WO2014046291A1 - キャリア付金属箔、樹脂製の板状キャリアと金属箔とからなる積層体、ならびにそれらの用途 - Google Patents
キャリア付金属箔、樹脂製の板状キャリアと金属箔とからなる積層体、ならびにそれらの用途 Download PDFInfo
- Publication number
- WO2014046291A1 WO2014046291A1 PCT/JP2013/075779 JP2013075779W WO2014046291A1 WO 2014046291 A1 WO2014046291 A1 WO 2014046291A1 JP 2013075779 W JP2013075779 W JP 2013075779W WO 2014046291 A1 WO2014046291 A1 WO 2014046291A1
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- WIPO (PCT)
- Prior art keywords
- metal foil
- carrier
- plate
- laminate
- resin
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
Definitions
- the present invention relates to a metal foil with a carrier.
- the present invention relates to a laminate comprising a resin plate carrier and a metal foil that is easily and removably adhered to at least one surface of the carrier. More specifically, the present invention relates to a metal foil with a carrier or a laminate used in the production of a single-sided or two-layer multilayer laminate or an ultrathin coreless substrate used for a printed wiring board.
- a printed wiring board uses, as a basic constituent material, a dielectric material called “prepreg” obtained by impregnating a base material such as a synthetic resin plate, a glass plate, a glass nonwoven fabric, and paper with a synthetic resin. . Further, a sheet such as copper or copper alloy foil having electrical conductivity is bonded to the side facing the prepreg.
- the laminated body thus assembled is generally called a CCL (Copper Clad Laminate) material.
- the surface of the copper foil in contact with the prepreg is usually a mat surface in order to increase the bonding strength.
- a foil made of aluminum, nickel, zinc or the like may be used instead of the copper or copper alloy foil. Their thickness is about 5 to 200 ⁇ m. This commonly used CCL (Copper Clad Laminate) material is shown in FIG.
- Patent Document 1 proposes a metal foil with a carrier composed of a synthetic resin plate-shaped carrier and a metal foil that is mechanically peelably adhered to at least one surface of the carrier. Describes that it can be used for the assembly of printed wiring boards. It was shown that the peel strength between the plate-like carrier and the metal foil is preferably 1 gf / cm to 1 kgf / cm. According to the metal foil with a carrier, since the copper foil is supported over the entire surface by the synthetic resin, generation of wrinkles on the copper foil during lamination can be prevented. In addition, since the metal foil with carrier is in close contact with the synthetic resin without gaps, when the surface of the metal foil is plated or etched, it can be put into the chemical solution for plating or etching. .
- the linear expansion coefficient of the synthetic resin is at the same level as the copper foil that is a constituent material of the substrate and the prepreg after polymerization, the circuit is not misaligned, resulting in fewer defective products, It has the outstanding effect that a yield can be improved.
- the metal foil with carrier described in Patent Document 1 is an epoch-making invention that greatly contributes to the reduction of manufacturing cost by simplifying the manufacturing process of printed circuit boards and increasing the yield, but the peel strength between the plate-like carrier and the metal foil.
- a remarkable problem for the inventor is that the peel strength between the plate-like carrier and the metal foil becomes too high depending on the material of the plate-like carrier, and means for easily adjusting the peel strength is provided. It is desirable.
- the conventional metal foil with a carrier has a chemical solution at the interface between the plate-like carrier and the metal foil due to an external force applied at the time when the corner portion collides with another member during transportation or processing (during handling).
- an object of the present invention is to provide a metal foil with a carrier in which the peel strength between the resin-made plate-like carrier and the metal foil is adjusted, and the carrier and the metal foil in handling can be prevented from peeling off. .
- the present invention is as follows. (1) A laminate composed of a resin-made plate-like carrier and a metal foil that is detachably adhered to at least one surface of the carrier, A laminate in which the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil. (2) The laminate according to (1) is a metal foil with a carrier made of a resinous plate-like carrier and a metal foil that is peelably adhered to at least one surface of the carrier, A metal foil with a carrier in which at least a part of at least an end of the plate-like carrier is not covered with the metal foil when viewed in plan.
- the metal foil with a carrier according to (2) A metal foil with a carrier in which at least all of the end portions of the plate-like carrier are not covered with the metal foil when viewed in plan.
- the laminate according to (1) is a metal foil with a carrier made of a resin-made plate-like carrier and a metal foil that is peelably adhered to at least one surface of the carrier, The metal foil with a carrier whose area of the said metal foil is smaller than the area of the said plate-shaped carrier when planarly viewed.
- the ten-point average roughness (Rz jis) of the surface of the metal foil that is not in contact with the carrier is 0.4 ⁇ m or more and 10.0 ⁇ m or less, according to any one of (2) to (18) Metal foil with carrier.
- the mold release agent has the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- the mold release agent has the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by: M is any one of Al, Ti, Zr, n is 0 or 1 or 2, m is an integer from 1 to M valence, At least one of R 1 is an alkoxy group, where m + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr)
- the plate-like carrier and the metal foil are bonded together using a resin coating film composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluorine resin.
- the peel strength between the metal foil and the plate-shaped carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less (2) to (26)
- the laminate according to (1) is a laminate comprising a resin-made plate-like carrier and a metal foil that is peelably adhered to at least one surface of the carrier, A laminate in which the area of the metal foil is smaller than the area of the plate-like carrier when viewed in plan, and a part or all of the end side surface of the metal foil is covered with a resin.
- the laminate according to (1) is a laminate composed of a resin-made plate-like carrier and a metal foil that is detachably adhered to at least one surface of the carrier, When viewed in plan, the area of the metal foil is smaller than the area of the plate-shaped carrier, and a part or all of the end surface of the metal foil that is not in contact with the plate-shaped carrier is covered with resin.
- Laminated body (31) The laminate according to (29) or (30), which is a laminate comprising a resin-made plate-like carrier and a metal foil that is detachably adhered to at least one surface of the carrier. (32) The laminate according to any one of (29) to (31), wherein the peel strength between the plate-like carrier and the metal foil is 10 gf / cm or more and 200 gf / cm or less. (33) The laminate according to any one of (29) to (32), wherein the plate-like carrier has a polygonal shape when seen in a plan view. (34) The laminate according to (33), wherein at least one vertex of the plate-like carrier is not covered with the metal foil.
- the metal foil is smaller than the plate-shaped carrier, and at least a pair of opposite sides of the metal foil is shorter by 0.1 mm or more at each of both ends than the sides of the plate-shaped carrier corresponding to the side (29)
- the laminate according to any one of (38) to (38).
- the laminated body as described in.
- the mold release agent has the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- the mold release agent has the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by: M is any one of Al, Ti, Zr, n is 0 or 1 or 2, m is an integer from 1 to M valence, At least one of R 1 is an alkoxy group, where m + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr)
- a plate-like carrier and a metal foil are bonded together using a resin coating film composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluororesin
- the peel strength between the metal foil and the plate carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less (29) to (53)
- the laminated body in any one of.
- a metal foil with a carrier obtained by cutting the laminate according to any one of (29) to (55) on the metal foil of the laminate.
- the laminate according to (1) is a laminate composed of a resin-made plate-like carrier and a metal foil that is peelably adhered to two surfaces of the carrier, When viewed in plan, at least a part of the metal foil protrudes outside the end of the plate-like carrier, and at least a part of the portion where the metal foils are in contact with each other without the plate-like carrier interposed therebetween.
- the laminate according to (1) is a laminate composed of a resin-made plate-like carrier and a metal foil that is peelably adhered to two surfaces of the carrier, A laminate in which a laminated surface of the plate-like carrier is covered with the metal foil having an outer shape larger than that of the plate-like carrier, and a part of a portion where the metal foils are in contact with each other without a plate-like carrier is welded or bonded.
- the laminate according to (1) is a laminate composed of a resin-made plate-like carrier and a metal foil that is peelably adhered to two surfaces of the carrier, A laminate in which a laminated surface of the plate-like carrier is covered with the metal foil having an outer shape larger than that of the plate-like carrier, and outer peripheral portions of the metal foil are welded or bonded over the entire circumference.
- the laminate according to (1) is a laminate composed of a resin-made plate-like carrier and a metal foil that is detachably adhered to two surfaces of the carrier, A laminate in which a laminated surface of the plate-like carrier is covered with the metal foil having an outer shape larger than that of the plate-like carrier, and a portion where the metal foils are in contact with each other without a plate-like carrier is welded or bonded over the entire surface.
- (61) The laminate according to any one of (57) to (60), wherein the peel strength between the plate-like carrier and the metal foil is 10 gf / cm or more and 200 gf / cm or less.
- the laminate according to (1) is a laminate composed of a resin-made plate carrier and a metal foil that is peelably adhered to two surfaces of the carrier, When viewed from above, the metal foil is laminated on the plate-shaped carrier so that there is a portion where the metal foil is not in contact with the plate-shaped carrier on the outside of the plate-shaped carrier. Is a laminated body in which a part of the contact portion is welded or bonded without using a plate-like carrier.
- the laminate according to (1) is a laminate made of a resin-made plate-like carrier and a metal foil that is peelably adhered to two surfaces of the carrier, When viewed from above, the metal foil is laminated on the plate-shaped carrier so that there is a portion where the metal foil is not in contact with the plate-shaped carrier on the outside of the plate-shaped carrier. Is a laminated body in which a portion that is in contact with each other without a plate-like carrier is welded or bonded over the entire surface. (64) The laminate according to (62) or (63), wherein the peel strength between the plate-like carrier and the metal foil is 10 gf / cm or more and 200 gf / cm or less.
- the ratio (Sb / Sa) of the area (Sa) of the metal foil and the area (Sb) of the plate-like carrier when viewed in plan is 0.6 or more and less than 1.0 (57) to (64 ).
- the ratio (Sp / Sq) of the area (Sp) where the two metal foils are welded or bonded to the area (Sq) of the metal foil including the welded or bonded surface is 0.001.
- the mold release agent has the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- the mold release agent has the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by: M is any one of Al, Ti, Zr, n is 0 or 1 or 2, m is an integer from 1 to M valence, At least one of R 1 is an alkoxy group, where m + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr)
- the laminate according to (75) wherein the aluminate compound, titanate compound, zirconate compound, hydrolysis products thereof, and condensates of the hydrolysis products shown in the above are used singly or in combination.
- a plate-like carrier and a metal foil are bonded together using a resin coating film composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluororesin
- the peel strength between the metal foil and the plate-like carrier after heating at 220 ° C. for at least one of 3, 6 or 9 hours is 10 gf / cm or more and 200 gf / cm or less (57) to (79)
- the laminated body in any one of. (81) The laminate according to any one of (57) to (80), wherein the metal foil is a copper foil.
- a metal foil with a carrier obtained by cutting the laminate according to any one of (57) to (81) on the inner side of a portion where the metal foil is welded or bonded when viewed in plan.
- (83) Manufacture of a multilayer metal-clad laminate comprising laminating a resin on at least one metal foil side of the laminate according to (1) and then repeatedly laminating the resin or metal foil one or more times.
- a resin is laminated on at least one metal foil side of the laminate according to (1), and then a resin, a single-sided or double-sided metal-clad laminate, or a laminate according to (1), or (2) ⁇ (28), (56), metal foil with carrier according to any one of (82) or laminate according to any one of (29) to (55), (57) to (81)
- a method for producing a multilayer metal-clad laminate comprising laminating a body or metal foil one or more times.
- a resin is laminated on at least one metal foil side of the metal foil with a carrier according to any one of (2) to (28), and then the resin or the metal foil is repeatedly laminated one or more times.
- a method for producing a multilayer metal-clad laminate comprising: (86) A resin is laminated on the metal foil side of the metal foil with a carrier according to any one of (2) to (28), and then a resin, a single-sided or double-sided metal-clad laminate, and the laminate according to (1) Or a metal foil with a carrier according to any one of (2) to (28), (56), (82), or any one of (29) to (55), (57) to (81) A method for producing a multilayer metal-clad laminate comprising laminating a laminate or metal foil one or more times. (87) The method for producing a multilayer metal-clad laminate as described in any one of (83) to (86), wherein at least one of the resins is a prepreg.
- the method for producing a multilayer metal-clad laminate comprising the step of removing a part or all of the separated and separated metal foil by etching in the production method according to any one of (89) to (90).
- (92) A multilayer metal-clad laminate obtained by the production method according to any one of (83) to (91).
- (93) A method for manufacturing a buildup substrate, including a step of forming one or more buildup wiring layers on the metal foil side of the laminate according to (1).
- a resin is laminated on the metal foil side of the laminate according to (1), and then the resin, the single-sided or double-sided wiring board, the single-sided or double-sided metal-clad laminate, the laminate according to (1), (2 ) To (28), (56), a metal foil with a carrier according to any one of (82), a laminate according to any one of (29) to (55), (57) to (81), Or the manufacturing method of the buildup board
- the metal foil constituting the single-sided or double-sided wiring board the metal foil constituting the single-sided or double-sided metal-clad laminate, or the laminate
- substrate which further includes performing the process of forming wiring in at least one of the metal foil which comprises, metal foil which comprises metal foil with a carrier, metal foil which comprises a laminated body, and metal foil more than once.
- a metal foil is adhered to one side on the surface on which the wiring is formed.
- the metal foil is adhered to the carrier side, one side of the laminate according to (1) (2) to (28), (56 The step of laminating by contacting the carrier side of the metal foil with a carrier according to any one of the above) or the carrier side of the laminate according to any one of (29) to (55) in which the metal foil is in close contact with one side. Furthermore, the manufacturing method of the buildup board
- the laminate according to (1), and the metal foil is adhered to both sides (2) to ( 28), (56), (82) metal foil with a carrier according to any one of (29) to (55), (57) to (81) (99)
- substrate as described in (99) further including the process of making one metal foil of the laminated body contact, and laminating
- (102) The method for manufacturing a buildup substrate according to any one of (94) and (97) to (101), wherein at least one of the resins is a prepreg. (103)
- cutting is performed at a laminated surface of a plate-like carrier and a metal foil in at least one of the laminate or the laminate.
- a method for manufacturing a build-up wiring board including steps. (104) In the method for manufacturing a buildup substrate according to any one of (93) to (102), a step of peeling and separating the plate-like carrier and the metal foil in at least one of the laminated metal foils with a carrier The manufacturing method of the buildup wiring board which further contains. (105) The method for manufacturing a build-up wiring board according to (103) further includes a step of peeling and separating the laminate, the laminate, or the plate-like carrier of the metal foil with carrier and the metal foil after the cutting. Manufacturing method of build-up wiring board.
- the buildup wiring board further includes a step of removing a part or all of the metal foil adhered to the plate carrier by etching.
- Manufacturing method (7) A build-up wiring board obtained by the method according to (103) to (106).
- a method for producing a printed circuit board comprising a step of producing a build-up wiring board by the method according to (103) to (106).
- Resin is laminated on at least one metal foil side of the laminate according to any one of (29) to (55) and (57) to (81), and then the resin or metal foil is applied once.
- the manufacturing method of the multilayer metal-clad laminated board including repeatedly laminating above.
- a resin is laminated on the metal foil side of the laminate according to any one of (29) to (55) and (57) to (81), and then a resin, a single-sided or double-sided metal-clad laminate, or ( The laminate according to 1), or the metal foil with a carrier according to any one of (2) to (28), (56), (82), or (29) to (55), (57) to (81 ), Or a method for producing a multilayer metal-clad laminate comprising repeatedly laminating the metal foil one or more times. (111) The method for producing a multilayer metal-clad laminate according to any one of (109) and (110), wherein at least one of the resins is a prepreg.
- a method for manufacturing a buildup substrate including a step of forming one or more buildup wiring layers on the metal foil side of the laminate according to any one of (29) to (55) and (57) to (81) .
- a resin is laminated on the metal foil side of the laminate according to any one of (29) to (55) and (57) to (81), and then the resin, single-sided or double-sided wiring board, single-sided or double-sided metal A laminated laminate, or a laminate according to (1), or a laminate according to any of (29) to (55), (57) to (81), or (2) to (28), (56 ), (82) A metal foil with a carrier according to any one of the above, or a method for producing a build-up substrate, comprising repeatedly laminating the metal foil one or more times.
- a single-sided or double-sided wiring board In the method for manufacturing a buildup substrate according to (119), a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a laminate metal foil, a laminate plate-like carrier, a laminate metal foil, A laminate further comprising a step of making a hole in a plate-shaped carrier, metal foil, metal foil with a carrier, metal foil with a carrier, a plate-like carrier with a carrier, or resin, and conducting conductive plating on the side and bottom surfaces of the hole.
- Method for manufacturing an up board Method for manufacturing an up board.
- the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, or the laminate The manufacturing method of the buildup board
- substrate which further includes performing the process of forming wiring in at least one of the metal foil which comprises, metal foil which comprises a laminated body, metal foil which comprises metal foil with a carrier, and metal foil more than once .
- a metal foil is adhered to one surface on the surface on which the wiring is formed. Any one of (29) to (55), wherein the metal foil is adhered to the carrier side of the laminate according to (1) or one surface.
- the method further includes the step of laminating the carrier side of the metal foil with a carrier according to any one of (2) to (28) and (56), wherein the metal foil is adhered to one side of the carrier side of the laminate according to any one of the above.
- substrate as described in (121) which further includes the process of laminating
- (124) The method for manufacturing a buildup substrate according to any one of (119) to (123), wherein at least one of the resins is a prepreg.
- (125) In the method for manufacturing a build-up substrate according to any one of (117) to (124), cutting is performed at a laminated surface of a plate-like carrier and a metal foil in at least one of the laminate or the laminate.
- a method for manufacturing a build-up wiring board including steps.
- the present invention effectively reduces the peeling of both due to the external force generated by the collision with other members. Therefore, the handling property of the metal foil with carrier is improved, and the advantage that the productivity of the printed wiring board using the metal foil with carrier is improved is obtained.
- FIG. 1 An example of the configuration of CCL is shown.
- the structural example of the metal foil with a carrier which concerns on this invention is shown.
- the typical structural example when the metal foil with a carrier which concerns on this invention is planarly viewed is shown. It is the figure seen from the direction perpendicular
- the other typical structural example of the metal foil with a carrier which concerns on this invention is shown. It is the figure seen from the direction perpendicular
- the other typical structural example of the metal foil with a carrier which concerns on this invention is shown.
- the other typical structural example of the metal foil with a carrier which concerns on this invention is shown.
- FIG. 11 is a cross-sectional view taken along the line A-A ′ of the configuration example of FIG. 10.
- the other typical structural example of the laminated body which concerns on this invention is shown.
- the other typical structural example of the laminated body which concerns on this invention is shown.
- Another typical configuration example of the laminate according to the present invention will be shown.
- FIG. 15 is a F-F ′ cross-sectional view of the configuration example of FIG. 14. It is a schematic diagram explaining the manufacturing method of the laminated body which concerns on this invention.
- the typical structural example when the laminated body concerning this invention is planarly shown is shown.
- FIG. 18 is a cross-sectional view taken along the line A-A ′ of the configuration example of FIG. 17.
- the other typical structural example of the laminated body which concerns on this invention is shown.
- the assembly example of the multilayer CCL using the copper foil with a carrier which concerns on this invention (The form which copper foil joined to the single side
- the assembly example of the multilayer CCL using the copper foil with a carrier which concerns on this invention (The form which copper foil joined on both surfaces of the resin board) is shown.
- the present invention provides a laminate composed of a resin plate carrier and a metal foil that is detachably adhered to at least one surface of the carrier.
- This laminate is characterized in that the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil.
- the “laminated surface of the plate-like carrier and the metal foil” refers to a surface (contact surface) where the plate-like carrier and the metal foil come into contact with each other when the plate-like carrier and the metal foil are laminated.
- the metal foil is a laminate in which the metal foil is in close contact with only one side of the plate-like carrier
- “the one selected from the group of plate-like carrier and metal foil” includes the plate-like carrier and the metal foil.
- the “selected from the group of the plate-shaped carrier and metal foil” is adhered to the plate-shaped carrier and both sides thereof. Two metal foils are targeted.
- the said laminated body is metal foil with a carrier which consists of a resin-made plate-shaped carrier and the metal foil which adhered to at least one surface of this carrier so that peeling was possible.
- a metal foil with a carrier comprising a resin plate carrier and a metal foil which is detachably adhered to one or both sides, preferably both sides of the carrier, is prepared.
- FIGS. One structural example of the metal foil with a carrier according to the present invention is shown in FIGS.
- the metal foil with carrier 11 in which the metal foil 11a is detachably attached to both surfaces of a resin plate carrier 11c is shown at the beginning of FIG.
- the plate-like carrier 11c and the metal foil 11a are bonded together by using a layer made of a release agent or a release material 11b described later.
- 2, 20, and 21 are views when viewed from a direction perpendicular to the direction in which the plate-like carrier and the metal foil are overlapped. 2, 20, and 21, the length of contact between the plate-like carrier and the metal foil looks the same, but the metal foil with a carrier described in FIGS. 2, 20, and 21 is a plate
- the area of the laminated surface of the sheet carrier and the metal foil is smaller than the area of at least one of the plate carrier and the metal foil.
- the laminate is a laminate composed of a resin plate carrier and a metal foil that is detachably adhered to at least one surface of the carrier.
- the said laminated body is a laminated body which consists of a resin-made plate-shaped carrier and metal foil closely_contact
- this laminated body it is comprised from the resin-made plate-shaped carrier and the metal foil closely_contact
- Each metal foil with a carrier and a laminate are structurally similar to the CCL shown in FIG. 1, but in the present invention, the metal foil and the resin are finally separated and easily peeled off. It has a possible structure. In this respect, since the CCL is not peeled off, the structure and function are completely different.
- the metal foil with carrier used in the present invention, or the plate-like carrier and metal foil of the laminate must be peeled off, so it is inconvenient that the adhesiveness is excessively high, but the plate-like carrier and metal foil are Adhesiveness to such an extent that it does not peel off is necessary in a chemical treatment process such as plating performed in the printed circuit board manufacturing process.
