sword
Disconnecting device turn to multiple electronic units so as to monolithic cutting off the package substrate as cut-off object exemplified by
To illustrate (for example, referenced patent document 1, patent document 2).
In recent years, there is a situation where that user's requirement directly accommodates cut-off electronic unit to containing case.In this feelings
Under condition, multiple electronic units for being obtained by package substrate be although it is multiple obtain together, but each dispersedly under containing case
Fall and be received the containing case.This collecting mode is referred to as " scattered to accommodate ", " (バ Le Network) in bulk accommodates " etc. (with reference to special
Sharp document 1).Respectively using each electronic unit taken out from containing case as object, the visual examination of electronic unit is carried out.According to the party
Method, even if being found that defective work among electronic unit, can not also know the defective work be located at package substrate on which
The electronic unit of position.Therefore, generate be difficult to by for prevent the information of defective work feed back to before process
Problem.
Patent document 1：Japanese Patent Publication 2013-065603 publications (page 12~13, Fig. 1, Fig. 5)
Patent document 2：Japanese Patent Publication 2008-135467 publications (page 3~4, Fig. 4)
The content of the invention
In view of the above problems, it is an object of the invention to provide one kind to carry out electricity in the case where carrying out scattered accommodate
Inspection fixture, disconnecting device and the cutting-off method of the visual examination of subassembly.
To solve the above-mentioned problems, inspection according to the present invention is by being cut respectively along for separating with fixture
First boundary line of disconnected object and the second boundary line to intersect with first boundary line cut off the cut-off object to produce and lead to
Cross first boundary line and during the corresponding multiple per parts of multiple regions that the second boundary line is separated out with cutting
The inspection fixture that disconnected device is used together, the disconnecting device possess：
First absorbing unit and the second absorbing unit, are arranged at the disconnecting device, and each adsorb the multiple unit
Component；And
Multiple first pipelines are arranged at first absorbing unit, and for adsorbing the multiple per part, institute respectively
It states inspection fixture and is characterized in that possessing：
3rd absorbing unit, between first absorbing unit and second absorbing unit, and so as to mounting
It is set in the mode of first absorbing unit；
Multiple 3rd pipelines, are arranged at the 3rd absorbing unit, and are placed in the 3rd absorbing unit described
It can be respectively connected with the multiple first pipeline in the state of first absorbing unit；
Capping unit, by compared with the 3rd absorbing unit it is assemble and unassemble in a manner of set；And
Fixed cell fixes the 3rd absorbing unit with the capping unit,
In a state that the 3rd absorbing unit is placed in first absorbing unit, the 3rd absorbing unit is inhaled
It chimes in the multiple per part that first absorbing unit is received via second absorbing unit,
In a state that the capping unit is installed in the 3rd absorbing unit, the capping unit is the described 3rd
The multiple per part for being adsorbed on the 3rd absorbing unit is pushed down on absorbing unit,
The capping unit for pushing down the multiple per part is fixed in the 3rd suction by the fixed cell
Coupon member,
3rd absorbing unit is fixed in the 3rd absorbing unit with the capping unit in the capping unit
In the state of integrally move,
Optical check to the multiple per part be in the 3rd absorbing unit and the capping unit integrally
After movement, and carried out in a state that the capping unit is disassembled from the 3rd absorbing unit,
Wherein the multiple per part includes multiple electronic units or multiple optical components or multiple synthetic resins.
Inspection according to the present invention has following manner with fixture：
The optical check is visually carried out by operator.
Inspection according to the present invention has following manner with fixture：
The optical check is to use camera unit possessed by the disconnecting device, image processing unit and judge single
Member carries out.
Inspection according to the present invention has following manner with fixture：
The inner bottom surface of the capping unit in a state that the capping unit is installed in the 3rd absorbing unit by
Pressure is adsorbed on the multiple per part of the 3rd absorbing unit, possesses soft-member in the inner bottom surface.
To solve the above-mentioned problems, disconnecting device according to the present invention is by respectively along cut-off for separating
First boundary line of object and the second boundary line to intersect with first boundary line cut off the cut-off object to produce and pass through
It is used during the corresponding multiple per parts of multiple regions that first boundary line and the second boundary line are separated out
Disconnecting device, the disconnecting device possess：
Cutting unit cuts off the cut-off object respectively along first boundary line and the second boundary line；
First absorbing unit adsorbs the multiple per part respectively；
Multiple first pipelines are arranged at first absorbing unit, and for adsorbing the multiple per part respectively；
Attract unit, be connected with the multiple first pipeline；
Drying unit makes the multiple per part drying for being adsorbed in first absorbing unit；
Second absorbing unit receives from first absorbing unit and adsorbs the multiple per part；
Multiple second pipelines are arranged at second absorbing unit, and for adsorbing the multiple per part respectively；
3rd absorbing unit, so as to the mode for being placed in first absorbing unit is set；
Multiple 3rd pipelines, are arranged at the 3rd absorbing unit, and are placed in the 3rd absorbing unit described
It can be respectively connected with the multiple first pipeline in the state of first absorbing unit；
Capping unit, by compared with the 3rd absorbing unit it is assemble and unassemble in a manner of set；
Fixed cell fixes the 3rd absorbing unit with the capping unit；
Image acquisition unit is placed in the 3rd absorbing unit and the capping unit in the multiple per part
In a state that the 3rd absorbing unit is disassembled, the image of the multiple per part is obtained；And
Accepting unit, the multiple per part are received together with scattered state,
In a state that the 3rd absorbing unit is placed in first absorbing unit, the multiple per part from
Second absorbing unit by transfer to the 3rd absorbing unit,
By the multiple per part of transfer to the 3rd absorbing unit by the capping unit the described 3rd
It is held down on absorbing unit,
The capping unit for pushing down the multiple per part is fixed in the 3rd suction by the fixed cell
Coupon member,
Optical check to the multiple per part is in the capping unit and is fixed on described in the capping unit
3rd absorbing unit covers list after first absorbing unit is integrally moved to described image acquiring unit, and described
Member is in a state that the 3rd absorbing unit is disassembled, according to the multiple unit portion obtained by described image acquiring unit
The image of part carries out,
Wherein the multiple per part includes multiple electronic units or multiple optical components or multiple synthetic resins.
Disconnecting device according to the present invention has following manner：
Described image acquiring unit using the visual image of operator as the image of the multiple per part,
The optical check is visually carried out by the operator.
Disconnecting device according to the present invention has following manner：
Described image acquiring unit possesses：
Camera unit；
Image processing unit, the image of the multiple per part to being obtained by the camera unit carry out image
Reason；And
Identifying unit, according to progress described image processing as a result, judging whether the multiple per part is qualified.
The disconnecting device of electronic unit manufacture according to the present invention has following manner：
It is further equipped with：
Delivery unit makes the capping unit with being fixed on the 3rd absorbing unit of the capping unit at least described
It is integrally moved between first absorbing unit and the camera unit；And
Fixed lifting unit releases the 3rd absorbing unit with the capping unit by fixed state, and from described
3rd absorbing unit dismantles the capping unit,
Second absorbing unit to the multiple per part of the first absorbing unit transfer,
Second absorbing unit makes the multiple per part be moved to the accepting unit,
Second absorbing unit stops adsorbing the multiple per part, thus by the multiple per part dispersedly
Accommodate the accepting unit.
The disconnecting device of electronic unit manufacture according to the present invention has following manner：
It is further equipped with：
Indexing unit, in the multiple per part extracted out by the optical check to the multiple per part
Mark is added on defective work.
To solve the above-mentioned problems, cutting-off method according to the present invention is by respectively along cut-off for separating
First boundary line of object and the second boundary line to intersect with first boundary line cut off the cut-off object to produce and pass through
It is used during the corresponding multiple per parts of multiple regions that first boundary line and the second boundary line are separated out
Cutting-off method, the cutting-off method include：
The process for cutting off the cut-off object along first boundary line and the second boundary line；
The multiple per part is transported to the process of the first absorbing unit；
Each in the multiple per part is adsorbed in first absorbing unit via multiple first pipelines
Process；
The process that the multiple per part for being adsorbed in first absorbing unit is dried；
Stop by first absorbing unit to the process of the absorption of the multiple per part；
The process that each in the multiple per part is adsorbed in the second absorbing unit via multiple second pipelines；
The process that second absorbing unit for being adsorbed with the multiple per part is made to keep out of the way from the first absorbing unit；
The process that the 3rd absorbing unit with multiple 3rd pipelines is placed in first absorbing unit；
By the multiple per part from the second absorbing unit transfer to the process of the 3rd absorbing unit；
It, will be each in the multiple per part successively via the multiple first pipeline and the multiple 3rd pipeline
A process for being adsorbed in the 3rd absorbing unit；
Capping unit is fixed on the 3rd absorbing unit, and it is single in the described 3rd absorption by the capping unit
The process that the multiple per part is pushed down in member；
Stop by the 3rd absorbing unit to the process of the absorption of the multiple per part；
The capping unit is made integrally to be moved to image with being fixed with the 3rd absorbing unit of the capping unit to obtain
The process for taking unit；
The process that the capping unit is dismantled from the 3rd absorbing unit；
The process being optically inspected to the multiple per part for being placed in the 3rd absorbing unit；And
The multiple per part is accommodated into the process to accepting unit with the state disperseed,
Wherein the multiple per part includes multiple electronic units or multiple optical components or multiple synthetic resins.
The cutting-off method of electronic unit manufacture according to the present invention has following manner：
In the process being optically inspected, the multiple per part is checked by operator by visual observation.
The cutting-off method of electronic unit manufacture according to the present invention has following manner：
In the process being optically inspected, the image of the multiple per part is obtained using camera unit,
Image procossing is carried out to the described image got, according to progress described image processing as a result, to the multiple per part
It is optically inspected.
The cutting-off method of electronic unit manufacture according to the present invention has following manner：
After the process being optically inspected, further comprise making using second absorbing unit described more
A per part is moved to the process above accepting unit,
In the process integrally moved, the capping unit is made to adsorb with the described 3rd using delivery unit single
Member integrally moves,
In the process of the collecting to accepting unit, stop by by be moved to the process above the accepting unit and
Absorption of second absorbing unit to the multiple per part being moved to above the accepting unit, thus will be described more
A per part dispersedly accommodates the accepting unit.
The cutting-off method of electronic unit manufacture according to the present invention has following manner：
Further comprise the defective work in the multiple per parts extracted out by the process being optically inspected
The process of upper addition mark.
The present invention possesses in disconnecting device：It is single to be placed in the 3rd absorption in multiple per parts for image acquisition unit
First and capping unit obtains the image of multiple per parts in a state that the 3rd absorbing unit is disassembled；And accepting unit,
Multiple per parts are received together with scattered state.In the present invention for possessing this structure, the 3rd absorbing unit is adsorbed in
Multiple per parts be held down by capping unit, and capping unit is fixed in the 3rd absorbing unit.Then, covering
Unit is integrally moved to being fixed on the 3rd absorbing unit of the capping unit after image acquisition unit, and in capping unit
In a state that the 3rd absorbing unit is disassembled, the image of multiple per parts is obtained by image acquisition unit.And then root
According to the image obtained, multiple per parts are optically inspected.It as a result, in the present invention, can be in multiple per parts
In the case of being received together with scattered state, multiple per parts are optically inspected.
In accordance with the invention it is possible to visually multiple per parts are optically inspected by operator.
In accordance with the invention it is possible to use camera unit, the image progress to the multiple per parts obtained by camera unit
The image processing unit of image procossing and multiple per parts are optically inspected according to the result for carrying out image procossing
Inspection unit is optically inspected multiple per parts.
Description of the drawings
Fig. 1 is the schematic plan for the embodiment 1 for showing disconnecting device according to the present invention.
(1) of Fig. 2 is the integrally-built front view for showing inspection fixture according to the present invention, and (2) of Fig. 2 are tables
Show the front view that multiple this state of electronic unit after cut-out are transported using the inspection with fixture, (3) of Fig. 2 are to represent to make
The front view of multiple this state of electronic unit is checked with inspection with the plate in fixture.
(1) of Fig. 3 is the front view for representing that multiple electronic units are dried this state, and (2) of Fig. 3 are to represent
By temporarily holding mechanism multiple electronic units is made dry to be configured with inspection with the superjacent air space of workbench in the state of keeping out of the way
With the front view of plate this state in fixture.
(1) of Fig. 4 is represented in the state of keeping out of the way multiple electronic units by temporarily holding mechanism in dry recruitment
The front view for plate this state for making to be placed on platform in inspection fixture, (2) of Fig. 4 are to represent be adsorbed with multiple ministrys of electronics industry
The superjacent air space of the plate of part is configured with the front view for covering this state.
(1) of Fig. 5 is to represent to cover to make multiple electronic units by fixed on the plate of multiple electronic units is placed with
It is pressed the front view of this state, (2) of Fig. 5 are display plates with the inspection fixture that lid is fixed and is integrated from drying
The front view of this state is lifted with workbench.
Fig. 6 is the schematic plan for the embodiment 2 for showing disconnecting device according to the present invention.
Reference sign
1 preposition objective table
2 package substrates (cut-off object)
3 cut-out transfer mechanisms
4 cut-out objective tables
5 mandrels
6 rotating swords (cutting unit)
7 wiper mechanisms
8 emptiers
9 electronic units (per part)
10 aggregates
11 cleaning brush
12 injection equipments (drying unit)
13 drying workbench (the first absorbing unit)
14 inspection fixtures
15 microscopes (image acquisition unit)
16 containing cases (accepting unit)
17 scrape component
18 suction pumps (attraction unit)
19 plates (the 3rd absorbing unit)
20 lids (capping unit)
21st, 31 base material
22nd, 32 adsorption element
A pipeline (the 3rd pipeline) more than 23
24th, 26,34 recess portion
25 threaded holes (fixed cell, fixed lifting unit)
27 soft-members
28 screws (fixed cell, fixed lifting unit)
29 operation consoles
30 pipings
A pipeline (the first pipeline) more than 33
35 erecting beds
36 dry gas
37 temporarily hold mechanism (the second absorbing unit)
A pipeline (the second pipeline) more than 38
39 conveyers (delivery unit)
40 video cameras (camera unit)
41 markers (indexing unit)
A cuts off module
B delivery modules
C receiving parts
D cutting portions
E cleaning parts
F delivery sections
G image processing parts
H determination units
The first boundary lines of L1
L2 the second boundary lines
M1, M2 disconnecting device
OP operators
CTL control units
Specific embodiment
Disconnecting device according to the present invention possesses：Package substrate 2 is cut into multiple electronic units 9 by rotating sword；As
First attracts the drying workbench 13 of unit, adsorbs multiple electronic units 9 respectively；As multiple pipelines 33 of the first pipeline,
It is arranged at drying workbench 13；As the suction pump 18 for attracting unit, it is connected with multiple pipelines 33；Spray as drying unit
Mechanism 12 is penetrated, dries the multiple electronic units 9 for being adsorbed in drying workbench 13；Mechanism 37 is temporarily held, from dry recruitment
Make platform 13 to receive and adsorb multiple electronic units 9；The plate 19 for attracting unit as the 3rd, so as to being placed in drying workbench
Mode on 13 is set；As multiple pipelines 23 of the 3rd pipeline, plate 19 is arranged at, and drying work is placed in plate 19
It can be respectively connected with multiple pipelines 33 in the state of on platform 13；As the lid 20 of capping unit, it is positioned on plate 19, and with phase
It is set for 19 assemble and unassemble mode of plate；As the screw 28 of fixed cell, plate 19 and lid 20 are fixed；And containing case
16, multiple electronic units 9 are received together with scattered state.In the disconnecting device for possessing more than structure, in multiple electronics
Component 9 is placed on plate 19 and is made by being installed on the lid of plate 19 in a state that multiple electronic units 9 are pressed, lid 20 with
Plate 19 is integrally moved to the lower section of microscope 15.In lid 20 in a state that plate 19 is disassembled, pass through the visual of operator OP
Visual examination is carried out to multiple electronic units 9, after inspection, multiple electronic units 9 are received containing case 16 together.
