TWI574105B - An alkali developing type photosensitive resin composition, a dry film and a cured product, and a printed circuit board - Google Patents

An alkali developing type photosensitive resin composition, a dry film and a cured product, and a printed circuit board Download PDF

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Publication number
TWI574105B
TWI574105B TW103109910A TW103109910A TWI574105B TW I574105 B TWI574105 B TW I574105B TW 103109910 A TW103109910 A TW 103109910A TW 103109910 A TW103109910 A TW 103109910A TW I574105 B TWI574105 B TW I574105B
Authority
TW
Taiwan
Prior art keywords
alkali
resin composition
photosensitive resin
resin
developable photosensitive
Prior art date
Application number
TW103109910A
Other languages
English (en)
Chinese (zh)
Other versions
TW201530252A (zh
Inventor
Mamoru Yonemoto
Guobin Pu
Original Assignee
Taiyo Ink (Suzhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink (Suzhou) Co Ltd filed Critical Taiyo Ink (Suzhou) Co Ltd
Publication of TW201530252A publication Critical patent/TW201530252A/zh
Application granted granted Critical
Publication of TWI574105B publication Critical patent/TWI574105B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW103109910A 2014-01-27 2014-03-17 An alkali developing type photosensitive resin composition, a dry film and a cured product, and a printed circuit board TWI574105B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410039780.0A CN104808436B (zh) 2014-01-27 2014-01-27 碱显影型感光性树脂组合物、干膜和固化物、以及印刷电路板

Publications (2)

Publication Number Publication Date
TW201530252A TW201530252A (zh) 2015-08-01
TWI574105B true TWI574105B (zh) 2017-03-11

Family

ID=53680713

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103109910A TWI574105B (zh) 2014-01-27 2014-03-17 An alkali developing type photosensitive resin composition, a dry film and a cured product, and a printed circuit board

Country Status (4)

Country Link
JP (1) JP6360900B2 (ja)
CN (1) CN104808436B (ja)
TW (1) TWI574105B (ja)
WO (1) WO2015109645A1 (ja)

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* Cited by examiner, † Cited by third party
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JP6295739B2 (ja) * 2014-03-11 2018-03-20 東洋インキＳｃホールディングス株式会社 フィルム状感光性樹脂組成物、感光性ドライフィルム、および感光性ドライフィルムの製造方法、並びに液状感光性樹脂組成物
CN107850847B (zh) * 2015-08-05 2021-04-13 太阳油墨制造株式会社 层叠结构体、干膜和柔性印刷电路板
JP6633425B2 (ja) * 2016-02-26 2020-01-22 東京応化工業株式会社 硬化性樹脂組成物
JP7072819B2 (ja) * 2016-09-15 2022-05-23 互応化学工業株式会社 感光性樹脂組成物及びプリント配線板
JP6789193B2 (ja) * 2017-08-09 2020-11-25 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP7101513B2 (ja) * 2018-03-28 2022-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
CN112708305A (zh) * 2020-12-17 2021-04-27 广州亦盛环保科技有限公司 一种油墨及其制备方法和应用
CN113204171A (zh) * 2021-04-12 2021-08-03 浙江福斯特新材料研究院有限公司 一种感光性树脂组合物
CN113156764B (zh) * 2021-04-20 2024-04-26 杭州福斯特电子材料有限公司 一种感光性树脂组合物及抗蚀剂层压体
CN114316671A (zh) * 2022-02-11 2022-04-12 江苏可信电子材料有限公司 一种高柔韧性的白色塞孔油墨及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW290569B (ja) * 1994-04-05 1996-11-11 Taiyo Ink Seisaku Kk
TW201124433A (en) * 2009-09-02 2011-07-16 Taiyo Ink Mfg Co Ltd Curable resin composition
JP2013134873A (ja) * 2011-12-26 2013-07-08 Stanley Electric Co Ltd 白熱電球、および、フィラメント

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JPS5936256B2 (ja) * 1977-12-21 1984-09-03 岡本化学工業株式会社 現像液組成物
JP3134037B2 (ja) * 1995-01-13 2001-02-13 太陽インキ製造株式会社 メラミンの有機酸塩を用いた熱硬化性もしくは光硬化性・熱硬化性コーティング組成物
JP2000250222A (ja) * 1999-02-26 2000-09-14 Hitachi Chem Co Ltd 着色画像形成用感光性フィルム及びこれを用いた着色画像の製造法
JP2001142201A (ja) * 1999-11-17 2001-05-25 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント及びカラーフィルターの製造法
JP2002040633A (ja) * 2000-07-24 2002-02-06 Toshiba Chem Corp ハロゲンフリーの感光性樹脂組成物
JP2003167349A (ja) * 2001-11-30 2003-06-13 Mitsubishi Paper Mills Ltd 平版印刷版の現像処理方法
JP2004004531A (ja) * 2002-01-30 2004-01-08 Sumitomo Chem Co Ltd 感光性樹脂組成物
JP2005232195A (ja) * 2004-02-05 2005-09-02 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物、及びその硬化塗膜
CN1680470A (zh) * 2004-04-09 2005-10-12 太阳油墨股份有限公司 固化性树脂组合物及其固化涂膜
JP4315919B2 (ja) * 2005-02-10 2009-08-19 ヘンケルジャパン株式会社 高濃度現像剤原液
CN100469843C (zh) * 2007-04-10 2009-03-18 深圳市容大电子材料有限公司 一种液态感光防焊油墨及其在电路板印制的应用
JP2009000520A (ja) * 2007-06-22 2009-01-08 Acushnet Co 多層ゴルフボール
JP5285257B2 (ja) * 2007-09-21 2013-09-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2010072340A (ja) * 2008-09-18 2010-04-02 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
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KR102056819B1 (ko) * 2012-04-27 2019-12-17 다이요 잉키 세이조 가부시키가이샤 광경화 열경화성 수지 조성물, 경화물 및 프린트 배선판

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW290569B (ja) * 1994-04-05 1996-11-11 Taiyo Ink Seisaku Kk
TW201124433A (en) * 2009-09-02 2011-07-16 Taiyo Ink Mfg Co Ltd Curable resin composition
JP2013134873A (ja) * 2011-12-26 2013-07-08 Stanley Electric Co Ltd 白熱電球、および、フィラメント

Also Published As

Publication number Publication date
TW201530252A (zh) 2015-08-01
JP2017506361A (ja) 2017-03-02
WO2015109645A1 (zh) 2015-07-30
CN104808436A (zh) 2015-07-29
CN104808436B (zh) 2017-11-24
JP6360900B2 (ja) 2018-07-18

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