- the peel strength between the metal foil and the plate-like carrier is preferably 10 gf / cm or more, more preferably 30 gf / cm or more, and even more preferably 50 gf / cm or more. Therefore, it is preferably 200 gf / cm or less, more preferably 150 gf / cm or less, and still more preferably 80 gf / cm or less.
- the adjustment of the peel strength for realizing such adhesion can be easily realized by using a layer or a release material made of a specific release agent, as will be described later. Adhesion is moderately reduced and the peel strength can be adjusted to the above-described range by laminating a layer or release material made of such a release agent between the plate-like carrier and the metal foil. Because.
- the metal foil with a carrier of the present embodiment has a structure in which the area of the metal foil is smaller than the area of the plate-like carrier when viewed in plan.
- a structure in which the area of the metal foil is smaller than the area of the plate-like carrier when viewed in plan.
- the metal foil when viewed in plan, at least a part of at least an end of the plate carrier, for example, the top of the plate carrier is covered with the metal foil as shown in FIG.
- a structure that is not known is mentioned.
- FIG. 3 and 4 show typical configuration examples of the metal foil with a carrier.
- FIG. 3 is a diagram when this configuration example is viewed in plan
- FIG. 4 is a diagram when the configuration example is viewed from a direction perpendicular to the direction in which the configuration example is superimposed.
- the plate-like carrier 121 and the metal foil 122 are bonded together to form the carrier-attached metal foil 120, but when the two are bonded together, the surface of the plate-like carrier 121 is not covered with the metal foil.
- An exposed portion 123 appears.
- the square vertex of the metal foil has a curved surface 124, and as a whole, the area of the metal foil 122 is smaller than the area of the plate-like carrier 121 when the metal foil with a carrier is viewed in plan view. That is, the metal foil is smaller than the plate carrier.
- the exposed portion not covered with the metal foil appears at at least one vertex of the plate-like carrier, two or more vertices are used from the viewpoint of reducing the frequency of collision with other members during handling. Is more preferable, and it is particularly preferable that it appears at every vertex as shown in FIG.
- the shape when the plate-like carrier is viewed in plan is a quadrangle, it may be a polygon other than this.
- a curved surface is given to the vertex of the metal foil has been shown, it may be a plane instead of the curved surface, and may be a polygon as a whole.
- FIG. 5 and 6 show other typical configuration examples of the metal foil with a carrier.
- FIG. 5 is a diagram when this configuration example is viewed in plan
- FIG. 6 is a direction perpendicular to the direction in which this configuration example is superimposed, and the difference in size between the plate-like carrier and the metal foil can be seen. It is the figure seen from the direction. 5 and 6, the plate-like carrier 131 and the metal foil 132 are bonded together to form the carrier-attached metal foil 130. When the two are bonded together, the surface of the plate-like carrier 131, the metal foil 132 is attached. Exposed portions 133 that are not covered with metal foil appear on both sides of the sheet.
- the edge (edge) of the plate-like carrier is defined as A (mm), and the edge (edge) covered with the metal foil of the plate-like carrier is used.
- B means the total length of the edge (edge) covered with the metal foil of the plate carrier (the total length of the edges of the four sides covered with the metal foil of the plate carrier).
- the metal foil 132 is smaller than the plate-shaped carrier 131, and at least a pair of opposite sides of the metal foil 132 is 0.1 mm at both ends compared to the sides of the plate-shaped carrier 131 corresponding to the side.
- the “corresponding side” is in contact with or closest to the side of interest (side C in FIG. 5) in the metal foil 132 when the plate-like carrier 131 and the metal foil 132 are bonded together. This refers to the side (side D in FIG. 5) of the plate-like carrier 131 to be performed.
- the width corresponding to the short side of the exposed portion 133 is sufficient if it is 0.1 mm or more, but is preferably 3 mm or more, more preferably 5 mm or more, more preferably 10 mm or more, more preferably 15 mm or more. More preferably, it is 20 mm or more, More preferably, it is 25 mm or more, More preferably, it is 30 mm or more.
- the exposed part 133 is the upper limit of the magnitude
- 3 to 6 show a mode in which the metal foil is bonded to only one side of the plate carrier, but the metal foil may be bonded to both sides.
- the square vertex of the metal foil 142 has a curved surface 144.
- the area of the metal foil 142 is larger than the area of the plate-like carrier 141 when the metal foil with carrier 140 is viewed in plan.
- the metal foil 142 is smaller than the plate-shaped carrier 141 which is smaller.
- At least a pair of opposing sides of the metal foil 142 is configured to be shorter by 0.1 mm or more at each of both ends than the sides of the plate-like carrier 141 corresponding to the sides, preferably 3 mm or more, more preferably It is 5 mm or more, more preferably 10 mm or more, more preferably 15 mm or more, more preferably 20 mm or more, more preferably 25 mm or more, more preferably 30 mm or more.
- the length of the side of interest in the metal foil 142 is assumed to be the length of the side, assuming a side obtained by projecting toward the corresponding side of the plate-like carrier 141. That is, in FIG. Also in FIG.
- the plate-like carrier 141 and the metal foil 142 are bonded together to constitute the carrier-attached metal foil 140, but when both are bonded, the surface of the plate-like carrier 141 is sandwiched between the metal foil 142. Exposed portions 143 that are not covered with metal foil appear on both sides.
- the square vertex of the plate-shaped carrier 141 may have a curved surface.
- the plate-shaped carrier 151 and the metal foil 152 are bonded together to form the carrier-attached metal foil 150, but when they are bonded together, the surface of the plate-shaped carrier 151 is formed around the metal foil 152.
- An exposed portion 153 that is not covered with foil appears. 8 shows a case where the pair of sides of the metal foil 132 is shorter than the corresponding side of the plate-like carrier 131 in FIG. 5, but the other pair of sides of the metal foil is also plate-like. A mode shorter than the corresponding side of the carrier is shown. In the configuration shown in FIG. 8, it is considered that the frequency of direct contact with the interface between the plate-like carrier and the metal foil can be reduced even if other members collide with the embodiment shown in FIG. Peeling between the inside plate-like carrier and the metal foil can be further reduced.
- the plate-shaped carrier 161 and the metal foil 162 are bonded to form the metal foil 160 with a carrier.
- the surface of the plate-shaped carrier 161 is a metal around the metal foil 162.
- An exposed portion 163 that is not covered with foil appears.
- the mode of FIG. 9 shows a mode in which the square corners of the metal foil 152 are dropped in FIG. Even with such a configuration, it is considered that the frequency of direct contact with the interface between the plate-like carrier and the metal foil can be reduced even if other members collide with each other, and as a result, the plate-like carrier and the metal foil being handled Can be reduced.
- the area of the plate-like carrier that is not covered with the metal foil, that is, the exposed portion has a diameter of 0 using a drill or the like.
- About 1 to 10 holes may be provided with a diameter of about 01 mm to 10 mm.
- Such a hole provided in the exposed portion can be used as a means for fixing a positioning pin or the like when manufacturing a multi-layer metal-clad laminate or a build-up board, which will be described later.
- the laminate of the present embodiment has a structure in which the area of the metal foil constituting the laminate is smaller than the area of the plate-like carrier constituting the laminate when viewed in plan.
- a structure when viewed in plan, at least a part of at least an end of the plate-like carrier, for example, a partial region of the plate-like carrier 321 as shown in FIG. The structure not covered with is mentioned.
- FIG. 10 and 11 show typical configuration examples of the laminate.
- FIG. 10 is a plan view of this configuration example
- FIG. 11 is a cross-sectional view taken along the line AA ′ of this configuration example.
- the plate-like carrier 321 and the metal foil 322 are bonded together to form a laminate 320 through a press as described later.
- the resin melts from the plate-like carrier 321.
- it rises along the end of the metal foil 322 and covers the side surface of the end of the metal foil 322 to form a skin covering layer 323.
- the metal foil 322 is smaller than the plate-like carrier 321, and at least a pair of opposite sides of the metal foil 322 is 0.1 mm at each of both ends compared to the sides of the plate-like carrier 321 corresponding to the side.
- the structure is shorter, preferably 3 mm or shorter, more preferably 5 mm or shorter, more preferably 10 mm or shorter, more preferably 15 mm or shorter, more preferably 20 mm or shorter, more preferably 25 mm or shorter, more Preferably, the configuration is shorter than 30 mm.
- the “corresponding side” refers to the side of interest (side C ′ in FIG. 10) in the metal foil 322 when the plate-like carrier 321 and the metal foil 322 are bonded together, or the most. It refers to the side of the adjacent plate-like carrier 321 (side D ′ in FIG. 10).
- FIG. 10 shows a case where the pair of sides of the metal foil 322 is shorter than the corresponding side of the plate-like carrier 321, but as shown in FIG. It is good also as an aspect shorter than each corresponding edge
- the A-A ′ cross section of the configuration example of FIG. 12 is also the same as that shown in FIG.
- the frequency of direct contact with the interface between the plate-like carrier and the metal foil can be reduced even if other members collide with each other, and as a result, the plate-like carrier and the metal foil during handling are peeled off. Can be reduced. Further, by covering the side surface of the metal foil so as not to be exposed, it is possible to prevent the chemical solution from entering the interface in the chemical solution processing step as described above, and to further reduce the peeling between the plate-like carrier and the metal foil. be able to. Further, in the configuration as shown in FIG. 12, it is considered that the frequency of direct contact with the interface between the plate-like carrier and the metal foil can be reduced even when other members collide with the embodiment shown in FIG. As a result, peeling between the plate-like carrier and the metal foil during handling can be further reduced.
- At least a pair of opposing sides of the metal foil before covering with resin is shorter than each side of the plate carrier corresponding to the side by 0.1 mm or more.
- it is preferably 3 mm or shorter, more preferably 5 mm or shorter, more preferably 10 mm or shorter, more preferably 15 mm or shorter, more preferably 20 mm or shorter, more preferably 25 mm or shorter, more preferably Shorter than 30 mm.
- the longer the length the smaller the metal foil.
- it is not preferable that the metal foil is too small from the viewpoint of securing the adhesion between the plate-like carrier and the metal foil.
- the ratio (Sa / Sb) of the area (Sa) of the metal foil and the area (Sb) of the plate carrier when viewed in plan is 0.7 or more, preferably 0.8.
- the size of the metal foil is preferably set so as to be 8 or more.
- the square vertex of the metal foil 342 has a curved surface 344, and as a whole, the area of the metal foil 342 is larger than the area of the plate-like carrier 341 when the metal foil with carrier 340 is viewed in plan.
- the metal foil 342 is smaller than the plate-like carrier 341 which is smaller.
- at least a pair of opposing sides of the metal foil 342 is configured to be shorter by 0.1 mm or more at both ends than the sides of the plate-like carrier 341 corresponding to the sides. In the case of FIG.
- the length of the side of interest in the metal foil 342 is assumed to be the length of the side obtained by imagining the side obtained by projecting toward the corresponding side of the plate-like carrier 341. That is, in FIG. 13, it indicates the same length as the side E ′.
- the cross section AA ′ in the configuration example of FIG. 13 is also the same as that shown in FIG.
- FIG. 14 is a plan view of this configuration example
- FIG. 15 is a cross-sectional view taken along the line FF ′ of this configuration example. 14 and 15, the plate-like carrier 351 and the metal foil 352 are bonded together to form a laminated plate 350 through a press as described later. When this press is performed, the resin melts from the plate-like carrier 351.
- the shape when the plate-like carrier is viewed in plan is a quadrangle, it may be a polygon other than this, or may be another shape such as a circle or an ellipse.
- a curved surface is given to the vertex of the metal foil has been shown, it may be a plane instead of the curved surface, and may be a polygon as a whole.
- a diameter of 0.01 mm is used by using a drill or the like in the region not covered with the metal foil of the plate-like carrier, that is, the exposed portion.
- About 1 to 10 holes may be provided with a diameter of about 10 mm.
- Such a hole provided in the exposed portion can be used as a means for fixing a positioning pin or the like when manufacturing a multi-layer metal-clad laminate or a build-up board, which will be described later.
- the laminated body 320, 330, 340, 350 as shown in FIGS. 10 to 15 is cut at the metal foil on the laminated body, for example, at the cut line B, thereby obtaining a metal foil with a carrier. It is done. Or after laminating a wiring layer, a resin, a build-up layer, etc. on the laminate as described later, by cutting at the metal foil on this laminate, a multilayer metal-clad laminate or It will be in the state by which the metal foil with a carrier was formed in the outermost surface of a buildup board
- the laminate of the present embodiment when viewed in plan, at least a part of the metal foil protrudes outside the end of the plate-like carrier, and the metal foils are sandwiched by the plate-like carrier at the protruding portion. At least a part of the contact portion is welded or bonded.
- FIG. 17 and 18 show typical configuration examples of the laminate.
- FIG. 17 is a plan view of this configuration example
- FIG. 18 is a cross-sectional view taken along the line AA ′ of this configuration example.
- the plate-like carrier 221 and the metal foil 222 are bonded together, and two metal foils 222 are welded or bonded to the outside of the plate-like carrier 21 when viewed in plan, thereby forming a laminate 220.
- the laminated surface of the plate-like carrier 221 is covered with a metal foil 222 having an outer shape larger than that of the plate-like carrier, for example, a large area, and when viewed in plan, the metal foil is outside the plate-like carrier.
- a part of the two metal foils is welded or bonded.
- the part to be welded or bonded is preferably the entire circumference of the peripheral edge of the metal foil.
- the metal foil is the entire surface of the portion protruding from the plate-like carrier.
- a mode 1 in which a part of the metal foils that are in contact with each other without a plate-like carrier is welded or bonded a mode 2 in which the outer peripheral parts of the metal foil are welded or bonded over the entire circumference, metal
- attached over the whole surface etc. can be considered, it is preferable that the interface of a plate-shaped carrier and metal foil is not exposed, and also metal foils A larger area of adhesion or welding is preferred.
- the embodiment 2 is more preferable, and the embodiment 3 is more preferable.
- FIG. 19 As another typical configuration example of the present invention, as shown in FIG. 19, a laminate in which a part of the metal foil 232 is welded or bonded to the outside of the plate-like carrier 231 when viewed in plan. 230, and the same effect can be obtained in this embodiment, but the interface between the plate-like carrier 231 and the metal foil 232 is exposed on the side not covered with the metal foil 232. Therefore, since it is difficult to prevent the chemical solution from entering from these directions, when it is necessary to prevent the chemical solution from entering from the four directions, the embodiment shown in FIG. 17 is preferable.
- an adhesive such as an epoxy resin adhesive can be suitably used.
- a known adhesive can be used as the adhesive.
- heat may be applied to the laminate when manufacturing the build-up substrate, it is preferable to use an adhesive having heat resistance.
- it can carry out by a well-known welding method.
- resistance welding, seam welding, ultrasonic welding, TIG (tungsten inert gas) welding, MIG (metal inert gas) welding, MAG (metal active gas welding) welding, friction stir welding (Friction) can be performed by welding methods such as Stir Welding and laser welding.
- welding slag generated during welding can be performed by ultrasonic welding, friction stir welding (FSW), and seam welding. Is preferable because there is little. Furthermore, this adhesion can be effectively exerted when the region where the metal foil is bonded or welded is within a certain range.
- the ratio (Sb / Sa) of the area (Sa) of the metal foil and the area (Sb) of the plate-like carrier when viewed in plan is 0.6 or more and less than 1.0, preferably 0.80 or more and 0. .95 or less is preferable because a necessary and sufficient area for bonding or welding metal foils can be secured.
- the ratio (Sp / Sq) of the area (Sp) where the two metal foils are welded or bonded to the area (Sq) of the metal foil including the welded or bonded surface. Is preferably 0.001 or more and 0.2 or less, more preferably 0.01 or more and 0.20 or less, since a necessary and sufficient area for bonding or welding metal foils can be secured.
- the areas and shapes of the two metal foils stacked on the top and bottom of the plate carrier are preferably the same, but may be different.
- the values of Sa and Sq are those of the metal foil having the larger area.
- the shape of the plate-like carrier in a plan view is a quadrangle
- other shapes may be used.
- the metal foil may have a shape other than a square.
- the aspect where the area of the metal foil is larger than the area of the plate carrier has been described, even when the area of the plate carrier is larger than the area of the metal foil, when viewed in plan, Even if the metal foil is laminated on the plate carrier so that there is a portion where the metal foils are not in contact with each other without the plate carrier on the outside of the plate carrier, this metal foil
- the same effect as described above can be obtained by welding or adhering a part of a portion where they are in contact with each other without using a plate-like carrier, or by welding or adhering the entire surface.
- the plate-like carrier portion that is not laminated with the metal foil is an exposed portion that is not covered with the metal foil when viewed in plan.
- a drill or the like in a portion where the metal foil is in contact without passing through the plate-like carrier or a portion where the plate-like carrier is not covered with the metal foil and exposed 1 to 10 holes having a diameter of about 0.01 mm to 10 mm may be provided.
- the holes thus provided can be used as means for fixing positioning pins or the like in the production of a multilayer metal-clad laminate described later or the build-up board.
- the laminates 220 and 230 as shown in FIGS. 17 to 19 are cut along the cut line B, for example, inside the portion where the metal foil is welded or bonded when the laminate is viewed in plan.
- a metal foil with a carrier is obtained.
- the metal foil with a carrier can be formed on the outermost surface of the multilayer metal-clad laminate or build-up substrate.
- a release agent or a release material that can be preferably used when laminating a plate-like carrier and a metal foil in order to achieve adhesion required for the use of “metal foil with carrier” described later. To do.
- Silane compound A silane compound having a structure represented by the following formula, a hydrolysis product thereof, or a condensate of the hydrolysis product (hereinafter simply referred to as a silane compound) is used alone or in combination. Then, by sticking the plate-like carrier and the metal foil, the adhesiveness is moderately lowered, and the peel strength can be adjusted to a range described later.
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- the silane compound must have at least one alkoxy group.
- a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group in the absence of an alkoxy group, or any one of these hydrocarbons in which one or more hydrogen atoms are substituted with a halogen atom
- a substituent is comprised only by group, there exists a tendency for the adhesiveness of a plate-shaped carrier and metal foil surface to fall too much.
- the silane compound is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or any one of these hydrocarbon groups in which one or more hydrogen atoms are substituted with a halogen atom.
- the alkoxy group according to the present invention includes an alkoxy group in which one or more hydrogen atoms are substituted with halogen atoms.
- the silane compound has three alkoxy groups and the hydrocarbon group (a hydrocarbon group in which one or more hydrogen atoms are substituted with a halogen atom). It is preferable to have one).
- both R 3 and R 4 are alkoxy groups.
- Alkoxy groups include, but are not limited to, methoxy, ethoxy, n- or iso-propoxy, n-, iso- or tert-butoxy, n-, iso- or neo-pentoxy, n-hexoxy Group, cyclohexyloxy group, n-heptoxy group, n-octoxy group and the like, straight chain, branched or cyclic carbon number of 1-20, preferably carbon number of 1-10, more preferably carbon number of 1- 5 alkoxy groups.
- the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- alkyl group examples include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, and n-hexyl.
- cycloalkyl group examples include, but are not limited to, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and the like, which have 3 to 10 carbon atoms, preferably 5 to 7 carbon atoms.
- An alkyl group is mentioned.
- the aryl group includes a phenyl group, a phenyl group substituted with an alkyl group (eg, tolyl group, xylyl group), 1- or 2-naphthyl group, anthryl group, etc., having 6 to 20, preferably 6 to 14 carbon atoms.
- an alkyl group eg, tolyl group,
- one or more hydrogen atoms may be substituted with a halogen atom, and may be substituted with, for example, a fluorine atom, a chlorine atom, or a bromine atom.
- Examples of preferred silane compounds include methyltrimethoxysilane, ethyltrimethoxysilane, n- or iso-propyltrimethoxysilane, n-, iso- or tert-butyltrimethoxysilane, n-, iso- or neo-pentyl.
- propyltrimethoxysilane, methyltriethoxysilane, hexyltrimethoxysilane, phenyltriethoxysilane, and decyltrimethoxysilane are preferable from the viewpoint of availability.
- the metal foil or laminate with a carrier can be manufactured by closely attaching a plate-like carrier and the metal foil with a hot press. For example, after the silane compound is applied to the bonding surface of the metal foil and / or plate carrier, the B-stage resin plate carrier is hot-press laminated on the bonding surface of the metal foil. Can be manufactured.
- the silane compound can be used in the form of an aqueous solution.
- Alcohols such as methanol and ethanol can be added in order to increase the solubility in water.
- the addition of alcohol is particularly effective when a highly hydrophobic silane compound is used.
- the stirring time after the silane compound is dissolved in water can be, for example, 1 to 100 hours, and typically 1 to 30 hours. Of course, there is a method of using without stirring.
- the concentration of the silane compound in the aqueous solution of the silane compound can be 0.01 to 10.0% by volume, and typically 0.1 to 5.0% by volume.
- the pH of the aqueous solution of the silane compound is not particularly limited and can be used on either the acidic side or the alkaline side.
- it can be used at a pH in the range of 3.0 to 10.0.
- the pH is preferably in the range of 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0. .
- Examples of the compound having two or less mercapto groups in the molecule include thiol, dithiol, thiocarboxylic acid or a salt thereof, dithiocarboxylic acid or a salt thereof, thiosulfonic acid or a salt thereof, and dithiosulfonic acid or a salt thereof. At least one selected from these can be used.
- Thiol has one mercapto group in the molecule and is represented by, for example, R-SH.
- R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.
- Dithiol has two mercapto groups in the molecule and is represented by, for example, R (SH) 2 .
- R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.
- Two mercapto groups may be bonded to the same carbon, or may be bonded to different carbons or nitrogens.
- the thiocarboxylic acid is one in which a hydroxyl group of an organic carboxylic acid is substituted with a mercapto group, and is represented by, for example, R—CO—SH.
- R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.
- the thiocarboxylic acid can also be used in the form of a salt. A compound having two thiocarboxylic acid groups can also be used.
- Dithiocarboxylic acid is one in which two oxygen atoms in the carboxy group of an organic carboxylic acid are substituted with sulfur atoms, and is represented by, for example, R- (CS) -SH.