[embodiment 1]
The disconnecting device involved by the embodiment of the present invention 1 is illustrated with reference to figure 1.To any in present specification
Zhang Tu carries out suitably omitting or exaggerate schematically to describe for ease of understanding.Identical structural element is used identical
Reference numeral, and suitably omit the description.
Fig. 1 shows the disconnecting device M1 of the electronic unit manufacture of the embodiment of the present invention 1.Disconnecting device M1 has cut-out
Modules A and delivery module B.Cutting off modules A has receiving part C, cutting portion D and cleaning part E.Cut off modules A and delivery module B
It is mounted side by side in X direction.Receiving part C, cutting portion D and cleaning part E are mounted side by side in X direction.In addition, in present specification
In, it is+direction or-direction as direction if not to representing that the symbol in direction adds "+,-".
Receiving part C has preposition objective table 1.Package substrate (cut-off object) 2 is fed into from the outside of disconnecting device M1
Preposition objective table 1.
Cutting portion D has cut-out transfer mechanism 3 and the cut-out objective table 4 being arranged on cut-out transfer mechanism 3.From
A face possessed by the package substrate 2 that preposition objective table 1 receives is fixed in cut-out by the known technologies such as adsorbing or adhering to
With objective table 4.Cutting portion D has mandrel 5.Rotating sword 6 is fixed in rotation axis (not shown) possessed by mandrel 5.Rotating sword 6
It can be rotated with (such as 15000~30000rpm) at a high speed.
Cleaning part E has wiper mechanism 7 and emptier 8.Emptier 8 is to more by what is formed by cutting off package substrate 2
The aggregate 10 that a electronic unit 9 is formed is transported.Wiper mechanism 7 has sink (not shown) and is housed in water with lower section
The cleaning brush 11 of state rotation in slot.Cleaning brush 11 because lower section immerse sink in water in due to containing dampening state rotate.
Delivery module B is for delivering the module of multiple electronic units 9 to the outside of disconnecting device M1.Delivery module B has
There is delivery section F.Delivery section F have the injection equipment 12 to multiple 9 jet drying gases of electronic unit, it is dry with workbench 13,
Inspection is with fixture 14 and the microscope of inspection 15.In addition, delivery module B also have containing case 16, scrape component 17 and
Suction pump (vacuum pump) 18.Operator OP is responsible for performing checks multiple ministrys of electronics industry with fixture 14 and microscope 15 using inspection
The personnel of the operation of part 9, the operation that multiple electronic units 9 after inspection are accommodated to containing case 16 etc..
Suction pump 18 is arranged at the lower part of delivery module B.Suction pump 18 is so that package substrate 2 is adsorbed in cut-out loading
Aggregate 9 is adsorbed in the attraction unit set for the purpose of emptier 8 and drying workbench 13 etc. by platform 4.Suction pump 18 passes through
Cut-out objective table 4, emptier 8, drying workbench 13 etc. are connected to by piping and valve (not shown).Attraction in Fig. 1
Pump 18 is illustrated as further including motor, air entry, exhaust outlet etc. outside suction pump main body.In addition, in disconnecting device M1 also
It is provided with each structural element to illustrating before this and respectively acts the control unit CTL controlled.
The cut-off object including package substrate 2 is illustrated with reference to figure 1.Being cut off object has by intersecting
The first boundary line L1 and the second boundary line L2 and the multiple regions that are separated out.By respectively along the first boundary line and the second side
Boundary line cuts off cut-off object, so as to regard multiple electronic units 9 corresponding with multiple regions as multiple unit portions
Part produces.8 electronic units 9 are shown in FIG. 1.Without being limited thereto, the quantity of multiple electronic units 9 can be more than can also
Less than 8.
As cut-off object, first, semiconductor wafer (silicon wafer, compound semiconductor wafer etc.) can be enumerated, it should half
Conductor chip is incorporated with the circuit as the function part electrically functioned.Second, substrate (ceramic substrate etc.) can be enumerated,
The substrate is incorporated with multiple active components or such as resistive element passive element (being equivalent to function part).3rd, envelope can be enumerated
Substrate 2 is filled, which has：Substrate；Shaped like chips component (is equivalent to function part, hereinafter referred to as " chip "), installs respectively
In multiple regions possessed by substrate；And potting resin, be formed as tabular so that multiple regions are capped together.It is encapsulating
On substrate 2, multiple chips are together by carry out resin-encapsulated.
Substrate possessed by package substrate 2 includes：The lead frame that is made of copper or iron-based alloy etc. and with glass epoxide
Laminate, the printed base plate (printed wiring board) that the laminate etc. of copper-clad polyimide film is base material.In addition, substrate further includes：
It is the ceramic substrate of base material with aluminium oxide, carborundum, sapphire etc.；Using metals such as copper or aluminium as the metal substrate (metal of base material
ベ ー ス substrates)；It is ilm substrate (Off ィ Le ム ベ ー ス substrates) of base material etc. with polyimide film etc..
Semiconductor integrated circuit (IC, semiconductor integrated circuit) of the chip including strip,
The chip of optical semiconductor, transistor, diode, resistance, capacitor, thermistor etc..A region on substrate, can
To install a chip, multiple chips can also be installed.Multiple chips mounted on a region can be identical type, also may be used
Think variety classes.As potting resin, for example, can use by the thermosetting resins such as epoxy resin, silicones hardening and
The hardening resin of formation.Potting resin can be formed in the single side of substrate, can also be formed in the two-sided of substrate.
Process, cleaning process and the inspection operation of cutting off package substrate 2 are illustrated with reference to figure 1 and Fig. 2.First,
Cut-out shown in FIG. 1 receives package substrate 2 with objective table 4 from preposition objective table 1.Cut-out objective table 4 adsorbs the package substrate
2.By potting resin configuration possessed by package substrate 2 in downside, by substrate configuration in upside, to adsorb potting resin (
It can reverse to configure by upper and lower).
