JP6235391B2 - 検査用治具、切断装置及び切断方法 - Google Patents

検査用治具、切断装置及び切断方法 Download PDF

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Publication number
JP6235391B2
JP6235391B2 JP2014065041A JP2014065041A JP6235391B2 JP 6235391 B2 JP6235391 B2 JP 6235391B2 JP 2014065041 A JP2014065041 A JP 2014065041A JP 2014065041 A JP2014065041 A JP 2014065041A JP 6235391 B2 JP6235391 B2 JP 6235391B2
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Japan
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suction
unit members
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adsorbing
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Japanese (ja)
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JP2015188024A5 (enExample
JP2015188024A (ja
Inventor
裕也 和泉
裕也 和泉
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Towa Corp
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Towa Corp
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Priority to JP2014065041A priority Critical patent/JP6235391B2/ja
Priority to CN201510104727.9A priority patent/CN104952767B/zh
Priority to TW104107678A priority patent/TWI613056B/zh
Priority to KR1020150033604A priority patent/KR101659686B1/ko
Publication of JP2015188024A publication Critical patent/JP2015188024A/ja
Publication of JP2015188024A5 publication Critical patent/JP2015188024A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2014065041A 2014-03-27 2014-03-27 検査用治具、切断装置及び切断方法 Active JP6235391B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014065041A JP6235391B2 (ja) 2014-03-27 2014-03-27 検査用治具、切断装置及び切断方法
CN201510104727.9A CN104952767B (zh) 2014-03-27 2015-03-10 检查用夹具、切断装置以及切断方法
TW104107678A TWI613056B (zh) 2014-03-27 2015-03-11 檢查用治具、切斷裝置及切斷方法
KR1020150033604A KR101659686B1 (ko) 2014-03-27 2015-03-11 검사용 지그, 절단 장치 및 절단 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014065041A JP6235391B2 (ja) 2014-03-27 2014-03-27 検査用治具、切断装置及び切断方法

Publications (3)

Publication Number Publication Date
JP2015188024A JP2015188024A (ja) 2015-10-29
JP2015188024A5 JP2015188024A5 (enExample) 2017-08-31
JP6235391B2 true JP6235391B2 (ja) 2017-11-22

Family

ID=54167334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014065041A Active JP6235391B2 (ja) 2014-03-27 2014-03-27 検査用治具、切断装置及び切断方法

Country Status (4)

Country Link
JP (1) JP6235391B2 (enExample)
KR (1) KR101659686B1 (enExample)
CN (1) CN104952767B (enExample)
TW (1) TWI613056B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6482454B2 (ja) * 2015-12-18 2019-03-13 Ｔｏｗａ株式会社 電子部品の製造方法ならびに電子部品製造装置
JP6785735B2 (ja) * 2017-09-07 2020-11-18 Ｔｏｗａ株式会社 切断装置及び半導体パッケージの搬送方法
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
KR102066574B1 (ko) * 2019-06-13 2020-01-15 박세준 동관 절단기
JP7333741B2 (ja) * 2019-11-05 2023-08-25 株式会社ディスコ 加工装置
CN112901986B (zh) * 2020-12-09 2022-04-26 首都师范大学 一种虚拟现实视频播放装置
KR102888135B1 (ko) * 2021-03-18 2025-11-19 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
JP7744834B2 (ja) * 2022-01-13 2025-09-26 Ｔｏｗａ株式会社 加工装置、及び、加工品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1229010C (zh) * 2001-08-08 2005-11-23 松下电器产业株式会社 安装电子部件的设备和方法
JP3824914B2 (ja) * 2001-11-30 2006-09-20 Ｔｏｗａ株式会社 基板の切断方法
JP2003207455A (ja) * 2002-01-15 2003-07-25 Towa Corp パッケージの保持用治具
JP4162535B2 (ja) * 2003-05-09 2008-10-08 Ｔｏｗａ株式会社 封止済基板の切断方法及び装置
JP5285217B2 (ja) 2006-11-27 2013-09-11 Ｔｏｗａ株式会社 電子部品の製造装置及び製造方法
JP5215556B2 (ja) * 2006-12-20 2013-06-19 Ｔｏｗａ株式会社 電子部品製造用の個片化装置
TWM321029U (en) * 2007-02-16 2007-10-21 Gallant Prec Machining Co Ltd Chip tray feeder
JP5192790B2 (ja) * 2007-11-28 2013-05-08 Ｔｏｗａ株式会社 基板の切断方法及び装置
JP5108481B2 (ja) * 2007-11-30 2012-12-26 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
JP5511154B2 (ja) * 2008-06-13 2014-06-04 Ｔｏｗａ株式会社 電子部品製造用の個片化装置及び個片化方法
SG183593A1 (en) * 2011-03-02 2012-09-27 Rokko Systems Pte Ltd Improved system for substrate processing
JP5947010B2 (ja) * 2011-09-15 2016-07-06 株式会社ディスコ 分割装置

Also Published As

Publication number Publication date
TW201540456A (zh) 2015-11-01
CN104952767B (zh) 2018-05-22
CN104952767A (zh) 2015-09-30
KR101659686B1 (ko) 2016-09-26
JP2015188024A (ja) 2015-10-29
KR20150112799A (ko) 2015-10-07
TWI613056B (zh) 2018-02-01

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