- R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.
- Dithiocarboxylic acid can also be used in the form of a salt.
- a compound having two dithiocarboxylic acid groups can also be used.
- the thiosulfonic acid is obtained by replacing the hydroxyl group of an organic sulfonic acid with a mercapto group, and is represented by, for example, R (SO 2 ) -SH.
- R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.
- thiosulfonic acid can be used in the form of a salt.
- Dithiosulfonic acid is one in which two hydroxyl groups of organic disulfonic acid are substituted with mercapto groups, and is represented by, for example, R-((SO 2 ) -SH) 2 .
- R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.
- Two thiosulfonic acid groups may be bonded to the same carbon, or may be bonded to different carbons.
- Dithiosulfonic acid can also be used in the form of a salt.
- examples of the aliphatic hydrocarbon group suitable as R include an alkyl group and a cycloalkyl group, and these hydrocarbon groups may contain either or both of a hydroxyl group and an amino group.
- alkyl group examples include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, n And straight-chain or branched alkyl groups having 1 to 20, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as -hexyl group, n-octyl group, and n-decyl group. .
- cycloalkyl group is not limited, but it has 3 to 10 carbon atoms such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, etc., preferably 5 to 7 carbon atoms.
- cycloalkyl group preferably 3 to 10 carbon atoms.
- suitable aromatic hydrocarbon groups as R include phenyl groups, phenyl groups substituted with alkyl groups (eg, tolyl groups, xylyl groups), 1- or 2-naphthyl groups, anthryl groups, and the like. -20, preferably 6-14 aryl groups, and these hydrocarbon groups may contain either or both of a hydroxyl group and an amino group.
- heterocyclic group suitable as R examples include imidazole, triazole, tetrazole, benzimidazole, benzotriazole, thiazole, and benzothiazole, which may contain either or both of a hydroxyl group and an amino group.
- Preferred examples of the compound having two or less mercapto groups in the molecule include 3-mercapto-1,2, propanediol, 2-mercaptoethanol, 1,2-ethanedithiol, 6-mercapto-1-hexanol, 1- Octanethiol, 1-dodecanethiol, 10-hydroxy-1-dodecanethiol, 10-carboxy-1-dodecanethiol, 10-amino-1-dodecanethiol, sodium 1-dodecanethiolsulfonate, thiophenol, thiobenzoic acid, Examples include 4-amino-thiophenol, p-toluenethiol, 2,4-dimethylbenzenethiol, 3-mercapto-1,2,4 triazole, and 2-mercapto-benzothiazole. Of these, 3-mercapto-1,2-propanediol is preferred from the viewpoint of water solubility and waste disposal.
- the metal foil or laminate with a carrier can be manufactured by closely attaching a plate-like carrier and the metal foil with a hot press. For example, after a metal foil and / or a plate-like carrier bonding surface is coated with a compound having two or less mercapto groups in the molecule, the metal foil bonding surface is made of a B-stage resin. This plate-shaped carrier can be manufactured by hot press lamination.
- a compound having two or less mercapto groups in the molecule can be used in the form of an aqueous solution.
- Alcohols such as methanol and ethanol can be added in order to increase the solubility in water.
- the addition of alcohol is particularly effective when a compound having two or less mercapto groups in a highly hydrophobic molecule is used.
- the peel strength can be adjusted by adjusting the concentration.
- the concentration of the compound having 2 or less mercapto groups in the molecule in the aqueous solution can be 0.01 to 10.0% by weight, typically 0.1 to 5.0%. % By weight.
- the pH of the aqueous solution of the compound having two or less mercapto groups in the molecule is not particularly limited and can be used on either the acidic side or the alkaline side.
- it can be used at a pH in the range of 3.0 to 10.0.
- the pH is preferably in the range of 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0. .
- Metal alkoxide An aluminate compound, titanate compound, zirconate compound having a structure represented by the following formula, or a hydrolysis product thereof, or a condensate of the hydrolysis product (hereinafter simply referred to as a metal alkoxide) alone
- a metal alkoxide aluminate compound, titanate compound, zirconate compound having a structure represented by the following formula, or a hydrolysis product thereof, or a condensate of the hydrolysis product (hereinafter simply referred to as a metal alkoxide) alone
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms. Any one of these substituted hydrocarbon groups, M is any one of Al, Ti, and Zr, n is 0 or 1 or 2, m is an integer from 1 to M, and R At least one of 1 is an alkoxy group.
- M + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr.
- the metal alkoxide must have at least one alkoxy group.
- a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group in the absence of an alkoxy group, or any one of these hydrocarbons in which one or more hydrogen atoms are substituted with a halogen atom
- a substituent is comprised only by group, there exists a tendency for the adhesiveness of a plate-shaped carrier and metal foil surface to fall too much.
- the metal alkoxide is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or any one of these hydrocarbon groups in which one or more hydrogen atoms are substituted with a halogen atom. It is necessary to have 0-2. This is because when three or more hydrocarbon groups are present, the adhesion between the plate-like carrier and the metal foil surface tends to be excessively lowered.
- the alkoxy group according to the present invention includes an alkoxy group in which one or more hydrogen atoms are substituted with halogen atoms.
- the metal alkoxide has two or more alkoxy groups and the hydrocarbon group (a hydrocarbon in which one or more hydrogen atoms are substituted with a halogen atom). It preferably has one or two groups).
- alkyl group examples include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, n And straight-chain or branched alkyl groups having 1 to 20, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as -hexyl group, n-octyl group, and n-decyl group. .
- cycloalkyl group is not limited, but it has 3 to 10 carbon atoms such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, etc., preferably 5 to 7 carbon atoms.
- cycloalkyl group preferably 3 to 10 carbon atoms.
- examples of the aromatic hydrocarbon group suitable as R 2 include a phenyl group, a phenyl group substituted with an alkyl group (eg, tolyl group, xylyl group), 1- or 2-naphthyl group, anthryl group, and the like. Examples thereof include 6 to 20, preferably 6 to 14, aryl groups, and these hydrocarbon groups may contain one or both of a hydroxyl group and an amino group.
- one or more hydrogen atoms may be substituted with a halogen atom, and may be substituted with, for example, a fluorine atom, a chlorine atom, or a bromine atom.
- aluminate compounds include trimethoxyaluminum, methyldimethoxyaluminum, ethyldimethoxyaluminum, n- or iso-propyldimethoxyaluminum, n-, iso- or tert-butyldimethoxyaluminum, n-, iso- or neo- Pentyl dimethoxy aluminum, hexyl dimethoxy aluminum, octyl dimethoxy aluminum, decyl dimethoxy aluminum, phenyl dimethoxy aluminum; alkyl-substituted phenyl dimethoxy aluminum (for example, p- (methyl) phenyl dimethoxy aluminum), dimethylmethoxy aluminum, triethoxy aluminum, methyl diethoxy aluminum Ethyldiethoxyaluminum, n- or iso-propyldiethyl Aluminum, n-, iso- or tert-butyldieth
- titanate compounds examples include tetramethoxy titanium, methyl trimethoxy titanium, ethyl trimethoxy titanium, n- or iso-propyl trimethoxy titanium, n-, iso- or tert-butyl trimethoxy titanium, n-, iso- Or neo-pentyltrimethoxytitanium, hexyltrimethoxytitanium, octyltrimethoxytitanium, decyltrimethoxytitanium, phenyltrimethoxytitanium; alkyl-substituted phenyltrimethoxytitanium (eg p- (methyl) phenyltrimethoxytitanium), dimethyldimethoxy Titanium, tetraethoxy titanium, methyl triethoxy titanium, ethyl triethoxy titanium, n- or iso-propyl triethoxy titanium, n-, iso
- zirconate compounds include tetramethoxyzirconium, methyltrimethoxyzirconium, ethyltrimethoxyzirconium, n- or iso-propyltrimethoxyzirconium, n-, iso- or tert-butyltrimethoxyzirconium, n-, iso- Or neo-pentyltrimethoxyzirconium, hexyltrimethoxyzirconium, octyltrimethoxyzirconium, decyltrimethoxyzirconium, phenyltrimethoxyzirconium; alkyl-substituted phenyltrimethoxyzirconium (eg, p- (methyl) phenyltrimethoxyzirconium), dimethyldimethoxy Zirconium, tetraethoxyzirconium, methyltriethoxyzirconium, ethyltrie
- the metal foil or laminate with a carrier can be manufactured by closely attaching a plate-like carrier and the metal foil with a hot press. For example, after applying the metal alkoxide in the molecule to the bonding surface of the metal foil and / or plate carrier, the B-stage resin plate carrier is applied to the bonding surface of the metal foil. It can be manufactured by hot press lamination.
- Metal alkoxide can be used in the form of an aqueous solution.
- Alcohols such as methanol and ethanol can be added in order to increase the solubility in water.
- the addition of alcohol is particularly effective when a highly hydrophobic metal alkoxide is used.
- the concentration of the metal alkoxide in the aqueous solution can be 0.001 to 1.0 mol / L, and typically 0.005 to 0.2 mol / L.
- the pH of the aqueous solution of metal alkoxide is not particularly limited and can be used on either the acidic side or the alkaline side.
- it can be used at a pH in the range of 3.0 to 10.0.
- the pH is preferably in the range of 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0. .
- the adjustment of the peel strength for realizing such adhesion is composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluororesin. This is done by using a resin coating. Such a resin coating film is baked under predetermined conditions as described later, and is hot-pressed and bonded between the plate-like carrier and the metal foil, so that the adhesiveness is appropriately lowered and peeled. This is because the strength can be adjusted to the above-described range.
- Epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, brominated epoxy resin, amine type epoxy resin, flexible epoxy resin, hydrogenated bisphenol A type epoxy resin, phenoxy resin, Examples thereof include brominated phenoxy resin.
- the melamine-based resin examples include methyl etherified melamine resin, butylated urea melamine resin, butylated melamine resin, methylated melamine resin, and butyl alcohol-modified melamine resin.
- the melamine resin may be a mixed resin of the resin and a butylated urea resin, a butylated benzoguanamine resin, or the like.
- the number average molecular weight of the epoxy resin is preferably 2000 to 3000, and the number average molecular weight of the melamine resin is preferably 500 to 1000.
- the resin can be made into a paint and the adhesive strength of the resin coating film can be easily adjusted to a predetermined range.
- examples of the fluororesin include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, and polyvinyl fluoride.
- silicone examples include methylphenyl polysiloxane, methyl hydropolysiloxane, dimethyl polysiloxane, modified dimethyl polysiloxane, and mixtures thereof.
- the modification is, for example, epoxy modification, alkyl modification, amino modification, carboxyl modification, alcohol modification, fluorine modification, alkylaralkyl polyether modification, epoxy polyether modification, polyether modification, alkyl higher alcohol ester modification, polyester modification.
- the resin coating film if the film thickness is too small, the resin coating film is too thin and difficult to form, so that the productivity is likely to decrease. Moreover, even if a film thickness exceeds a fixed magnitude
- the total amount of epoxy resin and melamine resin is preferably contained in an amount of 10 to 1500 parts by weight, more preferably 20 to 800 parts by weight with respect to 100 parts by weight of silicone. Is preferred.
- fluororesin functions as a release agent and has the effect of improving the heat resistance of the resin coating film. If the amount of fluororesin is too much compared to silicone, the aforementioned peel strength will be reduced, which may cause peeling during transportation or processing of the metal foil with a carrier or laminate, and the temperature required for the baking process described later will increase. Therefore, it becomes uneconomical. From this viewpoint, the fluororesin is preferably 0 to 50 parts by mass, more preferably 0 to 40 parts by mass with respect to 100 parts by mass of silicone.
- the resin coating film is selected from SiO 2 , MgO, Al 2 O 3 , BaSO 4 and Mg (OH) 2 in addition to silicone and epoxy resin and / or melamine resin and, if necessary, fluororesin 1 You may contain the surface roughening particle
- the resin coating film contains surface roughening particles, the surface of the resin coating film becomes uneven. Due to the unevenness, the surface of the plate-like carrier or metal foil to which the resin coating film is applied becomes uneven and becomes a matte surface.
- the content of the surface roughening particles is not particularly limited as long as the resin coating is roughened, but it is preferably 1 to 10 parts by mass with respect to 100 parts by mass of silicone.
- the particle diameter of the surface roughened particles is preferably 15 nm to 4 ⁇ m.
- the particle diameter means an average particle diameter (average value of the maximum particle diameter and the minimum particle diameter) measured from a scanning electron microscope (SEM) photograph or the like.
- SEM scanning electron microscope
- the amount of irregularities on the surface of the plate-like carrier or metal foil is about 4.0 ⁇ m in terms of the maximum height roughness Ry defined by JIS.
- the manufacturing method of the metal foil with a carrier or a laminated body by the mold release material using a resin coating film is demonstrated.
- This metal foil with a carrier is obtained through a procedure having a step of applying the above-described resin coating to at least one surface of a plate-like carrier or metal foil and a baking step of curing the applied resin coating.
- the laminate of the second embodiment is obtained by a hot press described later after the baking step, and the laminate of the third embodiment is welded between the metal foils as described above or after the baking step. Obtained by bonding.
- each step will be described.
- a resin coating consisting of silicone as the main agent, epoxy resin as the curing agent, melamine resin, and fluororesin as the release agent as required is applied to one or both sides of the plate-like carrier. And forming a resin coating film.
- the resin paint is obtained by dissolving an epoxy resin, a melamine resin, a fluororesin, and silicone in an organic solvent such as alcohol.
- the blending amount (addition amount) in the resin coating is preferably 10 to 1500 parts by mass of the total of the epoxy resin and the melamine resin with respect to 100 parts by mass of the silicone.
- the fluororesin is preferably 0 to 50 parts by mass with respect to 100 parts by mass of silicone.
- the coating method in the coating process is not particularly limited as long as a resin coating film can be formed, but a gravure coating method, a bar coating method, a roll coating method, a curtain flow coating method, a method using an electrostatic coating machine, etc. are used. In view of the uniformity of the resin coating film and the ease of work, the gravure coating method is preferred.
- the coating amount is preferably 1.0 to 2.0 g / m 2 so that the resin coating film 3 has a preferable film thickness: 0.5 to 5 ⁇ m.
- the gravure coating method is a method in which a resin coating film is formed on the surface of a plate-like carrier by transferring a resin coating filled in a recess (cell) provided on the roll surface to the plate-like carrier.
- the lower part of the lower roll having cells provided on the surface is immersed in the resin paint, and the resin paint is pumped into the cell by the rotation of the lower roll.
- the plate-like carrier is arranged between the lower roll and the upper roll arranged on the upper side of the lower roll, and the lower roll and the upper roll are held while pressing the plate-like carrier against the lower roll with the upper roll.
- the plate-like carrier is conveyed, and the resin paint pumped into the cell is transferred (applied) to one side of the plate-like carrier.
- a doctor blade on the side where the plate-shaped carrier is brought into contact with the surface of the lower roll, excess resin paint pumped up on the roll surface other than the cells is removed, and the surface of the plate-shaped carrier is removed. A predetermined amount of resin paint is applied to the substrate.
- a smoothing roll may be disposed on the carry-out side of the plate carrier to maintain the smoothness of the resin coating film.
- the baking step is a step of subjecting the resin coating film formed in the coating step to a baking treatment at 125 to 320 ° C. (baking temperature) for 0.5 to 60 seconds (baking time).
- baking temperature is the ultimate temperature of the plate carrier.
- a conventionally well-known apparatus is used as a heating means used for a baking process.
- the baking is insufficient, for example, when the baking temperature is less than 125 ° C. or when the baking time is less than 0.5 seconds, the resin coating becomes insufficiently cured, and the peel strength exceeds 200 gf / cm, The peelability is reduced.
- baking is an excessive condition, for example, when baking temperature exceeds 320 degreeC, a resin coating film deteriorates, the said peeling strength exceeds 200 gf / cm, and the workability
- a plate-shaped carrier may change in quality by high temperature. Further, when the baking time exceeds 60 seconds, the productivity is deteriorated.
- the resin coating in the application step is made of silicone as a main agent, epoxy resin as a curing agent, melamine resin, fluororesin as a release agent, SiO 2 , It may consist of one or more types of surface roughening particles selected from MgO, Al 2 O 3 , BaSO 4 and Mg (OH) 2 .
- the resin paint is obtained by further adding surface roughening particles to the above-described silicone-added resin solution.
- the surface of the resin coating film becomes uneven, and the unevenness makes the plate-like carrier or metal foil uneven, resulting in a matte surface.
- the blending amount (addition amount) of surface roughening particles in the resin coating is 1 to 10 masses per 100 mass parts of silicone. Part. Further, it is more preferable that the surface roughened particles have a particle size of 15 nm to 4 ⁇ m.
- the production method according to the present invention is as described above. However, in carrying out the present invention, other steps may be included between or before and after each step within a range that does not adversely affect each step. . For example, you may perform the washing
- the metal after assuming at least one of heating for 3 hours, 6 hours or 9 hours at 220 ° C., assuming heating conditions in the production process of the multilayer printed wiring board.
- the peel strength between the foil and the plate-like carrier is preferably 30 gf / cm or more, and more preferably 50 gf / cm or more.
- the peel strength is preferably 200 gf / cm or less, more preferably 150 gf / cm or less, and even more preferably 80 gf / cm or less.
- the peel strength after heating at 220 ° C. was described above in both 3 hours and 6 hours, or both 6 hours and 9 hours from the viewpoint of being able to cope with various lamination numbers. It is preferable to satisfy the range, and it is further preferable that all peel strengths after 3 hours, 6 hours, and 9 hours satisfy the above-described range.
- the peel strength is measured in accordance with a 90 degree peel strength measuring method defined in JIS C6481.
- the resin that serves as the plate-like carrier is not particularly limited, and phenol resin, polyimide resin, epoxy resin, natural rubber, pine resin, and the like can be used, but a thermosetting resin is preferable.
- a prepreg can also be used. The prepreg before being bonded to the metal foil is preferably in a B-stage state.
- the linear expansion coefficient of the prepreg (C stage) is 12 to 18 ( ⁇ 10 ⁇ 6 / ° C.), 16.5 ( ⁇ 10 ⁇ 6 / ° C.) of the copper foil as the constituent material of the substrate, or 17 of the SUS press plate .3 ( ⁇ 10 ⁇ 6 / ° C.) is advantageous in that it is difficult to cause circuit misalignment due to a phenomenon (scaling change) in which the substrate size before and after pressing differs from that at the time of design. Furthermore, as a synergistic effect of these merits, it becomes possible to produce a multilayer ultra-thin coreless substrate.
- the prepreg used here may be the same as or different from the prepreg constituting the circuit board.
- a metal plate has been used as a plate-shaped carrier of a metal foil with a carrier.
- the plate-like carrier and the metal foil are adhered to each other by welding or an adhesive.
- an adhesive from the viewpoint of heat resistance, there are many things that are generally not suitable for build-up, and when closely contacting by welding, the peel strength is too high when using full-surface welding, It is difficult to peel off easily, and it becomes difficult to prevent the chemical solution from entering between the plate-shaped carrier and the metal foil when using partial welding. . Therefore, by using a resin-made plate-like carrier, an appropriate peel strength can be exhibited with the metal foil, and by using a heat-resistant resin, it can sufficiently withstand the heat history during build-up. be able to. In addition, as a heat resistant resin, a well-known thing can be used.
- the plate-like carrier preferably has a high glass transition temperature Tg from the viewpoint of maintaining the peel strength after heating in an optimal range, for example, a glass transition temperature Tg of 120 to 320 ° C., preferably 170 to 240 ° C. It is.
- the glass transition temperature Tg is a value measured by DSC (differential scanning calorimetry).
- the thermal expansion coefficient of the resin is within + 10% and ⁇ 30% of the thermal expansion coefficient of the metal foil. As a result, it is possible to effectively prevent circuit misalignment due to the difference in thermal expansion between the metal foil and the resin, thereby reducing the occurrence of defective products and improving the yield.
- the thickness of the plate-like carrier is not particularly limited and may be rigid or flexible. However, if it is too thick, it will adversely affect the heat distribution during hot pressing, while if it is too thin, it will bend and will not flow through the printed wiring board manufacturing process. Therefore, it is usually 5 ⁇ m or more and 1000 ⁇ m or less, preferably 50 ⁇ m or more and 900 ⁇ m or less, and more preferably 100 ⁇ m or more and 400 ⁇ m or less.
- the metal foil copper or copper alloy foil is a typical one, but foil of aluminum, nickel, zinc or the like can also be used. In the case of copper or copper alloy foil, electrolytic foil or rolled foil can be used.
- the metal foil generally has a thickness of 1 ⁇ m or more, preferably 5 ⁇ m or more, and 400 ⁇ m or less, preferably 120 ⁇ m or less, considering use as a wiring of a printed circuit board.
- metal foils having the same thickness may be used, or metal foils having different thicknesses may be used.
- the metal foil used may be subjected to various surface treatments.
- metal plating for the purpose of imparting heat resistance Ni plating, Ni—Zn alloy plating, Cu—Ni alloy plating, Cu—Zn alloy plating, Zn plating, Cu—Ni—Zn alloy plating, Co—Ni alloy plating, etc.
- Chromate treatment including the case where one or more alloy elements such as Zn, P, Ni, Mo, Zr, Ti, etc.
- the chromate treatment liquid for imparting rust prevention and discoloration resistance, surface roughness (For example, copper electrodeposition grains, Cu—Ni—Co alloy plating, Cu—Ni—P alloy plating, Cu—Co alloy plating, Cu—Ni alloy plating, Cu—Co alloy plating, And copper alloy plating such as Cu—As alloy plating and Cu—As—W alloy plating).
- the roughening treatment not only affects the peel strength between the metal foil and the plate carrier, but also the chromate treatment has a great influence. Chromate treatment is important from the viewpoint of rust prevention and discoloration resistance, but since it tends to significantly increase the peel strength, it is also meaningful as a means for adjusting the peel strength.
- the matte surface (M surface) of the electrolytic copper foil is used as an adhesive surface with the resin, and surface treatment such as roughening treatment is performed.