Then, cut-out transfer mechanism 3 will be adsorbed on the package substrate 2 of the cut-out objective table 4+X into figure successively
Direction and +Y direction are transported, and are stopped in the lower section of mandrel 5.It is fixed on the rotation in rotation axis (not shown) possessed by mandrel 5
Turn sword 6 to rotate with (such as degree of 15000~30000rpm) at a high speed.For example, cut-out is with transfer mechanism 3 and cut-out objective table
4 suitably move along Y, θ direction, and rotating sword 6 is suitably moved along X, Z-direction.By these processing, rotating sword 6 and 2 quilt of package substrate
Alignment.In the present embodiment, cut-out objective table 4 is made to rotate+90 ° or -90 °.
Then, by the way that cut-out is made to be relatively moved with transfer mechanism 3 and mandrel 5 along Y-direction, so that rotate at high speed two
Piece rotating sword 6 cuts off package substrate 2 along the Y direction.Package substrate 2 facings conduct from another as the substrate side
One face of the potting resin side is cut off along two among the second boundary line L2 (by cutting entirely).Cutting water is from nozzle
(not shown) is fed into the part that rotating sword 6 is in contact with package substrate 2.It continues on another among the second boundary line L2
Outer two, package substrate 2 is cut off successively.
Then, cut-out objective table 4 is made to rotate+90 ° or -90 °.Two among the first boundary line L1 are continued on, according to
Secondary cut-out package substrate 2.Finally, complete to cut off package substrate 2 along the first all boundary line L1.2 periphery of package substrate
Unwanted part is flushed away to remove by cutting water.By these processing, package substrate 2 is singulated as multiple ministrys of electronics industry
Part 9.
Then, the potting resin side for making the aggregate 10 being made of multiple electronic units 9 downward, passes through emptier 8
Carry out the sorbing substrate side.Emptier 8 is while the state for being adsorbed with aggregate 10 is remain, in the top of wiper mechanism 7
By, and moved along +X direction.By these processing, multiple electronics are touched with the cleaning brush 11 that the state containing dampening rotates
The potting resin side possessed by component 9, so as to be cleaned to those faces.
Then, continue that aggregate 10 is made to keep being adsorbed in the state of emptier 8 and moving along +X direction.Afterwards, from edge
The injection equipment 12 as drying unit of Y-direction configuration towards aggregate 10, the dry gas such as air is made to spray upward.One
While from 12 jet drying gas of injection equipment, while injection equipment 12 is made to be moved along the X direction compared with emptier 8.Make as a result,
Each possessed potting resin side drying in multiple electronic units 9.It is as long as while dry from the injection of injection equipment 12
Pathogenic dryness body, while injection equipment 12 is made to be relatively moved with emptier 8.It can also make the injection equipment configured along the X direction
12 move along the Y direction.
Then, aggregate 10 is made to keep being adsorbed in the state of emptier 8 and moving along +X direction.Afterwards, by aggregate 10
It with workbench 13 and is adsorbed from emptier 8 together transfer to drying.Afterwards, from injection equipment 12 towards aggregate 10, make
Dry gas is sprayed downward.One side jet drying gas, while injection equipment 12 is made to be relatively moved with drying workbench 13.By
This, makes each possessed substrate side drying in multiple electronic units 9.
Then, operator OP uses inspection fixture 14, and at least perform successively following operation (on these operations, will
It describes later).First is the lower section that the multiple electronic units 9 for being fixed in inspection fixture 14 is made to be moved to microscope 15
Operation.Second is to check the operation of multiple electronic units 9 by visual observation using microscope 15.According to the species of electronic unit 9,
Feature, size etc. can not also be checked using microscope 15.3rd is that multiple electronic units 9 is made to be moved to containing case
The operation of 16 top.4th is the operation accommodated multiple electronic units 9 dispersedly and together to containing case 16.Pass through this
Multiple electronic units 9 are accommodated containing case 16 by a little operations.
The inspection fixture 14 involved by the embodiment of the present invention 1 is illustrated with reference to figure 2.As shown in (1) of Fig. 2,
Check has plate 19 and lid 20 with fixture 14.Plate 19 can pass through screw clamp (aftermentioned), clamp (Network ラ Application プ) etc. with lid 20
Appropriate fixed cell is loaded and unloaded.
Plate 19 has base material 21 and the adsorption element 22 being fixed on base material 21.On plate 19, divide with multiple electronic units 9
The multiple pipelines 23 for penetrating through adsorption element 22 and base material 21 are not correspondingly provided with.In the lower part of base material 21, it is provided with and more
The recess portion 24 that a pipeline 23 connects.Recess portion 24 has opening in the lower surface of base material 21.In the adsorption section of the upper surface of base material 21
The peripheral portion of part 22 is provided at least two threaded holes 25.
The lower part of lid 20 is provided with recess portion 26.Recess portion 26 is the first half that plate 19 is accommodated when plate 19 and lid 20 are fixed
Divide the space of i.e. adsorption element 22.The depth of recess portion 26 is formed appropriate depth, so that when plate 19 and lid 20 are fixed,
The inner bottom surface of recess portion 26 can press multiple electronic units 9 (ginseng (in (1) of Fig. 2, face corresponding with the upper surface of recess portion 26)
Examine (2) of Fig. 2).
As needed, the methods of cohesive setting can be passed through by structures such as silicone rubber, fluorubber in the inner bottom surface of recess portion 26
Into sheet soft-member 27.Thereby, it is possible to prevent that multiple electronic units 9 are impaired.
On lid 20, with 25 corresponding position of threaded hole possessed by base material 21 at be provided with through hole and (do not scheme
Show).Inserted with screw 28 in through hole.By using the unit for being referred to as screw clamp of screw 28 and threaded hole 25,
Plate 19 can be mounted with lid 20 and can be disassembled and (can be loaded and unloaded).By screw clamp, lid 20 is by adsorption element 22
It covers and is fixed in base material 21.
Base material 21 in lid 20 and plate 19 passes through the tree processing the metal materials such as aluminium, formed by rigid plastics such as acrylic acid
Fat material etc. and be made.Adsorption element 22 passes through the processing such as drilled, slotted on the resin materials such as silicone rubber, fluorubber
And it is made.The liquid resins such as silicone rubber, fluorubber (fluid resin) can also be injected into the intracavitary of molding die, by base
Material 21 is pressed in thereon, and cures liquid resin.Thereby, it is possible to produce base material 21 and the adsorption element 22 as formed body
The plate 19 being integrated.
It is more when inspection is used to be transported with fixture 14 to multiple electronic units 9 after cut-out as shown in (2) of Fig. 2
A electronic unit 9 is held down in the upper surface of adsorption element 22 by lid 20.Thereby, it is possible to transport multiple electronic units 9 without
The position of multiple electronic units 9 can be made to shift.
Material, surface state according to multiple electronic units 9 etc., it is preferable to use resin materials to make lid 20.This
In the case of, multiple electronic units 9 are clamped and fixed using the lid 20 and adsorption element 22 that are made of respectively resin material.By
This, can prevent that multiple electronic units 9 are impaired when transporting multiple electronic units 9.
As shown in (3) of Fig. 2, after using inspection and transporting multiple electronic units 9 with fixture 14, by inspection fixture
It is placed into possessed by disconnecting device on operation console 29.Using suction pump 18 successively via piping 30, recess portion 24 and multiple pipelines
23 adsorb multiple electronic units 9.Afterwards, since the state shown in (2) of Fig. 2, operator's (with reference to figure 1) unclamps screw
28, lid 20 is dismantled from plate 19.Operator checks multiple electronic units 9 by visual observation using microscope 15.
