TWI575617B - An electronic component, an electronic component manufacturing method, and an electronic component manufacturing apparatus - Google Patents

An electronic component, an electronic component manufacturing method, and an electronic component manufacturing apparatus Download PDF

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Publication number
TWI575617B
TWI575617B TW104136866A TW104136866A TWI575617B TW I575617 B TWI575617 B TW I575617B TW 104136866 A TW104136866 A TW 104136866A TW 104136866 A TW104136866 A TW 104136866A TW I575617 B TWI575617 B TW I575617B
Authority
TW
Taiwan
Prior art keywords
electronic component
plate
mold
conductor
shaped member
Prior art date
Application number
TW104136866A
Other languages
English (en)
Chinese (zh)
Other versions
TW201620050A (zh
Inventor
Shin Takeuchi
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201620050A publication Critical patent/TW201620050A/zh
Application granted granted Critical
Publication of TWI575617B publication Critical patent/TWI575617B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B29C2043/182—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated completely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW104136866A 2014-11-28 2015-11-09 An electronic component, an electronic component manufacturing method, and an electronic component manufacturing apparatus TWI575617B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014242572A JP6444707B2 (ja) 2014-11-28 2014-11-28 電子部品、その製造方法及び製造装置

Publications (2)

Publication Number Publication Date
TW201620050A TW201620050A (zh) 2016-06-01
TWI575617B true TWI575617B (zh) 2017-03-21

Family

ID=56089650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104136866A TWI575617B (zh) 2014-11-28 2015-11-09 An electronic component, an electronic component manufacturing method, and an electronic component manufacturing apparatus

Country Status (4)

Country Link
JP (1) JP6444707B2 (ja)
KR (1) KR101847691B1 (ja)
CN (1) CN105643855B (ja)
TW (1) TWI575617B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106003385B (zh) * 2016-07-12 2018-09-11 苏州宏泉高压电容器有限公司 一种高压陶瓷电容器瓷介质芯片成型用冲压模具
JP6672113B2 (ja) * 2016-09-09 2020-03-25 Ｔｏｗａ株式会社 電子回路装置及び電子回路装置の製造方法
JP2018113399A (ja) * 2017-01-13 2018-07-19 Ｔｏｗａ株式会社 回路部品の製造方法および回路部品
TWI667745B (zh) * 2018-02-05 2019-08-01 南茂科技股份有限公司 半導體封裝結構
TWI655891B (zh) * 2018-03-08 2019-04-01 綠點高新科技股份有限公司 電子模組及其製造方法及電子裝置的殼體及其製造方法
US11239179B2 (en) 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
JP6802314B2 (ja) * 2018-11-28 2020-12-16 宗哲 蔡 半導体パッケージ及びその製造方法
TWI744572B (zh) 2018-11-28 2021-11-01 蔡憲聰 具有封裝內隔室屏蔽的半導體封裝及其製作方法
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
CN112750796A (zh) 2019-10-30 2021-05-04 新光电气工业株式会社 半导体装置以及半导体装置的制造方法
EP4184566A1 (en) * 2021-11-19 2023-05-24 Nexperia B.V. A semiconductor device and a method of manufacturing such semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201334873A (zh) * 2012-02-28 2013-09-01 Towa Corp 樹脂密封用材料及其製造方法
TW201405677A (zh) * 2012-07-17 2014-02-01 Nitto Denko Corp 半導體裝置之製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580167B1 (en) * 2001-04-20 2003-06-17 Amkor Technology, Inc. Heat spreader with spring IC package
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP4519398B2 (ja) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 樹脂封止方法及び半導体装置の製造方法
WO2008093414A1 (ja) * 2007-01-31 2008-08-07 Fujitsu Microelectronics Limited 半導体装置及びその製造方法
JP2009094095A (ja) * 2007-10-03 2009-04-30 Sharp Corp マルチチップモジュール
JP5248918B2 (ja) 2008-05-28 2013-07-31 新光電気工業株式会社 電子部品装置及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201334873A (zh) * 2012-02-28 2013-09-01 Towa Corp 樹脂密封用材料及其製造方法
TW201405677A (zh) * 2012-07-17 2014-02-01 Nitto Denko Corp 半導體裝置之製造方法

Also Published As

Publication number Publication date
JP6444707B2 (ja) 2018-12-26
JP2016103616A (ja) 2016-06-02
KR20160064970A (ko) 2016-06-08
CN105643855B (zh) 2018-09-18
KR101847691B1 (ko) 2018-04-10
CN105643855A (zh) 2016-06-08
TW201620050A (zh) 2016-06-01

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