- the adhesive strength is improved by the chemical and physical anchoring effects.
- various binders are added to increase the adhesive strength with the metal foil.
- the surface roughness of the bonded surface is contacted in order to adjust the peel strength between the metal foil and the plate-like carrier to the preferred range described above.
- a ten-point average roughness (Rz jis) of the surface of the metal foil measured in accordance with JIS B 0601: 2001 with a formula roughness meter it is preferably 3.5 ⁇ m or less, more preferably 3.0 ⁇ m or less.
- reducing the surface roughness indefinitely takes time and increases costs, so it is preferably 0.1 ⁇ m or more, and more preferably 0.3 ⁇ m or more.
- the metal foil When electrolytic copper foil is used as the metal foil, it is possible to use either a glossy surface (shiny surface, S surface) or a rough surface (matte surface, M surface) by adjusting to such a surface roughness. However, it is easier to adjust the surface roughness by using the S-plane. On the other hand, it is preferable that the ten-point average roughness (Rz jis) of the surface of the metal foil not contacting the carrier is 0.4 ⁇ m or more and 10.0 ⁇ m or less.
- the surface treatment for improving the peel strength such as the roughening treatment is not performed on the bonding surface of the metal foil with the resin.
- the binder for improving the adhesive force with metal foil is not added in resin.
- hot pressing is performed at a pressure of 30 to 40 kg / cm 2 and a temperature higher than the glass transition temperature of the prepreg. It is preferable.
- the plate 325 is placed and pressed in the direction P from the top of the cover plate 325 by the press 326.
- the resin component melted from the plate carrier flows in the direction r so that the interface between the plate carrier 321 and the metal foil 322 is not exposed when viewed from the direction perpendicular to the surface direction. Can be covered.
- the surface of the metal foil or resin was measured with a scanning electron microscope or the like equipped with XPS (X-ray photoelectron spectrometer), EPMA (electron beam microanalyzer), EDX (energy dispersive X-ray analysis). If detected, it can be inferred that a silane compound is present on the surface of the metal foil or resin. If S is detected, the surface of the metal foil or resin has two or less mercapto groups in the molecule. It can be inferred that a compound is present, and if Al, Ti, Zr is detected, it can be inferred that the metal alkoxide is present on the surface of the metal foil or resin.
- this invention provides the use of the laminated body mentioned above.
- a multilayer metal-clad laminate including laminating a resin on at least one metal foil side of the laminate and then repeatedly laminating the resin or metal foil one or more times.
- a manufacturing method is mentioned.
- a resin is laminated on at least one metal foil side of the laminate, and then the resin, the single-sided or double-sided metal-clad laminate, the laminate of the invention, the metal foil with a carrier of the invention, or the laminate of the invention Or a metal foil with a carrier obtained from the laminate of the present invention, or a method for producing a multilayer metal-clad laminate comprising repeatedly laminating a metal foil one or more times.
- the lamination after the resin laminated on the first laminate is performed as many times as desired.
- the resin, the single-sided or double-sided metal-clad laminate, the laminate of the present invention, and the metal foil with a carrier of the present invention are used. It can be arbitrarily selected from the group consisting of the laminate of the present invention and metal foil.
- disconnected in the laminated surface of the plate-shaped carrier and metal foil in at least one of the said laminated body or the said laminated body may be included. Thereby, especially in the laminated body part of 2nd and 3rd embodiment, a plate-shaped carrier and metal foil will be in the peelable state.
- the laminated surface to be cut is a surface that allows the plate carrier and the metal foil to be peeled to be peeled.
- “cutting at the laminated surface of the plate-like carrier and the metal foil” means cutting so that the cut surface intersects with the laminated surface of the plate-like carrier and the metal foil (hereinafter the same). Further, this cutting step is not essential when the plate-like carrier and the metal foil of the metal foil portion with a carrier in the subsequent stage are peeled off. Further, the cut multilayer copper-clad laminate may include a step of peeling and separating the plate carrier and the metal foil.
- separate is the laminated body after a cutting process or before a cutting process, the metal foil with a carrier after a cutting process or before a cutting process, or the laminated body after a cutting process. (same as below) Furthermore, after peeling and isolate
- substrate including the process of forming one or more buildup wiring layers in the metal foil side of a laminated body is mentioned.
- the build-up wiring layer can be formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
- a resin is laminated on the metal foil side of the laminate, and then the resin, single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, laminate of the present invention, metal foil with carrier of the present invention, laminate of the present invention Or a metal foil with a carrier obtained from the laminate of the present invention, or a method for producing a build-up substrate including repeatedly laminating a metal foil one or more times.
- lamination after the resin laminated on the first laminate is performed as many times as desired.
- the metal foil with carrier of the invention, the laminate of the invention and the metal foil can be arbitrarily selected. As shown in the method for manufacturing a build-up board using a metal foil with a carrier or a laminate, which will be described later, if necessary, holes are formed in the constituent layers of each build-up board and / or wiring is made as necessary. Further, if necessary, the laminate of the present invention, the metal foil with a carrier of the present invention, or the laminate of the present invention may be laminated on the outermost wiring.
- the manufacturing method of the build-up board may include a step of cutting at a laminated surface of a plate-like carrier and a metal foil in at least one of the laminate or the laminate.
- a plate-shaped carrier and metal foil will be in the peelable state. Therefore, it is preferable that the laminated surface to be cut is a surface that allows the plate carrier and the metal foil to be peeled to be peeled. Note that this cutting step is not essential when the plate-like carrier and the metal foil in the metal foil portion with a carrier in the subsequent stage are peeled off.
- disconnected multilayer copper clad laminated board may include the process of peeling and isolate
- the present invention provides the use of the metal foil with a carrier described above.
- a multilayer metal comprising laminating a resin on at least one metal foil side of the above-described metal foil with carrier, and then laminating the resin or the metal foil repeatedly one or more times, for example, 1 to 10 times.
- a method for producing a tension laminate is provided.
- a resin is laminated on the metal foil side of the metal foil with carrier described above, and then the resin, single-sided or double-sided metal-clad laminate, the laminate of the present invention, the metal foil with carrier of the present invention, or the present invention
- a method for producing a multilayer metal-clad laminate comprising laminating a laminate of the invention, a metal foil with a carrier obtained from the laminate of the invention, or a metal foil repeatedly at least once, for example, 1 to 10 times.
- the lamination after the resin laminated on the first metal foil with carrier is performed as many times as desired, and in each lamination, the resin, single-sided or double-sided metal-clad laminate, the laminate of the present invention, and the carrier of the present invention are attached. It can be arbitrarily selected from the group consisting of a metal foil, a laminate of the present invention, and a metal foil.
- cutting is performed, for example, on the metal foil of the metal foil with a carrier at the laminate surface of the plate-like carrier and the metal foil in at least one of the laminate or the laminate. And a step of peeling and separating the plate-like carrier of the metal foil with a carrier after cutting and the metal foil, for example.
- the method may further include a step of removing a part or all of the metal foil by etching after the plate carrier and the metal foil are separated from each other.
- a resin is laminated on the metal foil side of the metal foil with a carrier described above, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a laminate of the present invention, or a carrier of the present invention Production of Build-up Substrate Comprising Laminated Metal Foil, Laminated Body of the Present Invention, or Metallic Foil with Carrier Obtained from Laminated Body of Present Invention, or Laminating Metal Foil Repeated One or More Times, for example, 1 to 10 Times A method is provided.
- the lamination after the resin laminated on the first metal foil with a carrier is performed as many times as desired.
- the resin, the single-sided or double-sided wiring board, the single-sided or double-sided metal-clad laminate, the laminate of the present invention The metal foil with a carrier of the present invention, the laminate of the present invention and the metal foil can be arbitrarily selected.
- a method for manufacturing a buildup board including a step of laminating one or more buildup wiring layers on the metal foil side of the metal foil with carrier described above.
- the build-up wiring layer can be formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
- this invention provides the use of the laminated body mentioned above.
- a multilayer metal-clad laminate comprising laminating a resin on at least one metal foil side of the laminate described above, and then laminating the resin or metal foil repeatedly one or more times, for example, 1 to 10 times.
- a method of manufacturing a board is provided.
- the resin is laminated on the metal foil side of the laminate described above, and then the resin, single-sided or double-sided metal-clad laminate, the laminate of the present invention, the metal foil with carrier of the present invention, or the laminate of the present invention.
- a metal foil with a carrier obtained by cutting at a predetermined position of the laminate of the present invention, or a multilayer metal-clad laminate comprising laminating a metal foil repeatedly at least once, for example, 1 to 10 times A method of manufacturing a board is provided.
- the lamination after the resin laminated on the first laminate is performed as many times as desired, and each lamination is different from the resin, single-sided or double-sided metal-clad laminate, the laminate of the present invention, and the first laminate. It can be arbitrarily selected from the group consisting of the laminate of the present invention, the metal foil with a carrier of the present invention, the metal foil with a carrier obtained from the laminate of the present invention, and the metal foil.
- the step of cutting for example, on the metal foil of the laminate, at the laminate surface of the laminate or the plate-like carrier and the metal foil in at least one of the laminates And, for example, a step of peeling and separating the plate-like carrier and the metal foil of the laminate after cutting, respectively.
- attached can be included.
- the method may further include a step of removing a part or the whole of the metal foil by etching after the plate-like carrier and the metal foil are separated from each other.
- the resin is laminated on the metal foil side of the laminate described above, and then the resin, single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, the laminate of the present invention, or the laminate of the present invention,
- the metal foil with a carrier of the present invention, or the metal foil with a carrier obtained by cutting at a predetermined position of the laminate of the present invention as described above, or the metal foil is laminated one or more times, for example, 1 to 10 times repeatedly.
- substrate including this is provided.
- the lamination after the resin laminated on the first laminated body is performed as many times as desired.
- the resin, the single-sided or double-sided wiring board, the single-sided or double-sided metal-clad laminate, the laminate of the present invention It can be arbitrarily selected from the group consisting of the laminate of the present invention, the metal foil with carrier of the present invention, the metal foil with carrier obtained from the laminate of the present invention, and the metal foil.
- a method for manufacturing a buildup board including a step of laminating one or more buildup wiring layers on the metal foil side of the above-described laminate.
- the build-up wiring layer can be formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
- the subtractive method in the fourth buildup board manufacturing method using the metal foil with a carrier or the laminate is a metal-clad laminate or a wiring board (including a printed wiring board and a printed circuit board). It refers to a method of forming a conductor pattern by selectively removing unnecessary portions of the metal foil by etching or the like.
- the full additive method is a method of forming a conductor pattern by electroless plating and / or electrolytic plating without using a metal foil for the conductor layer.
- the semi-additive method is an electroless method on a seed layer made of metal foil, for example. In this method, a conductor pattern is formed by using metal deposition and electrolytic plating, etching, or a combination thereof, and then an unnecessary seed layer is removed by etching.
- the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, the metal foil constituting the laminate, the metal foil constituting the metal foil with carrier, and the laminate are constituted. It may further include performing the step of forming the wiring on at least one of the metal foil and the metal foil once or more.
- the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, the metal foil constituting the laminate, the metal foil constituting the laminate, and the metal foil with carrier are constituted. It may further include performing the step of forming the wiring on at least one of the metal foil and the metal foil one or more times.
- the metal foil is provided on the carrier side of the laminate according to the present invention in which the metal foil is adhered to one side on the surface on which the wiring is formed, or on one side.
- a step of laminating the carrier side of the metal foil with a carrier according to the present invention in which the metal foil is adhered, or the carrier side of the laminate according to the present invention in which the metal foil is closely adhered to one surface can be further included.
- a resin is laminated on the surface on which the wiring is formed, and a metal foil is adhered to both sides of the carrier or both sides of the laminate according to the present invention in which the metal foil is adhered to both surfaces of the resin.
- the method may further include a step of laminating the metal foil with carrier or the laminate according to the present invention in which the metal foil is adhered to both surfaces.
- the metal foil is provided on the carrier side of the laminate according to the present invention in which the metal foil is adhered on one side on the surface on which the wiring is formed, or on the one side.
- the step of laminating the carrier side of the metal foil with a carrier according to the present invention in which the metal foil is in close contact with the carrier side of the laminate according to the present invention in which the metal foil is in close contact can also be included.
- a resin is laminated on the surface on which the wiring is formed, and a metal foil is adhered to both sides of the carrier or both sides of the laminate according to the present invention in which the metal foil is adhered to both surfaces of the resin.
- a step of laminating the laminate or the metal foil with a carrier according to the present invention in which the metal foil is adhered to both sides may be further included.
- the “surface on which the wiring is formed” means a portion where wiring is formed on the surface that appears every time the build-up is performed, and the build-up substrate includes both the final product and the middle.
- the laminate or, if necessary, the metal foil with a carrier on the laminate surface of the laminate or the plate-like carrier and the metal foil in at least one of the laminates for example, the laminate or, if necessary, the metal foil with a carrier on the laminate surface of the laminate or the plate-like carrier and the metal foil in at least one of the laminates.
- the method may further include a step of removing a part or all of the metal foil by etching after the plate carrier and the metal foil are separated from each other.
- each layer can be laminated
- This thermocompression bonding may be performed every time one layer is stacked, may be performed after being laminated to some extent, or may be performed collectively at the end.
- the present invention provides a method for manufacturing a build-up board as described above, wherein a single-sided or double-sided wiring board, a single-sided or double-sided copper-clad laminate, a laminated metal foil, a laminated plate-like carrier, a metal foil with a carrier A plate-shaped carrier of metal foil with a carrier, a metal foil of a laminated body, a plate-shaped carrier of a laminated body, a metal foil or a resin, holes are formed on the side and bottom surfaces of the holes, and the one-sided or double-sided wiring is further formed.
- Metal foil and circuit part constituting a substrate metal foil constituting a single-sided or double-sided copper-clad laminate, metal foil constituting a laminate, metal foil constituting a metal foil with carrier, metal foil constituting a laminate, or Provided is a method for manufacturing a build-up substrate in which a step of forming a circuit on a metal foil is performed at least once.
- the metal foil with carrier used here is the metal foil with carrier 11 in which the metal foil 11a is adhered to one surface of the plate-like carrier 11c.
- a desired number of prepregs 12, then a two-layer printed circuit board or two-layer metal-clad laminate called an inner layer core 13, then a prepreg 12, and then a metal foil 11 with a carrier are sequentially stacked on the metal foil 11 with a carrier.
- a set of four-layer CCL assembly units is completed.
- this unit 14 (commonly called “page”) is repeated about 10 times to form a press assembly 15 (commonly called “book”) (FIG. 20).
- the book 15 is sandwiched between the laminated molds 10 and set in a hot press machine, and a large number of four-layer CCLs can be manufactured simultaneously by press molding at a predetermined temperature and pressure.
- a stainless plate can be used as the laminated mold 10.
- the plate is not limited, for example, a thick plate of about 1 to 10 mm can be used.
- CCL having four or more layers can be produced in the same process by increasing the number of inner core layers.
- a resin as an insulating layer, a two-layer circuit board, a resin as an insulating layer are sequentially stacked, and the metal foil side is in contact with the resin on the metal foil side.
- a buildup substrate can be manufactured by sequentially stacking the metal foils of the metal foil with a carrier of the present invention.
- a resin as an insulating layer, a two-layer circuit board, and a resin as an insulating layer are sequentially stacked on the metal foil side of the laminate of the present invention, and the metal foil side is in contact with the resin on the metal foil side.
- the build-up substrate can be manufactured by stacking the metal foils of the laminated body or the metal foil with carrier in order and cutting the metal foil of the laminated body at a predetermined location where the predetermined position is included in the cut surface.
- a metal foil with a carrier when used, with respect to at least one metal foil side of the metal foil with a carrier in which the metal foil is in close contact with both surfaces or one surface of the resin plate carrier 11c. Then, a resin as an insulating layer and a metal foil as a conductor layer are sequentially laminated. Next, if necessary, a step of half-etching the entire surface of the metal foil to adjust the thickness may be included.
- Electroless plating is performed on the entire surface or a part of the substrate to form an interlayer connection, and further electrolytic plating is performed as necessary.
- a plating resist may be formed in advance on each portion of the metal foil where electroless plating or electrolytic plating is unnecessary before performing each plating.
- the surface of the metal foil may be chemically roughened in advance.
- the plating resist is removed after plating.
- a circuit is formed by removing unnecessary portions of the metal foil and the electroless plating portion and the electrolytic plating portion by etching. Thereby, a build-up substrate is obtained.
- the process from the lamination of the resin and metal foil to the circuit formation may be repeated a plurality of times to form a multilayer build-up substrate.
- the metal side of the metal foil with a carrier having the metal foil adhered to one side of the present invention may be contacted and laminated, or once the resin is laminated Alternatively, one metal foil of the metal foil with carrier in which the metal foil is adhered to both surfaces of the present invention may be brought into contact with each other and laminated.
- the metal of the laminate portion to be peeled off from the plate-like carrier and the metal foil after circuit formation is obtained in the same manner as when the metal foil with a carrier is used.
- the build-up substrate is obtained by cutting at a predetermined location where the foil is included in the cut surface.
- the steps from the lamination of the resin and the copper foil to the circuit formation may be repeated a plurality of times to form a multilayer build-up substrate.
- the outermost surface of this build-up substrate is laminated by contacting the resin side of the laminate in which the metal foil is closely attached to one side of the present invention, or the resin side of the metal foil with a carrier having the metal foil closely attached to one side.
- one metal foil of the laminate in which the metal foil is adhered to both surfaces of the present invention, or one metal foil of the metal foil with a carrier in which the metal foil is adhered to both surfaces May be laminated in contact with each other.
- the laminate may be cut at a predetermined location so that the metal foil of the laminate is included in the cut surface up to the previous stage. You may cut so that the metal surface of all the laminated bodies may be finally included in a cut surface, without performing a cut.
- a prepreg containing a thermosetting resin can be suitably used as the resin used for manufacturing the build-up substrate.
- the exposed surface of the metal foil of the metal foil with a carrier obtained by laminating a metal foil, for example, a copper foil, on one side or both sides of a resin plate carrier Further, a resin as an insulating layer, for example, a prepreg or a photosensitive resin is laminated. Thereafter, a via hole is formed at a predetermined position of the resin.
- the via hole can be formed by laser processing. After the laser processing, desmear treatment for removing smear in the via hole is preferably performed.
- the resin in the via hole forming portion can be removed by a photolithography method.
- electroless plating is performed on the bottom and side surfaces of the via holes, the entire surface or a part of the resin to form interlayer connections, and further electrolytic plating is performed as necessary.
- a plating resist may be formed in advance on each portion of the resin where electroless plating or electrolytic plating is unnecessary before performing each plating. Further, when the adhesion between electroless plating, electrolytic plating, plating resist and resin is insufficient, the surface of the resin may be chemically roughened in advance.
- the plating resist is removed after plating. Next, an unnecessary portion of the electroless plating portion or the electrolytic plating portion is removed by etching to form a circuit. Thereby, a build-up substrate is obtained.
- the steps from resin lamination to circuit formation may be repeated a plurality of times to form a multilayered build-up substrate. Further, the outermost surface of this build-up substrate is laminated by contacting the resin side of the laminate in which the metal foil is closely attached to one side of the present invention, or the resin side of the metal foil with a carrier having the metal foil closely attached to one side. Alternatively, after laminating the resin once, one metal foil of the laminate in which the metal foil is adhered to both surfaces of the present invention, or one metal foil of the metal foil with a carrier in which the metal foil is adhered to both surfaces May be laminated in contact with each other.
- the metal of the laminate portion to be peeled off from the plate-like carrier and the metal foil after the circuit is formed in the same manner as when the metal foil with a carrier is used.
- the build-up substrate can be manufactured by cutting at a predetermined location where the foil is included in the cut surface. The steps from resin lamination to circuit formation may be repeated a plurality of times to form a multilayered build-up substrate. Further, the outermost surface of this build-up substrate is laminated by contacting the resin side of the laminate in which the metal foil is closely attached to one side of the present invention, or the resin side of the metal foil with a carrier having the metal foil closely attached to one side.
- one metal foil of the laminate in which the metal foil is adhered to both surfaces of the present invention, or one metal foil of the metal foil with a carrier in which the metal foil is adhered to both surfaces May be laminated in contact with each other.
- the laminate may be cut at a predetermined location so that the metal foil of the laminate is included in the cut surface up to the previous stage. You may cut so that the metal surface of all the laminated bodies may be finally included in a cut surface, without performing a cut.
- a wiring is formed on the surface through a plating process and / or an etching process, and further, build-up wiring is performed by separating and separating between the carrier resin and the metal foil.
- the board is completed. Wiring may be formed on the peeling surface of the metal foil after peeling and separation, or the entire surface of the metal foil may be removed by etching to form a multilayer build-up wiring board.
- a printed circuit board is completed by mounting electronic components on the build-up wiring board. Moreover, a printed circuit board can be obtained even if an electronic component is mounted directly on a coreless buildup substrate before resin peeling.
- Example 1-1 A plurality of electrolytic copper foils (thickness 12 ⁇ m) were prepared, and nickel-zinc (Ni—Zn) alloy plating treatment and chromate (Cr—Zn) were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions. Chromate) treatment, the ten-point average roughness (measured in accordance with JIS B 0601: 2001) of the bonded surface (here, S surface) is 1.5 ⁇ m, and then the resin is Nanya Plastic Co., Ltd. A manufactured prepreg (FR-4 resin) was bonded to the S surface of the electrolytic copper foil, and hot-pressed at 170 ° C. for 100 minutes to prepare a copper foil with a carrier.
- Ni—Zn nickel-zinc
- Cr—Zn chromate
- Nickel-zinc alloy plating Ni concentration 17g / L (added as NiSO 4 ) Zn concentration 4g / L (added as ZnSO 4 ) pH 3.1 Liquid temperature 40 °C Current density 0.1-10A / dm 2 Plating time 0.1 to 10 seconds
- an aqueous solution of the mold release agent is applied using a spray coater, and then the copper foil surface is dried in air at 100 ° C. Was pasted together.