With reference to 2~Fig. 6 of figure, to use the structure needed in the inspection that inspection according to the present invention carried out with fixture with
And the cutting-off method including the inspection illustrates.In (1) of Fig. 3, dry workbench 13 has base material 31 and inhales
Attached component 32.Dry on workbench 13, correspondingly it is provided with respectively by adsorption element 32 and base with multiple electronic units 9
Multiple pipelines 33 that material 31 penetrates through.In the lower part of base material 31, the recess portion 34 connected with multiple pipelines 33 is provided with.Recess portion 34 is in base
The lower surface of material 31 has opening.Drying workbench 13 is installed on erecting bed 35 possessed by disconnecting device.
Dry in the space of the top of workbench 13, it is configured with injection equipment 12 (with reference to figure 1).Injection equipment 12 to
The 9 jet drying gas 36 of multiple electronic units for being adsorbed on drying workbench 13.
In the dry top with workbench 13, be configured with the multiple electronic units 9 of absorption attracts facing for unit as second
When holding mechanism 37.On mechanism 37 is temporarily held, the work of perforation configuration is correspondingly provided with respectively with multiple electronic units 9
For multiple pipelines 38 of the second pipeline.Temporarily holding mechanism 37 can be in the upper of drying workbench 13 and drying workbench 13
It retreats between side.In addition, temporarily holding mechanism 37 can be kept out of the way and the top of drying workbench 13 is made to become empty
Space.In (1) of Fig. 3, the unadsorbed multiple electronic units 9 of mechanism 37 are temporarily held, and are kept out of the way from drying workbench 13
And the top of drying workbench 13 is made to become empty space.
The process for checking multiple electronic units 9 cleaned after severance among cutting-off method is illustrated below.
First, as shown in (1) of Fig. 3, using conveyer 8 (with reference to figure 1) by multiple electronic units 9 with the potting resin side under
Mode be placed into the upper surface of the adsorption element 32 in drying workbench 13.It, will be more after cleaning by multiple pipelines 33
A electronic unit 9 is adsorbed in the upper surface of adsorption element 32.By the dry gas 36 sprayed from injection equipment 12, to being adsorbed
Multiple electronic units 9 be dried.Each possessed substrate side in multiple electronic units 9 is carried out as a result,
It is dry.
Then, as shown in (2) of Fig. 3, multiple electricity are being adsorbed by temporarily holding multiple pipelines 38 possessed by mechanism 37
After subassembly 9, make to temporarily hold mechanism 37 and keep out of the way from drying workbench 13, so that the top of drying workbench 13 becomes
Empty space.Plate 19 in inspection fixture 14 shown in (1) of Fig. 2 is configured at dry use by operator OP (with reference to figure 1)
The empty space of 13 top of workbench.
Then, as shown in (1) of Fig. 4, operator OP (with reference to figure 1) is in the upper table of the dry base material 31 in workbench 13
Place the plate 19 of inspection fixture 14 in face.Afterwards, the mechanism 37 that temporarily holds for being adsorbed with multiple electronic units 9 is made to drop to plate 19
Upper surface near.
Then, as shown in (2) of Fig. 4, the absorption temporarily held in mechanism 37 shown in (1) of Fig. 4 is released, it will be multiple
Electronic unit 9 is from 37 transfer of mechanism is temporarily held to the upper surface of plate 19.Using suction pump 18 successively via piping 30, recess portion
Multiple electronic units 9 are adsorbed in the upper surface of plate 19 by the 34th, multiple pipelines 33 and multiple pipelines 23.
Then, as shown in (1) of Fig. 5, operator OP (with reference to figure 1) is by the inspection shown in (1) of Fig. 2 in fixture 14
Lid 20 is positioned over the upper surface of the base material 21 in plate 19.As a result, lid 20 recess portion 26 inner bottom surface (in (1) in Fig. 5, with
The corresponding face in upper surface of recess portion 26) bond soft-member 27 press multiple electronic units 9.Operator OP (with reference to figure 1)
Rotary screw 28 is simultaneously tightened, and thus installs plate 19 and lid 20 (fixation).Afterwards, by the absorption on the plate 19 shown in (2) of Fig. 4
It releases.
Then, as shown in (2) of Fig. 5, operator OP (with reference to figure 1) from it is dry with picked up on workbench 13 be fixed with it is multiple
The inspection of electronic unit 9 fixture 14.It is micro- that operator OP is moved to the inspection fixture 14 for being fixed with multiple electronic units 9
The lower section of mirror 15.
Then, since the state shown in (2) of Fig. 2, as shown in (3) of Fig. 2, operator OP (with reference to figure 1) will be fixed
The inspection fixture 14 for having multiple electronic units 9 is placed in possessed by disconnecting device on operation console 29.Using suction pump 18 according to
It is secondary via piping 30, recess portion 24 and multiple pipelines 23, multiple electronic units 9 are adsorbed in the upper surface of plate 19 (with reference to figure 2
(3)).Operator OP rotary screws 28 simultaneously unclamp, and lid 20 is thus dismantled from plate 19.Afterwards, as shown in (3) of Fig. 2, operator
OP checks multiple electronic units 9 by visual observation using microscope 15.
Then, when finding that appearance is unqualified in multiple electronic units 9, operator OP is corresponded to (with reference to figure 1)
The necessary processing of the situation.For example, operator OP records among multiple electronic units 9 with being judged as the underproof electronics of appearance
The related information of component 9 related information such as (for example, with) position, unqualified patterns, and report to the work before inspection operation
The process management person of sequence (for example, cut off operation, resin-encapsulated process etc.).As other measures, first, operator OP can be
Mark is added on the underproof electronic unit 9 of appearance among multiple electronic units 9.Second, operator OP can be in the sources of releasing
After the absorption of suction pump 18, the underproof electronic unit 9 of appearance among multiple electronic units 9 is removed from plate 19.
Then, operator OP (with reference to figure 1) picks up plate 19 from operation console 29.Plate 19 is carried to Fig. 1 institutes by operator OP
The top of the containing case 16 shown, and returning face plate 19.The multiple electronic units 9 placed in the upper surface of plate 19 are accommodated as a result,
Containing case 16.Sometimes electronic unit 9 can remain to be close in the structural element of plate 19 and is made of resin materials such as silicone rubbers
Adsorption element 22 surface on state.At this point, operator OP will be close to adsorption section using the component 17 shown in FIG. 1 that scrapes
Electronic unit 9 on 22 surface of part is scraped from the surface.Therefore, it is possible to by multiple electronic units 9 with scattered state together
Accommodate containing case 16 (scattered to accommodate).
According to the present embodiment, first, it is received the feelings of containing case 16 together with scattered state in multiple electronic units 9
Under condition, multiple electronic units 9 are optically inspected by operator OP (with reference to figure 1).Operator OP will be with multiple electronic units 9
Among the related information of the underproof electronic unit 9 of appearance report to the process management person of the process before inspection operation.By
This, in the process before inspection operation, unqualified reason can be effectively performed finds out and answers equity.Second, it can be only
The electronic unit 9 that certified products are judged as among multiple electronic units 9 is accommodated into containing case 16.
