TWI561608B - - Google Patents
Info
- Publication number
- TWI561608B TWI561608B TW101143970A TW101143970A TWI561608B TW I561608 B TWI561608 B TW I561608B TW 101143970 A TW101143970 A TW 101143970A TW 101143970 A TW101143970 A TW 101143970A TW I561608 B TWI561608 B TW I561608B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011256252 | 2011-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201339279A TW201339279A (zh) | 2013-10-01 |
TWI561608B true TWI561608B (zh) | 2016-12-11 |
Family
ID=48469887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101143970A TW201339279A (zh) | 2011-11-24 | 2012-11-23 | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9318243B2 (zh) |
EP (1) | EP2785158B1 (zh) |
JP (1) | JP6295080B2 (zh) |
KR (1) | KR101608295B1 (zh) |
CN (1) | CN103947305B (zh) |
TW (1) | TW201339279A (zh) |
WO (1) | WO2013077448A1 (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401205B (zh) * | 2008-01-31 | 2013-07-11 | Ind Tech Res Inst | 利用光熱效應製作應用基板的方法 |
US9236162B2 (en) * | 2012-04-26 | 2016-01-12 | Osaka University | Transparent conductive ink and transparent conductive pattern forming method |
JP5275498B1 (ja) * | 2012-07-03 | 2013-08-28 | 石原薬品株式会社 | 導電膜形成方法及び焼結進行剤 |
JP5897437B2 (ja) * | 2012-09-14 | 2016-03-30 | 富士フイルム株式会社 | 導電層の製造方法、プリント配線基板 |
JP2014067617A (ja) * | 2012-09-26 | 2014-04-17 | Fujifilm Corp | 導電膜の製造方法および導電膜形成用組成物 |
US10622244B2 (en) | 2013-02-18 | 2020-04-14 | Orbotech Ltd. | Pulsed-mode direct-write laser metallization |
JP5700864B2 (ja) * | 2013-05-15 | 2015-04-15 | 石原ケミカル株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
EP3026677B1 (en) * | 2013-07-23 | 2018-04-11 | Asahi Kasei Kabushiki Kaisha | Copper and/or copper oxide dispersion, and method for electroconductive film using dispersion |
US10537027B2 (en) | 2013-08-02 | 2020-01-14 | Orbotech Ltd. | Method producing a conductive path on a substrate |
JP2015046369A (ja) * | 2013-08-29 | 2015-03-12 | 富士フイルム株式会社 | 導電膜の製造方法および導電膜 |
JP2015050107A (ja) * | 2013-09-03 | 2015-03-16 | 富士フイルム株式会社 | 導電膜の製造方法 |
EP3064556B1 (en) * | 2013-10-31 | 2019-10-02 | Showa Denko K.K. | Electrically conductive composition for thin film printing, and method for forming thin film conductive pattern |
JP6071913B2 (ja) * | 2014-01-30 | 2017-02-01 | 富士フイルム株式会社 | インクジェット用導電インク組成物 |
JP6092134B2 (ja) * | 2014-01-30 | 2017-03-08 | 富士フイルム株式会社 | 有機薄膜トランジスタの製造方法 |
US10091875B2 (en) | 2014-04-01 | 2018-10-02 | Korea Electronics Technology Institute | Ink composition for light sintering, wiring board using same and manufacturing method therefor |
KR102084575B1 (ko) * | 2014-12-23 | 2020-03-05 | 전자부품연구원 | 광 소결용 잉크 조성물 및 그를 이용한 배선기판의 제조 방법 |
IL247946B (en) * | 2014-04-10 | 2022-08-01 | Orbotech Ltd | Metallization using direct writing with a pulsed laser |
JP6574553B2 (ja) * | 2014-06-26 | 2019-09-11 | 昭和電工株式会社 | 導電パターン形成用組成物および導電パターン形成方法 |
KR101698159B1 (ko) | 2014-08-04 | 2017-01-19 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체 |
US9649730B2 (en) * | 2015-08-12 | 2017-05-16 | E I Du Pont De Nemours And Company | Paste and process for forming a solderable polyimide-based polymer thick film conductor |
US9637647B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a polymer thick film copper conductor composition |
US9637648B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a solderable polymer thick film copper conductor composition |
US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
EP3598461A4 (en) | 2017-03-16 | 2021-01-13 | Asahi Kasei Kabushiki Kaisha | DISPERSION, METHOD OF MANUFACTURING A STRUCTURE WITH CONDUCTIVE PATTERNS USING THE DISPERSION AND STRUCTURE WITH CONDUCTIVE PATTERNS |
KR102481993B1 (ko) * | 2017-04-07 | 2022-12-29 | 아주대학교산학협력단 | 도전입자의 미세 패터닝 방법 |
US11109492B2 (en) | 2017-07-18 | 2021-08-31 | Asahi Kasei Kabushiki Kaisha | Structure including electroconductive pattern regions, method for producing same, stack, method for producing same, and copper wiring |
KR102456821B1 (ko) * | 2017-07-27 | 2022-10-19 | 아사히 가세이 가부시키가이샤 | 산화구리 잉크 및 이것을 이용한 도전성 기판의 제조 방법, 도막을 포함하는 제품 및 이것을 이용한 제품의 제조 방법, 도전성 패턴을 갖는 제품의 제조 방법, 및 도전성 패턴을 갖는 제품 |
