AU2002361101A1 - Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same - Google Patents

Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same

Info

Publication number
AU2002361101A1
AU2002361101A1 AU2002361101A AU2002361101A AU2002361101A1 AU 2002361101 A1 AU2002361101 A1 AU 2002361101A1 AU 2002361101 A AU2002361101 A AU 2002361101A AU 2002361101 A AU2002361101 A AU 2002361101A AU 2002361101 A1 AU2002361101 A1 AU 2002361101A1
Authority
AU
Australia
Prior art keywords
conductive composition
conductive
forming
same
circuit formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002361101A
Inventor
Kazunobu Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of AU2002361101A1 publication Critical patent/AU2002361101A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
AU2002361101A 2002-12-26 2002-12-26 Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same Abandoned AU2002361101A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/013638 WO2004061006A1 (en) 2002-12-26 2002-12-26 Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same

Publications (1)

Publication Number Publication Date
AU2002361101A1 true AU2002361101A1 (en) 2004-07-29

Family

ID=32697305

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002361101A Abandoned AU2002361101A1 (en) 2002-12-26 2002-12-26 Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same

Country Status (3)

Country Link
JP (1) JP4319625B2 (en)
AU (1) AU2002361101A1 (en)
WO (1) WO2004061006A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140267107A1 (en) 2013-03-15 2014-09-18 Sinovia Technologies Photoactive Transparent Conductive Films
US9081278B2 (en) 2012-03-22 2015-07-14 Toray Industries, Inc. Photosensitive conductive paste and method of producing conductive pattern
KR20140148400A (en) 2012-03-28 2014-12-31 도레이 카부시키가이샤 Photosensitive conductive paste and method for producing conductive pattern
KR101788100B1 (en) 2013-03-29 2017-10-19 도레이 카부시키가이샤 Conductive paste and method for producing conductive pattern
US20160118155A1 (en) 2013-06-27 2016-04-28 Toray Industries, Inc. Conductive paste, method of producing conductive pattern, and touch panel
JPWO2015122345A1 (en) 2014-02-12 2017-03-30 東レ株式会社 Conductive paste, pattern manufacturing method, conductive pattern manufacturing method, and sensor
JP7150208B1 (en) * 2021-04-23 2022-10-07 東京応化工業株式会社 Photocurable composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4159056B2 (en) * 1995-01-05 2008-10-01 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Aqueous developable photosensitive resistor composition for photolithography and method for forming thick film resistor
JPH09329891A (en) * 1996-06-12 1997-12-22 Nippon Kayaku Co Ltd Resin composition, its film and its cured matter
JP3947287B2 (en) * 1997-12-27 2007-07-18 大日本印刷株式会社 Photosensitive conductor paste and transfer sheet using the same
JP2000276945A (en) * 1999-03-25 2000-10-06 Murata Mfg Co Ltd Conductor paste and circuit board using it

Also Published As

Publication number Publication date
JP4319625B2 (en) 2009-08-26
JPWO2004061006A1 (en) 2006-05-11
WO2004061006A1 (en) 2004-07-22

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase