TWI551436B - A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like - Google Patents

A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like Download PDF

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Publication number
TWI551436B
TWI551436B TW102134254A TW102134254A TWI551436B TW I551436 B TWI551436 B TW I551436B TW 102134254 A TW102134254 A TW 102134254A TW 102134254 A TW102134254 A TW 102134254A TW I551436 B TWI551436 B TW I551436B
Authority
TW
Taiwan
Prior art keywords
metal foil
plate
shaped carrier
carrier
resin
Prior art date
Application number
TW102134254A
Other languages
English (en)
Chinese (zh)
Other versions
TW201434620A (zh
Inventor
Terumasa Moriyama
Michiya Kohiki
Masafumi Ishii
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201434620A publication Critical patent/TW201434620A/zh
Application granted granted Critical
Publication of TWI551436B publication Critical patent/TWI551436B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW102134254A 2012-09-24 2013-09-24 A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like TWI551436B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012210083 2012-09-24
JP2012218864 2012-09-28
JP2012222422 2012-10-04

Publications (2)

Publication Number Publication Date
TW201434620A TW201434620A (zh) 2014-09-16
TWI551436B true TWI551436B (zh) 2016-10-01

Family

ID=50341590

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102134254A TWI551436B (zh) 2012-09-24 2013-09-24 A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like

Country Status (5)

Country Link
JP (1) JP6096787B2 (ko)
KR (2) KR20170130640A (ko)
CN (1) CN104661810A (ko)
TW (1) TWI551436B (ko)
WO (1) WO2014046291A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6341644B2 (ja) * 2013-09-26 2018-06-13 フリージア・マクロス株式会社 キャリヤ付き金属箔および積層基板の製造方法
JP5826322B2 (ja) * 2014-03-25 2015-12-02 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
MY193192A (en) * 2014-06-03 2022-09-26 Mitsui Mining & Smelting Co Ltd Metal foil with releasing resin layer, and printed wiring board
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101683388B1 (ko) * 2015-07-28 2016-12-06 남두현 파스너 제조 시스템 및 방법 및 이것에 의해 제조된 파스너
JP6498091B2 (ja) * 2015-09-25 2019-04-10 Ｊｘ金属株式会社 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
KR102179165B1 (ko) 2017-11-28 2020-11-16 삼성전자주식회사 캐리어 기판 및 상기 캐리어 기판을 이용한 반도체 패키지의 제조방법
KR20210100589A (ko) 2018-12-14 2021-08-17 미츠비시 가스 가가쿠 가부시키가이샤 반도체 소자 탑재용 패키지 기판의 제조 방법
KR20210145776A (ko) 2019-03-22 2021-12-02 디엠씨 글로벌 아이엔씨. 변화하는 두께의 클래드 층을 갖는 클래딩된 물품

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201234937A (en) * 2011-02-10 2012-08-16 Freesia Macross Corp Metal foil with carrier and method for producing laminated substrate using same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
US6596391B2 (en) * 1997-05-14 2003-07-22 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
JP2003059749A (ja) * 2001-08-10 2003-02-28 Toyo Metallizing Co Ltd 電子部品用金属膜転写フィルム
JP4582436B2 (ja) * 2001-08-27 2010-11-17 Ｊｘ日鉱日石金属株式会社 水溶性樹脂キャリア付銅箔及び該銅箔を使用したプリント基板
JP2003200524A (ja) * 2001-12-28 2003-07-15 Furukawa Circuit Foil Kk 抵抗層内蔵型銅張り積層板、それを用いたプリント回路基板
US20040112516A1 (en) * 2002-12-13 2004-06-17 Metallized Products, Inc. Method and apparatus for electric-charge adhering of thin release-layered plastic firlms to thin copper foil substrates and the like and improved products thereby produced
JP2005045150A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP4805304B2 (ja) * 2008-05-12 2011-11-02 Ｊｘ日鉱日石金属株式会社 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201234937A (en) * 2011-02-10 2012-08-16 Freesia Macross Corp Metal foil with carrier and method for producing laminated substrate using same

Also Published As

Publication number Publication date
JPWO2014046291A1 (ja) 2016-08-18
WO2014046291A1 (ja) 2014-03-27
CN104661810A (zh) 2015-05-27
KR20170130640A (ko) 2017-11-28
TW201434620A (zh) 2014-09-16
KR20150063471A (ko) 2015-06-09
JP6096787B2 (ja) 2017-03-15

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