FR3074163B1 (fr) * | 2017-11-30 | 2019-10-25 | Mcve Technologie | Compose precurseur de pistes de circuits imprime, procede de fabrication de pistes de circuits imprime a partir de ce compose et support comportant de telles pistes de circuits imprime. |
JP7172224B2 (ja) | 2018-07-19 | 2022-11-16 | 昭和電工マテリアルズ株式会社 | 導体形成用組成物、及び、導体層を有する物品の製造方法 |
KR102213925B1 (ko) | 2019-10-31 | 2021-02-08 | (주)쎄미시스코 | 실리카 입자를 포함하는 광소결용 잉크 조성물 |
CN114716158A (zh) * | 2022-02-22 | 2022-07-08 | 上海沚明电子材料有限公司 | 导电玻璃基板及其制备方法、玻璃显示装置 |
CN116013580B (zh) * | 2023-01-05 | 2023-11-28 | 哈尔滨理工大学 | 一种用于功率半导体封装的自还原型铜烧结浆料及其制备方法和应用 |
Citations (2)
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JP2009283547A (ja) * | 2008-05-20 | 2009-12-03 | Dainippon Printing Co Ltd | 導電性パターンの形成方法とその形成装置並びに導電性基板 |
JP2010118449A (ja) * | 2008-11-12 | 2010-05-27 | Toray Ind Inc | 導電膜の製造方法 |
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US4072771A (en) * | 1975-11-28 | 1978-02-07 | Bala Electronics Corporation | Copper thick film conductor |
US5062891A (en) * | 1987-08-13 | 1991-11-05 | Ceramics Process Systems Corporation | Metallic inks for co-sintering process |
US20060159838A1 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Controlling ink migration during the formation of printable electronic features |
JP2004319781A (ja) | 2003-04-16 | 2004-11-11 | Shin Etsu Polymer Co Ltd | フレキシブルプリント基板およびその製造方法 |
JP2005071805A (ja) * | 2003-08-25 | 2005-03-17 | Fuji Photo Film Co Ltd | 金属酸化物及び/又は金属水酸化物の粒子と金属の粒子を含む組成物、組成物を用いたプリント配線基板、その製造方法及びそれに用いるインク |
JP5408878B2 (ja) | 2004-11-24 | 2014-02-05 | エヌシーシー ナノ, エルエルシー | ナノ材料組成物の電気的使用、めっき的使用および触媒的使用 |
JP2006173408A (ja) * | 2004-12-16 | 2006-06-29 | Catalysts & Chem Ind Co Ltd | 回路付基板の製造方法および該方法で得られた回路付基板 |
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JP5071105B2 (ja) * | 2005-03-11 | 2012-11-14 | 東洋インキScホールディングス株式会社 | 導電性インキ、導電回路、及び非接触型メディア |
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JP2008293821A (ja) * | 2007-05-25 | 2008-12-04 | Panasonic Corp | 導電性ペースト、それを用いた回路基板および電子電気機器 |
WO2009054343A1 (ja) * | 2007-10-22 | 2009-04-30 | Hitachi Chemical Company, Ltd. | 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液 |
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JP5286846B2 (ja) * | 2008-03-12 | 2013-09-11 | 日立化成株式会社 | 導電性基板及びその製造方法、並びに銅配線基板及びその製造方法 |
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WO2010044904A1 (en) * | 2008-10-17 | 2010-04-22 | Ncc Nano, Llc | Method for reducing thin films on low temperature substrates |
JP2011047003A (ja) * | 2009-08-27 | 2011-03-10 | Toray Ind Inc | 銅膜の製造方法 |
JP2011060654A (ja) * | 2009-09-11 | 2011-03-24 | Toyobo Co Ltd | 銅薄膜製造方法および銅薄膜 |
JP5747821B2 (ja) * | 2009-09-16 | 2015-07-15 | 日立化成株式会社 | 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物 |
JP2011142052A (ja) * | 2010-01-08 | 2011-07-21 | Hitachi Chem Co Ltd | 銅導体インク及び導電性基板及びその製造方法 |
TWI481326B (zh) * | 2011-11-24 | 2015-04-11 | Showa Denko Kk | A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating |
TWI569700B (zh) * | 2011-11-25 | 2017-02-01 | 昭和電工股份有限公司 | 導電性圖案生成方法 |
-
2012
- 2012-11-23 TW TW101143970A patent/TW201339279A/zh unknown
- 2012-11-26 JP JP2013545983A patent/JP6295080B2/ja active Active
- 2012-11-26 CN CN201280057724.9A patent/CN103947305B/zh active Active
- 2012-11-26 KR KR1020147013104A patent/KR101608295B1/ko active IP Right Grant
- 2012-11-26 US US14/359,958 patent/US9318243B2/en active Active
- 2012-11-26 WO PCT/JP2012/080468 patent/WO2013077448A1/ja active Application Filing
- 2012-11-26 EP EP12851695.2A patent/EP2785158B1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009283547A (ja) * | 2008-05-20 | 2009-12-03 | Dainippon Printing Co Ltd | 導電性パターンの形成方法とその形成装置並びに導電性基板 |
JP2010118449A (ja) * | 2008-11-12 | 2010-05-27 | Toray Ind Inc | 導電膜の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201339279A (zh) | 2013-10-01 |
EP2785158A1 (en) | 2014-10-01 |
US20150024120A1 (en) | 2015-01-22 |
EP2785158A4 (en) | 2015-04-29 |
CN103947305A (zh) | 2014-07-23 |
US9318243B2 (en) | 2016-04-19 |
CN103947305B (zh) | 2017-03-08 |
KR101608295B1 (ko) | 2016-04-04 |
WO2013077448A1 (ja) | 2013-05-30 |
KR20140082810A (ko) | 2014-07-02 |
JPWO2013077448A1 (ja) | 2015-04-27 |
EP2785158B1 (en) | 2016-09-28 |
JP6295080B2 (ja) | 2018-03-14 |