[embodiment 2]
The disconnecting device involved by the embodiment of the present invention 1 is illustrated with reference to figure 6.As the embodiment of the present invention 2,
Fig. 6 shows the disconnecting device M2 of electronic unit manufacture.The feature of disconnecting device M2 is：With perform successively cleaning process and
Multiple electronic units 9 of drying process are object, are performed automatically from inspection operation to scattered collecting process.
As shown in fig. 6, conveyer 39 is to maintain and transports the conveyer of inspection of the inspection with fixture 14.Video camera
40 are arranged in the top of the plate 19 shown in (3) of Fig. 2 and multiple electronic units 9 of the upper surface to being adsorbed in plate 19 are clapped
The camera unit taken the photograph.Image processing part G is the image that the image procossings such as binaryzation are carried out according to the image obtained by video camera 40
Processing unit.Determination unit H is according to the image data obtained from processing result image, by being compared with prespecified data
Compared with the methods of, using each in multiple electronic units 9 as object, determine whether the judgement list of qualified (qualified unqualified)
Member.Marker 41 is to be judged to adding the mark list of mark by determination unit H on underproof electronic unit 9 by ink etc.
Member.Image processing part G and determination unit H can be built in control unit CTL.
The process after cleaning package substrate 2 is illustrated with reference to figure 6.In other words, to being pair with multiple electronic units 9
As being illustrated automatically from the situation that inspection operation is performed to scattered collecting process.
In the process shown in Fig. 3~Fig. 5, conveyer 39 performs following action.First, perform inspection fixture 14
Plate 19 be placed on the action (reference of the dryings of unadsorbed multiple electronic units 9 upper surface of the base material 31 in workbench 13
(2) of Fig. 3 and (1) of Fig. 4).Then, perform the lid 20 in the inspection fixture 14 shown in (1) of Fig. 2 being placed on and be adsorbed with
The action of the drying of multiple electronic units 9 upper surface of the base material 31 in workbench 13 (with reference to (2) of figure 4).Then, perform
It rotates screw 28 and tightens thus action that plate 19 and lid 20 are installed to (fixation) (with reference to (1) of figure 5).Then, perform
From dry with picking up the inspection fixture 14 for being fixed with multiple electronic units 9 (with reference to (2) of figure 5) on workbench 13 and make the inspection
Look into the action for the lower section that microscope 15 is moved to fixture 14 (with reference to figure 6).
Then, the top of the plate 19 shown in video camera 40 from (3) of Fig. 2 is to being adsorbed in multiple electronics of the upper surface of plate 19
Component 9 is shot.Image processing part G carries out the image procossings such as binaryzation according to the image obtained by video camera 40.Determination unit H
According to the image data obtained from processing result image, the methods of by compared with prespecified data, with multiple electricity
Each in subassembly 9 is object, is determined whether qualified (qualified unqualified).Marker 41 is by ink etc. by judging
Portion H is judged to adding mark on underproof electronic unit 9.It can will be with being determined as underproof electronic unit 9 by determination unit H
Related information related information such as (for example, with) position, unqualified patterns is stored in control unit CTL.
Then, if it is desired, then automatically removed by absorbing unit (not shown) and be judged as underproof electronic unit
9.It can also manually be removed by operator and be judged as underproof electronic unit 9.
Then, multiple electronic units 9 are accommodated to (scattered to accommodate) automatically to containing case 16.It is judged as not conforming to eliminating
In the case of the electronic unit 9 of lattice, the electronic unit 9 that certified products are judged as among multiple electronic units 9 is only accommodated into receipts
Tank 16.
According to the present embodiment, first, it is performed automatically from inspection operation to scattered collecting work for object with multiple electronic units 9
Sequence.Thereby, it is possible to multiple electronic units 9 are efficiently performed from inspection operation to scattered collecting process.Second, in multiple electronics
In the case that component 9 is received containing case 16 together with scattered state, multiple electronic units 9 are automatically by carry out optics inspection
It looks into.The information related with the underproof electronic unit 9 of appearance among multiple electronic units 9 can be automatically reported to check work
The process management person of process before sequence.As a result, in the process before inspection operation, unqualified original can be more effectively carried out
Equity is found out and answered to cause.3rd, it can be only automatic by the electronic unit 9 that certified products are judged as among multiple electronic units 9
Accommodate containing case 16.
In the present embodiment, clamp is used as screw by plate 19 and 20 fixed fixed cell of lid, can also be replaced
Deng.In this case, handle (レ バ ー) of the operation of conveyer 39 clamp etc. carrys out the installation and removal into andante 19 and lid 20.
In addition, in each embodiment illustrated before this, as the injection equipment 12 of jet drying gas, can use along
Length direction is provided with the jet port of slit-shaped or the tube (パ イ プ) of multiple jet ports.It can also make 12 edge of injection equipment
The X-direction shown in Fig. 1, Fig. 6 to configure and move along the Y direction.
As the dry gas 36 ejected from injection equipment 12, it can use dry air or nitrogen etc. can be in factory
The appropriate dry gas obtained.
As absorbing unit, suction pump (vacuum pump) 18 can be replaced and use vacuum ejector.In addition it is also possible to it will use
Aggregate 9 is adsorbed in emptier 8 and drying with being used in the absorbing unit that package substrate 2 is adsorbed in cut-out objective table 4
It is set respectively by the use of the suction pump 18 as absorbing unit of 13 grade of workbench.
Characteristic, surface state according to multiple electronic units 9 etc. can not also use microscope 15 (in other words, without putting
Greatly), checked by visual observation by operator.
In explanation before this, as cut-off object, using package substrate 2 for object, as by cut off cut-off object and
The multiple per parts obtained, are object with multiple electronic units 9, are illustrated.It is without being limited thereto, by resin forming come
The present invention can be applied when optical components by manufacturing lens, optical module, light guide plate.In addition, manufacturing general resin forming
The present invention can also be applied during product.
As cut-out mode, in addition to rotating sword 6, laser, water column, wire saw, band saw, air blast or profit can be used
Carried out with the slot being respectively formed on the first boundary line L1 of package substrate 2 and the second boundary line L2 cut off these modes it
In at least any one.Use cut off as cut-out mode when, package substrate 2 can be cut by using 6 grade of rotating sword
It cuts into the way of thickness direction (hemisection), thus forms slot.
The present invention is not limited to the above embodiments, without departing from the scope of the subject in the invention, can appoint as needed
It anticipates and is suitably combined, changes or selectively uses.For example, operator OP that can be as shown in Figure 1 performs Fig. 6
Run performed by shown conveyer 39.
Claims (14)
1. a kind of inspection fixture, by respectively along the first boundary line for separating cut-off object and with first border
The second boundary line that line intersects cut off the cut-off object produce with by first boundary line and the second boundary
It is used during the corresponding multiple per parts of multiple regions that line is separated out together with disconnecting device, the disconnecting device tool
It is standby：
First absorbing unit and the second absorbing unit, are arranged at the disconnecting device, and each adsorb the multiple per part；
And
Multiple first pipelines are arranged at first absorbing unit, and for adsorbing the multiple per part, the inspection respectively
It looks into and is characterized in that with fixture, possessed：
3rd absorbing unit between first absorbing unit and second absorbing unit, and so as to is placed in institute
The mode for stating the first absorbing unit is set；
Multiple 3rd pipelines are arranged at the 3rd absorbing unit, and are placed in described first in the 3rd absorbing unit
It can be respectively connected with the multiple first pipeline in the state of absorbing unit；
Capping unit, by compared with the 3rd absorbing unit it is assemble and unassemble in a manner of set；And
Fixed cell fixes the 3rd absorbing unit with the capping unit,
In a state that the 3rd absorbing unit is placed in first absorbing unit, the 3rd absorbing unit absorption from
The multiple per part that first absorbing unit is received via second absorbing unit,
In a state that the capping unit is installed in the 3rd absorbing unit, the capping unit is in the described 3rd absorption
The multiple per part for being adsorbed on the 3rd absorbing unit is pushed down on unit,
The capping unit for pushing down the multiple per part is fixed in the 3rd absorption list by the fixed cell
Member,
3rd absorbing unit is fixed in the shape of the 3rd absorbing unit with the capping unit in the capping unit
It is integrally moved under state,
Optical check to the multiple per part is integrally moved with the capping unit in the 3rd absorbing unit
Afterwards, and in a state that the capping unit is disassembled from the 3rd absorbing unit carry out,
Wherein the multiple per part includes multiple electronic units or multiple optical components or multiple synthetic resins.