- the use conditions of the release agent the type of release agent, the stirring time from when the release agent is dissolved in water to before application, the concentration of the release agent in the aqueous solution, the alcohol concentration in the aqueous solution, the pH of the aqueous solution Is shown in Table 1-1.
- the release material resin coating on the S-surface or plate carrier is formed by applying a composition for a resin coating having the composition shown in Table 1-1 by a gravure coating method, and then using a doctor blade.
- the thickness was adjusted to 2-4 ⁇ m.
- the applied resin coating film was baked by heating at 150 ° C. for 30 seconds.
- bisphenol A type epoxy resin is used as the epoxy resin shown in Table 1-1
- methyl etherified melamine resin is used as the melamine resin
- polytetrafluoroethylene is used as the fluororesin
- dimethyl silicone resin is used. Used dimethylpolysiloxane.
- Example 1-2 to Experimental Example 1-12 Using the copper foil, resin (prepreg) and release agent shown in Table 1-1, a carrier-attached copper foil was produced in the same procedure as in Experimental Example 1-1.
- a release agent was applied on a plate-like carrier. Further, heat treatment was performed under the conditions shown in Table 1-1. Each was evaluated in the same manner as in Experimental Example 1-1. The results are shown in Table 1-1 and Table 1-2.
- a copper foil with a carrier was prepared by laminating a copper foil and a resin (prepreg) without using any release agent or release material, and the same as in Experimental Example 1-1. Evaluation was performed.
- Treatment liquid 3-glycidoxypropyltrimethoxysilane 0.9 volume% aqueous solution pH 5.0 to 9.0 Stirred at room temperature for 12 hours
- Treatment method After applying the treatment liquid using a spray coater, the treated surface is dried in air at 100 ° C. for 5 minutes.
- the release agent can be processed on the surface of the copper foil or the surface of the plate carrier (prepreg), and then the peel strength of the laminate, the peel strength after heating, the peel It can be seen that the same results were obtained in workability.
- a prepreg having a thickness of 200 ⁇ m was used as the plate-like carrier when laminating the plate-like carrier (prepreg) and the copper foil.
- the prepreg had a square shape of 550 mm square, and the copper foil had a rectangular shape of 550 mm ⁇ 500 mm square.
- the positional relationship between the prepreg and the copper foil was such that the center of the copper foil and the center position of the prepreg were matched, and the sides of the copper foil and the side of the prepreg were arranged parallel to each other (the mode of FIG. 5).
- the total length A of the edge of the prepreg is 2200 mm
- the length B of the edge of the prepreg covered with the copper foil is 1000 mm
- the ratio of B to A (B / A) is 0.45
- the ratio (Sa / Sb) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.91. Copper foil was laminated on both sides of the prepreg.
- the prepreg shown in Experimental Example 1-2 was made into an octagonal shape by cutting off a straight line connecting two points on the prepreg edge at a distance of 25 mm from each vertex. 2 except that the copper foil shown in Fig. 2 is an octagonal shape cut off by a straight line connecting two points on the edge of the copper foil at a distance of 25 mm from each vertex, under the same conditions as in Experimental Example 1-1.
- a copper foil and a prepreg were laminated (not shown). At this time, the ratio (B / A) to the total length A of the edge of the prepreg is 0 (zero). Further, the ratio (Sa / Sb) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.83. Copper foil was laminated on both sides of the prepreg.
- a hole with a diameter of 1 mm was formed in four portions of the copper foil with a carrier thus produced where the plate-like carrier was exposed, and used as a guide hole for positioning in the subsequent build-up process.
- FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metals, JTC 12 ⁇ m (product name)) are sequentially stacked on both sides of the copper foil with a carrier thus produced.
- a four-layer copper-clad laminate was produced by hot pressing at 170 ° C. for 100 minutes at a pressure of 150 ° C.
- a 100 ⁇ m diameter hole penetrating the copper foil on the surface of the four-layer copper-clad laminate and the insulating layer (cured prepreg) thereunder was drilled using a laser processing machine.
- electroless copper plating on the copper foil surface on the copper foil with a carrier exposed at the bottom of the hole, the side surface of the hole, and the copper foil on the surface of the four-layer copper-clad laminate, and copper plating by electrolytic copper plating The electrical connection was formed between the copper foil on the copper foil with a carrier and the copper foil on the surface of the four-layer copper-clad laminate.
- a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this manner, a four-layer buildup substrate can be produced.
- Example 1-13> A copper foil with a carrier was prepared using the same copper foil, mold release agent and prepreg as in Experimental Example 1-1, except that both the copper foil and the prepreg in Example 1-1 had a square shape of 550 mm square. A two-layer build-up wiring board was obtained in the same procedure as in Experimental Example 1-1.
- Nickel-zinc alloy plating Ni concentration 17g / L (added as NiSO 4 ) Zn concentration 4g / L (added as ZnSO 4) pH 3.1 Liquid temperature 40 °C Current density 0.1-10A / dm 2 Plating time 0.1 to 10 seconds
- an aqueous solution of the mold release agent is applied using a spray coater, and then the copper foil surface is dried in air at 100 ° C. Was pasted together.
- the type of release agent the stirring time from when the release agent is dissolved in water to before application, the concentration of the release agent in the aqueous solution, the alcohol concentration in the aqueous solution, the pH of the aqueous solution Is shown in Table 2-1.
- the release material resin coating on the S-surface or plate carrier is formed by applying a resin coating composition having the composition shown in Table 2-1 by a gravure coating method, and then using a doctor blade.
- the thickness was adjusted to 2-4 ⁇ m. Moreover, the applied resin coating film was baked by heating at 150 ° C. for 30 seconds.
- bisphenol A type epoxy resin is used as the epoxy resin shown in Table 2-1
- methyl etherified melamine resin is used as the melamine resin
- polytetrafluoroethylene is used as the fluororesin
- dimethyl silicone resin is used. Used dimethylpolysiloxane.
- the laminated body has a thermal history during the further heat treatment such as circuit formation on the metal foil with a carrier, the conditions described in Table 2-1 (here, 3 ° C. at 220 ° C.) Heat treatment).
- Example 2-2 Using the copper foil, resin (prepreg) and release agent shown in Table 2-1, a laminate was produced in the same procedure as in Experimental Example 2-1.
- the release agent was applied on the plate-like carrier. Further, heat treatment was performed under the conditions shown in Table 2-1. Each was evaluated in the same manner as in Experimental Example 2-1. The results are shown in Tables 2-1 and 2-2.
- the copper foil and the resin (prepreg) were bonded to each other without using any release agent or release material, and a copper foil with a carrier was prepared. Evaluation was performed.
- Treatment liquid 3-glycidoxypropyltrimethoxysilane 0.9 volume% aqueous solution pH 5.0 to 9.0 Stirred at room temperature for 12 hours
- Treatment method After applying the treatment liquid using a spray coater, the treated surface is dried in air at 100 ° C. for 5 minutes.
- the release agent can be processed on the surface of the copper foil or the surface of the plate carrier (prepreg), and then the peel strength of the laminate, the peel strength after heating, the peel It can be seen that the same results were obtained in workability.
- a prepreg having a thickness of 200 ⁇ m was used as the plate-like carrier when laminating the plate-like carrier (prepreg) and the copper foil.
- the prepreg had a square shape of 550 mm square, and the copper foil had a rectangular shape of 550 mm ⁇ 500 mm square.
- the positional relationship between the prepreg and the copper foil was such that the center of the copper foil and the center position of the prepreg were matched, and the copper foil side and the prepreg side were arranged in parallel and laminated (the modes of FIGS. 14 and 15).
- an aluminum plate having a thickness of 550 mm ⁇ 500 mm square and a thickness of 0.1 mm was placed at the same position on the copper foil and laminated. By doing so, it is possible to manufacture a laminate having a structure in which the resin of the prepreg flows during the thermocompression pressing and covers the side surface of the end portion of the copper foil.
- the total length A of the edge of the prepreg is 2200 mm
- the length B of the edge of the prepreg covered with the copper foil is 1000 mm
- the ratio of B to A (B / A) is 0.45.
- the ratio (Sa / Sb) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.91. Copper foil was laminated on both sides of the prepreg.
- the ratio (B / A) to the total length A of the edge of the prepreg is 0 (zero). Further, the ratio (Sa / Sb) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.83. Copper foil was laminated on both sides of the prepreg.
- Experimental Example 2-5 to Experimental Example 2-10 except that the square of the copper foil having the dimensions shown in Experimental Example 2-1 has a shape having a curve with a curvature radius of 25 mm, Experimental Example 2- A copper foil and a prepreg were laminated under the same conditions as in No. 1 (not shown). At this time, the ratio (B / A) to the total length A of the edge of the prepreg is 0.41. Further, the ratio (Sa / Sb) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.91. Copper foil was laminated on both sides of the prepreg.
- the prepreg shown in Experimental Example 2-2 has an octagonal shape obtained by cutting off the prepreg edge at a distance of 25 mm from each vertex with a straight line connecting two points on the prepreg edge. 2 except that the copper foil shown in FIG. 2 is an octagonal shape cut off by a straight line connecting two points on the edge of the copper foil at a distance of 25 mm from each vertex, under the same conditions as in Experimental Example 2-1.
- a copper foil and a prepreg were laminated (not shown). At this time, the ratio (B / A) to the total length A of the edge of the prepreg is 0 (zero). Further, the ratio (Sa / Sb) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.83. Copper foil was laminated on both sides of the prepreg.
- a hole with a diameter of 1 mm was formed in four portions of the copper foil with a carrier thus produced where the plate-like carrier was exposed, and used as a guide hole for positioning in the subsequent build-up process.
- FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd., JTC 12 ⁇ m (product name)) are sequentially stacked on both sides of the copper foil with a carrier thus produced.
- a four-layer copper-clad laminate was produced by hot pressing at 170 ° C. for 100 minutes at a pressure of 150 ° C.
- a 100 ⁇ m diameter hole penetrating the copper foil on the surface of the four-layer copper-clad laminate and the insulating layer (cured prepreg) thereunder was drilled using a laser processing machine.
- electroless copper plating on the copper foil surface on the copper foil with carrier exposed at the bottom of the hole, the side surface of the hole, and the copper foil on the surface of the four-layer copper-clad laminate, and copper plating by electrolytic copper plating The electrical connection was formed between the copper foil on the copper foil with a carrier and the copper foil on the surface of the four-layer copper-clad laminate.
- a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this manner, a four-layer buildup substrate can be produced.
- the copper foil that was in close contact with the plate-like carrier on the two sets of two-layer build-up wiring boards was etched to form a wiring to obtain two sets of two-layer build-up wiring boards.
- Example 2-13> A copper foil with a carrier was prepared using the same copper foil, mold release agent and prepreg as in Experimental Example 2-1, except that both the copper foil and the prepreg were in the shape of a square of 550 mm square in Experimental Example 2-1.
- a two-layer build-up wiring board was obtained by the same procedure as in Experimental example 2-1.
- Nickel-zinc alloy plating Ni concentration 17g / L (added as NiSO 4 ) Zn concentration 4g / L (added as ZnSO 4) pH 3.1 Liquid temperature 40 °C Current density 0.1-10A / dm 2 Plating time 0.1 to 10 seconds
- an aqueous solution of the mold release agent is applied using a spray coater, and then the copper foil surface is dried in air at 100 ° C. Was pasted together.
- the type of release agent the stirring time from when the release agent is dissolved in water to before application, the concentration of the release agent in the aqueous solution, the alcohol concentration in the aqueous solution, the pH of the aqueous solution Is shown in Table 3-1.
- the release material resin coating on the S-surface or plate carrier is formed by applying a resin coating composition having the composition shown in Table 3-1 by a gravure coating method, and then using a doctor blade.
- the thickness was adjusted to 2-4 ⁇ m.
- the applied resin coating film was baked by heating at 150 ° C. for 30 seconds.
- bisphenol A type epoxy resin is used as the epoxy resin shown in Table 3-1
- methyl etherified melamine resin is used as the melamine resin
- polytetrafluoroethylene is used as the fluororesin
- dimethyl silicone resin is used. Used dimethylpolysiloxane.
- the laminated body has a thermal history during further heat treatment such as circuit formation for the laminated body, the conditions described in Table 3-1 (here, 220 ° C. for 3 hours) The heat treatment was performed.
- Treatment liquid 3-glycidoxypropyltrimethoxysilane 0.9 volume% aqueous solution pH 5.0 to 9.0 Stirred at room temperature for 12 hours
- Treatment method After applying the treatment liquid using a spray coater, the treated surface is dried in air at 100 ° C. for 5 minutes.
- the release agent can be processed on the surface of the copper foil or the surface of the plate carrier (prepreg), and then the peel strength of the laminate, the peel strength after heating, the peel It can be seen that the same results were obtained in workability.
- a prepreg having a thickness of 200 ⁇ m was used as the plate-like carrier when laminating the plate-like carrier (prepreg) and the copper foil.
- the prepreg had a square shape of 550 mm square, and the copper foil had a square shape of 600 mm ⁇ 600 mm square.
- the positional relationship between the prepreg and the copper foil was such that the center of the copper foil and the center position of the prepreg were aligned, and the sides of the copper foil and the prepreg were arranged in parallel (in the form of FIG. 17).
- the ratio (Sb / Sa) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.84.
- the copper foil was laminated on both sides of the prepreg, and both sides had the same shape and the same area.
- region containing the square part of two laminated copper foils was welded using the ultrasonic welding machine.
- the ratio (Sp / Sq) of the area (Sp) where the copper foil is welded to the area (Sq) of the copper foil including the welded surface is 0.001.
- Experimental Example 3-2 except that the portion from the two laminated copper foils to the 10 mm width from the end of the copper foil was welded using an ultrasonic welder all around the circumference.
- a copper foil and a prepreg were laminated under the same conditions as in No. 1 (embodiment of FIG. 17).
- the ratio (Sb / Sa) of the area (Sa) of the copper foil and the area (Sb) of the prepreg when viewed in plan is 0.84.
- ratio (Sp / Sq) of the area (Sp) where the copper foil is welded and the area (Sq) of the copper foil including the welded surface is 0.07.
- a hole having a diameter of 1 mm was formed in four portions of the laminate thus produced where the plate-like carrier was exposed, and used as a guide hole for positioning in the subsequent build-up process.
- FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd., JTC 12 ⁇ m (product name)) are sequentially stacked on both sides of the laminate thus produced, and a pressure of 3 MPa. Was subjected to hot pressing at 170 ° C. for 100 minutes to prepare a four-layer copper-clad laminate.
- a 100 ⁇ m diameter hole penetrating the copper foil on the surface of the four-layer copper-clad laminate and the insulating layer (cured prepreg) thereunder was drilled using a laser processing machine.
- copper plating is performed by electroless copper plating and electrolytic copper plating on the copper foil surface on the laminate exposed at the bottom of the hole, the side surface of the hole, and the copper foil on the surface of the four-layer copper-clad laminate.
- An electrical connection was formed between the copper foil on the laminate and the copper foil on the surface of the four-layer copper clad laminate.
- a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this manner, a four-layer buildup substrate can be produced.
- the plate-like carrier and copper foil of the laminate are machined. Two sets of two-layer build-up wiring boards were obtained by peeling off and separating.
- the copper foil that was in close contact with the plate-like carrier on the two sets of two-layer build-up wiring boards was etched to form a wiring to obtain two sets of two-layer build-up wiring boards.
- Example 3-13 A copper foil with a carrier was prepared using the same copper foil, mold release agent and prepreg as in Experimental Example 3-1, except that both the copper foil and the prepreg were in the shape of a square of 550 mm square in Experimental Example 3-1.
- a two-layer build-up wiring board was obtained by the same procedure as in Experimental example 3-1.
