TWI549211B - A manufacturing apparatus for a semiconductor device and a method for manufacturing the semiconductor device - Google Patents

A manufacturing apparatus for a semiconductor device and a method for manufacturing the semiconductor device Download PDF

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Publication number
TWI549211B
TWI549211B TW102129174A TW102129174A TWI549211B TW I549211 B TWI549211 B TW I549211B TW 102129174 A TW102129174 A TW 102129174A TW 102129174 A TW102129174 A TW 102129174A TW I549211 B TWI549211 B TW I549211B
Authority
TW
Taiwan
Prior art keywords
wafer
sheet
attached
semiconductor device
manufacturing
Prior art date
Application number
TW102129174A
Other languages
English (en)
Chinese (zh)
Other versions
TW201413853A (zh
Inventor
Yoshifumi Sugisawa
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW201413853A publication Critical patent/TW201413853A/zh
Application granted granted Critical
Publication of TWI549211B publication Critical patent/TWI549211B/zh

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Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
TW102129174A 2012-09-28 2013-08-14 A manufacturing apparatus for a semiconductor device and a method for manufacturing the semiconductor device TWI549211B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012218800 2012-09-28
JP2013094679A JP6055369B2 (ja) 2012-09-28 2013-04-26 半導体装置の製造装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW201413853A TW201413853A (zh) 2014-04-01
TWI549211B true TWI549211B (zh) 2016-09-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW102129174A TWI549211B (zh) 2012-09-28 2013-08-14 A manufacturing apparatus for a semiconductor device and a method for manufacturing the semiconductor device

Country Status (2)

Country Link
JP (1) JP6055369B2 (ja)
TW (1) TWI549211B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025267A (ja) * 2014-07-23 2016-02-08 株式会社ディスコ ウェーハの加工方法
JP6270671B2 (ja) * 2014-09-17 2018-01-31 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
JP6640552B2 (ja) 2015-12-22 2020-02-05 株式会社シマノ 両軸受リール
JP7182537B2 (ja) 2019-12-10 2022-12-02 グローブライド株式会社 魚釣用リール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7850799B2 (en) * 2006-02-22 2010-12-14 Nitto Denko Corporation Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
US20110232841A1 (en) * 2010-03-23 2011-09-29 Masayuki Yamamoto Semiconductor wafer mounting method and semiconductor wafer mounting apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6319754B1 (en) * 2000-07-10 2001-11-20 Advanced Semiconductor Engineering, Inc. Wafer-dicing process
JP4689972B2 (ja) * 2004-05-26 2011-06-01 リンテック株式会社 ウエハ処理装置及びウエハ処理方法
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP4781770B2 (ja) * 2005-10-07 2011-09-28 株式会社ディスコ ウェハ加工方法
JP4520403B2 (ja) * 2005-12-09 2010-08-04 リンテック株式会社 テープ貼付装置及び貼付方法
JP4616231B2 (ja) * 2006-10-30 2011-01-19 リンテック株式会社 シート貼付装置及び貼付方法
JP5314307B2 (ja) * 2008-03-25 2013-10-16 リンテック株式会社 レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法
JP5351458B2 (ja) * 2008-07-29 2013-11-27 リンテック株式会社 ウェハ加工用接着シートおよび半導体装置の製造方法
JP2010206044A (ja) * 2009-03-05 2010-09-16 Toshiba Corp 半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7850799B2 (en) * 2006-02-22 2010-12-14 Nitto Denko Corporation Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
US20110232841A1 (en) * 2010-03-23 2011-09-29 Masayuki Yamamoto Semiconductor wafer mounting method and semiconductor wafer mounting apparatus

Also Published As

Publication number Publication date
JP2014082445A (ja) 2014-05-08
JP6055369B2 (ja) 2016-12-27
TW201413853A (zh) 2014-04-01

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