CN106003385B - 一种高压陶瓷电容器瓷介质芯片成型用冲压模具 - Google Patents
一种高压陶瓷电容器瓷介质芯片成型用冲压模具 Download PDFInfo
- Publication number
- CN106003385B CN106003385B CN201610545260.6A CN201610545260A CN106003385B CN 106003385 B CN106003385 B CN 106003385B CN 201610545260 A CN201610545260 A CN 201610545260A CN 106003385 B CN106003385 B CN 106003385B
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- Prior art keywords
- disk
- annulus
- dielectric chip
- ceramic dielectric
- protrusion
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- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 24
- 238000000465 moulding Methods 0.000 title claims abstract description 16
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 238000000748 compression moulding Methods 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims 1
- 208000037656 Respiratory Sounds Diseases 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/0097—Press moulds; Press-mould and press-ram assemblies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/0002—Auxiliary parts or elements of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/10—Moulds with means incorporated therein, or carried thereby, for ejecting or detaching the moulded article
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610545260.6A CN106003385B (zh) | 2016-07-12 | 2016-07-12 | 一种高压陶瓷电容器瓷介质芯片成型用冲压模具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610545260.6A CN106003385B (zh) | 2016-07-12 | 2016-07-12 | 一种高压陶瓷电容器瓷介质芯片成型用冲压模具 |
Publications (2)
Publication Number | Publication Date |
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CN106003385A CN106003385A (zh) | 2016-10-12 |
CN106003385B true CN106003385B (zh) | 2018-09-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610545260.6A Active CN106003385B (zh) | 2016-07-12 | 2016-07-12 | 一种高压陶瓷电容器瓷介质芯片成型用冲压模具 |
Country Status (1)
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CN (1) | CN106003385B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108638299A (zh) * | 2018-05-11 | 2018-10-12 | 苏州宏泉高压电容器有限公司 | 一种陶瓷电容器瓷介质芯片成型用冲压模具 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001155957A (ja) * | 1999-04-30 | 2001-06-08 | Matsushita Electric Ind Co Ltd | 電子部品 |
CN102637650A (zh) * | 2011-02-09 | 2012-08-15 | 富士通株式会社 | 半导体装置及其制造方法以及电源 |
CN103258770A (zh) * | 2012-02-17 | 2013-08-21 | 富士通株式会社 | 制造半导体装置的方法和制造电子装置的方法 |
CN105583944A (zh) * | 2016-02-19 | 2016-05-18 | 福州欣翔威电子科技有限公司 | 陶瓷电容器干压设备 |
CN105643855A (zh) * | 2014-11-28 | 2016-06-08 | 东和株式会社 | 电子部件、其制造方法及制造装置 |
CN206011375U (zh) * | 2016-07-12 | 2017-03-15 | 苏州宏泉高压电容器有限公司 | 一种高压陶瓷电容器瓷介质芯片成型用冲压模具 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW491472U (en) * | 2001-04-20 | 2002-06-11 | Schmidt Scient Taiwan Ltd | Automatic silver-wetting machine |
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2016
- 2016-07-12 CN CN201610545260.6A patent/CN106003385B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001155957A (ja) * | 1999-04-30 | 2001-06-08 | Matsushita Electric Ind Co Ltd | 電子部品 |
CN102637650A (zh) * | 2011-02-09 | 2012-08-15 | 富士通株式会社 | 半导体装置及其制造方法以及电源 |
CN103258770A (zh) * | 2012-02-17 | 2013-08-21 | 富士通株式会社 | 制造半导体装置的方法和制造电子装置的方法 |
CN105643855A (zh) * | 2014-11-28 | 2016-06-08 | 东和株式会社 | 电子部件、其制造方法及制造装置 |
CN105583944A (zh) * | 2016-02-19 | 2016-05-18 | 福州欣翔威电子科技有限公司 | 陶瓷电容器干压设备 |
CN206011375U (zh) * | 2016-07-12 | 2017-03-15 | 苏州宏泉高压电容器有限公司 | 一种高压陶瓷电容器瓷介质芯片成型用冲压模具 |
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CN106003385A (zh) | 2016-10-12 |
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Effective date of registration: 20240409 Address after: Room 201, Building 2, No. 2 Jianmin Second Road, Chashan Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN XINLANG HARDWARE & PLASTIC PRODUCTS CO.,LTD. Country or region after: China Address before: 215200 South Side of Quanhai Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU HONGQUAN HIGH VOLTAGE CAPACITOR Co.,Ltd. Country or region before: China |
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