TWI560248B - Photosensitive conductive paste and method for manufacturing conductive pattern - Google Patents

Photosensitive conductive paste and method for manufacturing conductive pattern

Info

Publication number
TWI560248B
TWI560248B TW102109792A TW102109792A TWI560248B TW I560248 B TWI560248 B TW I560248B TW 102109792 A TW102109792 A TW 102109792A TW 102109792 A TW102109792 A TW 102109792A TW I560248 B TWI560248 B TW I560248B
Authority
TW
Taiwan
Prior art keywords
manufacturing
photosensitive
conductive pattern
conductive paste
paste
Prior art date
Application number
TW102109792A
Other languages
English (en)
Other versions
TW201348353A (zh
Inventor
Tsukuru Mizuguchi
Satoshi Matsuba
Kazutaka Kusano
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201348353A publication Critical patent/TW201348353A/zh
Application granted granted Critical
Publication of TWI560248B publication Critical patent/TWI560248B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Conductive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Electric Cables (AREA)
TW102109792A 2012-03-22 2013-03-20 Photosensitive conductive paste and method for manufacturing conductive pattern TWI560248B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012064946 2012-03-22

Publications (2)

Publication Number Publication Date
TW201348353A TW201348353A (zh) 2013-12-01
TWI560248B true TWI560248B (en) 2016-12-01

Family

ID=49222471

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102109792A TWI560248B (en) 2012-03-22 2013-03-20 Photosensitive conductive paste and method for manufacturing conductive pattern

Country Status (6)

Country Link
US (1) US9081278B2 (zh)
JP (1) JP5403187B1 (zh)
KR (1) KR101716722B1 (zh)
CN (1) CN104204946A (zh)
TW (1) TWI560248B (zh)
WO (1) WO2013141009A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9846361B2 (en) * 2012-11-13 2017-12-19 Toray Industries, Inc. Photosensitive conductive paste, multilayer substrate, method of producing conductive pattern, and electrostatic capacitance type touch panel
WO2016158864A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101031845A (zh) * 2004-08-06 2007-09-05 E.I.内穆尔杜邦公司 用在光图案化方法中的可水溶液显影的可光成像的组合物前体

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JPH1064333A (ja) 1996-08-21 1998-03-06 Taiyo Ink Mfg Ltd 導電性銅ペースト組成物及びそれを用いたプリント回路基板の製造方法
US6309502B1 (en) * 1997-08-19 2001-10-30 3M Innovative Properties Company Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
JP3947287B2 (ja) * 1997-12-27 2007-07-18 大日本印刷株式会社 感光性導体ペーストおよびこれを用いた転写シート
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AU2002361101A1 (en) 2002-12-26 2004-07-29 Taiyo Ink Mfg. Co., Ltd. Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same
JP4160449B2 (ja) 2003-06-06 2008-10-01 株式会社神戸製鋼所 自動探傷装置
JP2005240092A (ja) 2004-02-26 2005-09-08 Dowa Mining Co Ltd 銀粉およびその製造方法
JP4834665B2 (ja) * 2005-07-13 2011-12-14 太陽ホールディングス株式会社 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン
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US7887992B2 (en) * 2008-12-23 2011-02-15 E. I. Du Pont De Nemours And Company Photosensitive paste and process for production of pattern using the same
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WO2010113287A1 (ja) * 2009-03-31 2010-10-07 太陽インキ製造株式会社 感光性導電ペースト及び電極パターン
JP5533043B2 (ja) 2010-03-05 2014-06-25 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法
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KR20110136150A (ko) * 2010-06-14 2011-12-21 정승원 친환경적인 터치패널용 감광성 전극 페이스트 조성물
JP5278632B2 (ja) 2011-03-14 2013-09-04 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101031845A (zh) * 2004-08-06 2007-09-05 E.I.内穆尔杜邦公司 用在光图案化方法中的可水溶液显影的可光成像的组合物前体

Also Published As

Publication number Publication date
KR20140138722A (ko) 2014-12-04
JP5403187B1 (ja) 2014-01-29
WO2013141009A1 (ja) 2013-09-26
KR101716722B1 (ko) 2017-03-15
CN104204946A (zh) 2014-12-10
TW201348353A (zh) 2013-12-01
JPWO2013141009A1 (ja) 2015-08-03
US9081278B2 (en) 2015-07-14
US20150050586A1 (en) 2015-02-19

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