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Abstract
Description
(1)樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層物であって、
前記板状キャリアおよび前記金属箔の積層面の面積が、前記板状キャリアおよび前記金属箔の群から選択されるものの内、少なくとも一つの面積よりも小さい積層物。
(2)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔であって、
平面視したときに、前記板状キャリアの少なくとも端部の少なくとも一部が前記金属箔で覆われていないキャリア付金属箔。
(3)(2)に記載のキャリア付金属箔であって、
平面視したときに、前記板状キャリアの少なくとも端部の全部が前記金属箔で覆われていないキャリア付金属箔。
(4)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔であって、
平面視したときに、前記金属箔の面積が前記板状キャリアの面積よりも小さいキャリア付金属箔。
(5)板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である(2)~(4)のいずれかに記載のキャリア付金属箔。
(6)平面視したときに、前記板状キャリアの形状が多角形である(2)~(5)のいずれかに記載のキャリア付金属箔。
(7)前記板状キャリアの少なくとも1つの頂点が前記金属箔で覆われていない(6)に記載のキャリア付金属箔。
(8)前記板状キャリアの2以上の頂点が前記金属箔で覆われていない(6)または(7)に記載のキャリア付金属箔。
(9)前記板状キャリアの全ての頂点が前記金属箔で覆われていない(6)~(8)のいずれかに記載のキャリア付金属箔。
(10)前記金属箔が多角形である(2)~(9)のいずれかに記載のキャリア付金属箔。
(11)前記板状キャリアの縁(ふち)の全長さをA(mm)として、前記板状キャリアの金属箔に覆われている縁(ふち)の長さをB(mm)とした場合に、Aに対するBの比(=B/A)の値が0~0.8である(2)~(10)のいずれかに記載のキャリア付金属箔。
(12)樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔であって、
前記金属箔が前記板状キャリアよりも小さく、かつ、前記金属箔の少なくとも一対の対向する辺が当該辺に対応する板状キャリアの辺と比べて両端のそれぞれにおいて0.1mm以上短い(2)~(11)のいずれかに記載のキャリア付金属箔。
(13)平面視したときの金属箔の面積(Sa)と板状キャリアの面積(Sb)との比(Sa/Sb)が、0.7以上である(2)~(12)のいずれかに記載のキャリア付金属箔。
(14)前記板状キャリアの金属箔で覆われていない領域において、直径0.01mm~10mmの孔が1~10箇所設けられた(2)~(13)のいずれかに記載のキャリア付金属箔。
(15)樹脂製の板状キャリアが熱硬化性樹脂を含む(2)~(14)のいずれかに記載のキャリア付金属箔。
(16)樹脂製の板状キャリアがプリプレグである(2)~(15)のいずれかに記載のキャリア付金属箔。
(17)前記板状キャリアは、120~320℃のガラス転移温度Tgを有する(15)または(16)に記載のキャリア付金属箔。
(18)前記金属箔の前記キャリアと接する側表面の十点平均粗さ(Rz jis)が、3.5μm以下である(2)~(17)のいずれかに記載のキャリア付金属箔。
(19)前記金属箔の前記キャリアと接しない側の表面の十点平均粗さ(Rz jis)が、0.4μm以上10.0μm以下である(2)~(18)のいずれかに記載のキャリア付金属箔。
(20)前記金属箔の厚みが、1μm以上400μm以下である(2)~(19)のいずれかに記載のキャリア付金属箔。
(21)前記板状キャリアの厚みが5μm以上1000μm以下である(2)~(20)のいずれかに記載のキャリア付金属箔。
(22)板状キャリアと金属箔とを、離型剤を用いて貼り合わせてなる(2)~(21)のいずれかに記載のキャリア付金属箔。
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる(22)に記載のキャリア付金属箔。
(24)前記離型剤が、分子内に2つ以下のメルカプト基を有する化合物を用いてなる(22)に記載のキャリア付金属箔。
に示すアルミネート化合物、チタネート化合物、ジルコネート化合物、これらの加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる(22)に記載のキャリア付金属箔。
(26)板状キャリアと金属箔とを、シリコーンと、エポキシ系樹脂、メラミン系樹脂およびフッ素樹脂から選択されるいずれか1つまたは複数の樹脂とで構成される樹脂塗膜を用いて貼り合わせてなる(2)~(21)のいずれかに記載のキャリア付金属箔。
(27)220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である(2)~(26)のいずれかに記載のキャリア付金属箔。
(28)前記金属箔が、銅箔である(2)~(27)のいずれかに記載のキャリア付金属箔。
(29)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記金属箔の面積が前記板状キャリアの面積よりも小さく、かつ、前記金属箔の端部側面の一部または全部が樹脂で覆われている積層体。
(30)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記金属箔の面積が前記板状キャリアの面積よりも小さく、かつ、前記金属箔の板状キャリアと接しない側の端部表面の一部または全部が樹脂で覆われている積層体。
(31)樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層体である(29)または(30)に記載の積層体。
(32)板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である(29)~(31)のいずれかに記載の積層体。
(33)平面視したときに、前記板状キャリアの形状が多角形である(29)~(32)のいずれかに記載の積層体。
(34)前記板状キャリアの少なくとも1つの頂点が前記金属箔で覆われていない(33)に記載の積層体。
(35)前記板状キャリアの2以上の頂点が前記金属箔で覆われていない(33)または(34)に記載の積層体。
(36)前記板状キャリアの全ての頂点が前記金属箔で覆われていない(33)~(35)のいずれかに記載の積層体。
(37)前記金属箔が多角形である(29)~(36)のいずれかに記載の積層体。
(38)前記板状キャリアの縁(ふち)の全長さをA(mm)として、前記板状キャリアの金属箔に覆われている縁(ふち)の長さをB(mm)とした場合に、Aに対するBの比(=B/A)の値が0~0.8である(29)~(37)のいずれかに記載の積層体。
(39)樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔を得るための積層体であって、
前記金属箔が前記板状キャリアよりも小さく、かつ、前記金属箔の少なくとも一対の対向する辺が当該辺に対応する板状キャリアの辺と比べて両端のそれぞれにおいて0.1mm以上短い(29)~(38)のいずれかに記載の積層体。
(40)平面視したときの金属箔の面積(Sa)と板状キャリアの面積(Sb)との比(Sa/Sb)が、0.7以上である(29)から(39)のいずれかに記載の積層体。
(41)前記板状キャリアの金属箔で覆われていない領域において、直径0.01mm~10mmの孔が1~10箇所設けられた(29)~(40)のいずれかに記載の積層体。
(42)樹脂製の板状キャリアが熱硬化性樹脂を含む(29)~(41)のいずれかに記載の積層体。
(43)樹脂製の板状キャリアがプリプレグである(29)~(42)のいずれかに記載の積層体。
(44)前記板状キャリアは、120~320℃のガラス転移温度Tgを有する(42)または(43)に記載の積層体。
(45)前記金属箔の前記キャリアと接する側表面の十点平均粗さ(Rz jis)が、3.5μm以下である(29)~(44)のいずれかに記載の積層体。
(46)前記金属箔の前記キャリアと接しない側の表面の十点平均粗さ(Rz jis)が、0.4μm以上10.0μm以下である(29)~(45)のいずれかに記載の積層体。
(47)前記金属箔の厚みが、1μm以上400μm以下である(29)~(46)のいずれかに記載の積層体。
(48)前記板状キャリアの厚みが5μm以上1000μm以下である(29)~(47)のいずれかに記載の積層体。
(49)板状キャリアと金属箔とを、離型剤を用いて貼り合わせてなる(29)~(48)のいずれかに記載の積層体。
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる(49)に記載の積層体。
(51)前記離型剤が、分子内に2つ以下のメルカプト基を有する化合物を用いてなる(49)に記載の積層体。
に示すアルミネート化合物、チタネート化合物、ジルコネート化合物、これらの加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる(49)に記載の積層体。
(53)板状キャリアと金属箔とを、シリコーンと、エポキシ系樹脂、メラミン系樹脂およびフッ素樹脂から選択されるいずれか1つまたは複数の樹脂とで構成される樹脂塗膜を用いて貼り合わせてなる(29)~(48)のいずれかに記載の積層体。
(54)220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である(29)~(53)のいずれかに記載の積層体。
(55)前記金属箔が、銅箔である(29)~(54)のいずれか一項に記載の積層体。
(56)(29)~(55)のいずれかに記載の積層体を、当該積層体の金属箔上で切断して得られるキャリア付金属箔。
(57)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記金属箔の少なくとも一部が、前記板状キャリアの端部よりも外側にはみ出し、当該金属箔同士がこのはみ出し部分において板状キャリアを介さずに接する部分の少なくとも一部が溶接または接着されている積層体。
(58)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
前記板状キャリアの積層面が板状キャリアよりも外形が大きい前記金属箔で覆われるとともに、金属箔同士が板状キャリアを介さずに接する部分の一部が溶接または接着されている積層体。
(59)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
前記板状キャリアの積層面が板状キャリアよりも外形が大きい前記金属箔で覆われるとともに、金属箔の外周部同士が全周にわたって溶接または接着されている積層体。
(60)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
前記板状キャリアの積層面が板状キャリアよりも外形が大きい前記金属箔で覆われるとともに、金属箔同士が板状キャリアを介さずに接する部分が全面にわたって溶接または接着されている積層体。
(61)板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である(57)~(60)のいずれかに記載の積層体。
(62)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記板状キャリアの外側で、金属箔同士が板状キャリアを介さずに接する部分が存在するように、板状キャリアに対して金属箔が積層されるとともに、金属箔同士が板状キャリアを介さずに接する部分の一部が溶接または接着されている積層体。
(63)(1)に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記板状キャリアの外側で、金属箔同士が板状キャリアを介さずに接する部分が存在するように、板状キャリアに対して金属箔が積層されるとともに、金属箔同士が板状キャリアを介さずに接する部分が全面にわたって溶接または接着されている積層体。
(64)板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である(62)または(63)に記載の積層体。
(65)平面視したときの金属箔の面積(Sa)と板状キャリアの面積(Sb)との比(Sb/Sa)が、0.6以上1.0未満である(57)~(64)のいずれかに記載の積層体。
(66)前記二つの金属箔が溶接または接着されている面積(Sp)と、前記当該溶接または接着された面を含む金属箔の面積(Sq)との比(Sp/Sq)が0.001以上0.2以下である(57)~(65)のいずれかに記載の積層体。
(67)樹脂製の板状キャリアが熱硬化性樹脂を含む(57)~(66)のいずれかに記載の積層体。
(68)樹脂製の板状キャリアがプリプレグである(57)~(67)のいずれかに記載の積層体。
(69)前記板状キャリアは、120~320℃のガラス転移温度Tgを有する(67)または(68)に記載の積層体。
(70)前記金属箔の前記キャリアと接する側表面の十点平均粗さ(Rz jis)が、3.5μm以下である(57)~(69)のいずれかに記載の積層体。
(71)前記金属箔の前記キャリアと接しない側の表面の十点平均粗さ(Rz jis)が、0.4μm以上10.0μm以下である(57)~(70)のいずれかに記載の積層体。
(72)前記金属箔の厚みが、1μm以上400μm以下である(57)~(71)のいずれかに記載の積層体。
(73)前記板状キャリアの厚みが5μm以上1000μm以下である(57)~(72)のいずれかに記載の積層体。
(74)(57)~(73)のいずれかに記載の積層体において、金属箔が板状キャリアを介さずに接している部分、または板状キャリアの金属箔に覆われず露出している部分において、直径0.01mm~10mmの孔が1~10箇所設けられた積層体。
(75)板状キャリアと金属箔とを、離型剤を用いて貼り合わせてなる(57)~(74)のいずれかに記載の積層体。
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる(75)に記載の積層体。
(77)前記離型剤が、分子内に2つ以下のメルカプト基を有する化合物を用いてなる(75)に記載の積層体。
に示すアルミネート化合物、チタネート化合物、ジルコネート化合物、これらの加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる(75)に記載の積層体。
(79)板状キャリアと金属箔とを、シリコーンと、エポキシ系樹脂、メラミン系樹脂およびフッ素樹脂から選択されるいずれか1つまたは複数の樹脂とで構成される樹脂塗膜を用いて貼り合わせてなる(57)~(74)のいずれかに記載の積層体。
(80)220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である(57)~(79)のいずれかに記載の積層体。
(81)前記金属箔が、銅箔である(57)~(80)のいずれかに記載の積層体。
(82)(57)~(81)のいずれかに記載の積層体を、平面視したときに、金属箔が溶接または接着されている部分よりも内側で切断して得られるキャリア付金属箔。
(83)(1)に記載の積層物の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
(84)(1)に記載の積層物の少なくとも一つの金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面金属張積層板、または(1)に記載の積層物、または(2)~(28),(56),(82)のいずれか一項に記載のキャリア付金属箔、または(29)~(55),(57)~(81)のいずれか一項に記載の積層体、または金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
(85)(2)~(28)のいずれかに記載のキャリア付き金属箔の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
(86)(2)~(28)のいずれかに記載のキャリア付き金属箔の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面金属張積層板、(1)に記載の積層物、または(2)~(28),(56),(82)のいずれかに記載のキャリア付金属箔、または(29)~(55),(57)~(81)のいずれかに記載の積層体、または金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
(87)前記樹脂の少なくとも一つがプリプレグであることを特徴とする(83)~(86)のいずれか一項に記載の多層金属張積層板の製造方法。
(88)(83)~(87)のいずれかに記載の多層金属張積層板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含む多層金属張積層板の製造方法。
(89)(84)~(87)のいずれかに記載の製造方法において、前記キャリア付金属箔の板状キャリアと金属箔を剥離して分離する工程を更に含む多層金属張積層板の製造方法。
(90)(88)に記載の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含む多層金属張積層板の製造方法。
(91)(89)~(90)のいずれかに記載の製造方法において、剥離して分離した金属箔の一部または全部をエッチングにより除去する工程を含む多層金属張積層板の製造方法。
(92)(83)~(91)のいずれかに記載の製造方法により得られる多層金属張積層板。
(93)(1)に記載の積層物の金属箔側に、ビルドアップ配線層を一層以上形成する工程を含むビルドアップ基板の製造方法。
(94)(1)に記載の積層物の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、(1)に記載の積層物、(2)~(28),(56),(82)のいずれかに記載のキャリア付き金属箔、(29)~(55),(57)~(81)のいずれか一項に記載の積層体、または金属箔を1回以上繰り返して積層することを含むビルドアップ基板の製造方法。
(95)(2)~(28)のいずれかに記載のキャリア付き金属箔の金属箔側に、ビルドアップ配線層を一層以上形成する工程を含むビルドアップ基板の製造方法。
(96)ビルドアップ配線層はサブトラクティブ法又はフルアディティブ法又はセミアディティブ法の少なくとも一つを用いて形成される(93)または(95)に記載のビルドアップ基板の製造方法。
(97)(2)~(28)のいずれかに記載のキャリア付き金属箔の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、(1)に記載の積層物、(2)~(28),(56),(82)のいずれかに記載のキャリア付き金属箔、(29)~(55),(57)~(81)のいずれかに記載の積層体、または金属箔を1回以上繰り返して積層することを含むビルドアップ基板の製造方法。
(98)(94)または(97)に記載のビルドアップ基板の製造方法において、片面あるいは両面配線基板、片面あるいは両面金属張積層板、積層物の金属箔、積層物の板状キャリア、キャリア付き金属箔の金属箔、キャリア付き金属箔の板状キャリア、積層体の金属箔、積層体の板状キャリア、金属箔、又は樹脂に穴を開け、当該穴の側面および底面に導通めっきをする工程を更に含むビルドアップ基板の製造方法。
(99)(97)または(98)に記載のビルドアップ基板の製造方法において、前記片面あるいは両面配線基板を構成する金属箔、片面あるいは両面金属張積層板を構成する金属箔、積層物を構成する金属箔、キャリア付き金属箔を構成する金属箔、積層体を構成する金属箔及び金属箔の少なくとも一つに配線を形成する工程を1回以上行うことを更に含むビルドアップ基板の製造方法。
(100)配線形成された表面の上に、片面に金属箔を密着させた(1)に記載の積層物のキャリア側、片面に金属箔を密着させた(2)~(28)、(56)のいずれかに記載のキャリア付金属箔のキャリア側、または片面に金属箔を密着させた(29)~(55)のいずれかに記載の積層体のキャリア側を接触させて積層する工程を更に含む(99)に記載のビルドアップ基板の製造方法。
(101)配線形成された表面の上に、樹脂を積層し、当該樹脂に両面に金属箔を密着させた(1)に記載の積層物、両面に金属箔を密着させた(2)~(28),(56),(82)のいずれかに記載のキャリア付金属箔、または両面に金属箔を密着させた(29)~(55),(57)~(81)のいずれかに記載の積層体の一方の金属箔を接触させて積層する工程を更に含む(99)に記載のビルドアップ基板の製造方法。
(102)前記樹脂の少なくとも一つがプリプレグであることを特徴とする(94),(97)~(101)のいずれかに記載のビルドアップ基板の製造方法。
(103)(93)~(102)のいずれかに記載のビルドアップ基板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含むビルドアップ配線板の製造方法。
(104)(93)~(102)のいずれかに記載のビルドアップ基板の製造方法において、積層した前記キャリア付金属箔の少なくとも一つにおける板状キャリアと金属箔とを剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
(105)(103)に記載のビルドアップ配線板の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
(106)(104)または(105)に記載のビルドアップ配線板の製造方法において、板状キャリアと密着していた金属箔の一部または全部をエッチングにより除去する工程を更に含むビルドアップ配線板の製造方法。
(107)(103)~(106)に記載の方法により得られるビルドアップ配線板。
(108)(103)~(106)に記載の方法によりビルドアップ配線板を製造する工程を含むプリント回路板の製造方法。
(109)(29)~(55),(57)~(81)のいずれかに記載の積層体の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
(110)(29)~(55),(57)~(81)のいずれかに記載の積層体の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面金属張積層板、または(1)に記載の積層物、または(2)~(28),(56),(82)のいずれかに記載のキャリア付金属箔、または(29)~(55),(57)~(81)のいずれかに記載の積層体、または金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
(111)前記樹脂の少なくとも一つがプリプレグであることを特徴とする(109)または(110)のいずれかに記載の多層金属張積層板の製造方法。
(112)(109)~(111)のいずれかに記載の多層金属張積層板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含む多層金属張積層板の製造方法。
(113)(109)~(111)のいずれかに記載の多層金属張積層板の製造方法において、積層した前記キャリア付金属箔の板状キャリアと金属箔を剥離して分離する工程を更に含む多層金属張積層板の製造方法。
(114)(112)に記載の多層金属張積層板の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含む多層金属張積層板の製造方法。
(115)(113)または(114)に記載の製造方法において、剥離して分離した金属箔の一部または全部をエッチングにより除去する工程を含む多層金属張積層板の製造方法。
(116)(109)~(115)のいずれかに記載の製造方法により得られる多層金属張積層板。
(117)(29)~(55),(57)~(81)のいずれかに記載の積層体の金属箔側に、ビルドアップ配線層を一層以上形成する工程を含むビルドアップ基板の製造方法。
(118)ビルドアップ配線層はサブトラクティブ法又はフルアディティブ法又はセミアディティブ法の少なくとも一方を用いて形成される(117)に記載のビルドアップ基板の製造方法。
(119)(29)~(55),(57)~(81)のいずれかに記載の積層体の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、または(1)に記載の積層物、または(29)~(55),(57)~(81)のいずれかに記載の積層体、または(2)~(28),(56),(82)のいずれかに記載のキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含むビルドアップ基板の製造方法。
(120)(119)に記載のビルドアップ基板の製造方法において、片面あるいは両面配線基板、片面あるいは両面金属張積層板、積層物の金属箔、積層物の板状キャリア、積層体の金属箔、積層体の板状キャリア、金属箔、キャリア付金属箔の金属箔、キャリア付金属箔の板状キャリア、又は樹脂に穴を開け、当該穴の側面および底面に導通めっきをする工程を更に含むビルドアップ基板の製造方法。
(121)(119)または(120)に記載のビルドアップ基板の製造方法において、前記片面あるいは両面配線基板を構成する金属箔、片面あるいは両面金属張積層板を構成する金属箔、積層物を構成する金属箔、積層体を構成する金属箔、キャリア付金属箔を構成する金属箔、及び金属箔の少なくとも一つに配線を形成する工程を1回以上行うことを更に含むビルドアップ基板の製造方法。
(122)配線形成された表面の上に、片面に金属箔を密着させた(1)に記載の積層物のキャリア側、または片面に金属箔を密着させた(29)~(55)のいずれかに記載の積層体のキャリア側、または片面に金属箔を密着させた(2)~(28),(56)のいずれかに記載のキャリア付金属箔のキャリア側を積層する工程を更に含む請求項(121)に記載のビルドアップ基板の製造方法。
(123)配線形成された表面の上に、樹脂を積層し、当該樹脂に両面に金属箔を密着させた(1)に記載の積層物、または両面に金属箔を密着させた(29)~(55),(57)~(81)のいずれかに記載の積層体、または両面に金属箔を密着させた(2)~(28),(56),(82)のいずれかに記載のキャリア付金属箔を積層する工程を更に含む(121)に記載のビルドアップ基板の製造方法。
(124)前記樹脂の少なくとも一つがプリプレグであることを特徴とする(119)~(123)のいずれかに記載のビルドアップ基板の製造方法。
(125)(117)~(124)のいずれかに記載のビルドアップ基板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含むビルドアップ配線板の製造方法。
(126)(117)~(124)のいずれか一項に記載のビルドアップ基板の製造方法において、積層した前記キャリア付金属箔の板状キャリアと金属箔を剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
(127)(125)に記載のビルドアップ配線板の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
(128)(126)または(127)に記載のビルドアップ配線板の製造方法において、板状キャリアと密着していた金属箔の一部または全部をエッチングにより除去する工程を更に含むビルドアップ配線板の製造方法。
(129)(125)~(128)のいずれかに記載の製造方法により得られるビルドアップ配線板。
(130)(125)~(128)のいずれかに記載の製造方法によりビルドアップ配線板を製造する工程を含むプリント回路板の製造方法。
以下、本発明の各実施形態について、詳細に説明する。
