TWI570825B - 利用黏合劑層疊金屬薄板的半導體檢測板及其製造方法 - Google Patents

利用黏合劑層疊金屬薄板的半導體檢測板及其製造方法 Download PDF

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Publication number
TWI570825B
TWI570825B TW105119299A TW105119299A TWI570825B TW I570825 B TWI570825 B TW I570825B TW 105119299 A TW105119299 A TW 105119299A TW 105119299 A TW105119299 A TW 105119299A TW I570825 B TWI570825 B TW I570825B
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TW
Taiwan
Prior art keywords
thin plate
manufacturing
adhesive
semiconductor
binder
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TW105119299A
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English (en)
Chinese (zh)
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TW201639056A (zh
Inventor
尹璟燮
Original Assignee
硅谷股份公司
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Application filed by 硅谷股份公司 filed Critical 硅谷股份公司
Publication of TW201639056A publication Critical patent/TW201639056A/zh
Application granted granted Critical
Publication of TWI570825B publication Critical patent/TWI570825B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Laminated Bodies (AREA)
TW105119299A 2014-03-26 2015-02-13 利用黏合劑層疊金屬薄板的半導體檢測板及其製造方法 TWI570825B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140035410A KR101435459B1 (ko) 2014-03-26 2014-03-26 접착제를 이용하여 금속 박판을 적층한 반도체 검사 패드 및 제조방법

Publications (2)

Publication Number Publication Date
TW201639056A TW201639056A (zh) 2016-11-01
TWI570825B true TWI570825B (zh) 2017-02-11

Family

ID=51751553

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104105118A TW201546923A (zh) 2014-03-26 2015-02-13 利用黏合劑層疊金屬薄板的半導體檢測板及其製造方法
TW105119299A TWI570825B (zh) 2014-03-26 2015-02-13 利用黏合劑層疊金屬薄板的半導體檢測板及其製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW104105118A TW201546923A (zh) 2014-03-26 2015-02-13 利用黏合劑層疊金屬薄板的半導體檢測板及其製造方法

Country Status (5)

Country Link
JP (1) JP2016536567A (ja)
KR (1) KR101435459B1 (ja)
CN (1) CN105122437A (ja)
TW (2) TW201546923A (ja)
WO (1) WO2015147438A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101435459B1 (ko) * 2014-03-26 2014-08-28 실리콘밸리(주) 접착제를 이용하여 금속 박판을 적층한 반도체 검사 패드 및 제조방법
WO2015076465A1 (ko) * 2013-11-22 2015-05-28 실리콘밸리(주) 금속 박판을 적층한 반도체 검사 패드 및 제조방법
CN114934290B (zh) * 2022-03-09 2024-01-30 氢克新能源技术(上海)有限公司 一种气体扩散层及其加工工艺
CN118146725B (zh) * 2024-04-30 2024-08-20 苏州微飞半导体有限公司 一种用于ic测试的垂直导电胶制作方法

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US6581276B2 (en) * 2000-04-04 2003-06-24 Amerasia International Technology, Inc. Fine-pitch flexible connector, and method for making same
US20090201038A1 (en) * 2008-02-11 2009-08-13 Knickerbocker John U Test head for functional wafer level testing, system and method therefor
WO2013058465A1 (ko) * 2011-10-19 2013-04-25 실리콘밸리(주) 반도체소자 테스트용 콘텍트 제조방법
TW201347054A (zh) * 2012-03-07 2013-11-16 Toray Industries 半導體裝置之製造方法及半導體裝置之製造裝置

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JPS61240511A (ja) * 1985-04-18 1986-10-25 松下電器産業株式会社 異方導電性接着剤シ−トの製造方法
JP3558298B2 (ja) * 1991-03-15 2004-08-25 ソニー株式会社 電極集合体、ｉｃソケット、ｉｃテスター、および電極集合体の製造方法
JPH06174750A (ja) * 1992-12-09 1994-06-24 Sharp Corp 液晶パネル検査用プローバー
JP2000243486A (ja) * 1999-02-17 2000-09-08 Jsr Corp 異方導電性シート
JP2001144414A (ja) * 1999-11-11 2001-05-25 Mitsui Mining & Smelting Co Ltd プリントサーキットボードの製造方法
CN100536231C (zh) * 2002-03-20 2009-09-02 日本压着端子制造株式会社 各向异性导电片及其制造方法
EP1487057A4 (en) * 2002-03-20 2006-08-16 J S T Mfg Co Ltd Anisotropic Conductive Sheet Material And Method Of Making It
EP1487055A4 (en) * 2002-03-20 2006-08-16 J S T Mfg Co Ltd ANISOTROPIC CONDUCTIVE SHEET AND METHOD OF MANUFACTURING THE SAME
KR100775742B1 (ko) * 2005-08-29 2007-11-09 김용욱 키탑패드의 제조방법 및 키탑패드
KR100772454B1 (ko) * 2006-04-24 2007-11-01 엘지전자 주식회사 이방성 도전 필름 및 그 제조방법
TWI377624B (en) * 2008-05-13 2012-11-21 Ind Tech Res Inst Conducting film structure, fabrication method thereof, and conducting film type probe device for ic
CN101383256B (zh) * 2008-10-23 2011-09-28 上海交通大学 大长径比侧壁电极及其制造方法
KR20100060272A (ko) * 2008-11-27 2010-06-07 (주)보람하이테크 단방향 도전성 시트 및 그 제조 방법
KR101055502B1 (ko) * 2009-12-24 2011-08-08 삼성전기주식회사 금속회로기판 및 그 제조방법
WO2015076465A1 (ko) * 2013-11-22 2015-05-28 실리콘밸리(주) 금속 박판을 적층한 반도체 검사 패드 및 제조방법
KR101374770B1 (ko) * 2013-11-22 2014-03-17 실리콘밸리(주) 금속 박판의 적층을 이용한 반도체 검사 패드 및 제조방법
KR101435459B1 (ko) * 2014-03-26 2014-08-28 실리콘밸리(주) 접착제를 이용하여 금속 박판을 적층한 반도체 검사 패드 및 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6581276B2 (en) * 2000-04-04 2003-06-24 Amerasia International Technology, Inc. Fine-pitch flexible connector, and method for making same
US20090201038A1 (en) * 2008-02-11 2009-08-13 Knickerbocker John U Test head for functional wafer level testing, system and method therefor
WO2013058465A1 (ko) * 2011-10-19 2013-04-25 실리콘밸리(주) 반도체소자 테스트용 콘텍트 제조방법
TW201347054A (zh) * 2012-03-07 2013-11-16 Toray Industries 半導體裝置之製造方法及半導體裝置之製造裝置

Also Published As

Publication number Publication date
TW201546923A (zh) 2015-12-16
TW201639056A (zh) 2016-11-01
KR101435459B1 (ko) 2014-08-28
CN105122437A (zh) 2015-12-02
JP2016536567A (ja) 2016-11-24
WO2015147438A1 (ko) 2015-10-01

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