CN104661810A - 附载体金属箔、由树脂制板状载体与金属箔构成的积层体、以及它们的用途 - Google Patents

附载体金属箔、由树脂制板状载体与金属箔构成的积层体、以及它们的用途 Download PDF

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Publication number
CN104661810A
CN104661810A CN201380049551.0A CN201380049551A CN104661810A CN 104661810 A CN104661810 A CN 104661810A CN 201380049551 A CN201380049551 A CN 201380049551A CN 104661810 A CN104661810 A CN 104661810A
Authority
CN
China
Prior art keywords
metal forming
plate
shaped support
mentioned
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380049551.0A
Other languages
English (en)
Chinese (zh)
Inventor
森山晃正
古曳伦也
石井雅史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN104661810A publication Critical patent/CN104661810A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201380049551.0A 2012-09-24 2013-09-24 附载体金属箔、由树脂制板状载体与金属箔构成的积层体、以及它们的用途 Pending CN104661810A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012210083 2012-09-24
JP2012-210083 2012-09-24
JP2012218864 2012-09-28
JP2012-218864 2012-09-28
JP2012222422 2012-10-04
JP2012-222422 2012-10-04
PCT/JP2013/075779 WO2014046291A1 (ja) 2012-09-24 2013-09-24 キャリア付金属箔、樹脂製の板状キャリアと金属箔とからなる積層体、ならびにそれらの用途

Publications (1)

Publication Number Publication Date
CN104661810A true CN104661810A (zh) 2015-05-27

Family

ID=50341590

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380049551.0A Pending CN104661810A (zh) 2012-09-24 2013-09-24 附载体金属箔、由树脂制板状载体与金属箔构成的积层体、以及它们的用途

Country Status (5)

Country Link
JP (1) JP6096787B2 (ko)
KR (2) KR20150063471A (ko)
CN (1) CN104661810A (ko)
TW (1) TWI551436B (ko)
WO (1) WO2014046291A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104943255A (zh) * 2014-03-25 2015-09-30 Jx日矿日石金属株式会社 表面处理铜箔、覆铜积层板、印刷配线板、电子机器、半导体封装及印刷配线板的制造方法
CN107921749A (zh) * 2015-09-25 2018-04-17 Ｊｘ金属株式会社 表面处理金属箔、积层体、印刷配线板、半导体封装、电子机器及印刷配线板的制造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6341644B2 (ja) * 2013-09-26 2018-06-13 フリージア・マクロス株式会社 キャリヤ付き金属箔および積層基板の製造方法
JP5936794B2 (ja) * 2014-06-03 2016-06-22 三井金属鉱業株式会社 剥離樹脂層付金属箔及びプリント配線板
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101683388B1 (ko) * 2015-07-28 2016-12-06 남두현 파스너 제조 시스템 및 방법 및 이것에 의해 제조된 파스너
KR102179165B1 (ko) 2017-11-28 2020-11-16 삼성전자주식회사 캐리어 기판 및 상기 캐리어 기판을 이용한 반도체 패키지의 제조방법
US12119277B2 (en) 2018-12-14 2024-10-15 Mitsubishi Gas Chemical Company, Inc. Method for producing package substrate for mounting semiconductor device
EP3941675A1 (en) 2019-03-22 2022-01-26 DMC Global Inc. Cladded article with clad layer having varying thickness

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CN1578589A (zh) * 2003-07-25 2005-02-09 松下电器产业株式会社 中间连接用配线基材、多层配线基板以及其制造方法
JP2009272589A (ja) * 2008-05-12 2009-11-19 Nippon Mining & Metals Co Ltd キャリヤー付金属箔
CN101662892A (zh) * 2003-09-01 2010-03-03 古河电气工业株式会社 带有载体的极薄铜箔及其制造方法及布线板
CN102264540A (zh) * 2008-12-24 2011-11-30 吉坤日矿日石金属株式会社 带载体的金属箔
TW201234937A (en) * 2011-02-10 2012-08-16 Freesia Macross Corp Metal foil with carrier and method for producing laminated substrate using same

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JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
US6596391B2 (en) * 1997-05-14 2003-07-22 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
JP2003059749A (ja) * 2001-08-10 2003-02-28 Toyo Metallizing Co Ltd 電子部品用金属膜転写フィルム
JP4582436B2 (ja) * 2001-08-27 2010-11-17 Ｊｘ日鉱日石金属株式会社 水溶性樹脂キャリア付銅箔及び該銅箔を使用したプリント基板
JP2003200524A (ja) * 2001-12-28 2003-07-15 Furukawa Circuit Foil Kk 抵抗層内蔵型銅張り積層板、それを用いたプリント回路基板
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CN1578589A (zh) * 2003-07-25 2005-02-09 松下电器产业株式会社 中间连接用配线基材、多层配线基板以及其制造方法
CN101662892A (zh) * 2003-09-01 2010-03-03 古河电气工业株式会社 带有载体的极薄铜箔及其制造方法及布线板
JP2009272589A (ja) * 2008-05-12 2009-11-19 Nippon Mining & Metals Co Ltd キャリヤー付金属箔
CN102264540A (zh) * 2008-12-24 2011-11-30 吉坤日矿日石金属株式会社 带载体的金属箔
TW201234937A (en) * 2011-02-10 2012-08-16 Freesia Macross Corp Metal foil with carrier and method for producing laminated substrate using same

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祝大同: "《印制电路用覆铜箔层压板新技术》", 31 January 2006, 中国水利水电出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104943255A (zh) * 2014-03-25 2015-09-30 Jx日矿日石金属株式会社 表面处理铜箔、覆铜积层板、印刷配线板、电子机器、半导体封装及印刷配线板的制造方法
CN107921749A (zh) * 2015-09-25 2018-04-17 Ｊｘ金属株式会社 表面处理金属箔、积层体、印刷配线板、半导体封装、电子机器及印刷配线板的制造方法

Also Published As

Publication number Publication date
JPWO2014046291A1 (ja) 2016-08-18
KR20150063471A (ko) 2015-06-09
TWI551436B (zh) 2016-10-01
KR20170130640A (ko) 2017-11-28
WO2014046291A1 (ja) 2014-03-27
JP6096787B2 (ja) 2017-03-15
TW201434620A (zh) 2014-09-16

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Effective date of abandoning: 20210223

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