このキャリア付金属箔においては、樹脂製の板状キャリアと該キャリアの片面又は両面、好ましくは両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔を準備する。本発明に係るキャリア付金属箔の一構成例を図2および図20に示す。特に、図20の最初のところには、樹脂製の板状キャリア11cの両面に、金属箔11aを剥離可能に密着させたキャリア付金属箔11が示されている。板状キャリア11cと金属箔11aとの間は、後述する離型剤からなる層あるいは離型材11bを用いて貼り合わせられている。なお、図2、図20、図21は板状キャリアと金属箔とを重ね合わせる方向に対して垂直な方向から見たときの図である。図2、図20、図21において、板状キャリアと金属箔との接触している長さが同じように見えるが、図2、図20、図21に記載されているキャリア付金属箔は板状キャリアおよび金属箔の積層面の面積が、板状キャリアおよび金属箔の少なくとも一つの面積よりも小さい。
また、本発明に係る第三の実施形態では、前記積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体である。
この積層体においては、樹脂製の板状キャリアと該キャリアの片面又は両面、好ましくは両面に剥離可能に密着させた金属箔とから構成される。この積層体の一構成例を図2に示す。
本実施形態のキャリア付金属箔は、平面視したときに、前記金属箔の面積が前記板状キャリアの面積よりも小さい構造をとる。このような構造の代表的な例としては、平面視したときに、前記板状キャリアの少なくとも端部の少なくとも一部、例えば図3に示したように板状キャリアの頂点が前記金属箔で覆われていない構造が挙げられる。
図3、図4において、板状キャリア121と金属箔122と貼り合わせてキャリア付金属箔120を構成するが、両者を貼り合わせたときに、板状キャリア121の表面に金属箔で覆われない露出部123が現れる。
図5、図6において、板状キャリア131と金属箔132と貼り合わせてキャリア付金属箔130を構成するが、両者を貼り合わせたときに、板状キャリア131の表面であり、金属箔132を挟んで両側に金属箔で覆われない露出部133が現れる。
図7では、金属箔142の四角の頂点が曲面144を有しており、全体として、キャリア付金属箔140を平面視したときの板状キャリア141の面積よりも金属箔142の面積の方が小さい、すなわち板状キャリア141よりも金属箔142の方が小さくなっている。また、金属箔142の少なくとも一対の対向する辺が当該辺に対応する板状キャリア141の辺と比べて両端のそれぞれにおいて0.1mm以上短い構成となっており、好ましくは3mm以上、より好ましくは5mm以上、より好ましくは10mm以上、より好ましくは15mm以上、より好ましくは20mm以上、より好ましくは25mm以上、より好ましくは30mm以上である。なお、図7の場合、金属箔142において着目する辺の長さとは、板状キャリア141の対応する辺に向かって投影して得られる辺を仮想し、当該辺の長さとしている。すなわち、図7において、辺Eと同じ長さを指す。図7においても、板状キャリア141と金属箔142と貼り合わせてキャリア付金属箔140を構成するが、両者を貼り合わせたときに、板状キャリア141の表面であり、金属箔142を挟んで両側に金属箔で覆われない露出部143が現れる。なお、板状キャリア141の四角の頂点が曲面を有していても良い。
本実施形態の積層体は、平面視したときに、積層体を構成する金属箔の面積が同じく積層体を構成する板状キャリアの面積よりも小さい構造をとる。このような構造の代表的な例としては、平面視したときに、板状キャリアの少なくとも端部の少なくとも一部、例えば図10に示したように板状キャリア321の一部領域が金属箔322で覆われていない構造が挙げられる。
図10、図11において、板状キャリア321と金属箔322と貼り合わせて、後述するようなプレスを経て積層体320を構成するが、このプレスをしたときに板状キャリア321から樹脂が溶融し、金属箔322の端部に沿ってせり上がり、金属箔322の端部側面を覆って皮覆層323を形成する。
図13では、金属箔342の四角の頂点が曲面344を有しており、全体として、キャリア付金属箔340を平面視したときの板状キャリア341の面積よりも金属箔342の面積の方が小さい、すなわち板状キャリア341よりも金属箔342の方が小さくなっている。また、金属箔342の少なくとも一対の対向する辺が当該辺に対応する板状キャリア341の辺と比べて両端のそれぞれにおいて0.1mm以上短い構成となっている。なお、図13の場合、金属箔342において着目する辺の長さとは、板状キャリア341の対応する辺に向かって投影して得られる辺を仮想し、当該辺の長さとしている。すなわち、図13において、辺E’と同じ長さを指す。なお、図13の構成例のA-A’断面も、図11に示したものとなる。
図14、図15において、板状キャリア351と金属箔352と貼り合わせて、後述するようなプレスを経て積層板350を構成するが、このプレスをしたときに板状キャリア351から樹脂が溶融し、金属箔352の端部に沿ってせり上がり、さらに金属箔352の上面にも回り、金属箔352の端部側面および金属箔352の一部を覆って皮覆層353を形成する。
なお、板状キャリアが平面視したときの形状が四角形である場合を示したが、これ以外の多角形としてもよく、円や楕円等のその他の形としてもよい。一方、金属箔の頂点に曲面を持たせる場合を示したが、この曲面の変わりに平面とし、全体として多角形としてもよい。
本実施形態の積層体は、平面視したときに、前記金属箔の少なくとも一部が、前記板状キャリアの端部よりも外側にはみ出し、当該金属箔同士がこのはみ出し部分において板状キャリアを介さずに接する部分の少なくとも一部が溶接または接着されている。
図17、図18において、板状キャリア221と金属箔222と貼り合わせて、平面視したときに板状キャリア21の外側で、二つの金属箔222が溶接または接着され、積層体220が構成される。
すなわち、好ましい態様として、金属箔同士が板状キャリアを介さずに接する部分の一部が溶接または接着された態様1、金属箔の外周部同士が全周にわたって溶接または接着された態様2、金属箔同士が板状キャリアを介さずに接する部分が全面にわたって溶接または接着された態様3などが考えられるが、板状キャリアと金属箔との界面が露出していない方が好ましく、さらに金属箔同士の接着または溶接の面積が大きい方が好ましい。この観点から、態様2がさらに好ましく、態様3が一層好ましい。
次式に示す構造を有するシラン化合物、またはその加水分解生成物質、または該加水分解生成物質の縮合体(以下、単にシラン化合物と記述する)を単独でまたは複数混合して使用して、板状キャリアと金属箔を貼り合わせることで、適度に密着性が低下し、剥離強度を後述するような範囲に調節できる。
ハロゲン原子としては、フッ素原子、塩素原子、臭素原子およびヨウ素原子が挙げられる。
分子内に2つ以下のメルカプト基を有する化合物を使用して、板状キャリアと金属箔を貼り合わせることによっても、適度に密着性が低下し、剥離強度を後述するような範囲に調節できる。
但し、分子内に3つ以上のメルカプト基を有する化合物またはその塩を板状キャリアと金属箔との間に介在させて貼り合わせた場合、本願記載の剥離強度低減の目的には適さない。これは、分子内にメルカプト基が過剰に存在するとメルカプト基同士、またはメルカプト基と板状キャリア、またはメルカプト基と金属箔との化学反応によってスルフィド結合、ジスルフィド結合またはポリスルフィド結合が過剰に生成し、板状キャリアと金属箔の間に強固な3次元架橋構造が形成されることで剥離強度が上昇することがあると考えられるからである。このような事例は特許文献2(特開2000-196207)に開示されている。
次式に示す構造を有するアルミネート化合物、チタネート化合物、ジルコネート化合物、またはその加水分解生成物質、または該加水分解生成物質の縮合体(以下、単に金属アルコキシドと記述する)を単独でまたは複数混合して使用して、板状キャリアと金属箔を貼り合わせることで、適度に密着性が低下し、剥離強度を後述するような範囲に調節できる。
これらの炭化水素基は一つ以上の水素原子がハロゲン原子で置換されてもよく、例えば、フッ素原子、塩素原子、又は臭素原子で置換されることができる。
板状キャリアと金属箔とを、シリコーンと、エポキシ系樹脂、メラミン系樹脂およびフッ素樹脂から選択されるいずれか1つまたは複数の樹脂とで構成される樹脂塗膜を使用して、板状キャリアと金属箔を貼り合わせることで、適度に密着性が低下し、剥離強度を後述するような範囲に調節できる。
このキャリア付金属箔は、板状キャリアあるいは金属箔の少なくとも一方の表面に、上述した樹脂塗膜を塗布する工程と、この塗布した樹脂塗膜を硬化させる焼付け工程とを有する手順を経て得られる。また、第二の実施態様の積層体は、焼付け工程の後、後述するホットプレスにより得られ、第三の実施形態の積層体は、焼付け工程の後、前述のような金属箔同士の溶接または接着により得られる。以下、各工程について説明する。
塗布工程は、板状キャリアの片面または両面に、主剤としてのシリコーンと、硬化剤としてのエポキシ系樹脂、メラミン系樹脂と、必要に応じて剥離剤としてのフッ素樹脂とからなる樹脂塗料を塗布して樹脂塗膜を形成する工程である。樹脂塗料は、アルコール等の有機溶媒にエポキシ系樹脂、メラミン系樹脂、フッ素樹脂およびシリコーンを溶解したものである。また、樹脂塗料における配合量(添加量)は、シリコーン100質量部に対して、エポキシ系樹脂、メラミン系樹脂の合計が10~1500質量部であることが好ましい。また、フッ素樹脂は、シリコーン100質量部に対して、0~50質量部であることが好ましい。
焼付け工程は、塗布工程で形成された樹脂塗膜に125~320℃(焼付け温度)で0.5~60秒間(焼付け時間)の焼付け処理を施す工程である。このように、所定配合量の樹脂塗料で形成された樹脂塗膜に所定条件の焼付け処理を施すことによって、樹脂塗膜により付与される板状キャリアと金属箔との間の剥離強度が所定範囲に制御される。本発明において、焼付け温度は板状キャリアの到達温度である。また、焼付け処理に使用される加熱手段としては、従来公知の装置を使用する。
一般に、多層プリント配線板の製造過程では、積層プレス工程やデスミア工程で加熱処理することが多い。そのため、本発明のキャリア付金属箔または積層体を用いる場合、キャリア付金属箔または積層体が受ける熱履歴は、積層数が多くなるほど厳しくなる。従って、特に多層プリント配線板への適用を考える上では、所要の熱履歴を経た後にも、キャリア付金属箔または積層体から得られるキャリア付金属箔における、金属箔と板状キャリアとの剥離強度が先述した範囲にあることが望ましい。
特に第二の実施形態である積層体を製造する際のホットプレス時には、図16に示すように、板状キャリア321の上に金属箔322を貼り合わせた後、さらに金属箔322の上面にカバー板325を乗せて、カバー板325の上からプレス機326にて、方向Pに向かって加圧する。これにより、板状キャリアから溶融した樹脂分が方向rに向かって流れて、面方向に対して垂直な方向から見たときに、板状キャリア321と金属箔322との界面を露出させないように皮覆することができる。このようにして、面方向に対して垂直な方向から見たときに、金属箔端部側面または端部上面の一部又は全部が樹脂で覆われている積層板を構成することができる。
本発明の積層物の用途としては、積層物の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法が挙げられる。
さらに、積層物の少なくとも一つの金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面金属張積層板、または本発明の積層物、または本発明のキャリア付金属箔、または本発明の積層体、または本発明の積層体から得られるキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法が挙げられる。なお、最初の積層物に積層した樹脂以降の積層は、所望する回数だけ行われ、各積層回とも、樹脂、片面あるいは両面金属張積層板、本発明の積層物、本発明のキャリア付金属箔、本発明の積層体および金属箔からなる群から任意に選択することができる。
上記の多層金属張積層板の製造方法においては、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含んでいてもよい。これにより、特に第二および第三の実施形態の積層体部分において板状キャリアと金属箔とが剥離可能な状態となる。したがって、切断する積層面は、剥離する対象となる板状キャリアと金属箔とが剥離可能な状態になるような面とすることが好ましい。なお、ここで「板状キャリアと金属箔との積層面にて切断する」とは切断面が板状キャリアと金属箔との積層面と交わるように切断することをいう(以下、同じ)。また、この切断する工程は、後段のキャリア付金属箔部分の板状キャリアと金属箔との剥離を行うに際しては必須ではない。
さらに、この切断した多層銅張積層板について、板状キャリアと金属箔とを剥離して分離する工程を含んでいてもよい。なお、板状キャリアと金属箔との分離する箇所は、切断処理後または切断処理前の積層物、切断処理後または切断処理前のキャリア付金属箔、または切断処理後の積層体である。(以下、同じ)
またさらに、前記板状キャリアと金属箔とを剥離して分離した後、金属箔の一部または全部をエッチングにより除去する工程を更に含むことができる。
さらに、積層物の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、本発明の積層物、本発明のキャリア付き金属箔、本発明の積層体、または本発明の積層体から得られるキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含むビルドアップ基板の製造方法が挙げられる。なお、最初の積層物に積層した樹脂以降の積層は、所望する回数だけ行われ、各積層回とも、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、本発明の積層物、本発明のキャリア付金属箔、本発明の積層体および金属箔からなる群から任意に選択することができる。
後述する、キャリア付金属箔または積層板を用いたビルドアップ基板の製造方法に示したように、必要に応じて、各ビルドアップ基板の構成層について穴を開け、および/または必要に応じて配線を形成し、さらに必要に応じて、最表面の配線上に、本発明の積層物、本発明のキャリア付金属箔または本発明の積層板を積層してもよい。
上記のビルドアップ基板の製造方法においては、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含んでいてもよい。これにより、特に第二および第三の実施形態の積層体部分において板状キャリアと金属箔とが剥離可能な状態となる。したがって、切断する積層面は、剥離する対象となる板状キャリアと金属箔とが剥離可能な状態になるような面とすることが好ましい。なお、この切断する工程は、後段のキャリア付金属箔部分の板状キャリアと金属箔との剥離を行うに際しては必須ではない。
さらに、この切断した多層銅張積層板について、板状キャリアと金属箔とのを剥離して分離する工程を含んでいてもよい。
またさらに、前記板状キャリアと金属箔とを剥離して分離した後、金属箔の一部または全部をエッチングにより除去する工程を更に含むことができる。
第一に、上述したキャリア付金属箔の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上、例えば1~10回繰り返して積層することを含む多層金属張積層板の製造方法が提供される。
第一に、上述した積層体の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上、例えば1~10回繰り返して積層することを含む多層金属張積層板の製造方法が提供される。
さらに、このビルドアップ基板の最表面には、本発明の片面に金属箔を密着させたキャリア付金属箔の金属箔の樹脂側を接触させて積層してもよいし、一旦樹脂を積層した後に、本発明の両面に金属箔を密着させたキャリア付金属箔の一方の金属箔を接触させて積層してもよい。
さらに、このビルドアップ基板の最表面には、本発明の片面に金属箔を密着させた積層体の樹脂側、または片面に金属箔を密着させたキャリア付金属箔の樹脂側を接触させて積層してもよいし、一旦樹脂を積層した後に、本発明の両面に金属箔を密着させた積層体の一方の金属箔、または両面に金属箔を密着させたキャリア付金属箔の一方の金属箔を接触させて積層してもよい。なお、最後に積層体を密着させる場合、その前段までで積層体の金属箔が切断面に含まれるような所定の箇所でのカットをしておいてもよいが、最後の積層体の密着までカットを行わず、最後に全ての積層体の金属面が切断面に含まれるようにカットしてもよい。
さらに、このビルドアップ基板の最表面には、本発明の片面に金属箔を密着させた積層体の樹脂側、または片面に金属箔を密着させたキャリア付金属箔の樹脂側を接触させて積層してもよいし、一旦樹脂を積層した後に、本発明の両面に金属箔を密着させた積層体の一方の金属箔、または両面に金属箔を密着させたキャリア付金属箔の一方の金属箔を接触させて積層してもよい。
さらに、このビルドアップ基板の最表面には、本発明の片面に金属箔を密着させた積層体の樹脂側、または片面に金属箔を密着させたキャリア付金属箔の樹脂側を接触させて積層してもよいし、一旦樹脂を積層した後に、本発明の両面に金属箔を密着させた積層体の一方の金属箔、または両面に金属箔を密着させたキャリア付金属箔の一方の金属箔を接触させて積層してもよい。なお、最後に積層体を密着させる場合、その前段までで積層体の金属箔が切断面に含まれるような所定の箇所でのカットをしておいてもよいが、最後の積層体の密着までカットを行わず、最後に全ての積層体の金属面が切断面に含まれるようにカットしてもよい。
<実験例1-1>
複数の電解銅箔(厚さ12μm)を準備し、それぞれの電解銅箔のシャイニー(S)面に対して、下記の条件によるニッケル-亜鉛(Ni-Zn)合金めっき処理およびクロメート(Cr-Znクロメート)処理を施し、貼り合わせ面(ここではS面)の十点平均粗さ(Rz jis:JIS B 0601:2001に準拠して測定)を1.5μmとした後、樹脂として南亜プラスティック社製のプリプレグ(FR-4レジン)を当該電解銅箔のS面と貼り合わせ、170℃で100分ホットプレス加工を行って、キャリア付銅箔を作製した。
Ni濃度 17g/L(NiSO4として添加)
Zn濃度 4g/L(ZnSO4として添加)
pH 3.1
液温 40℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒
Cr濃度 1.4g/L(CrO3またはK2CrO7として添加)
Zn濃度 0.01~1.0g/L(ZnSO4として添加)
Na2SO4濃度 10g/L
pH 4.8
液温 55℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒
また、当該S面または板状キャリアへの離型材樹脂塗膜の形成は、表1-1に示した組成を有する樹脂塗膜用の組成物をグラビアコート法により塗布した後、ドクターブレードを用いてその厚みを2~4μmに調節した。また、塗布した樹脂塗膜は、150℃で、30秒間加熱して焼き付け処理を行った。なお、表1-1で示したエポキシ系樹脂としてはビスフェノールA型エポキシ樹脂を用い、メラミン系樹脂としてはメチルエーテル化メラミン樹脂を用い、フッ素樹脂としてはポリテトラフルオロエチレンを用い、ジメチルシリコーンレジンとしてはジメチルポリシロキサンを用いた。
表1-1に示す銅箔、樹脂(プリプレグ)および離型剤を用いて、実験例1-1と同様の手順で、キャリア付銅箔を作製した。実験例1-3、実験例1-7、実験例1-10においては、離型剤を板状キャリア上に塗布した。また、表1-1に示した条件の熱処理を行った。それぞれについて実験例1-1と同様の評価を行った。結果を表1-1、表1-2に示す。
実験例1-12では、離型剤および離型材のいずれも用いることなく、銅箔と樹脂(プリプレグ)とを貼り合わせて、キャリア付銅箔を作製して、実験例1-1と同様の評価を行った。
処理液:3-グリシドキシプロピルトリメトキシシラン 0.9体積%水溶液
pH5.0~9.0
12時間常温で攪拌したもの
処理方法:スプレーコーターを用いて処理液を塗布後、100℃の空気中で5分間処理面を乾燥させる。
Cu濃度 20g/L(CuSO4として添加)
H2SO4濃度 50~100g/L
As濃度 0.01~2.0g/L(亜ヒ酸として添加)
液温 40℃
電流密度 40~100A/dm2
めっき時間 0.1~30秒
実験例1-1において、銅箔およびプリプレグの両方につき、550mm角の正方形の形状とした以外は、実験例1-1と同様の銅箔、離型剤およびプリプレグを用いて、キャリア付銅箔を作製し、実験例1-1と同様の手順にて2層ビルドアップ配線板を得た。
また、実験例1-13と実験例1-1とを比較すると、実験例1-1の方がプリプレグと銅箔との界面で剥がれかかった状態の個数が少なかった。
また、実験例1-1と実験例1-2~実験例1-11とを比較すると、実験例1-2~実験例1-11の方がプリプレグと銅箔との界面で剥がれかかった状態の個数が少なかった。
<実験例2-1>
複数の電解銅箔(厚さ12μm)を準備し、それぞれの電解銅箔のシャイニー(S)面に対して、下記の条件によるニッケル-亜鉛(Ni-Zn)合金めっき処理およびクロメート(Cr-Znクロメート)処理を施し、貼り合わせ面(ここではS面)の十点平均粗さ(Rz jis:JIS B 0031(2003)に準拠して測定)を1.5μmとした後、樹脂として南亜プラスティック社製のプリプレグ(FR-4レジン)を当該電解銅箔のS面と貼り合わせ、170℃で100分ホットプレス加工を行って、キャリア付銅箔を作製した。
Ni濃度 17g/L(NiSO4として添加)
Zn濃度 4g/L(ZnSO4として添加)
pH 3.1
液温 40℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒
Cr濃度 1.4g/L(CrO3またはK2CrO7として添加)
Zn濃度 0.01~1.0g/L(ZnSO4として添加)
Na2SO4濃度 10g/L
pH 4.8
液温 55℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒
また、当該S面または板状キャリアへの離型材樹脂塗膜の形成は、表2-1に示した組成を有する樹脂塗膜用の組成物をグラビアコート法により塗布した後、ドクターブレードを用いてその厚みを2~4μmに調節した。また、塗布した樹脂塗膜は、150℃で、30秒間加熱して焼き付け処理を行った。なお、表2-1で示したエポキシ系樹脂としてはビスフェノールA型エポキシ樹脂を用い、メラミン系樹脂としてはメチルエーテル化メラミン樹脂を用い、フッ素樹脂としてはポリテトラフルオロエチレンを用い、ジメチルシリコーンレジンとしてはジメチルポリシロキサンを用いた。
表2-1に示す銅箔、樹脂(プリプレグ)および離型剤を用いて、実験例2-1と同様の手順で、積層体を作製した。実験例2-3、実験例2-7、実験例2-10においては、離型剤を板状キャリア上に塗布した。また、表2-1に示した条件の熱処理を行った。それぞれについて実験例2-1と同様の評価を行った。結果を表2-1、表2-2に示す。
実験例2-12では、離型剤および離型材のいずれも用いることなく、銅箔と樹脂(プリプレグ)とを貼り合わせて、キャリア付銅箔を作製して、実験例2-1と同様の評価を行った。
処理液:3-グリシドキシプロピルトリメトキシシラン 0.9体積%水溶液
pH5.0~9.0
12時間常温で攪拌したもの
処理方法:スプレーコーターを用いて処理液を塗布後、100℃の空気中で5分間処理面を乾燥させる。
Cu濃度 20g/L(CuSO4として添加)
H2SO4濃度 50~100g/L
As濃度 0.01~2.0g/L(亜ヒ酸として添加)
液温 40℃
電流密度 40~100A/dm2
めっき時間 0.1~30秒
実験例2-1において、銅箔およびプリプレグの両方につき、550mm角の正方形の形状とした以外は、実験例2-1と同様の銅箔、離型剤およびプリプレグを用いて、キャリア付銅箔を作製し、実験例2-1と同様の手順にて2層ビルドアップ配線板を得た。
また、実験例2-13と実験例2-1とを比較すると、実験例2-1の方がプリプレグと銅箔との界面で剥がれかかった状態の個数が少なかった。
また、実験例2-1と実験例2-2~実験例2-11とを比較すると、実験例2-2~実験例2-11の方がプリプレグと銅箔との界面で剥がれかかった状態の個数が少なかった。
<実験例3-1>
複数の電解銅箔(厚さ12μm)を準備し、それぞれの電解銅箔のシャイニー(S)面に対して、下記の条件によるニッケル-亜鉛(Ni-Zn)合金めっき処理およびクロメート(Cr-Znクロメート)処理を施し、貼り合わせ面(ここではS面)の十点平均粗さ(Rz jis:JIS B 0031(2003)に準拠して測定)を1.5μmとした後、樹脂として南亜プラスティック社製のプリプレグ(FR-4レジン)を当該電解銅箔のS面と貼り合わせ、170℃で100分ホットプレス加工を行って、キャリア付銅箔を作製した。
Ni濃度 17g/L(NiSO4として添加)
Zn濃度 4g/L(ZnSO4として添加)
pH 3.1
液温 40℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒
Cr濃度 1.4g/L(CrO3またはK2CrO7として添加)
Zn濃度 0.01~1.0g/L(ZnSO4として添加)
Na2SO4濃度 10g/L
pH 4.8
液温 55℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒
また、当該S面または板状キャリアへの離型材樹脂塗膜の形成は、表3-1に示した組成を有する樹脂塗膜用の組成物をグラビアコート法により塗布した後、ドクターブレードを用いてその厚みを2~4μmに調節した。また、塗布した樹脂塗膜は、150℃で、30秒間加熱して焼き付け処理を行った。なお、表3-1で示したエポキシ系樹脂としてはビスフェノールA型エポキシ樹脂を用い、メラミン系樹脂としてはメチルエーテル化メラミン樹脂を用い、フッ素樹脂としてはポリテトラフルオロエチレンを用い、ジメチルシリコーンレジンとしてはジメチルポリシロキサンを用いた。
表3-1に示す銅箔、樹脂(プリプレグ)および離型剤を用いて、実験例3-1と同様の手順で、キャリア付銅箔を作製した。実験例3-3、3-7、3-10においては、離型剤を板状キャリア上に塗布した。また、表3-1に示した条件の熱処理を行った。それぞれについて実験例3-1と同様の評価を行った。結果を表3-1、表3-2に示す。
実験例3-12では、離型剤および離型材のいずれも用いることなく、銅箔と樹脂(プリプレグ)とを貼り合わせて、キャリア付銅箔を作製して、実験例3-1と同様の評価を行った。
処理液:3-グリシドキシプロピルトリメトキシシラン 0.9体積%水溶液
pH5.0~9.0
12時間常温で攪拌したもの
処理方法:スプレーコーターを用いて処理液を塗布後、100℃の空気中で5分間処理面を乾燥させる。
Cu濃度 20g/L(CuSO4として添加)
H2SO4濃度 50~100g/L
As濃度 0.01~2.0g/L(亜ヒ酸として添加)
液温 40℃
電流密度 40~100A/dm2
めっき時間 0.1~30秒
実験例3-1において、銅箔およびプリプレグの両方につき、550mm角の正方形の形状とした以外は、実験例3-1と同様の銅箔、離型剤およびプリプレグを用いて、キャリア付銅箔を作製し、実験例3-1と同様の手順にて2層ビルドアップ配線板を得た。
また、実験例3-13と実験例3-1とを比較すると、実験例3-1の方がプリプレグと銅箔との界面で剥がれかかった状態の個数が少なかった。
また、実験例3-1と実験例3-2~3-11とを比較すると、実験例3-2~3-11の方がプリプレグと銅箔との界面で剥がれかかった状態の個数が少なかった。
11 キャリア付金属箔
11a 金属箔
11b 離型剤からなる層あるいは離型材
11c 板状キャリア
12 プリプレグ
13 内層コア
14 ページ
15 ブック
16 ビルドアップ層
220 積層体
221 板状キャリア
222 金属箔
224 樹脂-金属箔界面