2. inspection fixture according to claim 1, which is characterized in that
The optical check is visually carried out by operator.
3. inspection fixture according to claim 1, which is characterized in that
The optical check is come using camera unit, image processing unit and identifying unit possessed by the disconnecting device
It carries out.
4. the inspection fixture according to any one in claims 1 to 3, which is characterized in that
The inner bottom surface of the capping unit presses quilt in a state that the capping unit is installed in the 3rd absorbing unit
The multiple per part of the 3rd absorbing unit is adsorbed in, possesses soft-member in the inner bottom surface.
5. a kind of disconnecting device, by respectively along the first boundary line for separating cut-off object and with first boundary line
The second boundary line that intersects cut off the cut-off object produce with by first boundary line and the second boundary line
It is used during the corresponding multiple per parts of the multiple regions that are separated out, the disconnecting device is characterized in that possessing：
Cutting unit cuts off the cut-off object respectively along first boundary line and the second boundary line；
First absorbing unit adsorbs the multiple per part respectively；
Multiple first pipelines are arranged at first absorbing unit, and for adsorbing the multiple per part respectively；
Attract unit, be connected with the multiple first pipeline；
Drying unit makes the multiple per part drying for being adsorbed in first absorbing unit；
Second absorbing unit receives from first absorbing unit and adsorbs the multiple per part；
Multiple second pipelines are arranged at second absorbing unit, and for adsorbing the multiple per part respectively；
3rd absorbing unit, so as to the mode for being placed in first absorbing unit is set；
Multiple 3rd pipelines are arranged at the 3rd absorbing unit, and are placed in described first in the 3rd absorbing unit
It can be respectively connected with the multiple first pipeline in the state of absorbing unit；
Capping unit, by compared with the 3rd absorbing unit it is assemble and unassemble in a manner of set；
Fixed cell fixes the 3rd absorbing unit with the capping unit；
Image acquisition unit is placed in the 3rd absorbing unit in the multiple per part and the capping unit is from institute
It states in a state that the 3rd absorbing unit is disassembled, obtains the image of the multiple per part；And
Accepting unit, the multiple per part are received together with scattered state,
In a state that the 3rd absorbing unit is placed in first absorbing unit, the multiple per part is from described
Second absorbing unit by transfer to the 3rd absorbing unit,
By the multiple per part of transfer to the 3rd absorbing unit by the capping unit in the described 3rd absorption
It is held down on unit,
The capping unit for pushing down the multiple per part is fixed in the 3rd absorption list by the fixed cell
Member,
Optical check to the multiple per part is in the capping unit and is fixed on the described 3rd of the capping unit
Absorbing unit after first absorbing unit is integrally moved to described image acquiring unit, and the capping unit from
In a state that 3rd absorbing unit is disassembled, according to the multiple per part obtained by described image acquiring unit
Image carries out,
Wherein the multiple per part includes multiple electronic units or multiple optical components or multiple synthetic resins.
6. disconnecting device according to claim 5, which is characterized in that
Described image acquiring unit using the visual image of operator as the image of the multiple per part,
The optical check is visually carried out by the operator.
7. disconnecting device according to claim 5, which is characterized in that described image acquiring unit possesses：
Camera unit；
Image processing unit, the image of the multiple per part to being obtained by the camera unit carry out image procossing；With
And
Identifying unit, according to progress described image processing as a result, judging whether the multiple per part is qualified.
8. disconnecting device according to claim 7, which is characterized in that be further equipped with：
Delivery unit makes the capping unit and is fixed on the 3rd absorbing unit of the capping unit at least described first
It is integrally moved between absorbing unit and the camera unit；And
Fixed lifting unit releases the 3rd absorbing unit with the capping unit by fixed state, and from the described 3rd
Absorbing unit dismantles the capping unit,
Second absorbing unit to the multiple per part of the 3rd absorbing unit transfer,
3rd absorbing unit makes the multiple per part be moved to the accepting unit,
3rd absorbing unit stops adsorbing the multiple per part, thus dispersedly accommodates the multiple per part
To the accepting unit.
9. the disconnecting device according to any one in claim 5~8, which is characterized in that be further equipped with：
Indexing unit, in not conforming to for the multiple per part extracted out by the optical check to the multiple per part
Mark is added on lattice product.
10. a kind of cutting-off method, by respectively along the first boundary line for separating cut-off object and with first border
The second boundary line that line intersects cut off the cut-off object produce with by first boundary line and the second boundary
It being used during the corresponding multiple per parts of multiple regions that line is separated out, the cutting-off method is characterized in that, including：
The process for cutting off the cut-off object respectively along first boundary line and the second boundary line；
The multiple per part is transported to the process of the first absorbing unit；
Each in the multiple per part is adsorbed in the process of first absorbing unit via multiple first pipelines；
The process that the multiple per part for being adsorbed in first absorbing unit is dried；
Stop by first absorbing unit to the process of the absorption of the multiple per part；
The process that each in the multiple per part is adsorbed in the second absorbing unit via multiple second pipelines；
The process that second absorbing unit for being adsorbed with the multiple per part is made to keep out of the way from first absorbing unit；
The process that the 3rd absorbing unit with multiple 3rd pipelines is placed in first absorbing unit；
By the multiple per part from the second absorbing unit transfer to the process of the 3rd absorbing unit；
Successively via the multiple first pipeline and the multiple 3rd pipeline, by each suction in the multiple per part
The process for investing the 3rd absorbing unit；
Capping unit is fixed on the 3rd absorbing unit, and by the capping unit on the 3rd absorbing unit
The process for pushing down the multiple per part；
Stop by the 3rd absorbing unit to the process of the absorption of the multiple per part；
The capping unit is made integrally to be moved to image acquisition list with being fixed with the 3rd absorbing unit of the capping unit
The process of member；
The process that the capping unit is dismantled from the 3rd absorbing unit；
The process being optically inspected to the multiple per part for being placed in the 3rd absorbing unit；And
The multiple per part is accommodated into the process to accepting unit with the state disperseed,
Wherein the multiple per part includes multiple electronic units or multiple optical components or multiple synthetic resins.
11. cutting-off method according to claim 10, which is characterized in that
In the process being optically inspected, the multiple per part is checked by operator by visual observation.
12. cutting-off method according to claim 10, which is characterized in that
In the process being optically inspected, the image of the multiple per part is obtained using camera unit, to obtaining
The described image got carries out image procossing, according to progress described image processing as a result, being carried out to the multiple per part
Optical check.