230 積層体
231 板状キャリア
232 金属箔
320 積層体
321 板状キャリア
322 金属箔
323 皮覆層
330 積層体
331 板状キャリア
332 金属箔
333 皮覆層
340 積層体
341 板状キャリア
342 金属箔
343 皮覆層
350 積層体
351 板状キャリア
352 金属箔
353 皮覆層
Claims (130)
- 樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層物であって、
前記板状キャリアおよび前記金属箔の積層面の面積が、前記板状キャリアおよび前記金属箔の群から選択されるものの内、少なくとも一つの面積よりも小さい積層物。 - 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔であって、
平面視したときに、前記板状キャリアの少なくとも端部の少なくとも一部が前記金属箔で覆われていないキャリア付金属箔。 - 請求項2に記載のキャリア付金属箔であって、
平面視したときに、前記板状キャリアの端部の全部が前記金属箔で覆われていないキャリア付金属箔。 - 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔であって、
平面視したときに、前記金属箔の面積が前記板状キャリアの面積よりも小さいキャリア付金属箔。 - 板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である請求項2~4のいずれか一項に記載のキャリア付金属箔。
- 平面視したときに、前記板状キャリアの形状が多角形である請求項2~5のいずれか一項に記載のキャリア付金属箔。
- 前記板状キャリアの少なくとも1つの頂点が前記金属箔で覆われていない請求項6に記載のキャリア付金属箔。
- 前記板状キャリアの2以上の頂点が前記金属箔で覆われていない請求項6または7に記載のキャリア付金属箔。
- 前記板状キャリアの全ての頂点が前記金属箔で覆われていない請求項6~8のいずれか一項に記載のキャリア付金属箔。
- 前記金属箔が多角形である請求項2~9のいずれか一項に記載のキャリア付金属箔。
- 前記板状キャリアの縁(ふち)の全長さをA(mm)として、前記板状キャリアの金属箔に覆われている縁(ふち)の長さをB(mm)とした場合に、Aに対するBの比(=B/A)の値が0~0.8である請求項2~10のいずれか一項に記載のキャリア付金属箔。
- 樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔であって、
前記金属箔が前記板状キャリアよりも小さく、かつ、前記金属箔の少なくとも一対の対向する辺が当該辺に対応する板状キャリアの辺と比べて両端のそれぞれにおいて0.1mm以上短い請求項2~11のいずれか一項に記載のキャリア付金属箔。 - 平面視したときの金属箔の面積(Sa)と板状キャリアの面積(Sb)との比(Sa/Sb)が、0.7以上である請求項2~12のいずれか一項に記載のキャリア付金属箔。
- 前記板状キャリアの金属箔で覆われていない領域において、直径0.01mm~10mmの孔が1~10箇所設けられた請求項2~13のいずれか一項に記載のキャリア付金属箔。
- 樹脂製の板状キャリアが熱硬化性樹脂を含む請求項2~14のいずれか一項に記載のキャリア付金属箔。
- 樹脂製の板状キャリアがプリプレグである請求項2~15のいずれか一項に記載のキャリア付金属箔。
- 前記板状キャリアは、120~320℃のガラス転移温度Tgを有する請求項15または16に記載のキャリア付金属箔。
- 前記金属箔の前記キャリアと接する側表面の十点平均粗さ(Rz jis)が、3.5μm以下である請求項2~17のいずれか一項に記載のキャリア付金属箔。
- 前記金属箔の前記キャリアと接しない側の表面の十点平均粗さ(Rz jis)が、0.4μm以上10.0μm以下である請求項2~18のいずれか一項に記載のキャリア付金属箔。
- 前記金属箔の厚みが、1μm以上400μm以下である請求項2~19のいずれか一項に記載のキャリア付金属箔。
- 前記板状キャリアの厚みが5μm以上1000μm以下である請求項2~20のいずれか一項に記載のキャリア付金属箔。
- 板状キャリアと金属箔とを、離型剤を用いて貼り合わせてなる請求項2~21のいずれか一項に記載のキャリア付金属箔。
- 前記離型剤が、次式:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる請求項22に記載のキャリア付金属箔。 - 前記離型剤が、分子内に2つ以下のメルカプト基を有する化合物を用いてなる請求項22に記載のキャリア付金属箔。
- 前記離型剤が、次式:
に示すアルミネート化合物、チタネート化合物、ジルコネート化合物、これらの加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる請求項22に記載のキャリア付金属箔。 - 板状キャリアと金属箔とを、シリコーンと、エポキシ系樹脂、メラミン系樹脂およびフッ素樹脂から選択されるいずれか1つまたは複数の樹脂とで構成される樹脂塗膜を用いて貼り合わせてなる請求項2~21のいずれか一項に記載のキャリア付金属箔。
- 220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である請求項2~26のいずれか一項に記載のキャリア付金属箔。
- 前記金属箔が、銅箔である請求項2~27のいずれか一項に記載のキャリア付金属箔。
- 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記金属箔の面積が前記板状キャリアの面積よりも小さく、かつ、前記金属箔の端部側面の一部または全部が樹脂で覆われている積層体。 - 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記金属箔の面積が前記板状キャリアの面積よりも小さく、かつ、前記金属箔の板状キャリアと接しない側の端部表面の一部または全部が樹脂で覆われている積層体。 - 樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなる積層体である請求項29または30に記載の積層体。
- 板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である請求項29~31のいずれか一項に記載の積層体。
- 平面視したときに、前記板状キャリアの形状が多角形である請求項29~32のいずれか一項に記載の積層体。
- 前記板状キャリアの少なくとも1つの頂点が前記金属箔で覆われていない請求項33に記載の積層体。
- 前記板状キャリアの2以上の頂点が前記金属箔で覆われていない請求項33または34に記載の積層体。
- 前記板状キャリアの全ての頂点が前記金属箔で覆われていない請求項33~35のいずれか一項に記載の積層体。
- 前記金属箔が多角形である請求項29~36のいずれか一項に記載の積層体。
- 前記板状キャリアの縁(ふち)の全長さをA(mm)として、前記板状キャリアの金属箔に覆われている縁(ふち)の長さをB(mm)とした場合に、Aに対するBの比(=B/A)の値が0~0.8である請求項29~37のいずれか一項に記載の積層体。
- 樹脂製の板状キャリアと、該キャリアの少なくとも一方の面に、剥離可能に密着させた金属箔からなるキャリア付金属箔を得るための積層体であって、
前記金属箔が前記板状キャリアよりも小さく、かつ、前記金属箔の少なくとも一対の対向する辺が当該辺に対応する板状キャリアの辺と比べて両端のそれぞれにおいて0.1mm以上短い請求項29~38のいずれか一項に記載の積層体。 - 平面視したときの金属箔の面積(Sa)と板状キャリアの面積(Sb)との比(Sa/Sb)が、0.7以上である請求項29~39のいずれか一項に記載の積層体。
- 前記板状キャリアの金属箔で覆われていない領域において、直径0.01mm~10mmの孔が1~10箇所設けられた請求項29~40のいずれか一項に記載の積層体。
- 樹脂製の板状キャリアが熱硬化性樹脂を含む請求項29~41のいずれか一項に記載の積層体。
- 樹脂製の板状キャリアがプリプレグである請求項29~42のいずれか一項に記載の積層体。
- 前記板状キャリアは、120~320℃のガラス転移温度Tgを有する請求項42または43に記載の積層体。
- 前記金属箔の前記キャリアと接する側表面の十点平均粗さ(Rz jis)が、3.5μm以下である請求項29~44のいずれか一項に記載の積層体。
- 前記金属箔の前記キャリアと接しない側の表面の十点平均粗さ(Rz jis)が、0.4μm以上10.0μm以下である請求項29~45のいずれか一項に記載の積層体。
- 前記金属箔の厚みが、1μm以上400μm以下である請求項29~46のいずれか一項に記載の積層体。
- 前記板状キャリアの厚みが5μm以上1000μm以下である請求項29~47のいずれか一項に記載の積層体。
- 板状キャリアと金属箔とを、離型剤を用いて貼り合わせてなる請求項29~48のいずれか一項に記載の積層体。
- 前記離型剤が、次式:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる請求項49に記載の積層体。 - 前記離型剤が、分子内に2つ以下のメルカプト基を有する化合物を用いてなる請求項49に記載の積層体。
- 前記離型剤が、次式:
に示すアルミネート化合物、チタネート化合物、ジルコネート化合物、これらの加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる請求項49に記載の積層体。 - 板状キャリアと金属箔とを、シリコーンと、エポキシ系樹脂、メラミン系樹脂およびフッ素樹脂から選択されるいずれか1つまたは複数の樹脂とで構成される樹脂塗膜を用いて貼り合わせてなる請求項29~48のいずれか一項に記載の積層体。
- 220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である請求項29~53のいずれか一項に記載の積層体。
- 前記金属箔が、銅箔である請求項29~54のいずれか一項に記載の積層体。
- 請求項29~55のいずれか一項に記載の積層体を、当該積層体の金属箔上で切断して得られるキャリア付金属箔。
- 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記金属箔の少なくとも一部が、前記板状キャリアの端部よりも外側にはみ出し、当該金属箔同士がこのはみ出し部分において板状キャリアを介さずに接する部分の少なくとも一部が溶接または接着されている積層体。 - 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
前記板状キャリアの積層面が板状キャリアよりも外形が大きい前記金属箔で覆われるとともに、金属箔同士が板状キャリアを介さずに接する部分の一部が溶接または接着されている積層体。 - 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
前記板状キャリアの積層面が板状キャリアよりも外形が大きい前記金属箔で覆われるとともに、金属箔の外周部同士が全周にわたって溶接または接着されている積層体。 - 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
前記板状キャリアの積層面が板状キャリアよりも外形が大きい前記金属箔で覆われるとともに、金属箔同士が板状キャリアを介さずに接する部分が全面にわたって溶接または接着されている積層体。 - 板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である請求項57~60のいずれか一項に記載の積層体。
- 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記板状キャリアの外側で、金属箔同士が板状キャリアを介さずに接する部分が存在するように、板状キャリアに対して金属箔が積層されるとともに、金属箔同士が板状キャリアを介さずに接する部分の一部が溶接または接着されている積層体。 - 請求項1に記載の積層物が、樹脂製の板状キャリアと、該キャリアの二つの面に、剥離可能に密着させた金属箔からなる積層体であって、
平面視したときに、前記板状キャリアの外側で、金属箔同士が板状キャリアを介さずに接する部分が存在するように、板状キャリアに対して金属箔が積層されるとともに、金属箔同士が板状キャリアを介さずに接する部分が全面にわたって溶接または接着されている積層体。 - 板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である請求項62または63に記載の積層体。
- 平面視したときの金属箔の面積(Sa)と板状キャリアの面積(Sb)との比(Sb/Sa)が、0.6以上1.0未満である請求項57~64のいずれか一項に記載の積層体。
- 前記二つの金属箔が溶接または接着されている面積(Sp)と、前記当該溶接または接着された面を含む金属箔の面積(Sq)との比(Sp/Sq)が0.001以上0.2以下である請求項57~65のいずれか一項に記載の積層体。
- 樹脂製の板状キャリアが熱硬化性樹脂を含む請求項57~66のいずれか一項に記載の積層体。
- 樹脂製の板状キャリアがプリプレグである請求項57~67のいずれか一項に記載の積層体。
- 前記板状キャリアは、120~320℃のガラス転移温度Tgを有する請求項67または68に記載の積層体。
- 前記金属箔の前記キャリアと接する側表面の十点平均粗さ(Rz jis)が、3.5μm以下である請求項57~69のいずれか一項に記載の積層体。
- 前記金属箔の前記キャリアと接しない側の表面の十点平均粗さ(Rz jis)が、0.4μm以上10.0μm以下である請求項57~70のいずれか一項に記載の積層体。
- 前記金属箔の厚みが、1μm以上400μm以下である請求項57~71のいずれか一項に記載の積層体。
- 前記板状キャリアの厚みが5μm以上1000μm以下である請求項57~72のいずれか一項に記載の積層体。
- 請求項57~73のいずれか一項に記載の積層体において、金属箔が板状キャリアを介さずに接している部分、または板状キャリアの金属箔に覆われず露出している部分において、直径0.01mm~10mmの孔が1~10箇所設けられた積層体。
- 板状キャリアと金属箔とを、離型剤を用いて貼り合わせてなる請求項57~74のいずれか一項に記載の積層体。
- 前記離型剤が、次式:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる請求項75に記載の積層体。 - 前記離型剤が、分子内に2つ以下のメルカプト基を有する化合物を用いてなる請求項75に記載の積層体。
- 前記離型剤が、次式:
に示すアルミネート化合物、チタネート化合物、ジルコネート化合物、これらの加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いてなる請求項75に記載の積層体。 - 板状キャリアと金属箔とを、シリコーンと、エポキシ系樹脂、メラミン系樹脂およびフッ素樹脂から選択されるいずれか1つまたは複数の樹脂とで構成される樹脂塗膜を用いて貼り合わせてなる請求項57~74のいずれか一項に記載の積層体。
- 220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である請求項57~79のいずれか一項に記載の積層体。
- 前記金属箔が、銅箔である請求項57~80のいずれか一項に記載の積層体。
- 請求項57~81のいずれか一項に記載の積層体を、平面視したときに、金属箔が溶接または接着されている部分よりも内側で切断して得られるキャリア付金属箔。
- 請求項1に記載の積層物の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
- 請求項1に記載の積層物の少なくとも一つの金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面金属張積層板、または請求項1に記載の積層物、または請求項2~28,56,82のいずれか一項に記載のキャリア付金属箔、または請求項29~55,57~81のいずれか一項に記載の積層体、または金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
- 請求項2~28のいずれか一項に記載のキャリア付き金属箔の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
- 請求項2~28のいずれか一項に記載のキャリア付き金属箔の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面金属張積層板、または請求項1に記載の積層物、または請求項2~28,56,82のいずれか一項に記載のキャリア付金属箔、または請求項29~55,57~81のいずれか一項に記載の積層体、または金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
- 前記樹脂の少なくとも一つがプリプレグであることを特徴とする請求項83~86のいずれか一項に記載の多層金属張積層板の製造方法。
- 請求項83~87のいずれか一項に記載の多層金属張積層板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含む多層金属張積層板の製造方法。
- 請求項84~87のいずれか一項に記載の製造方法において、前記キャリア付金属箔の板状キャリアと金属箔を剥離して分離する工程を更に含む多層金属張積層板の製造方法。
- 請求項88に記載の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含む多層金属張積層板の製造方法。
- 請求項89~90のいずれか一項に記載の製造方法において、剥離して分離した金属箔の一部または全部をエッチングにより除去する工程を含む多層金属張積層板の製造方法。
- 請求項83~91のいずれか一項に記載の製造方法により得られる多層金属張積層板。
- 請求項1に記載の積層物の金属箔側に、ビルドアップ配線層を一層以上形成する工程を含むビルドアップ基板の製造方法。
- 請求項1に記載の積層物の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、請求項1に記載の積層物、請求項2~28,56,82のいずれかに記載のキャリア付き金属箔、請求項29~55,57~81のいずれか一項に記載の積層体、または金属箔を1回以上繰り返して積層することを含むビルドアップ基板の製造方法。
- 請求項2~28のいずれか一項に記載のキャリア付き金属箔の金属箔側に、ビルドアップ配線層を一層以上形成する工程を含むビルドアップ基板の製造方法。
- ビルドアップ配線層はサブトラクティブ法又はフルアディティブ法又はセミアディティブ法の少なくとも一つを用いて形成される請求項93または95に記載のビルドアップ基板の製造方法。
- 請求項2~28のいずれか一項に記載のキャリア付き金属箔の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、請求項1に記載の積層物、請求項2~28,56,82のいずれかに記載のキャリア付き金属箔、請求項29~55,57~81のいずれか一項に記載の積層体、または金属箔を1回以上繰り返して積層することを含むビルドアップ基板の製造方法。
- 請求項94または97に記載のビルドアップ基板の製造方法において、片面あるいは両面配線基板、片面あるいは両面金属張積層板、積層物の金属箔、積層物の板状キャリア、キャリア付き金属箔の金属箔、キャリア付き金属箔の板状キャリア、積層体の金属箔、積層体の板状キャリア、金属箔、又は樹脂に穴を開け、当該穴の側面および底面に導通めっきをする工程を更に含むビルドアップ基板の製造方法。
- 請求項97または98に記載のビルドアップ基板の製造方法において、前記片面あるいは両面配線基板を構成する金属箔、片面あるいは両面金属張積層板を構成する金属箔、積層物を構成する金属箔、キャリア付き金属箔を構成する金属箔、積層体を構成する金属箔及び金属箔の少なくとも一つに配線を形成する工程を1回以上行うことを更に含むビルドアップ基板の製造方法。
- 配線形成された表面の上に、片面に金属箔を密着させた請求項1に記載の積層物のキャリア側、片面に金属箔を密着させた請求項2~28,56のいずれか一項に記載のキャリア付金属箔のキャリア側、または片面に金属箔を密着させた請求項29~55のいずれか一項に記載の積層体のキャリア側を接触させて積層する工程を更に含む請求項99に記載のビルドアップ基板の製造方法。
- 配線形成された表面の上に、樹脂を積層し、当該樹脂に両面に金属箔を密着させた請求項1に記載の積層物、両面に金属箔を密着させた請求項2~28,56,82のいずれか一項に記載のキャリア付金属箔、または両面に金属箔を密着させた請求項29~55,57~81のいずれか一項に記載の積層体の一方の金属箔を接触させて積層する工程を更に含む請求項99に記載のビルドアップ基板の製造方法。
- 前記樹脂の少なくとも一つがプリプレグであることを特徴とする請求項94,97~101のいずれか一項に記載のビルドアップ基板の製造方法。
- 請求項93~102のいずれか一項に記載のビルドアップ基板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含むビルドアップ配線板の製造方法。
- 請求項93~102のいずれか一項に記載のビルドアップ基板の製造方法において、積層した前記キャリア付金属箔の少なくとも一つにおける板状キャリアと金属箔とを剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
- 請求項103に記載のビルドアップ配線板の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
- 請求項104または105に記載のビルドアップ配線板の製造方法において、板状キャリアと密着していた金属箔の一部または全部をエッチングにより除去する工程を更に含むビルドアップ配線板の製造方法。
- 請求項103~106のいずれか一項に記載の方法により得られるビルドアップ配線板。
- 請求項103~106のいずれか一項に記載の方法によりビルドアップ配線板を製造する工程を含むプリント回路板の製造方法。
- 請求項29~55,57~81のいずれか一項に記載の積層体の少なくとも一つの金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
- 請求項29~55,57~81のいずれか一項に記載の積層体の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面金属張積層板、または請求項1に記載の積層物、または請求項2~28,56,82のいずれか一項に記載のキャリア付金属箔、または請求項29~55,57~81のいずれか一項に記載の積層体、または金属箔を1回以上繰り返して積層することを含む多層金属張積層板の製造方法。
- 前記樹脂の少なくとも一つがプリプレグであることを特徴とする請求項109または110のいずれか一項に記載の多層金属張積層板の製造方法。
- 請求項109~111のいずれか一項に記載の多層金属張積層板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含む多層金属張積層板の製造方法。
- 請求項109~111のいずれか一項に記載の多層金属張積層板の製造方法において、積層した前記キャリア付金属箔の板状キャリアと金属箔を剥離して分離する工程を更に含む多層金属張積層板の製造方法。
- 請求項112に記載の多層金属張積層板の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含む多層金属張積層板の製造方法。
- 請求項113または114に記載の製造方法において、剥離して分離した金属箔の一部または全部をエッチングにより除去する工程を含む多層金属張積層板の製造方法。
- 請求項109~115のいずれか一項に記載の製造方法により得られる多層金属張積層板。
- 請求項29~55,57~81のいずれか一項に記載の積層体の金属箔側に、ビルドアップ配線層を一層以上形成する工程を含むビルドアップ基板の製造方法。
- ビルドアップ配線層はサブトラクティブ法又はフルアディティブ法又はセミアディティブ法の少なくとも一方を用いて形成される請求項117に記載のビルドアップ基板の製造方法。
- 請求項29~55,57~81のいずれか一項に記載の積層体の金属箔側に樹脂を積層し、次いで、樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、または請求項1に記載の積層物、または請求項29~55,57~81のいずれか一項に記載の積層体、または請求項2~28,56,82のいずれか一項に記載のキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含むビルドアップ基板の製造方法。
- 請求項119に記載のビルドアップ基板の製造方法において、片面あるいは両面配線基板、片面あるいは両面金属張積層板、積層物の金属箔、積層物の板状キャリア、積層体の金属箔、積層体の板状キャリア、金属箔、キャリア付金属箔の金属箔、キャリア付金属箔の板状キャリア、又は樹脂に穴を開け、当該穴の側面および底面に導通めっきをする工程を更に含むビルドアップ基板の製造方法。
- 請求項119または120に記載のビルドアップ基板の製造方法において、前記片面あるいは両面配線基板を構成する金属箔、片面あるいは両面金属張積層板を構成する金属箔、積層物を構成する金属箔、積層体を構成する金属箔、キャリア付金属箔を構成する金属箔、及び金属箔の少なくとも一つに配線を形成する工程を1回以上行うことを更に含むビルドアップ基板の製造方法。
- 配線形成された表面の上に、片面に金属箔を密着させた請求項1に記載の積層物のキャリア側、または片面に金属箔を密着させた請求項29~55のいずれか一項に記載の積層体のキャリア側、または片面に金属箔を密着させた請求項2~28,56のいずれか一項に記載のキャリア付金属箔のキャリア側を積層する工程を更に含む請求項121のいずれか一項に記載のビルドアップ基板の製造方法。
- 配線形成された表面の上に、樹脂を積層し、当該樹脂に両面に金属箔を密着させた請求項1に記載の積層物、または両面に金属箔を密着させた請求項29~55,57~81のいずれか一項に記載の積層体、または両面に金属箔を密着させた請求項2~28,56,82のいずれか一項に記載のキャリア付金属箔を積層する工程を更に含む請求項121のいずれか一項に記載のビルドアップ基板の製造方法。
- 前記樹脂の少なくとも一つがプリプレグであることを特徴とする請求項119~123のいずれか一項に記載のビルドアップ基板の製造方法。
- 請求項117~124のいずれか一項に記載のビルドアップ基板の製造方法において、前記積層体または前記積層物の少なくとも一つにおける板状キャリアと金属箔との積層面にて切断する工程を含むビルドアップ配線板の製造方法。
- 請求項117~124のいずれか一項に記載のビルドアップ基板の製造方法において、積層した前記キャリア付金属箔の板状キャリアと金属箔を剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
- 請求項125に記載のビルドアップ配線板の製造方法において、前記切断後の積層体、積層物またはキャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含むビルドアップ配線板の製造方法。
- 請求項126または127に記載のビルドアップ配線板の製造方法において、板状キャリアと密着していた金属箔の一部または全部をエッチングにより除去する工程を更に含むビルドアップ配線板の製造方法。
- 請求項125~128のいずれか一項に記載の製造方法により得られるビルドアップ配線板。
- 請求項125~128のいずれか一項に記載の製造方法によりビルドアップ配線板を製造する工程を含むプリント回路板の製造方法。
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