13. the cutting-off method according to any one in claim 10~12, which is characterized in that
After the process being optically inspected, further comprise making the multiple list using the 3rd absorbing unit
Position component is moved to the process above the accepting unit,
In the process integrally moved, the capping unit and the 3rd absorbing unit one are made using delivery unit
Body it is mobile,
In process of the collecting to accepting unit, stop by being moved by being moved to the process above the accepting unit
Absorption of the 3rd absorbing unit to the multiple per part above to the accepting unit, thus by the multiple list
Position component dispersedly accommodates the accepting unit.
14. the cutting-off method according to any one in claim 10~12, which is characterized in that
Further comprise the defective work in the multiple per part extracted out by the process being optically inspected
The process of upper addition mark.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-065041 | 2014-03-27 | ||
| JP2014065041A JP6235391B2 (en) | 2014-03-27 | 2014-03-27 | Inspection jig, cutting device, and cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104952767A CN104952767A (en) | 2015-09-30 |
| CN104952767B true CN104952767B (en) | 2018-05-22 |
Family
ID=54167334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510104727.9A Active CN104952767B (en) | 2014-03-27 | 2015-03-10 | It checks with fixture, disconnecting device and cutting-off method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6235391B2 (en) |
| KR (1) | KR101659686B1 (en) |
| CN (1) | CN104952767B (en) |
| TW (1) | TWI613056B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6482454B2 (en) * | 2015-12-18 | 2019-03-13 | Ｔｏｗａ株式会社 | Electronic component manufacturing method and electronic component manufacturing apparatus |
| JP6785735B2 (en) * | 2017-09-07 | 2020-11-18 | Ｔｏｗａ株式会社 | Cutting device and semiconductor package transport method |
| JP6886379B2 (en) * | 2017-09-28 | 2021-06-16 | Ｔｏｗａ株式会社 | Holding member, manufacturing method of holding member, inspection device and cutting device |
| JP6746756B1 (en) * | 2019-05-24 | 2020-08-26 | Ｔｏｗａ株式会社 | Suction plate, cutting device and cutting method |
| KR102066574B1 (en) * | 2019-06-13 | 2020-01-15 | 박세준 | Copper tube cutting machine |
| JP7333741B2 (en) | 2019-11-05 | 2023-08-25 | 株式会社ディスコ | processing equipment |
| CN112901986B (en) * | 2020-12-09 | 2022-04-26 | 首都师范大学 | Virtual reality video play device |
| KR20230135661A (en) * | 2021-03-18 | 2023-09-25 | 토와 가부시기가이샤 | Processing equipment and manufacturing methods of processed products |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479838A (en) * | 2006-12-20 | 2009-07-08 | 东和株式会社 | Individualizing apparatus for electronic component manufacture |
| CN101878523A (en) * | 2007-11-28 | 2010-11-03 | 东和株式会社 | Method and device for cutting substrate |
| CN101878525A (en) * | 2007-11-30 | 2010-11-03 | 东和株式会社 | The carrying device of singualtion electronic component and transport method |
| CN102047399A (en) * | 2008-06-13 | 2011-05-04 | 东和株式会社 | Separating device and separating method for electronic component manufacture |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10296993T5 (en) * | 2001-08-08 | 2004-08-05 | Matsushita Electric Industrial Co., Ltd., Kadoma | Device and method for assembling electronic components |
| JP3824914B2 (en) | 2001-11-30 | 2006-09-20 | Ｔｏｗａ株式会社 | Substrate cutting method |
| JP2003207455A (en) * | 2002-01-15 | 2003-07-25 | Towa Corp | Tool for retaining package |
| JP4162535B2 (en) * | 2003-05-09 | 2008-10-08 | Ｔｏｗａ株式会社 | Method and apparatus for cutting sealed substrate |
| JP5285217B2 (en) | 2006-11-27 | 2013-09-11 | Ｔｏｗａ株式会社 | Electronic component manufacturing apparatus and manufacturing method |
| TWM321029U (en) * | 2007-02-16 | 2007-10-21 | Gallant Prec Machining Co Ltd | Chip tray feeder |
| SG183593A1 (en) * | 2011-03-02 | 2012-09-27 | Rokko Systems Pte Ltd | Improved system for substrate processing |
| JP5947010B2 (en) * | 2011-09-15 | 2016-07-06 | 株式会社ディスコ | Splitting device |
-
2014
- 2014-03-27 JP JP2014065041A patent/JP6235391B2/en active Active
-
2015
- 2015-03-10 CN CN201510104727.9A patent/CN104952767B/en active Active
- 2015-03-11 TW TW104107678A patent/TWI613056B/en active
- 2015-03-11 KR KR1020150033604A patent/KR101659686B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479838A (en) * | 2006-12-20 | 2009-07-08 | 东和株式会社 | Individualizing apparatus for electronic component manufacture |
| CN101878523A (en) * | 2007-11-28 | 2010-11-03 | 东和株式会社 | Method and device for cutting substrate |
| CN101878525A (en) * | 2007-11-30 | 2010-11-03 | 东和株式会社 | The carrying device of singualtion electronic component and transport method |
| CN102047399A (en) * | 2008-06-13 | 2011-05-04 | 东和株式会社 | Separating device and separating method for electronic component manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015188024A (en) | 2015-10-29 |
| KR20150112799A (en) | 2015-10-07 |
| KR101659686B1 (en) | 2016-09-26 |
| CN104952767A (en) | 2015-09-30 |
| TWI613056B (en) | 2018-02-01 |
| JP6235391B2 (en) | 2017-11-22 |
| TW201540456A (en) | 2015-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104952767B (en) | It checks with fixture, disconnecting device and cutting-off method | |
| US10964555B2 (en) | Water jet processing apparatus | |
| CN107533965B (en) | Adsorption mechanism, adsorption method, manufacturing device and manufacturing method | |
| TWI647865B (en) | Processing method of package substrate | |
| CN105702627B (en) | Cutting device | |
| CN107045976B (en) | Cutting device | |
| CN111834243A (en) | Inspection apparatus and processing apparatus | |
| KR20040019173A (en) | Wafer table, apparatus for sawing wafer and attaching semiconductor device and apparaus for sawing wafer and sorting semiconductor device using the same | |
| KR102242827B1 (en) | Peeling apparatus | |
| TWI726230B (en) | Holding member, method of manufacturing holding member, holding mechanism, and product manufacturing device | |
| CN105633017B (en) | Method for dividing package substrate | |
| CN110303607B (en) | Cutting device | |
| CN109986461B (en) | Cutting device | |
| JP2020120029A (en) | Chuck table | |
| CN105914164B (en) | Processing device | |
| JP2021167034A (en) | Blade holding fixture, cutting device, and fitting method for cutting blade | |
| US11628515B2 (en) | Processing apparatus for processing workpiece | |
| JP7191473B2 (en) | KEY PATTERN DETECTION METHOD AND DEVICE | |
| JP2016207820A (en) | Processing method of wafer | |
| JP2018148151A (en) | Processing method and cutting device of package substrate | |
| JP2019021703A (en) | Cutting method of tabular workpiece | |
| JP6976660B2 (en) | Processing equipment | |
| JP7394664B2 (en) | Processing method of workpiece and jig for chip conveyance | |
| CN108987326B (en) | Chip storage method | |
| TW202349557A (en) | Fixing member and fluid injection nozzle mechanism wherein the fixing member has a cylindrical support portion, a truncated cone-shaped pushing and holding portion, and a through hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |